WO2018180951A1 - Dispositif de source de lumière et dispositif de projection - Google Patents

Dispositif de source de lumière et dispositif de projection Download PDF

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Publication number
WO2018180951A1
WO2018180951A1 PCT/JP2018/011597 JP2018011597W WO2018180951A1 WO 2018180951 A1 WO2018180951 A1 WO 2018180951A1 JP 2018011597 W JP2018011597 W JP 2018011597W WO 2018180951 A1 WO2018180951 A1 WO 2018180951A1
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WO
WIPO (PCT)
Prior art keywords
source device
light source
lens holder
optical element
base
Prior art date
Application number
PCT/JP2018/011597
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English (en)
Japanese (ja)
Inventor
秀雄 山口
一幸 松村
Original Assignee
パナソニックＩｐマネジメント株式会社
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Publication of WO2018180951A1 publication Critical patent/WO2018180951A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/16—Laser light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element

Definitions

  • the present disclosure relates to a light source device and a light projecting device, and more particularly to a display field such as a projection display device that uses light emitted by irradiating a wavelength conversion element with light emitted from a semiconductor light emitting device, or illumination for a vehicle.
  • the present invention relates to a light source device used in an illumination field such as medical illumination, and a light projecting device using the light source device.
  • a light source device using a semiconductor light emitting device composed of a semiconductor light emitting element such as a semiconductor laser in order to emit a high luminous flux, the light emitted from the semiconductor light emitting device is condensed on the wavelength conversion element to convert the wavelength. Radiate outside the element.
  • a light projecting device using a conventional light source device disclosed in Patent Document 1 will be described with reference to FIG.
  • FIG. 20 is a diagram for explaining a configuration of a conventional light projecting device 1001 and an optical path of light emitted from the semiconductor light emitting device 1011.
  • blue light (blue laser light) LB emitted from the semiconductor light emitting device 1011 is collected by the condenser lens 1012. It is reflected by the reflecting surface 1131 of the mirror 1013 while being collected, and enters the surface of the phosphor 1014 that emits yellow light from obliquely upward on the front side.
  • the blue light LB incident on the phosphor 1014 is mixed with the yellow light emitted from the phosphor 1014, and almost all of the blue light LB is emitted as a white light, which is emitted radially upward. .
  • This white light is reflected forward by the reflecting surface 1151 of the reflector 1015 and irradiated from the projection lens 1017 forward.
  • the phosphor 1014 is attached to a metal flat plate 1018 on which heat dissipating fins 1181 are formed.
  • the block on which the semiconductor light emitting device 1011 and the condenser lens 1012 are mounted is attached to a metal flat plate 1016.
  • the present disclosure has been made to solve such a problem, and an object thereof is to provide a light source device suitable for thickness reduction and a light projection device including the light source device.
  • a light source device includes a semiconductor light emitting element that emits laser light, a condensing lens that condenses the laser light emitted from the semiconductor light emitting element, and the condensing lens.
  • a reflective optical element that reflects the condensed laser light, a phosphor optical element that is irradiated with the laser light reflected by the reflective optical element, a base on which the phosphor optical element is disposed, and the light condensing
  • a lens holder that holds the lens; and a pressing member that presses the lens holder against the base.
  • the lens holder that holds the condenser lens is fixed by being pressed against the base on which the phosphor optical element is disposed, the position of the condenser lens can be brought close to the phosphor optical element, The light source device can be thinned.
  • the base includes a first surface, a second surface, and a side surface extending from the first surface in a direction perpendicular to the first surface.
  • the semiconductor light emitting element is disposed on the first surface
  • the phosphor optical element is disposed on the second surface
  • the lens holder is disposed on the side surface by the pressing member. It is good to be pressed.
  • the semiconductor light emitting element and the phosphor optical element are arranged on a base made of a single body, and the lens holder is pressed against the side surface of the base, so that the semiconductor light emitting element, the phosphor optical element, and the light collecting element
  • the lens can be brought closer, and the light source device can be made thinner. Further, since the lens holder can be moved along the side surface in the optical axis direction of the semiconductor light emitting element, the lens holder is unlikely to be displaced from the optical axis of the semiconductor light emitting element.
  • the second surface may be positioned above the first surface, and the side surface may be positioned between the first surface and the second surface.
  • the light source device has a lens holder having a length for adjusting the spot of light emitted from the semiconductor light emitting element, and can bring the reflecting optical element and the phosphor optical element close to each other. Therefore, the semiconductor light emitting element, the reflective optical element, the phosphor optical element, and the condenser lens can be brought close to each other, and the light source device can be made thinner.
  • the condenser lens holder with the condenser lens firmly mounted on the base on which the phosphor optical element is mounted is fixed with high accuracy, so that it depends on the external environment such as temperature change, humidity change, vibration, and impact. Adverse effects are suppressed.
  • a pin that is depressed in a direction intersecting an optical axis direction of the laser light emitted from the semiconductor light emitting element can be inserted into the outer peripheral surface of the lens holder.
  • a recess is formed, and the lens holder is preferably movable in the optical axis direction.
  • a collar portion protruding in a direction intersecting an optical axis direction of the laser light emitted from the semiconductor light emitting element is formed on the outer peripheral surface of the lens holder,
  • the lens holder may be configured to be movable in the optical axis direction.
  • the base is configured by an integral body having a first surface, a second surface, and a third surface parallel to the first surface and the second surface.
  • the semiconductor light emitting element is disposed on the first surface
  • the phosphor optical element is disposed on the second surface
  • the lens holder is pressed against the third surface by the pressing member. Is done.
  • the second surface is located above the first surface, and the third surface is located between the first surface and the second surface.
  • This configuration makes it possible to further reduce the thickness of the light source device.
  • the lens holder may be made of the same material as the base.
  • the lens holder may be made of a metal material.
  • the change in position can be reduced by the thermal expansion of the lens holder, so that a light source device that is resistant to changes in the external environment can be realized.
  • the light projecting device of the present disclosure includes a light source device and an optical member that changes a direction of light emitted from the light source device, the light source device including a semiconductor light emitting element that emits laser light, and the semiconductor
  • the light source device including a semiconductor light emitting element that emits laser light, and the semiconductor
  • a condensing lens that condenses the laser light emitted from the light emitting element, a reflective optical element that reflects the laser light condensed by the condensing lens, and the laser light reflected by the reflective optical element are irradiated.
  • the lens holder that holds the condenser lens is fixed by being pressed against the base on which the phosphor optical element is disposed, the position of the condenser lens can be brought close to the phosphor optical element,
  • the light source device can be made thinner, and the light projecting device can also be made thinner.
  • the light source device and the like it is possible to suppress the occurrence of deviation in the optical path that guides the emitted light from the semiconductor light emitting device to the phosphor element due to a change in the external environment.
  • the light source device can be radiated well and the light source device can be made thin.
  • FIG. 1 is a cross-sectional view for explaining the configuration of the light source device according to the first embodiment of the present disclosure.
  • FIG. 2 is a perspective view illustrating an appearance of the light source device according to the first embodiment of the present disclosure when viewed from above.
  • FIG. 3 is a perspective view illustrating an appearance of the light source device according to the first embodiment of the present disclosure when viewed from the lower surface.
  • FIG. 4 is an exploded view for explaining the configuration of the light source device according to the first embodiment of the present disclosure.
  • FIG. 5 is a front view for explaining the configuration of the light source device according to the first embodiment of the present disclosure.
  • FIG. 6 is a perspective view for explaining an adjustment function of the light source device according to the first embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view for explaining an adjustment function of the light source device according to the first embodiment of the present disclosure.
  • FIG. 8 is a front view for explaining the shape of the condensing lens holder according to the first embodiment of the present disclosure.
  • FIG. 9 is a perspective view for explaining the shape of the condensing lens holder according to the first embodiment of the present disclosure.
  • FIG. 10 is a cross-sectional view for explaining the configuration of the light projecting device according to the first embodiment of the present disclosure.
  • FIG. 11 is a front view for explaining the configuration of the light source device according to the second embodiment of the present disclosure.
  • FIG. 12 is a perspective view for explaining the function of the light source device according to the second embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view for explaining the function of the light source device according to the second embodiment of the present disclosure.
  • FIG. 14 is a front view for explaining the shape of the condensing lens holder according to the second embodiment of the present disclosure.
  • FIG. 15 is a perspective view for explaining the shape of the condenser lens holder according to the second embodiment of the present disclosure.
  • FIG. 16 is a front view for explaining the configuration of the light source device according to the third embodiment of the present disclosure.
  • FIG. 17 is a cross-sectional view for explaining the configuration of the light source device according to the third embodiment of the present disclosure.
  • FIG. 18 is a perspective view for explaining the shape of the condensing lens holder according to the third embodiment of the present disclosure.
  • FIG. 19 is a perspective view for explaining the function of the light source device according to the third embodiment of the present disclosure.
  • FIG. 20 is a cross-sectional view for explaining the configuration of a conventional light source device.
  • the X axis, the Y axis, and the Z axis represent the three axes of the three-dimensional orthogonal coordinate system.
  • the X axis and the Y axis are orthogonal to each other, and both are orthogonal to the Z axis.
  • the Z-axis positive direction side may be described as the upper side and the Z-axis negative direction side as the lower side.
  • the Y-axis positive direction side may be described as the rear and the Y-axis negative direction side as the front.
  • FIG. 1 is a cross-sectional view for explaining the configuration of the light source device 1 according to the first embodiment of the present disclosure.
  • FIG. 2 is a perspective view illustrating an appearance of the light source device 1 according to Embodiment 1 of the present disclosure when viewed from the top.
  • FIG. 3 is a perspective view illustrating an external appearance of the light source device 1 according to Embodiment 1 of the present disclosure when viewed from the lower surface.
  • FIG. 4 is an exploded view for explaining the configuration of the light source device 1 according to the first embodiment of the present disclosure.
  • FIG. 5 is a front view for explaining the configuration of the light source device 1 according to the first embodiment of the present disclosure.
  • the light source device 1 includes a semiconductor light emitting element 11, a condenser lens 26, a reflective optical element unit 20, a phosphor optical element 30, and a base 40. And a condensing lens holder (lens holder) 27 for holding the condensing lens 26 and a pressing spring (pressing member) 28.
  • the semiconductor light emitting device 10 and the phosphor optical element 30 are fixed to the base 40.
  • a reflective optical element unit 20 in which a reflective optical element 22 having a reflective surface 21 is fixed to a reflective optical element holding member 23 is fixed to a base 40.
  • the condensing lens unit 25 in which the condensing lens 26 is fixed to the condensing lens holder 27 is configured to be pressed and held by the base 40 by the pressing spring 28.
  • the semiconductor light emitting device 10 includes a semiconductor light emitting element 11 on which an optical waveguide is formed, and a package 12 for mounting the semiconductor light emitting element 11.
  • the internal space of the semiconductor light emitting device 10 is a sealed space, and high airtightness is maintained so that the semiconductor light emitting element 11 is shielded from the external atmosphere.
  • the semiconductor light emitting element 11 is a semiconductor laser element (for example, a laser chip) made of, for example, a nitride semiconductor, and emits laser light having a peak wavelength between 380 nm and 490 nm as emitted light 51.
  • a semiconductor laser element for example, a laser chip
  • the package 12 is, for example, a so-called CAN package, and includes a disk-shaped base 13, a post (not shown) for mounting the semiconductor light emitting element 11 on the base 13 directly or via a submount (not shown), and externally.
  • a lead pin 14 for supplying power to the semiconductor light emitting element 11 and a metal cap 15 disposed on the base 13 are provided.
  • a window glass 16 is attached to the cap 15 in order to seal the semiconductor light emitting element 11.
  • Window glass 16 is an example of a translucent member that transmits outgoing light 51 emitted from semiconductor light emitting element 11, and is a plate glass in the present embodiment.
  • the semiconductor light emitting element 11 is disposed in a sealed space surrounded by the base 13 and the cap 15.
  • the semiconductor light emitting element 11 is mounted on the base 13 so as to be thermally and physically connected to the base 13.
  • the semiconductor light emitting device 10 configured as described above is disposed on the first surface 42 of the base 40. Specifically, the semiconductor light emitting device 10 is mounted on the base 40 such that the surface of the base 13 opposite to the surface on which the semiconductor light emitting element 11 is disposed contacts the first surface 42 of the base 40.
  • the semiconductor light emitting device 10 As a means for mounting the semiconductor light emitting device 10 on the base 40, a means for fixing by bonding or soldering with an adhesive such as a resin material is conceivable.
  • the semiconductor light emitting device 10 is fixed in a pressed state to the first surface 42 of the base 40 by a ring screw 18 having a cylindrical shape and a threaded outer peripheral portion.
  • the semiconductor light emitting device 10 (specifically, the base 13) is thermally and physically connected to the first surface 42 of the base 40.
  • the condenser lens unit 25 is disposed between the reflective optical element unit 20 and the semiconductor light emitting device 10.
  • the condenser lens unit 25 includes a condenser lens 26 and a condenser lens holder 27.
  • the condenser lens 26 is a finite lens, and is fixed to the condenser lens holder 27 by adhesion or the like.
  • the condenser lens holder 27 is held on the base 40 by a pressing spring 28.
  • the condenser lens 26 has a function of condensing the emitted light 51 from the semiconductor light emitting device 10 at a predetermined focal position.
  • the condenser lens holder 27 is a holding member that holds the condenser lens 26.
  • the material of the condensing lens holder 27 is not specifically limited, For example, it is good to form with a metal material. By adopting a metal material as the material of the condensing lens holder 27, a change in position due to thermal expansion of the condensing lens holder 27 can be reduced. Therefore, it is possible to produce the light source device 1 that is resistant to changes in the external environment.
  • the condenser lens holder 27 may be made of the same material as the base 40. By doing so, changes due to thermal expansion of the condenser lens holder 27 and the base 40 are the same. Therefore, the light source device 1 that is resistant to changes in the external environment can be manufactured.
  • the reflection optical element 22 constituting the reflection optical element unit 20 is a planar reflection mirror, and has a planar reflection surface 21.
  • the reflective optical element 22 has a configuration in which a reflective film is formed on the surface of a flat substrate. The surface of this reflective film is a reflective surface 21.
  • the reflective optical element 22 reflects the laser light (emitted light 51) collected by the condenser lens 26.
  • the reflective surface 21 may be the back surface of the reflective optical element 22.
  • As the reflective film a multilayer reflective film made of a plurality of dielectric films having different refractive indexes, a metal film made of a metal such as Ag, Au, or Cu, or an alloy film made of an alloy thereof is used.
  • the reflective optical element unit 20 is attached to the base 40 so as to be disposed above the semiconductor light emitting device 10. Specifically, the reflective optical element unit 20 is configured such that the reflective optical element holding member 23 is in contact with a fourth surface 49 formed on the base 40 by the third screw 24 (see FIG. 4). It is fixed to the base 40 by being screwed to.
  • a substrate 37 joined to the lead pins 14 of the semiconductor light emitting device 10 by solder or the like, and a connector 38 mounted on the substrate 37 for supplying power from the outside are arranged. ing.
  • the substrate 37 is fixed to the base 40 by a first screw 39.
  • the phosphor optical element 30 includes a phosphor 31 and a phosphor holding member 32 that holds the phosphor 31.
  • the phosphor 31 is provided on the phosphor holding member 32, for example.
  • the phosphor optical element 30 is an example of a wavelength conversion element that converts the wavelength of incident light.
  • the phosphor optical element 30 includes a phosphor 31 as a wavelength conversion material that converts the wavelength of incident light.
  • the phosphor 31 emits fluorescence using incident light as excitation light.
  • the phosphor 31 is made of, for example, a cerium-activated yttrium aluminum garnet (YAG: Ce 3+ ) phosphor material.
  • YAG: Ce 3+ cerium-activated yttrium aluminum garnet
  • phosphor particles such as YAG: Ce 3+ mixed and dispersed in a transparent resin (binder) such as glass or silicone may be used, and for example, YAG: Ce 3+ may be used.
  • a ceramic phosphor plate formed by mixing and sintering phosphor particles such as alumina (Al 2 O 3 ) or the like may be used.
  • the phosphor 31 is not limited to the YAG system.
  • the phosphor holding member 32 is a ceramic body made of, for example, aluminum nitride.
  • a reflective film made of, for example, a silver alloy may be formed between the phosphor holding member 32 and the phosphor 31.
  • the phosphor optical element 30 configured as described above is disposed on the second surface 43 of the base 40. Specifically, the phosphor optical element 30 is fixed to the base 40 so that the phosphor holding member 32 side contacts the second surface 43. Accordingly, the phosphor optical element 30 (specifically, the phosphor holding member 32) is thermally and physically connected to the second surface 43 of the base 40.
  • the fluorescent optical element 30 is irradiated with the reflected light 52 from the reflective optical element unit 20. Specifically, the reflected light 52 from the reflective optical element unit 20 irradiates the phosphor 31. As a result, the phosphor 31 is excited by the reflected light 52 and emits fluorescence 93. As described above, the light source device 1 emits the radiated light 91 in which the scattered light 92 obtained by scattering the reflected light 52 by the phosphor optical element 30 and the fluorescent light 93 excited by the reflected light 52 and emitted. .
  • the pressing member 28 is a pressing member that presses the condenser lens holder 27 against the base 40.
  • the pressing member 28 only needs to bias the condenser lens holder 27 toward the base 40 side.
  • the pressing member 28 is a spring material.
  • the light source device 1 may include a light-transmitting cover 33 disposed above the phosphor optical element 30.
  • the translucent cover 33 is fixed to the translucent cover holding member 34 by means such as adhesion.
  • the semiconductor light emitting device 10 and the phosphor optical element 30 may be disposed in a closed space surrounded by the base 40, the translucent cover holding member 34, and the translucent cover 33.
  • the condenser lens 26 is disposed on the upper surface of the semiconductor light emitting device 10 disposed on the first surface 42 of the base 40. Further, the condenser lens 26 is fixed to the condenser lens holder 27 by means such as adhesion.
  • the condensing lens unit 25 is pressed in the pressing direction 70 by a pressing spring 28 fixed to the base 40 with a screw or the like, and the surface on which the base 40 is located, in the first embodiment, the first side face 45 and the second side. It is in contact with two surfaces, the side surface 46.
  • the pressing direction 70 is the Y axis positive direction.
  • FIG. 8 is a front view for explaining the shape of the condenser lens holder 27 according to the first embodiment of the present disclosure
  • FIG. 9 is the shape of the condenser lens holder 27 according to the first embodiment of the present disclosure. It is a perspective view for demonstrating.
  • the outer shape of the condenser lens holder 27 has a substantially circular shape coaxial with the outer shape of the condenser lens 26. Further, the condensing lens unit 25 on which the condensing lens 26 is mounted is configured to be movable on the base 40 in the optical axis direction 71 of the emitted light from the semiconductor light emitting device 10.
  • the outer peripheral surface of the condensing lens holder 27 is formed with a recess that is recessed in a direction intersecting the optical axis direction 71 of the laser light (emitted light 51) emitted from the semiconductor light emitting element 11 and into which a pin can be inserted. ing.
  • a first recess 72 into which a first adjustment pin (pin) 74 recessed in the X-axis direction can be inserted, and the side opposite to the first recess 72 And the 2nd recessed part (recessed part) 73 which can insert the 2nd adjustment pin (pin) 75 depressed in the X-axis direction is formed.
  • the condensing lens holder 27 is formed with a first recess 72 and a second recess 73 in a symmetrical shape.
  • a first adjustment pin 74 and a second adjustment pin 75 are disposed at a position facing the first adjustment pin 74.
  • FIG. 6 is a perspective view for explaining the adjustment function of the light source device 1 according to the first embodiment of the present disclosure
  • FIG. 7 illustrates the adjustment function of the light source device 1 according to the first embodiment of the present disclosure. It is sectional drawing for doing. 7 is a cross-sectional view taken along line VII-VII in FIG.
  • the first adjustment pin 74 When moving the condensing lens unit 25 in the optical axis direction 71, the first adjustment pin 74 is inserted into the first recess 72 of the condensing lens holder 27, and the second adjustment position is opposed to the first adjustment pin 74.
  • the adjustment pin 75 is inserted into the second recess 73 of the condenser lens holder 27.
  • the condenser lens unit 25 moves in the optical axis direction 71, and as a result, a spot irradiated on the phosphor optical element 30 The shape can be adjusted.
  • the condenser lens 26 is disposed in the vicinity of the semiconductor light emitting device 10 in order to take in the emitted light 51 from the semiconductor light emitting device 10 to the maximum extent.
  • the position of the condenser lens unit 25 is adjusted (moved)
  • the position of the condenser lens 26 is moved by several ⁇ m to several tens of ⁇ m in the X-axis direction or the Y-axis direction.
  • the outgoing light 51 emitted from the light is reflected by the reflective optical element 22, and the spot position 78 on the phosphor optical element 30 is irradiated to a position greatly deviated in the X-axis direction or the Y-axis direction.
  • the light irradiated to the position shifted from the desired position on the phosphor optical element 30 is projected forward by the reflector 160 described in the light projecting device 101 of FIG.
  • the center of the intensity distribution of the projected light is projected at a position shifted from a desired position.
  • a deviation from the desired position of the center of the intensity distribution of the light projected at a long distance becomes significant.
  • the condensing lens holder 27 provided in the light source device 1 according to Embodiment 1 of the present disclosure is in contact with the first side surface 45 and the second side surface 46 that are side surfaces of the base 40. Specifically, the condensing lens holder 27 hits the condensing lens holder 27 against the base 40 on which the semiconductor light emitting element 11 and the phosphor 31 are mounted. For this reason, the condensing lens holder 27 of the light source device 1 is less likely to be displaced with changes in the external environment.
  • the contact surface on which the condenser lens holder 27 and the base 40 according to the first embodiment of the present disclosure are in contact is the spot position 78 irradiated on the semiconductor light emitting device 10 and the phosphor optical element 30. It is arranged between.
  • the contact surface between the condenser lens holder 27 and the base 40 is between the first surface 42 on which the semiconductor light emitting device 10 is mounted and the second surface 43 on which the phosphor optical element 30 is mounted. Placed in.
  • the contact surfaces are the first side surface 45 and the second side surface 46. That is, the condenser lens holder 27 is pressed against the side surfaces (the first side surface 45 and the second side surface 46) by the pressing member 28.
  • the length of the contact surface of the condenser lens holder 27 with the base 40 in the optical axis direction 71 can be secured, and the condenser lens holder 27 is moved in the optical axis direction 71. Since the condenser lens holder 27 and the base 40 are in contact with each other, stable spot adjustment is possible.
  • the second surface 43 is located above the first surface 42, and the side surface where the condenser lens holder 27 and the base 40 are in contact with each other is preferably located between the first surface 42 and the second surface 43. .
  • the light source device 1 allows the condenser lens holder 27 to adjust the spot of light emitted from the semiconductor light emitting element 11, and the optical axis direction of the contact surface with the base 40 of the condenser lens holder 27.
  • the length of 71 can be secured.
  • the reflecting optical element 22 and the phosphor optical element 30 can be brought close to each other. Therefore, the semiconductor light emitting element 11, the reflective optical element 22, the phosphor optical element 30, and the condenser lens 26 can be brought close to each other, and the light source device 1 can be made thinner.
  • a pin that is recessed in a direction intersecting the optical axis direction 71 of the laser light emitted from the semiconductor light emitting element 11 can be inserted into the outer peripheral surface of the condenser lens holder 27 according to the first embodiment of the present disclosure.
  • a recess is formed.
  • the condenser lens holder 27 is arranged in the light source device 1 so as to be movable in the optical axis direction 71. With this configuration, by adjusting the position of the condenser lens 26 in the optical axis direction 71, it is possible to adjust the spot shape irradiated on the phosphor optical element 30, and the condenser lens 26 at the time of adjustment can be adjusted.
  • a stable light source device 1 with little in-plane (XY plane in the present embodiment) positional deviation can be provided.
  • the pressurizing unit After adjusting the condensing lens unit 25 described in the first embodiment of the present disclosure in the optical axis direction 71, from the rear of the pressing spring 28 (in the first embodiment, the Y-axis positive direction), the pressurizing unit The condensing lens unit 25 is fixed to the base 40 by pressing the pressing spring 28 with the second screw (pressing part) 79 that functions as: Therefore, the light source device 1 can reduce the deviation of the spot position 78 on the phosphor 31 from a desired position due to a change in the external environment.
  • the condenser lens unit 25 is fixed to the base 40 with an adhesive or the like. Thereafter, the condenser lens unit 25 is fixed with screws or the like.
  • a load such as a screw is directly applied to the condensing lens holder 27 or indirectly the rotational force of the screw. For this reason, the adjusted condenser lens unit 25 may be displaced.
  • the light source device 1 includes the second screw 79 that is a pressing portion that pressurizes the pressing spring 28 that is a pressing member toward the condenser lens holder 27 side. Specifically, the second screw 79 presses the condensing lens holder 27 to the base 40 via the pressing spring 28. Therefore, since the load of the second screw 79 is not directly applied to the condenser lens holder 27, it can be fixed with high accuracy.
  • the condenser lens holder 27 on which the condenser lens 26 is firmly mounted with high positional accuracy is fixed to the base 40 on which the phosphor optical element 30 is mounted, so that temperature change, humidity change, vibration, The adverse effects of the external environment such as impact can be suppressed.
  • the one that functions as the pressurizing unit 79 may be other than a screw.
  • the parallel pin is inserted into the base 40 and the pressing spring 28 is pushed from behind the pressing spring 28. In the state, the same effect can be obtained by fixing the parallel pin to the base.
  • FIG. 10 is a schematic cross-sectional view illustrating a configuration of the light projecting device 101 according to the first embodiment of the present disclosure.
  • the light projecting device 101 includes a heat radiating member 60, a light source device 1 attached to the heat radiating member 60, and a reflector 160 that reflects radiated light 91 emitted from the light source device 1 (emitted from the light source device 1).
  • the light projecting device 101 is, for example, a lamp for a vehicle headlamp. That is, the light source device 1 is used as a light source of the light projecting device 101.
  • the light source device 1 is attached to the heat dissipation member 60.
  • the heat radiating member 60 includes a base plate 61 for transferring heat generated in the light source device 1 to the heat radiating fins 62 and a heat radiating fin 62 for radiating heat generated in the light source device 1 to the outside air.
  • the light source device 1 is attached to the attachment portion 61 a of the base plate 61.
  • the attachment surface of the attachment part 61a is a flat surface, for example.
  • the light source device 1 is fixed to the attachment portion 61a by screws (not shown), for example.
  • the light source device 1 is disposed on the base plate 61 such that the heat radiation surface 41 of the base 40 and the mounting portion 61a are in contact with each other.
  • a power cable 63 that supplies power to the light source device 1 to turn on the light projecting device 101 is connected to the connector 38 of the light source device 1.
  • the reflector 160 is a reflecting member for projecting forward by changing the radiation angle of the radiated light 91 from the light source device 1, and is disposed so that the reflective surface that reflects the radiated light 91 faces the light source device 1. . Specifically, the reflector 160 is disposed above the phosphor optical element 30 so that the reflection surface is irradiated with the radiation light 91. More specifically, the reflector 160 is disposed so that the focal point of the reflector 160 substantially coincides with the light emitting point of the phosphor optical element 30 (specifically, the phosphor 31).
  • the light source device 1 can emit the emitted light 91 having a wide radiation angle.
  • emission direction of the emitted light 91 can be arrange
  • the emitted light 91 from the light source device 1 can be used with high efficiency, and the reflector 160 can be freely designed for downsizing and thinning.
  • the light source device is different from the first embodiment in the shape of the condenser lens holder, which is a mechanism for adjusting the condenser lens unit in the optical axis direction.
  • FIG. 11 is a front view for explaining the configuration of the light source device according to the second embodiment of the present disclosure.
  • FIG. 12 is a perspective view for explaining the adjustment function of the light source device according to the second embodiment of the present disclosure
  • FIG. 13 is a diagram for explaining the adjustment function of the light source device according to the second embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.
  • the condenser lens 26 is disposed on the upper surface side of the semiconductor light emitting device 10 disposed on the first surface 42 of the base 40.
  • the condenser lens 26 is fixed to the condenser lens holder 27a by adhesion or the like.
  • the condensing lens unit 25a is pressed in the pressing direction 70a by a pressing spring 28a fixed to the base 40 with a screw, and the surface on which the base 40 is located, in the second embodiment, the third side surface 47 and the fourth side surface 48. It touches the two sides.
  • the pressing direction 70a is the X-axis negative direction.
  • FIG. 14 is a front view for explaining the shape of the condensing lens holder 27a according to the second embodiment of the present disclosure
  • FIG. 15 is the shape of the condensing lens holder 27a according to the second embodiment of the present disclosure. It is a perspective view for demonstrating.
  • the outer shape of the condensing lens holder 27 a is substantially circular and coaxial with the outer shape of the condensing lens 26, and the condensing lens unit 25 a having the condensing lens 26 mounted on the base 40 is the semiconductor light emitting device 10. It is configured to be movable in the optical axis direction 71 of the outgoing light 51 from.
  • a flange portion protruding in a direction intersecting with the optical axis direction 71 of the laser light (emitted light 51) emitted from the semiconductor light emitting device 10 is formed.
  • the first collar portion 80 projecting in the X-axis direction on the outer peripheral surface of the condenser lens holder 27a is opposite to the first collar portion 80 and projects in the X-axis direction.
  • a second collar portion 81 is formed.
  • the first collar portion 80 and the second collar portion 81 are formed on the condenser lens holder 27a in a symmetrical shape.
  • an upper adjustment plate 82 and a lower adjustment plate 83 are provided between the first collar portion 80 and the second collar portion 81 of the condenser lens holder 27a. It is arranged in the vertical position.
  • adjustment is performed by sandwiching the first collar portion 80 and the second collar portion 81 from above and below by the upper adjustment plate 82 and the lower adjustment plate 83. Also good.
  • the clamping force at that time is such that when the lens is sandwiched, the condensing lens unit 25a must not be separated from the third side surface 47 and the fourth side surface 48 which are in contact with the base 40. The point is to use power.
  • the condenser lens 26 is disposed in the vicinity of the semiconductor light emitting device 10 in order to take in the emitted light 51 from the semiconductor light emitting device 10 to the maximum extent.
  • the position of the condenser lens unit 25a is adjusted, the position of the condenser lens 26 is moved by several ⁇ m to several tens of ⁇ m in the X-axis direction or the Y-axis direction.
  • the incident light 51 is reflected by the reflective optical element 22, and the spot position 78 on the phosphor optical element 30 is irradiated to a position largely deviated from a desired position in the X-axis direction or the Y-axis direction.
  • the light irradiated to the position shifted from the desired position of the phosphor optical element 30 is projected forward by the reflector 160 described in the light projecting device 101, but the center of the intensity distribution of the projected light is desired. There is a problem that it is projected at a position deviated from the position. In particular, when irradiating light far away, a deviation from the desired position of the center of the intensity distribution of the light projected at a long distance becomes significant.
  • the condensing lens holder 27a of the light source device according to the second embodiment of the present disclosure includes a first collar portion 80 and a second collar portion 81.
  • the first collar portion 80 and the second collar portion 81 are projecting portions that are erected in a direction perpendicular to the optical axis direction 71 from the outer peripheral surface of the condenser lens holder 27a.
  • the first collar portion 80 and the second collar portion 81 are used to adjust the movement of the condenser lens holder 27a in the optical axis direction 71.
  • the light source device according to Embodiment 2 can reduce the spot position deviation of the phosphor due to a change in the external environment.
  • the condenser lens unit 25 is fixed to the base 40 with an adhesive or the like. Thereafter, the condenser lens unit 25 is fixed with screws or the like.
  • a load such as a screw is applied directly to the condensing lens holder 27 or a rotational force of the screw. For this reason, a load such as a screw causes a position shift of the condenser lens unit adjusted. Therefore, in the second embodiment of the present disclosure, the pressing unit 79 presses the condenser lens holder 27 against the base 40 via the pressing spring 28a. Therefore, a load such as a screw is not directly applied to the condensing lens holder 27, so that it can be fixed with high accuracy.
  • the light source device is different from the first and second embodiments in that the direction in which the condenser lens holder is pressed by the pressing member is different.
  • FIG. 16 is a front view for explaining the configuration of the light source device according to the third embodiment of the present disclosure
  • FIG. 17 is a cross-section for explaining the configuration of the light source device according to the third embodiment of the present disclosure
  • FIG. FIG. 18 is a perspective view for explaining the shape of the condensing lens holder according to the third embodiment of the present disclosure.
  • the condenser lens 26 is disposed on the upper surface of the semiconductor light emitting device 10 disposed on the first surface 42 of the base 40a.
  • the condenser lens 26 is fixed to the condenser lens holder 27b by adhesion or the like.
  • the condensing lens holder 27b on which the condensing lens 26 is mounted has two positioning holes 85a and 85b.
  • the positioning hole 85a has a round hole shape
  • the positioning hole 85b has a long hole shape.
  • the positioning holes 85 a and 85 b are through holes that penetrate the condenser lens holder 27 b in the optical axis direction 71.
  • the positioning hole 85b which is a long hole shape has a long shape in the alignment direction of the positioning hole 85a and the positioning hole 85b.
  • two positioning bosses 84a and 84b are formed on the base 40a at positions facing the positioning holes 85a and 85b, respectively.
  • the two positioning bosses 84a and 84b are provided on the base 40a and regulate the position of the condenser lens unit 25b with respect to the base 40a.
  • the two positioning bosses 84a and 84b are formed to protrude from the base 40a in a direction parallel to the optical axis direction 71.
  • the light source device has two pressing springs 28b as shown in FIG.
  • the condenser lens unit 25b is fixed to the base 40a by being pressed in the pressing direction 70b shown in FIG. 17 by two pressing springs 28b fixed to the base 40a.
  • the condenser lens unit 25b is pressed against the third surface 44 of the base 40a shown in FIG.
  • the pressing direction 70b is a direction parallel to the optical axis direction 71 and a negative Z-axis direction.
  • the third surface 44 is a surface parallel to the first surface 42 on which the semiconductor light emitting device 10 formed on the base 40a is mounted and the second surface 43 on which the phosphor optical element 30 is mounted.
  • the base 40 a is configured by an integral body having a first surface 42, a second surface 43, and a first surface 42 and a third surface 44 parallel to the second surface 43.
  • the semiconductor light emitting element 11 is disposed on the first surface 42, and the phosphor optical element 30 is disposed on the second surface 43.
  • the condenser lens holder 27b is pressed against the third surface 44 by the pressing member 28b.
  • FIG. 19 is a perspective view for explaining the function of the light source device according to the third embodiment of the present disclosure.
  • the structure and mechanism for moving the condenser lens unit 25b in the optical axis direction 71 are the same as in the first embodiment, and the condenser lens holder 27b positions the condenser lens unit 25b in the optical axis direction 71.
  • the base 40a is fixed by adhesion or the like.
  • the condensing lens 26 is arranged in the vicinity of the semiconductor light emitting device 10 in order to take in the emitted light 51 (see FIG. 1) from the semiconductor light emitting device 10 to the maximum extent.
  • the position of the condensing lens unit 25b is adjusted, if the position of the condensing lens 26 is moved by several ⁇ m to several tens of ⁇ m in the X-axis direction or Y-axis direction, the light is emitted from the semiconductor light emitting device 10, and FIG. 19, the reflected light 52 (see FIG. 1) reflected by the reflecting optical element 22 (see FIG.
  • a base configured as an integral body having the first surface 42, the second surface 43, and the third surface 44 parallel to the first surface 42 and the second surface 43.
  • the third surface 44 is located between the first surface 42 and the second surface 43. Specifically, the third surface 44 is located between the first surface 42 and the second surface 43 in the optical axis direction 71.
  • the second surface 43 on which the phosphor optical element 30 formed on the base 40a is mounted is above the first surface 42 on which the semiconductor light emitting element 11 (specifically, the semiconductor light emitting device 10) is mounted.
  • the third surface 44 to which the condenser lens holder 27 b is pressed is positioned between the first surface 42 and the second surface 43. According to such a configuration, the light source device according to Embodiment 3 can be further reduced in thickness.
  • the light source device of the present disclosure can efficiently guide the light emitted from the semiconductor light emitting element to the phosphor, can reduce the distance between the semiconductor light emitting element and the lens, and the height of the light emitting device. Can be reduced, and the spot deviation of the phosphor due to the external environment change can be reduced, and the durability of the light source device can be improved. Therefore, the present disclosure can be widely used as various optical devices such as a light source device having a semiconductor light emitting element and a phosphor and a light projecting device using the light source device.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Semiconductor Lasers (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Projection Apparatus (AREA)

Abstract

Le dispositif de source de lumière (1) selon l'invention comprend : un élément électroluminescent semi-conducteur (11) qui émet une lumière laser (lumière d'émission (51)) ; une lentille collectrice (26) qui collecte la lumière laser émise par l'élément électroluminescent semi-conducteur (11) ; un élément optique réfléchissant (22) qui réfléchit la lumière laser collectée par la lentille collectrice (26) ; un élément optique de luminophore (30) qui est exposé à la lumière laser qui est réfléchie par l'élément optique réfléchissant (22) ; une base (40) sur laquelle l'élément optique de luminophore (30) est disposé ; un support de lentille (support de lentille collectrice) (27) qui supporte la lentille collectrice (26) ; et un élément de compression (28) qui comprime le support de lentille (27) contre la base (40).
PCT/JP2018/011597 2017-03-27 2018-03-23 Dispositif de source de lumière et dispositif de projection WO2018180951A1 (fr)

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JP2017-061986 2017-03-27
JP2017061986A JP2020095773A (ja) 2017-03-27 2017-03-27 光源装置および投光装置

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WO2018180951A1 true WO2018180951A1 (fr) 2018-10-04

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059608A (ja) * 2010-09-10 2012-03-22 Stanley Electric Co Ltd 車両用灯具ユニット
JP2014149975A (ja) * 2013-02-01 2014-08-21 Panasonic Corp 照明装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059608A (ja) * 2010-09-10 2012-03-22 Stanley Electric Co Ltd 車両用灯具ユニット
JP2014149975A (ja) * 2013-02-01 2014-08-21 Panasonic Corp 照明装置

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