WO2018135112A1 - Dispositif d'acquisition de grandeur d'écart de position, dispositif d'inspection, procédé d'acquisition de grandeur d'écart de position, et procédé d'inspection - Google Patents

Dispositif d'acquisition de grandeur d'écart de position, dispositif d'inspection, procédé d'acquisition de grandeur d'écart de position, et procédé d'inspection Download PDF

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Publication number
WO2018135112A1
WO2018135112A1 PCT/JP2017/040777 JP2017040777W WO2018135112A1 WO 2018135112 A1 WO2018135112 A1 WO 2018135112A1 JP 2017040777 W JP2017040777 W JP 2017040777W WO 2018135112 A1 WO2018135112 A1 WO 2018135112A1
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WIPO (PCT)
Prior art keywords
positional deviation
amount acquisition
image
area
deviation amount
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PCT/JP2017/040777
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English (en)
Japanese (ja)
Inventor
一哉 里見
祐司 赤木
井上　学
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Priority to CN201780083841.5A priority Critical patent/CN110199173B/zh
Priority to KR1020197019485A priority patent/KR102227341B1/ko
Publication of WO2018135112A1 publication Critical patent/WO2018135112A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a positional deviation amount acquisition device, an inspection device, a positional deviation amount acquisition method, and an inspection method.
  • inspection is performed based on design data such as CAM (Computer Aided Manufacturing) data.
  • design data such as CAM (Computer Aided Manufacturing) data.
  • CAM Computer Aided Manufacturing
  • an image of a design pattern indicated by design data is compared with an image showing a wiring pattern of a printed circuit board, and a place having a certain difference or more is extracted as a defect.
  • alignment of two images is performed. In the alignment, a positional deviation amount between the two images is obtained.
  • Japanese Patent Laid-Open No. 6-300703 discloses an inspection apparatus that detects a defect by comparing an inspected image and a reference image with each other for each evaluation section divided into regions of a predetermined size.
  • the inspection apparatus the amount of positional deviation between both images in each evaluation section is obtained, and a frequency distribution with respect to the amount of positional deviation is obtained.
  • the position of the center of gravity of the distribution in the frequency distribution is acquired as a displacement amount of the entire image, and the distance between the point farthest from the center of gravity and the center of gravity is acquired as the maximum value of internal distortion in the pattern indicated by the image to be inspected.
  • the pattern of one divided area may be composed of only linear pattern elements extending in one direction, for example.
  • the positional deviation amount in the direction perpendicular to the one direction can be obtained with high accuracy, but it is difficult to obtain the positional deviation amount in the one direction with high accuracy.
  • the present invention is directed to a misregistration amount acquisition device and aims to accurately obtain misregistration amounts of respective divided areas in two images.
  • the positional deviation amount acquisition device includes an image dividing unit that divides one of two images to obtain a divided region group, and a deviation amount acquisition process that acquires a positional deviation amount between the two images.
  • an appropriate area specifying unit that specifies a plurality of appropriate areas suitable for the shift amount acquisition processing from the divided area group, and in each appropriate area, between the two images
  • a misregistration amount calculation unit that obtains misregistration amounts based on the misregistration amounts of the plurality of appropriate areas and the positional relationship between the improper areas and the appropriate areas;
  • the suitability area specifying unit obtains the suitability degree by detecting a feature point included in a pattern indicated by each of the divided areas.
  • the one image is an image derived from design data indicating a design pattern
  • the other image of the two images is an object on which an actual pattern based on the design data is formed. It is an image acquired by imaging an object.
  • a difference between each appropriate region and the other image of the two images is obtained while moving each appropriate region in the one image vertically and horizontally. As a result, the positional deviation amount of each appropriate region is acquired.
  • a formula for a positional deviation amount using the position of each divided region as a parameter is set in advance, and the positional deviation amount calculation unit includes a positional deviation amount of the plurality of appropriate regions, and Based on the positions of the plurality of appropriate regions, the coefficient of the equation is obtained.
  • the present invention is also directed to an inspection apparatus.
  • the inspection apparatus according to the present invention uses the positional deviation amount acquisition device and the positional deviation amount of each of the divided regions acquired by the positional deviation amount acquisition device, while aligning the two images.
  • An inspection unit that acquires an inspection result for the inspection image included in the two images.
  • the present invention is also directed to a positional deviation amount acquisition method and an inspection method.
  • FIG. 1 is a diagram showing a configuration of a pattern inspection apparatus 1 according to an embodiment of the present invention.
  • the pattern inspection apparatus 1 is an apparatus that inspects the appearance of a printed circuit board (also referred to as a printed wiring board) before electronic components are mounted, for example.
  • the printed circuit board has a wiring pattern formed on a surface of a resin substrate 9 (hereinafter simply referred to as “substrate 9”) using a conductive material such as copper.
  • a conductive material film (conductive film) is provided on the surface of the substrate 9.
  • a resist film which is a photosensitive material, is formed on the conductive film, and a pattern image based on the design data is directly drawn on the resist film by a drawing apparatus (direct drawing apparatus).
  • the substrate 9 on which the pattern is drawn is subjected to development processing, etching processing, resist stripping processing, and the like. Thereby, a wiring pattern is formed on the substrate 9.
  • the etching process for the substrate 9 is, for example, wet etching performed by applying an etching solution to the substrate 9.
  • an etching solution for example, dry etching using plasma or the like may be performed.
  • a pattern may be formed (exposed) on the resist film using a photomask showing a design pattern.
  • the pattern inspection apparatus 1 includes an apparatus main body 2 that captures an image of the substrate 9, and a computer 3 that controls the overall operation of the pattern inspection apparatus 1 and that implements a calculation unit and the like described later.
  • the apparatus main body 2 captures the substrate 9 and acquires a captured image (data) of multi-gradation, a stage 22 that holds the substrate 9, and the stage 22 relative to the imaging device 21. It has a stage drive unit 23 that moves.
  • the imaging device 21 electrically outputs an illumination unit 211 that emits illumination light, an optical system 212 that guides illumination light to the substrate 9 and is incident with light from the substrate 9, and an image of the substrate 9 formed by the optical system 212.
  • An imaging unit 213 that converts the signal into a signal is included.
  • the stage drive unit 23 includes a ball screw, a guide rail, a motor, and the like. A predetermined area on the substrate 9 is imaged by the computer 3 controlling the stage drive unit 23 and the imaging device 21.
  • FIG. 2 is a diagram showing the configuration of the computer 3.
  • the computer 3 has a general computer system configuration including a CPU 31 that performs various arithmetic processes, a ROM 32 that stores basic programs, and a RAM 33 that stores various information.
  • the computer 3 is readable by a computer such as a fixed disk 34 for storing information, a display 35 for displaying various information such as images, a keyboard 36a and a mouse 36b for receiving input from an operator, an optical disk, a magnetic disk, a magneto-optical disk, etc.
  • a reading device 37 that reads information from the recording medium 8 and a communication unit 38 that transmits and receives signals to and from other components of the pattern inspection device 1 are further included.
  • the program 80 is read from the recording medium 8 via the reading device 37 in advance and stored in the fixed disk 34.
  • the CPU 31 executes arithmetic processing while using the RAM 33 and the fixed disk 34 according to the program 80.
  • FIG. 3 is a block diagram showing a functional configuration of the pattern inspection apparatus 1.
  • the computer 3 includes a positional deviation amount acquisition device 41, an inspection unit 42, and a storage unit 49.
  • the positional deviation amount acquisition device 41 includes an image dividing unit 411, an appropriate region specifying unit 412, a positional deviation amount acquisition unit 413, and a positional deviation amount calculation unit 414.
  • the storage unit 49 stores design data 48 such as CAM data (or CAD data). Details of functions realized by these configurations will be described later. In addition, these functions may be constructed by a dedicated electric circuit, or a dedicated electric circuit may be partially used.
  • FIG. 4 is a diagram showing a flow of processing in which the pattern inspection apparatus 1 inspects the substrate 9.
  • a plurality of substrates 9 manufactured as one lot hereinafter referred to as “target lot”.
  • the plurality of substrates 9 included in the target lot are used for manufacturing the same product, and the same wiring pattern is formed.
  • design data 48 used when forming a wiring pattern on the surface of the substrate 9 (hereinafter, an actual wiring pattern on the substrate 9 is referred to as “real pattern”) is stored in the storage unit 49. It is input and prepared (step S10).
  • the design data 48 in the present embodiment is vector data indicating a design pattern.
  • the design data 48 may be raster data. Actual patterns on the plurality of substrates 9 included in the target lot are formed by an etching process or the like based on the design data 48.
  • the image dividing unit 411 generates a binary image indicating a design pattern (hereinafter referred to as “reference image”).
  • reference image a binary image indicating a design pattern
  • a plurality of pixels are arranged in the row direction and the column direction, one value (for example, 1) is assigned to each pixel included in the pattern area of the design pattern, and each pixel included in the background area is assigned another value.
  • a value (for example, 0) is assigned.
  • the reference image 6 is divided into a plurality of regions 60 (hereinafter referred to as “divided regions 60”) (step S11).
  • the reference image 6 is equally divided in the row direction and the column direction, and the plurality of divided regions 60 have the same size.
  • the plurality of divided regions 60 may have different sizes.
  • a set of a plurality of divided regions 60 is referred to as a “divided region group”.
  • FIG. 6 and 7 are diagrams showing a part of the divided region 60.
  • FIG. 6 When the divided region group is acquired by the image dividing unit 411, the appropriate region specifying unit 412 uses each pixel not included in the pattern region 61 in the reference image 6, that is, each pixel included in the background region 62 as a target pixel.
  • the distance from the target pixel to the edge of the pattern area 61 (hereinafter referred to as “background measurement distance”) is measured for each of the eight directions set at 45 degree intervals.
  • the background measurement distances in eight directions when the pixel 82 is the target pixel are indicated by arrows 81 (one arrow is denoted by reference numeral 81 a).
  • the target pixel when only the background measurement distance in one direction is greater than or equal to the predetermined determination distance and the background measurement distances in the other seven directions are less than the determination distance, the target pixel is detected as a recessed pixel.
  • the pixel 82 in FIG. 6 since only the background measurement distance indicated by the arrow 81a is equal to or greater than the determination distance, the pixel 82 is a concave pixel.
  • the recessed pixel indicates the presence of a recessed portion 63 (hereinafter referred to as “pattern recessed portion 63”) of the pattern region 61.
  • An upper limit of the background measurement distance is determined in advance, and an arrow 81a in FIG. 6 is the upper limit background measurement distance.
  • the search for the recessed pixels may be performed for every predetermined number of pixels in the background region 62 (the same applies to the search for the raised pixels).
  • each pixel included in the pattern area 61 is set as a target pixel, and the distance from the target pixel to the edge of the pattern area 61 with respect to each of the eight directions set at 45 ° intervals (hereinafter, "Pattern measurement distance") is measured.
  • the pattern measurement distances in eight directions when the pixels 72 and 72A are the target pixels are indicated by arrows 71 (three arrows are denoted by reference numerals 71a, 71b, and 71c).
  • the target pixel when only the pattern measurement distance in one direction is equal to or greater than the predetermined determination distance and the pattern measurement distance in the other seven directions is less than the determination distance, the target pixel is detected as a convex pixel.
  • the convex pixel indicates the presence of a convex part 64 (hereinafter referred to as “pattern convex part 64”) of the pattern region 61.
  • pattern convex part 64 The upper limit of the pattern measurement distance is determined in advance, and arrows 71a and 71b in FIG. 7 are the upper limit pattern measurement distance.
  • the aptitude area specifying unit 412 obtains the number of convex and concave pixels included in each divided area 60 and specifies the divided area 60 having the predetermined number or more as the appropriate area (step S12).
  • three divided areas 60 identified as appropriate areas are vertically arranged.
  • the divided region 60 in which the number of convex pixels and concave pixels is less than a predetermined number is specified as an inappropriate region.
  • three divided regions 60 identified as inappropriate regions are shown vertically.
  • a parallel diagonal line is given to the divided region 60 specified as the appropriate region in the divided region group of the reference image 6.
  • the captured image of the substrate 9 and the reference image 6 are aligned.
  • a positional deviation amount between the pattern indicated by each divided region 60 of the reference image 6 and the pattern in the captured image that matches (or approximately matches) the pattern is obtained.
  • the pattern indicated by the divided region 60 includes a pattern concave portion 63 and a pattern convex portion 64 to some extent (the reason will be described later).
  • it is treated as an appropriate area suitable for “shift amount acquisition processing”.
  • the divided region group the divided region 60 in which the number of concave pixels and convex pixels is less than a predetermined number is treated as an inappropriate region that is not suitable for the shift amount acquisition process.
  • the inappropriate area is a divided area 60 that is not included in the plurality of appropriate areas in the divided area group.
  • the first substrate 9 among the plurality of substrates 9 included in the target lot is placed on the stage 22 (see FIG. 1), and a predetermined region on the substrate 9 is obtained by the stage driving unit 23. Is arranged in an imaging region by the imaging unit 213. Then, a captured image showing an actual pattern (hereinafter referred to as “real pattern image”) is acquired by the imaging unit 213 and output to the positional deviation amount acquisition device 41 (step S13).
  • real pattern image a captured image showing an actual pattern
  • a plurality of pixels are arranged in the row direction and the column direction.
  • the resolution of the actual pattern image is the same as the resolution of the reference image 6.
  • the reference image 6 is generated from the design data 48 in accordance with the resolution of the image captured by the imaging unit 213.
  • the size of the region on the substrate 9 indicated by one pixel of the reference image 6 is the same as the size of the region on the substrate 9 indicated by one pixel of the actual pattern image.
  • the positional deviation amount acquisition unit 413 binarizes the actual pattern image with a predetermined threshold value, and generates a binary image (hereinafter referred to as “inspected image”) indicating the actual pattern. Then, a shift amount acquisition process between the image to be inspected and the reference image 6 is performed in each divided region 60 that is a suitable region, and a positional shift amount is acquired for each suitable region (step S14).
  • FIG. 11 is a diagram for explaining the shift amount acquisition processing.
  • regions 50 corresponding to the respective divided regions 60 of the reference image 6 This is an area indicating the same position on the substrate 9 as the divided area 60, and is hereinafter referred to as “inspected divided area 50”.
  • inspected divided area 50 is an area indicating the same position on the substrate 9 as the divided area 60.
  • the entire divided region 60 is overlapped with the entire inspection divided region 50 corresponding to the divided region 60, and each pixel of the divided region 60 is overlapped.
  • the difference (absolute value) between the value and the value of the pixel of the image to be inspected that overlaps the pixel is obtained. Then, the sum of the difference values obtained for all the pixels in the divided region 60 is acquired as an evaluation value.
  • the evaluation value is obtained in the same manner while moving the divided region 60 one pixel at a time in the vertical and horizontal directions (row direction and column direction) from the position of the inspection divided region 50.
  • each pixel in the pixel array of M rows and N columns (M and N are arbitrary integers) centering on the central pixel of the inspected divided region 50 is overlapped with the central pixel of the divided region 60.
  • the evaluation value is acquired while arranging the divided regions 60.
  • a pixel that obtains an evaluation value that is equal to or lower than a predetermined threshold is specified as the specific pixel. In a state where the center pixel of the divided region 60 is arranged at a position overlapping the specific pixel, the difference between the divided region 60 and the image to be inspected is relatively small.
  • FIG. 12 is a diagram showing an array 510 of 5 ⁇ 5 pixels 51 (that is, the pixel array 510) centered on the central pixel 51a of the inspected divided region 50.
  • the specific pixels 51 are indicated by parallel diagonal lines. Yes.
  • a plurality of specific pixels 51 are gathered together as a specific pixel group.
  • a vector from the center pixel 51a of the divided region 50 to be inspected toward the barycentric position 52 in the specific pixel group is acquired as the positional deviation amount of the divided region 60.
  • the displacement amount includes a component in the row direction and a component in the column direction.
  • the positional deviation amount acquisition unit 413 obtains the positional deviation amount of the appropriate area by obtaining the difference between the appropriate area and the image to be inspected while moving each appropriate area in the reference image 6 vertically and horizontally. Is acquired.
  • a formula for a positional deviation amount using the position of each divided region 60 as a parameter (hereinafter referred to as “deviation amount calculation formula”) is set in advance.
  • the position shift amount ⁇ X in the row direction and the position shift in the column direction are calculated using the position Xb in the row direction and the position Yb in the column direction of the central pixel of the divided region 60 shown in FIG.
  • the quantity ⁇ Y is represented.
  • ⁇ x, ⁇ x, ⁇ x, ⁇ y, ⁇ y, ⁇ y are coefficients.
  • the positions of a plurality of appropriate regions (the positions of the divided regions 60 indicated by the parallel diagonal lines in FIG. 10) and the misregistrations of the plurality of aptitude regions acquired by the misregistration amount acquisition unit 413.
  • coefficients ⁇ x, ⁇ x, ⁇ x, ⁇ y, ⁇ y, ⁇ y (values) of the deviation amount calculation formula are obtained (step S15). For example, these coefficients are obtained by the least square method.
  • the position Xb in the row direction and the position Yb in the column direction of the center pixel of each inadequate region are substituted into the shift amount calculation formula. .
  • the positional deviation amount ⁇ X in the row direction and the positional deviation amount ⁇ Y in the column direction are obtained for the inappropriate area (step S16).
  • the coefficients ⁇ x, ⁇ x, ⁇ x, ⁇ y, ⁇ y, and ⁇ y in the deviation amount calculation formulas are calculated based on the positional deviation amounts of the plurality of appropriate areas and the positions of the plurality of appropriate areas in the row direction and the column direction. Based on.
  • the misalignment amount of the improper region is obtained by a misregistration amount calculation formula using the position of the improper region in the row direction and the column direction. Therefore, it can be said that the misregistration amount of the improper region is substantially obtained based on the misregistration amounts of the plural aptitude regions and the positional relationship between the improper region and the plural aptitude regions.
  • a difference area image indicating a difference between the divided area 60 and the inspection image is acquired.
  • the difference area image is a binary value that indicates the exclusive OR of the value of each pixel in the divided area 60 and the value of the pixel of the image to be inspected that overlaps the pixel in the reference image 6 and the image to be inspected that are aligned. It is an image.
  • the difference area image shows a defect candidate pixel. When the size of a set of defect candidate pixels adjacent to each other is larger than a predetermined area threshold, the set of defect candidate pixels is detected as a defect region.
  • the width of the pattern area or the width of the background area is acquired as the pattern width or the background width at each position of the inspected image.
  • a width threshold is set for each position of the reference image 6.
  • the reference image 6 and the inspection image that are aligned the reference image that overlaps each position of the inspection image.
  • a threshold of position 6 is acquired.
  • it is determined whether or not the position of the image to be inspected is a defect by comparing the pattern width or background width of the position of the image to be inspected with the threshold value.
  • the inspection unit 42 acquires the inspection result for the inspected image while aligning the reference image 6 and the inspected image using the misalignment amount of each divided region 60 (step S17). .
  • the second substrate 9 included in the target lot is imaged by the imaging unit 213, and an image to be inspected is acquired (steps S18 and S13). Subsequently, in the same manner as described above, the positional deviation amount of the appropriate region is acquired, and the coefficient of the deviation amount calculation formula is obtained (steps S14 and S15). Since the plurality of substrates 9 included in the target lot are based on the same design data 48, the appropriate regions in the divided region group are the same in the plurality of substrates 9. Then, the amount of misalignment of the improper region is acquired, and the inspection result is acquired from the reference image 6 and the inspected image that have been aligned (steps S16 and S17). When the processes in steps S13 to S17 are performed on all the substrates 9 included in the target lot, the process in the pattern inspection apparatus 1 is completed (step S18).
  • the shift amount acquisition process is performed on, for example, the three divided regions 60 in FIG.
  • the patterns in the upper, middle, and lower divided regions 60 in FIG. 9 are configured only by linear pattern elements that extend in the row direction, the column direction, and the oblique direction, respectively. Accordingly, as shown in the upper, middle, and lower stages of FIG. 13, in the pixel array 510 of M rows and N columns with the center pixel 51a of the inspected divided region 50 at the center, the specific pixels 51 with parallel diagonal lines are respectively in the row direction.
  • the pattern of the divided region 60 including the pattern concave portion 63 or the pattern convex portion 64 is not only a linear pattern element extending in one direction.
  • the concave pixel or the convex pixel becomes a feature point in the pattern indicated by the divided region 60, and the above M rows and N columns In the pixel array 510, the specific pixels 51 are arranged in a line.
  • the number of concave pixels and convex pixels is The degree of suitability for the shift amount acquisition processing of the divided area 60 is shown.
  • a plurality of appropriate areas are specified from the divided area group by obtaining the suitability degree of each divided area 60 for the deviation amount acquisition process, and the positional deviation amount of each appropriate area is acquired by the deviation amount acquisition process. The Then, the misregistration amount is obtained for the improper region based on the misregistration amounts of the plural aptitude regions and the positional relationship between the improper region and the plural aptitude regions. In this way, by using the positional deviation amount of the appropriate area suitable for the deviation amount acquisition process, the positional deviation amount of the improper area that is not suitable for the deviation amount acquisition process is obtained, so that each division in the reference image 6 and the image to be inspected is performed. The positional deviation amount of the region 60 can be obtained with high accuracy.
  • the processing amount in the positional shift amount acquisition unit 413 is reduced as compared to the case where the shift amount acquisition process is performed on all the divided regions 60. That is, it is possible to shorten the time required to acquire the positional deviation amount.
  • the difference between the appropriate area and the image to be inspected is obtained while moving each appropriate area in the reference image 6 up and down and left and right.
  • a deviation amount calculation formula using the position of each divided region 60 as a parameter is set in advance, and based on the positional deviation amounts of the plurality of appropriate regions and the positions of the plurality of appropriate regions, A coefficient is determined. As a result, the amount of misalignment of the inappropriate area can be quickly obtained.
  • the inspection unit 42 acquires the inspection result for the image to be inspected while aligning the reference image 6 and the image to be inspected using the displacement amount of each divided region 60. At this time, the alignment of the reference image 6 and the image to be inspected is performed for each divided region 60, so that the inspection result of the image to be inspected can be obtained with high accuracy (reduced false alarm).
  • the positional deviation amount acquisition device 41 and the pattern inspection device 1 can be variously modified.
  • the aptitude area specifying unit 412 detects the characteristic points included in the pattern indicated by each of the divided areas 60 using the concave and convex pixels as characteristic points, thereby facilitating the suitability of the divided area 60 for the shift amount acquisition processing.
  • the feature point may be other than the concave pixel and the convex pixel.
  • a vertex of a polygon figure that is a pattern element or a curved portion (excluding a straight line) at the edge of the pattern element may be treated as a feature point.
  • the aptitude degree may be obtained by a method other than detection of feature points.
  • the image dividing unit 411 may acquire a divided region group of the image to be inspected. In this case, a plurality of appropriate areas are specified from the divided area group, and a shift amount acquisition process is performed to obtain a difference between each appropriate area and the reference image 6.
  • a shift amount acquisition process is performed to obtain a difference between each appropriate area and the reference image 6.
  • one of the two images of the image to be inspected and the reference image 6 is divided to acquire a divided region group, and a plurality of appropriate regions suitable for the shift amount acquisition processing are obtained. , Specified from the divided region group.
  • the position shift of the suitability region is obtained by calculating the difference between the suitability region and the other image of the two images while moving each suitability region in the one image vertically and horizontally. A quantity is acquired.
  • a divided area group is acquired in the reference image 6 derived from the design data 48 indicating the design pattern. Further, when an actual pattern is formed on a plurality of substrates 9 based on the same design data 48, by obtaining a divided region group in the reference image 6 derived from the design data 48, the coverage of the plurality of substrates 9 is obtained. A plurality of substrates 9 can be efficiently inspected using the same suitability area for the inspection image.
  • a method other than the method described with reference to FIGS. 11 and 12 may be used as the displacement amount acquisition processing for acquiring the displacement amount between the two images.
  • various methods for example, a normalized correlation method
  • pattern matching can be employed.
  • the amount of positional deviation between the image to be inspected that is obtained by binarizing the actual pattern image and the binary reference image 6 is acquired.
  • An image may be used as an image to be inspected.
  • an image of the design pattern in which the pattern region 61 and the background region 62 are given the average value of the pattern region and the average value of the background region, respectively, is generated as the reference image.
  • the above-described processing by the misregistration amount acquisition device 41 is performed on the multi-tone inspection image and the reference image.
  • the inspection unit 42 may acquire inspection results for a multi-tone inspection image.
  • the deviation amount calculation formula of Formula 1 is only an example, and a secondary or higher order formula may be used. Further, the positional deviation amount calculation unit 414 may obtain the positional deviation amount of the inappropriate region without using the deviation amount calculation formula.
  • the misalignment of the non-suitable areas is determined by interpolation using the misalignment amounts of several suitable areas located around each non-suitable area and the positional relationship between these suitability areas and the non-suitable areas. An amount may be determined.
  • the substrate that is the object of inspection in the pattern inspection apparatus 1 may be a semiconductor substrate, a glass substrate, or the like. Moreover, in the pattern inspection apparatus 1, an inspection may be performed on a film-like object or a three-dimensional object other than the substrate.
  • the misregistration amount acquisition device 41 for obtaining the misregistration amounts of two images may be used in a drawing device or the like, and can be used to acquire misregistration amounts in various types of images.

Abstract

L'invention concerne une unité de division d'image (411) de ce dispositif d'acquisition de grandeur d'écart de position (41) qui divise une des deux images de façon à acquérir un groupe de zones divisées. L'invention concerne également une unité de spécification de zone appropriée (412) qui spécifie une pluralité de zones appropriées dans le groupe de zones divisées qui sont appropriées pour un traitement d'acquisition de grandeur d'écart afin de définir une grandeur d'écart de position entre les deux images en déterminant l'adéquation de chaque zone divisée pour le traitement d'acquisition de grandeur d'écart. Pour chaque zone appropriée, une unité d'acquisition de grandeur d'écart de position (413) acquiert une grandeur d'écart de position en effectuant un traitement pour déterminer la grandeur d'écart entre les deux images à l'intérieur de la zone appropriée. Une unité de calcul de grandeur d'écart de position (414) détermine la grandeur d'écart de position pour une zone inappropriée dans le groupe de zones divisées qui n'est pas incluse dans la pluralité de zones appropriées sur la base des grandeurs d'écart de position de la pluralité de zones appropriées et des relations de position entre la pluralité de zones appropriées et la zone inappropriée. Par conséquent, il est possible de déterminer avec précision la grandeur d'écart de position entre les deux images pour chaque zone divisée.
PCT/JP2017/040777 2017-01-20 2017-11-13 Dispositif d'acquisition de grandeur d'écart de position, dispositif d'inspection, procédé d'acquisition de grandeur d'écart de position, et procédé d'inspection WO2018135112A1 (fr)

Priority Applications (2)

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