WO2018147511A1 - Bidirectional conductive pin and bidirectional conductive pattern module, and bidirectional conductive socket using same - Google Patents

Abstract

The present invention relates to a bidirectional conductive pin using carbon fiber and a bidirectional conductive pattern module, and a bidirectional conductive socket using the same. The bidirectional conductive pin using carbon fiber according to the present invention comprises: a pin body made of an insulating material having elasticity; and a plurality of conductive wire members formed inside the pin body such that an upper portion thereof is exposed to an upper portion of the pin body and a lower portion thereof is exposed to a lower portion of the pin body, wherein the plurality of conductive wire members are arranged in a mutually twisted manner in the vertical direction inside the pin body, and each of the conductive wire members comprises: carbon fiber; and a conductive outer skin applied to an outer surface of the carbon fiber so that the conductive wire member has conductivity. As such, it is possible to replace a pogo-pin type semiconductor test socket, and it is possible to realize a high-speed test with stable signal transmission and be realize pitch-free, and also, the present invention may be applied to an interposer that electrically connects a high-speed CPU and a board therebetween.

Description

Bidirectional conductive pins and bidirectional conductive pattern modules, and bidirectional conductive sockets using the same

The present invention relates to a bidirectional conductive pin and a bidirectional conductive pattern module using carbon fiber, and a bidirectional conductive socket using the same. More particularly, the present invention can replace a pogo-pin type semiconductor test socket while providing stable signal transmission. Not only is it possible to test at speed, but it is also pitch-free and uses carbon fiber, which can be applied to an interposer that electrically connects the CPU and the board between the high-speed CPU and the board. The present invention relates to a bidirectional conductive pin and a bidirectional conductive pattern module, and a bidirectional conductive socket using the same.

After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.

However, the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, the conventional semiconductor test socket 1100 includes a housing 1110 having a through hole 1111 formed in a vertical direction at a position corresponding to the terminal 1131 of the semiconductor device 1130, and Pogo-pins 1120 mounted in the through holes 1111 of the housing 1110 to electrically connect the terminals 1131 of the semiconductor device 1130 and the pads 1141 of the test apparatus 1140. Is done.

The configuration of the pogo-pin 1120 is a barrel 1124, which is used as a pogo-pin body and has a hollow cylindrical shape, and is formed below the barrel 1124. A semiconductor device connected to a contact tip 1123, a spring 1122 connected to the contact tip 1123 inside the barrel 1124 and contracting and expanding, and opposite to a spring 1122 connected to the contact tip 1123. It is composed of a contact pin 1121 to perform the vertical movement according to the contact with 1130.

At this time, the spring 1122 contracts and expands, while absorbing the mechanical shock transmitted to the contact pins 1121 and the contact tips 1123, the springs 1122 of the terminals 1131 and the test apparatus 1140 of the semiconductor device 1130. The pad 1141 is electrically connected to check whether there is an electrical failure.

However, the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.

In addition, as shown in FIGS. 1 to 3, the pogo-pin type semiconductor test socket is connected to the connecting tip 1123, the spring 1122, and the connecting pin 1121 in the upper and lower directions. Because of this structure, there is a limit in reducing the length in the vertical direction, which is a limit in testing a high-speed device.

In addition, the recent demand for a test socket capable of implementing a fine pitch and a product that can be universally applied, that is, pitch-fre, irrespective of the pitch interval of the terminal under test is increased. Doing.

Meanwhile, the pogo-pin semiconductor test socket is used in a structure for electrically connecting two devices in addition to the test of the semiconductor device. As a representative example, a high-speed CPU, for example, an interposer connecting a pin of a CPU and a terminal of a board between a CPU and a board used in a large-capacity server.

In the case of a CPU used in a large-capacity server, the area of the CPU is larger than that of a general PC, and the number of pins is more than 1000, and if a direct contact is made with a terminal of a board, contact failure may occur. A pin-type interposer elastically connects the two devices in the vertical direction.

However, in the case of the Pogo-pin type interposer, as described above, there is a limitation in applying to a CPU in which the pitch interval is narrowed due to the limitation of the pitch, as well as the length in the vertical direction. Limitations raise the difficulty of keeping up with the speed of high-speed CPUs.

Accordingly, the present invention has been made to solve the above problems, it is possible to replace the pogo-pin type semiconductor test socket, but also high-speed test with stable signal transmission as well as pitch-free (Pitch) bi-directional conductive pins and bi-directional conductive pattern modules using carbon fiber, which can be implemented, and also applicable to an interposer that electrically connects the CPU and the board between the high-speed CPU and the board. It is an object to provide a conductive socket.

According to the present invention, in the bidirectional conductive pin using carbon fiber, the pin body of the insulating material having elasticity, the upper portion is exposed to the upper portion of the pin body, the lower portion is exposed to the lower portion of the pin body A plurality of conductive wire members formed inside the pin body; The plurality of conductive wire members are disposed in the form of twisted mutually in the up and down direction inside the pin body; Each of the conductive wire members is achieved by a bidirectional conductive pin using carbon fibers, characterized in that it comprises a carbon fiber and a conductive sheath portion coated on the outer surface of the carbon fiber such that the conductive wire member is conductive.

Here, the conductive outer portion may be formed through sequential plating of nickel and gold.

In addition, the pin body is made of a silicon material; The pin body is divided into an upper region, an intermediate region and a lower region sequentially in the vertical direction; The material of the intermediate region may be formed of a material softer than the hardness of the upper region and the lower region.

The pin body may be provided in a cylindrical shape having a through hole formed therein in a vertical direction.

In addition, the through hole may be filled with an insulating insulating material having elasticity.

In addition, a conductive material having elasticity may be filled in the through hole.

The central region of the pin body may have a 휜 shape.

On the other hand, according to another embodiment of the present invention, a plurality of bidirectional conductive modules formed by attaching the bidirectional conductive pins using the carbon fiber in the horizontal direction is arranged in a depth direction; It can also be achieved by a bidirectional conductive socket using a carbon fiber, characterized in that it comprises a restoring member of an insulating material disposed between a plurality of the bidirectional conductive module to provide a restoring force in the vertical direction.

Here, the restoring member may be formed to have a shape in which carbon fibers are wound on a plane.

On the other hand, according to another embodiment of the present invention, in the bidirectional conductive pin using the carbon fiber, the upper contact portion of the conductive metal material, the lower contact portion of the conductive metal material spaced downward from the upper contact portion, A plurality of conductive wire members connecting the upper contact portion and the lower contact portion to electrically connect the upper contact portion and the lower contact portion; Each of the conductive wire members is achieved by a bidirectional conductive pin using carbon fibers, characterized in that it comprises a carbon fiber and a conductive sheath coated on the outer surface of the carbon fiber such that the conductive wire member is conductive. .

Wherein the upper contact portion has a cylindrical shape formed by rolling a thin plate made of a conductive metal to surround upper regions of the plurality of conductive wire members; The lower contact portion may have a cylindrical shape formed by rolling a thin plate made of a conductive metal to surround lower regions of the plurality of conductive wire members.

The upper contact portion may further include an upper thin plate of a conductive metal material and an upper anisotropic conductive film attached to the upper thin plate with the upper regions of the plurality of conductive wire members interposed therebetween; The lower contact portion may include a lower thin plate made of a conductive metal material and a lower anisotropic conductive film attached to the lower thin plate with a plurality of lower regions of the conductive wire member interposed therebetween.

The plurality of conductive wire members may have a twisted shape in the vertical direction.

The intermediate regions in the vertical direction of the plurality of conductive wire members may have a U-shape.

In addition, an insulating main body of a silicon material may be formed between the upper contact portion and the lower contact portion to form a plurality of conductive wire members therein.

On the other hand, the above object is, in accordance with another embodiment of the present invention, a plurality of the bidirectional conductive pins are arranged in a horizontal direction with the spaced apart from each other; A bidirectional conductive pattern module using carbon fiber, characterized in that it comprises a main body of an insulating material for fixing the bidirectional conductive pins spaced apart in a state that the plurality of conductive wire members of each of the bidirectional conductive pins are accommodated therein. It can also be achieved by

According to the present invention according to the configuration as described above, it is possible to replace the pogo-pin type semiconductor test socket, but also high-speed test with stable signal transmission, as well as to implement pitch-free (Pitch-free) In addition, a bidirectional conductive pin and a bidirectional conductive pattern module using carbon fiber, which are applicable to an interposer electrically connecting the CPU and the board between a high-speed CPU and a board, and a bidirectional conductive socket using the same are provided.

1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket,

4 is a view for explaining a bidirectional conductive line pin according to the first embodiment of the present invention;

5 is a view for explaining a bidirectional conductive line pin according to a second embodiment of the present invention;

6 is a view for explaining a bidirectional conductive line pin according to a third embodiment of the present invention;

7 is a view for explaining a bidirectional conductive line pin according to a fourth embodiment of the present invention.

8 and 9 are views for explaining a bidirectional conductive socket according to an embodiment of the present invention,

10 to 12 are views for explaining a bidirectional conductive socket according to another embodiment of the present invention,

13 and 14 are views for explaining examples of a method of manufacturing a bidirectional conductive module of a bidirectional conductive socket according to another embodiment of the present invention;

15 is a view for explaining a bidirectional conductive line pin according to a fifth embodiment of the present invention;

16 is a view for explaining a bidirectional conductive pin according to a sixth embodiment of the present invention;

17 to 19 are views for explaining a method of manufacturing a bidirectional conductive pattern module according to another embodiment according to the present invention.

Bi-directional conductive pins using carbon fiber according to the present invention is formed inside the pin body so that the upper portion is exposed to the upper portion of the fin body, the lower portion is exposed to the lower portion of the fin body, and the elastic body A plurality of conductive wire members; The plurality of conductive wire members are disposed in the form of twisted mutually in the up and down direction inside the pin body; Each of the conductive wire members is characterized in that it comprises a carbon fiber and a conductive shell applied to the outer surface of the carbon fiber such that the conductive wire member is conductive.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

4 is a view for explaining the bidirectional conductive pin 1 according to the first embodiment of the present invention. Referring to FIG. 4, the bidirectional conductive pin 1 includes a pin body 10 and a plurality of conductive wire members 20.

The pin body 10 is made of an insulating material having elasticity, for example, a silicon material. The plurality of conductive wire members 20 are formed inside the pin body 10 with an upper portion exposed to an upper portion of the pin body 10 and a lower portion exposed to a lower portion of the pin body 10.

Here, the plurality of conductive wire members 20 are arranged in a twisted shape in the up and down direction inside the pin body 10, through which the conductive wire member 20 is pressed downward in the upper direction of the pin body 10. When it is elastically supported in the vertical direction when it is possible to form a restoring force.

The conductive wire member 20 according to the present invention includes carbon fibers and a conductive shell. The carbon fiber has a strong restoring force, so that the bidirectional conductive pin 1 according to the present invention is applied to the semiconductor test socket or the interposer and pressed upward, even when the bidirectional conductive pin 1 is pressed downward.

The conductive sheath is applied to the outer surface of the carbon fiber such that the conductive wire member 20 is conductive. In the present invention, the conductive shell is formed through the sequential plating of nickel and gold, so that the bidirectional conductive pin 1 is formed to have conductivity.

Through the above configuration, the conductive body is formed on a carbon fiber having a large but large restoring force as thin as a human hair to impart conductivity, and a plurality of conductive wire members 20 are braided along the vertical direction. By forming (10), it becomes possible to manufacture the bidirectional conductive pin 1 of small thickness.

More specifically, one carbon fiber has a diameter of approximately 0.007 mm, so that even if the bidirectional conductive pin 1 is manufactured using 5 to 6 carbon fibers, the carbon fiber can be manufactured to a thickness of 0.05 mm or less. .

Through this, when manufacturing the bidirectional conductive socket 100 to be described later using the bidirectional conductive pin 1, not only the implementation of the fine pitch but also the pitch-free (Pitch-free) can be implemented.

Meanwhile, the fin body 10 of the bidirectional conductive pin 1 according to the first embodiment of the present invention is sequentially divided into an upper region 11, an intermediate region 13, and a lower region 12 in the vertical direction. Yes. Here, the material of the intermediate region 13 is made of a material that is softer than the hardness of the upper region 11 and the lower region 12 as an example. As a result, the upper region 11 and the lower region 12 which are substantially in contact with the semiconductor device or the test circuit board and are pressurized are formed of a strong material to receive the pressure more firmly, thereby preventing damage or crushing. In addition, the intermediate region 13 may be made of a soft material so as to elastically support the pressure.

5 is a view for explaining the bidirectional conductive pin 1a according to the second embodiment of the present invention. The bidirectional conductive pin 1a according to the second embodiment of the present invention, as in the first embodiment, includes a pin body 10a and a plurality of conductive wire members 20a.

In addition, the pin body 10a of the bidirectional conductive pin 1a according to the second embodiment of the present invention may be provided in a cylindrical shape having a through hole 30a penetrating therein in the vertical direction. As a result, a smoother contact is possible when the balls of the semiconductor device are contacted in the upper direction.

Here, another configuration of the bidirectional conductive pin 1a according to the second embodiment of the present invention, for example, the pin body 10a, the conductive wire member 20a, the upper region 11a of the pin body 10a, The lower region 12a and the middle region 13a correspond to the first embodiment, and a detailed description thereof will be omitted.

6 is a view for explaining the bidirectional conductive pin 1b according to the third embodiment of the present invention. The bidirectional conductive pin 1b according to the third embodiment of the present invention, as in the first embodiment, includes a pin body 10b and a plurality of conductive wire members 20b.

In addition, the pin body 10b of the bidirectional conductive pin 1b according to the third embodiment of the present invention is provided in a cylindrical shape in which a through hole 30a (see FIG. 5) through which the inside penetrates in the vertical direction is formed. The insulating material having elasticity may be filled therein or the conductive material having elasticity may be filled to form the filling part 40b. Here, when the insulating material is filled in the through hole 30a, the elastic material is more elastically supported in contact with the semiconductor device, and when the conductive material is filled, the conductivity in the vertical direction can be improved.

Here, another configuration of the bidirectional conductive pin 1b according to the third embodiment of the present invention, for example, the pin body 10b, the conductive wire member 20b, the upper region 11b of the pin body 10b, The lower region 12b and the intermediate region 13b correspond to the first and second embodiments, and thus detailed description thereof will be omitted.

7 is a view for explaining the bidirectional conductive pin 1c according to the fourth embodiment of the present invention. The bidirectional conductive pin 1c according to the fourth embodiment of the present invention is a modification of the first to third embodiments, and is characterized in that the intermediate region of the pin body is provided to have a 휜 shape. As a result, when the bidirectional conductive pin 1c is applied to the semiconductor test socket or the interposer, the bidirectional conductive pin 1c can be elastically supported against the pressing force in the vertical direction and provide a greater restoring force. Here, the bidirectional conductive pins 1, 1a, and ab shown in the first to third embodiments may have a 휜 shape to constitute the fourth embodiment.

8 and 9 are diagrams for describing a bidirectional conductive socket 100 according to an exemplary embodiment of the present invention. The bidirectional conductive socket 100 according to the embodiment of the present invention inserts each of the plurality of bidirectional conductive pins 1 into the insertion hole 3a of the base plate 3, and then the upper surface of the bidirectional conductive pin 1. The insulating body 5 made of silicon may be formed to be exposed in the upper direction.

10 to 12 are views for explaining the bidirectional conductive socket 100a according to another embodiment of the present invention.

First, as shown in FIG. 10A, the bidirectional conductive module 110 is manufactured by arranging and attaching the plurality of bidirectional conductive pins 1 in a horizontal direction. As shown in FIG. 10B, after the carbon fiber 7 is wound around the cylindrical rod B1, the cylindrical rod B1 is removed. Then, as shown in (c) of FIG. 10, the carbon fiber 7 is pressed while pushing in the A direction to form the carbon fiber 7 to have a wound shape on a plane.

And, as shown in Figure 11, after attaching the carbon fiber 7 to the bi-directional conductive module 110 to form a restoring member to provide a restoring force in the vertical direction, a plurality of bi-directional conductive module 110 manufactured as described above ) Is sequentially attached in the depth direction as shown in FIG. 12, thereby making it possible to manufacture the bidirectional conductive socket 100a. Through this, a bidirectional conductive socket 100a is formed in which a restoring member made of carbon fibers 7 is disposed between the plurality of bidirectional conductive modules 110.

Through the above configuration, one bidirectional conductive pin 1 forms a pin having conductivity in the vertical direction. As described above, the diameter of one bidirectional conductive pin 1 is smaller than 0.05 mm. Pitch-free implementations are possible.

Meanwhile, FIGS. 13 and 14 are views for explaining examples of a method of manufacturing the bidirectional conductive modules 110a, 110b, and 110c of the bidirectional conductive socket 100 according to another embodiment of the present invention.

Referring to FIG. 13, when the conductive wire member 20 is formed long, and the silicone material is applied in a twisted state, a base pin 1 ′ longer than the bidirectional conductive pin 1 is formed, which is attached in the horizontal direction. The base module 110 ′ is formed.

Then, after attaching the restoring member made of carbon fiber 7, it is possible to cut along the perforation line of FIG. 13 to manufacture the bidirectional conductive module 110.

Here, when cutting along the cut line C1 of FIG. 13, as shown in FIG. 14A, the restoring member is maintained in a circular shape to provide stronger restoring force, and when cutting along the cutting line C2 of FIG. 13. As shown in FIG. 14B, the upper and lower portions of the restoring member are cut off to provide a relatively less strong restoring force.

FIG. 14C illustrates an example in which the intermediate region is formed to have a shape in the depth direction in manufacturing the bidirectional conductive module 110c by attaching the plurality of bidirectional conductive pins 1 in the horizontal direction. For example, the horizontal bar B2 may be pressed in the intermediate region 13, or the bidirectional conductive pin 1 having the above-described shape may be attached in the horizontal direction. At this time, the horizontal bar (B2) can be removed after the manufacture of the bidirectional conductive socket 100.

15 is a view for explaining the bidirectional conductive pin 200 according to the fifth embodiment of the present invention. Referring to FIG. 15, the bidirectional conductive pin 200 according to the fifth embodiment of the present invention includes an upper contact portion 210, a lower contact portion 220, and a plurality of conductive wire members 230. In addition, the bidirectional conductive pin 200 according to the fifth embodiment of the present invention may further include an insulating body 240.

The upper contact portion 210 is provided with a conductive metal material. For example, nickel and gold may be sequentially plated based on copper to form conductivity. In the fifth embodiment of the present invention, it is assumed that the upper contact portion 210 has a cylindrical shape formed by rolling the thin metal plate to surround the upper region of the conductive wire member 230.

Similarly, the lower contact portion 220 is provided with a conductive metal material. For example, nickel and gold may be sequentially plated based on copper to form conductivity. In the fifth embodiment of the present invention, for example, the lower contact portion 220 has a cylindrical shape formed by rolling a thin metal plate around the lower region of the conductive wire member 230.

The plurality of conductive wire members 230 connect the upper contact portion 210 and the lower contact portion 220 so that the upper contact portion 210 and the lower contact portion 220 are electrically connected to each other. Here, as shown in FIG. 15, the conductive wire member 230 is disposed to have a twisted shape along the up and down direction, through which the upper contact portion 210 is pressed upwards and downwards in the vertical direction. It is possible to form the restoring force while supporting elastically.

The conductive wire member 230 according to the present invention includes a carbon fiber and a conductive shell. The carbon fiber has a strong restoring force, so that the bidirectional conductive pin 200 according to the present invention may be applied to the semiconductor test socket or the interposer and pressurized downward so that the carbon fiber may be restored upward.

The conductive sheath is applied to the outer surface of the carbon fiber such that the conductive wire member 230 is conductive. In the present invention, the conductive outer shell is formed through sequential plating of nickel and gold, so that the bidirectional conductive pin 200 is formed to have conductivity.

The insulating body 240 is formed to accommodate the plurality of conductive wire members 230 therebetween between the upper contact portion 210 and the lower contact portion 220. Insulating body 240 is an example of being provided with a silicon material which is an insulating material.

Through the above-described configuration, the conductive body is formed on a carbon fiber having a thickness but large restoring force as thin as a human hair to impart conductivity, and the insulating main body is braided along a plurality of conductive wire members 230 along the vertical direction. By forming the 240, the bidirectional conductive pin 200 having a small thickness can be manufactured.

More specifically, since one carbon fiber has a diameter of approximately 0.007 mm, even if the bidirectional conductive pin 200 is manufactured using 5 to 6 carbon fibers, the carbon fiber can be manufactured to a thickness of 0.05 mm or less. . In addition, since the upper contact portion 210 and the lower contact portion 220 are made of a conductive metal material, more stable electrical connection is possible when contacting the upper and lower directions, and protrusions 211 and 221 are formed in the upper and lower regions, respectively. Thus, more stable contact can be ensured.

Through this, when the bidirectional conductive socket is manufactured using the bidirectional conductive pin 200, not only the fine pitch may be implemented but also the pitch-free may be implemented.

16 is a diagram for describing a bidirectional conductive pin 300 according to a sixth embodiment of the present invention. The bidirectional conductive pin 300 according to the sixth embodiment of the present invention includes the upper contact portions 310 and 350, the lower contact portions 320 and 360, and the plurality of conductive wire members 340, as in the fifth embodiment. In addition, the bidirectional conductive pin 300 according to the sixth embodiment of the present invention may further include an insulating body 340.

The upper contact portions 310 and 350 may be made of a conductive metal material. For example, nickel and gold may be sequentially plated based on copper to form conductivity. In the sixth embodiment of the present invention, for example, the upper contact portions 310 and 350 include the upper thin plate 310 and the upper anisotropic conductive film 350.

The upper thin plate 310 is provided in the form of a thin metal plate having conductivity. Here, the upper thin plate 310 may be formed through a sequential plating of nickel and gold based on a thin copper plate. The upper anisotropic conductive film 350 is attached to the upper thin plate 310 with the upper regions of the plurality of conductive wire members 340 interposed therebetween, thereby attaching the conductive wire member 340 to the upper thin plate 310.

Similarly, the lower contact portions 320 and 360 may be made of a conductive metal material. For example, nickel and gold may be sequentially plated based on copper to form conductivity. In the sixth embodiment of the present invention, for example, the lower contact portions 320 and 360 include the lower thin plate 320 and the lower anisotropic conductive film 360.

The lower thin plate 320 is provided in the form of a thin metal plate having conductivity. Here, the lower thin plate 320 may be formed through sequential plating of nickel and gold based on a thin copper plate. The lower anisotropic conductive film 360 is attached to the lower thin plate 320 with the lower regions of the plurality of conductive wire members 340 interposed therebetween, thereby attaching the conductive wire member 340 to the lower thin plate 320.

The plurality of conductive wire members 340 connect the upper contact portions 310 and 350 and the lower contact portions 320 and 360 to electrically connect the upper contact portions 310 and 350 and the lower contact portions 320 and 360. Here, the middle portion of the conductive wire member 340 may have a 휜 shape, a detailed description thereof will be described later.

Similar to the fifth embodiment, the conductive wire member 340 according to the sixth embodiment of the present invention includes carbon fibers and a conductive shell. The carbon fiber has a strong restoring force, so that the bidirectional conductive pin 300 according to the present invention may be applied to the semiconductor test socket or the interposer and pressurized downward, thereby restoring upward.

The conductive sheath is applied to the outer surface of the carbon fiber such that the conductive wire member 340 is conductive. In the present invention, the conductive shell is formed through the sequential plating of nickel and gold, so that the bidirectional conductive pin 300 is formed to have conductivity.

The insulating body 340 is formed to accommodate a plurality of conductive wire members 340 therein between the upper contact portions 310 and 350 and the lower contact portions 320 and 360. For example, the insulating body 340 is made of a silicon material which is an insulating material.

According to the above configuration, the bidirectional conductive pin 300 according to the sixth embodiment of the present invention also provides the same effect as the above-described fifth embodiment.

Here, the upper thin plate 310 and the lower thin plate 320 may be formed with protrusions 311 and 321 protruding in the upper and lower directions, respectively, to enable more stable contact when contacting in the upper and lower directions.

Hereinafter, a method of manufacturing a bidirectional conductive pattern module according to still another embodiment of the present invention will be described with reference to FIGS. 17 to 19.

First, as shown in FIG. 17A, a plurality of upper thin plates 310 and a plurality of lower thin plates 320 are arranged in a horizontally spaced state by patterning a metal thin plate, for example, a copper thin plate. Form. Here, the upper region of the upper thin plate 310 and the lower region of the lower thin plate 320 may be manufactured in the form of a crown.

Then, as illustrated in FIG. 17B, the upper thin plates 310 and the lower thin plates 320 corresponding to each other are connected to the plurality of conductive wire members 340. As described above, the plurality of conductive wire members 340 may include carbon fibers and conductive outer skin portions. Here, the plating of the carbon fiber for forming the conductive outer portion may be formed by plating together when the upper thin plate 310 and the lower thin plate 320 are plated, and the plating of the upper thin plate 310 and the lower thin plate 320 may be performed. Plating may be performed separately. That is, it may be plated together during nickel and gold plating of the copper thin plate, and may be separately performed before or after attachment of the upper anisotropic conductive film 350 and the lower anisotropic conductive film 360 which will be described later.

When the attachment of the conductive wire member 340 is completed as described above, as shown in FIG. 18A, the upper anisotropic conductive film 350 and the lower anisotropic conductive film 360 may be attached to the upper thin plate 310 and the lower portion. In the present invention, the anisotropic conductive film 350a elongated in the horizontal direction is attached to the plurality of upper thin plates 310 at one time. After attaching to the lower thin plate 320 at one time, the upper anisotropic conductive film 350 and the respective lower anisotropic conductive film 360 are attached to each other by cutting along the cutting line C1. Here, the attachment of the anisotropic conductive films 350a and 360a may be more firmly attached by thermal fusion.

According to the above configuration, the one upper thin plate 310 and the lower thin plate 320 corresponding to each other, and the plurality of conductive wire members 340 connecting them are one bidirectional conductive pin 300 having conductivity in the vertical direction ).

As described above, when the upper anisotropic conductive film 350 and the lower anisotropic conductive film 360 are completed, as shown in FIG. 18B, the main body 340a is formed using silicon of an insulating material. . Here, the main body 340a is formed so that each of the conductive wire members 340 is accommodated therein, through which the bidirectional conductive pins 300 are horizontally spaced apart from each other.

Here, when the main body 340a is formed, as shown in FIG. 18B, after the horizontal bar B is formed, the conductive wire member 340 is formed by the horizontal bar B. 340a has a U-shape inside.

When the upper support plate 410 and the lower support plate 420 fixing the upper thin plate 310 and the lower thin plate 320 through the cutting line C2 are cut, the bidirectional conductive pattern module as shown in FIG. 19. Can be made.

Here, when the bidirectional conductive pattern module is cut along the cut line C3 shown in FIG. 19, the bidirectional conductive pin 300 according to the sixth embodiment as illustrated in FIG. 16 may be manufactured.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

[Description of the code]

1,1a, 1b, 1c: Bidirectional conductive pins 10,10a, 10b: Pin body

11,11a, 11b: upper region 12,12a, 12b: lower region

13,13a, 13b: intermediate region 20,20a, 20b: conductive wire member

30a: through hole 40b: filling part

3: base plate 3a: insertion hole

100,100a: bidirectional conductive socket

110,110a, 110b, 110c: Bidirectional conductive module

5: insulating body 7: carbon fiber

200,300: Bidirectional conductive pin 210: Upper contact

220: lower contact portion 230, 330: conductive wire member

240,340: insulating body 310: upper sheet

320: lower thin plate 350: upper anisotropic conductive film

360: lower anisotropic conductive film

The present invention can be applied to connect a semiconductor device and a test circuit board to be tested in a process of testing a semiconductor device, and can also be applied to an interposer connecting between a CPU and a board.

Claims (16)

1. In the bidirectional conductive pin using carbon fiber,

   A pin body of insulating material having elasticity,

   A plurality of conductive wire members formed inside the pin body such that an upper portion is exposed to an upper portion of the pin body and a lower portion is exposed to a lower portion of the pin body;

   The plurality of conductive wire members are disposed in the form of twisted mutually in the up and down direction inside the pin body;

   Each of the conductive wire members,

   With carbon fiber,

   Bidirectional conductive pins using carbon fibers, characterized in that the conductive wire member comprises a conductive outer skin applied to the outer surface of the carbon fiber to have conductivity.
2. The method of claim 1,

   The conductive outer portion is bidirectional conductive pins using carbon fibers, characterized in that formed through sequential plating of nickel and gold.
3. The method of claim 1,

   The pin body is made of silicon material;

   The pin body is divided into an upper region, an intermediate region and a lower region sequentially in the vertical direction;

   Bidirectional conductive pins using carbon fibers, characterized in that the material of the intermediate region is provided with a material softer than the hardness of the upper region and the lower region.
4. The method of claim 1,

   The pin body is a bi-directional conductive pin using carbon fiber, characterized in that provided in the cylindrical shape having a through hole therein in the vertical direction.
5. The method of claim 4, wherein

   Bi-directional conductive pins using carbon fibers, characterized in that the through-hole is filled with an insulating insulating material having elasticity.
6. The method of claim 4, wherein

   Bidirectional conductive pins using carbon fibers, characterized in that the through-hole is filled with a conductive material having elasticity.
7. The method of claim 1,

   The central region of the pin body is a bi-directional conductive pin using a carbon fiber, characterized in that having a fin shape.
8. A pattern module in which a plurality of bidirectional conductive modules formed by attaching the bidirectional conductive pins using the carbon fiber according to any one of claims 1 to 7 are attached along the horizontal direction;

   A bidirectional conductive socket using carbon fibers, characterized by comprising a restoring member of an insulating material disposed between a plurality of the bidirectional conductive module to provide a restoring force in the vertical direction.
9. The method of claim 8,

   The restoration member is a bidirectional conductive socket using carbon fibers, characterized in that the carbon fiber is formed to have a shape wound on a plane.
10. In the bidirectional conductive pin using carbon fiber,

    An upper contact of conductive metal,

    A lower contact portion of a conductive metal material spaced downward from the upper contact portion,

    A plurality of conductive wire members connecting the upper contact portion and the lower contact portion to electrically connect the upper contact portion and the lower contact portion;

    Each of the conductive wire members,

    With carbon fiber,

    Bidirectional conductive pins using carbon fibers, characterized in that the conductive wire member comprises a conductive outer skin applied to the outer surface of the carbon fiber to have conductivity.
11. The method of claim 10,

    The upper contact portion has a cylindrical shape formed by rolling a thin plate made of a conductive metal to surround upper regions of the plurality of conductive wire members;

    The lower contact portion has a cylindrical shape in which a thin plate made of a conductive metal material is rolled around the lower regions of the plurality of conductive wire members to form a bidirectional conductive pin using carbon fiber.
12. The method of claim 10,

    The upper contact portion

    An upper sheet of conductive metal,

    An upper anisotropic conductive film attached to the upper thin plate with the upper regions of the plurality of conductive wire members interposed therebetween;

    The lower contact portion

    A lower sheet of conductive metal,

    And a lower anisotropic conductive film attached to the lower thin plate with the lower regions of the plurality of conductive wire members interposed therebetween.
13. The method of claim 10,

    A plurality of the conductive wire member has a twisted shape along the vertical direction, bidirectional conductive pins using carbon fibers.
14. The method of claim 10,

    The intermediate region in the up-down direction of the plurality of conductive wire members has a U-shape, wherein the bidirectional conductive pins using the carbon fiber.
15. The method of claim 10,

    And an insulating main body made of silicon material formed between the upper contact portion and the lower contact portion to accommodate the plurality of conductive wire members therein. 2.
16. 16. A plurality of bidirectional conductive pins according to any one of claims 10 to 15 are arranged in a horizontal direction with each other spaced apart;

    Bidirectional conductive pattern module using carbon fiber, characterized in that it comprises a main body of an insulating material for fixing the bidirectional conductive pins spaced apart in a state that the plurality of conductive wire members of each of the bidirectional conductive pins received therein .

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