KR20180059155A - Deposition Method for Champagne Gold Color - Google Patents

Abstract

The present invention relates to a method to plate a champagne gold color, using a sputter to perform plating. According to the present invention, the method to plate the champagne gold color comprises: a plating preparation step of placing an object to be plated at a plating position in the sputter, and placing a sputter target made of an alloy substance including copper and aluminum in the sputter; and a plating step of plating the object to be plated by sputtering which collides ion with the sputter target prepared in the plating preparation step to deposit a sputtered substance on the object to be plated. Accordingly, the object to be plated is able to be plated in order to represent the champagne gold color, which is represented by a color corresponding to a* = 1 to 5 and b* = 13 to 19 based on a commission internationale de l′Eclairage (CIE) color coordinate L*a*b* expression defined by CIE, thus enhancing reproducibility of the champagne gold color and preventing generation of a decoloring effect. Accordingly, disclosed is a technology capable of enhancing plating quality of an object, such as an ornament and the like, to be plated.

Description

Champagne Gold Coloring Method {Deposition Method for Champagne Gold Color}

The present invention relates to a plating method for plating an emblem or a decorative material to have a specific color. More specifically, the brightness L * is 78 (L * a * b *) based on the CIE color coordinates L * And a * corresponds to between 1 and 5, and b * corresponds to a color corresponding to between 13 and 19. The present invention also relates to a method for plating a champagne gold color.

Many products, such as smart phones, automobiles, and household appliances, often have decorative products such as ambulances and ornaments to give aesthetically pleasing feeling. These ornamental products generally are formed by injection molding or the like and are plated to give an elegant feeling of metallicity.

Here, various plating materials and plating methods are applied to produce various colors. Plating methods can be classified into wet plating and dry plating. Wet plating has various problems compared to dry plating in environmental problems, manufacturing cost and time. Therefore, a lot of research and development on dry plating using vacuum deposition equipment such as sputter equipment has been performed.

In connection with such dry plating, Korean Patent Registration No. 10-0646009 (a method of dry-plating an epoxy resin and a plastic material) discloses a dry-plating technique for plastics as an injection-molded product.

However, the prior art 1 has the following problems.

In some cases, two or more metallic sputter targets may be used together for deposition to implement a particular color, such as champagne gold, while using inert gases and multiple reaction gases. When dry plating is performed using two or more kinds of sputter targets and various kinds of gases, there is a problem that the reproducibility of the plating color is lowered under the same conditions.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of coloring champagne gold which can improve the plating reproducibility of a specific color such as champagne gold by using sputter equipment.

According to an aspect of the present invention, there is provided a method for plating a sputter target, the sputter target comprising a sputter target made of an alloy material including copper and aluminum, target in a sputtering process; And a plating step of plating the plating object by sputtering in which ions are collided with the sputter target prepared in the plating preparation step to deposit the plating target on the plating object, thereby obtaining the CIE color coordinate L * defined by the International Lighting Committee (CIE) According to the a * b * expression method, one may characterize that the plating object is plated to exhibit a champagne gold color represented by a * in the range of 1 to 5 and b * in the range of 13 to 19 have.

Here, another characteristic may be that the brightness L * of the champagne gold color falls between 78 and 95.

Here, in the plating step, the inert gas may be supplied to the atmospheric gas of the sputtering at a predetermined degree of vacuum.

를 더 공급시켜주는 것을 또 하나의 특징으로 할 수도 있다. Further, the inert gas is argon, and the atmospheric gas

As shown in Fig.

의 SCCM(Standard Cubic Centimeter per Minute) 비는 1 : 0.04 내지 1 : 0.15 사이에 해당되는 것을 또 하나의 특징으로 할 수도 있다. Further, argon supplied as the atmospheric gas and

The standard cubic centimeter per minute (SCCM) ratio of 1: 0.04 to 1: 0.15.

Here, the sputter target may be an alloy material made of copper and aluminum, and the weight ratio (wt%) of copper and aluminum is between 80:20 and 90:10.

Forming a protective layer on the plating layer formed by plating the plating object in the plating step; May be further included.

인 것을 또 하나의 특징으로 할 수도 있다. Furthermore,

May be another feature.

Forming an anti-fingerprint layer on the anti-fingerprint layer so that a fingerprint is not left on the protective layer formed in the protective layer; May be further included.

Further, the anti-fingerprint layer formed in the anti-fingerprint layer forming step may be further characterized in that the anti-fingerprint liquid is formed by spraying the anti-fingerprint liquid onto the protective layer and drying the anti-fingerprint liquid.

Furthermore, drying of the anti-fingerprint liquid may be performed by irradiating ultraviolet rays.

According to the champagne gold plating method according to the present invention, the brightness L * corresponds to 78 to 95 in accordance with the CIE color coordinate L * a * b * expression scheme defined by the International Lighting Committee (CIE), a * , B * improves the reproducibility of the champagne gold color represented by the color corresponding to 13 to 19, and suppresses the occurrence of the dichroic phenomenon. Therefore, the plating quality for the plating object such as the ambulance or the decorative object There is an effect to improve.

1 is a flowchart schematically illustrating a method of coloring champagne gold according to an embodiment of the present invention.
FIG. 2 is a graph showing the results of the deposition of the copper and aluminum sputter targets using a sputter target made of copper and an aluminum alloy material in an argon atmosphere gas in the case of the Champagne gold color plating method according to an embodiment of the present invention. The color coordinates of the plated color and the reflectance according to the wavelength can be roughly compared.
FIG. 3 is a graph showing the relationship between the deposition of copper and an aluminum sputter target when a sputter target made of an alloy material of copper and aluminum is used in an atmosphere of argon and nitrogen in the method of coloring champagne gold according to an embodiment of the present invention The color coordinates of the plated color and the reflectance for each wavelength can be roughly compared with each other.
FIG. 4 is a schematic view showing an SEM image showing a surface of a plated layer deposited by vapor deposition in a champagne gold color plating method according to an embodiment of the present invention. FIG.
FIG. 5 is a schematic view showing an AFM image or the like showing the surface of a plated layer deposited by vapor deposition in a champagne gold color plating method according to an embodiment of the present invention.
FIG. 6 is an XPS diagram showing the intrinsic components of a plated layer deposited by vapor deposition in a champagne gold color plating method according to an embodiment of the present invention.

The present invention may take various transformations and may have various embodiments, and specific embodiments are illustrated by way of example in the drawings and will be described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the following embodiments together with the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or corresponding elements throughout.

In the following examples, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.

In the following examples, terms such as "comprising" or "having" mean that a feature or element described in the specification is present, and does not preclude the possibility that one or more other features or components will be added.

In the drawings, the sizes of components may be exaggerated or reduced to facilitate understanding and understanding. For example, the sizes, lengths, angles, and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience and understanding of the description, and may be reversed to the order described.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a flow chart schematically illustrating a method of coloring champagne gold according to an embodiment of the present invention. FIG. 2 is a schematic view illustrating a method of coloring a champagne gold according to an embodiment of the present invention. FIG. 3 is a view showing a schematic comparison of the color coordinates of the plated color and the reflectance according to the wavelength when deposition is carried out using a sputter target made of copper and an aluminum sputter target together, and FIG. In the case of depositing using a sputter target made of copper and an aluminum alloy material in a argon and nitrogen atmosphere gas and depositing using both a copper and an aluminum sputter target together in a champagne gold color plating method according to an embodiment, So that it can be compared with the color coordinates and the reflectance of each wavelength. 4 is a schematic view showing an SEM image showing a surface of a plating layer plated with a metal in a champagne gold color plating method according to an embodiment of the present invention, An AFM image or the like showing the surface of a plated layer deposited by vapor deposition in a color plating method.

Referring to FIG. 1, the champagne gold color plating method according to an embodiment of the present invention has a brightness L * of 78 to 95 according to the CIE color coordinates L * a * b * , A * corresponds to between 1 and 5, and b * corresponds to a champagne gold color represented by a color corresponding to 13 to 19. The plating preparation step (S110) and the plating step (S120) (S130), and more preferably, forming an anti-fingerprint layer (S140).

The method for plating the champagne gold may be performed in a deposition apparatus such as a sputtering apparatus. In this embodiment, plating is performed by deposition using a sputtering apparatus.

<< S110 >>

First, a plating preparation step (S110) is a step of placing a plating target object 100 to be plated at a plating position in a sputter (not shown) and positioning a sputter target (not shown) in the sputter.

It is also preferable that the sputter target made of copper and the sputter target made of aluminum are separately prepared and placed in the sputtering and co-deposition in the plating step (S120). It is preferable to use a single sputter target which is an alloy material including copper and aluminum.

Here, the weight ratio (wt%) of copper and aluminum in the sputter target made of an alloy material of copper and aluminum is preferably between 80:20 and 90:10.

<< S120 >>

The plating step S120 is a step of plating the plating target body 100 by sputtering in which the ions are collided with the sputter target prepared in the plating preparation step S110 and are deposited on the plating target body 100. [

In this plating step (S120), it is preferable that sputtering is performed using an inert gas which is a Group 8 element at a predetermined degree of vacuum as an atmospheric gas.

등과 같은 가스를 의미한다고 할 수 있다.Here, the atmospheric gas refers to a gas existing around the sputter target for sputtering in a chamber environment where sputtering is performed. Therefore, in the present specification, the atmospheric gas is collectively referred to as the discharge gas and the reactive gas in the sputtering equipment. If the discharge gas and the reactive gas are distinguished from each other, the discharge gas is an inert gas,

And the like.

를 함께 분위기가스로서 공급시켜주는 것이 바람직하다. The inert gas is preferably argon, more preferably argon and a small amount of

Are supplied together as the atmospheric gas.

의 SCCM(Standard Cubic Centimeter per Minute) 비는 1 : 0.04 내지 1 : 0.15 사이에 해당되는 것이 바람직하다. 예를 들어, 아르곤을 100SCCM 으로 한다면,

는 4 SCCM 내지 15 SCCM 사이에 해당되도록 설정하여 주는 것이 바람직하다는 것이다.Here, argon supplied as the atmospheric gas

The ratio of the standard cubic centimeter per minute (SCCM) is preferably between 1: 0.04 and 1: 0.15. For example, if argon is 100 SCCM,

Is preferably set to be between 4 SCCM and 15 SCCM.

In this way, the plating layer 110 is formed on the plating target body 100.

Here, as shown in FIG. 4 or FIG. 5, a single sputter made of copper and an aluminum alloy material is formed on the surface of the plating layer 110 formed by separately depositing copper and aluminum in a sputter target and vapor- It can be seen that the surface of the plating layer 110 formed by depositing in the argon atmosphere gas as the target is formed more evenly.

As shown in FIG. 4, the plating layer 110 is formed by depositing in a nitrogen and argon atmosphere gas rather than the surface of the plating layer 110 formed by vapor deposition in an argon atmosphere gas with a single sputter target made of copper and an aluminum alloy material, It can be seen that the surface of the substrate is more uniformly formed.

In this way, the uniformity of the surface of the plating layer 110 is differently formed, but the composition ratios all show the same composition ratios in all three cases.

It is preferable to form the plating layer 110 through the plating step S120, but it is preferable to form the protective layer through the protective layer forming step S130 in order to protect the plating layer 110. [

<< S130 >>

The protective layer forming step S130 is a step of forming the protective layer 120 on the plating layer 110 formed by plating the plating target body 100 in the plating step S120.

인 것이 바람직하다. 그리고 이러한 보호층(120)은 스퍼터링 등에 의한 방법으로 형성시킬 수도 있다.Here, the protective layer 120

. The protective layer 120 may be formed by sputtering or the like.

로 보호층(120)을 형성시키면, 변색 또는 이색현상이 발생되지 않도록 보호할 수 있으므로 바람직하다.On the upper side of the plating layer 110

It is preferable to form the protective layer 120 to prevent discoloration or a discoloration phenomenon from occurring.

로 보호층(120)을 형성시키면 산화방지 및 내부식성이 향상되므로 바람직하다.Also,

It is preferable to form the protective layer 120 because oxidation and corrosion resistance are improved.

It may be sufficient to form the protective layer 120. In order to prevent or suppress the phenomenon of the fingerprints coming into contact with the user's hand or the like on the protective layer 120, Is further preferable.

<< S140 >>

The anti-fingerprint layer forming step S140 is a step of forming the anti-fingerprint layer 130 so that no fingerprint is left on the protective layer 120 formed in the protective layer forming step S130.

In order to form the anti-fingerprint layer 130 in the anti-fingerprint layer formation step S140, the anti-fingerprint liquid is coated on the protection layer 130. [ Here, various methods can be applied to coat the anti-fingerprint liquid on the protective layer 130, but it is also possible to use a method such as spray coating or spin coating.

The anti-fingerprint liquid is uniformly coated on the protective layer 130, and then dried to form the anti-fingerprint layer 130. In this case, it is also preferable to apply heat to the film, and in addition, it is also preferable to form the anti-fingerprint layer 130 by irradiating ultraviolet rays and drying the film.

Thus, the anti-fingerprint layer 130 can be formed.

If the anti-fingerprint layer 130 is formed as described above, occurrence of aging change or oxidation phenomenon at room temperature can be suppressed and occurrence of scratches can be suppressed.

Through the steps as described above, it is possible to perform plating with champagne gold color.

For reference, in the case of plating with a sputter target made of an alloy material at a ratio of copper and aluminum in the ratio of 80:20 to 90:10 in an argon atmosphere gas and a case in which plating is performed with a sputter target separately made of copper and aluminum, The reflectance is schematically shown in Fig.

분위기 가스 속에서 구리와 알루미늄이 80 : 20 내지 90 : 10 사이의 비율로 합금물질로 된 스퍼터타겟을 이용하여

의 양에 따른 색좌표와 파장별 반사율을 도 3에 개략적으로 나타내었다. Then, argon and a small amount of

Using a sputter target made of alloy material in a ratio of copper and aluminum in the atmosphere gas of 80:20 to 90:10

The color coordinates and the reflectance according to wavelength are schematically shown in Fig.

FIG. 6 is an XPS graph showing the intrinsic composition of the plated layer deposited by vapor deposition in the champagne gold color plating method according to the embodiment of the present invention. The inherent peak of the copper peak (WL43: Cu111, WL52: 200) was injected under two conditions of nitrogen process gas to minimize WL43 and to shift the WL45 peak of aluminum to short wavelength.

As described above, according to the champagne gold color plating method according to the present invention, the brightness L * is in the range of 78 to 95 based on the CIE color coordinates L * a * b * expression method defined by the International Lighting Committee (CIE) the a * corresponds to between 1 and 5, the b * improves the reproducibility of the champagne gold color represented by the color corresponding to 13 to 19, and the occurrence of the dichromatic phenomenon can be suppressed, Thereby improving the plating quality of the object.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be construed as being limited only by the embodiments, and the scope of the present invention should be understood as the following claims and their equivalents.

100: Plating object 110: Plating layer
120: Protective layer 130: Anti-fingerprint layer

Claims (11)

A plating preparation step of placing a plating target to be plated in a plating position in a sputter and positioning a sputter target made of an alloy material including copper and aluminum in the sputter; And
And a plating step of plating the plating object by sputtering in which ions are collided with the sputter target prepared in the plating preparation step and deposited on the plating object,
According to the CIE color coordinates L * a * b * regulated by the International Commission on Illumination (CIE), a * corresponds to between 1 and 5 and b * corresponds to a champagne gold color expressed in colors between 13 and 19 Wherein the plating object is plated.
The method according to claim 1,
Wherein the brightness L * of the champagne gold color is between 78 and 95.
The method according to claim 1,
In the plating step,
Wherein an inert gas is supplied to the atmospheric gas of the sputtering at a predetermined degree of vacuum.
The method of claim 3,
Wherein the inert gas is argon,
As the atmosphere gas

Wherein the method further comprises the steps of:
5. The method of claim 4,
Argon supplied as the atmospheric gas and

Wherein a ratio of a standard cubic centimeter per minute (SCCM) of the glass is between 1: 0.04 and 1: 0.15.
The method according to claim 1,
Wherein the sputter target is an alloy material comprising copper and aluminum,
Wherein the weight ratio of copper and aluminum (wt%) is between 80:20 and 90:10.
The method according to claim 1,
A protective layer forming step of forming a protective layer on the plating layer formed by plating the plating object in the plating step; Further comprising the steps of:
8. The method of claim 7,
The protective layer

Wherein the method comprises the steps &lt; RTI ID = 0.0 &gt; of: &lt; / RTI &gt;
8. The method of claim 7,
Forming an anti-fingerprint layer on an upper side of the protective layer formed in the protective layer forming step to form an anti-fingerprint layer so that no fingerprint is left on the protective layer; Further comprising the steps of:
10. The method of claim 9,
Wherein the anti-fingerprint layer formed in the anti-
Wherein the anti-fingerprint liquid is sprayed on the protective layer and then dried.
11. The method of claim 10,
Wherein the anti-fingerprint liquid is dried by irradiating ultraviolet rays.

Images