WO2018189586A3 - 用于提供锡膏的组件及其方法 - Google Patents

用于提供锡膏的组件及其方法 Download PDF

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Publication number
WO2018189586A3
WO2018189586A3 PCT/IB2018/000451 IB2018000451W WO2018189586A3 WO 2018189586 A3 WO2018189586 A3 WO 2018189586A3 IB 2018000451 W IB2018000451 W IB 2018000451W WO 2018189586 A3 WO2018189586 A3 WO 2018189586A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
tub
housing
nozzle
paste tub
Prior art date
Application number
PCT/IB2018/000451
Other languages
English (en)
French (fr)
Other versions
WO2018189586A2 (zh
Inventor
杨宁
Original Assignee
伊利诺斯工具制品有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710245230.8A external-priority patent/CN108738247B/zh
Priority claimed from CN201720395604.XU external-priority patent/CN207266402U/zh
Application filed by 伊利诺斯工具制品有限公司 filed Critical 伊利诺斯工具制品有限公司
Priority to JP2019555898A priority Critical patent/JP7218299B2/ja
Priority to EP18737964.9A priority patent/EP3610975A2/en
Priority to US16/604,472 priority patent/US11173562B2/en
Priority to KR1020197033358A priority patent/KR102445985B1/ko
Publication of WO2018189586A2 publication Critical patent/WO2018189586A2/zh
Publication of WO2018189586A3 publication Critical patent/WO2018189586A3/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本申请提供了一种用于提供锡膏的方法，用于将锡膏罐中容纳的锡膏提供到锡膏印刷机中，所述方法包括：将锡膏喷嘴通过锡膏罐的开口插入所述锡膏罐的壳体中，其中所述锡膏罐的壳体中容纳有锡膏；通过所述锡膏喷嘴将所述锡膏罐开口朝下地承载在工作台上；通过能够随所述锡膏罐的壳体上下移动的保持架与所述锡膏罐的壳体的外壁上的卡接装置的配合来保持所述锡膏罐；通过按压所述锡膏罐的壳体，使得所述锡膏罐的壳体相对于所述锡膏喷嘴移动，同时使得所述保持架随着所述锡膏罐的壳体的移动而移动，以将所述锡膏罐的壳体中容纳的锡膏从所述锡膏喷嘴中挤出。
PCT/IB2018/000451 2017-04-14 2018-04-13 用于提供锡膏的组件及其方法 WO2018189586A2 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019555898A JP7218299B2 (ja) 2017-04-14 2018-04-13 はんだペーストを供給する組立体及びその方法
EP18737964.9A EP3610975A2 (en) 2017-04-14 2018-04-13 A solder paste feeding component and method
US16/604,472 US11173562B2 (en) 2017-04-14 2018-04-13 Solder paste feeding assembly and method
KR1020197033358A KR102445985B1 (ko) 2017-04-14 2018-04-13 솔더 페이스트 공급 조립체 및 솔더 페이스트 공급 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201720395604.X 2017-04-14
CN201710245230.8A CN108738247B (zh) 2017-04-14 2017-04-14 一种供锡组件
CN201720395604.XU CN207266402U (zh) 2017-04-14 2017-04-14 一种供锡组件
CN201710245230.8 2017-04-14

Publications (2)

Publication Number Publication Date
WO2018189586A2 WO2018189586A2 (zh) 2018-10-18
WO2018189586A3 true WO2018189586A3 (zh) 2018-11-29

Family

ID=62842149

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2018/000451 WO2018189586A2 (zh) 2017-04-14 2018-04-13 用于提供锡膏的组件及其方法

Country Status (6)

Country Link
US (1) US11173562B2 (zh)
EP (1) EP3610975A2 (zh)
JP (1) JP7218299B2 (zh)
KR (1) KR102445985B1 (zh)
TW (1) TWI760480B (zh)
WO (1) WO2018189586A2 (zh)

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KR102376418B1 (ko) * 2017-04-14 2022-03-17 일리노이즈 툴 워크스 인코포레이티드 솔더 페이스트 프린터를 위한 자동 솔더 페이스트 도포 장치
KR102218105B1 (ko) * 2019-12-19 2021-02-19 고혜원 솔더카트리지의 범용 사용이 가능한 솔더 자동 주입기
KR102416881B1 (ko) * 2021-04-14 2022-07-05 유명근 페이스트 디스펜서용 삽입 가압 모듈
KR102416799B1 (ko) * 2021-04-15 2022-07-05 유명근 페이스트 디스펜서
CN114554710A (zh) * 2022-02-18 2022-05-27 范俊飞 一种适用于装配贴片元件的锡液点膏机

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US20140117067A1 (en) * 2012-10-26 2014-05-01 Yamaha Hatsudoki Kabushiki Kaisha Viscous material feeder and viscous material printer
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Also Published As

Publication number Publication date
KR20190139944A (ko) 2019-12-18
US11173562B2 (en) 2021-11-16
JP2020516499A (ja) 2020-06-11
EP3610975A2 (en) 2020-02-19
WO2018189586A2 (zh) 2018-10-18
TW201841776A (zh) 2018-12-01
JP7218299B2 (ja) 2023-02-06
US20210129248A1 (en) 2021-05-06
TWI760480B (zh) 2022-04-11
KR102445985B1 (ko) 2022-09-21

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