TW201904360A - Plasma processing device and method for manufacturing surface treated film - Google Patents

Abstract

Provided is a plasma treatment device comprising: a plasma treatment unit capable of subjecting a film to a plasma treatment; and an inversion unit capable of inverting a film that has been delivered from the plasma treatment unit and returning the film to the plasma treatment unit. The plasma treatment unit is comprises: a cooling roller having a peripheral surface that can be contacted by the film delivered to the inversion unit and the film returned from the inversion unit, said cooling roller being provided such that the temperature can be adjusted; and a plurality of electrodes provided facing the peripheral surface of the cooling roller. The plurality of electrodes include a first electrode and a second electrode. The first electrode is provided so that the film being delivered to the inversion unit is conveyed so as to pass between the first electrode and the cooling roller while the film contacts the peripheral surface of the cooling roller, and the second electrode is provided so that the film returned from the inversion unit is conveyed so as to pass between the second electrode and the cooling roller while the film contacts the peripheral surface of the cooling roller.

Description

Plasma processing device and method for manufacturing surface-treated film

The invention relates to a plasma processing device and a method for manufacturing a surface treatment film using the plasma processing device.

Conventionally, a technique of performing plasma treatment on a thin film is known (Patent Document 1: Japanese Patent Publication No. 2001-49469).

Plasma treatment of the film usually heats the film. If the film is heated, there is a possibility of dimensional change and film deformation. For example, if the resin film is heated, it may shrink. Therefore, from the viewpoint of cooling the film to suppress deformation, there is a case where plasma treatment is performed with the film in contact with the cooling roller.

When plasma treatment is applied to only one side of the film, one cooling roll is usually used. However, in the case of performing plasma treatment on both sides of the film, in the past, it was necessary to use a plurality of cooling rollers. Specifically, in a state where one surface of the film is in contact with a cooling roller, plasma treatment is performed on the other surface of the film, and then in a state in which the other surface of the film is in contact with another cooling roller, Plasma treatment is performed on one surface, thereby achieving plasma treatment on both sides of the film.

In this way, in the conventional method using a plurality of cooling rollers such as "a cooling roller used when performing plasma treatment on one surface of the film and a cooling roller used when performing plasma treatment on the other surface of the film" There is a tendency to enlarge. As a specific example, if a plurality of cooling rollers are used, the installation space requirements of the cooling rollers themselves become wider. In addition, it is necessary to provide a plurality of devices for supplying refrigerant to the cooling rollers and devices for driving the cooling rollers. With only these devices, the equipment becomes larger.

Furthermore, in the conventional method using a plurality of cooling rollers, the control of the processing conditions tends to become complicated. As a specific example, if a plurality of cooling rollers are used, transport control is generally required to make the transport speed of the film transported on each cooling roller uniform. However, the control to make the transportation speed uniform is complicated, and it is expected to be simplified.

In addition, in plasma processing, it is necessary to control the processing environment. Therefore, the cooling roller is generally housed in a casing, and the plasma processing is performed while controlling the processing environment in the casing. Therefore, when a plurality of cooling rollers are used, usually a plurality of casings are prepared, and in these casings, the processing environment is controlled individually. In this case, since the supply and exhaust of ambient air are performed for each housing, the amount of exhaust air increases from time to time, and it is difficult to adjust the pressure in the housing. Therefore, for example, even if plasma treatment is to be performed on both sides of the film under the same conditions, it is still difficult to control the processing conditions on both sides to be the same.

The present invention was conceived in view of the foregoing problems, and its object is to provide: a plasma processing apparatus that can perform plasma processing on both sides of a film, and can miniaturize equipment and simplify control; and a surface treatment film A manufacturing method that can manufacture a surface-treated thin film that is subjected to plasma treatment on both sides using the aforementioned plasma processing apparatus.

[1] A plasma processing apparatus including a plasma processing section capable of performing plasma processing on a thin film, and an inversion capable of reversing the thin film sent from the plasma processing section and returning it to the plasma processing section The plasma processing section includes a cooling roller and a plurality of electrodes, and the cooling roller has a circumferential surface that the film sent to the reversing section and the film returned from the reversing section can contact, and is provided to be adjustable Temperature, the plurality of electrode installation surfaces face the circumferential surface of the cooling roller; the plurality of electrodes include a first electrode and a second electrode; the first electrode contacts the circumference of the cooling roller with the film sent to the reversing portion In the state of the surface, it is provided by being transported between the first electrode and the cooling roller; the second electrode passes through the film while the film returned from the reversing portion contacts the circumferential surface of the cooling roller The second electrode is provided so as to be transported between the aforementioned cooling rollers.

[2] The plasma processing apparatus according to [1], wherein when the total number of electrodes included in the plurality of electrodes is n, the combination of adjacent electrodes is located relative to the central axis of the cooling roller The center angles of the successes are all above 0.8 × (360 ° / n).

[3] The plasma processing apparatus according to [1] or [2], wherein the total number of electrodes included in the plurality of electrodes is 12 or less.

[4] A method for manufacturing a surface-treated film, which is a method for manufacturing a surface-treated film using the plasma processing apparatus as described in any one of [1] to [3]; it includes: a first surface and The step of supplying the target film on the second surface to the plasma processing section so that the target film passes through the first electrode and the cooling roller in a state where the first surface of the target film contacts the circumferential surface of the cooling roller The process of transporting between the two, while performing the plasma treatment process on the second surface of the target film, the process of sending the target film from the plasma processing part to the reversal part, the object film in the reversal part The process of intermediate reversal, the process of returning the target film from the reversal section to the plasma treatment section, and the state in which the second surface of the target film is in contact with the circumferential surface of the cooling roller The target film is transported between the second electrode and the cooling roller, and a plasma treatment process is performed on the first surface of the target film

According to the present invention, there can be provided: a plasma processing apparatus that can perform plasma processing on both sides of a film, and can miniaturize equipment and simplify control; and a method of manufacturing a surface-treated film that uses the foregoing plasma processing The device can be used to produce surface-treated films that are plasma-treated on both sides.

The embodiments and examples are disclosed below to explain the present invention in detail. However, the present invention is not limited to the embodiments and examples disclosed below, and can be arbitrarily changed and implemented without departing from the scope of the application and its equivalent.

In the following description, unless otherwise specified, the so-called "upstream" and "downstream" mean upstream and downstream in the direction of film transport.

FIG. 1 is a schematic front view of a plasma processing apparatus 10 according to an embodiment of the present invention. As shown in FIG. 1, a plasma processing apparatus 10 according to an embodiment of the present invention includes a plasma processing unit 100 and a reversing unit 200.

The plasma processing section 100 is provided to be capable of performing plasma processing on the film 20 having the first surface 20F and the second surface 20S, and includes: a housing 110; a cooling roller 120; a plurality of electrodes 131, 132, 133, 141, 142 and 143; and pressure rollers 151, 152, 161 and 162. Here, the first surface 20F of the film 20 refers to one of the front surface and the reverse surface of the film 20, and the second surface 20S of the film 20 refers to the other of the front surface and the reverse surface of the film 20. It can be arbitrarily set which of the front surface and the back surface of the film 20 is designated as the first surface 20F and which is designated as the second surface 20S.

The housing 110 is a box that divides the compartment for plasma treatment of the film 20 from the outside. Cooling roller 120; electrodes 131, 132, 133, 141, 142, and 143; and pressing rollers 151, 152, 161, and 162; housed in this housing 110.

The housing 110 is formed with an inlet and outlet for carrying in and out of the film 20. In addition, an inlet (not shown) and an outlet (not shown) of the ambient gas for plasma processing are formed in the housing 110. The housing 110 is provided in such a manner that ambient air supplied from a gas supply device not shown can be fed through the inlet and discharged through the outlet.

The cooling roller 120 is provided so as to be able to rotate in the circumferential direction in the same direction as the transport direction of the film 20. This cooling roller 120 is provided as a support for supporting the film 20 during the plasma treatment. Therefore, the cooling roller 120 has the circumferential surface 120P that the film 20 sent out to the reversing section 200 and the film 20 sent back from the reversing section 200 can contact. The aforementioned “film 20 sent to the reversing section 200” refers to the film 20 that is located upstream of the reversing section 200 in the transport path of the film 20. In addition, the "film 20 sent back from the reversing unit 200" refers to the film 20 located downstream of the reversing unit 200 in the transport path of the film 20.

In general, the cooling roller 120 is formed to include a conductive material such as metal in order to function as a roller electrode for generating plasma. For example, the cooling roller 120 may be a roller formed of a conductive material. In addition, for example, the cooling roller 120 may be a roller in which a dielectric body such as glass or ceramic is coated on a roller body formed of a conductive material. The cooling roller 120 is generally grounded, and is provided in such a manner that a plasma discharge area can be formed between the electrodes 131, 132, 133, 141, 142, and 143.

The cooling roller 120 is provided to adjust the temperature. In more detail, the cooling roller 120 is provided to be capable of cooling in order to suppress the temperature rise of the film 20 due to the heat even if heat is generated during plasma processing. Generally, the cooling roller 120 is provided with a flow path (not shown) through which a refrigerant such as water can flow. Moreover, the cooling roller 120 is installed so that the temperature of the cooling roller 120 can be adjusted by the refrigerant supplied from a refrigerant supply device not shown flowing through the aforementioned flow path.

The electrodes 131, 132, 133, 141, 142, and 143 are disposed so as to face the circumferential surface 120P of the cooling roller 120. Generally, these electrodes 131, 132, 133, 141, 142, and 143 are provided as electrodes extending parallel to the axis direction of the cooling roller 120. In addition, the electrodes 131, 132, 133, 141, 142, and 143 are generally provided at the same distance from the circumferential surface 120P of the cooling roller 120. In addition, as the electrodes 131, 132, 133, 141, 142, and 143, those having the same material, the same size, and the same shape are generally used.

The aforementioned plurality of electrodes 131, 132, 133, 141, 142, and 143 include a first electrode for performing plasma treatment on one of the two surfaces 20F and 20S of the thin film 20 and a plasma for applying the plasma to the other Treated second electrode. In this embodiment, the electrodes 131, 132, and 133 are classified as the first electrodes, and the electrodes 141, 142, and 143 are classified as the second electrodes. The first electrodes 131, 132, and 133 are provided so that the film 20 sent to the reversing section 200 is transported between the first electrodes 131, 132, and 133 and the cooling roller 120. In addition, the second electrodes 141, 142, and 143 are provided in such a manner that the film 20 returned from the reversing section 200 is transported between the second electrodes 141, 142, and 143 and the cooling roller 120.

From the viewpoint of performing plasma treatment on both surfaces 20F and 20S of the thin film 20 under the same conditions, the number of the first electrodes 131, 132, and 133 and the number of the second electrodes 141, 142, and 143 are preferably the same. From the same viewpoint as above, the positions of the first electrodes 131, 132, and 133 and the positions of the second electrodes 141, 142, and 143 are preferably relative to the central axis 120C of the cooling roller 120. Here, "symmetrical with respect to the central axis 120C of the cooling roller 120" means that the cross-section perpendicular to the central axis of the cooling roller 120 is point-symmetric with the central axis 120C of the cooling roller 120 as the center of symmetry.

Since it is necessary to have at least one of the first electrode and the second electrode, the number of electrodes 131, 132, 133, 141, 142, and 143 provided in the plasma processing section 100 is usually two or more. On the other hand, from the viewpoint of facilitating maintenance, the number of electrodes 131, 132, 133, 141, 142, and 143 is preferably 12 or less.

When the total number of electrodes 131, 132, 133, 141, 142, and 143 is n, the central angle θ formed by the combination of adjacent electrodes with respect to the central axis 120C of the cooling roller 120 falls within the specified Within the range is better. However, the central angle θ is 0 <θ ≦ 180 °. Here, the combination of adjacent electrodes includes, for example, a combination of the electrode 131 and the electrode 132, a combination of the electrode 131 and the electrode 143, and the like. Also, the "center angle θ formed by the combination of adjacent electrodes with respect to the central axis 120C of the cooling roller 120" means "in a cross section perpendicular to the central axis 120C of the cooling roller 120, the central axis of the cooling roller 120 The angle formed by 120C and the two lines connecting the centers of adjacent electrodes. " In the following description, this central angle θ may be referred to as "inter-electrode central angle θ". In FIG. 1, a line L1 connecting the center axis 120C of the cooling roller 120 and the center 131C of the electrode 131 and a line L2 connecting the center axis 120C of the cooling roller 120 and the center 132C of the electrode 132 adjacent to the electrode 131 are formed The angle is disclosed as an example of the aforementioned central angle θ between the electrodes.

Specifically, the center angle θ between the electrodes is specifically “0.8 × (360 ° / n)” or more, and more preferably “0.9 × (360 ° / n)” or more. Among them, the center angle θ between the electrodes is preferably the same for any combination of adjacent electrodes. Therefore, the center angle θ between the electrodes is preferably “1.0 × (360 ° / n)”. Thereby, the deviation of the plasma processing temperature of each of the electrodes 131, 132, 133, 141, 142, and 143 can be suppressed.

The pressure rollers 151, 152, 161, and 162 are provided to be able to rotate in the circumferential direction in the same direction as the transport direction of the film 20. In addition, the pressure rollers 151, 152, 161, and 162 are provided so that their central axes (not shown) extend in the axial direction of the cooling roller 120.

The pressure rollers 151, 152, 161, and 162 are arranged so that the film 20 can be pressed to contact the circumferential surface 120P of the cooling roller 120 during the plasma treatment. Specifically, the pressing rollers 151 and 152 can “make the film 20 transported between the first electrodes 131, 132 and 133 and the cooling roller 120 come into contact by pressing the film 20 with the pressing rollers 151 and 152 The state of the circumferential surface 120P of the cooling roller 120 is set in such a manner that the pressing rollers 161 and 162 can “pass the first electrode 141, 142 and 143 and the cooling roller by pressing the film 20 with the pressing rollers 161 and 162” The film 20 transported between 120 is provided so as to contact the circumferential surface 120P of the cooling roller 120.

The reversing section 200 is provided so that the film 20 sent from the plasma processing section 100 can be reversed and sent back to the plasma processing section 100. Here, “reversing” the film 20 refers to inverting the positional relationship between the first surface 20F and the second surface 20S of the film 20 using the cooling roller 120 as a reference.

2 is a schematic perspective view of a film reversing device 210 included in the reversing section 200 of the plasma processing apparatus 10 according to an embodiment of the present invention. In addition, in FIG. 2, in order to easily distinguish the first surface 20F and the second surface 20S of the thin film 20, the second surface 20S is indicated by diagonal lines.

As shown in FIG. 2, the reversing unit 200 includes a film reversing device 210 having a plurality of steering bars 211, 212 and 213. The steering rods 211, 212, and 213 are components that can fold back the transported film 20. The film reversing device 210 is provided so that the film 20 can be reversed by combining the turning back caused by the aforementioned steering rods 211, 212, and 213. As such a film inverting device 210, for example, a cross-inverting device (Cross Inverter) manufactured by Bellmatic Corporation or the like can be used. However, the mechanism used for the reversing section 200 to reverse the film 20 is not limited, and the reversal of the film 20 may be realized by a mechanism other than the film reversing device 210 described above.

The plasma processing apparatus 10 according to an embodiment of the present invention is provided as described above. If this plasma processing apparatus 10 is used, it is possible to manufacture a surface-treated film that performs plasma processing on both the first surface and the second surface. The manufacturing method will be described below. In addition, in the following description, in order to distinguish it from a surface-treated film, a film before plasma treatment is applied to both the first surface and the second surface may be referred to as an “object film”.

As shown in FIG. 1, in the method of manufacturing a surface-treated film using the plasma processing apparatus 10 described above, a target film 20 having a first surface 20F and a second surface 20S is prepared. As the target film 20, a long film is generally used. Here, the so-called "strip-shaped" film 20 refers to a film that generally has a length of 5 times or more relative to the width, and preferably has a length of 10 times or more. Take up the length of the film for storage or handling. The upper limit of the length is not particularly limited. For example, the width should be 100,000 times or less relative to the width. In addition, as the target film 20, a resin film is generally used.

Examples of the resin contained in the resin film include: styrene resin; acrylic resin; methacrylic resin; halogen-containing resin; olefin resin such as polyethylene and polypropylene; resin having an alicyclic structure; polycarbonate resin; Polyester resins such as polyethylene terephthalate and polyethylene naphthalate; polyamide resins; thermoplastic polyurethane resins; polyether resins such as polyether and polybenzaldehyde; polymerization of 2,6-xylenol Polyphenylene ether resins such as cellulose; cellulose esters, cellulose carbamates, cellulose ethers and other cellulose derivatives; polydimethylsiloxane, polymethylphenylsiloxane and other silicone resins; Wait.

After preparing the target film 20, a process of supplying the target film 20 to the plasma processing section 100 is performed. The supplied target film 20 enters the casing 110 and passes through the pressing roller 151 to contact the cooling roller 120. Then, the object film 20 is conveyed in a state where the first surface 20F of the object film 20 is brought into contact with the circumferential surface 120P of the cooling roller 120 by being pressed by the pressure rollers 151 and 152.

While the first surface 20F of the target film 20 is in contact with the circumferential surface 120P of the cooling roller 120, the target film 20 is transported so as to pass between the first electrodes 131, 132, and 133 and the cooling roller 120 while aligning the object The second surface 20S of the film 20 is subjected to a plasma treatment process. Within the housing 110, a suitable type and amount of ambient gas is supplied through an inlet (not shown). In addition, the supplied ambient gas flows through the housing 110 and is discharged through a discharge port (not shown). In such a state, a voltage is applied between the first electrodes 131, 132, and 133 and the cooling roller 120 as a roller electrode by a power source not shown. With this voltage, plasma is generated between the first electrodes 131, 132, and 133 and the cooling roller 120. Then, by this plasma, a plasma treatment is performed on the second surface 20S which is the surface of the target film 20 on the opposite side to the cooling roller 120. At this time, the type and amount of the ambient gas and the magnitude of the applied voltage depend on the material of the target thin film 20 and the properties to be given to the target thin film 20 by plasma treatment.

After the plasma treatment is performed on the second surface 20S, the process of sending the target thin film 20 from the plasma treatment section 100 to the reversing section 200 is performed. Specifically, the film 20 to which the plasma treatment has been applied to the second surface 20S passes through the pressing roller 152 and advances to the outside of the housing 110 and is sent to the reversing section 200.

After that, a process of inverting the delivered film 20 in the inversion unit 200 is performed. In the present embodiment, as shown in FIG. 2, the target film 20 is reversed by turning back due to the plurality of steering bars 211, 212 and 213. By such a reversal, the state of the target film 20 changes from the state where the first surface 20F can contact the circumferential surface 120P of the cooling roller 120 to the state where the second surface 20S can contact the circumferential surface 120P of the cooling roller 120.

After the reversal, as shown in FIG. 1, a process of returning the target film 20 from the reversal unit 200 to the plasma processing unit 100 is performed. The target film 20 sent back to the plasma processing section 100 enters the casing 110, passes through the pressing roller 161, and contacts the cooling roller 120. Then, the target film 20 is conveyed in a state where the second surface 20S of the target film 20 is brought into contact with the circumferential surface 120P of the cooling roller 120 by being pressed by the pressure rollers 161 and 162.

While the second surface 20S of the target film 20 is in contact with the circumferential surface 120P of the cooling roller 120, the target film 20 is transported while passing between the second electrodes 141, 142, and 143 and the cooling roller 120. The plasma processing is performed on the first surface 20F of the target film 20. As described above, appropriate types and amounts of ambient gas flow through the housing 110. In such a state, a voltage is applied between the second electrodes 141, 142, and 143 and the cooling roller 120 as a roller electrode by a power source not shown, thereby performing the same procedure as the plasma treatment for the second surface 20S , Plasma treatment is performed on the first surface 20F of the target film 20. Then, by this, plasma treatment of both the first surface 20F and the second surface 20S of the target film 20 is performed to obtain the surface-treated film 20.

The surface-treated thin film 20 obtained in this way is sent out from the plasma processing unit 100 and recovered by a suitable recycling device (not shown). On the first surface 20F and the second surface 20S of the obtained surface-treated thin film 20, functional groups are generated by plasma treatment to improve the adhesion.

In the plasma processing apparatus 10 according to the above embodiment, since the common cooling roller 120 is used for the plasma processing for the first surface 20F and the plasma processing for the second surface 20S, the equipment can be miniaturized. For example, since only one cooling roller 120 is used, the installation space of the cooling roller 120 itself can be reduced, the cooling system for supplying refrigerant to the cooling roller 120 can be miniaturized, the power supply system for applying voltage can be simplified, and the number of uses can be reduced. The device for driving the cooling roller 120 by rotation achieves miniaturization of the equipment.

In addition, in the plasma processing apparatus 10 according to the above-described embodiment, the control related to plasma processing can be simplified. For example, since the common cooling roll 120 is used in the plasma treatment for the first surface 20F and the plasma treatment for the second surface 20S, the speed of the film to be transported on different cooling rolls is not required Consistent conventional methods for general shipping control. Therefore, the control of the transport speed of the target film can be simplified.

In addition, in the plasma processing apparatus 10 according to the above embodiment, the plasma processing for the first surface 20F and the plasma processing for the second surface 20S can be performed in the common housing 110. Therefore, it is possible to reduce the amount of ambient air exhausted compared to the conventional method using multiple housings. In addition, in the plasma processing apparatus 10 according to the above embodiment, the pressure of the ambient gas in the housing 110 is easier to control than the conventional method using a plurality of housings. For example, when plasma treatment is to be performed on the first surface 20F and the second surface 20S of the target thin film 20 under the same conditions, even if no special adjustments are made, the type and pressure of the ambient gas can usually be kept at The plasma treatment of the two is the same, so it is easy to control the pressure.

In addition, in the plasma processing apparatus 10 according to the above-described embodiment, since the temperature rise of the target film 20 due to plasma processing is suppressed by the cooling roller 120, the dimensional change of the target film 20 due to heat can be suppressed . At this time, if the center angle θ between the electrodes 131, 132, 133, 141, 142, and 143 is set appropriately, the deviation of the plasma processing temperature of each of the electrodes 131, 132, 133, 141, 142, and 143 can be suppressed Therefore, the plasma treatment conditions for each of the electrodes 131, 132, 133, 141, 142, and 143 can be normalized. Therefore, the control of the processing conditions of the plasma treatment becomes easy, and the surface-treated film 20 as expected can be easily obtained. Regarding this point, for example, it can be understood by considering that the center angle θ between the electrodes is small. If the center angle θ between the electrodes is small, the target film 20 is subjected to the plasma treatment by the next electrode after being heated by the plasma treatment by one electrode and before being sufficiently cooled by the cooling roller 120. The possibility that the temperature at the time point of receiving plasma treatment is higher than expected. However, by appropriately setting the center angle θ between the electrodes, it becomes easy to avoid such unintended high temperature and suppress the deviation of the plasma processing temperature.

Furthermore, in the plasma processing apparatus 10 according to the above embodiment, the target film 20 is pressed by the pressure rollers 151, 152, 161, and 162. Therefore, the object film 20 strengthens contact with the circumference of the cooling roller 120 during the passage between the first electrodes 131, 132, and 133 and the cooling roller 120, and between the second electrodes 141, 142, and 143 and the cooling roller 120. The surface 120P. According to this, a large frictional force acts between the cooling roller 120 and the target film 20. Therefore, even if the stress due to the heating caused by the plasma treatment causes the target film 20 to expand or contract, the frictional force resists the stress, so that the dimensional change of the target film 20 can be effectively suppressed.

Furthermore, in the plasma processing apparatus 10 according to the above embodiment, since any of the electrodes 131, 132, 133, 141, 142, and 143 are provided at equal distances from the circumferential surface 120P of the cooling roller 120, it is possible The uniformity depends on the processing conditions of the electrodes 131, 132, 133, 141, 142, and 143. Therefore, it is particularly easy to control the processing conditions of the plasma treatment.

In the above embodiment, the material, thickness and transport speed of the treatment film 20; the type and pressure of the ambient gas; the magnitude of the applied voltage for plasma generation; and other conditions, within the range where the desired surface treatment film can be obtained, It has to be set arbitrarily.

10‧‧‧Plasma treatment device

20‧‧‧film

20F‧‧‧First surface

20S‧‧‧Second surface

100‧‧‧Plasma Processing Department

110‧‧‧Housing

120‧‧‧cooling roller

120P‧‧‧Circular surface

120C‧‧‧Central axis

131, 132, 133, 141, 142 and 143

151, 152, 161 and 162

200‧‧‧Reversal Department

210‧‧‧film reversal device

211, 212 and 213

FIG. 1 is a schematic front view of a plasma processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic perspective view of a thin film inverting device included in an inverting portion of a plasma processing apparatus according to an embodiment of the present invention.

Claims (4)

A plasma processing apparatus includes a plasma processing unit that can perform plasma processing on a film, and an inversion unit that can reverse the film sent from the plasma processing unit and return it to the plasma processing unit; The plasma processing section includes a cooling roller and a plurality of electrodes. The cooling roller has a circumferential surface that the film sent out to the reversing section and the film sent back from the reversing section can contact, and is arranged to adjust the temperature. A plurality of electrode installation surfaces face the circumferential surface of the cooling roller; the plurality of electrodes include a first electrode and a second electrode; the first electrode is in a state where the film sent to the reversing portion is in contact with the circumferential surface of the cooling roller The second electrode is provided by being transported between the first electrode and the cooling roller; the second electrode passes through the first electrode in a state where the film sent back from the reversing portion contacts the circumferential surface of the cooling roller The method of transporting with the cooling roller is provided. The plasma processing apparatus according to claim 1, wherein when the total number of electrodes included in the plurality of electrodes is n, the center of the combination of adjacent electrodes with respect to the central axis of the cooling roller The angles are all above 0.8 × (360 ° / n). The plasma processing apparatus according to claim 1 or 2, wherein the total number of electrodes included in the plurality of electrodes is 12 or less. A method for manufacturing a surface-treated film, which is a method for manufacturing a surface-treated film using the plasma processing apparatus according to any one of claims 1 to 3; it includes: an object having a first surface and a second surface The process of supplying the film to the plasma processing section; transporting the target film through the first electrode and the cooling roller in a state where the first surface of the target film contacts the circumferential surface of the cooling roller , The process of performing plasma treatment on the second surface of the target film at the same time; the process of sending the target film from the plasma processing part to the inverting part; the process of inverting the target film in the inverting part The process of returning the target film from the reversing section to the plasma processing section; and in a state where the second surface of the target film is in contact with the circumferential surface of the cooling roller, passing the target film through the first The two electrodes are transported between the cooling roller and the plasma treatment is performed on the first surface of the target film.