WO2018209963A1 - 腔体射频器件 - Google Patents

腔体射频器件 Download PDF

Info

Publication number
WO2018209963A1
WO2018209963A1 PCT/CN2017/119478 CN2017119478W WO2018209963A1 WO 2018209963 A1 WO2018209963 A1 WO 2018209963A1 CN 2017119478 W CN2017119478 W CN 2017119478W WO 2018209963 A1 WO2018209963 A1 WO 2018209963A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
wiring
groove
circuit
wiring groove
Prior art date
Application number
PCT/CN2017/119478
Other languages
English (en)
French (fr)
Inventor
卜斌龙
刘培涛
陈礼涛
苏国生
Original Assignee
京信通信系统（中国）有限公司
京信通信技术(广州)有限公司
京信通信系统（广州）有限公司
天津京信通信系统有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京信通信系统（中国）有限公司, 京信通信技术(广州)有限公司, 京信通信系统（广州）有限公司, 天津京信通信系统有限公司 filed Critical 京信通信系统（中国）有限公司
Publication of WO2018209963A1 publication Critical patent/WO2018209963A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/125—Means for positioning

Definitions

  • the present invention relates to the field of communication base station antenna technologies, and in particular, to a cavity radio frequency device.
  • Radio frequency devices are widely used in the field of communication base station antenna technology, and the performance of the radio frequency can affect the quality of the entire network coverage.
  • the transmission cable is susceptible to environmental or external forces and carries solder out of the wiring slot
  • the present invention provides a cavity RF device, which aims to improve the intermodulation index and improve the stability of the overall electrical performance index by preventing solder oxidation and improving the reliability of the connection structure between the transmission cable and the wiring groove.
  • a cavity RF device comprising a cavity having a plurality of package walls, the cavity being externally provided with a wiring trench defined by the package wall and for mounting a transmission cable, the outer conductor of the transmission cable being soldered to the wiring trench
  • the potting groove is further formed with a potting glue covering the solder
  • the package wall is provided with a retaining stop for limiting the potting glue.
  • At least two spaced-apart wiring grooves are formed, and an intermediate groove is formed between the two wiring grooves, and the potting compound is integrally formed in the intermediate groove, the package wall and the solder. .
  • the anti-detachment limiting structure is a pair of limiting arms extending opposite to the groove bottom of the wiring groove and extending inward along the groove side wall of the wiring groove.
  • the limiting arm and the package wall are integrally formed by pultrusion or die casting.
  • a limiting structure is formed in the wiring groove for interconnecting the solder and the package wall.
  • the limiting structure includes a soldering space recessed in the wiring groove, and/or a protrusion protruding at least on a sidewall of the groove of the wiring groove.
  • the wiring groove is provided with at least one through hole penetrating into the cavity.
  • a radio frequency circuit is disposed in the cavity; the radio frequency circuit includes a phase shifter circuit, a filter circuit, a power divider circuit, a coupler circuit, a duplexer circuit, a combiner circuit, and a bridge circuit. At least one.
  • the present invention has the following advantages:
  • the cavity RF device of the invention has a simple structure, and is fixed on the basis of fixing the transmission cable in the wiring groove by using solder, and can prevent the oxidation of the solder by setting the potting glue and the anti-delimitation member outside the cavity.
  • the double effect of structural reliability of confining the transmission cable in the wiring slot is greatly improved, and the solder is not strong, the reliability is poor, and the environment and the external force are easily loosened, and the cavity RF device can be used for a long time.
  • FIG. 1 is a first schematic structural diagram of a cavity RF device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing a second structure of a cavity RF device according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a third structure of a cavity RF device according to an embodiment of the present invention.
  • 100 transmission cable; 200: cavity; 210: package wall; 220: cavity; 230: wiring groove; 211: limit arm; 231: tin space; 240: intermediate groove; 300: solder; 400: irrigation Sealing; 500: RF circuit.
  • first and second in the present invention do not represent a specific number and order, but are merely used for distinguishing names.
  • the cavity 200 radio frequency device provided by the embodiment includes a cavity 200 having a plurality of package walls 210.
  • the cavity 200 is externally defined by the package wall 210 and used for mounting the transmission cable 100.
  • the wiring trench 230, the outer conductor of the transmission cable 100 is fixedly connected to the wiring trench 230 through the solder 300, and the potting paste 400 covering the solder 300 is formed in the wiring trench 230, and the package wall 210 is provided with an anti-blocking adhesive 400. Take off the limiter.
  • the cavity 200 radio frequency device has a simple structure.
  • the solder can be prevented by providing the potting compound 400 and the anti-detachment stopper outside the cavity 200.
  • the oxidation of 300 greatly improves the structural reliability of confining the transmission cable 100 in the wiring groove 230, and avoids the situation that the solder 300 is not strong, the reliability is poor, and the environment and external force are easily loosened.
  • the intermodulation index can be greatly improved, the stability of the electrical performance can be improved, and the safety hazard can be reduced, which is suitable for popularization and application in the field of communication base station antenna technology.
  • the potting compound 400 Since the transmission cable 100 is usually peeled off from the package wall 210 forming the wiring groove 230 by external soldering or pulling force, and the connection between the transmission cable 100 and the cavity 200 is loosened, the potting compound 400 is soldered.
  • the cover sealing of 300 or the sealing of the solder 300 and the exposed transmission cable 100 can prevent the transmission cable 100 from being loosened after the contact is fixed.
  • the potting compound 400 covers the entire exposed solder 300 and the transmission cable 100, so that the transmission cable 100 can also be better protected.
  • the exposed transmission cable 100 and the exposed solder 300 refer to corresponding surfaces of the notch end of the wiring groove 230. In actual production, the solder 300 tends to cover the periphery of the transmission cable 100. In this case, it should be understood that the potting compound 400 completely covers and contacts the exposed solder 300 near the notch end of the wiring groove 230. Fixed without contact with the transmission cable 100.
  • the wiring trench 230 may have a "U" shape, a semicircular shape, an "L” shape, or other desired shape. Specifically, in the embodiment, the wiring groove 230 is protruded from the cavity 200 in a substantially U shape.
  • the potting compound 400 described above may be a conventional glass glue or other material suitable for use in a radio frequency device.
  • the structure can utilize the intermediate groove 240 to limit the sealing of the potting compound 400; on the other hand, the potting compound 400 can form an interconnection structure between the intermediate groove 240 and the solder 300 without increasing irrigation.
  • the overall structure strength can be better under the premise of the complexity of the molding process of the sealant 400; therefore, such a structure can further improve the structural stability and reliability between the transmission cable 100 and the package wall 210.
  • such a structure can also utilize the cladding layer to keep the transmission cables 100 in the two wiring slots 230 isolated from each other at all times, and the RF device as a whole is compact.
  • the anti-detachment stopper is disposed opposite to the groove bottom of the wiring groove 230 and extends inward along the groove side wall of the wiring groove 230.
  • the limiting arm 211 mainly functions as a longitudinal limit for the potting compound 400, the solder 300 and the transmission cable 100.
  • the slot side wall of the wiring slot 230 can laterally limit the transmission cable 100, thereby simplifying The purpose of the anti-offset.
  • the limit stop arm 211 and the package wall 210 are integrally formed by pultrusion or die casting to simplify the manufacturing process and facilitate mass production.
  • a limiting structure for interconnecting the solder 300 and the package wall 210 is further disposed in the wiring trench 230.
  • the limiting structure serves as a medium for interconnecting the solder 300 and the package wall 210.
  • the solder 300 itself is relatively simple, that is, the limiting structure includes a solder-receiving space 231 recessed in the wiring trench 230, and/ Or, at least a protrusion (not shown) protruding from the groove side wall of the wiring groove 230 is protruded.
  • the arrangement of the tin-filled space 231 allows a portion of the solder 300 to enter the solder-filled space 231 during soldering, so that after the solder 300 is cured, the portion of the solder 300 is trapped in the solder-filled space 231 and encapsulated with the solder-filled space 231.
  • the wall 210 is fixedly connected and is not easily peeled off from the wiring groove 230, which greatly improves the robustness and reliability of the solder joint.
  • the above-described tin-filled space 231 is preferably disposed uniformly or discretely within the wiring trench 230, and is also preferably disposed at the intersection of the trench sidewalls of the wiring trench 230 and the trench bottom wall. When the groove width of the wiring groove 230 is large, the protrusion portion may be provided to achieve the purpose of stopping the solder 300, and at the same time, the purpose of reducing the solder 300 material is achieved.
  • solder 300 refers to the solder after curing.
  • the cavity 200 has a substantially rectangular parallelepiped shape, and has a four-faced package wall 210 at the periphery thereof, and at least one end surface of the two end faces in the longitudinal direction is not provided with the package wall 210 to reserve an opening, and the cavity 200
  • the cavity 220 is formed inside, and the RF circuit 500 is locked in the cavity 220.
  • the RF circuit 500 includes but is not limited to a phase shifter circuit, a filter circuit, a power divider circuit, a coupler circuit, a duplexer circuit, and a combined circuit. At least one of a circuit and a bridge circuit.
  • the wiring trench 230 is disposed at least outside the one package wall 210, and the trench sidewall of the wiring trench 230 is formed by extending outwardly from any of the package walls 210.
  • the trench bottom wall of the wiring trench 230 is surrounded by four sides of the package wall 210. Any one of them is available.
  • At least one through hole penetrating into the cavity 200 is provided on the wiring groove 230 according to the requirement of the lead of the RF circuit 500.
  • the transmission cable 100 is connected to the RF circuit 500 after passing through the through hole.
  • the cavity 200 is made of metal, and the aperture of the through hole is also sized to allow the medium of the transmission cable 100 to pass through, thereby insulating the cavity 200 from the inner conductor of the transmission cable 100.

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明公开了一种腔体射频器件，包括具有多个封装壁的腔体，所述腔体外设有由所述封装壁界定并用于安装传输电缆的布线槽，所述传输电缆的外导体通过焊锡与所述布线槽固定连接，所述布线槽内还成型有覆盖所述焊锡的灌封胶，所述封装壁上设有用于限制所述灌封胶的防脱限位件。该腔体射频器件，在利用焊锡将传输电缆固定于布线槽内的基础上，通过在腔体外设置灌封胶和防脱限位件，能够在防止焊锡氧化的同时起到大幅提高将传输电缆约束在布线槽内的结构可靠性的双重效果，避免了焊锡不牢固、可靠性差及受环境、外力等因素易松脱的情况，在长期使用过程中能提升互调指标，改善电气性能的稳定性，降低安全隐患，适合在通信基站天线技术领域推广应用。

Description

腔体射频器件 技术领域
本发明涉及通信基站天线技术领域，尤其涉及一种腔体射频器件。
背景技术
射频器件在通信基站天线技术领域中应用广泛，其性能的优劣能够影响到整个网络覆盖的质量。
目前，为了实现射频器件中传输电缆与腔体之间的安装固定，较好的方式是在腔体上设置布线槽，并通过焊锡将传输电缆固定在经过覆铜或覆铜锡表面处理的布线槽中。然而，申请人在长期生产应用中发现，采用上述结构的射频器件在使用过程中存在以下弊端：
1.焊锡易氧化；
2.传输电缆易受环境或外力影响而携带焊锡脱离布线槽；
3.射频器件在长时间工作后传输电缆和布线槽的部分焊锡连接处容易出现松动或处于“虚脱”状态，从而导致电气连接出现异常；
这些均容易造成电气性能指标出现不稳定，尤其是无源互调指标出现恶化的情况，存在较大的安全隐患。
发明内容
基于此，本发明提供了一种腔体射频器件，旨在通过防止焊锡氧化并提高传输电缆与布线槽之间连接结构可靠性，从而改善互调指标，提高整体电气性能指标的稳定性。
为了实现上述目的，本发明采用的技术方案如下：
腔体射频器件，包括具有多个封装壁的腔体，所述腔体外设有由所述封装壁界定并用于安装传输电缆的布线槽，所述传输电缆的外导体通过焊锡与所述布线槽固定连接，所述布线槽内还成型有覆盖所述焊锡的灌封胶，所述封装壁上设有用于限制所述灌封胶的防脱限位件。
进一步的，至少包括两个间隔设置的所述布线槽，两个所述布线槽之间形成中间槽，所述灌封胶在所述中间槽内、所述封装壁及所述焊锡上一体成型。
进一步的，所述防脱限位结构为与所述布线槽的槽底相对而置并沿所述布线槽的槽侧壁朝内弯折延伸的一对限位挡臂。
进一步的，所述限位挡臂与所述封装壁通过拉挤或压铸一体成型。
进一步的，所述布线槽内还设有能使所述焊锡与所述封装壁之间交叉互连的限位结构。
进一步的，所述限位结构包括凹设于所述布线槽内的容锡空间，和/或，至少凸设于所述布线槽的槽侧壁上的突起部。
进一步的，所述布线槽设有至少一个贯通至所述腔体内的通孔。
进一步的，所述腔体内设有射频电路；所述射频电路包括移相器电路、滤波器电路、功分器电路、耦合器电路、双工器电路、合路器电路及电桥电路中的至少一种。
与现有技术相比，本发明具备如下优点：
本发明的腔体射频器件，结构简单，在利用焊锡将传输电缆固定于布线槽内的基础上，通过在腔体外设置灌封胶和防脱限位件，能够在防止焊锡氧化的同时起到大幅提高将传输电缆约束在布线槽内的结构可靠性的双重效果，避免了焊锡不牢固、可靠性差及受环境、外力等因素易松脱的情况，在腔体射频器 件的长期使用过程中能极大的提升互调指标，改善电气性能的稳定性，降低安全隐患，适合在通信基站天线技术领域推广应用。
附图说明
图1为本发明实施例提供的腔体射频器件的第一种结构示意图；
图2为本发明实施例提供的腔体射频器件的第二种结构示意图；
图3为本发明实施例提供的腔体射频器件的第三种结构示意图。
附图标号说明：
100：传输电缆；200：腔体；210：封装壁；220：空腔；230：布线槽；211：限位挡臂；231：容锡空间；240：中间槽；300：焊锡；400：灌封胶；500：射频电路。
具体实施方式
为使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施方式，对本发明进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本发明，并不限定本发明的保护范围。
需要说明的是，当元件被称为“固设于”、“设置于”或“安设于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件；一个元件与另一个元件固定连接的具体方式可以通过现有技术实现，在此不再赘述，优选采用螺纹连接的固定方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术 语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本发明中“第一”、“第二”不代表具体的数量及顺序，仅仅是用于名称的区分。
如图1至图3所示，本实施例提供的腔体200射频器件，包括具有多个封装壁210的腔体200，腔体200外设有由封装壁210界定并用于安装传输电缆100的布线槽230，传输电缆100的外导体通过焊锡300与布线槽230固定连接，布线槽230内还成型有覆盖焊锡300的灌封胶400，封装壁210上设有用于限制灌封胶400的防脱限位件。
该腔体200射频器件，结构简单，在利用焊锡300将传输电缆100固定于布线槽230内的基础上，通过在腔体200外设置灌封胶400和防脱限位件，能够在防止焊锡300氧化的同时起到大幅提高将传输电缆100约束在布线槽230内的结构可靠性的双重效果，避免了焊锡300不牢固、可靠性差及受环境、外力等因素易松脱的情况，在腔体200射频器件的长期使用过程中能极大的提升互调指标，改善电气性能的稳定性，降低安全隐患，适合在通信基站天线技术领域推广应用。
由于传输电缆100通常是在外部震动或拉力作用下携带焊锡300从形成布线槽230的封装壁210剥离脱落而导致传输电缆100与腔体200之间发生松动，故灌封胶400无论是对焊锡300进行覆盖密封还是对焊锡300及外露的传输电缆100均进行覆盖密封，都能在接触固定后达到防止传输电缆100松脱的作用。当然，能为优选的是灌封胶400覆盖于整个外露的焊锡300和传输电缆100，这样对传输电缆100也能起到较好的保护作用。需要说明的是，上述外露的传输电缆100及外露的焊锡300指的是靠近布线槽230的槽口端的相应表面。在实 际生产中，焊锡300往往会覆盖传输电缆100的四周，在这种情况下，应当理解的是，上述灌封胶400对靠近布线槽230的槽口端的外露焊锡300进行全面覆盖密封并接触固定，而不会与传输电缆100相接触。
上述布线槽230可以呈“U”形、半圆形、“L”形或其他所需形状。具体在本实施例中，布线槽230大致呈“U”形凸设于腔体200外。
上述灌封胶400可以采用常见的玻璃胶或其他适于在射频器件中应用的材料。
进一步的，在本实施例中，至少包括两个间隔设置的布线槽230，两个布线槽230之间形成中间槽240，灌封胶400在中间槽240内、封装壁210及焊锡300上一体成型。这样的结构一方面可以利用中间槽240对灌封胶400起到限位防松的作用；另一方面灌封胶400可以在中间槽240与焊锡300之间形成互连结构，在不增加灌封胶400成型工艺的复杂度的前提下能使整体结构强度较好；因此，这样的结构能进一步提高传输电缆100与封装壁210之间的结构稳固性和可靠性。此外，这样的结构还可以利用包覆层使两个布线槽230中的传输电缆100始终保持相互隔离，并且射频器件整体结构紧凑。
具体在本实施例中，为了简化加工制作步骤并提高整体结构的紧凑度，防脱限位件为与布线槽230的槽底相对而置并沿布线槽230的槽侧壁朝内弯折延伸的一对限位挡臂211。这样限位挡臂211主要对灌封胶400、焊锡300及传输电缆100起到纵向限位的作用，利用布线槽230的槽侧壁可对传输电缆100进行横向限位作用，从而能达到简化防脱限位件的目的。
进一步的，在本实施例中，限位挡臂211与封装壁210通过拉挤或压铸一体成型，以简化制作过程，并利于批量生产。
进一步的，布线槽230内还设有能使焊锡300与封装壁210之间交叉互连 的限位结构。限位结构作为使焊锡300与封装壁210之间交叉互连的介质，较为简单的是由焊锡300自身充当，即：限位结构包括凹设于布线槽230内的容锡空间231，和/或，至少凸设于布线槽230的槽侧壁上的突起部(未示出)。容锡空间231的设置可使焊接时部分焊锡300能进入该容锡空间231，进而在焊锡300固化后使得该部分焊锡300会被卡在容锡空间231内并与形成容锡空间231的封装壁210固定连接而不易从布线槽230中剥离脱落，极大的提高了焊点的牢固性和可靠性。上述容锡空间231优选在布线槽230内均匀或离散设置，还优选设置在布线槽230的槽侧壁与槽底壁的交汇处。在布线槽230的槽宽较大时，也可以通过设置突起部以达到止挡焊锡300的目的，同时达到减小焊锡300用料的目的。
应当理解的是，上述焊锡300指的是焊接固化后的锡料。
具体在本实施例中，腔体200大致呈长方体形，并且其外围具有四个面的封装壁210，其纵长方向两个端面至少一端面未设封装壁210以预留开口，腔体200内部形成空腔220，射频电路500卡设于空腔220中，上述射频电路500包括但不限于移相器电路、滤波器电路、功分器电路、耦合器电路、双工器电路、合路器电路及电桥电路中的至少一种。上述布线槽230至少在一个封装壁210外侧设置，且布线槽230的槽侧壁是由任一封装壁210朝外凸设延伸形成，布线槽230的槽底壁由四个面的封装壁210的任意一个提供。布线槽230上根据射频电路500引线的需要设有至少一个贯通至腔体200内的通孔，传输电缆100穿过该通孔后与射频电路500相连。腔体200的材质为金属，通孔的孔径大小还应设置成允许传输电缆100的介质穿过，从而使腔体200与传输电缆100的内导体绝缘。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述 实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (8)

  1. 腔体射频器件，其特征在于：包括具有多个封装壁的腔体，所述腔体外设有由所述封装壁界定并用于安装传输电缆的布线槽，所述传输电缆的外导体通过焊锡与所述布线槽固定连接，所述布线槽内还成型有覆盖所述焊锡的灌封胶，所述封装壁上设有用于限制所述灌封胶的防脱限位件。
  2. 如权利要求1所述的腔体射频器件，其特征在于：至少包括两个间隔设置的所述布线槽，两个所述布线槽之间形成中间槽，所述灌封胶在所述中间槽内、所述封装壁及所述焊锡上一体成型。
  3. 如权利要求1所述的腔体射频器件，其特征在于：所述防脱限位结构为与所述布线槽的槽底相对而置并沿所述布线槽的槽侧壁朝内弯折延伸的一对限位挡臂。
  4. 如权利要求3所述的腔体射频器件，其特征在于：所述限位挡臂与所述封装壁通过拉挤或压铸一体成型。
  5. 如权利要求1所述的腔体射频器件，其特征在于：所述布线槽内还设有能使所述焊锡与所述封装壁之间交叉互连的限位结构。
  6. 如权利要求5所述的腔体射频器件，其特征在于：所述限位结构包括凹设于所述布线槽内的容锡空间，和/或，至少凸设于所述布线槽的槽侧壁上的突起部。
  7. 如权利要求1所述的腔体射频器件，其特征在于：所述布线槽设有至少一个贯通至所述腔体内的通孔。
  8. 如权利要求1至7中任一项所述的腔体射频器件，其特征在于：所述腔体内设有射频电路；所述射频电路包括移相器电路、滤波器电路、功分器电路、耦合器电路、双工器电路、合路器电路及电桥电路中的至少一种。
PCT/CN2017/119478 2017-05-17 2017-12-28 腔体射频器件 WO2018209963A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710346397.3A CN107146927A (zh) 2017-05-17 2017-05-17 腔体射频器件
CN201710346397.3 2017-05-17

Publications (1)

Publication Number Publication Date
WO2018209963A1 true WO2018209963A1 (zh) 2018-11-22

Family

ID=59777619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/119478 WO2018209963A1 (zh) 2017-05-17 2017-12-28 腔体射频器件

Country Status (2)

Country Link
CN (1) CN107146927A (zh)
WO (1) WO2018209963A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107146927A (zh) * 2017-05-17 2017-09-08 京信通信系统（中国）有限公司 腔体射频器件
CN109904597B (zh) 2017-12-11 2020-12-08 华为技术有限公司 一种馈电设备、天线及电子设备
CN112436243A (zh) * 2019-08-26 2021-03-02 广东博纬通信科技有限公司 一种腔体式移相器
CN110661102B (zh) * 2019-09-29 2021-05-07 华南理工大学 移相装置及基站天线
CN111584983B (zh) * 2020-06-09 2021-07-13 中国电子科技集团公司第十四研究所 一种多层结构的滤波耦合组件

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319885A (zh) * 2000-03-24 2001-10-31 松下电器产业株式会社 固定夹具、配线基板和电子零部件组装体及其制造方法
CN1595734A (zh) * 2004-07-07 2005-03-16 万海潮 平面换向器的制造方法及其产品
CN102683990A (zh) * 2011-03-16 2012-09-19 株式会社捷太格特 电子单元的防水结构
CN104037475A (zh) * 2014-01-28 2014-09-10 京信通信技术(广州)有限公司 腔体式微波器件
WO2015123863A1 (en) * 2014-02-21 2015-08-27 Sumitomo Electric Industries, Ltd. Wiring member and manufacturing method thereof
WO2017043663A1 (ja) * 2015-09-11 2017-03-16 株式会社フジクラ アンテナ装置
CN107146927A (zh) * 2017-05-17 2017-09-08 京信通信系统（中国）有限公司 腔体射频器件
CN206806472U (zh) * 2017-05-17 2017-12-26 京信通信系统（中国）有限公司 腔体射频器件

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319885A (zh) * 2000-03-24 2001-10-31 松下电器产业株式会社 固定夹具、配线基板和电子零部件组装体及其制造方法
CN1595734A (zh) * 2004-07-07 2005-03-16 万海潮 平面换向器的制造方法及其产品
CN102683990A (zh) * 2011-03-16 2012-09-19 株式会社捷太格特 电子单元的防水结构
CN104037475A (zh) * 2014-01-28 2014-09-10 京信通信技术(广州)有限公司 腔体式微波器件
WO2015123863A1 (en) * 2014-02-21 2015-08-27 Sumitomo Electric Industries, Ltd. Wiring member and manufacturing method thereof
WO2017043663A1 (ja) * 2015-09-11 2017-03-16 株式会社フジクラ アンテナ装置
CN107146927A (zh) * 2017-05-17 2017-09-08 京信通信系统（中国）有限公司 腔体射频器件
CN206806472U (zh) * 2017-05-17 2017-12-26 京信通信系统（中国）有限公司 腔体射频器件

Also Published As

Publication number Publication date
CN107146927A (zh) 2017-09-08

Similar Documents

Publication Publication Date Title
WO2018209963A1 (zh) 腔体射频器件
CN104396006B (zh) 半导体元件收纳用封装件以及半导体装置
CN206864596U (zh) 一种毫米波差分微带线到矩形波导的过渡结构
WO2019085557A1 (zh) 移相器
US20180076509A1 (en) Antenna feeder configured for feeding an antenna integrated within an electronic device
KR20170047890A (ko) 동축 케이블용 동축 커넥터
CN202616554U (zh) 一种射频同轴连接器
JP2008060042A (ja) 高周波モジュール
CN107154808B (zh) 射频器件的封装结构及射频器件
US10644373B2 (en) Ridge waveguide to a partial H-plane waveguide transition
CN206806472U (zh) 腔体射频器件
WO2020088327A1 (zh) 一种平衡-不平衡变换装置、通信器件及通信系统
CN107004934B (zh) 腔体滤波器、连接器、双工器以及射频拉远设备
CN204230398U (zh) 高频信号传输线路以及电子设备
CN115207589A (zh) 耦合装置及制造方法、波导天线、雷达、终端、pcb
CN106972230A (zh) 一种高稳定性低互调衰减器
CN206948293U (zh) 射频器件的封装结构及射频器件
KR101778303B1 (ko) 고속 신호 전송을 위한 ｔｏ－ｃａｎ(티오-캔) 구조의 광모듈
CN205960175U (zh) 一种新型高互调电桥耦合器
EP0142602B1 (en) Microwave coupler
US8319586B2 (en) Integrated circuit
US9467194B2 (en) High frequency circuit device
CN213660741U (zh) 一种气密型射频同轴连接器
CN114039183B (zh) 共面波导-矩形波导转换器
CN207441935U (zh) 一种低互调微带线功率分配器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17910320

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 08/05/2020)

122 Ep: pct application non-entry in european phase

Ref document number: 17910320

Country of ref document: EP

Kind code of ref document: A1