CN211805637U - Clamp for surface modification process and assembly comprising same - Google Patents

Clamp for surface modification process and assembly comprising same Download PDF

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Publication number
CN211805637U
CN211805637U CN201790001580.3U CN201790001580U CN211805637U CN 211805637 U CN211805637 U CN 211805637U CN 201790001580 U CN201790001580 U CN 201790001580U CN 211805637 U CN211805637 U CN 211805637U
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China
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abutment
abutments
inserts
clamp
clamping
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Expired - Fee Related
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Chinese (zh)
Inventor
史蒂芬·詹姆斯·戴蒙德
周泽锋
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P2i Ltd
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P2i Ltd
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Priority claimed from GBGB1621641.8A external-priority patent/GB201621641D0/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment

Abstract

The utility model discloses an anchor clamps that are used for centre gripping one or more article when surface modification, it includes one or more butt joint portion, butt joint portion can be from the separation of supporting part to conveniently change butt joint portion. With this arrangement, the abutting portion can be replaced without changing the remaining portion of the jig. For example, the docking portion may be replaced when it becomes worn or brittle during use. By installing a docking station that is appropriate for a particular article, the clamp can accommodate articles of different sizes, shapes and configurations.

Description

Clamp for surface modification process and assembly comprising same
Technical Field
The present invention relates to fastening articles in a surface modification process, and more particularly, to a clamp for holding and/or partially shielding one or more articles, an assembly comprising a clamp, a method of operating a clamp, and a method of surface modification using a clamp.
Background
In surface modification of an article, such as the application of a vapor deposition coating, it is necessary to secure the article in place. For example, the article may need to be maintained in and provide surface modification conditions to the surface modification chamber.
For reasons of economy, it is desirable that the articles can be secured in a relatively compact manner to achieve a high chamber loading.
Some articles also need to be clamped to maintain their structural integrity during the surface modification process. This is particularly important when a sub-atmospheric surface modification process is applied to prevent flaking, delamination or other damage.
In surface modification processes, it is sometimes necessary to mask an article so that a portion of the surface is not modified. Masking is important, for example, when portions of an article may lose their intended function or appearance due to the application of a coating.
A particular area of interest for masking includes coating electronic devices, such as touch screen devices, using a vapor deposition process. It is of great benefit to apply coatings to these devices, such as liquid barriers (e.g. WO2007/083122), while components of the devices benefit from being uncoated. These components include, but are not limited to, electrical contacts, exterior surfaces, and screens. If not effectively masked during coating, the function or appearance of these components may be affected.
Disclosure of Invention
In general terms, the present invention provides a clamp for securing one or more articles in a surface modification process that includes one or more abutments that are separable from a support to facilitate replacement of the abutments.
A first aspect of the invention provides a clamp for securing one or more articles in a surface modification process, comprising first and second inserts configurable to a clamping position in which one or more articles are clamped between the first and second inserts, wherein at least one of the first and second inserts is provided with a support portion carrying one or more abutments arranged to abut one or more articles located between the first and second inserts in the clamping position, the one or more abutments being separable from the corresponding support portion to facilitate replacement of the one or more abutments.
With this arrangement, the abutting portion can be replaced without changing the remaining portion of the jig. For example, the abutments may be replaced if worn or brittle in use. Alternatively, the clip may be adapted to receive articles of different sizes, shapes and configurations by mounting abutments adapted to the particular article.
The insert may be removable from the clip, or the insert may be permanently or temporarily attached to the clip so that it cannot be easily removed. The support is substantially plate-shaped, i.e. the width and length are significantly larger than the thickness. The support portion may have a generally planar inner surface, i.e. an inwardly facing surface.
According to a preferred embodiment of the invention, the first and second inserts are provided with a support portion and one or more abutment portions, respectively.
The support portion may be provided at a fixed predetermined position of the clamping position, or the position of the support portion at the clamping position may be changed.
Each docking portion may be configured to dock with one of the plurality of articles located in the clamping position. In a preferred embodiment of the invention, the abutment of the first insert and the abutment of the second insert are arranged such that in the clamped position one of the plurality of articles is clamped between the abutments of the first and second inserts. In this embodiment, at least one abutment is arranged to provide a clamping force to drive at least one abutment towards the other abutment to clamp an article therebetween.
In a preferred embodiment of the invention, one or more of the abutments comprises an elastically deformable material. Thus, a good seal can be provided between the abutment and the article to which it is abutted. Further, in some embodiments, compression of the elastically deformable material may provide a clamping force to urge the interface portion into contact with the article.
Optionally, each support portion is provided with a first interlocking feature and each abutment portion is provided with a second interlocking feature. The first and second interlocking features have an interlocked position and a non-interlocked position. In the interlocked position, the first and second interlocking features interface with each other to lock the interfacing portion and the corresponding support portion. In the non-interlocked position, the abutment is disengaged from the corresponding support. With this arrangement, the docking portion can be easily removed from the support portion and replaced.
In some embodiments, the first interlocking feature comprises one or more first structures on the corresponding support portion and the second interlocking feature comprises one or more second structures on the corresponding abutment portion, the one or more first structures being respectively engageable with a corresponding one of the one or more second structures in the interlocked position.
The first interlocking feature may be provided with a recess in the corresponding buttress and the second interlocking feature may be provided with a protrusion extending from the corresponding abutment, the protrusion extending into the recess in the interlocked position.
Preferably, the first and second interlocking features can interface with each other in different ways in the interlocked position, and therefore the position of each interface portion relative to the support portion can be changed to alter the clamp and accommodate articles of different configurations.
In these embodiments, the first interlocking feature may be provided with a plurality of first structures and the second interlocking feature may be provided with at least one second structure that may interface with any one of the plurality of first structures in an interlocked position.
In a preferred embodiment of the invention, the one or more abutments comprise a material having a shore a hardness of not less than 50A, or not more than 70A, preferably not more than 60A. It has been found that materials of this hardness range can provide a moderate deformation to obtain a good seal.
The material of one or more abutments comprises an elastomeric material, such as a fluoroelastomer material. The fluorine-containing elastic material includes fluoro elastomer (FKM), perfluoro elastomer (FFKM), or tetrafluoroethylene/propylene rubber (FEPM). One significant advantage of fluoroelastomers is that fluoroelastomers are low or zero outgassing materials and are therefore suitable for being exposed to surface modification conditions.
Preferably, the one or more abutment members are arranged to provide a clamping force to one or more regions of the one or more articles located between the first and second inserts in the clamping position during the surface modification process. The clamping force is applied in a clamping direction, perpendicular to the inner surface of the support. The clamping force may be generated by compressing the abutment, such as compressing the elastically deformable region of the abutment.
Further, the clamp may comprise one or more resilient members to urge the abutment portion into abutment with one or more articles located between the first and second inserts in the clamping position. For example, one or more of the resilient members may be provided with a spring (e.g. a compression spring) or an element comprising a resiliently deformable material (e.g. an elastic material), respectively.
In some embodiments of the invention, the fixture is used to provide a masking effect, at least one of the one or more abutments being provided with an abutment surface for equipping one or more regions in one or more articles between the first and second inserts in the clamping position in a surface modification process. For example, the abutment surface may be provided on a peripheral projection defining the area to be masked, which peripheral projection is arranged, in use, to abut the article.
Alternatively, one or more of the abutments may be provided with an abutment surface for abutment against one or more articles located between the first and second inserts in the clamped position, the contour of the abutment surface corresponding to the contour of the corresponding one or more articles. For example, the abutment surface is provided with one or more protrusions or recesses for abutting one or more features of the article. The abutment surfaces allow the article to be guided or positioned relative to the corresponding insert. In some embodiments, the abutment surface is provided with a peripheral projection for abutting the article, the peripheral projection defining an area to be masked during the surface modification process.
In a preferred embodiment of the invention, the first or second insert comprises a number of juxtaposed abutments, each abutment being arranged to abut a corresponding one of a number of articles to be exposed to the surface modification process. Furthermore, the first and second inserts are dimensioned to allow several articles to be positioned side by side in the clamping position. Thus, several articles may be immediately exposed to surface modification conditions. So configured, a very efficient structure may be provided to achieve higher chamber loading.
The first and/or second inserts may be provided with one or more guide features to enable positioning of the article to be subjected to the surface modification process relative to the fixture. In some embodiments, the first and/or second inserts are provided with a plurality of guide features, each for positioning an article to be subjected to a surface modification process relative to the fixture such that the plurality of articles are positioned side-by-side. Preferably, one or more guide features are each provided with an abutment surface as described above.
The support portion of the first and/or second insert is preferably rigid and may comprise a polymeric material, a metallic material or a combination thereof.
The fixture may further comprise clamping means for driving the first and second inserts into the clamping position. The clamping arrangement may comprise one or more pairs of clamping structures having an interlocked position in which the clamp is in the clamping position and a non-interlocked position in which the clamp is not in the clamping position. In some embodiments, one or more pairs of gripping structures may interface in an interlocked position with an interference fit. The clamp may further comprise one or more snaps for locking the clamp in the clamped position.
The first insert is preferably movable relative to the second insert to allow loading or unloading of an item from the clamp. For example, the first panel may be connected to the second panel by a hinge that allows the first panel to rotate relative to the second panel.
One or more of the abutment portions of the first or second inserts may be provided with a plurality of discrete abutment members which are separable from the corresponding support portions.
In these embodiments, the discrete abutments are each provided with an abutment region having a width that gradually decreases along the clamping direction to a narrowest position to provide an abutment surface for abutting one or more articles located between the first and second inserts in the clamped position. For example, the docking area is conical. The docking area may comprise a resiliently deformable material, such as an elastomeric material. The deformation of the resilient material may provide the clamping force.
In some embodiments, the one or more abutment portions of the first or second inserts are each provided with a plurality of abutment features extending therefrom to provide a plurality of abutment surfaces for abutting one or more articles positioned between the first and second inserts in the clamping position. So configured, a gripping force may be provided for multiple areas and/or locations of the article. Furthermore, multiple regions of the article may be obscured by a single interface.
One or more of the abutment portions of the first or second panel may be provided with first and second connection formations for providing interconnection with a corresponding support portion. The first and second connecting structures are arranged such that the abutment surfaces of the abutment portions at different positions are located with respect to the corresponding support portions. That is, the first connection structure may be provided to position the abutment surface at a first distance from the support portion, and the second connection structure may be provided to position the abutment surface at a second distance from the support portion, the second distance being smaller than the first distance. With this arrangement, the clip can accommodate articles of different thicknesses simply by repositioning the abutment. For example, the difference between the first and second spacing may be equal to the difference in thickness of the first and second articles to be gripped by the clamp.
A second aspect of the present invention provides a method of clamping one or more articles in a surface modification process according to the first aspect of the present invention, comprising:
loading one or more articles between the first and second inserts and placing the first and second inserts in a clamped position such that the one or more abutments abut the one or more articles; and
the one or more articles are exposed to surface modification conditions.
The second aspect of the present invention may include the operation of any of the features of the clamp described herein.
A third aspect of the invention provides an assembly comprising a clamp according to the first aspect of the invention, and one or more replacement abutments for replacing the one or more abutments, the replacement abutments being arranged to be carried by a corresponding support portion to abut one or more articles located between the first and second inserts in the clamping position.
Thus, the docking portion can be replaced by a replacement docking portion. For example, the interface may be replaced if worn or brittle during use. Alternatively, the holder is adapted to receive articles of different sizes, shapes and configurations by mounting a docking portion adapted to a particular article. This is particularly advantageous for some embodiments in which the support portions of the first and second inserts are arranged in a fixed, predetermined position in the clamping position.
The replacement interface may have any of the features of the interface described herein, including the features defined in the first aspect of the invention.
The replacement abutments may be substantially identical to the abutments to allow for direct replacement when the abutments are worn or brittle.
Alternatively, the replacement abutment and the abutment have different dimensions in the clamping direction. That is, the dimension may be a distance between the support portion (inner surface) and the abutment surface of the corresponding abutment portion.
As an alternative embodiment, the alternative interface may have an interface surface of a different configuration than the interface. For example, the docking station may be configured to dock one or more items having a first configuration, and the alternate docking station may be configured to dock one or more items having a second configuration different from the first configuration. So configured, the clamp may be used to receive articles having different configurations.
A fourth aspect of the invention provides a method of operating the assembly of the third aspect of the invention (or a method of operating the clamp of the first aspect), comprising:
removing one or more abutments from the corresponding supports; and
one or more replacement abutments are assembled on the support.
In the present invention, especially the surface modification process in the embodiments described in the first, second, third and fourth aspects includes, but is not limited to, a deposition process, especially a particle or vapor deposition process. The surface modification process may be adapted for use at sub-atmospheric pressure, i.e. involving exposure of the one or more articles to a pressure below atmospheric pressure. Suitably, the sub-atmospheric pressure may be from 0.01 to 999.99mbar, such as from 0.1 to 999.99mbar, from 0.5 to 999.99 mbar. In some embodiments, the surface modification process is a sub-atmospheric vapor deposition process, particularly a plasma polymerization process.
For example, the surface modification conditions may be vapor deposition conditions, and the surface modification conditions may include a pressure below atmospheric pressure. According to an embodiment of the invention, the vapor deposition conditions are plasma polymerization conditions.
The surface modification conditions may include, an excitation medium; and a monomer at least partially excited by the excitation medium to form a liquid-repellent coating on the article. The excitation medium may comprise a plasma or a pulsed plasma. The monomer may be a compound having formula (I),
Figure DEST_PATH_GDA0002616459440000081
wherein R1, R2 and R3 are each independently selected from hydrogen, alkyl, haloalkyl, or aryl optionally substituted with halogen, R4 is a group X-R5 wherein R5 is an alkyl or haloalkyl group and X is a bond; x is a group having the formula-C (O) O (CH2) nY, wherein n is an integer from 1 to 10 and Y is a bond or a sulfonamide group; or X is a group- (O) PR6(O) q (CH2) t, wherein R6 is aryl optionally substituted by halogen, p is 0 or 1, q is 0 or 1, t is 0 or an integer from 1 to 10, and when q is 1, t is not 0.
Suitably, the workpiece may be exposed to a plasma comprising a monomeric compound for a sufficient time to form a protective polymeric coating on the surface of the workpiece, wherein the monomeric compound has the formula (II):
Figure DEST_PATH_GDA0002616459440000082
wherein R1, R2 and R4 are each independently selected from hydrogen, optionally substituted straight or branched C1-C6 alkyl, or haloalkyl, or aryl optionally substituted with halogen, and R3 is selected from:
Figure DEST_PATH_GDA0002616459440000083
wherein each X is independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl, haloalkyl, or aryl optionally substituted with halo; n1 is an integer from 1 to 27.
In some embodiments, the monomer may be as defined in the claims of WO 2007/083122.
Suitably, the monomer may be selected from 1H, 2H-perfluorohexyl acrylate (PFAC4), 1H, 2H-perfluorooctyl acrylate (PFAC6), 1H, 2H-perfluorodecyl acrylate (PFAC8) and 1H, 2H-perfluorododecyl acrylate (PFAC 10).
Suitably, the masked article may be exposed to a monomer compound and a crosslinking agent comprising two or more unsaturated bonds linked by means of one or more linking moieties and having a boiling point of less than 500 ℃ at standard pressure. For example, the crosslinking agent may be selected from 1, 4-butanediol divinyl ether (BDVE), 1, 4-cyclohexanedimethanol divinyl ether (CDDE), 1, 7-octadiene (17OD), 1,2, 4-Trivinylcyclohexane (TVCH), Divinyladipate (DVA), 1, 3-divinyltetramethyldisiloxane (DVTMDS), diallyl 1, 4-cyclohexanedicarboxylate (DCHD), 1, 6-Divinylperfluorohexane (DVPFH), 1H,6H, 6H-perfluorohexanediol diacrylate (PFHDA), and glyoxal bis (diallyl acetal) (GBDA).
Preferably, the surface modification conditions may render the coating liquid repellent, such as water and/or oil repellent.
The one or more items may be of any desired type. In one embodiment of the present invention, the one or more items comprise one or more electronic devices or electronic components. For example, the one or more items may comprise one or more touch screen devices, in particular smartphones or tablets. Optionally, at least the touch screen of these devices may be obscured. The one or more items may also include a layered screen, such as an LCD screen, a TFT screen.
Throughout the description and claims of this application, the terms "comprise" and "contain" and variations thereof mean that including but not limited to, and not excluding other elements, integers or steps. Furthermore, the singular forms may have the plural meaning unless the specification indicates otherwise. In particular, when the indefinite article is used, the specification is to be understood as having a singular and plural meaning unless the context requires otherwise.
Features of various aspects of the invention will be described in detail below in conjunction with any of the other aspects of the invention. Within the scope of the present application, the various aspects, embodiments, examples or alternatives given in the preceding paragraphs, the claims and/or the following description and drawings, in particular the individual features, may be used individually or in combination. That is, any embodiment and/or features of any embodiment may be combined in any combination unless the features are incompatible.
Drawings
One or more embodiments of the present invention are described below by way of example in conjunction with the following drawings, in which:
figure 1 shows an isometric view of one embodiment of the clamp of the present invention, the clamp being in a loading position.
FIG. 2 is a rear isometric view of the clamp of FIG. 1, with portions of the frame omitted.
Fig. 3 is a schematic view of the fixture of fig. 1, in which several devices are loaded.
Fig. 4A and 4B are schematic views of the inner and outer surfaces, respectively, of the lower insert of the fixture of fig. 1.
Fig. 5A and 5B are schematic views of the inner and outer surfaces, respectively, of the upper insert of the fixture of fig. 1, with the offset connectors shown on the platform for clarity.
Fig. 6 is an exploded view of the clamp of fig. 1.
Fig. 7 is a rear isometric view of the clamp of fig. 1, with the support portion of the upper insert omitted.
Fig. 8 is a partial cross-sectional view of the fixture of fig. 1.
Fig. 9A, 9B, 9C, 9D and 9E are plan, side and isometric views, respectively, of the clamp of fig. 1 in a clamping position.
Fig. 10 is a detail view of the offset connector of the upper insert of the fixture of fig. 1.
Figure 11 is an isometric view of another embodiment of the clamp of the present invention, the clamp in the loading position.
Fig. 12 is a rear isometric view of the clamp of fig. 11.
FIG. 13 is a schematic view of the fixture of FIG. 11 with several devices loaded.
Fig. 14A and 14B are schematic views of the inner and outer surfaces, respectively, of the lower insert of the fixture of fig. 11.
Fig. 15A and 15B are schematic views of the inner and outer surfaces, respectively, of the upper insert of the fixture of fig. 11.
Fig. 16 is an exploded view of the clamp of fig. 11.
Fig. 17 is a partial cross-sectional view of the clip of fig. 11.
Fig. 18A, 18B, 18C, 18D and 18E are plan, side and isometric views, respectively, of the clamp of fig. 11 in a clamping position.
Fig. 19 is a detail view of the abutment portion of the upper insert of the fixture of fig. 11.
Detailed Description
The clamp of the present invention may be used to shield one or more regions of an article through one or more interfaces in a surface modification process, and/or to hold one or more surface regions of an article in a surface modification process. In the illustrated embodiment, the article is an electronic mobile device, such as a smartphone or tablet computer. In some embodiments, one or more masking and/or one or more clamping abutments are applied to both major faces of each device to mask the screen and one or more areas of the back face of each device. In other embodiments, only one face of each device applies one or more masking and/or gripping abutments.
The embodiment shown in fig. 1 to 10 provides a fixture 100 in which several (nine in the illustrated embodiment) mobile devices 10 are provided with front and rear regions, respectively. Clip 100 includes upper insert 20 and lower insert 40, with device 10 being maintained between upper insert 20 and lower insert 40.
The lower insert 40 includes a generally rectangular, rigid, plate-like support portion 42, with the support portion 42 being releasably secured to the rigid frame 50. The rigid frame 50 is provided with first 52a and second 52b elongated beams, first 54a, second 54b and third 54c latch assemblies, and four hinges 58. The snap assemblies 54a,54b,54c are positioned such that the first long side of lower clamping member 40 is clamped between first long beam 52a and the snap assemblies such that long beam 52a abuts the outer surface of lower insert 40 and the snap assemblies abut the inner surface of lower insert 40. Similarly, the second long side of lower insert 40 is sandwiched between second long beam 52b and hinge 58 such that second long beam 52b abuts the outer surface of lower insert 40 and hinge 58 abuts the inner surface of lower insert 40.
The upper insert 20 is provided with a substantially rectangular, rigid, plate-like support portion 22, and in the illustrated embodiment, the support portion 22 is formed by connecting three plates in series. The upper insert 20 is connected to the hinge 58 by a hinge joint so that it can be rotated between a holding position and a loading position. In the clamped position, the upper and lower inserts are generally parallel to each other, and the device 10 is clamped between the upper and lower inserts, as shown in fig. 9A-E. As shown in fig. 1, in the loading position, upper insert 20 is rotated away from lower insert 40 so that device 10 may be loaded into fixture 100 or removed from fixture 100.
The upper insert 20 is provided with a plurality of (six in the present embodiment) holding projections 23 each including a cylindrical member extending from and toward the inner surface of the upper insert 20 substantially perpendicularly thereto. Each grip tab 23 interfaces with a corresponding grip core 55 in the snap assembly 54a,54b,54c by interference fit. When clamping tabs 23 and core 55 are sufficiently mated, clamp 100 is in a clamping position such that mating of clamping tabs 23 and core 55 secures upper insert 20 relative to lower insert 40, and a clamping force is exerted on device 10. The snap assemblies 54a,54b,54c are each provided with a pair of snaps 56, the snaps 56 operable to abut an edge of the upper insert 20 to lock the upper insert 20 in the clamped position.
The upper insert 20 and the lower insert 40 are provided with a number of abutments 24,44, respectively (nine in this embodiment), which abutments 24,44 are driven against corresponding areas of the device 10 in the clamped position, respectively, to mask this area during the surface modification process.
The lower insert 40 is provided with nine lower abutments 44, each lower abutment 44 being releasably connected to the support 42 so that the lower abutment 44 can be replaced. For example, the clamp 100 may be used to maintain other devices 10 having different shapes or configurations when worn or brittle during use. Furthermore, the abutment 44 may be replaced by several equivalent abutments having different thicknesses in the clamping direction, at least in the region of the abutment face of the abutment device 10 when in use. That is, the jig 100 can be used to hold devices 10 of different thicknesses by changing the thickness of the lower butting portion (the dimension between the inner surface of the supporting portion 42 and the butting surface in the holding direction).
The lower abutment portions 44 are respectively provided with a plurality of cylindrical interlocking projections (not shown) which are abutted by interference fit with a corresponding plurality of interlocking cores (blind holes in the present embodiment, not shown) in the support portion 42 to interlock the lower abutment portions 44 and the support portion 42. With this arrangement, when replacement is required, the used lower abutting portion 44 can be detached from the supporting portion 42. Replacement of the lower abutment 44 may conveniently be interlocked with the support by driving the lower abutment 44 towards the support until each interlock projection sufficiently abuts with the corresponding interlock core.
Each lower abutment 44 of the lower insert 40 is provided with an abutment surface, i.e. a surface arranged to abut a corresponding device 10 in the clamped position, the surface contour corresponding to the screen surface of the corresponding device 10. Thus, each lower abutment 44 has a continuous peripheral edge 45, the peripheral edge 45 enclosing a recessed area 46. In the recessed area 46, the device 10 is in the clamping position. So configured, material costs and outgassing potential may be reduced. Because the peripheral region forms a sealed periphery around the central region, effective shielding can be provided.
The upper insert 20 includes nine upper abutments 24, each of which mates with a corresponding one of the lower abutments 44. Similar to the lower abutment 44 described above, the nine upper abutments 24 each releasably connect the support portion 20 of the upper insert 20 to facilitate replacement thereof. When wear or tear occurs during use, upper interface 24 may be replaced and fixture 100 may be used to maintain other devices having different shapes or configurations. Furthermore, the abutment 24 may be replaced by several equivalent abutments of different thickness in the clamping direction, at least in the region of the abutment surface of the abutment device 10 when in use. That is, the jig 100 can be used to clamp devices of different thicknesses by adjusting the thickness of the upper butting part (the dimension between the inner surface of the supporting part 22 and the butting surface in the clamping direction).
Each upper abutment 24 is connected to the support 22 of the upper insert 20 by four biasing connectors 30, each biasing connector 30 being provided with a spring 32 wound around a rigid pin 34. The pin 34 is connected to the support 22 by a rigid connection, for example a threaded joint in a hole 36 through the support 22, so that it extends substantially perpendicular to the support 22 and abuts a corresponding blind hole in the upper abutment 24. Each spring 32 acts to bias the corresponding upper abutment 24 away from the support 22 when the clamp 100 is in the clamping position. The limited sliding of the pin 34 in the blind hole 36 facilitates the biasing action.
As such, when replacement is required, the used upper mating portion 24 can be removed from the support portion 22 by disconnecting the offset connector 30. The support portion 22 can be easily attached by reattaching the offset connector 30 in place of the upper mating portion 24.
Each upper abutment 24 of the upper insert 20 is provided with an abutment surface, i.e. a surface arranged to abut a respective device 10 in the clamping position, the surface contour of which corresponds to the contour of the back of the corresponding device 10. Thus, each upper abutment 24 has a continuous peripheral edge 25 surrounding a recessed area 26, and the device 10 is located in the recessed area 26 and in the clamping position. So configured, material costs and outgassing potential may be reduced. Since the peripheral region forms a seal around the central region, effective shielding can still be provided.
Each upper docking portion 24 is also provided with two circular apertures 28, the circular apertures 28 being arranged to surround corresponding features of the device 10, such as the camera lens and the LED light source window. A peripheral edge is provided around each circular aperture 28 to form a sealed perimeter around the circular aperture.
Thus, the lower abutment 44 and the upper abutment 24 cooperate to shield a substantial portion of each device 10, the only unshielded area being the continuous perimeter formed by the circular aperture 28 and the edges 25,45 of the abutments. Thus, the docking station may shield the entire device 10, except for the camera lens, the LED light source window, and the joint between the screen, back cover, and body of the device. In addition, the biasing action of the biasing connector 30, in conjunction with the clamping action of the clamping pin 23, ensures that a vapor seal is formed between the device 10 and the corresponding abutment 44,24, ensuring that the device 10 is safely clamped to maintain its structural integrity, particularly during sub-atmospheric surface modification processes.
The supports 22,42 and the frame 50 may be formed of a rigid material, such as a metallic material (e.g., aluminum). Thus, the clamp 100 is overall rigid and resistant to tolerance deformation.
The support portion 22 of the upper support 20 includes a series of perforations 60 that allow each device to be readily exposed during the surface modification process. The peripheral gap between upper insert 20 and lower insert 40 also promotes exposure.
In some embodiments, perforations 60 may be used to secure upper interface portion 24 to upper support portion 22. For example, each offset connector 30 may be correspondingly connected to a perforation 60. So configured, the position and/or orientation of each upper mating portion 24 may be changed by attaching the offset connector 30 and a different aperture 60.
The lower abutment 44 and the upper abutment 24 (or at least the abutment surface of each abutment) are each formed from an elastomer having a shore hardness of from 50A to 70A, preferably from 50A to 60A. Suitable elastomers include fluoroelastomers, such as FKM or FFKM, which have the advantage of low or zero outgassing.
The deformable nature of the elastomeric material is such that when the devices 10 are driven into sealing contact with the interfacing surfaces, a good seal is formed between each device 10 and the corresponding upper and lower interfaces in the clamped position.
Further, when the resilient material is pressed to the clamping position, it acts as a compression spring to apply a clamping force to each corresponding device 10. In addition to promoting vapor sealing, the clamping force may also maintain the structural integrity of the device 10 during the surface modification process, particularly when a sub-atmospheric surface modification process is applied, to prevent flaking, delamination, or other damage to the device.
In some embodiments, the upper interface portion 24 and/or the lower interface portion 44 may comprise a rigid substrate (e.g., a metal substrate, an aluminum substrate) with a layer of resilient material disposed thereon to provide an interface surface for the interface portion. In other embodiments, each abutment is formed entirely of an elastomeric material.
In use, the fixture 100 is first set in a loading position (as shown in fig. 1) with several devices 10 loaded thereon such that each device 10 is located in the recess 46 of the corresponding lower dock 44. The upper insert 20 is then rotated until the gripping protrusions 23 are sufficiently in abutment with the corresponding cores 55. The fixture 100 is then in the clamped position (as shown in fig. 9A-E) such that the abutting surfaces of the upper and lower abutments 24 and 44 are driven to the vapor seal apparatus 10, thereby shielding the components of the apparatus 10 that are shielded by the abutments. In the clamping position, a clamping force is applied to each device 10. Finally, the snaps 56 are closed to maintain the clamp in the clamped position until released.
By placing the loaded jig 100 in a plasma polymerization deposition chamber, the loaded jig 100 may be exposed to surface modification conditions, such as vapor deposition conditions, as described in more detail below. For example, the surface modification conditions may provide a barrier coating, such as a water-resistant coating.
Fig. 11 to 19 show a second embodiment of the clamp 200 of the present invention, in which only one surface of each device 10 is concealed. In this embodiment, the screen of the device is obscured.
The clamp 200 of the second embodiment has features in common with the clamp 100 of the first embodiment, and the description of the features in common with the first embodiment is equally applicable to the second embodiment. The clamp 200 of the second embodiment differs from the clamp 100 of the first embodiment only in the upper insert, which is designated 120 in the second embodiment and described in detail below.
Similar to the first embodiment, the upper insert 120 of the second embodiment includes a generally rectangular, rigid, plate-like support portion 122, which in the illustrated embodiment is formed by joining three plates in series. Upper inserts 120 are coupled to the hinges by a hinge structure for rotation between a clamping position (shown in fig. 18A-E) and a loading position (shown in fig. 11). In the clamped position, the upper and lower inserts are substantially parallel to each other, and the device 10 is clamped between the upper and lower inserts. In the loading position, upper insert 120 is rotated away from the lower insert so that device 10 may be loaded into fixture 200 or removed from fixture 200.
Unlike the row of holes 60 of the first embodiment, the supporting portion 122 of the upper insert 120 is provided with a plurality of linear grooves 130 in the second embodiment. In the second embodiment, the linear grooves 130 are eight linear grooves 130 arranged side by side in three rows. Each slot 130 has a generally rectangular region 132 with a slot width w. At the end of the slot 130 there is a circular area 134, the circular area 134 having a diameter d which is larger than the width w of the slot.
Instead of the upper abutment 24 of the first embodiment, there are several upper abutments 124, in the form of offset members arranged in a distributed manner. Each upper abutment portion 124 is provided with a connecting region 125 arranged to abut a slot 130 of the support portion 124 to secure the abutment portion 124. Each upper interface portion 124 is also provided with an integral interface region 126 configured to interface with the device 10 held by the clamp 200 in the clamping position.
As shown in fig. 19, the connecting region 125 has a generally circular cross-section with two reduced diameter regions 125a, each having a diameter (or width) equal to or slightly less than the slot width w, to allow the rectangular region 132 of the slot 130 to fit. The connecting region 125 is also provided with three large diameter regions 125b, each separated by a reduced diameter region 125a, and having a diameter (or width) greater than the width w of the slot 130, so as not to pass through the rectangular region 132 of the slot 130, but equal to or less than the diameter d of the circular region 134 of the slot 130.
So configured, the abutments 124 can be inserted into the corresponding slots 130, respectively, by passing one or both of the large diameter regions 125b through the circular region 134 of the slot 130 and sliding the reduced diameter region 125a of the abutments 124 along the slot 134 to enter the rectangular region 132 and thereby secure the abutments 124 and the supports 122.
By selecting one or both of the abutment slots 130 in the reduced diameter region 125a, the position of the abutment surface 127 can be selected from two possible positions, as shown in fig. 19. The spacing between the two possible positions in the clamping direction corresponds to the distance d between the two reduced diameter regions 125 a. So configured, a single set of upper interfaces 124 can be used to secure a device 10 having a thickness t, or a device 10 having a thickness t-d, simply by repositioning the upper interfaces 124.
In another embodiment of the present invention, the connection area of the upper butt-joint part 124 may have only one area 125a with a reduced diameter, which is surrounded by two areas 125b with a large diameter.
The abutment region 126 of each upper abutment 124 is provided with a conical region extending from the region of reduced diameter, the diameter of the conical region decreasing from a maximum diameter greater than the width w of the slot to a minimum diameter defining a circular abutment surface 127 to further secure the abutment 124 to the support 122. As shown in fig. 18A-E, the abutment surface 127 is the only component of each upper abutment 124 that contacts the corresponding device 10 when the clamp 200 is in the clamped position.
Each upper abutment 124 (or at least the conical region of each abutment, or at least the abutment surface of each abutment) is made of an elastomer having a shore hardness of 50A to 70A, preferably 50A to 60A, respectively. Suitable elastomers include fluoroelastomers, such as FKM or FFKM, which have the advantage of low or zero outgassing.
The deformable nature of the resilient material ensures that when pressed in the clamped position it can act as a compression spring to apply a clamping force to each device 10. Thus, the upper dock 124 drives the corresponding device 10 toward the lower dock 44 to facilitate forming a vapor seal therebetween. In addition, the clamping force may be used to maintain the structural integrity of the device 10 during the surface modification process, particularly under the application of sub-atmospheric surface modification conditions, to prevent flaking, delamination, or other damage to the device.
In some embodiments, the lower interface 44 may include a rigid substrate (e.g., a metal substrate, an aluminum substrate) with a layer of resilient material disposed thereon to provide an interface surface for the interface. In other embodiments, the entire interface is molded from a resilient material. Similarly, the connection region 125 of each upper abutment 124 may comprise a rigid member (i.e., formed of a rigid material, such as a metallic material, aluminum), and the abutment region 126 (or at least the abutment surface 127 thereof) may be formed of a resilient material.
The slot 130 allows the position of each interface 124 to be varied to accommodate the configuration of the device 10 located in the fixture 200. That is, the interfaces 124 may be secured at any location along the rectangular area of the slot 130, respectively, to provide a clamping force at a desired location.
In addition, the slot 130 allows the interface 124 to be replaced, such as by wear or brittle fracture of the interface 124. Furthermore, the abutment 124 may be replaced by several equivalent abutments having different heights in the clamping direction. That is, the jig 200 can be used to clamp devices 10 having different thicknesses by changing the height of the upper interfacing portion (the dimension between the inner surface of the supporting portion 122 and the interfacing surface 127 in the clamping direction).
In use, the jig 200 is first set in a loading position (shown in figure 11), with several devices 10 loaded in the jig 200 such that each device 10 is located in the recess 46 of the corresponding lower docking portion 44. The upper inserts 120 are then rotated until the gripping protrusions 23 are fully engaged with the corresponding cores 55, respectively. The fixture 200 is then in a clamping position (as shown in fig. 18A-E) such that the interface surface of the lower interface 44 is driven into a vapor seal with the device 10, thereby shielding those components of the device 10 that are shielded by the interface, and the upper interface 124 applies a clamping force to each device 10. Finally, the catch 56 is closed to ensure that the clamp remains in the clamped position until released.
The loaded jig 200 may be exposed to surface modification conditions by placing the loaded jig 200 into a plasma polymerization deposition chamber, as will be described in detail below. For example, the surface modification conditions may provide a barrier coating, such as a water-resistant coating.
One or more upper abutments 124 can move within corresponding slots 130 to change the location at which the clamping force is applied. If desired, the upper abutments 124 can be removed from the corresponding slots 130 and replaced with replacement upper abutments 124 by sliding the upper abutments 124 along the slots into the circular areas 134 and separating them.
In the present embodiment, two abutments 124 are provided per linear slot 130, however, it will be appreciated by those skilled in the art that alternative arrangements may be employed in other embodiments.
In some embodiments, the slot 130 may be replaced with an array of apertures similar to the apertures 60 in the first embodiment, each of which may be used to secure one of the upper abutments 124 to the corresponding support 112. Thus, the position and/or orientation of each upper abutment 124 may be altered by the connection of the attachment region and the different apertures.
In all embodiments of the present invention, the vapor deposition process comprises exposing the loaded jig 100 to vapor deposition conditions as described in WO2007/083122, the entire contents of which are incorporated herein by reference in their entirety.
The vapor deposition conditions may further include a crosslinker, which may be selected from 1, 4-butanediol divinyl ether (BDVE), 1, 4-cyclohexanedimethanol divinyl ether (CDDE), 1, 7-octadiene (17OD), 1,2, 4-Trivinylcyclohexane (TVCH), Divinyladipate (DVA), 1, 3-divinyltetramethyldisiloxane (DVTMDS), 1, 4-cyclohexanedicarboxylate diallyl ester (DCHD), 1, 6-Divinylperfluorohexane (DVPFH), 1H,6H, 6H-perfluorohexanediol diacrylate (PFHDA), and glyoxal bis (diallyl acetal) (GBDA).
It has been found that under vapor deposition conditions, only those parts of the apparatus 10 that are not masked are coated with the vapor deposited coating.

Claims (26)

1. A clamp for securing one or more articles in a surface modification process, comprising first and second inserts arrangeable in a clamping position in which one or more articles are clamped between the first and second inserts, wherein at least one of the first and second inserts is provided with a support portion provided with one or more abutments for abutting one or more articles located between the first and second inserts in the clamping position, the one or more abutments being separable from the corresponding support portion to facilitate replacement of the one or more abutments.
2. The clamp of claim 1, wherein one or more abutments comprise a resiliently deformable material.
3. A clip as claimed in claim 1 or claim 2, wherein each support portion is provided with a first interlocking feature and each abutment portion is provided with a second interlocking feature, the first and second interlocking features having an interlocking position in which the first and second interlocking features abut one another to lock the abutment portion on the corresponding support portion and a non-interlocking position in which the abutment portion is separated from the corresponding support portion.
4. The clamp of claim 3, wherein the first and second interlocking features can interface with each other in the interlocked position in a number of different ways.
5. The clamp of claim 3, wherein the first interlocking feature comprises a plurality of first structures and the second interlocking feature comprises at least one second structure, the at least one second structure being adapted to interface with any one of the plurality of first structures in an interlocked position.
6. The clamp of claim 1, wherein the one or more abutments comprise a material having a shore a durometer of 50A to 70A, or 50A to 60A.
7. A clip as claimed in claim 6, wherein one or more abutments comprise a resilient material, such as a fluoroelastomer material.
8. The fixture of claim 1, wherein the one or more abutments are configured to provide a clamping force to one or more regions of the one or more articles located between the first and second inserts in the clamped position during the surface modification process.
9. The clamp of claim 1, comprising one or more resilient members to urge the abutment into abutment with one or more articles located between the first and second inserts in the clamping position.
10. The fixture of claim 1, wherein at least one of the one or more abutments is provided with an abutment surface arranged to mask one or more regions of the one or more articles positioned between the first and second inserts in the clamped position during the surface modification process.
11. A clip as claimed in claim 1, wherein one or more abutments provide an abutment surface for abutment against one or more articles located between the first and second inserts in the clamping position, the abutment surface being contoured to correspond with the corresponding article or articles.
12. The fixture of claim 1, wherein the first or second insert is provided with a plurality of abutments arranged side by side, each abutment being arranged to abut a corresponding one of a plurality of articles exposed to the surface modification process.
13. A jig as claimed at claim 1 wherein the first and/or second inserts are provided with one or more guide features for locating an article to be subjected to the surface modification process relative to the jig.
14. A jig as claimed at claim 1 wherein the first and/or second inserts are provided with a plurality of guide features each for positioning an article to be subjected to a surface modification process relative to the jig such that the plurality of articles are positioned side by side.
15. A clamp according to claim 14 wherein one or more guide features are each provided with an abutment surface according to claim 11.
16. The clip of claim 1 wherein the support portion of the first and/or second inserts is rigid, comprising a polymeric material, a metallic material, or a combination thereof.
17. A fixture as claimed in claim 1, comprising clamping means for driving the first and second inserts into the clamping position.
18. The clamp of claim 17, wherein the clamping arrangement includes one or more pairs of clamping structures having an interlocked position in which the clamp is in the clamping position and a non-interlocked position in which the clamp is not in the clamping position.
19. The clamp of claim 1, wherein the first insert is movable relative to the second insert to allow loading or unloading of an item from the clamp.
20. A clip as claimed in claim 1, wherein one or more abutments of the first or second inserts are provided with a plurality of discrete abutments which are separable from the corresponding supports.
21. A clip as claimed in claim 20, wherein each discrete abutment member is provided with an abutment region, the width of the abutment region tapering in the clamping direction towards the narrowest portion to provide an abutment surface for abutting one or more articles located between the first and second insert members in the clamping position.
22. The holder of claim 1 wherein the one or more abutment portions of the first or second inserts are each provided with a plurality of abutment features extending therefrom to provide a plurality of abutment surfaces for abutting one or more articles located between the first and second inserts in the holding position.
23. An assembly comprising a clip according to any one of claims 1 to 22 and one or more replacement abutments for replacing the one or more abutments, the replacement abutments being arranged to be carried by a corresponding support to abut one or more articles located between the first and second inserts in the clamped position.
24. An assembly according to claim 23, wherein the replacement docking station has any of the features of the docking station of any of claims 1 to 22.
25. The assembly of claim 23, wherein the size of the replacement abutment is different from the size of the abutment in the clamping direction.
26. The assembly of claim 23, wherein the interface surface of the replacement interface and the interface surface of the interface are differently configured.
CN201790001580.3U 2016-12-19 2017-12-19 Clamp for surface modification process and assembly comprising same Expired - Fee Related CN211805637U (en)

Applications Claiming Priority (5)

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GBGB1621641.8A GB201621641D0 (en) 2016-12-19 2016-12-19 Improvements relating to masking
GB1621641.8 2016-12-19
CN2017097504 2017-08-15
CNPCT/CN2017/097504 2017-08-15
PCT/CN2017/117212 WO2018113671A1 (en) 2016-12-19 2017-12-19 A jig for surface modification processes

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CN109064887B (en) * 2018-08-31 2021-03-05 Oppo(重庆)智能科技有限公司 Activation jig for screen of electronic device
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US6806943B2 (en) * 2002-08-09 2004-10-19 International Business Machines Corporation Mask clamping device
JP5877328B2 (en) * 2012-10-25 2016-03-08 パナソニックIpマネジメント株式会社 SCREEN PRINTING APPARATUS AND METHOD FOR SETTING BOARD CLAMP POSITION IN SCREEN PRINTING APPARATUS
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KR101638344B1 (en) * 2015-12-04 2016-07-11 주식회사 유아이디 negative panel fixing device and method for sputtering

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CN211150516U (en) 2020-07-31

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