WO2018157528A1 - 发声装置模组 - Google Patents

发声装置模组 Download PDF

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Publication number
WO2018157528A1
WO2018157528A1 PCT/CN2017/090637 CN2017090637W WO2018157528A1 WO 2018157528 A1 WO2018157528 A1 WO 2018157528A1 CN 2017090637 W CN2017090637 W CN 2017090637W WO 2018157528 A1 WO2018157528 A1 WO 2018157528A1
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Prior art keywords
injection hole
circuit board
module housing
hole
board
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Ceased
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PCT/CN2017/090637
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English (en)
French (fr)
Inventor
陈阿亮
刘广福
陈国强
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Goertek Inc
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Goertek Inc
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Publication of WO2018157528A1 publication Critical patent/WO2018157528A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor

Definitions

  • the invention belongs to a sounding device module, and in particular, the invention relates to a sounding device module.
  • the sounding device is assembled in the whole electronic product, and is usually electrically connected to the peripheral device through the circuit board, and the circuit board needs to protrude from the inside of the housing of the sounding device to the outside.
  • the circuit board needs to protrude from the inside of the housing of the sounding device to the outside.
  • the adhesive has flowability, and the adhesive may flow to the peripheral area of the circuit board, causing the appearance of the sounding device to change, affecting the subsequent assembly of the sounding device; on the other hand, the circuit board protrudes from the sounding device housing.
  • Adhesive seals are required around the location, but due to the shielding of the board itself and the housing structure, it is not possible to accurately monitor whether the adhesive seals the bottom and sides of the board. In addition, the process steps of applying the adhesive are complicated, which affects the assembly speed of the product.
  • a sound emitting device module includes a module housing and a circuit board disposed in the module housing, the module housing having a board opening, the circuit a plate extending from the through-plate opening to an outer side of the module housing, the module housing having a first injection hole and a second injection hole at a position close to the plate opening, the first The injection hole and the second injection hole respectively penetrate from the outer side of the module housing to both side surfaces of the circuit board, and the first injection hole and the second injection hole communicate with each other at the circuit board.
  • the first injection hole and the second injection hole are filled with a sealant, and the sealant is configured to close a gap between the circuit board and the plate opening and close the first injection hole and the second injection Plastic hole.
  • the through-hole is opened on a sidewall of the module housing, and a height of the through-hole on the sidewall is flush with a height of the circuit board fixed in the module housing.
  • the first glue injection hole is configured to extend from a top surface of the module housing to the circuit board, and the second glue injection hole is configured to be upward from a bottom surface of the module housing Extending to the board.
  • first injection hole and/or the second injection hole are disposed adjacent to the side wall having the through hole.
  • the first injection hole is opposite to the second injection hole, and the first injection hole and the second injection hole have the same hole structure.
  • the first injection hole and the second injection hole are cubic cylindrical holes.
  • the length of the cross section of the first injection hole and the second injection hole in the width direction of the circuit board is greater than the width of the circuit board at the corresponding position.
  • the module housing includes an upper housing and a lower housing, respectively, the upper housing and the lower housing respectively have a through-plate notch, and the upper housing is configured to be engaged with the lower housing,
  • the two through-hole gap combinations constitute the through-hole.
  • the module housing has an extension portion configured to carry a circuit board extending from the board opening.
  • One technical effect of the present invention is to seal the gap between the plate opening and the circuit board through the first injection hole and the second injection hole to improve the sealing condition. Improve sealing reliability.
  • FIG. 1 is a side cross-sectional view of a sound emitting device module provided by the present invention
  • Figure 2 is a partial enlarged view of Figure 1;
  • FIG. 3 is a schematic perspective structural view of a sound emitting device module provided by the present invention.
  • FIG. 4 is an exploded view of the components of the sounding device module provided by the present invention.
  • the sounding device module includes a module housing 1 and a circuit board 2.
  • the circuit board 2 is disposed in the module housing 1 , and the module housing 1 is provided with a through plate opening 11 , and the through plate opening 11 communicates with the module housing 1 Internal and external.
  • a partial region of the circuit board 2 extends from the through-hole 11 to the outside of the module housing 1.
  • the module housing 1 has a first injection hole 12 and a second injection hole 13 at a position on the module housing 1 adjacent to the plate opening 11.
  • Two of the injection holes penetrate from the outside of the module housing 1 to the two surfaces of the circuit board 2, and the first injection hole 12 corresponds to one side surface of the circuit board 2, and the second injection
  • the glue hole 13 corresponds to the other side surface of the circuit board 2. Further, the first glue injection hole 12 and the second glue injection hole 13 communicate with each other at the position of the circuit board 2.
  • the two injection holes are located close to the plate opening 11, so that the gap between the circuit board 2 and the plate opening 11 is in communication with the two injection holes.
  • the first injection hole and the second injection hole are filled with a sealant. Due to the structural design features of the two injection holes, the sealant can flow to the plate opening on the circuit board and the lower surface.
  • An adhesive seal is formed at the gap between the plate opening and the edge of the circuit board and the gap of the plate opening.
  • the design of the first injection hole and the second injection hole of the invention can effectively improve the sealing reliability between the plate opening and the circuit board, and may cause various directions between the circuit board and the board opening. The gap is sealed by the adhesive.
  • the sealing is performed by the first and second injection holes, and the sealing conditions on the upper and lower surfaces and the edges of the circuit board can be monitored. If the sealing is not completely completed, the holes can be repaired.
  • the sealant filled in the glue injection hole also closes the first injection hole and the second injection hole to prevent air leakage.
  • the sealant filled in the injection hole does not easily flow to other areas of the circuit board, which reduces the possibility that the sealant changes the appearance of the circuit board and the sounding device module, and provides guarantee for the assembly reliability of the product. .
  • the steps and processes of the sealing operation are simpler than the prior art, and it is only necessary to fill the glue injection hole with a sealant.
  • the sounding device module further includes a sounding device unit 3, and the sounding device unit 3 is fixedly disposed in the module housing 1 for receiving a sound signal to generate sound.
  • the sounding device unit 3 can be electrically connected to the circuit board 2 to transmit an acoustic signal to the sounding device unit 3.
  • the present invention specifically provides a specific embodiment of the module housing 1.
  • the through hole 11 can be opened on the side wall of the module housing 1, and the module housing 1 whole
  • the body has a flat structure, and the circuit board 2 is laid in the module housing 1.
  • the height of the board opening 11 on the side wall of the module housing 1 is substantially flush with the height of the circuit board 2 fixed in the module housing 1 to facilitate the extension of the circuit board 2 from the board opening 11 to the mode.
  • first injection molding hole 12 and the second injection molding hole 13 is also shown in the embodiment shown in FIG. 2, and the first injection molding hole 12 extends from the top surface of the module housing 1 to the lower side.
  • the inside of the module case 1 is connected to the upper surface of the circuit board 2.
  • the second glue injection hole 13 extends upward from the bottom surface of the module housing 1 to the inside of the module housing 1 and communicates with the lower surface of the circuit board 2.
  • the first glue injection hole 12 and the second glue injection hole 13 can bypass the edge of the circuit board 2 to form a communication effect between the two holes.
  • the two injection holes are all straight holes for the injection of the sealant onto the surface of the board.
  • the first glue injection hole 12 and the second glue injection hole 13 may be close to the side wall of the module housing 1 where the plate opening 11 is located.
  • two injection holes are disposed adjacent to the side wall where the plate opening 11 is located.
  • the sealant flowing into the injection hole can be directly filled in the gap between the circuit board 2 and the plate opening 11, forming a sealing effect.
  • the invention does not limit the thickness of the side wall of the module housing, nor does it limit the degree of proximity of the glue injection hole to the plate opening, as long as the adhesive can pass through the injection hole from the inner side of the shell wall of the module housing. Seal the gap between the board opening and the board.
  • the structure and position of the first injection hole and the second injection hole may be set according to the actual structure of the sounding device module.
  • the first injection hole may face the second injection hole, and the inner hole structure of the two injection holes may be identical. Convenient processing of the injection hole can further simplify the injection molding process.
  • the first injection hole 12 and the second injection hole 13 may be cubic cylindrical holes, and the cubic cylindrical injection holes have a rectangular cross section, and the cubic cylindrical holes are suitable.
  • the sealant can be filled into the gap between the edge of the circuit board and the plate opening 11, the cross section of the injection hole
  • the length in the width direction of the board is preferably larger than the width of the board at the corresponding position.
  • the first injection hole and the second injection hole may also be cylindrical and rhombic holes, which are not limited in the present invention.
  • the internal structure of the injection hole can also be based on the note The shape of the dispensing needle used in the glue process is designed.
  • the module housing 1 may include an upper housing 14 and a lower housing 15, and the upper housing 14 and the lower housing 15 are fastened to form a complete module housing 1
  • the circuit board 2 and the sounding device unit 3 are disposed inside the upper casing 14 and the lower casing 15.
  • the upper casing 14 and the lower casing 15 respectively have through-hole cutouts. When the upper casing 14 and the lower casing 15 are engaged, the two through-hole gaps constitute the through-plate. Mouth 11.
  • the module housing 1 has an extension portion 16 for carrying the circuit board 2 protruding from the board opening 11.
  • the circuit board 2 located outside the module housing 1 can be adhesively fixed to the extension portion 16 to facilitate electrical connection between the sounding device module and the electronic product.
  • the extension portion 16 can be plugged into the circuit of the whole electronic product to realize electrical connection between the circuit board and the product.
  • a sealant may be further disposed outside the module case and between the circuit board and the extension portion, which is not limited by the present invention.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Slot Machines And Peripheral Devices (AREA)

Abstract

本发明公开了一种发声装置模组。该发声装置模组包括模组壳体以及设置在所述模组壳体中的电路板，所述模组壳体具有穿板口，所述电路板从所述穿板口伸到所述模组壳体外侧，所述模组壳体在靠近所述穿板口的位置处具有第一注胶孔和第二注胶孔，所述第一注胶孔和第二注胶孔分别从所述模组壳体的外侧贯通到所述电路板的两侧表面，所述第一注胶孔与第二注胶孔在电路板处连通，所述第一注胶孔和第二注胶孔中填充有密封胶，所述密封胶配置为封闭所述电路板与穿板口之间的缝隙并封闭所述第一注胶孔和第二注胶孔。本发明解决的一个技术问题是如何改善电路板与穿板口的密封状态。

Description

发声装置模组 技术领域
本发明属于发声装置模组，具体地，本发明涉及一种发声装置模组。
背景技术
近年来，电子产品的发展迅速，平板电脑、智能手机已成为人们日常生活的必需品。电子产品的更新换代速度快，产品的性能逐渐提升。发声装置是电子产品中的一种重要部件，用于声音信号与声音之间的转换。本领域技术人员也对发声装置的性能进行不断的改进，以适应电子产品的发展。
在现有技术中，发声装置装配在电子产品整机中，通常通过电路板与周边的器件进行电连接，电路板需要从发声装置的壳体内部伸出到外侧。在电路板伸出的位置，需要涂覆粘接剂进行密封，防止发声装置漏气。但是，这种结构存在缺陷。一方面，粘接剂具有流淌性，粘接剂有可能流淌到电路板的周边区域，造成发声装置外观改变，影响发声装置后续的装配；另一方面，电路板从发声装置壳体伸出的位置的四周都需要粘接剂密封，但是由于电路板自身以及壳体结构的遮挡，粘接剂是否密封住电路板的底部和侧面无法进行准确的监控。另外，涂覆粘接剂的工艺步骤比较复杂，影响了产品的装配速度。
所以，有必要对发声装置有关电路板伸出和密封的结构进行改进，改善电路板伸出位置的密封状况，提高密封可靠性，简化粘接密封的工艺步骤。
发明内容
本发明的一个目的是提供一种改进的发声装置模组的新技术方案。
根据本发明的第一方面，提供了一种发声装置模组，包括模组壳体以及设置在所述模组壳体中的电路板，所述模组壳体具有穿板口，所述电路板从所述穿板口伸到所述模组壳体外侧，所述模组壳体在靠近所述穿板口的位置处具有第一注胶孔和第二注胶孔，所述第一注胶孔和第二注胶孔分别从所述模组壳体的外侧贯通到所述电路板的两侧表面，所述第一注胶孔与第二注胶孔在电路板处连通，所述第一注胶孔和第二注胶孔中填充有密封胶，所述密封胶配置为封闭所述电路板与穿板口之间的缝隙并封闭所述第一注胶孔和第二注胶孔。
可选地，所述穿板口开设在所述模组壳体的侧壁上，所述穿板口在侧壁上的高度与所述电路板固定在模组壳体内的高度相齐平。
可选地，所述第一注胶孔配置为从所述模组壳体的顶面向下延伸至所述电路板，所述第二注胶孔配置为从所述模组壳体的底面向上延伸至所述电路板。
可选地，所述第一注胶孔和/或第二注胶孔比邻设置于具有所述穿板口的侧壁旁。
可选地，所述第一注胶孔正对所述第二注胶孔，第一注胶孔与第二注胶孔的孔结构相同。
可选地，所述第一注胶孔和第二注胶孔呈立方柱形孔。
可选地，所述第一注胶孔和第二注胶孔的横截面在电路板的宽度方向上的长度大于对应位置处的电路板的宽度。
可选地，所述模组壳体包括上壳体和下壳体，所述上壳体和下壳体上分别具有穿板缺口，所述上壳体配置为能与下壳体扣合，两个所述穿板缺口组合构成所述穿板口。
可选地，所述模组壳体具有外延部，所述外延部配置为用于承载从所述穿板口伸出的电路板。
本发明的一个技术效果是，通过所述第一注胶孔和第二注胶孔对穿板口与电路板之间的缝隙进行密封，改善密封状况。提高密封可靠性。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的 其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明提供的发声装置模组的侧面剖视图；
图2是图1的局部放大图；
图3是本发明提供的发声装置模组的立体结构示意图；
图4是本发明提供的发声装置模组的部件爆炸图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供了一种改进的发声装置模组，如图1、2所示，该发声装置模组包括模组壳体1和电路板2。所述电路板2设置在所述模组壳体1中，所述模组壳体1上设置有穿板口11，所述穿板口11连通模组壳体1 的内部和外部。所述电路板2的部分区域从所述穿板口11处延伸到所述模组壳体1的外侧。在模组壳体1上靠近所述穿板口11的位置处，模组壳体1具有第一注胶孔12和第二注胶孔13。两个所述注胶孔从所述模组壳体1的外部一直贯通到所述电路板2的两个表面上，第一注胶孔12与电路板2的一侧表面对应，第二注胶孔13则与电路板2的另一侧表面对应。进一步地，所述第一注胶孔12和第二注胶孔13在电路板2的位置处相互连通。两个注胶孔的位置靠近所述穿板口11，所以电路板2与穿板口11之间的缝隙是与两个注胶孔连通的。
所述第一注胶孔和第二注胶孔中填充有密封胶，由于两个注胶孔的结构设计特点，所述密封胶能够流动到穿板口处，在电路板上、下两表面与穿板口的缝隙处以及电路板的边棱与穿板口的缝隙处都形成粘接密封。本发明的这种第一注胶孔、第二注胶孔的设计一方面能够有效提高穿板口与电路板之间的密封可靠性，使电路板与穿板口之间各个方向上可能产生的缝隙都被粘接剂密封。
进一步地，通过第一、第二注胶孔进行密封，能够对电路板的上下表面以及边缘处的密封情况进行监控，如果出现未完全密封的情况，也可以在孔内进行修补。填充在注胶孔中的密封胶也会将第一注胶孔和第二注胶孔封闭，防止漏气。
另一方面，填充在注胶孔中的密封胶不易流动到电路板的其它区域，减小了密封胶改变电路板、发声装置模组的外观的可能性，对产品的装配可靠性提供了保障。密封操作的步骤和工艺相对于现有技术更简便，只需向注胶孔内填充密封胶即可。
如图1、4所示，所述发声装置模组中还可以包括发声装置单体3，所述发声装置单体3固定设置在所述模组壳体1内，用于接收声音信号产生声音。所述发声装置单体3可以与所述电路板2形成电连接，以将声音信号传输给发声装置单体3。
本发明具体提供了一种模组壳体1的具体实施方式，如图2所示，所述穿板口11可以开设在所述模组壳体1的侧壁上，所述模组壳体1整 体呈扁平结构，所述电路板2铺于模组壳体1中。所述穿板口11在模组壳体1的侧壁上的高度与所述电路板2固定在模组壳体1内的高度基本齐平，便于电路板2从穿板口11延伸到模组壳体1外部。
图2所示的实施方式中也示出了第一注胶孔12、第二注胶孔13的优选分布方式，所述第一注胶孔12从模组壳体1的顶面向下延伸到模组壳体1内部，连通到所述电路板2的上表面。所述第二注胶孔13从所述模组壳体1的底面向上延伸到模组壳体1内部，连通到所述电路板2的下表面。所述第一注胶孔12与第二注胶孔13可以绕过所述电路板2的边缘，形成两孔道之间的连通效果。在这种实施方式中，两个注胶孔的结构都是直孔，便于密封胶注入到电路板的表面。
优选地，在上述实施方式中，所述第一注胶孔12和第二注胶孔13可以靠近穿板口11所在的模组壳体1的侧壁。如图1、2所示，两个注胶孔比邻设置在穿板口11所在的侧壁旁。流入注胶孔的密封胶能够直接填充在电路板2与穿板口11之间的缝隙上，形成密封效果。本发明并不对模组壳体的侧壁的厚度进行限制，也不对注胶孔与穿板口靠近的程度进行限制，只要保证粘接剂能够通过注胶孔从模组壳体的壳壁内侧将穿板口与电路板之间的缝隙密封即可。
本发明在实际实施时可以根据发声装置模组的实际结构设置所述第一注胶孔和第二注胶孔的结构和位置。优选地，所述第一注胶孔可以正对所述第二注胶孔，两个注胶孔的内孔结构可以完全相同。方便注胶孔的加工，也能够进一步简化注胶密封工艺。
可选地，如图3所示，所述第一注胶孔12和第二注胶孔13可以呈立方柱形孔，立方柱形的注胶孔的横截面呈长方形，立方柱形孔适合与具有两条平行边棱的电路板2相配合。进一步优选地，为了便于使第一注胶孔12与第二注胶孔13连通，使密封胶能够填充到电路板的边棱与穿板口11之间的缝隙处，注胶孔的横截面在电路板的宽度方向上的长度优选大于对应位置处的电路板的宽度。所述第一注胶孔和第二注胶孔也可以呈圆柱形、菱形孔，本发明不对此进行限制。注胶孔的内部结构也可以根据注 胶工艺时所采用的点胶针头的形状进行设计。
可选地，如图4所示，所述模组壳体1可以包括上壳体14和下壳体15，所述上壳体14与下壳体15扣合构成完整的模组壳体1结构，所述电路板2和发声装置单体3设置在上壳体14和下壳体15内部。特别地，所述上壳体14和下壳体15上分别具有穿板缺口，当所述上壳体14与下壳体15扣合时，两个所述穿板缺口组合构成所述穿板口11。
可选地，如图1、2、4所示，所述模组壳体1上具有外延部16，所述外延部16用于承载从所述穿板口11伸出的电路板2。位于模组壳体1外侧的电路板2可以粘接固定在所述外延部16上，以便于所述发声装置模组与电子产品整机进行电连接。所述外延部16可以插接在电子产品整机的电路上，以实现电路板与产品整机的电连接。在本实施方式中，可以不用从所述模组壳体的外侧对电路板与穿板口之间的缝隙进行封闭，密封胶已从模组壳体的内侧实现了密封。或者，出于提高密封可靠性的考虑，也可以在所述模组壳体外侧以及电路板与外延部之间再设置密封胶，本发明不对此进行限制。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (9)

  1. 一种发声装置模组，其特征在于，包括模组壳体(1)以及设置在所述模组壳体(1)中的电路板(2)，所述模组壳体(1)具有穿板口(11)，所述电路板(2)从所述穿板口(11)伸到所述模组壳体(1)外侧，所述模组壳体(1)在靠近所述穿板口(11)的位置处具有第一注胶孔(12)和第二注胶孔(13)，所述第一注胶孔(12)和第二注胶孔(13)分别从所述模组壳体(1)的外侧贯通到所述电路板(2)的两侧表面，所述第一注胶孔(12)与第二注胶孔(13)在电路板(2)处连通，所述第一注胶孔(12)和第二注胶孔(13)中填充有密封胶，所述密封胶配置为封闭所述电路板(2)与穿板口(11)之间的缝隙并封闭所述第一注胶孔(12)和第二注胶孔(13)。
  2. 根据权利要求1所述的发声装置模组，其特征在于，所述穿板口(11)开设在所述模组壳体(1)的侧壁上，所述穿板口(11)在侧壁上的高度与所述电路板(2)固定在模组壳体(1)内的高度相齐平。
  3. 根据权利要求1或2所述的发声装置模组，其特征在于，所述第一注胶孔(12)配置为从所述模组壳体(1)的顶面向下延伸至所述电路板(2)，所述第二注胶孔(13)配置为从所述模组壳体(1)的底面向上延伸至所述电路板(2)。
  4. 根据权利要求1-3任意之一所述的发声装置模组，其特征在于，所述第一注胶孔(12)和/或第二注胶孔(13)比邻设置于具有所述穿板口(11)的侧壁旁。
  5. 根据权利要求1-4任意之一所述的发声装置模组，其特征在于，所述第一注胶孔(12)正对所述第二注胶孔(13)，第一注胶孔(12)与第二注胶孔(13)的孔结构相同。
  6. 根据权利要求1-5任意之一所述的发声装置模组，其特征在于，所述第一注胶孔(12)和第二注胶孔(13)呈立方柱形孔。
  7. 根据权利要求1-6任意之一所述的发声装置模组，其特征在于， 所述第一注胶孔(12)和第二注胶孔(13)的横截面在电路板(2)的宽度方向上的长度大于对应位置处的电路板(2)的宽度。
  8. 根据权利要求1-7任意之一所述的发声装置模组，其特征在于，所述模组壳体(1)包括上壳体(14)和下壳体(15)，所述上壳体(14)和下壳体(15)上分别具有穿板缺口，所述上壳体(14)配置为能与下壳体(15)扣合，两个所述穿板缺口组合构成所述穿板口(11)。
  9. 根据权利要求1-8任意之一所述的发声装置模组，其特征在于，所述模组壳体(1)具有外延部(16)，所述外延部(16)配置为用于承载从所述穿板口(11)伸出的电路板(2)。
PCT/CN2017/090637 2017-03-01 2017-06-28 发声装置模组 Ceased WO2018157528A1 (zh)

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