WO2018158904A1 - Dispositif de montage de composant et procédé de traitement d'image - Google Patents

Dispositif de montage de composant et procédé de traitement d'image Download PDF

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Publication number
WO2018158904A1
WO2018158904A1 PCT/JP2017/008242 JP2017008242W WO2018158904A1 WO 2018158904 A1 WO2018158904 A1 WO 2018158904A1 JP 2017008242 W JP2017008242 W JP 2017008242W WO 2018158904 A1 WO2018158904 A1 WO 2018158904A1
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WIPO (PCT)
Prior art keywords
image
component
holder
images
rotation
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PCT/JP2017/008242
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English (en)
Japanese (ja)
Inventor
幹也 鈴木
雅史 天野
秀一郎 鬼頭
雄哉 稲浦
Original Assignee
株式会社Ｆｕｊｉ
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Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2019502379A priority Critical patent/JP7050048B2/ja
Priority to PCT/JP2017/008242 priority patent/WO2018158904A1/fr
Publication of WO2018158904A1 publication Critical patent/WO2018158904A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This specification discloses a component mounting apparatus and an image processing method.
  • a component mounting apparatus that mounts a component held by a holder such as a suction nozzle on a substrate, in order to accurately acquire a holding state such as a position and an angle of the held component, the resolution is higher than an image obtained by imaging the component.
  • a high-resolution image has been proposed (see, for example, Patent Document 1).
  • a high-resolution process is performed by performing super-resolution processing using a plurality of images captured by relatively moving a holder that holds the component and an imaging device that captures the component in the horizontal direction (XY direction). A resolution image is generated.
  • the super-resolution processing requires a plurality of images picked up by moving the holder and the imaging device relative to each other in the horizontal direction.
  • the holder and the imaging device in the horizontal direction may be used. In some cases, it may be difficult to make a relative movement. In that case, there is a possibility that the super-resolution processing cannot be appropriately performed.
  • This disclosure is not limited to the relative movement between the holder and the imaging device in the horizontal direction, and a main object is to generate a high-resolution image using a plurality of images.
  • the rotation angle of the component in the image captured by the imaging device is different from the holder that holds the component, the imaging device that images the component held by the holder.
  • a rotating device that relatively rotates the holder holding the components and the imaging device, and the rotating device so that the relative rotation angles of the holding tool and the imaging device are different.
  • a control device that controls and controls the imaging device to image the component held by the holder in each of the plurality of states; and a plurality of images captured by the imaging device in each of the plurality of states
  • an image processing apparatus that performs processing for generating a high-resolution image having a higher resolution than the plurality of images.
  • the component mounting apparatus images a component held by the holder in each of a plurality of states in which the relative rotation angles of the holder and the imaging device are different, and a plurality of images captured in each of the plurality of states Is used to generate a high-resolution image having a higher resolution than the plurality of images. Accordingly, a high resolution image can be generated using a plurality of images having different rotation angles of the components in the image without relatively moving the holder that holds the components and the imaging device in the horizontal direction.
  • the image processing method of the present disclosure is an image processing method for an image obtained by imaging a component, and includes (a) acquiring a plurality of images having different rotation angles of the component, and (b) acquiring at the step (a). And a step of generating a high resolution image having a resolution higher than that of the plurality of images using the plurality of images.
  • the component and the imaging device that captures the component are relatively moved in the horizontal direction, and a plurality of images with different rotation angles in the image can be detected. A resolution image can be generated.
  • various aspects of the above-described component mounting apparatus may be employed, or a configuration that realizes each function of the above-described component mounting apparatus may be added.
  • FIG. 1 is a configuration diagram showing a configuration of a mounting system 10.
  • FIG. 3 is a block diagram showing a configuration of a component mounting apparatus 11.
  • FIG. 3 is a configuration diagram showing a configuration of a mounting head 22.
  • the flowchart which shows an example of a mounting process routine.
  • the flowchart which shows an example of a super-resolution process.
  • Explanatory drawing which shows an example of the image used for a super-resolution process.
  • FIG. 1 is a configuration diagram showing the configuration of the mounting system 10.
  • FIG. 2 is a block diagram illustrating a configuration of the component mounting apparatus 11.
  • FIG. 3 is a configuration diagram showing the configuration of the mounting head 22.
  • the mounting system 10 is a system that executes a process of mounting the component P on the board S, for example.
  • the mounting system 10 includes a component mounting apparatus 11 that performs a mounting process for mounting a component P on a substrate S, and a management computer (PC) 60 that manages each apparatus of the mounting system 10.
  • PC management computer
  • a plurality of component mounting apparatuses 11 are arranged from upstream to downstream. In FIG. 1, only one component mounting apparatus 11 is shown for convenience of explanation.
  • the mounting process includes a process of placing, mounting, inserting, joining, and bonding the component P on the substrate.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.
  • the component mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, and a control device 50.
  • the substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position.
  • the substrate transport unit 12 has a pair of conveyor belts provided in the front-rear direction of FIG. The board
  • substrate S is conveyed by this conveyor belt.
  • the mounting unit 13 collects the component P from the component supply unit 14 and arranges it on the substrate S fixed to the substrate transport unit 12.
  • the mounting unit 13 includes a head moving unit 20 and a mounting head 22.
  • the head moving unit 20 includes a slider that is guided by a guide rail and moves in the XY directions, and a motor that drives the slider.
  • the mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20.
  • a plurality of suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22.
  • the suction nozzle 24 is a collection member that collects parts using negative pressure.
  • the mounting head 22 includes a cylindrical rotary head 23 in which a plurality of nozzle holders 25 that hold the respective suction nozzles 24 are arranged, an R-axis drive device 30 that rotates the rotary head 23, and a nozzle A Q-axis driving device 35 for rotating the holder 25 (suction nozzle 24), a Z-axis driving device 40 for moving the nozzle holder 25 in the Z-axis direction, and a camera unit 45 for imaging the component P sucked by the suction nozzle 24 Is provided.
  • a plurality of for example, twelve, two in FIG.
  • suction nozzles 24 are arranged on the circumference coaxial with the central axis at predetermined angular intervals (for example, intervals of 30 degrees). .
  • a reference mark M composed of a plurality of (four in this embodiment) circular marks is provided on the lower surface of the flange portion of the suction nozzle 24, as shown in the enlarged view of FIG. 3, a reference mark M composed of a plurality of (four in this embodiment) circular marks is provided.
  • the reference mark M is imaged together with the part P by the parts camera 46 of the camera unit 45.
  • the rotation axis (rotation axis) of the rotary head 23 of the mounting head 22 is referred to as the R axis
  • the rotation axis of the suction nozzle 24 (nozzle holder 25) is referred to as the Q axis.
  • the nozzle holder 25 is configured as a hollow cylindrical member that extends in the Z-axis direction.
  • the upper end portion 25a of the nozzle holder 25 is formed in a disk shape having a diameter slightly larger than the shaft portion of the nozzle holder 25, and a gear 25b is formed on the outer diameter.
  • the nozzle holder 25 is formed with a flange portion 25c having a diameter slightly larger than that of the shaft portion at a predetermined position below the upper end portion 25a.
  • a spring (coil spring) 26 is disposed between an annular surface below the flange portion 25 c and a recess (not shown) formed on the upper surface of the rotary head 23. For this reason, the spring 26 urges the nozzle holder 25 (flange portion 25c) upward by using the depression on the upper surface of the rotary head 23 as a spring receiver.
  • the R-axis drive device 30 includes a drive motor 31 such as a servo motor, and a rotary shaft 32 to which the drive force of the drive motor 31 is transmitted and connected to the central axis of the rotary head 23.
  • the R-axis drive device 30 rotates the rotary head 23 intermittently about the R axis by a predetermined angle by driving the drive motor 31 intermittently by a predetermined angle (for example, 30 degrees).
  • a predetermined angle for example, 30 degrees
  • the R-axis drive device 30 pivots each suction nozzle 24 disposed on the rotary head 23 by a predetermined angle in the circumferential direction.
  • the R-axis drive device 30 includes an encoder 31a (see FIG. 2) such as a rotary encoder that can detect the rotation amount of the drive motor 31.
  • the Q-axis drive device 35 is rotatable about a drive motor 36 such as a servo motor, a drive gear 37 attached to the drive shaft of the drive motor 36, and a rotary shaft 32 of the R-axis drive device 30. And a rotating body 38 formed with a driven gear 38 a that meshes with the drive gear 37.
  • the driven gear 38 a of the rotating body 38 is also meshed with the gear 25 b of each nozzle holder 25.
  • the Q-axis drive device 35 drives the drive motor 36 to rotate the rotating body 38 by meshing the drive gear 37 and the driven gear 38a, and each mesh by meshing the driven gear 38a with the gear 25b of the nozzle holder 25.
  • the nozzle holder 25 is rotated around the axis. Thereby, each suction nozzle 24 rotates around the Q axis.
  • the Q-axis drive device 35 includes an encoder 36a (see FIG. 2) such as a rotary encoder that can detect the rotation amount of the drive motor 36.
  • the Z-axis drive device 40 includes a drive motor 41 such as a servo motor, a screw shaft 42 that extends in the Z-axis direction and transmits the driving force of the drive motor 41, and the rotation of the screw shaft 42. And a Z-axis slider 44 attached to the ball screw nut 43.
  • the Z-axis slider 44 is formed with a substantially L-shaped lever portion 44a that protrudes toward the rotary head 23 and can push down the upper end portion 25a of the nozzle holder 25 within a predetermined range.
  • the Z-axis drive device 40 drives the drive motor 41 to move the Z-axis slider 44 in the Z-axis direction, thereby moving the nozzle holder 25 at the left position in FIG. 3 in the Z-axis direction.
  • the Z-axis drive device 40 raises and lowers the suction nozzle 24 (1) located at the left side position (also referred to as the lift position) in FIG.
  • the suction nozzle 24 picks up the component P supplied from the component supply unit 14 or mounts the sucked component on the substrate S by moving up and down.
  • the Z-axis drive device 40 includes an encoder 41a (see FIG. 2) such as a rotary encoder that can detect the rotation amount of the drive motor 41.
  • the camera unit 45 includes a parts camera 46 in which a lens is disposed downward, and an optical system unit 47 (see a perspective view in FIG. 3) that forms an optical path to the parts camera 46.
  • an entrance 47a is provided at a position below the suction nozzle 24 (2) at the right position in FIG. 3
  • an exit 47b is provided at a position below the lens of the parts camera 46.
  • the position of the suction nozzle 24 (2) which is the right position in FIG. 3, is a position that is symmetric with respect to the ascending / descending position of the rotary head 23 and the central axis (R axis) of the rotary head 23.
  • the optical system unit 47 includes three prisms 48a, 48b, and 48c that refract light.
  • the optical system unit 47 refracts the light incident from the entrance 47a provided below the suction nozzle 24 (2) by the three prisms 48a, 48b, and 48c, and reaches the parts camera 46 from the exit 47b. Can be made.
  • the parts camera 46 of the camera unit 45 can capture an image of the lower surface of the component P attracted by the suction nozzle 24 (2), and outputs the captured image to the control device 50.
  • the position of the suction nozzle 24 (2) is an imaging position by the parts camera 46.
  • the head moving unit 20 moves in the XY direction together with the suction nozzles 24 of the mounting head 22.
  • the component supply unit 14 supplies components from the front side of the component mounting apparatus 11, and includes a tape feeder 15 that is arranged in a line in the left-right direction (X direction) and can supply components by tape, and a tray.
  • a tray feeder 16 capable of supplying parts.
  • the tape feeder 15 includes a reel on which a tape in which components are accommodated at predetermined intervals is wound, and supplies the components by pulling out the tape from the reels.
  • the tray feeder 16 supplies parts using a tray in which the parts are aligned and arranged.
  • the control device 50 is configured as a microprocessor centered on a CPU 51, and includes a ROM 52 that stores a processing program, an HDD 53 that stores various data, a RAM 54 that is used as a work area, and an external device and an electrical device.
  • An input / output interface (I / F) 55 for exchanging signals is provided. These are connected via a bus 56.
  • the control device 50 outputs control signals to the board transport unit 12, the mounting unit 13, the component supply unit 14, and the camera unit 45 (part camera 46), and the mounting unit 13, the component supply unit 14, and the encoders 31a, 36a, and 41a.
  • the signal from the camera unit 45 (parts camera 46) is input.
  • the management PC 60 is a computer that manages information of each device of the mounting system 10.
  • the management PC 60 includes a control device configured as a microprocessor centered on a CPU.
  • the control device includes a ROM for storing processing programs, an HDD for storing various data, a RAM used as a work area, an input / output interface for exchanging electrical signals with an external device, and the like.
  • the management PC 60 includes an input device 62 such as a keyboard and a mouse for inputting various commands by an operator, and a display 64 for displaying various information.
  • FIG. 4 is a flowchart showing an example of a mounting process routine executed by the CPU 51 of the control device 50. This routine is stored in the HDD 53 of the control device 50, and is executed by a start instruction by an operator via the input device 62 of the management PC 60 or the like.
  • the CPU 51 of the control device 50 first carries in the substrate S by the substrate transport unit 12 (S100). Next, the CPU 51 sucks the component P supplied by the component supply unit 14 to the suction nozzle 24 located at the lift position (S110). The CPU 51 drives the R-axis drive device 30 of the mounting head 22 to sequentially turn the suction nozzles 24 to the lift position, and moves the suction nozzles 24 located at the lift position in the Z-axis direction by the Z-axis drive device 40. The component P is adsorbed. The CPU 51 executes super-resolution processing every time the suction nozzle 24 that has picked up the component P moves to the imaging position by driving the R-axis drive device 30 (S120).
  • This super-resolution processing is performed based on the processing of FIG. 5 described later. Then, based on the image obtained by the super-resolution processing, the positional deviation amount of the component P in the suction nozzle 24 located at the imaging position is calculated (S130).
  • the CPU 51 starts mounting from the component P for which the super-resolution processing is completed before the super-resolution processing for all the components P among the components P sucked by the plurality of suction nozzles 24 is completed. It is good to go. In that case, the CPU 51 sequentially performs the super-resolution processing of the components P sucked by the suction nozzle 24 that has moved to the imaging position while mounting some of the components P for which the super-resolution processing has been completed. It may be a thing.
  • the CPU 51 corrects the mounting position based on the positional deviation amount of the component P calculated by the super-resolution processing, and mounts the component P on the substrate S (S140).
  • the CPU 51 adjusts the position of the component P in the X and Y directions by adjusting the position of the mounting head 22 using the head moving unit 20. Further, the CPU 51 adjusts the position of the component P in the rotation direction by adjusting the rotation position of the suction nozzle 24 using the Q-axis drive device 35.
  • the CPU 51 repeats the processing of S110 to S140 until it determines that the processing of all the components P scheduled to be mounted on the current substrate S is completed (S150).
  • the substrate transport unit 12 carries out the substrate S (S160), and all the substrates S scheduled to be mounted are processed. It is determined whether or not it is completed (S170). If the CPU 51 determines that the processing of all the substrates S has not been completed, it returns to S100 and repeats the processing, and if it determines that the processing of all the substrates S has been completed, it ends the mounting processing routine.
  • FIG. 5 is a flowchart illustrating an example of super-resolution processing.
  • FIG. 6 is an explanatory diagram illustrating an example of an image used for super-resolution processing.
  • the CPU 51 of the control device 50 first has one piece P of the component P sucked by the suction nozzle 24 in a state (first state) in which the suction nozzle 24 is pivoted to the imaging position (first state).
  • the eye image is taken by the parts camera 46 (S200).
  • FIG. 6A is an example of the first image.
  • an image picked up by the parts camera 46 includes a part P and a reference mark M.
  • the CPU 51 rotates the suction nozzle 24 by the Q-axis drive device 35 (S210), and is sucked by the suction nozzle 24 in a state where the suction nozzle 24 at the imaging position is rotated (second state).
  • FIG. 6B is an example of the second image.
  • FIG. 6B shows the amount of rotation of the component P large for convenience so that the state of rotation of the component P can be understood, but the amount of rotation of the component P is actually small.
  • the CPU 51 converts the suction nozzle 24 with a rotation amount such that a positional shift amount of less than about 1 pixel is generated in the XY direction with respect to the first image. What is necessary is just to take an image with the parts camera 46 after rotating.
  • the CPU 51 calculates a positional deviation amount (rotational deviation amount) between the images based on the position of the reference mark M in the first image and the position of the reference mark M in the second image (S230). .
  • the CPU 51 detects the reference mark M by extracting a region in which the color (pixel value), shape, number of pixels, and the like match the reference mark M from each image, for example. Further, the CPU 51 sets the positional deviation amount of the reference mark M calculated from the positional coordinates of the reference mark M before and after the rotation as the positional deviation amount of both images.
  • the positional deviation amount is calculated as, for example, a combination of a positional deviation amount in the X direction, a positional deviation amount in the Y direction, and a positional deviation amount (rotation angle) in the rotation direction.
  • the rotation amount of the suction nozzle 24 may vary in rotation error due to backlash of each gear of the Q-axis drive device 35.
  • the CPU 51 can set the positional deviation amount before and after the rotation including such a rotational error as the positional deviation amount of both images. Subsequently, the CPU 51 generates a high resolution image by executing super-resolution processing, for example, by superimposing the first image and the second image on the basis of the calculated displacement amount between the images.
  • the CPU 51 determines the amount of positional deviation in the X direction, the amount of positional deviation in the Y direction, and the rotational direction of the component P sucked by the suction nozzle 24 from the high resolution image generated in S240. Is calculated. As described above, the CPU 51 rotates the suction nozzle 24 around the Q axis after the first image obtained by picking up the part P sucked by the suction nozzle 24 at the image pickup position with the parts camera 46, and then moves the part P on. Super-resolution processing is performed using the second image captured by the parts camera 46.
  • the mounting head 22 is provided with the parts camera 46 (camera unit 45), the super-resolution processing is appropriately performed even in a configuration in which the suction nozzle 24 and the parts camera 46 cannot be relatively moved in the XY directions. It can be carried out.
  • the suction nozzle 24 of the present embodiment corresponds to a holder of the present disclosure
  • the parts camera 46 corresponds to an imaging device
  • the Q-axis drive device 35 corresponds to a rotation device
  • the control device 50 includes a control device, an image processing device, and the like.
  • the component mounting apparatus 11 corresponds to a component mounting apparatus.
  • the reference mark M corresponds to the reference mark.
  • the R-axis drive device 30 corresponds to a turning device.
  • an example of the image processing method of the present disclosure is also clarified by describing the operation of the component mounting apparatus 11.
  • Super-resolution processing for generating a high-resolution image with high resolution is performed using the first image and the second image of P. For this reason, the component mounting apparatus 11 can generate a high-resolution image from a plurality of images without relatively moving the suction nozzle 24 that sucks the component P and the part camera 46 in the XY directions.
  • the component mounting apparatus 11 uses the Q-axis drive device 35 to change the relative rotation angle between the suction nozzle 24 and the parts camera 46 at the time of imaging, the component mounting apparatus 11 (the suction nozzle 24) at the time of mounting is used. It is possible to prevent the configuration of the apparatus from becoming complicated as compared with that performed by a rotation and a separate driving apparatus.
  • each suction nozzle 24 is provided with a reference mark M.
  • the parts camera 46 captures an image including the part P and the reference mark M.
  • the CPU 51 of the control device 50 generates a high resolution image using a plurality of images based on the position of the reference mark M in the image. Since the reference mark M in the image reflects a rotation error in the relative rotation between the suction nozzle 24 and the parts camera 46, the CPU 51 of the control device 50 determines the high resolution image based on the position of the reference mark M. Can be generated with high accuracy.
  • the component mounting apparatus 11 is provided with a plurality of suction nozzles 24 in the circumferential direction, and includes a mounting head 22 including an R-axis driving device 30 that intermittently moves the plurality of suction nozzles 24 in the circumferential direction about the R axis. Is provided.
  • the Q-axis drive device 35 rotates the suction nozzle 24 around the Q-axis when the suction nozzle 24 that has been pivotally moved is at least at the imaging position, and the parts camera 46 can image the suction nozzle 24 at the imaging position. It is provided in the mounting head 22 so as to be.
  • the component mounting apparatus 11 does not need to provide an arrangement space for the parts camera 46 at another location of the component mounting apparatus 11, and can have a compact configuration. Further, the component mounting apparatus 11 can appropriately perform the super-resolution processing while having such a compact configuration.
  • the mounting head 22 turns the suction nozzle 24 around the R axis along the Z-axis direction.
  • the mounting head 22 may be configured to rotationally move a plurality of suction nozzles arranged radially about the rotation axis along the X-axis direction or the Y-axis direction (for example, JP 20002-543602 A). No. publication).
  • the mounting head 22 is not limited to the one having the rotary head 23 having the plurality of suction nozzles 24, and may be one having only one suction nozzle 24 or the like.
  • the component P (suction nozzle 24) during imaging necessary for super-resolution processing is rotated using the Q-axis drive device 35 for adjusting the orientation of the component P during mounting.
  • a rotation drive device different from the Q-axis drive device 35 may perform relative rotation between the component P (suction nozzle 24) and the part camera 46.
  • the amount of positional deviation between the first image and the second image is detected based on the reference mark M.
  • the present invention is not limited to this.
  • the amount of displacement between the first image and the second image may be detected using an encoder 36a that detects the amount of rotation of the drive motor 36 of the Q-axis drive device 35.
  • the interval between the first image and the second image is determined based on the rotation amount of the drive motor 36 detected by the encoder 36a. What is necessary is just to perform the process which detects the amount of position shift of this.
  • the reference mark M may not be provided in the suction nozzle 24.
  • the suction nozzle 24 is rotated with respect to the part camera 46, but the present invention is not limited to this, and the part camera 46 may be rotated with respect to the suction nozzle 24. That is, a rotating device that rotates the part camera 46 may be provided.
  • the parts camera 46 is provided on the mounting head 22.
  • the present invention is not limited to this, and the parts camera may be provided at a place other than the mounting head 22.
  • a part camera that images the component P (suction nozzle 24) from below may be provided between the substrate transport unit 12 and the component supply unit 14 in the Y-axis direction. That is, the parts camera may not move with the mounting head 22.
  • the component mounting apparatus 11 can relatively move the suction nozzle 24 and the parts camera in the XY directions.
  • the component mounting apparatus 11 moves the suction nozzle 24 and the parts camera relative to each other in the X and Y directions (super-resolution processing based on a plurality of images picked up by relatively rotating the suction nozzle 24 and the parts camera). It is possible to perform super-resolution processing based on a plurality of images picked up by moving in the horizontal direction.
  • the component mounting apparatus 11 is either the former super-resolution process with rotational movement or the latter super-resolution process with horizontal movement, depending on the type of parts, the efficiency of movement and rotation at the time of image capture, and the like. It is good also as what performs this selectively.
  • a high-resolution image is generated based on two images having different relative rotation angles between the suction nozzle 24 and the part camera 46.
  • the present invention is not limited to this.
  • a high resolution image may be generated based on a plurality of three or more images having different relative rotation angles.
  • the holder has been described as the suction nozzle 24.
  • the holder is not particularly limited as long as it can hold a component, and may be, for example, a mechanical chuck that mechanically holds and holds the component. .
  • the reference mark M is composed of a plurality of circular marks.
  • the present invention is not limited to this, and the shape of the reference mark M is the amount of positional deviation in the image before and after the rotation of the suction nozzle 24. Other shapes may be used as long as they can be calculated.
  • the reference mark M is provided on the lower surface of the flange portion of the suction nozzle 24.
  • the present invention is not limited to this, and the position where the reference mark M is provided is between the suction nozzle 24 and the parts camera 46. Any other position may be used as long as a rotation error in relative rotation is reflected.
  • the reference mark may be provided on the lower surface of a rod-shaped member extending from the lower surface of the flange portion of the suction nozzle 24 to substantially the same height as the lower surface of the component P at the imaging position.
  • the component P and the mark are within the depth of field even if the depth of field of the parts camera is relatively shallow. This increases the degree of freedom regarding the depth of field of the parts camera.
  • the rotating device may rotate the holder with respect to the imaging device.
  • Many of such component mounting apparatuses rotate the holder in order to adjust the rotation angle of the component during mounting. Therefore, if the rotation device rotates the holder, the rotation of the holder during mounting and the rotation of the holder during imaging can be performed by a common rotation device. It is possible to prevent the apparatus configuration from becoming complicated as compared with the apparatus provided with the.
  • the holder is provided with a reference mark
  • the imaging device captures an image including the component and the reference mark in each of the plurality of states
  • the processing device may perform processing for generating the high-resolution image using the plurality of images based on the position of the reference mark in the image. Since the rotation position of the reference mark in the image reflects an error in relative rotation between the holder and the imaging device, it is possible to generate a high-resolution image with high accuracy based on the position of the reference mark. Become.
  • the component mounting apparatus includes a rotation amount detection device that detects a relative rotation amount between the holder and the imaging device by the rotation device, and the image processing device is detected by the rotation amount detection device.
  • the high-resolution image may be generated using the plurality of images based on the rotation amount. In this way, it is possible to easily acquire the rotation amount and generate a high-resolution image as compared with the case where the rotation amount is acquired from a reference mark or the like in the image.
  • the component mounting apparatus includes a head including a swiveling device that includes a plurality of the holders in the circumferential direction and intermittently pivots the plurality of the holders in the circumferential direction around a swivel axis.
  • An apparatus is provided in the head so as to rotate the holder around the rotation axis when the holder that has pivoted is at a predetermined position in at least the circumferential direction, and the imaging device is the holder that is in the predetermined position. It is good also as what is provided in the said head so that the said components hold
  • By providing the imaging device in the head it is not necessary to provide a space for arranging the imaging device in another place of the component mounting device.
  • the imaging device when the imaging device is provided in the head, the head and the imaging device cannot be moved relative to each other in the horizontal direction, so that the effect of generating a high-resolution image from a plurality of images with different rotation angles of the components is remarkable. It will be a thing.
  • the present invention can be used for an apparatus for mounting a held component.

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  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Selon l'invention, un dispositif de montage de composant comporte : un outil de maintien permettant de maintenir un composant ; un dispositif de capture d'image qui capture des images du composant maintenu dans l'outil de maintien ; un dispositif de rotation qui fait tourner de façon relative l'outil de maintien, qui maintient le composant, et le dispositif de capture d'image de sorte que les angles de rotation du composant sont différents dans les images capturées par le dispositif de capture d'image ; un dispositif de commande qui commande le dispositif rotatif pour qu'il soit dans une pluralité d'états, dans lesquels les angles de rotation relatifs de l'outil de maintien et du dispositif de capture d'image sont différents, et qui commande le dispositif de capture d'image pour qu'il capture les images du composant maintenu dans l'outil de maintien dans chaque état de la pluralité d'états ; et un dispositif de traitement d'images qui utilise une pluralité d'images capturées par le dispositif de capture d'image dans chaque état de la pluralité d'états pour produire une image à haute résolution ayant une résolution supérieure à celle de la pluralité d'images.
PCT/JP2017/008242 2017-03-02 2017-03-02 Dispositif de montage de composant et procédé de traitement d'image WO2018158904A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019502379A JP7050048B2 (ja) 2017-03-02 2017-03-02 部品実装装置および画像処理方法
PCT/JP2017/008242 WO2018158904A1 (fr) 2017-03-02 2017-03-02 Dispositif de montage de composant et procédé de traitement d'image

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013080467A (ja) * 2011-09-27 2013-05-02 Boeing Co:The 超解像を利用したビデオ補正
WO2014192096A1 (fr) * 2013-05-29 2014-12-04 富士機械製造株式会社 Dispositif de montage de composant électronique
WO2015083220A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Machine d'assemblage
JP2016110312A (ja) * 2014-12-04 2016-06-20 株式会社東芝 画像処理方法、画像処理装置及びプログラム
WO2016207990A1 (fr) * 2015-06-24 2016-12-29 オリンパス株式会社 Dispositif de traitement d'image, dispositif d'imagerie, procédé de traitement d'image, programme de traitement d'image et support de stockage

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6174677B2 (ja) * 2013-03-18 2017-08-02 富士機械製造株式会社 部品実装装置および部品実装装置における校正方法
JP6646055B2 (ja) * 2015-07-08 2020-02-14 株式会社Ｆｕｊｉ 実装装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013080467A (ja) * 2011-09-27 2013-05-02 Boeing Co:The 超解像を利用したビデオ補正
WO2014192096A1 (fr) * 2013-05-29 2014-12-04 富士機械製造株式会社 Dispositif de montage de composant électronique
WO2015083220A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Machine d'assemblage
JP2016110312A (ja) * 2014-12-04 2016-06-20 株式会社東芝 画像処理方法、画像処理装置及びプログラム
WO2016207990A1 (fr) * 2015-06-24 2016-12-29 オリンパス株式会社 Dispositif de traitement d'image, dispositif d'imagerie, procédé de traitement d'image, programme de traitement d'image et support de stockage

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