WO2018120360A1 - 全激光复合增材制造方法和装置 - Google Patents

全激光复合增材制造方法和装置 Download PDF

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Publication number
WO2018120360A1
WO2018120360A1 PCT/CN2017/073492 CN2017073492W WO2018120360A1 WO 2018120360 A1 WO2018120360 A1 WO 2018120360A1 CN 2017073492 W CN2017073492 W CN 2017073492W WO 2018120360 A1 WO2018120360 A1 WO 2018120360A1
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Prior art keywords
laser
laser light
mirror
molding
light source
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PCT/CN2017/073492
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English (en)
French (fr)
Inventor
张文武
焦俊科
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中国科学院宁波材料技术与工程研究所
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Application filed by 中国科学院宁波材料技术与工程研究所 filed Critical 中国科学院宁波材料技术与工程研究所
Priority to EP17887563.9A priority Critical patent/EP3563965B1/en
Priority to US16/475,100 priority patent/US11541480B2/en
Priority to JP2019536072A priority patent/JP6815522B2/ja
Publication of WO2018120360A1 publication Critical patent/WO2018120360A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/008—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating pressure combined with radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
    • B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present application relates to a material laser processing method, and belongs to the field of material processing.
  • Select Laser Melting can realize the formation of complex structural parts, but the forming precision is low, the surface finish is poor, and the resolution is low. Generally, subsequent processing is needed to improve the surface finish. Subsequent processing generally chooses two ways. One is to introduce machine addition and subtraction materials in additive manufacturing. This method can improve the macro-scale finish, but the tool reliability and durability are poor, and the resolution is low, especially for the micro-channel processing capability. Insufficient; the other is to introduce ultra-fast laser material reduction technology into laser additive manufacturing, which can realize the precision forming and processing of micro-channels of complex internal cavity structures.
  • a method for manufacturing a full-laser composite additive material is provided.
  • SLM laser selective melting
  • a laser precision encapsulation method is used to solve the problem of forming microchannels, especially overhanging surfaces of materials. It solves the problem of microchannel powder residue and meets the requirements of high precision, high gloss and high cleanliness of aerospace key components.
  • the addition and subtraction of the all-laser composite additive manufacturing method are all realized by laser. After the method is melt-molded by a laser selection to obtain a substrate, the pulsed laser is reduced on the substrate to form a cavity, and the cavity is packaged to obtain a molding material having an internal cavity structure.
  • the method comprises the steps of:
  • step b) etching the substrate obtained by step a) by laser II to form a groove structure;
  • Light II is a pulsed laser;
  • step b) covering the groove structure obtained in step b) with a prefabricated plate, and soldering and packaging the prefabricated plate by laser I to form a microchannel;
  • the laser light I is a continuous wave infrared laser or a pulsed infrared laser.
  • the laser light II comprises a solid pulse laser, a semiconductor pulsed laser, a gas pulsed laser, and the pulsed laser has a pulse width ranging from 1 femtosecond to 100 milliseconds.
  • the metal material comprises a high temperature alloy, a stainless steel, an aluminum alloy, a magnesium alloy, a copper alloy.
  • the high temperature alloy includes at least one of a nickel-based superalloy, a titanium-based superalloy, a tungsten alloy, and a niobium alloy.
  • the stainless steel refers to stainless steel other than the high temperature alloy.
  • the edge of the groove structure obtained in the step b) has a concave edge, the depth of the concave edge being consistent with the thickness of the prefabricated plate.
  • the depth of the concave edge is consistent with the thickness of the prefabricated plate to ensure that the packaged prefabricated plate is integrally embedded in the formed substrate, and the surface thereof is flat after packaging.
  • the step c) is to cover the groove structure obtained in the step b) with a precast plate of the same material as the base body, position it by an external mechanism, and apply a welding pressure to the prefabricated plate, and the laser I
  • the prefabricated plate is welded and packaged to obtain a molding material having a microchannel structure.
  • the prefabricated panel is a wall material of the same material as the substrate.
  • the external mechanism comprises a micro-machine arm and a motion platform; the welding pressure is applied in a mechanical manner, a pneumatic manner, or an electromagnetic manner.
  • an all-laser composite additive manufacturing apparatus On the basis of laser selective melting (SLM), a laser precision packaging method is used to solve the forming problem of the overhang surface, and the microchannel powder is solved. Residual problems meet the requirements of high precision, high gloss and high cleanliness of aerospace key components.
  • SLM laser selective melting
  • the addition and subtraction of the all-laser composite additive manufacturing device are achieved by laser.
  • the all-laser composite additive manufacturing apparatus includes a laser unit, a control unit, and a molding unit, wherein the laser unit is connected to the molding unit optical path, and the control unit is electrically connected to the laser unit and the molding unit, respectively;
  • the laser portion includes a first laser source and a second laser source
  • the molding portion includes a welded portion, and the welded portion is controlled by the control portion and the
  • the laser department is equipped with additive manufacturing.
  • the first laser source comprises a continuous wave infrared laser or a pulsed infrared laser.
  • the first laser source is a continuous wave infrared laser.
  • the second laser light source comprises a solid short pulse laser, a semiconductor short pulse laser, a gas short pulse laser, and the short pulse laser has a pulse width ranging from 1 femtosecond to 100 milliseconds.
  • the second laser source comprises a femtosecond pulse laser, a picosecond pulse laser, a nanosecond pulse laser, a microsecond pulse laser or a millisecond pulse laser.
  • the laser portion includes a first optical modulation system and a second optical modulation system;
  • the first optical modulation system is located on an outgoing laser light path of the first laser light source, and the first optical modulation system modulates a laser light emitted by the first laser light source;
  • the second optical modulation system is located on an outgoing laser beam path of the second laser source, and the second optical modulation system modulates laser light emitted by the second laser source.
  • the laser portion includes a first mirror
  • the first mirror is simultaneously located on the outgoing laser light path of the first laser light source and the second laser light source, and the first mirror transmits infrared light and reflects visible light;
  • the first laser light source is an infrared laser, and the emitted laser light of the first laser light source passes through the first optical modulation system, passes through the first mirror, and enters the molding portion;
  • the second laser light source is a visible light laser, and the emitted laser light of the second laser light source is reflected by the first mirror to the molding portion after passing through the second optical modulation system.
  • the light beam transmitted by the first laser light source through the first mirror and the light beam reflected by the first laser light source are in the same optical path.
  • the laser portion includes a second mirror
  • the second mirror is located on the outgoing laser light path of the second laser light source, and the emitted laser light of the second laser light source is reflected by the second mirror and is directed to the second optical modulation system.
  • the molding portion includes a molding cavity, a scanning galvanometer, a dusting system, and a motion system;
  • the welding portion includes a mechanical arm and a pressure applying portion, and the mechanical arm is manufactured by adding the material by the laser portion welding under the application of pressure by the pressure applying portion;
  • the pressure applying portion includes mechanical pressure, pneumatic pressure, and electromagnetic pressure
  • the molding cavity is provided with an air inlet for charging an inert gas and an air outlet for vacuuming;
  • the scanning galvanometer is located at the top of the molding cavity, and reflects the laser light emitted by the laser portion and is scanned to the bottom of the molding cavity;
  • the dusting system and the motion system are located at the bottom of the forming cavity.
  • control portion comprises a computer, a laser range finder, a third mirror and an image sensor;
  • the computer is electrically connected to the laser range finder and the image sensor respectively;
  • the third mirror is located on the optical path of the first laser source, and the first laser source emits light through the third mirror and the laser beam of the laser rangefinder through the third The beam reflected by the mirror is the same as the light path.
  • the first laser source is a 1064 nm continuous wave fiber laser
  • the second laser source is a 532 nm picosecond laser.
  • the all-laser composite additive manufacturing method and device provided by the present application combines laser selective melting, laser precision removal, and laser precision packaging to solve the problem of forming the overhang surface and the problem of microchannel powder residue, and satisfy the key to aerospace. High-precision, high-gloss, high-purity requirements for parts processing.
  • FIG. 1 is a schematic view showing a manufacturing process of an all-laser composite additive manufacturing apparatus according to an embodiment of the present application.
  • FIG. 2 is a flow chart showing the manufacture of an all-laser composite additive manufacturing apparatus according to an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a full laser composite additive manufacturing apparatus according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a full laser composite additive manufacturing apparatus according to an embodiment of the present application.
  • FIG. 1 The manufacturing process of the all-laser composite additive manufacturing apparatus of the present application is as shown in FIG. 1 , wherein:
  • Step S1 laser selective area melting (SLM): using infrared laser to perform 3D printing forming of complex structural parts;
  • Step S2 laser fine removal processing: using ultra-fast laser (femtosecond, picosecond), processing the groove structure on the 3D printing forming part in step S1, and performing laser polishing and finishing processing on the surface of the groove structure, Improve the finish of the wall and the bottom;
  • Step S3 laser precision encapsulation: placing the metal piece above the groove structure formed in step S2, and welding the position where the metal piece and the groove structure are in contact with the infrared laser to be precisely packaged, so that the metal piece and the metal piece are 3D printing matrix material metallurgical bonding to form microchannels;
  • Step S4 Laser Selective Melting (SLM): On the 3D printed base material packaged in step S3, the additive manufacturing is continued by the infrared laser until the processing is completed.
  • SLM Laser Selective Melting
  • FIG. 2 The micro-channel processing flow of the manufacturing process of the all-laser composite additive manufacturing apparatus of the present application is as shown in FIG. 2, specifically:
  • the 1064 nm infrared continuous wave laser performs SLM molding of the metal powder.
  • the groove structure is processed on the formed part by the 532 nm picosecond green laser, and the surface of the groove structure is laser polished and finished. The finish of the wall and bottom.
  • the micro-robot is a set of devices that automatically grab, place, and press, grab and place thin-walled materials, and apply welding pressure.
  • micro-robot collaborates with a 1064nm infrared continuous wave laser for precision packaging of thin-walled materials.
  • a 0.5 mm thick thin-walled material similar to the SLM molding material is grasped by a micro-robot, in a CCD visual positioning system ( With the aid of a CCD detector, it is placed precisely above the groove structure (microchannel) and pressure is applied, and the thin-walled material is welded and packaged by a 1064 nm infrared continuous wave laser.
  • the system sets up the CCD vision detection and laser ranging system to collect the shape features of the molding, and then according to the CAD model comparison, the closed-loop realizes automatic online dressing, cleaning, packaging and additive.
  • the metal powder is carried out by a 1064 nm infrared continuous wave laser.
  • SLM molding completes the microchannel processing process based on SLM molding. The above process is the manufacturing process of the all-laser composite additive manufacturing apparatus of one embodiment of the present application.
  • the apparatus includes: a laser part 2, a control part 4, and a molding part 6, the laser part 2 and The molding portion 6 is optically connected, and the control portion 4 is electrically connected to the laser portion 2 and the molding portion 6, respectively.
  • the laser section 2 includes a laser 20 and a laser 22.
  • the laser 20 is a continuous wave laser and the laser 22 is a short pulse laser.
  • the molding portion 6 includes a welded portion 68 that is controlled by the control portion 4 to cooperate with the laser portion 2.
  • the laser 20 is additively fabricated at the bottom of the forming portion 6 to produce a product substrate, and then the laser 22 is used to form a groove structure on the obtained product substrate, and the prefabricated metal plate is placed on the groove structure by the solder portion 68 and is laser-driven. 20 soldered package to obtain a microchannel structure.
  • the working mode is shown in Figure 1, where:
  • Step S1 laser selective area melting (SLM): 3D printing forming of complex structural parts by using laser 20;
  • Step S2 laser micro-removal processing: the laser 22 is an ultra-fast laser (femtosecond, picosecond), the groove structure is processed on the 3D printing forming part in step S1, and the surface of the groove structure is laser-polished and finished. Processing to improve the finish of the wall and bottom;
  • the laser 22 is an ultra-fast laser (femtosecond, picosecond)
  • the groove structure is processed on the 3D printing forming part in step S1
  • the surface of the groove structure is laser-polished and finished. Processing to improve the finish of the wall and bottom;
  • Step S3 laser precision encapsulation: the soldering portion 68 places the metal piece over the groove structure formed in step S2, and uses a laser 20 to solder the position where the metal piece contacts the groove structure to be precisely packaged, so that The metal sheet is metallurgically combined with the 3D printed base material to form a microchannel;
  • Step S4 Laser Selective Melting (SLM): On the 3D printed base material packaged in step S3, the additive manufacturing is continued by the infrared laser until the processing is completed.
  • SLM Laser Selective Melting
  • the present embodiment provides a specific all-laser composite additive manufacturing apparatus.
  • the present embodiment will be described in detail below with reference to the accompanying drawings.
  • FIG. 4 is a schematic structural view of a full laser composite additive manufacturing apparatus according to an embodiment of the present application. As shown in FIG. 4, the apparatus includes:
  • Laser portion 2 (not labeled in FIG. 4) includes laser 20, laser 22, optical modulator 240, optical modulator 242, mirror 260, and mirror 262.
  • the laser 20 is a continuous wave infrared laser, which uses a 1064 nm fiber laser for 3DSLM molding and precision packaging of complex components;
  • the laser 22 is a short pulse laser, and a 532 nm picosecond laser is selected for microchannel molding and polishing, fine Integrity.
  • the mirror 260 is an infrared light transmitting and visible light reflecting mirror.
  • the 1064 nm continuous wave infrared laser of the laser 20 can pass through the mirror 260, and the 532 nm picosecond green laser of the laser 22 is reflected by the mirror 260.
  • the control unit 4 (not labeled in FIG. 4) includes a computer 40, a range finder 42, a mirror 44, and a CCD detector 46.
  • the range finder 42 and the CCD detecting unit 46 are configured to acquire the shape features of the molding, and then perform automatic online trimming, cleaning, packaging, and additive according to the CAD model comparison and closed loop.
  • the molding portion 6 (not labeled in FIG. 4) includes a molding cavity 60, a scanning galvanometer 62, a powder spreading device 64, a motion system 66, and a welded portion 68.
  • the scanning galvanometer 62 is located at the entrance of the optical path at the top of the molding cavity 60, and reflects the laser beam emitted from the laser portion 2 toward the bottom of the molding cavity 60, and scans and manufactures the additive.
  • the side of the molding cavity 60 has an air inlet 600 for filling the molding chamber with an inert gas, and an air outlet 602 for extracting the gas in the molding chamber 60.
  • the scanning galvanometer 62 is a dual-wavelength scanning galvanometer.
  • the laser light emitted by the laser 20 and the laser 22 enters the molding cavity 60 containing the inert gas through the scanning galvanometer 62.
  • the two types of lasers realize time-sharing operation through the central control of the computer 40 system.
  • the laser beam emitted from the laser 20 passes through the mirror 44, and the mirror 44 is located on the outgoing light path of the laser 20.
  • the laser 20 emits light through the mirror 44, is modulated by the optical modulator 240, and is incident on the mirror 260.
  • Scanning galvanometer 62 reflects and scans at the bottom of molding cavity 60.
  • the range finder 42 is a laser range finder.
  • the ranging laser beam emitted from the range finder 42 is directed to the mirror 44 and reflected.
  • the reflected distance measuring laser beam is in the same optical path as the laser 20, so that the laser 20 is being measured. The distance at which the laser selective region is melted.
  • the powder spreading system 64 is a powder bed based powder spreading system, the bottom of which is a metal powder spreading system formed by laser selective melting technology (SLM).
  • SLM laser selective melting technology
  • the green laser light emitted from the laser 22 is reflected by the mirror 262, modulated by the optical modulator 242, and then reflected toward the mirror 260.
  • the welding portion 68 in the molding cavity 60 includes a set of micro-robots that are automatically grasped, placed, and pressed for gripping and placing the thin-walled material, and simultaneously pressing the thin-walled material to match the 1064 nm laser of the laser 20. Collaborative soldering for precision packaging.
  • the computer 40 of the control unit 4 is electrically connected to the laser 20, the laser 22, the optical modulator 240, and the optical modulator 242, respectively, to control the above components while being electrically connected to the CCD detector 46 to monitor the material processing in real time.
  • the laser 20 is additively fabricated at the bottom of the forming portion 6 to produce a product substrate, and then the laser 22 is used to form a groove structure on the obtained product substrate, and the prefabricated metal plate is placed on the groove structure by the solder portion 68 and is laser-driven. 20 soldered package to obtain a microchannel structure.
  • the working mode is shown in Figure 1, where:
  • Step S1 laser selective area melting (SLM): 3D printing forming of complex structural parts by using laser 20;
  • Step S2 laser micro-removal processing: the laser 22 is an ultra-fast laser (femtosecond, picosecond), the groove structure is processed on the 3D printing forming part in step S1, and the surface of the groove structure is laser-polished and finished. Processing to improve the finish of the wall and bottom;
  • the laser 22 is an ultra-fast laser (femtosecond, picosecond)
  • the groove structure is processed on the 3D printing forming part in step S1
  • the surface of the groove structure is laser-polished and finished. Processing to improve the finish of the wall and bottom;
  • Step S3 laser precision encapsulation: the soldering portion 68 places the metal piece over the groove structure formed in step S2, and uses a laser 20 to solder the position where the metal piece contacts the groove structure to be precisely packaged, so that The metal sheet is metallurgically combined with the 3D printed base material to form a microchannel;
  • Step S4 Laser Selective Melting (SLM): On the 3D printed base material packaged in step S3, the additive manufacturing is continued by the infrared laser until the processing is completed.
  • SLM Laser Selective Melting
  • the primary microchannel processing flow is as shown in FIG. 2.
  • the powder spreading system 64 is powdered at the bottom of the molding cavity 60
  • the 1040 nm infrared continuous wave fiber laser laser of the laser 20 is controlled by the computer 40, and
  • the scanning galvanometer 62 is reflected to the bottom of the molding cavity 60 and scanned for SLM molding of the metal powder, at which time the computer 40 controls the laser 22 to not start.
  • the picosecond green (532 nm) laser of the laser 22 is controlled by the computer 40 on the formed part
  • the groove structure is processed, and the surface of the groove structure is subjected to laser polishing and finishing processing with the aid of the range finder 42 and the CCD detector 46 to improve the smoothness of the wall surface and the bottom surface.
  • the molding cavity 60 is provided with a welding portion 68.
  • the welding portion 68 is a set of micro robot hands for automatically grasping, placing and pressing, for gripping, placing and pressing the thin wall material, and the laser of 1064 nm with the laser 20 Cooperating for precision packaging, specifically, after the laser 22 processes the groove structure (microchannel) on the formed part, a 0.5 mm thick thin-walled material similar to the SLM molding material is grasped by the micro-robot of the welded portion 68. With the aid of a visual positioning system (CCD detector 46), it is placed precisely above the groove structure (microchannel) and pressure is applied, and the laser 20 is controlled by the computer 40 to weld the thin wall material. The system sets up the CCD vision detection and laser ranging system to collect the shape features of the molding, and then according to the CAD model comparison, the closed-loop realizes automatic online dressing, cleaning, packaging and additive.
  • CCD detector 46 visual positioning system
  • the 1064 nm infrared continuous wave fiber laser laser of the laser 20 is controlled by the computer 40, and is reflected by the scanning galvanometer 62 to the bottom of the molding cavity 60 and scanned for SLM of the metal powder. Molding, complete the microchannel processing process based on SLM molding.
  • the above process is the manufacturing process of the all-laser composite additive manufacturing apparatus of one embodiment of the present application.

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Abstract

一种全激光复合增材制造方法，由激光选区熔化成型得到基体后，由脉冲激光在所述基体上减材成型以形成空腔，再对所述空腔封装，以得到具有内部空腔结构的成型材料。该方法在激光选区熔化的基础上，用激光精密封装的方法，解决悬垂面的成型问题，解决微通道粉体残留的问题，满足航空航天关键零部件加工高精度、高光洁度、高洁净度的要求。还公开了上述方法用到的装置，包括激光部（2）、控制部（4）和成型部（6），激光部与成型部光路连接，控制部分别与激光部和成型部电连接；激光部包括第一激光光源和第二激光光源；成型部包括焊接部（68），焊接部由控制部控制的方式与激光部配合增材制造。

Description

全激光复合增材制造方法和装置 技术领域
本申请涉及一种材料激光加工方法，属于材料加工领域。
背景技术
择性激光熔化技术(Select Laser Melting)可以实现复杂结构件的成形，但成形精度低、表面光洁度差、分辨率低，一般需要后续加工来提高表面的光洁度。后续加工一般选择两种方式，一种是在增材制造中引入机加减材，这种方法可提高宏观尺度光洁度，但刀具可靠性和耐久性差，分辨率低，特别对于微通道的加工能力不足；另一种是把超快激光减材技术引入激光增材制造中，这种方法可以实现复杂内腔结构件微通道的精密成形、加工。这两种方式都面临着微通道内部有粉体残留，通道上壁面粘粉、悬垂面加工困难的问题，影响到成形工件的最终使用效果，特别是在对加工质量要求严苛的航空航天关键零部件的制造上，该方法难以满足高光洁度、高洁净度、高精度的要求，另外，这两种方法都无法实现悬垂面的加工，限制了技术的应用领域。
发明内容
根据本申请的一个方面，提供了一种全激光复合增材制造方法，在激光选区熔化(SLM)的基础上，用激光精密封装的方法，解决材料内部微通道、尤其是悬垂面的成型问题，解决微通道粉体残留的问题，满足航空航天关键零部件加工高精度、高光洁度、高洁净度的要求。该全激光复合增材制造方法的增材与减材均由激光实现。该方法由激光选区熔化成型得到基体后，由脉冲激光在所述基体上减材成型以形成空腔，再对所述空腔封装，以得到具有内部空腔结构的成型材料。
优选地，所述方法包括如下步骤：
a)由激光I进行激光选区熔化得到金属材料的基体；
b)由激光II对步骤a)得到的所述基体刻蚀形成凹槽结构；所述激 光II为脉冲激光；
c)在步骤b)得到的所述凹槽结构上覆盖预制板，并由激光I对所述预制板焊接封装，形成微通道；
d)步骤c)得到的微通道结构上激光选区熔化成型，得到具有微通道结构的成型材料。
优选地，所述激光I为连续波红外激光器或脉冲红外激光器。
优选地，所述激光II包括固体脉冲激光器、半导体脉冲激光器、气体脉冲激光器，所述脉冲激光器的脉宽范围为1飞秒至100毫秒。
优选地，所述金属材料包括高温合金、不锈钢、铝合金、镁合金、铜合金。所述高温合金包括镍基高温合金、钛基高温合金、钨合金、铌合金中的至少一种。本申请中，所述不锈钢是指所述高温合金以外的不锈钢。
优选地，所述步骤b)得到的凹槽结构的边缘具有凹缘，所述凹缘的深度与所述预制板的厚度一致。所述凹缘的深度与所述预制板的厚度一致，以保证封装预制板整体嵌入成型的基体，封装后其表面平整。
优选地，所述步骤c)为在步骤b)得到的所述凹槽结构上覆盖与基体相同材料的预制板，通过外部机构进行定位、并对预制板施加焊接压力，并由激光I对所述预制板焊接封装，得到具有微通道结构的成型材料。
进一步优选地，所述预制板为与基体相同材料的壁材料。
进一步优选地，所述外部机构包括微型机器臂、运动平台；焊接压力的施加方式包括机械方式、气动方式、电磁方式。
根据本申请的又一个方面，提供了一种全激光复合增材制造装置，在激光选区熔化(SLM)的基础上，用激光精密封装的方法，解决悬垂面的成型问题，解决微通道粉体残留的问题，满足航空航天关键零部件加工高精度、高光洁度、高洁净度的要求。该全激光复合增材制造装置的增材与减材均由激光实现。该全激光复合增材制造装置包括激光部、控制部和成型部，所述激光部与所述成型部光路连接，所述控制部分别与所述激光部和所述成型部电连接；
所述激光部包括第一激光光源和第二激光光源；
所述成型部包括焊接部，所述焊接部由所述控制部控制的方式与所述 激光部配合增材制造。
优选地，所述第一激光光源包括连续波红外激光器或脉冲红外激光器。作为一个具体的实施方式，所述第一激光光源为连续波红外激光器。
优选地，所述第二激光光源包括固体短脉冲激光器、半导体短脉冲激光器、气体短脉冲激光器，所述短脉冲激光器的脉宽范围为1飞秒至100毫秒。
优选地，所述第二激光光源包括飞秒脉冲激光器、皮秒脉冲激光器、纳秒脉冲激光器、微秒脉冲激光器或毫秒脉冲激光器。
优选地，所述激光部包括第一光学调制系统和第二光学调制系统；
所述第一光学调制系统位于所述第一激光光源的出射激光光路上，所述第一光学调制系统调制所述第一激光光源射出的激光；
所述第二光学调制系统位于所述第二激光光源的出射激光光路上，所述第二光学调制系统调制所述第二激光光源射出的激光。
进一步优选地，所述激光部包括第一反射镜；
所述第一反射镜同时位于所述第一激光光源和所述第二激光光源的出射激光光路上，所述第一反射镜透射红外光且反射可见光；
所述第一激光光源为红外激光，所述第一激光光源的出射激光经过所述第一光学调制系统后射向并透过所述第一反射镜后进入所述成型部；
所述第二激光光源为可见光激光，所述第二激光光源的出射激光经过所述第二光学调制系统后由所述第一反射镜反射向所述成型部。
所述第一激光光源透过所述第一反射镜后的光束与所述第二激光光源被所述第一反射镜反射后的光束同光路。
进一步优选地，所述激光部包括第二反射镜；
所述第二反射镜位于所述第二激光光源的出射激光光路上，所述第二激光光源的出射激光经过所述第二反射镜反射后射向所述第二光学调制系统。
优选地，所述成型部包括成型腔、扫描振镜、铺粉系统、运动系统；
所述焊接部包括机械臂和压力施加部，所述机械臂在所述压力施加部施加压力的情况下通过所述激光部焊接以增材制造；
所述压力施加部包括机械施压、气动施压、电磁施压；
所述成型腔具备用于充入惰性气体的进气口和用于抽真空的出气口；
所述扫描振镜位于所述成型腔的顶部，反射所述激光部射出的激光并以扫描的方式射向所述成型腔的底部；
所述铺粉系统和所述运动系统位于所述成型腔的底部。
优选地，所述控制部包括计算机、激光测距仪、第三反射镜和图像传感器；
所述计算机分别与所述激光测距仪和所述图像传感器电连接；
所述第三反射镜位于所述第一激光光源射出光线的光路上，所述第一激光光源射出光线透过所述第三反射镜与所述激光测距仪的激光光束经所述第三反射镜反射后的光束同光路。
作为一个具体的实施方式，所述第一激光光源为1064nm连续波光纤激光器，所述第二激光光源为532nm皮秒激光器。
本申请能产生的有益效果包括：
本申请所提供的全激光复合增材制造方法和装置，将激光选区熔化、激光精密去除、激光精密封装融合在一起，解决悬垂面的成型问题、微通道粉体残留的问题，满足航空航天关键零部件加工高精度、高光洁度、高洁净度的要求。
附图说明
图1为本申请一种实施方式的全激光复合增材制造装置的制造过程示意图。
图2为本申请一种实施方式的全激光复合增材制造装置的制造流程图。
图3为本申请一种实施方式的全激光复合增材制造装置示意图。
图4为本申请一种实施方式的全激光复合增材制造装置示意图。
部件和附图标记列表：
附图标记 部件名称
2 激光部
20 激光器
附图标记 部件名称
22 激光器
240 光学调制器
242 光学调制器
260 反射镜
262 反射镜
4 控制部
40 计算机
42 测距仪
44 反射镜
46 CCD检测器
6 成型部
60 成型腔
600 进气口
602 出气口
62 扫描振镜
64 铺粉系统
66 运动系统
68 焊接部
具体实施方式
下面结合实施例详述本申请，但本申请并不局限于这些实施例。
如无特别说明，本申请的实施例中的原料和部件均通过商业途径购买。
实施例1
下面将结合附图，对本申请的优选实施例进行详细的描述。本申请的全激光复合增材制造装置的制造过程如图1所示，其中：
步骤S1、激光选区熔化(SLM)：采用红外激光进行复杂结构件的3D打印成形；
步骤S2、激光微细去除加工：采用超快激光(飞秒、皮秒)，在步骤S1中3D打印成形件上加工凹槽结构，并对所述凹槽结构表面进行激光抛光、精整加工，提高壁面和底面的光洁度；
步骤S3、激光精密封装：将金属片放置在步骤S2中形成的所述凹槽结构上方，采用红外激光对所述金属片与凹槽结构相接触的位置进行焊接以精密封装，使得金属片与3D打印基体材料冶金结合，形成微通道；
步骤S4、激光选区熔化(SLM)：在步骤S3封装完成的3D打印基体材料上，利用红外激光继续进行增材制造，直至完成加工。
实施例2
下面将结合附图，对本申请的优选实施例进行详细的描述。本申请的全激光复合增材制造装置的制造过程的一次微通道加工流程如图2所示，具体而言：
铺粉系统完成金属粉末铺粉后，1064nm红外连续波激光器进行金属粉末的SLM成型。
然后在测距仪和CCD视觉系统(CCD检测器)的辅助下，由532nm皮秒绿光激光在成形件上加工凹槽结构，对所述凹槽结构表面进行激光抛光、精整加工，提高壁面和底面的光洁度。
微型机器手为一套自动抓取、放置、施压的装置，其抓取、放置薄壁材料，并施加焊接压。
微型机器手与1064nm红外连续波激光器协作进行薄壁材料精密封装。
具体而言，1064nm红外连续波激光器在成形件上加工凹槽结构(微通道)后，由微型机器手抓取一块0.5mm厚的与SLM成型材料相同的薄壁材料，在CCD视觉定位系统(CCD检测器)的辅助下，精密放置在凹槽结构(微通道)上方，并施加压力，由1064nm红外连续波激光器对所述薄壁材料进行焊接封装。系统设置CCD视觉检测与激光测距系统，用于采集成型特征形貌，然后根据CAD模型比对，闭环实现自动化在线修整、清理、封装和增材。
再由铺粉系统铺粉后，由1064nm红外连续波激光器进行金属粉末的 SLM成型，完成一次SLM成型基础上的微通道加工过程。以上过程即为本申请一种实施方式的全激光复合增材制造装置的制造过程。
实施例3
下面将结合附图，对本申请的优选实施例进行详细的描述。
图3为本申请一种实施方式的全激光复合增材制造装置的结构示意图，如图3所示，该装置包括：包括激光部2、控制部4和成型部6，所述激光部2与所述成型部6光路连接，所述控制部4分别与所述激光部2和所述成型部6电连接。
所述激光部2包括激光器20和激光器22。激光器20为连续波激光，激光器22为短脉冲激光。
所述成型部6包括焊接部68，所述焊接部68由所述控制部4控制，与所述激光部2配合工作。
激光器20在成型部6的底部增材制造产品基底，然后由激光器22在得到的产品基底上经减材形成凹槽结构，再由焊接部68将预制金属板放置在凹槽结构上并由激光器20焊接封装，得到微通道结构。具体而言，工作方式如图1所示，其中：
步骤S1、激光选区熔化(SLM)：采用激光器20进行复杂结构件的3D打印成形；
步骤S2、激光微细去除加工：激光器22为超快激光(飞秒、皮秒)，在步骤S1中3D打印成形件上加工凹槽结构，并对所述凹槽结构表面进行激光抛光、精整加工，提高壁面和底面的光洁度；
步骤S3、激光精密封装：焊接部68将金属片放置在步骤S2中形成的所述凹槽结构上方，采用激光器20对所述金属片与凹槽结构相接触的位置进行焊接以精密封装，使得金属片与3D打印基体材料冶金结合，形成微通道；
步骤S4、激光选区熔化(SLM)：在步骤S3封装完成的3D打印基体材料上，利用红外激光继续进行增材制造，直至完成加工。
实施例4
在实施例3的基础上，本实施例提供了一种具体的全激光复合增材制造装置，下面将结合附图，对本实施例进行详细的描述。
图4为本申请一种实施方式的全激光复合增材制造装置的结构示意图，如图4所示，该装置包括：
激光部2(图4中未标记)，其包括激光器20、激光器22、光学调制器240、光学调制器242、反射镜260、反射镜262。其中，激光器20为连续波红外激光，选用1064nm光纤激光器，用于复杂构件的3DSLM成型以及精密封装；激光器22为短脉冲激光，选择532nm的皮秒激光器，用于微通道的成型以及抛光、精整等。反射镜260为红外光透射、可见光反射型反射镜，激光器20的1064nm连续波红外激光可透过反射镜260，激光器22的532nm皮秒绿光激光会被反射镜260反射。
控制部4(图4中未标记)，其包括计算机40、测距仪42、反射镜44、CCD检测器46。测距仪42和CCD检测部46，用于采集成型特征形貌，然后根据CAD模型比对，闭环实现自动化在线修整、清理、封装和增材。
成型部6(图4中未标记)，其包括成型腔60、扫描振镜62、铺粉装置64、运动系统66、焊接部68。其中，扫描振镜62位于成型腔60顶部的光路入口，将激光部2发射来的激光光束反射向成型腔60的底部，并扫描以增材制造。成型腔60侧面具有进气口600和出气口602，进气口600用于向成型腔内充入惰性气体，出气口602用于将成型腔60中的气体抽出。
扫描振镜62为一台双波长扫描振镜，激光器20和激光器22射出的激光通过扫描振镜62进入含有惰性气体的成型腔60，两类激光通过计算机40系统的中央控制实现分时工作。
激光器20射出的激光先经过反射镜44，反射镜44位于激光器20的出射光路上，激光器20射出光线透过反射镜44，经光学调制器240调制后射向并透过反射镜260后，经扫描振镜62反射并在成型腔60底部扫描。测距仪42为激光测距仪，测距仪42发出的测距激光光束射向反射镜44并被反射，反射后的测距激光光束与激光器20射出的激光同光路，以测量激光器20正在进行激光选区熔化的部位的距离。
铺粉系统64是基于粉末床的铺粉系统，其底部为采用激光选区熔化技术(SLM)金属成型的金属粉末铺布系统。
激光器22射出的绿光激光经反射镜262反射后，经光学调制器242调制后射向反射镜260后反射。
成型腔60内的焊接部68包括一套自动抓取、放置、施压的微型机器手，用于封装薄壁材料的抓取、放置，同时对薄壁材料施压以配合激光器20的1064nm激光协作焊接进行精密封装。
控制部4的计算机40分别与激光器20、激光器22、光学调制器240、光学调制器242电连接，以控制上述部件，同时和CCD检测器46电连接，以实时监测材料加工的情况。
激光器20在成型部6的底部增材制造产品基底，然后由激光器22在得到的产品基底上经减材形成凹槽结构，再由焊接部68将预制金属板放置在凹槽结构上并由激光器20焊接封装，得到微通道结构。工作方式如图1所示，其中：
步骤S1、激光选区熔化(SLM)：采用激光器20进行复杂结构件的3D打印成形；
步骤S2、激光微细去除加工：激光器22为超快激光(飞秒、皮秒)，在步骤S1中3D打印成形件上加工凹槽结构，并对所述凹槽结构表面进行激光抛光、精整加工，提高壁面和底面的光洁度；
步骤S3、激光精密封装：焊接部68将金属片放置在步骤S2中形成的所述凹槽结构上方，采用激光器20对所述金属片与凹槽结构相接触的位置进行焊接以精密封装，使得金属片与3D打印基体材料冶金结合，形成微通道；
步骤S4、激光选区熔化(SLM)：在步骤S3封装完成的3D打印基体材料上，利用红外激光继续进行增材制造，直至完成加工。
具体而言，本实施例中，一次微通道加工流程如图2所示，铺粉系统64在成型腔60底部铺粉后，由计算机40控制激光器20的1064nm红外连续波光纤激光激光器工作，由扫描振镜62反射至成型腔60底部并扫描，进行金属粉末的SLM成型，此时计算机40控制激光器22不启动。
由计算机40控制激光器22的皮秒绿光(532nm)激光，在成形件上 加工凹槽结构，在测距仪42和CCD检测器46的辅助下对所述凹槽结构表面进行激光抛光、精整加工，提高壁面和底面的光洁度。
成型腔60内设焊接部68，焊接部68为一套自动抓取、放置、施压的微型机器手，用于封装薄壁材料的抓取、放置，并施压，与激光器20的1064nm激光协作进行精密封装，具体而言，激光器22在成形件上加工凹槽结构(微通道)后，由焊接部68的微型机器手抓取一块0.5mm厚的与SLM成型材料相同的薄壁材料，在视觉定位系统(CCD检测器46)的辅助下，精密放置在凹槽结构(微通道)上方，并施加压力，由计算机40控制激光器20对所述薄壁材料进行焊接封装。系统设置CCD视觉检测与激光测距系统，用于采集成型特征形貌，然后根据CAD模型比对，闭环实现自动化在线修整、清理、封装和增材。
再由铺粉系统64在成型腔60底部铺粉后，由计算机40控制激光器20的1064nm红外连续波光纤激光激光器工作，由扫描振镜62反射至成型腔60底部并扫描，进行金属粉末的SLM成型，完成一次SLM成型基础上的微通道加工过程。以上过程即为本申请一种实施方式的全激光复合增材制造装置的制造过程。
以上所述，仅是本申请的几个实施例，并非对本申请做任何形式的限制，虽然本申请以较佳实施例揭示如上，然而并非用以限制本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案的范围内，利用上述揭示的技术内容做出些许的变动或修饰均等同于等效实施案例，均属于技术方案范围内。

Claims (10)

  1. 一种全激光复合增材制造方法，其特征在于，激光选区熔化成型得到基体后，由脉冲激光在所述基体上减材成型以形成空腔，再对所述空腔封装，以得到具有内部空腔结构的成型材料。
  2. 根据权利要求1所述的方法，其特征在于，包括如下步骤：
    a)由激光I进行激光选区熔化得到金属材料的基体；
    b)由激光II对步骤a)得到的所述基体刻蚀形成凹槽结构；所述激光II为脉冲激光；
    c)在步骤b)得到的所述凹槽结构上覆盖预制板，并由激光I对所述预制板焊接封装，形成微通道；
    d)步骤c)得到的微通道结构上激光选区熔化成型，得到具有微通道结构的成型材料。
  3. 根据权利要求2所述的方法，其特征在于，所述激光I为连续波红外激光器或脉冲红外激光器；
    优选地，所述激光II包括固体脉冲激光器、半导体脉冲激光器、气体脉冲激光器，所述脉冲激光器的脉宽范围为1飞秒至100毫秒。
  4. 根据权利要求2所述的方法，其特征在于，所述金属材料包括高温合金、不锈钢、铝合金、镁合金、铜合金。
  5. 根据权利要求2所述的方法，其特征在于，所述步骤b)得到的凹槽结构的边缘具有凹缘，所述凹缘的深度与所述预制板的厚度一致；
    优选地，所述步骤c)为在步骤b)得到的所述凹槽结构上覆盖与基体相同材料的预制板，通过外部机构进行定位、并对预制板施加焊接压力，并由激光I对所述预制板焊接封装，得到具有微通道结构的成型材料。
  6. 根据权利要求5所述的方法，其特征在于，所述外部机构包括微型机器臂、运动平台；焊接压力的施加方式包括机械方式、气动方式、电磁方式。
  7. 一种采用权利要求1至6任一项所述方法的全激光复合增材制造装置，其特征在于，所述装置包括激光部、控制部和成型部，所述激光部与所述成型部光路连接，所述控制部分别与所述激光部和所述成型部电连 接；
    所述激光部包括第一激光光源和第二激光光源；
    所述成型部包括焊接部，所述焊接部由所述控制部控制的方式与所述激光部配合增材制造。
  8. 根据权利要求7所述的装置，其特征在于，所述第一激光光源包括连续波红外激光器或脉冲红外激光器；
    所述第二激光光源包括固体短脉冲激光器、半导体短脉冲激光器、气体短脉冲激光器，所述短脉冲激光器的脉宽范围为1飞秒至100毫秒；
    优选地，所述第二激光光源包括飞秒脉冲激光器、皮秒脉冲激光器、纳秒脉冲激光器、微秒脉冲激光器或毫秒脉冲激光器。
  9. 根据权利要求7所述的装置，其特征在于，所述激光部包括第一光学调制系统和第二光学调制系统；
    所述第一光学调制系统位于所述第一激光光源的出射激光光路上，所述第一光学调制系统调制所述第一激光光源射出的激光；
    所述第二光学调制系统位于所述第二激光光源的出射激光光路上，所述第二光学调制系统调制所述第二激光光源射出的激光；
    优选地，所述激光部包括第一反射镜；
    所述第一反射镜同时位于所述第一激光光源和所述第二激光光源的出射激光光路上，所述第一反射镜透射红外光且反射可见光；
    所述第一激光光源为红外激光，所述第一激光光源的出射激光经过所述第一光学调制系统后射向并透过所述第一反射镜后进入所述成型部；
    所述第二激光光源为可见光激光，所述第二激光光源的出射激光经过所述第二光学调制系统后由所述第一反射镜反射向所述成型部；
    优选地，所述激光部包括第二反射镜；
    所述第二反射镜位于所述第二激光光源的出射激光光路上，所述第二激光光源的出射激光经过所述第二反射镜反射后射向所述第二光学调制系统。
  10. 根据权利要求7所述的装置，其特征在于，所述成型部包括成型腔、扫描振镜、铺粉系统、运动系统；
    所述焊接部包括机械臂和压力施加部，所述机械臂在所述压力施加部 施加压力的情况下通过所述激光部焊接以增材制造；
    所述压力施加部包括机械施压、气动施压、电磁施压；
    所述成型腔具备用于充入惰性气体的进气口和用于抽真空的出气口；
    所述扫描振镜位于所述成型腔的顶部，反射所述激光部射出的激光并以扫描的方式射向所述成型腔的底部；
    所述铺粉系统和所述运动系统位于所述成型腔的底部；
    优选地，所述控制部包括计算机、激光测距仪、第三反射镜和图像传感器；
    所述计算机分别与所述激光测距仪和所述图像传感器电连接；
    所述第三反射镜位于所述第一激光光源射出光线的光路上，所述第一激光光源射出光线透过所述第三反射镜与所述激光测距仪的激光光束经所述第三反射镜反射后的光束同光路；
    优选地，所述第一激光光源为1064nm连续波光纤激光器，所述第二激光光源为532nm皮秒激光器。
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