WO2018211699A1 - Superconducting wire material, superconducting coil, superconducting magnet, and superconducting device - Google Patents

Superconducting wire material, superconducting coil, superconducting magnet, and superconducting device Download PDF

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Publication number
WO2018211699A1
WO2018211699A1 PCT/JP2017/018878 JP2017018878W WO2018211699A1 WO 2018211699 A1 WO2018211699 A1 WO 2018211699A1 JP 2017018878 W JP2017018878 W JP 2017018878W WO 2018211699 A1 WO2018211699 A1 WO 2018211699A1
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Prior art keywords
superconducting
layer
wire
superconducting material
covering member
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PCT/JP2017/018878
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French (fr)
Japanese (ja)
Inventor
康太郎 大木
永石　竜起
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住友電気工業株式会社
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Priority to PCT/JP2017/018878 priority Critical patent/WO2018211699A1/en
Publication of WO2018211699A1 publication Critical patent/WO2018211699A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/68—Connections to or between superconductive connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

  • the present invention relates to a superconducting wire, a superconducting coil, a superconducting magnet, and a superconducting device.
  • Patent Document 1 includes a first wire including a first superconducting material layer, a second wire including a second superconducting material layer, a first superconducting material layer, and a first superconducting material layer.
  • a superconducting wire comprising a joining layer containing a superconducting material that joins two superconducting material layers is disclosed.
  • the superconducting wire of the present disclosure includes a first wire, a second wire, a first bonding layer, and a covering member.
  • the first wire has a first superconducting material layer.
  • the second wire has a second superconducting material layer.
  • the first portion of the first superconducting material layer is disposed to face the second portion of the second superconducting material layer.
  • the first joining layer joins the first portion of the first superconducting material layer and the second portion of the second superconducting material layer.
  • the covering member is disposed so as to embed the first bonding layer and the region of the first wire and the second wire disposed so as to overlap the first bonding layer.
  • the material constituting the first bonding layer includes a superconductor.
  • the superconducting coil of the present disclosure has a central axis.
  • the superconducting coil includes the superconducting wire.
  • the superconducting wire is wound around the central axis.
  • a superconducting magnet of the present disclosure includes the superconducting coil, a cryostat, and a refrigerator.
  • the cryostat houses a superconducting coil.
  • the refrigerator cools the superconducting coil.
  • a superconducting device of the present disclosure includes the superconducting magnet.
  • FIG. 1 is a schematic cross-sectional view of a superconducting wire according to Embodiment 1.
  • FIG. FIG. 2 is a schematic sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic partial enlarged sectional view of region III shown in FIG. 1 of the superconducting wire according to the first embodiment.
  • FIG. 4 is a diagram showing a flowchart of the method of manufacturing the superconducting wire according to the first embodiment.
  • FIG. 5 is a schematic cross-sectional view of a first modification of the superconducting wire according to the first embodiment.
  • FIG. 6 is a schematic cross-sectional view of a second modification of the superconducting wire according to the first embodiment.
  • FIG. 7 is a schematic cross-sectional view of the superconducting wire according to the second embodiment.
  • FIG. 8 is a schematic partial enlarged cross-sectional view of region VIII shown in FIG. 7 of the superconducting wire according to the second embodiment.
  • FIG. 9 is a schematic cross-sectional view of a first modification of the superconducting wire according to the second embodiment.
  • FIG. 10 is a schematic cross-sectional view of a second modification of the superconducting wire according to the second embodiment.
  • FIG. 11 is a schematic cross-sectional view of the superconducting wire according to the third embodiment.
  • FIG. 12 is a schematic cross-sectional view of a first modification of the superconducting wire according to the third embodiment.
  • FIG. 13 is a schematic cross-sectional view of a second modification of the superconducting wire according to the third embodiment.
  • FIG. 14 is a schematic cross-sectional view of the superconducting magnet according to the fourth embodiment.
  • FIG. 15 is a schematic side view of a superconducting device according to the fifth embodiment.
  • a first object of the present disclosure is to provide a superconducting wire in which durability of a connection portion in which superconducting material layers are connected by a bonding layer is improved.
  • the second object of the present disclosure is to provide a superconducting coil, a superconducting magnet, and a superconducting device including such a superconducting wire.
  • the present disclosure it is possible to obtain a superconducting wire with improved durability of the connection portion.
  • the superconducting coil, the superconducting magnet, and the superconducting device can each have high reliability.
  • the superconducting wire 1, 1b of the present disclosure includes a first wire 10, a second wire 20, a first bonding layer 40, and a covering member 60.
  • the first wire 10 has a first superconducting material layer 13.
  • the second wire 20 has a second superconducting material layer 23.
  • the first portion 17 of the first superconducting material layer 13 is disposed to face the second portion 27 a of the second superconducting material layer 23.
  • the first bonding layer 40 bonds the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23.
  • the covering member 60 is disposed so as to embed the first bonding layer 40 in the region disposed so as to overlap the first bonding layer 40 in the first wire 10 and the second wire 20. .
  • the material constituting the first bonding layer 40 includes a superconductor.
  • the joint portion where the first wire 10 and the second wire 20 are joined by the first joining layer 40 can be covered by the covering member 60.
  • the joint portion can be reinforced by the covering member 60.
  • moisture content from the outside can be suppressed.
  • the covering member 60 includes first to third layers 61 to 63 which are a plurality of layers.
  • the covering member 60 can have a multilayer structure. Therefore, the covering member 60 can be provided with a plurality of functions by making the layers constituting the covering member 60, for example, layers of different materials.
  • the number of layers constituting the covering member 60 may be two or four or more.
  • the first wire 10 includes a first conductor layer (a protective layer 18 and a stabilization layer 19) disposed on the first superconducting material layer 13.
  • Second wire 20 includes a second conductor layer (protective layer 28 and stabilization layer 29) disposed on second superconducting material layer 23.
  • the covering member 60 includes a conductor portion (the covering member 60 in FIG. 5 or the third layer 63 in FIG. 6). The conductor portion of the covering member 60 connects the first conductor layer and the second conductor layer. In this case, the covering member 60 can electrically connect the first conductor layer of the first wire 10 and the second conductor layer of the second wire 20.
  • the first superconducting material layer 13 is composed of RE1 1 Ba 2 Cu 3 O y1 (6.0 ⁇ y1 ⁇ 8.0, where RE1 represents a rare earth element). Yes.
  • the second superconducting material layer 23 is composed of RE2 1 Ba 2 Cu 3 O y2 (6.0 ⁇ y2 ⁇ 8.0, where RE2 represents a rare earth element).
  • the superconductor of the first bonding layer 40 is composed of RE3 1 Ba 2 Cu 3 O y3 (6.0 ⁇ y3 ⁇ 8.0, where RE3 represents a rare earth element).
  • the first superconducting material layer 13, the second superconducting material layer 23, and the first bonding layer 40 have the same crystal structure.
  • the first superconducting material layer 13 and the second superconducting material layer 23 are bonded to each other through a bonding layer 40 including a superconductor.
  • the superconducting wire 1, 1b it is possible to realize a superconducting junction in the bonding layer 40, the superconducting critical current I c of the superconducting wire 1, 1b are increased.
  • the first portion 17 of the first superconducting material layer 13 is disposed at a position adjacent to the first end face 10e in the longitudinal direction.
  • the second portion 27 a of the second superconducting material layer 23 is disposed at a position adjacent to the second end face 20 e in the longitudinal direction.
  • the 1st wire 10 and the 2nd wire 20 are arrange
  • the covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e.
  • the superconducting wire 1, 1 b further includes a third wire 30 and a second bonding layer 42.
  • the third wire 30 has a third superconducting material layer 33.
  • the second bonding layer 42 bonds the second superconducting material layer 23 and the third superconducting material layer 33.
  • the first wire 10 has a first length in the longitudinal direction of the first wire 10.
  • the second wire 20 has a second length in the longitudinal direction of the second wire 20.
  • the third wire 30 has a third length in the longitudinal direction of the third wire 30. The second length is shorter than the first length and the third length.
  • the covering member 60 is disposed so as to embed the entire second wire 20, the region disposed so as to overlap the second bonding layer 42 in the third wire 30, and the second bonding layer 42 therein. Has been.
  • the entire joining portion using the second wire 20 as the joining material of the first wire 10 and the third wire 30 can be covered with the covering member 60.
  • the joint portion can be protected and reinforced by the covering member 60.
  • the superconducting coil 70 of the present disclosure includes the superconducting wires 1 and 1b of the present disclosure.
  • Superconducting wires 1 and 1 b are wound around the central axis of superconducting coil 70.
  • the superconducting coil 70 has high reliability and can generate a strong magnetic field.
  • the superconducting magnet 100 of the present disclosure includes the superconducting coil 70, a cryostat 105 that accommodates the superconducting coil 70, and a refrigerator 102 that cools the superconducting coil 70.
  • the superconducting magnet 100 has high reliability and can generate a strong magnetic field.
  • the superconducting device 200 of the present disclosure includes the superconducting magnet 100.
  • the superconducting device 200 has high reliability and can generate a strong magnetic field.
  • the superconducting wire 1 of the present embodiment includes a first wire 10, a second wire 20, and a first superconducting material bonding layer 40 (hereinafter simply referred to as a bonding layer 40).
  • the covering member 60 are mainly provided.
  • the covering member 60 may be made of any material.
  • the covering member 60 may be a conductor such as a metal.
  • the covering member 60 may be an insulator such as resin.
  • the covering member 60 surrounds a connecting portion between the first wire 10 and the second wire 20.
  • the covering member 60 is configured so that the connecting portion is embedded in the covering member 60.
  • the first wire 10 includes a first superconducting material layer 13 having a first main surface 13s. Specifically, the first wire 10 is provided on the first metal substrate 11, the first intermediate layer 12 provided on the first metal substrate 11, and the first intermediate layer 12. The first superconducting material layer 13 may be included.
  • the second wire 20 includes a second superconducting material layer 23 having a second main surface 23s. Specifically, the second wire 20 is provided on the second metal substrate 21, the second intermediate layer 22 provided on the second metal substrate 21, and the second intermediate layer 22. The second superconducting material layer 23 may be included.
  • the first wire 10 and the second wire 20 may be different portions of one wire.
  • the first wire 10 may be one end of one wire
  • the second wire 20 may be the other end of the one wire.
  • the first metal substrate 11 and the second metal substrate 21 may each be an oriented metal substrate.
  • An oriented metal substrate means a metal substrate having a uniform crystal orientation on the surface of the metal substrate.
  • the oriented metal substrate may be, for example, a clad type metal substrate in which a nickel layer, a copper layer, and the like are arranged on a SUS or Hastelloy (registered trademark) base metal substrate.
  • the first intermediate layer 12 may be made of a material that has extremely low reactivity with the first superconducting material layer 13 and does not deteriorate the superconducting characteristics of the first superconducting material layer 13.
  • the second intermediate layer 22 may be made of a material that has extremely low reactivity with the second superconducting material layer 23 and does not deteriorate the superconducting characteristics of the second superconducting material layer 23.
  • the first intermediate layer 12 and the second intermediate layer 22 are, for example, YSZ (yttria stabilized zirconia), CeO 2 (cerium oxide), MgO (magnesium oxide), Y 2 O 3 (yttrium oxide), Al, respectively.
  • It may be composed of at least one of 2 O 3 (aluminum oxide), LaMnO 3 (lanthanum manganese oxide), Gd 2 Zr 2 O 7 (gadolinium zirconate) and SrTiO 3 (strontium titanate).
  • 2 O 3 aluminum oxide
  • LaMnO 3 lanthanum manganese oxide
  • Gd 2 Zr 2 O 7 gadolinium zirconate
  • SrTiO 3 sinrontium titanate
  • the first intermediate layer 12 and the second intermediate layer 22 may each be composed of a plurality of layers.
  • the first intermediate layer 12 and the second intermediate layer 22 are formed by, for example, an IBAD (Ion Beam Assisted Deposition) method. It may be a crystal orientation layer formed in the above manner.
  • the first metal substrate 11 has crystal orientation on its surface
  • the first intermediate layer 12 reduces the difference in crystal orientation between the first metal substrate 11 and the first superconducting material layer 13. Also good.
  • the second metal substrate 21 has crystal orientation on its surface
  • the second intermediate layer 22 reduces the difference in crystal orientation between the second metal substrate 21 and the second superconducting material layer 23. Also good.
  • the first superconducting material layer 13 is a portion of the first wire 10 through which a superconducting current flows.
  • the second superconducting material layer 23 is a portion of the second wire 20 through which a superconducting current flows.
  • the first superconducting material layer 13 and the second superconducting material layer 23 are not particularly limited, but may be composed of an oxide superconducting material.
  • the first superconducting material layer 13 may be made of RE1 1 Ba 2 Cu 3 O y1 (6.0 ⁇ y1 ⁇ 8.0, where RE1 represents a rare earth element).
  • the second superconducting material layer 23 may be made of RE2 1 Ba 2 Cu 3 O y2 (6.0 ⁇ y2 ⁇ 8.0, where RE2 represents a rare earth element).
  • RE2 may be the same as or different from RE1. More specifically, RE1 and RE2 are yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium ( Tm), ytterbium (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho). More specifically, y1 and y2 may be 6.8 or more and 7.0 or less, respectively.
  • the first superconducting material bonding layer 40 includes a first portion 17 that is a part of the first main surface 13 s of the first superconducting material layer 13 and a second main surface 23 s of the second superconducting material layer 23.
  • the second portion 27a is joined.
  • the first portion 17 may be located at a first end portion that is an end portion of the first wire rod 10 near the second wire rod 20.
  • the second portion 27 a may be located at the second end portion that is the end portion of the second wire rod 20 near the first wire rod 10.
  • the first superconducting material bonding layer 40 is not particularly limited, but may be composed of an oxide superconducting material.
  • the first superconducting material bonding layer 40 may be made of RE3 1 Ba 2 Cu 3 O y3 (6.0 ⁇ y3 ⁇ 8.0, where RE3 represents a rare earth element).
  • RE3 may be the same as or different from RE1.
  • RE3 may be the same as or different from RE2. More specifically, RE3 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y3 may be 6.8 or more and 7.0 or less.
  • the covering member 60 embeds the first superconductor material bonding layer 40 and the region of the first wire material 10 and the second wire material 20 so as to overlap with the first superconductor material bonding layer 40. Placed in. If it says from a different viewpoint, the covering member 60 is arrange
  • the covering member 60 is in contact with the first main surface 13 s of the first superconducting material layer 13 of the first wire 10, and from the second end surface 20 e of the second wire 20 to the second metal substrate 21. It is formed to extend up. As shown in FIG. 2, the covering member 60 is disposed so as to surround the periphery of the joint portion in a cross section perpendicular to the extending direction of the first wire 10. Further, in the extending direction of the first wire 10, the outer peripheral surface of the covering member 60 and the first superconducting material bonding layer 40 are arranged apart from each other. As a result, the first superconducting material bonding layer 40 is isolated from the external atmosphere by the covering member 60.
  • the manufacturing method of the superconducting wire 1 of the present embodiment is performed on at least one of the first superconducting material layer 13 included in the first wire 10 and the second superconducting material layer 23 included in the second wire 20. And forming a microcrystal of the oxide superconducting material constituting the first superconducting material bonding layer 40, that is, a microcrystal generating step (S10).
  • the first superconducting material bonding layer is formed on at least one of the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23.
  • Forming a film containing an organic compound of an element constituting 40 that is, a coating film forming step (S11).
  • the solution containing the organic compound of the element constituting the first superconducting material bonding layer 40 is used as the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23.
  • a raw material solution in the MOD method can be used as this solution.
  • a solution a solution in which an organic compound (for example, an organometallic compound or an organometallic complex) of an element constituting RE3 1 Ba 2 Cu 3 O y3 which is a material of the first superconducting material bonding layer 40 is dissolved in an organic solvent.
  • an organic compound for example, an organometallic compound or an organometallic complex
  • the organic compound may be an organic compound not containing fluorine.
  • the microcrystal production step (S10) includes pre-baking a film containing an organic compound of an element constituting the first superconducting material bonding layer 40, that is, a pre-heat treatment step (S12). Specifically, this film is temporarily fired at a first temperature.
  • the first temperature is equal to or higher than the decomposition temperature of the organic compound and lower than the temperature at which the oxide superconducting material constituting the first superconducting material bonding layer 40 is generated.
  • the organic compound contained in this film is thermally decomposed to become a precursor of the oxide superconducting material (hereinafter, a film containing this precursor is referred to as a pre-baked film).
  • the precursor of the oxide superconducting material includes, for example, BaCO 3 which is a carbon compound of Ba, an oxide of a rare earth element (RE3), and CuO.
  • the pre-baking treatment step (S12) may be performed, for example, at a first temperature such as about 500 ° C. and in an atmosphere having an oxygen concentration of 20% or more.
  • the step (S10) includes heating the calcined film at a second temperature higher than the first temperature to thermally decompose the carbon compound contained in the calcined film, that is, the calcining decomposition step (S13). .
  • the second temperature may be, for example, 650 ° C. or higher and 800 ° C. or lower.
  • the carbon compound contained in the temporarily fired film is thermally decomposed, and the oxide superconducting material constituting the first superconducting material bonding layer 40 is obtained.
  • membrane is performed in the atmosphere of 1st oxygen concentration.
  • the first oxygen concentration is 1% or more and 100% or less.
  • the oxygen partial pressure may be 1 atm for the atmosphere. Therefore, it is suppressed that the microcrystal grows and the average grain size of the microcrystal becomes larger than 300 nm.
  • a polycrystalline layer containing microcrystals of material is formed.
  • the carbon compound such as BaCO 3 contained in the calcined film is thermally decomposed, RE3 1 Ba 2 Cu 3 O y3 is produced in the polycrystalline layer.
  • the orientation of the microcrystal contained in the polycrystalline layer is a random orientation.
  • the grain size of the microcrystals is not more than the thickness of the polycrystalline layer, and is preferably not more than 300 nm.
  • an area equivalent circle diameter (Heywood diameter) of the microcrystal calculated from an image obtained by SEM is used.
  • the second portion 27a of the second wire 20 is mounted on the first portion 17 of the first wire 10 via the polycrystalline layer containing microcrystals. Placing, that is, a bonding step (S20).
  • the manufacturing method of the superconducting wire 1 of the present embodiment applies heat to the first wire 10, the polycrystalline layer containing microcrystals, and the second wire 20 while applying pressure to the first superconductor from the microcrystals.
  • the material joining layer 40 is generated, that is, a heating joining step (S30) is provided.
  • the heat bonding step (S30) is also called a main heat treatment step or a heating and pressing step. Specifically, the first wire 10 and the second wire 20 are pressed against each other using a pressing jig, whereby 1 MPa or more is applied to the first wire 10, the polycrystalline layer, and the second wire 20. Apply pressure.
  • the third temperature is equal to or higher than the second temperature and equal to or higher than the temperature at which the oxide superconducting material constituting the first superconducting material bonding layer 40 is generated.
  • the second oxygen concentration is lower than the first oxygen concentration.
  • the second oxygen concentration may be 100 ppm, for example.
  • the microcrystals generated in the calcined film decomposition step (S13) grow to generate the first superconducting material bonding layer 40 composed of crystals having a large grain size.
  • a microcrystal grows along at least one crystal orientation of the first superconducting material layer 13 and the second superconducting material layer 23 on which the film has been formed in the coating film forming step (S11), and the first superconducting material The bonding layer 40 is obtained.
  • the first superconducting material layer 13 of the first wire 10 and the second superconducting material layer 23 of the second wire 20 are joined to each other via the first superconducting material joining layer 40.
  • the first superconducting material layer 13, the first superconducting material bonding layer 40, and the second superconducting material layer 23 are subjected to oxygen annealing, that is, an oxygen annealing step (S40). ) May be further provided.
  • the oxygen annealing step (S40) is performed at a fourth temperature and in an atmosphere having a third oxygen concentration.
  • the fourth temperature is equal to or lower than the third temperature.
  • the fourth temperature may be 200 ° C. or higher and 500 ° C. or lower.
  • the third oxygen concentration is higher than the second oxygen concentration.
  • the third oxygen concentration may be, for example, 100% (oxygen partial pressure 1 atm).
  • the oxygen annealing step is made sufficiently long so that the first superconducting material layer 13, the first superconducting material bonding layer 40, and the second superconducting material layer 23 have oxygen. Can be adequately supplied.
  • the method of manufacturing the superconducting wire 1 according to the present embodiment includes a region disposed so as to overlap the first bonding layer 40 in the first wire 10 and the second wire 20, and the first superconducting material bonding layer 40.
  • a covering member 60 so as to be embedded therein, that is, a covering step (S50).
  • the covering member is formed by an arbitrary method so as to embed the connecting portion where the first wire 10 and the second wire 20 are connected by the first superconducting material bonding layer 40 as described above.
  • 60 is formed.
  • the covering member 60 may be formed by disposing a molten metal or liquid resin using a mold around the connection portion and solidifying the covering member 60 into a shape.
  • the covering member 60 may be formed by winding a tape-like member or a sheet-like member made of a material constituting the covering member 60 around the connection portion.
  • the superconducting wire 1 of the present embodiment can be manufactured through the above steps.
  • the first portion 17 of the first superconducting material layer 13 is disposed to face the second portion 27 a of the second superconducting material layer 23.
  • the first superconducting material joining layer 40 joins the first portion 17 of the first superconducting material layer 13 and the second portion 27 a of the second superconducting material layer 23.
  • the covering member 60 includes a first superconductor material, a region disposed so as to overlap the first superconductor material bonding layer 40 in the first wire material 10 and the second wire material 20, and the first superconductor material.
  • the bonding layer 40 is disposed so as to be embedded therein.
  • the joint portion where the first wire 10 and the second wire 20 are joined by the first superconducting material joining layer 40 can be covered by the covering member 60.
  • the joint portion can be reinforced by the covering member 60.
  • by covering the bonding portion with the covering member 60 it is possible to prevent the first superconducting material bonding layer 40 from being exposed to the external atmosphere. For this reason, generation
  • the first superconducting material layer 13, the second superconducting material layer 23, and the first superconducting material bonding layer 40 have the same crystal structure. That is, the first superconducting material layer 13 and the second superconducting material layer 23 are joined to each other via the first superconducting material joining layer 40 in which oxygen is sufficiently introduced to improve the superconducting characteristics. Therefore, according to the superconducting wire 1, superconducting bonding in the first superconducting material bonding layer 40 can be realized, and the superconducting characteristics in the first superconducting material bonding layer 40 are improved, so that the superconducting critical current I c of the superconducting wire 1 is improved. Will increase.
  • the first modification of the superconducting wire 1 of the present embodiment basically has the same configuration as the superconducting wire 1 shown in FIGS. It is formed so that the wire 10 includes the protective layer 18 and the stabilization layer 19, the second wire 20 includes the protection layer 28 and the stabilization layer 29, and the covering member 60 is in contact with the stabilization layers 19 and 29. Is different from the superconducting wire 1 shown in FIGS. At least one of the protective layer 18 and the stabilization layer 19 of the first wire 10 corresponds to the first conductor layer. At least one of the protective layer 28 and the stabilization layer 29 of the second wire 20 corresponds to the second conductor layer.
  • the protective layer 18 is disposed on the surface of the first superconducting material layer 13 in the first wire 10.
  • the protective layer 18 is disposed away from the first superconducting material bonding layer 40 located in the first portion 17. If it says from a different viewpoint, the edge part of the protective layer 18 will be arrange
  • a stabilization layer 19 is disposed on the surface of the protective layer 18. The distance between the end of the stabilization layer 19 and the first portion 17 is greater than the distance between the protective layer 18 and the first portion 17. From a different point of view, the protective layer 18 includes a portion extending toward the outside of the stabilization layer 19.
  • the stabilization layer 19 is formed so as to cover the entire first metal substrate 11, first intermediate layer 12, first superconducting material layer 13, and protective layer 18. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the first wire 10, the stabilization layer 19 includes the first metal substrate 11, the first intermediate layer 12, and the first superconducting material. It arrange
  • a protective layer 28 is disposed on the surface of the second superconducting material layer 23.
  • the protective layer 28 is disposed away from the first superconducting material bonding layer 40. If it says from a different viewpoint, the edge part of the protective layer 28 will be arrange
  • FIG. A stabilization layer 29 is disposed on the surface of the protective layer 28. The distance between the end of the stabilization layer 29 and the first portion 17 is greater than the distance between the protective layer 28 and the first portion 17. From a different point of view, the protective layer 28 includes a portion extending toward the outside of the stabilization layer 29.
  • the stabilization layer 29 is formed so as to cover the entire second metal substrate 21, second intermediate layer 22, second superconducting material layer 23, and protective layer 28. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the second wire 20, the stabilization layer 29 is composed of the second metal substrate 21, the second intermediate layer 22, and the second superconducting material. It arrange
  • the covering member 60 is connected to the stabilization layers 19 and 29.
  • the covering member 60 is connected to the protective layers 18 and 28.
  • the covering member 60 is in contact with the first superconducting material layer 13 and the second superconducting material layer 23 between the protective layers 18 and 28 and the first portion 17.
  • the covering member 60 is made of a conductor.
  • a metal such as solder, copper and silver may be used as a material constituting the covering member 60.
  • the superconducting wire 1 shown in FIG. 5 can achieve the same effects as the superconducting wire 1 shown in FIGS. Further, in the superconducting wire 1 shown in FIG. 5, the first wire 10 includes a protective layer 18 as a first conductor layer and a stabilization layer 19 disposed on the first superconducting material layer 13.
  • the second wire 20 includes a protective layer 28 and a stabilization layer 29 as a second conductor layer disposed on the second superconducting material layer 23.
  • the covering member 60 includes a conductor portion. In the configuration shown in FIG. 5, the entire covering member 60 is a conductor portion.
  • the covering member 60 that is a conductor portion includes at least one of the first protective layer 18 and the first stabilizing layer 19, and at least one of the second protective layer 28 and the second stabilizing layer 29. And connect.
  • the covering member 60 connects the first stabilization layer 19 and the second stabilization layer 29.
  • the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the second stabilization layer 29 of the second wire 20. Therefore, when a problem occurs in the first superconducting material bonding layer 40 and no current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the first superconducting material bonding layer 40. The current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18, the stabilizing layer 19, the covering member 60, the stabilizing layer 29, and the protective layer 28.
  • the second modification of the superconducting wire 1 of the present embodiment basically has the same configuration as that of the superconducting wire 1 shown in FIG. 5, but includes a plurality of covering members 60. It differs from the superconducting wire 1 shown in FIG. 5 in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
  • the first layer 61 of the covering member 60 is disposed so as to cover the entire connecting portion.
  • the first layer 61 includes the first end surface 10e of the first wire 10 from the second main surface 23s of the second superconducting material layer 23, the back surface side of the first metal substrate 11 (the first intermediate layer 12 is (The surface opposite to the formed surface).
  • the first layer 61 includes a second end surface 20e of the second wire 20 from the first main surface 13s of the first superconducting material layer 13, and a back surface side (second intermediate) of the second metal substrate 21. It extends to the surface opposite to the surface on which the layer 22 is formed.
  • the first layer 61 has a cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed, and the first wire 10, the second wire 20, It arrange
  • a material of the first layer 61 for example, a metal such as solder, copper, or silver may be used, or a resin may be used.
  • any method of the first layer 61 any method can be used.
  • the second layer 62 is formed on the outer peripheral surface of the first layer 61.
  • the second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61.
  • one end of the second layer 62 is in contact with the first superconducting material layer 13.
  • the other end portion of the second layer 62 located on the opposite side to the one end portion is in contact with the second superconducting material layer 23.
  • a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62.
  • a sheet-like member or a tape-like member made of metal or resin may be used as the second layer 62. In this case, the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
  • the third layer 63 is formed on the outer peripheral surface of the second layer 62.
  • the third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62.
  • one end of the third layer 63 is in contact with the stabilization layer 19 of the first wire 10.
  • the other end portion of the third layer 63 located on the opposite side of the one end portion is in contact with the stabilization layer 29 of the second wire 20.
  • the third layer 63 corresponds to the conductor portion of the covering member 60.
  • a material of the third layer 63 for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
  • the superconducting wire 1 shown in FIG. 6 can achieve the same effects as the superconducting wire 1 shown in FIG. Furthermore, in the superconducting wire 1 shown in FIG. 6, the covering member 60 includes a first layer 61, a second layer 62, and a third layer 63 as a plurality of layers. That is, the covering member 60 has a multilayer structure. Therefore, the first to third layers 61, 62, and 63 constituting the covering member 60 can be provided with a plurality of functions by making the layers of different materials, for example.
  • FIG. 2 (Embodiment 2) ⁇ Configuration of superconducting wire>
  • a superconducting wire 1b according to the second embodiment will be described with reference to FIGS. 3, 7, and 8.
  • FIG. The superconducting wire 1b of the present embodiment has the same configuration as the superconducting wire 1 of the first embodiment, but is mainly different in the following points.
  • the superconducting wire 1b of the present embodiment further includes a third wire 30 and a second superconducting material bonding layer 42.
  • the second superconducting material joining layer 42 as the second joining layer has the same configuration as the first superconducting material joining layer 40 shown in FIG. Further, the shape of the covering member 60 shown in FIG. 7 is different from the shape of the covering member 60 shown in FIGS. 1 and 2.
  • the covering member 60 includes the second wire 20 as a whole, a region of the first wire that is arranged to overlap the first superconducting material bonding layer 40, the first superconducting material bonding layer 40, In the third wire 30, the region disposed so as to overlap the second superconducting material bonding layer 42 and the second superconducting material bonding layer 42 are disposed so as to be embedded therein.
  • the third wire 30 includes a third superconducting material layer 33 having a third main surface 33s. Specifically, the third wire 30 is provided on the third metal substrate 31, the third intermediate layer 32 provided on the third metal substrate 31, and the third intermediate layer 32. The third superconducting material layer 33 may be included.
  • the third wire 30 may be configured in the same manner as the first wire 10.
  • the first wire 10 and the third wire 30 may be different portions of one wire.
  • the first wire 10 may be one end of one wire
  • the third wire 30 may be the other end of the one wire.
  • the third metal substrate 31 may be an oriented metal substrate.
  • An oriented metal substrate means a metal substrate having a uniform crystal orientation on the surface of the metal substrate.
  • the oriented metal substrate may be, for example, a clad type metal substrate in which a nickel layer, a copper layer, and the like are arranged on a SUS or Hastelloy (registered trademark) base metal substrate.
  • the third intermediate layer 32 may be made of a material that has extremely low reactivity with the third superconducting material layer 33 and does not deteriorate the superconducting characteristics of the third superconducting material layer 33.
  • the third intermediate layer 32 includes, for example, YSZ (yttria stabilized zirconia), CeO 2 (cerium oxide), MgO (magnesium oxide), Y 2 O 3 (yttrium oxide), Al 2 O 3 (aluminum oxide), LaMnO. 3 (lanthanum manganese oxide), Gd 2 Zr 2 O 7 (gadolinium zirconate), and SrTiO 3 (strontium titanate).
  • the third intermediate layer 32 may be composed of a plurality of layers.
  • the third intermediate layer 32 may be a crystal orientation layer formed by, for example, an IBAD (Ion Beam Assisted Deposition) method.
  • IBAD Ion Beam Assisted Deposition
  • the third intermediate layer 32 reduces the difference in crystal orientation between the third metal substrate 31 and the third superconducting material layer 33. Also good.
  • the third superconducting material layer 33 is a portion of the third wire 30 through which the superconducting current flows.
  • the third superconducting material layer 33 is not particularly limited, but may be composed of an oxide superconducting material.
  • the third superconducting material layers 33, RE4 1 Ba 2 Cu 3 O y4 (6.0 ⁇ y4 ⁇ 8.0, RE4 represents a rare earth element) may be configured with.
  • RE4 may be the same as or different from RE1.
  • RE4 may be the same as or different from RE2.
  • RE4 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y4 may be 6.8 or more and 7.0 or less.
  • the second length of the second wire 20 in the longitudinal direction of the second wire 20 is the first length of the first wire 10 and the length of the third wire 30 in the longitudinal direction of the first wire 10. Shorter than the third length of the third wire 30 in the direction.
  • the first wire 10 has a first end face 10e.
  • the third wire rod 30 has a third end face 30e.
  • the third end face 30e is opposed to the first end face 10e with a space between the third end face 30e and the first end face 10e.
  • the first main surface 13 s of the first superconducting material layer 13 and the second main surface 23 s of the second superconducting material layer 23 are bonded to each other through the first superconducting material bonding layer 40.
  • the second main surface 23 s of the second superconducting material layer 23 and the third main surface 33 s of the third superconducting material layer 33 are joined to each other via the second superconducting material joining layer 42.
  • the second wire 20 straddles the first end surface 10 e of the first wire 10 and the third end surface 30 e of the third wire 30.
  • the second superconducting material layer 23 bridges the first superconducting material layer 13 and the third superconducting material layer 33. Note that the first end surface 10e and the third end surface 30e may be close to or in contact with each other.
  • the second superconducting material bonding layer 42 includes a third portion 27b of the second main surface 23s of the second superconducting material layer 23 and a fourth portion of the third main surface 33s of the third superconducting material layer 33. 37 is joined.
  • the third portion 27b is different from the second portion 27a.
  • the third portion 27b may be located at the end of the second wire 20 opposite to the second portion 27a in the longitudinal direction.
  • the fourth portion 37 may be located at a third end portion of the third wire 30 adjacent to the third end surface 30e.
  • the second superconducting material bonding layer 42 is not particularly limited, but may be composed of an oxide superconducting material. Specifically, the second superconducting material bonding layer 42 may be composed of RE5 1 Ba 2 Cu 3 O y5 (6.0 ⁇ y5 ⁇ 8.0, where RE5 represents a rare earth element). RE5 may be the same as RE2, or may be different. RE5 may be the same as RE3 or different. RE5 may be the same as RE4 or different.
  • RE5 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y5 may be 6.8 or more and 7.0 or less.
  • the covering member 60 includes the entire second wire 20, the end on the first end surface 10 e side of the first wire 10, and the end on the third end surface 30 e side of the third wire 30. Is arranged to embed. A part of the covering member 60 is filled in a gap between the first end surface 10e and the third end surface 30e.
  • the covering member 60 has the second wire 20, the third wire 30, the second wire 30 in the cross section perpendicular to the extending direction of the third wire 30 in the region where the second superconducting material bonding layer 42 is formed.
  • the two superconducting material bonding layers 42 are arranged so as to surround the whole.
  • the method of joining the second superconducting material layer 23 and the third superconducting material layer 33 through the second superconducting material joining layer 42 is the same as that of the first superconducting material joining layer 40 in the first embodiment. This is the same as the method of joining the first superconducting material layer 13 and the second superconducting material layer 23 (see FIG. 4).
  • the method for forming the covering member 60 is basically the same as the method for forming the covering member 60 in the first embodiment.
  • Superconducting wire 1b of the present embodiment has the following effects in addition to the effects of superconducting wire 1 of the first embodiment.
  • the superconducting wire 1b of the present embodiment further includes a third wire 30 and a second superconducting material bonding layer 42.
  • the covering member 60 is added to the entire second wire 20, the region of the first wire 10 that is arranged to overlap the first superconducting material bonding layer 40, and the first superconducting material bonding layer 40, In the third wire 30, the region disposed so as to overlap the second superconducting material bonding layer 42 and the second superconducting material bonding layer 42 are disposed so as to be embedded therein.
  • the entire joining portion in which the second wire 20 is used as the joining material of the first wire 10 and the third wire 30 can be covered with the covering member 60. For this reason, the joint portion can be protected and reinforced by the covering member 60.
  • the first modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIGS. It is formed so that the wire 10 includes the protective layer 18 and the stabilization layer 19, the third wire 30 includes the protection layer 38 and the stabilization layer 39, and the covering member 60 is in contact with the stabilization layers 19 and 39. Is different from the superconducting wire 1b shown in FIGS. At least one of the protective layer 38 and the stabilization layer 39 of the third wire 30 corresponds to the third conductor layer.
  • the configuration of the first wire 10 is the same as the configuration of the first wire 10 in the superconducting wire 1 shown in FIG. That is, the protective layer 18 is disposed on the surface of the first superconducting material layer 13.
  • a stabilization layer 19 is disposed on the surface of the protective layer 18. The distance between the end of the stabilization layer 19 and the first portion 17 is greater than the distance between the protective layer 18 and the first portion 17.
  • the stabilization layer 19 is formed so as to cover the entire first metal substrate 11, first intermediate layer 12, first superconducting material layer 13, and protective layer 18.
  • a protective layer 38 is disposed on the surface of the third superconducting material layer 33.
  • the protective layer 38 is disposed away from the second superconducting material bonding layer 42. From a different point of view, the end of the protective layer 38 is spaced from the second superconducting material bonding layer 42.
  • a stabilizing layer 39 is disposed on the surface of the protective layer 38. The distance between the end of the stabilization layer 39 and the fourth portion 37 is greater than the distance between the protective layer 28 and the fourth portion 37. From a different point of view, the protective layer 38 includes a portion extending toward the outside of the stabilization layer 39.
  • the stabilization layer 39 is formed so as to cover the entire third metal substrate 31, third intermediate layer 32, third superconducting material layer 33, and protective layer 38. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the third wire 30, the stabilization layer 39 includes the third metal substrate 31, the third intermediate layer 32, and the third superconducting material. It arrange
  • the covering member 60 is connected to the stabilization layers 19 and 39.
  • the covering member 60 is connected to the protective layers 18 and 38.
  • the covering member 60 is in contact with the first superconducting material layer 13 between the protective layer 18 and the first portion 17.
  • the covering member 60 is in contact with the third superconducting material layer 33 between the protective layer 38 and the fourth portion 37.
  • the covering member 60 is made of a conductor.
  • a metal such as solder, copper and silver may be used as a material constituting the covering member 60.
  • the superconducting wire 1b shown in FIG. 9 can achieve the same effects as the superconducting wire 1b shown in FIGS. Further, in the superconducting wire 1 b shown in FIG. 9, the first wire 10 includes a protective layer 18 and a stabilization layer 19 as a first conductor layer disposed on the first superconducting material layer 13.
  • the third wire 30 includes a protective layer 38 and a stabilization layer 39 as a third conductor layer disposed on the third superconducting material layer 33.
  • the covering member 60 includes a conductor portion. In the configuration shown in FIG. 9, the entire covering member 60 is a conductor portion.
  • the covering member 60 which is a conductor portion, includes at least one of the first protective layer 18 and the first stabilizing layer 19, and at least one of the third protective layer 38 and the third stabilizing layer 39. And connect.
  • the covering member 60 connects the first stabilization layer 19 and the third stabilization layer 39.
  • the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the third stabilization layer 39 of the third wire 30.
  • the second modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG.
  • the superconducting wire 1b shown in FIG. 9 is different in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
  • the first layer 61 of the covering member 60 is disposed so as to cover the entire connecting portion.
  • the first layer 61 extends from the first main surface 13 s of the first superconducting material layer 13 through the surface of the second wire 20 to the third superconducting material layer 33 of the third wire 30. It extends to the main surface 33s.
  • the first layer 61 is formed on the back surface of the first metal substrate 11 of the first wire rod 10 (the surface opposite to the surface on which the first intermediate layer 12 is formed on the first metal substrate 11). Through the region between the first end face 10e and the third end face 30e, the back surface of the third metal substrate 31 of the third wire 30 (the third intermediate layer 32 is formed in the third metal substrate 31).
  • the first layer 61 has the first wire 10, the second wire 20, or the cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed.
  • the third wire 30, the first superconducting material bonding layer 40, or the second superconducting material bonding layer 42 is disposed so as to surround the whole.
  • a material of the first layer 61 for example, a metal such as solder, copper, or silver may be used, or a resin may be used.
  • any method can be used as a manufacturing method of the first layer 61.
  • the second layer 62 is formed on the outer peripheral surface of the first layer 61.
  • the second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61.
  • one end of the second layer 62 is in contact with the first superconducting material layer 13 and the back surface of the first metal substrate 11.
  • the other end of the second layer 62 located on the opposite side of the one end is in contact with the third superconducting material layer 33 and the back surface of the third metal substrate 31.
  • a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62.
  • a sheet-like member or a tape-like member made of metal or resin may be used as the second layer 62. In this case, the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
  • the third layer 63 is formed on the outer peripheral surface of the second layer 62.
  • the third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62.
  • one end of the third layer 63 is in contact with the stabilization layer 19 of the first wire 10.
  • the other end of the third layer 63 located on the opposite side of the one end is in contact with the stabilization layer 39 of the third wire 30.
  • the third layer 63 corresponds to the conductor portion of the covering member 60.
  • a material of the third layer 63 for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
  • the superconducting wire 1b shown in FIG. 10 can achieve the same effects as the superconducting wire 1b shown in FIG. Furthermore, in the superconducting wire 1b shown in FIG. 10, the covering member 60 includes a first layer 61, a second layer 62, and a third layer 63 as a plurality of layers. That is, the covering member 60 has a multilayer structure. Therefore, the same effect as the superconducting wire 1 shown in FIG. 6 can be obtained.
  • the superconducting wire 1b of the present embodiment has the same configuration as the superconducting wire 1 of the first embodiment, but is mainly different in the following points.
  • the first wire 10 and the second wire 20 are arranged so that the first end surface 10e and the second end surface 20e face the same direction.
  • the first superconducting material bonding layer 40 includes a first portion 17 that is a part of the first main surface 13 s of the first superconducting material layer 13 and a second superconducting material layer 23.
  • the second portion 27a of the second main surface 23s is joined.
  • the covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e therein.
  • the distance between the first wire 10 and the second wire 20 increases as the distance from the covering member 60 increases. That is, the portion adjacent to the covering member 60 in the first wire 10 and the second wire 20 is curved so that the distance from each other increases as the distance from the covering member 60 increases.
  • the method of manufacturing superconducting wire 1b is basically the same as the method of manufacturing superconducting wire 1 according to Embodiment 1 shown in FIGS. However, in the method of manufacturing the superconducting wire 1b shown in FIG. 11, when the first wire 10 and the second wire 20 are overlapped in the bonding step (S20) shown in FIG. 4, the first end face 10e and The first wire 10 and the second wire 20 are arranged so that the second end face 20e faces in the same direction.
  • the covering step (S50) the first end face 10e of the first wire rod 10 and the second end face 20e of the second wire rod 20 are covered, and the first wire rod 10 and the second wire rod 20 are
  • the covering member 60 is formed so as to embed the connecting portion connected by the first superconducting material bonding layer 40.
  • the superconducting wire 1b shown in FIG. 11 can be manufactured by the same steps as the manufacturing method of the superconducting wire 1 according to the first embodiment.
  • Superconducting wire 1b of the present embodiment has the following effects in addition to the effects of superconducting wire 1 of the first embodiment.
  • the first portion 17 of the first superconducting material layer 13 is disposed at a position adjacent to the first end face 10e in the longitudinal direction.
  • the second portion 27 a of the second superconducting material layer 23 is disposed at a position adjacent to the second end face 20 e in the longitudinal direction.
  • the 1st wire 10 and the 2nd wire 20 are arrange
  • the covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e.
  • the first modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG.
  • the point provided with the protective layer 18 and the stabilizing layer 19, the point where the second wire 20 is provided with the protective layer 28 and the stabilizing layer 29, the point where the covering member 60 is formed in contact with the stabilizing layers 19, 29, FIG. 11 shows that the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 are connected to each other at a position adjacent to the first portion 17 and the second portion 27a.
  • At least one of the protective layer 18 and the stabilization layer 19 of the first wire 10 corresponds to the first conductor layer.
  • At least one of the protective layer 28 and the stabilization layer 29 of the second wire 20 corresponds to the second conductor layer.
  • the covering member 60 is made of a conductor such as solder or a metal such as copper.
  • the edge part by the side of the 1st end surface 10e in the protective layer 18 and the edge part by the side of the 2nd end surface 20e in the protective layer 28 are connected, and comprise a connection area
  • the connection region between the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 is located closer to the first end face 10e than the end of the covering member 60 on the side of the stabilizing layers 19 and 29. Also good.
  • the covering member 60 includes, in the first wire 10 and the second wire 20, a region disposed so as to overlap the first superconducting material bonding layer 40, the protective layer 18 and the protective layer 28. Are arranged so as to embed a region arranged so as to overlap the connected portion.
  • the structure of the 1st wire 10 and the 2nd wire 20 which comprises the superconducting wire 1b shown in FIG. 12 is the 1st wire 10 and the 2nd wire 20 which comprise the superconducting wire 1 shown in FIG. It is the same as that of the structure.
  • the protective layer 28 of the 1st wire 10 and the protective layer 28 of the 2nd wire 20 are joined in a heat joining process (S30).
  • the superconducting wire 1b shown in FIG. 12 can achieve the same effects as the superconducting wire 1b shown in FIG. Further, in the superconducting wire 1 b shown in FIG. 12, the first wire 10 includes a protective layer 18 and a stabilization layer 19 as a first conductor layer disposed on the first superconducting material layer 13.
  • the second wire 20 includes a protective layer 28 and a stabilization layer 29 as a second conductor layer disposed on the second superconducting material layer 23.
  • the covering member 60 includes a conductor portion. In the configuration shown in FIG. 12, the entire covering member 60 is a conductor portion.
  • the covering member 60 that is a conductor portion connects the first stabilization layer 19 and the second stabilization layer 29. Furthermore, in FIG. 12, the 1st protective layer 18 and the 2nd protective layer 28 are connected in the position adjacent to the 1st part 17 and the 2nd part 27a. In this case, the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the second stabilization layer 29 of the second wire 20. Further, the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 are directly connected. Therefore, when a problem occurs in the first superconducting material bonding layer 40 and no current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the first superconducting material bonding layer 40.
  • a current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18 and the protective layer 28.
  • the current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18, the stabilizing layer 19, the covering member 60, the stabilizing layer 29, and the protective layer 28.
  • the second modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG. It differs from the superconducting wire 1 shown in FIG. 12 in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
  • the first layer 61 of the covering member 60 is disposed so as to cover the entire connection portion and to cover the first end face 10 e and the second end face 20 e.
  • the first layer 61 extends from the back surface of the second metal substrate 21 to the second end surface 20 e of the second wire 20, the first end surface 10 e of the first wire 10, and the back surface of the first metal substrate 11. It is extended.
  • the first layer 61 has a cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed, and the first wire 10, the second wire 20, It arrange
  • a material of the first layer 61 for example, a metal such as solder, copper, or silver may be used, or a resin may be used.
  • any method of the first layer 61 any method can be used.
  • the second layer 62 is formed on the outer peripheral surface of the first layer 61.
  • the second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61.
  • one end of the second layer 62 is in contact with the back surface of the second metal substrate 21.
  • the other end of the second layer 62 located on the side opposite to the one end is in contact with the back surface of the first metal substrate 11.
  • a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62.
  • a sheet-like member or a tape-like member made of metal or resin may be used as the second layer 62.
  • the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
  • the third layer 63 is formed on the outer peripheral surface of the second layer 62.
  • the third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62.
  • one end of the third layer 63 is in contact with the stabilization layer 29 of the second wire 20.
  • the other end portion of the third layer 63 located on the opposite side of the one end portion is in contact with the stabilizing layer 19 of the first wire 10.
  • the third layer 63 corresponds to the conductor portion of the covering member 60.
  • a material of the third layer 63 for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
  • the superconducting wire 1b shown in FIG. 13 can achieve the same effects as the superconducting wire 1b shown in FIG. Furthermore, in the superconducting wire 1b shown in FIG. 13, the covering member 60 has a multilayer structure. Therefore, the first to third layers 61, 62, and 63 constituting the covering member 60 can be provided with a plurality of functions by making the layers of different materials, for example.
  • the superconducting magnet 100 of the present embodiment cools the superconducting coil 70 including any of the superconducting wires 1 and 1b of the first to third embodiments, the cryostat 105 that houses the superconducting coil 70, and the superconducting coil 70.
  • the refrigerator 102 is mainly provided.
  • the superconducting magnet 100 may further include a heat shield 106 held inside the cryostat 105 and a magnetic shield 140.
  • superconducting coil 70 one of the superconducting wires 1 and 1b is wound around the central axis of the superconducting coil 70.
  • Superconducting coil body 110 including superconducting coil 70 is housed in cryostat 105.
  • Superconducting coil body 110 is held inside heat shield 106.
  • Superconducting coil body 110 includes a plurality of superconducting coils 70, an upper support portion 114, and a lower support portion 111.
  • a plurality of superconducting coils 70 are stacked. The upper and lower end surfaces of the superconducting coils 70 stacked are arranged so that the upper support portion 114 and the lower support portion 111 sandwich the upper end surface and the lower end surface.
  • a cooling plate 113 is disposed on the upper end surface of the superconducting coil 70 that is laminated and on the lower end surface of the superconducting coil 70 that is laminated.
  • a cooling plate (not shown) is also disposed between the superconducting coils 70 adjacent to each other.
  • One end of the cooling plate 113 is connected to the second cooling head 131 of the refrigerator 102.
  • a cooling plate (not shown) disposed between the superconducting coils 70 adjacent to each other is also connected to the second cooling head 131 at one end thereof.
  • the first cooling head 132 of the refrigerator 102 may be connected to the wall portion of the heat shield 106. Therefore, the wall portion of the heat shield 106 can also be cooled by the refrigerator 102.
  • the lower support part 111 of the superconducting coil body 110 has a size larger than the planar shape of the superconducting coil 70.
  • the lower support portion 111 is fixed to the heat shield 106 by a plurality of support members 115.
  • the plurality of support members 115 are rod-shaped members, and connect the upper wall of the heat shield 106 and the outer peripheral portion of the lower support portion 111.
  • a plurality of support members 115 are arranged on the outer periphery of the superconducting coil body 110. Support members 115 are arranged to surround superconducting coil 70 at the same interval.
  • the heat shield 106 that holds the superconducting coil body 110 is connected to the cryostat 105 by the connecting portion 120.
  • the connecting portions 120 are arranged at equal intervals along the outer peripheral portion of the superconducting coil body 110 so as to surround the central axis of the superconducting coil body 110.
  • the connection part 120 connects the lid body 135 of the cryostat 105 and the upper wall of the heat shield 106.
  • the refrigerator 102 is arranged so as to extend from the upper part of the lid 135 of the cryostat 105 to the inside of the heat shield 106.
  • the refrigerator 102 cools the superconducting coil body 110.
  • the main body 133 and the motor 134 of the refrigerator 102 are disposed above the upper surface of the lid 135.
  • the refrigerator 102 is arranged so as to reach the inside of the heat shield 106 from the main body 133.
  • the refrigerator 102 may be, for example, a Gifford McMahon refrigerator.
  • the refrigerator 102 is connected through a pipe 137 to a compressor (not shown) that compresses the refrigerant.
  • the refrigerant for example, helium gas
  • the refrigerant is expanded by a displacer driven by a motor 134, whereby the regenerator material provided in the refrigerator 102 is cooled.
  • the refrigerant which has become low pressure due to expansion, is returned to the compressor and is increased in pressure again.
  • the first cooling head 132 of the refrigerator 102 cools the heat shield 106 to prevent external heat from entering the heat shield 106.
  • the second cooling head 131 of the refrigerator 102 cools the superconducting coil 70 via the cooling plate 113.
  • the superconducting coil 70 is in a superconducting state.
  • the cryostat 105 includes a cryostat main body 136 and a lid body 135.
  • the periphery of the main body 133 and the motor 134 is surrounded by a magnetic shield 140.
  • the magnetic shield 140 can prevent a part of the magnetic field generated from the superconducting coil body 110 from entering the motor 134.
  • the superconducting magnet 100 is formed with an opening 107 that penetrates the cryostat 105 and the heat shield 106 and reaches the bottom wall of the cryostat main body 136 from the lid body 135 of the cryostat 105.
  • the opening 107 is disposed so as to penetrate the central portion of the superconducting coil 70 of the superconducting coil body 110.
  • a detected body 210 (see FIG. 15) is disposed inside the opening 107, and a magnetic field generated from the superconducting coil body 110 can be applied to the detected body 210.
  • Superconducting coil 70 of the present embodiment includes one of superconducting wires 1 and 1b.
  • One of the superconducting wires 1 and 1b is wound around the central axis of the superconducting coil. Therefore, the superconducting coil 70 of the present embodiment can stably realize superconducting junctions in the first superconducting material joining layer 40 or the second superconducting material joining layer 42, has high reliability, and Can generate a strong magnetic field.
  • the superconducting coil 70 of the present embodiment can be operated in the permanent current mode.
  • the superconducting magnet 100 of this embodiment includes a superconducting coil 70 including any of the superconducting wires 1 and 1b, a cryostat 105 that accommodates the superconducting coil 70, and a refrigerator 102 that cools the superconducting coil 70. Therefore, the superconducting magnet 100 of the present embodiment has high reliability and can generate a strong magnetic field. Superconducting magnet 100 of the present embodiment can be operated in a permanent current mode.
  • Superconducting device 200 of the present embodiment may be, for example, a magnetic resonance imaging (MRI) apparatus.
  • MRI magnetic resonance imaging
  • the superconducting device 200 of the present embodiment mainly includes the superconducting magnet 100 of the fourth embodiment.
  • Superconducting device 200 of the present embodiment may further include a movable table 202 and a control unit 208.
  • the movable table 202 includes a top plate 205 on which the detected object 210 is placed and a drive unit 204 that moves the top plate 205.
  • the control unit 208 is connected to the superconducting magnet 100 and the drive unit 204.
  • the control unit 208 drives the superconducting magnet 100 to generate a uniform magnetic field in the opening 107 of the superconducting magnet 100.
  • the control unit 208 moves the movable table 202 and causes the detected object 210 placed on the movable table 202 to enter the opening 107 of the superconducting magnet 100.
  • the control unit 208 moves the movable table 202 and causes the detected object 210 placed on the movable table 202 to exit from the opening 107 of the superconducting magnet 100.
  • Superconducting device 200 of the present embodiment includes superconducting magnet 100. Therefore, the superconducting device 200 of the present embodiment can be operated in the permanent current mode, has high reliability, and can generate a strong magnetic field. Using the superconducting device 200 of the present embodiment, the detected object 210 can be imaged with high accuracy.

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Abstract

This superconducting wire material is provided with a first wire material, a second wire material, a first joining layer, and a coating member. The first wire material is provided with a first superconducting material layer. The second wire material is provided with a second superconducting material layer. A first portion of the first superconducting material layer is disposed facing a second portion of the second superconducting material layer. The first joining layer joins the first portion of the first superconducting material layer and the second portion of the second superconducting material layer. The coating member is disposed such that the first joining layer and the regions of the first wire material and the second wire material that are disposed overlapping the first joining layer are embedded in the interior thereof. The material composing the first joining layer includes a superconductor.

Description

超電導線材、超電導コイル、超電導マグネット及び超電導機器Superconducting wire, superconducting coil, superconducting magnet and superconducting equipment
　本発明は、超電導線材、超電導コイル、超電導マグネット及び超電導機器に関する。 The present invention relates to a superconducting wire, a superconducting coil, a superconducting magnet, and a superconducting device.
　国際公開第２０１６／１２９４６９号（特許文献１）は、第１の超電導材料層を含む第１の線材と、第２の超電導材料層を含む第２の線材と、第１の超電導材料層と第２の超電導材料層とを接合する超電導材料を含む接合層とを備える超電導線材を開示している。 International Publication No. 2016/129469 (Patent Document 1) includes a first wire including a first superconducting material layer, a second wire including a second superconducting material layer, a first superconducting material layer, and a first superconducting material layer. A superconducting wire comprising a joining layer containing a superconducting material that joins two superconducting material layers is disclosed.
国際公開第２０１６／１２９４６９号International Publication No. 2016/129469
　本開示の超電導線材は、第１の線材と、第２の線材と、第１の接合層と、被覆部材とを備える。第１の線材は、第１の超電導材料層を有する。第２の線材は、第２の超電導材料層を有する。第１の超電導材料層の第１の部分は第２の超電導材料層の第２の部分に対向して配置される。第１の接合層は、第１の超電導材料層の第１の部分と第２の超電導材料層の第２の部分とを接合する。被覆部材は、第１の線材および前記第２の線材において第１の接合層と重なるように配置された領域と、第１の接合層と、を内部に埋め込むように配置される。第１の接合層を構成する材料は超電導体を含む。 The superconducting wire of the present disclosure includes a first wire, a second wire, a first bonding layer, and a covering member. The first wire has a first superconducting material layer. The second wire has a second superconducting material layer. The first portion of the first superconducting material layer is disposed to face the second portion of the second superconducting material layer. The first joining layer joins the first portion of the first superconducting material layer and the second portion of the second superconducting material layer. The covering member is disposed so as to embed the first bonding layer and the region of the first wire and the second wire disposed so as to overlap the first bonding layer. The material constituting the first bonding layer includes a superconductor.
　本開示の超電導コイルは、中心軸を有する。当該超電導コイルは、上記超電導線材を備える。超電導線材は、上記中心軸周りに巻き回されている。本開示の超電導マグネットは、上記超電導コイルと、クライオスタットと、冷凍機とを備える。クライオスタットは、超電導コイルを収容する。冷凍機は、超電導コイルを冷却する。本開示の超電導機器は、上記超電導マグネットを備える。 The superconducting coil of the present disclosure has a central axis. The superconducting coil includes the superconducting wire. The superconducting wire is wound around the central axis. A superconducting magnet of the present disclosure includes the superconducting coil, a cryostat, and a refrigerator. The cryostat houses a superconducting coil. The refrigerator cools the superconducting coil. A superconducting device of the present disclosure includes the superconducting magnet.
図１は、実施の形態１に係る超電導線材の概略断面図である。1 is a schematic cross-sectional view of a superconducting wire according to Embodiment 1. FIG. 図２は、図１の線分ＩＩ－ＩＩにおける概略断面図である。FIG. 2 is a schematic sectional view taken along line II-II in FIG. 図３は、実施の形態１に係る超電導線材の、図１に示される領域ＩＩＩの概略部分拡大断面図である。FIG. 3 is a schematic partial enlarged sectional view of region III shown in FIG. 1 of the superconducting wire according to the first embodiment. 図４は、実施の形態１に係る超電導線材の製造方法のフローチャートを示す図である。FIG. 4 is a diagram showing a flowchart of the method of manufacturing the superconducting wire according to the first embodiment. 図５は、実施の形態１に係る超電導線材の第１の変形例の概略断面図である。FIG. 5 is a schematic cross-sectional view of a first modification of the superconducting wire according to the first embodiment. 図６は、実施の形態１に係る超電導線材の第２の変形例の概略断面図である。FIG. 6 is a schematic cross-sectional view of a second modification of the superconducting wire according to the first embodiment. 図７は、実施の形態２に係る超電導線材の概略断面図である。FIG. 7 is a schematic cross-sectional view of the superconducting wire according to the second embodiment. 図８は、実施の形態２に係る超電導線材の、図７に示される領域ＶＩＩＩの概略部分拡大断面図である。FIG. 8 is a schematic partial enlarged cross-sectional view of region VIII shown in FIG. 7 of the superconducting wire according to the second embodiment. 図９は、実施の形態２に係る超電導線材の第１の変形例の概略断面図である。FIG. 9 is a schematic cross-sectional view of a first modification of the superconducting wire according to the second embodiment. 図１０は、実施の形態２に係る超電導線材の第２の変形例の概略断面図である。FIG. 10 is a schematic cross-sectional view of a second modification of the superconducting wire according to the second embodiment. 図１１は、実施の形態３に係る超電導線材の概略断面図である。FIG. 11 is a schematic cross-sectional view of the superconducting wire according to the third embodiment. 図１２は、実施の形態３に係る超電導線材の第１の変形例の概略断面図である。FIG. 12 is a schematic cross-sectional view of a first modification of the superconducting wire according to the third embodiment. 図１３は、実施の形態３に係る超電導線材の第２の変形例の概略断面図である。FIG. 13 is a schematic cross-sectional view of a second modification of the superconducting wire according to the third embodiment. 図１４は、実施の形態４に係る超電導マグネットの概略断面図である。FIG. 14 is a schematic cross-sectional view of the superconducting magnet according to the fourth embodiment. 図１５は、実施の形態５に係る超電導機器の概略側面図である。FIG. 15 is a schematic side view of a superconducting device according to the fifth embodiment.
　[本開示が解決しようとする課題]
　本開示の第１の目的は、超電導材料層同士を接合層で接続した接続部の耐久性が向上された超電導線材を提供することである。本開示の第２の目的は、このような超電導線材を含む超電導コイル、超電導マグネット及び超電導機器を提供することである。 [Problems to be solved by this disclosure]
A first object of the present disclosure is to provide a superconducting wire in which durability of a connection portion in which superconducting material layers are connected by a bonding layer is improved. The second object of the present disclosure is to provide a superconducting coil, a superconducting magnet, and a superconducting device including such a superconducting wire.
　[本開示の効果]
　本開示によれば、接続部の耐久性が向上された超電導線材を得ることができる。本開示によれば、超電導コイル、超電導マグネット及び超電導機器は、各々、高い信頼性を有し得る。 [Effects of the present disclosure]
According to the present disclosure, it is possible to obtain a superconducting wire with improved durability of the connection portion. According to the present disclosure, the superconducting coil, the superconducting magnet, and the superconducting device can each have high reliability.
　[本発明の実施形態の説明]
　最初に本発明の実施態様を列記して説明する。 [Description of Embodiment of the Present Invention]
First, embodiments of the present invention will be listed and described.
　（１）　本開示の超電導線材１，１ｂは、第１の線材１０と、第２の線材２０と、第１の接合層４０と、被覆部材６０とを備える。第１の線材１０は、第１の超電導材料層１３を有する。第２の線材２０は、第２の超電導材料層２３を有する。第１の超電導材料層１３の第１の部分１７は第２の超電導材料層２３の第２の部分２７ａに対向して配置される。第１の接合層４０は、第１の超電導材料層１３の第１の部分１７と第２の超電導材料層２３の第２の部分２７ａとを接合する。被覆部材６０は、第１の線材１０および第２の線材２０において第１の接合層４０と重なるように配置された領域と、第１の接合層４０と、を内部に埋め込むように配置される。第１の接合層４０を構成する材料は超電導体を含む。 (1) The superconducting wire 1, 1b of the present disclosure includes a first wire 10, a second wire 20, a first bonding layer 40, and a covering member 60. The first wire 10 has a first superconducting material layer 13. The second wire 20 has a second superconducting material layer 23. The first portion 17 of the first superconducting material layer 13 is disposed to face the second portion 27 a of the second superconducting material layer 23. The first bonding layer 40 bonds the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23. The covering member 60 is disposed so as to embed the first bonding layer 40 in the region disposed so as to overlap the first bonding layer 40 in the first wire 10 and the second wire 20. . The material constituting the first bonding layer 40 includes a superconductor.
　このようにすれば、第１の接合層４０により第１の線材１０と第２の線材２０とが接合された接合部を被覆部材６０により覆うことができる。このため、接合部を被覆部材６０により補強することができる。さらに、被覆部材６０により接合部を覆うことで、第１の接合層４０が外部の雰囲気に晒されることを防止できる。このため、第１の接合層４０が外部からの水分に触れることで変質するといった問題の発生を抑制できる。 In this way, the joint portion where the first wire 10 and the second wire 20 are joined by the first joining layer 40 can be covered by the covering member 60. For this reason, the joint portion can be reinforced by the covering member 60. Furthermore, it is possible to prevent the first bonding layer 40 from being exposed to the external atmosphere by covering the bonding portion with the covering member 60. For this reason, generation | occurrence | production of the problem that the 1st joining layer 40 changes in quality by touching the water | moisture content from the outside can be suppressed.
　（２）　上記超電導線材１，１ｂにおいて、被覆部材６０は複数の層である第１～３層６１～６３を含む。この場合、被覆部材６０を多層構造とすることができる。そのため、被覆部材６０を構成するそれぞれの層について、たとえば異なる材料の層とすることで被覆部材６０に複数の機能を持たせることができる。なお、被覆部材６０を構成する層の数は２であってもよく、４以上であってもよい。 (2) In the superconducting wires 1 and 1b, the covering member 60 includes first to third layers 61 to 63 which are a plurality of layers. In this case, the covering member 60 can have a multilayer structure. Therefore, the covering member 60 can be provided with a plurality of functions by making the layers constituting the covering member 60, for example, layers of different materials. The number of layers constituting the covering member 60 may be two or four or more.
　（３）　上記超電導線材１，１ｂにおいて、第１の線材１０は、第１の超電導材料層１３上に配置された第１の導体層（保護層１８および安定化層１９）を含む。第２の線材２０は、第２の超電導材料層２３上に配置された第２の導体層（保護層２８および安定化層２９）を含む。被覆部材６０は導電体部分（図５の被覆部材６０または図６の第３層６３）を含む。被覆部材６０の導電体部分は、第１の導体層と第２の導体層とを接続する。この場合、被覆部材６０により第１の線材１０の第１の導体層と第２の線材２０の第２の導体層とを電気的に接続できる。そのため、第１の接合層４０に不具合が発生し、第１の超電導材料層１３から第１の接合層４０を介して第２の超電導材料層２３へ電流を流せなくなったときに、第１の導体層から被覆部材６０の導電体部分を介して第２の導体層へ当該電流を流すことができる。 (3) In the superconducting wires 1 and 1b, the first wire 10 includes a first conductor layer (a protective layer 18 and a stabilization layer 19) disposed on the first superconducting material layer 13. Second wire 20 includes a second conductor layer (protective layer 28 and stabilization layer 29) disposed on second superconducting material layer 23. The covering member 60 includes a conductor portion (the covering member 60 in FIG. 5 or the third layer 63 in FIG. 6). The conductor portion of the covering member 60 connects the first conductor layer and the second conductor layer. In this case, the covering member 60 can electrically connect the first conductor layer of the first wire 10 and the second conductor layer of the second wire 20. Therefore, when a problem occurs in the first bonding layer 40 and no current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the first bonding layer 40, The current can flow from the conductor layer to the second conductor layer via the conductor portion of the covering member 60.
　（４）　上記超電導線材１，１ｂにおいて、第１の超電導材料層１３は、ＲＥ１1Ｂａ2Ｃｕ3Ｏy1（６．０≦ｙ１≦８．０、ＲＥ１は希土類元素を表す）により構成されている。第２の超電導材料層２３は、ＲＥ２1Ｂａ2Ｃｕ3Ｏy2（６．０≦ｙ２≦８．０、ＲＥ２は希土類元素を表す）により構成されている。第１の接合層４０の超電導体は、ＲＥ３1Ｂａ2Ｃｕ3Ｏy3（６．０≦ｙ３≦８．０、ＲＥ３は希土類元素を表す）により構成されている。 (4) In the superconducting wires 1 and 1b, the first superconducting material layer 13 is composed of RE1 1 Ba 2 Cu 3 O y1 (6.0 ≦ y1 ≦ 8.0, where RE1 represents a rare earth element). Yes. The second superconducting material layer 23 is composed of RE2 1 Ba 2 Cu 3 O y2 (6.0 ≦ y2 ≦ 8.0, where RE2 represents a rare earth element). The superconductor of the first bonding layer 40 is composed of RE3 1 Ba 2 Cu 3 O y3 (6.0 ≦ y3 ≦ 8.0, where RE3 represents a rare earth element).
　上記超電導線材１，１ｂでは、第１の超電導材料層１３、第２の超電導材料層２３及び第１の接合層４０は、同じ結晶構造を有している。第１の超電導材料層１３と第２の超電導材料層２３とは、超電導体を含む接合層４０を介して、互いに接合される。上記超電導線材１，１ｂによれば、接合層４０における超電導接合を実現できるとともに、超電導線材１，１ｂの超電導臨界電流Ｉcが増加する。 In the superconducting wires 1 and 1b, the first superconducting material layer 13, the second superconducting material layer 23, and the first bonding layer 40 have the same crystal structure. The first superconducting material layer 13 and the second superconducting material layer 23 are bonded to each other through a bonding layer 40 including a superconductor. According to the superconducting wire 1, 1b, it is possible to realize a superconducting junction in the bonding layer 40, the superconducting critical current I c of the superconducting wire 1, 1b are increased.
　（５）　上記超電導線材１ｂでは、第１の線材１０において、長手方向における第１の端面１０ｅに隣接する位置に第１の超電導材料層１３の第１の部分１７は配置される。第２の線材２０において、長手方向における第２の端面２０ｅに隣接する位置に第２の超電導材料層２３の第２の部分２７ａは配置される。第１の線材１０と第２の線材２０とは、第１の端面１０ｅと第２の端面２０ｅとが同じ方向に向くように配置される。被覆部材６０は、第１の端面１０ｅおよび第２の端面２０ｅを埋め込むように配置されている。 (5) In the superconducting wire 1b, in the first wire 10, the first portion 17 of the first superconducting material layer 13 is disposed at a position adjacent to the first end face 10e in the longitudinal direction. In the second wire 20, the second portion 27 a of the second superconducting material layer 23 is disposed at a position adjacent to the second end face 20 e in the longitudinal direction. The 1st wire 10 and the 2nd wire 20 are arrange | positioned so that the 1st end surface 10e and the 2nd end surface 20e may face the same direction. The covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e.
　この場合、第１の端面１０ｅと第２の端面２０ｅとが同じ方向を向くような状態の接合部を被覆部材６０により覆うことで、当該接合部を被覆部材６０により保護するとともに補強することができる。 In this case, it is possible to protect and reinforce the joint with the covering member 60 by covering the joint with the covering member 60 such that the first end face 10e and the second end face 20e face the same direction. it can.
　（６）　上記超電導線材１，１ｂは、第３の線材３０と、第２の接合層４２とをさらに備える。第３の線材３０は、第３の超電導材料層３３を有する。第２の接合層４２は、第２の超電導材料層２３と第３の超電導材料層３３とを接合する。第１の線材１０は、第１の線材１０の長手方向において第１の長さを有する。第２の線材２０は、第２の線材２０の長手方向において第２の長さを有する。第３の線材３０は、第３の線材３０の長手方向において第３の長さを有する。第２の長さは、第１の長さおよび第３の長さよりも短い。被覆部材６０は、第２の線材２０の全体と、第３の線材３０において第２の接合層４２と重なるように配置された領域と、第２の接合層４２とを内部に埋め込むように配置されている。 (6) The superconducting wire 1, 1 b further includes a third wire 30 and a second bonding layer 42. The third wire 30 has a third superconducting material layer 33. The second bonding layer 42 bonds the second superconducting material layer 23 and the third superconducting material layer 33. The first wire 10 has a first length in the longitudinal direction of the first wire 10. The second wire 20 has a second length in the longitudinal direction of the second wire 20. The third wire 30 has a third length in the longitudinal direction of the third wire 30. The second length is shorter than the first length and the third length. The covering member 60 is disposed so as to embed the entire second wire 20, the region disposed so as to overlap the second bonding layer 42 in the third wire 30, and the second bonding layer 42 therein. Has been.
　この場合、第２の線材２０を第１の線材１０と第３の線材３０との接合材として用いた接合部の全体を被覆部材６０により覆うことができる。このため、当該接合部を被覆部材６０により保護するとともに補強することができる。 In this case, the entire joining portion using the second wire 20 as the joining material of the first wire 10 and the third wire 30 can be covered with the covering member 60. For this reason, the joint portion can be protected and reinforced by the covering member 60.
　（７）　本開示の超電導コイル７０は、本開示の超電導線材１，１ｂを備える。超電導線材１，１ｂは、超電導コイル７０の中心軸周りに巻き回されている。上記超電導コイル７０は、高い信頼性を有し、かつ、強い磁場を発生し得る。 (7) The superconducting coil 70 of the present disclosure includes the superconducting wires 1 and 1b of the present disclosure. Superconducting wires 1 and 1 b are wound around the central axis of superconducting coil 70. The superconducting coil 70 has high reliability and can generate a strong magnetic field.
　（８）　本開示の超電導マグネット１００は、上記超電導コイル７０と、超電導コイル７０を収容するクライオスタット１０５と、超電導コイル７０を冷却する冷凍機１０２とを備える。上記超電導マグネット１００は、高い信頼性を有し、かつ、強い磁場を発生し得る。 (8) The superconducting magnet 100 of the present disclosure includes the superconducting coil 70, a cryostat 105 that accommodates the superconducting coil 70, and a refrigerator 102 that cools the superconducting coil 70. The superconducting magnet 100 has high reliability and can generate a strong magnetic field.
　（９）　本開示の超電導機器２００は、上記超電導マグネット１００を備える。上記超電導機器２００は、高い信頼性を有し、かつ、強い磁場を発生し得る。 (9) The superconducting device 200 of the present disclosure includes the superconducting magnet 100. The superconducting device 200 has high reliability and can generate a strong magnetic field.
　[本発明の実施形態の詳細]
　次に、図面に基づいて本発明の実施の形態の詳細について説明する。なお、以下の図面において同一または相当する部分には同一の参照番号を付し、その説明は繰返さない。以下に記載する実施の形態の少なくとも一部の構成を任意に組み合わせてもよい。 [Details of the embodiment of the present invention]
Next, details of embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated. You may combine arbitrarily the structure of at least one part of embodiment described below.
　（実施の形態１）
　＜超電導線材の構成＞
　図１～図３に示されるように、本実施の形態の超電導線材１は、第１の線材１０と、第２の線材２０と、第１の超電導材料接合層４０（以下、単に接合層４０とも呼ぶ）と、被覆部材６０とを主に備える。被覆部材６０は、任意の材料により構成されていてもよい。たとえば、被覆部材６０は金属などの導電体であってもよい。また、被覆部材６０は樹脂などの絶縁体であってもよい。後述するように、被覆部材６０は第１の線材１０と第２の線材２０との接続部を囲む。被覆部材６０は、当該接続部を被覆部材６０の内部に埋設した状態となるように構成されている。 (Embodiment 1)
<Configuration of superconducting wire>
As shown in FIG. 1 to FIG. 3, the superconducting wire 1 of the present embodiment includes a first wire 10, a second wire 20, and a first superconducting material bonding layer 40 (hereinafter simply referred to as a bonding layer 40). And the covering member 60 are mainly provided. The covering member 60 may be made of any material. For example, the covering member 60 may be a conductor such as a metal. The covering member 60 may be an insulator such as resin. As will be described later, the covering member 60 surrounds a connecting portion between the first wire 10 and the second wire 20. The covering member 60 is configured so that the connecting portion is embedded in the covering member 60.
　第１の線材１０は、第１の主面１３ｓを有する第１の超電導材料層１３を含む。特定的には、第１の線材１０は、第１の金属基板１１と、第１の金属基板１１上に設けられた第１の中間層１２と、第１の中間層１２上に設けられた第１の超電導材料層１３とを含んでもよい。 The first wire 10 includes a first superconducting material layer 13 having a first main surface 13s. Specifically, the first wire 10 is provided on the first metal substrate 11, the first intermediate layer 12 provided on the first metal substrate 11, and the first intermediate layer 12. The first superconducting material layer 13 may be included.
　第２の線材２０は、第２の主面２３ｓを有する第２の超電導材料層２３を含む。特定的には、第２の線材２０は、第２の金属基板２１と、第２の金属基板２１上に設けられた第２の中間層２２と、第２の中間層２２上に設けられた第２の超電導材料層２３とを含んでもよい。なお、第１の線材１０と第２の線材２０とは、一本の線材の異なる部分であってもよい。たとえば、第１の線材１０は一本の線材の一方端であってもよく、第２の線材２０は当該一本の線材の他方端であってもよい。 The second wire 20 includes a second superconducting material layer 23 having a second main surface 23s. Specifically, the second wire 20 is provided on the second metal substrate 21, the second intermediate layer 22 provided on the second metal substrate 21, and the second intermediate layer 22. The second superconducting material layer 23 may be included. The first wire 10 and the second wire 20 may be different portions of one wire. For example, the first wire 10 may be one end of one wire, and the second wire 20 may be the other end of the one wire.
　第１の金属基板１１及び第２の金属基板２１は、各々、配向金属基板であってもよい。配向金属基板は、金属基板の表面において、結晶方位が揃っている金属基板を意味する。配向金属基板は、例えば、ＳＵＳまたはハステロイ（登録商標）のベース金属基板上にニッケル層及び銅層などが配置されたクラッドタイプの金属基板であってもよい。 The first metal substrate 11 and the second metal substrate 21 may each be an oriented metal substrate. An oriented metal substrate means a metal substrate having a uniform crystal orientation on the surface of the metal substrate. The oriented metal substrate may be, for example, a clad type metal substrate in which a nickel layer, a copper layer, and the like are arranged on a SUS or Hastelloy (registered trademark) base metal substrate.
　第１の中間層１２は、第１の超電導材料層１３との反応性が極めて低く、第１の超電導材料層１３の超電導特性を低下させないような材料を用いることができる。第２の中間層２２は、第２の超電導材料層２３との反応性が極めて低く、第２の超電導材料層２３の超電導特性を低下させないような材料を用いることができる。第１の中間層１２及び第２の中間層２２は、各々、例えば、ＹＳＺ（イットリア安定化ジルコニア）、ＣｅＯ２（酸化セリウム）、ＭｇＯ（酸化マグネシウム）、Ｙ２Ｏ３（酸化イットリウム）、Ａｌ２Ｏ３（酸化アルミニウム）、ＬａＭｎＯ３（酸化ランタンマンガン）、Ｇｄ2Ｚｒ2Ｏ7（ジルコン酸ガドリニウム）およびＳｒＴｉＯ３（チタン酸ストロンチウム）の少なくとも一つから構成されてもよい。 The first intermediate layer 12 may be made of a material that has extremely low reactivity with the first superconducting material layer 13 and does not deteriorate the superconducting characteristics of the first superconducting material layer 13. The second intermediate layer 22 may be made of a material that has extremely low reactivity with the second superconducting material layer 23 and does not deteriorate the superconducting characteristics of the second superconducting material layer 23. The first intermediate layer 12 and the second intermediate layer 22 are, for example, YSZ (yttria stabilized zirconia), CeO 2 (cerium oxide), MgO (magnesium oxide), Y 2 O 3 (yttrium oxide), Al, respectively. It may be composed of at least one of 2 O 3 (aluminum oxide), LaMnO 3 (lanthanum manganese oxide), Gd 2 Zr 2 O 7 (gadolinium zirconate) and SrTiO 3 (strontium titanate).
　第１の中間層１２及び第２の中間層２２は、各々、複数の層により構成されてもよい。第１の金属基板１１及び第２の金属基板２１としてＳＵＳ基板またはハステロイ基板が用いられる場合、第１の中間層１２及び第２の中間層２２は、例えば、ＩＢＡＤ（Ion　Beam　Assisted　Deposition）法にて形成された結晶配向層であってもよい。第１の金属基板１１がその表面に結晶配向性を有するとき、第１の中間層１２は、第１の金属基板１１と第１の超電導材料層１３との結晶配向性の差を緩和してもよい。第２の金属基板２１がその表面に結晶配向性を有するとき、第２の中間層２２は、第２の金属基板２１と第２の超電導材料層２３との結晶配向性の差を緩和してもよい。 The first intermediate layer 12 and the second intermediate layer 22 may each be composed of a plurality of layers. When a SUS substrate or a Hastelloy substrate is used as the first metal substrate 11 and the second metal substrate 21, the first intermediate layer 12 and the second intermediate layer 22 are formed by, for example, an IBAD (Ion Beam Assisted Deposition) method. It may be a crystal orientation layer formed in the above manner. When the first metal substrate 11 has crystal orientation on its surface, the first intermediate layer 12 reduces the difference in crystal orientation between the first metal substrate 11 and the first superconducting material layer 13. Also good. When the second metal substrate 21 has crystal orientation on its surface, the second intermediate layer 22 reduces the difference in crystal orientation between the second metal substrate 21 and the second superconducting material layer 23. Also good.
　第１の超電導材料層１３は、第１の線材１０のうち、超電導電流が流れる部分である。第２の超電導材料層２３は、第２の線材２０のうち、超電導電流が流れる部分である。第１の超電導材料層１３及び第２の超電導材料層２３は、特に限定されないが、酸化物超電導材料で構成されてもよい。特定的には、第１の超電導材料層１３は、ＲＥ１1Ｂａ2Ｃｕ3Ｏy1（６．０≦ｙ１≦８．０、ＲＥ１は希土類元素を表す）により構成されてもよい。第２の超電導材料層２３は、ＲＥ２1Ｂａ2Ｃｕ3Ｏy2（６．０≦ｙ２≦８．０、ＲＥ２は希土類元素を表す）により構成されてもよい。ＲＥ２は、ＲＥ１と同じであってもよいし、異なってもよい。さらに特定的には、ＲＥ１及びＲＥ２は、各々、イットリウム（Ｙ）、ガドリニウム（Ｇｄ）、ジスプロシウム（Ｄｙ）、ユウロピウム（Ｅｕ）、ランタン（Ｌａ）、ネオジム(Ｎｄ)、エルビウム(Ｅｒ)、ツリウム(Ｔｍ)、イッテルビウム（Ｙｂ）、ルテチウム（Ｌｕ）、サマリウム（Ｓｍ）またはホルミウム（Ｈｏ）であってもよい。さらに特定的には、ｙ１及びｙ２は、各々、６．８以上７．０以下であってもよい。 The first superconducting material layer 13 is a portion of the first wire 10 through which a superconducting current flows. The second superconducting material layer 23 is a portion of the second wire 20 through which a superconducting current flows. The first superconducting material layer 13 and the second superconducting material layer 23 are not particularly limited, but may be composed of an oxide superconducting material. Specifically, the first superconducting material layer 13 may be made of RE1 1 Ba 2 Cu 3 O y1 (6.0 ≦ y1 ≦ 8.0, where RE1 represents a rare earth element). The second superconducting material layer 23 may be made of RE2 1 Ba 2 Cu 3 O y2 (6.0 ≦ y2 ≦ 8.0, where RE2 represents a rare earth element). RE2 may be the same as or different from RE1. More specifically, RE1 and RE2 are yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium ( Tm), ytterbium (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho). More specifically, y1 and y2 may be 6.8 or more and 7.0 or less, respectively.
　第１の超電導材料接合層４０は、第１の超電導材料層１３の第１の主面１３ｓの一部である第１の部分１７と第２の超電導材料層２３の第２の主面２３ｓの第２の部分２７ａとを接合する。第１の部分１７は、第１の線材１０において第２の線材２０寄りの端部である第１の端部に位置してもよい。第２の部分２７ａは、第２の線材２０において第１の線材１０寄りの端部である第２の端部に位置してもよい。第１の超電導材料接合層４０は、特に限定されないが、酸化物超電導材料で構成されてもよい。特定的には、第１の超電導材料接合層４０は、ＲＥ３1Ｂａ2Ｃｕ3Ｏy3（６．０≦ｙ３≦８．０、ＲＥ３は希土類元素を表す）により構成されてもよい。ＲＥ３は、ＲＥ１と同じであってもよいし、異なってもよい。ＲＥ３は、ＲＥ２と同じであってもよいし、異なってもよい。さらに特定的には、ＲＥ３は、イットリウム（Ｙ）、ガドリニウム（Ｇｄ）、ジスプロシウム（Ｄｙ）、ユウロピウム（Ｅｕ）、ランタン（Ｌａ）、ネオジム(Ｎｄ)、エルビウム(Ｅｒ)、ツリウム(Ｔｍ)、イッテルビウム（Ｙｂ）、ルテチウム（Ｌｕ）、サマリウム（Ｓｍ）またはホルミウム（Ｈｏ）であってもよい。さらに特定的には、ｙ３は、６．８以上７．０以下であってもよい。 The first superconducting material bonding layer 40 includes a first portion 17 that is a part of the first main surface 13 s of the first superconducting material layer 13 and a second main surface 23 s of the second superconducting material layer 23. The second portion 27a is joined. The first portion 17 may be located at a first end portion that is an end portion of the first wire rod 10 near the second wire rod 20. The second portion 27 a may be located at the second end portion that is the end portion of the second wire rod 20 near the first wire rod 10. The first superconducting material bonding layer 40 is not particularly limited, but may be composed of an oxide superconducting material. Specifically, the first superconducting material bonding layer 40 may be made of RE3 1 Ba 2 Cu 3 O y3 (6.0 ≦ y3 ≦ 8.0, where RE3 represents a rare earth element). RE3 may be the same as or different from RE1. RE3 may be the same as or different from RE2. More specifically, RE3 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y3 may be 6.8 or more and 7.0 or less.
　被覆部材６０は、第１の線材１０および第２の線材２０において第１の超電導材料接合層４０と重なるように配置された領域と、第１の超電導材料接合層４０と、を内部に埋め込むように配置される。異なる観点から言えば、被覆部材６０は、第１の超電導材料接合層４０により第１の線材１０と第２の線材２０とが接合された接合部を内部に埋め込むように配置される。被覆部材６０は、図１に示すように第２の線材２０の第２の超電導材料層２３の第２の主面２３ｓに接するとともに、第１の線材１０の第１の端面１０ｅ上から第１の金属基板１１上にまで延びるように形成されている。また、被覆部材６０は、第１の線材１０の第１の超電導材料層１３の第１の主面１３ｓに接するとともに、第２の線材２０の第２の端面２０ｅ上から第２の金属基板２１上にまで延びるように形成されている。被覆部材６０は、図２に示すように第１の線材１０の延在方向に垂直な断面において、上記接合部の周囲を囲むように配置されている。また、第１の線材１０の延在方向において、被覆部材６０の外周面と第１の超電導材料接合層４０とは離れて配置されている。この結果、被覆部材６０により第１の超電導材料接合層４０は外部雰囲気から隔離されている。 The covering member 60 embeds the first superconductor material bonding layer 40 and the region of the first wire material 10 and the second wire material 20 so as to overlap with the first superconductor material bonding layer 40. Placed in. If it says from a different viewpoint, the covering member 60 is arrange | positioned so that the junction part by which the 1st wire 10 and the 2nd wire 20 were joined by the 1st superconducting material joining layer 40 may be embedded inside. As shown in FIG. 1, the covering member 60 is in contact with the second main surface 23 s of the second superconducting material layer 23 of the second wire 20, and the first from the first end surface 10 e of the first wire 10. It extends so as to extend onto the metal substrate 11. The covering member 60 is in contact with the first main surface 13 s of the first superconducting material layer 13 of the first wire 10, and from the second end surface 20 e of the second wire 20 to the second metal substrate 21. It is formed to extend up. As shown in FIG. 2, the covering member 60 is disposed so as to surround the periphery of the joint portion in a cross section perpendicular to the extending direction of the first wire 10. Further, in the extending direction of the first wire 10, the outer peripheral surface of the covering member 60 and the first superconducting material bonding layer 40 are arranged apart from each other. As a result, the first superconducting material bonding layer 40 is isolated from the external atmosphere by the covering member 60.
　＜超電導線材の製造方法＞
　図４を参照して、本実施の形態の超電導線材１の製造方法について説明する。 <Manufacturing method of superconducting wire>
With reference to FIG. 4, the manufacturing method of the superconducting wire 1 of this Embodiment is demonstrated.
　本実施の形態の超電導線材１の製造方法は、第１の線材１０に含まれる第１の超電導材料層１３及び第２の線材２０に含まれる第２の超電導材料層２３の少なくとも１つの上に、第１の超電導材料接合層４０を構成する酸化物超電導材料の微結晶を形成すること、つまり微結晶生成工程（Ｓ１０）を備える。 The manufacturing method of the superconducting wire 1 of the present embodiment is performed on at least one of the first superconducting material layer 13 included in the first wire 10 and the second superconducting material layer 23 included in the second wire 20. And forming a microcrystal of the oxide superconducting material constituting the first superconducting material bonding layer 40, that is, a microcrystal generating step (S10).
　微結晶生成工程（Ｓ１０）は、第１の超電導材料層１３の第１の部分１７及び第２の超電導材料層２３の第２の部分２７ａの少なくとも１つの上に、第１の超電導材料接合層４０を構成する元素の有機化合物を含む膜を形成すること、つまり塗膜形成工程（Ｓ１１）を含む。一例では、第１の超電導材料接合層４０を構成する元素の有機化合物を含む溶液が、第１の超電導材料層１３の第１の部分１７及び第２の超電導材料層２３の第２の部分２７ａの少なくとも１つの上に塗布される。この溶液として、具体的には、ＭＯＤ法における原料溶液を用いることができる。すなわち、溶液として、第１の超電導材料接合層４０の材料であるＲＥ３1Ｂａ2Ｃｕ3Ｏy3を構成する元素の有機化合物（例えば、有機金属化合物または有機金属錯体）を有機溶媒に溶解した溶液が用いられる。有機化合物は、フッ素を含まない有機化合物であってもよい。 In the microcrystal generation step (S10), the first superconducting material bonding layer is formed on at least one of the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23. Forming a film containing an organic compound of an element constituting 40, that is, a coating film forming step (S11). In one example, the solution containing the organic compound of the element constituting the first superconducting material bonding layer 40 is used as the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23. On at least one of the coatings. Specifically, a raw material solution in the MOD method can be used as this solution. That is, as a solution, a solution in which an organic compound (for example, an organometallic compound or an organometallic complex) of an element constituting RE3 1 Ba 2 Cu 3 O y3 which is a material of the first superconducting material bonding layer 40 is dissolved in an organic solvent. Is used. The organic compound may be an organic compound not containing fluorine.
　微結晶生成工程（Ｓ１０）は、第１の超電導材料接合層４０を構成する元素の有機化合物を含む膜を仮焼成すること、つまり仮焼熱処理工程（Ｓ１２）を含む。具体的には、この膜は、第１の温度で仮焼成される。第１の温度は、上記の有機化合物の分解温度以上、かつ、第１の超電導材料接合層４０を構成する酸化物超電導材料が生成される温度未満である。これにより、この膜に含まれている有機化合物は熱分解されて、酸化物超電導材料の前駆体となる（以下、この前駆体を含む膜を仮焼成膜という）。酸化物超電導材料の前駆体は、例えば、Ｂａの炭素化合物であるＢａＣＯ3、希土類元素（ＲＥ３）の酸化物、及び、ＣｕＯを含む。仮焼成処理工程（Ｓ１２）は、例えば、約５００℃のような第１の温度で、かつ、２０％以上の酸素濃度の雰囲気下で行われてもよい。 The microcrystal production step (S10) includes pre-baking a film containing an organic compound of an element constituting the first superconducting material bonding layer 40, that is, a pre-heat treatment step (S12). Specifically, this film is temporarily fired at a first temperature. The first temperature is equal to or higher than the decomposition temperature of the organic compound and lower than the temperature at which the oxide superconducting material constituting the first superconducting material bonding layer 40 is generated. Thereby, the organic compound contained in this film is thermally decomposed to become a precursor of the oxide superconducting material (hereinafter, a film containing this precursor is referred to as a pre-baked film). The precursor of the oxide superconducting material includes, for example, BaCO 3 which is a carbon compound of Ba, an oxide of a rare earth element (RE3), and CuO. The pre-baking treatment step (S12) may be performed, for example, at a first temperature such as about 500 ° C. and in an atmosphere having an oxygen concentration of 20% or more.
　工程（Ｓ１０）は、第１の温度よりも高い第２の温度で仮焼成膜を加熱して、仮焼成膜に含まれる炭素化合物を熱分解させること、つまり仮焼分解工程（Ｓ１３）を含む。第２の温度は、例えば、６５０℃以上８００℃以下であってもよい。仮焼成膜に含まれる炭素化合物が熱分解されて、第１の超電導材料接合層４０を構成する酸化物超電導材料が得られる。仮焼成膜に含まれる炭素化合物を熱分解させる当該工程（Ｓ１３）は、第１の酸素濃度の雰囲気下で行われる。第１の酸素濃度は、１％以上１００％以下である。たとえば、当該雰囲気について、酸素分圧を１ａｔｍとしてもよい。そのため、微結晶が成長して微結晶の平均粒径が３００ｎｍより大きくなることが抑制される。こうして、第１の超電導材料層１３の第１の部分１７及び第２の超電導材料層２３の第２の部分２７ａの少なくとも１つの上に、第１の超電導材料接合層４０を構成する酸化物超電導材料の微結晶を含む多結晶層が形成される。 The step (S10) includes heating the calcined film at a second temperature higher than the first temperature to thermally decompose the carbon compound contained in the calcined film, that is, the calcining decomposition step (S13). . The second temperature may be, for example, 650 ° C. or higher and 800 ° C. or lower. The carbon compound contained in the temporarily fired film is thermally decomposed, and the oxide superconducting material constituting the first superconducting material bonding layer 40 is obtained. The said process (S13) which thermally decomposes the carbon compound contained in a temporary baking film | membrane is performed in the atmosphere of 1st oxygen concentration. The first oxygen concentration is 1% or more and 100% or less. For example, the oxygen partial pressure may be 1 atm for the atmosphere. Therefore, it is suppressed that the microcrystal grows and the average grain size of the microcrystal becomes larger than 300 nm. Thus, the oxide superconductivity constituting the first superconducting material bonding layer 40 on at least one of the first portion 17 of the first superconducting material layer 13 and the second portion 27a of the second superconducting material layer 23. A polycrystalline layer containing microcrystals of material is formed.
　図４に示される、微結晶生成工程（Ｓ１０）後、すなわち、仮焼膜分解工程（Ｓ１３）後には、仮焼成膜中に含まれていたＢａＣＯ3のような炭素化合物が熱分解されて、多結晶層中にＲＥ３1Ｂａ2Ｃｕ3Ｏy3が生成される。当該多結晶層に含まれる微結晶の配向はランダム配向となっている。また、当該微結晶の粒径は多結晶層の厚み以下となっており、好ましくは３００ｎｍ以下である。当該微結晶の粒径としては、ＳＥＭで得られた像から算出された、微結晶の面積円相当径（Ｈｅｙｗｏｏｄ径）を用いる。 After the microcrystal production step (S10) shown in FIG. 4, that is, after the calcined film decomposition step (S13), the carbon compound such as BaCO 3 contained in the calcined film is thermally decomposed, RE3 1 Ba 2 Cu 3 O y3 is produced in the polycrystalline layer. The orientation of the microcrystal contained in the polycrystalline layer is a random orientation. The grain size of the microcrystals is not more than the thickness of the polycrystalline layer, and is preferably not more than 300 nm. As the particle diameter of the microcrystal, an area equivalent circle diameter (Heywood diameter) of the microcrystal calculated from an image obtained by SEM is used.
　本実施の形態の超電導線材１の製造方法は、微結晶を含む多結晶層を介して、第１の線材１０の第１の部分１７上に第２の線材２０の第２の部分２７ａを載置すること、つまり貼り合わせ工程（Ｓ２０）を備える。 In the method of manufacturing the superconducting wire 1 of the present embodiment, the second portion 27a of the second wire 20 is mounted on the first portion 17 of the first wire 10 via the polycrystalline layer containing microcrystals. Placing, that is, a bonding step (S20).
　本実施の形態の超電導線材１の製造方法は、第１の線材１０と微結晶を含む多結晶層と第２の線材２０とに圧力を加えながら熱を加えて、微結晶から第１の超電導材料接合層４０を生成すること、つまり加熱接合工程（Ｓ３０）を備える。当該加熱接合工程（Ｓ３０）は、本焼熱処理工程あるいは加熱加圧工程とも呼ぶ。具体的には、押圧治具を用いて、第１の線材１０と第２の線材２０とを互いに押し付けることによって、第１の線材１０と多結晶層と第２の線材２０とに１ＭＰａ以上の圧力を加える。第１の線材１０と多結晶層と第２の線材２０とに圧力を加えながら、第１の線材１０と多結晶層と第２の線材２０とを、第３の温度で、かつ、第２の酸素濃度の雰囲気下で加熱する。第３の温度は、第２の温度以上であり、かつ、第１の超電導材料接合層４０を構成する酸化物超電導材料が生成される温度以上である。第２の酸素濃度は、第１の酸素濃度よりも低い。第２の酸素濃度は、例えば、１００ｐｐｍであってもよい。 The manufacturing method of the superconducting wire 1 of the present embodiment applies heat to the first wire 10, the polycrystalline layer containing microcrystals, and the second wire 20 while applying pressure to the first superconductor from the microcrystals. The material joining layer 40 is generated, that is, a heating joining step (S30) is provided. The heat bonding step (S30) is also called a main heat treatment step or a heating and pressing step. Specifically, the first wire 10 and the second wire 20 are pressed against each other using a pressing jig, whereby 1 MPa or more is applied to the first wire 10, the polycrystalline layer, and the second wire 20. Apply pressure. While applying pressure to the first wire 10, the polycrystalline layer, and the second wire 20, the first wire 10, the polycrystalline layer, and the second wire 20 are moved at the third temperature and the second It heats in the atmosphere of oxygen concentration. The third temperature is equal to or higher than the second temperature and equal to or higher than the temperature at which the oxide superconducting material constituting the first superconducting material bonding layer 40 is generated. The second oxygen concentration is lower than the first oxygen concentration. The second oxygen concentration may be 100 ppm, for example.
　この加熱接合工程（Ｓ３０）では、仮焼膜分解工程（Ｓ１３）において生成された微結晶が成長して、大きな粒径を有する結晶により構成される第１の超電導材料接合層４０が生成される。塗膜形成工程（Ｓ１１）において膜が形成されていた第１の超電導材料層１３及び第２の超電導材料層２３の少なくとも１つの結晶方位に沿って微結晶は成長して、第１の超電導材料接合層４０になる。こうして、第１の超電導材料接合層４０を介して、第１の線材１０の第１の超電導材料層１３と第２の線材２０の第２の超電導材料層２３とは互いに接合される。 In the heat bonding step (S30), the microcrystals generated in the calcined film decomposition step (S13) grow to generate the first superconducting material bonding layer 40 composed of crystals having a large grain size. . A microcrystal grows along at least one crystal orientation of the first superconducting material layer 13 and the second superconducting material layer 23 on which the film has been formed in the coating film forming step (S11), and the first superconducting material The bonding layer 40 is obtained. Thus, the first superconducting material layer 13 of the first wire 10 and the second superconducting material layer 23 of the second wire 20 are joined to each other via the first superconducting material joining layer 40.
　図４に示される、加熱接合工程（Ｓ３０）後の第１の超電導材料接合層４０（ＲＥ３＝Ｙ）では、上記微結晶より大きな粒径を有する結晶が生成されている。つまり、加熱接合工程（Ｓ３０）によって、ランダム配向の微結晶が成長して、配向された第１の超電導材料接合層４０が形成される。 In the first superconducting material bonding layer 40 (RE3 = Y) after the heat bonding step (S30) shown in FIG. 4, crystals having a larger particle diameter than the above-mentioned microcrystals are generated. That is, in the heat bonding step (S30), randomly oriented microcrystals grow and the aligned first superconducting material bonding layer 40 is formed.
　本実施の形態の超電導線材１の製造方法は、第１の超電導材料層１３と第１の超電導材料接合層４０と第２の超電導材料層２３とを酸素アニールすること、つまり酸素アニール工程（Ｓ４０）をさらに備えてもよい。酸素アニール工程（Ｓ４０）は、第４の温度で、かつ、第３の酸素濃度の雰囲気下で行われる。第４の温度は、第３の温度以下である。第４の温度は、２００℃以上５００℃以下であってもよい。第３の酸素濃度は、第２の酸素濃度よりも高い。第３の酸素濃度は、例えば、１００％（酸素分圧１ａｔｍ）であってもよい。酸素アニール工程（Ｓ４０）において、たとえば酸素アニール工程の実施時間を十分に長くすることで、第１の超電導材料層１３、第１の超電導材料接合層４０及び第２の超電導材料層２３に、酸素が十分に供給され得る。 In the manufacturing method of the superconducting wire 1 of the present embodiment, the first superconducting material layer 13, the first superconducting material bonding layer 40, and the second superconducting material layer 23 are subjected to oxygen annealing, that is, an oxygen annealing step (S40). ) May be further provided. The oxygen annealing step (S40) is performed at a fourth temperature and in an atmosphere having a third oxygen concentration. The fourth temperature is equal to or lower than the third temperature. The fourth temperature may be 200 ° C. or higher and 500 ° C. or lower. The third oxygen concentration is higher than the second oxygen concentration. The third oxygen concentration may be, for example, 100% (oxygen partial pressure 1 atm). In the oxygen annealing step (S40), for example, the oxygen annealing step is made sufficiently long so that the first superconducting material layer 13, the first superconducting material bonding layer 40, and the second superconducting material layer 23 have oxygen. Can be adequately supplied.
　本実施の形態の超電導線材１の製造方法は、第１の線材１０および第２の線材２０において第１の接合層４０と重なるように配置された領域と、第１の超電導材料接合層４０と、を内部に埋め込むように被覆部材６０を形成すること、つまり被覆工程（Ｓ５０）をさらに備える。被覆工程（Ｓ５０）では、上記のように第１の超電導材料接合層４０により第１の線材１０と第２の線材２０とが接続されている接続部を埋め込むように、任意の方法により被覆部材６０が形成される。たとえば、金型を用いて溶融した金属または液状の樹脂を接続部の周囲に配置し、被覆部材６０の形状となるように固化することで被覆部材６０を形成していもよい。あるいは、被覆部材６０を構成する材料からなるテープ状部材またはシート状部材を接続部の周囲に巻きつけて被覆部材６０を形成してもよい。以上の工程によって、本実施の形態の超電導線材１は製造され得る。 The method of manufacturing the superconducting wire 1 according to the present embodiment includes a region disposed so as to overlap the first bonding layer 40 in the first wire 10 and the second wire 20, and the first superconducting material bonding layer 40. Is further provided with a covering member 60 so as to be embedded therein, that is, a covering step (S50). In the covering step (S50), the covering member is formed by an arbitrary method so as to embed the connecting portion where the first wire 10 and the second wire 20 are connected by the first superconducting material bonding layer 40 as described above. 60 is formed. For example, the covering member 60 may be formed by disposing a molten metal or liquid resin using a mold around the connection portion and solidifying the covering member 60 into a shape. Alternatively, the covering member 60 may be formed by winding a tape-like member or a sheet-like member made of a material constituting the covering member 60 around the connection portion. The superconducting wire 1 of the present embodiment can be manufactured through the above steps.
　＜作用効果＞
　上述した超電導線材１では、第１の超電導材料層１３の第１の部分１７は第２の超電導材料層２３の第２の部分２７ａに対向して配置される。第１の超電導材料接合層４０は、第１の超電導材料層１３の第１の部分１７と第２の超電導材料層２３の第２の部分２７ａとを接合する。図１および図３に示すように、被覆部材６０は、第１の線材１０および第２の線材２０において第１の超電導材料接合層４０と重なるように配置された領域と、第１の超電導材料接合層４０と、を内部に埋め込むように配置される。 <Effect>
In the above-described superconducting wire 1, the first portion 17 of the first superconducting material layer 13 is disposed to face the second portion 27 a of the second superconducting material layer 23. The first superconducting material joining layer 40 joins the first portion 17 of the first superconducting material layer 13 and the second portion 27 a of the second superconducting material layer 23. As shown in FIGS. 1 and 3, the covering member 60 includes a first superconductor material, a region disposed so as to overlap the first superconductor material bonding layer 40 in the first wire material 10 and the second wire material 20, and the first superconductor material. The bonding layer 40 is disposed so as to be embedded therein.
　このため、第１の超電導材料接合層４０により第１の線材１０と第２の線材２０とが接合された接合部を被覆部材６０により覆うことができる。この結果、接合部を被覆部材６０により補強することができる。さらに、被覆部材６０により接合部を覆うことで、第１の超電導材料接合層４０が外部の雰囲気に晒されることを防止できる。このため、第１の超電導材料接合層４０が外部からの水分に触れることで変質するといった問題の発生を抑制できる。 For this reason, the joint portion where the first wire 10 and the second wire 20 are joined by the first superconducting material joining layer 40 can be covered by the covering member 60. As a result, the joint portion can be reinforced by the covering member 60. Furthermore, by covering the bonding portion with the covering member 60, it is possible to prevent the first superconducting material bonding layer 40 from being exposed to the external atmosphere. For this reason, generation | occurrence | production of the problem that the 1st superconducting material joining layer 40 changes in quality by touching the moisture from the outside can be suppressed.
　また、超電導線材１では、第１の超電導材料層１３、第２の超電導材料層２３及び第１の超電導材料接合層４０は、同じ結晶構造を有している。つまり、第１の超電導材料層１３と第２の超電導材料層２３とは、十分に酸素が導入されて超電導特性が向上された第１の超電導材料接合層４０を介して、互いに接合される。そのため、上記超電導線材１によれば、第１の超電導材料接合層４０における超電導接合を実現できるとともに、第１の超電導材料接合層４０における超電導特性が向上するため超電導線材１の超電導臨界電流Ｉcが増加する。 In the superconducting wire 1, the first superconducting material layer 13, the second superconducting material layer 23, and the first superconducting material bonding layer 40 have the same crystal structure. That is, the first superconducting material layer 13 and the second superconducting material layer 23 are joined to each other via the first superconducting material joining layer 40 in which oxygen is sufficiently introduced to improve the superconducting characteristics. Therefore, according to the superconducting wire 1, superconducting bonding in the first superconducting material bonding layer 40 can be realized, and the superconducting characteristics in the first superconducting material bonding layer 40 are improved, so that the superconducting critical current I c of the superconducting wire 1 is improved. Will increase.
　＜超電導線材の第１の変形例の構成＞
　図５に示されるように、本実施の形態の超電導線材１の第１の変形例は、基本的には図１～図３に示した超電導線材１と同様の構成を備えるが、第１の線材１０が保護層１８および安定化層１９を備える点、第２の線材２０が保護層２８および安定化層２９を備える点、および被覆部材６０が安定化層１９、２９に接するように形成されている点、が図１～図３に示した超電導線材１と異なる。第１の線材１０の保護層１８および安定化層１９の少なくともいずれか一方が第１の導体層に対応する。第２の線材２０の保護層２８および安定化層２９の少なくともいずれか一方が第２の導体層に対応する。 <Configuration of First Modification of Superconducting Wire>
As shown in FIG. 5, the first modification of the superconducting wire 1 of the present embodiment basically has the same configuration as the superconducting wire 1 shown in FIGS. It is formed so that the wire 10 includes the protective layer 18 and the stabilization layer 19, the second wire 20 includes the protection layer 28 and the stabilization layer 29, and the covering member 60 is in contact with the stabilization layers 19 and 29. Is different from the superconducting wire 1 shown in FIGS. At least one of the protective layer 18 and the stabilization layer 19 of the first wire 10 corresponds to the first conductor layer. At least one of the protective layer 28 and the stabilization layer 29 of the second wire 20 corresponds to the second conductor layer.
　より具体的には、図５に示した超電導線材１において、第１の線材１０では第１の超電導材料層１３の表面上に保護層１８が配置される。保護層１８は、第１の部分１７に位置する第１の超電導材料接合層４０から離れて配置されている。異なる観点から言えば、保護層１８の端部は第１の超電導材料接合層４０から間隔を隔てて配置されている。保護層１８の表面上には安定化層１９が配置されている。安定化層１９の端部と第１の部分１７との間の距離は、保護層１８と第１の部分１７との間の距離より大きい。異なる観点から言えば、保護層１８は安定化層１９の外側に向けて延在している部分を含む。 More specifically, in the superconducting wire 1 shown in FIG. 5, the protective layer 18 is disposed on the surface of the first superconducting material layer 13 in the first wire 10. The protective layer 18 is disposed away from the first superconducting material bonding layer 40 located in the first portion 17. If it says from a different viewpoint, the edge part of the protective layer 18 will be arrange | positioned at intervals from the 1st superconducting material joining layer 40. A stabilization layer 19 is disposed on the surface of the protective layer 18. The distance between the end of the stabilization layer 19 and the first portion 17 is greater than the distance between the protective layer 18 and the first portion 17. From a different point of view, the protective layer 18 includes a portion extending toward the outside of the stabilization layer 19.
　安定化層１９は第１の金属基板１１、第１の中間層１２、第１の超電導材料層１３、保護層１８の全体を覆うように形成されている。異なる観点から言えば、第１の線材１０の延在方向に垂直な方向に沿った断面において、安定化層１９は、第１の金属基板１１、第１の中間層１２、第１の超電導材料層１３、および保護層１８の全体を囲むように配置されている。 The stabilization layer 19 is formed so as to cover the entire first metal substrate 11, first intermediate layer 12, first superconducting material layer 13, and protective layer 18. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the first wire 10, the stabilization layer 19 includes the first metal substrate 11, the first intermediate layer 12, and the first superconducting material. It arrange | positions so that the layer 13 and the whole protective layer 18 may be enclosed.
　第２の線材２０では第２の超電導材料層２３の表面上に保護層２８が配置される。保護層２８は、第１の超電導材料接合層４０から離れて配置されている。異なる観点から言えば、保護層２８の端部は第１の超電導材料接合層４０から間隔を隔てて配置されている。保護層２８の表面上には安定化層２９が配置されている。安定化層２９の端部と第１の部分１７との間の距離は、保護層２８と第１の部分１７との間の距離より大きい。異なる観点から言えば、保護層２８は安定化層２９の外側に向けて延在している部分を含む。 In the second wire 20, a protective layer 28 is disposed on the surface of the second superconducting material layer 23. The protective layer 28 is disposed away from the first superconducting material bonding layer 40. If it says from a different viewpoint, the edge part of the protective layer 28 will be arrange | positioned at intervals from the 1st superconducting material joining layer 40. FIG. A stabilization layer 29 is disposed on the surface of the protective layer 28. The distance between the end of the stabilization layer 29 and the first portion 17 is greater than the distance between the protective layer 28 and the first portion 17. From a different point of view, the protective layer 28 includes a portion extending toward the outside of the stabilization layer 29.
　安定化層２９は第２の金属基板２１、第２の中間層２２、第２の超電導材料層２３、保護層２８の全体を覆うように形成されている。異なる観点から言えば、第２の線材２０の延在方向に垂直な方向に沿った断面において、安定化層２９は、第２の金属基板２１、第２の中間層２２、第２の超電導材料層２３、および保護層２８の全体を囲むように配置されている。 The stabilization layer 29 is formed so as to cover the entire second metal substrate 21, second intermediate layer 22, second superconducting material layer 23, and protective layer 28. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the second wire 20, the stabilization layer 29 is composed of the second metal substrate 21, the second intermediate layer 22, and the second superconducting material. It arrange | positions so that the layer 23 and the whole protective layer 28 may be enclosed.
　被覆部材６０は、安定化層１９、２９と接続されている。また、被覆部材６０は保護層１８、２８と接続されている。被覆部材６０は、保護層１８、２８と第１の部分１７との間において第１の超電導材料層１３および第２の超電導材料層２３と接触している。被覆部材６０は導電体からなる。たとえば、被覆部材６０を構成する材料としてはんだ、銅および銀などの金属を用いてもよい。 The covering member 60 is connected to the stabilization layers 19 and 29. The covering member 60 is connected to the protective layers 18 and 28. The covering member 60 is in contact with the first superconducting material layer 13 and the second superconducting material layer 23 between the protective layers 18 and 28 and the first portion 17. The covering member 60 is made of a conductor. For example, a metal such as solder, copper and silver may be used as a material constituting the covering member 60.
　＜超電導線材の第１の変形例の作用効果＞
　図５に示された超電導線材１は、図１～図３に示した超電導線材１と同様の効果を奏することができる。さらに、図５に示した超電導線材１において、第１の線材１０は、第１の超電導材料層１３上に配置された第１の導体層としての保護層１８および安定化層１９を含む。第２の線材２０は、第２の超電導材料層２３上に配置された第２の導体層としての保護層２８および安定化層２９を含む。被覆部材６０は導電体部分を含む。図５に示された構成では、被覆部材６０全体が導電体部分となっている。導電体部分である被覆部材６０は、第１の保護層１８および第１の安定化層１９の少なくともいずれか一方と、第２の保護層２８および第２の安定化層２９の少なくともいずれか一方とを接続する。図５では被覆部材６０は第１の安定化層１９と第２の安定化層２９とを接続する。この場合、被覆部材６０により第１の線材１０の第１の安定化層１９と第２の線材２０の第２の安定化層２９とを電気的に接続できる。そのため、第１の超電導材料接合層４０に不具合が発生し、第１の超電導材料層１３から第１の超電導材料接合層４０を介して第２の超電導材料層２３へ電流を流せなくなったときに、第１の超電導材料層１３から保護層１８、安定化層１９、被覆部材６０、安定化層２９、保護層２８を介して第２の超電導材料層２３へ当該電流を流すことができる。 <Operational effect of the first modification of the superconducting wire>
The superconducting wire 1 shown in FIG. 5 can achieve the same effects as the superconducting wire 1 shown in FIGS. Further, in the superconducting wire 1 shown in FIG. 5, the first wire 10 includes a protective layer 18 as a first conductor layer and a stabilization layer 19 disposed on the first superconducting material layer 13. The second wire 20 includes a protective layer 28 and a stabilization layer 29 as a second conductor layer disposed on the second superconducting material layer 23. The covering member 60 includes a conductor portion. In the configuration shown in FIG. 5, the entire covering member 60 is a conductor portion. The covering member 60 that is a conductor portion includes at least one of the first protective layer 18 and the first stabilizing layer 19, and at least one of the second protective layer 28 and the second stabilizing layer 29. And connect. In FIG. 5, the covering member 60 connects the first stabilization layer 19 and the second stabilization layer 29. In this case, the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the second stabilization layer 29 of the second wire 20. Therefore, when a problem occurs in the first superconducting material bonding layer 40 and no current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the first superconducting material bonding layer 40. The current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18, the stabilizing layer 19, the covering member 60, the stabilizing layer 29, and the protective layer 28.
　＜超電導線材の第２の変形例の構成＞
　図６に示されるように、本実施の形態の超電導線材１の第２の変形例は、基本的には図５に示した超電導線材１と同様の構成を備えるが、被覆部材６０が複数の層としての第１層６１、第２層６２、第３層６３を含む点が図５に示した超電導線材１と異なる。 <Configuration of Second Modification of Superconducting Wire>
As shown in FIG. 6, the second modification of the superconducting wire 1 of the present embodiment basically has the same configuration as that of the superconducting wire 1 shown in FIG. 5, but includes a plurality of covering members 60. It differs from the superconducting wire 1 shown in FIG. 5 in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
　図６に示すように、被覆部材６０の第１層６１は接続部の全体を覆うように配置されている。第１層６１は第２の超電導材料層２３の第２の主面２３ｓ上から第１の線材１０の第１の端面１０ｅ、第１の金属基板１１の裏面側（第１の中間層１２が形成された表面と反対側の面）上にまで延在している。また、第１層６１は、第１の超電導材料層１３の第１の主面１３ｓ上から第２の線材２０の第２の端面２０ｅ、第２の金属基板２１の裏面側（第２の中間層２２が形成された表面と反対側の面）上にまで延在している。また、第１層６１は、第１の超電導材料接合層４０が形成された領域において第１の線材１０の延在方向に垂直な断面にて、第１の線材１０、第２の線材２０、第１の超電導材料接合層４０の全体を囲むように配置されている。第１層６１の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第１層６１の製造方法としては、任意の方法を用いることができる。 As shown in FIG. 6, the first layer 61 of the covering member 60 is disposed so as to cover the entire connecting portion. The first layer 61 includes the first end surface 10e of the first wire 10 from the second main surface 23s of the second superconducting material layer 23, the back surface side of the first metal substrate 11 (the first intermediate layer 12 is (The surface opposite to the formed surface). In addition, the first layer 61 includes a second end surface 20e of the second wire 20 from the first main surface 13s of the first superconducting material layer 13, and a back surface side (second intermediate) of the second metal substrate 21. It extends to the surface opposite to the surface on which the layer 22 is formed. In addition, the first layer 61 has a cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed, and the first wire 10, the second wire 20, It arrange | positions so that the whole 1st superconducting material joining layer 40 may be enclosed. As a material of the first layer 61, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. As a manufacturing method of the first layer 61, any method can be used.
　第２層６２は、第１層６１の外周表面上に形成されている。第２層６２は第１層６１の外周表面全体を覆うように配置されていてもよい。図６では、第２層６２の一方の端部は第１の超電導材料層１３と接触している。また、第２層６２において上記一方の端部と反対側に位置する他方の端部は、第２の超電導材料層２３と接触している。第２層６２の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第２層６２の製造方法としては任意の方法を用いることができる。また、第２層６２として、金属や樹脂などからなるシート状部材またはテープ状部材を用いてもよい。この場合、当該シート状部材またはテープ状部材を第１層６１に巻きつけるようにして、第２層６２を形成してもよい。 The second layer 62 is formed on the outer peripheral surface of the first layer 61. The second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61. In FIG. 6, one end of the second layer 62 is in contact with the first superconducting material layer 13. The other end portion of the second layer 62 located on the opposite side to the one end portion is in contact with the second superconducting material layer 23. As the material of the second layer 62, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62. Further, as the second layer 62, a sheet-like member or a tape-like member made of metal or resin may be used. In this case, the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
　第３層６３は、第２層６２の外周表面上に形成されている。第３層６３は第２層６２の外周表面全体を覆うように配置されていてもよい。図６では、第３層６３の一方の端部は第１の線材１０の安定化層１９と接触している。また、第３層６３において上記一方の端部と反対側に位置する他方の端部は、第２の線材２０の安定化層２９と接触している。第３層６３は、被覆部材６０の導電体部分に相当する。第３層６３の材料として、たとえばはんだや銅、銀などの金属を用いてもよい。第３層６３の製造方法としては任意の方法を用いることができる。 The third layer 63 is formed on the outer peripheral surface of the second layer 62. The third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62. In FIG. 6, one end of the third layer 63 is in contact with the stabilization layer 19 of the first wire 10. In addition, the other end portion of the third layer 63 located on the opposite side of the one end portion is in contact with the stabilization layer 29 of the second wire 20. The third layer 63 corresponds to the conductor portion of the covering member 60. As a material of the third layer 63, for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
　＜超電導線材の第２の変形例の作用効果＞
　図６に示した超電導線材１は、図５に示した超電導線材１と同様の効果を奏することができる。さらに、図６に示した超電導線材１において、被覆部材６０は複数の層としての第１層６１、第２層６２、第３層６３を含む。つまり、被覆部材６０が多層構造となっている。そのため、被覆部材６０を構成する第１～第３層６１，６２，６３について、たとえば異なる材料の層とすることで被覆部材６０に複数の機能を持たせることができる。 <Operation effect of the second modification of the superconducting wire>
The superconducting wire 1 shown in FIG. 6 can achieve the same effects as the superconducting wire 1 shown in FIG. Furthermore, in the superconducting wire 1 shown in FIG. 6, the covering member 60 includes a first layer 61, a second layer 62, and a third layer 63 as a plurality of layers. That is, the covering member 60 has a multilayer structure. Therefore, the first to third layers 61, 62, and 63 constituting the covering member 60 can be provided with a plurality of functions by making the layers of different materials, for example.
　（実施の形態２）
　＜超電導線材の構成＞
　図３、図７及び図８を参照して、実施の形態２の超電導線材１ｂについて説明する。本実施の形態の超電導線材１ｂは、実施の形態１の超電導線材１と同様の構成を備えるが、以下の点で主に異なる。 (Embodiment 2)
<Configuration of superconducting wire>
A superconducting wire 1b according to the second embodiment will be described with reference to FIGS. 3, 7, and 8. FIG. The superconducting wire 1b of the present embodiment has the same configuration as the superconducting wire 1 of the first embodiment, but is mainly different in the following points.
　本実施の形態の超電導線材１ｂは、第３の線材３０と、第２の超電導材料接合層４２とをさらに備える。第２の接合層としての第２の超電導材料接合層４２は、図３に示した第１の超電導材料接合層４０と同様の構成を備える。また、図７に示した被覆部材６０の形状が図１および図２に示した被覆部材６０の形状と異なっている。被覆部材６０は、第２の線材２０の全体と、第１の線材において第１の超電導材料接合層４０と重なるように配置された領域と、第１の超電導材料接合層４０とに加え、第３の線材３０において第２の超電導材料接合層４２と重なるように配置された領域と、第２の超電導材料接合層４２とを内部に埋め込むように配置されている。 The superconducting wire 1b of the present embodiment further includes a third wire 30 and a second superconducting material bonding layer 42. The second superconducting material joining layer 42 as the second joining layer has the same configuration as the first superconducting material joining layer 40 shown in FIG. Further, the shape of the covering member 60 shown in FIG. 7 is different from the shape of the covering member 60 shown in FIGS. 1 and 2. The covering member 60 includes the second wire 20 as a whole, a region of the first wire that is arranged to overlap the first superconducting material bonding layer 40, the first superconducting material bonding layer 40, In the third wire 30, the region disposed so as to overlap the second superconducting material bonding layer 42 and the second superconducting material bonding layer 42 are disposed so as to be embedded therein.
　第３の線材３０は、第３の主面３３ｓを有する第３の超電導材料層３３を含む。特定的には、第３の線材３０は、第３の金属基板３１と、第３の金属基板３１上に設けられた第３の中間層３２と、第３の中間層３２上に設けられた第３の超電導材料層３３とを含んでもよい。第３の線材３０は、第１の線材１０と同様に構成されてもよい。なお、第１の線材１０と第３の線材３０とは、一本の線材の異なる部分であってもよい。たとえば、第１の線材１０は一本の線材の一方端であってもよく、第３の線材３０は当該一本の線材の他方端であってもよい。 The third wire 30 includes a third superconducting material layer 33 having a third main surface 33s. Specifically, the third wire 30 is provided on the third metal substrate 31, the third intermediate layer 32 provided on the third metal substrate 31, and the third intermediate layer 32. The third superconducting material layer 33 may be included. The third wire 30 may be configured in the same manner as the first wire 10. The first wire 10 and the third wire 30 may be different portions of one wire. For example, the first wire 10 may be one end of one wire, and the third wire 30 may be the other end of the one wire.
　第３の金属基板３１は、配向金属基板であってもよい。配向金属基板は、金属基板の表面において、結晶方位が揃っている金属基板を意味する。配向金属基板は、例えば、ＳＵＳまたはハステロイ（登録商標）のベース金属基板上にニッケル層及び銅層などが配置されたクラッドタイプの金属基板であってもよい。 The third metal substrate 31 may be an oriented metal substrate. An oriented metal substrate means a metal substrate having a uniform crystal orientation on the surface of the metal substrate. The oriented metal substrate may be, for example, a clad type metal substrate in which a nickel layer, a copper layer, and the like are arranged on a SUS or Hastelloy (registered trademark) base metal substrate.
　第３の中間層３２は、第３の超電導材料層３３との反応性が極めて低く、第３の超電導材料層３３の超電導特性を低下させないような材料を用いることができる。第３の中間層３２は、例えば、ＹＳＺ（イットリア安定化ジルコニア）、ＣｅＯ２（酸化セリウム）、ＭｇＯ（酸化マグネシウム）、Ｙ２Ｏ３（酸化イットリウム）、Ａｌ２Ｏ３（酸化アルミニウム）、ＬａＭｎＯ３（酸化ランタンマンガン）、Ｇｄ2Ｚｒ2Ｏ7（ジルコン酸ガドリニウム）およびＳｒＴｉＯ３（チタン酸ストロンチウム）の少なくとも一つから構成されてもよい。 The third intermediate layer 32 may be made of a material that has extremely low reactivity with the third superconducting material layer 33 and does not deteriorate the superconducting characteristics of the third superconducting material layer 33. The third intermediate layer 32 includes, for example, YSZ (yttria stabilized zirconia), CeO 2 (cerium oxide), MgO (magnesium oxide), Y 2 O 3 (yttrium oxide), Al 2 O 3 (aluminum oxide), LaMnO. 3 (lanthanum manganese oxide), Gd 2 Zr 2 O 7 (gadolinium zirconate), and SrTiO 3 (strontium titanate).
　第３の中間層３２は、複数の層により構成されていてもよい。第３の金属基板３１としてＳＵＳ基板またはハステロイ基板が用いられる場合、第３の中間層３２は、例えば、ＩＢＡＤ（Ion　Beam　Assisted　Deposition）法にて形成された結晶配向層であってもよい。第３の金属基板３１がその表面に結晶配向性を有するとき、第３の中間層３２は、第３の金属基板３１と第３の超電導材料層３３との結晶配向性の差を緩和してもよい。 The third intermediate layer 32 may be composed of a plurality of layers. When a SUS substrate or a Hastelloy substrate is used as the third metal substrate 31, the third intermediate layer 32 may be a crystal orientation layer formed by, for example, an IBAD (Ion Beam Assisted Deposition) method. When the third metal substrate 31 has crystal orientation on its surface, the third intermediate layer 32 reduces the difference in crystal orientation between the third metal substrate 31 and the third superconducting material layer 33. Also good.
　第３の超電導材料層３３は、第３の線材３０のうち、超電導電流が流れる部分である。第３の超電導材料層３３は、特に限定されないが、酸化物超電導材料で構成されてもよい。特定的には、第３の超電導材料層３３は、ＲＥ４1Ｂａ2Ｃｕ3Ｏy4（６．０≦ｙ４≦８．０、ＲＥ４は希土類元素を表す）により構成されてもよい。ＲＥ４は、ＲＥ１と同じであってもよいし、異なってもよい。ＲＥ４は、ＲＥ２と同じであってもよいし、異なってもよい。さらに特定的には、ＲＥ４は、イットリウム（Ｙ）、ガドリニウム（Ｇｄ）、ジスプロシウム（Ｄｙ）、ユウロピウム（Ｅｕ）、ランタン（Ｌａ）、ネオジム(Ｎｄ)、エルビウム(Ｅｒ)、ツリウム(Ｔｍ)、イッテルビウム（Ｙｂ）、ルテチウム（Ｌｕ）、サマリウム（Ｓｍ）またはホルミウム（Ｈｏ）であってもよい。さらに特定的には、ｙ４は、６．８以上７．０以下であってもよい。 The third superconducting material layer 33 is a portion of the third wire 30 through which the superconducting current flows. The third superconducting material layer 33 is not particularly limited, but may be composed of an oxide superconducting material. In particular, the third superconducting material layers 33, RE4 1 Ba 2 Cu 3 O y4 (6.0 ≦ y4 ≦ 8.0, RE4 represents a rare earth element) may be configured with. RE4 may be the same as or different from RE1. RE4 may be the same as or different from RE2. More specifically, RE4 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y4 may be 6.8 or more and 7.0 or less.
　第２の線材２０の長手方向における第２の線材２０の第２の長さは、第１の線材１０の長手方向における第１の線材１０の第１の長さ及び第３の線材３０の長手方向における第３の線材３０の第３の長さよりも短い。 The second length of the second wire 20 in the longitudinal direction of the second wire 20 is the first length of the first wire 10 and the length of the third wire 30 in the longitudinal direction of the first wire 10. Shorter than the third length of the third wire 30 in the direction.
　第１の線材１０は、第１の端面１０ｅを有する。第３の線材３０は、第３の端面３０ｅを有する。第３の端面３０ｅは、第１の端面１０ｅとの間に間隔を空けて、第１の端面１０ｅに対向している。第１の超電導材料層１３の第１の主面１３ｓと第２の超電導材料層２３の第２の主面２３ｓとは、第１の超電導材料接合層４０を介して、互いに接合されている。第２の超電導材料層２３の第２の主面２３ｓと第３の超電導材料層３３の第３の主面３３ｓとは、第２の超電導材料接合層４２を介して、互いに接合されている。第２の線材２０は、第１の線材１０の第１の端面１０ｅと第３の線材３０の第３の端面３０ｅとを跨いでいる。第２の超電導材料層２３は、第１の超電導材料層１３と第３の超電導材料層３３とを橋渡ししている。なお、第１の端面１０ｅと第３の端面３０ｅとは近接あるいは接触していてもよい。 The first wire 10 has a first end face 10e. The third wire rod 30 has a third end face 30e. The third end face 30e is opposed to the first end face 10e with a space between the third end face 30e and the first end face 10e. The first main surface 13 s of the first superconducting material layer 13 and the second main surface 23 s of the second superconducting material layer 23 are bonded to each other through the first superconducting material bonding layer 40. The second main surface 23 s of the second superconducting material layer 23 and the third main surface 33 s of the third superconducting material layer 33 are joined to each other via the second superconducting material joining layer 42. The second wire 20 straddles the first end surface 10 e of the first wire 10 and the third end surface 30 e of the third wire 30. The second superconducting material layer 23 bridges the first superconducting material layer 13 and the third superconducting material layer 33. Note that the first end surface 10e and the third end surface 30e may be close to or in contact with each other.
　第２の超電導材料接合層４２は、第２の超電導材料層２３の第２の主面２３ｓの第３の部分２７ｂと第３の超電導材料層３３の第３の主面３３ｓの第４の部分３７とを接合する。第３の部分２７ｂは、第２の部分２７ａとは異なる。第３の部分２７ｂは、第２の線材２０において長手方向における第２の部分２７ａと反対側の端部に位置してもよい。第４の部分３７は、第３の線材３０において第３の端面３０ｅに隣接する第３の端部に位置してもよい。 The second superconducting material bonding layer 42 includes a third portion 27b of the second main surface 23s of the second superconducting material layer 23 and a fourth portion of the third main surface 33s of the third superconducting material layer 33. 37 is joined. The third portion 27b is different from the second portion 27a. The third portion 27b may be located at the end of the second wire 20 opposite to the second portion 27a in the longitudinal direction. The fourth portion 37 may be located at a third end portion of the third wire 30 adjacent to the third end surface 30e.
　第２の超電導材料接合層４２は、特に限定されないが、酸化物超電導材料で構成されてもよい。特定的には、第２の超電導材料接合層４２は、ＲＥ５1Ｂａ2Ｃｕ3Ｏy5（６．０≦ｙ５≦８．０、ＲＥ５は希土類元素を表す）により構成されてもよい。ＲＥ５は、ＲＥ２と同じであってもよいし、異なってもよい。ＲＥ５は、ＲＥ３と同じであってもよいし、異なってもよい。ＲＥ５は、ＲＥ４と同じであってもよいし、異なってもよい。さらに特定的には、ＲＥ５は、イットリウム（Ｙ）、ガドリニウム（Ｇｄ）、ジスプロシウム（Ｄｙ）、ユウロピウム（Ｅｕ）、ランタン（Ｌａ）、ネオジム(Ｎｄ)、エルビウム(Ｅｒ)、ツリウム(Ｔｍ)、イッテルビウム（Ｙｂ）、ルテチウム（Ｌｕ）、サマリウム（Ｓｍ）またはホルミウム（Ｈｏ）であってもよい。さらに特定的には、ｙ５は、６．８以上７．０以下であってもよい。 The second superconducting material bonding layer 42 is not particularly limited, but may be composed of an oxide superconducting material. Specifically, the second superconducting material bonding layer 42 may be composed of RE5 1 Ba 2 Cu 3 O y5 (6.0 ≦ y5 ≦ 8.0, where RE5 represents a rare earth element). RE5 may be the same as RE2, or may be different. RE5 may be the same as RE3 or different. RE5 may be the same as RE4 or different. More specifically, RE5 is yttrium (Y), gadolinium (Gd), dysprosium (Dy), europium (Eu), lanthanum (La), neodymium (Nd), erbium (Er), thulium (Tm), ytterbium. (Yb), lutetium (Lu), samarium (Sm) or holmium (Ho) may be used. More specifically, y5 may be 6.8 or more and 7.0 or less.
　被覆部材６０は、上述のように第２の線材２０全体と、第１の線材１０の第１の端面１０ｅ側の端部と、第３の線材３０の第３の端面３０ｅ側の端部とを埋め込むように配置されている。被覆部材６０の一部は第１の端面１０ｅと第３の端面３０ｅとの間の空隙に充填されている。また、被覆部材６０は、第２の超電導材料接合層４２が形成された領域において第３の線材３０の延在方向に垂直な断面にて、第２の線材２０、第３の線材３０、第２の超電導材料接合層４２の全体を囲むように配置されている。 As described above, the covering member 60 includes the entire second wire 20, the end on the first end surface 10 e side of the first wire 10, and the end on the third end surface 30 e side of the third wire 30. Is arranged to embed. A part of the covering member 60 is filled in a gap between the first end surface 10e and the third end surface 30e. In addition, the covering member 60 has the second wire 20, the third wire 30, the second wire 30 in the cross section perpendicular to the extending direction of the third wire 30 in the region where the second superconducting material bonding layer 42 is formed. The two superconducting material bonding layers 42 are arranged so as to surround the whole.
　＜超電導線材の製造方法＞
　第２の超電導材料接合層４２を介して第２の超電導材料層２３と第３の超電導材料層３３とを接合する方法は、実施の形態１における第１の超電導材料接合層４０を介して第１の超電導材料層１３と第２の超電導材料層２３とを接合する方法（図４を参照）と同様である。また、被覆部材６０の形成方法は、基本的に実施の形態１における被覆部材６０の形成方法と同様である。 <Manufacturing method of superconducting wire>
The method of joining the second superconducting material layer 23 and the third superconducting material layer 33 through the second superconducting material joining layer 42 is the same as that of the first superconducting material joining layer 40 in the first embodiment. This is the same as the method of joining the first superconducting material layer 13 and the second superconducting material layer 23 (see FIG. 4). The method for forming the covering member 60 is basically the same as the method for forming the covering member 60 in the first embodiment.
　＜作用効果＞
　本実施の形態の超電導線材１ｂは、実施の形態１の超電導線材１の効果に加えて、以下の効果を奏する。 <Effect>
Superconducting wire 1b of the present embodiment has the following effects in addition to the effects of superconducting wire 1 of the first embodiment.
　本実施の形態の超電導線材１ｂは、第３の線材３０と、第２の超電導材料接合層４２とをさらに備える。被覆部材６０は、第２の線材２０の全体と、第１の線材１０において第１の超電導材料接合層４０と重なるように配置された領域と、第１の超電導材料接合層４０とに加え、第３の線材３０において第２の超電導材料接合層４２と重なるように配置された領域と、第２の超電導材料接合層４２とを内部に埋め込むように配置されている。この場合、第２の線材２０を第１の線材１０と第３の線材３０との接合材として用いた接合部の全体を被覆部材６０により覆うことができる。このため、当該接合部を被覆部材６０により保護するとともに補強することができる。 The superconducting wire 1b of the present embodiment further includes a third wire 30 and a second superconducting material bonding layer 42. The covering member 60 is added to the entire second wire 20, the region of the first wire 10 that is arranged to overlap the first superconducting material bonding layer 40, and the first superconducting material bonding layer 40, In the third wire 30, the region disposed so as to overlap the second superconducting material bonding layer 42 and the second superconducting material bonding layer 42 are disposed so as to be embedded therein. In this case, the entire joining portion in which the second wire 20 is used as the joining material of the first wire 10 and the third wire 30 can be covered with the covering member 60. For this reason, the joint portion can be protected and reinforced by the covering member 60.
　＜超電導線材の第１の変形例の構成＞
　図９に示されるように、本実施の形態の超電導線材１ｂの第１の変形例は、基本的には図７および図８に示した超電導線材１ｂと同様の構成を備えるが、第１の線材１０が保護層１８および安定化層１９を備える点、第３の線材３０が保護層３８および安定化層３９を備える点、および被覆部材６０が安定化層１９、３９に接するように形成されている点、が図７および図８に示した超電導線材１ｂと異なる。第３の線材３０の保護層３８および安定化層３９の少なくともいずれか一方が第３の導体層に対応する。 <Configuration of First Modification of Superconducting Wire>
As shown in FIG. 9, the first modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIGS. It is formed so that the wire 10 includes the protective layer 18 and the stabilization layer 19, the third wire 30 includes the protection layer 38 and the stabilization layer 39, and the covering member 60 is in contact with the stabilization layers 19 and 39. Is different from the superconducting wire 1b shown in FIGS. At least one of the protective layer 38 and the stabilization layer 39 of the third wire 30 corresponds to the third conductor layer.
　より具体的には、図９に示した超電導線材１ｂにおいて、第１の線材１０の構成は図５に示した超電導線材１における第１の線材１０の構成と同様である。すなわち、第１の超電導材料層１３の表面上に保護層１８が配置される。保護層１８の表面上には安定化層１９が配置されている。安定化層１９の端部と第１の部分１７との間の距離は、保護層１８と第１の部分１７との間の距離より大きい。安定化層１９は第１の金属基板１１、第１の中間層１２、第１の超電導材料層１３、保護層１８の全体を覆うように形成されている。 More specifically, in the superconducting wire 1b shown in FIG. 9, the configuration of the first wire 10 is the same as the configuration of the first wire 10 in the superconducting wire 1 shown in FIG. That is, the protective layer 18 is disposed on the surface of the first superconducting material layer 13. A stabilization layer 19 is disposed on the surface of the protective layer 18. The distance between the end of the stabilization layer 19 and the first portion 17 is greater than the distance between the protective layer 18 and the first portion 17. The stabilization layer 19 is formed so as to cover the entire first metal substrate 11, first intermediate layer 12, first superconducting material layer 13, and protective layer 18.
　第３の線材３０では第３の超電導材料層３３の表面上に保護層３８が配置される。保護層３８は、第２の超電導材料接合層４２から離れて配置されている。異なる観点から言えば、保護層３８の端部は第２の超電導材料接合層４２から間隔を隔てて配置されている。保護層３８の表面上には安定化層３９が配置されている。安定化層３９の端部と第４の部分３７との間の距離は、保護層２８と第４の部分３７との間の距離より大きい。異なる観点から言えば、保護層３８は安定化層３９の外側に向けて延在している部分を含む。 In the third wire 30, a protective layer 38 is disposed on the surface of the third superconducting material layer 33. The protective layer 38 is disposed away from the second superconducting material bonding layer 42. From a different point of view, the end of the protective layer 38 is spaced from the second superconducting material bonding layer 42. A stabilizing layer 39 is disposed on the surface of the protective layer 38. The distance between the end of the stabilization layer 39 and the fourth portion 37 is greater than the distance between the protective layer 28 and the fourth portion 37. From a different point of view, the protective layer 38 includes a portion extending toward the outside of the stabilization layer 39.
　安定化層３９は第３の金属基板３１、第３の中間層３２、第３の超電導材料層３３、保護層３８の全体を覆うように形成されている。異なる観点から言えば、第３の線材３０の延在方向に垂直な方向に沿った断面において、安定化層３９は、第３の金属基板３１、第３の中間層３２、第３の超電導材料層３３、および保護層３８の全体を囲むように配置されている。 The stabilization layer 39 is formed so as to cover the entire third metal substrate 31, third intermediate layer 32, third superconducting material layer 33, and protective layer 38. From a different point of view, in the cross section along the direction perpendicular to the extending direction of the third wire 30, the stabilization layer 39 includes the third metal substrate 31, the third intermediate layer 32, and the third superconducting material. It arrange | positions so that the layer 33 and the whole protective layer 38 may be enclosed.
　被覆部材６０は、安定化層１９，３９と接続されている。また、被覆部材６０は保護層１８、３８と接続されている。被覆部材６０は、保護層１８と第１の部分１７との間において第１の超電導材料層１３と接触している。また、被覆部材６０は、保護層３８と第４の部分３７との間において第３の超電導材料層３３と接触している。被覆部材６０は導電体からなる。たとえば、被覆部材６０を構成する材料としてはんだ、銅および銀などの金属を用いてもよい。 The covering member 60 is connected to the stabilization layers 19 and 39. The covering member 60 is connected to the protective layers 18 and 38. The covering member 60 is in contact with the first superconducting material layer 13 between the protective layer 18 and the first portion 17. The covering member 60 is in contact with the third superconducting material layer 33 between the protective layer 38 and the fourth portion 37. The covering member 60 is made of a conductor. For example, a metal such as solder, copper and silver may be used as a material constituting the covering member 60.
　＜超電導線材の第１の変形例の作用効果＞
　図９に示された超電導線材１ｂは、図７および図８に示した超電導線材１ｂと同様の効果を奏することができる。さらに、図９に示した超電導線材１ｂにおいて、第１の線材１０は、第１の超電導材料層１３上に配置された第１の導体層としての保護層１８および安定化層１９を含む。第３の線材３０は、第３の超電導材料層３３上に配置された第３の導体層としての保護層３８および安定化層３９を含む。被覆部材６０は導電体部分を含む。図９に示された構成では、被覆部材６０全体が導電体部分となっている。導電体部分である被覆部材６０は、第１の保護層１８および第１の安定化層１９の少なくともいずれか一方と、第３の保護層３８および第３の安定化層３９の少なくともいずれか一方とを接続する。図９では被覆部材６０は第１の安定化層１９と第３の安定化層３９とを接続する。この場合、被覆部材６０により第１の線材１０の第１の安定化層１９と第３の線材３０の第３の安定化層３９とを電気的に接続できる。そのため、第１の超電導材料接合層４０または第２の超電導材料接合層４２に不具合が発生し、第１の超電導材料層１３から第１の超電導材料接合層４０、第２の超電導材料層２３、第２の超電導材料接合層４２を介して第３の超電導材料層３３へ電流を流せなくなったときに、第１の超電導材料層１３から保護層１８、安定化層１９、被覆部材６０、安定化層３９、保護層３８を介して第３の超電導材料層３３へ当該電流を流すことができる。 <Operational effect of the first modification of the superconducting wire>
The superconducting wire 1b shown in FIG. 9 can achieve the same effects as the superconducting wire 1b shown in FIGS. Further, in the superconducting wire 1 b shown in FIG. 9, the first wire 10 includes a protective layer 18 and a stabilization layer 19 as a first conductor layer disposed on the first superconducting material layer 13. The third wire 30 includes a protective layer 38 and a stabilization layer 39 as a third conductor layer disposed on the third superconducting material layer 33. The covering member 60 includes a conductor portion. In the configuration shown in FIG. 9, the entire covering member 60 is a conductor portion. The covering member 60, which is a conductor portion, includes at least one of the first protective layer 18 and the first stabilizing layer 19, and at least one of the third protective layer 38 and the third stabilizing layer 39. And connect. In FIG. 9, the covering member 60 connects the first stabilization layer 19 and the third stabilization layer 39. In this case, the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the third stabilization layer 39 of the third wire 30. Therefore, a failure occurs in the first superconducting material bonding layer 40 or the second superconducting material bonding layer 42, and the first superconducting material layer 13 to the first superconducting material bonding layer 40, the second superconducting material layer 23, When no current can flow to the third superconducting material layer 33 via the second superconducting material bonding layer 42, the protective layer 18, the stabilization layer 19, the covering member 60, and the stabilization from the first superconducting material layer 13 are stabilized. The current can be passed to the third superconducting material layer 33 through the layer 39 and the protective layer 38.
　＜超電導線材の第２の変形例の構成＞
　図１０に示されるように、本実施の形態の超電導線材１ｂの第２の変形例は、基本的には図９に示した超電導線材１ｂと同様の構成を備えるが、被覆部材６０が複数の層としての第１層６１、第２層６２、第３層６３を含む点が図９に示した超電導線材１ｂと異なる。 <Configuration of Second Modification of Superconducting Wire>
As shown in FIG. 10, the second modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG. The superconducting wire 1b shown in FIG. 9 is different in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
　図１０に示すように、被覆部材６０の第１層６１は接続部の全体を覆うように配置されている。第１層６１は、第１の超電導材料層１３の第１の主面１３ｓ上から第２の線材２０の表面上を介し、第３の線材３０の第３の超電導材料層３３の第３の主面３３ｓ上にまで延在している。また、第１層６１は、第１の線材１０の第１の金属基板１１の裏面（第１の金属基板１１において第１の中間層１２が形成された表面と反対側の面）上から、第１の端面１０ｅと第３の端面３０ｅとの間の領域を介して、第３の線材３０の第３の金属基板３１の裏面（第３の金属基板３１において第３の中間層３２が形成された表面と反対側の面）上にまで延びるように形成されている。また、第１層６１は、第１の超電導材料接合層４０が形成された領域において第１の線材１０の延在方向に垂直な断面にて、第１の線材１０、第２の線材２０または第３の線材３０、第１の超電導材料接合層４０または第２の超電導材料接合層４２の全体を囲むように配置されている。第１層６１の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第１層６１の製造方法としては、任意の方法を用いることができる。 As shown in FIG. 10, the first layer 61 of the covering member 60 is disposed so as to cover the entire connecting portion. The first layer 61 extends from the first main surface 13 s of the first superconducting material layer 13 through the surface of the second wire 20 to the third superconducting material layer 33 of the third wire 30. It extends to the main surface 33s. In addition, the first layer 61 is formed on the back surface of the first metal substrate 11 of the first wire rod 10 (the surface opposite to the surface on which the first intermediate layer 12 is formed on the first metal substrate 11). Through the region between the first end face 10e and the third end face 30e, the back surface of the third metal substrate 31 of the third wire 30 (the third intermediate layer 32 is formed in the third metal substrate 31). It is formed so that it may extend on the surface on the opposite side to the formed surface. In addition, the first layer 61 has the first wire 10, the second wire 20, or the cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed. The third wire 30, the first superconducting material bonding layer 40, or the second superconducting material bonding layer 42 is disposed so as to surround the whole. As a material of the first layer 61, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. As a manufacturing method of the first layer 61, any method can be used.
　第２層６２は、第１層６１の外周表面上に形成されている。第２層６２は第１層６１の外周表面全体を覆うように配置されていてもよい。図１０では、第２層６２の一方の端部は第１の超電導材料層１３および第１の金属基板１１の裏面と接触している。また、第２層６２において上記一方の端部と反対側に位置する他方の端部は、第３の超電導材料層３３および第３の金属基板３１の裏面と接触している。第２層６２の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第２層６２の製造方法としては任意の方法を用いることができる。また、第２層６２として、金属や樹脂などからなるシート状部材またはテープ状部材を用いてもよい。この場合、当該シート状部材またはテープ状部材を第１層６１に巻きつけるようにして、第２層６２を形成してもよい。 The second layer 62 is formed on the outer peripheral surface of the first layer 61. The second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61. In FIG. 10, one end of the second layer 62 is in contact with the first superconducting material layer 13 and the back surface of the first metal substrate 11. The other end of the second layer 62 located on the opposite side of the one end is in contact with the third superconducting material layer 33 and the back surface of the third metal substrate 31. As the material of the second layer 62, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62. Further, as the second layer 62, a sheet-like member or a tape-like member made of metal or resin may be used. In this case, the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
　第３層６３は、第２層６２の外周表面上に形成されている。第３層６３は第２層６２の外周表面全体を覆うように配置されていてもよい。図１０では、第３層６３の一方の端部は第１の線材１０の安定化層１９と接触している。また、第３層６３において上記一方の端部と反対側に位置する他方の端部は、第３の線材３０の安定化層３９と接触している。第３層６３は、被覆部材６０の導電体部分に相当する。第３層６３の材料として、たとえばはんだや銅、銀などの金属を用いてもよい。第３層６３の製造方法としては任意の方法を用いることができる。 The third layer 63 is formed on the outer peripheral surface of the second layer 62. The third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62. In FIG. 10, one end of the third layer 63 is in contact with the stabilization layer 19 of the first wire 10. The other end of the third layer 63 located on the opposite side of the one end is in contact with the stabilization layer 39 of the third wire 30. The third layer 63 corresponds to the conductor portion of the covering member 60. As a material of the third layer 63, for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
　＜超電導線材の第２の変形例の作用効果＞
　図１０に示した超電導線材１ｂは、図９に示した超電導線材１ｂと同様の効果を奏することができる。さらに、図１０に示した超電導線材１ｂにおいて、被覆部材６０は複数の層としての第１層６１、第２層６２、第３層６３を含む。つまり、被覆部材６０が多層構造となっている。そのため、図６に示した超電導線材１と同様の効果を奏することができる。 <Operation effect of the second modification of the superconducting wire>
The superconducting wire 1b shown in FIG. 10 can achieve the same effects as the superconducting wire 1b shown in FIG. Furthermore, in the superconducting wire 1b shown in FIG. 10, the covering member 60 includes a first layer 61, a second layer 62, and a third layer 63 as a plurality of layers. That is, the covering member 60 has a multilayer structure. Therefore, the same effect as the superconducting wire 1 shown in FIG. 6 can be obtained.
　（実施の形態３）
　＜超電導線材の構成＞
　図１１を参照して、実施の形態３の超電導線材１ｂについて説明する。本実施の形態の超電導線材１ｂは、実施の形態１の超電導線材１と同様の構成を備えるが、以下の点で主に異なる。 (Embodiment 3)
<Configuration of superconducting wire>
With reference to FIG. 11, superconducting wire 1b of the third embodiment will be described. The superconducting wire 1b of the present embodiment has the same configuration as the superconducting wire 1 of the first embodiment, but is mainly different in the following points.
　本実施の形態の超電導線材１ｂにおいて、第１の線材１０と第２の線材２０とは、第１の端面１０ｅと第２の端面２０ｅとが同じ方向に向くように配置される。図３に示すように、第１の超電導材料接合層４０は、第１の超電導材料層１３の第１の主面１３ｓの一部である第１の部分１７と第２の超電導材料層２３の第２の主面２３ｓの第２の部分２７ａとを接合する。被覆部材６０は、第１の端面１０ｅおよび第２の端面２０ｅを内部に埋め込むように配置されている。また、図１１に示すように、第１の線材１０と第２の線材２０との間の距離は、被覆部材６０から離れるにしたがって大きくなっている。つまり、第１の線材１０と第２の線材２０とにおいて被覆部材６０と隣接する部分は、被覆部材６０から離れるほど、互いの距離が大きくなるように湾曲している。 In the superconducting wire 1b of the present embodiment, the first wire 10 and the second wire 20 are arranged so that the first end surface 10e and the second end surface 20e face the same direction. As shown in FIG. 3, the first superconducting material bonding layer 40 includes a first portion 17 that is a part of the first main surface 13 s of the first superconducting material layer 13 and a second superconducting material layer 23. The second portion 27a of the second main surface 23s is joined. The covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e therein. Also, as shown in FIG. 11, the distance between the first wire 10 and the second wire 20 increases as the distance from the covering member 60 increases. That is, the portion adjacent to the covering member 60 in the first wire 10 and the second wire 20 is curved so that the distance from each other increases as the distance from the covering member 60 increases.
　＜超電導線材の製造方法＞
　超電導線材１ｂの製造方法は、基本的には図１～図３に示した実施の形態１に係る超電導線材１の製造方法と同様である。ただし、図４に示した貼り合わせ工程（Ｓ２０）において第１の線材１０と第２の線材２０とを重ね合わせる時に、図１１に示した超電導線材１ｂの製造方法では、第１の端面１０ｅと第２の端面２０ｅとが同じ方向に向くように第１の線材１０と第２の線材２０とを配置する。また、被覆工程（Ｓ５０）において、第１の線材１０の第１の端面１０ｅと第２の線材２０の第２の端面２０ｅとを覆うとともに、第１の線材１０と第２の線材２０とが第１の超電導材料接合層４０により接続されている接続部を埋め込むように被覆部材６０が形成される。上記の点以外は、実施の形態１に係る超電導線材１の製造方法と同様の工程により、図１１に示した超電導線材１ｂは製造され得る。 <Manufacturing method of superconducting wire>
The method of manufacturing superconducting wire 1b is basically the same as the method of manufacturing superconducting wire 1 according to Embodiment 1 shown in FIGS. However, in the method of manufacturing the superconducting wire 1b shown in FIG. 11, when the first wire 10 and the second wire 20 are overlapped in the bonding step (S20) shown in FIG. 4, the first end face 10e and The first wire 10 and the second wire 20 are arranged so that the second end face 20e faces in the same direction. In the covering step (S50), the first end face 10e of the first wire rod 10 and the second end face 20e of the second wire rod 20 are covered, and the first wire rod 10 and the second wire rod 20 are The covering member 60 is formed so as to embed the connecting portion connected by the first superconducting material bonding layer 40. Except for the above points, the superconducting wire 1b shown in FIG. 11 can be manufactured by the same steps as the manufacturing method of the superconducting wire 1 according to the first embodiment.
　＜作用効果＞
　本実施の形態の超電導線材１ｂは、実施の形態１の超電導線材１の効果に加えて、以下の効果を奏する。 <Effect>
Superconducting wire 1b of the present embodiment has the following effects in addition to the effects of superconducting wire 1 of the first embodiment.
　図１１に示した超電導線材１ｂでは、第１の線材１０において、長手方向における第１の端面１０ｅに隣接する位置に第１の超電導材料層１３の第１の部分１７が配置される。第２の線材２０において、長手方向における第２の端面２０ｅに隣接する位置に第２の超電導材料層２３の第２の部分２７ａが配置される。第１の線材１０と第２の線材２０とは、第１の端面１０ｅと第２の端面２０ｅとが同じ方向に向くように配置される。被覆部材６０は、第１の端面１０ｅおよび第２の端面２０ｅを埋め込むように配置されている。 In the superconducting wire 1b shown in FIG. 11, in the first wire 10, the first portion 17 of the first superconducting material layer 13 is disposed at a position adjacent to the first end face 10e in the longitudinal direction. In the second wire 20, the second portion 27 a of the second superconducting material layer 23 is disposed at a position adjacent to the second end face 20 e in the longitudinal direction. The 1st wire 10 and the 2nd wire 20 are arrange | positioned so that the 1st end surface 10e and the 2nd end surface 20e may face the same direction. The covering member 60 is disposed so as to embed the first end surface 10e and the second end surface 20e.
　この場合、第１の端面１０ｅと第２の端面２０ｅとが同じ方向を向くような状態の接合部を被覆部材６０により覆うことで、当該接合部を被覆部材６０により保護するとともに補強することができる。 In this case, it is possible to protect and reinforce the joint with the covering member 60 by covering the joint with the covering member 60 such that the first end face 10e and the second end face 20e face the same direction. it can.
　＜超電導線材の第１の変形例の構成＞
　図１２に示されるように、本実施の形態の超電導線材１ｂの第１の変形例は、基本的には図１１に示した超電導線材１ｂと同様の構成を備えるが、第１の線材１０が保護層１８および安定化層１９を備える点、第２の線材２０が保護層２８および安定化層２９を備える点、被覆部材６０が安定化層１９、２９に接するように形成されている点、第１の部分１７および第２の部分２７ａに隣接する位置において、第１の線材１０の保護層１８と第２の線材２０の保護層２８とが接続されている点、が図１１に示した超電導線材１ｂと異なる。第１の線材１０の保護層１８および安定化層１９の少なくともいずれか一方が第１の導体層に対応する。第２の線材２０の保護層２８および安定化層２９の少なくともいずれか一方が第２の導体層に対応する。被覆部材６０ははんだ、銅などの金属、といった導電体からなる。なお、図１２に示すように、保護層１８における第１の端面１０ｅ側の端部と、保護層２８における第２の端面２０ｅ側の端部とが接続され、接続領域を構成する。第１の線材１０の保護層１８と第２の線材２０の保護層２８との接続領域は、被覆部材６０における安定化層１９、２９側の端部より第１の端面１０ｅ側に位置してもよい。異なる観点から言えば、被覆部材６０は、第１の線材１０および第２の線材２０において、第１の超電導材料接合層４０と重なるように配置された領域と、保護層１８と保護層２８とが接続された部分と重なるように配置された領域とを内部に埋め込むように配置されている。 <Configuration of First Modification of Superconducting Wire>
As shown in FIG. 12, the first modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG. The point provided with the protective layer 18 and the stabilizing layer 19, the point where the second wire 20 is provided with the protective layer 28 and the stabilizing layer 29, the point where the covering member 60 is formed in contact with the stabilizing layers 19, 29, FIG. 11 shows that the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 are connected to each other at a position adjacent to the first portion 17 and the second portion 27a. Different from superconducting wire 1b. At least one of the protective layer 18 and the stabilization layer 19 of the first wire 10 corresponds to the first conductor layer. At least one of the protective layer 28 and the stabilization layer 29 of the second wire 20 corresponds to the second conductor layer. The covering member 60 is made of a conductor such as solder or a metal such as copper. In addition, as shown in FIG. 12, the edge part by the side of the 1st end surface 10e in the protective layer 18 and the edge part by the side of the 2nd end surface 20e in the protective layer 28 are connected, and comprise a connection area | region. The connection region between the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 is located closer to the first end face 10e than the end of the covering member 60 on the side of the stabilizing layers 19 and 29. Also good. Speaking from a different point of view, the covering member 60 includes, in the first wire 10 and the second wire 20, a region disposed so as to overlap the first superconducting material bonding layer 40, the protective layer 18 and the protective layer 28. Are arranged so as to embed a region arranged so as to overlap the connected portion.
　なお、図１２に示した超電導線材１ｂを構成する第１の線材１０および第２の線材２０の構成は、図５に示した超電導線材１を構成する第１の線材１０および第２の線材２０の構成と同様である。また、第１の線材１０の保護層２８と第２の線材２０の保護層２８とは、加熱接合工程（Ｓ３０）において接合される。 In addition, the structure of the 1st wire 10 and the 2nd wire 20 which comprises the superconducting wire 1b shown in FIG. 12 is the 1st wire 10 and the 2nd wire 20 which comprise the superconducting wire 1 shown in FIG. It is the same as that of the structure. Moreover, the protective layer 28 of the 1st wire 10 and the protective layer 28 of the 2nd wire 20 are joined in a heat joining process (S30).
　＜超電導線材の第１の変形例の作用効果＞
　図１２に示された超電導線材１ｂは、図１１に示した超電導線材１ｂと同様の効果を奏することができる。さらに、図１２に示した超電導線材１ｂにおいて、第１の線材１０は、第１の超電導材料層１３上に配置された第１の導体層としての保護層１８および安定化層１９を含む。第２の線材２０は、第２の超電導材料層２３上に配置された第２の導体層としての保護層２８および安定化層２９を含む。被覆部材６０は導電体部分を含む。図１２に示された構成では、被覆部材６０全体が導電体部分となっている。導電体部分である被覆部材６０は、第１の安定化層１９と第２の安定化層２９とを接続する。さらに、図１２では、第１の保護層１８と第２の保護層２８とが第１の部分１７および第２の部分２７ａに隣接する位置において接続されている。この場合、被覆部材６０により第１の線材１０の第１の安定化層１９と第２の線材２０の第２の安定化層２９とを電気的に接続できる。さらに、第１の線材１０の保護層１８と第２の線材２０の保護層２８とを直接的に接続している。そのため、第１の超電導材料接合層４０に不具合が発生し、第１の超電導材料層１３から第１の超電導材料接合層４０を介して第２の超電導材料層２３へ電流を流せなくなったときに、第１の超電導材料層１３から保護層１８、保護層２８を介して第２の超電導材料層２３へ電流を流すことができる。あるいは、第１の超電導材料層１３から保護層１８、安定化層１９、被覆部材６０、安定化層２９、保護層２８を介して第２の超電導材料層２３へ当該電流を流すことができる。 <Operational effect of the first modification of the superconducting wire>
The superconducting wire 1b shown in FIG. 12 can achieve the same effects as the superconducting wire 1b shown in FIG. Further, in the superconducting wire 1 b shown in FIG. 12, the first wire 10 includes a protective layer 18 and a stabilization layer 19 as a first conductor layer disposed on the first superconducting material layer 13. The second wire 20 includes a protective layer 28 and a stabilization layer 29 as a second conductor layer disposed on the second superconducting material layer 23. The covering member 60 includes a conductor portion. In the configuration shown in FIG. 12, the entire covering member 60 is a conductor portion. The covering member 60 that is a conductor portion connects the first stabilization layer 19 and the second stabilization layer 29. Furthermore, in FIG. 12, the 1st protective layer 18 and the 2nd protective layer 28 are connected in the position adjacent to the 1st part 17 and the 2nd part 27a. In this case, the covering member 60 can electrically connect the first stabilization layer 19 of the first wire 10 and the second stabilization layer 29 of the second wire 20. Further, the protective layer 18 of the first wire 10 and the protective layer 28 of the second wire 20 are directly connected. Therefore, when a problem occurs in the first superconducting material bonding layer 40 and no current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the first superconducting material bonding layer 40. A current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18 and the protective layer 28. Alternatively, the current can flow from the first superconducting material layer 13 to the second superconducting material layer 23 via the protective layer 18, the stabilizing layer 19, the covering member 60, the stabilizing layer 29, and the protective layer 28.
　＜超電導線材の第２の変形例の構成＞
　図１３に示されるように、本実施の形態の超電導線材１ｂの第２の変形例は、基本的には図１２に示した超電導線材１ｂと同様の構成を備えるが、被覆部材６０が複数の層としての第１層６１、第２層６２、第３層６３を含む点が図１２に示した超電導線材１と異なる。 <Configuration of Second Modification of Superconducting Wire>
As shown in FIG. 13, the second modification of the superconducting wire 1b of the present embodiment basically has the same configuration as the superconducting wire 1b shown in FIG. It differs from the superconducting wire 1 shown in FIG. 12 in that it includes a first layer 61, a second layer 62, and a third layer 63 as layers.
　図１３に示すように、被覆部材６０の第１層６１は接続部の全体を覆うとともに、第１の端面１０ｅおよび第２の端面２０ｅを覆うように配置されている。第１層６１は第２の金属基板２１の裏面上から第２の線材２０の第２の端面２０ｅ、第１の線材１０の第１の端面１０ｅ、第１の金属基板１１の裏面上にまで延在している。また、第１層６１は、第１の超電導材料接合層４０が形成された領域において第１の線材１０の延在方向に垂直な断面にて、第１の線材１０、第２の線材２０、第１の超電導材料接合層４０の全体を囲むように配置されている。第１層６１の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第１層６１の製造方法としては、任意の方法を用いることができる。 As shown in FIG. 13, the first layer 61 of the covering member 60 is disposed so as to cover the entire connection portion and to cover the first end face 10 e and the second end face 20 e. The first layer 61 extends from the back surface of the second metal substrate 21 to the second end surface 20 e of the second wire 20, the first end surface 10 e of the first wire 10, and the back surface of the first metal substrate 11. It is extended. In addition, the first layer 61 has a cross section perpendicular to the extending direction of the first wire 10 in the region where the first superconducting material bonding layer 40 is formed, and the first wire 10, the second wire 20, It arrange | positions so that the whole 1st superconducting material joining layer 40 may be enclosed. As a material of the first layer 61, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. As a manufacturing method of the first layer 61, any method can be used.
　第２層６２は、第１層６１の外周表面上に形成されている。第２層６２は第１層６１の外周表面全体を覆うように配置されていてもよい。図１３では、第２層６２の一方の端部は第２の金属基板２１の裏面と接触している。また、第２層６２において上記一方の端部と反対側に位置する他方の端部は、第１の金属基板１１の裏面と接触している。第２層６２の材料として、たとえばはんだや銅、銀などの金属を用いてもよいし、樹脂を用いてもよい。第２層６２の製造方法としては任意の方法を用いることができる。また、第２層６２として、金属や樹脂などからなるシート状部材またはテープ状部材を用いてもよい。この場合、当該シート状部材またはテープ状部材を第１層６１に巻きつけるようにして、第２層６２を形成してもよい。 The second layer 62 is formed on the outer peripheral surface of the first layer 61. The second layer 62 may be disposed so as to cover the entire outer peripheral surface of the first layer 61. In FIG. 13, one end of the second layer 62 is in contact with the back surface of the second metal substrate 21. In addition, the other end of the second layer 62 located on the side opposite to the one end is in contact with the back surface of the first metal substrate 11. As the material of the second layer 62, for example, a metal such as solder, copper, or silver may be used, or a resin may be used. Any method can be used as a method of manufacturing the second layer 62. Further, as the second layer 62, a sheet-like member or a tape-like member made of metal or resin may be used. In this case, the second layer 62 may be formed by winding the sheet-like member or tape-like member around the first layer 61.
　第３層６３は、第２層６２の外周表面上に形成されている。第３層６３は第２層６２の外周表面全体を覆うように配置されていてもよい。図１３では、第３層６３の一方の端部は第２の線材２０の安定化層２９と接触している。また、第３層６３において上記一方の端部と反対側に位置する他方の端部は、第１の線材１０の安定化層１９と接触している。第３層６３は、被覆部材６０の導電体部分に相当する。第３層６３の材料として、たとえばはんだや銅、銀などの金属を用いてもよい。第３層６３の製造方法としては任意の方法を用いることができる。 The third layer 63 is formed on the outer peripheral surface of the second layer 62. The third layer 63 may be arranged so as to cover the entire outer peripheral surface of the second layer 62. In FIG. 13, one end of the third layer 63 is in contact with the stabilization layer 29 of the second wire 20. Further, the other end portion of the third layer 63 located on the opposite side of the one end portion is in contact with the stabilizing layer 19 of the first wire 10. The third layer 63 corresponds to the conductor portion of the covering member 60. As a material of the third layer 63, for example, a metal such as solder, copper, or silver may be used. Any method can be used as a method of manufacturing the third layer 63.
　＜超電導線材の第２の変形例の作用効果＞
　図１３に示した超電導線材１ｂは、図１２に示した超電導線材１ｂと同様の効果を奏することができる。さらに、図１３に示した超電導線材１ｂにおいて、被覆部材６０が多層構造となっている。そのため、被覆部材６０を構成する第１～第３層６１，６２，６３について、たとえば異なる材料の層とすることで被覆部材６０に複数の機能を持たせることができる。 <Operation effect of the second modification of the superconducting wire>
The superconducting wire 1b shown in FIG. 13 can achieve the same effects as the superconducting wire 1b shown in FIG. Furthermore, in the superconducting wire 1b shown in FIG. 13, the covering member 60 has a multilayer structure. Therefore, the first to third layers 61, 62, and 63 constituting the covering member 60 can be provided with a plurality of functions by making the layers of different materials, for example.
　（実施の形態４）
　＜超電導マグネットの構成＞
　図１４を参照して、実施の形態４の超電導マグネット１００について説明する。 (Embodiment 4)
<Configuration of superconducting magnet>
A superconducting magnet 100 according to the fourth embodiment will be described with reference to FIG.
　本実施の形態の超電導マグネット１００は、実施の形態１～実施の形態３の超電導線材１，１ｂのいずれかを含む超電導コイル７０と、超電導コイル７０を収容するクライオスタット１０５と、超電導コイル７０を冷却する冷凍機１０２とを主に備える。特定的には、超電導マグネット１００は、クライオスタット１０５の内部に保持された熱シールド１０６と、磁性体シールド１４０とをさらに備えてもよい。 The superconducting magnet 100 of the present embodiment cools the superconducting coil 70 including any of the superconducting wires 1 and 1b of the first to third embodiments, the cryostat 105 that houses the superconducting coil 70, and the superconducting coil 70. The refrigerator 102 is mainly provided. Specifically, the superconducting magnet 100 may further include a heat shield 106 held inside the cryostat 105 and a magnetic shield 140.
　超電導コイル７０では、超電導線材１，１ｂのいずれかが、超電導コイル７０の中心軸周りに巻き回されている。超電導コイル７０を含む超電導コイル体１１０は、クライオスタット１０５内に収容されている。超電導コイル体１１０は、熱シールド１０６の内部に保持されている。超電導コイル体１１０は、複数の超電導コイル７０と、上方支持部１１４と、下方支持部１１１とを含む。複数の超電導コイル７０は積層されている。積層された超電導コイル７０の上端面および下端面を上方支持部１１４と下方支持部１１１とが挟むように配置されている。 In the superconducting coil 70, one of the superconducting wires 1 and 1b is wound around the central axis of the superconducting coil 70. Superconducting coil body 110 including superconducting coil 70 is housed in cryostat 105. Superconducting coil body 110 is held inside heat shield 106. Superconducting coil body 110 includes a plurality of superconducting coils 70, an upper support portion 114, and a lower support portion 111. A plurality of superconducting coils 70 are stacked. The upper and lower end surfaces of the superconducting coils 70 stacked are arranged so that the upper support portion 114 and the lower support portion 111 sandwich the upper end surface and the lower end surface.
　積層された超電導コイル７０の上端面上と、積層された超電導コイル７０の下端面上とに冷却板１１３が配置されている。互いに隣接する超電導コイル７０の間にも冷却板（図示せず）が配置されている。冷却板１１３は、一方端が冷凍機１０２の第２冷却ヘッド１３１に接続されている。互いに隣接する超電導コイル７０の間に配置された冷却板（図示せず）も、その一方端が第２冷却ヘッド１３１に接続されている。冷凍機１０２の第１冷却ヘッド１３２は熱シールド１０６の壁部に接続されてもよい。そのため、冷凍機１０２によって熱シールド１０６の壁部も冷却され得る。 A cooling plate 113 is disposed on the upper end surface of the superconducting coil 70 that is laminated and on the lower end surface of the superconducting coil 70 that is laminated. A cooling plate (not shown) is also disposed between the superconducting coils 70 adjacent to each other. One end of the cooling plate 113 is connected to the second cooling head 131 of the refrigerator 102. A cooling plate (not shown) disposed between the superconducting coils 70 adjacent to each other is also connected to the second cooling head 131 at one end thereof. The first cooling head 132 of the refrigerator 102 may be connected to the wall portion of the heat shield 106. Therefore, the wall portion of the heat shield 106 can also be cooled by the refrigerator 102.
　超電導コイル体１１０の下方支持部１１１は、超電導コイル７０の平面形状より大きいサイズを有する。下方支持部１１１は、複数の支持部材１１５によって熱シールド１０６に固定されている。複数の支持部材１１５は、棒状の部材であって、熱シールド１０６の上壁と下方支持部１１１の外周部とを接続している。複数の支持部材１１５が超電導コイル体１１０の外周部に配置されている。支持部材１１５は、互いに同じ間隔を隔てて超電導コイル７０を囲むように配置されている。 The lower support part 111 of the superconducting coil body 110 has a size larger than the planar shape of the superconducting coil 70. The lower support portion 111 is fixed to the heat shield 106 by a plurality of support members 115. The plurality of support members 115 are rod-shaped members, and connect the upper wall of the heat shield 106 and the outer peripheral portion of the lower support portion 111. A plurality of support members 115 are arranged on the outer periphery of the superconducting coil body 110. Support members 115 are arranged to surround superconducting coil 70 at the same interval.
　超電導コイル体１１０を保持する熱シールド１０６は、接続部１２０によってクライオスタット１０５に接続されている。接続部１２０は、超電導コイル体１１０の中心軸を囲むように、超電導コイル体１１０の外周部に沿って等間隔で配置されている。接続部１２０は、クライオスタット１０５の蓋体１３５と熱シールド１０６の上壁とを接続している。 The heat shield 106 that holds the superconducting coil body 110 is connected to the cryostat 105 by the connecting portion 120. The connecting portions 120 are arranged at equal intervals along the outer peripheral portion of the superconducting coil body 110 so as to surround the central axis of the superconducting coil body 110. The connection part 120 connects the lid body 135 of the cryostat 105 and the upper wall of the heat shield 106.
　クライオスタット１０５の蓋体１３５の上部から熱シールド１０６の内部まで延在するように冷凍機１０２が配置されている。冷凍機１０２は、超電導コイル体１１０を冷却する。具体的には、蓋体１３５の上部表面の上方に冷凍機１０２の本体部１３３およびモータ１３４が配置される。本体部１３３から熱シールド１０６の内部にまで到達するように冷凍機１０２が配置されている。 The refrigerator 102 is arranged so as to extend from the upper part of the lid 135 of the cryostat 105 to the inside of the heat shield 106. The refrigerator 102 cools the superconducting coil body 110. Specifically, the main body 133 and the motor 134 of the refrigerator 102 are disposed above the upper surface of the lid 135. The refrigerator 102 is arranged so as to reach the inside of the heat shield 106 from the main body 133.
　冷凍機１０２は、たとえばギフォード・マクマホン式冷凍機であってもよい。冷凍機１０２は、配管１３７を通じて、冷媒を圧縮するコンプレッサ（図示せず）に接続されている。コンプレッサで高圧に圧縮された冷媒（たとえば、ヘリウムガス）は冷凍機１０２に供給される。この冷媒がモータ１３４により駆動されるディスプレーサにより膨張されることにより、冷凍機１０２に内設された蓄冷材が冷却される。膨張することにより低圧となった冷媒はコンプレッサに戻されて再び高圧化される。 The refrigerator 102 may be, for example, a Gifford McMahon refrigerator. The refrigerator 102 is connected through a pipe 137 to a compressor (not shown) that compresses the refrigerant. The refrigerant (for example, helium gas) compressed to a high pressure by the compressor is supplied to the refrigerator 102. The refrigerant is expanded by a displacer driven by a motor 134, whereby the regenerator material provided in the refrigerator 102 is cooled. The refrigerant, which has become low pressure due to expansion, is returned to the compressor and is increased in pressure again.
　冷凍機１０２の第１冷却ヘッド１３２が熱シールド１０６を冷却することによって外部の熱が熱シールド１０６内に侵入することが防止される。冷凍機１０２の第２冷却ヘッド１３１が冷却板１１３を介して超電導コイル７０を冷却する。こうして、超電導コイル７０は超電導状態となる。 The first cooling head 132 of the refrigerator 102 cools the heat shield 106 to prevent external heat from entering the heat shield 106. The second cooling head 131 of the refrigerator 102 cools the superconducting coil 70 via the cooling plate 113. Thus, the superconducting coil 70 is in a superconducting state.
　クライオスタット１０５は、クライオスタット本体部１３６と蓋体１３５とを含む。本体部１３３およびモータ１３４の周囲は、磁性体シールド１４０によって囲まれている。磁性体シールド１４０は、超電導コイル体１１０から発生した磁場の一部がモータ１３４に侵入することを防止し得る。 The cryostat 105 includes a cryostat main body 136 and a lid body 135. The periphery of the main body 133 and the motor 134 is surrounded by a magnetic shield 140. The magnetic shield 140 can prevent a part of the magnetic field generated from the superconducting coil body 110 from entering the motor 134.
　超電導マグネット１００には、クライオスタット１０５および熱シールド１０６を貫通し、クライオスタット１０５の蓋体１３５からクライオスタット本体部１３６の底壁まで到達する開口部１０７が形成されている。開口部１０７は、超電導コイル体１１０の超電導コイル７０の中央部を貫通するように配置されている。被検知体２１０（図１５を参照）が開口部１０７の内部に配置されて、被検知体２１０に超電導コイル体１１０から発生した磁場が印加され得る。 The superconducting magnet 100 is formed with an opening 107 that penetrates the cryostat 105 and the heat shield 106 and reaches the bottom wall of the cryostat main body 136 from the lid body 135 of the cryostat 105. The opening 107 is disposed so as to penetrate the central portion of the superconducting coil 70 of the superconducting coil body 110. A detected body 210 (see FIG. 15) is disposed inside the opening 107, and a magnetic field generated from the superconducting coil body 110 can be applied to the detected body 210.
　＜作用効果＞
　本実施の形態の超電導コイル７０の効果について説明する。本実施の形態の超電導コイル７０は、超電導線材１，１ｂのいずれかを含む。超電導線材１，１ｂのいずれかは、超電導コイルの中心軸周りに巻き回されている。そのため、本実施の形態の超電導コイル７０は、第１の超電導材料接合層４０または第２の超電導材料接合層４２において超電導接合を安定して実現可能であって、高い信頼性を有し、かつ、強い磁場を発生し得る。本実施の形態の超電導コイル７０は、永久電流モードでの運転が可能である。 <Effect>
The effect of the superconducting coil 70 of the present embodiment will be described. Superconducting coil 70 of the present embodiment includes one of superconducting wires 1 and 1b. One of the superconducting wires 1 and 1b is wound around the central axis of the superconducting coil. Therefore, the superconducting coil 70 of the present embodiment can stably realize superconducting junctions in the first superconducting material joining layer 40 or the second superconducting material joining layer 42, has high reliability, and Can generate a strong magnetic field. The superconducting coil 70 of the present embodiment can be operated in the permanent current mode.
　本実施の形態の超電導マグネット１００の効果について説明する。本実施の形態の超電導マグネット１００は、超電導線材１，１ｂのいずれかを含む超電導コイル７０と、超電導コイル７０を収容するクライオスタット１０５と、超電導コイル７０を冷却する冷凍機１０２とを備える。そのため、本実施の形態の超電導マグネット１００は、高い信頼性を有し、かつ、強い磁場を発生し得る。本実施の形態の超電導マグネット１００は、永久電流モードでの運転が可能である。 The effect of the superconducting magnet 100 of this embodiment will be described. The superconducting magnet 100 of the present embodiment includes a superconducting coil 70 including any of the superconducting wires 1 and 1b, a cryostat 105 that accommodates the superconducting coil 70, and a refrigerator 102 that cools the superconducting coil 70. Therefore, the superconducting magnet 100 of the present embodiment has high reliability and can generate a strong magnetic field. Superconducting magnet 100 of the present embodiment can be operated in a permanent current mode.
　（実施の形態５）
　＜超電導機器の構成＞
　図１５を参照して、実施の形態５の超電導機器２００について説明する。本実施の形態の超電導機器２００は、例えば、磁気共鳴イメージング（ＭＲＩ）装置であってもよい。 (Embodiment 5)
<Configuration of superconducting equipment>
With reference to FIG. 15, superconducting device 200 according to the fifth embodiment will be described. Superconducting device 200 of the present embodiment may be, for example, a magnetic resonance imaging (MRI) apparatus.
　本実施の形態の超電導機器２００は、実施の形態４の超電導マグネット１００を主に備える。本実施の形態の超電導機器２００は、可動台２０２と制御部２０８とをさらに備えてもよい。可動台２０２は、被検知体２１０が載置される天板２０５と、天板２０５を移動させる駆動部２０４とを含む。制御部２０８は、超電導マグネット１００と、駆動部２０４とに接続されている。 The superconducting device 200 of the present embodiment mainly includes the superconducting magnet 100 of the fourth embodiment. Superconducting device 200 of the present embodiment may further include a movable table 202 and a control unit 208. The movable table 202 includes a top plate 205 on which the detected object 210 is placed and a drive unit 204 that moves the top plate 205. The control unit 208 is connected to the superconducting magnet 100 and the drive unit 204.
　制御部２０８は、超電導マグネット１００を駆動して、超電導マグネット１００の開口部１０７内に均一な磁場を発生させる。制御部２０８は、可動台２０２を移動させて、可動台２０２上に載置された被検知体２１０を超電導マグネット１００の開口部１０７内に進入させる。被検知体２１０の撮像を終えると、制御部２０８は可動台２０２を移動させて、可動台２０２上に載置された被検知体２１０を超電導マグネット１００の開口部１０７から退出させる。 The control unit 208 drives the superconducting magnet 100 to generate a uniform magnetic field in the opening 107 of the superconducting magnet 100. The control unit 208 moves the movable table 202 and causes the detected object 210 placed on the movable table 202 to enter the opening 107 of the superconducting magnet 100. When the imaging of the detected object 210 is completed, the control unit 208 moves the movable table 202 and causes the detected object 210 placed on the movable table 202 to exit from the opening 107 of the superconducting magnet 100.
　＜作用効果＞
　本実施の形態の超電導機器２００の効果について説明する。本実施の形態の超電導機器２００は、超電導マグネット１００を備える。そのため、本実施の形態の超電導機器２００は、永久電流モードでの運転が可能であり、高い信頼性を有し、かつ、強い磁場を発生し得る。本実施の形態の超電導機器２００を用いて、被検知体２１０は精度よく撮像され得る。 <Effect>
The effect of the superconducting device 200 of the present embodiment will be described. Superconducting device 200 of the present embodiment includes superconducting magnet 100. Therefore, the superconducting device 200 of the present embodiment can be operated in the permanent current mode, has high reliability, and can generate a strong magnetic field. Using the superconducting device 200 of the present embodiment, the detected object 210 can be imaged with high accuracy.
　今回開示された実施の形態はすべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は上記した実施の形態ではなく請求の範囲によって示され、請求の範囲と均等の意味、および範囲内でのすべての変更が含まれることが意図される。 It should be considered that the embodiment disclosed this time is illustrative in all respects and not restrictive. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims, and is intended to include meanings equivalent to the scope of claims and all modifications within the scope.
　１，１ｂ　超電導線材、１０　第１の線材、１０ｅ　第１の端面、１１　第１の金属基板、１２　第１の中間層、１３　第１の超電導材料層、１３ｓ　第１の主面、１７　第１の部分、１８，２８，３８　保護層、１９，２９，３９　安定化層、２０　第２の線材、２０ｅ　第２の端面、２１　第２の金属基板、２２　第２の中間層、２３　第２の超電導材料層、２３ｓ　第２の主面、２７ａ　第２の部分、２７ｂ　第３の部分、３０　第３の線材、３０ｅ　第３の端面、３１　第３の金属基板、３２　第３の中間層、３３　第３の超電導材料層、３３ｓ　第３の主面、３７　第４の部分、４０，４２　超電導材料接合層、６０　被覆部材、６１　第１層、６２　第２層、６３　第３層、７０　超電導コイル、１００　超電導マグネット、１０２　冷凍機、１０５　クライオスタット、１０６　熱シールド、１０７　開口部、１１０　超電導コイル体、１１１　下方支持部、１１３　冷却板、１１４　上方支持部、１１５　支持部材、１２０　接続部、１３１　第２冷却ヘッド、１３２　第１冷却ヘッド、１３３　本体部、１３４　モータ、１３５　蓋体、１３６　クライオスタット本体部、１３７　配管、１４０　磁性体シールド、２００　超電導機器、２０２　可動台、２０４　駆動部、２０５　天板、２０８　制御部、２１０　被検知体。 1, 1b superconducting wire, 10 first wire, 10e first end face, 11 first metal substrate, 12 first intermediate layer, 13 first superconducting material layer, 13s first main surface, 17 first 18, 28, 38 Protective layer, 19, 29, 39 Stabilization layer, 20 Second wire rod, 20 e Second end face, 21 Second metal substrate, 22 Second intermediate layer, 23 Second Superconducting material layer, 23s second main surface, 27a second portion, 27b third portion, 30 third wire rod, 30e third end surface, 31 third metal substrate, 32 third intermediate layer, 33 3rd superconducting material layer, 33s 3rd main surface, 37 4th part, 40, 42 superconducting material joining layer, 60 covering member, 61 1st layer, 62 2nd layer, 63 3rd layer, 70 superconducting coil , 100 superconducting magnet, 02 refrigerator, 105 cryostat, 106 heat shield, 107 opening, 110 superconducting coil body, 111 lower support part, 113 cooling plate, 114 upper support part, 115 support member, 120 connection part, 131 second cooling head, 132 second 1 cooling head, 133 main body, 134 motor, 135 lid, 136 cryostat main body, 137 piping, 140 magnetic shield, 200 superconducting equipment, 202 movable base, 204 drive unit, 205 top plate, 208 control unit, 210 covered Detecting body.

Claims (9)

  1. 　第１の超電導材料層を有する第１の線材と、
    　第２の超電導材料層を有する第２の線材とを備え、
    　前記第１の超電導材料層の第１の部分は前記第２の超電導材料層の第２の部分に対向して配置され、さらに、
    　前記第１の超電導材料層の前記第１の部分と前記第２の超電導材料層の前記第２の部分とを接合する第１の接合層と、
    　前記第１の線材および前記第２の線材において、前記第１の接合層と重なるように配置された領域と、前記第１の接合層とを内部に埋め込むように配置された被覆部材とを備え、
    　前記第１の接合層を構成する材料は超電導体を含む、超電導線材。     A first wire having a first superconducting material layer;
    A second wire having a second superconducting material layer,
    A first portion of the first superconducting material layer is disposed opposite to a second portion of the second superconducting material layer;
    A first joining layer joining the first portion of the first superconducting material layer and the second portion of the second superconducting material layer;
    The first wire and the second wire each include a region disposed so as to overlap the first bonding layer and a covering member disposed so as to embed the first bonding layer therein. ,
    The material constituting the first bonding layer is a superconducting wire including a superconductor.
  2. 　前記被覆部材は複数の層を含む、請求項１に記載の超電導線材。 The superconducting wire according to claim 1, wherein the covering member includes a plurality of layers.
  3. 　前記第１の線材は、前記第１の超電導材料層上に配置された第１の導体層を含み、
    　前記第２の線材は、前記第２の超電導材料層上に配置された第２の導体層を含み、
    　前記被覆部材は導電体部分を含み、
    　前記被覆部材の前記導電体部分は、前記第１の導体層と前記第２の導体層とを接続する、請求項１または請求項２に記載の超電導線材。     The first wire includes a first conductor layer disposed on the first superconducting material layer,
    The second wire includes a second conductor layer disposed on the second superconducting material layer,
    The covering member includes a conductor portion;
    The superconducting wire according to claim 1, wherein the conductor portion of the covering member connects the first conductor layer and the second conductor layer.
  4. 　前記第１の超電導材料層は、ＲＥ１1Ｂａ2Ｃｕ3Ｏy1（６．０≦ｙ１≦８．０、ＲＥ１は希土類元素を表す）により構成されており、
    　前記第２の超電導材料層は、ＲＥ２1Ｂａ2Ｃｕ3Ｏy2（６．０≦ｙ２≦８．０、ＲＥ２は希土類元素を表す）により構成されており、
    　前記第１の接合層の前記超電導体は、ＲＥ３1Ｂａ2Ｃｕ3Ｏy3（６．０≦ｙ３≦８．０、ＲＥ３は希土類元素を表す）により構成されている、請求項１～請求項３のいずれか１項に記載の超電導線材。     The first superconducting material layer is composed of RE1 1 Ba 2 Cu 3 O y1 (6.0 ≦ y1 ≦ 8.0, where RE1 represents a rare earth element),
    The second superconducting material layer is composed of RE2 1 Ba 2 Cu 3 O y2 (6.0 ≦ y2 ≦ 8.0, where RE2 represents a rare earth element),
    The superconductor of the first bonding layer is composed of RE3 1 Ba 2 Cu 3 O y3 (6.0 ≦ y3 ≦ 8.0, where RE3 represents a rare earth element). 4. The superconducting wire according to any one of 3 above.
  5. 　前記第１の線材において、長手方向における第１の端面に隣接する位置に前記第１の超電導材料層の前記第１の部分は配置され、
    　前記第２の線材において、長手方向における第２の端面に隣接する位置に前記第２の超電導材料層の前記第２の部分は配置され、
    　前記第１の線材と前記第２の線材とは、前記第１の端面と前記第２の端面とが同じ方向に向くように配置され、
    　前記被覆部材は、前記第１の端面および前記第２の端面を埋め込むように配置されている、請求項１～請求項４のいずれか１項に記載の超電導線材。     In the first wire, the first portion of the first superconducting material layer is disposed at a position adjacent to the first end face in the longitudinal direction,
    In the second wire, the second portion of the second superconducting material layer is disposed at a position adjacent to the second end face in the longitudinal direction,
    The first wire and the second wire are arranged so that the first end surface and the second end surface are oriented in the same direction,
    The superconducting wire according to any one of claims 1 to 4, wherein the covering member is disposed so as to embed the first end face and the second end face.
  6. 　第３の超電導材料層を有する第３の線材と、
    　前記第２の超電導材料層と前記第３の超電導材料層とを接合する第２の接合層とをさらに備え、
    　前記第１の線材は、前記第１の線材の長手方向において第１の長さを有し、
    　前記第２の線材は、前記第２の線材の長手方向において第２の長さを有し、
    　前記第３の線材は、前記第３の線材の長手方向において第３の長さを有し、
    　前記第２の長さは、前記第１の長さおよび前記第３の長さよりも短く、
    　前記被覆部材は、前記第２の線材の全体と、前記第３の線材において前記第２の接合層と重なるように配置された領域と、前記第２の接合層とを内部に埋め込むように配置されている、請求項１～請求項４のいずれか１項に記載の超電導線材。     A third wire having a third superconducting material layer;
    A second joining layer joining the second superconducting material layer and the third superconducting material layer;
    The first wire has a first length in the longitudinal direction of the first wire,
    The second wire has a second length in the longitudinal direction of the second wire,
    The third wire has a third length in the longitudinal direction of the third wire,
    The second length is shorter than the first length and the third length,
    The covering member is disposed so as to embed the entire second wire, a region of the third wire disposed so as to overlap the second bonding layer, and the second bonding layer. The superconducting wire according to any one of claims 1 to 4, wherein the superconducting wire is provided.
  7. 　中心軸を有する超電導コイルであって、
    　請求項１～請求項６のいずれか１項に記載の前記超電導線材を備え、
    　前記超電導線材は、前記中心軸周りに巻き回されている、超電導コイル。     A superconducting coil having a central axis,
    The superconducting wire according to any one of claims 1 to 6,
    The superconducting wire is a superconducting coil wound around the central axis.
  8. 　　請求項７に記載の前記超電導コイルと、
    　前記超電導コイルを収容するクライオスタットと、
    　前記超電導コイルを冷却する冷凍機とを備える、超電導マグネット。     The superconducting coil according to claim 7,
    A cryostat that houses the superconducting coil;
    A superconducting magnet comprising a refrigerator for cooling the superconducting coil.
  9. 　請求項８に記載の前記超電導マグネットを備える、超電導機器。 A superconducting device comprising the superconducting magnet according to claim 8.
PCT/JP2017/018878 2017-05-19 2017-05-19 Superconducting wire material, superconducting coil, superconducting magnet, and superconducting device WO2018211699A1 (en)

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WO2020161909A1 (en) * 2019-02-08 2020-08-13 住友電気工業株式会社 Superconducting wire connection structure
CN114220650A (en) * 2021-12-20 2022-03-22 中国科学院电工研究所 Second-generation high-temperature superconducting tape closed coil and preparation method thereof
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