GB2579663A

GB2579663A - Universal jig

Info

Publication number: GB2579663A
Application number: GB1820156.6A
Authority: GB
Inventors: James Dymond Stephen; Douglas Pearson Green Andrew
Original assignee: P2i Ltd
Current assignee: P2i Ltd
Priority date: 2018-12-11
Filing date: 2018-12-11
Publication date: 2020-07-01
Also published as: CN213081174U; GB201820156D0

Abstract

A method or apparatus 500 for holding an item 590, such as a printed circuit board, during a surface modification process. The jig 590 comprises first 510 and second 520 supports configured to hold the item 590, and a locating element engaging with a cooperating element of the item to locate the item relative to the jig 500. The item 590 is clamped between the first 510 and second 520 supports, which may be connected by hinges 502. The locating element may comprise a protrusion configured to engage with a corresponding cavity or hole of the PCB 590. An abutment portion 506, 508 may be arranged to abut a portion of the item 590 to be masked during a coating process. The abutment portion 506, 508 may comprise a resiliently deformable material. The coating process may be a vapour deposition process such as a plasma polymerisation process.

Description

UNIVERSAL JIG

TECHNICAL FIELD

The present invention relates to jigs. In particular, though not exclusively, the present invention relates to a jig for holding an item during a surface modification process, and to a method of holding an item in a jig during a surface modification process.

BACKGROUND

It is often necessary to hold printed circuit boards (PCBs) or other similar items in a jig to perform process steps thereon. For example, when surface modifying an item, e.g. by applying a coating to an item by vapour deposition, there is often a need to mask the item such that part of the item's surface is not modified. The application of a mask for this purpose may be carried out by an automated process, e.g. by a robotic arm, and there is a need to hold and locate the item in a known position to facilitate this.

As an example, it is sometimes desirable to apply a masking material to one or more regions of a component of a mobile electronic device, such as a printed circuit board, screen, back cover or other item before a vapour deposited coating is applied to, for example, provide liquid repellence to the non-masked regions. A jig may also be necessary to hold printed circuit boards or other items during other process steps, such as de-masking or during the mounting of electronic components thereon.

In certain situations, it may necessary to locate the item in a jig with a high degree of accuracy. For example, in order to precisely apply a masking material to individual components of a printed circuit board, it may be necessary to align the printed circuit board within the jig to an accuracy of at least ±0.1 mm with respect to the length and/or width of the printed circuit board.

Therefore, a need remains for a jig that is capable of more accurately locating an item. SUMMARY OF THE INVENTION A first aspect of the invention provides a jig for holding an item during a surface modification process, the jig comprising: a first support configured to support the item; a second support configured to support the item; and a locating element configured to engage a cooperating element of the item to thereby locate the item relative to the jig; wherein the first and second supports are configurable in a closed configuration in which the item is clamped between the first and second supports.

By engaging with a cooperating element of an item, the locating element advantageously facilitates the accurate alignment of the item in the jig. Once the surface modification process has taken place and the item has been removed from the jig, further identical items can be aligned accurately within the jig with high reproducibility. The locating element is thus advantageous in making the placement of multiple identical items into the jig highly repeatable.

The item may be a generally planar member having a relatively small thickness. Thus, the item may have generally two main faces subtended by a relatively thin edge. The item may have any shape in planform. The jig may be able to hold items having a convoluted perimeter shape. The item typically has a length (i.e. a longest dimension across at least one of its main faces) of 150 mm or less, and/or a width (i.e. a longest dimension in a direction perpendicular to the length across at least one of its main faces) of 90 mm or less.

In some embodiments, the item may comprise one or more printed circuit boards, electronic devices or electronic components. For example, the item may comprise two printed circuit boards connected by a flexible connection. The one or more printed circuit boards may be single-sided, double-sided or multi-layer printed circuit boards. The one or more printed circuit boards may comprise a substrate carrying one or more conductive tracks thereon electrically connecting two or more electronic components.

Optionally, the jig may be used for holding two or more items during a surface modification process. In such embodiments, the jig may comprise two or more locating elements each configured to engage a cooperating element of each of the two or more items to thereby locate the items relative to the jig.

The surface modification process may include, but is not limited to, one or more of a masking process, demasking process, coating process, curing process, etching process, cleaning process, or a process of mounting of one or more electronic components on the surface of the item.

Examples of masking processes in the context of the invention include, but are not limited to, the application of a masking material which is removable after a coating process. The masking material may take any desired form, consistent with achieving a desired masking performance or effect. In various embodiments, the masking material comprises a curable resin. In particular, the masking material may be fluid in an uncured state and solid in a cured state. The method may comprise curing the resin after application.

Advantageously, the resin may be radiation curable, for example UV curable. Such masking materials are known in the art. They may typically comprise a polymerizable monomer or oligomer, a photoinitiator and optionally various other additives, for example such as antioxidants, fillers and thickening agents. Examples of suitable polymerizable monomers include substituted vinyl compounds, in particular such as acrylates.

The UV curable resin used in the masking process may advantageously comprise an acrylated urethane, for example a substituted or unsubstituted urethane methacrylate or urethane acrylate. Such compositions are sold by DymaxRTM under the trade names DymaxRTM 920479-B, DymaxRTM 9-20318-F, and DymaxRTM 9-318-F.

However, the masking process may also make use of other types of masking material.

The masking material may comprise a plurality of units of masking material. For example, the masking material may comprise a plurality of dots or other regions of masking material. The masking process may comprise applying a plurality of discrete units of masking material.

Examples of coating processes in the context of this invention, include, without limitation, deposition processes, in particular particle or vapour deposition processes. The coating process may suitably be sub-atmospheric, i.e. involve exposure of the one or more optionally masked items to sub-atmospheric pressures. Suitably, the sub-atmospheric pressure may be in the range of from 0.01 to 999.99 mbar, such as in the range of from 0.1 to 999.99 mbar, e.g. in the range of from 0.5 to 999.99 mbar. In some embodiments, the coating process is a sub-atmospheric vapour deposition process, in particular a plasma polymerisation process.

Coating conditions may, for example, be vapour deposition conditions. The coating conditions may comprise sub-atmospheric pressure. In an embodiment, the vapour deposition conditions are plasma polymerisation conditions.

Coating conditions may optionally comprise: an excitation medium; and a monomer that is at least partly activated by the excitation medium to form a liquid repellent coating on the item. The excitation medium may in particular comprise a plasma, optionally a pulsed plasma.

The monomer may be a compound of formula (0: Rh (R3 R2 R4 where R1, R2 and R3 are independently selected from hydrogen, alkyl, haloalkyl or aryl optionally substituted by halo; and R4 is a group X-R5 where R5 is an alkyl or haloalkyl group and X is a bond; X is a group of formula -C(0)0(CH2)nY, where n is an integer of from 1 to 10 and Y is a bond or a sulphonamide group; or X is a group -(0)pR6(0)q(CH2)t, where R6 is aryl optionally substituted by halo, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of from 1 to 10, provided that where q is 1, t is other than 0.

Suitably, the item may be exposed to a plasma comprising a monomer compound for a period of time sufficient to allow a protective polymeric coating to form on a surface of the item; wherein the monomer compound has the following formula (ID: Ri R3 R2 R4 where Ri, R2 and R4 are each independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl or halo alkyl or aryl optionally substituted by halo, and R3 is selected from: CX3 CX3 X 0 ni or where each X is independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl, halo alkyl or aryl optionally substituted by halo; and n1 is an integer from 1 to 27.

In some embodiments, the monomer may be as identified in the claims of WO 2007/083122.

Suitably, the monomer may be selected from 1H,1H,2H,2H-perfluorohexyl acrylate (PFAC4), 1H,1H,2H,2H-perfluorooctyl acrylate (PFAC6), 1H,1H,2H,2H-perfluorodecyl acrylate (PFAC8) and 1H,1H,2H,2H-perfluorododecyl acrylate (PFAC10).

Suitably, an optionally masked item may be exposed to the monomer compound in combination with a crosslinking agent comprising two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500 °C. The crosslinking reagent may be selected from, for example, 1,4-butanediol divinyl ether (BDVE), 1,4-cyclohexanedimethanol divinyl ether (CODE), 1,7-octadiene (170D), 1,2,4-trivinylcyclohexane (TVCH), divinyl adipate (DVA), 1,3-divinyltetramethyldisiloxane (DVTM DS), diallyl 1,4-cyclohexanedicarboxylate (DCHD), 1,6-divinylperfluorohexane (DVPFH), 1H,1H,6H,6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis(diallyl acetal) (GBDA).

The coating conditions may lead to a coating that may advantageously be liquid repelling, e.g. water and/or oil repelling.

Optionally, the jig may be used for holding an item during two or more surface modification process steps. For example, the jig may be used for holding an item during a masking process step, a coating process step, or a demasking process step (to remove the masking material applied during a prior masking process step). The two or more surface modification process steps may be carried out by the same production apparatus, or by two or more different production apparatuses. When two or more different production apparatuses are used, the jig eliminates the need for a human operator to manually handle the item between process steps as it is transferred between different production apparatuses. This not only reduces the chances of the item being dropped or damaged by the human operator, but also avoids the need for the human operator to reposition the item relative to the jig during two or more surface modification process steps.

In some embodiments, the first support may comprise a first set of one or more support elements and the second support may comprise a second set of one or more support elements.

The first set of one or more support elements may comprise in the range of from one to thirty support elements, or in the range of from one to twenty support elements, optionally in the range of from one to ten support elements. For example, the first set of one or more support elements may comprise one support element, or two support elements, or three support elements, or four support elements, or five support elements, or six support elements, or seven support elements, or eight support elements, or nine support elements, or ten support elements.

The second set of one or more support elements may comprise in the range of from one to thirty support elements, or in the range of from one to twenty support elements, optionally in the range of from one to ten support elements. For example, the second set of one or more support elements may comprise one support element, or two support elements, or three support elements, or four support elements, or five support elements, or six support elements, or seven support elements, or eight support elements, or nine support elements, or ten support elements.

When the first and second supports are in the closed configuration, the item may be clamped between the first and second sets of support elements. The use of support elements minimises the contact area between the jig and the item, thereby maximising the surface area of the item available to undergo surface modification.

Some or all of the support elements in the first set of support elements may have a complimentary support element in the second set of support elements that overlie each other when the first and second supports are in the closed configuration.

Optionally, the first and second supports may be configurable in an open configuration for insertion and removal of the item. The open configuration of the first and second supports defines an arrangement in which an item may be supported on either the first support or second support; but is not clamped between the first and second supports. Such an arrangement facilitates insertion of an item into the jig between the first and second supports, as well as facilitating the removal of an item from the jig.

In some embodiments, the first support may have an opening configured to expose an area of a first surface of the item when clamped in the jig. The opening may suitably have an area equal to the area of the first surface of the item. Alternatively, the opening may have an area larger than the area of the first surface of the item. The presence of an opening in the first support advantageously increases the total area of the first surface of the item available to undergo surface modification.

In some embodiments, the first support may have a plurality of openings configured to expose a plurality of areas of a first surface of an item when clamped in the jig. Alternatively, the first support may have a plurality of openings each configured to expose an area of the first surfaces of a plurality of items clamped in the jig.

Optionally, the first set of support elements may be arranged to extend into the opening. This allows the whole item to be held within the opening, thereby increasing the total area of the first surface of the item available to undergo surface modification.

In some embodiments, the second support may have an opening configured to expose an area of a second surface of the item when clamped in the jig. The opening may suitably have an area equal to the area of the second surface of the item. Alternatively, the opening may have an area larger than the area of the second surface of the item. The presence of an opening in the second support advantageously increases the total area of the surface of the item available to undergo surface modification.

In some embodiments, the second support may have a plurality of openings configured to expose a plurality of areas of a second surface of an item when clamped in the jig. Alternatively, the second support may have a plurality of openings each configured to expose an area of the second surfaces of a plurality of items clamped in the jig.

Optionally, the second set of support elements may be arranged to extend into the opening. This allows the whole item to be held within the opening, thereby increasing the total area of the second surface of the item available to undergo surface modification.

In some embodiments, the locating element may be mounted on a support element. Thus, in this way, the support element is capable of both supporting the item and locating the item relative to the jig.

Optionally, the locating element may comprise two or more locating elements each mounted individually on two or more respective support elements of the first set. In some embodiments, each of the support elements of the first set may comprise a locating element mounted thereon.

Alternatively, the locating element may comprise a locating element mounted on a support element of the first set and a locating element mounted on a support element of the second set. Locating elements mounted on support elements of the first and second sets may suitably be complimentary, i.e. they may cooperate and/or overlie each other when the first and second supports are in the closed configuration.

In some embodiments, the locating element may comprise a male feature configured to engage with a corresponding female feature of the cooperating element of the item. For example, the locating element may comprise a protrusion configured to engage with a cavity or hole in the item. In a particular embodiment, the locating element may comprise a pin configured to engage with a screw hole in the item.

Alternatively, the locating element may comprise a female feature configured to engage with a corresponding male feature of the cooperating element of the item. For example, the locating element may comprise a cavity or hole configured to engage with a protrusion on the item.

Examples of suitable features of the cooperating element of the item include, but are not limited to, screw holes, through holes, vias, slots, solder formations, wire connector lugs, terminal blocks, integrated circuits, capacitors, controller chips, resistors, transformers, cable or microphone jacks, and pogo pins.

In some embodiments, the first and second supports may be configured to rotate relative to one another between the open and closed configurations. For example, the first support may be arranged to pivot about the second support or vice versa.

Optionally, the first and second supports may be connected by one or more hinged connections, i.e. hinges or hinged joints. For example, the first and second supports may be connected by a pair of hinged connections, each connected at one end to a respective side of the first and second supports. Hinged connections may advantageously allow the first and second supports to rotate relative to one another between the open and closed configurations.

In some embodiments, the opening mechanism may comprise a pair of hinge arms, each connected at one end to a respective side of the first and second supports and at another end to a hinged joint, wherein the hinged joint is movable to an open configuration in which the hinge arms are pivoted away from one another to thereby move the first and second supports apart.

In some embodiments, the jig may comprise a fastener for holding the first and second supports together in the closed configuration. For example, the jig may comprise a spring mounted thumb clamp, or a sliding thumb lock. The fastener advantageously retains the item in the jig during the surface modification process, or when loading the jig into a rotatable subassembly as described below.

Optionally, the jig may comprise a secondary locating element configured to engage a cooperating element of a rotatable sub-assembly to thereby locate the jig relative to the rotatable sub-assembly. The secondary locating element may, for example, be configured to engage with a cooperating element arranged in a jaw or arm of the rotatable sub-assembly. The rotatable sub-assembly may suitably be mounted on a mounting sub-assembly so as to be rotatable relative thereto. In this way, all sides/faces of the item held by the jig can be inspected, or surface modification processes carried out thereon.

In some embodiments, the secondary locating element may comprise a male feature configured to engage with a corresponding female feature of the cooperating element of the rotatable sub-assembly. For example, the secondary locating element may comprise a protrusion configured to engage with a cavity or hole in the rotatable sub-assembly. In some embodiments, the protrusion may be tapered. In a particular embodiment, the locating element may comprise a pin configured to engage with a hole in the rotatable sub-assembly.

Alternatively, the secondary locating element may comprise a female feature configured to engage with a corresponding male feature of the cooperating element of the rotatable subassembly. For example, the secondary locating element may comprise a cavity or hole configured to engage with a protrusion on the rotatable sub-assembly. In some embodiments, the cavity or hole may be tapered.

In embodiments in which a surface modification process is carried out on an item held in the jig by automated production machinery, such as a robotic arm configured to apply a coating or masking material to the item, rotation of the item relative to the machinery enables the complexity of the machinery -and therefore its related cost -to be minimised. For example, it may be necessary to provide only a single robotic arm able to carry out a surface modification process on both sides of the item.

In some embodiments, the first support may comprise an abutment portion arranged to abut a portion of a first side of the item when the first and second supports are configured in the closed configuration. Alternatively or additionally, the second support may comprise an abutment portion arranged to abut a portion of a second side of the item when the first and second supports are configured in the closed configuration.

The abutment portion may advantageously be separable from the first/second support to facilitate replacement of the abutment portion. This arrangement enables the abutment portion to be replaced without modification being required to the rest of the jig. For example, the abutment portion may be replaced if it becomes worn or perished during use. This arrangement also allows abutment portions of different shapes or sizes to be used with the jig.

Suitably, the abutment portion may be arranged to abut a portion of the item to be masked, for example, when the jig is for holding an item during a coating process. Advantageously, this may eliminate the need to perform a masking step prior to the coating process as well as a demasking process step after the coating process.

In some embodiments the abutment portion may comprise a resiliently deformable material. In this way, the material may lie flat against flat surfaces of the item and encapsulate any raised 3-dimensional features on the item. For example, when the item is a printed circuit board, the resiliently deformable material may lie flat against the surface of the board and encapsulate any electronic components mounted thereon. Thus, a good seal can be readily provided between the abutment portion and an item which it abuts. Moreover, in some embodiments, compression of the resiliently deformable material may provide a clamping force to urge the abutment portion into contact with the item.

In some embodiments the abutment portion comprises a material having a Shore A hardness of 50A or more or 50A or less, optionally 20A or less. Materials within this range have been found to provide an appropriate degree of deformation to achieve a good seal.

Examples of appropriate materials for the one or more abutment portions include elastomeric materials, for example silicon rubbers or fluorinated elastomers. Examples of fluorinated elastomers include fluoroelastomers (FKM), perfluoro-elastomers (FFKM), or tetrafluoroethylene/propylene rubbers (FEPM). A particular advantage of fluorinated elastomers is that they are low-or zero-outgassing materials, and therefore suitable for exposure to surface modification conditions.

A second aspect of the invention provides a method of holding an item in a jig during a surface modification process, the jig comprising first and second supports and a locating element, wherein the method comprises the steps of: (0 placing the item on the first support; (ii) defining the position of the item relative to the jig by engaging the locating element with a cooperating element on the item; and (iii) clamping the item between the first and second supports.

The method may comprise the step of arranging the first and second supports in an open (i.e. non-clamping) configuration for insertion / removal of the item between the first and second supports.

In some embodiments, the step of clamping the item between the first and second supports may comprise clamping the item between a first set of one or more support elements arranged on the first support and a second set of one or more support elements arranged on the second support.

The method may comprise the step of arranging the first support, on which a first set of one or more support elements are arranged and the second support, on which a second set of one or more support elements are arranged, in a closed configuration to thereby clamp the item between the first and second sets of one or more support elements.

In some embodiments, the step of defining the position of the item relative to the jig may comprise engaging a male feature with a female feature on the item. For example, the step of defining the position of the item relative to the jig may comprise engaging a protrusion with a cavity or hole in the item.

The method may comprise engaging one or more secondary locating elements of the jig with one or more cooperating elements of a rotatable sub-assembly to thereby locate the jig relative to the rotatable sub-assembly.

A third aspect of the invention provides a method of carrying out a surface modification process step on an item, the method comprising the steps of: securing the item with a jig according to the first aspect and/or any of the optional features thereof described herein and/or any of the embodiments described herein; and carrying out a surface modification process step on the item.

In some embodiments the surface modification process step may comprise applying a surface layer such as a masking material to the secured item. The masking material may be applied to one or more regions of the secured item prior to exposing the item to coating conditions, to thereby prevent coating those one or more regions. Alternatively, or in addition, the surface layer may comprise an adhesive layer.

The method may comprise the steps of carrying out a first surface modification process step on a first face of the item and a second process step on a second face of the item. In some embodiments the method may further include the steps of, after carrying out the first surface modification process step and before carrying out the second surface modification process step, rotating the jig from a first position to a second position. Optionally, the jig may be rotated through substantially 180° from the first position to the second position. The first and second surface modification process steps may be carried out by the same production apparatus, i.e. an apparatus configured to carry out the first and second surface modification process steps.

Throughout the description and claims of this specification, the words "comprise" and "contain" and variations of the words, for example "comprising" and "comprises", mean "including but not limited to", and do not exclude other components, integers or steps. Moreover, the singular encompasses the plural unless the context otherwise requires: in particular, where the indefinite article is used, the specification is to be understood as contemplating plurality as well as singularity, unless the context requires otherwise.

Preferred features of each aspect of the invention may be as described in connection with any of the other aspects. Within the scope of this application it is expressly intended that the various aspects, embodiments, examples and alternatives set out in the preceding paragraphs, in the claims and/or in the following description and drawings, and in particular the individual features thereof, may be taken independently or in any combination. That is, all embodiments and/or features of any embodiment can be combined in any way and/or combination, unless such features are incompatible.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1A is a front view of a jig in accordance with an embodiment of the invention in an open conformation; Figure 1B is a side view of the jig of Figure 1A; Figure 1C is a plan view of the jig of Figure 1A; Figure 1D is a perspective view of the jig of Figure 1A; Figure 2A is a plan view of the jig of Figures 1A-D in a closed conformation; Figure 2B is a side view of the jig of Figure 2A; Figure 2C is a perspective view of the jig of Figure 2A; Figure 3A is a front view of two printed circuit boards being supported by the jig of Figures 1A-D in an open conformation; Figure 3B is a side view of the jig and printed circuit boards of Figure 3A; Figure 3C is a plan view of jig and printed circuit boards of Figure 3A; Figure 3D is a perspective view of the jig and printed circuit boards of Figure 3A; Figure 4A is a front view of two printed circuit boards being clamped by the jig of Figures 1A-D in a closed conformation; Figure 4B is a side view of the jig and printed circuit boards of Figure 4A; Figure 5 is a perspective view of a C-shaped printed circuit board being clamped by a jig according to a second embodiment of the invention in a closed conformation; Figure 6 is a perspective view of a jig in accordance with a third embodiment of the invention engaged with the jaws of a rotatable sub-assembly Figure 7A is a perspective view of a C-shaped printed circuit board being supported by the jig according to a fourth embodiment of the invention in an open conformation; and Figure 7B is a perspective view of a C-shaped printed circuit board being supported by the jig of Figure 7A in a closed conformation.

DETAILED DESCRIPTION

Figures 1, 2,3 and 4 illustrate a jig 100 according to a first embodiment of the invention. The jig 100 is assembled from planar rectangular first and second support frames 110, 120 joined together by a pair of hinges 102, 104. The first and second support frames 110, 120 are formed from lightweight sheet aluminium and are of approximately the same length, width and thickness.

The first and second support frames 110, 120 are moveable relative to each other from a first open conformation shown in Figures 1 and 3 to a second closed conformation shown in Figures 2 and 4. The first and second support frames 110, 120 are configured to hold both a large printed circuit board 190 and a small printed circuit board 195, as is described in more detail below.

Referring to Figures 1A to 1 D, the first support frame 110 has opposing first and second faces 113, 114 and four edges 115, 116, 117, 118. The pair of hinges 102, 104 joining the first support frame 110 to the second support frame 120 are arranged spaced apart along the first edge 115. The second and third edges 116, 117 are adjacent to the first edge 115 and parallel to one another. The fourth edge 118 is adjacent to the second and third edges 116, 117 and parallel to the first edge 115.

The first support frame 110 has a first opening 111 and a second opening 112. The first opening 111 is larger than the second opening 112. The first opening 111 has a first set of three support elements 130 that project from the first support frame 110 into the first opening 111 in the plane of the first support frame 110. The first set of support elements 130 each bear a locating element 140 that projects upwards from the support elements 130 perpendicular to the plane of the second face 114.

The first opening 111 has a second set of two support elements 132 that project from the first support frame 110 into the first opening 111 in the plane of the first support frame 110. The second set of support elements 132 do not bear locating elements 140.

The second opening 112 has set of three support elements 134 that project from the first support frame 110 into the second opening 112 in the plane of the first support frame 110. The three support elements 134 each have a locating element 140 that projects upwards from the support elements 134 perpendicular to the plane of the second face 114.

All of the support elements 130, 132, 134 of the first support frame 110 lie flush with the first face 113. Since all of the support elements 130, 132, 134 of the first support frame 110 have a thickness less than the thickness of the first support frame 110, they project into the first and second openings 111, 112 at a depth lower the level of the plane of the second face 114.

The second and third edges 116, 117 of the first support frame 110 bear a total of four tabs 160 (two on each edge) that project upwards from the first support frame 110 perpendicular to the plane of the second face 114. Each tab 160 bears a cylindrical secondary locating element 150 that tapers outwards away from the first support frame 110 in the plane of the first support frame 110.

A small planar tab 170 is attached to the fourth edge 118 and extends from the first support frame 110 in the plane of the first support frame 110. The small planar tab 170 bears a spring mounted thumb clip 175 that projects upwards from the small planar tab 170 perpendicular to the plane of the second face 114.

The second support frame 120 has opposing first and second faces 123, 124 and four edges 125, 126, 127, 128. The pair of hinges 102, 104 joining the second support frame 120 to the first support frame 110 are arranged spaced apart along the first edge 125. The second and third edges 126, 127 are adjacent to the first edge 125 and parallel to one another. The fourth edge 128 is adjacent to the second and third edges 126, 127 and parallel to the first edge 125.

The second support frame 120 has a first opening 121 and a second opening 122. The first and second openings 121, 122 are of approximately the same size and shape as the first and second openings 111, 112 of the first support frame 110. Furthermore, the positions of the first and second openings 121, 122 in the second support frame 120 are the same as the positions of the first and second openings 111, 112 in the first support frame 110.

The first opening 121 has a set of five support elements 136 that project from the second support frame 120 into the first opening 121 in the plane of the second support frame 120. The five support elements 136 of the first opening 121 do not bear locating elements 140. The second opening 122 has a set of three support elements 138 that project from the second support frame 120 into the second opening 122 in the plane of the second support frame 120. The three support elements 138 of the second opening 122 do not bear locating elements 140.

The support elements 136, 138 of the first and second openings 121, 122 of the second support frame 120 are of the same thickness as the second support frame 120 and therefore lie flush with both the first and second faces 123, 124.

Inset into the second and third edges 126, 127 are a total of four indents 162 (two on each edge). The indents 162 define generally rectangular shaped cut outs in the second and third edges 126, 127. The positions of the indents 162 in the second support frame 120 are the same as the positions of the tabs 160 in the first support frame 110. Inset into the fourth edge 128 is a fifth indent 164, which defines a generally rectangular shaped cut-out along a portion of the fourth edge 128.

Figures 1A to 1D illustrate the jig 100 in an open conformation, in which the second face 114 of the first support frame 110 is arranged at an angle of approximately 110° to the first face 123 of the second support frame 120. The open conformation of the jig 100 allows a printed circuit board to be inserted or removed from between the first and second support frames 110, 120. The first support frame 110 can be rotated relative to the second support frame 120 about hinges 102, 104 anywhere in the angular range of from 0° to 180°.

Figures 2A to 2D illustrate the jig 100 in the closed conformation, wherein the first and second support frames 110, 120 are arranged such the first and second support frames 110, 120 lie directly on top of one another (i.e. are superimposed). When the jig 100 is in the closed conformation, the tabs 160 are accommodated by the indents 162. The spring mounted thumb clip 175 of the first support frame 110 is engaged with the fifth indent 164 of the second support frame 120, thereby securing the jig 100 in the closed conformation. In order to bring the jig 100 back into the open conformation, pressure is applied by hand to the spring mounted thumb clip 175 so that it no longer engages the fifth indent 164. The first support frame 110 can then be lifted up and rotated away from the second support frame 120 about hinges 102, 104.

Figures 3A to 3D illustrate the jig 100 in an open conformation with large and small printed circuit boards 190, 195 being supported in the first and second openings 111, 112 respectively. The large printed circuit board 190 rests on the five support elements 130, 132 of the first opening 111. Locating elements 140 present on three of the support elements 132 engage with screw holes 191 of the large printed circuit board 190, thereby allowing the large printed circuit board 190 to be positioned precisely within the first opening 111.

Likewise, the small printed circuit board 190 rests on the three support elements 134 of the second opening 112. Locating elements 140 present on all three of the support elements 134 engage with screw holes 196 of the small printed circuit board 195, thereby allowing the small printed circuit board 195 to be positioned precisely within the second opening 112.

In use, the large and small printed circuit boards 190, 195 are positioned in the first and second openings 111, 112 respectively. The second support frame 120 is then rotated about hinges 102, 104 until the first face 123 of the second support frame 120 overlies the second face 114 of the first support frame 110 such that the fifth indent 164 of the second support frame 120 contacts the spring mounted thumb clip 175 of the first support frame 110. At this point increased pressure must be applied by hand to push the first and second support frames 110, 120 together resulting in the fifth indent 164 engaging with the spring mounted thumb clip 175.

Figures 3A and 4B illustrate the jig 100 in a closed conformation in which large and small printed circuit boards 190, 195 are clamped between the first and second support frames 110, 120. The large printed circuit board 190 is clamped between the five support elements 130, 132 of the first opening 111 of the first support frame 110 and the five support elements 136 of the first opening 121 of the second support frame 120. The small printed circuit board 195 is clamped between the three support elements 134 of the second opening 112 of the first support frame 110 and the three support elements 138 of the second opening 122 of the second support frame 120.

To remove the large and small printed circuit boards 190, 195, pressure is applied by hand to the spring mounted thumb clip 175 so that it no longer engages the fifth indent 164 of the second support frame 120. The second support frame 120 is then rotated about hinges 102, 104 and lifted up away from the first support frame thus returning the jig 100 to the open conformation.

Figure 5 illustrates a jig 200 according to a second embodiment of the invention. The illustrated jig 200 is similar in many respects to the jig 100 illustrated in Figures 1 to 4, and the description below is focused mainly on those features that are different.

The jig 200 comprises a planar rectangular first support frame 210 joined to a planar C-shaped second support frame 220 by a pair of hinges 202, 204. The first and second support frames 210, 220 are configured to hold a C-shaped printed circuit board 290, as described below. Figure 5 illustrates the jig 200 in the closed conformation with a C-shaped printed circuit board 290 clamped between the first and second support frames 210, 220.

The first support frame 210 has opposing first and second faces 213, 214 and four edges 215, 216, 217, 218. The pair of hinges 102, 104 joining the first support frame 210 to the second support frame 120 are arranged spaced apart along the first edge 215. The second and third edges 216, 217 are adjacent to the first edge 215 and parallel to one another. The fourth edge 218 is adjacent to the second and third edges 216, 217 and parallel to the first edge 215.

The first support frame 210 has a C-shaped opening 211. The opening 211 has a set of seven support elements 230 that project from the first support frame 210 into the opening 211 in the plane of the first support frame 210. The support elements 230 each bear a locating element 240 (not visible from Figure 5) that projects upwards from each support element 230 perpendicular to the plane of the second face 214.

The first and fourth edges 215, 218 of the first support frame 210 bear a total of four tabs 260 (two on each edge) that project upwards from the first support frame 210 perpendicular to the plane of the second face 214. Each tab 260 bears a cylindrical secondary locating element 250 that tapers outwards away from the first support frame 210 in the plane of the first support frame 210.

The second face 214 bears a spring mounted thumb clip 275 that projects upwards from the second face 214 perpendicular to the plane of the second face 214. The spring mounted thumb clip is inset from the fourth edge 218 and is located towards the centre of the first support frame 210. The first support frame 210 has two rectangular openings 280 either side of the spring mounted thumb clip 275. The openings 280 serve to reduce the amount of aluminium required to manufacture the first support frame 220.

The second support frame 220 has opposing first and second faces 223, 224 and four edges 225, 226, 227, 228. The pair of hinges 202, 204 joining the second support frame 220 to the first support frame 210 are arranged spaced apart along the first edge 225. The second and third edges 226, 227 are adjacent to the first edge 225 and parallel to one another.

The fourth edge 228 is adjacent to the second and third edges 226, 227 and parallel to the first edge 225. A central portion 264 of the fourth edge 228 is inset towards the centre of the second support frame 220, thus giving the second support frame 220 a generally planar C-shape.

The second support frame 220 has a C-shaped opening 221. The opening 221 is of approximately the same size and shape as the opening 211 of the first support frame 210. The position of the opening 221 in the second support frame 220 is the same as the position of the opening 211 in the first support frame 210.

The opening 221 has a set of seven support elements 232 that project from the first support frame 210 into the opening 211 in the plane of the second support frame 220. The support elements 232 do not bear locating elements 240.

When the jig 200 is in the closed conformation, as illustrated in Figure 5, the spring mounted thumb clip 275 of the first support frame 210 is engaged with the central portion 264 of the fourth edge 228 of the second support frame 120, thereby securing the jig 200 in the closed conformation. In order to bring the jig 200 into the open conformation, pressure is applied by hand to the spring mounted thumb clip 175 so that it no longer engages the central portion 264. The first support frame 210 can then be lifted up and rotated away from the second support frame 220 about hinges 202, 204. The C-shaped printed circuit board 290 can then be removed from between the first and second support frames 210, 220.

Figure 6 illustrates a jig 300 according to a third embodiment of the invention and a rotatable sub-assembly 400. The illustrated jig 300 is similar in many respects to the jig 100 illustrated in Figures 1 to 4, being configured to hold both a large printed circuit board 190 and a small printed circuit board 195. The rotatable sub-assembly 400 is configured to engage with the jig 300 when the jig 300 is in the closed conformation, and rotation of the rotatable sub-assembly 400 enables surface modification processes to be carried out on either side of the large and small printed circuit boards 190, 195.

The rotatable sub-assembly 400 comprises first and second elongate jaws 410, 420. A first groove 411 runs along the length of the first jaw 410. A second groove 421 runs along the length of the second jaw 420. The first groove 411 is configured to engage with the second edges 316, 326 of the first and second supports 310, 320. The second groove 421 is configured to engage with the third edges 317, 327 of the first and second supports 310, 320. Each of the jaws 410, 420 comprise two sockets 450 configured to engage with the secondary locating elements 350 of the jig 300, thereby allowing the jig 300 to be positioned precisely within the rotatable sub-assembly 400.

The rotatable sub-assembly 400 can be mounted on a static mounting sub-assembly (not shown in Figure 6), which is capable of rotating the rotatable sub-assembly 400 relative to the static mounting sub-assembly about a rotational axis, R. The rotatable sub-assembly 400 may be rotated about the rotational axis, R, through 180°, thereby allowing one or more regions of masking material applied to opposite faces of the large and small printed circuit boards 190, 195 by a robotic arm (not shown in Figure 6).

Thus, a single robotic arm can be used to operate on both faces of the printed circuit boards 190, 195. The printed circuit boards 190, 195 are then removed from the jig 300 and exposed to surface modification conditions, e.g. vapour deposition conditions by placing them in a plasma polymerisation deposition chamber. The printed circuit boards 190, 195 may in some circumstances be returned to the jig 300 following the surface modification process in order to remove some or all of the regions of masking material, or to perform other surface modification processes thereon.

The jigs 100, 200 of the first and second embodiments of the invention may also be used with the rotatable sub-assembly 400 in the same way as described above.

Figure 7A and 7B illustrate a jig 500 according to a fourth embodiment of the invention. The illustrated jig 500 is similar in many respects to the jigs 100, 200, 300 of the first through third embodiments illustrated in Figures 1 to 6, and the description below is focused mainly on those features that are different.

The jig 500 comprises a planar C-shaped first support frame 510 joined to a planar C-shaped second support frame 520 by a hinge 502. The first and second support frames 510, 520 are configured to hold a C-shaped printed circuit board 590, as described below. Figure 7A illustrates the jig 500 in an open conformation supporting a C-shaped printed circuit board 590. Figure 7B illustrates the jig 500 in the closed conformation with a C-shaped printed circuit board 590 clamped between the first and second support frames 510, 520.

The first support frame 510 has two rectangular abutment portions 506, 508, each of which bear a rectangular sheet of fluorinated elastomer 586, 588 that is shaped and sized to correspond to a region of the C-shaped printed circuit board 590 to be obscured by the respective abutment portion 506, 508.

When the jig 500 is in the closed conformation, as illustrated in Figure 7B, the fluorinated elastomer 586, 588 side of the abutment portions 506, 508 each abut a region of the C-shaped printed circuit board 590. The fluorinated elastomer 586, 588 resiliently deforms around and encapsulates any raised components on the C-shaped printed circuit board 590, thereby forming a good seal over the C-shaped printed circuit board 590 and providing a masking effect when item held in jig 500 is subject to a coating process.

The jig 500 has four cylindrical secondary locating elements 550 that taper outwards away from the first support frame 510 in the plane of the first support frame 510. Thus, the jig 500 may also be used with the rotatable sub-assembly 400 of the third embodiment of the invention in the same way as described above for the jigs 100, 200, 300 in accordance with the first through third embodiments of the invention.

In each of the embodiments and aspects described herein the jig is for holding an item such as a printed circuit board, or a plurality of items such as a plurality of printed circuit boards or an assembly of a plurality of printed circuit boards. The or each item is typically a generally planar member having a relatively small thickness. Thus, the or each item has generally two main faces subtended by a relatively thin edge. The or each item may have any shape in planform, and typically has a convoluted perimeter shape. The or each item typically has a length (i.e. a longest dimension across at least one of its main faces) of 150 mm or less, and/or a width (i.e. a longest dimension in a direction perpendicular to the length across at least one of its main faces) of 90 mm or less.

The or each item may be placed between the first and second supports of the jig by hand, or by automated means such as a robotic arm. The use of a robotic arm may be advantageous in making the placement of multiple identical items into the jig highly repeatable.

By way of example, a vapour deposition process in accordance with an embodiment of the invention comprises exposing the item to vapour deposition conditions substantially as described in WO 2007/083122, which is incorporated herein by reference.

In another embodiment the vapour deposition conditions further comprise a cross-linker selected from 1,4-butanediol divinyl ether (BDVE), 1,4-cyclohexanedimethanol divinyl ether (CDDE), 1,7-octadiene (170D), 1,2,4-trivinylcyclohexane (TVCH), divinyl adipate (DVA), 1,3-divinyltetramethyldisiloxane (DVTMDS), diallyl 1,4-cyclohexanedicarboxylate (DCHD), 1,6-divinylperfluorohexane (DVPFH), 1H,1H,6H,6H-perfluorohexanediol diacrylate (PFHDA) and glyoxal bis(diallyl acetal) (GBDA).

Claims

CLAIMS1. A jig for holding an item during a surface modification process, the jig comprising: a first support configured to support the item; a second support configured to support the item; and a locating element configured to engage a cooperating element of the item to thereby locate the item relative to the jig; wherein the first and second supports are configurable in a closed configuration in which the item is clamped between the first and second supports.
A jig according to claim 1, wherein the item comprises a printed circuit board.
3. A jig according to claim 1 or claim 2, wherein the first support comprises a first set of one or more support elements and the second support comprises a second set of one or more support elements; and wherein when the first and second supports are configured in the closed configuration, the item is clamped between the first and second sets of support elements.
4. A jig according to claim 3, wherein the first and second supports are configurable in an open configuration for insertion and removal of the item.
5. A jig according to any preceding claim, wherein the first support has a first opening configured to expose a region of a surface of the item when clamped in the jig.
6. A jig according to claim 5, wherein the first set of support elements are arranged to extend into the first opening.
7. A jig according to any preceding claim, wherein the second support has a second opening configured to expose a region of a surface of the item when held in the jig.
8. A jig according to claim 7, wherein the second set of support elements are arranged to extend into the second opening.
9. A jig according to any preceding claim, wherein the locating element is mounted on a support element.
10. A jig according to any preceding claim, wherein the locating element comprises a male feature configured to engage with a corresponding female feature of the cooperating element of the item.
11. A jig according to any preceding claim, wherein the locating element comprises a protrusion configured to engage with a cavity or hole in the item.
12. A jig according to any one of claims 3 to 11, wherein each of the support elements in the first set of one or more support elements comprise a locating element mounted thereon.
13. A jig according to any preceding claim, wherein the first and second supports are configured to rotate relative to one another between the open and closed configurations.
14. A jig according to any preceding claim, wherein the first and second supports are connected by one or more hinged connections.
15. A jig according to any preceding claim, comprising a fastener for holding the first and second supports together in the closed configuration.
16. A jig according to any preceding claim, comprising a secondary locating element configured to engage a cooperating element of a rotatable sub-assembly to thereby locate the jig relative to the rotatable sub-assembly.
17. A jig according to claim 16, wherein the secondary locating element comprises a male feature configured to engage with a corresponding female feature on the rotatable subassembly.
18. A jig according to any preceding claim, wherein the first support comprises an abutment portion arranged to abut a portion of a first side of the item when the first and second supports are configured in the closed configuration to thereby obscure the portion of the first side of the item.
19. A jig according to claim 18, wherein the abutment portion is separable from the first support to facilitate replacement of the abutment portion.
20. A method of holding an item in a jig during a surface modification process, the jig comprising first and second supports and a locating element, wherein the method comprises the steps of: placing the item on the first support; (ii) defining the position of the item relative to the jig by engaging the locating element with a cooperating element on the item; and (iii) clamping the item between the first and second supports.
21. A method according to claim 20, wherein the item comprises a printed circuit board.
22. A method according to claim 20 or claim 21, comprising the step of arranging the first and second supports in an open configuration for insertion / removal of the item between the first and second supports.
23. A method according to any one of claims 20 to 22, wherein the step of clamping the item between the first and second supports comprises clamping the item between a first set of one or more support elements arranged on the first support and a second set of one or more support elements arranged on the second support.
24. A method according to claim 22 or claim 23, comprising the step of arranging the first support, on which a first set of one or more support elements are arranged, and the second support, on which a second set of one or more support elements are arranged, in a closed configuration to thereby clamp the item between the first and second sets of one or more support elements.
25. A method according to any one of claims 20 to 24, wherein the step of defining the position of the item relative to the jig comprises engaging a male feature with a female feature on the item.
26. A method according to any one of claims 20 to 25, comprising engaging one or more secondary locating elements of the jig with one or more cooperating elements of a rotatable sub-assembly to thereby locate the jig relative to the rotatable sub-assembly.
27. A method of carrying out a surface modification process step on an item, the method comprising the steps of: (i) securing the items with a jig according to any of claims 1 to 19; and (ii) carrying out a surface modification process step on the secured item.