WO2018097488A1

WO2018097488A1 - Method for plating to express champagne gold color

Info

Publication number: WO2018097488A1
Application number: PCT/KR2017/011806
Authority: WO
Inventors: 백우성; 이상문; 변나은; 신형섭
Original assignee: 주식회사 셀코스
Priority date: 2016-11-25
Filing date: 2017-10-25
Publication date: 2018-05-31
Also published as: KR20180059155A

Abstract

The present invention relates to a plating method for plating using a sputter, the method comprising: a plating preparation step of positioning an object to be plated at a plating position in a sputter and a sputtering target made of an alloy material including copper and aluminum in the sputter; and a plating step of plating the object by sputtering in which ions collide with the sputtering target prepared in the plating preparation step to deposit the target on the object. Accordingly, the present invention can plate an object to exhibit a champagne gold color as expressed by the CIE color coordinate L*a*b* expression method regulated by Commission Internationale de I'Eclairage (CIE) wherein a* corresponds to 1 to 5 and b* corresponds to 13 to 19, and thus can enhance the reproducibility of the champagne gold color and restrain the appearance of different colors, etc.

Description

Champagne Gold Color Plating Method

The present invention relates to a plating method for plating an emblem, a decoration, or the like to have a specific color. More specifically, the brightness L * is 78 based on the CIE color coordinate L * a * b * expression method defined by the International Lighting Commission (CIE). The present invention relates to a plating method for plating a champagne gold color represented by a color corresponding to 1 to 5, a * corresponding to 1 to 5, and b * corresponding to 13 to 19.

Decorative products such as emblems and ornaments are often attached to various products such as smartphones, automobiles, and home appliances in order to give an aesthetic luxury. These decorative products are usually formed by injection molding or the like, and are plated to give a metallic luxurious feel.

In order to realize various colors, various plating materials and plating methods are applied. The plating method can be largely divided into wet plating and dry plating. In the case of wet plating, there are various problems compared to dry plating in terms of environmental problems, manufacturing cost and time. Therefore, technical research and development on dry plating using vacuum deposition equipment, such as sputtering equipment, are mainly performed.

In connection with such dry plating, Korean Patent Registration No. 10-0646009 (ABS resin and dry plating method on plastics) and the like disclose a dry plating technology for plastic, which is an injection molded product.

However, the prior art 1 and the like had the following problems.

In order to achieve a specific color, such as champagne gold, two or more metallic sputter targets may be used together with the inert gas and various reaction gases. In the case of dry plating using two or more sputter targets and various gas types, there was a problem in that reproducibility of plating color was inferior.

An object of the present invention is to solve the above-mentioned problems, to provide a champagne gold color plating method that can improve the reproducibility of the plating of a specific color, such as champagne gold using a sputtering equipment.

Champagne gold plating method according to an embodiment of the present invention for achieving the above object is a sputter target (sputter) made of an alloying material containing copper and aluminum, the plating object to be plated is placed in the plating position in the sputter (sputter) a plating preparation step of positioning the target in the sputter; And a plating step of plating the plating object by sputtering by colliding ions on the sputter target prepared in the plating preparation step and depositing on the plating object. The CIE color coordinate L * defined by the International Commission on Illumination (CIE). Based on a * b * expression, a * may be characterized by plating the plating object such that a * corresponds to 1 to 5 and b * represents a champagne gold color represented by a color corresponding to 13 to 19. have.

Here, the brightness L * of the champagne gold color may be another feature that corresponds to between 78 and 95.

Here, in the plating step, it may be another feature to supply an inert gas to the atmosphere gas of the sputtering made at a predetermined degree of vacuum.

Further, the inert gas is argon, the atmosphere gas

It may also be another feature to supply more.

Furthermore, argon supplied as the atmosphere gas and

SCCM (Standard Cubic Centimeter per Minute) ratio may be another feature that corresponds to 1: 0.04 to 1: 0.15.

Here, the sputter target is an alloy material consisting of copper and aluminum, the weight ratio (wt%) of copper and aluminum may be another feature that corresponds to between 80:20 to 90:10.

Here, the protective layer forming step of forming a protective layer on the upper side of the plating layer formed by plating the plating object in the plating step; It may also be another feature to include a further.

Further, the protective layer

It may also be another feature to be.

Furthermore, an anti-fingerprint layer forming step of forming an anti-fingerprint layer so that fingerprint marks do not remain on the protective layer formed in the protective layer forming step; It may also be another feature to include a further.

Furthermore, the anti-fingerprint layer formed in the anti-fingerprint layer forming step may be another feature that is formed by spray coating the anti-fingerprint liquid on the protective layer and then drying.

Furthermore, the anti-fingerprint may be dried by irradiating ultraviolet light.

According to the champagne gold plating method according to the present invention, based on the CIE color coordinate L * a * b * expression method defined by the International Illumination Commission (CIE), the brightness L * is between 78 and 95, a * is 1 to 5 B * is to improve the reproducibility of the champagne gold color represented by the color corresponding to 13 to 19 and to suppress the occurrence of dichroic phenomenon, so that the plating quality of the plating object such as an emblem or a decoration It has the effect of improving.

1 is a flow chart schematically showing a champagne gold color plating method according to an embodiment of the present invention.

2 is a champagne gold color plating method according to an embodiment of the present invention, when the deposition by using a sputter target made of copper and aluminum alloy material in an argon atmosphere gas and the copper, aluminum sputter target was deposited by using together In this case, the color coordinates of the plated color and the reflectance for each wavelength can be compared.

3 is a champagne gold color plating method according to an embodiment of the present invention, when using a sputter target made of an alloy material of copper and aluminum in an argon and nitrogen atmosphere gas and using a copper, aluminum sputter target together In the case of vapor deposition, the color coordinates of the plated color and the reflectivity for each wavelength can be compared.

FIG. 4 is an image view schematically showing an SEM image showing a surface of a plating layer deposited on champagne gold color according to an embodiment of the present invention.

5 is a schematic view showing an AFM image, etc. showing the surface of the plating layer deposited in the champagne gold color plating method according to an embodiment of the present invention.

6 is an XPS diagram graphically showing the intrinsic components of the deposited plating layer in the champagne gold color plating method according to an embodiment of the present invention.

Hereinafter, a preferred embodiment with reference to the accompanying drawings to be described in more detail with respect to the present invention will be described.

1 is a flow chart schematically showing a champagne gold color plating method according to an embodiment of the present invention, Figure 2 is a champagne gold color plating method according to an embodiment of the present invention, an alloying material of copper and aluminum in argon atmosphere gas In the case of using a sputter target to be deposited and when using a copper and aluminum sputter target together to deposit the color coordinates of the plated color and reflectance for each wavelength can be compared to show the schematic, Figure 3 is a view of the present invention In the champagne gold color plating method according to the embodiment, when the deposition by using a sputter target made of copper and aluminum alloy material in the argon and nitrogen atmosphere gas and the deposition using both copper and aluminum sputter target together The color coordinates and reflectance of each wavelength can be compared for comparison. 4 is an image diagram schematically showing an SEM image showing the surface of the plating layer deposited in the champagne gold color plating method according to an embodiment of the present invention, Figure 5 is a champagne gold according to an embodiment of the present invention In the color plating method, an AFM image and the like showing the surface of the deposited plating layer are schematically illustrated.

Referring first to Figure 1, the champagne gold color plating method according to an embodiment of the present invention, the brightness L * is between 78 to 95 based on the CIE color coordinate L * a * b * expression method defined by the International Illumination Commission (CIE) In this case, a * corresponds to 1 to 5, and b * is a method of plating a champagne gold color represented by a color corresponding to 13 to 19. A plating preparation step (S110) and a plating step (S120) are performed. It includes, and preferably further comprises a protective layer forming step (S130), more preferably further comprises an anti-fingerprint layer forming step (S140).

The champagne gold color plating method may be made in a deposition apparatus such as a sputter apparatus, and in this embodiment, the plating by deposition using the sputter apparatus will be described as an example.

<< S110 >>

First, the plating preparation step (S110) is a step of placing the plating object 100 to be plated at a plating position in a sputter (not shown), and placing a sputter target (not shown) in the sputter.

Sputter targets made of copper and sputter targets made of aluminum are separately prepared and placed in the sputter, and it may be desirable to co-deposition together in the plating step (S120). It is preferable to use a single sputter target, which is an alloy material containing copper and aluminum.

Here, the weight ratio (wt%) of copper and aluminum in the sputter target made of an alloy material made of copper and aluminum preferably corresponds to between 80:20 and 90:10.

<< S120 >>

Plating step (S120) is a step of plating the plating target 100 by sputtering to collide with ions to the sputter target prepared in the plating preparation step (S110) to deposit on the plating target 100.

In the plating step (S120), it is preferable that sputtering is performed using an inert gas, which is a Group 8 element, as an atmospheric gas at a predetermined vacuum degree.

Here, the atmosphere gas refers to a gas present around the sputter target for sputtering in a chamber environment in which sputtering is performed. Therefore, in the present specification, the atmosphere gas generically refers to the discharge gas and the reaction gas in the sputtering equipment. If the discharge gas and the reactive gas are distinguished, the discharge gas is an inert gas, and the reaction gas will be described later.

It can be said to mean a gas such as.

And the inert gas is preferably argon, more preferably argon and a small amount of

It is preferable to supply together as an atmosphere gas.

Where argon supplied as the atmosphere gas

SCCM (Standard Cubic Centimeter per Minute) ratio of preferably corresponds to 1: 0.04 to 1: 0.15. For example, if you set argon to 100SCCM,

Is preferably set to correspond to between 4 SCCM and 15 SCCM.

In this manner, the plating layer 110 is formed on the plating object 100.

Here, a single sputter made of copper and aluminum alloy material than the surface of the plating layer 110 formed by depositing each of copper and aluminum separately as a sputter target and being deposited together in an argon atmosphere gas, as shown in FIG. 4 or 5. It can be seen that the surface of the plating layer 110 formed by depositing in an argon atmosphere gas is more evenly formed as a target.

4, the plating layer 110 formed by depositing in an atmosphere of nitrogen and argon gas rather than the surface of the plating layer 110 formed by depositing in an atmosphere of argon with a single sputter target made of copper and an aluminum alloy material, as shown in FIG. 4. It can be seen that the surface of is formed more evenly.

As described above, evenness of the surface of the plating layer 110 is different, but the component ratios are the same in all three cases.

Although it may be finished by forming the plating layer 110 through the plating step (S120), it is preferable to form a protective layer through the protective layer forming step (S130) to protect the plating layer (110).

<< S130 >>

Next, the protective layer forming step (S130) is a step of forming the protective layer 120 on the upper side of the plating layer 110 formed by plating the plating object 100 in the plating step (S120).

Where the protective layer 120 is

Is preferably. The protective layer 120 may also be formed by sputtering or the like.

On top of the plating layer 110

The protective layer 120 is preferably formed because the protective layer 120 can be protected from discoloration or dichroic phenomenon.

Also like this

It is preferable to form the furnace protection layer 120 because the oxidation prevention and the corrosion resistance are improved.

It may be sufficient even to form the above protective layer 120, but in order to prevent or suppress the phenomenon that the fingerprint is buried in contact with the user's hand and the like in the protective layer 120 as follows (S140) It is also preferable that it further comprises.

<< S140 >>

Anti-fingerprint layer forming step (S140) is a step of forming an anti-fingerprint (Anti-Finger print) layer 130 so as not to leave fingerprint marks on the upper side of the protective layer 120 formed in the protective layer forming step (S130).

In order to form the anti-fingerprint layer 130 in the anti-fingerprint layer forming step (S140) is applied to the anti-fingerprint solution on the protective layer 130. There may be a variety of methods as a method of applying the anti-fingerprint solution on the protective layer 130, it is also possible to use a method such as spray coating or spin coating.

The anti-fingerprint liquid is evenly applied on the protective layer 130 and then dried to form the anti-fingerprint layer 130. It is also preferable to dry by applying heat, and in addition, it is also preferable to form the anti-fingerprint layer 130 by irradiating with ultraviolet rays to dry.

In this way, the antifingerprint layer 130 can be formed.

When the anti-fingerprint layer 130 is formed in this way, the occurrence of changes over time or oxidation at room temperature is suppressed, and scratches may also be suppressed.

Through the steps as described above it is possible to plate the champagne gold color.

For reference, in the argon atmosphere, copper and aluminum were plated with a sputter target made of an alloying material at a ratio between 80: 20 and 90: 10 and color coordinates and wavelengths when plated with a sputter target made of copper and aluminum separately. Reflectance is schematically shown in FIG. 2.

And argon and a small amount of

Using sputter targets made of alloying material in the ratio of 80: 20 to 90: 10

The color coordinates and the reflectance for each wavelength according to the amount of are schematically shown in FIG. 3.

In addition, in the champagne gold color plating method according to an embodiment of the present invention, the XPS graph showing the intrinsic components of the deposited plating layer is shown in FIG. The inherent peaks of copper peaks (WL43: Cu111, WL52: 200) were added to the nitrogen process gas under two conditions to minimize WL43 and shift the peak of WL45 of aluminum to short wavelength.

As described above, according to the champagne gold color plating method according to the present invention, the brightness L * corresponds to 78 to 95 based on the CIE color coordinate L * a * b * expression method defined by the International Lighting Commission (CIE), a * is between 1 and 5, and b * is used to increase the reproducibility of the champagne gold color represented by the color corresponding to 13 to 19, and to suppress the occurrence of dichroism, and so on. There is an advantage of improving the plating quality for the object.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with reference to a preferred embodiment of the present invention, the present invention has been described above. It should not be understood to be limited only to the embodiments, and the scope of the present invention should be understood by the claims and equivalent concepts described below.

Claims

A plating preparation step of placing a plating target to be plated at a plating position in a sputter and placing a sputter target made of an alloy (Alloy) material including copper and aluminum in the sputter; And

And a plating step of plating the plating object by sputtering to impinge ions on the sputter target prepared in the plating preparation step and deposit the deposited on the plating object.

According to the CIE color coordinates L * a * b * expressions prescribed by the International Lighting Commission (CIE), a * corresponds to 1 to 5 and b * represents a champagne gold color represented by a color corresponding to 13 to 19. Champagne gold color plating method characterized in that for plating the plating object.
The method of claim 1,

Brightness L * of the champagne gold color is a champagne gold color plating method, characterized in that corresponding to between 78 and 95.
The method of claim 1,

In the plating step,

Champagne gold color plating method characterized in that to supply an inert gas to the atmosphere gas of the sputtering made at a predetermined degree of vacuum.
The method of claim 3, wherein

The inert gas is argon,

Into the atmosphere gas
Champagne gold color plating method characterized in that the supply more.
The method of claim 4, wherein

Argon supplied as the atmosphere gas and
SCCM (Standard Cubic Centimeter per Minute) ratio of champagne gold color plating method, characterized in that corresponding to 1: 0.04 to 1: 0.15.
The method of claim 1,

The sputter target is an alloy material made of copper and aluminum,

The weight ratio (wt%) of copper and aluminum is champagne gold color plating method characterized in that corresponding to between 80:20 to 90:10.
The method of claim 1,

A protective layer forming step of forming a protective layer on an upper side of the plating layer formed by plating the plating object in the plating step; Champagne gold color plating method characterized in that it further comprises.
The method of claim 7, wherein

The protective layer
Champagne gold color plating method characterized in that.
The method of claim 7, wherein

An anti-fingerprint layer forming step of forming an anti-fingerprint layer so that fingerprint marks do not remain on the protective layer formed in the protective layer forming step; Champagne gold color plating method characterized in that it further comprises.
The method of claim 9,

The anti-fingerprint layer formed in the anti-fingerprint layer forming step,

Champagne gold color plating method characterized in that the anti-fingerprint liquid is spray-coated on the protective layer and then dried.
The method of claim 10,

The anti-fingerprint drying is champagne gold color plating method, characterized in that made by irradiation with ultraviolet rays.