WO2018196135A1 - 电子调速器及无人机 - Google Patents

电子调速器及无人机 Download PDF

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Publication number
WO2018196135A1
WO2018196135A1 PCT/CN2017/089241 CN2017089241W WO2018196135A1 WO 2018196135 A1 WO2018196135 A1 WO 2018196135A1 CN 2017089241 W CN2017089241 W CN 2017089241W WO 2018196135 A1 WO2018196135 A1 WO 2018196135A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
electronic governor
circuit board
accommodating groove
accommodating
Prior art date
Application number
PCT/CN2017/089241
Other languages
English (en)
French (fr)
Inventor
肖乐
刘炜刚
蓝求
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201780065387.0A priority Critical patent/CN109892026B/zh
Priority to CN202210358410.8A priority patent/CN114628147A/zh
Publication of WO2018196135A1 publication Critical patent/WO2018196135A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D27/00—Arrangement or mounting of power plants in aircraft; Aircraft characterised by the type or position of power plants
    • B64D27/02—Aircraft characterised by the type or position of power plants
    • B64D27/24—Aircraft characterised by the type or position of power plants using steam or spring force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D47/00—Equipment not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the technology of drones, in particular to an electronic governor and a drone.
  • the electronic governor is one of the important components in the drone, which is used to control the rotation of the motor in the drone to enable the start and stop of the drone and speed regulation.
  • the electronic governor includes a control circuit board, and the control circuit board is provided with electronic components such as capacitors and MOS tubes, which are easy to generate heat, especially when the capacitor is subjected to large ripple current, a large amount of heat is generated, so that the temperature of the capacitor is too high.
  • the risk of failure In the prior art, the capacitor is usually exposed directly in the air, and the capacitor is used to dissipate heat by using air convection, and the heat dissipation effect is poor; or the thermal conductive silica gel is applied on the control circuit board, and the capacitor is cooled by the contact between the thermal conductive silica gel and the capacitor.
  • the present invention provides an electronic governor and a drone, which can increase the contact area between the capacitor and the metal casing, and improve the heat conduction efficiency between the capacitor and the metal casing, and is effective. Improve the heat dissipation effect of the capacitor and reduce the risk of high temperature failure of the capacitor.
  • a first aspect of the invention provides an electronic governor comprising:
  • a first circuit board for carrying the capacitor and electrically connected to the capacitor
  • a metal housing for receiving the first circuit board
  • the inner surface of the metal casing is provided with at least one accommodating groove, and the capacitor is at least partially received in the accommodating groove to dissipate the capacitor through the metal casing.
  • the capacitor is disposed flat in the accommodating groove.
  • the accommodating groove faces the groove wall of the capacitor and includes a contact surface that contacts the cylindrical surface of the capacitor.
  • the contact surface includes a curved surface that is adapted to the cylindrical surface of the capacitor.
  • a heat conducting medium is disposed between the contact surface and the cylindrical surface of the capacitor;
  • the heat conductive medium is a liquid or paste heat conductive medium, and after drying, a heat conductive layer is formed.
  • the sidewall of the accommodating groove facing the capacitor includes a curved surface in contact with the capacitor, and a plane of the curved surface and the bottom wall.
  • a heat conductive medium is filled between the curved surface and the capacitor, and between the plane and the capacitor;
  • the heat conductive medium is a liquid or paste heat conductive medium, and after drying, a heat conductive layer is formed.
  • a gap is formed between the accommodating groove and the capacitor.
  • a gap between the capacitor slot and the capacitor is filled with a heat conductive medium
  • the heat conductive medium comprises at least one of the following: a thermal grease, a thermal silica gel, an anodized film, and a phase change heat transfer medium.
  • the accommodating groove includes a first accommodating space formed by the metal casing being recessed downward.
  • the bottom wall of the metal casing is provided with a boss, and the accommodating groove includes a second accommodating space formed between two adjacent bosses.
  • boss is a metal bump.
  • boss is integrally provided with the metal casing.
  • the accommodating groove further includes a first accommodating space formed by the metal housing being recessed downward, the first accommodating space is disposed in communication with the second accommodating space, and the second accommodating space The space is located above the first accommodating space.
  • the metal casing includes a bottom wall and a side wall disposed at an edge of the bottom wall and extending upward, and the first end surface of the capacitor is in contact with a sidewall of the lower metal casing.
  • a mounting groove for mounting a temperature sensor is disposed on the metal housing, and a second end surface of the capacitor is used to contact the temperature sensor.
  • the accommodating groove includes a first sidewall contacting the cylindrical surface of the capacitor, and a second sidewall contacting the second end surface of the capacitor, the first sidewall and the second sidewall There is a preset distance between the side walls.
  • the electronic governor includes:
  • At least two capacitors At least two capacitors, the number of the receiving slots being the same as the number of the capacitors.
  • At least two of the accommodating grooves communicate with each other.
  • the metal housing includes an upper metal housing and a lower metal housing, the upper metal housing is disposed opposite to the lower metal to form a cavity, and the first circuit board is disposed in the cavity Inside.
  • the electronic governor further includes:
  • a second circuit board disposed in the metal housing, disposed on the first circuit board side to press the capacitor in the receiving slot through the second circuit board; wherein An MCU is provided on the second circuit board.
  • Another aspect of the present invention provides a drone comprising:
  • Flight controller set on the fuselage
  • a motor electrically coupled to the electronic governor to cause the electronic governor to control the rotation of the motor based on a throttle control signal sent by the flight controller;
  • a propeller is coupled to the motor to cause the motor to drive the propeller to rotate under control of the electronic governor to provide flight propulsion.
  • the electronic governor and the unmanned aerial vehicle provided by the invention can be arranged in the accommodating groove by arranging a accommodating groove on the inner surface of the metal casing of the electronic governor, thereby effectively increasing the capacitance and the metal casing
  • the contact area improves the heat transfer efficiency between the capacitor and the metal case, improves the heat dissipation effect on the capacitor, and reduces the risk of high temperature failure of the capacitor.
  • FIG. 1 is a schematic structural view 1 of a first embodiment of an electronic governor according to the present invention.
  • FIG. 2 is a schematic structural view 2 of the first embodiment of the electronic governor of the present invention.
  • Figure 3 is a partial enlarged view of Figure 2;
  • FIG. 4 is a schematic structural view 1 of the seventh embodiment of the electronic governor of the present invention.
  • Figure 5 is a second schematic structural view of the seventh embodiment of the electronic governor of the present invention.
  • Figure 6 is a schematic structural view 1 of the eleventh embodiment of the electronic governor of the present invention.
  • Figure 7 is a second schematic structural view of the eleventh embodiment of the electronic governor of the present invention.
  • Figure 9 is a cross-sectional view taken along line A-A of Figure 8.
  • Figure 10 is a schematic view showing the connection of the flight controller, the electronic governor and the motor in the unmanned aerial vehicle of the present invention.
  • 1000-electronic governor 1110-first circuit board; 1111-capacitor; 1120-second circuit board; 1200-metal housing; 1201-capacity slot; 1202-projection; 1203-avoidance slot; - mounting groove; 1201a-curved surface; 1201b-plane; 1201c-first side wall; 1201d-second side wall; 2000-flight controller; 3000-motor.
  • first and second are used merely to facilitate the description of different components, and are not to be construed as indicating or implying a sequence relationship, relative importance or implicit indication.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • FIG. 1 is a schematic structural view 1 of a first embodiment of an electronic governor according to the present invention.
  • FIG. 2 is a schematic structural view 2 of the first embodiment of the electronic governor of the present invention.
  • an electronic governor 1000 including:
  • a first circuit board 1110 for carrying the capacitor 1111 and electrically connected to the capacitor 1111;
  • the inner surface of the metal casing 1200 is provided with at least one accommodating groove 1201.
  • the capacitor 1111 is at least partially received in the accommodating groove 1201 to dissipate the capacitor 1111 through the metal casing 1200.
  • the capacitor 1111 is usually disposed at the junction of the electronic governor 1000 and the power source to ensure smoothness of the input voltage.
  • the input end and the output end of the capacitor 1111 are electrically connected to the first circuit board 1110, and the capacitor 1111 can also be fixed on the first circuit board 1110 by means of clamping, bonding, etc., so that the capacitor 1111 and the first circuit board 1110 The electrical connection between them is more reliable.
  • the metal housing 1200 can form a receiving space for receiving the first circuit board 1110.
  • the first circuit board 1110 is disposed in the receiving space.
  • At least one receiving groove 1201 is formed on the inner surface of the metal housing 1200. Part or all of the capacitor 1201 is received in the accommodating groove 1201, and the capacitor 1111 transfers the generated heat to the metal casing 1200 to reduce the heat of the capacitor 1111 itself.
  • the accommodating slot 1201 accommodates all of the capacitors 1111, an opening is required to be formed in the accommodating slot 1201, so that the capacitor 1111 can enter the accommodating slot 1201, and a through hole is required in the accommodating slot 1201.
  • the input end and the output end of the capacitor 1111 can be electrically connected to the first circuit board 1110.
  • the capacitor 1111 can be electrically connected only to the first circuit board 1110.
  • the input end and the output end of the capacitor 1111 can also be electrically connected to the first circuit board 1110 through the inlet of the receiving slot 1201.
  • the specific structure of the accommodating slot 1201 is not limited in this embodiment, and those skilled in the art can perform the setting according to actual needs, as long as the function of accommodating and supporting the capacitor 1111 can be realized.
  • the accommodating slots 1201 for accommodating the capacitors 1111 are spaced apart so as to have a heat dissipation structure between the two adjacent capacitors 1111, thereby further improving the heat dissipation effect. .
  • the metal casing 1200 can be made of a common metal material, preferably a metal material having a high thermal conductivity, such as a copper alloy, an aluminum alloy, or the like. Since the thermal conductivity of the metal is higher than the thermal conductivity of the thermal conductive medium such as silica gel, and the price is relatively low compared to the silica gel, the electrons provided in the embodiment are compared with the filling of the silica gel between the capacitor 1111 and the existing metal casing 1200.
  • the governor has better heat dissipation, lower cost and lower weight.
  • the electronic governor 1000 of the present embodiment is configured to receive the capacitor 1111 in the accommodating groove 1201 by providing the accommodating groove 1201 on the inner surface of the metal casing 1200, thereby effectively increasing the capacitance 1111 and the metal casing 1200.
  • Contact area to improve heat conduction between capacitor 1111 and metal housing 1200 Efficiency, improve the heat dissipation effect on the capacitor 1111, and reduce the risk of high temperature failure of the capacitor 1111.
  • the capacitor 1111 is disposed in the accommodating groove 1201.
  • the axial direction of the capacitor 1111 is parallel to the bottom wall of the metal casing 1200.
  • the length of the capacitor 1111 in the axial direction of the capacitor 1111 can be equal to the axial height of the capacitor 1111, so that the receiving slot 1201 can accommodate the capacitor 1111. More of the portion, so that the capacitor 1111 and the metal housing 1200 have a larger contact area, further improving the heat dissipation effect on the capacitor 1111.
  • the capacitor 1111 is disposed in the accommodating slot 1201, and the capacitor 1111 is circumferentially positioned through the accommodating slot 1201 to prevent the capacitor 1111 from shaking left and right, so that the capacitor 1111 and the first circuit board 1110 are
  • the electrical connection is more reliable; in addition, the arrangement can greatly increase the contact area between the capacitor 1111 and the receiving slot 1201, and improve the heat dissipation effect on the capacitor 1111.
  • the groove wall of the receiving groove 1201 facing the capacitor 1111 includes a contact surface that contacts the cylindrical surface of the capacitor 1111.
  • the contact surface includes a curved surface matching the cylindrical surface of the capacitor 1111, so that the capacitor 1111 is in stereo contact with the accommodating groove 1201 and closely fits, thereby providing a larger contact area between the capacitor 1111 and the metal casing 1200.
  • the capacitor 1111 since the capacitor 1111 has a cylindrical shape, the space formed by the receiving groove 1201 is also cylindrical, and the diameter of the cylindrical space is adapted to the diameter of the capacitor 1111.
  • a heat conductive medium may be filled between the contact surface and the cylinder of the capacitor 1111; wherein the heat conductive medium is a liquid or a paste A heat transfer medium that forms a heat conductive layer after drying.
  • a heat conductive medium is filled between the capacitor 1111 and the contact surface.
  • the heat conductive medium may be in a liquid or paste form, and has a certain fluidity so that the heat conductive medium can be filled with a capacitor.
  • the gap between the 1111 and the contact surface; after a certain time, the liquid or paste-like heat conductive medium is dry to form a heat conductive layer, which can transfer the heat of the capacitor 1111 to the metal case 1200 more quickly, and can better position the capacitor 1111.
  • the capacitor 1111 is prevented from shaking, and the electrical connection between the capacitor 1111 and the first circuit board 1110 is ensured to be reliable.
  • Fig. 3 is a partially enlarged schematic view of Fig. 2;
  • the sidewall of the receiving slot 1201 facing the capacitor 1111 includes a curved surface 1201 a that is in contact with the capacitor 1111 , and a curved surface 1201 a and a plane 1201 b of the bottom wall.
  • the accommodating groove 1201 may include two oppositely disposed side walls, and a bottom wall connected between the two side walls; the side wall includes a curved surface 1201a contacting the cylindrical surface of the capacitor 1111, and the connecting curved surface 1201a and The plane 1201b of the bottom wall.
  • the accommodating groove 1201 provided in this embodiment is convenient for processing and manufacturing, can simplify the processing process of the accommodating groove 1201, improve the processing efficiency of the accommodating groove 1201, thereby further reducing the processing cost of the electronic governor 1000, and
  • the curved surface 1201a of the 1111 cylinder contact also increases the contact area of the capacitor 1111 with the metal casing 1200.
  • a heat conductive medium is filled between the curved surface 1201a and the capacitor 1111, between the plane 1201b and the capacitor 1111; wherein the heat conductive medium is a liquid or paste heat conductive medium, and after drying, a heat conductive layer is formed.
  • the description of the heat-conducting medium can be similar to that of the foregoing embodiment 3, and is not described herein again. It should be noted that in the embodiment, the heat-conducting medium fills the gap between the curved surface 1201a and the capacitor 1111, and between the plane 1201b and the capacitor 1111.
  • the size of the accommodating groove 1201 needs to be properly set so that the space between the two contact faces can be slightly larger than the capacitance 1111. There is a certain gap between the contact surface and the cylinder of the capacitor 1111, so that the accommodating groove 1201 can be adapted to accommodate more capacitors 1111, and the accommodating groove 1201, that is, the metal casing 1200 to the capacitor 1111 is improved. Scope of application.
  • the specific size of the accommodating slot 1201 and the gap between the accommodating slot 1201 and the capacitor 1111 are not specifically limited in this embodiment, and those skilled in the art may specifically set according to the size of the capacitor 1111.
  • a heat conductive medium is filled between the contact surface and the cylinder surface of the capacitor 1111; wherein the heat conductive medium is a liquid or paste heat conductive medium, and the heat conductive layer is formed after drying.
  • the heat conductive medium may include at least one of the following: a thermal conductive silicone grease, a thermal conductive silicone, an anodized film, and a phase change heat conductive medium.
  • the same or different heat transfer medium can be used between the different accommodating grooves 1201 and the capacitor 1111 accommodated therein.
  • the heat conductive medium is injected into the accommodating groove 1201.
  • the heat conductive medium may be liquid or paste, and has a certain fluidity, so that the heat conductive medium can be filled with the capacitor 1111 and Between the slots 1201; the liquid after a certain time Or the paste-shaped heat conductive medium is dry to form a heat conductive layer, and the capacitor 1111 is connected to the groove wall of the accommodating groove 1201, so that the heat of the capacitor 1111 can be transmitted to the metal case 1200 more quickly, and the capacitor 1111 can be better positioned.
  • the capacitor 1111 is prevented from shaking, and the electrical connection between the capacitor 1111 and the first circuit board 1110 is ensured to be reliable.
  • the accommodating groove 1201 includes a first accommodating space formed by the metal housing 1200 being recessed downward.
  • the metal housing 1200 can have a certain thickness, and the metal housing 1200 can be recessed downward to form a first accommodating space, and the capacitor 1111 is received in the first accommodating space.
  • the structure of the accommodating slot 1201 is not limited.
  • the accommodating slot 1201 can be configured to form the first accommodating space of the accommodating capacitor 1111.
  • the accommodating slot 1201 can be configured.
  • the groove 1201 may form a first accommodating space having a rectangular, trapezoidal, and circular arc shape in cross section.
  • FIG. 4 is a schematic structural view 1 of the seventh embodiment of the electronic governor of the present invention.
  • FIG. 5 is a second schematic structural diagram of Embodiment 7 of the electronic governor of the present invention.
  • the bottom wall of the metal casing 1200 is provided with a boss 1202.
  • the boss 1202 can be disposed near the end of the metal housing 1200.
  • the boss 1202 has a predetermined height and can be opened in the receiving slot 1201 on the boss 1202.
  • the upper surface of the boss 1202 can be The lower surface of a circuit board 1110 is in contact to have a larger contact area between the capacitor 1111 and the accommodating groove 1201.
  • the accommodating groove 1201 may include a second accommodating space formed between two adjacent bosses 1202.
  • the electronic governor 1000 includes two capacitors 1111.
  • the metal housing 1200 may be provided with three bosses 1202.
  • the two bosses 1202 on both sides are connected to the side walls of the metal casing 1200 to be faster.
  • the heat of the capacitor 1111 is dissipated to the outside of the electronic governor 1000; the two bosses 1202 on the two sides respectively form a second accommodating space with the boss 1202 in the middle, and at this time, the boss 1202 provides the receiving space.
  • the side wall of the groove 1201, the bottom wall of the metal casing 1200 forms the bottom wall of the accommodating groove 1201.
  • the accommodating groove 1201 may further include a first accommodating space formed by the metal housing 1200 recessed downwardly, the first accommodating space is disposed in communication with the second accommodating space, and the second accommodating space is located Above the first accommodation space.
  • the bottom wall of the metal casing 1200 can be recessed downward to form a first accommodating space, so that the structure of the electronic governor 1000 is more compact, which helps to reduce the electronic governor. 1000 volume.
  • the metal housing 1200 is further provided with a escaping groove 1203 for providing sufficient installation space for other electrical components disposed in the metal housing 1200.
  • the boss 1202 may be a metal protrusion, and the metal protrusion material may be the same as the metal case 1200, so that the metal protrusion is integrally provided with the metal case 1200.
  • the metal casing 1200 includes a bottom wall and a side wall disposed at an edge of the bottom wall and extending upward, and the first end surface of the capacitor 1111 is in contact with the sidewall of the lower metal casing 1220 to further increase The contact area of the large capacitor 1111 with the metal casing 1200.
  • a mounting groove 1204 for mounting a temperature sensor may be disposed on the metal housing 1200 to detect the temperature of the capacitor 1111 in real time through a temperature sensor.
  • the mounting slot can be disposed adjacent to the accommodating slot 1201.
  • the mounting slot is disposed at the second end of the capacitor, and the mounting slot is disposed in communication with the accommodating slot 1201, so that the second end surface of the capacitor 1111 can be in contact with the temperature sensor, thereby The temperature detected by the temperature sensor is made more accurate.
  • the temperature sensor is connected to the microprogram controller MCU or other control component in the electronic governor 1000.
  • the temperature sensor is connected to the MCU as an example: the temperature sensor transmits the detected temperature to the MCU, and the MCU selects the temperature. Comparing with the preset first threshold, when the temperature reaches the preset first threshold, the MCU reports the situation to the flight controller, and the flight controller controls the drone to land or break the electronic governor 1000. Electrical treatment.
  • each capacitor 1111 can be correspondingly disposed with at least one temperature sensor to detect the temperature of the corresponding capacitor 1111 through the temperature sensor, and each temperature sensor is connected to the MCU. At this time, when the MCU determines that the temperature difference between the two capacitors 1111 reaches a preset state, At the second threshold, it is possible to quickly determine that at least one of the capacitors 1111 is abnormal.
  • the accommodating groove 1201 includes a first sidewall 1201c contacting the cylindrical surface of the capacitor 1111, and a second sidewall 1201d contacting the second end surface of the capacitor 1111, the first sidewall 1201c There is a predetermined distance from the second side wall 1201d, so that a escaping space for accommodating the end of the capacitor 1111 is disposed in the accommodating groove 1201.
  • the capacitor 1111 since most of the capacitors 1111 are not a standard cylindrical structure, a common electrolytic capacitor is taken as an example: the capacitor 1111 includes a columnar body, and the first end of the columnar body is in contact with the sidewall of the metal casing 1200, and the columnar body The second end of the column body is provided with a connecting end (pin or terminal, etc.) for connecting with the first circuit board 1110. The second end of the columnar body is disposed along the radial protruding columnar body of the columnar body. At this time, the avoidance space is used for The second end of the column body is received such that the capacitor 1111 better fits the receiving groove 1201.
  • the electronic governor 1000 includes: at least two capacitors 1111, and the number of the receiving slots 1201 is the same as the number of the capacitors 1111.
  • the at least two capacitors 1111 are spaced apart, and the corresponding accommodating slots 1201 are also spaced apart.
  • at least two accommodating grooves 1201 communicate with each other such that liquid or paste-like heat transfer medium between the accommodating grooves 1201 can circulate with each other.
  • at least one through hole may be opened in the groove wall between the slots of the two capacitors 1111. Based on the seventh embodiment, the gap between the first sidewall 1201c and the second sidewall 1201d can also achieve communication between the slots of two adjacent capacitors 1111.
  • Figure 6 is a schematic structural view 1 of the eleventh embodiment of the electronic governor of the present invention.
  • FIG. 7 is a second schematic structural view of the eleventh embodiment of the electronic governor of the present invention.
  • the metal housing 1200 includes an upper metal housing 1210 and a lower metal housing 1220.
  • the upper metal housing 1210 is disposed opposite to the lower metal to form a cavity.
  • the first circuit board 1110 is disposed within the cavity.
  • the upper metal housing 1210 can be detachably coupled to the lower metal housing 1220 to facilitate repair or replacement of electrical components disposed within the housing. Specifically, the upper metal housing 1210 can be snapped and/or screwed to the lower metal housing 1220.
  • the upper metal housing 1210 and/or the lower metal housing 1220 are further provided with lugs. For example, two ends of the lower metal housing 1220 are respectively provided with two ears for fixing the electronic governor 1000 through the lugs. On the fuselage.
  • the accommodating groove 1201 may be disposed on the upper metal casing 1210 and/or the lower metal casing 1220.
  • the upper metal housing 1210 and the lower metal housing 1220 may be provided with receiving slots 1201.
  • FIG. 8 is a schematic view showing the assembly of a first circuit board, a second circuit board, a capacitor, and a metal case in the electronic governor of the present invention
  • Fig. 9 is a cross-sectional view taken along line A-A of Fig. 8;
  • the electronic governor 1000 may further include:
  • the second circuit board 1120 is received in the metal housing 1200 and disposed on the upper side of the first circuit board 1110 to press the capacitor 1111 into the receiving slot 1201 through the second circuit board 1120.
  • the second circuit board 1120 There is an MCU on it.
  • an easily heat-generating electrical component such as a capacitor 1111, a MOS transistor, or the like may be disposed on the first circuit board 1110, and the MCU and the thermal element may be disposed on the second circuit board 1120 to reduce the capacitance 1111 and MOS.
  • the heat generated by the tube affects the MCU, the thermal element, and the like.
  • the first circuit board 1110 can include a first end that sets the capacitor 1111 and a second end that faces away from the capacitor 1111.
  • the second circuit board 1120 can be disposed above the first end of the first circuit board 1110, that is, the second circuit board 1120 can be disposed above the capacitor 1111 to press the capacitor 1111 through the second circuit board 1120.
  • the capacitor 1111 is more stably received in the receiving slot 1201.
  • the second circuit board 1120 may be disposed above the second end of the first circuit board 1110.
  • no other components are disposed between the capacitor 1111 and the upper metal case 1210 and the lower metal case 1220, and the upper metal case may be disposed.
  • Each of the body 1210 and the lower metal casing 1220 is provided with a receiving groove 1201, and the capacitor 1111 has a larger contact area with the metal casing 1200.
  • the metal housing 1200 is not limited to the metal housing 1200 of the electronic governor.
  • the capacitor 1111 is disposed and the capacitor 1111 is disposed in the space surrounded by the metal housing 1200, the above may be adopted.
  • the accommodating groove 1201 in each embodiment has dissipated heat from the capacitor 1111 through the metal case 1200.
  • Figure 10 is a schematic view showing the connection of the flight controller, the electronic governor and the motor in the unmanned aerial vehicle of the present invention.
  • the embodiment further provides a drone, including:
  • Flight controller 2000 disposed on the fuselage
  • An electronic governor 1000 communicatively coupled to the flight controller 2000;
  • the motor 3000 is electrically connected to the electronic governor 1000 to cause the electronic governor 1000 to control the rotation of the motor 3000 according to the throttle control signal sent by the flight controller 2000;
  • the propeller is coupled to the motor 3000 to cause the motor 3000 to drive the propeller to rotate under the control of the electronic governor 1000 to provide flight propulsion.
  • the electronic governor 1000 is the electronic governor 1000 in any of the foregoing embodiments, and its structure and function are similar to those of the foregoing embodiment, and details are not described herein again.
  • the body of the drone may include a center body and an arm disposed around the center body.
  • the end of the arm facing away from the center body may be provided with a mounting seat for mounting the motor 3000, and the electronic governor 1000 may be disposed in the center body.
  • the electronic governor 1000 may be disposed in the center body. Inside the cavity of the arm or on the mount.
  • the capacitor 1111 is received in the accommodating groove 1201 by providing the accommodating groove 1201 on the inner surface of the metal casing 1200 of the electronic governor 1000, thereby effectively increasing the capacitance 1111 and the metal.
  • the contact area of the housing 1200 increases the heat transfer efficiency between the capacitor 1111 and the metal housing 1200, improves the heat dissipation effect on the capacitor 1111, and reduces the risk of high temperature failure of the capacitor 1111.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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Abstract

一种电子调速器(1000)及无人机，涉及无人机技术。电子调速器(1000)包括：电容(1111)；第一电路板(1110)，用于承载电容(1111)，并且与电容(1111)电连接；以及金属壳体(1200)，用于收容第一电路板(1110)；其中，金属壳体(1200)的内表面设置有至少一个容置槽(1201)，电容(1111)至少部分容置在容置槽(1201)中，以通过金属壳体(1200)对电容(1111)进行散热。无人机包括：飞行控制器(2000)、电子调速器(1000)、电机(3000)，电子调速器(1000)用于根据飞行控制器(2000)发送的油门控制信号控制电机(3000)转动。电子调速器(1000)及无人机，通过在电子调速器(1000)的金属壳体(1200)的内表面设置容置槽(1201)，将电容(1111)收容在容置槽(1201)中，能够有效增大电容(1111)与金属壳体(1200)的接触面积，提高电容(1111)与金属壳体(1200)之间的热传导效率，提高对电容(1111)的散热效果，减少电容(1111)高温失效的风险。

Description

电子调速器及无人机 技术领域
本发明涉及无人机技术，尤其涉及一种电子调速器及无人机。
背景技术
电子调速器是无人机中的重要部件之一，用于控制无人机中的电机的转动，以使无人机的启停和调速等。
电子调速器包括控制电路板，控制电路板上设置有电容、MOS管等易发热的电子元件，尤其是电容在承受大纹波电流时会产生大量的热量，使电容的温度过高，存在失效的风险。现有技术中，通常是将电容直接裸露在空气中，利用空气对流对电容进行散热，散热效果较差；或者是在控制电路板上涂抹导热硅胶，通过导热硅胶与电容的接触对电容进行散热，然而，基于成本与重量的考虑，通常是在控制电路板上涂抹较薄的导热硅胶层，电容与导热硅胶层的接触面积很小，对电容的散热效果仍然较差。
发明内容
针对现有技术中的上述缺陷，本发明提供一种用于电子调速器及无人机，能够增大电容与金属壳体的接触面积，提高电容与金属壳体之间的热传导效率，有效提高对电容的散热效果，减少电容高温失效的风险。
本发明的第一个方面是提供一种电子调速器，包括：
电容；
第一电路板，用于承载所述电容，并且与所述电容电连接；以及
金属壳体，用于收容所述第一电路板；
其中，所述金属壳体的内表面设置有至少一个容置槽，所述电容至少部分容置在所述容置槽中，以通过所述金属壳体对所述电容进行散热。
进一步地，所述电容平躺地设置在所述容置槽中。
进一步地，所述容置槽朝向所述电容的槽壁包括与所述电容的柱面接触的接触面。
进一步地，所述接触面包括与所述电容的柱面相适配的曲面。
进一步地，所述接触面与所述电容的柱面之间设置有导热介质；
其中，所述导热介质为液态或膏状的导热介质，干涸后形成导热层。
进一步地，所述容置槽朝向所述电容的侧壁包括与所述电容接触的曲面，以及所述曲面与底壁的平面。
进一步地，所述曲面与电容之间、所述平面与所述电容之间均填充有导热介质；
其中，所述导热介质为液态或膏状的导热介质，干涸后形成导热层。
进一步地，所述容置槽与所述电容之间具有间隙。
进一步地，所述电容槽与所述电容之间的间隙中填充有导热介质；
其中，所述导热介质包括如下至少一种：导热硅脂、导热硅胶、阳极氧化膜以及相变化导热介质。
进一步地，所述容置槽包括所述金属壳体向下凹陷形成的第一容置空间。
进一步地，所述金属壳体的底壁设置有凸台，所述容置槽包括相邻的两个所述凸台之间形成的第二容置空间。
进一步地，所述凸台为金属凸起。
进一步地，所述凸台与所述金属壳体一体设置。
进一步地，所述容置槽还包括所述金属壳体向下凹陷形成的第一容置空间，所述第一容置空间与所述第二容置空间连通设置，并且所述第二容置空间位于所述第一容置空间的上方。
进一步地，所述金属壳体包括底壁以及设置在底壁边缘并向上延伸的侧壁，所述电容的第一端面与所述下金属壳体的侧壁接触。
进一步地，所述金属壳体上设置有用于安装温度传感器的安装槽，且所述电容的第二端面用于与所述温度传感器接触。
进一步地，所述容置槽包括与所述电容的柱面接触的第一侧壁，以及与所述电容的第二端面接触的第二侧壁，所述第一侧壁与所述第二侧壁之间具有预设距离。
进一步地，所述电子调速器，包括：
至少两个电容，所述容置槽的数量与所述电容的数量相同。
进一步地，至少两个所述容置槽之间相互连通。
进一步地，所述金属壳体包括上金属壳体以及下金属壳体，所述上金属壳体与所述下金属相对设置，以形成容腔，所述第一电路板设置在所述容腔内。
进一步地，所述电子调速器还包括：
第二电路板，收容在所述金属壳体内，设置在所述第一电路板上侧，以通过所述第二电路板将所述电容压持在所述容置槽中；其中，所述第二电路板上设有MCU。
本发明的另一个方面是提供一种无人机，包括：
飞行控制器，设置在机身上；
前述任一项所述的电子调速器，与所述飞行控制器通信连接；
电机，与所述电子调速器电连接，以使所述电子调速器根据所述飞行控制器发送的油门控制信号控制所述电机转动；以及
螺旋桨，与所述电机连接，以使所述电机在所述电子调速器的控制下驱动所述螺旋桨转动，从而提供飞行推进力。
本发明提供的电子调速器及无人机，通过在电子调速器的金属壳体的内表面设置容置槽，将电容收容在该容置槽中，能够有效增大电容与金属壳体的接触面积，提高电容与金属壳体之间的热传导效率，提高对电容的散热效果，减少电容高温失效的风险。
附图说明
图1为本发明电子调速器实施例一的结构示意图一；
图2为本发明电子调速器实施例一的结构示意图二；
图3为图2的局部放大示意图；
图4为本发明电子调速器实施例七的结构示意图一；
图5为本发明电子调速器实施例七的结构示意图二；
图6为本发明电子调速器实施例十一的结构示意图一；
图7为本发明电子调速器实施例十一的结构示意图二；
图8为本发明电子调速器中第一电路板、第二电路板、电容及金属壳体 装配示意图；
图9为图8的A-A向剖视图；
图10为本发明无人机中飞行控制器、电子调速器与电机的连接示意图。
其中，1000-电子调速器；1110-第一电路板；1111-电容；1120-第二电路板；1200-金属壳体；1201-容置槽；1202-凸台；1203-避让槽；1204-安装槽；1201a-曲面；1201b-平面；1201c-第一侧壁；1201d-第二侧壁；2000-飞行控制器；3000-电机。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。
基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
其中，“上”、“下”等的用语，是用于描述各个结构在附图中的相对位置关系，仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当亦视为本发明可实施的范畴。
需要说明的是，在本发明的描述中，术语“第一”、“第二”仅用于方便描述不同的部件，而不能理解为指示或暗示顺序关系、相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。
实施例一
图1为本发明电子调速器实施例一的结构示意图一；
图2为本发明电子调速器实施例一的结构示意图二。
请参照图1-2，本实施例提供一种电子调速器1000，包括：
电容1111；
第一电路板1110，用于承载电容1111，并且与电容1111电连接；以及
金属壳体1200，用于收容第一电路板1110；
其中，金属壳体1200的内表面设置有至少一个容置槽1201，电容1111至少部分容置在容置槽1201中，以通过金属壳体1200对电容1111进行散热。
具体地，电容1111通常设置在电子调速器1000与电源的连接处，以保证输入电压的平稳。电容1111的输入端以及输出端与第一电路板1110电连接，并且，电容1111还可以通过卡箍、粘接等方式固定在第一电路板1110上，以使电容1111与第一电路板1110之间的电连接更可靠。
金属壳体1200能够形成用于收容第一电路板1110的收容空间，第一电路板1110设置在该收容空间中；在金属壳体1200的内表面上形成至少一个容置槽1201，电容1111的部分或者全部容置在该容置槽1201中，电容1111将产生的热量传递给金属壳体1200，以使电容1111自身的热量降低。
需要说明的是：当容置槽1201收容电容1111的全部时，需要在容置槽1201上开设入口，以使电容1111能够进入容置槽1201，并且需要在容置槽1201上开设通孔，以使电容1111的输入端以及输出端能够与第一电路板1110电连接，此时，电容1111仅与第一电路板1110电连接即可。其中，电容1111的输入端以及输出端也可以通过容置槽1201的入口与第一电路板1110电连接。
本实施例对于容置槽1201的具体结构不做限定，本领域技术人员可以根据实际需要进行设置，只要能够实现其容置并支撑电容1111的功能即可。此外，当电子调速器1000包括至少两个电容1111时，用于容纳电容1111的容置槽1201间隔设置，以使两个相邻的电容1111之间也具有散热结构，从而进一步提高散热效果。
金属壳体1200可以采用常用的金属材料制成，较佳地，采用导热系数较高的金属材料，例如铜合金、铝合金等。由于金属的导热系数高于硅胶等导热介质的导热系数，且价格相对硅胶较低廉，因此，相对于在电容1111与现有的金属壳体1200之间填充硅胶而言，本实施例提供的电子调速器的散热效果更好，成本更低，重量更小。
本实施例提供的电子调速器1000，通过在金属壳体1200的内表面设置容置槽1201，将电容1111收容在该容置槽1201中，能够有效增大电容1111与金属壳体1200的接触面积，提高电容1111与金属壳体1200之间的热传导 效率，提高对电容1111的散热效果，减少电容1111高温失效的风险。
实施例二
在实施例一的基础上，电容1111平躺地设置在容置槽1201中。
具体地，电容1111的轴向与金属壳体1200的底壁平行设置，电容1111槽沿电容1111轴向方向的长度可以等于电容1111的轴向高度，以使容置槽1201能够容置电容1111的更多部分，从而使电容1111与金属壳体1200之间具有更大的接触面积，进一步提高对电容1111的散热效果。
本实施例中，通过将电容1111平躺设置在容置槽1201中，还通过容置槽1201对电容1111进行周向定位，避免电容1111左右晃动，使电容1111与第一电路板1110之间的电连接更可靠；此外，该设置方式还能够大大增加电容1111与容置槽1201的接触面积，提高对电容1111的散热效果。
实施例三
在实施例二的基础上，容置槽1201朝向电容1111的槽壁包括与电容1111的柱面接触的接触面。
具体地，接触面包括与电容1111的柱面相适配的曲面，以使电容1111与容置槽1201立体接触、紧密贴合，从而使电容1111与金属壳体1200之间具有更大的接触面积。例如：由于电容1111呈圆柱形，容置槽1201形成的空间也呈柱形，且该柱形空间的直径与电容1111的直径相适配。
由于公差的存在，电容1111与容置槽1201的槽壁之间会存在一定的间隙，进一步地，可以在接触面与电容1111的柱面之间填充导热介质；其中，导热介质为液态或膏状的导热介质，干涸后形成导热层。
在将第一电路板1110以及电容1111装配到位之后，向电容1111与接触面之间填充导热介质，此时导热介质可以为液态或膏状，具有一定的流动性，以使导热介质可以充满电容1111与接触面之间的间隙；一定时间之后液态或膏状的导热介质干涸形成导热层，能够更快速地将电容1111的热量传递给金属壳体1200，还能够更好地对电容1111进行定位，避免电容1111晃动，保证电容1111与第一电路板1110的电连接可靠。
实施例四
图3为图2的局部放大示意图。
请参照图3，在实施例二的基础上，容置槽1201朝向电容1111的侧壁包括与电容1111接触的曲面1201a，以及曲面1201a与底壁的平面1201b。
本实施例中，容置槽1201可以包括两个相对设置的侧壁，以及连接在两侧壁之间的底壁；侧壁包括与电容1111的柱面接触的曲面1201a，以及连接曲面1201a与底壁的平面1201b。本实施例提供的容置槽1201，便于加工制造，能够简化容置槽1201的加工工序，提高容置槽1201的加工效率，进而进一步降低电子调速器1000的加工成本，并且，通过与电容1111的柱面相接触的曲面1201a，还提高了电容1111与金属壳体1200的接触面积。
进一步地，曲面1201a与电容1111之间、平面1201b与电容1111之间均填充有导热介质；其中，导热介质为液态或膏状的导热介质，干涸后形成导热层。关于导热介质的描述可以与前述实施例三类似，此处不再赘述；需要说明的是：本实施例中，导热介质充满曲面1201a与电容1111之间、平面1201b与电容1111之间的间隙。
实施例五
在前述任一实施例的基础上，容置槽1201与电容1111之间具有间隙。
由于在加工过程中，电容1111与容置槽1201会存在一定的公差，因此，需要对容置槽1201的尺寸进行合理设置，以使两个接触面之间的空间可以稍大于电容1111，也就是在接触面与电容1111的柱面之间可以具有一定的间隙，以使容置槽1201能够适用于容置更多的电容1111，提高了容置槽1201也即金属壳体1200对电容1111的适用范围。本实施例对于容置槽1201的具体尺寸以及容置槽1201与电容1111的间隙不做具体限定，本领域技术人员具体可以根据电容1111的尺寸进行设置。
进一步地，在接触面与电容1111的柱面之间填充有导热介质；其中，导热介质为液态或膏状的导热介质，干涸后形成导热层。具体地，导热介质可以包括如下至少一种：导热硅脂、导热硅胶、阳极氧化膜以及相变化导热介质。不同的容置槽1201与其容置的电容1111之间可以使用相同或者不同的导热介质。
在将第一电路板1110以及电容1111装配到位之后，向容置槽1201内注入导热介质，此时导热介质可以为液态或膏状，具有一定的流动性，以使导热介质可以充满电容1111与接容置槽1201之间的间隙；一定时间之后液态 或膏状的导热介质干涸形成导热层，将电容1111与容置槽1201的槽壁连接，能够更快速地将电容1111的热量传递给金属壳体1200，还能够更好地对电容1111进行定位，避免电容1111晃动，保证电容1111与第一电路板1110的电连接可靠。
实施例六
在前述任一实施例的基础上，容置槽1201包括金属壳体1200向下凹陷形成的第一容置空间。
本实施例中，金属壳体1200可以具有一定的厚度，金属壳体1200可以向下凹陷形成第一容置空间，电容1111容置在该第一容置空间中。本实施例对于容置槽1201的结构不做具体限定，本领域技术人员可以根据实际需要进行设置，只要容置槽1201能够形成容置电容1111的第一容置空间即可；例如：容置槽1201可以形成横截面为矩形、梯形，圆弧形的第一容置空间。
实施例七
图4为本发明电子调速器实施例七的结构示意图一；
图5为本发明电子调速器实施例七的结构示意图二。
请参照图4-5，在前述实施例一至实施例五中任一实施例的基础上，金属壳体1200的底壁设置有凸台1202。例如：凸台1202可以靠近金属壳体1200内的端部设置，凸台1202具有预设高度，可以在凸台1202上开设在容置槽1201，此时，凸台1202的上表面可以与第一电路板1110的下表面接触，以使电容1111与容置槽1201之间具有更大的接触面积。
容置槽1201可以包括相邻的两个凸台1202之间形成的第二容置空间。以电子调速器1000包括两个电容1111为例：金属壳体1200内可以设置有三个凸台1202，其中位于两侧的两个凸台1202与金属壳体1200的侧壁连接，以更快速地将电容1111的热量散发到电子调速器1000外；位于两侧的两个凸台1202分别与处于中间的凸台1202形成第二容置空间，此时，凸台1202提供了形成容置槽1201的侧壁，金属壳体1200的底壁形成容置槽1201的底壁。
进一步地，容置槽1201还可以包括金属壳体1200向下凹陷形成的第一容置空间，第一容置空间与第二容置空间连通设置，并且第二容置空间位于 第一容置空间的上方。
在满足其承载能力以及刚度要求的前提下，金属壳体1200的底壁可以向下凹陷形成第一容置空间，使得电子调速器1000的结构更加紧凑，有助于减小电子调速器1000的体积。此外，金属壳体1200上还设置有避让槽1203，避让槽1203用于为设置在金属壳体1200内的其它电器元件提供足够的安装空间。
本实施例中，凸台1202可以为金属凸起，金属凸起的材料可以与金属壳体1200相同，以便于金属凸起与金属壳体1200一体设置。
实施例八
在前述任一实施例的基础上，金属壳体1200包括底壁以及设置在底壁边缘并向上延伸的侧壁，电容1111的第一端面与下金属壳体1220的侧壁接触，以进一步增大电容1111与金属壳体1200的接触面积。
进一步地，金属壳体1200上还可以设置有用于安装温度传感器的安装槽1204，以通过温度传感器实时检测电容1111的温度。安装槽可以靠近容置槽1201设置，较佳地，安装槽设置在电容的第二端，且安装槽与容置槽1201连通设置，以使电容1111的第二端面能够与温度传感器接触，从而使得温度传感器检测的温度更精确。
其中，温度传感器与电子调速器1000中的微程序控制器MCU或者其它控制元件连接，本实施例以温度传感器与MCU连接为例：温度传感器将检测到的温度传递给MCU，MCU将该温度与预设的第一阈值进行对比，当该温度达到预设的第一阈值时，MCU将该情况上报给飞行控制器，由飞行控制器控制无人机降落或对电子调速器1000进行断电处理。
此外，由于相邻的两个电容1111可以通过两个电容1111之间的金属壳体1200或者凸台1202实现温度的传递，所以，正常状态下，两个电容1111的温度相近。每个电容1111可以对应设置至少一个温度传感器，以通过温度传感器检测相应电容1111的温度，各温度传感器均与MCU连接，此时，当MCU确定两个电容1111之间的温度差达到预设的第二阈值时，可以快速确定至少其中一个电容1111发生异常。
实施例九
在前述任一实施例的基础上，容置槽1201包括与电容1111的柱面接触的第一侧壁1201c，以及与电容1111的第二端面接触的第二侧壁1201d，第一侧壁1201c与第二侧壁1201d之间具有预设距离，从而在容置槽1201中设置有用于容纳电容1111的端部的避让空间。
本实施例中，由于大多数电容1111并不是标准的圆柱形结构，以常见的电解电容为例：电容1111包括柱状本体，柱状本体的第一端与金属壳体1200的侧壁接触，柱状本体的第二端设置有用于与第一电路板1110连接的连接端(引脚或者端子等)，柱状本体的第二端沿柱状本体的径向凸出柱状本体设置，此时，避让空间用于容纳柱状本体的第二端，使得电容1111更好地与容置槽1201贴合。
实施例十
在前述任一实施例的基础上，电子调速器1000，包括：至少两个电容1111，容置槽1201的数量与电容1111的数量相同。
其中，至少两个电容1111间隔设置，则相应的容置槽1201也间隔设置。较佳地，至少两个容置槽1201之间相互连通，以使各容置槽1201之间的液体或者膏体状的导热介质可以相互流通。具体地，可以在两个电容1111槽之间的槽壁上开设至少一个通孔。在实施例七的基础上，第一侧壁1201c与第二侧壁1201d之间的间隙也可以实现两个相邻电容1111槽之间的连通。
实施例十一
图6为本发明电子调速器实施例十一的结构示意图一；
图7为本发明电子调速器实施例十一的结构示意图二。
请参照图6-7，在前述任一实施例的基础上，金属壳体1200包括上金属壳体1210以及下金属壳体1220，上金属壳体1210与下金属相对设置，以形成容腔，第一电路板1110设置在容腔内。
本实施例中，上金属壳体1210可以与下金属壳体1220可拆卸连接，以便于对设置在容腔内的电器元件进行维修或者更换。具体地，上金属壳体1210可以与下金属壳体1220卡接和/或螺接。上金属壳体1210和/或下金属壳体1220上还设置有支耳，例如下金属壳体1220的两端分别设置有两个支耳，以通过支耳将电子调速器1000固定设置在机身上。
其中，容置槽1201可以设置在上金属壳体1210和/或下金属壳体1220上。例如：当电容1111与上金属壳体1210、下金属壳体1220之间没有设置其它部件时，可以在上金属壳体1210、下金属壳体1220上均设置有容置槽1201。
实施例十二
图8为本发明电子调速器中第一电路板、第二电路板、电容及金属壳体装配示意图；
图9为图8的A-A向剖视图。
请参照图8-9，在前述任一实施例的基础上，电子调速器1000，还可以包括：
第二电路板1120，收容在金属壳体1200内，设置在第一电路板1110上侧，以通过第二电路板1120将电容1111压持在容置槽1201中；其中，第二电路板1120上设有MCU。
本实施例中，可以将易发热的电器元件例如电容1111、MOS管等设置在第一电路板1110上，将MCU以及热敏元件等设置在第二电路板1120上，以减少电容1111、MOS管产生的热量对MCU、热敏元件等的影响。
第一电路板1110可以包括设置电容1111的第一端以及背离电容1111的第二端。第二电路板1120可以设置在第一电路板1110的第一端的上方，也就是第二电路板1120可以设置在电容1111的上方，以通过第二电路板1120将电容1111压持在容置槽1201中，使得电容1111更稳固容置在容置槽1201中。或者，第二电路板1120可以设置在第一电路板1110的第二端的上方，此时，电容1111与上金属壳体1210、下金属壳体1220之间没有设置其它部件，可以在上金属壳体1210、下金属壳体1220上均设置有容置槽1201，电容1111与金属壳体1200之间具有更大的接触面积。
需要说明的是：上述金属壳体1200并不限于电子调速器的金属壳体1200，在其它设置有电容1111并且将电容1111设置在金属壳体1200围成的空间中时，均可以采用上述各实施例中的容置槽1201，已通过金属壳体1200对电容1111进行散热。
实施例十三
图10为本发明无人机中飞行控制器、电子调速器与电机的连接示意图。
请参照图10，本实施例还提供一种无人机，包括：
飞行控制器2000，设置在机身上；
电子调速器1000，与飞行控制器2000通信连接；
电机3000，与电子调速器1000电连接，以使电子调速器1000根据飞行控制器2000发送的油门控制信号控制电机3000转动；以及
螺旋桨，与电机3000连接，以使电机3000在电子调速器1000的控制下驱动螺旋桨转动，从而提供飞行推进力。
其中，电子调速器1000为前述任一实施例中的电子调速器1000，其结构、功能与前述实施例类似，此处不再赘述。
无人机的机身可以包括中心体以及设置在中心体四周的机臂，机臂背离中心体的端部可以设置有用于安装电机3000的安装座，电子调速器1000可以设在中心体内、机臂的腔体内或者安装座上。
本实施例提供的无人机，通过在电子调速器1000的金属壳体1200的内表面设置容置槽1201，将电容1111收容在该容置槽1201中，能够有效增大电容1111与金属壳体1200的接触面积，提高电容1111与金属壳体1200之间的热传导效率，提高对电容1111的散热效果，减少电容1111高温失效的风险。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (17)

  1. 一种电子调速器，其特征在于，包括：
    电容；
    第一电路板，用于承载所述电容，并且与所述电容电连接；以及
    金属壳体，用于收容所述第一电路板；
    其中，所述金属壳体的内表面设置有至少一个容置槽，所述电容至少部分容置在所述容置槽中，以通过所述金属壳体对所述电容进行散热。
  2. 根据权利要求1所述的电子调速器，其特征在于，所述电容平躺地设置在所述容置槽中。
  3. 根据权利要求2所述的电子调速器，其特征在于，所述容置槽朝向所述电容的槽壁包括与所述电容的柱面接触的接触面。
  4. 根据权利要求3所述的电子调速器，其特征在于，所述接触面包括与所述电容的柱面相适配的曲面；
    或/及，所述接触面与所述电容的柱面之间设置有导热介质；其中，所述导热介质为液态或膏状的导热介质，干涸后形成导热层。
  5. 根据权利要求2所述的电子调速器，其特征在于，所述容置槽朝向所述电容的侧壁包括与所述电容接触的曲面，以及所述曲面与底壁的平面。
  6. 根据权利要求5所述的电子调速器，其特征在于，所述曲面与电容之间、所述平面与所述电容之间均填充有导热介质；
    其中，所述导热介质为液态或膏状的导热介质，干涸后形成导热层。
  7. 根据权利要求1所述的电子调速器，其特征在于，所述容置槽与所述电容之间具有间隙。
  8. 根据权利要求7所述的电子调速器，其特征在于，所述电容槽与所述电容之间的间隙中填充有导热介质；
    其中，所述导热介质包括如下至少一种：导热硅脂、导热硅胶、阳极氧化膜以及相变化导热介质。
  9. 根据权利要求1所述的电子调速器，其特征在于，所述容置槽包括所述金属壳体向下凹陷形成的第一容置空间。
  10. 根据权利要求1所述的电子调速器，其特征在于，所述金属壳体的 底壁设置有凸台，所述容置槽包括相邻的两个所述凸台之间形成的第二容置空间。
  11. 根据权利要求10所述的电子调速器，其特征在于，所述凸台为金属凸起；
    或/及，所述凸台与所述金属壳体一体设置；
    或/及，所述容置槽还包括所述金属壳体向下凹陷形成的第一容置空间，所述第一容置空间与所述第二容置空间连通设置，并且所述第二容置空间位于所述第一容置空间的上方。
  12. 根据权利要求1所述的电子调速器，其特征在于，所述金属壳体包括底壁以及设置在底壁边缘并向上延伸的侧壁，所述电容的第一端面与所述下金属壳体的侧壁接触。
  13. 根据权利要求12所述的电子调速器，其特征在于，所述金属壳体上设置有用于安装温度传感器的安装槽，且所述电容的第二端面用于与所述温度传感器接触；
    或/及，所述容置槽包括与所述电容的柱面接触的第一侧壁，以及与所述电容的第二端面接触的第二侧壁，所述第一侧壁与所述第二侧壁之间具有预设距离。
  14. 根据权利要求1所述的电子调速器，其特征在于，包括：
    至少两个电容，所述容置槽的数量与所述电容的数量相同。
  15. 根据权利要求14所述的电子调速器，其特征在于，至少两个所述容置槽之间相互连通。
  16. 根据权利要求1所述的电子调速器，其特征在于，所述金属壳体包括上金属壳体以及下金属壳体，所述上金属壳体与所述下金属相对设置，以形成容腔，所述第一电路板设置在所述容腔内；
    或，所述电子调速器还包括：第二电路板，收容在所述金属壳体内，设置在所述第一电路板上侧，以通过所述第二电路板将所述电容压持在所述容置槽中；其中，所述第二电路板上设有MCU。
  17. 一种无人机，其特征在于，包括：
    飞行控制器，设置在机身上；
    权利要求1-16任一项所述的电子调速器，与所述飞行控制器通信连接；
    电机，与所述电子调速器电连接，以使所述电子调速器根据所述飞行控制器发送的油门控制信号控制所述电机转动；以及
    螺旋桨，与所述电机连接，以使所述电机在所述电子调速器的控制下驱动所述螺旋桨转动，从而提供飞行推进力。
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