WO2018159746A1 - 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法 - Google Patents

光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法 Download PDF

Info

Publication number
WO2018159746A1
WO2018159746A1 PCT/JP2018/007721 JP2018007721W WO2018159746A1 WO 2018159746 A1 WO2018159746 A1 WO 2018159746A1 JP 2018007721 W JP2018007721 W JP 2018007721W WO 2018159746 A1 WO2018159746 A1 WO 2018159746A1
Authority
WO
WIPO (PCT)
Prior art keywords
core
epoxy resin
layer
optical waveguide
resin composition
Prior art date
Application number
PCT/JP2018/007721
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智之 平山
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201880014642.3A priority Critical patent/CN110537125B/zh
Priority to KR1020197019928A priority patent/KR102456203B1/ko
Publication of WO2018159746A1 publication Critical patent/WO2018159746A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Definitions

  • the present invention relates to a photosensitive epoxy resin composition for forming an optical waveguide core, a photosensitive film for forming an optical waveguide core, an optical waveguide, an opto-electric hybrid board, and an optical waveguide manufacturing method.
  • optical waveguides that transmit optical signals are known.
  • the optical waveguide includes a core layer through which an optical signal passes and a clad layer that covers the core layer.
  • the core layer is required to have various properties in a balanced manner in order to ensure the performance of the optical waveguide.
  • the core layer has a low absorption loss (linear loss) and high refractive index for suppressing optical loss, an excellent flexibility for ensuring the flexibility of the optical waveguide, and an excellent patterning for forming by photolithography. Sex is required.
  • the photosensitive epoxy resin composition for optical waveguide formation forms a core layer by a wet process.
  • the photosensitive epoxy resin composition for forming an optical waveguide is dissolved in an organic solvent to prepare a photosensitive varnish, the photosensitive varnish is coated on the undercladding layer, dried, and then dried. The film is exposed and developed to form a core layer.
  • the coating surface 33A becomes uniform. Therefore, when the depression 32 is generated in the under cladding layer 31 in the manufacturing process, the thickness T1 of the coating film 33 corresponding to the depression 32 of the under cladding layer 31 is equal to the thickness T2 of the portion without the depression 32 (under cladding layer). The thickness of the coating film 33 in the portion corresponding to the flat surface 31 is larger.
  • the thickness of the dry film 34 formed by drying the coating film 33 of the photosensitive varnish cannot be made constant throughout, and as a result, the dimensional accuracy of the core layer formed by exposing and developing the dry film 34 decreases. There is a problem that it ends up.
  • the dry film 34 is attached following the recess 32 of the underclad layer 31.
  • the thickness of the dry film 34 can be made constant throughout, and the dimensional accuracy of the core layer can be improved.
  • the carrier film 35 is peeled off from the dry film 34, so that the dry film 34 has a tack property for adhering to the under cladding layer 31. And releasability of the carrier film 35 are required.
  • the dry film prepared from the photosensitive epoxy resin composition for forming an optical waveguide described in Patent Document 1 cannot secure the tackiness required for the dry process and cannot stably adhere to the undercladding layer.
  • the present invention provides a photosensitive epoxy resin composition for forming an optical waveguide core, which can be suitably applied to the formation of a core layer by a dry process, while ensuring various properties required for the optical waveguide in a well-balanced manner, and forming an optical waveguide core
  • a photosensitive film, an optical waveguide, an opto-electric hybrid board, and an optical waveguide manufacturing method are provided.
  • the present invention [1] contains a resin component and a cationic photopolymerization initiator, and the resin component is a cresol novolac type epoxy resin having three or more epoxy groups and a solid component having two epoxy groups.
  • a photosensitive epoxy resin composition for forming an optical waveguide core containing a bisphenol-type epoxy resin, a liquid bisphenol-type epoxy resin having two epoxy groups, and a solid fluorene ring-containing epoxy compound is included.
  • the present invention [2] is based on a total of 100 parts by mass of the cresol novolac epoxy resin, the solid bisphenol epoxy resin, the liquid bisphenol epoxy resin, and the solid fluorene ring-containing epoxy compound.
  • the content ratio of the cresol novolac type epoxy resin is 45 parts by mass or more and 60 parts by mass or less, the content ratio of the solid bisphenol type epoxy resin is 15 parts by mass or more and 25 parts by mass or less, and the liquid bisphenol
  • the content ratio of the type epoxy resin is 15 parts by mass or more and 25 parts by mass or less, and the content ratio of the solid fluorene ring-containing epoxy compound is 5 parts by mass or more and 15 parts by mass or less.
  • a photosensitive epoxy resin composition for forming an optical waveguide core is included.
  • This invention [3] contains the photosensitive film for optical waveguide core formation provided with the resin composition layer containing the photosensitive epoxy resin composition for optical waveguide core formation as described in said [1] or [2]. .
  • the present invention [4] includes an optical waveguide provided with a core layer containing a cured product of the photosensitive epoxy resin composition for forming an optical waveguide core according to the above [1] or [2].
  • the present invention [5] includes the optical waveguide according to the above [4], further including a cladding layer covering the core layer and having a refractive index of 1.554 or less.
  • the present invention [6] includes an opto-electric hybrid board provided with the optical waveguide described in [4] or [5] above.
  • the present invention includes a step of forming an undercladding layer, a step of attaching the resin composition layer of the photosensitive film for forming an optical waveguide core according to [3] above to the undercladding layer, Exposing and developing the resin composition layer to form a core layer on the undercladding layer; and forming an overcladding layer on the undercladding layer so as to cover the core layer.
  • a method of manufacturing a waveguide is included.
  • the resin component is a cresol novolac type epoxy resin which is a crosslinkable component, a solid bisphenol type epoxy resin and a liquid bisphenol type epoxy which are flexibility components. It contains a resin and a solid fluorene ring-containing epoxy compound that is a refractive index adjusting component.
  • the core layer containing a cured product of the photosensitive epoxy resin composition for forming an optical waveguide core can ensure a low absorption loss, excellent patternability, excellent flexibility, and a high refractive index in a balanced manner.
  • the flexibility-imparting component contains a liquid bisphenol-type epoxy resin, tackiness can be imparted to the resin composition layer containing the photosensitive epoxy resin composition for forming an optical waveguide core.
  • the photosensitive epoxy resin composition for forming an optical waveguide core can be suitably applied to the formation of a core layer by a dry process while ensuring various properties required for the optical waveguide in a well-balanced manner.
  • the photosensitive film for forming an optical waveguide core of the present invention includes a resin composition layer containing the above-described photosensitive epoxy resin composition for forming an optical waveguide core, various properties required for the optical waveguide can be secured in a balanced manner. However, it can be suitably applied to the formation of the core layer by a dry process.
  • the optical waveguide of the present invention includes a core layer containing a cured product of the above-described photosensitive epoxy resin composition for forming an optical waveguide core, so that various properties required for the optical waveguide can be secured in a well-balanced manner.
  • the dimensional accuracy can be improved.
  • the opto-electric hybrid board according to the present invention includes the above-described optical waveguide, it is possible to improve the dimensional accuracy of the core layer while ensuring various properties required for the optical waveguide in a well-balanced manner.
  • the resin composition layer included in the photosensitive film for forming an optical waveguide core described above is attached to an underclad layer
  • the resin composition layer is exposed and developed, A core layer is formed on the under cladding layer. That is, the core layer can be formed by a dry process.
  • an optical waveguide including a core layer having various characteristics required in a balanced manner and having excellent dimensional accuracy.
  • FIG. 1 shows a cross-sectional view of one embodiment of a photosensitive film for forming an optical waveguide core of the present invention.
  • FIG. 2 is a plan view of an embodiment of the opto-electric hybrid board according to the present invention.
  • FIG. 3 is a cross-sectional view taken along the line AA of the opto-electric hybrid board shown in FIG. 4 is a cross-sectional view taken along the line BB of the opto-electric hybrid board shown in FIG. 5A to 5F show manufacturing process diagrams of the opto-electric hybrid board shown in FIG. 3.
  • FIG. 5A shows a process of forming an under clad layer
  • FIG. 5B shows a process of attaching a core resin composition layer to the under clad layer.
  • FIG. 5C is the step of exposing the core resin composition layer
  • FIG. 5D is the step of peeling the carrier film from the core resin composition layer
  • FIG. 5E is the step of developing the core layer
  • FIG. 6A shows an explanatory diagram for explaining the wet process
  • FIG. 6B shows an explanatory diagram for explaining the dry process.
  • the photosensitive epoxy resin composition for forming an optical waveguide core of the present invention (hereinafter, referred to as a core epoxy resin composition) will be described.
  • the epoxy resin composition for the core is a material for the core layer provided in the optical waveguide, and contains a resin component and a cationic photopolymerization initiator.
  • the resin component contains a cresol novolac type epoxy resin, a solid bisphenol type epoxy resin, a liquid bisphenol type epoxy resin, and a solid fluorene ring-containing epoxy compound, and preferably consists of them.
  • Solid means a solid state having no fluidity at room temperature (25 ° C. ⁇ 5 ° C.), and “liquid” means at room temperature (25 ° C. ⁇ 5 ° C.).
  • (1-1) Cresol Novolac Type Epoxy Resin Cresol novolac type epoxy resin is a crosslinkable component and has three or more epoxy groups.
  • the cresol novolac type epoxy resin is a solid state having no fluidity at room temperature (25 ° C. ⁇ 5 ° C.), and is represented by, for example, the following general formula (1).
  • General formula (1) General formula (1)
  • n represents an integer of 1 or more and 4 or less.
  • the cresol novolak type epoxy resin represented by the general formula (1) has a main chain containing (consisting of) a cresol novolak structure and a side chain containing a glycidyl ether unit.
  • the resin component contains a cresol novolac type epoxy resin, it is possible to surely reduce the absorption loss of the core layer, which will be described later, and to reliably reduce the optical loss.
  • cresol novolac type epoxy resin A commercially available product can be used as the cresol novolac type epoxy resin.
  • cresol novolac epoxy resins include YDCN-704A (epoxy equivalents 204 to 216 g / eq.), YDCN-700-10 (epoxy equivalents 198 to 210 g / eq.), YDCN-700-7 (epoxy equivalents). 196 to 210 g / eq.), YDCN-700-3 (epoxy equivalent 194 to 208 g / eq.) (All manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), and the like.
  • Such cresol novolac type epoxy resins can be used alone or in combination of two or more.
  • the content of the cresol novolac epoxy resin is the sum of the cresol novolac epoxy resin, the solid bisphenol epoxy resin, the liquid bisphenol epoxy resin, and the solid fluorene ring-containing epoxy compound (hereinafter referred to as total epoxy component and For example, 30 parts by mass or more, preferably 45 parts by mass or more, more preferably 50 parts by mass or more, for example, 70 parts by mass or less, preferably 60 parts by mass or less with respect to 100 parts by mass. .
  • the solid bisphenol-type epoxy resin is a flexibility-imparting component that imparts flexibility to the core layer described later together with the liquid bisphenol-type epoxy resin.
  • the solid bisphenol type epoxy resin has two epoxy groups.
  • a solid bisphenol-type epoxy resin has a molecular chain including a plurality of aromatic rings and an epoxy group bonded to both ends of the molecular chain.
  • the epoxy equivalent in the solid bisphenol type epoxy resin is, for example, 450 g / eq. Or more, preferably 500 g / eq. As described above, for example, 5000 g / eq. Hereinafter, preferably, 800 g / eq. It is as follows.
  • Examples of such a solid bisphenol type epoxy resin include a solid bisphenol A type epoxy resin.
  • the solid bisphenol type epoxy resin contains the solid bisphenol A type epoxy resin, the core layer can be reliably improved in flexibility.
  • the solid bisphenol type epoxy resin is preferably made of a solid bisphenol A type epoxy resin.
  • Solid bisphenol A type epoxy resin is a copolymer of bisphenol A and epichlorohydrin, and has glycidyl ether units at both ends of the molecular chain.
  • Solid bisphenol A type epoxy resin Commercially available products can be used as the solid bisphenol A type epoxy resin.
  • Commercially available products of solid bisphenol A type epoxy resin include, for example, JER1002 (epoxy equivalent 600 to 700 g / eq.), JER1003 (epoxy equivalent 670 to 770 g / eq.), JER1004 (epoxy equivalent 875 to 975 g / eq.), Examples include JER1007 (epoxy equivalent 1750-2200 g / eq.), JER1010 (epoxy equivalent 3000-5000 g / eq.) (All manufactured by Mitsubishi Chemical Corporation), and the like.
  • Such solid bisphenol A type epoxy resins can be used alone or in combination of two or more.
  • the resin component may include other bisphenol type epoxy resins such as a solid bisphenol F type epoxy resin in addition to the solid bisphenol A type epoxy resin as a solid bisphenol type epoxy resin.
  • the solid bisphenol type epoxy resin is mainly composed of a solid bisphenol A type epoxy resin, and other solid bisphenol type epoxy resins.
  • Resin such as bisphenol F type epoxy resin
  • the solid bisphenol A type epoxy resin is, for example, 90% by mass or more and 100% by mass or less based on the total amount of the solid bisphenol type epoxy resin (the total of the bisphenol A type epoxy resin and the other bisphenol type epoxy resin).
  • the other solid bisphenol-type epoxy resin solid bisphenol F-type epoxy resin
  • the content ratio of the solid bisphenol-type epoxy resin is, for example, 10 parts by mass or more, preferably 15 parts by mass or more, more preferably 20 parts by mass or more, for example, 30 parts by mass with respect to 100 parts by mass of the total epoxy component.
  • it is preferably 25 parts by mass or less, and more preferably 22 parts by mass or less.
  • the liquid bisphenol-type epoxy resin is a tackiness-imparting component that imparts tackiness to the core resin composition layer described later, as well as a flexibility-imparting component.
  • Liquid bisphenol type epoxy resin has two epoxy groups.
  • a liquid bisphenol-type epoxy resin has a molecular chain including a plurality of aromatic rings and an epoxy group bonded to both ends of the molecular chain.
  • the epoxy equivalent in the liquid bisphenol type epoxy resin is, for example, 170 g / eq. Or more, preferably 180 g / eq. As described above, for example, 300 g / eq. Hereinafter, preferably, 200 g / eq. It is as follows.
  • liquid bisphenol type epoxy resin examples include a liquid bisphenol A type epoxy resin.
  • the liquid bisphenol type epoxy resin contains the liquid bisphenol A type epoxy resin, the flexibility of the core layer described later can be reliably improved.
  • the liquid bisphenol type epoxy resin is preferably composed of a liquid bisphenol A type epoxy resin.
  • the liquid bisphenol A type epoxy resin has the same structure as the solid bisphenol A type epoxy resin except for the number of repetitions.
  • liquid bisphenol A type epoxy resin A commercially available product can be used as the liquid bisphenol A type epoxy resin.
  • Commercially available liquid bisphenol A type epoxy resins include, for example, JER828 (epoxy equivalent 184 to 194 g / eq.), JER825 (epoxy equivalent 170 to 180 g / eq.), JER827 (epoxy equivalent 180 to 190 g / eq.), JER828EL (epoxy equivalent 184 to 194 g / eq.), JER828US (epoxy equivalent 184 to 194 g / eq.), JER828XA (epoxy equivalent 197 to 215 g / eq.) (All manufactured by Mitsubishi Chemical Corporation, etc.)
  • the liquid bisphenol A type epoxy resin can be used alone or in combination of two or more.
  • the resin component may include other bisphenol type epoxy resins such as a liquid bisphenol F type epoxy resin in addition to the liquid bisphenol A type epoxy resin as a liquid bisphenol type epoxy resin.
  • the liquid bisphenol type epoxy resin is mainly composed of the liquid bisphenol A type epoxy resin, and other liquid bisphenol type epoxy resins.
  • Resin such as bisphenol F type epoxy resin
  • the liquid bisphenol A type epoxy resin is, for example, 90% by mass or more and 100% by mass or less with respect to the total amount of the liquid bisphenol type epoxy resin (the total of the bisphenol A type epoxy resin and the other bisphenol type epoxy resin).
  • the other liquid bisphenol-type epoxy resin bisphenol F-type epoxy resin
  • the content ratio of the liquid bisphenol-type epoxy resin is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, more preferably 15 parts by mass or more, for example, 30 parts by mass with respect to 100 parts by mass of the total epoxy component.
  • it is preferably 25 parts by mass or less, more preferably 20 parts by mass or less.
  • the content of the liquid bisphenol type epoxy resin is, for example, 5 parts by mass or more, preferably 7 parts by mass or more, more preferably 15 parts by mass or more, with respect to 100 parts by mass of the cresol novolac type epoxy resin. 100 parts by mass or less, preferably 80 parts by mass or less, and more preferably 60 parts by mass or less.
  • the content of the liquid bisphenol-type epoxy resin is, for example, 10 parts by mass or more, preferably 25 parts by mass or more, more preferably 50 parts by mass or more, with respect to 100 parts by mass of the solid bisphenol-type epoxy resin.
  • it is 300 parts by mass or less, preferably 200 parts by mass or less, and more preferably 150 parts by mass or less.
  • the content ratio of the liquid bisphenol-type epoxy resin is, for example, 20 parts by mass or more, preferably 50 parts by mass or more, more preferably 100 parts by mass or more with respect to 100 parts by mass of the solid fluorene ring-containing epoxy compound.
  • it is 800 parts by mass or less, preferably 700 parts by mass or less, and more preferably 400 parts by mass or less.
  • the content ratio of the liquid bisphenol-type epoxy resin is not less than the above lower limit, the tackiness of the core resin composition layer described later can be improved, and the core resin composition layer described later can be used as an under cladding layer or a cover.
  • the film can be securely adhered to the film. If the content ratio of the liquid bisphenol-type epoxy resin is not more than the above upper limit, it is possible to suppress an excessive increase in the tackiness of the core resin composition layer, which will be described later, from the core resin composition layer to the cover film or carrier film. Can be peeled off smoothly.
  • Solid fluorene ring-containing epoxy compound is a refractive index adjusting component for adjusting the refractive index of the core layer of the optical waveguide.
  • the solid fluorene ring-containing epoxy compound has a fluorene ring and an epoxy group.
  • Examples of such a solid fluorene ring-containing epoxy compound include a fluorene ring-containing epoxy compound represented by the following chemical formula (2). Chemical formula (2)
  • the fluorene ring-containing epoxy compound represented by the chemical formula (2) is a crystalline monomer.
  • the solid fluorene ring-containing epoxy compound contains the fluorene ring-containing epoxy compound represented by the chemical formula (2), the refractive index of the core layer described later can be reliably improved.
  • the solid fluorene ring-containing epoxy compound is preferably composed of a fluorene ring-containing epoxy compound represented by the chemical formula (2).
  • fluorene ring-containing epoxy compound represented by the chemical formula (2) a commercially available product can be used, and examples thereof include Ogsol PG-100 (manufactured by Osaka Gas Chemical Company).
  • the content ratio of the solid fluorene ring-containing epoxy compound is, for example, 1 part by mass or more, preferably 5 parts by mass or more, more preferably 8 parts by mass or more, for example, 25 parts by mass with respect to 100 parts by mass of the total epoxy components. Part or less, preferably 15 parts by weight or less, and more preferably 10 parts by weight or less.
  • the refractive index of the core layer can be improved. If the content ratio of the solid fluorene ring-containing epoxy compound is not more than the above upper limit, the content of other epoxy components can be ensured, and various properties required for the optical waveguide can be ensured in a more balanced manner.
  • the resin component is a specific epoxy component (cresol novolac type epoxy resin, solid bisphenol type epoxy resin, liquid bisphenol type epoxy resin) as long as the effects of the present invention are not impaired.
  • Other resin components other than the resin and the solid fluorene ring-containing epoxy compound can also be contained.
  • resin components examples include other epoxy components (for example, liquid fluorene ring-containing epoxy compounds), polyolefin resins, silicone resins, urethane resins, and the like. These other resin components can be used alone or in combination of two or more.
  • the content rate of an above-described specific epoxy component is 90 to 100 mass% in a resin component, for example.
  • the content rate of another resin component is 0 to 10 mass% in a resin component, for example.
  • the photocationic polymerization initiator is a photoacid generator that generates an acid by light irradiation, and cures the core epoxy resin composition by light irradiation (for example, ultraviolet irradiation).
  • cationic photopolymerization initiator examples include hexafluoroantimony sulfonium salts (for example, triphenylsulfonium hexafluoroantimonate, p- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-chlorophenyldiphenylsulfonium hexafluoroantimonate, bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluoroantimonate, diphenyliodonium hexafluoroantimonate, etc.), hexafluorophosphate sulfonium salts (for example, triphenylsulfonium hexafluorophosphate, p- (phenylthio) phenyldiphenyl) Sulfonium hexafluorophosphate, 4-chloropheny
  • hexafluoroantimony sulfonium salts are preferable, and triphenylsulfonium hexafluoroantimonate and diphenyliodonium hexafluoroantimonate are more preferable.
  • the content ratio of the cationic photopolymerization initiator is, for example, 0.1 parts by mass or more, preferably 0.25 parts by mass or more, for example, 3 parts by mass or less, preferably 1 part by mass with respect to 100 parts by mass of the resin component. Or less. 3.
  • the core epoxy resin composition may further contain an organic solvent, an antioxidant, or the like, if necessary.
  • the core epoxy resin composition contains an organic solvent
  • the core epoxy resin composition can be prepared as a core-forming varnish (hereinafter referred to as core varnish).
  • organic solvents examples include esters (eg, ethyl lactate, propylene glycol methyl acetate), ketones (eg, methyl ethyl ketone, cyclohexanone, 2-butanone, etc.), ethers (eg, diglyme, diethylene glycol methyl ethyl ether, propylene glycol). Monomethyl ether, tetramethylfuran, dimethoxyethane and the like), amides (for example, N, N-dimethylacetamide and the like), and the like, preferably esters, and more preferably ethyl lactate.
  • the organic solvent can be used alone or in combination of two or more.
  • the content ratio of the organic solvent is, for example, 20 parts by mass or more, preferably 40 parts by mass or more, for example, 80 parts by mass or less, preferably 60 parts by mass or less with respect to 100 parts by mass of the resin component.
  • the core epoxy resin composition contains an antioxidant, the core epoxy resin composition can be prevented from oxidative deterioration and the stability of the core epoxy resin composition can be improved.
  • antioxidants examples include hindered phenol antioxidants and phosphate ester antioxidants.
  • Antioxidants can be used alone or in combination of two or more.
  • a combination of a hindered phenol antioxidant and a phosphate ester antioxidant is preferably used.
  • the content of the antioxidant is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 3 parts by mass or less, preferably 1 part by mass or less, relative to 100 parts by mass of the resin component. It is.
  • the core epoxy resin composition can further contain a silane-based or titanium-based coupling agent, an adhesion-imparting agent, a leveling agent, an antifoaming agent, and the like as necessary.
  • the resin component is a cresol novolac type epoxy resin that is a crosslinkable component (reactive component), a solid bisphenol type epoxy resin that is a flexibility-imparting component, and a liquid bisphenol type epoxy.
  • Resin and the solid fluorene ring containing epoxy compound which is a refractive index adjustment component are contained.
  • the core layer containing a cured product of the core epoxy resin composition can ensure a low absorption loss, excellent patternability, excellent flexibility, and a high refractive index in a well-balanced manner.
  • the flexibility-imparting component contains a liquid bisphenol-type epoxy resin, tackiness can be imparted to the core resin composition layer including the core epoxy resin composition.
  • the epoxy resin composition for the core can be suitably applied to the formation of the core layer by a dry process while ensuring various properties required for the optical waveguide in a well-balanced manner.
  • the cresol novolac type epoxy resin, the solid bisphenol type epoxy resin, the liquid bisphenol type epoxy resin, and the solid fluorene ring-containing epoxy compound are preferably in the above ranges. It is.
  • the respective content ratios of the cresol novolac epoxy resin and the liquid bisphenol epoxy resin are within the above ranges. Designed to.
  • the respective content ratios of the cresol novolac type epoxy resin and the liquid bisphenol type epoxy resin are in a trade-off relationship.
  • the core layer is designed in the above range so that the flexibility and refractive index of the core layer are balanced.
  • the core layer containing the cured product of the core epoxy resin composition can ensure excellent flexibility and high refractive index in a well-balanced manner while ensuring excellent patternability and dry process suitability.
  • the core photosensitive film 1 includes a core resin composition layer 2 (an example of a resin composition layer) including the above-described core epoxy resin composition, a carrier film 3, and a cover film 4.
  • the core photosensitive film 1 is a component for producing one component (core layer) of an optical waveguide, and specifically includes a core resin composition layer 2, a carrier film 3, and a cover film 4. It is a device that can be distributed industrially and used by industry.
  • the core resin composition layer 2 is a dry product of the above-described core epoxy resin composition, and is a dry film having a film shape (flat plate shape). Specifically, the core resin composition layer 2 has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat surface and a flat back surface.
  • the above-described epoxy components (cresol novolac type epoxy resin, solid bisphenol type epoxy resin, liquid bisphenol type epoxy resin, solid fluorene ring-containing epoxy compound) are not polymerized, and the core
  • the resin composition layer 2 contains the epoxy component in an uncured state.
  • the core resin composition layer 2 has surface tackiness.
  • the carrier film 3 can be peeled off from the back surface of the core resin composition layer 2 to support and protect the core resin composition layer 2 until the core photosensitive film 1 is used for forming the core layer. It is affixed to. That is, the carrier film 3 is laminated on the back surface of the core resin composition layer 2 so as to cover the back surface of the core resin composition layer 2 at the time of shipment / transport / storage of the core photosensitive film 1; Immediately before use of the core photosensitive film 1, the flexible film can be peeled off from the back surface of the core resin composition layer 2 so as to be bent in a substantially U shape.
  • the carrier film 3 has a flat plate shape, specifically, has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat surface and a flat back surface. The sticking surface (surface) of the carrier film 3 is peeled off as necessary.
  • the carrier film 3 preferably has optical transparency.
  • Examples of the material of the carrier film 3 include resin materials such as polyester (for example, polyethylene terephthalate (PET)) and polyolefin (for example, polyethylene, polypropylene, etc.).
  • resin materials such as polyester (for example, polyethylene terephthalate (PET)) and polyolefin (for example, polyethylene, polypropylene, etc.).
  • the cover film 4 is detachably pasted on the surface of the core resin composition layer 2 in order to protect the core resin composition layer 2 until the core photosensitive film 1 is used for forming the core layer. It is worn. That is, the cover film 4 is laminated on the surface of the core resin composition layer 2 so as to cover the surface of the core resin composition layer 2 at the time of shipment / transport / storage of the core photosensitive film 1, It is a flexible film that can be peeled off from the surface of the core resin composition layer 2 so as to be curved in a substantially U-shape immediately before use of the core photosensitive film 1.
  • the cover film 4 has a flat plate shape, specifically, has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat surface and a flat back surface. Moreover, the sticking surface (back surface) of the cover film 4 is peeled off as necessary.
  • Examples of the material of the cover film 4 include the same resin material as that of the carrier film 3. ⁇ Method for producing photosensitive film for forming optical waveguide core> Next, the manufacturing method of the photosensitive film 1 for cores is demonstrated.
  • the core epoxy resin composition (preferably core varnish) is applied to the surface of the carrier film 3 by a known method.
  • the core epoxy resin composition is dried by heating to form a coating film.
  • the coating film is dried, and the core resin composition layer 2 formed from the core epoxy resin composition is prepared.
  • the cover film 4 is attached to the surface of the core resin composition layer 2 with a known laminator.
  • the core photosensitive film 1 is manufactured.
  • the core photosensitive film 1 is used for manufacturing the opto-electric hybrid board 7 including the optical waveguide 8 will be described with reference to FIGS. 2 to 5F.
  • the configuration of the opto-electric hybrid board 7 will be described with reference to FIGS.
  • the over cladding layer 12 described later is omitted in order to clarify the relative arrangement and shape of the core layer 10 described later.
  • the opto-electric hybrid board 7 has a substantially flat plate shape extending in a predetermined direction.
  • the opto-electric hybrid board 7 includes an electric circuit board 9 and an optical waveguide 8 integrally.
  • the electric circuit board 9 and the optical waveguide 8 are laminated in the thickness direction of the opto-electric hybrid board 7.
  • the electric circuit board 9 includes a metal support layer 15, a base insulating layer 16, a conductor layer 17, and a cover insulating layer 18, and preferably consists of them.
  • the metal support layer 15 is a reinforcing layer that reinforces the conductor layer 17.
  • the metal support layer 15 is provided on one end of the electric circuit board 9 in a predetermined direction. Examples of the material of the metal support layer 15 include metals such as stainless steel.
  • the metal support layer 15 has a plurality (three) of openings 19 corresponding to a plurality (three) of core portions 13 described later. The opening 19 penetrates the metal support layer 15 in the thickness direction.
  • the base insulating layer 16 is an insulating layer that insulates the conductor layer 17 and the metal support layer 15, and is located between the conductor layer 17 and the metal support layer 15 in the thickness direction of the electric circuit board 9.
  • the base insulating layer 16 extends over the entire electric circuit board 9. Examples of the material of the base insulating layer 16 include a resin such as polyimide.
  • the conductor layer 17 is a signal layer that transmits electricity (electrical signal) between an external circuit board (not shown) and an optical element (not shown).
  • the conductor layer 17 is provided at one end of the electric circuit board 9 in a predetermined direction. Examples of the material of the conductor layer 17 include conductors such as copper.
  • the conductor layer 17 has a pattern shape including a first terminal 20, a second terminal 22, and a wiring 21 that electrically connects the first terminal 20 and the second terminal 22.
  • Two (one pair) first terminals 20 are provided for each of a plurality of core portions 13 to be described later.
  • a plurality of second terminals 22 are provided corresponding to each of the plurality of first terminals 20, and are electrically connected to the first terminals 20 by wires 21.
  • the insulating cover layer 18 is disposed on the insulating base layer 16 so as to cover the wiring 21 and expose the first terminal 20 and the second terminal 22.
  • Examples of the material of the insulating cover layer 18 include a resin such as polyimide.
  • the optical waveguide 8 is a strip type optical waveguide.
  • the optical waveguide 8 is disposed on the electric circuit board 9 and has flexibility.
  • the optical waveguide 8 includes an under-cladding layer 11 and an over-cladding layer 12 as an example of a clad layer, and a core layer 10, and preferably includes only them.
  • the under cladding layer 11 and the over cladding layer 12 cover the core layer 10.
  • the underclad layer 11 is laminated on the electric circuit board 9.
  • the material of the under clad layer 11 is, for example, a resin having transparency and flexibility, which will be described later in detail.
  • the refractive index of the under cladding layer 11 is, for example, 1.560 or less, preferably 1.554 or less.
  • the core layer 10 is disposed on the under cladding layer 11.
  • the core layer 10 includes a cured product of the above-described core epoxy resin composition, and preferably includes a cured product of the above-described core epoxy resin composition.
  • the core layer 10 has flexibility.
  • the core layer 10 has a plurality (three) of core portions 13 that are spaced apart from each other in the width direction of the optical waveguide 8.
  • the core part 13 has a substantially rectangular shape in plan view extending in a predetermined direction.
  • the core portion 13 has a mirror surface 14.
  • the mirror surface 14 is formed by cutting the core portion 13 and is an inclined surface having an angle of 45 degrees with respect to the extending direction of the core portion 13.
  • the mirror surface 14 is located in the opening 19 of the metal support layer 15 when projected in the thickness direction.
  • the refractive index of the core layer 10 is larger than the refractive indexes of the under cladding layer 11 and the over cladding layer 12. Specifically, the refractive index of the core layer 10 is, for example, 1.583 or more, preferably 1.584 or more.
  • the over clad layer 12 is disposed on the under clad layer 11 so as to cover the core layer 10.
  • the material of the over cladding layer 12 is, for example, a resin having transparency and flexibility, and is preferably the same as the material of the under cladding layer 11.
  • the refractive index of the over clad layer 12 is smaller than the refractive index of the core layer 10.
  • the range of the refractive index of the over cladding layer 12 is the same as the range of the refractive index of the under cladding layer 11.
  • the manufacturing method of the opto-electric hybrid board 7 includes a step of preparing an electric circuit board 9, a step of forming an undercladding layer 11 (FIG. 5A), and a core resin composition that the core photosensitive film 1 has.
  • Such a method for manufacturing the opto-electric hybrid board 7 is preferably carried out by a roll-to-roll method.
  • an electric circuit board 9 including a metal support layer 15, a base insulating layer 16, a conductor layer 17, and a cover insulating layer 18 is prepared.
  • a clad resin composition layer formed from the material of the under clad layer 11 is formed on the electric circuit substrate 9, and then the under clad layer is formed by photolithography. 11 is formed.
  • a reinforcing sheet 26 for reinforcing the electric circuit board 9 is attached to the back surface of the electric circuit board 9 (the surface opposite to the surface where the undercladding layer 11 is formed) before the undercladding forming step.
  • the reinforcing sheet 26 is a backing material for the electric circuit board 9 and includes, for example, a resin film such as a PET film.
  • the method for forming the clad resin composition layer is not particularly limited, and may be a wet process in which a clad varnish containing the material of the under clad layer 11 is applied on the electric circuit substrate 9 and dried. May be applied to a carrier film and dried to prepare a clad resin composition layer, and the clad resin composition layer may be attached to the electric circuit board 9 in a dry process.
  • the clad varnish contains, for example, an epoxy resin component for clad and the above-mentioned photocationic polymerization initiator, and contains the above-mentioned organic solvent, the above-mentioned antioxidant, and the like as appropriate. .
  • the epoxy resin component for cladding is not particularly limited, but includes, for example, a polyfunctional epoxy resin, a bifunctional epoxy resin and the like.
  • the polyfunctional epoxy resin has three or more epoxy groups.
  • the cresol novolac type epoxy resin described above a solid alicyclic polyfunctional epoxy resin (for example, 2,2-bis (hydroxymethyl)) 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 1-butanol), 1,3,5-trisglycidyl isocyanuric acid and the like.
  • Polyfunctional epoxy resins can be used alone or in combination of two or more.
  • the bifunctional epoxy resin has two epoxy groups.
  • the above-described solid bisphenol type epoxy resin, the above liquid bisphenol type epoxy resin, and the liquid bifunctional epoxy represented by the following general formula (3) examples thereof include a resin and a solid bifunctional epoxy resin represented by the following general formula (4).
  • Bifunctional epoxy resins can be used alone or in combination of two or more.
  • R 1 represents a hydrogen atom or a methyl group.
  • R ⁇ 1 > may mutually be same or different.
  • R 2 represents one kind of atom selected from the group consisting of a hydrogen atom, a methyl group, a chlorine atom and a bromine atom.
  • Plural R 2 s may be different may be the same as each other.
  • X represents an alkylene group or alkyleneoxy group having 2 to 15 carbon atoms. Several X may mutually be same or different.
  • n is 1 or more and 5 or less.
  • R 1 represents one kind of atom selected from the group consisting of a hydrogen atom, a methyl group, a chlorine atom and a bromine atom. Several R ⁇ 1 > may mutually be same or different.
  • X represents an alkylene group or alkyleneoxy group having 2 to 15 carbon atoms. Several X may mutually be same or different.
  • n is 1 or more and 1000 or less.
  • the core resin composition layer 2 is disposed so as to face the under cladding layer 11, and the core resin composition layer 2 is attached to the under cladding layer 11 by a known laminator.
  • the pasting temperature is, for example, 40 ° C. or more, preferably 60 ° C. or more, for example, 120 ° C. or less, preferably 100 ° C. or less.
  • the application pressure is, for example, 0.05 MPa or more, preferably 0.1 MPa or more, for example, 1.0 MPa or less, preferably 0.5 MPa or less.
  • ultraviolet rays are applied to the core resin composition layer 2 over the carrier film 3 through a photomask 25 in which slits corresponding to the pattern of the core layer 10 are formed. Irradiate.
  • the ultraviolet rays are transmitted through the carrier film 3 to expose a portion corresponding to the core layer 10 in the core resin composition layer 2.
  • the resin composition for cores hardens
  • the dose of ultraviolet rays for example, 10 mJ / cm 2 or more, preferably, 100 mJ / cm 2 or more, more preferably, 500 mJ / cm 2 or more, for example, 20000 mJ / cm 2 or less, preferably, 15,000 mJ / cm 2 or less, More preferably, it is 10,000 mJ / cm 2 or less.
  • the carrier film 3 is peeled off from the exposed core resin composition layer 2. Thereafter, preferably, the resin composition layer for core 2 after exposure is pre-baked.
  • the heating temperature is, for example, 80 ° C. or higher, preferably 100 ° C. or higher, for example, 250 ° C. or lower, preferably 150 ° C. or lower.
  • the heating time is, for example, 10 seconds or longer, preferably 5 minutes or longer, for example, 2 hours or shorter, preferably 1 hour or shorter.
  • development processing is performed with a known developer (for example, ⁇ -butyrolactone, etc.) to dissolve and remove the unexposed portions in the core resin composition layer 2.
  • a known developer for example, ⁇ -butyrolactone, etc.
  • the core layer 10 is formed on the under cladding layer 11.
  • a clad resin composition layer formed from the material of the over clad layer 12 is formed on the under clad layer 11 so as to cover the core layer 10, and then the over clad is formed by photolithography. Layer 12 is formed.
  • the method of forming the clad resin composition layer includes, for example, the same method as described above in the formation of the under clad layer 11.
  • the material of the over clad layer 12 is, for example, the same as the material of the under clad layer 11. Is mentioned.
  • the optical waveguide 8 is trimmed so that the mirror surface 14 (see FIG. 2) is formed.
  • the opto-electric hybrid board 7 is manufactured.
  • the opto-electric hybrid board 7 includes the core layer 10 containing the cured product of the above-described core epoxy resin composition, various characteristics required for the optical waveguide 8 are ensured in a well-balanced manner. However, the dimensional accuracy of the core layer 10 can be improved.
  • the reinforcing sheet 26 is attached to the electric circuit board 9 before the under clad forming step.
  • the electric circuit board 9 may be recessed due to tension.
  • the electric circuit board 9 includes a base insulating layer 16 and a cover insulating layer 18 made of resin, and a metal support layer 15 and a conductor layer 17 made of metal. Therefore, the electrical circuit board 9 may be recessed due to differences in rigidity and linear expansion coefficient of members made of different materials.
  • the under clad layer 11 when the under clad layer 11 is formed on the electric circuit board 9 having the dent, the under clad layer 11 follows the dent of the electric circuit board 9 and the dent is also generated in the under clad layer 11 (see FIG. 6B).
  • the core resin composition layer 2 of the core photosensitive film 1 is attached to the under cladding layer 11 as shown in FIGS. 5B to 5F.
  • the core resin composition layer 2 is exposed and developed to form the core layer 10 on the undercladding layer 11. That is, the core layer 10 can be formed by a dry process.
  • the opto-electric hybrid board 7 including the core layer 10 having various characteristics required in a balanced manner and having excellent dimensional accuracy can be smoothly manufactured. can do.
  • the core photosensitive film 1 includes a core resin composition layer 2, a carrier film 3, and a cover film 4.
  • the photosensitive film for forming an optical waveguide core of the present invention includes: It is not limited to this.
  • the optical waveguide core-forming photosensitive film may not include the carrier film 3 and / or the cover film 4 as long as it includes the core resin composition layer 2. That is, the photosensitive film for forming an optical waveguide core may be composed of only the core resin composition layer 2, and the core resin composition layer 2 and any one of the carrier film 3 and the cover film 4. May be provided.
  • the opto-electric hybrid board 7 including the optical waveguide 8 and the electric circuit board 9 has been described, but the present invention is not limited to this.
  • the optical waveguide 8 may be provided on a base material instead of the electric circuit board 9.
  • the base material include a silicon wafer, a metal substrate (for example, a slenless plate), a glass substrate, and the like.
  • the positive type in which the exposed portion of the core resin composition layer 2 is insolubilized and the unexposed portion of the core resin composition layer 2 is solubilized has been described.
  • a negative type in which the unexposed portion of the core resin composition layer 2 is insolubilized and the unexposed portion of the core resin composition layer 2 is insolubilized may be used.
  • a clad varnish (cladding epoxy resin composition) formed from the material of the clad layer was prepared by filtration. (Preparation of photosensitive film for cladding) A clad varnish was applied to a carrier film (polyethylene film, trade name: Sunfort AQ4059, manufactured by Hitachi Chemical Co., Ltd.) subjected to a release treatment using an applicator.
  • a carrier film polyethylene film, trade name: Sunfort AQ4059, manufactured by Hitachi Chemical Co., Ltd.
  • the coated clad varnish was dried at 120 ° C. for 10 minutes. As a result, the clad varnish was dried, and a clad resin composition layer having a thickness of 40 ⁇ m was prepared.
  • a release film-treated cover film polyethylene film, trade name: Sunfort AQ4059, manufactured by Hitachi Chemical Co., Ltd.
  • a laminator conditions: 40 ° C., conveyance speed 0.5 m / min, Bonding was performed using a bonding pressure of 0.3 MPa.
  • Comparative Example 1 no liquid bisphenol A type epoxy resin was added. In Comparative Example 2, no solid bisphenol A type epoxy resin was added. Further, in Comparative Example 3, a liquid fluorene ring-containing epoxy compound was added in place of the solid fluorene ring-containing epoxy compound without adding a liquid bisphenol A type epoxy resin.
  • preparation of photosensitive film for core A core photosensitive film was prepared in the same manner as the preparation of the clad photosensitive film except that the clad varnish was changed to the core varnish. The thickness of the core resin composition layer was 75 ⁇ m. (Production of optical waveguide) The cover film was peeled from the clad photosensitive film, and the clad resin composition layer was laminated on the surface of the silicon wafer using a pressure laminator at 80 ° C. and 0.3 MPa.
  • the resin composition layer for cladding was irradiated with ultraviolet light through a glass mask (thickness: 4.8 mm, no pattern) with a super high pressure mercury lamp on the condition of 3000 mJ / cm 2 through the carrier film.
  • the ultraviolet light was transmitted through the carrier film to expose the clad resin composition layer.
  • the clad resin composition layer was cured.
  • the carrier film was peeled from the clad resin composition layer, followed by heat treatment (prebaking) at 140 ° C. for 10 minutes. Thereby, an under clad layer was formed on the silicon wafer.
  • the cover film was peeled off from the core photosensitive film, and the core fat composition layer was laminated on the surface of the undercladding layer using a pressure laminator at 80 ° C. and 0.3 MPa.
  • the material layer was irradiated with ultraviolet light under the condition of 5000 mJ / cm 2 with an ultrahigh pressure mercury lamp. The ultraviolet light was transmitted through the carrier film to expose a portion corresponding to the core layer in the core resin composition layer. Thereby, the core layer was hardened.
  • the carrier film was peeled from the core resin composition layer, and then heat-treated (prebaked) at 140 ° C. for 10 minutes.
  • the unexposed portion of the core resin composition layer was dissolved and removed by developing in a developer ( ⁇ -butyrolactone) at room temperature.
  • a core layer was formed on the under cladding layer. Thereafter, the core layer was air blown and then dried at 120 ° C. for 5 minutes.
  • a clad varnish was applied on the under clad layer by a spin coater so as to cover the core layer.
  • the clad varnish was then dried at 130 ° C. for 5 minutes.
  • a clad resin composition layer was formed.
  • the thickness of the clad resin composition layer was 20 ⁇ m.
  • the resin composition layer for cladding was exposed by irradiating with ultraviolet light through a glass mask (thickness: 4.8 mm, no pattern) with an ultrahigh pressure mercury lamp at 2000 mJ / cm 2 .
  • the clad resin composition layer was heat-treated (prebaked) at 140 ° C. for 10 minutes. Thereby, the over clad layer was formed on the under clad layer.
  • the linear loss was calculated from the average total loss.
  • a loss value per unit length was calculated from the calculated linear loss by the cutback method, and evaluated based on the following criteria.
  • the core tree composition layer having a thickness of about 70 ⁇ m was prepared by heating and drying at 130 ° C. for 5 minutes.
  • the core layer was peeled from the glass substrate, bent to the following curvature radius, and the presence or absence of cracks in the core layer was confirmed. And it evaluated based on the following reference
  • ⁇ No crack occurred at a curvature radius of 1 mm.
  • ⁇ Cracks did not occur at a radius of curvature of 2 mm, but cracks occurred at a radius of curvature of 1 mm.
  • X A crack occurred with a curvature radius of 2 mm.
  • the carrier film was peeled from the core resin composition layer.
  • the suitability of the dry process was evaluated according to the following criteria.
  • the cover film was in close contact with the core fat composition layer, and the surface of the core fat composition layer was formed when the cover film was peeled off, or the cover film was not in close contact with the core fat composition layer.
  • the photosensitive epoxy resin composition for forming an optical waveguide core and the photosensitive film for forming an optical waveguide core of the present invention can be suitably used, for example, as a material for a core layer constituting an optical waveguide used in various industrial products.
  • the optical waveguide of the present invention can be suitably used for, for example, an opto-electric hybrid board used for various industrial products.
  • the optical waveguide manufacturing method of the present invention is suitably used for manufacturing an optical waveguide that can be used for an opto-electric hybrid board, for example.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optical Integrated Circuits (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
PCT/JP2018/007721 2017-03-03 2018-03-01 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法 WO2018159746A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880014642.3A CN110537125B (zh) 2017-03-03 2018-03-01 光波导芯形成用感光性环氧树脂组合物、感光性薄膜、光电混载基板、光波导及其制造方法
KR1020197019928A KR102456203B1 (ko) 2017-03-03 2018-03-01 광도파로 코어 형성용 감광성 에폭시 수지 조성물, 광도파로 코어 형성용 감광성 필름, 광도파로, 광전기 혼재 기판 및 광도파로의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-040299 2017-03-03
JP2017040299A JP6859136B2 (ja) 2017-03-03 2017-03-03 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法

Publications (1)

Publication Number Publication Date
WO2018159746A1 true WO2018159746A1 (ja) 2018-09-07

Family

ID=63371261

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/007721 WO2018159746A1 (ja) 2017-03-03 2018-03-01 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法

Country Status (5)

Country Link
JP (1) JP6859136B2 (zh)
KR (1) KR102456203B1 (zh)
CN (1) CN110537125B (zh)
TW (1) TWI758427B (zh)
WO (1) WO2018159746A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024157820A1 (ja) * 2023-01-23 2024-08-02 味の素株式会社 樹脂シート

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173852B2 (ja) 2018-12-11 2022-11-16 日東電工株式会社 光導波路用エポキシ樹脂感光性組成物、光導波路用感光性フィルム、光導波路、および、光電気混載基板
WO2022024756A1 (ja) * 2020-07-29 2022-02-03 日東電工株式会社 光電気混載基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130213691A1 (en) * 2010-10-08 2013-08-22 Kyoung Soo Park Electronic device
WO2014174923A1 (ja) * 2013-04-23 2014-10-30 日東電工株式会社 感光性エポキシ樹脂組成物および光導波路コア層形成用硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
WO2014174924A1 (ja) * 2013-04-26 2014-10-30 日東電工株式会社 光導波路用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルム、およびそれを用いた光導波路ならびに光・電気伝送用混載フレキシブルプリント配線板、およびその光導波路の製法
JP2017008317A (ja) * 2015-06-25 2017-01-12 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器
JP2017009689A (ja) * 2015-06-18 2017-01-12 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262228B2 (en) * 2003-11-21 2007-08-28 Curators Of The University Of Missouri Photoinitiator systems with anthracene-based electron donors for curing cationically polymerizable resins
JP5004146B2 (ja) * 2005-04-28 2012-08-22 日本化薬株式会社 エポキシ樹脂、およびエポキシ樹脂組成物
WO2009139375A1 (ja) * 2008-05-13 2009-11-19 日立化成工業株式会社 光導波路の製造方法及び光導波路
CN103155050B (zh) * 2010-10-08 2017-05-03 第一毛织株式会社 各向异性导电膜
US20160209743A1 (en) * 2013-09-04 2016-07-21 Hitachi Chemical Company, Ltd. Photosensitive resin composition for forming member having curved shape, photosensitive resin film for forming member having curved shape using said composition, and lens member manufactred using said composition or said film
JP6274498B2 (ja) * 2013-11-08 2018-02-07 日東電工株式会社 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
CN107709399B (zh) * 2015-06-25 2020-01-24 东丽株式会社 环氧树脂组合物、纤维增强复合材料、成型品及压力容器
FR3049960B1 (fr) 2016-04-08 2021-08-20 Selenium Medical Procede de traitement de surface d'un materiau biocompatible et implant traite par ledit procede

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130213691A1 (en) * 2010-10-08 2013-08-22 Kyoung Soo Park Electronic device
WO2014174923A1 (ja) * 2013-04-23 2014-10-30 日東電工株式会社 感光性エポキシ樹脂組成物および光導波路コア層形成用硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
WO2014174924A1 (ja) * 2013-04-26 2014-10-30 日東電工株式会社 光導波路用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルム、およびそれを用いた光導波路ならびに光・電気伝送用混載フレキシブルプリント配線板、およびその光導波路の製法
JP2017009689A (ja) * 2015-06-18 2017-01-12 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
JP2017008317A (ja) * 2015-06-25 2017-01-12 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024157820A1 (ja) * 2023-01-23 2024-08-02 味の素株式会社 樹脂シート

Also Published As

Publication number Publication date
CN110537125A (zh) 2019-12-03
JP2018146710A (ja) 2018-09-20
CN110537125B (zh) 2021-05-28
KR20190122649A (ko) 2019-10-30
TWI758427B (zh) 2022-03-21
KR102456203B1 (ko) 2022-10-18
JP6859136B2 (ja) 2021-04-14
TW201839049A (zh) 2018-11-01

Similar Documents

Publication Publication Date Title
JP4810887B2 (ja) エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
JP4810911B2 (ja) エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
EP1564565B1 (en) Optical waveguide and production method thereof
US8155493B2 (en) Flexible optical waveguide and process for its production
US20100150510A1 (en) Flexible optical waveguide, process for its production, and epoxy resin composition for flexible optical waveguides
WO2018159746A1 (ja) 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
KR102115637B1 (ko) 광도파로용 감광성 에폭시 수지 조성물, 광도파로 형성용 경화성 필름, 및 감광성 에폭시 수지 조성물을 이용하여 제조한 광도파로 및 광ㆍ전기 전송용 혼재 플렉시블 프린트 배선판, 및 그 광도파로의 제법
US20110280531A1 (en) Resin composition for production of optical waveguide, and optical waveguide produced by using the resin composition
JP2007084765A (ja) 硬化性エポキシ樹脂フィルム、これを用いた光導波路及び光電気複合基板
JP5028004B2 (ja) 硬化性エポキシ樹脂フィルム
WO2020121818A1 (ja) 光導波路用エポキシ樹脂感光性組成物、光導波路用感光性フィルム、光導波路、および、光電気混載基板
CN107075081B (zh) 光波导用感光性树脂组合物和光波导芯层形成用光固化性薄膜、光波导及印刷电路板
CN110073258B (zh) 光波导形成用感光性环氧树脂组合物、光波导形成用固化性薄膜及使用其的光波导、光/电传输用混载挠性印刷电路板
JP5754127B2 (ja) 光学材料用樹脂組成物、光学材料用樹脂フィルム及び光学材料用ワニス並びにこれらを用いた光導波路
JP7224802B2 (ja) 光導波路形成用感光性エポキシ樹脂組成物、光導波路形成用感光性フィルムおよびそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
WO2015068592A1 (ja) 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
JP4929667B2 (ja) 光学材料用樹脂組成物、光学材料用樹脂フィルム及びこれを用いた光導波路
TW202347032A (zh) 感光性樹脂組成物
JP2011221226A (ja) 光導波路の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18761560

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20197019928

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18761560

Country of ref document: EP

Kind code of ref document: A1