Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
  • B64D13/00—Arrangements or adaptations of air-treatment apparatus for aircraft crew or passengers, or freight space
  • B64D13/006—Arrangements or adaptations of air-treatment apparatus for aircraft crew or passengers, or freight space the air being used to cool structural parts of the aircraft
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
  • B64D33/00—Arrangement in aircraft of power plant parts or auxiliaries not otherwise provided for
  • B64D33/08—Arrangement in aircraft of power plant parts or auxiliaries not otherwise provided for of power plant cooling systems
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U10/00—Type of UAV
  • B64U10/10—Rotorcrafts
  • B64U10/13—Flying platforms
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U20/00—Constructional aspects of UAVs
  • B64U20/80—Arrangement of on-board electronics, e.g. avionics systems or wiring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U20/00—Constructional aspects of UAVs
  • B64U20/90—Cooling
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U20/00—Constructional aspects of UAVs
  • B64U20/90—Cooling
  • B64U20/92—Cooling of avionics
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U20/00—Constructional aspects of UAVs
  • B64U20/90—Cooling
  • B64U20/96—Cooling using air
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U30/00—Means for producing lift; Empennages; Arrangements thereof
  • B64U30/20—Rotors; Rotor supports
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U30/00—Means for producing lift; Empennages; Arrangements thereof
  • B64U30/20—Rotors; Rotor supports
  • B64U30/29—Constructional aspects of rotors or rotor supports; Arrangements thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U50/00—Propulsion; Power supply
  • B64U50/10—Propulsion
  • B64U50/13—Propulsion using external fans or propellers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
  • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
  • F28D2021/0021—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for aircrafts or cosmonautics

Definitions

• This disclosure relates generally to unmanned aerial vehicles (UAVs), and more specifically, but not exclusively, to passive cooling for UAVs.
• Small UAV systems (sometimes referred to as drones) generate a lot of heat from CPU, GPU, DDR, WiFi, GPS, PMIC, Video/ISP, and Camera Sensor components.
• This heat poses a significant thermal management challenge to achieve reliable operations of the UAV in harsh environments because high junction temperature, high ambient temperature (40°C), and radiation from the sun become major thermal barriers to achieve high performance.
• skin temperature is also a design constraint as most UAV manufacturers request 45 -55°C as the maximum allowable touch surface temperature to allow users to hold the UAV to preview the camera images, for example.
• a passive cooling apparatus comprises: a pipe with a fin and a fluid, the fin located on a top of the pipe in a first location; a heat source attached to the top of the pipe in a second location, the second location space a first distance from the first location; a propeller located above the fin; and a wick structure along an inner surface of the pipe, the wick structure configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.
• a passive cooling apparatus comprises: means for heat transfer, the means for heat transfer configured to transfer heat from a second location to a first location spaced a first distance from the second location; means for heat dissipation, the means for heat dissipation located on a top of the means for heat transfer in the first location; means for heat conduction, the means for heat conduction located in the means for heat transfer; means for air flow, the means for air flow located above the means for heat dissipation; and means for liquid containment along an inner surface of the means for heat transfer, the means for liquid containment configured to allow the means for heat conduction to travel within the means for liquid containment and to allow a vapor form of the means for heat conduction to exit the means for liquid containment towards a center of the means for heat transfer.
• a UAV comprises: a body; a pipe with a fin and a fluid, the fin located on a top of the pipe in a first location outside the body and the pipe extends from inside the body to outside the body; a heat source attached to the top of the pipe in a second location inside the body, the second location space a first distance from the first location; a propeller located above the fin; and a wick structure along an inner surface of the pipe, the wick structure configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.
• FIG. 1 illustrates one example of a pipe for passive cooling in accordance with some examples of the disclosure
• FIG. 2 illustrates one example of an UAV with a pipe for passive cooling in accordance with some examples of the disclosure
• FIG. 3 illustrates one example of an UAV with four propellers and a plurality of pipes for passive cooling in accordance with some examples of the disclosure
• FIG. 4 illustrates one example of an UAV with four propellers and two straight pipes for passive cooling in accordance with some examples of the disclosure
• FIG. 5 illustrates one example of an UAV with four propellers and an H shaped pipe for passive cooling in accordance with some examples of the disclosure
• FIG. 6 illustrates one example of an UAV with four propellers, two unconnected
• FIG. 7 illustrates one example of an UAV with a pipe for passive cooling in accordance with some examples of the disclosure.
• FIGS. 8A-G illustrate examples of heat sink configurations in accordance with some examples of the disclosure.
• the exemplary methods, apparatus, and systems disclosed herein mitigate shortcomings of the conventional methods, apparatus, and systems, as well as other previously unidentified needs.
• Some examples in this disclosure provide an innovative passive cooling solution with a sealed UAV enclosure system that is lightweight and allows the heat to be dissipated from a semiconductor chip to the ambient environment very efficiently without fan cooling while enabling a hermetic structure of the UAV to maximize system reliability and protect electronics from moisture, dust, and corrosive chemicals.
• One example includes a pipe with a fin located on a top of the pipe outside the UAV enclosure under a propeller, a fluid inside the pipe, and a wick structure along an inner surface of the pipe.
• the wick structure configured to allow the fluid to travel within the wick structure from a heat source inside the UAV enclosure where a vapor form of the fluid is generated by the heat from the heat source and exits the wick structure towards a center of the pipe. The vapor then travels in the center of the pipe to the fin location where the fin helps extract the heat and cause the vapor to condense back into the liquid within the wick structure.
• FIG. 1 illustrates one example of a pipe for passive cooling in accordance with some examples of the disclosure.
• a passive cooling apparatus 105 may include a pipe 105, a heat source 110 (e.g. a semiconductor die, a memory chip, a battery, etc.) located in a second location that transfers heat 111 to the pipe 105, a heat sink 140 (e.g. a bar shaped fin, a pin fin, or a plurality of pin or bar shaped fins, etc.) located in a first location that removes heat 111 from the pipe 105, a wick structure 150 along an inner surface of the pipe 105, and a fluid 120 inside the wick structure 150.
• a heat source 110 e.g. a semiconductor die, a memory chip, a battery, etc.
• a heat sink 140 e.g. a bar shaped fin, a pin fin, or a plurality of pin or bar shaped fins, etc.
• the passive cooling apparatus 100 may be viewed as having three sections - an evaporator section 160 near the heat source 110, a condenser section 170 near the heat sink 140, and an adiabatic section 180 between the evaporator section 160 and the condenser section 170.
• the fluid 120 is converted to a vapor 130 and exits the wick structure to the center of pipe 105.
• the adiabatic section 180 the vapor 130 travels towards the condenser section 170 in the center of the pipe because of the adiabatic expansion occurring in the evaporator section 160 while the liquid 120 travels towards the evaporator section 160 in the wick structure 150.
• the condenser section 170 the vapor 130 is converted back to a liquid 120 and moves into the wick structure 150.
• the pipe 105 may be approximately 2-4 mm in width and have a round, oval, square, or rectangular circumference, for example.
• the pipe 105 may be a straight pipe, an L shaped pipe, an H shaped pipe, or a T shaped pipe, for example.
• the pipe 105 may have an extremely high thermal conductivity of 10k W/m-K, for example.
• the pipe 105 may be composed of aluminum, copper, plastic materials, or a combination of these materials depending on the desired tradeoff between weight and cooling performance.
• the thickness of the pipe 105 may be varied along the axial direction of the pipe 105 with some portions thicker and some portions thinner to accommodate available space inside the UAV and different chipset heights.
• the heat pipe thickness may vary from 0.5mm to 5mm.
• the wick structure 150 may be a honeycomb, mesh, fiber, or powder filled micro-scaled wick structure that acts as a passive pump allowing vapor to exit the wick structure 150 and allowing liquid to enter the wick structure 150 as well as travel inside from a first section to the second section in an adiabatic process.
• the heat sink 140 may be a pin fin or plurality of pin fins, a bar shaped fin or a plurality of bar shaped fins, or similar shapes that remove heat 111 from pipe 105 for dissipation outside the pipe 105.
• the heat sink 140 may be composed of aluminum, copper, plastic materials, or a combination of these materials depending on the desired tradeoff between weight and cooling performance.
• the heat source 110 may be a semiconductor chip, a logic chip, a memory chip, a battery, or a similar device that produces heat 111.
• the heat source 110 may be attached directly to the pipe 105 to allow heat 111 to transfer from the heat source 110 to the pipe 105 or may be attached with a thermally conductive adhesive.
• FIG. 2 illustrates one example of an UAV with a pipe for passive cooling in accordance with some examples of the disclosure.
• a UAV passive cooling apparatus 200 may include a pipe 205 (e.g. pipe 105), a semiconductor chip 210 mounted on the pipe 205 in a second location, a first plurality of fins 240 mounted on the pipe 205 in a first location, and a second plurality of fins 242 mounted on the pipe 205 in a third location.
• the pipe 205 enables heat 211 from the semiconductor chip 210 to travel in the pipe 205 from the second location to both the first plurality of fins 240 in the first location and the second plurality of fins 242 in the third location.
• the UAV passive cooling apparatus 200 may include a first propeller 220 located above the first plurality of fins 240, a second propeller 222 located above the second plurality of fins 242.
• the first plurality of fins 220 and the second plurality of fins 222 may provide forced convective cooling air 221 at the first plurality of fins 240 and the second plurality of fins 242 respectively to dissipate heat from heat pipe to ambient air with a bulk airflow of approximately 45 CFM.
• the UAV passive cooling apparatus 200 may include a boom 230 extending to either side of a body enclosure 260 that houses a printed circuit board 250 attached to the semiconductor chip 210 opposite the pipe 205.
• the body enclosure 260 may be plastic or aluminum, for example, and may be hermetically sealed to protect the printed circuit board 250 and the semiconductor chip 210 from moisture, dust, and corrosive chemicals.
• the boom 230 may be plastic or aluminum, for example, and supports the portion of the pipe 205 extending outside body enclosure 260 as well as the first propeller 220 and the second propeller 222.
• FIG. 3 illustrates one example of an UAV with four propellers and a plurality of pipes for passive cooling in accordance with some examples of the disclosure.
• a UAV 300 e.g. UAV 200
• a pipe 305 e.g. pipe 105 or pipe 205
• first plurality of fins 340 mounted on the pipe 305 in a first location
• a second plurality of fins 342 mounted on the pipe 305 in a second location
• a third plurality of fins 344 mounted on the pipe 305 in a third location
• the UAV 300 may include a body enclosure 360, a camera 335 mounted on the front of the body enclosure 360, and a battery 365 mounted on the top of the body enclosure 360.
• the UAV 300 may include a first propeller 320 mounted on a first boom 330 above the first plurality of fins 340, a second propeller 322 mounted on a second boom 332 above the second plurality of fins 342, a third propeller 324 mounted on a third boom 334 above the third plurality of fins 344, and a fourth propeller 326 mounted on a fourth boom 336 above the fourth plurality of fins 346.
• propellers may be used. While four booms (e.g. boom 230) are shown in Figure 3, it should be understood that more or less booms may be used depending on the number of propellers or plurality of fins. While four separate plurality of fins (e.g. first plurality of fins 240 or second plurality of fins 242) are shown in Figure 3, it should be understood that more or less pluralities may be used and each plurality of fins may include one or more fins. While a single heat pipe 305 is illustrated in Figure 3, it should be understood that one or more separate heat pipes may be used.
• FIG. 4 illustrates one example of an UAV with four propellers and two straight pipes for passive cooling in accordance with some examples of the disclosure.
• a UAV 400 e.g. UAV 300
• the UAV 400 may include a first propeller 420 mounted on one end of the first pipe 405, a second propeller 422 mounted on an opposite end of the first pipe 405, a third propeller 424 mounted on one end of the second pipe 406, and a fourth propeller 426 mounted on an opposite end of the second pipe 406.
• the UAV 400 may include a first semiconductor chip 410 (e.g. heat source 110) mounted on the first pipe 405, a second semiconductor chip 412 (e.g. heat source 110) mounted on the first pipe
• a third semiconductor chip 414 (e.g. heat source 110) mounted on the second pipe
• first pipe 405 and the second pipe 406 are illustrated as straight rectangular pipes, other shapes may be used such as oval, curved, for example, and the pipes may be physically and or fluidly connected.
• FIG. 5 illustrates one example of an UAV with four propellers and an H shaped pipe for passive cooling in accordance with some examples of the disclosure.
• a UAV 500 e.g. UAV 400
• the UAV 500 may include a first propeller 520 mounted on one end of the pipe 505, a second propeller 522 mounted on a second end of the pipe 505, a third propeller 524 mounted on a third end of the pipe 505, and a fourth propeller 526 mounted on a fourth end of the pipe 505.
• the UAV 500 may include a first semiconductor chip 510 (e.g. heat source 110) mounted on the pipe 505, a second semiconductor chip 512 (e.g. heat source 110) mounted on the pipe 505, and a third semiconductor chip 514 (e.g. heat source 110) mounted on the pipe 505. While three chips are illustrated in Figure 5, more or less chips may be used and the locations may not be only along the central portion of the pipe 405. While the pipe 505 is illustrated as an H shaped rectangular pipe, other shapes may be used such as oval, curved, for example, and the pipe may be physically and or fluidly connected.
• a first semiconductor chip 510 e.g. heat source 110
• second semiconductor chip 512 e.g. heat source 110
• a third semiconductor chip 514 e.g. heat source 110
• FIG. 6 illustrates one example of an UAV with four propellers, two unconnected L shaped pipes, and two connected L shaped pipes for passive cooling in accordance with some examples of the disclosure.
• a UAV 600 e.g. UAV 500
• the UAV 600 may include a first propeller 620 mounted on one end of the first pipe 605, a second propeller 622 mounted on one end of the second pipe 606, a third propeller 624 mounted on one end of the third pipe 607, and a fourth propeller 626 mounted on an opposite end of the third pipe 607.
• the UAV 600 may include a first semiconductor chip 610 (e.g. heat source 110) mounted on the first pipe 605, a second semiconductor chip 612 (e.g. heat source 110) mounted on the first pipe 605, a third semiconductor chip 613 (e.g. heat source 110) mounted on the second pipe 606, a fourth semiconductor chip 614 (e.g. heat source 110) mounted on the second pipe 606, a fifth semiconductor chip 615 (e.g.
• first pipe 605 and the second pipe 606 are illustrated as L shaped rectangular pipes and the third pipe 607, other shapes may be used such as oval, curved, for example, and the pipes may be physically and or fluidly connected.
• FIG. 7 illustrates one example of an UAV with a pipe for passive cooling in accordance with some examples of the disclosure.
• a UAV passive cooling apparatus 700 may include means for heat transfer 705 (e.g. pipe 105) configured to transfer heat 711 from a second location to a first location and a third location spaced from the second location, a semiconductor chip 710 mounted on the means for heat transfer 705 in the second location, first means for heat dissipation 740 (e.g. heat sink 140) located on a top of the means for heat transfer 705 in the first location, a second means for heat dissipation 742 (e.g. heat sink 142) located on a top of the means for heat transfer 705 in the third location,
• first means for heat dissipation 740 e.g. heat sink 140
• a second means for heat dissipation 742 e.g. heat sink 142 located on a top of the means for heat transfer 705 in the third location
• the means for heat transfer 705 enables heat 711 from the semiconductor chip
• the UAV passive cooling apparatus 700 may include a first means for air flow 720 (e.g. first propeller propeller 220) located above the first means for heat dissipation 740, a second means for air flow 722 (e.g. second propeller 222) located above the second means for heat dissipation 742.
• a first means for air flow 720 e.g. first propeller propeller 220
• a second means for air flow 722 e.g. second propeller 222 located above the second means for heat dissipation 742.
• the first means for air flow 720 and the second means for air flow 722 may provide forced convective cooling air 721 at the first means for heat dissipation 740 and the second means for heat dissipation 742 respectively to dissipate heat 711 from the means for heat transfer 705 to ambient air with a bulk airflow of approximately 45 CFM.
• the UAV passive cooling apparatus 700 may include a boom 730 extending to either side of a body enclosure 760 that houses a printed circuit board 750 attached to the semiconductor chip 710 opposite the means for heat transfer 705.
• the body enclosure 760 may be plastic or aluminum, for example, and may be hermetically sealed to protect the printed circuit board 750 and the semiconductor chip 710 from moisture, dust, and corrosive chemicals.
• the boom 730 may be plastic or aluminum, for example, and supports the portion of the means for heat transfer 705 extending outside body enclosure 760 as well as the first means for air flow 720 and the second means for air flow 722.
• the UAV 700 may include a means for heat conduction 701 (e.g. liquid 120 and vapor 130), the means for heat conduction 701 may be located in the means for heat transfer 705, and a means for liquid containment (e.g.
• the means for liquid containment may be configured to allow the means for heat conduction 701 to travel within the means for liquid containment and to allow a vapor form of the means for heat conduction 701 to exit the means for liquid containment towards a center of the means for heat transfer 705.
• the various components illustrated in Figure 7 may be more or less than shown.
• FIGS 8A-G illustrate examples of heat sink (e.g. heat sink 140, 240, 242, 340,
• one configuration may include a plurality of circular heat sinks 140 arranged in rows and columns inline.
• one configuration may include a plurality of circular heat sinks 140 arranged in staggered rows and columns.
• one configuration may include a plurality of square heat sinks 140 arranged in rows and columns inline.
• one configuration may include a plurality of square heat sinks 140 arranged in staggered rows and columns.
• one configuration may include a plurality of rectangular or plate like heat sinks 140 arranged in staggered rows and columns.
• one configuration may include a plurality of oval or elliptical heat sinks 140 arranged in staggered rows and columns.
• one configuration may include a plurality of rectangular or plate like heat sinks 140 arranged in parallel.
• FIGS. 1-8G may be rearranged and/or combined into a single component, process, feature or function or embodied in several components, processes, or functions. Additional elements, components, processes, and/or functions may also be added without departing from the disclosure. It should also be noted that FIGS. 1-8G and its corresponding description in the present disclosure is not limited to dies and/or ICs. In some implementations, FIGS. 1-8G and its corresponding description may be used to manufacture, create, provide, and/or produce integrated devices.
• a device may include a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package on package (PoP) device, and/or an interposer.
• IC integrated circuit
• IC integrated circuit
• PoP package on package
• exemplary is used herein to mean “serving as an example, instance, or illustration.” Any details described herein as “exemplary” is not to be construed as advantageous over other examples. Likewise, the term “examples” does not mean that all examples include the discussed feature, advantage or mode of operation. Furthermore, a particular feature and/or structure can be combined with one or more other features and/or structures. Moreover, at least a portion of the apparatus described hereby can be configured to perform at least a portion of a method described hereby.
• connection means any connection or coupling, either direct or indirect, between elements, and can encompass a presence of an intermediate element between two elements that are “connected” or “coupled” together via the intermediate element.
• any reference herein to an element using a designation such as “first,” “second,” and so forth does not limit the quantity and/or order of those elements. Rather, these designations are used as a convenient method of distinguishing between two or more elements and/or instances of an element. Also, unless stated otherwise, a set of elements can comprise one or more elements.
• a block or a component of a device should also be understood as a corresponding method action or as a feature of a method action.
• aspects described in connection with or as a method action also constitute a description of a corresponding block or detail or feature of a corresponding device.
• Some or all of the method actions can be performed by a hardware apparatus (or using a hardware apparatus), such as, for example, a microprocessor, a programmable computer or an electronic circuit. In some examples, some or a plurality of the most important method actions can be performed by such an apparatus.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Aviation & Aerospace Engineering (AREA)
• Remote Sensing (AREA)
• Sustainable Development (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• General Engineering & Computer Science (AREA)
• Life Sciences & Earth Sciences (AREA)
• Combustion & Propulsion (AREA)
• Chemical & Material Sciences (AREA)
• General Health & Medical Sciences (AREA)
• Pulmonology (AREA)
• Health & Medical Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

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• 2016
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