WO2018230313A1 - Liquide de traitement pour formation de membrane dotée de performances anticorrosives et isolantes - Google Patents
Liquide de traitement pour formation de membrane dotée de performances anticorrosives et isolantes Download PDFInfo
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- WO2018230313A1 WO2018230313A1 PCT/JP2018/020266 JP2018020266W WO2018230313A1 WO 2018230313 A1 WO2018230313 A1 WO 2018230313A1 JP 2018020266 W JP2018020266 W JP 2018020266W WO 2018230313 A1 WO2018230313 A1 WO 2018230313A1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/173—Macromolecular compounds
Definitions
- the present invention relates to a processing solution for forming a film, a method for forming a film, and the like.
- Patent Document 1 discloses a rust prevention treatment method by forming a siliceous film after chemical conversion treatment with trivalent chromium.
- Patent Document 1 does not discuss insulation.
- the requirements for the corrosion resistance and insulation performance for the metal materials described above are increasing, and there is a problem that the above-described methods cannot satisfy the required corrosion resistance and insulation performance.
- An object of the present invention is to provide a treatment liquid and a treatment method capable of further enhancing both the rust prevention performance and insulation of a metal material.
- the present invention provides a treatment liquid and a treatment method capable of further enhancing both the rust prevention performance and the insulating property of the metal material while the film formed by the treatment is thinner.
- the present inventor contains a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond, an organometallic compound, and water. It has been found that the above-mentioned problems can be solved by using a treatment liquid for forming a film having corrosion resistance and insulation performance. As a result of further research based on this knowledge, the present inventor completed the present invention.
- this invention includes the following aspects as one aspect: Item 1.
- a treatment liquid for forming a film having corrosion resistance and insulation performance comprising a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond, an organometallic compound, and water.
- Item 2. Item 2. The treatment liquid according to Item 1, wherein the silicon compound contains a resin.
- Item 3. Item 3.
- the treatment liquid according to Item 1 or 2 wherein the organometallic compound is at least one selected from the group consisting of an organometallic chelate compound and a metal alkoxide.
- Item 4. Item 4.
- Item 5. The treatment liquid according to any one of Items 1 to 4, wherein the content of the organometallic compound is 0.01 to 50 parts by mass with respect to 100 parts by mass of the silicon compound.
- Item 6. The treatment liquid according to any one of Items 1 to 5, wherein the water content is 1 to 100 parts by mass with respect to 100 parts by mass of the silicon compound.
- Item 8 The method according to Item 7, further comprising (Step 2) a step of curing after Step 1.
- Step 2 a step of curing after Step 1.
- Item 9. Item 9.
- Item 10. A crosslinked structure of a silicon compound comprising a metal material and a film on the surface of the metal material, wherein the film has at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond; And containing an organometallic compound, Film-containing metal material.
- the present invention it is possible to provide a treatment liquid and a treatment method that can further improve both the rust prevention performance and the insulating property of a metal material. Moreover, according to this invention, the metal material containing a rust preventive film which can be obtained by this processing method can also be provided.
- the present invention includes a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond, an organometallic compound, and water, and has corrosion resistance and insulation performance.
- the treatment liquid for forming a film having the above in the present specification, it may be referred to as “the treatment liquid of the present invention”
- the film formation method using the treatment liquid of the present invention, and the treatment liquid of the present invention relates to a film-containing metal material that can be obtained. These will be described below.
- the alkoxysilyl group is not particularly limited as long as it is an alkoxysilyl group having at least one alkoxy group.
- Examples of the alkoxysilyl group include, for example, the general formula (1): (R 1 ) m (R 2 O) 3-m Si— (wherein R 1 is a functional group and R 2 is a lower alkyl group. And an integer of 0 to 2).
- Examples of the functional group represented by R 1 include methyl, dimethyl, phenyl, diphenyl, hexyl, decyl, 1,6-bis (trimethoxysilyl), trifluoropropyl, vinyl, 3-glycidoxypropyl, 3-glycid Xylpropylmethyl, 2- (3,4-epoxycyclohexyl) ethyl, p-styryl, 3-methacryloxypropyl, 3-methacryloxypropylmethyl, 3-acryloxypropyl, 3-aminopropyl, N-2- (amino Ethyl) -3-aminopropyl, N-2- (aminoethyl) -3-aminopropylmethyl, 3-triethoxysilyl-N- (1,3-dimethylbutylidene) propylamine, N-phenyl-3- Aminopropyl, N- (vinylbenzyl) -2-aminoethyl-3
- lower alkyl group represented by R 2 examples include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, sec-butyl, n-pentyl, 1-ethylpropyl, isopentyl.
- linear or branched alkyl groups having about 1 to 6 carbon atoms such as neopentyl.
- the alkoxysilylene group is not particularly limited as long as it is an alkoxysilylene group having at least one alkoxy group.
- Examples of the functional group represented by R 3 include the same functional groups represented by R 1 .
- Examples of the lower alkyl group represented by R 4 include the same as the lower alkyl group represented by R 2 .
- the silicon compound is not particularly limited as long as it is a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond as a partial structure.
- the silicon compound include resins, alkoxysilane oligomers, and alkoxysilanes. Among these, Preferably resin is mentioned.
- the resin examples include not only silicone resins but also various resins into which alkoxysilyl groups are introduced (for example, acrylic resins, urethane resins, epoxy resins, polyester resins, melamine resins, etc.).
- acrylic resins, urethane resins, epoxy resins, polyester resins, melamine resins, etc. examples include acrylic resins, urethane resins, epoxy resins, polyester resins, melamine resins, etc.
- an acrylic resin and a silicone resin into which an alkoxysilyl group is introduced are preferable, and an acrylic resin into which an alkoxysilyl group is introduced is more preferable.
- the weight average molecular weight of the resin is not particularly limited, but is, for example, 11000 to 200000, preferably 11000 to 100,000, more preferably 11000 to 70000, and still more preferably 11000 to 50000.
- the content of the alkoxysilyl group is, for example, 1 to 70% by mass, preferably 2 to 60% by mass, more preferably 3 to 50% by mass, and still more preferably It is 4 to 45% by mass, more preferably 5 to 40% by mass.
- alkoxysilane examples include Si (OCH 3 ) 4 , Si (OC 2 H 5 ) 4 , CH 3 Si (OCH 3 ) 3 , CH 3 Si (OC 2 H 5 ) 3 , C 2 H 5 Si (OCH 3).
- the alkoxysilane oligomer is obtained by hydrolyzing and polycondensing alkoxysilane.
- the alkoxysilane oligomer for example, an alkoxysilane oligomer having a weight average molecular weight of about 500 to 10,000 can be used.
- the silicon compound may be used alone or in combination of two or more. Good.
- the content of the silicon compound is, for example, 3 to 70% by mass, preferably 5 to 30% by mass, and more preferably 8 to 25% by mass with respect to 100% by mass of the treatment liquid of the present invention.
- the treatment liquid of the present invention may contain an alkoxysilyl group, an alkoxysilylene group, and a resin having no siloxane bond (non-silicon resin).
- non-silicon resin examples include an epoxy resin, an acrylic resin, a urethane resin, a polyester resin, and a melamine resin.
- an epoxy resin is mentioned, More preferably, a bisphenol A type epoxy resin is mentioned.
- Component A is preferably an acrylic resin or silicone resin into which an alkoxysilyl group is introduced, and more preferably an acrylic resin into which an alkoxysilyl group is introduced.
- Component B is preferably a non-silicon resin, more preferably an epoxy resin, and still more preferably a bisphenol A type epoxy resin.
- component B is, for example, 30 to 200 parts by mass, preferably 60 to 150 parts by mass, more preferably 80 to 120 parts per 100 parts by mass of component A. Part by mass, more preferably 90 to 110 parts by mass.
- the organometallic compound is not particularly limited as long as it can function as a catalyst for the condensation reaction.
- a metal compound for example, a water-soluble organometallic chelate compound containing titanium, zirconium, aluminum, tin or the like, a metal alkoxide, or the like can be used as a metal component.
- examples of the organic titanium compound include titanium alkoxide compounds such as tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra tertiary butyl titanate, and tetraoctyl titanate; titanium diisopropoxybisacetylacetonate, titanium tetra Titanium chelates such as acetylacetonate, titanium dioctyloxybisethylacetoacetonate, titanium octylene glycolate, titanium diisopropoxybisethylacetylacetonate, titanium lactate, titanium lactate ammonium salt, titanium diisopropoxybistriethanolaminate
- examples of the organic zirconium compound include dipropyl compounds such as normal propyl zirconate and normal butyl zirconate.
- zirconium oxide compound examples include zirconium tetraacetylacetonate, zirconium tributoxymonoacetylacetonate, zirconium dibutoxybisethylacetoacetate, zirconium tributoxymonostearate and the like.
- Aluminum alkoxide compounds such as aluminum butyl acetate, monobutoxy aluminum diisopropylate, aluminum butyrate; ethyl acetoacetate aluminum diisopropylate, aluminum trisethyl acetate, alkyl acetoacetate aluminum diisopropylate, aluminum monoacetylacetonate bisethylacetoacetate, etc.
- aluminum chelate compounds That.
- the organometallic compound may be a single type or a combination of two or more types.
- the content of the organometallic compound is not particularly limited, but is usually about 0.01 to 50 parts by mass and about 0.1 to 30 parts by mass with respect to 100 parts by mass of the silicon compound. 1 to 30 parts by mass is more preferable, 5 to 30 parts by mass is further preferable, 10 to 25 parts by mass is still more preferable, and 15 to 25 parts by mass is even more preferable.
- the treatment liquid of the present invention may contain a catalyst other than the organometallic compound. However, preferably, the treatment liquid of the present invention does not contain a catalyst other than the organometallic compound.
- the content of water is not particularly limited, but is, for example, 1 to 100 parts by mass, preferably 10 to 100 parts by mass, and more preferably 20 to 100 parts by mass with respect to 100 parts by mass of the silicon compound.
- the treatment liquid of the present invention preferably contains a solvent.
- the solvent is not particularly limited as long as it is a hydrophilic solvent.
- an organic solvent such as an alcohol, glycol, glycol ether, ether, ether alcohol, or ketone is used alone or as necessary. They can be used in appropriate combinations. Among these, glycol ether solvents are more preferable.
- glycol ether solvent examples include a solvent represented by the general formula (3): HO—R 5 —O—R 6 (wherein R 5 represents a lower alkylene group and R 5 represents an alkyl group). Is mentioned.
- the lower alkylene group represented by R 5 is not particularly limited, and includes any linear or branched (preferably branched) group.
- the number of carbon atoms of the alkylene group is, for example, 1 to 6, preferably 1 to 5, more preferably 2 to 4, and still more preferably 3.
- Specific examples of the alkylene group include a methylene group, an ethylene group, an n-propylene group, an isopropylene group, an n-butylene group, and an isobutylene group.
- the alkyl group represented by R 6 is not particularly limited, and includes any of linear or branched (preferably linear).
- the number of carbon atoms of the alkyl group is, for example, 1 to 6, preferably 1 to 4, more preferably 1 to 2, and still more preferably 1.
- Specific examples of the alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, sec-butyl group and the like.
- the treatment liquid of the present invention may contain other components in addition to the above components.
- the content of other components is, for example, 0 to 20% by mass, preferably 0 to 10% by mass, more preferably 0 to 5% by mass, and further preferably 0 to 1% with respect to 100% by mass of the treatment liquid of the present invention. % By mass, more preferably 0% by mass.
- the method for producing the treatment liquid of the present invention is not particularly limited, and can be obtained by appropriately mixing each component.
- the treatment liquid of the present invention is preferably obtained by mixing a silicon compound and, if necessary, a solvent, and adding and mixing water and an organometallic compound thereto.
- the intermolecular and / or intramolecular molecules of the film forming component may be partially crosslinked.
- a coating having corrosion resistance and insulation performance can be formed on the surface of the metal material.
- the metal material is not particularly limited as long as at least a part of the surface is made of metal.
- the metal include various metals such as zinc, aluminum, magnesium, cobalt, nickel, iron, copper, tin, gold, and alloys thereof, and preferably zinc. More specifically, as a metal material, an article made only of metal, a composite article in which other articles other than metal (for example, ceramic material, plastics material, etc.) and metal are combined, and has a metal plating film on the surface Examples thereof include plating products (for example, steel plating products having a zinc plating film or a zinc alloy plating film on the surface).
- the metal constituting the surface of the metal material may be an untreated metal or a metal that has been subjected to a pretreatment such as a degreasing treatment or an acid activation treatment.
- coating method for example, known methods such as dip coating, spray coating, roll coating, spin coating, and bar coating can be employed.
- the curing treatment is not particularly limited as long as it is a treatment capable of curing the film forming component in the treatment liquid of the present invention.
- the curing treatment is preferably heat treatment.
- the temperature of the heat treatment is not particularly limited, but is, for example, 20 ° C. or higher, preferably 50 to 300 ° C., more preferably 100 to 250 ° C., and further preferably 150 to 250 ° C.
- the time for the heat treatment is not particularly limited, but is, for example, 5 minutes to 2 hours, preferably 10 minutes to 1 hour, more preferably 20 minutes to 40 minutes.
- the silicon compound includes a metal material and a film on the surface of the metal material, and the film has at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond.
- a film-containing metal material containing a crosslinked structure and an organometallic compound can be obtained.
- Having corrosion resistance means performing a salt spray test (JIS Z2371), and the time until the generation area ratio of red rust to the sample surface area becomes 10% is, for example, 30 hours or more, preferably 40 hours or more, more preferably 100 Time or more, more preferably 150 hours or more, even more preferably 200 hours or more, and even more preferably 250 hours or more.
- the maximum voltage at which dielectric breakdown does not occur when a voltage is applied by a withstand voltage test is, for example, 1200 V or more, preferably 1500 V or more.
- the thickness of the coating is preferably thinner, for example, 0.1 to 100 ⁇ m, preferably 0.5 to 50 ⁇ m, more preferably 1 to 30 ⁇ m.
- Example 1 A liquid mixture comprising 20% by mass of a silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd., weight average molecular weight: about 11,000 to 100,000), 10% by mass of methyltrimethoxysilane oligomer, and 70% by mass of propylene glycol monomethyl ether was prepared. . Next, 10 parts by mass of water and 5 parts by mass of titanium diisopropoxybisethyl acetylacetonate were added to 100 parts by mass of the mixed solution to prepare a film forming treatment liquid.
- a silicone resin manufactured by Shin-Etsu Chemical Co., Ltd., weight average molecular weight: about 11,000 to 100,000
- propylene glycol monomethyl ether propylene glycol monomethyl ether
- a nickel-plated steel plate (size 100 ⁇ 60 ⁇ 0.3 mm) was used as a metal material, and after alkaline degreasing treatment, the treatment liquid prepared above was spray-coated, and 200 times using a dryer. A film having a siloxane bond was formed by heat treatment at 30 ° C. for 30 minutes.
- Example 2 A mixture comprising 15% by mass of acrylic silicone resin (produced by Taisei Fine Chemical Co., Ltd., weight average molecular weight: about 20,000, alkoxysilyl group content 40% by mass), 15% by mass of tetramethoxysilane, and 70% by mass of propylene glycol monoethyl ether A liquid was prepared. Next, 30 parts by mass of water and 5 parts by mass of titanium diisopropoxybisethyl acetylacetonate were added to 100 parts by mass of the mixed liquid to prepare a film forming treatment liquid.
- acrylic silicone resin produced by Taisei Fine Chemical Co., Ltd., weight average molecular weight: about 20,000, alkoxysilyl group content 40% by mass
- propylene glycol monoethyl ether A liquid was prepared.
- 30 parts by mass of water and 5 parts by mass of titanium diisopropoxybisethyl acetylacetonate were added to 100 parts by mass of the mixed liquid to prepare a film forming treatment liquid.
- Example 2 a nickel-plated steel plate (size 100 ⁇ 60 ⁇ 0.3 mm) was used as a metal material, and after alkaline degreasing treatment, the treatment liquid prepared above was spray-coated. Then, a heat treatment was performed at 200 ° C. for 30 minutes using a dryer to form a film having a siloxane bond.
- Example 3 Acrylic silicone resin (produced by Taisei Fine Chemical Co., Ltd., weight average molecular weight: about 20,000, alkoxysilyl group content 40 mass%) 10 mass%, bisphenol A type epoxy resin 10 mass%, and propylene glycol monoethyl ether 80 mass% A mixed solution was prepared. Next, 3 parts by mass of water and 2 parts by mass of aluminum monoacetylacetonate bisethylacetoacetate were added to 100 parts by mass of the mixed solution to prepare a film forming treatment liquid.
- Example 2 a nickel-plated steel plate (size 100 ⁇ 60 ⁇ 0.3 mm) was used as a metal material, and after alkaline degreasing treatment, the treatment liquid prepared above was spray-coated. Then, a heat treatment was performed at 200 ° C. for 30 minutes using a dryer to form a film having a siloxane bond.
- Comparative Example 1 A mixture comprising 15% by mass of acrylic silicone resin (produced by Taisei Fine Chemical Co., Ltd., weight average molecular weight: about 20,000, alkoxysilyl group content 40% by mass), 15% by mass of tetramethoxysilane, and 70% by mass of propylene glycol monoethyl ether A liquid was prepared. Next, 0.1 part by mass of water and 3 parts by mass of titanium diisopropoxybisethyl acetylacetonate were added to 100 parts by mass of the mixed solution to prepare a film forming treatment liquid.
- acrylic silicone resin produced by Taisei Fine Chemical Co., Ltd., weight average molecular weight: about 20,000, alkoxysilyl group content 40% by mass
- propylene glycol monoethyl ether A liquid was prepared. Next, 0.1 part by mass of water and 3 parts by mass of titanium diisopropoxybisethyl acetylacetonate were added to 100 parts by mass of the mixed solution to prepare a film
- Example 2 a nickel-plated steel plate (size 100 ⁇ 60 ⁇ 0.3 mm) was used as a metal material, and after alkaline degreasing treatment, the treatment liquid prepared above was spray-coated. Then, a heat treatment was performed at 200 ° C. for 30 minutes using a dryer to form a film having a siloxane bond.
- Comparative Example 2 A mixed liquid consisting of 20% by mass of a bisphenol A type epoxy resin and 80% by mass of propylene glycol monoethyl ether was prepared. Next, 0.1 parts by mass of water and 2 parts by mass of aluminum monoacetylacetonate bisethylacetoacetate were added to 100 parts by mass of the mixed solution to prepare a film forming treatment liquid.
- Example 2 a nickel-plated steel plate (size 100 ⁇ 60 ⁇ 0.3 mm) was used as a metal material, and after alkaline degreasing treatment, the treatment liquid prepared above was spray-coated. Then, heat treatment was performed at 200 ° C. for 30 minutes using a dryer to form a film.
- Test Example 1 Corrosion Resistance Test A salt spray test (JIS Z2371) was performed on the nickel steel sheets on which the films obtained in Examples 1 to 3 and Comparative Examples 1 and 2 described above were formed. The time until the ratio reached 10% was measured. The results of the test are shown in Table 1 below.
- Test Example 2 Insulation test Maximum voltage that does not cause dielectric breakdown by applying a voltage in a withstand voltage test to the nickel steel sheets on which the films obtained in Examples 1 to 3 and Comparative Examples 1 and 2 are formed. Was measured. The results of the test are shown in Table 1 below.
- the film having a siloxane bond formed using the treatment liquid of the present invention has excellent corrosion resistance and insulation.
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Abstract
L'invention fournit un liquide de traitement ainsi qu'un procédé de traitement qui permettent d'améliorer à la fois les performances anticorrosives et l'isolation d'un matériau métallique. Plus précisément, l'invention concerne un liquide de traitement pour formation de membrane dotée de performances anticorrosives et isolantes, lequel liquide de traitement comprend un composé silicium possédant au moins un élément choisi dans un groupe constitué d'un groupe alcoxysilyle, d'un groupe alcoxysilylène et d'une liaison siloxane, un composé métal organique, et une eau.
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JP2019525268A JPWO2018230313A1 (ja) | 2017-06-14 | 2018-05-28 | 耐食性能及び絶縁性能を有する皮膜の形成用処理液 |
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Cited By (1)
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JP7467866B2 (ja) | 2019-10-02 | 2024-04-16 | 住友ゴム工業株式会社 | 親水性基材及び親水性基材作製方法 |
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JP2009190369A (ja) * | 2008-02-18 | 2009-08-27 | Jfe Steel Corp | 絶縁被膜を有する電磁鋼板 |
JP2013112837A (ja) * | 2011-11-25 | 2013-06-10 | Jfe Steel Corp | 絶縁被膜付き電磁鋼板 |
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2018
- 2018-05-28 JP JP2019525268A patent/JPWO2018230313A1/ja active Pending
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JP2003193263A (ja) * | 2001-10-05 | 2003-07-09 | Nippon Steel Corp | 優れた端面絶縁性を有する鉄心と鉄心端面の絶縁被膜処理方法 |
JP2009190369A (ja) * | 2008-02-18 | 2009-08-27 | Jfe Steel Corp | 絶縁被膜を有する電磁鋼板 |
JP2013112837A (ja) * | 2011-11-25 | 2013-06-10 | Jfe Steel Corp | 絶縁被膜付き電磁鋼板 |
JP2014009371A (ja) * | 2012-06-28 | 2014-01-20 | Jfe Steel Corp | 絶縁被膜付き電磁鋼板 |
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JP7467866B2 (ja) | 2019-10-02 | 2024-04-16 | 住友ゴム工業株式会社 | 親水性基材及び親水性基材作製方法 |
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