WO2018180217A1 - Contact électrique, relais électromagnétique pourvu dudit contact, et procédé de fabrication de contact électrique - Google Patents

Contact électrique, relais électromagnétique pourvu dudit contact, et procédé de fabrication de contact électrique Download PDF

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Publication number
WO2018180217A1
WO2018180217A1 PCT/JP2018/008146 JP2018008146W WO2018180217A1 WO 2018180217 A1 WO2018180217 A1 WO 2018180217A1 JP 2018008146 W JP2018008146 W JP 2018008146W WO 2018180217 A1 WO2018180217 A1 WO 2018180217A1
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Prior art keywords
base
electrical contact
contact layer
contact
layer
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PCT/JP2018/008146
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English (en)
Japanese (ja)
Inventor
開 伊集院
青木　達也
西川　和宏
前田　正史
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日本電産株式会社
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Publication of WO2018180217A1 publication Critical patent/WO2018180217A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Definitions

  • the present invention relates to an electrical contact, an electromagnetic relay including the electrical contact, and a method for manufacturing the electrical contact.
  • an electromagnetic relay for example, as disclosed in Patent Document 1, an electrical contact disposed on a fixed contact spring and an electrical contact disposed on a movable contact spring are operated by an operation of an electromagnet including an iron core magnetic pole and a coil.
  • an electromagnet including an iron core magnetic pole and a coil.
  • the arrangement of contacting or separating is known.
  • the electrical contact used for the electromagnetic relay having the above-described configuration is required not only to be conductive but also to be durable. Therefore, as disclosed in Patent Document 2, for example, a configuration is known in which a material in which a metal oxide is dispersed in Ag is used as the material of the electrical contact. Thus, conductivity can be ensured by using Ag as the material of the electrical contact. Moreover, the durability as the electrical contact can be improved by dispersing a metal oxide in Ag. *
  • the electrical contact member disclosed in Patent Document 4 is obtained by spraying a mixed powder containing a refractory metal and a highly conductive metal onto a base material made of the highly conductive metal. That is, in the configuration disclosed in Patent Document 4, a contact layer is formed on the substrate by spraying the mixed powder onto the base material.
  • the denseness of the distribution of elements affecting the durability in the contact layer obtained by the mixed powder is the metal oxide.
  • the durability of the contact layer has a relationship with the dense distribution of elements that affect the durability.
  • the particles in the mixed powder have a certain size. Therefore, when noble metal particles and metal oxide particles are used as the mixed powder, the distribution of elements affecting the durability cannot be made very dense. Therefore, when the said contact layer is formed using the said mixed powder, a contact layer with high durability may not be obtained.
  • An object of the present invention is to provide an electrical contact capable of improving durability in an electrical contact having a contact layer formed of a plurality of particles on a base, and a method for manufacturing the electrical contact.
  • the electrical contact which concerns on one Embodiment of this invention is an electrical contact which supplies with electricity by contacting a to-be-contacted part.
  • the electrical contact includes a base portion including a conductive metal material, and a contact layer located on the base portion and energized between the contacted portion.
  • the contact layer includes an alloy having a noble metal and an oxide of a metal other than the noble metal, and is composed of a plurality of flat alloy particles that are diffusion-bonded.
  • the manufacturing method of the electrical contact which concerns on one Embodiment of this invention is a manufacturing method of the electrical contact which supplies with electricity by contacting a to-be-contacted part.
  • a base forming step for forming a base including a conductive metal material, and alloy particles including an alloy having a noble metal and an oxide of a metal other than the noble metal are injected together with a gas to the base.
  • a contact layer forming step of forming a contact layer on the base is a contact layer on the base.
  • the durability of the electrical contact can be improved.
  • FIG. 1 is a figure showing typically composition of a relay device provided with an electric contact concerning an embodiment.
  • FIG. 2 is a cross-sectional view showing a schematic configuration of the electrical contact.
  • FIG. 3 is a photograph showing the result of observing the cross section of the electrical contact in the stacking direction of the base and contact layer and observing the cross section.
  • FIG. 4 is a diagram schematically showing how the lead frame is molded.
  • FIG. 5 is a diagram schematically showing a state in which a contact layer is formed on the protruding portion of the lead frame by a spray method.
  • FIG. 6 is a view corresponding to FIG. 2 illustrating a schematic configuration of an electrical contact according to another embodiment.
  • FIG. 7 is a diagram schematically showing how the base is fixed to the lead frame.
  • FIG. 8 is a diagram schematically showing a state in which a contact layer is formed on the base fixed to the lead frame by a spray method.
  • FIG. 9 is a view corresponding to FIG. 2 showing a
  • fixed In the following description, the expressions “fixed”, “connected”, “attached”, etc. (hereinafter referred to as “fixed”, etc.) are fixed not only when the members are directly fixed, but also through other members. It includes cases where That is, in the following description, expressions such as fixation include the meanings of direct and indirect fixation between members. *
  • FIG. 1 is a diagram schematically showing a relay device 1 (electromagnetic relay) including an electrical contact 2 according to an embodiment of the present invention.
  • FIG. 1 is the figure which looked at the relay apparatus 1 from the side.
  • the relay device 1 has a pair of electrical contacts 2 and 3 that are arranged to face each other with a predetermined interval.
  • the relay device 1 controls energization and interruption of current by switching between contact and separation of the pair of electrical contacts 2 and 3.
  • the electrical contact 3 is a contacted portion that contacts the electrical contact 2.
  • the relay device 1 may have two or more pairs of electrical contacts that are arranged to face each other at a predetermined interval. *
  • the relay device 1 has a pair of flat lead frames 4 and 5 provided with electrical contacts 2 and 3, respectively, and a drive mechanism 6. *
  • the pair of lead frames 4 and 5 are flat members formed of a conductive metal material such as Cu or Cu alloy.
  • the electrical conductivity of the pair of lead frames 4 and 5 is preferably 50% IACS or more.
  • the pair of lead frames 4 and 5 are arranged to face each other with a predetermined interval, and one end side is fixed.
  • the other end side of the pair of lead frames 4 and 5 is a free end, and the electrical contacts 2 and 3 are arranged opposite to the other end side.
  • the electrical contact 2 is electrically connected to the lead frame 4.
  • the electrical contact 3 is electrically connected to the lead frame 5. *
  • a power source is electrically connected to the lead frame 4, and a device driven by power supplied from the power source is electrically connected to the lead frame 5.
  • the drive mechanism 6 includes a cylindrical coil 6a (shown in a longitudinal section in FIG. 1), an iron core 6b positioned inside the coil 6a, and an armature 6c.
  • the armature 6c is a crank-shaped member formed of a magnetic material when viewed from the side.
  • One end side of the armature 6c is in contact with one lead frame 4 provided with the electrical contact 2 of the pair of lead frames 4 and 5.
  • the other end side of the armature 6c is located in the vicinity of the coil 6a and the iron core 6b, and is separated from the coil 6a and the iron core 6b toward the tip.
  • the bending part of the armature 6c is supported rotatably.
  • the rotation center of the armature 6c is indicated by P. *
  • a current is supplied to the coil 6a from a power source (not shown). Supply of current to the coil 6a is performed when an instruction to energize the relay device 1 is received from a control device (not shown). When a current is supplied to the coil 6a, a magnetic field is generated in the coil 6a and the iron core 6b. On the other hand, when the control device instructs the relay device 1 to shut off, no current is supplied to the coil 6a. *
  • the relay device 1 may include a return spring that separates the lead frame 4 from the lead frame 5 when no magnetic field is generated in the coil 6a and the iron core 6b.
  • the electrical contact 2 is located on the other end side of the lead frame 4.
  • the electrical contact 2 includes a base portion 11 constituted by a part of the lead frame 4 and a contact layer 12 formed on the base portion 11.
  • the base 11 is a protruding portion 4a in which a part of the lead frame 4 protrudes in a bottomed cylindrical shape on one side in the thickness direction (contact layer side).
  • the lead frame 4 has a recess 4 b on the other side in the thickness direction with respect to the base 11.
  • the protruding portion 4a constituting the base portion 11 is formed by denting a part of the lead frame 4 to one side in the thickness direction. That is, the base 11 is a single member with the lead frame 4. *
  • the base 11 can be easily formed on the lead frame 4 by using the protruding portion 4 a obtained by denting a part of the lead frame 4 in one side in the thickness direction as the base 11.
  • the manufacturing cost can be reduced.
  • the contact layer 12 functions as a contact portion that contacts the electrical contact 3 in the electrical contact 2.
  • the contact layer 12 includes, for example, a noble metal such as Ag and an oxide of a metal other than the noble metal such as Sn (hereinafter, metal oxide).
  • the contact layer 12 has a thickness of 0.01 mm to 2.0 mm, for example. As described above, when the contact layer 12 includes a noble metal such as Ag and a metal oxide, the electrical resistance of the contact layer 12 can be reduced and the durability of the contact layer 12 can be reduced as compared with the case where other conductive materials are used. Can be improved.
  • the electrical conductivity of the contact layer 12 is preferably 50% IACS or more.
  • the contact layer 12 is formed by causing fine alloy particles X containing Ag and a metal oxide to collide with the protruding portion 4a (base portion 11) of the lead frame 4 by, for example, a spray method or the like.
  • the alloy particles X can be obtained by seeing a cross section when the electrical contact 2 is cut in the stacking direction of the base 11 and the contact layer 12 as shown in FIG. It is deformed into an ellipse that is longer in the direction perpendicular to the stacking direction than in the direction.
  • the alloy particles X deformed in an elliptical shape are diffusion bonded to the base 11 or other alloy particles X.
  • the contact layer 12 includes an alloy of a noble metal (for example, Ag) and a metal oxide (for example, an oxide of a metal such as Sn), and is configured by a plurality of flat alloy particles X that are diffusion-bonded.
  • FIG. 3 is a photograph showing the result of observing a cross section of the electrical contact 2 in the stacking direction of the base 11 and the contact layer 12 and observing the cross section. *
  • the metal oxide is dispersed.
  • the size (diameter) of the metal oxide in the contact layer 12 is distributed around 50 to 500 nm. Thereby, a dense layer structure is obtained in the contact layer 12, and the durability of the entire contact layer 12 can be improved.
  • the minimum size of the metal strand to be used is determined. Therefore, when forming an electrical contact, a noble metal more than a required amount is used. However, as described above, by forming the contact layer 12 using the spray method, the contact layer 12 can be easily formed without making it thicker than necessary.
  • the amount of metal oxide in the alloy particles X is not limited by the amount of metal oxide added. Can be adjusted. Thereby, durability of the contact layer 12 can be improved.
  • the contact layer 12 is formed on the base 11 by the spray method etc. using the alloy particle X containing Ag and a metal oxide. Therefore, the size of the metal oxide can be reduced and the metal oxide can be dispersed in the alloy particles X as compared with the case where a mixed metal powder is used as in the method disclosed in the fourth embodiment. Can be made. Thereby, compared with the case where mixed powder is used, the contact layer 12 which has the structure
  • the noble metal contained in the contact layer 12 is not limited to Ag, but may be Au, Pt, Ir, Ru, Pd, Ni, or W. Further, the contact layer 12 is not limited to a noble metal, and may include an alloy containing a noble metal element as a main component. *
  • the metal oxide contained in the contact layer 12 is not limited to Sn oxide, but Zn, Al, Cu, Mg, Ni, Sb, In, Cd, Ga, Se, Tl, Te, Pb, Bi, Po The oxide of may be sufficient. *
  • the electrical contact 3 may have the same configuration as the electrical contact 2 or may have a different configuration.
  • the contact portion of the electrical contact 3 is also preferably made of a material containing a noble metal, like the electrical contact 2.
  • the contact part of the electrical contact 3 also has the same configuration as the contact layer 12 of the electrical contact 2 from the viewpoint of durability.
  • a metal plate made of a material containing Cu or a Cu alloy is sandwiched in a thickness direction by a pair of molds 41 and 42 and pressed, whereby the protrusion 4 a and the recess 4 b are formed on the metal plate.
  • the mold 41 has a mold convex portion 41a for forming the concave portion 4b in the metal plate.
  • the mold 42 has a mold recess 42a for forming the protrusion 4a on the metal plate.
  • the metal plate 41 is sandwiched in the thickness direction by the molds 41 and 42 and pressed to form the lead frame 4 having the protrusions 4a and the recesses 4b.
  • the mold convex part 41a and the mold concave part 42a of the molds 41 and 42 are each circular in a plan view. Therefore, the protrusion 4a formed on the lead frame 4 has a bottomed cylindrical shape.
  • FIG. 5 is a diagram schematically showing the state of layer formation, and the positional relationship and size relationship between the layer forming apparatus 50 used in the spray method and the lead frame 4 are different from actual ones. *
  • the layer forming apparatus 50 forms a contact layer 12 on the base 11 by a so-called cold spray method in which fine particles collide against the substrate in a solid phase state below the melting temperature to form a layer on the substrate. To do.
  • the layer forming apparatus 50 includes a spray gun 51 that discharges the alloy particles X using a high-pressure gas.
  • the spray gun 51 has a space 51a in which alloy particles X are supplied from the outside, and a nozzle 51b for discharging the alloy particles X in the space 51a.
  • the alloy particles X are supplied from the outside to the space 51a of the spray gun 51, and a high-pressure gas having a predetermined pressure (for example, a pressure higher than 1 MPa) and a predetermined temperature (below the melting temperature of the alloy particles X) is supplied.
  • a high-pressure gas having a predetermined pressure for example, a pressure higher than 1 MPa
  • a predetermined temperature below the melting temperature of the alloy particles X
  • the alloy particles X collide with the surface of the base 11 part of the alloy particles X bite into the base 11, and the base 11 and the contact layer 12 are cut in the stacking direction. Also, it is deformed into a long flat shape in a direction perpendicular to the stacking direction. Thereby, the flat alloy particles X are diffusion bonded to the base 11.
  • the alloy particle X collides with another alloy particle X the alloy particle X is deformed into a flat shape that is long in the orthogonal direction in the cross section. Thereby, the particles X are diffusion bonded.
  • FIG. 3 shows a cross-sectional photograph of the electrical contact when the contact layer 12 is formed by colliding the alloy particles X on the base 11. *
  • the alloy particle X is, for example, a particle containing an alloy having Ag which is a noble metal and an oxide of Sn.
  • Sn oxide is dispersed in the particles. Therefore, by forming the contact layer 12 using the alloy particles X, the Sn oxide can be further dispersed in the contact layer 12. Therefore, compared with the case where the contact layer is formed using the mixed powder of Ag and metal oxide, a finer layer structure can be obtained in the contact layer 12 as a whole, and thus the contact layer 12 having high durability can be obtained.
  • the alloy particles X preferably have a particle size of 1 ⁇ m to 100 ⁇ m. From the viewpoint of efficiently discharging the alloy particles X supplied into the space 51a of the spray gun 51 from the nozzle 51b of the spray gun 51, the particle size of the alloy particles X is more preferably 10 ⁇ m or more. From the viewpoint of obtaining a fine layer structure in the contact layer 12, it is more preferable to use the alloy particles X having a particle size distributed around 10 ⁇ m to 20 ⁇ m in the formation of the contact layer 12. *
  • the noble metal contained in the alloy particle X is not limited to Ag, but may be Au, Pt, Ir, Ru, Pd, Ni, and W.
  • the contact layer 12 is not limited to a noble metal, and may include an alloy containing a noble metal element as a main component. *
  • the metal oxide contained in the alloy particle X is not limited to the oxide of Sn, but oxidation of Zn, Al, Cu, Mg, Ni, Sb, In, Cd, Ga, Se, Tl, Te, Pb, Bi, and Po. It may be a thing. *
  • the high-pressure gas is preferably a gas that can prevent oxidation and alteration of the alloy particles X.
  • the high-pressure gas is preferably a gas having a high sound speed in the gas. Examples of such a gas include H 2 , He, N 2 , O 2, and a gas containing them as a main component.
  • the step of forming the base portion 11 corresponds to the base portion forming step.
  • the step of forming the contact layer 12 on the base 11 corresponds to the contact layer forming step.
  • the contact layer 12 is formed on the base 11 of the lead frame 4 as shown in FIG.
  • the contact layer 12 has a thickness of 0.01 mm to 2.0 mm, for example. *
  • the size (diameter) of the metal oxide in the contact layer 12 is distributed around 50 to 500 nm, for example. That is, the metal oxide can be dispersed in the contact layer 12. Therefore, since a detailed layer structure is obtained in the entire contact layer 12, the durability of the contact layer 12 can be improved.
  • the processing cost of the powder increases. Therefore, as in the present embodiment, by forming the contact layer 12 using the alloy particles X of Ag and metal oxide, the manufacturing cost can be reduced as compared with the case where the above mixed powder is used.
  • the contact layer 12 is formed by a cold spray method.
  • the contact layer 12 may be formed by a method other than the cold spray method. Examples of other forming methods include plasma spraying using plasma, methods using flame spraying such as flame spraying, and methods such as vapor deposition. Further, the contact layer may be formed by combining various forming methods. *
  • the contact layer 12 after forming the contact layer 12 on the base 11, you may finish-mold the contact layer 12 with a shaping
  • the base 11 of the first embodiment has a bottomed cylindrical shape.
  • the shape of the base may be any shape such as a polyhedral shape as long as the contact layer can be formed on the base.
  • the base 11 is constituted by a part of the lead frame 4.
  • the base of the electrical contact may be a member different from the lead frame.
  • FIG. 6 shows an example in which the base 111 of the electrical contact 102 is a member different from the lead frame 104.
  • the flat lead frame 104 has a through hole 104a on the other end side which is a free end.
  • the lead frame 104 is formed of a conductive metal material containing Cu or a Cu alloy, like the lead frame 4 of the first embodiment.
  • the electrical contact 102 includes a base 111 that is a separate member from the lead frame 104 and a contact layer 112. *
  • the base 111 is formed of a conductive metal material containing Cu or a Cu alloy, like the lead frame 104.
  • the base 111 includes a shaft 121 and a flange 122 located on one end side of the shaft 121. *
  • the shaft portion 121 can be disposed in the through hole 104 a of the lead frame 104. That is, the lead frame 104 has a through hole 104 a that can accommodate the shaft portion 121.
  • the shaft 121 is crushed on the other end side in a state of being disposed in the through hole 104 a of the lead frame 104. Therefore, the base 111 is fixed to the peripheral edge of the lead frame 104 facing the through hole 104 a in a state where the shaft 121 is disposed in the through hole 104 a of the lead frame 104. Thereby, the base 111 can be formed separately from the lead frame 104 and attached to the lead frame 104. *
  • the contact layer 112 is located on the surface of the flange portion 122 of the base portion 111.
  • the contact layer 112 is comprised by the alloy particle containing the alloy of noble metals, such as Ag, and a metal oxide like the contact layer of Embodiment 1, for example.
  • the lead frame 104 having the through hole 104a is formed, and the base 111 having the shaft portion 121 and the flange portion 122 is formed. Both the lead frame 104 and the base 111 are made of a conductive metal material containing Cu or a Cu alloy. *
  • the lead frame 104 and the base 111 are set to the pair of molds 141 and 142 in a state where the shaft 121 of the base 111 is disposed in the through hole 104 a of the lead frame 104.
  • the mold 141 has a pin 141a and a guide hole 141b.
  • the pin 141a moves in the guide hole 141b of the mold 141.
  • the other end side of the shaft portion 121 of the base portion 111 is disposed.
  • the mold 142 has a mold recess 142a.
  • the flange 122 of the base 111 is disposed in the mold recess 142a. Accordingly, the flange 122 of the base 111 can be held by the mold 142.
  • the lead frame 104 is held while being sandwiched between the pair of molds 141 and 142. *
  • the shaft 141 of the base 111 is moved by moving the pin 141a within the guide hole 141b of the mold 141 in a state where the pair of molds 141 and 142 is disposed with respect to the lead frame 104 and the base 111. Crush the other end of the.
  • the base 111 is fixed to the peripheral portion of the lead frame 104 facing the through hole 104a in a state where a part of the shaft 121 is disposed in the through hole 104a of the lead frame 104. Therefore, the shaft 121 of the base 111 can be fixed to the lead frame 104.
  • the contact layer 112 is formed on the flange portion 122 of the base 111 by the layer forming apparatus 50 having the same configuration as that of the above embodiment. Note that the method for forming the contact layer 112 by the layer forming apparatus 50 is the same as that in the first embodiment, and a detailed description thereof will be omitted. *
  • the process of fixing the base 111 to the lead frame 104 corresponds to the base forming process.
  • the step of forming the contact layer 112 on the base 111 corresponds to the contact layer forming step.
  • the base 111 can be formed separately from the lead frame 104. Thereby, the base 111 can be formed of a metal material different from that of the lead frame 104, or the base 111 can be formed in a free shape. Therefore, the design freedom of the base 111 can be improved.
  • the contact layer 12 is formed on the base 11.
  • an antioxidant layer may be formed on the base 11 and the contact layer 12 may be formed on the antioxidant layer. That is, before the contact layer forming step, the acid preventing layer may be formed on the surface of the substrate 11 by the antioxidant layer forming step.
  • FIG. 9 shows a schematic configuration of the electrical contact 202 in which the antioxidant layer 13 is formed on the base 11 and the contact layer 12 is formed on the antioxidant layer 13.
  • the antioxidant layer 13 includes a noble metal such as Ag.
  • the formation method of the antioxidant layer 13 may be any formation method as long as it can be formed, such as spraying or plating. *
  • the antioxidant layer 13 By forming the antioxidant layer 13 on the base 11 as described above, it is possible to prevent the base 11 from being oxidized when the contact layer 12 is formed. Therefore, it is possible to suppress an increase in electrical resistance inside the electrical contact 202.
  • the present invention is applicable to an electrical contact having a contact layer formed by a plurality of particles on a base.

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Abstract

Le problème décrit par la présente invention est de produire un contact électrique pourvu d'une couche de contact constituée d'une pluralité de particules sur une base et dont la durabilité peut être améliorée, ainsi qu'un procédé de fabrication du contact électrique. La solution de l'invention porte sur un contact électrique pourvu : d'une base (11) comprenant un matériau métallique électroconducteur ; et d'une couche de contact (12) située sur la base (11), la couche de contact (12) conduisant de l'électricité à un autre contact électrique. La couche de contact (12) comprend une pluralité de particules d'alliage de forme plate (X) qui contiennent un métal noble et un alliage d'oxyde métallique et qui sont liées par diffusion.
PCT/JP2018/008146 2017-03-27 2018-03-02 Contact électrique, relais électromagnétique pourvu dudit contact, et procédé de fabrication de contact électrique WO2018180217A1 (fr)

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JP2017061824 2017-03-27

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316725A (ja) * 1989-06-15 1991-01-24 Tanaka Kikinzoku Kogyo Kk 薄板ばね材料
JP2005276647A (ja) * 2004-03-25 2005-10-06 Matsushita Electric Works Ltd 高周波スイッチ
JP2013514614A (ja) * 2009-12-18 2013-04-25 メタロー テクノロジーズ インターナショナル エスエー 電気接点パッドおよび電気接点を製造する方法
JP2017036464A (ja) * 2015-08-06 2017-02-16 日本発條株式会社 導電部材、ガス絶縁開閉装置用導電部材およびガス絶縁開閉装置用導電部材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316725A (ja) * 1989-06-15 1991-01-24 Tanaka Kikinzoku Kogyo Kk 薄板ばね材料
JP2005276647A (ja) * 2004-03-25 2005-10-06 Matsushita Electric Works Ltd 高周波スイッチ
JP2013514614A (ja) * 2009-12-18 2013-04-25 メタロー テクノロジーズ インターナショナル エスエー 電気接点パッドおよび電気接点を製造する方法
JP2017036464A (ja) * 2015-08-06 2017-02-16 日本発條株式会社 導電部材、ガス絶縁開閉装置用導電部材およびガス絶縁開閉装置用導電部材の製造方法

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