WO2018107791A1 - 驱动芯片的传递交接平台的自动测量方法、设备 - Google Patents

驱动芯片的传递交接平台的自动测量方法、设备 Download PDF

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Publication number
WO2018107791A1
WO2018107791A1 PCT/CN2017/097604 CN2017097604W WO2018107791A1 WO 2018107791 A1 WO2018107791 A1 WO 2018107791A1 CN 2017097604 W CN2017097604 W CN 2017097604W WO 2018107791 A1 WO2018107791 A1 WO 2018107791A1
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WIPO (PCT)
Prior art keywords
height
value
nozzle
platform
transfer
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PCT/CN2017/097604
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English (en)
French (fr)
Inventor
张光辉
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
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Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/082,871 priority Critical patent/US10775156B2/en
Publication of WO2018107791A1 publication Critical patent/WO2018107791A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Definitions

  • the present application relates to an electronic chip technology, and in particular, to an automatic measurement method and device for a transfer interface of a driving chip.
  • the height of the transfer interface is detected as a conventional test item for the existing drive chip transfer interface.
  • the thickness gauge is used to measure the height of the transfer platform (Gap) between the nozzles.
  • the existing detection method is a method of visual inspection by the inspection personnel, which is subject to the experience and level of the inspection personnel, and is not only costly, but also the detection standards are not uniform, which affects the detection results.
  • One of the purposes of the present application is to provide an automatic measurement method and device for a transmission and delivery platform of a driving chip, which realizes automatic detection of the height of the platform without manual participation, so the cost is low and the detection result is accurate.
  • a method of detecting an automatic measuring device of a transfer transfer platform of a driving chip comprising: a platform, a predetermined position nozzle, a reverse nozzle, a sensor, and a reflection sheet, wherein The predetermined position nozzle is placed on the platform, the reverse nozzle is fixedly disposed at an upper end of the platform, and when the platform rotates, the predetermined position nozzle is moved to the reverse nozzle
  • the sensor directly below is fixed to one side of the reversing nozzle, the reflection sheet is fixed to one side of the pre-position nozzle and the reflection sheet is located under the sensor, and the method includes the following steps :
  • An automatic measuring device controls the light source to emit light to the reflective sheet
  • the sensor detects a measured value of the reflective sheet
  • the automatic measuring device determines the variation curve of the measured value and the height according to the material of the reflective sheet
  • the automatic measuring device queries the height value corresponding to the measured value from the curve;
  • the automatic measuring device determines whether the delivery handover platform can pass the detection according to the height value.
  • the highest height of the reflective sheet is the same as the highest height of the predetermined position nozzle.
  • the method further includes:
  • the reverse nozzle is controlled to move up or down according to the height value until the transfer interface passes the detection.
  • controlling the inversion nozzle to move up or down according to the height value until the transmission handover platform passes the detection specifically includes:
  • the control reverse nozzle moves upward.
  • the sensor measures the first measurement value once, and obtains the first height according to the first measurement value, such as the first height and the preset height. If the value is the same, the movement is stopped, otherwise it is moved up again and the height measurement step is performed until the height value corresponding to the measured value after the movement is the same as the preset height.
  • controlling the inversion nozzle to move up or down according to the height value until the transmission handover platform passes the detection specifically includes:
  • the control reverses the nozzle to move downward.
  • the sensor measures the second measurement value once, and obtains the second height according to the second measurement value, such as the second height and the preset. If the height values are the same, the movement is stopped, otherwise the downward movement is performed again and the height measurement step is performed until the height value corresponding to the measured value after the movement is the same as the preset height.
  • an automatic measuring device for a transfer interface of a driving chip comprising: a platform, a predetermined position nozzle, and a reverse nozzle, wherein the device further comprises: a sensor and a reflective sheet, wherein The predetermined position nozzle is placed on the platform, the reverse nozzle is fixedly disposed at an upper end of the platform, and when the platform rotates, the predetermined position nozzle is moved to the reverse nozzle Directly below; the sensor is fixed to one side of the reversing nozzle, the reflection sheet is fixed to one side of the pre-position nozzle and the reflection sheet is located below the sensor, and the device further includes
  • a processing unit configured to control the light source to emit light to the reflective sheet
  • the sensor is configured to detect a measured value of the reflective sheet
  • the processing unit is configured to determine a change curve of the measured value and the height according to the material of the reflective sheet, and query the height value corresponding to the measured value from the change curve; and determine, according to the height value, whether the transfer handover platform can pass the detection.
  • the highest height of the reflective sheet is the same as the highest height of the predetermined position nozzle.
  • the processing unit is further configured to control, when the detection fails, to move the reverse nozzle upward or downward according to the height value until the transfer handover platform passes the detection.
  • the processing unit is configured to: if the height value is smaller than the preset height value, control the reverse nozzle to move upward, and each time the sensor is measured, the first measurement value is obtained by the sensor, and the first measurement value is obtained according to the first measurement value.
  • the first height if the first height is the same as the preset height value, stops moving, otherwise moves up again and performs the height measuring step until the height value corresponding to the measured value after the movement is the same as the preset height.
  • the processing unit is configured to: if the height value is greater than the preset height value, control the reverse nozzle to move downward, and each time the sensor is measured, the sensor obtains the second measurement value once, according to the second measurement value.
  • the second height if the second height is the same as the preset height value, the movement is stopped, otherwise the downward movement is performed again and the height measurement step is performed until the height value corresponding to the measured value after the movement is The preset height is the same.
  • an automatic measuring device for a transfer transfer platform of a drive chip comprising: a platform, a pre-position nozzle, a reverse nozzle, a sensor, and a reflective sheet; wherein the predetermined Positioning nozzle is placed on the platform, the reverse nozzle is fixedly disposed at an upper end of the platform, and when the platform rotates, the predetermined position nozzle is moved to directly below the reverse nozzle;
  • the sensor is fixed on one side of the reverse nozzle, the reflection sheet is fixed on one side of the predetermined position nozzle, and the reflection sheet is located under the sensor
  • the device further includes: a processing unit,
  • the processing unit is configured to control a light source to emit light to the reflective sheet; the sensor is configured to detect a measured value of the reflective sheet; and the processing unit is further configured to determine a measured value and a height change according to a material of the reflective sheet a curve, the height value corresponding to the measured value is queried from the change curve; determining whether the transfer transfer
  • the sensor measures the first measurement value once, and obtains the first height according to the first measurement value, for example, the first height is the same as the preset height value. , then stop moving, otherwise move up again and perform the height measurement step until the height value corresponding to the measured value after moving is the same as the preset height; if the height value is larger than the preset height value, control the reverse nozzle to move downward.
  • the sensor obtains the second measurement value once, and obtains the second height according to the second measurement value. If the second height is the same as the preset height value, the movement is stopped, otherwise the downward movement is performed again and the height measurement step is performed until The height value corresponding to the measured value after the movement is the same as the preset height.
  • FIG. 1 is a schematic structural view of a platform measuring device of the prior art
  • 2-1 is a schematic structural diagram of a platform measuring device according to a preferred embodiment of the present application.
  • FIG. 2-2 is a schematic structural diagram of a platform measuring device according to a preferred embodiment of the present application.
  • FIG. 3 is a flowchart of a detection method provided by a preferred embodiment of the present application.
  • Figure 4-1 is a fitted line diagram of a glass reflective sheet
  • Figure 4-2 is a fitting line diagram of a polished copper sheet reflection sheet
  • Figure 4-3 is a graph showing the correlation between the measured values of the platform and the sensor.
  • Computer device also referred to as “computer” in the context, is meant an intelligent electronic device that can perform predetermined processing, such as numerical calculations and/or logical calculations, by running a predetermined program or instruction, which can include a processor and The memory is executed by the processor to execute a predetermined process pre-stored in the memory to execute a predetermined process, or is executed by hardware such as an ASIC, an FPGA, a DSP, or the like, or a combination of the two.
  • Computer devices include, but are not limited to, servers, personal computers, notebook computers, tablets, smart phones, and the like.
  • FIG. 1 it is a schematic diagram of the detection of an automatic measuring device for transmitting a transfer platform of a driving chip, and the device comprises: a platform 1 , a predetermined position nozzle 2 , and a reverse suction nozzle 3 .
  • the pre-positioning nozzle 2 is placed on the platform 1, and the reversing nozzle 3 is fixedly disposed at the upper end of the platform 1.
  • the pre-position nozzle 2 is moved to directly below the reversing nozzle 3; the sheet (to be inspected)
  • the specification is that the 20um sheet is detected and the 30um sheet is not detected.
  • An aspect of the present application provides a method for detecting an automatic measuring device of a transfer interface of a driving chip.
  • the device is as shown in FIG. 2-1 and FIG. 2-2, and includes: a platform 1, a predetermined position nozzle 2, Inverting the nozzle 3, the sensor 4 and the reflection sheet 5, wherein the sensor 4 is fixed to one side of the reversing nozzle 3, the reflection sheet 5 is fixed to one side of the pre-position nozzle 2 and the The reflective sheet 4 is located below the sensor 4.
  • the method is as shown in FIG. 3 and includes the following steps:
  • Step S301 The automatic measuring device controls the light source to emit light to the reflective sheet.
  • Step S302 the sensor 4 of the automatic measuring device detects the measured value of the reflective sheet.
  • Step S303 determining a variation curve between the measured value and the height according to the material of the reflective sheet.
  • Step S304 Query the height value corresponding to the measured value from the change curve.
  • Step S305 Determine, according to the height value, whether the delivery handover platform can pass the detection.
  • the method provided by the present application detects the measured value of the reflective sheet by the sensor, and directly obtains the height value by the measured value and the height change curve, so the height value does not need to be manually judged, and the device can automatically determine, so the detection has no human participation. low cost.
  • the reflective sheet 5 is fixed on one side of the predetermined position nozzle 2 and the highest height of the reflection sheet is the same as the highest height of the predetermined position nozzle 2 and the reflection sheet 5 and the predetermined position nozzle 2 are in the height direction.
  • Flush This setting is to facilitate the height value can be equal to the height of the transfer platform (Gap) between the nozzles, avoiding the conversion between the height values, which is convenient for calculation.
  • the foregoing method may further include:
  • the reverse nozzle 3 is controlled to move up or down according to the height value until the transfer interface passes the detection.
  • the manner of controlling the reverse nozzle 3 to move up or down may be various.
  • the reverse nozzle may be moved up or down by a servo motor.
  • the stepping motor can be used to drive the reverse nozzle to move up or down.
  • the specific embodiments of the present application do not limit the specific manner of the above control.
  • Controlling the reverse nozzle 3 to move up or down according to the height value until the transmission handover platform passes the detection may specifically include:
  • the control reverses the nozzle 3 to move upward, and each time the sensor is measured, the sensor is measured once. a measured value, according to the first measured value to obtain a first height, if the first height is the same as the preset height value, the movement is stopped, otherwise the upward movement is performed again and the height measuring step is performed until the height value corresponding to the measured value after the movement and the The preset height is the same.
  • the control reverses the nozzle 3 to move downward.
  • the sensor measures the second measurement value once, and obtains the second height according to the second measurement value, such as the second height and the pre-measurement. If the height values are the same, the movement is stopped, otherwise the downward movement is performed again and the height measurement step is performed until the height value corresponding to the measured value after the movement is the same as the preset height.
  • an automatic measuring device for a transfer interface of a driving chip is provided.
  • the hardware structure of the device is as shown in FIG. 2-1 and FIG. 2-2, and includes: a platform 1, a predetermined position nozzle 2, and a reverse a nozzle 3, a sensor 4 and a reflection sheet 5, wherein the sensor 4 is fixed to one side of the reversing nozzle 3, the reflection sheet 5 is fixed to one side of the pre-position nozzle 2 and the reflection The sheet 4 is located below the sensor 4, and the device further comprises:
  • a processing unit configured to control the light source to emit light to the reflective sheet.
  • the sensor 4 is configured to detect the measured value of the reflective sheet.
  • the processing unit is configured to determine a change curve of the measured value and the height according to the material of the reflective sheet, and query the height value corresponding to the measured value from the change curve; and determine, according to the height value, whether the transfer handover platform can pass the detection.
  • the method provided by the present application detects the measured value of the reflective sheet by the sensor, and directly obtains the height value by the measured value and the height change curve, so the height value does not need to be manually judged, and the device can automatically determine, so the detection has no human participation. low cost.
  • the reflective sheet 5 is fixed on one side of the predetermined position nozzle 2 and the highest height of the reflection sheet is the same as the highest height of the predetermined position nozzle 2 and the reflection sheet 5 and the predetermined position nozzle 2 are in the height direction.
  • Flush This setting is to facilitate the height value can be equal to the height of the transfer platform (Gap) between the nozzles, avoiding the conversion between the height values, which is convenient for calculation.
  • the processing unit is further configured to control, when the detection fails, to move the reverse nozzle 3 upward or downward according to the height value until the transfer handover platform passes the detection.
  • the manner of controlling the reverse nozzle 3 to move up or down may be various.
  • the reverse nozzle may be moved up or down by a servo motor.
  • the stepping motor can be used to drive the reverse nozzle to move up or down.
  • the specific embodiments of the present application do not limit the specific manner of the above control.
  • the processing unit is specifically configured to control the reverse nozzle 3 to move upward if the height value is smaller than the preset height value, and each time the sensor is measured, the first measurement value is obtained once, and the first height is obtained according to the first measurement value. If the first height is the same as the preset height value, the movement is stopped, otherwise the upward movement is performed again and the height measurement step is performed until the height value corresponding to the measured value after the movement is the same as the preset height.
  • the processing unit is further configured to: if the height value is greater than the preset height value, control the reverse nozzle 3 to move downward, and each time the sensor moves, the sensor measures the second measurement value once, and obtains the second measurement value according to the second measurement value. Height, such as the second height and the preset height value Similarly, the movement is stopped, otherwise the downward movement is performed again and the height measurement step is performed until the height value corresponding to the measured value after the movement is the same as the preset height.

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Abstract

一种驱动芯片的传递交接平台的自动测量设备的检测方法，自动测量设备包括：平台（1）、预定位吸嘴（2）、反转吸嘴（3）、传感器（4）和反射片（5），其中，传感器（4）与反转吸嘴（3）的一侧固定，反射片（5）固定在预定位吸嘴（2）的一侧且反射片（5）位于传感器（4）的下面，检测方法包括如下步骤：自动测量设备控制光源向反射片（5）发出光线（301）；传感器（4）检测反射片（5）的测量值（302）；自动测量设备依据反射片（5）的材质确定测量值与高度的变化曲线（303）；自动测量设备从该变化曲线中查询出该测量值对应的高度值（304）；自动测量设备依据该高度值判断该平台（1）是否能够通过检测（305）。

Description

驱动芯片的传递交接平台的自动测量方法、设备 技术领域
本申请涉及电子芯片技术，尤其涉及一种驱动芯片的传递交接平台的自动测量方法、设备。
背景技术
传递交接平台的高度检测为现有的驱动芯片传递交接平台的常规检测项目,现有的驱动芯片(英文:Drive IC)传递时，使用厚薄规测量各吸嘴间交接平台(Gap)的高度，现有的检测方式为检测人员目测的方式，此受制于检测人员的经验和水平，不仅成本高，且检测标准不统一，影响检测结果。
发明内容
本申请的目的之一提供一种驱动芯片的传递交接平台的自动测量方法、设备，实现平台高度的自动检测，无需人工参与，所以成本低，检测结果准确。
根据本申请的一个方面，提供了一种驱动芯片的传递交接平台的自动测量设备的检测方法，所述自动检测设备包括：平台、预定位吸嘴、反转吸嘴、传感器和反射片，其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方所述传感器与所述反转吸嘴的一侧固定，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下面，所述方法包括如下步骤：
自动测量设备控制光源向所述反射片发出光线；
所述传感器检测该反射片的测量值；
自动测量设备依据反射片的材质确定测量值与高度的变化曲线；
自动测量设备从该变化曲线中查询出该测量值对应的高度值；
自动测量设备依据该高度值判断该传递交接平台是否能够通过检测。
可选的，所述反射片的最高高度与所述预定位吸嘴的最高高度相同。
可选的，所述方法还包括：
如检测不通过，则依据高度值控制所述反转吸嘴向上或向下移动直至该传递交接平台通过检测。
可选的，所述依据高度值控制所述反转吸嘴向上或向下移动直至该传递交接平台通过检测具体包括：
如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
可选的，所述依据高度值控制所述反转吸嘴向上或向下移动直至该传递交接平台通过检测具体包括：
如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
另一方面，提供一种驱动芯片的传递交接平台的自动测量设备，所述设备包括：平台、预定位吸嘴、反转吸嘴，其中，设备所述设备还包括：传感器和反射片，其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方；所述传感器固定在所述反转吸嘴的一侧，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下方，所述设备还包括
处理单元，用于控制光源向所述反射片发出光线；
所述传感器，用于检测该反射片的测量值；
所述处理单元，用于依据反射片的材质确定测量值与高度的变化曲线，从该变化曲线中查询出该测量值对应的高度值；依据该高度值判断该传递交接平台是否能够通过检测。
可选的，所述反射片的最高高度与预定位吸嘴的最高高度相同。
可选的，所述处理单元，还用于如检测不通过，则依据高度值控制所述反转吸嘴向上或向下移动直至该传递交接平台通过检测。
可选的，所述处理单元，具体用于如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
可选的，所述处理单元，具体用于如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与 该预设高度相同。
根据本申请的又一个方面，提供了一种驱动芯片的传递交接平台的自动测量设备，所述设备包括：平台、预定位吸嘴、反转吸嘴、传感器以及反射片；其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方；所述传感器固定在所述反转吸嘴的一侧，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下方，所述设备还包括：处理单元，所述处理单元用于控制光源向所述反射片发出光线；所述传感器，用于检测该反射片的测量值；所述处理单元，还用于依据反射片的材质确定测量值与高度的变化曲线，从该变化曲线中查询出该测量值对应的高度值；依据该高度值判断该传递交接平台是否能够通过检测；其中，所述处理单元，还用于如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同；如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
本领域普通技术人员将了解，虽然下面的详细说明将参考图示实施例、附图进行，但本申请并不仅限于这些实施例。而是，本申请的范围是广泛的，且意在仅通过后附的权利要求限定本申请的范围。
附图说明
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显：
图1为现有技术的平台测量设备的结构示意图；
图2-1为根据本申请一个优选实施例的平台测量设备的结构示意图；
图2-2为根据本申请一个优选实施例的平台测量设备的结构示意图；
图3为本申请一个优选实施例提供的检测方法的流程图；
图4-1为玻璃反射片的拟合线图；
图4-2为抛光铜片反射片的拟合线图；
图4-3为平台与传感器的测量值相关性曲线图。
具体实施方式
在更加详细地讨论示例性实施例之前应当提到的是，一些示例性实施例被描述成作为流程图描绘的处理或方法。虽然流程图将各项操作描述成顺序的处理，但是其中的许多操作可以被并行地、并发地或者同时实施。此外，各项操作的顺序可以被重新安排。当其操作完成时所述处理可以被终止，但是还可以具有未包括在附图中的附加步骤。所述处理可以对应于方法、函数、规程、子例程、子程序等等。
在上下文中所称“计算机设备”，也称为“电脑”，是指可以通过运行预定程序或指令来执行数值计算和/或逻辑计算等预定处理过程的智能电子设备，其可以包括处理器与存储器，由处理器执行在存储器中预存的存续指令来执行预定处理过程，或是由ASIC、FPGA、DSP等硬件执行预定处理过程，或是由上述二者组合来实现。计算机设备包括但不限于服务器、个人电脑、笔记本电脑、平板电脑、智能手机等。
后面所讨论的方法(其中一些通过流程图示出)可以通过硬件、软件、固件、中间件、微代码、硬件描述语言或者其任意组合来实施。当用软件、固件、中间件或微代码来实施时，用以实施必要任务的程序代码或代码段可以被存储在机器或计算机可读介质(比如存储介质)中。(一个或多个)处理器可以实施必要的任务。
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
应当理解的是，虽然在这里可能使用了术语“第一”、“第二”等等来描述各个单元，但是这些单元不应当受这些术语限制。使用这些术语仅仅是为了将一个单元与另一个单元进行区分。举例来说，在不背离示例性实施例的范围的情况下，第一单元可以被称为第二单元，并且类似地第二单元可以被称为第一单元。这里所使用的术语“和/或”包括其中一个或更多所列出的相关联项目的任意和所有组合。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
还应当提到的是，在一些替换实现方式中，所提到的功能/动作可以按照不同于附图中标示的顺序发生。举例来说，取决于所涉及的功能/动作，相继示出的两幅图实际上可以基本上同时执行 或者有时可以按照相反的顺序来执行。
下面结合附图对本申请作进一步详细描述。
如图1所示，为一种驱动芯片的传递交接平台的自动测量设备的检测示意图，该设备包括：平台1、预定位吸嘴2、反转吸嘴3。预定位吸嘴2放置平台1上,反转吸嘴3固定设置在平台1的上端,平台1转动时带动预定位吸嘴2移动至反转吸嘴3的正下方；薄片(待检测部件)规格是20um的薄片检测通过，30um的薄片检测不通过。
本申请的一个方面，提供了一种驱动芯片的传递交接平台的自动测量设备的检测方法，该设备如图2-1、图2-2所示，包括：平台1、预定位吸嘴2、反转吸嘴3、传感器4和反射片5，其中，该传感器4与所述反转吸嘴3的一侧固定，该反射片5固定在所述预定位吸嘴2的一侧且所述反射片4位于所述传感器4的下面，该方法如图3所示，包括如下步骤：
步骤S301、自动测量设备控制光源向所述反射片发出光线。
步骤S302、自动测量设备的传感器4检测该反射片的测量值。
步骤S303、依据反射片的材质确定测量值与高度的变化曲线。
上述变化曲线具体可以如图4-1、图4-2、图4-3为传感器测量值与平台的相关性示意图。
步骤S304、从该变化曲线中查询出该测量值对应的高度值。
步骤S305、依据该高度值判断该传递交接平台是否能够通过检测。
本申请提供的方法通过传感器检测反射片的测量值，通过该测量值与高度的变化曲线直接查询得到该高度值，所以该高度值无需人工判断，设备可以自动判断，所以其检测无人工参与，成本低。
可选的，上述反射片5固定在所述预定位吸嘴2的一侧且反射片的最高高度与预定位吸嘴2的最高高度相同及反射片5与预定位吸嘴2在高度方向上平齐。此设置是为了方便高度值可以等于各吸嘴间交接平台(Gap)的高度，避免了高度值之间的转换，方便了计算。
可选的，上述方法在步骤S305之后还可以包括：
如检测不通过，则依据高度值控制所述反转吸嘴3向上或向下移动直至该传递交接平台通过检测。
上述控制所述反转吸嘴3向上或向下移动的方式可以有多种，例如在本申请一个具体实施例中，可以通过伺服电机带动反转吸嘴向上或向下移动。当然在本申请另一个具体实施例中，可以通过步进电机带动反转吸嘴向上或向下移动。本申请具体实施方式并不限制上述控制的具体方式。
依据高度值控制所述反转吸嘴3向上或向下移动直至该传递交接平台通过检测具体可以包括：
如高度值比预设高度值小，则控制反转吸嘴3向上移动，每移动一次，传感器测量一次得到第 一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
如高度值比预设高度值大，则控制反转吸嘴3向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
本申请的另一方面，提供一种驱动芯片的传递交接平台的自动测量设备，该设备硬件结构如图2-1、图2-2所示，包括：平台1、预定位吸嘴2、反转吸嘴3、传感器4和反射片5，其中，该传感器4与所述反转吸嘴3的一侧固定，该反射片5固定在所述预定位吸嘴2的一侧且所述反射片4位于所述传感器4的下面，该设备还包括：
处理单元，用于控制光源向所述反射片发出光线。
传感器4，用于检测该反射片的测量值。
处理单元，用于依据反射片的材质确定测量值与高度的变化曲线，从该变化曲线中查询出该测量值对应的高度值；依据该高度值判断该传递交接平台是否能够通过检测。
本申请提供的方法通过传感器检测反射片的测量值，通过该测量值与高度的变化曲线直接查询得到该高度值，所以该高度值无需人工判断，设备可以自动判断，所以其检测无人工参与，成本低。
可选的，上述反射片5固定在所述预定位吸嘴2的一侧且反射片的最高高度与预定位吸嘴2的最高高度相同及反射片5与预定位吸嘴2在高度方向上平齐。此设置是为了方便高度值可以等于各吸嘴间交接平台(Gap)的高度，避免了高度值之间的转换，方便了计算。
可选的，处理单元，还用于如检测不通过，则依据高度值控制所述反转吸嘴3向上或向下移动直至该传递交接平台通过检测。
上述控制所述反转吸嘴3向上或向下移动的方式可以有多种，例如在本申请一个具体实施例中，可以通过伺服电机带动反转吸嘴向上或向下移动。当然在本申请另一个具体实施例中，可以通过步进电机带动反转吸嘴向上或向下移动。本申请具体实施方式并不限制上述控制的具体方式。
上述处理单元，具体用于如高度值比预设高度值小，则控制反转吸嘴3向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
上述处理单元，具体还用于如高度值比预设高度值大，则控制反转吸嘴3向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相 同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
对于本领域技术人员而言，显然本申请不限于上述示范性实施例的细节，而且在不背离本申请的精神或基本特征的情况下，能够以其他的具体形式实现本申请。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本申请的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化涵括在本申请内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。此外，显然“包括”一词不排除其他单元或步骤，单数不排除复数。系统权利要求中陈述的多个单元或设备也可以由一个单元或设备通过软件或者硬件来实现。第一，第二等词语用来表示名称，而并不表示任何特定的顺序。

Claims (20)

  1. 一种驱动芯片的传递交接平台的自动测量设备的检测方法，所述自动检测设备包括：平台、预定位吸嘴、反转吸嘴、传感器以及反射片；
    其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方；所述传感器与所述反转吸嘴的一侧固定，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下面，所述方法包括如下步骤：
    自动测量设备控制光源向所述反射片发出光线；
    所述传感器检测该反射片的测量值；
    自动测量设备依据反射片的材质确定测量值与高度的变化曲线；
    自动测量设备从该变化曲线中查询出该测量值对应的高度值；
    自动测量设备依据该高度值判断该传递交接平台是否能够通过检测。
  2. 根据权利要求1所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，所述反射片的最高高度与所述预定位吸嘴的最高高度相同。
  3. 根据权利要求1所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，所述方法还包括：如检测不通过，则依据高度值控制所述反转吸嘴向上移动直至该传递交接平台通过检测。
  4. 根据权利要求3所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，所述依据高度值控制所述反转吸嘴向上移动直至该传递交接平台通过检测具体包括：
    如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度。
  5. 根据权利要求4所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，如所述第一高度与预设高度值相同，则停止移动。
  6. 根据权利要求4所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，如所述第一高度与该预设高度值不相同，则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
  7. 根据权利要求1所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，所述方法还包括：如检测不通过，则依据高度值控制所述反转吸嘴向下移动直至该传递交接平台通过检测。
  8. 根据权利要求7所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，所述依据高度值控制所述反转吸嘴向下移动直至该传递交接平台通过检测具体包括：
    如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度。
  9. 根据权利要求8所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，如所述第二高度与预设高度值相同，则停止移动。
  10. 根据权利要求8所述的驱动芯片的传递交接平台的自动测量设备的检测方法，其中，如所述第二高度与该预设高度值不相同，则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
  11. 一种驱动芯片的传递交接平台的自动测量设备，所述设备包括：平台、预定位吸嘴、反转吸嘴、传感器以及反射片；
    其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方；所述传感器固定在所述反转吸嘴的一侧，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下方，所述设备还包括：
    处理单元，所述处理单元用于控制光源向所述反射片发出光线；
    所述传感器，用于检测该反射片的测量值；
    所述处理单元，还用于依据反射片的材质确定测量值与高度的变化曲线，从该变化曲线中查询出该测量值对应的高度值；依据该高度值判断该传递交接平台是否能够通过检测。
  12. 根据权利要求11所述的驱动芯片的传递交接平台的自动测量设备，其中，所述反射片的最高高度与预定位吸嘴的最高高度相同。
  13. 根据权利要求11所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，还用于如检测不通过，则依据高度值控制所述反转吸嘴向上或向下移动直至该传递交接平台通过检测。
  14. 根据权利要求13所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度。
  15. 根据权利要求14所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如所述第一高度与预设高度值相同，则停止移动。
  16. 根据权利要求14所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如所述第一高度与该预设高度值不相同，则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
  17. 根据权利要求13所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度。
  18. 根据权利要求17所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如所述第二高度与预设高度值相同，则停止移动。
  19. 根据权利要求17所述的驱动芯片的传递交接平台的自动测量设备，其中，所述处理单元，具体用于如所述第二高度与该预设高度值不相同，则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
  20. 一种驱动芯片的传递交接平台的自动测量设备，所述设备包括：平台、预定位吸嘴、反转吸嘴、传感器以及反射片；
    其中，所述预定位吸嘴放置在所述平台上,所述反转吸嘴固定设置在所述平台的上端,所述平台转动时带动所述预定位吸嘴移动至所述反转吸嘴的正下方；所述传感器固定在所述反转吸嘴的一侧，所述反射片固定在所述预定位吸嘴的一侧且所述反射片位于所述传感器的下方，所述设备还包括：
    处理单元，所述处理单元用于控制光源向所述反射片发出光线；
    所述传感器，用于检测该反射片的测量值；
    所述处理单元，还用于依据反射片的材质确定测量值与高度的变化曲线，从该变化曲线中查询出该测量值对应的高度值；依据该高度值判断该传递交接平台是否能够通过检测；
    其中，所述处理单元，还用于如高度值比预设高度值小，则控制反转吸嘴向上移动，每移动一次，传感器测量一次得到第一测量值，依据第一测量值得到第一高度，如第一高度与预设高度值相同，则停止移动，否则再次向上移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同；如高度值比预设高度值大，则控制反转吸嘴向下移动，每移动一次，传感器测量一次得到第二测量值，依据第二测量值得到第二高度，如第二高度与预设高度值相同，则停止移动，否则再次向下移动并进行高度测量步骤直至移动后的测量值对应的高度值与该预设高度相同。
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