WO2018221248A1

WO2018221248A1 - Plasma treatment device and method for manufacturing surface treated film

Info

Publication number: WO2018221248A1
Application number: PCT/JP2018/019129
Authority: WO
Inventors: 祐哉平野
Original assignee: 日本ゼオン株式会社
Priority date: 2017-05-31
Filing date: 2018-05-17
Publication date: 2018-12-06
Also published as: JPWO2018221248A1; TW201904360A

Abstract

Provided is a plasma treatment device comprising: a plasma treatment unit capable of subjecting a film to a plasma treatment; and an inversion unit capable of inverting a film that has been delivered from the plasma treatment unit and returning the film to the plasma treatment unit. The plasma treatment unit is comprises: a cooling roller having a peripheral surface that can be contacted by the film delivered to the inversion unit and the film returned from the inversion unit, said cooling roller being provided such that the temperature can be adjusted; and a plurality of electrodes provided facing the peripheral surface of the cooling roller. The plurality of electrodes include a first electrode and a second electrode. The first electrode is provided so that the film being delivered to the inversion unit is conveyed so as to pass between the first electrode and the cooling roller while the film contacts the peripheral surface of the cooling roller, and the second electrode is provided so that the film returned from the inversion unit is conveyed so as to pass between the second electrode and the cooling roller while the film contacts the peripheral surface of the cooling roller.

Description

Plasma processing apparatus and surface treatment film manufacturing method

The present invention relates to a plasma processing apparatus and a method for producing a surface-treated film using the plasma processing apparatus.

Conventionally, a technique for performing plasma treatment on a film is known (Patent Document 1).

JP 2001-49469 A

When the plasma treatment is performed on the film, the film is usually heated. When the film is heated, dimensional changes occur and the film can be deformed. For example, a resin film may shrink when heated. Therefore, from the viewpoint of suppressing deformation by cooling the film, the plasma treatment may be performed in a state where the film is in contact with the cooling roll.

When only one side of the film is subjected to plasma treatment, usually one cooling roll is used. However, when plasma treatment is performed on both sides of a film, it has been conventionally required to use a plurality of cooling rolls. Specifically, in a state in which one surface of the film is in contact with a certain cooling roll, plasma treatment is performed on the other surface of the film, and then in a state in which the other surface of the film is in contact with another cooling roll. The plasma treatment on both surfaces of the film was achieved by performing the plasma treatment on one surface of the film.

As described above, a conventional method using a plurality of cooling rolls, that is, a cooling roll used when plasma treatment is performed on one surface of a film and a cooling roll used when plasma treatment is performed on the other surface of the film. Then, the equipment tends to increase in size. If a specific example is given, if several cooling rolls are used, the installation space of cooling roll itself will be requested | required widely. In addition, it is required to install a plurality of devices for supplying the coolant to the cooling roll and a device for driving the cooling roll, and the size of the equipment is increased by the amount of these devices.

Furthermore, in the conventional method using a plurality of cooling rolls, control of processing conditions tends to be complicated. As a specific example, when a plurality of cooling rolls are used, usually, conveyance control for matching the conveyance speeds of the films conveyed on the respective cooling rolls is required. However, the control for matching the conveyance speed is complicated, and simplification is desired.

In general, in plasma processing, it is required to control the processing atmosphere. Therefore, the cooling roll is generally housed in a case, and plasma processing is generally performed while controlling the processing atmosphere in the case. Therefore, when a plurality of cooling rolls are used, usually a plurality of cases are prepared, and the processing atmosphere is controlled in each case. In this case, since supply and exhaust of atmospheric gas are performed for each case, the amount of exhaust air increases or it is difficult to adjust the pressure in the case. Therefore, for example, even if plasma processing is performed on both surfaces of the film under the same conditions, it is difficult to control the processing conditions on both surfaces to be the same.

The present invention was devised in view of the above-mentioned problems, a plasma processing apparatus capable of performing plasma processing on both surfaces of a film, and capable of downsizing equipment and simplifying control; and An object of the present invention is to provide a method for producing a surface-treated film, which can produce a surface-treated film having both surfaces subjected to plasma treatment using the plasma treatment apparatus.

[1] A plasma processing unit capable of performing plasma processing on the film, and an inversion unit capable of turning the film sent out from the plasma processing unit upside down and returning it to the plasma processing unit,
The plasma processing unit has a peripheral surface with which the film sent to the reversing unit and the film returned from the reversing unit can come into contact with each other, and a cooling roll provided so as to be adjustable in temperature. A plurality of electrodes provided to face the peripheral surface of
The plurality of electrodes includes a first electrode and a second electrode,
The first electrode is provided to be conveyed between the first electrode and the cooling roll in a state where the film fed to the reversing part is in contact with the peripheral surface of the cooling roll,
The second electrode is provided so as to be conveyed between the second electrode and the cooling roll in a state where the film returned from the reversing portion is in contact with the peripheral surface of the cooling roll. , Plasma processing equipment.
[2] When the total number of electrodes included in the plurality of electrodes is n, the center angle formed by the pair of adjacent electrodes with respect to the central axis of the cooling roll is 0.8 × ( 360 [deg.] / N) or higher, the plasma processing apparatus according to [1].
[3] The plasma processing apparatus according to [1] or [2], wherein the total number of electrodes included in the plurality of electrodes is 12 or less.
[4] A method for producing a surface-treated film using the plasma processing apparatus according to any one of [1] to [3],
Supplying a target film having a first surface and a second surface to the plasma processing unit;
With the first surface of the target film in contact with the peripheral surface of the cooling roll, the target film is conveyed so as to pass between the first electrode and the cooling roll. Applying plasma treatment to the two surfaces;
Sending the target film from the plasma processing unit to the reversing unit;
Turning the target film over at the reversing part;
Returning the target film from the reversing unit to the plasma processing unit;
In a state where the second surface of the target film is in contact with the peripheral surface of the cooling roll, the target film is transported so as to pass between the second electrode and the cooling roll. And a step of performing plasma treatment on one surface.

According to the present invention, a plasma processing apparatus capable of performing plasma processing on both sides of a film and capable of downsizing and simplifying control of the equipment; and both sides of the film were subjected to plasma processing. A method for producing a surface-treated film, which can produce a surface-treated film using the plasma treatment apparatus, can be provided.

FIG. 1 is a front view schematically showing a plasma processing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing a film reversing device provided in the reversing unit of the plasma processing apparatus according to the embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented with any modifications without departing from the scope of the claims and their equivalents.
In the following description, unless otherwise specified, “upstream” and “downstream” indicate upstream and downstream in the film transport direction.

FIG. 1 is a front view schematically showing a plasma processing apparatus 10 according to an embodiment of the present invention. As shown in FIG. 1, a plasma processing apparatus 10 according to an embodiment of the present invention includes a plasma processing unit 100 and a reversing unit 200.

The plasma processing unit 100 is provided so as to be able to perform plasma processing on the film 20 having the first surface 20F and the second surface 20S, and includes a case 110; a cooling roll 120; a plurality of

electrodes

131, 132, 133, and 141. 142 and 143; and

presser rolls

151, 152, 161 and 162; Here, the first surface 20F of the film 20 refers to one of the front surface and the back surface of the film 20, and the second surface 20S of the film 20 refers to the other of the front surface and the back surface of the film 20. Which of the front surface and the back surface of the film 20 is the first surface 20F and which is the second surface 20S can be arbitrarily set.

The case 110 is a housing that divides a room for performing a plasma treatment on the film 20 from the outside. The cooling roll 120; the

electrodes

131, 132, 133, 141, 142, and 143; and the

presser rolls

151, 152, 161, and 162; are housed in the case 110.

The case 110 has an entrance for taking in and out the film 20. In addition, the case 110 has an inlet (not shown) and an outlet (not shown) for an atmospheric gas for plasma processing. The case 110 is provided so that atmospheric gas supplied from a gas supply device (not shown) can be taken in through the intake port and discharged through the discharge port.

The cooling roll 120 is provided so as to be rotatable in the circumferential direction in the same direction as the conveyance direction of the film 20. The cooling roll 120 is provided as a support for supporting the film 20 during a period in which the plasma treatment is performed. Therefore, the cooling roll 120 has the peripheral surface 120P with which the film 20 sent out to the inversion part 200 and the film 20 returned from the inversion part 200 can contact. The “film 20 delivered to the reversing unit 200” refers to the film 20 upstream of the reversing unit 200 in the transport path of the film 20. The “film 20 returned from the reversing unit 200” refers to the film 20 downstream of the reversing unit 200 in the conveyance path of the film 20.

Usually, the cooling roll 120 is formed to include a conductive material such as a metal so that it can function as a roll electrode for generating plasma. For example, the cooling roll 120 may be a roll formed of a conductive material. In addition, for example, the cooling roll 120 may be a roll in which a roll body formed of a conductive material is covered with a dielectric such as glass or ceramics. The cooling roll 120 is normally grounded and provided so that a plasma discharge region can be formed between the

electrodes

131, 132, 133, 141, 142, and 143.

The cooling roll 120 is provided so that the temperature can be adjusted. More specifically, the cooling roll 120 is provided so that it can be cooled so that even if heat is generated during the plasma processing, the temperature rise of the film 20 due to the heat can be suppressed. Usually, a flow path (not shown) through which a coolant such as water can flow is provided in the cooling roll 120. And the cooling roll 120 is provided so that the temperature of the cooling roll 120 can be adjusted, when the refrigerant | coolant supplied from the refrigerant | coolant supply apparatus which is not shown distribute | circulates the said flow path.

The

electrodes

131, 132, 133, 141, 142, and 143 are provided to face the peripheral surface 120P of the cooling roll 120. Usually, these

electrodes

131, 132, 133, 141, 142, and 143 are provided as electrodes that extend in parallel to the axial direction of the cooling roll 120. Moreover, these

electrodes

131, 132, 133, 141, 142, and 143 are normally provided so that the distance from the peripheral surface 120P of the cooling roll 120 is the same. Furthermore, as the

electrodes

131, 132, 133, 141, 142, and 143, the same material, the same size, and the same shape are usually used.

The plurality of

electrodes

131, 132, 133, 141, 142, and 143 include a first electrode for performing plasma treatment on one of both

surfaces

20F and 20S of the film 20, and a first electrode for performing plasma treatment on the other. Including two electrodes. In the present embodiment, the

electrodes

131, 132, and 133 are classified as first electrodes, and the

electrodes

141, 142, and 143 are classified as second electrodes. The

first electrodes

131, 132, and 133 are provided so that the film 20 fed to the reversing unit 200 is conveyed through between the

first electrodes

131, 132, and 133 and the cooling roll 120. . The

second electrodes

141, 142, and 143 are provided so that the film 20 returned from the reversing unit 200 is conveyed between the

second electrodes

141, 142, and 143 and the cooling roll 120. Yes.

From the viewpoint of performing plasma treatment on both

surfaces

20F and 20S of the film 20 under the same conditions, the number of the

first electrodes

131, 132 and 133 and the number of the

second electrodes

141, 142 and 143 are preferably the same. . Further, from the same viewpoint as described above, the positions of the

first electrodes

131, 132, and 133 and the positions of the

second electrodes

141, 142, and 143 are preferably symmetric with respect to the central axis 120 C of the cooling roll 120. Here, “being symmetrical with respect to the central axis 120C of the cooling roll 120” means being point-symmetric with respect to the central axis C of the cooling roll 120 in the cross section perpendicular to the central axis C of the cooling roll 120. Say.

Since it is required to have at least one each of the first electrode and the second electrode, the number of the

electrodes

131, 132, 133, 141, 142, and 143 provided in the plasma processing unit 100 is usually two or more. On the other hand, from the viewpoint of facilitating maintenance, the number of

electrodes

131, 132, 133, 141, 142, and 143 is preferably 12 or less.

When the total number of the

electrodes

131, 132, 133, 141, 142, and 143 is n, the center angle θ that the set of adjacent electrodes forms with respect to the central axis 120C of the cooling roll 120 is all within a predetermined range. It is preferable to fit in. However, this central angle θ is 0 <θ ≦ 180 °. Here, examples of the pair of adjacent electrodes include a pair of the electrode 131 and the electrode 132, a pair of the electrode 131 and the electrode 143, and the like. Further, “the central angle θ formed by a pair of adjacent electrodes with respect to the central axis 120C of the cooling roll 120” means “in the cross section perpendicular to the central axis 120C of the cooling roll 120, the central axis 120C of the cooling roll 120; “An angle formed by two lines connecting the centers of adjacent electrodes”. In the following description, this center angle θ may be referred to as “interelectrode center angle θ”. In FIG. 1, a line L1 connecting the central axis 120C of the cooling roll 120 and the center 131C of the electrode 131, a line L2 connecting the central axis 120C of the cooling roll 120 and the center 132C of the electrode 132 adjacent to the electrode 131, Is an example of the interelectrode center angle θ.

Specifically, the interelectrode center angle θ is preferably “0.8 × (360 ° / n)” or more, and more preferably “0.9 × (360 ° / n)” or more. In particular, the interelectrode center angle θ is particularly preferably the same for any pair of adjacent electrodes, and thus the interelectrode center angle θ is “1.0 × (360 ° / n)”. It is particularly preferred. Thereby, the dispersion | variation in the plasma processing temperature for every

electrode

131, 132, 133, 141, 142, and 143 can be suppressed.

The presser rolls 151, 152, 161 and 162 are provided in the same direction as the transport direction of the film 20 and are rotatable in the circumferential direction. Further, the presser rolls 151, 152, 161 and 162 are provided such that their central axes (not shown) extend in the axial direction of the cooling roll 120.

The press rolls 151, 152, 161, and 162 are provided so that the film 20 can be brought into contact with the peripheral surface 120 P of the cooling roll 120 during the plasma treatment period by pressing the film 20. Specifically, the press rolls 151 and 152 press the film 20 with the press rolls 151 and 152, whereby the film 20 conveyed between the

first electrodes

131, 132, and 133 and the cooling roll 120. Is provided so as to be in contact with the peripheral surface 120P of the cooling roll 120. Also, the press rolls 161 and 162 cool the film 20 conveyed between the

second electrodes

141, 142, and 143 and the cooling roll 120 by pressing the film 20 with the press rolls 161 and 162. It is provided so as to be in contact with the peripheral surface 120P of the roll 120.

The reversing unit 200 is provided so that the film 20 sent from the plasma processing unit 100 can be turned over and returned to the plasma processing unit 100. Here, “turning the film 20 over” means that the positional relationship between the first surface 20F and the second surface 20S of the film 20 with respect to the cooling roll 120 is reversed.

FIG. 2 is a perspective view schematically showing a film reversing device 210 provided in the reversing unit 200 of the plasma processing apparatus 10 according to an embodiment of the present invention. Further, in FIG. 2, the second surface 20 S is indicated by hatching in order to easily distinguish the first surface 20 F and the second surface 20 S of the film 20.

2, the reversing unit 200 includes a film reversing device 210 that includes a plurality of turn bars 211, 212, and 213. The turn bars 211, 212, and 213 are members that can fold the film 20 being conveyed. The film reversing device 210 is provided so that the film 20 can be turned over by combining the turning by the turn bars 211, 212 and 213. As such a film reversing device 210, for example, a cross inverter manufactured by Belmatic Corporation or the like can be used. However, the mechanism used by the reversing unit 200 to turn over the film 20 is not limited, and the film 20 may be turned over by a mechanism other than the film reversing device 210 described above.

The plasma processing apparatus 10 according to an embodiment of the present invention is provided as described above. If this plasma processing apparatus 10 is used, the surface treatment film by which the plasma treatment was given to both the 1st surface and the 2nd surface can be manufactured. The manufacturing method will be described below. In the following description, a film before being subjected to plasma treatment on both the first surface and the second surface may be referred to as a “target film” in order to distinguish it from the surface-treated film.

As shown in FIG. 1, in the method for producing a surface-treated film using the plasma processing apparatus 10 described above, a target film 20 having a first surface 20F and a second surface 20S is prepared. As the target film 20, a long film is usually used. Here, the “long” film 20 means a film having a length of usually 5 times or more, preferably 10 times or more, and specifically a roll. A film having such a length that it can be wound up and stored or transported. The upper limit of the length is not particularly limited, and can be, for example, 100,000 times or less with respect to the width. Moreover, as the object film 20, a resin film is usually used.

Examples of the resin contained in the resin film include styrene resin; acrylic resin; methacrylic resin; halogen-containing resin; olefin resin such as polyethylene and polypropylene; resin having alicyclic structure; polycarbonate resin; polyethylene terephthalate, polyethylene naphthalate, etc. Polyamide resins; Thermoplastic polyurethane resins; Polysulfone resins such as polyethersulfone and polysulfone; Polyphenylene ether resins such as polymers of 2,6-xylenol; Cellulose esters, cellulose carbameters, cellulose ethers, etc. Cellulose derivatives; silicone resins such as polydimethylsiloxane and polymethylphenylsiloxane; and the like.

After the target film 20 is prepared, a process of supplying the target film 20 to the plasma processing unit 100 is performed. The supplied target film 20 enters the case 110 and contacts the cooling roll 120 via the presser roll 151. Then, the target film 20 is held by the press rolls 151 and 152 and is conveyed in a state where the first surface 20F of the target film 20 is in strong contact with the peripheral surface 120P of the cooling roll 120.

While the first surface 20F of the target film 20 is in contact with the peripheral surface 120P of the cooling roll 120, the target film 20 is conveyed so as to pass between the

first electrodes

131, 132, and 133 and the cooling roll 120. Then, a step of performing plasma treatment on the second surface 20S of the target film 20 is performed. An appropriate type and amount of atmospheric gas is supplied into the case 110 through an intake port (not shown). The supplied atmospheric gas is discharged through a discharge port (not shown) after flowing through the case 110. In such a state, a voltage is applied between the

first electrodes

131, 132, and 133 and the cooling roll 120 as a roll electrode by a power source (not shown). Due to this voltage, plasma is generated between the

first electrodes

131, 132 and 133 and the cooling roll 120. And the plasma process with respect to the 2nd surface 20S as a surface of the object film 20 on the opposite side to the cooling roll 120 is performed by this plasma. At this time, the type and amount of the atmospheric gas and the magnitude of the voltage to be applied can be set according to the material of the target film 20 and the property to be given to the target film 20 by the plasma treatment.

After the plasma processing is performed on the second surface 20S, a process of sending the target film 20 from the plasma processing unit 100 to the reversing unit 200 is performed. Specifically, the target film 20 that has been subjected to the plasma treatment on the second surface 20 S proceeds to the outside of the case 110 through the press roll 152 and is sent to the reversing unit 200.

Then, the process of turning over the object film 20 sent in the reversing part 200 is performed. In the present embodiment, as shown in FIG. 2, the target film 20 is turned upside down by folding back with a plurality of turn bars 211, 212, and 213. By such turning over, the state of the target film 20 changes from a state where the first surface 20F can contact the peripheral surface 120P of the cooling roll 120 to a state where the second surface 20S can contact the peripheral surface 120P of the cooling roll 120. To do.

After turning over, a process of returning the target film 20 from the reversing unit 200 to the plasma processing unit 100 is performed as shown in FIG. The target film 20 returned to the plasma processing unit 100 enters the case 110 and contacts the cooling roll 120 through the press roll 161. Then, the target film 20 is conveyed by the press rolls 161 and 162, and the second surface 20 S of the target film 20 is in strong contact with the peripheral surface 120 P of the cooling roll 120.

While the second surface 20S of the target film 20 is in contact with the peripheral surface 120P of the cooling roll 120, the target film 20 is conveyed so as to pass between the

second electrodes

141, 142 and 143 and the cooling roll 120. Then, a step of performing plasma treatment on the first surface 20F of the target film 20 is performed. As described above, an appropriate type and amount of atmospheric gas is circulated in the case 110. In such a state, by applying a voltage by a power source (not shown) between the

second electrodes

141, 142 and 143 and the cooling roll 120 as a roll electrode, in the same manner as the plasma treatment for the second surface 20S, Plasma processing is performed on the first surface 20F of the target film 20. And thereby, the plasma processing to both the 1st surface 20F and the 2nd surface 20S of the object film 20 is performed, and the surface treatment film 20 is obtained.

The surface treatment film 20 thus obtained is sent out from the plasma processing unit 100 and collected by an appropriate collection device (not shown). A functional group is generated by plasma treatment on the first surface 20F and the second surface 20S of the obtained surface-treated film 20, and the adhesiveness thereof is enhanced.

In the plasma processing apparatus 10 according to the above-described embodiment, since the common cooling roll 120 is used for the plasma processing for the first surface 20F and the plasma processing for the second surface 20S, the equipment can be downsized. For example, since only one cooling roll 120 is used, the installation space of the cooling roll 120 itself can be reduced, the cooling system for supplying the cooling roll 120 with a coolant can be downsized, or a power supply system for applying voltage can be provided. The equipment can be downsized by simplifying or reducing the number of devices for rotating the cooling roll 120.

Furthermore, in the plasma processing apparatus 10 according to the above-described embodiment, control related to plasma processing can be simplified. For example, since the common cooling roll 120 is used for the plasma treatment for the first surface 20F and the plasma treatment for the second surface 20S, a conventional method for matching the conveyance speeds of the target films conveyed on different cooling rolls. Such conveyance control is unnecessary. Therefore, control of the conveyance speed of the target film can be simplified.

Moreover, in the plasma processing apparatus 10 according to the above-described embodiment, the plasma processing for the first surface 20F and the plasma processing for the second surface 20S can be performed in the common case 110. Therefore, the exhaust gas volume of the atmospheric gas can be reduced as compared with the conventional method using a plurality of cases. Moreover, in the plasma processing apparatus 10 according to the above-described embodiment, it is easier to control the pressure of the atmospheric gas in the case 110 than in the conventional method using a plurality of cases. For example, when plasma processing is to be performed on the first surface 20F and the second surface 20S of the target film 20 under the same conditions, both the types and pressures of the atmospheric gas are usually processed without special adjustment. Therefore, pressure control is easy.

Furthermore, in the plasma processing apparatus 10 according to the above-described embodiment, since the temperature increase of the target film 20 due to the plasma processing is suppressed by the cooling roll 120, the dimensional change of the target film 20 due to heat can be suppressed. At this time, if the inter-electrode center angle θ of the

electrodes

131, 132, 133, 141, 142, and 143 is appropriately set, variation in plasma processing temperature for each of the

electrodes

131, 132, 133, 141, 142, and 143 can be suppressed. The plasma processing conditions for the

electrodes

131, 132, 133, 141, 142, and 143 can be made uniform. Therefore, it becomes easy to control the processing conditions of the plasma treatment, and the surface treatment film 20 as intended can be easily obtained. This can be understood by considering, for example, the case where the interelectrode center angle θ is small. When the interelectrode center angle θ is small, the target film 20 is subjected to the plasma treatment by the next electrode before being sufficiently cooled by the cooling roll 120 after being heated by being subjected to the plasma treatment by a certain electrode. The temperature at the time of treatment may be higher than intended. However, by appropriately setting the interelectrode center angle θ, it becomes easy to avoid such unintended high temperatures, and variations in plasma processing temperature can be suppressed.

In the plasma processing apparatus 10 according to the above-described embodiment, the target film 20 is pressed against the presser rolls 151, 152, 161, and 162. Therefore, the target film 20 has a cooling roll during a period passing between the

first electrodes

131, 132, and 133 and the cooling roll 120 and a period passing between the

second electrodes

141, 142, and 143 and the cooling roll 120. It strongly contacts the peripheral surface 120P of 120. Therefore, a large frictional force acts between the cooling roll 120 and the target film 20. Therefore, even if stress that causes expansion or contraction occurs in the target film 20 due to heating by the plasma treatment, the frictional force resists the stress, so that the dimensional change of the target film 20 can be effectively suppressed.

Furthermore, in the plasma processing apparatus 10 according to the above-described embodiment, since all the

electrodes

131, 132, 133, 141, 142, and 143 are provided at an equal distance from the peripheral surface 120 P of the cooling roll 120, each electrode 131 is provided. , 132, 133, 141, 142, and 143 can be made uniform. Therefore, it is possible to control the processing conditions of the plasma processing particularly easily.

In the embodiment described above, the conditions such as the material, thickness, and conveyance speed of the treatment film 20; the type and pressure of the atmospheric gas; the magnitude of the applied voltage for generating plasma; Can be set arbitrarily.

DESCRIPTION OF SYMBOLS 10 Plasma processing apparatus 20 Film 20F 1st surface 20S 2nd surface 100 Plasma processing part 110 Case 120 Cooling roll

120P Circumferential surface

120C Center axis

131, 132, 133, 141, 142 and 143

Electrode

151, 152, 161 and 162 Pressing roll 200 reversing unit 210

film reversing device

211, 212 and 213 turn bar

Claims

A plasma processing unit capable of performing plasma processing on the film, and a reversing unit capable of turning the film sent out from the plasma processing unit upside down and returning it to the plasma processing unit,
The plasma processing unit has a peripheral surface with which the film sent to the reversing unit and the film returned from the reversing unit can come into contact with each other, and a cooling roll provided so as to be adjustable in temperature. A plurality of electrodes provided to face the peripheral surface of
The plurality of electrodes includes a first electrode and a second electrode,
The first electrode is provided to be conveyed between the first electrode and the cooling roll in a state where the film fed to the reversing part is in contact with the peripheral surface of the cooling roll,
The second electrode is provided so as to be conveyed between the second electrode and the cooling roll in a state where the film returned from the reversing portion is in contact with the peripheral surface of the cooling roll. , Plasma processing equipment.
When the total number of electrodes included in the plurality of electrodes is n, the center angle formed by the set of adjacent electrodes with respect to the central axis of the cooling roll is 0.8 × (360 ° / The plasma processing apparatus according to claim 1, wherein n) or more.
The plasma processing apparatus according to claim 1 or 2, wherein the total number of electrodes included in the plurality of electrodes is 12 or less.
A method for producing a surface-treated film using the plasma treatment apparatus according to any one of claims 1 to 3,
Supplying a target film having a first surface and a second surface to the plasma processing unit;
With the first surface of the target film in contact with the peripheral surface of the cooling roll, the target film is conveyed so as to pass between the first electrode and the cooling roll. Applying plasma treatment to the two surfaces;
Sending the target film from the plasma processing unit to the reversing unit;
Turning the target film over at the reversing part;
Returning the target film from the reversing unit to the plasma processing unit;
In a state where the second surface of the target film is in contact with the peripheral surface of the cooling roll, the target film is transported so as to pass between the second electrode and the cooling roll. And a step of performing plasma treatment on one surface.