WO2018181476A1 - 露光装置、露光方法、フラットパネルディスプレイの製造方法、及び、デバイス製造方法 - Google Patents
露光装置、露光方法、フラットパネルディスプレイの製造方法、及び、デバイス製造方法 Download PDFInfo
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- WO2018181476A1 WO2018181476A1 PCT/JP2018/012767 JP2018012767W WO2018181476A1 WO 2018181476 A1 WO2018181476 A1 WO 2018181476A1 JP 2018012767 W JP2018012767 W JP 2018012767W WO 2018181476 A1 WO2018181476 A1 WO 2018181476A1
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- Prior art keywords
- mask
- support
- plate
- exposure apparatus
- exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Definitions
- the present invention relates to a technical field of, for example, an exposure apparatus and an exposure method for exposing an object, a method for manufacturing a flat panel display using the exposure apparatus, and a device manufacturing method using the exposure apparatus.
- An exposure apparatus is used in a lithography process for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements.
- An exposure apparatus projects illumination light through a mask on which a desired pattern is formed onto a plate (for example, a glass substrate coated with a resist) using a projection optical system, thereby forming a pattern on the plate.
- the exposure apparatus projects illumination light on the plate while moving the plate. For this reason, when the position accuracy of the plate is deteriorated, there is a possibility that the pattern cannot be appropriately formed on the plate.
- the optical system is supported in an exposure apparatus that irradiates an object with illumination light through the optical system, scans and exposes the object, and forms a predetermined pattern of the mask on the object.
- An exposure apparatus is provided that includes a support device that supports the object, and an object support unit that is provided on the support device and supports the object in a non-contact manner.
- an exposure apparatus that irradiates an object with illumination light through an optical system, scans and exposes the object, and forms a predetermined pattern provided on a mask on the object.
- an exposure apparatus including a supporting device.
- an exposure apparatus that irradiates an object with illumination light via an optical system, scans and exposes the object, and forms a predetermined pattern provided on a mask on the object.
- an exposure apparatus comprising: an object support unit that supports the mask; a mask support unit that supports the mask or a mask drive unit that drives the mask in a non-contact manner; and a support device that supports the object support unit and the mask support unit. Is done.
- an exposure apparatus comprising: an object support unit that supports a predetermined surface of an object in a non-contact manner; and a processing unit that scans and exposes the predetermined surface and forms a predetermined pattern on the predetermined surface.
- the flat panel includes exposing the object using any of the exposure apparatuses according to the first to fourth aspects described above and developing the exposed object.
- a method for manufacturing a display is provided.
- a device manufacturing method including exposing the object using any one of the exposure apparatuses according to the first to fourth aspects described above and developing the exposed object. A method is provided.
- the optical system in which the object is irradiated with illumination light through the optical system, the object is scanned and exposed, and the predetermined pattern of the mask is formed on the object, the optical system is supported.
- An exposure method is provided that includes supporting the object in a non-contact manner by an object support portion provided in the support device.
- an exposure method comprising: supporting at least one of a mask support unit that non-contact supports a mask drive unit that drives the optical system and the optical system, and an object support unit that non-contact supports the object by a support device. Is provided.
- an exposure method comprising: supporting an object support unit; and supporting the mask or a mask support unit supporting the mask driving unit that drives the mask in a non-contact manner by a support device.
- an exposure method including supporting a predetermined surface of an object in a non-contact manner, performing scanning exposure on the predetermined surface, and forming a predetermined pattern on the predetermined surface.
- FIG. 1 is a cross-sectional view showing a cross section along the YZ plane of the exposure apparatus of the first embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 2 is a cross-sectional view showing the cross section along the XZ plane of the exposure apparatus of the first embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- 3A is a plan view of the surface plate observed from above, and
- FIG. 3B is a plan view of the surface plate observed from below.
- FIG. 4 is a cross-sectional view showing a cross section along the YZ plane of a modification of the exposure apparatus of the first embodiment (for the sake of convenience of drawing, some components are shown with side faces).
- FIG. 1 is a cross-sectional view showing a cross section along the YZ plane of the exposure apparatus of the first embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 2 is a cross-sectional view showing the cross section along the XZ plane
- FIG. 5 is a sectional view showing a cross section along the YZ plane of the exposure apparatus of the second embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 6 is a cross-sectional view taken along the YZ plane of a modification of the exposure apparatus of the second embodiment (for the sake of convenience of drawing, some components are shown as side faces).
- FIG. 7 is a cross-sectional view showing the cross section along the YZ plane of the exposure apparatus of the third embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 8 is a cross-sectional view showing the cross section along the YZ plane of the exposure apparatus of the fourth embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 9 is a cross-sectional view showing the cross section along the XZ plane of the exposure apparatus of the fourth embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 10 is a plan view of the surface plate observed from below.
- FIG. 11 is a cross-sectional view showing the cross section along the YZ plane of the exposure apparatus of the fifth embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 12 is a cross-sectional view taken along the YZ plane of the exposure apparatus of the sixth embodiment (for convenience of the drawing, some components are shown as side faces).
- FIG. 13 is a cross-sectional view taken along the XZ plane of the exposure apparatus of the sixth embodiment (for convenience of the drawing, some components are shown as side faces).
- FIG. 14 is a sectional view showing a section along the YZ plane of the exposure apparatus of the seventh embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 15 is a cross-sectional view showing an XZ plane of the exposure apparatus of the seventh embodiment (for convenience of the drawing, some components are shown with side faces).
- FIG. 16 is a plan view of the surface plate observed from above.
- FIG. 17 is a cross-sectional view taken along the YZ plane of the exposure apparatus of the eighth embodiment (for convenience of the drawing, some components are shown as side faces).
- FIG. 18 is a sectional view showing a section along the XZ plane of the exposure apparatus of the ninth embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 15 is a cross-sectional view showing an XZ plane of the exposure apparatus of the seventh embodiment (for convenience of the drawing, some components are shown with side faces).
- FIG. 16 is a plan view of the surface plate observed from above.
- FIG. 19 is a plan view of the surface plate observed from above.
- FIG. 20 is a plan view of the surface plate observed from above.
- FIG. 21 is a plan view of the surface plate observed from above.
- FIG. 22 is a cross-sectional view showing the cross section along the YZ plane of the exposure apparatus of the tenth embodiment (for convenience of the drawing, some constituent elements are shown with side faces). For the sake of convenience, some components are shown in a side view).
- FIG. 23 is a plan view of the surface plate observed from above.
- FIG. 24A is a plan view showing a lower surface of the holding portion
- FIG. 24B is a plan view showing a side surface of the holding portion.
- FIG. 25 is a cross-sectional view showing a YZ cross section of the holding portion.
- FIG. 26A is a cross-sectional view showing a YZ cross section of the chuck portion
- FIG. 26B is a plan view of the chuck portion observed from below.
- FIG. 27 is a plan view showing the moving direction of the plurality of chuck portions on the lower surface of the holding portion.
- FIG. 28 is a flowchart showing the flow of a device manufacturing method for manufacturing a display panel using an exposure apparatus.
- each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). It is assumed that the vertical direction or the direction of gravity in which gravity acts). Further, the + Z side is the upper side (upper side), and the ⁇ Z side is the lower side (lower side).
- the rotation directions around the X axis, the Y axis, and the Z axis are referred to as a ⁇ X direction, a ⁇ Y direction, and a ⁇ Z direction, respectively.
- FIG. 1 is a sectional view showing a section along the YZ plane of the exposure apparatus 1 of the first embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 2 is a cross-sectional view showing the cross section along the XZ plane of the exposure apparatus 1 of the first embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 3A is a plan view of the surface plate 14 observed from above.
- FIG. 3B is a plan view of the surface plate 14 observed from below.
- the exposure apparatus 1 of the first embodiment exposes a plate P, which is a flat glass coated with a photoresist (that is, a photosensitive agent), with an image of a mask pattern formed on a mask M. As a result, a device pattern corresponding to the mask pattern is transferred (in other words, formed) to the plate P.
- the plate P exposed by the exposure apparatus 1 is used for manufacturing a display panel of a display device (for example, a liquid crystal display, an organic EL display, etc.), for example.
- the plate P is, for example, a rectangular flat glass whose one side or diagonal is 500 mm or longer.
- the size of the plate P may be any size.
- the exposure apparatus 1 irradiates the mask M with the illumination light EL while moving the mask M and the plate P along a predetermined scanning direction (X-axis direction in the first embodiment), so The shot area is exposed. After the exposure of one shot area is completed, in order to start the exposure of another shot area, the exposure apparatus 1 moves the plate P in the non-scanning direction orthogonal to the scanning direction (in the first embodiment, the Y-axis direction). Move along. Then, the other shot areas on the plate P are exposed by irradiating the mask M with the illumination light EL while moving the mask M and the plate P along the scanning direction. Thereafter, the same operation is repeated for all shot areas on the plate P. That is, the exposure apparatus 1 is a so-called step-and-scan exposure apparatus.
- such an exposure apparatus 1 includes an illumination optical system 11, a mask stage 12, a projection optical system 13, a surface plate 14, a mask support 151, and a plate.
- a support portion 152 and a plate stage 16 are provided.
- the illumination optical system 11 irradiates the mask M with light emitted from a light source (not shown) (for example, a mercury lamp) as illumination light EL for exposure via an optical element (not shown).
- the optical element (not shown) includes at least one of a reflecting mirror, a dichroic mirror, a shutter, a wavelength selection filter, and a lens.
- the illumination light EL for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm) or h-line (wavelength 405 nm), or at least two of these combined lights is used.
- i-line wavelength 365 nm
- g-line wavelength 436 nm
- h-line wavelength 405 nm
- the illumination light EL irradiated by the illumination optical system 11 travels toward the ⁇ Z side along the Z-axis direction via the mask M and the projection optical system 13 positioned below the illumination optical system 11, and thus the mask. M and the plate P positioned below the projection optical system 13 are irradiated. Therefore, in the first embodiment, the traveling direction of the illumination light EL is the gravitational direction (that is, the direction from the + Z side to the ⁇ Z side).
- the illumination optical system 11 is supported on the floor G or the like via the support frame 111.
- the support frame 111 is supported on the floor G via a vibration isolator such as an air spring. For this reason, the illumination optical system 11 is vibrationally separated from the floor G.
- the support frame 111 may not be supported on the floor surface G via a vibration isolator such as an air spring.
- the illumination optical system 11 is arranged away from the surface plate 14 that supports the projection optical system 13 (further, a support frame 125 that supports a mask stage 12 and a support frame 160 that supports a plate stage 16 described later). Is done. Therefore, the illumination optical system 11 is vibrationally separated from the projection optical system 13, the mask M, and the plate P.
- the mask stage 12 can hold the mask M.
- the mask stage 12 includes a mask holder 121, a fixing part 122, and a holder support part 123.
- the mask holder 121 is a plate-like member that extends along the XY plane. A concave portion that can accommodate the mask M is formed at the center of the lower surface of the mask holder 121 (that is, the surface on the ⁇ Z side).
- the mask holder 121 is supported by a holder support portion 123 that is a plate-like member in which an opening capable of accommodating the mask holder 121 is formed.
- the mask M housed in the recess of the mask holder 121 is sucked and held by the mask holder 121.
- a gas suction hole (not shown) is formed in the recess of the mask holder 121. Furthermore, a part of the lower surface of the mask M accommodated in the recess of the mask holder 121 extends from the lower surface of the holder support portion 123 toward the mask holder 121 (that is, toward the opening in which the mask holder 121 is accommodated). It is located on the detachable fixing part 122 arranged on the holder support part 123. Therefore, the fall of the mask M from the mask holder 121 is prevented by the suction and fixing portion 122 by the mask holder 121.
- the mask holder 121 is movable with the holder support part 123 at least along the X-axis direction (that is, the scanning direction) while holding the mask M. For this reason, as the mask holder 121 moves, the mask M held by the mask holder 121 is also movable at least along the X-axis direction.
- the mask stage 12 includes a mask stage drive system 124.
- the mask stage drive system 124 is, for example, a drive system that includes a boil coil motor, but may be a drive system that includes other motors (or drive sources).
- the mask stage drive system 124 is a drive system including a boil coil motor
- the mask stage drive system 124 is fixed to a support frame 125 provided apart from the surface plate 14 and extends along the X-axis direction.
- An X guide part 1241, a mover (for example, one of a magnet and a coil) 1242 fixed to the holder support part 123, and a stator (for example, the other of a magnet and a coil) 1243 fixed to the X guide part 1241 are included. .
- the mask stage driving system is not limited to the mask stage driving system such that the X guide part 1241 is fixed to the stator 1243, and a mask stage driving system that does not include the X guide part 1241 but includes the stator 1243 extending in the X-axis direction is used. May be.
- the exposure apparatus 1 includes a pair of mask stage drive systems 124 that are arranged so as to sandwich the mask stage 12 along the Y-axis direction.
- the number of mask stage drive systems 124 may be provided at an arbitrary position.
- the support frame 125 is supported by the floor G through a vibration isolator (not shown) including an air spring. For this reason, the mask stage 12 is vibrationally separated from the floor surface G.
- the support frame 125 may not be supported by the floor G via a vibration isolator (not shown) including an air spring or the like.
- a linear motor or voice coil motor (VCM)
- VCM voice coil motor
- the projection optical system 13 is supported by a surface plate 14 below the mask stage 12.
- the projection optical system 13 is a multi-lens projection optical system described in, for example, US Pat. No. 6,552,775.
- the projection optical system 13 includes a plurality of optical systems capable of projecting a part of the pattern image of the mask M onto a plurality of predetermined-shaped (for example, trapezoidal) projection areas IA set on the plate P. Including.
- the surface plate 14 includes a gantry 141 and a plurality of legs 142.
- the gantry 141 is a plate-shaped (or frame-shaped) member that extends along the XY plane in the space between the mask stage 12 and the plate stage 16.
- the shape of the gantry 141 on the XY plane is a rectangle, but may be other shapes.
- An opening penetrating the gantry 141 along the Z-axis direction is formed at the center of the gantry 141 on the XY plane (particularly, the region through which the illumination light EL passes).
- the projection optical system 13 is accommodated in the aperture.
- the gantry 141 supports the projection optical system 13 below the mask stage 12 and above the plate stage 16 by accommodating the projection optical system 13 in the opening.
- Each of the plurality of leg portions 142 is a columnar member (in other words, a rod shape) extending along the Z-axis direction.
- the plurality of legs 142 support the gantry 141 from below in the vicinity of the outer edge (for example, four corners) of the gantry 141 on the XY plane.
- Each of the plurality of legs 142 is supported by the floor surface G via a vibration isolator (not shown) including an air spring or the like. For this reason, the surface plate 14 is vibrationally separated from the floor surface G.
- a mask support 151 is disposed (in other words, fixed) on at least a part of the upper surface of the gantry 141 (that is, the surface on the + Z side, in other words, the surface that can face the mask stage 12). ).
- the mask support 151 is disposed such that the upper surface of the mask support 151 (that is, the surface on the + Z side, in other words, the surface that can face the mask stage 12) is exposed from the upper surface of the gantry 141.
- the upper surface of the mask support 151 is exposed from the upper surface of the gantry 141, at least a part of the mask support 151 may be embedded in the gantry 141.
- the mask support 151 is disposed at a position where at least a part of the mask support 151 can face at least a part of the mask stage 12 along the Z-axis direction. That is, the mask support 151 is disposed at a position where at least a part of the mask support 151 can be positioned below at least a part of the mask stage 12.
- the mask support 151 has at least a part of the mask support 151 facing at least a part of the holder support 123 (that is, at least a part of the holder support 123). It is arranged at a position where it can be located below.
- the mask stage 12 is movable along the X-axis direction.
- the mask support 151 is disposed at a position where at least a part of the mask support 151 can be positioned below at least a part of the mask stage 12 regardless of the position of the mask stage 12.
- the mask support 151 is located at a position where at least a part of the mask support 151 can be positioned below at least a part of the mask stage 12 wherever the mask stage 12 is located. Be placed.
- the mask support 151 may have a shape extending along the X-axis direction (for example, a shape in which the X-axis direction is the longitudinal direction).
- the mask support 151 is not formed in the optical path of the illumination light EL.
- the mask support 151 is not formed at a position overlapping the optical path of the illumination light EL.
- the mask support 151 is formed so that the illumination light EL is incident on the projection optical system 13. Therefore, the illumination light EL is not shielded by the mask support 151.
- the mask support portion 151 includes a support portion 1511 and a support portion 1512 that each form part of the mask support portion 151.
- the support portion 1511 extends along the X-axis direction below the ⁇ Y side surface portion of the lower surface of the holder support portion 123.
- the support portion 1512 extends along the X-axis direction below the + Y side surface portion of the lower surface of the holder support portion 123. That is, each of the support portions 1511 and 1512 has a rectangular shape whose longitudinal direction is the X-axis direction in plan view.
- the optical path of the illumination light EL (or the optical axis of the projection optical system 13) through the mask M is separated into two support parts so as to sandwich the optical path along the Y-axis direction.
- a mask support 151 is disposed.
- a mask support 151 including a single support or a mask support 151 separated into three or more supports may be disposed on the gantry 141.
- the mask support unit 151 supports the mask stage 12 in a non-contact manner above the surface plate 14 from below the mask stage 12. That is, the mask support unit 151 supports the mask stage 12 so that the mask stage 12 floats with respect to the mask support unit 151 above the surface plate 14.
- a plurality of first gas ejection holes (not shown) and a plurality of first gas suction holes (not shown) are formed at least on the upper surface of the mask support 151.
- a porous body can be used as the mask support portion 151 in which such a plurality of first gas ejection holes and a plurality of first gas suction holes are formed.
- Gas for example, air
- a gas supply pipe 143 formed in the surface plate 14 in the gantry 141 in the example shown in FIGS. 1 to 2. Is done.
- a gas whose temperature is adjusted is supplied to the gas supply pipe 143 from a gas supply device S outside the exposure apparatus 1 through a gas supply port 144 formed on the outer surface of the surface plate 14.
- gas is ejected from the plurality of first gas ejection holes toward the lower surface of the mask stage 12 (in other words, toward the space between the mask support portion 151 and the mask stage 12).
- At least a part of the gas in the space between the mask support 151 and the mask stage 12 is sucked through the plurality of first gas suction holes.
- the gas sucked through the plurality of first gas suction holes is a gas suction pipe 145 formed in the surface plate 14 (in the frame portion 141 in the example shown in FIGS. 1 to 2) and the outer surface of the surface plate 14.
- the gas is sucked by the gas suction device R outside the exposure apparatus 1 through the gas suction port 146 formed in the above.
- the mask support portion 151 has a balance between the pressure of the gas ejected from the plurality of first gas ejection holes to the lower surface of the mask M and the negative pressure generated when the gas is sucked from the plurality of first gas suction holes, The mask stage 12 is supported without contact.
- the gas supply device S can control the relative position along the Z-axis direction of the mask stage 12 with respect to the mask support 151 by controlling the flow rate of gas to be supplied (or other arbitrary characteristics such as pressure). is there. Since the mask support 151 is fixed to the surface plate 14 that supports the projection optical system 13 and the mask stage 12 holds the mask M, the gas supply device S controls the flow rate of the supplied gas. Thus, the relative position along the Z-axis direction of the mask M with respect to the projection optical system 13 can be controlled. Similarly, the gas suction device R controls the relative position along the Z-axis direction of the mask stage 12 with respect to the mask support portion 151 by controlling the flow rate of the gas to be sucked (or other arbitrary characteristics such as pressure). It can be controlled. The gas suction device R can control the relative position along the Z-axis direction of the mask M with respect to the projection optical system 13 by controlling the flow rate of the gas to be sucked.
- At least one of the gas supply device S and the gas suction device R may control the gas flow rate so that the mask M is disposed on the object plane of the projection optical system 13. At least one of the gas supply device S and the gas suction device R may control the gas flow rate so that the mask M is disposed at a position optically conjugate with the plate P.
- a plate support 152 is disposed (in other words, fixed) on at least a part of the lower surface of the gantry 141 (that is, the surface on the ⁇ Z side, in other words, the surface that can face the plate P). ).
- the plate support 152 is disposed such that the lower surface of the plate support 152 (that is, the surface on the ⁇ Z side, in other words, the surface that can face the plate P) is exposed from the lower surface of the gantry 141.
- the lower surface of the plate support 152 is exposed from the lower surface of the gantry 141, at least a part of the plate support 152 may be embedded in the gantry 141.
- the plate support 152 is disposed at a position where at least a part of the plate support 152 can face at least a part of the plate P along the Z-axis direction. That is, the plate support 152 is disposed at a position where at least a part of the plate support 152 can be positioned above at least a part of the plate P. As will be described later, the plate P is movable along the X-axis direction and the Y-axis direction (that is, along the XY plane). In this case, the plate support 152 is disposed at a position where at least a part of the plate support 152 can be positioned above at least a part of the plate P regardless of the position of the plate P.
- the plate support 152 is disposed at a position where at least a part of the plate support 152 can be positioned above at least a part of the plate P, wherever the plate P is located.
- the in this case, for example, the plate support portion 152 may have a shape that expands along the XY plane.
- the plate support 152 is not formed in the optical path of the illumination light EL.
- the plate support 152 is not formed at a position that overlaps the optical path of the illumination light EL.
- the plate support 152 is formed so that the illumination light EL is irradiated onto the plate P. Therefore, the illumination light EL is not shielded by the plate support 152.
- the plate support 152 is a plate-like member that spreads along the XY plane so as to cover the movement range of the plate P.
- the plate support 152 has a trapezoidal opening 1521 corresponding to the trapezoidal projection area IA onto which the illumination light EL is projected so that the illumination light EL is not shielded by the plate support 152 (that is, along the Z-axis direction). Openings 1521) penetrating the plate support 152 are formed in the number corresponding to the number of projection areas IA.
- the plate support portion 152 supports the plate P in a non-contact manner from above the plate P below the surface plate 14. Since the plate support portion 152 supports the plate P from above the plate P, the plate support portion 152 supports the upper surface of the plate P.
- the upper surface of the plate P is an exposure surface of the plate P onto which the illumination light EL is projected (that is, a surface on which the projection area IA is set, a surface coated with a resist). For this reason, the plate support part 152 supports the exposure surface of the plate P in a non-contact manner. That is, the plate support unit 152 supports the plate P in a non-contact manner via the exposure surface of the plate P.
- a plurality of second gas ejection holes (not shown) and a plurality of second gas suction holes (not shown) are formed at least on the lower surface of the plate support portion 152.
- a porous body can be used as the plate support portion 152 in which the plurality of second gas ejection holes and the plurality of second gas suction holes are formed.
- a gas for example, air whose temperature is adjusted from the gas supply device S is supplied to the plurality of second gas ejection holes via the gas supply pipe 143 and the gas supply port 144.
- gas is also supplied to the plate support 152 using the gas supply pipe 143, the gas supply port 144, and the gas supply device S for supplying gas to the mask support 151. .
- gas is ejected from the plurality of second gas ejection holes toward the upper surface of the plate P (in other words, toward the space between the plate support portion 152 and the plate P).
- At least a part of the gas in the space between the plate support portion 152 and the plate P is sucked through the plurality of second gas suction holes.
- the gas sucked through the plurality of second gas suction holes is sucked by the gas suction device R through the gas suction pipe 145 and the gas suction port 146.
- the gas is sucked through the plate support 152 using the gas suction tube 145, the gas suction port 146, and the gas suction device R for sucking the gas through the mask support 151.
- the plate support part 152 has a balance between the pressure of the gas ejected from the plurality of second gas ejection holes to the upper surface of the plate P and the negative pressure generated when the gas is sucked from the plurality of second gas suction holes,
- the plate P is supported without contact.
- the plate support 152 can restrain the position of the plate P in the direction parallel to the Z-axis direction.
- the gas supply device S can control the relative position along the Z-axis direction of the plate P with respect to the plate support 152 by controlling the flow rate of the gas to be supplied (or other arbitrary characteristics such as pressure). . Since the plate support unit 152 is fixed to the surface plate 14 that supports the projection optical system 13, the gas supply device S controls the relative flow position of the plate P with respect to the projection optical system 13 by controlling the flow rate of the supplied gas. Can be controlled. Similarly, the gas suction device R controls the relative position along the Z-axis direction of the plate P with respect to the plate support 152 by controlling the flow rate of the gas to be sucked (or other arbitrary characteristics such as pressure). Is possible. The gas suction device R can control the relative position of the plate P with respect to the projection optical system 13 by controlling the flow rate of the sucked gas.
- At least one of the gas supply device S and the gas suction device R may control the gas flow rate so that the plate P is disposed on the image plane of the projection optical system 13. At least one of the gas supply device S and the gas suction device R may control the gas flow rate so that the plate P is disposed at a position optically conjugate with the mask M.
- the plate stage 16 is supported in a non-contact manner by the plate support portion 152 and the plate P whose position in the Z-axis direction is constrained along at least the X-axis direction and the Y-axis direction (that is, along the XY plane). It is a device that can be moved.
- the plate stage 16 includes a coarse movement stage 161 including a Y coarse movement stage 161Y and an X coarse movement stage 161X, and a fine movement stage 164.
- the plate stage 16 including the Y coarse movement stage 161Y, the X coarse movement stage 161X, and the fine movement stage 164 is supported by a support frame 160.
- the support frame 160 is supported by the floor surface G via a vibration isolator (not shown) including an air spring or the like. For this reason, the plate stage 16 (further, the plate P moved by the plate stage 16) is vibrationally separated from the floor surface G.
- the support frame 160 is provided separately from the surface plate 14 that supports the projection optical system 13 and the support frame 125 that supports the mask stage 12.
- the plate P moved by the plate stage 16 is placed on the surface plate 14 (further, the projection optical system 13 fixed to the surface plate 14) and the mask stage 12 (further, the mask M held by the mask stage 12). On the other hand, it is separated vibrationally.
- the support frame 160 may be supported on the floor G without using a vibration isolator (not shown) including an air spring or the like.
- the coarse movement stage 161 (that is, the Y coarse movement stage 161Y and the X coarse movement stage 161X) is in contact with the fine movement stage 164 and the Lorentz through the X fine movement stage drive system 165X and the Y fine movement stage drive system 165Y described later. Connected by force. Therefore, the vibration of coarse movement stage 161 is not transmitted to fine movement stage 164.
- At least a part of the surface plate 14 (particularly, the gantry 141) is located above (or outside) at least a part of the support frame 160, and At least a part of the support frame 125 is located above (or outside) a part. That is, at least a part of the surface plate 14 (particularly, at least a part of the gantry 141) is located between the support frame 125 and the support frame 160 along the Z-axis direction.
- the Y coarse movement stage 161Y is a plate-like member extending along the X-axis direction (for example, having a shape in which the X-axis direction is the longitudinal direction).
- the Y coarse movement stage 161Y is supported by the support frame 160 via the Y coarse movement stage drive system 162Y.
- the Y coarse movement stage 161Y is movable at least along the Y-axis direction by the Y coarse movement stage drive system 162Y.
- the Y coarse movement stage drive system 162Y is, for example, a drive system including a linear motor, but may be a drive system including another motor (or drive source).
- the Y coarse movement stage drive system 162Y is a drive system including a linear motor
- the Y coarse movement stage drive system 162Y is fixed to the upper surface of the support frame 160 and extends along the Y-axis direction.
- a mover (for example, one of a magnet and a coil) 1623Y and a stator (for example, the other of a magnet and a coil) 1624Y fixed to the upper surface of the support frame 160 and facing the mover 1623Y are included.
- the exposure apparatus 1 includes a Y coarse movement stage drive system 162Y disposed near the + X side end of the Y coarse movement stage 161Y and a -X side of the Y coarse movement stage 161Y.
- the exposure apparatus 1 may include an arbitrary number of Y coarse movement stage drive systems 162Y at arbitrary positions.
- deformation of the Y coarse movement stage 161Y (typically deformation in the Z axis direction) is mainly performed near the center of the Y coarse movement stage 161Y along the X axis direction.
- a pair of Y guide parts 1621Y and a pair of slide members 1622Y are arranged.
- the X coarse movement stage 161X is a member including a plate-shaped member and a pair of wall members extending from both end portions along the Y-axis direction of the plate-shaped member toward the + Z side.
- the X coarse movement stage 161X is supported by the Y coarse movement stage 161Y via the X coarse movement stage drive system 162X.
- the X coarse movement stage 161X can be moved at least along the X-axis direction by an X coarse movement stage drive system 162X.
- the X coarse movement stage drive system 162X is, for example, a drive system including a linear motor, but may be a drive system including another motor (or a drive source).
- the X coarse movement stage drive system 162X is a drive system including a linear motor
- the X coarse movement stage drive system 162X is fixed to the upper surface of the Y coarse movement stage 161Y and extends along the X-axis direction.
- a pair of slide members 1622X fixed to the lower surface of the guide portion 1621X and the X coarse movement stage 161X and having a U-shaped cross section so as to sandwich the pair of X guide portions 1621X, and fixed to the lower surface of the X coarse movement stage 161X
- the exposure apparatus 1 includes a single X coarse movement stage drive system 162X.
- the exposure apparatus 1 uses any number of X coarse movement stage drive systems 162
- Fine movement stage 164 includes a holding portion 1641 and a shaft portion 1642.
- the shaft portion 1642 is a columnar (or wall-shaped) member extending along the Z-axis direction.
- the shaft portion 1642 supports the holding portion 1641 from below the holding portion 1641.
- the holding part 1641 is a planar plate-like member.
- the upper surface of the holding unit 1641 can contact the lower surface of the plate P (that is, the surface opposite to the exposure surface of the plate P supported by the plate support unit 152, the back surface).
- the holding unit 1641 holds the lower surface of the plate P by suction. Therefore, a gas suction hole (not shown) is formed on the upper surface of the holding portion 1641.
- a porous body can be used as the holding portion 1641 in which such gas suction holes are formed.
- the holding portion 1641 holds a region including the central portion of the plate P on the XY plane.
- the fine movement stage 164 is movable along at least the X-axis direction while holding the plate P by the X fine movement stage drive system 165X. Further, fine movement stage 164 is movable along at least the Y-axis direction while holding plate P by Y fine movement stage drive system 165Y.
- Each of the X fine movement stage drive system 165X and the Y fine movement stage drive system 165Y is, for example, a drive system including a boil coil motor, but may be a drive system including other motors (or drive sources).
- the X fine movement stage drive system 165X is a drive system including a voice coil motor
- the X fine movement stage drive system 165X is fixed to the X guide part 1651X fixed to the shaft part 1642 and the X coarse movement stage 161X.
- the Y fine movement stage drive system 165Y is a drive system including a voice coil motor
- the Y fine movement stage drive system 165Y is fixed to the Y guide portion 1651Y fixed to the shaft portion 1642 and the X coarse movement stage 161X.
- the exposure apparatus 1 includes a single X fine movement stage drive system 165X and a single Y fine movement stage drive system 165Y, but any number of X fine movement stage drive systems 165X.
- an arbitrary number of Y stage drive systems 165Y may be provided at arbitrary positions.
- the X fine movement stage drive system 165X and the Y fine movement stage drive system 165Y also function as a support portion that supports the fine movement stage 164. That is, fine movement stage 164 is supported by X coarse movement stage 161X via X fine movement stage drive system 165X and Y fine movement stage drive system 165Y.
- the fine movement stage 164 supported by the X coarse movement stage 161X also moves along the X axis direction.
- the fine movement stage 164 supported by the Y coarse movement stage 161Y also moves along the Y axis direction. Further, the fine movement stage 164 moves along the X axis direction and the Y axis direction by the X fine movement stage drive system 165X and the Y fine movement stage drive system 165Y.
- the plate P held by the holding portion 1641 of the fine movement stage 164 also moves along each of the X-axis direction and the Y-axis direction.
- the plate P can move along each of the X-axis direction and the Y-axis direction.
- the plate P is supported in a non-contact manner by the plate support portion 152. Therefore, even if the plate P moves with the movement of the holding portion 1641 that holds the plate P, the plate support portion 152 itself does not move. For this reason, it can be said that the plate stage 16 moves the plate P relative to the plate support portion 152.
- the holding unit 1641 holds the plate P from below the plate P. That is, the holding unit 1641 does not hold the plate P from above the plate P. For this reason, the exposure of the plate P by the illumination light EL is not hindered by the holding portion 1641. Therefore, the holding unit 1641 faces the projection optical system 13 that projects the illumination light EL along the Z-axis direction as at least one of the X coarse movement stage 161X, the Y coarse movement stage 161Y, and the fine movement stage 164 moves. The position can be passed while holding the plate P.
- the holding unit 1641 passes the optical axis (that is, the optical center) of the projection optical system 13 while holding the plate P as at least one of the X coarse movement stage 161X, the Y coarse movement stage 161Y, and the fine movement stage 164 moves. can do.
- the unit movement amount (so-called stroke amount) of the Y coarse movement stage 161Y by the Y coarse movement stage drive system 162Y is larger than the stroke amount of the fine movement stage 164 in the Y-axis direction by the Y fine movement stage drive system 165Y.
- the stroke amount of the X coarse movement stage 161X by the X coarse movement stage drive system 162X is larger than the stroke amount of the fine movement stage 164 by the X fine movement stage drive system 165X in the X-axis direction.
- the Y coarse movement stage 161Y relatively roughly controls the position of the plate P in the Y-axis direction by moving the plate P relatively large along the Y-axis direction.
- the X coarse movement stage 161X relatively roughly controls the position of the plate P in the X-axis direction by relatively moving the plate P along the X-axis direction.
- the fine movement stage 164 moves the plate P relatively finely along each of the X-axis direction and the Y-axis direction, thereby relatively moving the respective positions of the plate P in the X-axis direction and the Y-axis direction. Finely control.
- the plate support portion 152 that supports the plate P is disposed on the surface plate 14 that supports the projection optical system 13. Further, the plate support 152 may be supported by a support frame connected to the surface plate 14 via an intermediate member (that is, at a position away from the surface plate 14). The effect that the heat accumulated in the projection optical system 13 supported by the surface plate 14 is not transmitted to the plate support 152 is obtained.
- a mask support 151 for supporting the mask M is disposed on the surface plate 14 for supporting the projection optical system 13. Further, the mask support 151 may be supported by a support frame connected to the surface plate 14 via an intermediate member (that is, at a position away from the surface plate 14). The effect that the heat accumulated in the projection optical system 13 supported by the surface plate 14 is not transmitted to the mask support 151 is obtained.
- both the plate support portion 152 and the mask support portion 151 are disposed on the same member, for example, the surface plate 14. Further, the plate support portion 152 and the mask support portion 151 may be disposed on different members connected to each other via the intermediate member.
- the plate P is supported by the plate support portion 152 in a non-contact manner. Accordingly, the plate stage 16 can move the substantially floating plate P that is not contact-supported by the plate support portion 152. Furthermore, the plate stage 16 can move the plate P in a state where the plate P is not held by a relatively heavy plate holder. That is, the plate stage 16 can move the plate P that is a relatively light moving object for the plate stage 16. For this reason, the plate stage 16 can move the plate P only by applying a relatively small force to the plate P. For this reason, it leads to simplification of the structure of the plate stage 16. Furthermore, reaction force and vibration that can be generated in the plate stage 16 and the like as the plate P moves are also relatively reduced.
- reaction force and vibration itself that can occur in the plate stage 16 and the like with the movement of the plate P are less likely to occur. Considering that such reaction force and vibration may lead to deterioration of positioning accuracy of the plate P, supporting the plate P in a non-contact manner may lead to suppression of deterioration of positioning accuracy of the plate P.
- the mask M is supported by the mask support 151 in a non-contact manner. Therefore, the mask stage 12 can move the mask M that is substantially levitated. Therefore, the mask cottage 12 can move the mask M only by applying a relatively small force to the mask M. This leads to simplification of the structure of the mask stage 12. Furthermore, reaction force and vibration that can be generated in the mask stage 12 and the like as the mask M moves are also relatively reduced. Alternatively, reaction forces and vibrations that can occur on the mask stage 12 and the like with the movement of the mask M are less likely to occur. Considering that such reaction force and vibration can lead to deterioration of the positioning accuracy of the mask M, supporting the mask M in a non-contact manner can suppress deterioration of the positioning accuracy of the mask M.
- the plate support unit 152 supports the upper surface (that is, the exposure surface, the surface) of the plate P in a non-contact manner. For this reason, the space
- the plate support unit 152 jets gas to the exposure surface of the plate P in order to support the plate P. For this reason, the entry of dust between the exposure surface of the plate P and the plate support 152 is appropriately suppressed by the gas ejected from the plate support 152. Further, the dust that has entered between the exposure surface of the plate P and the plate support portion 152 is caused between the exposure surface of the plate P and the plate support portion 152 by the gas ejected from the plate support portion 152. It is discharged outside the space. Therefore, the deterioration of exposure accuracy or the occurrence of defective exposure due to dust is appropriately suppressed.
- the gas supply pipe 143 is also used as a gas supply pipe for supplying gas to the plate support part 152 and as a gas supply pipe for supplying gas to the mask support part 151. Is also used. For this reason, the structure of the gas supply pipe 143 can be simplified.
- the gas suction tube 145 is also used as a gas suction tube for sucking gas through the plate support portion 152 and also as a gas suction tube for sucking gas through the mask support portion 151. Used. For this reason, the structure of the gas suction tube 145 can be simplified. As a result, the structure of the surface plate 14 on which the gas supply pipe 143 and the gas suction pipe 145 are formed can be simplified.
- the relative position of the plate P with respect to the projection optical system 13 is controlled by controlling at least one of the flow rate of the gas supplied from the plate support unit 152 and the flow rate of the gas sucked through the plate support unit 152.
- the plate stage 16 includes a drive system for adjusting the position of the plate P along the Z-axis direction (for example, a drive system that moves the holding portion 1641 that holds the plate P along the Z-axis direction). It does not have to be. For this reason, the plate stage 16 can be simplified.
- the plate stage 16 may include a drive system for adjusting the position of the plate P along the Z-axis direction.
- the relative position of the mask M with respect to the projection optical system 13 is controlled by controlling at least one of the flow rate of the gas supplied from the mask support 151 and the flow rate of the gas sucked through the mask support 151.
- the mask stage 12 includes a drive system for adjusting the position of the mask M along the Z-axis direction (for example, a drive system that moves the mask holder 121 that holds the mask M along the Z-axis direction). It does not have to be. For this reason, the mask stage 12 can be simplified.
- the mask stage 12 may include a drive system for adjusting the position of the mask M along the Z-axis direction.
- the holding part 1641 of the plate stage 16 holds an area including the central part of the plate P. For this reason, compared with the case where the holding
- the gantry 141 and the plate support 152 can be physically separated.
- the gantry 141 and the plate support 152 may be integrated.
- a part of the gantry 141 may function as the plate support 152.
- a gas ejection hole connected to the gas supply pipe 143 and a gas suction hole connected to the gas suction pipe 145 may be formed on the lower surface of the gantry 141.
- a part of the gantry 141 (specifically, the part where the gas ejection hole and the gas suction hole are formed) functions as the plate support part 152.
- the plate support portion 152 may be disposed in the first region on the lower surface of the gantry portion 141, and the portion including the second region on the lower surface of the gantry portion 141 may function as the plate support portion 152.
- a plate support 152 in which gas ejection holes are formed but no gas suction holes are formed is arranged, and in the fourth region on the lower surface of the gantry 141, A gas suction hole may be formed.
- a plate support 152 in which gas suction holes are formed but no gas ejection holes are disposed, and in the sixth region on the lower surface of the gantry 141, A gas ejection hole may be formed.
- the gantry 141 and the mask support 151 can be physically separated.
- the gantry 141 and the mask support 151 may be integrated.
- a part of the gantry 141 may function as the mask support 151.
- a gas ejection hole connected to the gas supply pipe 143 and a gas suction hole connected to the gas suction pipe 145 may be formed on the upper surface of the gantry 141.
- a part of the gantry 141 (specifically, a part where the gas ejection hole and the gas suction hole are formed) functions as the mask support part 151.
- the mask support 151 may be disposed in the seventh region on the upper surface of the gantry 141, and the portion including the eighth region on the upper surface of the gantry 141 may function as the mask support 151.
- a mask support 151 having gas ejection holes but not having gas suction holes is disposed, and in the tenth region on the lower surface of the gantry 141, A gas suction hole may be formed.
- a mask support 151 having gas suction holes formed but not having gas ejection holes is disposed, and in the twelfth region on the lower surface of the gantry 141, A gas ejection hole may be formed.
- At least a part of the mask support 151 may be opposed to at least a part of the mask M along the Z-axis direction (in other words, it may be located below at least a part of the mask M).
- at least a part of the mask support portion 151 may face the outer peripheral portion of the mask M on which no mask pattern is formed.
- An exposure apparatus 8 according to an eighth embodiment to be described later is an example of an exposure apparatus in which at least a part of the mask support 151 is opposed to at least a part of the mask M along the Z-axis direction.
- at least another part of the mask support 151 may be opposed to the mask stage 12 or opposed. It does not have to be.
- the plate support 152 has the opening 1521 corresponding to the projection area IA so that the illumination light EL is not shielded by the plate support 152.
- the opening 1521 may be filled with a transparent member 153 as shown in the exposure apparatus 1-1 of the modification of FIG.
- the transparent member 153 is a member through which the illumination light EL can pass. Therefore, even if the opening 1521 is filled with the transparent member 153, the illumination light EL is not shielded by the transparent member 153. Further, since the opening 1521 is filled with the transparent member 131, the pressure of the gas ejected from the plate support 152 to the upper surface of the plate P and the negative pressure generated when the gas is sucked from the plate support 152 are transparent.
- the plate support 152 itself may be made of a material that can pass the illumination light EL (that is, a transparent material).
- a part of the plate support portion 152 corresponding to the projection area IA may be formed of a transparent material. Even in this case, since the force for supporting the plate P acts on the plate P even immediately above the projection area IA, the plate P can be supported more appropriately.
- At least one of the gas supply pipe 143 and the gas suction pipe 145 may not be formed in the gantry 141. At least one of the gas supply pipe 143 and the gas suction pipe 145 may be arranged on the outer surface or the outside of the gantry 141 (or the leg 142). At least one of the gas supply pipe 143 and the gas suction pipe 145 may be arranged independently of the surface plate 14.
- the gas supply pipe 143 supplies gas to both the mask support 151 and the plate support 152.
- the gas supply device S controls the flow rate of the gas to control the relative position of the plate P with respect to the projection optical system 13
- the gas supply device S controls the flow rate of the gas to control the relative position of the plate P with respect to the projection optical system 13
- the relative position of the plate P with respect to the projection optical system 13 is controlled, but also the relative position of the mask M with respect to the projection optical system 13 may change unintentionally.
- the gas supply device S controls the flow rate of the gas in order to control the relative position of the mask M with respect to the projection optical system 13, not only the flow rate of the gas ejected from the mask support portion 151 but also from the plate support portion 152.
- the flow rate of the ejected gas can also change.
- the relative position of the mask M relative to the projection optical system 13 controlled, but the relative position of the plate P relative to the projection optical system 13 may change unintentionally.
- the gas supply pipe 143 includes a first gas supply pipe connected to the gas supply port 144, a second gas supply pipe connected to the mask support 151 from the first gas supply pipe, and a first A first adjustment device (for example, a valve) capable of adjusting the flow rate of the gas supplied from the gas supply pipe to the second gas supply pipe, and a first support device connected to the plate support 152 from the first gas supply pipe.
- a first adjustment device for example, a valve
- 3 gas supply pipes, and a second adjustment device capable of adjusting the flow rate of the gas supplied from the first gas supply pipe to the third gas supply pipe.
- a gas supply pipe that supplies gas to the mask support 151 and a gas supply pipe that supplies gas to the plate support 152 may be formed separately. Also in this case, since the flow rate of the gas ejected from the mask support 151 and the flow rate of the gas ejected from the plate support 152 can be controlled separately, the relative position of the mask M with respect to the projection optical system 13 and the projection optical system 13 The relative position of the plate P with respect to can be controlled separately.
- a gas supply port for supplying gas to the mask support 151 and a gas supply port for supplying gas to the plate support 152 may be formed separately.
- a gas supply device that supplies gas to the mask support 151 and a gas supply device that supplies gas to the plate support 152 may be prepared separately.
- the gas suction tube 145 sucks gas through both the mask support 151 and the plate support 152.
- the gas suction device R controls the flow rate of the gas in order to control the relative position of the plate P with respect to the projection optical system 13, not only the flow rate of the gas sucked through the plate support unit 152 but also the mask support.
- the flow rate of the gas sucked through the portion 151 may also change unintentionally.
- the gas suction device R controls the flow rate of the gas to control the relative position of the mask M with respect to the projection optical system 13, not only the flow rate of the gas sucked through the mask support 151 but also the plate support.
- the gas suction tube 145 includes a first gas suction tube connected to the gas suction port 146, a second gas suction tube connected to the mask support 151 from the first gas suction tube, and a second A third adjusting device (for example, a valve) capable of adjusting the flow rate of the gas sucked from the gas suction pipe to the first gas suction pipe, and a first support connected to the plate support 152 from the first gas suction pipe.
- 3 gas suction pipes, and a fourth adjustment device for example, a valve capable of adjusting the flow rate of the gas sucked from the third gas supply pipe to the first gas supply pipe.
- the relative position of the mask M with respect to the projection optical system 13 is controlled.
- the relative position of the plate P with respect to the projection optical system 13 can be controlled separately.
- a gas suction tube that sucks gas through the mask support 151 and a gas suction tube that sucks gas through the plate support 152 may be formed separately.
- a gas suction port that sucks gas through the mask support 151 and a gas suction port that sucks gas through the plate support 152 may be formed separately.
- a gas suction device that sucks gas through the mask support 151 and a gas suction device that sucks gas through the plate support 152 may be prepared separately.
- the holding part 1641 of the plate stage 16 may hold an area other than the area including the central part of the plate P.
- the holding unit 1641 may hold a region near the outer edge of the plate P. Even in this case, the plate stage 16 can move the plate P.
- the exposure apparatus 1 does not supply or suck gas from the mask support portion 151, but from the mask stage 12 side. Gas is supplied or sucked toward the upper surface (or the upper surface of the surface plate 14) to support the mask stage 12 in a non-contact manner with respect to the mask support 151 (or the upper surface of the surface plate 14). You may do it.
- the exposure apparatus 1 supports the mask M by supporting the mask M or the mask stage 12 (for example, a support that supports the mask M or the mask stage 12 by suction). ) May be provided.
- FIG. 5 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 2 of the second embodiment.
- the same referential mark is attached
- FIG. 5 in order to make the drawing easy to see, some of the same components as those included in the exposure apparatus 1 of the first embodiment described above are omitted.
- the exposure apparatus 2 includes the same components as the components included in the exposure apparatus 1. The same applies to the third and subsequent embodiments described below.
- the exposure apparatus 2 of the second embodiment differs from the exposure apparatus 1 of the first embodiment in that it further includes a surface plate 24 that is separated from the surface plate 14. Yes. Furthermore, the exposure apparatus 2 of the second embodiment is different from the exposure apparatus 1 of the first embodiment in that the mask support 151 is disposed on the surface plate 24 instead of the surface plate 14. .
- the other structure of the exposure apparatus 2 may be the same as the other structure of the exposure apparatus 1.
- the surface plate 24 includes a gantry 241 and a plurality of legs 242.
- the gantry 241 is a plate-shaped (or frame-shaped) member that extends along the XY plane in the space between the mask stage 12 and the gantry 141.
- the gantry 241 is located above (or outside) the gantry 141. Therefore, in the second embodiment, at least a part of the gantry unit 241 is located between at least a part of the gantry unit 141 and at least a part of the mask stage 12.
- the shape of the gantry 241 on the XY plane is a rectangle, but may be other shapes.
- An opening that penetrates the gantry 241 along the Z-axis direction is formed at the center of the gantry 241 on the XY plane (particularly, the region through which the illumination light EL passes).
- the illumination light EL that has passed through the mask M enters the projection optical system 13 through an opening formed in the gantry 241.
- the opening formed in the gantry 241 may be filled with a transparent member.
- the illumination light EL that has passed through the mask M is incident on the projection optical system 13 without being shielded because it passes through the transparent member.
- Each of the plurality of leg portions 242 is a columnar member extending along the Z-axis direction. The plurality of leg portions 242 are located outside the plurality of leg portions 142, but may not be located outside.
- the plurality of legs 242 support the gantry 241 from below in the vicinity of the outer edge (for example, four corners) of the gantry 241 on the XY plane.
- Each of the plurality of leg portions 242 is supported by the floor surface G via a vibration isolator (not shown) including an air spring or the like. For this reason, the surface plate 24 is vibrationally separated from the floor surface G.
- a mask support 151 is disposed (in other words, fixed) on at least a part of the upper surface of the gantry 241 (that is, the surface on the + Z side, in other words, the surface that can face the mask stage 12). ). Except for the point that the mask support 151 is arranged on the upper surface of the gantry 241, the structure of the mask support 151 in the second embodiment is the same as the structure of the mask support 151 in the first embodiment.
- the mask support unit 151 supports the mask stage 12 in a non-contact manner from below the mask stage 12 above the surface plate 24.
- Gas supply pipes formed in the surface plate 24 instead of the gas supply pipe 143 in the plurality of first gas ejection holes formed in the mask support portion 151.
- a gas is supplied via 243.
- a gas is supplied to the gas supply pipe 243 from a gas supply device S (not shown in FIG. 5) via a gas supply port 244 formed on the outer surface of the surface plate 24. Therefore, in the first embodiment, the gas supply pipe 143 and the gas supply port 144 formed on the surface plate 14 are used to supply gas to the plate support portion 152, while supplying gas to the mask support portion 151.
- the gas sucked through the plurality of first gas suction holes formed in the mask support portion 151 is replaced with the gas suction pipe 145 in the surface plate 24 (in the gantry 241 in the example shown in FIG. 5).
- the gas is sucked by the gas suction device R (not shown in FIG. 5) through the gas suction pipe 245 formed and the gas suction port 246 formed on the outer surface of the surface plate 24. Therefore, in the first embodiment, the gas suction pipe 145 and the gas suction port 146 formed on the surface plate 14 are used for sucking the gas through the plate support portion 152, while via the mask support portion 151. Therefore, it may not be used to suck the gas.
- the plate support portion 152 that supports the plate P is disposed on the surface plate 14 that supports the projection optical system 13 as in the exposure apparatus 1 of the first embodiment.
- the exposure apparatus 2 of the second embodiment has the effects that can be enjoyed by the exposure apparatus 1 of the first embodiment (however, the effects that can be enjoyed by arranging the mask support portion 151 on the surface plate 14 are excluded). The same effect can be enjoyed.
- the mask stage 12 is disposed above the gantry unit 241, and the mask support unit 151 is disposed on the upper surface of the gantry unit 241.
- the mask stage 12 may be disposed below the gantry unit 241 and above the gantry unit 141.
- the mask support 151 may be disposed on the lower surface of the gantry 241.
- the mask support unit 151 may support the mask stage 12 from above the mask stage 12 in a non-contact manner below the surface plate 24. In this case, since the possibility that the mask M falls from the mask holder 121 is relatively reduced, the mask stage 12 may not include the fixture 122.
- FIG. 7 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 3 of the third embodiment.
- the exposure apparatus 3 of the third embodiment differs from the exposure apparatus 1 of the first embodiment in that it further includes a surface plate 34 that is separated from the surface plate 14. Yes. Furthermore, in the exposure apparatus 3 of the third embodiment, as compared with the exposure apparatus 1 of the first embodiment, the mask support part 151 and the stage support part 152 are arranged on the surface plate 34 instead of the surface plate 14. It is different in that it is. Further, in the exposure apparatus 3 of the third embodiment, the gas supply pipe 143, the gas supply port 144, the gas suction pipe 145, and the gas suction port 146 are formed on the surface plate 14 as compared with the exposure apparatus 1 of the first embodiment. It is different in that it does not have to be. The other structure of the exposure apparatus 3 may be the same as the other structure of the exposure apparatus 1.
- the surface plate 34 includes a gantry 341 and a plurality of legs 342.
- the gantry 341 is a plate-shaped (or frame-shaped) member that extends along the XY plane in the space between the mask stage 12 and the plate stage 16.
- the shape of the gantry 341 on the XY plane is a rectangle, but may be other shapes.
- Each of the plurality of leg portions 342 is a columnar member extending along the Z-axis direction.
- the plurality of leg portions 342 are located inside the plurality of leg portions 142, but may not be located inside.
- the plurality of legs 342 support the gantry 341 from below in the vicinity of the outer edge (for example, four corners) of the gantry 341 on the XY plane.
- Each of the plurality of leg portions 342 is supported by the floor G through a vibration isolator (not shown) including an air spring or the like. For this reason, the surface plate 34 is vibrationally separated from the floor G.
- the gantry unit 341 is disposed at a position where it does not interfere with the gantry unit 141 (that is, it does not collide or contact).
- the gantry 341 has a structure that does not interfere with the gantry 141.
- a space 347 in which at least a part of the gantry 141 and the projection optical system 13 supported by the gantry 141 are arranged is formed in the gantry 341.
- the upper surface of the gantry unit 341 is located above the upper surface of the gantry unit 141.
- the lower surface of the gantry 341 is positioned below the lower surface of the gantry 141. Further, in the example shown in FIG.
- a part of the gantry 141 connected to the leg 142 is arranged outside the gantry 341, while the other part of the gantry 141 is inside the gantry 341.
- the space 347 communicates with the space outside the gantry 341 via the opening 3471 formed on the outer surface (particularly, the side surface) of the gantry 341.
- the gantry 341 may have any structure.
- An opening that penetrates the gantry 341 along the Z-axis direction is formed in the center of the gantry 341 on the XY plane (particularly, the region through which the illumination light EL passes).
- the opening that penetrates the gantry 341 along the Z-axis direction overlaps with the opening that penetrates the gantry 141 along the Z-axis direction (that is, the opening in which the projection optical system 13 is disposed) along the Z-axis direction. .
- the illumination light EL that has passed through the mask M enters the projection optical system 13 through an opening that penetrates the gantry 341.
- a mask support 151 is disposed on at least a part of the upper surface of the gantry 341 (in other words, fixed). Except for the point that the mask support 151 is disposed on the upper surface of the gantry 241, the structure of the mask support 151 in the third embodiment is the same as the structure of the mask support 151 in the first embodiment. Further, a plate support 152 is disposed (in other words, fixed) on at least a part of the lower surface of the gantry 341. Except for the point that the plate support 152 is disposed on the lower surface of the gantry 341, the structure of the plate support 152 in the third embodiment is the same as the structure of the plate support 152 in the first embodiment.
- the mask support unit 151 supports the mask stage 12 in a non-contact manner from below the mask stage 12 above the surface plate 34.
- the plate support unit 152 supports the plate P in a non-contact manner from above the plate P below the surface plate 34.
- a plurality of first gas ejection holes formed in the mask support 151 and a plurality of second gas ejection holes formed in the plate support 152 are provided in the surface plate 34 (see FIG. 7).
- gas is supplied via a gas supply pipe 343 formed in the gantry 341). Gas is supplied to the gas supply pipe 343 from a gas supply device S (not shown in FIG. 7) via a gas supply port 344 formed on the outer surface of the surface plate 34.
- the gas sucked through the plurality of first gas suction holes formed in the mask support portion 151 and the plurality of second gas suction holes formed in the plate support portion 152 is replaced with the gas suction pipe 145, and the surface plate Gas suction device R (however, FIG. (Not shown).
- both the plate support part 152 and the mask support part 151 are arranged on the same surface plate 34 as in the exposure apparatus 1 of the first embodiment. For this reason, similarly to the first embodiment, the deterioration of the positioning accuracy of the plate P with respect to the mask M is appropriately suppressed. Furthermore, the exposure apparatus 3 of the third embodiment can enjoy the effect that vibration generated by the movement of the mask M and the plate P is not transmitted to the projection optical system 13. Furthermore, the exposure apparatus 3 of the third embodiment can be enjoyed by the effects that the exposure apparatus 1 of the first embodiment can enjoy (however, the mask support part 151 and the plate support part 152 are arranged on the surface plate 14, respectively. It is possible to enjoy the same effects as (except possible effects).
- the mask stage 12 may be disposed below the upper surface of the gantry 341 and above the gantry 141.
- the mask support portion 151 may be disposed on a surface portion of the inner surface of the gantry portion 341 (that is, the inner surface that defines the space 347) that can face the mask stage 12.
- FIG. 8 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 4 of the fourth embodiment.
- FIG. 9 is a cross-sectional view showing the cross section along the XZ plane of the exposure apparatus 4 of the fourth embodiment (for convenience of the drawing, some constituent elements are shown with side faces).
- FIG. 10 is a plan view of the surface plate 44 observed from below.
- the exposure apparatus 4 of the fourth embodiment is different from the exposure apparatus 1 of the first embodiment in that it further includes an encoder system 47. Further, in the exposure apparatus 4 of the fourth embodiment, compared to the exposure apparatus 1 of the first embodiment, a part of the structure of the surface plate 44 and the plate stage 46 is the surface plate 14 in order to arrange the encoder system 47. The plate stage 16 is different from a part of the structure of the plate stage 16. Specifically, in the exposure apparatus 4 of the fourth embodiment, a part of the structure of the gantry unit 441 of the surface plate 44 and the fine movement stage 464 of the plate stage 46 is a gantry compared to the exposure apparatus 1 of the first embodiment. This is different in that it is different from the structures of the part 141 and the fine movement stage 164. The other structure of the exposure apparatus 4 may be the same as the other structure of the exposure apparatus 1.
- Encoder system 47 measures the position of plate P.
- the encoder system 47 includes an encoder head 471, an encoder scale 472, an encoder head 473, and an encoder scale 474.
- Encoder head 471 includes X head 471X and Y head 471Y.
- the encoder scale 472 includes an X scale 472X including a diffraction grating in which a plurality of grating lines extending along the Y-axis direction are formed at a predetermined pitch in the X-axis direction, and a plurality of grating lines extending along the X-axis direction as the Y-axis.
- Y scale 472Y including a diffraction grating formed at a predetermined pitch in the direction.
- the X head 471X emits a measurement beam to the X scale 472X and receives an interference beam from the X scale 472X.
- the X head 471X and the X scale 472X are disposed at positions that can face each other (particularly, positions that can face each other along the Z-axis direction).
- the Y head 471Y emits a measurement beam to the Y scale 472Y and receives an interference beam from the Y scale 472Y.
- the Y head 471Y and the Y scale 472Y are disposed at positions that can face each other (particularly, positions that can face each other along the Z-axis direction).
- the encoder head 471 is disposed on the plate stage 46, for example.
- the encoder head 471 is disposed on a member that moves in the same manner as the plate P in the plate stage 46.
- the encoder head 471 is disposed on the fine movement stage 464 (for example, the holding unit 1641) that holds the plate P.
- the encoder head 471 is disposed on the lower surface of the holding portion 1641.
- the encoder scale 472 is disposed on an object different from the surface plate 44 and the plate stage 46 (or the fine movement stage 464), for example.
- the object on which the encoder scale 472 is disposed can move relative to the surface plate 44 (particularly, moveable along at least one of the X-axis direction and the Y-axis direction).
- the body is used.
- a support frame 475 that can move relative to the surface plate 44 along the Y-axis direction is used as such a moving body will be described. It is not limited to.
- the support frame 475 includes a beam portion 4751, a pair of column portions 4752, and a pair of terminal portions 4753.
- the beam portion 4751 is a rod-like member that extends along the X-axis direction below the gantry portion 441. In the example shown in FIGS. 8 to 10, the beam portion 4751 extends along the X-axis direction below the plate P.
- the length of the beam portion 4751 along the X-axis direction is longer than the length of the maximum movement range of the plate stage 46 (particularly, the maximum movement range of the fine movement stage 464) along the X-axis direction. Both ends of the beam portion 4751 are located outside the plate support portion 152.
- the beam portion 4751 extends along the X-axis direction below the plate support portion 152 so as to cross both end portions of the plate support portion 152 along the X-axis direction.
- the pair of column portions 4752 are columnar members extending upward from both ends of the beam portion 4751 (that is, toward the gantry portion 441).
- the pair of column parts 4752 supports the beam part 4751 so as to hang from above the beam part 4751.
- the pair of terminal portions 4753 are plate-like members in plan view that are connected to the upper ends of the pair of column portions 4752.
- the upper surface of the end portion 4753 faces the lower surface of the gantry 441 (particularly, the portion of the lower surface where the plate support portion 152 is not disposed).
- the size of the terminal end portion 4753 on the XY plane is slightly larger than the size of the column portion 4752 on the XY plane. Therefore, the lower surface of the terminal end portion 4753 protrudes outward from the side surface of the column portion 4752.
- the lower surfaces of the pair of terminal portions 4753 are a pair of Y guides disposed so as to correspond to the pair of terminal portions 4753 on the lower surface of the gantry unit 441 outside the both ends of the plate support unit 152 along the X-axis direction.
- the portion 447 is supported from below.
- the Y guide portion 447 protrudes downward from the lower surface of the gantry portion 441 and faces a pair of wall portions 4471 along the X-axis direction, and the lower end portion of the pair of wall portions 4471. And a pair of bottom portions 4472 protruding so as to approach each other along the X-axis direction. A gap 4473 is secured between the pair of bottom portions 4472.
- the lower surfaces of the pair of terminal portions 4753 are supported from below by the bottom portion 4472 of the Y guide portion 447.
- the support frame 475 is supported so as to be suspended by the Y guide portion 447 below the gantry portion 441.
- the bottom portion 4472 ejects gas in the + Z direction and supports the end portion 4753 so as to float.
- the encoder scale 472 is disposed on the beam portion 4751.
- the X scale 472X is disposed in the first X scale region extending along the X axis direction on the upper surface of the beam portion 4751, and further, the X scale 472X extending along the X axis direction so as to be adjacent to the first X scale region.
- the Y scale 472Y is arranged in the 1Y scale area.
- the beam portion 4751 has the beam portion 4751 facing the holding portion 1641 so that the encoder head 471 arranged on the holding portion 1641 and the encoder scale 472 arranged on the beam portion 4751 face each other (particularly in the Z-axis direction). Are arranged to face each other).
- the beam portion 4751 since the encoder head 471 is disposed on the lower surface of the holding portion 1641 and the encoder scale 472 is disposed on the upper surface of the beam portion 4751, the beam portion 4751 has the upper surface of the beam portion 4751 on the holding portion 1641. It arrange
- the fine movement stage 464 can support the holding portion 1641 from below instead of the shaft portion 1642 described above, and the beam portion 4751 can hold the holding portion 1641.
- positioned under 1641 is included. In the example shown in FIGS.
- a bottom portion 4643 disposed below the holding portion 1641 and a pair extending from both ends of the bottom portion 4463 in the Y-axis direction toward the lower surface of the holding portion 1641.
- a housing 4642 including a wall portion 4644 is used.
- the housing 4642 can support the holding portion 1641 from below using a pair of wall portions 4644. Further, the housing 4642 can define a space 4645 surrounded by a bottom portion 4463 and a pair of wall portions 4644 below the lower surface of the holding portion 1641.
- the beam portion 4751 is arranged with respect to the fine movement stage 464 so as to pass through the space 4645 below the holding portion 1641. As a result, the beam portion 4751 can be arranged with respect to the plate stage 46 so that the encoder head 471 faces the encoder scale 472.
- the Y guide portion 447 has a guide function for guiding the movement of the support frame 475 along the Y-axis direction in addition to the function of supporting the support frame 475.
- each of the pair of wall portions 4471 and the pair of bottom portions 4472 of the Y guide portion 447 extends along the Y-axis direction (see FIG. 10).
- the end portion 4753 is supported by air levitation (or non-contact support) by a pair of wall portions 4471 and a pair of bottom portions 4472, and the distance therebetween is supported by an air gap of about several tens of micrometers.
- the gap 4473 is a slit extending along the Y-axis direction.
- the support frame 475 moves so that the state where the encoder head 471 faces the encoder scale 472 is maintained. Since the encoder head 471 is disposed on the plate stage 46 (particularly, the fine movement stage 464), the support frame 475 moves in the same manner as the fine movement stage 464 in order to maintain the state where the encoder head 471 faces the encoder scale 472. To do. That is, the support frame 475 moves so as to follow the fine movement stage 464.
- the beam portion 4751 of the support frame 475 has a shape extending along the X-axis direction
- the encoder scale 472 also has a shape extending along the X-axis direction.
- the support frame 475 moves so as to follow the movement of the fine movement stage 464 along the Y-axis direction. That is, the support frame 475 does not have to move along the X-axis direction.
- the support frame 475 may not move so as to follow the movement of the fine movement stage 464 along the X-axis direction.
- the exposure apparatus 4 may include a frame drive system for moving the support frame 475.
- the frame drive system may be a drive system including a linear motor, or a drive system including other motors (for example, a rotating belt coupled to the support frame 475, a pulley that supports the rotating belt, and the pulley And a drive system including a motor for rotationally driving the motor.
- the exposure apparatus 4 may not include a frame drive system for moving the support frame 475. In this case, the support frame 475 may move by being physically pushed out (or pulled) by at least a part of the plate stage 46.
- the support frame 475 moves so as to follow the Y coarse movement stage 161Y (as a result, follow the fine movement stage 464) by being physically pushed out (or pulled) by the Y coarse movement stage 161Y. May be.
- the support frame 475 may be moved so as to follow the fine movement stage 464 by being physically pushed out (or pulled) by the fine movement stage 464.
- Encoder head 473 includes X head 473X and Y head 473Y.
- the encoder scale 474 includes an X scale 474X including a diffraction grating in which a plurality of grating lines extending along the Y-axis direction are formed at a predetermined pitch in the X-axis direction, and a plurality of grating lines extending along the X-axis direction are defined as the Y-axis.
- Y scale 474Y including a diffraction grating formed at a predetermined pitch in the direction.
- the X head 473X irradiates the X scale 474X with a measurement beam and receives an interference beam from the X scale 474X.
- the X head 473X and the X scale 474X are disposed at positions that can face each other (particularly, positions that can face each other along the Z-axis direction).
- the Y head 473Y irradiates the measurement beam to the Y scale 474Y and receives the interference beam from the Y scale 474Y.
- the Y head 473Y and the X scale 474Y are disposed at positions that can face each other (particularly, positions that can face each other along the Z-axis direction).
- the encoder head 473 is disposed, for example, on an object (that is, the support frame 475) on which the encoder scale 472 is disposed. In the example shown in FIGS. 8 to 10, the encoder head 473 is disposed at the end portion 4753 of the support frame 475. Specifically, a concave portion 4754 is formed on the upper surface of the terminal end portion 4753. The encoder head 473 is disposed so as to be received in the recess 4754.
- the encoder scale 474 is disposed on the surface plate 44, for example. In the example shown in FIGS. 8 to 10, the encoder scale 474 is disposed on the lower surface of the surface plate 44.
- a recess 448 is formed on the lower surface of the surface plate 44 (particularly, the portion of the lower surface where the plate support 152 is not disposed and the end portion 4753 of the support frame 475 is opposed).
- the encoder scale 474 is disposed so as to be accommodated in the recess 448.
- the encoder head 473 arranged on the support frame 475 also moves along the Y-axis direction.
- the encoder scale 474 is disposed in the second X scale region extending along the Y-axis direction so that the state in which the encoder head 473 faces the encoder scale 474 is maintained even when the support frame 475 moves.
- a scale 474X, and a Y scale 474Y disposed in a second Y scale region extending along the Y-axis direction so as to be adjacent to the second X scale region.
- the light reception result of the X head 471X includes information on the relative position of the X head 471X with respect to the X scale 472X (particularly, the relative position along the X-axis direction). Since the X scale 472X is disposed on the support frame 475 and the X head 471X is disposed on the fine movement stage 464, the light reception result of the X head 471X is substantially in the X-axis direction of the fine movement stage 464 with respect to the support frame 475. Contains information about the relative position along. Further, since fine movement stage 464 holds plate P, the light reception result of X head 471X substantially includes information regarding the relative position of plate P with respect to support frame 475 along the X-axis direction. For the same reason, the light reception result of the Y head 471Y substantially includes information on the relative position along the Y-axis direction of the plate P with respect to the support frame 475.
- the light reception result of the X head 473X includes information regarding the relative position of the X head 473X with respect to the X scale 474X (particularly, the relative position along the X-axis direction). Since the X scale 474X is disposed on the surface plate 44 and the X head 473X is disposed on the support frame 475, the light reception result of the X head 473X is substantially in the X-axis direction of the support frame 475 with respect to the surface plate 44. Contains information about the relative position along. For the same reason, the light reception result of the Y head 473Y substantially includes information on the relative position of the support frame 475 along the Y-axis direction with respect to the surface plate 44.
- the light reception result of the X head 471X and the light reception result of the X head 473X substantially include information on the relative position along the X axis direction of the plate P with respect to the surface plate 44. Since the projection optical system 13 is disposed on the surface plate 44, the light reception result of the X head 471X and the light reception result of the X head 473X are substantially relative to the projection optical system 13 along the X-axis direction of the plate P. Contains information about the location. For the same reason, the light reception result of the Y head 471Y and the light reception result of the Y head 473Y substantially include information on the relative position along the Y-axis direction of the plate P with respect to the projection optical system 13. Therefore, the encoder system 47 is a measurement system for measuring the position of the plate P (in particular, the relative position of the plate P with respect to the projection optical system 13).
- the measurement result of the encoder system 47 is appropriately referred to by a control device that controls the operation of the exposure apparatus 4 when the plate P is exposed.
- the control device controls the position of the plate P based on the measurement result of the encoder system 47.
- the exposure apparatus 4 can expose the plate P while controlling the position of the plate P with relatively high accuracy. That is, the exposure apparatus 4 can control the position of the plate P with relatively high accuracy while enjoying the same effect that the exposure apparatus 1 of the first embodiment can enjoy.
- the plate stage 46 further includes a Z fine movement stage drive system 465Z.
- the Z fine movement stage drive system 465Z is a drive system for moving the fine movement stage 464 along at least the Z-axis direction while holding the plate P.
- the Z fine movement stage drive system 465Z is, for example, a drive system including a voice coil motor, but may be a drive system including other motors (or drive sources).
- the Z fine movement stage drive system 465Z is fixed to, for example, a Z guide portion fixed to the housing 4642 and the X coarse movement stage 161X.
- the plate stage 46 may include not only the Z fine movement stage drive system 465Z but also a device (for example, a spring) that can function as a weight canceling device.
- the plate stage 16 may include a weight cancellation device.
- the exposure apparatus 4 may include an arbitrary measurement apparatus that can measure the position of the plate P in addition to or instead of the encoder system 47.
- an arbitrary measurement device for example, an interferometer can be cited.
- FIG. 11 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 5 of the fifth embodiment.
- the exposure apparatus 5 of the fifth embodiment includes a plurality of (two in the example shown in FIG. 11) plate stages 56 as compared to the exposure apparatus 1 of the first embodiment. It is different in that.
- the two plate stages 56 are distinguished from each other as plate stages 56-1 and 56-2 as necessary.
- the exposure apparatus 5 of the fifth embodiment is different from the exposure apparatus 1 of the first embodiment in that an encoder system 57 is provided.
- the other structure of the exposure apparatus 5 may be the same as the other structure of the exposure apparatus 1.
- Each of the plate stages 56-1 and 56-2 is driven by an X coarse movement stage 161X, a Y coarse movement stage 161Y, an X coarse movement stage drive system 162X, and a Y coarse movement stage drive.
- a system 162Y and a fine movement stage 164 are provided.
- the Y guide portion 1621Y of the Y coarse movement stage drive system 162Y is shared by the plate stages 56-1 and 56-2.
- Each of the plate stages 56-1 and 56-2 holds the plate P using the holding unit 1641 of the fine movement stage 164. Accordingly, the plate P is held by the plate stages 56-1 and 56-2 at two places on the lower surface of the plate P.
- the plate stages 56-1 and 56-2 are arranged along the Y-axis direction. Therefore, the plate stages 56-1 and 56-2 hold the plate P at two positions aligned along the Y-axis direction on the lower surface of the plate P.
- the plate stages 56-1 and 56-2 may hold the plate P at two symmetrical positions with respect to the center of the plate P.
- the plate stages 56-1 and 56-2 may hold the plate P in the vicinity of two sides of the plate P facing each other along the X-axis direction or the Y-axis direction.
- the plate stages 56-1 and 56-2 are arranged along the X-axis direction or the Y-axis direction.
- the plate stages 56-1 and 56-2 may hold the plate P in the vicinity of the two apexes of the plate P aligned along the diagonal direction of the plate P.
- the plate stages 56-1 and 56-2 are arranged along the diagonal direction.
- the plate stages 56-1 and 56-2 divide the lower surface of the plate P into two regions having the same shape by an imaginary line passing through the center of the plate P, and the centers (or centroids) of the two regions.
- the plate P may be held.
- the plate stages 56-1 and 56-2 are arranged along the direction in which the two regions are arranged.
- the plate stages 56-1 and 56-2 may hold the plate P at a randomly selected position on the lower surface of the plate P.
- the exposure apparatus 5 includes an encoder system 57 as in the exposure apparatus 4.
- the exposure apparatus 5 includes two encoder systems 57-1 and 57-2 so as to correspond to the plate stages 56-1 and 56-2.
- Each of the encoder systems 57-1 and 57-2 includes an encoder head 471, an encoder scale 472, an encoder head 473, and an encoder scale 474, like the encoder system 47.
- the encoder systems 57-1 and 57-2 are different from the encoder system 47 in that the arrangement positions of the encoder head 471, the encoder scale 472, the encoder head 473, and the encoder scale 474 are different.
- the arrangement position in the fifth embodiment may be the same as the arrangement position in the fourth embodiment.
- the other structure of each of the encoder systems 57-1 and 57-2 may be the same as the other structure of the encoder system 47.
- the encoder head 471 is disposed on the plate stage 56 (particularly, the fine movement stage 164), as in the fourth embodiment.
- the encoder head 471 is arranged in the holding portion 1641 so as to protrude outward from the holding portion 1641 of the fine movement stage 164 (that is, the side away from the plate P).
- the protruding portion 5611 in the example shown in FIG. 11, the lower surface thereof
- the encoder scale 472 is arranged in a device different from the surface plate 14 and the fine movement stage 164 as in the fourth embodiment.
- the encoder scale 472 protrudes upward from the upper surface of the Y coarse movement stage 161Y on the outer side of the X coarse movement stage 161X and faces the protrusion 5611.
- the encoder head 473 is disposed on the Y coarse movement stage 161Y on which the encoder scale 472 is disposed, as in the fourth embodiment.
- the encoder head 473 protrudes from the side surface of the protrusion 5612 toward the side and then protrudes upward so as to protrude upward. It is arranged on a portion 5613 (the upper surface in the example shown in FIG. 11).
- the encoder scale 474 is arranged on the surface plate 14 as in the fourth embodiment.
- the exposure apparatus 5 of the fifth embodiment it is possible to enjoy the same effects as those that can be enjoyed by the exposure apparatus 1 of the first embodiment. Further, since the exposure apparatus 5 includes a plurality of plate stages 56 (particularly, a plurality of holding parts 1641), the exposure apparatus 5 includes a single plate stage 56 (particularly, a single holding part 1641). Compared to the case, the bending of the plate P held by the plurality of plate stages 56 is suppressed or prevented. That is, the flatness of the plate P is appropriately maintained. Furthermore, since the exposure apparatus 5 includes the encoder system 57, the exposure apparatus 5 can enjoy the same effects as those that can be enjoyed by the exposure apparatus 4 of the fourth embodiment.
- the exposure apparatus 5 may include three or more plate stages 56. As the number of plate stages 56 provided in the exposure apparatus 5 increases, the plate P is held at more locations on the lower surface of the plate P. Therefore, the flatness of the plate P is more appropriately maintained.
- each plate stage 56 may include a plurality of holding units 1641. Even in this case, since the plate P is held at a plurality of locations on the lower surface of the plate P by the plurality of holding portions 1641, the flatness of the plate P is the same as when the exposure apparatus 5 includes the plurality of plate stages 56. Is properly maintained.
- the exposure apparatus 5 may include a single plate stage 56.
- the plurality of plate stages 56 share the Y guide portion 1621Y of the Y coarse movement stage drive system 162Y.
- each of the plurality of plate stages 56 may include an individual Y guide portion 1621Y.
- the plurality of plate stages 56 may share the entire Y coarse movement stage drive system 162Y.
- the plurality of plate stages 56 may share a part of the Y coarse movement stage drive system 162Y other than the Y guide portion 1621Y.
- the plurality of plate stages 56 may share at least part of the X coarse movement stage 161X.
- the plurality of plate stages 56 may share at least a part of the X coarse movement stage drive system 162X.
- the plurality of plate stages 56 may share at least a part of the fine movement stage 164.
- the Y coarse movement stage 161Y, the Y coarse movement stage drive system 162Y, the X coarse movement stage 161X, and the X coarse movement stage drive system 162X are shared by the plurality of plate stages 56.
- FIG. 12 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 6 of the sixth embodiment.
- FIG. 13 is a cross-sectional view of the exposure apparatus 6 according to the sixth embodiment taken along the XZ plane (for convenience of the drawing, some components are shown as side faces).
- the mask stage 12 and the illumination optical system 11 are disposed below the surface plate 64 compared to the exposure apparatus 4 of the fourth embodiment.
- the difference is that the plate stage 46 is disposed above the surface plate 64.
- the exposure apparatus 6 of the sixth embodiment is different from the exposure apparatus 4 of the fourth embodiment in that it includes a fall prevention device 62 for preventing the mask stage 12 from dropping.
- the exposure apparatus 6 of the sixth embodiment is different from the exposure apparatus 4 of the fourth embodiment in that a part of the structure of the surface plate 64 is different from a part of the structure of the surface plate 44.
- the other structure of the exposure apparatus 6 may be the same as the other structure of the exposure apparatus 4.
- the illumination light EL irradiated by the illumination optical system 11 travels toward the + Z side along the Z-axis direction via the mask M and the projection optical system 13 positioned above the illumination optical system 11.
- the plate P positioned above the mask M and the projection optical system 13 is irradiated. Therefore, in the sixth embodiment, the traveling direction of the illumination light EL is the direction opposite to the direction of gravity (that is, the direction from the ⁇ Z side to the + Z side).
- the mask support portion 151 is disposed on at least a part of the lower surface of the gantry portion 641 of the surface plate 64.
- the mask support 151 is disposed such that the lower surface of the mask support 151 is exposed from the lower surface of the gantry 641.
- the mask support 151 is disposed at a position where at least a part of the mask support 151 can be positioned above at least a part of the mask stage 12.
- the mask support unit 151 supports the mask stage 12 in a non-contact manner from above the mask stage 12 below the surface plate 64.
- the mask stage 12 may not include the fixture 122.
- the exposure apparatus 6 includes a fall prevention device 62 for preventing the mask stage 12 from dropping.
- the fall prevention device 62 includes a plurality of frame portions 621, a plurality of connection portions 622, and a pair of fall prevention plates 623.
- the frame portion 621 is a member that extends from the support frame 125 so as to protrude along the Y-axis direction.
- the frame portion 621 extends from the support frame 125 in a direction approaching the mask M.
- the tip of the frame part 621 is disposed below the mask stage 12.
- a pair of support frames 125 are arranged on each of the + Y side and the ⁇ Y side of the mask stage 12. Therefore, the fall prevention device 62 extends from the support frame 125 arranged on the + Y side of the mask stage 12 as the frame portion 621 toward the ⁇ Y side until the tip is positioned below the mask stage 12.
- a frame portion 621-1 and a frame portion 621-2 extending from the support frame 125 disposed on the ⁇ Y side of the mask stage 12 toward the + Y side until the tip is positioned below the mask stage 12.
- the fall prevention device 62 includes a plurality of each of the frame portions 621-1 and 621-2.
- the plurality of frame parts 621-1 are arranged along the X-axis direction.
- the plurality of frame parts 621-2 are also arranged along the X-axis direction.
- the connecting part 622 connects each frame part 621 and the fall prevention plate 623.
- the fall prevention device 62 includes the same number of connecting portions 622 as the frame portion 621.
- the fall prevention plate 623 is a plate-like member in plan view.
- the pair of fall prevention plates 623 are disposed below the mask stage 12 at positions that do not overlap the optical path of the illumination light EL. As described above, since the mask stage 12 moves along the X-axis direction, the fall prevention plate 623 moves along the X-axis direction in order to appropriately prevent the mask stage 12 moving along the X-axis direction from dropping.
- the plate support 152 is disposed on at least a part of the upper surface of the gantry 641 of the surface plate 64.
- the plate support part 152 is disposed such that the upper surface of the plate support part 152 is exposed from the upper surface of the gantry part 641.
- the plate support 152 is disposed at a position where at least a part of the plate support 152 can be positioned below at least a part of the plate P.
- the plate support unit 152 supports the plate P from below the plate P in a non-contact manner above the surface plate 64.
- the plate stage 46 and the support frame 475 of the sixth embodiment are equivalent to the plate stage 46 and the support frame 475 obtained by reversing the vertical relationship between the plate stage 46 and the support frame 475 of the fourth embodiment. That is, by replacing “upper surface”, “upper”, “lower surface”, and “lower” in the description of the fourth embodiment with “lower surface”, “lower”, “upper surface”, and “upper”, respectively.
- the description regarding the plate stage 46 and the support frame 475 of the fourth embodiment is the description of the plate stage 46 and the support frame 475 of the sixth embodiment. For this reason, in order to abbreviate
- the surface plate 64 (particularly, the gantry portion 641) has a Y guide portion 447 that has a gantry compared to the surface plate 44 (particularly, the gantry portion 441).
- the encoder scale 474 is different in that the encoder scale 474 is accommodated in a recess 448 that is disposed on the upper surface of the portion 641 and formed on the upper surface of the gantry 641.
- Other structures of the surface plate 64 may be the same as other structures of the surface plate 44.
- the support frame 160 that supports the plate stage 46, the surface plate 64, and the mask is different from that in the fourth embodiment, in the sixth embodiment, the support frame 160 that supports the plate stage 46, the surface plate 64, and the mask.
- the positional relationship with the support frame 125 that supports the stage 12 also changes. Specifically, at least a part of the surface plate 64 (in particular, the gantry 641) is positioned below (or inside) at least a part of the support frame 160, and at least a part of the surface plate 64 below (or At least a part of the support frame 125 is located inside.
- the exposure apparatus 6 of the sixth embodiment it is possible to receive the same effects as those that can be enjoyed by the exposure apparatus 4 of the fourth embodiment. Furthermore, in the sixth embodiment, since the illumination optical system 11 and the mask stage 12 are disposed at a position relatively close to the floor surface G, the maintenance of the illumination optical system 11 and the mask stage 12 is facilitated. Furthermore, in the sixth embodiment, since the lower surface of the plate P becomes the exposure surface, dust (or arbitrary dust) that may adversely affect the exposure is deposited (or adhered) on the exposure surface of the plate P. The possibility is reduced. Therefore, the deterioration of exposure accuracy or the occurrence of defective exposure due to dust is appropriately suppressed.
- the encoder scale 472 is disposed so as to face downward (that is, disposed on the lower surface of the beam portion 4751), dust (or arbitrary dust) accumulates on the encoder scale 472 ( Alternatively, the possibility of adhesion) is reduced. Therefore, deterioration of the position measurement accuracy of the plate P caused by dust is appropriately suppressed. Furthermore, in the sixth embodiment, an object that is supported in a non-contact manner below the surface plate 64 moves along the X-axis direction instead of the plate P that moves along both the X-axis direction and the Y-axis direction. On the other hand, the mask stage 12 does not have to move along the Y-axis direction.
- the fall of the mask stage 12 can be prevented by using the fall prevention device 62 having a simplified structure as compared with the fall prevention device for preventing the plate P from falling. That is, the exposure apparatus 6 does not have to include a fall prevention device having a relatively complicated structure for preventing the plate P from dropping.
- the mask support unit 151 supports the mask stage 12 from above the mask stage 12 in a non-contact manner, there is almost no possibility that the mask stage 12 will fall.
- an unintended disturbance for example, vibration
- the possibility that the mask stage 12 will drop increases compared to the normal time. Therefore, it can be said that the above-described fall prevention device 62 is mainly intended to prevent the mask stage 12 from dropping under unintended circumstances.
- the exposure apparatus 6 may not include the fall prevention device 62.
- the exposure apparatus 6 may include a holding device that contacts the mask stage 12 or the mask M and holds the mask stage 12 or the mask M from below in addition to or instead of the fall prevention apparatus 62.
- a holding device for example, a moving device that can move while holding the mask stage 12 or the mask M like the plate stage 16 described above is used.
- the exposure apparatus 6 may not include the mask stage drive system 124.
- FIG. 14 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 7 of the seventh embodiment.
- FIG. 15 is a cross-sectional view of the exposure apparatus 7 according to the seventh embodiment, taken along the XZ plane (for convenience of the drawing, some components are shown as side faces).
- FIG. 16 is a plan view of the surface plate 14 observed from above.
- the exposure apparatus 7 of the seventh embodiment differs from the exposure apparatus 6 of the sixth embodiment in that the arrangement positions of the encoder head 471 and the encoder scale 472 are different. Yes. Specifically, the encoder head 471 is disposed on the lower surface of the bottom portion 4463 that constitutes the housing 4642 of the fine movement stage 464. On the other hand, the encoder scale 472 is disposed on the upper surface of the beam portion 4751 of the support frame 475.
- the other structure of the exposure apparatus 7 may be the same as the other structure of the exposure apparatus 6.
- the exposure apparatus 7 of the seventh embodiment it is possible to receive the same effects as the effects that the exposure apparatus 6 of the sixth embodiment can enjoy. Furthermore, in the seventh embodiment, the encoder scale 472 can be easily assembled when the exposure apparatus 7 is assembled.
- FIG. 17 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 8 of the eighth embodiment.
- the exposure apparatus 8 of the eighth embodiment is provided with a mask holding device 82 instead of the mask stage 12 as compared to the exposure apparatus 7 of the seventh embodiment described above. Is different. Furthermore, the exposure apparatus 8 of the eighth embodiment is different from the above-described exposure apparatus 7 of the seventh embodiment in that a mask M (more specifically, instead of the mask stage drive system 124 that moves the mask stage 12). And a mask stage driving system 824 for moving the mask holding device 82).
- the other structure of the exposure apparatus 8 may be the same as the other structure of the exposure apparatus 7.
- the drop prevention device 62 is not shown for simplification of the drawing, but the exposure device 8 may include the drop prevention device 62.
- the mask holding device 82 is, for example, a mask holding device described in International Publication No. 2014/024465 pamphlet. Therefore, a detailed description of the mask holding device 82 is omitted, but an outline of the mask holding device 82 will be briefly described.
- the mask holding device 82 is supported by a support frame 825 that is supported by the floor G through a vibration isolator such as an air spring.
- the mask holding device 82 includes a table 821, a voice coil motor 822, and a suction holding unit 823.
- the table 821 is supported by the support frame 825 via the mask stage drive system 824.
- the voice coil motor 822 is disposed on the upper surface of the table 821.
- the voice coil motor 822 can move the suction holder 823 along at least one of the X-axis direction and the Y-axis direction.
- the suction holding unit 823 is disposed on the upper surface of the table 821.
- the suction holding portion 823 includes an arm portion 8231 extending along the Y-axis direction so as to go from the table 821 toward the mask M.
- the arm portion 8231 contacts the lower surface of the mask M, and holds the mask M by suction at the contact portion.
- the exposure apparatus 8 includes a pair of mask holding devices 82 arranged on both sides of the mask M along the Y-axis direction so that the mask M can be held from both sides of the mask M along the Y-axis direction.
- the mask stage drive system 824 can move the mask holding device 82 (and the mask M held by the mask holding device 82) at least along the X-axis direction.
- the mask stage drive system 82 is fixed to the upper surface of the support frame 825 and extended along the X-axis direction, and to the lower surface of the table 821, for example.
- a pair of slide members having a U-shaped cross section so as to sandwich the pair of X guide portions, a mover (for example, one of a magnet and a coil) fixed to the lower surface of the table 821, and an upper surface of the support frame 825
- a stator for example, the other of a magnet and a coil
- the mask support 151 can be positioned such that at least a part of the mask support 151 can face at least a part of the mask M along the Z-axis direction. Placed in. That is, the mask support 151 is disposed at a position where at least a part of the mask support 151 can be positioned above at least a part of the mask M. As a result, the mask support unit 151 supports the mask M in a non-contact manner from above the mask M below the surface plate 64. However, also in the eighth embodiment, the mask support 151 is not formed in the optical path of the illumination light EL.
- the exposure apparatus 8 of the eighth embodiment it is possible to receive the same effects as the effects that the exposure apparatus 7 of the seventh embodiment can enjoy.
- FIG. 18 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the XZ plane of the exposure apparatus 9 of the ninth embodiment.
- FIG. 19 is a plan view of the surface plate 64 observed from above.
- a part of the structure of the plate stage 96 is the structure of the plate stage 46 compared to the exposure apparatus 7 of the seventh embodiment described above. It is different in that it is different from some.
- the other structure of the exposure apparatus 9 may be the same as the other structure of the exposure apparatus 7.
- the drop prevention device 62 is not shown for simplification of the drawing, but the exposure device 9 may include the drop prevention device 62.
- the plate stage 96 is different from the plate stage 46 in that it includes a plurality of fine movement stages 464 (two in the example shown in FIGS. 18 to 19).
- the two fine movement stages 464 are referred to as fine movement stages 464-1 and 464-2 and are distinguished from each other.
- Other structures of the plate stage 96 may be the same as other structures of the plate stage 46.
- the X coarse movement stage 161X supports the fine movement stages 464-1 and 464-2. Further, X fine movement stage drive system 165X, Y fine movement stage drive system 165Y and Z fine movement stage drive system 165Z for moving fine movement stage 464-1 and fine movement stage 464-2 are moved to X coarse movement stage 161X.
- An X fine movement stage drive system 165X, a Y fine movement stage drive system 165Y, and a Z fine movement stage drive system 165Z are arranged. However, at least a part of the X fine movement stage drive system 165X may be shared by the fine movement stages 464-1 and 464-2. At least a part of Y fine movement stage drive system 165Y may be shared by fine movement stages 464-1 and 464-2. At least a part of Z fine movement stage drive system 165Z may be shared by fine movement stages 464-1 and 464-2.
- the fine movement stages 464-1 and 464-2 are arranged so that the beam portion 4751 of the support frame 475 passes through the space 4645 inside the housing 4642 of each of the fine movement stages 464-1 and 464-2. Therefore, fine movement stages 464-1 and 464-2 are arranged so as to be aligned along the X-axis direction.
- Each of the fine movement stages 464-1 and 464-2 holds the plate P using the holding unit 1641. Accordingly, the plate P is held by the fine movement stages 464-1 and 464-2 at two places on the lower surface of the plate P.
- fine movement stages 464-1 and 464-2 are arranged along the X-axis direction. Therefore, fine movement stages 464-1 and 464-2 hold plate P at two positions along the X-axis direction on the upper surface of plate P (that is, the surface facing the exposure surface, the opposite surface, and the back surface). To do.
- Fine movement stages 464-1 and 464-2 are located on one side of the center of plate P on the XY plane and on the other side of the center of plate P on the XY plane (that is, on the side opposite to one side). Each of the regions located at is held. That is, fine movement stages 464-1 and 464-2 respectively hold a region located on one side of the center of plate P on the XY plane and a region located on the other side of the center of plate P on the XY plane. Are arranged so that they can be (in other words, aligned). In the example shown in FIGS.
- the fine movement stages 464-1 and 464-2 are the center of the plate P on the XY plane.
- An area located on the + X side from the center and an area located on the ⁇ X side from the center of the plate P on the XY plane are held.
- fine movement stages 464-1 and 464-2 hold regions near both ends of plate P in the X-axis direction.
- fine movement stages 464-1 and 464-2 may hold plate P at a randomly selected position on the lower surface of plate P.
- the exposure apparatus 9 of the ninth embodiment it is possible to receive the same effects as the effects that the exposure apparatus 1 of the first embodiment can enjoy. Further, since the exposure apparatus 9 includes a plurality of fine movement stages 464 (particularly, a plurality of holding units 1641), the plate P held by the plurality of fine movement stages 464 is the same as the exposure apparatus 5 of the fifth embodiment. Is suppressed or prevented. That is, the flatness of the plate P is appropriately maintained.
- the fine movement stages 464-1 and 464-2 move in synchronization with each other so as to suppress or prevent the bending of the plate P.
- the bending of the plate P is more appropriately suppressed or prevented (that is, the flatness of the plate P is appropriately maintained).
- the operation for suppressing or preventing the bending of the plate P in the ninth embodiment will be further described.
- a force acting so that the fine movement stage 464-1 and the fine movement stage 464-2 are separated from each other along the XY plane is applied to the fine movement stages 464-1 and 464-2.
- a force capable of moving fine movement stage 464-1 to the + X side is applied from fine movement stage drive system 165X to fine movement stage 464-1, and fine movement stage 464-2 is moved to the -X side.
- the possible force may be applied to fine movement stage 464-2 from X fine movement stage drive system 165X.
- a force acting so that the two holding portions 1641 are separated from each other along the XY plane is also applied to the holding portion 1641 of the fine movement stage 464-1 and the holding portion 1641 of the fine movement stage 464-2. Therefore, the possibility that the plate P held by the two holding portions 1641 bends along the X-axis direction is reduced. Alternatively, the bending of the plate P that has already been bent along the X-axis direction in a state where the two holding portions 1641 are held is eliminated (that is, extended).
- one fine movement stage 464 positioned on the front side in the moving direction of the plate P moves toward the moving direction of the plate P so as to pull the plate P, while being positioned on the rear side in the moving direction of the plate P.
- the other fine movement stage 464 may move so as to follow one plate stage 56 without pushing out the plate P.
- the other fine movement stage 464 may be pulled by one fine movement stage 464 without pushing out the plate P.
- a force that can move one fine movement stage 464 in the moving direction of the plate P is applied to one fine movement stage 464 from the X fine movement stage drive system 165X, and the other fine movement stage 464 has The force may not be applied from the X fine movement stage drive system 165X.
- a force capable of moving one fine movement stage 464 in the moving direction of the plate P is applied to one fine movement stage 464 from the X fine movement stage drive system 165X, and the other fine movement stage 464 includes Even if a force that can move the other fine movement stage 464 in the moving direction of the plate P and is smaller than the force applied to one fine movement stage 464 is applied from the X fine movement stage drive system 165X. Good.
- the plate P moves so as to be pulled by one fine movement stage 464 that holds the plate P in a region on the front side in the traveling direction of the plate P. Therefore, the possibility that the plate P held by the two holding portions 1641 bends along the X-axis direction is reduced.
- the bending of the plate P that has already been bent along the X-axis direction in a state where the two holding portions 1641 are held is eliminated (that is, extended).
- the plurality of fine movement stages 464 are arranged along the X-axis direction.
- the plurality of fine movement stages 464 may be arranged along the direction different from the X-axis direction on the XY plane.
- the plurality of fine movement stages 464 may be arranged so as to be aligned along the Y-axis direction.
- the plurality of fine movement stages 464 may be arranged along the direction intersecting both the X-axis direction and the Y-axis direction on the XY plane.
- the beam of the support frame 475 is placed inside the housing 4642 of at least one fine movement stage 464. While the portion 4751 passes, the beam portion 4751 may not pass through the housing 4642 of the remaining fine movement stage 464. In this case, the encoder head 471 may not be disposed on the fine movement stage 464 where the beam portion 4751 does not pass through the housing 4642.
- the exposure apparatus 9 is provided in the housing 4642 of the plurality of fine movement stages 464. There may be provided a plurality of support frames 475 that respectively pass through.
- the plate stage 96 may include three or more fine movement stages 464. As the number of fine movement stages 464 included in the plate stage 96 increases, the plate P is held at more positions on the lower surface of the plate P. Therefore, the flatness of the plate P is more appropriately maintained.
- the above-described exposure apparatus 5 of the fifth embodiment also has a feature common to the exposure apparatus 9 of the ninth embodiment in that the plate P is held by a plurality of holding units 1641. For this reason, also in the exposure apparatus 5 of the fifth embodiment, an operation for suppressing or preventing the bending of the plate P in the ninth embodiment may be performed.
- FIG. 22 is a cross-sectional view showing a cross section (including some side surfaces for convenience of the drawing) along the YZ plane of the exposure apparatus 10 of the tenth embodiment.
- FIG. 23 is a plan view of the surface plate 64 observed from above.
- a part of the structure of the plate stage 106 has the structure of the plate stage 96 as compared with the exposure apparatus 9 of the ninth embodiment described above. It is different in that it is different from some.
- a part of the structure of the holding part 4641 of the fine movement stage 464 has a structure of the holding part 1641 compared to the exposure apparatus 9 of the ninth embodiment described above. It is different in that it is different from some.
- the other structure of the exposure apparatus 10 may be the same as the other structure of the exposure apparatus 9.
- the holding portion 4641 is a plate-like member extending along the Y-axis direction.
- the holding member 4641 has a rectangular shape in plan view in which the Y-axis direction is the longitudinal direction.
- the length of the holding portion 4641 in the Y-axis direction is longer than the length of the holding portion 1641 in the Y-axis direction.
- the length of the holding portion 4641 in the Y-axis direction is shorter than the length of the plate P in the Y-axis direction, but may not be shorter than the length of the plate P in the Y-axis direction.
- the lower surface of the holding portion 4641 (that is, the surface holding the plate P facing the plate P) holds the upper surface of the plate P by suction.
- the contact area between the holding portion 4641 and the plate P is larger than in the ninth embodiment. That is, in the ninth embodiment, the number of holding positions where the plate P is held is increased by holding the plate P with the plurality of fine movement stages 464, whereas in the tenth embodiment, the holding portion 4641 is further increased.
- the holding area of the plate P that is, the area of the upper surface area of the plate P held by the holding portion 4641
- the bending of the plate P is more appropriately suppressed or prevented. That is, the flatness of the plate P is more appropriately maintained.
- the holding portion 4641 has a shape in which the Y-axis direction is the longitudinal direction, the bending of the plate P in the Y-axis direction is also appropriately suppressed or prevented. That is, the flatness of the plate P is more appropriately maintained.
- FIGS. 24A is a plan view showing a lower surface of the holding portion 4641
- FIG. 24B is a plan view showing a side surface of the holding portion 4641.
- FIG. 25 is a cross-sectional view showing a YZ cross section of the holding portion 4641.
- the holding portion 4641 includes a base portion 1030, an intermediate portion 1034, a holding surface portion 1036, and a plurality of (three in the example shown in FIG. 24A) chucks. Part 1040.
- Each of the base portion 1032, the intermediate portion 1034, and the holding surface portion 1036 is a planar plate-like member.
- An intermediate portion 1034 is stacked on the lower surface of the base portion 1032, and a holding surface portion 1036 is stacked on the lower surface of the intermediate portion 1034.
- the holding unit 4641 holds the plate P by the chuck unit 1040 adsorbing the upper surface of the plate P. Therefore, a gas suction hole is formed on the lower surface (that is, the lower end) of the chuck portion 1040. The gas sucked through the gas suction holes is sucked through the pipe line 1062 formed in the base portion 1032 and the intermediate portion 1034.
- the three chuck portions 1040 are accommodated in the three accommodating portions 1038 formed inside the holding surface portion 1036, respectively.
- the accommodating portion 1038 is a space formed in the holding surface portion 1036 and opened to the lower surface side of the holding surface portion 1036.
- One of the plurality of accommodating portions 1038 is formed near the center of the holding surface portion 1036 (specifically, the center on the XY plane).
- the chuck portion 1040 housed in the housing portion 1038 formed near the center of the holding surface portion 1036 will be appropriately referred to as “center chuck portion 1040C”.
- FIG. 26A is a cross-sectional view showing the YZ cross section of the chuck portion 1040.
- FIG. 26B is a plan view of the chuck portion 1040 observed from below.
- the chuck portion 1040 includes a protruding portion 1042 and a flange portion 1044.
- the protrusion 1042 is a cylindrical member.
- the flange portion 1044 is a disk-shaped member that is integrally connected to the upper end of the protruding portion 1042.
- the size of the protruding portion 1042 is adjusted so that the lower end of the protruding portion 1042 protrudes slightly (for example, about several tens of micrometers) from the lower surface of the holding surface portion 1036. Yes.
- the protruding amount of the protruding portion 1042 from the lower surface of the holding surface portion 1036 is such that the holding surface portion 1036 does not use the surface pressure generated due to the ejection of gas from the holding surface portion 1036 on the plate P adsorbed by the chuck portion 1040.
- the amount that can be supported by contact is set.
- the flange portion 1044 prevents the chuck portion 1040 from coming out of the housing portion 1038.
- a circumferential wall portion 1048a formed in an annular shape and a plurality of pins 1048b disposed inside the circumferential wall portion 1048a are formed.
- the lower end of the peripheral wall portion 1048a and the lower ends of the plurality of pins 1048b are aligned so that the positions along the Z-axis direction (that is, the height) are the same.
- a gas suction hole 1048c for sucking a gas in a space inside the peripheral wall portion 1048a is further formed at the lower end of the protruding portion 1042.
- the gas suction hole 1048c is formed near the center of a region surrounded by the plurality of pins 1048b.
- the gas supplied to the holding surface portion 1036 via the pipe line 1060 is ejected from a gas ejection hole on the lower surface of the holding surface portion 1036.
- the holding surface portion 1036 is a porous body.
- gas is ejected from the lower surface of the holding surface portion 1036 toward the upper surface of the plate P.
- a uniform surface pressure is generated from the holding surface portion 1036 to the plate P due to the gas ejected from the lower surface of the holding surface portion 1036 toward the upper surface of the plate P.
- the holding surface portion 1036 is a porous body, gas is sucked from the space between the holding surface portion 1036 and the plate P through a hole on the lower surface of the holding surface portion 1036 (a hole that can act as a gas suction hole).
- the upper surface of the plate P is caused by the force acting in the direction of gravity (that is, the ⁇ Z side) generated due to the ejection of the gas from the gas ejection hole and the suction of the gas from the gas suction hole.
- a force acting on the side opposite to the direction of gravity generated that is, + Z side
- the distribution of these two forces is set to an appropriate distribution that can flatten the upper surface of the plate P.
- the holding portion 4641 adsorbs the plate P, so that the bending of the plate P is eliminated.
- the holding surface portion 1036 is a porous body, the gas supplied to the holding surface portion 1036 via the conduit 1060 is further ejected from the gas ejection holes on the outer surface other than the lower surface of the holding surface portion 1036.
- the holding surface portion 1036 ejects gas to the outer peripheral surface of the chuck portion 1040 (excluding the center chuck portion 1040C).
- the arrow shown in FIG. 25 has shown the flow of gas.
- the chuck portion 1040 is held in a state where a gap is secured between the wall surface forming the accommodating portion 1038 and the outer peripheral surface of the chuck portion 1040 by the static pressure of the gas ejected from the holding surface portion 1036.
- the chuck portions 1040 other than the center chuck portion 1040C are disposed below the annular member 1046 that is a porous body.
- the gas is also supplied to the annular member 1046 via the pipe line 1060.
- the annular member 1046 ejects gas onto the upper surface (specifically, the upper surface of the flange portion 1044) of the chuck portion 1040 (excluding the center chuck portion 1040C), for example.
- the chuck portion 1040 is held in a state in which a gap is secured between the wall surface forming the accommodating portion 1038 and the upper surface of the chuck portion 1040 by the static pressure of the gas ejected from the annular member 1046.
- the chuck portion 1040 can freely move along the XY plane while holding the plate P. Can do.
- the freely movable chuck portion 1040 also moves along the XY plane. That is, the chuck portion 1040 moves so as to eliminate the bending of the plate P.
- the center chuck portion 1040C is in a restrained state so that it cannot move along the XY plane. For this reason, the movement of the chuck portions 1040 other than the center chuck portion 1040C eliminates the bending of the plate P starting from the position of the plate P held by the center chuck portion 1040C.
- the chuck portion 1040 moves from an unconstrained state (that is, a movable state) along the XY plane along the XY plane. It changes to a restrained state (that is, a state where it cannot move). Specifically, for example, supply of gas to the annular member 1046 via the pipe line 1060 is stopped and negative pressure is supplied to the annular member 1046. As a result, the wall surface forming the accommodating portion 1038 and the upper surface of the chuck portion 1040 come into contact with each other, so that the chuck portion 1040 is restrained along the XY plane by the frictional force between the wall surface and the upper surface of the chuck portion 1040. become.
- the exposure apparatus 10 of the tenth embodiment can more appropriately eliminate the bending of the plate P while enjoying the same effect as the effect that the exposure apparatus 9 of the ninth embodiment can enjoy. it can. That is, the flatness of the plate P is more appropriately maintained.
- the plurality of chuck portions 1040 in an unconstrained state along the XY plane uses a force acting on the plate P so as to eliminate the bending of the plate P due to the rigidity of the plate P. Is moving. That is, the exposure apparatus 10 does not include a drive system for actively moving the plurality of chuck portions 1040. However, the exposure apparatus 10 may include a drive system for actively moving the plurality of chuck portions 1040. This drive system may move the plurality of chuck portions 1040 using a force output from a power source such as a motor. Alternatively, the drive system may move the plurality of chuck units 1040 by controlling the pressure of the gas ejected to the outer peripheral surfaces of the plurality of chuck units 1040.
- each chuck portion 1040 on the XY plane can be controlled by the pressure of the gas ejected to the outer peripheral surface of each chuck portion 1040.
- the drive system may move each chuck portion 1040 in a desired moving direction by controlling the pressure of the gas ejected to the outer peripheral surface of each chuck portion 1040.
- the drive system may move the plurality of chuck portions 1040 such that other chuck portions 1040 other than the center chuck portion 1040C are separated from the center chuck portion 1040C. As a result, the bending of the plate P is appropriately eliminated.
- the holding portion 4641 may not include a mechanism that can eliminate the bending of the plate P (for example, the chuck portion 1040 that can be set in an unconstrained state along the XY plane described above).
- the holding portion 4641 may have any structure as long as the plate P can be held.
- the holding portion 4641 may be a plate-like member extending along the X-axis direction.
- the holding portion 4641 may be a plate-like member extending along a direction intersecting both the X-axis direction and the Y-axis direction on the XY plane.
- the holding portion 4641 may be a plate-like member that extends along the XY plane.
- the plate stage 106 includes a fine movement stage 464 including a holding portion 4641 that is a plate-like member extending along a first direction (for example, the X-axis direction), and a second direction (for example, different from the first direction) And a fine movement stage 464 including a holding portion 4641 which is a plate-like member extending along the (Y-axis direction).
- the plate stage 16 included in the exposure apparatus 1 of the first embodiment described above may include a holding unit 4641 in addition to or instead of the holding unit 1641.
- FIG. 28 is a flowchart showing the flow of a device manufacturing method for manufacturing a display panel using the exposure apparatus 1 (or the exposure apparatus 2 to the exposure apparatus 10) described above.
- a device manufacturing method for manufacturing a liquid crystal display panel which is an example of a display panel will be described.
- other display panels can also be manufactured using a device manufacturing method shown in FIG. 28 or a device manufacturing method obtained by modifying at least a part of the device manufacturing method shown in FIG.
- step S200 mask manufacturing process in FIG. 28, first, a mask 131 is manufactured. Thereafter, in step S201 (pattern formation process), an application process for applying a resist on the exposure target plate P, an exposure process for transferring a mask pattern for a display panel to the plate P using the exposure apparatus 1 described above, and the like. Then, a developing process for developing the plate P is executed. A resist pattern corresponding to the mask pattern (or device pattern) is formed on the plate P by a lithography process including the coating process, the exposure process, and the development process. Subsequent to the lithography process, an etching process using the resist pattern as a mask, a peeling process for removing the resist pattern, and the like are performed. As a result, a device pattern is formed on the plate P. Such a lithography process or the like is performed a plurality of times according to the number of layers formed on the plate P.
- step S202 color filter forming step
- step S203 cell assembly process
- liquid crystal is injected between the substrate 151 on which the device pattern is formed in step S201 and the color filter formed in step S202. As a result, a liquid crystal cell is manufactured.
- step S204 module assembly process
- components for example, an electric circuit and a backlight
- a liquid crystal display panel is completed.
- the illumination light EL may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 248 nm).
- the illumination light EL may be vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).
- As the illumination light EL a single wavelength laser beam in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium), and a nonlinear optical crystal Harmonics obtained by wavelength conversion to ultraviolet light using may be used.
- a solid-state laser (wavelength: 355 nm, 266 nm) or the like may be used as the illumination light EL.
- the projection optical system 13 is a multi-lens projection optical system including a plurality of optical systems.
- the projection optical system 13 may be a projection optical system including one optical system.
- the projection optical system 13 may be a projection optical system using an Offner type large mirror.
- the exposure apparatus 1 (or the exposure apparatuses 2 to 10, hereinafter the same in this paragraph) is used not only for manufacturing a display panel but also for manufacturing an electronic device such as a semiconductor element, a thin film magnetic head, or a micromachine. Alternatively, it may be used for manufacturing a device such as a DNA chip.
- the exposure apparatus 1 is used for transferring a circuit pattern onto a glass substrate or a silicon wafer in order to manufacture a mask or a reticle used in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like. May be used.
- the object to be exposed is not limited to the plate P that is the flat glass described above, but may be an object other than the plate P (for example, a wafer, a ceramic substrate, a film member, or a mask blank).
- At least a part of the configuration requirements of each embodiment described above can be appropriately combined with at least another part of the configuration requirements of each embodiment described above. At least a part of the configuration requirements of an embodiment can be appropriately combined with other embodiments. Some of the configuration requirements of the above-described embodiments may not be used. In addition, as long as it is permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in each of the above-described embodiments is incorporated as part of the description of the text.
- the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the scope or spirit of the invention that can be read from the claims and the entire specification, and an exposure apparatus with such changes, An exposure method, a flat panel display manufacturing method, and a device manufacturing method are also included in the technical scope of the present invention.
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Abstract
Description
はじめに、図1から図3(b)を参照しながら、第1実施形態の露光装置1について説明する。図1は、第1実施形態の露光装置1のYZ平面に沿った断面を示す(図面の便宜上、一部の構成要素については、側面を示す)断面図である。図2は、第1実施形態の露光装置1のXZ平面に沿った断面を示す(図面の便宜上、一部の構成要素については、側面を示す)断面図である。図3(a)は、定盤14を上方から観察した平面図である。図3(b)は、定盤14を下方から観察した平面図である。
続いて、図5を参照しながら、第2実施形態の露光装置2について説明する。図5は、第2実施形態の露光装置2のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。
続いて、図7を参照しながら、第3実施形態の露光装置3について説明する。図7は、第3実施形態の露光装置3のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。
続いて、図8から図10を参照しながら、第4実施形態の露光装置4について説明する。図8は、第4実施形態の露光装置4のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。図9は、第4実施形態の露光装置4のXZ平面に沿った断面を示す(図面の便宜上、一部の構成要素については、側面を示す)断面図である。図10は、定盤44を下方から観察した平面図である。
続いて、図11を参照しながら、第5実施形態の露光装置5について説明する。図11は、第5実施形態の露光装置5のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。
続いて、図12から図13を参照しながら、第4実施形態の露光装置4について説明する。図12は、第6実施形態の露光装置6のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。図13は、第6実施形態の露光装置6のXZ平面に沿った断面を示す(図面の便宜上、一部の構成要素については、側面を示す)断面図である。
続いて、図14から図16を参照しながら、第7実施形態の露光装置7について説明する。図14は、第7実施形態の露光装置7のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。図15は、第7実施形態の露光装置7のXZ平面に沿った断面を示す(図面の便宜上、一部の構成要素については、側面を示す)断面図である。図16は、定盤14を上方から観察した平面図である。
続いて、図17を参照しながら、第8実施形態の露光装置8について説明する。図17は、第8実施形態の露光装置8のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。
続いて、図18から図19を参照しながら、第9実施形態の露光装置9について説明する。図18は、第9実施形態の露光装置9のXZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。図19は、定盤64を上方から観察した平面図である。
続いて、図22から図23を参照しながら、第10実施形態の露光装置10について説明する。図22は、第10実施形態の露光装置10のYZ平面に沿った断面(図面の便宜上、一部の側面を含む)を示す断面図である。図23は、定盤64を上方から観察した平面図である。
続いて、図28を参照しながら、上述した露光装置1を用いて表示パネルを製造する方法について説明する。図28は、上述した露光装置1(或いは、露光装置2から露光装置10)を用いて表示パネルを製造するデバイス製造方法の流れを示すフローチャートである。尚、以下では、説明の便宜上、表示パネルの一例である液晶表示パネルを製造するデバイス製造方法について説明する。但し、その他の表示パネルもまた、図28に示すデバイス製造方法又は図28に示すデバイス製造方法の少なくとも一部を改変したデバイス製造方法を用いて製造可能である。
11 照明光学系
12 マスクステージ
13 投影光学系
14 定盤
141 架台部
142 脚部
143 気体供給管
145 気体吸引管
151 マスク支持部
152 プレート支持部
16 プレートステージ
M マスク
P プレート
Claims (51)
- 光学系を介して照明光を物体に照射し、前記物体を走査露光して、マスクが有する所定パターンを前記物体上に形成する露光装置において、
前記光学系を支持する支持装置と、
前記支持装置に設けられ、前記物体を非接触支持する物体支持部と
を備える露光装置。 - 前記物体支持部は、前記物体の露光面を非接触支持する請求項1に記載の露光装置。
- 前記物体支持部により非接触支持される前記物体の第1面と対向する第2面を保持する保持部をさらに備え、
前記保持部は、前記物体を前記物体支持部に対して相対駆動させる請求項1又は2に記載の露光装置。 - 前記保持部は、前記走査露光において、前記物体を保持した状態で前記光学系と対向する位置を通過可能である請求項3に記載の露光装置。
- 前記保持部は、前記走査露光において、前記物体を保持した状態で前記光学系の光学中心を通過可能である請求項4に記載の露光装置。
- 前記保持部は、前記非接触支持された物体が撓まないように、前記第2面の複数箇所を保持する請求項3から5の何れか一項に記載の露光装置。
- 前記複数箇所を保持する前記保持部は、前記物体が撓まないように、互いに離れる方向に駆動する請求項6に記載の露光装置。
- 前記支持装置と離間して設けられ、前記保持部を支持する支持部材を更に備える請求項3から7の何れか一項に記載の露光装置。
- 前記走査露光において、前記所定パターンを有するマスクを駆動するマスク駆動部と、
前記支持装置に設けられ、前記マスク駆動部を非接触支持するマスク支持部と
を更に備える請求項1から8の何れか一項に記載の露光装置。 - 前記支持装置に設けられ、前記マスクを非接触支持するマスク支持部と、
前記走査露光において、前記マスク支持部により非接触支持された前記マスクを駆動するマスク駆動部と
を更に備える請求項1から8の何れか一項に記載の露光装置。 - 前記支持装置は、前記物体を非接触支持する気体を前記物体支持部に供給するための気体供給部を有する請求項9又は10に記載の露光装置。
- 前記気体供給部は、前記マスク支持部に気体を供給する請求項11に記載の露光装置
- 前記支持装置は、前記物体と前記物体支持部との間の気体を吸引する吸引部を有する請求項11又は12に記載の露光装置。
- 前記吸引部は、前記マスク支持部から気体を吸引する請求項13に記載の露光装置。
- 光学系を介して照明光を物体に照射し、前記物体を走査露光しマスクに設けられた所定パターンを前記物体上に形成する露光装置において、
前記物体を非接触支持する物体支持部と、
前記マスク又は前記マスクを駆動するマスク駆動部を非接触支持するマスク支持部と、
前記マスク支持部と前記光学系との少なくとも何れか一方と前記物体支持部とを支持する支持装置と
を備える露光装置。 - 光学系を介して照明光を物体に照射し、前記物体を走査露光しマスクに設けられた所定パターンを前記物体上に形成する露光装置において、
前記物体を非接触支持する物体支持部と、
前記マスク又は前記マスクを駆動するマスク駆動部を非接触支持するマスク支持部と、
前記物体支持部と前記マスク支持部とを支持する支持装置と
を備える露光装置。 - 前記支持装置と離間して配置され、前記光学系を支持する光学系支持部を更に備える請求項16に記載の露光装置。
- 前記物体支持部により非接触支持される前記物体の第1面と対向する第2面を保持する保持部をさらに備え、
前記保持部は、前記物体を前記物体支持部に対して相対駆動させる請求項15から17の何れか一項に記載の露光装置。 - 前記支持装置と離間して設けられ、前記保持部を支持する支持部材を更に備える請求項18に記載の露光装置。
- 前記物体支持部により非接触支持される前記物体を保持する保持部と、
前記支持装置と離間して設けられ、前記保持部を支持する支持部材と、
前記支持装置及び前記支持部材と離間して設けられ、前記マスク駆動部を支持する支持フレームと
を更に備える請求項9から19の何れか一項に記載の露光装置。 - 前記支持装置は、前記走査露光において前記物体が駆動される走査方向と交差する所定方向に関して、前記支持フレームと前記支持部材との間に設けられる請求項20に記載の露光装置。
- 前記支持フレームは、前記所定方向に関して、前記支持装置および前記支持部材よりも外側に設けられる請求項21に記載の露光装置。
- 前記照明光の進行方向は、重力方向と平行な方向である請求項1から22の何れか一項に記載の露光装置。
- 前記支持フレームは、前記所定方向に関して、前記支持装置および前記支持部材よりも内側に設けられる請求項21に記載の露光装置。
- 前記照明光の進行方向は、重力方向と反対の方向である請求項1から21、24の何れか一項に記載の露光装置。
- 前記マスクを照射する照明光学系を更に備え、
前記照明光学系は、前記支持装置と前記支持フレームと前記支持部材とは離間して設けられる請求項24又は25に記載の露光装置。 - 前記走査露光において、前記光学系に対する前記物体の位置を計測する計測系を更に備える請求項1から26の何れか一項に記載の露光装置。
- 前記計測系の一部は、前記物体支持部により非接触支持される前記物体を保持する保持部に設けられ、
前記計測系の他部は、前記支持装置に設けられる請求項27に記載の露光装置。 - 前記物体支持部は、多孔体で形成される請求項1から28の何れか一項に記載の露光装置。
- 前記物体支持部は、前記照明光が前記物体に照射可能に構成されている請求項1から29のいずれか一項に記載の露光装置。
- 前記物体支持部は、前記照明光が通過する位置に開口を有する請求項30に記載の露光装置。
- 前記物体支持部は、前記開口を埋める透明部材を有する請求項31に記載の露光装置。
- 物体の所定面を非接触支持する物体支持部と、
前記所定面を走査露光し、所定パターンを前記所定面上に形成する処理部と
を備える露光装置。 - 前記所定面に対向する対向面を保持し、前記物体を前記物体支持部に対して相対駆動させる保持部を更に備える請求項33に記載の露光装置。
- 前記物体は、ディスプレイ装置の表示パネルに用いられる基板である請求項1から34の何れか一項に記載の露光装置。
- 前記物体は、サイズが500mm以上である基板である請求項35に記載の露光装置。
- 請求項1から36の何れか一項に記載の露光装置を用いて前記物体を露光することと、
露光された前記物体を現像することと
を含むフラットパネルディスプレイの製造方法。 - 請求項1から36の何れか一項に記載の露光装置を用いて前記物体を露光することと、
露光された前記物体を現像することと
を含むデバイス製造方法。 - 光学系を介して照明光を物体に照射し、前記物体を走査露光して、マスクが有する所定パターンを前記物体上に形成する露光方法において、
前記光学系を支持する支持装置に設けられた物体支持部により、前記物体を非接触支持することと、を含む露光方法。 - 前記非接触支持することでは、前記物体の露光面を非接触支持する請求項39に記載の露光方法。
- 前記物体支持部により非接触支持される前記物体の第1面と対向する第2面を保持部により保持し、前記保持部に保持された前記物体を前記物体支持部に対して相対駆動させることと、を更に含む請求項39又は40に記載の露光方法。
- 前記相対駆動させることでは、前記走査露光において、前記物体を保持した前記保持部を、前記光学系と対向する位置を通過させる請求項41に記載の露光方法。
- 前記支持装置と離間して設けられ、支持部材により前記保持部を支持することと、を更に含む請求項41又は42に記載の露光方法。
- 前記支持装置に設けられたマスク支持部により、前記所定パターンを有するマスクを駆動する前記マスク駆動部を非接触支持することと、を更に含む請求項39から43の何れか一項に記載の露光方法。
- 前記支持装置に設けられたマスク支持部により、前記マスクを非接触支持することと、
前記走査露光において、前記マスク支持部により非接触支持された前記マスクを駆動することと、を更に含む請求項39から43の何れか一項に記載の露光方法。 - 光学系を介して照明光を物体に照射し、前記物体を走査露光しマスクに設けられた所定パターンを前記物体上に形成する露光方法において、
前記マスク又は前記マスクを駆動するマスク駆動部を非接触支持するマスク支持部と前記光学系との少なくとも何れか一方と、前記物体を非接触支持する物体支持部とを支持装置により支持することと、を含む露光方法。 - 光学系を介して照明光を物体に照射し、前記物体を走査露光しマスクに設けられた所定パターンを前記物体上に形成する露光方法において、
前記物体を非接触支持する物体支持部と、前記マスク又は前記マスクを駆動するマスク駆動部を非接触支持するマスク支持部とを支持装置により支持することと、を含む露光方法。 - 前記支持装置と離間して配置され、光学系支持部により前記光学系を支持することと、を更に含む請求項47に記載の露光方法。
- 前記物体支持部により非接触支持される前記物体の第1面と対向する第2面を保持部により保持し、前記保持部に保持された前記物体を前記物体支持部に対して相対駆動させることと、を更に含む請求項46から48の何れか一項に記載の露光方法。
- 物体の所定面を非接触支持することと、
前記所定面を走査露光し、所定パターンを前記所定面上に形成することと、を含む露光方法。 - 前記所定面に対向する対向面を保持し、前記物体を前記物体支持部に対して相対駆動させることと、更に含む請求項50に記載の露光方法。
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US20110042874A1 (en) * | 2009-08-20 | 2011-02-24 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
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2018
- 2018-03-28 KR KR1020197031553A patent/KR102630304B1/ko active IP Right Grant
- 2018-03-28 CN CN201880022803.3A patent/CN110546572B/zh active Active
- 2018-03-28 TW TW107110731A patent/TWI758452B/zh active
- 2018-03-28 WO PCT/JP2018/012767 patent/WO2018181476A1/ja active Application Filing
- 2018-03-28 KR KR1020237023758A patent/KR20230110827A/ko not_active Application Discontinuation
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JP2017062490A (ja) * | 2011-12-29 | 2017-03-30 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
JP2014036023A (ja) * | 2012-08-07 | 2014-02-24 | Nikon Corp | 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
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CN111736298A (zh) * | 2019-03-25 | 2020-10-02 | 佳能株式会社 | 光学装置、曝光装置以及物品制造方法 |
CN111736298B (zh) * | 2019-03-25 | 2023-01-13 | 佳能株式会社 | 光学装置、曝光装置以及物品制造方法 |
Also Published As
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CN110546572B (zh) | 2023-01-10 |
TW201903532A (zh) | 2019-01-16 |
KR20230110827A (ko) | 2023-07-25 |
TWI758452B (zh) | 2022-03-21 |
KR20190124806A (ko) | 2019-11-05 |
CN110546572A (zh) | 2019-12-06 |
KR102630304B1 (ko) | 2024-01-26 |
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