WO2018113671A1 - A jig for surface modification processes - Google Patents
A jig for surface modification processes Download PDFInfo
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- WO2018113671A1 WO2018113671A1 PCT/CN2017/117212 CN2017117212W WO2018113671A1 WO 2018113671 A1 WO2018113671 A1 WO 2018113671A1 CN 2017117212 W CN2017117212 W CN 2017117212W WO 2018113671 A1 WO2018113671 A1 WO 2018113671A1
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- WIPO (PCT)
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- abutment
- abutment portions
- jig
- items
- clamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Definitions
- the invention relates to the securing of items during surface modification processes.
- this invention relates to a jig for clamping and/or partially masking one or more items, a kit comprising such a jig, a method of operating such a jig, and a method of surface modification utilising such a jig.
- a technical field in which there are specific concerns around masking is that of coating electronic devices, for example touchscreen devices, using a vapour deposition process. Whilst applying coatings to such devices can bring great benefits, such as liquid repellence (see for example WO2007/083122) , parts of the device may benefit from remaining uncoated. Such parts may include, without limitation, electrical contacts, exterior surfaces and screens. The functionality of aesthetic of such parts may be affected if they are not effectively masked during coating.
- the invention provides a jig for securing one or more items during a surface modification, the jig comprising one or more abutment portions that can be separated from a support portion to facilitate replacement of the abutment portions.
- a first aspect of the invention provides a jig for securing one or more items during a surface modification process, the jig comprising first and second inserts configurable in a clamping configuration in which one or more items are clamped therebetween, wherein at least one of the first and second inserts comprises a support portion carrying one or more abutment portions arranged to abut one or more items located between the first and second inserts in the clamping configuration, the one or more abutment portions being separable from their respective support portion to facilitate replacement of the one or more abutment portions.
- This arrangement enables the abutment portions to be replaced without modification being required to the rest of the jig.
- the abutment portions may be replaced if they become worn or perished during use.
- the jig may be adaptable to accommodate items of different sizes, shapes and configurations by installing abutment portions adapted for a particular item.
- the inserts may be removable from the jig or may be permanently or semi-permanently fixed to the jig in such a way that ready removal is not contemplated.
- the support portion (s) may be generally plate-like in configuration, i.e. having a width and length that are significantly greater than its thickness.
- the support portion (s) may have a generally planar inner face, i.e. an inwardly-facing face.
- first and second inserts each comprise a support portion and one or more abutment portions.
- the support portions may be arranged in a fixed, predetermined position relative to one another in the clamping configuration. Alternatively, it may be possible to vary a position of the support portions relative to one another in the clamping configuration.
- Each abutment portion may be arranged to abut a respective one of a plurality of items in the clamping configuration.
- an abutment portion of the first insert and an abutment portion of the second insert are arranged relative to one another such that a respective one of a plurality of items are sandwiched therebetween in the clamping configuration.
- at least one of the abutment portions is arranged to provide a clamping force to urge said at least one abutment portion towards the other of the abutment portions to clamp the item therebetween.
- the one or more abutment portions comprise a resiliently deformable material.
- a good seal can be readily provided between the abutment portion and an item which it abuts.
- compression of the resiliently deformable material may provide a clamping force to urge the abutment portion into contact with the item.
- the or each support portion has a first interlock feature and the or each abutment portion has a second interlock feature, the first and second interlock features having an interlocked configuration in which they are engaged with each other to lock the or each abutment portion to its respective support portion, and an unlocked configuration in which the or each abutment portion is separated from its respective support portion.
- the abutment portions can be readily removed from the support portion (s) and replaced.
- the first interlock feature comprises one or more first formations in the respective support portion and the second interlock feature comprises one or more corresponding second formations in the respective abutment portion, each of the one or more first formations engaging a respective one of the one or more second formations in the interlocked configuration.
- the first interlock feature may comprise a recess in the respective support portion and the second interlock feature may comprise a corresponding protrusion extending from the respective abutment portion, the protrusion extending into the recess in the interlocked configuration.
- the first and second interlock features are able to engage with one another in a plurality of different arrangements in the interlocked configuration.
- the position of each abutment portion with respect to the support portion can be altered to modify the jig to accommodate differently configured items.
- the first interlock feature may comprise a plurality of first formations
- the second interlock feature may comprise at least one second formation
- the at least one second formation may be able to engage with any of the plurality of first formations in the interlocked configuration.
- the one or more abutment portions comprise a material having a Shore A hardness of 50A or more or 70A or less, preferably 60A or less. Materials within this range have been found to provide an appropriate degree of deformation to achieve a good seal.
- Examples of appropriate materials for the one or more abutment portions include elastomeric materials, for example fluorinated elastomers.
- fluorinated elastomers include fluoroelastomers (FKM) , perfluoro-elastomers (FFKM) , or tetrafluoroethylene/propylene rubbers (FEPM) .
- FKM fluoroelastomers
- FFKM perfluoro-elastomers
- FEPM tetrafluoroethylene/propylene rubbers
- a particular advantage of fluorinated elastomers is that they are low-or zero-outgassing materials, and therefore suitable for exposure to surface modification conditions.
- the one or more abutment portions are preferably arranged to provide a clamping force to one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process.
- a clamping force is applied in a clamping direction which is typically normal to an inner face of the support portion (s) .
- the clamping force may be generated by compression of the abutment portion itself, e.g. by compression of an elastically deformable region of the abutment portion.
- the jig may comprise one or more resilient members arranged to urge the abutment portions into abutment with one or more items located between the first and second inserts in the clamping configuration.
- the one or more resilient members may each comprise a spring such as a compression spring, or a member comprising an elastically deformable material such as an elastomeric material.
- At least one of the one or more abutment portions comprises an abutment surface arranged to mask one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process.
- the abutment surface may be provided on a peripheral protrusion defining a region to be masked, the peripheral protrusion being arranged to abut the item in use.
- the one or more abutment portions may have an abutment surface for abutting one or more items located between the first and second inserts in the clamping configuration, the abutment surface having a surface profile corresponding to the one or more items.
- the abutment surface may comprise one or more protrusions or recesses configured to engage with one or more features of an item.
- the abutment surface may permit indexing, or location, of an item relative to the respective insert.
- the abutment surface may be provided on a peripheral protrusion arranged to abut an item, the peripheral protrusion defining a region to be masked during a surface modification process.
- the first or second insert includes a plurality of abutment portions arranged side-by-side, each abutment portion being arranged to abut a respective item of a plurality of items to be exposed to a surface modification process.
- the first and second inserts may be sized to permit a plurality of items to be located side-by-side therebetween in the clamping configuration.
- a plurality of items can be exposed to surface modification conditions at once. This arrangement provides for a particularly efficient configuration in which high chamber loadings can be achieved.
- the first and/or second inserts may comprise one or more indexing features configured to locate an item to be subjected to a surface modification process relative to the jig.
- the first and/or second inserts comprise a plurality of indexing features, each indexing feature being configured to locate an item to be subjected to a surface modification process relative to the jig so that a plurality of items are located side-by-side.
- each of the one or more indexing features comprises an abutment surface as described above.
- the support portion of the first and/or second insert is preferably generally rigid, and optionally comprises a material selected from polymers, metallic materials, and combinations thereof.
- the jig may further comprise clamping means for urging the first and second inserts into the clamping configuration.
- Such clamping means may comprise one or more pairs of clamping formations having an interlocked configuration in which the jig is in the clamping configuration and an unlocked configuration in which the jig is not in the clamping configuration.
- the one or more pairs of clamping formations may engage one another via an interference fit in the interlocked configuration.
- the jig may further comprise one or more catches for locking the jig in the clamping configuration.
- the first insert is preferably movable relative to the second insert to permit loading and unloading of items from the jig.
- the first insert may be connected to the second insert via a hinged joint permitting pivoting of the first insert relative to the second insert.
- the one or more abutment portions of the first or second insert may comprise a plurality of discrete abutment members separable from their respective support portion.
- the discrete abutment members may each have an abutment region with a width dimension that decreases in a clamping direction to a narrowest portion providing an abutment surface arranged to abut one or more items located between the first and second inserts in the clamping configuration.
- the abutment region may have a generally frusto-conical shape.
- the abutment region may comprise an elastically deformable material, such as an elastomeric material, compression of which is able to provide a clamping force.
- the one or more abutment portions of the first or second insert each comprise a plurality of abutment features projecting therefrom to provide a plurality of abutment surfaces arranged to abut one or more items located between the first and second inserts in the clamping configuration.
- a clamping force may be applied to multiple regions and/or locations of an item.
- multiple regions of an item may be masked byasingle abutment portion.
- the or each one or more abutment portions of the first or second inserts may comprise first and second attachment formations arranged to provide an interconnection with the respective support portion, the first and second attachment formations being arranged to locate an abutment surface of the respective abutment portion at different positions relative to the respective support portion. That is, the first attachment formation may be arranged to locate the abutment surface at a first distance from the support portion, the second attachment formation may be arranged to locate the abutment surface at a second distance from the support portion, the second distance being less than the first distance.
- the jig is able to accommodate items of different thicknesses simply by rearranging the abutment portions. For example, the difference between the first distance and the second distance may equal a difference between thicknesses of first items and second items to be held by the jig.
- a second aspect of the invention provides a method of holding one or more items in a jig according to the first aspect during a surface modification process, the method including:
- the second aspect of the invention may comprise operation of any of the features of the jig described herein.
- a third aspect of the invention provides a kit comprising a jig according to the first aspect, and one or more replacement abutment portions arranged to replace the one or more abutment portions, the replacement abutment portions being arranged to be carried by the respective support portion to abut one or more items located between the first and second inserts in the clamping configuration.
- the abutment portions can be replaced with replacement abutment portions.
- the abutment portions may be replaced if they become worn or perished during use.
- the jig may be adaptable to accommodate items of different sizes, shapes and configurations by installing abutment portions adapted for a particular item. This is particularly desirable in embodiments where the support portions of the first and second inserts are arranged in a fixed, predetermined position relative to one another in the clamping configuration.
- the replacement abutment portions may have any features of the abutment portions defined in the aspects described herein, including those defined in relation to the first aspect.
- the replacement abutment portions may be substantially identical to the abutment portions, for example to provide a direct replacement in the event of wear or perishing of the abutment portions.
- the replacement abutment portions may have a different dimension in the clamping direction than the abutment portions. That is, the dimension may be a distance between (an inner face of) the support portion and an abutment surface of the respective abutment portion.
- the replacement abutment portions may have a differently configured abutment surface to that of the abutment portions.
- the abutment portions may be configured to abut one or more items having a first configuration and the replacement portions may be configured to abut one or more items having a second configuration different to the first configuration. In this way, the jig can be used to accommodate items having different configurations.
- a fourth aspect of the invention provides a method of operating a kit according to the third aspect (or a method of operating a jig according to the first aspect) , the method including:
- the surface modification process may suitably be sub-atmospheric, i.e. involve exposure of the one or more masked items to sub-atmospheric pressures.
- the sub-atmospheric pressure may be in the range of from 0.01 to 999.99 mbar, such as in the range of from 0.1 to 999.99 mbar, e.g. in the range of from 0.5 to 999.99 mbar.
- the surface modification process is a sub-atmospheric vapour deposition process, in particular a plasma polymerisation process.
- Surface modification conditions may, for example, be vapour deposition conditions.
- the surface modification conditions may comprise sub-atmospheric pressure.
- the vapour deposition conditions are plasma polymerisation conditions.
- Surface modification conditions may optionally comprise: an excitation medium; and a monomer that is at least partly activated by the excitation medium to form a liquid repellent coating on the item.
- the excitation medium may in particular comprise a plasma, optionally a pulsed plasma.
- the monomer may be a compound of formula (I) :
- R1, R2 and R3 are independently selected from hydrogen, alkyl, haloalkyl or aryl optionally substituted by halo; and R4 is a group X-R5 where R5 is an alkyl or haloalkyl group and X is a bond;
- X is a group of formula -C (O) O (CH2) nY, where n is an integer of from 1 to 10 and Y is a bond or a sulphonamide group; or X is a group
- the workpiece may be exposed to a plasma comprising a monomer compound for a period of time sufficient to allow a protective polymeric coating to form on a surface of the workpiece; wherein the monomer compound has the following formula (II) :
- R1, R2 and R4 are each independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl or halo alkyl or aryl optionally substituted by halo, and R3 is selected from:
- each X is independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl, halo alkyl or aryl optionally substituted by halo; and n1 is an integer from 1 to 27.
- the monomer may be as identified in the claims of WO 2007/083122.
- the monomer may be selected from 1H, 1H, 2H, 2H-perfluorohexyl acrylate (PFAC4) , 1H, 1H, 2H, 2H-perfluorooctyl acrylate (PFAC6) , 1H, 1H, 2H, 2H-perfluorodecyl acrylate (PFAC8) and 1H, 1H, 2H, 2H-perfluorododecyl acrylate (PFAC10) .
- PFAC4 1H, 1H, 2H, 2H-perfluorohexyl acrylate
- PFAC6 1H, 1H, 2H, 2H-perfluorooctyl acrylate
- PFAC8 1H, 1H, 2H, 2H-perfluorodecyl acrylate
- PFAC10 1H, 1H, 2H, 2H-perfluorododecyl acrylate
- the masked item may be exposed to the monomer compound in combination with a crosslinking agent comprising two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500 °C.
- the crosslinking reagent may be selected, for example from 1, 4-butanediol divinyl ether (BDVE) , 1, 4-cyclohexanedimethanol divinyl ether (CDDE) , 1, 7-octadiene (17OD) , 1, 2, 4 -trivinylcyclohexane (TVCH) , divinyl adipate (DVA) , 1, 3-divinyltetramethyldisiloxane (DVTMDS) , diallyl 1, 4-cyclohexanedicarboxylate (DCHD) , 1, 6-divinylperfluorohexane (DVPFH) , 1H, 1H, 6H, 6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis (diallyl acetal) (GBDA) .
- BDVE 4-butanediol divinyl ether
- CDDE 4-cyclohexaned
- the surface modification conditions may lead to a coating that may advantageously be liquid repelling, e.g. water and/or oil repelling.
- the one or more items may be of any desired type.
- the one or more items comprise one or more electronic devices or electronic components.
- the one or more items may comprise one or more touchscreen devices, in particular smart phones or tablet computers.
- at least the touchscreen of such devices may be masked.
- the one or more items may in particular comprise a layered screen, for example an LCD screen, e.g. a TFT screen.
- Fig. 1 shows an isometric view of a jig according to an embodiment of the present invention in a loading configuration
- Fig. 2 shows a rear isometric view of the jig of Fig. 1, with portions of the frame omitted;
- Fig. 3 shows the jig according to Fig. 1 with a plurality of devices loaded therein;
- Figs. 4A and 4B show inner and outer faces, respectively, of a lower insert of the jig of Fig. 1;
- Figs. 5A and 5B show inner and outer faces, respectively, of an upper insert of the jig of Fig. 1, in which the biasing connectors are shown in phantom for clarity;
- Fig. 6 shows an exploded view of the jig of Fig. 1;
- Fig. 7 shows a rear isometric view of the jig of Fig. 1 with the support portion of the upper insert omitted;
- Fig. 8 shows a partial section view of the jig of Fig. 1;
- Figs 9A, 9B, 9C, 9D and 9E show plan, side and isometric views, respectively, of the jig of Fig. 1 in a clamping configuration
- Fig. 10 shows a detail view of the biasing connectors of the upper insert of the jig of Fig. 1;
- Fig. 11 shows an isometric view of a jig according to another embodiment of the invention in a loading configuration
- Fig. 12 shows a rear isometric view of the jig of Fig. 11;
- Fig. 13 shows the jig according to Fig. 11 with a plurality of devices loaded therein;
- Figs. 14A and 14B show inner and outer faces, respectively, of a lower insert of the jig of Fig. 11;
- Figs. 15A and 15B show inner and outer faces, respectively, of an upper insert of the jig of Fig. 11;
- Fig. 16 shows an exploded view of the jig of Fig. 11;
- Fig. 17 shows a partial section view of the jig of Fig. 11;
- Figs 18A, 18B, 18C, 18D and 18E show plan, side and isometric views, respectively, of the jig of Fig. 11 in a clamping configuration
- Fig. 19 shows a detail view of the abutment portions of the upper insert of the jig of Fig. 11.
- Jigs according to the invention may be used to mask one or more surface regions of items during a surface modification process, and/or to clamp one or more surface regions of items during a surface modification process, via one or more abutment portions.
- the items are electronic mobile devices such as smart phones or tablets.
- the one or more masking and/or clamping abutment portions are applied to both major faces of each device, for example to obscure the screen and one or more regions of the back cover of each device, while in others the one or more masking and/or clamping abutment portions are applied to only one face of each device.
- the embodiment illustrated in Figures 1 to 10 provides a jig 100 in which regions of both the front and the back faces of each of a plurality (nine in this embodiment) of mobile devices 10.
- the jig 100 comprises an upper insert 20 and lower insert 40 between which the devices 10 are held.
- the lower insert 40 comprises a generally rectangular, rigid, plate-like support portion 42 which is releasably secured to a rigid frame 50.
- the rigid frame 50 comprises first 52a and second 52b elongate beams, first 54a, second 54b and third 54ccatch assemblies, and four hinge members 58.
- the catch assemblies 54a, 54b, 54c are arranged so that a first longitudinal edge of the lower insert 40 is clamped between the first elongate beam 52a and the catch assemblies so that the elongate beam 52a abuts an outer face of the lower insert 40 and the catch assemblies abut an inner face thereof.
- a second longitudinal edge of the lower insert 40 is clamped between the second elongate beam 52b and the hinge members 58 so that the second elongate beam 52b abuts the outer face of the lower insert 40 and the hinge members abut the inner face.
- the upper insert 20 comprises a generally rectangular, rigid, plate-like support portion 22, which in the illustrated embodiment is formed from an assembly of three plates attached in series.
- the upper insert 20 is attached via a hinge joint to the hinge members 58 to enable it to pivot between a clamping configuration (shown in Figures 9A-E) in which the upper and lower inserts are generally parallel to one another and the devices 10 are clamped therebetween, and a loading configuration (shown in Figure 1) in which the upper insert 20 is rotated away from the lower insert 40 to enable the devices 10 to be loaded into or removed from the jig 100.
- the upper insert 20 comprises a plurality (six in this embodiment) of clamping protrusions 23, each of which comprises a generally cylindrical member that projects from an inner face of the upper insert 20 in a direction substantially perpendicular, or normal, to that inner face.
- Each clamping protrusion 23 engages a corresponding clamping bore 55 in a respective one of the catch assemblies 54a, 54b, 54c via an interference fit.
- the catch assemblies 54a, 54b, 54c each comprise a pair of catches 56 that are operable to engage an edge of the upper insert 20 to lock the upper insert 20 in the clamping configuration.
- the upper 20 and lower 40 inserts each comprise a plurality (nine in this embodiment) of abutment portions 24, 44 which are each urged against a respective region of a respective device 10 in the clamping configuration to thereby mask that region during a surface modification process.
- the lower insert 40 comprises nine lower abutment portions 44, each of which is releasably attached to the support portion 42 to enable the lower abutment portions 44 to be replaced, for example, when they have become worn or perished through use, or to enable the jig 100 to be used to hold other devices 10 having a different overall shape or configuration.
- the abutment portions 44 may be replaced with a plurality of equivalent abutment portions having a different thickness in the clamping direction, at least in the region of the abutment surface that abuts a device 10 in use. That is, the jig 100 may be used for clamping devices 10 having different thicknesses by varying the thickness (the dimension in the clamping direction between the inner surface of the support portion 42 and the abutment surface) of the lower abutment portions.
- the lower abutment portions 44 each comprise a plurality of generally cylindrical interlock protrusions (not shown) which engage with a corresponding plurality of interlock bores (blind bores in this embodiment; not shown) in the support portion 42 via an interference fit to interlock the lower abutment portions 44 with the support portion 42.
- used lower abutment portions 44 can be peeled away from the support portion 42 when replacement is required, and replacement lower abutment portions 44 can be readily interlocked with the support portion 42 by urging the lower abutment portions 44 towards the support portion until each interlock protrusion is fully engaged in a respective interlock bore.
- Each lower abutment portion 44 of the lower insert 40 has an abutment surface, i.e. the surface arranged to abut a respective device 10 in the clamping configuration, with a surface profile that corresponds to a screen face of the respective device 10.
- each lower abutment portion 44 has a continuous peripheral rim 45 that encloses a recessed region 46 within which the device 10 is seated in the clamping configuration. This arrangement reduces material costs and also the potential for outgassing. Effective masking is still provided because the peripheral region forms a sealing periphery around the central region.
- the upper insert 20 comprises nine upper abutment portions 24, each of which cooperates with a corresponding one of the lower abutment portions 44.
- each of the nine upper abutment portions 24 is releasably attached to the support portion 22 of the upper insert 20 to enable replacement thereof.
- the upper abutment portions 24 may be replaced when they have become worn or perished through use, or to enable the jig 100 to be used to hold other devices 10 having a different overall shape or configuration.
- the abutment portions 24 may be replaced with a plurality of equivalent abutment portions having a different thickness in the clamping direction, at least in the region of the abutment surface that abuts a device 10 in use. That is, the jig 100 may be used for clamping devices 10 having different thicknesses by varying the thickness (the dimension in the clamping direction between the inner surface of the support portion 22 and the abutment surface) of the upper abutment portions.
- Each upper abutment portion 24 is connected to the support portion 22 of the upper insert 20 via four biasing connectors 30.
- Each biasing connector 30 comprises a resilient spring 32 coiled around a rigid pin 34.
- the pin 34 is connected to the support portion 22, via a rigid connection such as a threaded joint in a hole 36 through the support portion 22, so that it extends substantially normal, or perpendicular, to the support portion 22 and engages a corresponding blind hole 36 in the upper abutment portion 24.
- the springs 32 each act to bias the respective upper abutment portions 24 away from the support portion 22 when the jig 100 is in the clamping configuration. A limited degree of sliding of the pin 34 within the blind hole 36 facilitates this biasing action.
- each upper abutment portion 24 of the upper insert 20 has an abutment surface, i.e. the surface arranged to abut a respective device 10 in the clamping configuration, with a surface profile that corresponds to a back cover of the respective device 10.
- each upper abutment portion 24 has a continuous peripheral rim 25 that encloses a recessed region 26 within which the device 10 is seated in the clamping configuration. This arrangement reduces material costs and also the potential for outgassing. Effective masking is still provided because the peripheral region forms a sealing periphery around the central region.
- the upper abutment portions 24 also each have two generally circular apertures 28, each of which is configured to encircle a corresponding feature of the respective device 10, in this case a camera lens and LED light source window.
- a peripheral rim encircles each aperture 28 to form a sealing periphery around the aperture.
- the lower 44 and upper 24 abutment portions thus serve to obscure a majority of each device 10, with the only regions remaining unobscured being the apertures 28 and a continuous peripheral strip subtended by the rims 25, 45 of the abutment portions.
- the abutment portions thus serve to mask an entirety of each device 10 with the exception of the camera lens, LED light source window, and the joint (s) between screen, back cover and main body of the device.
- the biasing action of the biasing connectors 30, in combination with the clamping action of the clamping pins 23, ensures that there is a vapour tight seal between the devices 10 and their respective abutment portions 44, 24 and that the devices 10 are securely clamped to help them retain their structural integrity, particularly during sub-atmospheric surface modification processes.
- the support portions 22, 42 and frame 50 are typically formed from a rigid material such as a metallic material, for example aluminium.
- a rigid material such as a metallic material, for example aluminium.
- the support portion 22 of the upper support 20 comprises an array of perforations 60, or through holes, which permit ready exposure of each of the devices during a surface modification process.
- the peripheral gaps between the upper 20 and lower 40 inserts also facilitate such exposure.
- the perforations 60 may be used to secure the upper abutment portions 24 to the support portion 22.
- each of the biasing connectors 30 may be connected to a respective one of the perforations 60. In this way, the position and/or orientation of each upper abutment portion 24 may be modified by interconnecting the biasing connectors 30 with different ones of the perforations 60.
- Each of the lower abutment portions 44 and upper abutment portions 24 (or at least, the abutment surface of each abutment portion) is formed from an elastomer having a Shore A hardness of between 50A and 70A, preferably between 50A and 60A.
- a suitable elastomer is a fluorinated elastomer such as FKM or FFKM. Such fluorinated elastomers have the particular benefit of being low-or zero-outgassing.
- the deformable nature of the elastomeric material enables a good seal to be provided between each device 10 and its respective lower and upper abutment portions in the clamping configuration as the device 10 is urged into a sealing contact with the abutment surfaces thereof.
- the clamping force may serve to retain the structural integrity of the devices 10 during a surface modification process, in particular such processes where a sub-atmospheric surface modification process is employed, in order to prevent peeling, delamination or other damage to the devices.
- the upper 24 and/or lower 44 abutment portions may comprise a rigid substrate (e.g. a metallic substrate such as an aluminium substrate) with a layer of elastomeric material thereon to provide the abutment surface of the abutment portion.
- a rigid substrate e.g. a metallic substrate such as an aluminium substrate
- each abutment portion may be formed entirely from the elastomeric material.
- the jig 100 is first arranged in the loading configuration (shown in Figure 1) and a plurality of devices 10 located therein such that each device 10 is nestled within the recess 46 of a respective lower abutment portion 44.
- the upper insert 20 is then pivoted until the clamping protrusions 23 each fully engage their corresponding bores 55.
- the jig 100 is then in the clamping configuration (shown in Figures 9A-E) , such that the abutment surfaces of the upper 24 and lower 44 abutment portions are urged into a vapour tight seal with the devices 10, thereby masking those parts of the devices 10 obscured by the abutment portions.
- a clamping force is also applied to each of the devices 10 in the clamping configuration.
- the catches 56 are closed to ensure that the jig remains in the clamping configuration until they are released.
- the loaded jig 100 may be exposed to surface modification conditions, e.g. vapour deposition conditions by placing it in a plasma polymerisation deposition chamber, as discussed further below.
- the surface modification conditions may provide a barrier coating such as a waterproof, water repellent or water resistant coating.
- FIGS 11 to 19 illustrate a jig 200 according to a second embodiment of the invention.
- only one face of each device 10 is masked; in this embodiment it is the screen of the device that is masked.
- the jig 200 of this embodiment shares many features in common with the jig 100 of the first embodiment, and the description above of such common features applies equally to the second embodiment.
- the only features of the jig 200 of the second embodiment that are different to those of the jig 100 of the first embodiment are those concerning the upper insert, which in the second embodiment is denoted by the reference numeral 120 and is described further below.
- the upper insert 120 of the second embodiment comprises a generally rectangular, rigid, plate-like support portion 122, which in the illustrated embodiment is formed from an assembly of three plates attached in series.
- the upper insert 120 is attached via a hinge joint to the hinge members 58 to enable it to pivot between a clamping configuration (shown in Figures 18A-E) in which the upper and lower inserts are generally parallel to one another and the devices 10 are clamped therebetween, and a loading configuration (shown in Figure 11) in which the upper insert 120 is rotated away from the lower insert 40 to enable the devices 10 to be loaded into or removed from the jig 200.
- the support portion 122 of the upper insert 120 of the second embodiment has a plurality of linear slots 130, in this embodiment arranged in three side-by-side columns of eight slots 130.
- Each slot 130 has a generally elongate rectangular region 132 having a slot width, w, and at one end thereof a circular region 134 having a diameter, d, that is larger than the slot width, w.
- each upper abutment portion 124 comprises an attachment region 125 configured to engage with a slot 130 of the support portion 122 to fix the abutment portion 124 thereto.
- Each upper abutment portion 124 also comprises an integral abutment region 126 configured to abut a device 10 held by the jig 200 in the clamping configuration.
- the attachment region 125 has a generally circular cross-section, with two reduced-diameter regions 125a that each have a diameter (or width) equal to or slightly less than the slot width, w, so that they fit snuggly within the rectangular region 132 of the slot 130.
- the attachment region 125 also has three larger-diameter regions 125b, each separated by a reduced-diameter region 125a, and each having a diameter (or width) that is greater than the slot width, w, so that they cannot pass through the rectangular region 132 of the slot 130, but equal to or smaller than the diameter, d, of the circular region 134 of the slot 130.
- the abutment portions 124 can each be inserted into a respective slot 130 by passing either one or two of the larger-diameter regions 125b through the circular region 134 of the slot 130 and then sliding the respective reduced-diameter region 125a of the abutment portion 124 along the slot 134 so that it enters the rectangular region 132 and thereby secures the abutment portion 124 to the support portion 122.
- a position of the abutment surface 127 By selecting a respective one of the two reduced-diameter regions 125a to engage the slot 130 it is possible to choose a position of the abutment surface 127 from two possible positions, both of which are illustrated in Fig. 19.
- the distance in the clamping direction between the two possible positions corresponds to the distance, d, between the two reduced-diameter regions 125a.
- a single set of upper abutment members 124 can be used to secure devices 10 having a thickness, t, or devices 10 having a thickness of t -d, simply by re-positioning the upper abutment portions 124.
- attachment regions of the upper abutment portions 124 may have only one reduced-diameter region 125a enclosed by two larger-diameter regions 125b.
- each upper abutment portion 124 comprises a frusto-conical region extending from the reduced-diameter region, the frusto-conical region reducing in diameter from a widest diameter greater than the slot width, w, to further secure the abutment portion 124 to the support portion 122, reducing to a narrowest diameter defining a circular abutment surface 127.
- the abutment surface 127 is the only part of each upper abutment portion 124 that contacts a respective device 10 in the clamping configuration of the jig 200 (shown in Figs. 18A-E) .
- Each of the upper abutment portions 124 (or the frusto-conical region of each upper abutment portion, or, as a minimum, the abutment surface of each abutment portion) is formed from an elastomer having a Shore A hardness of between 50A and 70A, preferably between 50A and 60A.
- a suitable elastomer is a fluorinated elastomer such as FKM or FFKM. Such fluorinated elastomers have the particular benefit of being low-or zero-outgassing.
- the deformable nature of the elastomeric material ensures that as it is compressed in the clamping configuration it acts like a compression spring to apply a clamping force to each respective device 10.
- the upper abutment portions 124 act to urge the respective devices 10 towards the lower abutment portions 44 to facilitate a vapour tight seal therebetween.
- the clamping force may serve to retain the structural integrity of the devices 10 during a surface modification process, in particular such processes where a sub- atmospheric surface modification process is employed, in order to prevent peeling, delamination or other damage to the devices.
- the lower abutment portions 44 may comprise a rigid substrate (e.g. a metallic substrate such as an aluminium substrate) with a layer of elastomeric material thereon to provide the abutment surface of the abutment portion.
- each abutment portion may be formed entirely from the elastomeric material.
- the attachment region 125 of each upper abutment portion 124 may comprise a rigid member (i.e. be formed from a rigid material, such as a metallic material such as aluminium) , and the abutment region 126 (or at least the abutment surface 127 thereof) may be formed from the elastomeric material.
- the slots 130 enable the location of each abutment portion 124 to be varied to suit the configuration of devices 10 within the jig 200. That is, the abutment portions 124 can each be secured at any location along the rectangular region of the respective slot 130 to provide a clamping force at a desired location.
- the slots 130 enable the abutment portions 124 to be replaced, for example if they become worn or perished.
- the abutment portions 124 may be replaced with a plurality of equivalent abutment portions having a different height in the clamping direction. That is, the jig 200 may be used for clamping devices 10 having different thicknesses by varying the height (the dimension in the clamping direction between the inner surface of the support portion 122 and the abutment surface 127) of the upper abutment portions.
- the jig 200 is first arranged in the loading configuration (shown in Figure 11) and a plurality of devices 10 located therein such that each device 10 is nestled within the recess 46 of a respective lower abutment portion 44.
- the upper insert 120 is then pivoted until the clamping protrusions 23 each fully engage their corresponding bores 55.
- the jig 200 is then in the clamping configuration (shown in Figures 18A-E) , such that the abutment surfaces of the lower abutment portions 44 are urged into a vapour tight seal with the devices 10, thereby masking those parts of the devices 10 obscured by the abutment portions, and the upper abutment portions 124 apply a clamping force to each of the devices 10.
- the catches 56 are closed to ensure that the jig remains in the clamping configuration until they are released.
- the loaded jig 200 may be exposed to surface modification conditions, e.g. vapour deposition conditions by placing it in a plasma polymerisation deposition chamber, as discussed further below.
- the surface modification conditions may provide a barrier coating such as a waterproof, water repellent or water resistant coating.
- One or more of the upper abutment portions 124 may be moved within their respective slots 130 to vary the location of the clamping force they apply. If necessary, the upper abutment portions 124 can be removed from their respective slots 130 by sliding them along the slot to the circular region 134 and disengaging them, and replaced with replacement upper abutment portions 124.
- each linear slot 130 carries two abutment portions 124, though the skilled person will readily understand that in other embodiments alternative arrangements are possible.
- the slots 130 may be replaced with an array of apertures similar to the perforations 60 of the first embodiment, and each aperture may be used to secure a respective one of the upper abutment portions 124 to the support portion 122. In this way, the position and/or orientation of each upper abutment portion 124 may be modified by interconnecting the attachment region thereof with different ones of the apertures.
- a vapour deposition process in accordance with an embodiment of the invention may comprise exposing the loaded jig 100 to vapour deposition conditions substantially as described in WO 2007/083122, which is incorporated herein by reference.
- the vapour deposition conditions may further comprise a cross-linker selected from 1, 4-butanediol divinyl ether (BDVE) , 1, 4-cyclohexanedimethanol divinyl ether (CDDE) , 1, 7-octadiene (17OD) , 1, 2, 4 -trivinylcyclohexane (TVCH) , divinyl adipate (DVA) , 1, 3-divinyltetramethyldisiloxane (DVTMDS) , diallyl 1, 4-cyclohexanedicarboxylate (DCHD) , 1, 6-divinylperfluorohexane (DVPFH) , 1H, 1H, 6H, 6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis (diallyl acetal) (GBDA) .
- BDVE 4-butanediol divinyl ether
- CDDE 4-cyclohex
- vapour deposition conditions only those parts of the devices 10 which are not masked are coated with a vapour deposition coating.
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Abstract
In general terms the invention provides a jig for securing one or more items during a surface modification, the jig comprising one or more abutment portions that can be separated from a support portion to facilitate replacement of the abutment portions. This arrangement enables the abutment portions to be replaced without modification being required to the rest of the jig. For example, the abutment portions may be replaced if they become worn or perished during use. Alternatively, the jig may be adaptable to accommodate items of different sizes, shapes and configurations by installing abutment portions adapted for a particular item.
Description
The invention relates to the securing of items during surface modification processes. In particular, though not exclusively, this invention relates to a jig for clamping and/or partially masking one or more items, a kit comprising such a jig, a method of operating such a jig, and a method of surface modification utilising such a jig.
There is a need when surface modifying items, e.g. by applying a vapour deposited coating, to secure such items in position. For example, items may need to be held in a surface modification chamber in which surface modification conditions are provided.
For reasons of economy it is desirable to secure items in a relatively compact configuration, for example to achieve high chamber loadings.
There is also a need to clamp some items to help them retain their structural integrity during the surface modification process. This may be of particular importance where a sub-atmospheric surface modification process is employed in order to prevent peeling, delamination or other damage.
There can also be a need to mask items during a surface modification process such that a portion of their surface is not modified. Masking may be of importance, for example, where part of the item would lose its desired functionality or aesthetic were a coating to be applied to it.
A technical field in which there are specific concerns around masking is that of coating electronic devices, for example touchscreen devices, using a vapour deposition process. Whilst applying coatings to such devices can bring great benefits, such as liquid repellence (see for example WO2007/083122) , parts of the device may benefit from remaining uncoated. Such parts may include, without limitation, electrical contacts, exterior surfaces and screens. The functionality of aesthetic of such parts may be affected if they are not effectively masked during coating.
SUMMARY OF THE INVENTION
In general terms the invention provides a jig for securing one or more items during a surface modification, the jig comprising one or more abutment portions that can be separated from a support portion to facilitate replacement of the abutment portions.
A first aspect of the invention provides a jig for securing one or more items during a surface modification process, the jig comprising first and second inserts configurable in a clamping configuration in which one or more items are clamped therebetween, wherein at least one of the first and second inserts comprises a support portion carrying one or more abutment portions arranged to abut one or more items located between the first and second inserts in the clamping configuration, the one or more abutment portions being separable from their respective support portion to facilitate replacement of the one or more abutment portions.
This arrangement enables the abutment portions to be replaced without modification being required to the rest of the jig. For example, the abutment portions may be replaced if they become worn or perished during use.
Alternatively, the jig may be adaptable to accommodate items of different sizes, shapes and configurations by installing abutment portions adapted for a particular item.
The inserts may be removable from the jig or may be permanently or semi-permanently fixed to the jig in such a way that ready removal is not contemplated. The support portion (s) may be generally plate-like in configuration, i.e. having a width and length that are significantly greater than its thickness. The support portion (s) may have a generally planar inner face, i.e. an inwardly-facing face.
In preferred embodiments the first and second inserts each comprise a support portion and one or more abutment portions.
The support portions may be arranged in a fixed, predetermined position relative to one another in the clamping configuration. Alternatively, it may be possible to vary a position of the support portions relative to one another in the clamping configuration.
Each abutment portion may be arranged to abut a respective one of a plurality of items in the clamping configuration. In preferred embodiments an abutment portion of the first insert and an abutment portion of the second insert are arranged relative to one another such that a respective one of a plurality of items are sandwiched therebetween in the clamping configuration. In such embodiments at least one of the abutment portions is arranged to provide a clamping force to urge said at least one abutment portion towards the other of the abutment portions to clamp the item therebetween.
In preferred embodiments the one or more abutment portions comprise a resiliently deformable material. Thus, a good seal can be readily provided between the abutment portion and an item which it abuts. Moreover, in some embodiments compression of the resiliently deformable material may provide a clamping force to urge the abutment portion into contact with the item.
Optionally, the or each support portion has a first interlock feature and the or each abutment portion has a second interlock feature, the first and second interlock features having an interlocked configuration in which they are engaged with each other to lock the or each abutment portion to its respective support portion, and an unlocked configuration in which the or each abutment portion is separated from its respective support portion. In this way the abutment portions can be readily removed from the support portion (s) and replaced.
In some embodiments the first interlock feature comprises one or more first formations in the respective support portion and the second interlock feature comprises one or more corresponding second formations in the respective abutment portion, each of the one or more first formations engaging a respective one of the one or more second formations in the interlocked configuration.
The first interlock feature may comprise a recess in the respective support portion and the second interlock feature may comprise a corresponding protrusion extending from the respective abutment portion, the protrusion extending into the recess in the interlocked configuration.
Preferably, the first and second interlock features are able to engage with one another in a plurality of different arrangements in the interlocked configuration. Thus, the position of each abutment portion with respect to the support portion can be altered to modify the jig to accommodate differently configured items.
In such embodiments the first interlock feature may comprise a plurality of first formations, the second interlock feature may comprise at least one second formation, and the at least one second formation may be able to engage with any of the plurality of first formations in the interlocked configuration.
In preferred embodiments the one or more abutment portions comprise a material having a Shore A hardness of 50A or more or 70A or less, preferably 60A or less. Materials within this range have been found to provide an appropriate degree of deformation to achieve a good seal.
Examples of appropriate materials for the one or more abutment portions include elastomeric materials, for example fluorinated elastomers. Such fluorinated elastomers include fluoroelastomers (FKM) , perfluoro-elastomers (FFKM) , or tetrafluoroethylene/propylene rubbers (FEPM) . A particular advantage of fluorinated elastomers is that they are low-or zero-outgassing materials, and therefore suitable for exposure to surface modification conditions.
The one or more abutment portions are preferably arranged to provide a clamping force to one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process. Such a clamping force is applied in a clamping direction which is typically normal to an inner face of the support portion (s) . The clamping force may be generated by compression of the abutment portion itself, e.g. by compression of an elastically deformable region of the abutment portion.
Alternatively, or in addition, the jig may comprise one or more resilient members arranged to urge the abutment portions into abutment with one or more items located between the first and second inserts in the clamping configuration. For example, the one or more resilient members may each comprise a spring such as a compression spring, or a member comprising an elastically deformable material such as an elastomeric material.
In embodiments in which the jig is used to provide a masking effect, at least one of the one or more abutment portions comprises an abutment surface arranged to mask one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process. For example, the abutment surface may be provided on a peripheral protrusion defining a region to be masked, the peripheral protrusion being arranged to abut the item in use.
Optionally, the one or more abutment portions may have an abutment surface for abutting one or more items located between the first and second inserts in the clamping configuration, the abutment surface having a surface profile corresponding to the one or more items. For example, the abutment surface may comprise one or more protrusions or recesses configured to engage with one or more features of an item. The abutment surface may permit indexing, or location, of an item relative to the respective insert. In some embodiments the abutment surface may be provided on a peripheral protrusion arranged to abut an item, the peripheral protrusion defining a region to be masked during a surface modification process.
In preferred embodiments the first or second insert includes a plurality of abutment portions arranged side-by-side, each abutment portion being arranged to abut a respective item of a plurality of items to be exposed to a surface modification process. Alternatively, or in addition, the first and second inserts may be sized to permit a plurality of items to be located side-by-side therebetween in the clamping configuration. Thus, a plurality of items can be exposed to surface modification conditions at once. This arrangement provides for a particularly efficient configuration in which high chamber loadings can be achieved.
The first and/or second inserts may comprise one or more indexing features configured to locate an item to be subjected to a surface modification process relative to the jig. In some embodiments the first and/or second inserts comprise a plurality of indexing features, each indexing feature being configured to locate an item to be subjected to a surface modification process relative to the jig so that a plurality of items are located side-by-side. Preferably, each of the one or more indexing features comprises an abutment surface as described above.
The support portion of the first and/or second insert is preferably generally rigid, and optionally comprises a material selected from polymers, metallic materials, and combinations thereof.
The jig may further comprise clamping means for urging the first and second inserts into the clamping configuration. Such clamping means may comprise one or more pairs of clamping formations having an interlocked configuration in which the jig is in the clamping configuration and an unlocked configuration in which the jig is not in the clamping configuration. In some embodiments the one or more pairs of clamping formations may engage one another via an interference fit in the interlocked configuration. The jig may further comprise one or more catches for locking the jig in the clamping configuration.
The first insert is preferably movable relative to the second insert to permit loading and unloading of items from the jig. For example, the first insert may be connected to the second insert via a hinged joint permitting pivoting of the first insert relative to the second insert.
The one or more abutment portions of the first or second insert may comprise a plurality of discrete abutment members separable from their respective support portion.
In such embodiments the discrete abutment members may each have an abutment region with a width dimension that decreases in a clamping direction to a narrowest portion providing an abutment surface arranged to abut one or more items located between the first and second inserts in the clamping configuration. For example, the abutment region may have a generally frusto-conical shape. The abutment region may comprise an elastically deformable material, such as an elastomeric material, compression of which is able to provide a clamping force.
In some embodiments the one or more abutment portions of the first or second insert each comprise a plurality of abutment features projecting therefrom to provide a plurality of abutment surfaces arranged to abut one or more items located between the first and second inserts in the clamping configuration. In this way, a clamping force may be applied to multiple regions and/or locations of an item. Moreover, multiple regions of an item may be masked byasingle abutment portion.
The or each one or more abutment portions of the first or second inserts may comprise first and second attachment formations arranged to provide an interconnection with the respective support portion, the first and second attachment formations being arranged to locate an abutment surface of the respective abutment portion at different positions relative to the respective support portion. That is, the first attachment formation may be arranged to locate the abutment surface at a first distance from the support portion, the second attachment formation may be arranged to locate the abutment surface at a second distance from the support portion, the second distance being less than the first distance. In this way, the jig is able to accommodate items of different thicknesses simply by rearranging the abutment portions. For example, the difference between the first distance and the second distance may equal a difference between thicknesses of first items and second items to be held by the jig.
A second aspect of the invention provides a method of holding one or more items in a jig according to the first aspect during a surface modification process, the method including:
loading the one or more items between the first and second inserts and arranging the first and second inserts in the clamping configuration so that the one or more abutment portions abut the one or more items; and
exposing the one or more items to surface modification conditions.
The second aspect of the invention may comprise operation of any of the features of the jig described herein.
A third aspect of the invention provides a kit comprising a jig according to the first aspect, and one or more replacement abutment portions arranged to replace the one or more abutment portions, the replacement abutment portions being arranged to be carried by the respective support portion to abut one or more items located between the first and second inserts in the clamping configuration.
Thus, the abutment portions can be replaced with replacement abutment portions. For example, the abutment portions may be replaced if they become worn or perished during use. Alternatively, the jig may be adaptable to accommodate items of different sizes, shapes and configurations by installing abutment portions adapted for a particular item. This is particularly desirable in embodiments where the support portions of the first and second inserts are arranged in a fixed, predetermined position relative to one another in the clamping configuration.
The replacement abutment portions may have any features of the abutment portions defined in the aspects described herein, including those defined in relation to the first aspect.
The replacement abutment portions may be substantially identical to the abutment portions, for example to provide a direct replacement in the event of wear or perishing of the abutment portions.
Alternatively, the replacement abutment portions may have a different dimension in the clamping direction than the abutment portions. That is, the dimension may be a distance between (an inner face of) the support portion and an abutment surface of the respective abutment portion.
As a further alternative, the replacement abutment portions may have a differently configured abutment surface to that of the abutment portions. For example, the abutment portions may be configured to abut one or more items having a first configuration and the replacement portions may be configured to abut one or more items having a second configuration different to the first configuration. In this way, the jig can be used to accommodate items having different configurations.
A fourth aspect of the invention provides a method of operating a kit according to the third aspect (or a method of operating a jig according to the first aspect) , the method including:
removing the one or more abutment portions from their respective support portion (s) ; and
affixing the one or more replacement abutment portions to the support portion (s) .
Examples of surface modification processes in the context of this invention, and in particular the first, second, third and fourth aspects described above, include, without limitation, deposition processes, in particular particle or vapour deposition processes. The surface modification process may suitably be sub-atmospheric, i.e. involve exposure of the one or more masked items to sub-atmospheric pressures. Suitably, the sub-atmospheric pressure may be in the range of from 0.01 to 999.99 mbar, such as in the range of from 0.1 to 999.99 mbar, e.g. in the range of from 0.5 to 999.99 mbar. In some embodiments of the surface modification process is a sub-atmospheric vapour deposition process, in particular a plasma polymerisation process.
Surface modification conditions may, for example, be vapour deposition conditions. The surface modification conditions may comprise sub-atmospheric pressure. In an embodiment, the vapour deposition conditions are plasma polymerisation conditions.
Surface modification conditions may optionally comprise: an excitation medium; and a monomer that is at least partly activated by the excitation medium to form a liquid repellent coating on the item. The excitation medium may in particular comprise a plasma, optionally a pulsed plasma.
The monomer may be a compound of formula (I) :
where R1, R2 and R3 are independently selected from hydrogen, alkyl, haloalkyl or aryl optionally substituted by halo; and R4 is a group X-R5 where R5 is an alkyl or haloalkyl group and X is a bond; X is a group of formula -C (O) O (CH2) nY, where n is an integer of from 1 to 10 and Y is a bond or a sulphonamide group; or X is a group
- (O) PR6 (O) q (CH2) t, where R6 is aryl optionally substituted by halo, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of from 1 to 10, provided that where q is 1, t is other than 0.
Suitably, the workpiece may be exposed to a plasma comprising a monomer compound for a period of time sufficient to allow a protective polymeric coating to form on a surface of the workpiece; wherein the monomer compound has the following formula (II) :
where R1, R2 and R4 are each independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl or halo alkyl or aryl optionally substituted by halo, and R3 is selected from:
where each X is independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl, halo alkyl or aryl optionally substituted by halo; and n1 is an integer from 1 to 27.
In some embodiments, the monomer may be as identified in the claims of WO 2007/083122.
Suitably, the monomer may be selected from 1H, 1H, 2H, 2H-perfluorohexyl acrylate (PFAC4) , 1H, 1H, 2H, 2H-perfluorooctyl acrylate (PFAC6) , 1H, 1H, 2H, 2H-perfluorodecyl acrylate (PFAC8) and 1H, 1H, 2H, 2H-perfluorododecyl acrylate (PFAC10) .
Suitably, the masked item may be exposed to the monomer compound in combination with a crosslinking agent comprising two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500 ℃. The crosslinking reagent may be selected, for example from 1, 4-butanediol divinyl ether (BDVE) , 1, 4-cyclohexanedimethanol divinyl ether (CDDE) , 1, 7-octadiene (17OD) , 1, 2, 4 -trivinylcyclohexane (TVCH) , divinyl adipate (DVA) , 1, 3-divinyltetramethyldisiloxane (DVTMDS) , diallyl 1, 4-cyclohexanedicarboxylate (DCHD) , 1, 6-divinylperfluorohexane (DVPFH) , 1H, 1H, 6H, 6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis (diallyl acetal) (GBDA) .
The surface modification conditions may lead to a coating that may advantageously be liquid repelling, e.g. water and/or oil repelling.
The one or more items may be of any desired type. In an embodiment, the one or more items comprise one or more electronic devices or electronic components. For example, the one or more items may comprise one or more touchscreen devices, in particular smart phones or tablet computers. Optionally, at least the touchscreen of such devices may be masked. The one or more items may in particular comprise a layered screen, for example an LCD screen, e.g. a TFT screen.
Throughout the description and claims of this specification, the words "comprise" and "contain" and variations of the words, for example "comprising" and "comprises" , mean "including but not limited to" , and do not exclude other components, integers or steps. Moreover the singular encompasses the plural unless the context otherwise requires: in particular, where the indefinite article is used, the specification is to be understood as contemplating plurality as well as singularity, unless the context requires otherwise.
Preferred features of each aspect of the invention may be as described in connection with any of the other aspects. Within the scope of this application it is expressly intended that the various aspects, embodiments, examples and alternatives set out in the preceding paragraphs, in the claims and/or in the following description and drawings, and in particular the individual features thereof, may be taken independently or in any combination. That is, all embodiments and/or features of any embodiment can be combined in any way and/or combination, unless such features are incompatible.
One or more embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
Fig. 1 shows an isometric view of a jig according to an embodiment of the present invention in a loading configuration;
Fig. 2 shows a rear isometric view of the jig of Fig. 1, with portions of the frame omitted;
Fig. 3 shows the jig according to Fig. 1 with a plurality of devices loaded therein;
Figs. 4A and 4B show inner and outer faces, respectively, of a lower insert of the jig of Fig. 1;
Figs. 5A and 5B show inner and outer faces, respectively, of an upper insert of the jig of Fig. 1, in which the biasing connectors are shown in phantom for clarity;
Fig. 6 shows an exploded view of the jig of Fig. 1;
Fig. 7 shows a rear isometric view of the jig of Fig. 1 with the support portion of the upper insert omitted;
Fig. 8 shows a partial section view of the jig of Fig. 1;
Figs 9A, 9B, 9C, 9D and 9E show plan, side and isometric views, respectively, of the jig of Fig. 1 in a clamping configuration;
Fig. 10 shows a detail view of the biasing connectors of the upper insert of the jig of Fig. 1;
Fig. 11 shows an isometric view of a jig according to another embodiment of the invention in a loading configuration;
Fig. 12 shows a rear isometric view of the jig of Fig. 11;
Fig. 13 shows the jig according to Fig. 11 with a plurality of devices loaded therein;
Figs. 14A and 14B show inner and outer faces, respectively, of a lower insert of the jig of Fig. 11;
Figs. 15A and 15B show inner and outer faces, respectively, of an upper insert of the jig of Fig. 11;
Fig. 16 shows an exploded view of the jig of Fig. 11;
Fig. 17 shows a partial section view of the jig of Fig. 11;
Figs 18A, 18B, 18C, 18D and 18E show plan, side and isometric views, respectively, of the jig of Fig. 11 in a clamping configuration; and
Fig. 19 shows a detail view of the abutment portions of the upper insert of the jig of Fig. 11.
Jigs according to the invention may be used to mask one or more surface regions of items during a surface modification process, and/or to clamp one or more surface regions of items during a surface modification process, via one or more abutment portions. In the illustrated embodiments the items are electronic mobile devices such as smart phones or tablets. In some embodiments the one or more masking and/or clamping abutment portions are applied to both major faces of each device, for example to obscure the screen and one or more regions of the back cover of each device, while in others the one or more masking and/or clamping abutment portions are applied to only one face of each device.
The embodiment illustrated in Figures 1 to 10 provides a jig 100 in which regions of both the front and the back faces of each of a plurality (nine in this embodiment) of mobile devices 10. The jig 100 comprises an upper insert 20 and lower insert 40 between which the devices 10 are held.
The lower insert 40 comprises a generally rectangular, rigid, plate-like support portion 42 which is releasably secured to a rigid frame 50. The rigid frame 50 comprises first 52a and second 52b elongate beams, first 54a, second 54b and third 54ccatch assemblies, and four hinge members 58. The catch assemblies 54a, 54b, 54c are arranged so that a first longitudinal edge of the lower insert 40 is clamped between the first elongate beam 52a and the catch assemblies so that the elongate beam 52a abuts an outer face of the lower insert 40 and the catch assemblies abut an inner face thereof. Similarly, a second longitudinal edge of the lower insert 40 is clamped between the second elongate beam 52b and the hinge members 58 so that the second elongate beam 52b abuts the outer face of the lower insert 40 and the hinge members abut the inner face.
The upper insert 20 comprises a generally rectangular, rigid, plate-like support portion 22, which in the illustrated embodiment is formed from an assembly of three plates attached in series. The upper insert 20 is attached via a hinge joint to the hinge members 58 to enable it to pivot between a clamping configuration (shown in Figures 9A-E) in which the upper and lower inserts are generally parallel to one another and the devices 10 are clamped therebetween, and a loading configuration (shown in Figure 1) in which the upper insert 20 is rotated away from the lower insert 40 to enable the devices 10 to be loaded into or removed from the jig 100.
The upper insert 20 comprises a plurality (six in this embodiment) of clamping protrusions 23, each of which comprises a generally cylindrical member that projects from an inner face of the upper insert 20 in a direction substantially perpendicular, or normal, to that inner face. Each clamping protrusion 23 engages a corresponding clamping bore 55 in a respective one of the catch assemblies 54a, 54b, 54c via an interference fit. When the clamping protrusions 23 and bores 55 are fully engaged the jig 100 is in the clamping configuration such that the engagement between the clamping protrusions 23 and bores 55 secures the upper insert 20 in a position relative to the lower insert 40 in which a clamping force is applied to the devices 10. The catch assemblies 54a, 54b, 54c each comprise a pair of catches 56 that are operable to engage an edge of the upper insert 20 to lock the upper insert 20 in the clamping configuration.
The upper 20 and lower 40 inserts each comprise a plurality (nine in this embodiment) of abutment portions 24, 44 which are each urged against a respective region of a respective device 10 in the clamping configuration to thereby mask that region during a surface modification process.
The lower insert 40 comprises nine lower abutment portions 44, each of which is releasably attached to the support portion 42 to enable the lower abutment portions 44 to be replaced, for example, when they have become worn or perished through use, or to enable the jig 100 to be used to hold other devices 10 having a different overall shape or configuration. In addition, the abutment portions 44 may be replaced with a plurality of equivalent abutment portions having a different thickness in the clamping direction, at least in the region of the abutment surface that abuts a device 10 in use. That is, the jig 100 may be used for clamping devices 10 having different thicknesses by varying the thickness (the dimension in the clamping direction between the inner surface of the support portion 42 and the abutment surface) of the lower abutment portions.
The lower abutment portions 44 each comprise a plurality of generally cylindrical interlock protrusions (not shown) which engage with a corresponding plurality of interlock bores (blind bores in this embodiment; not shown) in the support portion 42 via an interference fit to interlock the lower abutment portions 44 with the support portion 42. In this way, used lower abutment portions 44 can be peeled away from the support portion 42 when replacement is required, and replacement lower abutment portions 44 can be readily interlocked with the support portion 42 by urging the lower abutment portions 44 towards the support portion until each interlock protrusion is fully engaged in a respective interlock bore.
Each lower abutment portion 44 of the lower insert 40 has an abutment surface, i.e. the surface arranged to abut a respective device 10 in the clamping configuration, with a surface profile that corresponds to a screen face of the respective device 10. Thus, each lower abutment portion 44 has a continuous peripheral rim 45 that encloses a recessed region 46 within which the device 10 is seated in the clamping configuration. This arrangement reduces material costs and also the potential for outgassing. Effective masking is still provided because the peripheral region forms a sealing periphery around the central region.
The upper insert 20 comprises nine upper abutment portions 24, each of which cooperates with a corresponding one of the lower abutment portions 44. In a similar arrangement to that described above in relation to the lower abutment portions 44, each of the nine upper abutment portions 24 is releasably attached to the support portion 22 of the upper insert 20 to enable replacement thereof. The upper abutment portions 24 may be replaced when they have become worn or perished through use, or to enable the jig 100 to be used to hold other devices 10 having a different overall shape or configuration. In addition, the abutment portions 24 may be replaced with a plurality of equivalent abutment portions having a different thickness in the clamping direction, at least in the region of the abutment surface that abuts a device 10 in use. That is, the jig 100 may be used for clamping devices 10 having different thicknesses by varying the thickness (the dimension in the clamping direction between the inner surface of the support portion 22 and the abutment surface) of the upper abutment portions.
Each upper abutment portion 24 is connected to the support portion 22 of the upper insert 20 via four biasing connectors 30. Each biasing connector 30 comprises a resilient spring 32 coiled around a rigid pin 34. The pin 34 is connected to the support portion 22, via a rigid connection such as a threaded joint in a hole 36 through the support portion 22, so that it extends substantially normal, or perpendicular, to the support portion 22 and engages a corresponding blind hole 36 in the upper abutment portion 24. The springs 32 each act to bias the respective upper abutment portions 24 away from the support portion 22 when the jig 100 is in the clamping configuration. A limited degree of sliding of the pin 34 within the blind hole 36 facilitates this biasing action.
In this way, used upper abutment portions 24 can be removed from the support portion 22 when replacement is required by disconnecting the biasing connectors 30, and replacement upper abutment portions 24 can be readily connected to the support portion 22 by reconnecting the biasing connectors 30 Each upper abutment portion 24 of the upper insert 20 has an abutment surface, i.e. the surface arranged to abut a respective device 10 in the clamping configuration, with a surface profile that corresponds to a back cover of the respective device 10. Thus, each upper abutment portion 24 has a continuous peripheral rim 25 that encloses a recessed region 26 within which the device 10 is seated in the clamping configuration. This arrangement reduces material costs and also the potential for outgassing. Effective masking is still provided because the peripheral region forms a sealing periphery around the central region.
The upper abutment portions 24 also each have two generally circular apertures 28, each of which is configured to encircle a corresponding feature of the respective device 10, in this case a camera lens and LED light source window. A peripheral rim encircles each aperture 28 to form a sealing periphery around the aperture.
Together, the lower 44 and upper 24 abutment portions thus serve to obscure a majority of each device 10, with the only regions remaining unobscured being the apertures 28 and a continuous peripheral strip subtended by the rims 25, 45 of the abutment portions. The abutment portions thus serve to mask an entirety of each device 10 with the exception of the camera lens, LED light source window, and the joint (s) between screen, back cover and main body of the device. Moreover, the biasing action of the biasing connectors 30, in combination with the clamping action of the clamping pins 23, ensures that there is a vapour tight seal between the devices 10 and their respective abutment portions 44, 24 and that the devices 10 are securely clamped to help them retain their structural integrity, particularly during sub-atmospheric surface modification processes.
The support portions 22, 42 and frame 50 are typically formed from a rigid material such as a metallic material, for example aluminium. In this way, the jig 100 has an overall rigidity and resistance to out of tolerance deformation.
The support portion 22 of the upper support 20 comprises an array of perforations 60, or through holes, which permit ready exposure of each of the devices during a surface modification process. The peripheral gaps between the upper 20 and lower 40 inserts also facilitate such exposure.
In some embodiments the perforations 60 may be used to secure the upper abutment portions 24 to the support portion 22. For example, each of the biasing connectors 30 may be connected to a respective one of the perforations 60. In this way, the position and/or orientation of each upper abutment portion 24 may be modified by interconnecting the biasing connectors 30 with different ones of the perforations 60.
Each of the lower abutment portions 44 and upper abutment portions 24 (or at least, the abutment surface of each abutment portion) is formed from an elastomer having a Shore A hardness of between 50A and 70A, preferably between 50A and 60A. A suitable elastomer is a fluorinated elastomer such as FKM or FFKM. Such fluorinated elastomers have the particular benefit of being low-or zero-outgassing.
The deformable nature of the elastomeric material enables a good seal to be provided between each device 10 and its respective lower and upper abutment portions in the clamping configuration as the device 10 is urged into a sealing contact with the abutment surfaces thereof.
Moreover, as the elastomeric material is compressed in the clamping configuration it acts like a compression spring to apply a clamping force to each respective device 10. In addition to facilitating the vapour tight seal, the clamping force may serve to retain the structural integrity of the devices 10 during a surface modification process, in particular such processes where a sub-atmospheric surface modification process is employed, in order to prevent peeling, delamination or other damage to the devices.
In some embodiments the upper 24 and/or lower 44 abutment portions may comprise a rigid substrate (e.g. a metallic substrate such as an aluminium substrate) with a layer of elastomeric material thereon to provide the abutment surface of the abutment portion. In other embodiments each abutment portion may be formed entirely from the elastomeric material.
In use, the jig 100 is first arranged in the loading configuration (shown in Figure 1) and a plurality of devices 10 located therein such that each device 10 is nestled within the recess 46 of a respective lower abutment portion 44. The upper insert 20 is then pivoted until the clamping protrusions 23 each fully engage their corresponding bores 55. The jig 100 is then in the clamping configuration (shown in Figures 9A-E) , such that the abutment surfaces of the upper 24 and lower 44 abutment portions are urged into a vapour tight seal with the devices 10, thereby masking those parts of the devices 10 obscured by the abutment portions. A clamping force is also applied to each of the devices 10 in the clamping configuration. Finally, the catches 56 are closed to ensure that the jig remains in the clamping configuration until they are released.
The loaded jig 100 may be exposed to surface modification conditions, e.g. vapour deposition conditions by placing it in a plasma polymerisation deposition chamber, as discussed further below. By way of example, the surface modification conditions may provide a barrier coating such as a waterproof, water repellent or water resistant coating.
Figures 11 to 19 illustrate a jig 200 according to a second embodiment of the invention. In this embodiment only one face of each device 10 is masked; in this embodiment it is the screen of the device that is masked.
The jig 200 of this embodiment shares many features in common with the jig 100 of the first embodiment, and the description above of such common features applies equally to the second embodiment. In generalterms, the only features of the jig 200 of the second embodiment that are different to those of the jig 100 of the first embodiment are those concerning the upper insert, which in the second embodiment is denoted by the reference numeral 120 and is described further below.
Like the first embodiment, the upper insert 120 of the second embodiment comprises a generally rectangular, rigid, plate-like support portion 122, which in the illustrated embodiment is formed from an assembly of three plates attached in series. The upper insert 120 is attached via a hinge joint to the hinge members 58 to enable it to pivot between a clamping configuration (shown in Figures 18A-E) in which the upper and lower inserts are generally parallel to one another and the devices 10 are clamped therebetween, and a loading configuration (shown in Figure 11) in which the upper insert 120 is rotated away from the lower insert 40 to enable the devices 10 to be loaded into or removed from the jig 200.
In place of the array of perforations 60 of the first embodiment, the support portion 122 of the upper insert 120 of the second embodiment has a plurality of linear slots 130, in this embodiment arranged in three side-by-side columns of eight slots 130. Each slot 130 has a generally elongate rectangular region 132 having a slot width, w, and at one end thereof a circular region 134 having a diameter, d, that is larger than the slot width, w.
In place of the upper abutment portions 24 of the first embodiment are a plurality of upper abutment portions 124 in the form of discrete biasing members. Each upper abutment portion 124 comprises an attachment region 125 configured to engage with a slot 130 of the support portion 122 to fix the abutment portion 124 thereto. Each upper abutment portion 124 also comprises an integral abutment region 126 configured to abut a device 10 held by the jig 200 in the clamping configuration.
As is best seen in Fig. 19, the attachment region 125 has a generally circular cross-section, with two reduced-diameter regions 125a that each have a diameter (or width) equal to or slightly less than the slot width, w, so that they fit snuggly within the rectangular region 132 of the slot 130. The attachment region 125 also has three larger-diameter regions 125b, each separated by a reduced-diameter region 125a, and each having a diameter (or width) that is greater than the slot width, w, so that they cannot pass through the rectangular region 132 of the slot 130, but equal to or smaller than the diameter, d, of the circular region 134 of the slot 130.
In this way, the abutment portions 124 can each be inserted into a respective slot 130 by passing either one or two of the larger-diameter regions 125b through the circular region 134 of the slot 130 and then sliding the respective reduced-diameter region 125a of the abutment portion 124 along the slot 134 so that it enters the rectangular region 132 and thereby secures the abutment portion 124 to the support portion 122.
By selecting a respective one of the two reduced-diameter regions 125a to engage the slot 130 it is possible to choose a position of the abutment surface 127 from two possible positions, both of which are illustrated in Fig. 19. The distance in the clamping direction between the two possible positions corresponds to the distance, d, between the two reduced-diameter regions 125a. In this way, a single set of upper abutment members 124 can be used to secure devices 10 having a thickness, t, or devices 10 having a thickness of t -d, simply by re-positioning the upper abutment portions 124.
In other embodiments the attachment regions of the upper abutment portions 124 may have only one reduced-diameter region 125a enclosed by two larger-diameter regions 125b.
The abutment region 126 of each upper abutment portion 124 comprises a frusto-conical region extending from the reduced-diameter region, the frusto-conical region reducing in diameter from a widest diameter greater than the slot width, w, to further secure the abutment portion 124 to the support portion 122, reducing to a narrowest diameter defining a circular abutment surface 127. The abutment surface 127 is the only part of each upper abutment portion 124 that contacts a respective device 10 in the clamping configuration of the jig 200 (shown in Figs. 18A-E) .
Each of the upper abutment portions 124 (or the frusto-conical region of each upper abutment portion, or, as a minimum, the abutment surface of each abutment portion) is formed from an elastomer having a Shore A hardness of between 50A and 70A, preferably between 50A and 60A. A suitable elastomer is a fluorinated elastomer such as FKM or FFKM. Such fluorinated elastomers have the particular benefit of being low-or zero-outgassing.
The deformable nature of the elastomeric material ensures that as it is compressed in the clamping configuration it acts like a compression spring to apply a clamping force to each respective device 10. Thus, the upper abutment portions 124 act to urge the respective devices 10 towards the lower abutment portions 44 to facilitate a vapour tight seal therebetween. Moreover, the clamping force may serve to retain the structural integrity of the devices 10 during a surface modification process, in particular such processes where a sub- atmospheric surface modification process is employed, in order to prevent peeling, delamination or other damage to the devices.
In some embodiments the lower abutment portions 44 may comprise a rigid substrate (e.g. a metallic substrate such as an aluminium substrate) with a layer of elastomeric material thereon to provide the abutment surface of the abutment portion. In other embodiments each abutment portion may be formed entirely from the elastomeric material. Similarly, the attachment region 125 of each upper abutment portion 124 may comprise a rigid member (i.e. be formed from a rigid material, such as a metallic material such as aluminium) , and the abutment region 126 (or at least the abutment surface 127 thereof) may be formed from the elastomeric material.
The slots 130 enable the location of each abutment portion 124 to be varied to suit the configuration of devices 10 within the jig 200. That is, the abutment portions 124 can each be secured at any location along the rectangular region of the respective slot 130 to provide a clamping force at a desired location.
Moreover, the slots 130 enable the abutment portions 124 to be replaced, for example if they become worn or perished. In addition, the abutment portions 124 may be replaced with a plurality of equivalent abutment portions having a different height in the clamping direction. That is, the jig 200 may be used for clamping devices 10 having different thicknesses by varying the height (the dimension in the clamping direction between the inner surface of the support portion 122 and the abutment surface 127) of the upper abutment portions.
In use, the jig 200 is first arranged in the loading configuration (shown in Figure 11) and a plurality of devices 10 located therein such that each device 10 is nestled within the recess 46 of a respective lower abutment portion 44. The upper insert 120 is then pivoted until the clamping protrusions 23 each fully engage their corresponding bores 55. The jig 200 is then in the clamping configuration (shown in Figures 18A-E) , such that the abutment surfaces of the lower abutment portions 44 are urged into a vapour tight seal with the devices 10, thereby masking those parts of the devices 10 obscured by the abutment portions, and the upper abutment portions 124 apply a clamping force to each of the devices 10. Finally, the catches 56 are closed to ensure that the jig remains in the clamping configuration until they are released.
The loaded jig 200 may be exposed to surface modification conditions, e.g. vapour deposition conditions by placing it in a plasma polymerisation deposition chamber, as discussed further below. By way of example, the surface modification conditions may provide a barrier coating such as a waterproof, water repellent or water resistant coating.
One or more of the upper abutment portions 124 may be moved within their respective slots 130 to vary the location of the clamping force they apply. If necessary, the upper abutment portions 124 can be removed from their respective slots 130 by sliding them along the slot to the circular region 134 and disengaging them, and replaced with replacement upper abutment portions 124.
In this embodiment each linear slot 130 carries two abutment portions 124, though the skilled person will readily understand that in other embodiments alternative arrangements are possible.
In some embodiments the slots 130 may be replaced with an array of apertures similar to the perforations 60 of the first embodiment, and each aperture may be used to secure a respective one of the upper abutment portions 124 to the support portion 122. In this way, the position and/or orientation of each upper abutment portion 124 may be modified by interconnecting the attachment region thereof with different ones of the apertures.
In all embodiments of the invention a vapour deposition process in accordance with an embodiment of the invention may comprise exposing the loaded jig 100 to vapour deposition conditions substantially as described in WO 2007/083122, which is incorporated herein by reference.
The vapour deposition conditions may further comprise a cross-linker selected from 1, 4-butanediol divinyl ether (BDVE) , 1, 4-cyclohexanedimethanol divinyl ether (CDDE) , 1, 7-octadiene (17OD) , 1, 2, 4 -trivinylcyclohexane (TVCH) , divinyl adipate (DVA) , 1, 3-divinyltetramethyldisiloxane (DVTMDS) , diallyl 1, 4-cyclohexanedicarboxylate (DCHD) , 1, 6-divinylperfluorohexane (DVPFH) , 1H, 1H, 6H, 6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis (diallyl acetal) (GBDA) .
It has been found that in vapour deposition conditions only those parts of the devices 10 which are not masked are coated with a vapour deposition coating.
Claims (28)
- A jig for securing one or more items during a surface modification process, the jig comprising first and second inserts configurable in a clamping configuration in which one or more items are clamped therebetween, wherein at least one of the first and second inserts comprises a support portion carrying one or more abutment portions arranged to abut one or more items located between the first and second inserts in the clamping configuration, the one or more abutment portions being separable from their respective support portion to facilitate replacement of the one or more abutment portions.
- A jig according to claim 1, wherein the one or more abutment portions comprise a resiliently deformable material.
- A jig according to claim 1 or claim 2, wherein the or each support portion has a first interlock feature and the or each abutment portion has a second interlock feature, the first and second interlock features having an interlocked configuration in which they are engaged with each other to lock the or each abutment portion to its respective support portion, and an unlocked configuration in which the or each abutment portion is separated from its respective support portion.
- A jig according to claim 3, wherein the first and second interlock features are able to engage with one another in a plurality of different arrangements in the interlocked configuration.
- A jig according to claim 3 or claim 4, wherein the first interlock feature comprises a plurality of first formations, the second interlock feature comprises at least one second formation, and the at least one second formation is able to engage with any of the plurality of first formations in the interlocked configuration.
- A jig according to any preceding claim, wherein the one or more abutment portions comprise a material having a Shore A hardness of 50A or more or 70A or less, preferably 60A or less.
- A jig according to claim 6, wherein the one or more abutment portions comprise an elastomeric material, for example a fluorinated elastomer.
- A jig according to any preceding claim, wherein the one or more abutment portions are arranged to provide a clamping force to one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process.
- A jig according to any preceding claim, comprising one or more resilient members arranged to urge the abutment portions into abutment with one or more items located between the first and second inserts in the clamping configuration.
- A jig according to any preceding claim, wherein at least one of the one or more abutment portions comprises an abutment surface arranged to mask one or more regions of one or more items located between the first and second inserts in the clamping configuration during a surface modification process.
- A jig according to any preceding claim, wherein the one or more abutment portions have an abutment surface for abutting one or more items located between the first and second inserts in the clamping configuration, the abutment surface having a surface profile corresponding to the one or more items.
- A jig according to any preceding claim, wherein the first or second insert includes a plurality of abutment portions arranged side-by-side, each abutment portion being arranged to abut a respective item of a plurality of items to be exposed to a surface modification process.
- A jig according to any preceding claim, wherein the first and/or second inserts comprise one or more indexing features configured to locate an item to be subjected to a surface modification process relative to the jig.
- A jig according to any preceding claim, wherein the first and/or second inserts comprise a plurality of indexing features, each indexing feature being configured to locate an item to be subjected to a surface modification process relative to the jig so that a plurality of items are located side-by-side.
- A jig according to claim 14, wherein each of the one or more indexing features comprises an abutment surface according to claim 11.
- A jig according to any preceding claim, wherein the support portion of the first and/or second insert is generally rigid, and optionally comprises a material selected from polymers, metallic materials, and combinations thereof.
- A jig according to any preceding claim, comprising clamping means for urging the first and second inserts into the clamping configuration.
- A jig according to claim 17, wherein the clamping means comprises one or more pairs of clamping formations having an interlocked configuration in which the jig is in the clamping configuration and an unlocked configuration in which the jig is not in the clamping configuration.
- A jig according to any preceding claim, wherein the first insert is movable relative to the second insert to permit loading and unloading of items from the jig.
- A jig according to any preceding claim, wherein the one or more abutment portions of the first or second insert comprise a plurality of discrete abutment members separable from their respective support portion.
- A jig according to claim 20, wherein the discrete abutment members each have an abutment region with a width dimension that decreases in a clamping direction to a narrowest portion providing an abutment surface arranged to abut one or more items located between the first and second inserts in the clamping configuration.
- A jig according to any preceding claim, wherein the one or more abutment portions of the first or second insert each comprise a plurality of abutment features projecting therefrom to provide a plurality of abutment surfaces arranged to abut one or more items located between the first and second inserts in the clamping configuration.
- A method of holding one or more items in a jig according to any of claims 1 to 22 during a surface modification process, the method including:loading the one or more items between the first and second inserts and arranging the first and second inserts in the clamping configuration so that the one or more abutment portions abut the one or more items; andexposing the one or more items to surface modification conditions.
- A kit comprising a jig according to any of claims 1 to 22, and one or more replacement abutment portions arranged to replace the one or more abutment portions, the replacement abutment portions being arranged to be carried by the respective support portion to abut one or more items located between the first and second inserts in the clamping configuration.
- A kit according to claim 24, wherein the replacement abutment portions have any features of the abutment portions of claims 1 to 22.
- A kit according to claim 24 or claim 25, wherein the replacement abutment portions have a different dimension in the clamping direction than the abutment portions.
- A kit according to any of claims 24 to 26, wherein the replacement abutment portions have a differently configured abutment surface to that of the abutment portions.
- A method of operating a kit according to any of claims 24 to 27, the method including:removing the one or more abutment portions from their respective support portion (s) ; andaffixing the one or more replacement abutment portions to the support portion (s) .
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201790001580.3U CN211805637U (en) | 2016-12-19 | 2017-12-19 | Clamp for surface modification process and assembly comprising same |
TW107106086A TW201910544A (en) | 2017-08-15 | 2018-02-23 | A jig for surface modification processes |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1621641.8 | 2016-12-19 | ||
GBGB1621641.8A GB201621641D0 (en) | 2016-12-19 | 2016-12-19 | Improvements relating to masking |
CNPCT/CN2017/097504 | 2017-08-15 | ||
CN2017097504 | 2017-08-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018113671A1 true WO2018113671A1 (en) | 2018-06-28 |
WO2018113671A9 WO2018113671A9 (en) | 2019-01-10 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2017/053808 WO2018115846A1 (en) | 2016-12-19 | 2017-12-19 | Improvements relating to surface modification |
PCT/CN2017/117212 WO2018113671A1 (en) | 2016-12-19 | 2017-12-19 | A jig for surface modification processes |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2017/053808 WO2018115846A1 (en) | 2016-12-19 | 2017-12-19 | Improvements relating to surface modification |
Country Status (3)
Country | Link |
---|---|
CN (2) | CN211805637U (en) |
TW (1) | TW201836720A (en) |
WO (2) | WO2018115846A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109064887A (en) * | 2018-08-31 | 2018-12-21 | Oppo(重庆)智能科技有限公司 | The activation jig of screen for electronic device |
CN109623703A (en) * | 2019-01-29 | 2019-04-16 | Oppo(重庆)智能科技有限公司 | Flexible screen assembly tool and assemble method |
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CN103770450A (en) * | 2012-10-25 | 2014-05-07 | 松下电器产业株式会社 | Silk-screen printing device and setting method of substrate clamping position of the same |
CN103811770A (en) * | 2014-01-20 | 2014-05-21 | 南京大学昆山创新研究院 | Fuel battery membrane electrode preparation fixture as well as processing technology thereof |
KR101638344B1 (en) * | 2015-12-04 | 2016-07-11 | 주식회사 유아이디 | negative panel fixing device and method for sputtering |
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WO2014110175A2 (en) * | 2013-01-08 | 2014-07-17 | Hzo, Inc. | Apparatuses and systems for selectively applying a protective coating to electronic components and methods related thereto |
JP6077886B2 (en) * | 2013-03-04 | 2017-02-08 | 株式会社荏原製作所 | Plating equipment |
KR102437483B1 (en) * | 2013-08-30 | 2022-08-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Processing apparatus and processing method of stack |
SG10201807691XA (en) * | 2014-02-20 | 2018-10-30 | Intevac Inc | System and method for bi-facial processing of substrates |
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2017
- 2017-12-19 CN CN201790001580.3U patent/CN211805637U/en not_active Expired - Fee Related
- 2017-12-19 WO PCT/GB2017/053808 patent/WO2018115846A1/en active Application Filing
- 2017-12-19 TW TW106144665A patent/TW201836720A/en unknown
- 2017-12-19 CN CN201790001526.9U patent/CN211150516U/en not_active Expired - Fee Related
- 2017-12-19 WO PCT/CN2017/117212 patent/WO2018113671A1/en active Application Filing
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US6806943B2 (en) * | 2002-08-09 | 2004-10-19 | International Business Machines Corporation | Mask clamping device |
CN103770450A (en) * | 2012-10-25 | 2014-05-07 | 松下电器产业株式会社 | Silk-screen printing device and setting method of substrate clamping position of the same |
CN103811770A (en) * | 2014-01-20 | 2014-05-21 | 南京大学昆山创新研究院 | Fuel battery membrane electrode preparation fixture as well as processing technology thereof |
KR101638344B1 (en) * | 2015-12-04 | 2016-07-11 | 주식회사 유아이디 | negative panel fixing device and method for sputtering |
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CN109064887A (en) * | 2018-08-31 | 2018-12-21 | Oppo(重庆)智能科技有限公司 | The activation jig of screen for electronic device |
CN109623703A (en) * | 2019-01-29 | 2019-04-16 | Oppo(重庆)智能科技有限公司 | Flexible screen assembly tool and assemble method |
CN109623703B (en) * | 2019-01-29 | 2020-09-01 | Oppo(重庆)智能科技有限公司 | Flexible screen assembling tool and assembling method |
Also Published As
Publication number | Publication date |
---|---|
CN211805637U (en) | 2020-10-30 |
TW201836720A (en) | 2018-10-16 |
WO2018115846A1 (en) | 2018-06-28 |
WO2018113671A9 (en) | 2019-01-10 |
CN211150516U (en) | 2020-07-31 |
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