WO2018223437A1 - 一种柔性oled器件及其制备方法 - Google Patents

一种柔性oled器件及其制备方法 Download PDF

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WO2018223437A1
WO2018223437A1 PCT/CN2017/090366 CN2017090366W WO2018223437A1 WO 2018223437 A1 WO2018223437 A1 WO 2018223437A1 CN 2017090366 W CN2017090366 W CN 2017090366W WO 2018223437 A1 WO2018223437 A1 WO 2018223437A1
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shape memory
memory material
oled device
flexible substrate
flexible
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French (fr)
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李文杰
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a flexible OLED device and a preparation method thereof, and belongs to the field of OLED devices.
  • OLED Organic Light Emitting Diode
  • the flexible substrate can be used to replace the traditional glass substrate to achieve the flexibility of the panel.
  • the commonly used flexible substrates include metal films and polymer films.
  • the metal film has good flexibility and is light in weight compared to the polymer substrate.
  • Shape memory material refers to the external physical environment or chemical environment (such as temperature, electromagnetic field, solvent, light, pH, etc.), the material can respond to the external environment, by the material in shape, strain, hardness, etc. The degree of adjustment allows the material to return to its original state when the external environment changes again in a specific manner and pattern. Shape memory material is a new type of intelligent material, which is widely used in aerospace, electronics, industry, medical and other fields.
  • Shape memory polymers SMPs.
  • heat-sensitive shape memory polymers whose shape memory effect is shown in Figure 1
  • Figure 1 Shape memory polymers
  • the patent provides a method for using a shape memory polymer as a flexible OLED substrate and a package film, and has a good application prospect in smart wearable display in the future.
  • the object of the present invention is to provide a flexible OLED device having a flexible substrate including a shape memory material and a flexible packaging film, which is changed in the external environment, in view of the problems existing in the prior art. When it is changed according to the environment, it has a corresponding shape change and has good deformation characteristics.
  • the invention also provides a preparation method of a flexible OLED device, which is simple in operation, easy to obtain raw materials, and easy to be industrially produced on a large scale.
  • One aspect of the invention provides a flexible OLED device comprising:
  • the flexible substrate and the encapsulation film contain a shape memory material.
  • the shape memory material includes, but is not limited to, a heat sensitive shape memory material, an electrically sensitive shape memory material, and a magnetically sensitive shape memory material.
  • the heat sensitive shape memory material comprises, but is not limited to, a substituted or unsubstituted polyamide, a substituted or unsubstituted polyolefin, a substituted or unsubstituted polyurethane, a substituted or unsubstituted polyester. And polynorbornene.
  • the heat sensitive shape memory material comprises polyimide, polyetherimide, styrene/butadiene copolymer, polyisoprene, crosslinked polyethylene, crosslinked At least one of polyvinyl alcohol, polynorbornene, and polyfluoroolefin.
  • the shape memory material is added in the flexible substrate in an amount of 50-80% by weight.
  • the shape memory material is added in an amount of 50 to 80% by weight in the encapsulating film.
  • the encapsulating film has a film structure containing a shape memory material therein.
  • the flexible substrate is the same as the encapsulating film and is a film comprising a shape memory material.
  • the flexible substrate contains electrically conductive particles.
  • the conductive particles include, but are not limited to, metals, metal oxides, metal nitrides, and carbon materials, preferably including silver, copper, gold, aluminum, and alloys thereof, aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, and boron nitride. One or more of them.
  • the flexible substrate has a conductive function, ie it can serve as a substrate and as an anode of an OLED device.
  • the flexible substrate comprises a two-layer film structure
  • the bottom layer is a film that does not contain conductive particles
  • the side close to the OLED device is a film containing conductive particles.
  • the flexible OLED device of the present invention has a shape memory material in the flexible substrate and the package film, and is externally When the environment changes, the shape change can be generated according to the change of the environment, so the deformation characteristics are good.
  • the OLED device is an OLED device as understood by those skilled in the art, and generally includes an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode disposed in order from bottom to top.
  • the flexible substrate contains conductive particles, it can serve as an anode of the OLED device.
  • Another aspect of the present invention provides a method of fabricating the above flexible OLED device, comprising:
  • Step A preparing a flexible substrate and a package film containing a shape memory material
  • Step B preparing an OLED device on the flexible substrate
  • Step C encapsulating the package film on the OLED device to fabricate the flexible OLED device.
  • the flexible substrate is prepared by the following method:
  • the substrate solution was subjected to a film forming treatment to obtain a flexible substrate.
  • the flexible substrate is prepared by the following method:
  • the substrate solution to which the conductive particles are added is subjected to a film formation treatment to obtain a flexible substrate containing conductive particles.
  • the conductive particles are added in an amount of from 0.5 to 10.0% by weight.
  • the flexible substrate is prepared by the following method:
  • a conductive layer is prepared on the flexible substrate underlayer by performing a film formation process on the substrate solution to which the conductive particles are added, thereby obtaining a flexible substrate having a two-layer film structure.
  • the conductive particles are added in an amount of from 0.5 to 10.0% by weight.
  • the encapsulating film is prepared by the following method:
  • the film solution was subjected to a film formation treatment to obtain a package film.
  • the shape memory material includes, but is not limited to, a heat sensitive shape memory material, an electrically sensitive shape memory material, and a magnetically sensitive shape memory material.
  • the heat sensitive shape memory material comprises, but is not limited to, a substituted or unsubstituted polyamide, a substituted or unsubstituted polyolefin, a substituted or unsubstituted polyurethane, a substituted or unsubstituted polyester. And polynorbornene.
  • the heat sensitive shape memory material comprises polyimide, polyetherimide, styrene/butadiene copolymer, polyisoprene, crosslinked polyethylene, crosslinked At least one of polyvinyl alcohol, polynorbornene, and polyfluoroolefin.
  • the initiator is not particularly limited, and an initiator commonly used in the art may be selected, and preferably includes benzoyl peroxide, t-butyl peroxybenzoate, ammonium persulfate, and persulfuric acid. At least one of potassium.
  • the crosslinking agent is not particularly limited, and an organic substance having a double bond which is common in the art may be selected, and preferably includes acrylic acid, N,N-methylenebisacrylamide, and methyl group. At least one of methyl acrylate.
  • the weight ratio of the shape memory material, the initiator and the crosslinking agent is 50 to 80: 0.5 to 5: 0 to 15, preferably 55 to 75: 1 to 3: 0. ⁇ 10.
  • the film forming treatment is not particularly limited, and a film forming method known to those skilled in the art may be selected.
  • the substrate solution or the film solution is spin-coated on a substrate, and dried and then released.
  • the flexible OLED device is fabricated by encapsulating the package film outside of the OLED device by an encapsulant.
  • the flexible OLED device of the present invention comprises a shape memory material in both the flexible substrate and the package film.
  • a corresponding shape change can be generated according to changes in the environment, and thus the deformation characteristics are good.
  • the shape memory material of the flexible OLED device of the present invention can also be replaced by a light-sensitive shape memory material and Shape memory materials that are sensitive to other external environmental stimuli, such as sensitive shape memory materials, broaden the application of flexible OLED devices.
  • the preparation method of the flexible OLED device of the invention is simple in operation, easy to obtain raw materials, and easy for large-scale industrial production.
  • FIG. 1 is a schematic view showing the shape memory effect of a heat-sensitive shape memory polymer
  • FIG. 2 is a schematic structural view of a flexible OLED device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural view of a flexible OLED device according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic structural view of a flexible OLED device according to Embodiment 3 of the present invention.
  • the flexible OLED device of the present invention comprises: a flexible substrate 1, an OLED device 2 over the flexible substrate, and a package film 3 encapsulated outside the OLED device 2;
  • the OLED device 2 and the encapsulation film 3 are connected by an encapsulant 4.
  • the flexible substrate 1 of the flexible OLED device of the present invention has the same composition and structure as the encapsulating film 3, and is a film containing a shape memory material (as shown in FIG. 2).
  • the flexible substrate 1 of the flexible OLED device of the present invention contains conductive particles 6 which are simultaneously the anode of the OLED device (as shown in Figure 3).
  • the flexible substrate 1 of the flexible OLED device of the present invention comprises a two-layer structure
  • the underlayer is a film having the same composition and structure as that of the package film 3
  • the upper layer is a film containing the conductive particles 6, at the same time It is the anode of an OLED device (as shown in Figure 4).
  • the flexible OLED device is fabricated by encapsulating the package film on the OLED device by an encapsulant.
  • the flexible OLED device is fabricated by encapsulating the package film on the OLED device by an encapsulant.
  • step (3) adding carbon nanotubes to the film solution of step (1), and dissolving to obtain a second solution;
  • the flexible OLED device is fabricated by encapsulating the package film on the OLED device by an encapsulant.
  • Any numerical value mentioned in the present invention includes all values of one unit at a time from the lowest value to the highest value if there is only two unit intervals between any lowest value and any highest value. For example, if the amount of a component is declared, or the value of a process variable such as temperature, pressure, time, etc. is 50-90, it means in this specification that 51-89, 52-88, ..., and 69 are specifically listed. -71 and 70-71 values. For values other than integers, it is appropriate to consider 0.1, 0.01, 0.001 or 0.0001 as a unit. This is just a few specific examples. In the present application, all possible combinations of numerical values between the lowest and highest values recited are considered to have been disclosed.

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种柔性OLED器件，包括柔性衬底（1），位于柔性衬底（1）之上的OLED器件（2）和封装在OLED器件（2）之外的封装薄膜（3）；其中，柔性衬底（1）和封装薄膜（3）内含有形状记忆材料。形状记忆材料可根据外部环境的变化产生相应的形状变化，使得柔性OLED器件的变形特性良好。

Description

一种柔性OLED器件及其制备方法
本申请要求享有2017年6月7日提交的名称为“一种柔性OLED器件及其制备方法”的中国专利申请CN201710422087.5的优先权，其全部内容通过引用并入本文中。
技术领域
本发明涉及一种柔性OLED器件及其制备方法，属于OLED器件领域。
背景技术
有机发光器件OLED(Organic Light Emitting Diode)以其良好的自发光特性、高的对比度、快速响应以及柔性显示等优势，得到了广泛的应用。
柔性OLED面板已经成为有机发光器件的重要研究方向，选择柔性衬底替代传统的玻璃基板可以实现面板的可弯曲性，常用的柔性衬底包括金属薄膜和聚合物薄膜。金属薄膜和聚合物衬底相比，后者具有良好的柔韧性并且质地轻薄。
形状记忆材料是指在外界物理环境或者化学环境的刺激下(如温度、电磁场、溶剂、光照、pH等)，材料能够对外界环境做出响应，通过对材料在形状、应变、硬度等进行一定程度的调整，从而可以在外部环境以特定的方式和规律再次变化时，材料可以回复至起始状态。形状记忆材料是一种新型的智能材料，在航空航天，电子，工业，医疗等领域具有广泛应用。
形状记忆聚合物(shape memory polymers，SMPs。以热敏感型形状记忆高分子为例，其形状记忆效应示意图如图1所述)是形状记忆材料中不可或缺的大家族，在纺织业中有很好的应用，以此材料制备的纱线或采用其做成的衣物在常温下形成的折皱会随着温度升高时消除，具有智能防皱功能。
本专利提供一种将形状记忆聚合物作为柔性OLED衬底以及封装薄膜的方法，在未来智能穿戴显示方面将会有很好的应用前景。
发明内容
本发明的目的是针对现有技术存在的问题，提供一种柔性OLED器件，该柔性OLED器件具有包含形状记忆材料的柔性衬底以及柔性封装薄膜，在外部环境发生变化 时，可根据环境的变化产生相应的形状变化，具有良好的变形特性。本发明还提供了一种柔性OLED器件的制备方法，本方法操作简单，原料易得，易于大规模工业化生产。
本发明一方面提供了一种柔性OLED器件，包括：
柔性衬底；
位于所述柔性衬底之上的OLED器件；
封装在所述OLED器件外部的封装薄膜；
其中，所述柔性衬底和封装薄膜内含有形状记忆材料。
根据本发明的一些实施方式，所述形状记忆材料包括但不限于热敏感型形状记忆材料、电敏感型形状记忆材料和磁敏感型形状记忆材料。
根据本发明的优选实施例，所述热敏感型形状记忆材料包括但不限于取代或未取代的聚酰胺、取代或未取代的聚烯烃、取代或未取代的聚氨酯、取代或未取代的聚酯和聚降冰片烯。
在一些具体的实施例中，所述热敏感型形状记忆材料包括聚酰亚胺、聚醚酰亚胺、苯乙烯/丁二烯共聚物、聚异戊二烯、交联聚乙烯、交联聚乙烯醇、聚降冰片烯和聚氟代烯烃中的至少一种。
根据本发明的一些实施例，所述柔性衬底中形状记忆材料的添加量为50-80wt％。
根据本发明的优选实施方式，所述封装薄膜中形状记忆材料的添加量为50-80wt％。
根据本发明的一些实施例，所述封装薄膜具有薄膜结构，其内含有形状记忆材料。
在本发明的一些实施例中，所述柔性衬底与所述封装薄膜相同，为一层含有形状记忆材料的薄膜。
在本发明的一些实施例中，所述柔性衬底内含有导电粒子。所述导电粒子包括但不限于金属、金属氧化物、金属氮化物和碳材料，优选包括银、铜、金、铝及其合金，氧化铝，氧化镁，氧化锌，氮化铝和氮化硼中的一种或多种。
由于添加了导电粒子，所述柔性衬底具有导电功能，即可以作为衬底，又可以作为OLED器件的阳极。
在本发明的一些实施例中，所述柔性衬底包括双层薄膜结构，底层为不含有导电粒子的薄膜，靠近OLED器件的一侧为含有导电粒子的薄膜。
本发明的柔性OLED器件，柔性衬底以及封装薄膜内均含有形状记忆材料，在外部 环境发生变化时，可根据环境的变化产生相应的形状变化，因此变形特性良好。
根据本发明的一些实施方式，所述OLED器件为本领域技术人员所理解的OLED器件，一般来说包括从下至上依次设置的阳极、空穴传输层、发光层、电子传输层和阴极。当所述柔性衬底内含有导电粒子时，其可作为OLED器件的阳极。
本发明另一方面提供了上述柔性OLED器件的制备方法，包括：
步骤A：制备含有形状记忆材料的柔性衬底和封装薄膜；
步骤B：在所述柔性衬底上制备OLED器件；
步骤C：将所述封装薄膜封装在所述OLED器件上，制得所述柔性OLED器件。
根据本发明的一些实施方式，所述柔性衬底通过如下方法制备：
将所述形状记忆材料加热至熔融状态，加入引发剂和交联剂，搅拌溶解，制得衬底溶液；
对所述衬底溶液进行成膜处理，得到柔性衬底。
根据本发明的一些实施方式，所述柔性衬底通过如下方法制备：
将所述形状记忆材料加热至熔融状态，加入引发剂和交联剂，搅拌溶解，制得衬底溶液；
向所述衬底溶液中加入导电粒子，搅拌溶解，制得添加了导电粒子的衬底溶液；
对所述添加了导电粒子的衬底溶液进行成膜处理，得到含有导电粒子的柔性衬底。
在一些具体的实施例中，所述导电粒子的添加量为0.5-10.0wt％。
根据本发明的一些实施方式，所述柔性衬底通过如下方法制备：
将所述形状记忆材料加热至熔融状态，加入引发剂和交联剂，搅拌溶解，制得衬底溶液；
向所述衬底溶液中加入导电粒子，搅拌溶解，制得添加了导电粒子的衬底溶液；
对所述衬底溶液进行成膜处理，得到柔性衬底底层；
通过对所述添加了导电粒子的衬底溶液进行成膜处理，在所述柔性衬底底层上制备导电层，得到具有双层薄膜结构的柔性衬底。
在一些具体的实施例中，所述导电粒子的添加量为0.5-10.0wt％。
根据本发明的优选实施例，所述封装薄膜通过如下方法制备：
将所述形状记忆材料加热至熔融状态，加入引发剂和交联剂，搅拌溶解，制得薄膜溶液；
对所述薄膜溶液进行成膜处理，得到封装薄膜。
根据本发明的一些优选实施例，所述形状记忆材料包括但不限于热敏感型形状记忆材料、电敏感型形状记忆材料和磁敏感型形状记忆材料。
根据本发明的优选实施例，所述热敏感型形状记忆材料包括但不限于取代或未取代的聚酰胺、取代或未取代的聚烯烃、取代或未取代的聚氨酯、取代或未取代的聚酯和聚降冰片烯。
在一些具体的实施例中，所述热敏感型形状记忆材料包括聚酰亚胺、聚醚酰亚胺、苯乙烯/丁二烯共聚物、聚异戊二烯、交联聚乙烯、交联聚乙烯醇、聚降冰片烯和聚氟代烯烃中的至少一种。
根据本发明的一个实施方式，对于所述引发剂没有特别的限定，选择本领域常见的引发剂即可，优选包括过氧化苯甲酰、过氧化苯甲酸叔丁酯、过硫酸铵和过硫酸钾中的至少一种。
根据本发明的一个优选实施例，对于所述交联剂没有特别的限定，选择本领域常见的具有双键的有机物即可，优选包括丙烯酸、N,N-亚甲基双丙烯酰胺和甲基丙烯酸甲酯中的至少一种。
在本发明的优选实施例中，所述形状记忆材料、引发剂和交联剂的重量份配比为50～80:0.5～5:0～15，优选为55～75:1～3:0～10。
根据本发明的一些实施方式，对于所述成膜处理没有特别的限定，可选择本领域人员公知的成膜方法。例如将所述衬底溶液或薄膜溶液旋涂在基板上，干燥后脱模即得。
根据本发明的优选实施例，通过封装胶将所述封装薄膜封装在所述OLED器件外部，制得所述柔性OLED器件。
本发明的优点和有益技术效果如下：
1.本发明的柔性OLED器件，柔性衬底以及封装薄膜内均含有形状记忆材料，在外部环境发生变化时，可根据环境的变化产生相应的形状变化，因此变形特性良好。
2.将本发明柔性OLED器件与显示技术结合，可实现智能显示。
3.本发明柔性OLED器件的形状记忆材料还可以替换为光敏感型形状记忆材料和化 学敏感型形状记忆材料等对其他外部环境刺激敏感的形状记忆材料，拓宽了柔性OLED器件应用。
4.本发明柔性OLED器件的制备方法，操作简单，原料易得，易于大规模工业化生产。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例共同用于解释本发明，并不构成对本发明的限制。在附图中：
图1为热敏感型形状记忆高分子的形状记忆效应示意图示意图；
图2为根据本发明实施例1柔性OLED器件的结构示意图；
图3为根据本发明实施例2的柔性OLED器件结构示意图；
图4为根据本发明实施例3的柔性OLED器件结构示意图。
具体实施方式
以下结合具体的实施例对本发明的技术方案作一步的说明。
如图2-3所示，本发明柔性OLED器件包括：柔性衬底1，位于所述柔性衬底之上的OLED器件2，封装在所述OLED器件2之外的封装薄膜3；在所述OLED器件2和封装薄膜3之间通过封装胶4连接。
在本发明的一个实施例中，本发明的柔性OLED器件的柔性衬底1与封装薄膜3的成分和结构相同，为含有形状记忆材料的薄膜(如图2所示)。
在本发明的一个实施例中，本发明的柔性OLED器件的柔性衬底1内含有导电粒子6，其同时是OLED器件的阳极(如图3所示)。
在本发明的一个实施例中，本发明的柔性OLED器件的柔性衬底1包括两层结构，底层为与封装薄膜3的成分和结构相同的薄膜，上层为含有导电粒子6的薄膜，其同时是OLED器件的阳极(如图4所示)。
实施例1
制备如图2所示的柔性OLED器件：
(1)将聚乙烯醇粉末加热至80℃，使其熔融，然后加入丙烯酸、N,N-亚甲基双丙烯酰胺和过硫酸钾，搅拌直至熔融，得到衬底溶液和薄膜溶液；
(2)将衬底溶液和薄膜溶液分别涂布在基板上，干燥后得到柔性衬底和封装薄膜；
(3)将柔性衬底固定在载台上，在其上依次制备阳极、空穴传输层、发光层、电子传输层和阴极；
(4)通过封装胶将所述封装薄膜封装在所述OLED器件的上，制得所述柔性OLED器件。
实施例2
制备如图3所示的封装结构：
(1)将聚降冰片烯粉末加热至50℃，使其熔融，然后加入甲基丙烯酸甲酯和过氧化苯甲酰，搅拌直至熔融，得到薄膜溶液；
(2)将薄膜溶液涂布在基板上，干燥后得到封装薄膜；
(3)向步骤(1)的薄膜溶液中加入碳纳米管，溶解后得到衬底溶液；
(4)将衬底溶液涂布在基板上，干燥后得到柔性衬底；
(5)将柔性衬底固定在载台上，在其上依次制备空穴传输层、发光层、电子传输层和阴极；
(4)通过封装胶将所述封装薄膜封装在所述OLED器件的上，制得所述柔性OLED器件。
实施例3
制备如图4所示的封装结构：
(1)将聚异戊二烯粉末加热至65℃，使其熔融，然后加入丙烯酸、甲基丙烯酸甲酯和过氧化苯甲酸叔丁酯，搅拌直至熔融，得到第一溶液；
(2)将第一溶液涂布在基板上，干燥后得到柔性衬底底层和封装薄膜；
(3)向步骤(1)的薄膜溶液中加入碳纳米管，溶解后得到第二溶液；
(4)将第二溶液涂布在步骤(2)制备的柔性衬底底层上，干燥后得到柔性衬底；
(5)将柔性衬底固定在载台上，在其上依次制备空穴传输层、发光层、电子传输层和阴极；
(4)通过封装胶将所述封装薄膜封装在所述OLED器件的上，制得所述柔性OLED器件。
在本发明中的提到的任何数值，如果在任何最低值和任何最高值之间只是有两个单位的间隔，则包括从最低值到最高值的每次增加一个单位的所有值。例如，如果声明一种组分的量，或诸如温度、压力、时间等工艺变量的值为50-90，在本说明书中它的意思是具体列举了51-89、52-88……以及69-71以及70-71等数值。对于非整数的值，可以适当考虑以0.1、0.01、0.001或0.0001为一单位。这仅是一些特殊指明的例子。在本申请中，以相似方式，所列举的最低值和最高值之间的数值的所有可能组合都被认为已经公开。
应当注意的是，以上所述的实施例仅用于解释本发明，并不构成对本发明的任何限制。通过参照典型实施例对本发明进行了描述，但应当理解为其中所用的词语为描述性和解释性词汇，而不是限定性词汇。可以按规定在本发明权利要求的范围内对本发明作出修改，以及在不背离本发明的范围和精神内对本发明进行修订。尽管其中描述的本发明涉及特定的方法、材料和实施例，但是并不意味着本发明限于其中公开的特定例，相反，本发明可扩展至其他所有具有相同功能的方法和应用。
附图标记说明
1      柔性衬底
2      OLED器件
3      封装薄膜
4      形状记忆材料
5      导电粒子
6      封装胶

Claims (13)

  1. 一种柔性OLED器件，包括：
    柔性衬底；
    位于所述柔性衬底之上的OLED器件；
    封装在所述OLED器件之外的封装薄膜；
    其中，所述柔性衬底和封装薄膜内含有形状记忆材料。
  2. 根据权利要求1所述的器件，其中，所述形状记忆材料包括但不限于热敏感型形状记忆材料、电敏感型形状记忆材料和磁敏感型形状记忆材料。
  3. 根据权利要求2所述的器件，其中，所述热敏感型形状记忆材料包括但不限于取代或未取代的聚酰胺、聚烯烃、聚氨酯、聚酯和聚降冰片烯。
  4. 根据权利要求3所述的器件，其中，所述热敏感型形状记忆材料包括聚酰亚胺、聚醚酰亚胺、苯乙烯/丁二烯共聚物、聚异戊二烯、交联聚乙烯、交联聚乙烯醇、聚降冰片烯和聚氟代烯烃中的至少一种。
  5. 根据权利要求1所述的器件，其中，所述柔性衬底中形状记忆材料的添加量为50-80wt％。
  6. 根据权利要求1所述的器件，其中，所述封装薄膜中形状记忆材料的添加量为50-80wt％。
  7. 一种柔性OLED器件的制备方法，包括：
    步骤A：制备含有形状记忆材料的柔性衬底和封装薄膜；
    步骤B：在所述柔性衬底上制备OLED器件；
    步骤C：将所述封装薄膜封装在所述OLED器件外部，制得所述柔性OLED器件。
  8. 根据权利要求7所述的方法，其中，所述柔性OLED器件包括：
    柔性衬底；
    位于所述柔性衬底之上的OLED器件；
    封装在所述OLED器件之外的封装薄膜；
    其中，所述柔性衬底和封装薄膜内含有形状记忆材料。
  9. 根据权利要求7所述的方法，其特征在于，所述形状记忆材料包括但不限于热敏感型形状记忆材料、电敏感型形状记忆材料和磁敏感型形状记忆材料。
  10. 根据权利要求9所述的方法，其特征在于，所述热敏感型形状记忆材料包括但不限于取代或未取代的聚酰胺、聚烯烃、聚氨酯、聚酯和聚降冰片烯。
  11. 根据权利要求10所述的方法，其特征在于，所述热敏感型形状记忆材料包括聚 酰亚胺、聚醚酰亚胺、苯乙烯/丁二烯共聚物、聚异戊二烯、交联聚乙烯、交联聚乙烯醇、聚降冰片烯和聚氟代烯烃中的至少一种。
  12. 根据权利要求7所述的方法，其中，所述柔性衬底中形状记忆材料的添加量为50-80wt％。
  13. 根据权利要求7所述的方法，其中，所述封装薄膜中形状记忆材料的添加量为50-80wt％。
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