WO2018120381A1 - 高频感应蒸发源装置 - Google Patents

高频感应蒸发源装置 Download PDF

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Publication number
WO2018120381A1
WO2018120381A1 PCT/CN2017/073879 CN2017073879W WO2018120381A1 WO 2018120381 A1 WO2018120381 A1 WO 2018120381A1 CN 2017073879 W CN2017073879 W CN 2017073879W WO 2018120381 A1 WO2018120381 A1 WO 2018120381A1
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Prior art keywords
induction coil
evaporation source
frequency induction
source device
high frequency
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English (en)
French (fr)
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沐俊应
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/506,243 priority Critical patent/US20180347030A1/en
Publication of WO2018120381A1 publication Critical patent/WO2018120381A1/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a high frequency induction evaporation source device.
  • OLED Organic Light-Emitting Diode
  • organic electroluminescent display also known as an organic electroluminescent display
  • the working temperature has wide adaptability, light volume, fast response, easy to realize color display and large screen display, easy to realize integration with integrated circuit driver, easy to realize flexible display, and the like, and thus has broad application prospects.
  • the OLED manufacturing technology for mass production is to prepare a film of OLED material by vacuum evaporation.
  • the vacuum evaporation method is a method in which a raw material of a film to be formed in a vaporization chamber is heated in a vacuum chamber, and atoms or molecules are vaporized from the surface to form a vapor stream, which is incident on the surface of the substrate to be condensed to form a solid film.
  • the evaporation source is a key component of the evaporation device. According to the shape of the evaporation source, it can be divided into a point evaporation source, a line evaporation source, a surface evaporation source, etc. According to the heating mode of the evaporation source, the evaporation source can be further divided into a resistance heating evaporation source.
  • An electron beam heating evaporation source a high frequency inductive evaporation source (HFIC), a laser beam heating evaporation source, and the like.
  • the resistance heating evaporation source vapor deposition method is to use a high melting point metal such as tantalum (Ta) to form an appropriate shape of an evaporation source such as a heating wire, which is heated by direct current heating, and the evaporation material is directly heated and evaporated, and can be used for a melting point not too high.
  • Evaporative coating of materials is widely used in actual production due to its simple structure, low cost and reliable use.
  • the crucible containing the evaporation material is placed in the center of a metal induction coil such as copper (Cu), so that a high-frequency current is introduced into the induction coil, and a strong eddy current loss and magnetic force are generated under the induction of a magnetic field in a high frequency band.
  • the hysteresis loss causes the evaporation material to heat up until vaporization evaporates.
  • HFIC has the characteristics that the evaporation rate is large, and the evaporation material can generate heat when the evaporation material is metal, which is suitable for the application of special materials. Therefore, HFIC is an important supplement to the common resistance heating evaporation source.
  • a conventional high frequency induction evaporation source device includes an Outer Crucible 10, an Inner Crucible 20 located in the outer casing 10, and an induction coil 30 sleeved on the periphery of the outer casing 10. a thermal insulation layer 40 disposed between the induction coil 30 and the outer casing 10, a thermocouple 50 disposed under the outer casing 10, and a radio frequency generator 60 connected to the induction coil 30.
  • the outer crucible 10 is made of a material that is electrically conductive and resistant to high temperatures, and the inner crucible 20 must be chemically stable with high temperature resistance. The material is fixed to prevent a reaction between the evaporation material and the evaporation material.
  • the induction coil 30 receives an alternating current from the RF generator 60 to generate an induced magnetic field, and the external helium 10 is generated under the induced magnetic field. Inductive current generates heat to heat the inner crucible 20 and the evaporation material placed in the inner crucible 20.
  • the high-frequency induction evaporation source device is further provided with a process cooling water (PCW) channel to be used.
  • PCW process cooling water
  • the above-mentioned high frequency induction evaporation source device has the following deficiencies in use:
  • the evaporation material located away from the wall of the inner crucible 20 is difficult to be heated sufficiently, thereby causing a phenomenon that the local heating rate is not uniform;
  • the evaporation material located near the wall of the inner crucible 20 will crack due to overheating.
  • An object of the present invention is to provide a high-frequency induction evaporation source device which can heat the evaporation material by providing a radio frequency induction heating member having conductivity in the inner crucible, thereby effectively avoiding local heating rate unevenness and partial overheating of the evaporation material. The phenomenon of cracking occurs.
  • the present invention provides a high frequency induction evaporation source device, comprising an inner crucible for carrying an evaporation material, an induction coil sleeved on a periphery of the inner crucible, an RF generator connected to the induction coil, and a device a radio frequency induced heating element in the inner bore;
  • the induction coil is configured to receive an alternating current emitted by the radio frequency generator to generate an induced magnetic field;
  • the radio frequency induction heating component includes an inductive core body having conductivity, and generating an induced current in an induced magnetic field of the induction coil Heat is generated to heat the evaporated material.
  • the radio frequency induction heating component further includes a heat conducting layer covering the outer surface of the core;
  • the material of the inductive core body is tantalum or graphite, and the material of the heat conducting layer is aluminum oxide, boron nitride, or titanium.
  • the RF induction heating component is entirely solid or hollow.
  • the radio frequency induction heating member is entirely cylindrical or plate-shaped.
  • the high frequency induction evaporation source device further includes an outer crucible disposed between the inner crucible and the induction coil, the inner crucible being located in the outer crucible.
  • the high frequency induction evaporation source device further includes a thermal insulation layer disposed between the induction coil and the outer casing.
  • the material of the outer crucible is bismuth or graphite; the material of the inner crucible is aluminum oxide or boron nitride.
  • the high frequency induction evaporation source device further includes a thermocouple disposed under the outer crucible.
  • the material of the induction coil is copper.
  • the induction coil is cooled by the process cooling water during use, and the induction coil is cooled by providing a cooling water passage on the outer side thereof and introducing the process cooling water into the cooling water passage. ;or,
  • the induction coil is a hollow tube surrounded by a spiral, and the induction coil is cooled by introducing process cooling water into the induction coil.
  • the invention also provides a high frequency induction evaporation source device, comprising an inner crucible for carrying the evaporation material, an induction coil sleeved on the periphery of the inner crucible, an RF generator connected to the induction coil, and being disposed in the inner crucible Radio frequency induced heating element;
  • the induction coil is configured to receive an alternating current emitted by the radio frequency generator to generate an induced magnetic field
  • the radio frequency induction heating component includes an inductive core body having electrical conductivity, generating an induced current in an induced magnetic field of the induction coil and generating heat to heat the evaporation material;
  • the utility model further comprises an outer raft disposed between the inner cymbal and the induction coil, wherein the inner cymbal is located in the outer cymbal;
  • the utility model also includes a thermal insulation layer disposed between the induction coil and the outer casing;
  • thermocouple disposed below the outer crucible.
  • the present invention provides a high frequency induction evaporation source device comprising: an inner crucible for carrying an evaporation material, an induction coil sleeved around a periphery of the inner crucible, and an RF generator connected to the induction coil, And an RF induction heating component disposed in the inner casing; the induction coil is configured to receive an alternating current emitted by the radio frequency generator to generate an induced magnetic field; and the radio frequency induction heating component includes an inductive core body having conductivity, the induction The core body generates an induced current in the induced magnetic field of the induction coil and generates heat, thereby heating the evaporation material, and effectively dispersing the heating region of the evaporation material in the inner crucible compared with the existing high-frequency induction evaporation source device, thereby effectively The problem that the local heating rate of the evaporation material is not uniform, and the evaporation material near the inner wall is locally heated and cracked is avoided.
  • FIG. 1 is a schematic view of a conventional high frequency induction evaporation source device
  • FIG. 2 is a schematic view of a high frequency induction evaporation source device of the present invention
  • FIG. 3 is a schematic top plan view of the high frequency induction evaporation source device of the present invention when it is a point evaporation source device;
  • FIG. 4 is a schematic top plan view of the high frequency induction evaporation source device of the present invention when it is a line evaporation source device;
  • 5A is a partial cross-sectional view showing an embodiment of an induction coil of the high-frequency induction evaporation source device of the present invention
  • Figure 5B is a partial cross-sectional view showing a second embodiment of the induction coil of the high frequency induction evaporation source device of the present invention.
  • the present invention provides a high frequency induction evaporation source device, including an inner crucible for carrying an evaporation material, an induction coil 2 disposed on a periphery of the inner crucible 1, and a radio frequency generating connection with the induction coil 2. And a high frequency Induced Heater 6 disposed in the inner cymbal 1;
  • the induction coil 2 is configured to receive an alternating current emitted by the RF generator 3 to generate an induced magnetic field;
  • the RF induced heating component 6 includes an inductive core body 61 having conductivity, in the induction coil 2
  • the induced magnetic field generates an induced current and generates heat to heat the evaporated material.
  • the high-frequency induction evaporation source device of the present invention heats the evaporation material by providing the radio frequency induction heating member 6 in the inner crucible 1, and the existing high-frequency induction evaporation source device conducts heat only through the inner crucible wall to the evaporation material.
  • the heating region of the evaporation material in the inner crucible 1 can be effectively dispersed, and the problem that the local heating rate of the evaporation material is not uniform and the evaporation material close to the inner crucible wall is locally heated and cracked can be effectively avoided.
  • the radio frequency induction heating member 6 further includes a cladding electric core body 61.
  • the surface of the heat conducting layer 62 is not limited to the surface of the heat conducting layer 62.
  • the material of the inductive core body 61 is a high temperature resistant and electrically conductive material such as tantalum or graphite; the material of the heat conducting layer 62 is high temperature resistant, chemically stable alumina (Al 2 O 3 ), boron nitride (BN), or titanium (Ti) and other materials.
  • the radio frequency induction heating member 6 may be a solid structure as a whole or may also be a hollow structure.
  • the shape of the radio frequency induction heating component 6 is designed according to the overall shape of the high frequency induction evaporation source device, and can be a high frequency induction evaporation source of the point evaporation source device, the line evaporation source device, or the surface evaporation source device. Application in the device.
  • the high frequency induction evaporation source device of the present invention is a point evaporation source device, and the horizontal cross section of the inner crucible 1 is circular.
  • the radio frequency induction heating member 6 is cylindrical.
  • the radio frequency induction heating member 6 may be in other shapes adapted to the inner crucible 1 shape.
  • the high frequency induction evaporation source device of the present invention is a line evaporation source device
  • the horizontal cross section of the inner crucible 1 is rectangular
  • the radio frequency induction heating member 6 has a plate shape.
  • the radio frequency induction heating member 6 may also be in other shapes that accommodate the shape of the inner crucible 1.
  • the high frequency induction evaporation source device of the present invention further includes an outer crucible 4 disposed between the inner crucible 1 and the induction coil 2, a thermal insulation layer 5 disposed between the induction coil 2 and the outer crucible 4, and A thermocouple 7 is disposed below the outer crucible 4, and the inner crucible 1 is located inside the outer crucible 4.
  • the material of the outer crucible 4 is a material resistant to high temperature and conductivity such as germanium or graphite;
  • the material of the inner crucible 1 is a high temperature resistant material such as alumina;
  • the material of the thermal insulation layer 5 is Thermal insulation materials such as alumina, which play a role in thermal insulation.
  • the radio frequency induction heating member 6 can heat the evaporation material together with the outer crucible 4, and of course, the evaporation material can be independently heated.
  • the material of the induction coil 2 is a metal material such as copper.
  • the induction coil 2 is cooled by process cooling water (PCW); specifically, referring to FIG. 5A, the cooling water passage 8 is disposed outside the induction coil 2 and the process is introduced into the cooling water passage 8. Cooling the water to cool the induction coil 2; or,
  • the induction coil 2 itself is a spirally wrapped hollow tube, and the induction coil 2 is cooled by introducing process cooling water into the induction coil 2.
  • the high frequency inductive evaporation source device comprises an inner crucible for carrying an evaporation material, an induction coil sleeved around the inner crucible, an RF generator connected to the induction coil, and a radio frequency induction heating component in the inner bore;
  • the induction coil is configured to receive an alternating current emitted by the radio frequency generator to generate an induced magnetic field;
  • the radio frequency induction heating component includes an inductive core body having conductivity, the inductive core body The induction coil generates an induced current in the induced magnetic field and generates heat, thereby heating the evaporation material, and effectively dispersing the heating region of the evaporation material in the inner crucible compared with the existing high-frequency induction evaporation source device, thereby effectively avoiding steaming
  • the local heating rate of the hair material is not uniform, and the evaporation material near the inner wall is partially heated and cracked.

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
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Abstract

一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚（1）、套设于内坩埚（1）外围的感应线圈（2）、与感应线圈（2）连接的射频发生器（3）、及设于内坩埚（1）内的射频诱导加热部件（6）；感应线圈（2）用于接收射频发生器（3）发射的交变电流而产生感应磁场；射频诱导加热部件（6）包括具有导电性的感应内核体（61），感应内核体（61）在感应线圈（2）的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热。该蒸发源装置能有效避免蒸发材料局部加热速率不均匀及局部过加热而裂化的问题。

Description

高频感应蒸发源装置 技术领域
本发明涉及显示技术领域，尤其涉及一种高频感应蒸发源装置。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有制备工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示、易于实现和集成电路驱动器相匹配、易于实现柔性显示等优点，因而具有广阔的应用前景。目前实现量产的OLED制造技术均是采用真空蒸镀的方法制备OLED材料薄膜。
真空蒸镀法是在真空室中，加热蒸发容器中待形成薄膜的原材料，使其原子或分子从表面气化逸出，形成蒸汽流，入射至基板表面而凝结形成固态薄膜的方法。蒸发源是蒸发装置的关键部件，按照蒸发源的形状可分为点蒸发源、线蒸发源、面蒸发源等，根据蒸发源加热方式的不同，蒸发源又可以分为，电阻加热蒸发源、电子束加热蒸发源、高频感应蒸发源(High Frequency Induced Cell，HFIC)、以及激光束加热蒸发源等。其中，电阻加热蒸发源蒸镀法就是使用钽(Ta)等高熔点金属做成适当形状的蒸发源如加热丝，通入直流电加热，对蒸发材料进行直接加热蒸发，可用于熔点不太高的材料的蒸发镀膜，因其设备构造简单、造价便宜、使用可靠，目前在实际生产中大量应用。HFIC蒸镀法是将装有蒸发材料的坩埚放在铜(Cu)等金属感应线圈中央，使感应线圈内通入高频电流，在高频带内磁场的感应下产生强大的涡流损失和磁滞损失，使蒸发材料升温，直至汽化蒸发。HFIC所具有的特点是，蒸发速率大，蒸发材料为金属时蒸发材料可产生热量，适用于特殊材料的应用，因此HFIC是普通电阻加热蒸发源的重要补充。
如图1所示，现有一种高频感应蒸发源装置，包括外坩埚(Outer Crucible)10、位于外坩埚10内的内坩埚(Inner Crucible)20、套设于外坩埚10外围的感应线圈30、设于感应线圈30与外坩埚10之间的热保温层(Thermal Insulator)40、设于外坩埚10下方的热电偶(Thermal Couple)50、及与所述感应线圈30连接的射频发生器60，其中所述外坩埚10采用导电性且耐高温的材料，而所述内坩埚20必须采用耐高温性的化学性能稳 定的材料，以防止加热过程中与蒸发材料之间发生反应，使用过程中，感应线圈30接受到来自射频发生器60发射的交变电流而产生感应磁场，外坩埚10在该感应磁场下产生感应电流而生成热量，从而对内坩埚20及放置内坩埚20中的蒸发材料进行加热，另外，该高频感应蒸发源装置还设置有工艺冷却水(Process Cooling Water，PCW)通道以在使用时对感应线圈30进行冷却。
随着基板尺寸的增大，内坩埚20的尺寸也随之增大，上述高频感应蒸发源装置在使用过程中将存在以下不足之处：
1、位于远离内坩埚20壁的蒸发材料难以充分加热，从而产生局部加热速率不均匀的现象；
2、位于靠近内坩埚20壁的蒸发材料会因过加热而裂化。
发明内容
本发明的目的在于提供一种高频感应蒸发源装置，通过在内坩埚内设置具有导电性的射频诱导加热部件对蒸发材料进行加热，能够有效避免蒸发材料局部加热速率不均匀、及局部过加热而裂化的现象发生。
为实现上述目的，本发明提供一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；
所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；所述射频诱导加热部件包括感应内核体，所述感应内核体具有导电性，在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热。
所述射频诱导加热部件还包括包覆电应内核体外表面的热传导层；
所述感应内核体的材料为钽、或石墨，所述热传导层的材料为氧化铝、氮化硼、或钛。
所述射频诱导加热部件整体为实心、或空心结构。
所述射频诱导加热部件整体为圆柱状、或板状。
所述的高频感应蒸发源装置还包括设于内坩埚与感应线圈之间的外坩埚，所述内坩埚位于外坩埚内。
所述的高频感应蒸发源装置还包括设于所述感应线圈与外坩埚之间的热保温层。
所述外坩埚的材料为钽、或石墨；所述内坩埚的材料为氧化铝、或氮化硼。
所述的高频感应蒸发源装置还包括设于所述外坩埚下方的热电偶。
所述感应线圈的材料为铜。
所述的高频感应蒸发源装置，使用过程中，通过工艺冷却水对感应线圈进行冷却，具体通过在其外侧设置冷却水通道并向冷却水通道内通入工艺冷却水而对感应线圈进行冷却；或者，
所述感应线圈为螺旋环绕的中空管，通过向所述感应线圈内通入工艺冷却水而对感应线圈进行冷却。
本发明还提供一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；
所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；
所述射频诱导加热部件包括感应内核体，所述感应内核体具有导电性，在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热；
还包括设于内坩埚与感应线圈之间的外坩埚，所述内坩埚位于外坩埚内；
还包括设于所述感应线圈与外坩埚之间的热保温层；
还包括设于所述外坩埚下方的热电偶。
本发明的有益效果：本发明提供的一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；所述射频诱导加热部件包括具有导电性的感应内核体，所述感应内核体在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热，与现有的高频感应蒸发源装置相比，能够有效分散内坩埚中蒸发材料的加热区域，从而有效避免蒸发材料局部加热速率不均匀、及靠近内坩埚壁的蒸发材料局部过加热而裂化的问题。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的一种高频感应蒸发源装置的示意图；
图2为本发明的高频感应蒸发源装置的示意图；
图3为本发明的高频感应蒸发源装置为一种点蒸发源装置时的俯视示意图；
图4为本发明的高频感应蒸发源装置为一种线蒸发源装置时的俯视示意图；
图5A为本发明的高频感应蒸发源装置的感应线圈的一实施例的局部剖面图；
图5B为本发明的高频感应蒸发源装置的感应线圈的第二实施例的局部剖面图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚1、套设于内坩埚1外围的感应线圈2、与所述感应线圈2连接的射频发生器3、及设于内坩埚1内的射频诱导加热部件(High Frequency Induced Heater)6；
所述感应线圈2用于接收射频发生器3发射的交变电流而产生感应磁场；所述射频诱导加热部件6包括感应内核体61，所述感应内核体61具有导电性，在感应线圈2的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热。
本发明的高频感应蒸发源装置，通过在内坩埚1内设置射频诱导加热部件6而对蒸发材料进行加热，与现有的高频感应蒸发源装置仅通过内坩埚壁传导热量而对蒸发材料进行加热相比，能够有效分散内坩埚1中蒸发材料的加热区域，能够有效避免蒸发材料局部加热速率不均匀、及靠近内坩埚壁的蒸发材料局部过加热而裂化的问题。
具体地，为避免所述射频诱导加热部件6的感应内核体61直接与蒸发材料接触而在加热过程中对蒸发材料造成污染，所述射频诱导加热部件6还包括包覆电应内核体61外表面的热传导层62。
所述感应内核体61的材料为钽、或石墨等耐高温、具有导电性的材料；所述热传导层62的材料为耐高温、化学性质稳定的氧化铝(Al2O3)、氮化硼(BN)、或钛(Ti)等材料。
具体地，所述射频诱导加热部件6整体可以为实心结构，或者也可以为空心结构。
具体地，所述射频诱导加热部件6的形状根据高频感应蒸发源装置的整体形状而进行设计，可在为点蒸发源装置、线蒸发源装置、或面蒸发源装置的高频感应蒸发源装置中应用。
例如，如图3所示，本发明的高频感应蒸发源装置为点蒸发源装置，所述内坩埚1的水平横截面呈圆形，此时所述射频诱导加热部件6呈圆柱状而设于内坩埚1内，当然此时所述射频诱导加热部件6也可以为其他适应内坩埚1形状的形状。
再例如，如图4所示，本发明的高频感应蒸发源装置为线蒸发源装置，所述内坩埚1的水平横截面呈长方形，所述射频诱导加热部件6呈板状，当然此时所述射频诱导加热部件6也可以为其他适应内坩埚1形状的形状。
具体地，本发明的高频感应蒸发源装置还包括设于内坩埚1与感应线圈2之间的外坩埚4、设于所述感应线圈2与外坩埚4之间的热保温层5、及设于所述外坩埚4下方的热电偶7，所述内坩埚1位于外坩埚4内。
具体地，所述外坩埚4的材料为钽、或石墨等耐高温、具有导电性的材料；所述内坩埚1的材料为氧化铝等耐高温的材料；所述热保温层5的材料为氧化铝等隔热绝缘材料，从而起到保温隔热的作用。
具体地，本发明的高频感应蒸发源装置在使用过程中，所述射频诱导加热部件6可以与外坩埚4共同对蒸发材料进行加热，当然也可以独立对蒸发材料进行加热。
具体地，所述感应线圈2的材料为铜等金属材料。
具体地，使用过程中，通过工艺冷却水(PCW)对感应线圈2进行冷却；具体，请参阅图5A，可通过在感应线圈2外侧设置冷却水通道8并向冷却水通道8内通入工艺冷却水而对感应线圈2进行冷却；或者，
请参阅图5B，所述感应线圈2本身为螺旋环绕的中空管，通过向所述感应线圈2内通入工艺冷却水而对感应线圈2进行冷却。
综上所述，本发明提供的高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；所述射频诱导加热部件包括具有导电性的感应内核体，所述感应内核体在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热，与现有的高频感应蒸发源装置相比，能够有效分散内坩埚中蒸发材料的加热区域，从而有效避免蒸 发材料局部加热速率不均匀、及靠近内坩埚壁的蒸发材料局部过加热而裂化的问题。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (17)

  1. 一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；
    所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；
    所述射频诱导加热部件包括感应内核体，所述感应内核体具有导电性，在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热。
  2. 如权利要求1所述的高频感应蒸发源装置，其中，所述射频诱导加热部件还包括包覆电应内核体外表面的热传导层；
    所述感应内核体的材料为-钽、或石墨；所述热传导层的材料为氧化铝、氮化硼、或钛。
  3. 如权利要求2所述的高频感应蒸发源装置，其中，所述射频诱导加热部件整体为实心、或空心结构。
  4. 如权利要求2所述的高频感应蒸发源装置，其中，所述射频诱导加热部件整体为圆柱状、或板状。
  5. 如权利要求1所述的高频感应蒸发源装置，还包括设于内坩埚与感应线圈之间的外坩埚，所述内坩埚位于外坩埚内。
  6. 如权利要求5所述的高频感应蒸发源装置，还包括设于所述感应线圈与外坩埚之间的热保温层。
  7. 如权利要求6所述的高频感应蒸发源装置，其中，所述外坩埚的材料为钽、或石墨；所述内坩埚的材料为氧化铝、或氮化硼。
  8. 如权利要求5所述的高频感应蒸发源装置，还包括设于所述外坩埚下方的热电偶。
  9. 如权利要求1所述的高频感应蒸发源装置，其中，所述感应线圈的材料为铜。
  10. 如权利要求1所述的高频感应蒸发源装置，其中，使用过程中，通过工艺冷却水对感应线圈进行冷却，具体通过在其外侧设置冷却水通道并向冷却水通道内通入工艺冷却水而对感应线圈进行冷却；或者，
    所述感应线圈为螺旋环绕的中空管，通过向所述感应线圈内通入工艺冷却水而对感应线圈进行冷却。
  11. 一种高频感应蒸发源装置，包括用于承载蒸发材料的内坩埚、套 设于内坩埚外围的感应线圈、与所述感应线圈连接的射频发生器、及设于内坩埚内的射频诱导加热部件；
    所述感应线圈用于接收射频发生器发射的交变电流而产生感应磁场；
    所述射频诱导加热部件包括感应内核体，所述感应内核体具有导电性，在感应线圈的感应磁场中产生感应电流并生成热量，从而对蒸发材料进行加热；
    还包括设于内坩埚与感应线圈之间的外坩埚，所述内坩埚位于外坩埚内；
    还包括设于所述感应线圈与外坩埚之间的热保温层；
    还包括设于所述外坩埚下方的热电偶。
  12. 如权利要求11所述的高频感应蒸发源装置，其中，所述射频诱导加热部件还包括包覆电应内核体外表面的热传导层；
    所述感应内核体的材料为-钽、或石墨；所述热传导层的材料为氧化铝、氮化硼、或钛。
  13. 如权利要求12所述的高频感应蒸发源装置，其中，所述射频诱导加热部件整体为实心、或空心结构。
  14. 如权利要求12所述的高频感应蒸发源装置，其中，所述射频诱导加热部件整体为圆柱状、或板状。
  15. 如权利要求11所述的高频感应蒸发源装置，其中，所述外坩埚的材料为钽、或石墨；所述内坩埚的材料为氧化铝、或氮化硼。
  16. 如权利要求11所述的高频感应蒸发源装置，其中，所述感应线圈的材料为铜。
  17. 如权利要求11所述的高频感应蒸发源装置，其中，使用过程中，通过工艺冷却水对感应线圈进行冷却，具体通过在其外侧设置冷却水通道并向冷却水通道内通入工艺冷却水而对感应线圈进行冷却；或者，
    所述感应线圈为螺旋环绕的中空管，通过向所述感应线圈内通入工艺冷却水而对感应线圈进行冷却。
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