WO2018107555A1 - Oled显示器的封装方法及oled显示器 - Google Patents

Oled显示器的封装方法及oled显示器 Download PDF

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Publication number
WO2018107555A1
WO2018107555A1 PCT/CN2017/070623 CN2017070623W WO2018107555A1 WO 2018107555 A1 WO2018107555 A1 WO 2018107555A1 CN 2017070623 W CN2017070623 W CN 2017070623W WO 2018107555 A1 WO2018107555 A1 WO 2018107555A1
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Prior art keywords
substrate
desiccant
layer
oled display
copper film
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English (en)
French (fr)
Inventor
徐超
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/325,143 priority Critical patent/US10355245B2/en
Priority to KR1020197020551A priority patent/KR102253214B1/ko
Priority to JP2019531685A priority patent/JP6925425B2/ja
Publication of WO2018107555A1 publication Critical patent/WO2018107555A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for packaging an OLED display and an OLED display.
  • OLED displays have the advantages of high brightness, fast response, low power consumption, and flexibility, and are widely recognized as the focus of next-generation display technology.
  • the biggest advantage of OLEDs compared to TFT-LCDs is the ability to fabricate large, ultra-thin, flexible, transparent and double-sided display devices.
  • the lifetime of the device is not long.
  • the main reasons include two aspects: First, the organic film is sensitive to moisture and oxygen, and is prone to aging and denaturation due to water and oxygen, resulting in significant attenuation of brightness and lifetime of the device; In order to reduce the electron injection barrier, the cathode is usually a chemically active low-worker metal, which is easily oxidized, resulting in a reduced lifetime of the device.
  • the invention provides a packaging method of an OLED display and an OLED display, which can solve the problem that the OLED device existing in the prior art is easily damaged by water and oxygen, resulting in a decrease in lifetime.
  • a technical solution adopted by the present invention is to provide a method for packaging an OLED display, the method comprising the steps of: forming a copper film layer on the OLED layer of the first substrate by evaporation;
  • the first substrate includes an array substrate and an OLED layer formed on the array substrate; a sealant is formed on an outer edge of the second substrate; a desiccant layer is formed in a region of the sealant of the second substrate; a vacuum machine having hydrogen gas, a side on which the first substrate is formed with a copper film layer and a side on which the second substrate is formed with a desiccant layer are disposed opposite to each other, and the first substrate and the first The two substrates are pressed together, and the sealant is cured to seal hydrogen between the copper film layer and the second substrate, wherein the gas pressure in the vacuum machine is 0.1-10 pa.
  • the desiccant layer is a liquid desiccant, and the desiccant is formed on the second substrate by coating.
  • the desiccant layer is a solid desiccant, and the solid desiccant is formed in the second manner by lamination On the substrate.
  • the desiccant layer is formed with a reserved space; after the first substrate and the second substrate are pressed together The hydrogen gas is filled in the reserved space; the desiccant layer is in contact with the copper film layer.
  • another technical solution adopted by the present invention is to provide a method for packaging an OLED display, the method comprising the steps of: forming a copper film layer on an OLED layer of a first substrate, wherein the first The substrate comprises an array substrate and an OLED layer formed on the array substrate; a sealant is formed on an outer edge of the second substrate; a desiccant layer is formed in a region of the sealant of the second substrate; and the vacuum is filled with hydrogen a side of the first substrate on which the copper film layer is formed and a side on which the second substrate is formed with a desiccant layer, and press the first substrate and the second substrate And sealing the sealant to seal hydrogen between the copper film layer and the second substrate.
  • the copper film layer is formed on the OLED layer by evaporation.
  • the desiccant layer is a liquid desiccant, and the desiccant is formed on the second substrate by coating on.
  • the desiccant layer is a solid desiccant, and the solid desiccant is formed in the second manner by lamination On the substrate.
  • the gas pressure in the vacuum machine is 0.1-10 Pa.
  • the desiccant layer in the step of forming a desiccant layer in a region in the sealant of the second substrate, is formed with a reserved space; after the first substrate and the second substrate are pressed together , the hydrogen Filled in the reserved space; the desiccant layer is in contact with the copper film layer.
  • the desiccant is a liquid desiccant, and the liquid desiccant is coated into a plurality of dispersed droplets, or a fence shape, or a grid shape, or a spiral shape.
  • the desiccant is a solid desiccant
  • the solid desiccant is in the form of a sheet, and the solid desiccant is formed with a plurality of pores as a reserved space; or, the solid desiccant has a plurality of pieces, each piece A gap is reserved between the solid desiccants as a reserved space.
  • the plastic frame is a UV curing plastic frame.
  • an OLED display including a first substrate, a copper film layer, a desiccant layer and a second substrate;
  • the first substrate includes an array substrate and an OLED a layer, the OLED layer is disposed on the array substrate; a copper film layer is formed on the OLED layer; a desiccant layer is disposed on the copper film layer; and a second substrate is disposed on the desiccant layer
  • the outer edges of the second substrate and the first substrate are sealed by a sealant; hydrogen gas is filled between the copper film layer and the second substrate.
  • the desiccant layer is a liquid desiccant or a solid desiccant.
  • the desiccant layer is provided with a reserved space, and the hydrogen gas is filled in the reserved space; the desiccant layer is in contact with the copper film layer.
  • the desiccant is a liquid desiccant, and the liquid desiccant is coated into a plurality of dispersed droplets, or a fence shape, or a grid shape, or a spiral shape.
  • the desiccant is a solid desiccant
  • the solid desiccant is in the form of a sheet, and the solid desiccant is formed with a plurality of pores as a reserved space; or, the solid desiccant has a plurality of pieces, each piece A gap is reserved between the solid desiccants as a reserved space.
  • the desiccant of the desiccant layer is evenly distributed, and the reserved space is evenly distributed in the desiccant layer.
  • the plastic frame is a UV curing plastic frame.
  • the present invention forms a copper film layer on the first substrate OLED layer, and forms a desiccant layer on the second substrate, and is in a vacuum machine filled with hydrogen gas.
  • the first substrate and the second substrate are pressed together after the copper film layer and the dry base layer are oppositely disposed, so that hydrogen gas is sealed between the copper film layer and the second substrate, and when O2 is immersed into the OLED display, the copper is Cu in the film layer reacts with O2 to form CuO, thereby removing O2.
  • CuO is reduced to Cu by H2
  • the generated H2O is absorbed by the desiccant, thereby preventing water and oxygen from being on the OLED layer.
  • the damage can greatly improve the packaging effect of the OLED display and effectively extend the service life of the OLED display.
  • FIG. 1 is a schematic flow chart of a method for packaging an OLED display according to a first embodiment of the present invention
  • FIG. 2 is a schematic flow chart of a method for packaging an OLED display according to a second embodiment of the present invention
  • Figure 3 is a schematic structural view of the second embodiment of the present invention after step S201;
  • Figure 4 is a schematic structural view of the second embodiment of the present invention after step S202;
  • Figure 5 is a schematic structural view of the second embodiment of the present invention after step S203;
  • FIG. 6 is a schematic structural view of an OLED display finally formed in accordance with a second embodiment of the present invention.
  • FIG. 1 is a schematic flow chart of a method for packaging an OLED display according to a first embodiment of the present invention.
  • the array substrate is a TFT (Thin Film Transistor) array substrate
  • the OLED layer specifically includes a positive electrode sublayer, a hole transport sublayer, a luminescent sublayer, an electron transport sublayer, and a metal cathode sublayer, wherein the positive electrode The layer is electrically connected to the positive pole of the power source, and the metal cathode sublayer is electrically connected to the negative pole of the power source.
  • the holes of the positive electrode sub-layer and the charge of the cathode sub-layer are combined in the illuminating sub-layer to produce light, and three primary colors of red, green and blue (RGB) are generated depending on the composition of the illuminating sub-layer.
  • RGB Red, green and blue
  • the basic color is formed such that the OLED layer emits visible light.
  • the metal cathode sub-layer is formed of a relatively active metal such as Ca/Al or Mg/Ag.
  • a copper film layer is formed on the metal cathode sublayer.
  • the second substrate serves as a package substrate to encapsulate the first substrate.
  • the sealant can be a UV curable adhesive.
  • UV curing adhesive has the advantages of fast curing, low energy consumption, no solvent pollution, etc.
  • the curing principle is: the photoinitiator in the curing gel is rapidly decomposed into free radicals or cations under the irradiation of ultraviolet light of appropriate wavelength and light intensity, and then Initiation of unsaturated bond polymerization to cure the material.
  • the present invention forms a copper film layer on the first substrate OLED layer, and forms a desiccant layer on the second substrate, and the copper film layer and the dry base layer are opposed in a vacuum machine filled with hydrogen gas.
  • the first substrate and the second substrate are pressed together, so that hydrogen gas is sealed between the first substrate and the second substrate, and when O2 is immersed into the OLED display, Cu of the copper film layer reacts with O2 to generate CuO, thereby removing O2, when the OLED display is lit and heated, CuO is reduced to Cu by H2, and the generated H2O is absorbed by the desiccant, thereby preventing water and oxygen from damaging the OLED layer, thereby greatly improving the OLED display.
  • the packaging effect effectively extends the service life of the OLED display.
  • FIG. 2 is a schematic flow chart of a method for packaging an OLED display according to a second embodiment of the present invention.
  • FIG. 3 is a schematic structural view after step S201 in the second embodiment of the present invention.
  • the first substrate 10 includes an array substrate 11 and an OLED layer 12 formed on the array substrate 11.
  • the copper film layer 20 is completely covered on the OLED layer 12 by evaporation.
  • the copper is covered on the OLED layer 12 by a vacuum evaporation coating method to form a copper film layer 20.
  • the vacuum evaporation coating method is to heat and plate the material onto the substrate in a vacuum environment to form a vacuum evaporation method, which is to be film-formed.
  • the material is placed in a vacuum for evaporation or biochemistry to cause precipitation on the surface of the workpiece or substrate.
  • the method has the advantages of simple operation, high purity of the membrane, good quality, accurate thickness control, high film formation rate, high efficiency, simple membrane growth excitation and the like.
  • FIG. 4 is a schematic structural view after step S202 in the second embodiment of the present invention.
  • the UV sealant 40 is formed on the outer edge of the second substrate 30 for connection sealing between the second substrate 30 and the first substrate 10 in the subsequent order.
  • FIG. 5 is a schematic structural diagram of the second embodiment of the present invention after step S203.
  • the desiccant layer 50 in this embodiment is formed with a reserved space 52, that is, the desiccant 51 does not completely cover the area in the sealant 40 of the second substrate 30, but only covers a part of the area, and the remaining area is pre- A space 52 is left to fill the hydrogen in the reserved space 52.
  • the desiccant 51 of the present embodiment is a liquid desiccant
  • the liquid desiccant may be in the shape of a droplet of a sphere, and a plurality of droplet-shaped desiccants are evenly distributed in a region on the second substrate, adjacent thereto.
  • the space between the drop-shaped desiccants is the reserved space 52.
  • the liquid desiccant may also be coated in a fence shape, or in the form of a grid, or a spiral, etc., as long as a space is formed on the desiccant layer.
  • the solid desiccant may also form a desiccant layer 50 having a reserved space 52.
  • the solid desiccant may be in the form of a sheet, and the sheet-shaped solid desiccant is formed with a plurality of pores. The pores serve as a reserved space 52, and a sheet-like solid desiccant is formed on the second substrate 30 by lamination.
  • the desiccant layer 50 may also be formed of a plurality of solid desiccants, and a gap is left between each solid desiccant when the film is adhered, and the gap serves as a reserved space 52.
  • a gap may also be formed between the desiccant layer 50 and the copper film layer 20 to fill the hydrogen.
  • the vacuum machine is a VAS machine
  • the gas pressure in the machine is 0.1-10pa, specifically 0.1-4pa, such as 0.1pa, 2pa, 3.5pa, etc., or 4pa-10pa, for example 4pa, 6pa. , 6.7pa, 9pa or 10pa, etc.
  • the gas pressure in the machine can be varied within the range of 0.1-10pa, the specific pressure value can be determined according to the actual demand and the actual machine can reach.
  • UV frame glue 40 solid The crystallization is achieved by illuminating the UV light.
  • FIG. 6 is a schematic structural view of an OLED display finally formed according to a second embodiment of the present invention.
  • the copper film layer 20 on the first substrate 10 of the present embodiment and the desiccant layer 50 on the second substrate 30 are disposed opposite each other, and the desiccant layer 50 is in contact with the copper film layer 20, thereby ensuring the hydrogen gas 60 in the reserved space 52.
  • the immersed O2 reacts.
  • the desiccant 51 is in contact with the copper film layer 20, so that the H2O produced when H2 reduces CuO to Cu is directly absorbed by the desiccant 51. Thereby preventing damage to the OLED layer by H2O and O2.
  • the present invention also provides an OLED display. Specifically, please continue to refer to FIG. 6.
  • the OLED display includes a first substrate 10, a copper film layer 20, a desiccant layer 50, and a second substrate 30, wherein the copper film layer 20 is formed.
  • the desiccant layer 50 is disposed on the copper film layer 20
  • the second substrate 30 is disposed on the desiccant layer 50, and the outer edges of the second substrate 30 and the first substrate 10 are sealed by the sealant 40. connection.
  • hydrogen gas 60 is filled between the copper film layer 20 and the second substrate 30.
  • the first substrate 10 includes an array substrate 11 and an OLED layer 12, and the OLED layer 12 is disposed on the array substrate 11.
  • a copper film layer 20 is formed on the OLED layer 12, specifically, the copper film layer 20 overlies the metal cathode sub-layer of the OLED layer 12.
  • the desiccant layer 50 is disposed on the copper film layer 20, wherein the desiccant 51 may be a liquid desiccant or a solid desiccant.
  • the desiccant layer 50 of the present embodiment is formed with a reserved space 52 for filling hydrogen gas, the desiccant 51 is evenly distributed, and the reserved space 52 is evenly distributed, and the desiccant layer 50 is in contact with the copper film layer 20.
  • the desiccant 51 is a liquid desiccant
  • the liquid desiccant may be in the form of a sphere-like drop, and a plurality of droplet-shaped desiccants are evenly distributed in a region on the second substrate. The space between adjacent drop-shaped desiccants is reserved.
  • liquid desiccant may also be coated in a fence, or grid, or spiral, or the like.
  • the desiccant layer 50 having the reserved space 52 may also be formed by a solid desiccant, the solid desiccant may be in the form of a sheet, and the sheet-shaped solid desiccant is formed with a plurality of pores. The pores serve as a reserved space 52, and a sheet-like solid desiccant is formed on the second substrate 30 by lamination.
  • the desiccant layer 50 may also be formed of a plurality of solid desiccants, and a gap is left between each solid desiccant when the film is adhered, and the gap serves as a reserved space 52.
  • the desiccant layer 50 of the present embodiment is in contact with the copper film layer 20, thereby ensuring that the hydrogen gas 60 in the reserved space 52 is in contact with the copper film layer 20, so that the H260 can directly contact the CuO formed on the formed copper film layer 20. Therefore, when the OLED display is lit and heated, the hydrogen gas 60 reduces CuO to Cu, and can repeatedly react with the immersed O2. At the same time, it is also ensured that the desiccant is in contact with the copper film layer 20, so that the H2O produced when the hydrogen gas 60 reduces CuO to Cu is directly absorbed by the desiccant. Thereby preventing damage to the OLED layer by H2O and O2.
  • the present invention can effectively improve the packaging effect and prolong the service life of the OLED display.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种OLED显示器的封装方法及OLED显示器，包括：在第一基板(10)的OLED层(12)上形成铜膜层(20)；在第二基板(30)的外缘形成框胶(40)；在第二基板(30)的框胶(40)内的区域形成干燥剂层(50)；在充有氢气的真空机台内，将第一基板(10)和第二基板(30)相对进行压合，将框胶(40)进行固化，以将氢气(60)封存在铜膜层(20)和第二基板(30)之间；该OLED显示器包括第一基板(10)、铜膜层(20)、干燥剂层(50)和第二基板(30)，在铜膜层(20)和第二基板(30)之间填充有氢气(60)。能有效提高封装效果，延长OLED显示器的使用寿命。

Description

OLED显示器的封装方法及OLED显示器 【技术领域】
本发明涉及显示技术领域，特别是涉及一种OLED显示器的封装方法及OLED显示器。
【背景技术】
OLED显示器具有亮度高、响应快、能耗低、可弯曲等一列优点，被广泛认可为下一代显示技术的焦点。OLED与TFT-LCD相比，最大的优势就是可制备大尺寸、超薄、柔性、透明及双面显示器件。
目前OLED普遍面临的一个问题是器件寿命不长，主要原因包括两个方面：一是有机薄膜对水气和氧气很敏感，容易因水氧发生老化变性，导致器件亮度和寿命出现明显衰减；二是为了减小电子的注入势垒，阴极通常采用是化学性质较为活泼的低功函数金属，这类金属很容易被氧化，导致器件的寿命降低。
【发明内容】
本发明提供一种OLED显示器的封装方法及OLED显示器，能够解决现有技术存在的OLED器件容易被水和氧损坏而导致寿命降低的问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种OLED显示器的封装方法，该方法包括以下步骤：通过蒸镀的方式在第一基板的OLED层上形成铜膜层，其中，所述第一基板包括阵列基板和形成在阵列基板上的OLED层；在第二基板的外缘形成框胶；在所述第二基板的所述框胶内的区域形成干燥剂层；在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合，将所述框胶进行固化，以将氢气封存在所述铜膜层和所述第二基板之间，其中，所述真空机台内的气体压强为0.1-10pa。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述 干燥剂层为液态干燥剂，所述干燥剂通过涂布的方式形成在所述第二基板上。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为固态干燥剂，所述固态干燥剂通过贴合的方式形成在所述第二基板上。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层形成有预留空间；将所述第一基板和所述第二基板压合后，所述氢气填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种OLED显示器的封装方法，该方法包括以下步骤：在第一基板的OLED层上形成铜膜层，其中，所述第一基板包括阵列基板和形成在阵列基板上的OLED层；在第二基板的外缘形成框胶；在所述第二基板的所述框胶内的区域形成干燥剂层；在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合，将所述框胶进行固化，以将氢气封存在所述铜膜层和所述第二基板之间。
其中，在第一基板的OLED层上形成铜膜层的步骤中，所述铜膜层通过蒸镀的方式形成在所述OLED层上。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为液态干燥剂，所述干燥剂通过涂布的方式形成在所述第二基板上。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为固态干燥剂，所述固态干燥剂通过贴合的方式形成在所述第二基板上。
其中，在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合的步骤中，所述真空机台内的气体压强为0.1-10pa。
其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层形成有预留空间；将所述第一基板和所述第二基板压合后，所述氢气 填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
其中，所述干燥剂为液态干燥剂，所述液态干燥剂涂布成多颗分散的水滴状，或者栅栏状，或者网格状，或者螺旋状。
其中，所述干燥剂其固态干燥剂，所述固态干燥剂呈片状，所述固态干燥剂上形成有多个孔隙以作为预留空间；或者，所述固态干燥剂有多片，每片所述固态干燥剂之间保留间隙以作为预留空间。
其中，所述胶框为UV固化胶框。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种OLED显示器，该OLED显示器包括第一基板、铜膜层、干燥剂层和第二基板；第一基板包括阵列基板和OLED层，所述OLED层设置在所述阵列基板上；铜膜层形成在所述OLED层上；干燥剂层设置在所述铜膜层上；第二基板设置在所述干燥剂层上，所述第二基板和所述第一基板的外缘通过框胶进行密封连接；在所述铜膜层和所述第二基板之间填充有氢气。
其中，所述干燥剂层为液态干燥剂或者固态干燥剂。
其中，所述干燥剂层设有预留空间，所述氢气填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
其中，所述干燥剂为液态干燥剂，所述液态干燥剂涂布成多颗分散的水滴状，或者栅栏状，或者网格状，或者螺旋状。
其中，所述干燥剂其固态干燥剂，所述固态干燥剂呈片状，所述固态干燥剂上形成有多个孔隙以作为预留空间；或者，所述固态干燥剂有多片，每片所述固态干燥剂之间保留间隙以作为预留空间。
其中，所述干燥剂层的干燥剂均匀分布，所述预留空间均匀分布在所述干燥剂层中。
其中，所述胶框为UV固化胶框。
本发明的有益效果是：区别于现有技术的情况，本发明通过在第一基板OLED层上形成铜膜层，并在第二基板上形成干燥剂层，并在充有氢气的真空机 台内将铜膜层和干燥基层相对设置后将第一基板和第二基板进行压合，从而将氢气封存在铜膜层和第二基板之间，当有O2浸入到OLED显示器内部时，铜膜层的Cu会和O2发生反应生成CuO，从而将O2除去，当OLED显示器点亮发热时，CuO被H2还原成Cu，同时生成的H2O被干燥剂吸收，从而能阻止水和氧对OLED层的损坏，因而能大大提高OLED显示器的封装效果，有效延长了OLED显示器的使用寿命。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明第一实施例提供的一种OLED显示器的封装方法的流程示意图；
图2是本发明第二实施例提供的一种OLED显示器的封装方法的流程示意图；
图3是本发明第二实施例中步骤S201后的结构示意图；
图4是本发明第二实施例中步骤S202后的结构示意图；
图5是本发明第二实施例中步骤S203后的结构示意图；
图6是本发明第二实施例最终形成的OLED显示器的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明第一实施例提供的一种OLED显示器的封装方法的流程示意图。
本实施例的OLED显示器的封装方法包括步骤：
S101、在第一基板的OLED层上形成铜膜层，其中，第一基板包括阵列基板和形成在阵列基板上的OLED层。
具体地，阵列基板为TFT(Thin Film Transistor，薄膜晶体管)阵列基板，OLED层具体包括正极子层、空穴传输子层、发光子层、电子传输子层以及金属阴极子层，其中，正极子层与电源正极电连接，金属阴极子层与电源负极电连接。当电源供应至适当电压时，正极子层的空穴与阴极子层的电荷就会在发光子层中结合，产生光亮，依发光子层的成份不同产生红、绿以及蓝(RGB)三原色，构成基本色彩，以使得OLED层发出可见光。其中，金属阴极子层由较为活泼的金属形成，例如Ca/Al或Mg/Ag等。铜膜层形成在金属阴极子层上。
S102、在第二基板的外缘形成框胶。
具体地，该第二基板作为封装基板以对第一基板进行封装。框胶可以是UV固化胶。UV固化胶粘剂具有固化快、耗能少、无溶剂污染等优点，其固化原理是：固化胶中的光引发剂在适当波长和光强的紫外光照射下，迅速分解成自由基或阳离子，进而引发不饱和键聚合，使材料固化。
S103、在第二基板的框胶内的区域形成干燥剂层。
S104、在充有氢气的真空机台内，将第一基板形成有铜膜层的一侧和第二基板形成有干燥剂层的一侧相对设置，并将第一基板和第二基板进行压合，并对框胶进行固化，以将氢气封存在铜膜层和第二基板之间。
具体地，当有O2浸入到OLED显示器内部时，铜膜层的Cu会和O2发生反应生成CuO，从而将O2除去，当OLED显示器点亮发热时，CuO被氢气还原呈Cu，同时生成H2O，而由于铜膜层和干燥剂层相对设置，因而生成的H2O可以被干燥剂层的干燥剂吸收，从而能阻止水和氧对OLED层的损坏，并能使得铜膜层的Cu可以重复使用，延长了OLED显示器的使用寿命。
相关的化学反应方程式如下：
Figure PCTCN2017070623-appb-000001
区别于现有技术，本发明通过在第一基板OLED层上形成铜膜层，并在第二基板上形成干燥剂层，并在充有氢气的真空机台内将铜膜层和干燥基层相对设置后将第一基板和第二基板进行压合，从而将氢气封存在第一基板和第二基板之间，当有O2浸入到OLED显示器内部时，铜膜层的Cu会和O2发生反应生成CuO，从而将O2除去，当OLED显示器点亮发热时，CuO被H2还原成Cu，同时生成的H2O被干燥剂吸收，从而能阻止水和氧对OLED层的损坏，因而能大大提高OLED显示器的封装效果，有效延长了OLED显示器的使用寿命。
请参阅图2，图2是本发明第二实施例提供的一种OLED显示器的封装方法的流程示意图。
本实施例提供的OLED显示器的封装方法包括步骤：
S201、在第一基板的OLED层上通过蒸镀的方式形成铜膜层，其中，第一基板包括阵列基板和形成在阵列基板上的OLED层。
如图3所示，图3是本发明第二实施例中步骤S201后的结构示意图。其中，第一基板10包括阵列基板11和形成在阵列基板11上的OLED层12。铜膜层20通过蒸镀的方式完全覆盖在OLED层12上。
铜通过真空蒸发镀膜法覆盖在OLED层12上形成铜膜层20，具体地，真空蒸发镀膜法为在真空环境中，将材料加热并镀到基片上成为真空蒸镀，其是将待成膜的物质置于真空中进行蒸发或生化，使之在工件或基片表面析出的过程。该方法具有操作简单、制成的膜纯度高、质量好、厚度可准确控制、成膜速率快、效率高、薄膜生长激励比较单纯等优点。
S202、在第二基板的外缘形成UV框胶。
如图4所示，图4是本发明第二实施例中步骤S202后的结构示意图。其中，UV框胶40形成在第二基板30的外缘，以用于后序将第二基板30与第一基板10之间进行连接密封。
S203、在第二基板的框胶内的区域涂布液体干燥剂以形成干燥剂层，且在干燥剂层形成用于填充氢气的预留空间。
具体地，请参阅图5，图5是本发明第二实施例中步骤S203后的结构示意图。本实施例中的干燥剂层50形成有预留空间52，即，干燥剂51并不是完全覆盖第二基板30的框胶40内的区域，而只是覆盖了一部分区域，其余的区域则为预留空间52，以将氢气填充在预留空间52内。
举例而言，本实施例的干燥剂51为液体干燥剂，液体干燥剂可以呈类似球体的水滴状，多颗水滴状的干燥剂均匀分布在第二基板上框胶内的区域，相邻的水滴状干燥剂之间的间隔则为预留空间52。
在其它实施例中，液体干燥剂还可以涂布成栅栏状，或者网格状，或者螺旋状等，只要在干燥剂层上形成预留空间即可。
可以理解的是，在其它一些实施例中，还可以是固态干燥剂形成具有预留空间52的干燥剂层50，固态干燥剂可以是片状，片状的固态干燥剂上形成有多个孔隙，该孔隙则作为预留空间52，片状的固态干燥剂通过贴合的方式形成在第二基板30上。此外，干燥剂层50也可以由多片固态干燥剂形成，贴合时，每片固态干燥剂之间保留间隙，该间隙则作为预留空间52。
在其它一些实施例中，还可以在干燥剂层50和铜膜层20之间形成间隙，用以填充氢气。
S204、在充有氢气的、气体压强为0.1-10pa的真空机台内，将第一基板形成有铜膜层的一侧和第二基板形成有干燥剂层的一侧相对设置，并将第一基板和第二基板进行压合至铜膜层和干燥剂层接触，将UV框胶进行固化，以将氢气封存在铜膜层和第二基板之间的预留空间内。
具体地，真空机台为VAS机台，机台内的气体压强为0.1-10pa，具体可以是0.1-4pa，例如0.1pa，2pa，3.5pa等，还可以是4pa-10pa，例如4pa，6pa，6.7pa，9pa或者10pa等，该机台内的气体压强可以在0.1-10pa的范围内变动，具体压强值可以根据实际需求和实际机台能达到的范围而定。UV框胶40的固 化则通过照射UV光实现。
如图6所示，图6是本发明第二实施例最终形成的OLED显示器的结构示意图。本实施例的第一基板10上的铜膜层20和第二基板30上的干燥剂层50相对设置，且干燥剂层50与铜膜层20接触，从而确保预留空间52内的氢气60与铜膜层20接触，使得氢气60能直接与形成的铜膜层20上形成的CuO接触，从而使得在OLED显示器点亮发热时，氢气60将CuO还原为Cu，使铜膜层能重复与浸入的O2发生反应。同时还确保干燥剂51与铜膜层20接触，使得H2将CuO还原为Cu时生产的H2O直接被干燥剂51吸收。从而防止H2O和O2对OLED层造成损坏。
本发明还提供了一种OLED显示器，具体地，请继续参阅图6，该OLED显示器包括第一基板10、铜膜层20、干燥剂层50以及第二基板30，其中，铜膜层20形成在第一基板10之上，干燥剂层50设置于铜膜层20上，第二基板30设置在干燥剂层50上，第二基板30和第一基板10的外缘通过框胶40进行密封连接。并且，在铜膜层20和第二基板30之间填充有氢气60。
具体地，第一基板10包括阵列基板11和OLED层12，OLED层12设置在阵列基板11上。铜膜层20形成在OLED层12上，具体地，该铜膜层20覆盖在OLED层12的金属阴极子层上。
干燥剂层50设置在铜膜层20上，其中，干燥剂51可以是液态干燥剂也可以是固态干燥剂。
具体地，本实施例的干燥剂层50上形成有用于填充氢气的预留空间52，干燥剂51均匀分布，预留空间52也均匀分布，干燥剂层50与铜膜层20接触。
举例而言，在一些实施例中，干燥剂51为液态干燥剂，该液体干燥剂可以呈类似球体的水滴状，多颗水滴状的干燥剂均匀分布在第二基板上框胶内的区域，相邻的水滴状干燥剂之间的间隔则为预留空间。
在其它实施例中，液体干燥剂还可以涂布成栅栏状，或者网格状，或者螺旋状等。
可以理解的是，在其它一些实施例中，还可以由固态干燥剂形成具有预留空间52的干燥剂层50，固态干燥剂可以是片状，片状的固态干燥剂上形成有多个孔隙，该孔隙则作为预留空间52，片状的固态干燥剂通过贴合的方式形成在第二基板30上。此外，干燥剂层50也可以由多片固态干燥剂形成，贴合时，每片固态干燥剂之间保留间隙，该间隙则作为预留空间52。
本实施例的且干燥剂层50与铜膜层20接触，从而确保预留空间52内的氢气60与铜膜层20接触，使得H260能直接与形成的铜膜层20上形成的CuO接触，从而使得在OLED显示器点亮发热时，氢气60将CuO还原为Cu，而能重复与浸入的O2发生反应。同时还确保干燥剂与铜膜层20接触，使得氢气60将CuO还原为Cu时生产的H2O直接被干燥剂吸收。从而防止H2O和O2对OLED层造成损坏。
综上所述，本发明能有效提高封装效果，延长OLED显示器的使用寿命。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种OLED显示器的封装方法，其中，包括以下步骤：
    通过蒸镀的方式在第一基板的OLED层上形成铜膜层，其中，所述第一基板包括阵列基板和形成在阵列基板上的OLED层；
    在第二基板的外缘形成框胶；
    在所述第二基板的所述框胶内的区域形成干燥剂层；
    在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合，将所述框胶进行固化，以将氢气封存在所述铜膜层和所述第二基板之间，其中，所述真空机台内的气体压强为0.1-10pa。
  2. 根据权利要求1所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为液态干燥剂，所述干燥剂通过涂布的方式形成在所述第二基板上。
  3. 根据权利要求1所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为固态干燥剂，所述固态干燥剂通过贴合的方式形成在所述第二基板上。
  4. 根据权利要求1所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层形成有预留空间；
    将所述第一基板和所述第二基板压合后，所述氢气填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
  5. 一种OLED显示器的封装方法，其中，包括以下步骤：
    在第一基板的OLED层上形成铜膜层，其中，所述第一基板包括阵列基板和形成在阵列基板上的OLED层；
    在第二基板的外缘形成框胶；
    在所述第二基板的所述框胶内的区域形成干燥剂层；
    在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合，将所述框胶进行固化，以将氢气封存在所述铜膜层和所述第二基板之间。
  6. 根据权利要求5所述的OLED显示器的封装方法，其中，在第一基板的OLED层上形成铜膜层的步骤中，所述铜膜层通过蒸镀的方式形成在所述OLED层上。
  7. 根据权利要求5所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为液态干燥剂，所述干燥剂通过涂布的方式形成在所述第二基板上。
  8. 根据权利要求5所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层为固态干燥剂，所述固态干燥剂通过贴合的方式形成在所述第二基板上。
  9. 根据权利要求5所述的OLED显示器的封装方法，其中，在充有氢气的真空机台内，将所述第一基板形成有铜膜层的一侧和所述第二基板形成有干燥剂层的一侧相对设置，并将所述第一基板和所述第二基板进行压合的步骤中，所述真空机台内的气体压强为0.1-10pa。
  10. 根据权利要求5所述的OLED显示器的封装方法，其中，在所述第二基板的所述框胶内的区域形成干燥剂层的步骤中，所述干燥剂层形成有预留空间；
    将所述第一基板和所述第二基板压合后，所述氢气填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
  11. 根据权利要求10所述的OLED显示器的封装方法，其中，所述干燥剂为液态干燥剂，所述液态干燥剂涂布成多颗分散的水滴状，或者栅栏状，或者网格状，或者螺旋状。
  12. 根据权利要求10所述的OLED显示器的封装方法，其中，所述干燥剂其固态干燥剂，所述固态干燥剂呈片状，所述固态干燥剂上形成有多个孔隙以作 为预留空间；或者，
    所述固态干燥剂有多片，每片所述固态干燥剂之间保留间隙以作为预留空间。
  13. 根据权利要求5所述的OLED显示器的封装方法，其中，所述胶框为UV固化胶框。
  14. 一种OLED显示器，其中，包括：
    第一基板，包括阵列基板和OLED层，所述OLED层设置在所述阵列基板上；
    铜膜层，形成在所述OLED层上；
    干燥剂层，设置在所述铜膜层上；
    第二基板，设置在所述干燥剂层上，所述第二基板和所述第一基板的外缘通过框胶进行密封连接；
    在所述铜膜层和所述第二基板之间填充有氢气。
  15. 根据权利要求14所述的OLED显示器，其中，所述干燥剂层为液态干燥剂或者固态干燥剂。
  16. 根据权利要求14所述的OLED显示器，其中，所述干燥剂层设有预留空间，所述氢气填充在所述预留空间内；所述干燥剂层与所述铜膜层接触。
  17. 根据权利要求16所述的OLED显示器，其中，所述干燥剂为液态干燥剂，所述液态干燥剂涂布成多颗分散的水滴状，或者栅栏状，或者网格状，或者螺旋状。
  18. 根据权利要求16所述的OLED显示器，其中，所述干燥剂其固态干燥剂，所述固态干燥剂呈片状，所述固态干燥剂上形成有多个孔隙以作为预留空间；或者，
    所述固态干燥剂有多片，每片所述固态干燥剂之间保留间隙以作为预留空间。
  19. 根据权利要求16所述的OLED显示器，其中，所述干燥剂层的干燥剂均 匀分布，所述预留空间均匀分布在所述干燥剂层中。
  20. 根据权利要求14所述的OLED显示器，其中，所述胶框为UV固化胶框。
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