WO2018099170A1 - 静电屏蔽装置 - Google Patents
静电屏蔽装置 Download PDFInfo
- Publication number
- WO2018099170A1 WO2018099170A1 PCT/CN2017/103462 CN2017103462W WO2018099170A1 WO 2018099170 A1 WO2018099170 A1 WO 2018099170A1 CN 2017103462 W CN2017103462 W CN 2017103462W WO 2018099170 A1 WO2018099170 A1 WO 2018099170A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shielding cover
- conductive layer
- shielding
- cover
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to electronic equipment accessories, and more particularly to an electrostatic shielding device.
- the upper and lower covers are generally used to form a shielding cover to cover the circuit board. Due to the space limitation in the electronic product, the circuit board is closer to the inner wall of the shielding cover, especially when the circuit board size is small, the shielding cover is The size is also reduced, the board is too close to the inner wall of the shield, and static electricity can enter the insulating cover from the connection of the upper and lower covers.
- the present invention overcomes the deficiencies of the prior art and provides an electrostatic shielding device with good shielding effect.
- An electrostatic shielding device includes a first shielding cover and a second shielding cover, wherein the first shielding cover and the second shielding cover cooperate to form a receiving cavity, and the receiving cavity is provided with a circuit board, the first shielding
- the cover is provided with a connecting portion that is mated with the second shielding cover, the connecting portion is covered with a first conductive layer, and the first conductive layer is connected to a grounding point of the circuit board.
- the inner wall of the first shielding cover is provided with ribs, the ribs abut the grounding points of the circuit board, and the surface of the ribs is provided with a second conductive layer.
- the first conductive layer is connected to the second conductive layer.
- the rib is extended from an edge of the inner wall of the first shielding cover toward a middle portion of the first shielding cover, and the first conductive layer is along an inner wall of the first shielding cover.
- the middle portion of the first shielding cover extends, and the first conductive layer is connected to the second conductive layer on the side of the rib.
- the connecting portion is provided with a protrusion
- the protrusion is circumferentially disposed along the first shielding cover
- the second shielding cover is disposed at a position corresponding to the protruding portion.
- the protrusion is disposed at an edge of the inner wall of the first shielding cover, and the protrusion is connected to an end of the rib adjacent to an edge of the first shielding cover.
- the first conductive layer is disposed on a surface of the protrusion, and the first conductive layer on the protrusion is connected to the second conductive layer on the rib.
- a fixing post is disposed on an inner wall of the first shielding cover or the second shielding cover, and the fixing post is provided with a fixing hole, and the circuit board is corresponding to the fixing hole a matching hole is disposed at a position, and a fastener passes through the matching hole, and the circuit board and the fixing post are coupled with the thread of the fixing hole through the fastener, and the circuit board is located away from the a junction of the first shielding cover and the second shielding cover.
- first shielding cover and the second shielding cover are both plastic covers, and the first shielding cover and the second shielding cover are both circular covers.
- a third conductive layer is disposed on the second shielding cover at a corresponding position of the first conductive layer.
- the first conductive layer, the second conductive layer, and the third conductive layer are both metal coatings.
- the electrostatic shielding device uses a first shielding cover and a second shielding cover to enclose a receiving cavity, and the circuit board is mounted in the receiving cavity.
- the first shielding cover cooperates with the second shielding cover to function as an electrostatic shielding, and at the same time in the first shielding.
- the cover is provided with a connecting portion with the second shielding cover, the connecting portion is covered with the first conductive layer, and the first conductive layer is connected with the grounding position of the circuit board, and when the static electricity enters the first shielding cover and the second shielding cover is connected
- the gap is in the middle, the static electricity is attracted by the first conductive layer, and a current is formed on the first conductive layer to flow into the grounding position of the circuit board, thereby preventing static electricity from entering the receiving cavity, and preventing the static electricity from contacting the important circuit on the circuit board, thereby causing the circuit board to fail.
- the electrostatic shielding device is connected to the grounding position of the circuit board by the first conductive layer, so that the static electricity is attracted by the first conductive layer to form a current flowing into the grounding position of the circuit board, and shielding The effect is better.
- FIG. 1 is a schematic cross-sectional view of an electrostatic shielding device
- FIG. 2 is a schematic structural view of a first shielding cover
- FIG. 3 is a schematic structural view of a second shielding cover.
- first shielding cover 110
- connecting portion 120
- first conductive layer 130
- a rib 140
- second conductive layer 150
- protrusion 200
- second shielding cover 210
- recess 220
- Fixed column 300, housing cavity, 400, circuit board.
- the electrostatic shielding device includes a first shielding cover 100 and a second shielding cover 200.
- the first shielding cover 100 and the second shielding cover 200 cooperate to form a receiving cavity 300.
- the receiving cavity 300 is provided with a circuit board. 400.
- the first shielding cover 100 is provided with a connecting portion 110 that is mated with the second shielding cover 200.
- the connecting portion 110 is covered with the first conductive layer 120, and the first conductive layer 120 is connected to the grounding position of the circuit board 400.
- the first shielding cover 100 and the second shielding cover 200 cooperate to function as an electrostatic shield, and the first conductive layer 120 is disposed on the connecting portion of the first shielding cover 100 and the second shielding cover 200, and the first conductive layer 120 and The grounding position of the circuit board 400 is connected.
- the static electricity enters the gap between the first shielding cover 100 and the second shielding cover 200, the static electricity is attracted by the first conductive layer 120, and a current flowing into the circuit is formed on the first conductive layer 120.
- the grounding position of the board 400 prevents static electricity from entering the accommodating cavity 300 and contacting the important circuit on the circuit board 400, thereby causing the circuit board 400 to fail.
- the mating connection of the first shielding cover 100 and the second shielding cover 200 is convenient for the circuit board. Repair and replacement, while low cost.
- the inner wall of the first shielding cover 100 is provided with a rib 130, and the ribs 130 and the grounding position of the circuit board 400 abut each other, and the surface of the rib 130 is provided with a second conductive layer 140, the first conductive Layer 120 is coupled to second conductive layer 140.
- the first conductive Layer 120 is coupled to second conductive layer 140.
- the grounding position of the circuit board 400 and the second conductive layer 140 on the rib 130 serve as a draining function to ensure that current flows into the grounding position of the circuit board 400.
- the rib 130 extends from the edge of the inner wall of the first shielding cover 100 toward the middle of the first shielding cover 100 , and the first conductive layer 120 faces the middle of the first shielding cover 100 along the inner wall of the first shielding cover 100 .
- the first conductive layer 120 is connected to the second conductive layer 140 on the side of the rib 130. Since the first conductive layer 120 extends toward the middle of the first shielding cover 100, if the static electricity enters the receiving cavity 300 through the gap between the first shielding cover 100 and the second shielding cover 200, the extended portion of the first conductive layer 120 may be opposite.
- the static electricity is attracted to enhance the electrostatic shielding effect of the electrostatic shielding device, and the portion of the first conductive layer 120 extending is connected to the second conductive layer 140 on the side of the rib 130 to ensure that the current in the first conductive layer 120 can smoothly flow into the second Conductive layer 140.
- the connecting portion 110 is provided with a protruding portion 150.
- the protruding portion 150 is circumferentially disposed along the first shielding cover 100, and the second shielding cover 200 is provided with a recess at a position corresponding to the protruding portion 150.
- the first shield cover 100 and the second shield cover 200 are coupled to the recessed portion 210 by the protrusion 150.
- the protrusion 150 is disposed at the edge of the inner wall of the first shield cover 100, and the protrusion 150 is adjacent to the rib 130. One end of the edge of the shielding cover 100 is connected, and the first conductive layer 120 is disposed on the surface of the protrusion 150.
- the first conductive layer 120 on the protrusion 150 is connected to the second conductive layer 140 on the rib 130.
- the protrusions 150 can prevent static electricity from entering the accommodating cavity, and the cooperation of the protrusions 150 and the recesses 210 makes the shape of the gap between the first shielding cover 100 and the second shielding cover 200 relatively curved, thereby increasing the static electricity entering the accommodating cavity 300 through the gap.
- the difficulty of the shielding effect of the electrostatic shielding device is enhanced.
- the protruding portion 150 is disposed at the edge of the inner wall of the first shielding cover 100, and the protruding portion 150 is connected to the rib 130, and the first conductive layer is disposed on the surface of the protruding portion 150. 120.
- the second conductive layer 140 on the rib 130 is directly connected to the first conductive layer 120, and the current formed by the first conductive layer 120 after being attracted to the static electricity can be quickly introduced into the second conductive layer 140.
- the longitudinal section of the protrusion 150 is square, but the cross section of the protrusion 150 may also be a triangle or a trapezoid or the like, and the protrusion 150 may also be disposed on the first shielding cover 100 and the second shielding cover 200. Match any area of the connection.
- the inner wall of the first shielding cover 100 or the second shielding cover 200 is provided with a fixing post 220.
- the fixing post 220 is provided with a fixing hole
- the circuit board 400 is provided with a matching hole at a corresponding position with the fixing hole.
- the fastener passes through the mating hole, and the circuit board 400 and the fixing post 220 are coupled to the screw of the fixing hole by a fastener, and the circuit board 400 is located away from the joint of the first shielding cover 100 and the second shielding cover 200.
- the fixing post 220 can fix the circuit board 400.
- the circuit board 400 When fixing the circuit board 400, the circuit board 400 should be ensured to be away from the connection between the first shielding cover 100 and the second shielding cover 200 to prevent static electricity from being blocked by the first shielding cover 100. After the gap connecting the second shield cover 200 enters the accommodating cavity 300, direct contact with an important circuit on the circuit board 400 causes the circuit board 400 to fail.
- the circuit board 400 is fixed by the connection of the fixing post 220 and the circuit board 400.
- the fixing post 220 is disposed on the inner wall of the second shielding cover 200. According to the specific structure of the circuit board 400, a plurality of fixing columns can be disposed. 220, the fixing post 220 may also be disposed on the inner wall of the first shielding cover 100.
- the circuit board 400 can be fixed by using the connection between the grounding position of the circuit board 400 and the rib 130, for example, the grounding position of the conductive rib board 130 and the circuit board 400, or the grounding position of the circuit board 400, and the ribs. A hole is provided in the plate 130 at a position corresponding to the grounding position, and the circuit board 400 is fixed to the rib 130 by the cooperation of the screw and the hole.
- the first shielding cover 100 and the second shielding cover 200 are both plastic covers, and the first shielding cover 100 and the second shielding cover 200 are both circular.
- the first shielding cover 100 and the second shielding cover 200 are both plastic covers.
- the plastic cover has good insulation effect, can isolate external current and prevent short circuit of the circuit board, and the plastic is easy to form, and the cost is low, but the first The shielding cover 100 and the second shielding cover 200 may also be other insulating materials.
- first shielding cover 100 and the second shielding cover 200 are both circular covers, but according to the shape of the circuit board 400, the first shielding cover 100 and the second shielding cover 200 may have other shapes, such as a square shape. Cover and so on.
- a third conductive layer is disposed on the second shielding cover 200 at a corresponding position with the first conductive layer 120.
- a third conductive layer may be disposed on the second shielding cover 200 at a position corresponding to the first conductive layer 120.
- the first conductive layer 120, the second conductive layer 140 and the third conductive layer are both metal coatings.
- the first conductive layer 120, the second conductive layer 140, and the third conductive layer are all metal coatings, and the metal coatings are of the same type, and the processing is: first spraying a coating containing metal ions Then, the above coating is scanned by a laser, and the metal ion-containing coating releases the metal atom under the induction of the laser, and finally immersed in a solution containing the same metal ion, and the metal ion is deposited by using the metal atom as a core, and finally forms a conductive. Metal coating.
- the first conductive layer 120, the second conductive layer 140 and the third conductive layer are both metal coatings, but materials capable of attracting static electricity and converting them into internal currents of the conductive layer can be used for the above-mentioned A conductive layer 120, a second conductive layer 140 and a third conductive layer.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
本发明公开一种静电屏蔽装置，包括第一屏蔽盖与第二屏蔽盖，所述第一屏蔽盖与所述第二屏蔽盖配合围成容纳腔，所述容纳腔设置有电路板，所述第一屏蔽盖上设置有与该第二屏蔽盖配合连接的连接部，所述连接部覆盖有第一导电层，所述第一导电层与所述电路板的接地位连接。当有静电进入第一屏蔽盖与第二屏蔽盖连接的间隙中时，静电会被第一导电层吸引，在第一导电层上形成电流，随后流入电路板的接地位，可防止静电进入容纳腔并与电路板上的重要电路接触导致电路板失效，屏蔽效果较好。
Description
本发明涉及电子设备配件，特别是涉及一种静电屏蔽装置。
随着科技不断进步和市场需要，电子产品不断朝着轻薄化，小型化的方向发展，而作为电子产品重要部件之一的电路板的尺寸也在不断减小。为了防止电路板受到静电干扰，一般利用上下盖配合形成屏蔽罩罩住电路板，由于电子产品内的空间限制，电路板距离屏蔽罩的内壁较近，尤其当电路板尺寸较小时，屏蔽罩的尺寸也随之减小，电路板过于靠近屏蔽罩的内壁，静电可从上下盖的连接处进入绝缘罩内。
发明内容
基于此，本发明在于克服现有技术的不足，提供一种屏蔽效果好的静电屏蔽装置。
其技术方案如下：
一种静电屏蔽装置，包括第一屏蔽盖与第二屏蔽盖，所述第一屏蔽盖与所述第二屏蔽盖配合围成容纳腔，所述容纳腔设置有电路板，所述第一屏蔽盖上设置有与所述第二屏蔽盖配合连接的连接部，所述连接部覆盖有第一导电层，所述第一导电层与所述电路板的接地位连接。
下面对一种技术方案进行进一步说明：
在其中一个实施例中，所述第一屏蔽盖的内壁设有筋板，所述筋板与所述电路板的接地位相互抵接，所述筋板的表面设有第二导电层，所述第一导电层与所述第二导电层连接。
在其中一个实施例中，所述筋板由所述第一屏蔽盖内壁的边缘向所述第一屏蔽盖的中部延伸设置，所述第一导电层沿所述第一屏蔽盖的内壁向所述第一屏蔽盖的中部延伸，所述第一导电层与所述筋板侧面的第二导电层连接。
在其中一个实施例中，所述连接部上设有突起部，所述突起部沿所述第一屏蔽盖周向设置，所述第二屏蔽盖在与所述突起部部对应的位置处设有凹陷部，所述第一屏蔽盖与所述第二屏蔽盖通过所述突起部与所述凹陷部的配合连接。
在其中一个实施例中，所述突起部设于所述第一屏蔽盖内壁的边缘处，所述突起部与所述筋板靠近所述第一屏蔽盖边缘的一端连接。
在其中一个实施例中，所述突起部的表面上均设有所述第一导电层，所述突起部上的第一导电层与所述筋板上的第二导电层连接。
在其中一个实施例中，所述第一屏蔽盖或所述第二屏蔽盖的内壁上设有固定柱，所述固定柱上设有固定孔，所述电路板在与所述固定孔的对应位置处设有配合孔，紧固件穿过所述配合孔，所述电路板与所述固定柱通过所述紧固件与所述固定孔的螺纹配合连接，所述电路板位于远离所述第一屏蔽盖与所述第二屏蔽盖的连接处。
在其中一个实施例中，所述第一屏蔽盖与所述第二屏蔽盖均为塑料盖，所述第一屏蔽盖与所述第二屏蔽盖均为圆形盖。
在其中一个实施例中，所述第二屏蔽盖上与所述第一导电层的对应位置处设有第三导电层。
在其中一个实施例中，所述第一导电层、所述第二导电层与所述第三导电层均为金属涂层。
下面对前述技术方案的优点或原理进行说明：
上述静电屏蔽装置利用第一屏蔽盖与第二屏蔽盖围成容纳腔，将电路板安装于容纳腔内，第一屏蔽盖与第二屏蔽盖配合起到静电屏蔽的作用，同时在第一屏蔽盖上设有与第二屏蔽盖配合的连接部，连接部覆盖有第一导电层，第一导电层与电路板的接地位连接，当有静电进入第一屏蔽盖与第二屏蔽盖连接的间隙中时，静电会被第一导电层吸引，在第一导电层上形成电流流入电路板的接地位，可防止静电进入容纳腔，避免静电与电路板上的重要电路接触导致电路板失效，上述静电屏蔽装置由于设置了第一导电层与电路板的接地位连接，使静电被第一导电层吸引形成电流流入电路板的接地位，屏蔽
效果较好。
图1为静电屏蔽装置的剖面示意图；
图2为第一屏蔽盖的结构示意图；
图3为第二屏蔽盖的结构示意图。
附图标记说明：
100、第一屏蔽盖，110、连接部、120、第一导电层，130、筋板，140、第二导电层，150、突起部，200、第二屏蔽盖，210、凹陷部，220、固定柱，300、容纳腔，400、电路板。
下面结合附图对本发明的实施例进行详细说明。
如图1及图2所示，静电屏蔽装置包括第一屏蔽盖100与第二屏蔽盖200，第一屏蔽盖100与第二屏蔽盖200配合围成容纳腔300，容纳腔300设置有电路板400，第一屏蔽盖100上设置有与第二屏蔽盖200配合连接的连接部110，连接部110覆盖有第一导电层120，第一导电层120与电路板400的接地位连接。第一屏蔽盖100与第二屏蔽盖200配合起到静电屏蔽的作用，同时第一屏蔽盖100与第二屏蔽盖200的连接部位上均设有第一导电层120，第一导电层120与电路板400的接地位连接，当有静电进入第一屏蔽盖100与第二屏蔽盖200连接的间隙中时，静电会被第一导电层120吸引，在第一导电层120上形成电流流入电路板400的接地位，可防止静电进入容纳腔300并与电路板400上的重要电路接触导致电路板400失效，此外，第一屏蔽盖100与第二屏蔽盖200的配合连接便于对电路板的维修及更换，同时成本低。
如图2所示，第一屏蔽盖100的内壁设有筋板130，筋板130与电路板400的接地位相互抵接，筋板130的表面均设有第二导电层140，第一导电层120与第二导电层140连接。当静电被第一导电层120吸引并在第一导电层120上形成电流后，电流流入第二导电层140，并通过第二导电层140流入电
路板400的接地位，筋板130上的第二导电层140起到引流的作用，可保证电流流入电路板400的接地位。
如图2所示，筋板130由第一屏蔽盖100内壁的边缘向第一屏蔽盖100的中部延伸设置，第一导电层120沿第一屏蔽盖100的内壁向第一屏蔽盖100的中部延伸，第一导电层120与筋板130侧面的第二导电层140连接。由于第一导电层120向第一屏蔽盖100的中部延伸，若静电通过第一屏蔽盖100与第二屏蔽盖200连接的间隙进入容纳腔300内时，第一导电层120延伸的部分可对静电进行吸引，增强静电屏蔽装置的静电屏蔽效果，同时第一导电层120延伸的部分与筋板130侧面的第二导电层140连接，确保第一导电层120内的电流可顺利的流入第二导电层140。
如图2及图3所示，连接部110上设有突起部150，突起部150沿第一屏蔽盖100周向设置，第二屏蔽盖200在与突起部150部对应的位置处设有凹陷部210，第一屏蔽盖100与第二屏蔽盖200通过突起部150与凹陷部210的配合连接，突起部150设于第一屏蔽盖100内壁的边缘处，突起部150与筋板130靠近第一屏蔽盖100边缘的一端连接，突起部150的表面上均设有第一导电层120，突起部150上的第一导电层120与筋板130上的第二导电层140连接。突起部150可阻止静电进入容纳腔内，同时突起部150与凹陷部210的配合使第一屏蔽盖100与第二屏蔽盖200连接的间隙形状较为曲折，增大了静电通过间隙进入容纳腔300的难度，增强了静电屏蔽装置的屏蔽效果，突起部150设于第一屏蔽盖100内壁的边缘处，同时突起部150与筋板130连接，由于突起部150的表面上设有第一导电层120，此时筋板130上的第二导电层140与第一导电层120直接连接，第一导电层120吸引静电后形成的电流能迅速导入第二导电层140。
在本实施例中，突起部150的纵截面为方形，但突起部150的横截面还可为三角形或梯形等，同时突起部150还可设置在第一屏蔽盖100上与第二屏蔽盖200配合连接的任意区域。
如图3所示，第一屏蔽盖100或第二屏蔽盖200的内壁上设有固定柱220，固定柱220上设有固定孔，电路板400在与固定孔的对应位置处设有配合孔，
紧固件穿过配合孔，电路板400与固定柱220通过紧固件与固定孔的螺纹配合连接，电路板400位于远离第一屏蔽盖100与第二屏蔽盖200的连接处。固定柱220可对电路板400进行固定，同时对电路板400进行固定时，应确保电路板400远离第一屏蔽盖100与第二屏蔽盖200的连接处，防止静电由第一屏蔽盖100与第二屏蔽盖200连接的间隙进入容纳腔300后，直接与电路板400上的重要电路接触导致电路板400失效。
在本实施例中，利用固定柱220与电路板400的连接对电路板400进行固定，固定柱220设于第二屏蔽盖200内壁上，根据电路板400的具体结构，可设置多个固定柱220，固定柱220还可设置在第一屏蔽盖100的内壁上。此外还可利用电路板400的接地位与筋板130的连接处对电路板400进行固定，例如利用导电胶黏合筋板130与电路板400的接地位，或在电路板400的接地位、筋板130上与接地位对应的位置处设置孔，通过螺钉与上述孔的配合，使电路板400固定于筋板130上。
如图1及图2所示，第一屏蔽盖100与第二屏蔽盖200均为塑料盖，第一屏蔽盖100与第二屏蔽盖200均为圆形。
在本实施例中，第一屏蔽盖100与第二屏蔽盖200均为塑料盖，塑料盖的绝缘效果好，可隔绝外部电流并防止电路板短路，同时塑料易成型，成本低，但第一屏蔽盖100与第二屏蔽盖200还可为其他绝缘材料。
在本实施例中，第一屏蔽盖100与第二屏蔽盖200均为圆形盖，但根据电路板400的形状，第一屏蔽盖100与第二屏蔽盖200还可为其他形状，例如方形盖等。
第二屏蔽盖200上与第一导电层120的对应位置处设有第三导电层。为保证静电不会由第一屏蔽盖100与第二屏蔽盖200连接处的间隙进入容纳腔300，还可在第二屏蔽盖200上与第一导电层120对应的位置处设置第三导电层，当第一屏蔽盖100与第二屏蔽盖200配合连接时，第三导电层与第一导电层120接触，第三导电层也可吸引静电并传导至第一导电层，增加静电屏蔽装置的静电屏蔽效果。
第一导电层120、第二导电层140与第三导电层均为金属涂层。在本实施
例中，第一导电层120、第二导电层140及第三导电层均为金属涂层，且上述金属涂层属于同种类型，其加工过程为：首先喷涂一种含有金属离子的涂层，然后通过激光扫描上述涂层，含有金属离子的涂层在激光的诱导下释放金属原子，最后将其浸入含有同种金属离子的溶液中，金属离子以金属原子为核进行沉积，最后形成导电的金属涂层。
在本实施例中，第一导电层120、第二导电层140与第三导电层均为金属涂层，但可以实现吸引静电并使其转化为导电层内部电流的材料，均可用于上述第一导电层120、第二导电层140与第三导电层。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。
Claims (10)
- 一种静电屏蔽装置，其特征在于，包括第一屏蔽盖与第二屏蔽盖，所述第一屏蔽盖与所述第二屏蔽盖配合围成容纳腔，所述容纳腔设置有电路板，所述第一屏蔽盖上设置有与所述第二屏蔽盖配合连接的连接部，所述连接部覆盖有第一导电层，所述第一导电层与所述电路板的接地位连接。
- 根据权利要求1所述的静电屏蔽装置，其特征在于，所述第一屏蔽盖的内壁设有筋板，所述筋板与所述电路板的接地位相互抵接，所述筋板的表面设有第二导电层，所述第一导电层与所述第二导电层连接。
- 根据权利要求2所述的静电屏蔽装置，其特征在于，所述筋板由所述第一屏蔽盖内壁的边缘向所述第一屏蔽盖的中部延伸设置，所述第一导电层沿所述第一屏蔽盖的内壁向所述第一屏蔽盖的中部延伸，所述第一导电层与所述筋板侧面的第二导电层连接。
- 根据权利要求3所述的静电屏蔽装置，其特征在于，所述连接部上设有突起部，所述突起部沿所述第一屏蔽盖周向设置，所述第二屏蔽盖在与所述突起部对应的位置处设有凹陷部，所述第一屏蔽盖与所述第二屏蔽盖通过所述突起部与所述凹陷部的配合连接。
- 根据权利要求4所述的静电屏蔽装置，其特征在于，所述突起部设于所述第一屏蔽盖内壁的边缘处，所述突起部与所述筋板靠近所述第一屏蔽盖边缘的一端连接。
- 根据权利要求5所述的静电屏蔽装置，其特征在于，所述突起部的表面上均设有所述第一导电层，所述突起部上的第一导电层与所述筋板上的第二导电层连接。
- 根据权利要求1-6任一项所述的静电屏蔽装置，其特征在于，所述第一屏蔽盖或所述第二屏蔽盖的内壁上设有固定柱，所述固定柱上设有固定孔，所述电路板在与所述固定孔的对应位置处设有配合孔，紧固件穿过所述配合孔，所述电路板与所述固定柱通过所述紧固件与所述固定孔的螺纹配合连接，所述电路板位于远离所述第一屏蔽盖与所述第二屏蔽盖的连接处。
- 根据权利要求1-6任一项所述的静电屏蔽装置，其特征在于，所述第 一屏蔽盖与所述第二屏蔽盖均为塑料盖，所述第一屏蔽盖与所述第二屏蔽盖均为圆形盖。
- 根据权利要求1-6任一项所述的静电屏蔽装置，其特征在于，所述第二屏蔽盖上与所述第一导电层的对应位置处设有第三导电层。
- 根据权利要求9所述的静电屏蔽装置，其特征在于，所述第一导电层、所述第二导电层与所述第三导电层均为金属涂层。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621307191.7 | 2016-11-30 | ||
| CN201621307191.7U CN206251571U (zh) | 2016-11-30 | 2016-11-30 | 静电屏蔽装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018099170A1 true WO2018099170A1 (zh) | 2018-06-07 |
Family
ID=59004937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/103462 Ceased WO2018099170A1 (zh) | 2016-11-30 | 2017-09-26 | 静电屏蔽装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206251571U (zh) |
| WO (1) | WO2018099170A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113853052A (zh) * | 2020-06-26 | 2021-12-28 | 双叶电子工业株式会社 | 电子元件 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206251571U (zh) * | 2016-11-30 | 2017-06-13 | 广州视源电子科技股份有限公司 | 静电屏蔽装置 |
| US11315725B2 (en) | 2018-11-02 | 2022-04-26 | Analog Devices International Unlimited Company | Current sensing coil electrostatic shielding |
| CN112438691A (zh) * | 2019-09-02 | 2021-03-05 | 周星 | 含电磁屏蔽系统的口腔观察仪 |
| CN114078387A (zh) * | 2021-11-10 | 2022-02-22 | 武汉华星光电半导体显示技术有限公司 | 显示模组及其制作方法、移动终端 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1145573A (zh) * | 1995-05-23 | 1997-03-19 | 索尼公司 | 电磁波屏蔽装置 |
| CN1196870A (zh) * | 1995-09-22 | 1998-10-21 | 梅特利通信公司 | 电路板的射频屏蔽盒 |
| CN2414587Y (zh) * | 2000-01-07 | 2001-01-10 | 神达电脑股份有限公司 | 电磁干扰屏蔽装置 |
| US20090067149A1 (en) * | 2007-09-07 | 2009-03-12 | Robert Bogursky | Electronic shielding apparatus and methods |
| CN102196718A (zh) * | 2010-03-17 | 2011-09-21 | 索尼计算机娱乐公司 | 电子装置 |
| CN103648261A (zh) * | 2013-12-18 | 2014-03-19 | 中国电子科技集团公司第四十一研究所 | 一种机箱屏蔽方法 |
| CN206251571U (zh) * | 2016-11-30 | 2017-06-13 | 广州视源电子科技股份有限公司 | 静电屏蔽装置 |
-
2016
- 2016-11-30 CN CN201621307191.7U patent/CN206251571U/zh active Active
-
2017
- 2017-09-26 WO PCT/CN2017/103462 patent/WO2018099170A1/zh not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1145573A (zh) * | 1995-05-23 | 1997-03-19 | 索尼公司 | 电磁波屏蔽装置 |
| CN1196870A (zh) * | 1995-09-22 | 1998-10-21 | 梅特利通信公司 | 电路板的射频屏蔽盒 |
| CN2414587Y (zh) * | 2000-01-07 | 2001-01-10 | 神达电脑股份有限公司 | 电磁干扰屏蔽装置 |
| US20090067149A1 (en) * | 2007-09-07 | 2009-03-12 | Robert Bogursky | Electronic shielding apparatus and methods |
| CN102196718A (zh) * | 2010-03-17 | 2011-09-21 | 索尼计算机娱乐公司 | 电子装置 |
| CN103648261A (zh) * | 2013-12-18 | 2014-03-19 | 中国电子科技集团公司第四十一研究所 | 一种机箱屏蔽方法 |
| CN206251571U (zh) * | 2016-11-30 | 2017-06-13 | 广州视源电子科技股份有限公司 | 静电屏蔽装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113853052A (zh) * | 2020-06-26 | 2021-12-28 | 双叶电子工业株式会社 | 电子元件 |
| CN113853052B (zh) * | 2020-06-26 | 2025-12-05 | 双叶电子工业株式会社 | 电子元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN206251571U (zh) | 2017-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018099170A1 (zh) | 静电屏蔽装置 | |
| JPWO2020169998A5 (zh) | ||
| JP2015233164A5 (zh) | ||
| KR20160001886U (ko) | 박막형 마그네틱 커넥터 모듈 | |
| JP2016015822A5 (zh) | ||
| US20170048963A1 (en) | Noise reduction board and electronic device | |
| US10863617B2 (en) | Printed circuit board and electronic apparatus having the same | |
| US20150171528A1 (en) | Electrical Connector with Upper Conductive Layer | |
| US20190150303A1 (en) | Substrate unit | |
| CN106104016A (zh) | 具备螺母压入部的座体 | |
| BR112018071935A8 (pt) | Aparelho de alta tensão e método de fabricação de tal aparelho | |
| TWI419631B (zh) | 多層電路板以及靜電放電保護結構 | |
| CN109196965B (zh) | 基板单元 | |
| JP6051105B2 (ja) | 電磁波遮蔽容器 | |
| JP6133630B2 (ja) | コンデンサ | |
| RU2013104886A (ru) | Элемент соединителя распределительного устройства и соответствующие узел и распределительное устройство, содержащие такой элемент соединителя | |
| JP2011223752A (ja) | 電気接続箱 | |
| US10178785B2 (en) | Spark preventing element for printed circuit board | |
| CN204335283U (zh) | 一种屏蔽罩及pcb板 | |
| US9313934B2 (en) | Dispensible electrical gasket, electronic module having dispensible electrical gasket, and method of fabricating same | |
| US10978822B2 (en) | Connector | |
| US20200153171A1 (en) | Electrical Connector | |
| CN203225416U (zh) | 同轴电缆连接组件 | |
| JPH0644131Y2 (ja) | 基板用スペーサー | |
| KR20160136097A (ko) | Rf 장비용 전기 커넥터 및 그 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17876245 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 17876245 Country of ref document: EP Kind code of ref document: A1 |