WO2018218925A1 - 基板及其制备方法、显示面板、显示装置 - Google Patents

基板及其制备方法、显示面板、显示装置 Download PDF

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Publication number
WO2018218925A1
WO2018218925A1 PCT/CN2017/115439 CN2017115439W WO2018218925A1 WO 2018218925 A1 WO2018218925 A1 WO 2018218925A1 CN 2017115439 W CN2017115439 W CN 2017115439W WO 2018218925 A1 WO2018218925 A1 WO 2018218925A1
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WIPO (PCT)
Prior art keywords
layer
display panel
spacer
substrate
electrode
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PCT/CN2017/115439
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English (en)
French (fr)
Inventor
赵必玉
张光均
张昌
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/070,059 priority Critical patent/US11237436B2/en
Priority to KR1020187020221A priority patent/KR102206526B1/ko
Priority to JP2018536754A priority patent/JP6997089B2/ja
Priority to EP17889538.9A priority patent/EP3633730A4/en
Publication of WO2018218925A1 publication Critical patent/WO2018218925A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13398—Spacer materials; Spacer properties
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13396—Spacers having different sizes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823468—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate sidewall spacers, e.g. double spacers, particular spacer material or shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to a substrate, a method of fabricating the same, a display panel, and a display device.
  • a spacer is usually provided for supporting the thickness of the box. If the spacer is made of only too hard material, when the display panel is pressed, the hard spacer will cause two possible risks. One is that the substrate is not deformed by the deformation, and the other is the lack of elasticity after deformation. Difficult to return to the original position, resulting in poor display. If only a material having a low hardness is used, the support strength of the spacer is slightly inferior. When the display panel is pressed, the spacer is liable to be displaced, resulting in display failure.
  • a substrate comprising a spacer, the spacer comprising a first layer, a second layer and a third layer which are sequentially stacked, the second layer comprising an upper portion and a lower portion, The lower portion is embedded in the first layer, at least partially embedded in the third layer; the material hardness of the second layer is higher than the material hardness of the first layer and the third layer.
  • the second layer is in the form of a flat plate.
  • the upper and lower bottom surfaces of the lower portion are smaller than the lower bottom surface of the upper portion near the lower portion.
  • the upper portion includes a flat portion and a convex portion on the flat portion away from the lower portion; the upper and lower bottom surfaces of the convex portion are smaller than the flat shape At least one of an upper bottom surface area and a lower bottom surface area; at least the convex sub-section is embedded in the third layer.
  • the upper portion is embedded in the third layer.
  • the area of the upper and lower bottom surfaces of the lower portion is smaller than the area of the lower bottom surface of the upper portion adjacent to the lower portion
  • the upper portion is in the form of a flat plate.
  • the side of the third layer covers the side of the first layer.
  • the first layer and the third layer are resin layers.
  • the second layer is a metal layer or a metal oxide layer.
  • the maximum thickness of the second layer is
  • At least one of the first layer and the third layer comprises a photoresist.
  • a display panel comprising the substrate of the first aspect.
  • the display panel further includes a pressure touch structure;
  • the pressure touch structure includes a first electrode layer and a second electrode layer, wherein the first electrode layer and the second electrode layer are respectively disposed on the partition Two sides of the mat; wherein the first electrode layer includes a plurality of first electrodes insulated from each other; and the second electrode layer includes a planar second electrode.
  • the display panel is an OLED display panel; the second electrode is shared with the cathode.
  • the display panel is a liquid crystal display panel; the second electrode layer is shared with the common electrode.
  • the display panel is a liquid crystal display panel; the second electrode layer is shared with the common electrode.
  • a method of fabricating a substrate comprising forming a spacer, forming the spacer, comprising: forming a first layer, the upper surface of the first layer having a groove; forming a first a second layer comprising an upper portion and a lower portion, the lower portion being embedded in the recess of the first layer; forming a third layer, at least partially embedded in the third layer; wherein The material hardness of the second layer is higher than the material hardness of the first layer and the third layer.
  • a display device comprising the display panel as described above.
  • FIG. 1 is a schematic structural view 1 of a substrate provided by at least one embodiment of the present disclosure
  • FIG. 2 is a schematic structural view 2 of a substrate provided by at least one embodiment of the present disclosure
  • FIG. 3 is a schematic structural view 3 of a substrate provided by at least one embodiment of the present disclosure.
  • FIG. 4 is a schematic structural view of a substrate provided by at least one embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram 5 of a substrate according to at least one embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram 6 of a substrate according to at least one embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a display panel according to at least one embodiment of the present disclosure.
  • FIG. 8 is a schematic flow chart of preparing a spacer provided by at least one embodiment of the present disclosure.
  • Figure 9a is a schematic view 1 of a first layer in a spacer provided by at least one embodiment of the present disclosure
  • Figure 9b is a schematic view 2 of the first layer in the spacer provided by at least one embodiment of the present disclosure.
  • Figure 9c is a schematic view 3 of the first layer in the spacer provided by at least one embodiment of the present disclosure.
  • Figure 10a is a schematic view 1 of a second layer in a spacer provided by at least one embodiment of the present disclosure
  • Figure 10b is a schematic view 2 of the second layer in the spacer provided by at least one embodiment of the present disclosure
  • Figure 11a is a schematic view 1 of a third layer in a spacer provided by at least one embodiment of the present disclosure
  • Figure 11b is a second schematic view of a third layer in a septum provided by at least one embodiment of the present disclosure.
  • At least one embodiment of the present disclosure provides a substrate, as shown in FIGS. 1-6, including a spacer 10 including a first layer 11, a second layer 12, and a third layer 13 stacked in a stack;
  • the layer 12 includes a lower portion 121 embedded in the first layer 11, and a lower portion 121 embedded in the third layer 13; the material hardness of the second layer 12 is higher than that of the first layer 11 and the third layer 13 hardness.
  • the shape of the spacer 10 may be a prism, a prism, a truncated cone or the like.
  • the present disclosure divides the second layer 12 into the upper portion 122 and the lower portion 121, but substantially, the contact faces of the upper portion 122 and the lower portion 121 may have no obvious interface, and the second layer 12 Can be a one-piece structure.
  • upper and “lower” in the upper portion 122 and the lower portion 121 are relative positions, and a portion embedded in the first layer 11 in the present disclosure is referred to as a lower portion 121, and a remaining portion of the second layer 12 is referred to as an upper portion 122.
  • the first layer 11, the second layer 12, and the third layer 13 are stacked, that is, the first layer 11, the second layer 12, and the third layer 13 are stacked in a direction along the substrate in the vertical substrate,
  • the first layer 11 can be disposed adjacent to the substrate of the substrate, and the third layer 13 can be disposed away from the substrate. That is, the first layer 11 is formed first, and then the second layer 12 is formed, and then the third layer 13 is formed.
  • the materials of the first layer 11 and the third layer 13 may be the same or different.
  • the material of the third layer 13 when the substrate is applied to the display panel and the display panel is subjected to pressure, the film layer or the glass substrate that is in contact with the spacer 10 is not scratched.
  • a groove may be formed on the surface of the first layer 11 near the second layer 12 when the first layer 11 is formed, so that when the first layer 11 is formed When the second layer is 12, the lower portion 121 of the second layer 12 can be filled in the groove and structurally embedded in the first layer 11.
  • the lower portion 121 is embedded in the first layer 11 as an example, and is not limited to the lower portion 121 being completely surrounded by the first layer 11.
  • one side may be exposed on the surface of the spacer 10, or may have two opposite sides. It is exposed on the surface of the spacer 10.
  • the upper portion 122 is embedded in the third layer 13, and is not limited to the upper portion 122 being completely surrounded by the third layer 13, for example, one side is exposed on the surface of the spacer 10, or two opposite sides may be exposed on the spacer.
  • At least one embodiment of the present disclosure provides a substrate by including a spacer layer 10 disposed thereon including a first layer 11, a second layer 12, and a third layer 13 which are sequentially laminated, and which has a high hardness of the second layer 12.
  • the support strength of the spacer 10 can be significantly improved while ensuring the low hardness of the surface of the spacer 10, and the spacer 10 is ensured by appropriately setting the thickness of the second layer 12. Elasticity thus avoids the problem that the spacer 10 cannot be restored to its original position after the pressure has disappeared.
  • the display panel is subjected to pressure.
  • the first layer 11 and the third layer 13 having a lower hardness are prevented from being displaced, so that displacement of the spacer 10 can be prevented.
  • the second layer 12 is of a flat type.
  • the thickness of the lower portion 121 and the upper portion 122 of the second layer 12 is the thickness of the spacer 10.
  • the second layer 12 When the second layer 12 is of a flat type, the second layer 12 can be formed by using only a common mask, and thus, the process is relatively simple and the cost is low.
  • the upper and lower bottom surfaces of the lower portion 121 are smaller than the bottom surface area of the upper portion 122 near the lower portion 121.
  • the lower portion 121 is a small protrusion provided on the upper portion 122.
  • the optional lower portion 121 is embedded in an intermediate position of the first layer 11 near the side of the second layer 12. In this case, the lower portion 121 is completely surrounded by the first layer 11.
  • At least one embodiment of the present disclosure can prevent the elasticity of the spacer 10 from being greatly affected by the thicker portion of the lower portion 121 by making the area of the upper and lower bottom surfaces of the lower portion 121 of the second layer 12 smaller.
  • the thickness of the lower portion 121 is made thicker, and the substrate can be applied to the display panel, and when the display panel is subjected to pressure, the first layer 11 having a lower hardness is further prevented from being displaced.
  • the upper portion 122 is of a flat type.
  • the upper portion 122 includes a flat type sub-portion 1221 and a convex sub-portion 1222 disposed on a side of the flat-type sub-portion 1221 away from the lower portion 121; the upper and lower portions of the convex sub-portion 1222 The bottom surface area is smaller than the upper bottom surface or the lower bottom surface area of the flat type sub-portion 1221; at least the convex sub-portion 1222 is embedded in the third layer 13.
  • the side surface of the flat-type sub-portion 1221 is exposed to the surface of the spacer 10.
  • the convex sub-portion 1222 is embedded in an intermediate position of the third layer 13 near the side of the second layer 12. In this case, the raised sub-portion 1222 is completely surrounded by the third layer 13.
  • the convex sub-portion 1222 of the upper portion 122 is embedded in the third layer 13, by making the upper and lower bottom surface areas of the convex sub-portion 1222 smaller, it is possible to avoid the spacer material due to the thicker thickness of the convex sub-portion 1222.
  • the elasticity of 10 has a large influence, and the thickness of the convex portion 1222 is made thicker, and the substrate can be applied to the display panel, and when the display panel is subjected to pressure, the third layer 13 having a lower hardness is further prevented from being displaced.
  • the flat portion 1221 and the convex portion 1222 are embedded in the third layer 13, that is, the upper portion 122 is embedded.
  • the third layer 13 having a lower hardness is further prevented from being displaced.
  • the side surface of the third layer 13 covers the side surface of the first layer 11. That is, the third layer 13 surrounds the first layer 11 and the second layer 12.
  • At least one embodiment of the present disclosure can further prevent displacement of the first layer 11 and the third layer 13 having lower hardness by causing the third layer 13 to surround the first layer 11 and the second layer 12.
  • the first layer 11 and the third layer 13 are resin layers.
  • the material of the resin layer may include an epoxy resin, an acrylic resin, or the like.
  • the materials of the first layer 11 and the third layer 13 may be different.
  • the materials of the first layer 11 and the third layer 13 may also be the same.
  • At least one of the first layer 11 and the third layer 13 may include a photoresist.
  • the spacer 10 can be made to have good elasticity by providing the first layer 11 and the third layer 13 as a resin layer, and the display panel is pressed when the substrate is applied to a display panel. At this time, the film layer or the glass substrate that is in contact with the spacer 10 is not scratched. Further, when a photoresist is used as the material of the first layer 11 and/or the third layer 13, the process steps of forming the first layer 11 and/or the third layer 13 can also be simplified.
  • the second layer 12 is a metal layer or a metal oxide layer.
  • the material of the metal layer may include a metal element, an alloy, or the like.
  • the material of the metal layer may include Mo (molybdenum), Al (aluminum), molybdenum aluminum alloy, or the like.
  • the material of the metal oxide layer includes a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or the like.
  • the support strength of the spacer 10 can be ensured by providing the second layer 12 as a metal layer or a metal oxide layer.
  • the maximum thickness of the second layer 12 is thus, on the basis of the support strength of the spacer 10, the elastic properties of the spacer 10 are not greatly affected.
  • At least embodiments of the present disclosure also provide a display panel including the substrate described above.
  • the display panel may be a liquid crystal display panel.
  • the substrate may be an array substrate, or may be opposite to the array substrate.
  • the display panel may be an OLED (Organic Light Emitting Diode) display panel, and based on the substrate, the substrate is an array substrate. Based on this, the OLED display panel may further include a package film or a package substrate. Wherein, the encapsulating film or the package substrate is in contact with the spacer 10.
  • OLED Organic Light Emitting Diode
  • At least embodiments of the present disclosure provide a display panel by making the spacer 10 in the display panel include the first layer 11, the second layer 12, and the third layer 13 which are sequentially stacked, and the hardness of the second layer 12 is higher than
  • the first layer 11 and the third layer 13 can significantly improve the support strength of the spacer 10 while ensuring the low hardness of the surface of the spacer 10, and ensure the elasticity of the spacer 10 by appropriately setting the thickness of the second layer 12. Therefore, the problem that the spacer 10 cannot be restored to the original position after the pressure applied to the display panel disappears can be avoided.
  • the lower portion 121 of the second layer 12 into the first layer 11 at least part of the upper portion 122 of the second layer 12 is embedded in the third portion.
  • the first layer 11 and the third layer 13 having a lower hardness can be prevented from being displaced when the display panel is subjected to pressure, so that displacement of the spacer 10 can be avoided.
  • the deformation effect of the display panel after being pressed can be improved, and the problem of poor display due to the spacer 10 after the display panel is pressed can be improved.
  • the display panel further includes a pressure touch structure 20; the pressure touch structure 20 includes a first electrode layer and a second electrode layer, and the first electrode layer and the second electrode layer are respectively disposed on the spacer 10 on both sides.
  • the first electrode layer may include a plurality of first electrodes 21 insulated from each other; and the second electrode layer may include a planar second electrode 22.
  • the plurality of first electrodes 21 may be arranged, for example, in an array.
  • the pressure value and the pre-stored standard pressure range can be compared. If the pressure value is within one of the standard pressure ranges, the function corresponding to the range is opened, for example, the information at the touch position is enlarged, and the Main page, lock screen, etc.
  • a standard pressure range can correspond to a function of the display device. Therefore, a plurality of standard pressure ranges can be set according to specific function items, and the corresponding relationship can be preset.
  • At least one embodiment of the present disclosure provides a pressure touch structure 20 on the display panel, and the first electrode layer 21 and the second electrode layer 22 of the pressure touch structure 20 are disposed on both sides of the spacer 10, and can be displayed.
  • the pressure touch structure recognizes the pressure value based on the deformation of the spacer 10 to improve the user experience.
  • the deformation effect of the display panel after being pressed can be improved, and the pressure recognition accuracy can be improved.
  • the second electrode may be shared with the cathode.
  • the second electrode may be shared with the common electrode.
  • the display panel is a flexible display panel.
  • the object 10 is designed and applied in a flexible display panel to improve the performance of the flexible display panel.
  • At least one embodiment of the present disclosure also provides a method of fabricating a substrate, including forming a spacer 10; wherein, as shown in FIG. 8, forming the spacer 10 includes the following steps:
  • the upper surface of the first layer 11 has a groove 110.
  • the shape of the first layer 11 may be a quadrangular pyramid.
  • the groove 110 may be disposed at an intermediate position of the upper surface of the first layer 11 as shown in FIG. 9a; or as shown in FIG. 9b, the groove 110 may penetrate one side of the first layer 11; or may be concave as shown in FIG. 9c. Both sides of the groove 110 are exposed on the outer surface of the first layer 11.
  • the first layer 11 can be formed by a process such as film formation, exposure, development, etching, or the like.
  • the second layer 12 includes an upper portion 122 and a lower portion 121, and the lower portion 121 is embedded in the recess 110 of the first layer 12.
  • a second layer 12 as shown in Figure 10a can be formed; for Figures 9b and 9c, a second layer 12 can be formed as shown in Figure 10b.
  • the second layer 12 can be formed by a process such as film formation, exposure, development, etching, or the like.
  • the outer surface of the third layer 13 may have a quadrangular shape.
  • a third layer 13 as shown in Figure 11a can be formed; for Figure 10b, a third layer 13 can be formed as shown in Figure 11b.
  • the third layer 13 can be formed by processes such as film formation, exposure, development, etching, and the like.
  • At least one embodiment of the present disclosure provides a method of preparing a spacer 10 in a substrate by including the spacer 10 including the first layer 11, the second layer 12, and the third layer 13 which are sequentially laminated, and the second layer
  • the hardness of 12 is higher than that of the first layer 11 and the third layer 13, and the support strength of the spacer 10 can be remarkably improved while ensuring the low hardness of the surface of the spacer 10, and the thickness of the second layer 12 is appropriately set to ensure the separation.
  • the elasticity of the pad 10 thus avoids the problem that the spacer 10 cannot be restored to its original position after the pressure has disappeared.
  • the display panel is subjected to pressure.
  • the first layer 11 and the third layer 13 having a lower hardness are prevented from being displaced, so that displacement of the spacer 10 can be prevented.
  • the display device may be any product or component having a display function such as a liquid crystal panel, an electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.

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Abstract

一种基板及其制备方法、显示面板、显示装置。该基板包括隔垫物（10），该隔垫物包括依次层叠设置的第一层（11）、第二层（12）和第三层（13）；第二层包括下部（121）和上部（122），下部嵌入第一层中，上部至少部分嵌入第三层中；第二层的材料硬度高于第一层和第三层的材料硬度。

Description

基板及其制备方法、显示面板、显示装置
相关申请的交叉引用
本申请要求于2017年5月27日提交的发明名称为“一种基板及其制备方法、显示面板”的中国专利申请第201710395936.2号的优先权，该申请的公开通过引用被全部结合于此。
技术领域
本公开涉及基板及其制备方法、显示面板、显示装置。
背景技术
目前的显示面板中通常会设置隔垫物，用于支撑盒厚。若隔垫物只采用过于坚硬的材料制成，当显示面板受到按压时，坚硬的隔垫物将引起出现两种可能风险，一是无形变造成基板划伤，二是形变后因缺乏弹性很难恢复到原位，导致显示不良发生。若只采用硬度较低的材料，这种隔垫物的支撑强度稍差，当显示面板受到按压时，隔垫物易发生位移，导致显示不良发生。
发明内容
根据本公开的第一方面，提供一种基板，包括隔垫物，所述隔垫物包括依次层叠设置的第一层、第二层和第三层；所述第二层包括上部和下部，所述下部嵌入所述第一层中，所述上部的至少部分嵌入所述第三层中；所述第二层的材料硬度高于所述第一层和所述第三层的材料硬度。
可选的，所述第二层呈平板型。
可选的，所述下部的上、下底面面积小于所述上部的靠近所述下部的下底面面积。
进一步可选的，所述上部包括平板型子部和所述平板型子部上远离所述下部一侧的凸起子部；所述凸起子部的上、下底面面积都小于所述平板型子部的上底面面积和下底面面积中的至少一者；至少所述凸起子部嵌入所述第三层中。
进一步的，所述上部嵌入所述第三层中。
在所述下部的上、下底面面积小于所述上部的靠近所述下部的下底面面积的 情况下，可选的，所述上部呈平板型。
基于上述，所述第三层的侧面覆盖所述第一层的侧面。
可选的，所述第一层和所述第三层为树脂层。
可选的，所述第二层为金属层或金属氧化物层。
可选的，所述第二层的最大厚度为
Figure PCTCN2017115439-appb-000001
可选的，所述第一层和所述第三层中的至少一者包括光刻胶。
根据本公开的第二方面，提供一种显示面板，包括第一方面的基板。
可选的，所述显示面板还包括压力触控结构；所述压力触控结构包括第一电极层和第二电极层，所述第一电极层和所述第二电极层分设于所述隔垫物的两侧；其中，所述第一电极层包括多个相互绝缘的第一电极；所述第二电极层包括面状的第二电极。
进一步可选的，所述显示面板为OLED显示面板；所述第二电极与阴极共用。
可选的，所述显示面板为液晶显示面板；所述第二电极层与公共电极共用。
基于上述，可选的，所述显示面板为液晶显示面板；所述第二电极层与公共电极共用。
根据本公开的第三方面，提供一种基板的制备方法，包括形成隔垫物，形成所述隔垫物，包括：形成第一层，所述第一层的上表面具有凹槽；形成第二层，所述第二层包括上部和下部，所述下部嵌入所述第一层的凹槽中；形成第三层，所述上部的至少部分嵌入所述第三层中；其中，所述第二层的材料硬度高于所述第一层和所述第三层的材料硬度。
根据本公开的第四方面，提供一种显示装置，包括如上所述的显示面板。
附图说明
为了更清楚地说明本公开实施例或相关技术中的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开至少一个实施例提供的基板的结构示意图一；
图2为本公开至少一个实施例提供的基板的结构示意图二；
图3为本公开至少一个实施例提供的基板的结构示意图三；
图4为本公开至少一个实施例提供的基板的结构示意图四；
图5为本公开至少一个实施例提供的基板的结构示意图五；
图6为本公开至少一个实施例提供的基板的结构示意图六；
图7为本公开至少一个实施例提供的显示面板的结构示意图；
图8为本公开至少一个实施例提供的制备隔垫物的流程示意图；
图9a为本公开至少一个实施例提供的隔垫物中第一层的示意图一；
图9b为本公开至少一个实施例提供的隔垫物中第一层的示意图二；
图9c为本公开至少一个实施例提供的隔垫物中第一层的示意图三；
图10a为本公开至少一个实施例提供的隔垫物中第二层的示意图一；
图10b为本公开至少一个实施例提供的隔垫物中第二层的示意图二；
图11a为本公开至少一个实施例提供的隔垫物中第三层的示意图一；
图11b为本公开至少一个实施例提供的隔垫物中第三层的示意图二。
具体实施方式
下面将结合本公开各个实施例中的附图，对本公开各个实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的各个实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开至少一个实施例提供一种基板，如图1-6所示，包括隔垫物10，隔垫物10包括层叠设置的第一层11、第二层12和第三层13；第二层12包括下部121和上部122，下部121嵌入第一层11中，上部122的至少部分嵌入第三层13中；第二层12的材料硬度高于第一层11和第三层13的材料硬度。
其中，隔垫物10的形状可以是棱台、棱柱、圆台等。
需要说明的是，第一，为描述方便，本公开将第二层12划分为上部122和下部121，但实质上，上部122和下部121的接触面可以是没有明显界面的，第二层12可以为一体结构。
其中，上部122、下部121中的“上”、“下”为相对位置，本公开中将嵌入第一层11中的部分称为下部121，将第二层12的剩余部分称为上部122。
第二，第一层11、第二层12和第三层13层叠设置，即，沿垂直基板中衬底的方向，第一层11、第二层12和第三层13层叠设置，
其中，可使第一层11靠近基板的衬底设置，第三层13远离衬底设置。即，先形成第一层11，再形成第二层12，之后形成第三层13。
第三，第一层11和第三层13的材料可以相同，也可不相同。在选取第三层13的材料时，以在基板应用于显示面板，显示面板受到压力时，不会对与隔垫物10接触的膜层或玻璃基板划伤为准。
第四，为实现第二层12的下部121嵌入第一层11，可在制备形成第一层11时，在第一层11的靠近第二层12的表面形成凹槽，这样，当形成第二层12时，第二层12的下部121便可填充在凹槽中，而在结构上体现为嵌入第一层11。
在此基础上，根据第二层12的具体结构，在第二层12上形成第三层13时，只需从结构上体现为第二层12的上部122的至少部分嵌入第三层13中即可。
第五，以下部121嵌入第一层11为例，并不限于下部121完全被第一层11包围，例如可以有一个侧面是暴露在隔垫物10表面的，也可以是有两个相对侧面暴露在隔垫物10表面。
同理，上部122嵌入第三层13，并不限于上部122完全被第三层13包围，例如有一个侧面是暴露在隔垫物10表面的，也可以是有两个相对侧面暴露在隔垫物10表面。
本公开至少一个实施例提供一种基板，通过使设置在其上的隔垫物10包括依次层叠的第一层11、第二层12和第三层13，并使第二层12的硬度高于第一层11和第三层13，可在保证隔垫物10表面低硬度的同时显著提高隔垫物10的支撑强度，且通过合理设置第二层12的厚度，保证隔垫物10的弹性，因而可避免在压力消失后隔垫物10无法恢复到原位的问题。在此基础上，通过使第二层12的下部121嵌入第一层11中、第二层12的上部122的至少部分嵌入第三层13中，以在基板应用于显示面板，显示面板受到压力时，防止硬度较低的第一层11和第三层13发生位移，因而可避免隔垫物10发生位移。
可选的，如图1和图2所示，第二层12呈平板型。
在此情况下，第二层12的下部121和上部122的厚度和为隔垫物10的厚度。
当第二层12呈平板型时，只需采用普通掩模板，即可形成第二层12，因而，工艺相对简单，成本较低。
可选的，如图3-6所示，下部121的上、下底面面积小于上部122的靠近下部121的底面面积。
即，下部121为设置于上部122上的小突起。
其中，可选下部121嵌入第一层11靠近第二层12一侧的中间位置。在此情况下，下部121完全被第一层11包围。
本公开至少一个实施例通过将第二层12中下部121的上、下底面的面积做的小一些，可避免由于下部121的厚度较厚而对隔垫物10的弹性有较大影响，而将下部121的厚度做的厚一些，可在基板应用于显示面板，显示面板受到压力时，进一步防止硬度较低的第一层11发生位移。
进一步可选的，如图3和图4所示，上部122呈平板型。
或者，可选的，如图5和图6所示，上部122包括平板型子部1221和设置于平板型子部1221远离下部121一侧的凸起子部1222；凸起子部1222的上、下底面面积小于平板型子部1221的上底面或下底面面积；至少凸起子部1222嵌入第三层13中。
其中，当仅是凸起子部1222嵌入第三层13中时，如图5所示，平板型子部1221的侧面暴露于隔垫物10的表面。可选的，凸起子部1222嵌入第三层13靠近第二层12一侧的中间位置。在此情况下，凸起子部1222完全被第三层13包围。
当只有上部122的凸起子部1222嵌入第三层13中时，通过将凸起子部1222的上、下底面面积做的小一些，可避免由于凸起子部1222的厚度较厚而对隔垫物10的弹性有较大影响，而将凸起子部1222的厚度做的厚一些，可在基板应用于显示面板，显示面板受到压力时，进一步防止硬度较低的第三层13发生位移。
在上部122包括平板型子部1221和凸起子部1222的情况下，如图6所示，可选的，平板型子部1221和凸起子部1222均嵌入第三层13中，即上部122嵌入第三层13中。这样，在基板应用于显示面板，显示面板受到压力时，进一步防止硬度较低的第三层13发生位移。
在上述基础上，可选的，如图2、图4、图6所示，第三层13的侧面覆盖第一层11的侧面。即，第三层13将第一层11和第二层12包围在内。
需要说明的是，当仅是凸起子部1222嵌入第三层13中时，平板型子部1221的侧面是暴露于隔垫物10的表面的(如图5所示)，因此，在此情况下，第三层13的侧面无法覆盖第一层11的侧面。
本公开的至少一个实施例通过使得第三层13将第一层11和第二层12包围在内，可进一步避免硬度较低的第一层11和第三层13发生位移。
基于上述，可选的，第一层11和第三层13为树脂层。其中，树脂层的材料可以包括环氧树脂、亚克力树脂等。
第一层11和第三层13的材料可以不同。第一层11和第三层13的材料也可以相同。
进一步可选的，第一层11和第三层13中至少一层可以包括光刻胶。
由于树脂材料的硬度较低，因而通过将第一层11和第三层13设置为树脂层，可使隔垫物10具有较好的弹性，且在该基板应用于显示面板，显示面板受压时，不会对与隔垫物10接触的膜层或玻璃基板造成划伤。此外，当采用光刻胶作为第一层11和/或第三层13的材料时，还可简化形成第一层11和/或第三层13的工艺步骤。
可选的，第二层12为金属层或金属氧化物层。
其中，金属层的材料可以包括金属单质、合金等。例如金属层的材料可以包括Mo(钼)、Al(铝)、钼铝合金等。
金属氧化物层的材料包括金属氧化物，例如ITO(氧化铟锡)、IZO(氧化铟锌)等。
由于金属材料、金属氧化物材料的硬度较高，因而通过将第二层12设置为金属层或金属氧化物层，可保证隔垫物10的支撑强度。
可选的，第二层12的最大厚度为
Figure PCTCN2017115439-appb-000002
这样，在保证隔垫物10的支撑强度的基础上，不会对隔垫物10的弹性性能造成大的影响。
本公开至少实施例还提供一种显示面板，包括上述的基板。
其中，显示面板可以是液晶显示面板，基于此，所述基板可以是阵列基板，也可以与阵列基板相对盒的对盒基板。
或者，显示面板可以是OLED(Organic Light Emitting Diode，有机电致发光二极管)显示面板，基于此，所述基板为阵列基板。在此基础上，OLED显示面板还可包括封装薄膜或封装基板。其中，封装薄膜或封装基板与隔垫物10接触。
本公开至少实施例提供一种显示面板，通过使显示面板中的隔垫物10包括依次层叠的第一层11、第二层12和第三层13，并使第二层12的硬度高于第一层11和第三层13，可在保证隔垫物10表面低硬度的同时显著提高隔垫物10的支撑强度，且通过合理设置第二层12的厚度，保证隔垫物10的弹性，因而可避免显示面板受到的压力消失后，隔垫物10无法恢复到原位的问题。在此基础上，通过使第二层12的下部121嵌入第一层11中、第二层12的上部122的至少部分嵌入第三 层13中，可在显示面板受到压力时，防止硬度较低的第一层11和第三层13发生位移，因而可避免隔垫物10发生位移。综上，可提高显示面板的受压后的形变效果，并改善显示面板受压后，由于隔垫物10而导致显示不良的问题。
可选的，如图7所示，显示面板还包括压力触控结构20；压力触控结构20包括第一电极层和第二电极层，第一电极层和第二电极层分设于隔垫物10的两侧。其中，第一电极层可包括多个相互绝缘的第一电极21；第二电极层可包括一个面状第二电极22。
此处，多个第一电极21例如可呈阵列排布。
基于此，根据平行板电容公式，即
Figure PCTCN2017115439-appb-000003
可知，第一电极21与第二电极22之间产生电容(C)。在此基础上，当显示面板没有受到压力时，第一电极层与第二电极层之间产生的电容固定，当显示面板受到压力时，由于隔垫物10受压，使得显示面板发生形变而使受压位置处第一电极21与第二电极22之间的距离发生变化，从而使得第一电极21与第二电极22之间产生的电容发生变化，经过相应的换算便可得到压力值。
在此基础上，可将所述压力值以及预存的标准压力范围进行比较，若压力值位于其中一个标准压力范围内，则打开与该范围对应的功能，例如放大触摸位置处的信息、返回到主页面、锁屏等。
其中，一个标准压力范围可以对应显示装置的一项功能，因此，可根据具体的功能项设置多个标准压力范围，且该对应关系可以是预先设置好的。
本公开至少一个实施例通过在显示面板上设置压力触控结构20，且使压力触控结构20的第一电极层21和第二电极层22分设在隔垫物10的两侧，可在显示面板受压时，基于隔垫物10的形变，使压力触控结构对压力值进行识别，提高用户体验。此外，由于隔垫物10的特殊设计，可提高显示面板受压后的形变效果，因而可提高压力识别精度。
进一步可选的，在显示面板为OLED显示面板的情况下，第二电极可以与阴极共用。
在显示面板为液晶显示面板的情况下，第二电极可以与公共电极共用。
这样，可简化制备显示面板的工艺。
基于上述，可选的，所述显示面板为柔性显示面板。
由于柔性显示面板经常会弯折，显示面板经常会变形，因而，将前述的隔垫 物10设计应用在柔性显示面板中，可提高柔性显示面板的性能。
本公开至少一个实施例还提供一种基板的制备方法，包括形成隔垫物10；其中，如图8所示，形成隔垫物10包括如下步骤：
S10、形成第一层11，第一层11的上表面具有凹槽110。
示例的，第一层11的形状可以为四棱台。凹槽110可如图9a所示设置于第一层11上表面的中间位置；也可如图9b所示，凹槽110贯穿第一层11的一个侧面；也可以如图9c所示，凹槽110的两个侧面暴露在第一层11的外表面。
其中，可通过成膜、曝光、显影、刻蚀等工艺形成第一层11。
S11、形成第二层12，第二层12包括上部122和下部121，下部121嵌入第一层12的凹槽110中。
示例的，针对图9a，可形成如图10a所示的第二层12；针对图9b和图9c，可形成如图10b所示的第二层12。
其中，可通过成膜、曝光、显影、刻蚀等工艺形成第二层12。
S12、形成第三层13，上部122的至少部分嵌入第三层13中；其中，第二层12的材料硬度高于第一层11和第三层13的材料硬度。
示例的，第三层13的外表面的形状可以为四棱台。针对图10a，可形成如图11a所示的第三层13；针对图10b，可形成如图11b所示的第三层13。
其中，可通过成膜、曝光、显影、刻蚀等工艺形成第三层13。
本公开至少一个实施例提供一种基板中的隔垫物10的制备方法，通过使隔垫物10包括依次层叠的第一层11、第二层12和第三层13，并使第二层12的硬度高于第一层11和第三层13，可在保证隔垫物10表面低硬度的同时显著提高隔垫物10的支撑强度，且通过合理设置第二层12的厚度，保证隔垫物10的弹性，因而可避免在压力消失后隔垫物10无法恢复到原位的问题。在此基础上，通过使第二层12的下部121嵌入第一层11中、第二层12的上部122的至少部分嵌入第三层13中，以在基板应用于显示面板，显示面板受到压力时，防止硬度较低的第一层11和第三层13发生位移，因而可避免隔垫物10发生位移。
本公开至少一个实施例提供一种显示装置，包括上述显示面板。显示装置可以是：液晶面板、电子纸、OLED面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此， 任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种基板，包括隔垫物，其中，所述隔垫物包括依次层叠设置的第一层、第二层和第三层；所述第二层包括上部和下部，所述下部嵌入所述第一层中，所述上部的至少部分嵌入所述第三层中；所述第二层的材料硬度高于所述第一层和所述第三层的材料硬度。
  2. 根据权利要求1所述的基板，其中，所述第二层呈平板型。
  3. 根据权利要求1所述的基板，其中，所述下部的上、下底面面积都小于所述上部的靠近所述下部的下底面面积。
  4. 根据权利要求3所述的基板，其中，所述上部包括平板型子部和所述平板型子部上的远离所述下部一侧的凸起子部；
    所述凸起子部的上、下底面面积都小于所述平板型子部的上底面面积和下底面面积中的至少一者；
    至少所述凸起子部嵌入所述第三层中。
  5. 根据权利要求4所述的基板，其中，所述上部嵌入所述第三层中。
  6. 根据权利要求3所述的基板，其中，所述上部呈平板型。
  7. 根据权利要求1-3、5-6任一项所述的基板，其中，所述第三层的侧面覆盖所述第一层的侧面。
  8. 根据权利要求1所述的基板，其中，所述第一层和所述第三层为树脂层。
  9. 根据权利要求1所述的基板，其中，所述第二层为金属层或金属氧化物层。
  10. 根据权利要求1所述的基板，其中，所述第二层的最大厚度为
    Figure PCTCN2017115439-appb-100001
  11. 根据权利要求1或8所述的基板，所述第一层和所述第三层中的至少一者包括光刻胶。
  12. 一种显示面板，包括权利要求1-11任一项所述的基板。
  13. 根据权利要求12所述的显示面板，还包括压力触控结构；
    所述压力触控结构包括第一电极层和第二电极层，所述第一电极层和所述第二电极层分设于所述隔垫物的两侧；
    其中，所述第一电极层包括多个相互绝缘的第一电极；所述第二电极层包括面状的第二电极。
  14. 根据权利要求13所述的显示面板，其中，所述显示面板为OLED显示面 板；
    所述第二电极与阴极共用。
  15. 根据权利要求13所述的显示面板，其中，所述显示面板为液晶显示面板；
    所述第二电极层与公共电极共用。
  16. 根据权利要求12-15任一项所述的显示面板，其中，所述显示面板为柔性显示面板。
  17. 一种基板的制备方法，包括形成隔垫物，其中，形成所述隔垫物包括：
    形成第一层，所述第一层的上表面具有凹槽；
    形成第二层，所述第二层包括上部和下部，所述下部嵌入所述第一层的凹槽中；
    形成第三层，所述上部的至少部分嵌入所述第三层中；
    其中，所述第二层的材料硬度高于所述第一层和所述第三层的材料硬度。
  18. 一种显示装置，包括如权利要求12－15所述的显示面板。
PCT/CN2017/115439 2017-05-27 2017-12-11 基板及其制备方法、显示面板、显示装置 WO2018218925A1 (zh)

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