WO2018223753A1 - 绑定区连接结构、触摸屏和显示装置 - Google Patents

绑定区连接结构、触摸屏和显示装置 Download PDF

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Publication number
WO2018223753A1
WO2018223753A1 PCT/CN2018/080975 CN2018080975W WO2018223753A1 WO 2018223753 A1 WO2018223753 A1 WO 2018223753A1 CN 2018080975 W CN2018080975 W CN 2018080975W WO 2018223753 A1 WO2018223753 A1 WO 2018223753A1
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WIPO (PCT)
Prior art keywords
connection structure
binding area
floating
binding
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2018/080975
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English (en)
French (fr)
Inventor
王庆浦
张雷
郭总杰
张志�
贺晓悦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/303,636 priority Critical patent/US11099682B2/en
Publication of WO2018223753A1 publication Critical patent/WO2018223753A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present disclosure relates to the field of touch display technologies, and in particular, to a binding area connection structure, a touch screen, and a display device.
  • the reliability of the touch display device market in wearable devices, in-vehicle, medical, industrial control and other fields is increasing.
  • the requirements for the conduction state of the binding area (ie, the Bonding area) of the touch substrate and the flexible printed circuit (FPC) are getting higher and higher.
  • the conduction state of the binding zone is monitored mainly by manually observing the blasting condition of the conductive particles.
  • the blasting of the conductive particles is good, and the conduction state of the binding zone is not guaranteed to be good.
  • the above means of monitoring the conduction state of the binding zone is not accurate.
  • the present disclosure provides a binding area connection structure, a touch screen, and a display device, thereby at least to some extent overcoming one or more problems due to limitations and disadvantages of the related art.
  • a bonding area connection structure for connecting a touch substrate and a flexible circuit board including:
  • a plurality of electrode routing pins arranged in a single row array are disposed in an intermediate portion of the binding region, and the plurality of the electrode routing pins are respectively connected to the touch electrodes on the touch substrate and the flexible circuit board Electrode
  • a plurality of floating pins are respectively disposed on two sides of the intermediate portion of the binding region, and one ends of the plurality of floating leads to the touch electrodes are respectively connected to corresponding first test points by wires, and For measuring the impedance of the binding zone.
  • the length of the floating pin is gradually shortened in a direction away from the intermediate portion of the binding region.
  • At least two of the floating pins are respectively disposed on both sides of the intermediate portion of the binding area.
  • three of the floating pins are respectively disposed on both sides of the intermediate portion of the binding area.
  • the length of the electrode trace pin and the length of the floating pin along a direction away from the middle region of the binding region are 1:1:0.75 in order: 0.5.
  • one end of the plurality of floating leads to the electrode is respectively connected to a corresponding second test point by a gold finger, and the second test point is corresponding to the same dangling
  • the first test point of the pin forms a test channel.
  • the first test point, the second test point, and the lead are made of the same layer material.
  • the first test point is integrally formed with the lead wire and the floating pin.
  • Another embodiment of the present disclosure further discloses a touch screen comprising: a touch substrate, a flexible circuit board, and the above-described binding area connection structure.
  • a display device including the touch panel described above is also disclosed.
  • FIG. 1 is a schematic diagram showing a design structure of a binding area in a related embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram showing the overall design structure of a corresponding binding area and an integrated circuit in a related embodiment of the present disclosure.
  • FIG. 3 shows a schematic diagram of a binding area design structure provided in an exemplary embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram showing an overall design structure of a binding area and an integrated circuit provided in an exemplary embodiment of the present disclosure.
  • FIG. 1 is a schematic structural diagram of a binding area in a related embodiment of the present disclosure.
  • a display area of a touch screen is provided with a plurality of touch electrodes 10 arranged in an array, and each touch electrode 10 Electrode traces 12a and 12b are provided correspondingly, wherein the electrode trace 12a is connected to the transmitting ends Tx1 and Tx2 of the touch electrode 10, and the electrode trace 12b is connected to the receiving ends Rx1, Rx2 and Rx3 of the touch electrode 10.
  • a peripheral area of one side of the display area is provided with a binding area, a plurality of electrode routing pins 20 are disposed in the middle area of the binding area, and electrode traces 12a and 12b are respectively associated with corresponding electrode routing pins 20. connection.
  • a dangling pin (ie, Dummy Pin) 30 is usually disposed on both sides of the middle portion of the binding area. As shown in FIG. 1, two floating pins 30 are respectively disposed on both sides of the middle portion of the binding area in FIG. 1, and the floating pins 30 are not connected to any electrodes, and the lengths of the floating pins 30 and the electrode routing pins 20 are Both are 1mm.
  • FIG. 2 also shows a schematic diagram of the overall design structure of the corresponding binding area and the integrated circuit.
  • the electrode routing pin 20 of the binding area is a pin that is normally connected to the circuit, and is connected to the FPC gold finger 40 and then connected to an integrated circuit (IC) 50.
  • the floating pin 30 is not connected to any circuit after being bound to the FPC gold finger 40.
  • the binding area structure shown in FIG. 1 and FIG. 2 merely increases the FPC binding length by setting the floating pin, and functions to increase the strength of the FPC solder joint, and the function of the test cannot be realized.
  • FIG. 3 is a schematic diagram showing a design of a binding area provided in an exemplary embodiment of the present disclosure.
  • the touch screen binding area connection structure includes a plurality of electrode routing pins 20 and floating pins 30, among which multiple The electrode trace pin 20 is disposed in the middle area of the binding area, and the floating pin 30 is disposed on both sides of the middle area of the binding area, that is, on both sides of the plurality of electrode routing pins 20.
  • a plurality of electrode lead pins 20 are distributed in the middle of the binding area in a single row array for respectively connecting the touch electrodes on the touch substrate and the electrodes on the flexible circuit board, and the plurality of floating pins 30 are connected to the touch.
  • One end of the electrode is connected to a corresponding first test point by a lead wire, respectively, for measuring the impedance of the bonded region.
  • the "corresponding first test point” referred to herein and the “corresponding second test point” appearing later refer to the use of the lead to connect the floating pin or the electrode lead pin. A connection point where the touch electrodes are connected one to one.
  • FIG. 3 also shows the touch electrodes 10, the transmitting ends T1 and Tx2 of the touch electrodes 10, and the receiving ends Rx1, Rx2, and Rx3, and the electrode traces 12a between the touch electrodes 10 and the electrode routing pins 20.
  • 12b is the same as the corresponding numbering in FIG. 1, and will not be described again here.
  • At least two floating pins 30 are respectively disposed on two sides of the middle area of the binding area, as shown in FIG. 3, for example, three are respectively set on the two sides of the middle area of the binding area.
  • One of the six floating pins 30, and one end of the six floating pins 30 leading to the touch electrode is respectively connected to the corresponding first test point through the lead 60, and six test points A1 are formed on both sides of the middle portion of the binding area. , A2, A3, A4, A5 and A6.
  • the floating pin 30 is led out to the corresponding first test point through the lead 60 to facilitate measurement.
  • the arrangement of the first test point and the wiring manner of the lead are not specifically limited.
  • FIG. 3 is only an example, and the actual design process needs to be combined with a specific circuit structure, as long as the first test point is exposed. Come out, there will be no short circuit due to too close distance.
  • the dangling pins 30 in this embodiment are not of equal length, but are of a gradual design. As shown in FIG. 3, the length of the floating pins 30 on both sides gradually becomes shorter along the direction away from the intermediate portion of the binding region. For example, the ratio of the length of the electrode trace pin to the length of the floating pin along the direction away from the middle region of the bond region is 1:1:0.75:0.5. In the actual design, the lengths of the floating pins 30 in FIG. 3 are: 0.5 mm, 0.75 mm, 1 mm, 1 mm, 0.75 mm, 0.5 mm, and the lengths of the electrode trace pins 20 in the middle portion of the bonding region are 1 mm. .
  • the pin length is only an example.
  • the number of floating pins is different. It can also be 2 or even 4 or more, and the length of the floating pin can be gradually changed according to a certain ratio. For example, if there are 5 floating pins on both sides, the ratio of the length of the electrode routing pins to the length of the floating pins along the direction away from the middle area of the binding area is 1:1:0.8:0.6:0.4. :0.2.
  • FIG. 4 is a schematic diagram showing an overall design structure of a bonding area and an integrated circuit provided in an exemplary embodiment of the present disclosure.
  • one end of the floating pin 30 leading to the integrated circuit IC is also connected by a gold finger 40.
  • the second test points corresponding to the first test points A1-A6 are B1-B6, respectively.
  • the electrode trace pin 20 is connected to the inside of the IC through the gold finger 40, but also the floating pin 30 is connected to the corresponding second test point through the gold finger 40, thereby forming correspondingly for the six floating pins.
  • Six test channels, and the two ends of the test channel are respectively connected to the first test point and the second test point.
  • the first test point, the second test point, and the lead are made of the same layer material, that is, the same process is fabricated. If the metal material is taken as an example, after depositing the metal layer, the dummy pin, the first test point, the second test point and the lead are formed by using a mask of a predetermined pattern; wherein the width of the lead is smaller than the width of the floating pin The width of the test point is approximately the same as the width of the floating pin so that the test equipment can conduct well with the test point.
  • the first test point is led out to a region other than below the dangling pin, and the second test point can be formed directly on the area above the longest dangling pin, and the second test point is exposed during fabrication. It should be noted that the materials of the first test point, the second test point and the lead may also be other conductive materials other than metal.
  • the floating pins can be integrally formed with the first test point and the leads between the two to ensure good conduction efficiency.
  • the binding area connection structure provided in this embodiment can be used to monitor the conduction state of the binding area corresponding to the pin connected to the electrode normally, and the floating pins on both sides of the middle area of the binding area first pass the design test. The point achieves the measurement of the bound impedance.
  • the first test points A1-A3 adopt a length gradient design of 0.5mm, 0.75mm, and 1mm.
  • the effective conduction area ratio of the floating pins corresponding to the first test points A1-A3 is 2:3:4, so that the quality is During the monitoring process, if an abnormality occurs in the binding area of the first test point A1, the risk of product occurrence can be predicted in time, effective monitoring can be realized, and the process can be improved, thereby avoiding the problem of quality monitoring lag in the process of mass production. .
  • another embodiment of the present disclosure further provides a touch screen including a touch substrate, a flexible circuit board, and a binding area connection structure for connecting the touch substrate and the flexible circuit board.
  • a display device is further provided, the display device comprising the above touch screen.
  • the display device in this embodiment may be a liquid crystal panel, an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, or a digital device. Any product or component that has a display function, such as a photo frame or a navigator.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供一种绑定区连接结构、触摸屏和显示装置。绑定区连接结构包括多个电极走线引脚和多个悬空引脚；多个电极走线引脚以行阵列分布，设置在绑定区中间区域，用于连接触摸基板上的触控电极与柔性电路板上的电极；多个悬空引脚分别设置在绑定区中间区域的两侧，且多个悬空引脚通向触控电极的一端分别通过引线连接到对应的第一测试点，用于测量绑定区阻抗，实现对产品的品质进行有效监控。

Description

绑定区连接结构、触摸屏和显示装置
交叉引用
本公开要求于2017年6月9日递交的、申请号为：201720667455.8，发明创造名称为“绑定区连接结构、触摸屏和显示装置”的中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及触摸显示技术领域，具体而言，涉及一种绑定区连接结构、触摸屏和显示装置。
背景技术
目前，可穿戴设备、车载、医疗、工控等领域对触摸显示设备市场的信赖性要求越来越高。尤其是对触摸基板与柔性电路板(Flexible Printed Circuit，简称FPC)相连的绑定区(即Bonding区)的导通状况的要求越来越高。
目前，主要通过人工观察导电粒子爆破状况来对绑定区导通状况进行监控。但是，导电粒子爆破状况良好，并不能保证对绑定区导通状况良好。目前，上述监测绑定区导通状况的手段并不准确。
发明内容
本公开提供一种绑定区连接结构、触摸屏和显示装置，进而至少在一定程度上克服由于相关技术的限制和缺陷而导致的一个或者多个问题。
本公开的其他特性和优点将通过下面的详细描述变得清晰，或者部分地通过本公开的实践而习得。
根据本公开的一个方面，提供一种绑定区连接结构，用于连接触摸基板和柔性电路板，包括：
多个以单行阵列分布的电极走线引脚，设置在绑定区中间区域，多个所述电极走线引脚分别用于连接所述触摸基板上的触控电极与所述柔性电路板上的电极；
多个悬空引脚，分别设置在所述绑定区中间区域的两侧，且多个所述悬空引脚通向所述触控电极的一端分别通过引线连接到对应的第一测试点，用于测量绑定区阻抗。
在本公开的一种示例性实施例中，沿着远离所述绑定区中间区域的方向所述悬空引脚的长度逐渐变短。
在本公开的一种示例性实施例中，在所述绑定区中间区域的两侧分别设置至少两个所述悬空引脚。
在本公开的一种示例性实施例中，在所述绑定区中间区域的两侧分别设置有三个所述悬空引脚。
在本公开的一种示例性实施例中，所述电极走线引脚的长度与沿着远离所述绑定区中间区域的方向所述悬空引脚的长度比例依次为1:1:0.75:0.5。
在本公开的一种示例性实施例中，多个所述悬空引脚通向所述电极的一端分别通过金手指连接到对应的第二测试点，且所述第二测试点与对应同一悬空引脚的所述第一测试点形成测试通道。
在本公开的一种示例性实施例中，所述第一测试点、所述第二测试点与所述引线为同层材料制作而成。
在本公开的一种示例性实施例中，所述第一测试点与所述引线以及所述悬空引脚为一体成型。
本公开的另一实施例中还公开一种触摸屏，包括：触摸基板、柔性电路板以及上述的绑定区连接结构。
本公开的再一实施例中还公开一种显示装置，包括上述的触摸屏。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出本公开一相关实施例中的绑定区设计结构示意图。
图2示出本公开一相关实施例中相应的绑定区与集成电路的整体设计结构示意图。
图3示出本公开示例性实施例中提供的绑定区设计结构示意图。
图4示出本公开示例性实施例中提供的绑定区与集成电路的整体设计结构示意图。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的范例；相反，提供这些实施方式使得本公开将更加全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。附图仅为本公开的 示意性图解，并非一定是按比例绘制。图中相同的附图标记表示相同或类似的部分，因而将省略对它们的重复描述。
此外，所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施方式中。在下面的描述中，提供许多具体细节从而给出对本公开的实施方式的充分理解。然而，本领域技术人员将意识到，可以实践本公开的技术方案而省略所述特定细节中的一个或更多，或者可以采用其它的方法、组元、装置、步骤等。在其它情况下，不详细示出或描述公知结构、方法、装置、实现、材料或者操作以避免喧宾夺主而使得本公开的各方面变得模糊。
附图中所示的一些方框图是功能实体，不一定必须与物理或逻辑上独立的实体相对应。可以采用软件形式来实现这些功能实体，或在一个或多个硬件模块或集成电路中实现这些功能实体，或在不同网络和/或处理器装置和/或微控制器装置中实现这些功能实体。
图1示出本公开一相关实施例中的绑定区设计结构示意图，如图1所示，触摸屏的显示区域设置有以阵列方式排布的多个触控电极10，每个触控电极10对应设置有电极走线12a和12b，其中电极走线12a连接触控电极10的发送端Tx1、Tx2，而电极走线12b连接触控电极10的接收端Rx1、Rx2、Rx3。通常情况下，显示区域的一侧周边区域设置有绑定区，绑定区中间区域设置有多条电极走线引脚20，而且电极走线12a和12b均与对应的电极走线引脚20连接。为了增强显示设备的抗拉拔力测试性能等，通常在绑定区中间区域的两侧还设置有悬空引脚(即Dummy Pin)30。如图1所示，图1中在绑定区中间区域的两侧分别设置两个悬空引脚30，悬空引脚30不与任何电极相连，悬空引脚30和电极走线引脚20的长度均为1mm。
在图1的基础上，图2还示出相应的绑定区与集成电路的整体设计结构示意图。如图2所示，绑定区的电极走线引脚20就是正常与电路连接的引脚，其与FPC金手指40绑定连接后接入到集成电路(Integrated Circuit，简称IC)50内部，而悬空引脚30与FPC金手指40绑定连接后不再连接任何电路。
因此，图1和图2所示的绑定区结构通过设置悬空引脚仅仅是增加FPC绑定长度，起到增大FPC焊点强度的作用，并不能实现测试的功能。
图3示出本公开示例性实施例中提供的绑定区设计结构示意图，如图3所示，触摸屏绑定区连接结构包括多个电极走线引脚20和悬空引脚30，其中多个电极走线引脚20设置在绑定区中间区域，而悬空引脚30设置在绑定区中间区域的两侧，也就是设置在多个电极走线引脚20的两侧。多个电极走线引脚20以单行阵列的形式分布在绑定区中间区域，分别用于连接触摸基板上的触控电极与柔性电路板上的电极，多个悬空引脚30通向触控电极的一端分别通过引线连接到对应的第一测试点，用于测量绑定区阻抗。
结合图3所示，本文中所涉及的“对应的第一测试点”以及后文出现的“对应的 第二测试点”均是指用于通过引线将悬空引脚或电极走线引脚与触控电极一对一连接起来的连接点。
另外，图3中也示出触控电极10、触控电极10的发送端T1、Tx2和接收端Rx1、Rx2、Rx3、触控电极10与电极走线引脚20之间的电极走线12a、12b均同于图1中相应编号的描述，此处不再赘述。
在一实施例中，绑定区中间区域的两侧分别设置至少两个悬空引脚30，如图3所示，以三个为例，也就是在绑定区中间区域的两侧分别设置三个悬空引脚30，并且这六个悬空引脚30通向触控电极的一端分别通过引线60连接到对应的第一测试点，在绑定区中间区域的两侧共形成六个测试点A1、A2、A3、A4、A5和A6。
需要说明的是，通过引线60将悬空引脚30引出到对应的第一测试点，以方便测量。本实施例中，对于第一测试点的排布以及引线的布线方式不做具体限定，图3仅为示例，实际设计过程中需要结合具体的电路结构而定，只要满足将第一测试点裸露出来，不会因距离过近而发生短路即可。
在一实施例中，本实施例中的悬空引脚30并不是等长的，而是采用渐变式设计。如图3所示，沿着远离绑定区中间区域的方向，两侧的悬空引脚30的长度逐渐变短。例如，电极走线引脚的长度与沿着远离绑定区中间区域的方向悬空引脚的长度的比例依次为1:1:0.75:0.5。在实际设计中，图3中悬空引脚30的长度分别为：0.5mm、0.75mm、1mm、1mm、0.75mm、0.5mm，绑定区中间区域的电极走线引脚20的长度均是1mm。
需要说明的是，本实施例的描述以及图3中在绑定区中间区域两侧分别设置3个悬空引脚以及引脚长度仅为示例，在本公开其他实施例中悬空引脚的个数还可以是2个甚至4个及以上，悬空引脚的长度按照一定比例渐变即可。例如，如果是两侧均设置5个悬空引脚，电极走线引脚的长度与沿着远离绑定区中间区域的方向悬空引脚的长度的比例依次为1:1:0.8:0.6:0.4:0.2。
图4示出本公开示例性实施例中提供的绑定区与集成电路的整体设计结构示意图，在图3所示基础上，悬空引脚30通向集成电路IC的一端还通过金手指40连接到第二测试点，与第一测试点A1-A6相对应的第二测试点分别为B1-B6。
如图4所示，不仅电极走线引脚20通过金手指40连接到IC内部，悬空引脚30也通过金手指40连接到对应的第二测试点上，从而针对六个悬空引脚对应形成六条测试通道，且测试通道的两端分别连接在第一测试点和第二测试点。
在本实施例中，第一测试点、第二测试点与引线为同层材料制作而成，即同一次工艺中制作而成。如果以金属材料为例，在沉积金属层之后，利用预设图形的掩膜板刻蚀形成悬空引脚、第一测试点、第二测试点与引线；其中引线的宽度小于悬空引脚的宽度，而测试点的宽度与悬空引脚的宽度大致相同，以便测试设备可以很好地与测 试点导通。第一测试点通过引线引出到悬空引脚下方以外的区域，而第二测试点可以直接形成在最长悬空引脚上方的区域，在制作时将第二测试点裸露出来即可。需要说明的是，第一测试点、第二测试点和引线的材料还可以是金属以外的其它导电材料。
如图3和图4所示，对于每一个悬空引脚而言，可以将悬空引脚与第一测试点以及两者之间的引线一体成型，保证良好的导通效率。
综上所述，本实施例提供的绑定区连接结构可以用来监控正常与电极连接的引脚对应的绑定区导通状况，绑定区中间区域两侧的悬空引脚首先通过设计测试点实现绑定阻抗的测量。其次第一测试点A1-A3采用长度渐变的设计为0.5mm、0.75mm、1mm，第一测试点A1-A3对应的悬空引脚的有效导通面积比例为2：3：4，这样在品质监控过程中，如检测到第一测试点A1出现绑定区出现异常，就可以及时预知产品出现的风险，实现有效的监控，进行工艺的改进，从而避免大量生产的过程中品质监控滞后的问题。
基于上述，本公开另一实施例中还提供一种触摸屏，包括触摸基板、柔性电路板以及用于连接触摸基板和柔性电路板的绑定区连接结构。
本实施例提供的触摸屏的有益效果与上述绑定区连接结构的有益效果相同，此处不再赘述。
本公开再一实施例中还提供一种显示装置，该显示装置包括上述触摸屏。
需要说明的是，本公开的实施例中对于显示装置的具体类型不做限定，本实施例中的显示装置可以为液晶面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本领域技术人员在考虑说明书及实践这里公开的实用新型后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (10)

  1. 一种绑定区连接结构，用于连接触摸基板和柔性电路板，包括：
    多个以单行阵列分布的电极走线引脚，设置在绑定区中间区域，多个所述电极走线引脚分别用于连接所述触摸基板上的触控电极与所述柔性电路板上的电极；
    多个悬空引脚，分别设置在所述绑定区中间区域的两侧，且多个所述悬空引脚通向所述触控电极的一端分别通过引线连接到对应的第一测试点，用于测量绑定区阻抗。
  2. 根据权利要求1所述的绑定区连接结构，沿着远离所述绑定区中间区域的方向所述悬空引脚的长度逐渐变短。
  3. 根据权利要求2所述的绑定区连接结构，在所述绑定区中间区域的两侧分别设置至少两个所述悬空引脚。
  4. 根据权利要求3所述的绑定区连接结构，在所述绑定区中间区域的两侧分别设置有三个所述悬空引脚。
  5. 根据权利要求1所述的绑定区连接结构，所述电极走线引脚的长度与沿着远离所述绑定区中间区域的方向所述悬空引脚的长度的比例依次为1:1:0.75:0.5。
  6. 根据权利要求1所述的绑定区连接结构，多个所述悬空引脚通向所述电极的一端分别通过金手指连接到对应的第二测试点，且所述第二测试点与对应同一悬空引脚的所述第一测试点形成测试通道。
  7. 根据权利要求6所述的绑定区连接结构，所述第一测试点、所述第二测试点与所述引线为同层材料制作而成。
  8. 根据权利要求7所述的绑定区连接结构，所述第一测试点与所述引线以及所述悬空引脚为一体成型。
  9. 一种触摸屏，包括：
    触摸基板；
    柔性电路板；以及
    权利要求1-8中任一项所述的绑定区连接结构。
  10. 一种显示装置，包括权利要求9所述的触摸屏。
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