WO2018090574A1 - 传片装置、工艺腔室、机械手、半导体装置和传片方法 - Google Patents

传片装置、工艺腔室、机械手、半导体装置和传片方法 Download PDF

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Publication number
WO2018090574A1
WO2018090574A1 PCT/CN2017/083042 CN2017083042W WO2018090574A1 WO 2018090574 A1 WO2018090574 A1 WO 2018090574A1 CN 2017083042 W CN2017083042 W CN 2017083042W WO 2018090574 A1 WO2018090574 A1 WO 2018090574A1
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Prior art keywords
wafer
transfer
synchronously
fingers
sub
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PCT/CN2017/083042
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English (en)
French (fr)
Inventor
邓玉春
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Publication of WO2018090574A1 publication Critical patent/WO2018090574A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Definitions

  • the present invention relates to the field of semiconductor device manufacturing, and in particular to a film transfer device, a process chamber, a robot, a semiconductor device, and a film transfer method.
  • Equipment capacity refers to the number of good products produced during the working hours of the equipment unit. It is an important technical parameter reflecting the processing capacity of the equipment.
  • the degassing device and the annealing device used in the manufacture of integrated circuits need to cooperate with the lifting mechanism of the process chamber to complete the transfer of the wafer before performing the corresponding process. How to improve equipment production capacity by shortening the transfer time and reducing the non-process time has become a major problem that equipment manufacturers need to solve.
  • the existing process chamber is a single-chamber structure, and a wafer carrier and a lifting mechanism for driving the wafer carrier for lifting movement are disposed in the process chamber.
  • the process chamber is coupled to the TM transfer chamber, and a robot is disposed within the transfer chamber for transferring the wafer between the process chamber and the transfer chamber and placing the wafer on a heater within the process chamber.
  • the existing process chamber inevitably has the following problems: since the wafer carrier and the robot can only take and handle one wafer at a time, the transfer efficiency is low, resulting in a non-process length. , affecting equipment capacity.
  • the present invention is directed to the above-mentioned deficiencies in the prior art, and provides a film transfer device, a process chamber, a robot, a semiconductor device, and a film transfer method for solving the problem of low wafer transfer efficiency.
  • the invention provides a film transfer device comprising:
  • a lifting mechanism for driving the plurality of wafer carriers to perform a lifting movement synchronously to perform a pick and place operation in cooperation with a robot capable of transmitting a plurality of wafers.
  • the wafer carrier includes a carrying position for carrying the wafer, and the heights of the carrying positions of the plurality of the wafer carriers are sequentially lowered in an order of arrangement.
  • the height difference between the carrying positions of each of the two adjacent wafer carriers is 6-10 mm.
  • the lifting mechanism comprises:
  • At least one vertically arranged lifting shaft At least one vertically arranged lifting shaft
  • a driving source for driving the at least one lifting shaft to perform a lifting movement synchronously
  • At least one connecting component the number of the connecting components corresponding to the number of the lifting shafts for connecting the lifting shaft and two wafer carriers adjacent thereto.
  • each of the connecting components comprises a mounting plate and two connecting plates, wherein
  • the mounting plate is horizontally disposed and connected to the lifting shaft corresponding to the connecting component;
  • the two connecting plates are stacked on the mounting plate and are respectively connected to the two wafer carriers corresponding to the lifting shaft.
  • the connecting component further includes a first long slot, a first threaded hole and a first connecting screw, wherein
  • the first long slot is disposed on each of the connecting plates
  • the first threaded hole is disposed on the mounting plate and corresponds to the first long slot
  • the first connecting screw is threadedly coupled to the first threaded hole through the first long slot.
  • the connecting component further includes a second long slot, a second threaded hole and a second connecting screw, wherein
  • the second long slot is disposed on the mounting plate, and a horizontal axis direction thereof is disposed along a circumferential direction of the lifting shaft corresponding to the connecting component;
  • the second threaded hole is disposed at a top end of the lifting shaft
  • the second connecting screw is threadedly connected to the second threaded hole through the second long slot.
  • the connecting assembly further includes a plurality of third threaded holes and a plurality of set screws, wherein
  • a plurality of the third threaded holes are disposed on each of the connecting plates;
  • a plurality of the set screws are screwed into the plurality of the third threaded holes in a one-to-one correspondence, and a lower end of each set screw is in contact with an upper surface of the mounting plate;
  • the level of the web is adjusted by adjusting the relative position of at least one of the set screws and the third threaded hole in its axial direction.
  • each of the wafer carriers includes a ring bracket and a plurality of wafer tips, wherein
  • the annular bracket is horizontally disposed
  • each of the wafer top fingers is coupled to the annular bracket, and a plurality of the wafer top fingers are circumferentially spaced along the annular bracket; a plurality of the top ends of the wafer top fingers collectively serve as a carrier The carrying position of the wafer.
  • the present invention also provides a process chamber, comprising:
  • a connecting sub-chamber located between each of the two adjacent process sub-chambers and in communication with the two.
  • the lifting mechanism includes at least one lifting shaft and a driving source, wherein
  • Each of the lifting shafts is located below the connecting sub-cavity, and an upper end thereof extends vertically upward through the connecting sub-cavity and two of the two process sub-chambers in communication with the connecting sub-cavity a wafer carrier is connected, and a lower end of each of the lifting shafts is connected to the driving source;
  • the driving source is configured to drive the at least one lifting shaft to perform a lifting movement synchronously.
  • the present invention also provides a robot, comprising:
  • a plurality of transfer fingers for transferring the wafers are arranged in the horizontal direction;
  • the driving device is configured to drive a plurality of the transfer fingers to move synchronously to cooperate with the above-mentioned film transfer device provided by the present invention to perform a pick and place operation.
  • the present invention further provides a semiconductor device including a transfer chamber, the above-described process chamber provided by the present invention, and the above-mentioned manipulator provided by the present invention, the manipulator being disposed in the transfer chamber for A wafer is transferred between the process chamber and the transfer chamber.
  • the present invention further provides a film transfer method, which is applied to the above-mentioned semiconductor device provided by the present invention to perform a pick and place operation on a wafer; the pick and place operation includes a film release process and a film taking process. among them,
  • the releasing process includes the following steps:
  • the lifting mechanism drives a plurality of the wafer carriers to rise synchronously to a transfer position
  • the driving device drives a plurality of the transfer fingers to synchronously transfer the respective wafers into the respective process sub-cavities in a one-to-one correspondence, and is placed on each of the wafer carriers;
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously descend to a process position.
  • the taking process includes the following steps:
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously rise to a transfer position
  • the driving device synchronously drives each of the transfer fingers to move into the respective process sub-cavities in a one-to-one manner, and respectively located under the wafers placed on the respective wafer carriers, and then drives each of the transfer films. Raise the finger and hold up the individual wafers;
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously descend to a process position.
  • the wafer carrier includes a carrying position for carrying the wafer, and heights of the carrying positions of the plurality of the wafer carriers are sequentially decreased in an order of arrangement;
  • the step S12 further includes the following sub-steps:
  • the driving device drives a plurality of the transfer finger fingers to synchronously transfer the respective wafers into each of the process sub-cavities;
  • S122 Perform horizontal position calibration of the wafers on each of the transfer fingers corresponding to the respective carrier positions in order of high to low carrying positions, and drive the driving device after each calibration.
  • Each of the transfer fingers is synchronously lowered by a corresponding height to place the wafer that has been calibrated on the wafer carrier corresponding to the transfer finger of the wafer;
  • the step S22 further includes the following sub-steps:
  • the driving device synchronously drives each of the transfer fingers to move into the respective process sub-cavities in a one-to-one correspondence;
  • S222 Perform horizontal position calibration on the wafers in the order of the carrier positions from low to high, and after each calibration, the driving device drives each of the transmitting fingers to synchronously rise to a corresponding height. To lift the wafer that has finished calibration from the wafer carrier on which the wafer is located.
  • the present invention further provides a film transfer method, which is applied to the above-mentioned semiconductor device provided by the present invention to perform a pick and place operation on a wafer; the pick and place operation includes a film release process and a film taking process. among them,
  • the releasing process includes the following steps:
  • the driving device drives a plurality of the transfer fingers to synchronously transfer the respective wafers into the respective process sub-cavities in a one-to-one correspondence, and are respectively located above each of the wafer carriers;
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously rise to a transfer position, and correspondingly lifts the wafers on each of the transfer fingers;
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously descend to a process position.
  • the taking process includes the following steps:
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously rise to a transfer position
  • the driving device synchronously drives each of the transfer fingers to move into the respective process sub-cavities in a one-to-one manner, and is located under the wafers placed on each of the wafer carriers;
  • the lifting mechanism drives each of the wafer carriers to be synchronously lowered, so that each of the transfer fingers respectively lifts each of the wafers;
  • the driving device drives each of the transfer fingers to synchronously exit each of the process sub-cavities.
  • the wafer carrier includes a carrying position for carrying the wafer, and heights of the carrying positions of the plurality of the wafer carriers are sequentially decreased in an order of arrangement;
  • the step S32 further includes:
  • the lifting mechanism drives a plurality of the wafer carriers to synchronously rise corresponding heights to lift up Completing the calibrated wafer;
  • the step S43 further includes:
  • the lifting mechanism drives each of the wafer carriers to synchronously lower the corresponding heights.
  • a transfer finger corresponding to the wafer that completed the calibration is used to lift the wafer.
  • the film transfer device provided by the present invention can be used in conjunction with a robot capable of transporting a plurality of wafers by providing a plurality of wafer carriers and driving a plurality of wafer carriers to perform a lifting motion using a lifting mechanism to realize simultaneous execution of a plurality of wafers.
  • the filming and taking operation can improve the wafer transfer efficiency and shorten the film transfer time, thereby increasing the equipment throughput.
  • the invention provides a process chamber, which is provided with the above-mentioned film transfer device provided by the present invention, and is provided with a plurality of process sub-cavities arranged in a horizontal direction and between two adjacent process sub-cavities, and two The connecting sub-cavities that are connected to each other can make the robot and the film transfer device cooperate, and at the same time perform the pick-and-place operation on the plurality of wafers, thereby improving the wafer transfer efficiency, shortening the film transfer time, and thereby increasing the equipment throughput.
  • the manipulator provided by the present invention can perform the picking and placing operation on a plurality of wafers in cooperation with the above-mentioned film transfer device provided by the present invention by providing a plurality of transfer fingers, thereby improving the wafer transfer efficiency and shortening the film transfer time. In turn, equipment capacity can be increased.
  • the semiconductor device provided by the present invention can realize the simultaneous picking and placing operation of a plurality of wafers by using the above-mentioned process chamber provided by the present invention and the above-mentioned manipulator provided by the present invention, thereby improving wafer transfer efficiency and shortening transfer time. In turn, the equipment capacity can be increased.
  • the film transfer method provided by the present invention is applied to the above-mentioned semiconductor device provided by the present invention, and can perform the pick-and-place operation on a plurality of wafers at the same time, thereby improving the wafer transfer efficiency, shortening the film transfer time, and thereby improving the device throughput. .
  • FIG. 1 is a cross-sectional view of a film transfer device according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of a lifting mechanism and a wafer carrier in a film transfer device according to an embodiment of the present invention
  • Figure 3 is a perspective view of a robot in an embodiment of the present invention.
  • the present invention provides a film transfer apparatus comprising a plurality of wafer carriers and a lifting mechanism, wherein the plurality of wafer carriers are sequentially arranged in a horizontal direction, and the arrangement shape thereof may be a straight line or may be curved.
  • the lifting mechanism is configured to drive a plurality of wafer carriers to perform a lifting movement synchronously to perform a pick and place operation in cooperation with a robot capable of transmitting a plurality of wafers.
  • the pick and place operation includes a take-up process and a release process, wherein the take-up process is performed by the movement of the robot and the movement of the wafer carrier to transfer the wafer from the wafer carrier to the robot.
  • the placement process is coordinated by the movement of the robot and the movement of the wafer carrier to transfer the wafer from the robot to the wafer carrier.
  • the film transfer device provided by the present invention can be used in conjunction with a robot capable of transporting a plurality of wafers by providing a plurality of wafer carriers and driving a plurality of wafer carriers to perform a lifting motion using a lifting mechanism to realize simultaneous execution of a plurality of wafers.
  • the filming and taking operation can improve the wafer transfer efficiency and shorten the film transfer time, thereby increasing the equipment throughput.
  • the film transfer device provided by the embodiment of the present invention includes: two wafer carriers: a first wafer carrier 201 and a second wafer carrier 202; the lifting mechanism 500 is located at the first wafer carrier 201 and The two wafer carriers 202 are below and connected to the first wafer carrier 201 and the second wafer carrier 202, respectively, to drive the first wafer carrier 201 and the second wafer carrier 202 to move in synchronization.
  • each wafer carrier includes an annular bracket and a plurality of wafer tips 203, wherein the annular brackets are horizontally disposed; the lower end of each wafer top finger 203 is coupled to the annular bracket, and a plurality of wafer tops
  • the fingers 203 are spaced apart along the circumference of the annular carrier; the upper ends of the plurality of wafer tips 203 collectively serve as a carrier for carrying the wafer.
  • the carrying position refers to the position at which the wafer carrier is used to place the wafer.
  • the annular bracket is connected to the top finger 203 of the wafer by a plurality of square grooves on each annular bracket, and a mounting portion is disposed at a lower end of each of the wafer top fingers 203. Located in the square Inside and in the groove, and fixedly connected to the ring bracket by screws.
  • three or four wafer tips 203 can be placed on each wafer carrier and evenly distributed over the wafer carrier to achieve stable support of the wafer.
  • the robot can place the wafer on the wafer carrier only after the calibration is passed. Or remove the wafer from the wafer carrier; if the calibration fails, the horizontal position of the wafer needs to be adjusted by adjusting the horizontal position of the robot.
  • the two transfer fingers 601 of the robot are relatively fixed, that is, the two transfer fingers 601 can only move synchronously, so that one of the transfer films cannot be made.
  • the position of the other of the transfer fingers 601 is individually adjusted on the premise that the finger 601 is fixed.
  • the wafer carrier includes a carrier bit for carrying the wafer, which is the location at which the wafer carrier is used to place the wafer.
  • the heights of the carrying positions of the plurality of wafer carriers are sequentially lowered in the order of arrangement. In this way, the position in the horizontal direction of the wafer can be calibrated in order from high to low, and after each calibration, the wafer to be calibrated is subjected to the pick and place operation, that is, the driving robot or the wafer carrier is raised or lowered. The sheet is taken or released to a height corresponding to the wafer.
  • calibrating the position in the horizontal direction of the wafer refers to by translating the transfer finger 601 of the robot to enable the wafer on the transfer finger 601 to be centered with the carrier of the wafer carrier.
  • the height difference between the bearing positions of each adjacent two wafer carriers is 6-10 mm, for example 8 mm. Within this range, it is ensured that the position of the wafer that has been calibrated is not affected when the position of the next wafer is calibrated.
  • the above-mentioned carrying positions are formed by the respective wafer top fingers 203 on the same wafer carrier, and the top heights of the respective wafer top fingers 203 on the same wafer carrier are the same to jointly support the wafer.
  • the heights of the wafer top fingers on different wafer carriers are different and are sequentially lowered in the order of arrangement.
  • the lifting mechanism includes at least one lifting shaft, a drive source, and at least one connection assembly.
  • the lifting shaft is set vertically.
  • the driving source is used to drive at least one lifting shaft to synchronize the lifting movement.
  • Connection component The number corresponds to the number of lifting shafts for connecting the lifting shaft and the two wafer carriers adjacent thereto, that is, each lifting shaft corresponds to two wafers adjacent to the lifting shaft A bracket that is coupled to the two wafer carriers by a connection assembly.
  • the elevating mechanism includes a lifting shaft 501, a driving source 500, and a connection assembly.
  • the lifting shaft 501 is respectively connected to the first wafer carrier 201 and the second wafer carrier 202 through a connection assembly.
  • the connection assembly includes a mounting plate 502 and two connecting plates, the two connecting plates being a first connecting plate 204 and a second connecting plate 205, respectively, wherein the mounting plate 502 is horizontally disposed and corresponding to the connecting assembly
  • the lifting shaft 501 is connected.
  • the first connecting plate 204 and the second connecting plate 205 are stacked on the mounting plate 502, and respectively correspond to two wafer carriers corresponding to the lifting shaft 501, that is, the first wafer carrier 201 and the second wafer carrier 202 connection.
  • the first wafer carrier 201 and the second wafer carrier 202 are symmetrically disposed on both sides of the lifting shaft 501.
  • the connecting plate and the mounting plate may be screwed.
  • the relative position of the connecting plate and the mounting plate in the horizontal direction can be adjusted by improving the screw connection; and/or, the connecting plate is on the lifting shaft. Adjustment of the position in the circumferential direction.
  • the first threaded hole is disposed on the mounting plate 502 and corresponds to the first long slot on the first connecting plate 204 and the second connecting plate 205, respectively, that is, the vertical axis of the first long slot and the first thread The axes of the holes coincide.
  • the first connecting screw 901 is threadedly coupled to the first threaded hole through the first long slot.
  • the first connecting screw 901 can be translated along the first long slot, that is, the connecting plate is translated relative to the mounting plate, and after the relative position of the connecting plate and the mounting plate is determined, the first connecting screw 901 is tightened. Secure the connection plate to the mounting plate.
  • connection assembly further includes a second connection screw 902, a second long slot and a second threaded hole, wherein the second long slot is annular or circular And disposed on the mounting plate, and the horizontal axis of the second long slot is disposed along a circumferential direction of the lifting shaft 501 corresponding to the connecting assembly, that is, the horizontal axis of the second long slot is along the surrounding lifting shaft 501
  • the second threaded hole is disposed at a top end of the lifting shaft 501, and the second connecting screw 902 is threadedly coupled to the second threaded hole through the second long slot.
  • the lower end of the set screw 903 can be pushed to tilt the mounting plate 502, the different set screws 903 are rotated, and the tilt of the mounting plate 502
  • the orientation is also different, thereby achieving the adjustment of the level of the connecting plate, and indirectly realizing the adjustment of the level of the wafer carrier.
  • an embodiment of the present invention further provides a process chamber including a film transfer device, a plurality of process sub-cavities, and a connection sub-cavity. Wherein, a plurality of process sub-cavities are sequentially arranged in the horizontal direction.
  • the film transfer device adopts the above-mentioned film transfer device provided by the embodiment of the present invention, wherein a plurality of wafer carriers are disposed in a plurality of process sub-cavities in a one-to-one correspondence. Connecting subchambers in each phase Adjacent to the two process sub-cavities, and connected to the two.
  • the lifting mechanism comprises at least one lifting shaft and a driving source, wherein each lifting shaft is located below the connecting sub-cavity, and an upper end thereof vertically extends through the connecting sub-cavity and two communicating with the connecting sub-cavity Two wafer carriers are connected in the process sub-cavity, and the lower end of each lifting shaft is connected to the driving source; the driving source is used for driving at least one lifting shaft to perform the lifting movement.
  • the two process sub-cavities are respectively a first process sub-cavity 101 and a second process sub-cavity 102, and the connection sub-cavity 103 is disposed in the first process sub-cavity 101 and the second process sub-cavity 102.
  • the first wafer carrier 201 and the second wafer carrier 202 are respectively located in the first process sub-cavity 101 and the second process sub-cavity 102.
  • the position of the wafer carrier can be defined by means of the wafer carrier positioning pin 401.
  • the lower end of the wafer carrier positioning pin 401 is machined with an external thread and is threadedly coupled to the bottom wall 100 of the process sub-chamber.
  • a positioning hole 206 is disposed on the wafer carrier, and the upper end of the wafer carrier positioning pin 401 passes through the positioning block 206, thereby realizing the position of the wafer carrier.
  • the embodiment of the present invention provides a process chamber, which is provided with the above-mentioned film transfer device provided by the embodiment of the present invention, and is provided with a plurality of process sub-cavities arranged in a horizontal direction and between two adjacent process sub-chambers. And connecting the sub-cavities with the two, the robot can be matched with the film transfer device, and the wafers can be taken and discharged at the same time, thereby improving the wafer transfer efficiency, shortening the film transfer time, and thereby improving the equipment throughput. .
  • the robot includes two transfer fingers 601, a wrist mechanical arm 602, an elbow mechanical arm 603, and a driving device 604, wherein the driving device 604 can pass through the wrist mechanical arm 602.
  • the elbow robot 603 drives the two transfer fingers 601 to move synchronously in the vertical direction and the horizontal direction.
  • the two transfer fingers 601 are connected by a U-shaped connecting plate, and are sequentially arranged in the horizontal direction, and the directions of the two transfer fingers 601 are identical.
  • the present invention further provides a semiconductor device including a transfer chamber, the above-described process chamber provided by the embodiment of the present invention, and a robot provided by the embodiment of the present invention, wherein the robot is disposed in the transfer chamber, The wafer is transferred between the process chamber and the transfer chamber.
  • the semiconductor device provided by the embodiment of the present invention can realize the simultaneous wafer picking and discharging operation of a plurality of wafers by using the above-mentioned process chamber provided by the embodiment of the present invention and the above-mentioned manipulator provided by the embodiment of the present invention, thereby improving wafer transfer. Efficiency, shortening the transfer time, and thus increasing equipment capacity.
  • the present invention further provides a film transfer method, which is applied to the above-mentioned semiconductor device provided by the embodiment of the present invention to perform a pick and place operation on a wafer.
  • the pick and place operation includes a placing process and a taking process.
  • FIG. 1-3 the above-described releasing process and the taking process are described in detail by taking two wafer carriers as an example.
  • the releasing process includes the following steps:
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to rise synchronously to the transfer position.
  • the transfer position refers to the position at which the wafer is taken out or placed.
  • the driving device 604 drives the two transfer fingers 601 to synchronously transfer the first wafer and the second wafer into the first process sub-cavity 101 and the second process sub-cavity 102, respectively, and respectively placed on the first wafer carrier 201 and The top of the wafer carrier 202 of the second wafer carrier 202 is 203.
  • the driving device 604 drives the two transfer fingers 601 to exit the first process sub-cavity 101, respectively. And a second process sub-cavity 102.
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to descend to the process position.
  • the process bit refers to the location where the wafer is processed.
  • the filming process includes the following steps:
  • the driving device 604 synchronously drives the two transfer fingers 601 to move into the first process sub-cavity 101 and the second process sub-cavity 102 one by one, and is respectively located under the first wafer and the second wafer, and then drives two transfer films.
  • the finger 601 is raised and the first wafer and the second wafer are lifted, respectively.
  • the driving device 604 drives the two transfer fingers 601 to simultaneously exit the first process sub-cavity 101 and the second process sub-cavity 102.
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to descend to the process position.
  • the robot can place the wafer on the wafer carrier only after the calibration is passed, or The wafer is removed from the wafer carrier; if the calibration fails, the horizontal position of the wafer needs to be adjusted by adjusting the horizontal position of the robot.
  • the two transfer fingers 601 of the robot are relatively fixed, that is, the two transfer fingers 601 can only move synchronously, so that one of the transfer films cannot be made.
  • the position of the other of the transfer fingers 601 is individually adjusted on the premise that the finger 601 is fixed.
  • the wafer carrier includes a carrier bit for carrying the wafer, which is the location at which the wafer carrier is used to place the wafer.
  • the heights of the carrying positions of the plurality of wafer carriers are sequentially lowered in the order of arrangement. In this way, the position in the horizontal direction of the wafer can be calibrated in order from high to low, and after each calibration, the wafer to be calibrated is subjected to the pick and place operation, that is, the driving robot or the wafer carrier is raised or lowered.
  • the carrying height of the first wafer carrier 201 is higher than the carrying height of the second wafer carrier 202.
  • step S12 further includes the following sub-steps:
  • S122 firstly perform horizontal position calibration of the first wafer on the transfer finger 601 corresponding to the carrying position of the first wafer carrier 201, and then transfer the finger corresponding to the carrying position of the second wafer carrier 202. Position calibration of the second wafer on 601 in the horizontal direction. And, after the positional alignment in the horizontal direction of the first wafer, the driving device 604 drives the two transfer fingers 601 to synchronously descend the first height to place the first wafer on which the calibration is completed on the first wafer carrier 201. Similarly, after positional alignment in the horizontal direction of the second wafer, the driving device 604 drives the two transfer fingers 601 to simultaneously descend the second height to place the second wafer that has been calibrated on the second wafer carrier 202. on. It is easy to understand that the first height is greater than the second height, and the difference between the two is the same as the difference between the heights of the first wafer carrier 201 and the second wafer carrier 202.
  • Step S22 further includes the following sub-steps:
  • the driving device 604 synchronously drives the two transfer fingers 601 to move into the first process sub-cavity 101 and the second process sub-cavity 102 in a one-to-one correspondence.
  • the film transfer method provided by the embodiment of the present invention is applicable to the above-mentioned semiconductor device provided by the embodiment of the present invention, and can perform the picking and placing operation on a plurality of wafers at the same time, thereby improving the wafer transfer efficiency and shortening the film transfer time. Can increase equipment capacity.
  • the film transfer method provided by the embodiment of the present invention is applied to the semiconductor device provided by the embodiment of the present invention to perform a pick and place operation on the wafer.
  • the pick and place operation includes a placing process and a taking process.
  • FIG. 1-3 the above-described releasing process and the taking process are described in detail by taking two wafer carriers as an example.
  • the releasing process includes the following steps:
  • the driving device 604 drives the two transfer fingers 601 to synchronously transfer the first wafer and the second wafer into the first process sub-cavity 101 and the second process sub-cavity 102, and is respectively located in the first wafer carrier 201 and the second Above the wafer carrier 202.
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to synchronously rise to the transfer position, and respectively lift the first wafer and the second wafer on the two transfer fingers 601.
  • the driving device 604 drives the two transfer fingers 601 to exit the first process sub-cavity 101 and the second process sub-cavity 102, respectively.
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to rise synchronously to the transfer position.
  • the driving device 604 drives the two transfer fingers 601 into the first process sub-cavity 101 and the second process sub-cavity 102, respectively, and is located below the first wafer and the second wafer.
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to descend synchronously, so that the two transfer fingers 601 respectively lift the first wafer and the second wafer.
  • the driving device 604 drives the two transfer fingers 601 to exit the first process sub-cavity 101 and the second process sub-cavity 102, respectively.
  • the wafer carrier includes a carrying position for carrying the wafer, which is the position at which the wafer carrier is used to place the wafer.
  • the heights of the carrying positions of the plurality of wafer carriers are sequentially lowered in the order of arrangement. In this case, taking two wafer holders as an example, the carrying height of the first wafer carrier 201 is higher than the carrying height of the second wafer carrier 202.
  • step S32 further includes:
  • the elevating mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to simultaneously rise a fifth height to lift the second wafer that completes the calibration.
  • the elevating mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to simultaneously rise a sixth height to lift the first wafer that completes the calibration. It is easily understood that the fifth height is less than the sixth height, and the difference between the two is the same as the difference between the heights of the first wafer carrier 201 and the second wafer carrier 202.
  • Step S43 further includes:
  • the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to simultaneously descend a seventh height to correspond to the first wafer that has been calibrated.
  • the transfer finger 601 holds the wafer. Similar to the second crystal After the position of the second wafer on the carrying position of the sheet carrier 202 is aligned, the lifting mechanism drives the first wafer carrier 201 and the second wafer carrier 202 to simultaneously descend an eighth height to correspond to the second wafer that has been calibrated.
  • the transfer finger 601 holds the wafer. It is easily understood that the seventh height is greater than the eighth height, and the difference between the two is the same as the difference between the heights of the first wafer carrier 201 and the second wafer carrier 202.
  • the film transfer method provided by the embodiment of the present invention is applicable to the above-mentioned semiconductor device provided by the embodiment of the present invention, and can perform the picking and placing operation on a plurality of wafers at the same time, thereby improving the wafer transfer efficiency and shortening the film transfer time. Can increase equipment capacity.

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

提供一种传片装置、工艺腔室、机械手、半导体装置和传片方法。传片装置包括：多个晶片托架（201,202），沿水平方向依次排列；升降机构（500），用于驱动多个晶片托架同步作升降运动，以与能够传输多个晶片的机械手（600）相配合进行取放片操作。传片装置通过设置多个晶片托架，并使用升降机构驱动多个晶片托架同步作升降运动，可以与能够传输多个晶片的机械手配合使用，实现多个晶片同时进行放片和取片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。

Description

传片装置、工艺腔室、机械手、半导体装置和传片方法 技术领域
本发明涉及半导体设备制造领域，具体涉及一种传片装置、工艺腔室、机械手、半导体装置和传片方法。
背景技术
随着集成电路市场的高速发展，芯片产能扩大的需求一方面给设备商带来了新的市场机遇，另一方面也对设备商现有及前瞻性的技术能力提出了更高的要求。设备产能指设备单位工作时间内良品的产出数，它是反映设备加工能力的一个重要技术参数。集成电路制造中使用的去气设备和退火设备在执行相应的工艺过程前，需要利用机械手与工艺腔室的升降机构配合完成晶片的传递。如何通过缩短传片时间、减少非工艺过程时间来提高设备产能，已经成为设备商亟需解决的一大难题。
现有的工艺腔室为单腔结构，且在该工艺腔室内设置有晶片托架和用于驱动该晶片托架作升降运动的升降机构。而且，工艺腔室与TM传输腔室连接，在该传输腔室内设置有机械手，用以在工艺腔室与传输腔室之间传递晶片，并将晶片放置在工艺腔室内的加热器上。
现有的工艺腔室在实际应用中不可避免地存在以下问题，即：由于晶片托架配合机械手每次只能对一个晶片进行取放片操作，传片效率较低，从而导致非工艺过程长，影响设备产能。
发明内容
本发明针对现有技术中存在的上述不足，提供一种传片装置、工艺腔室、机械手、半导体装置和传片方法，用以解决晶片传递效率低的问题。
本发明为解决上述技术问题，采用如下技术方案：
本发明提供一种传片装置，包括：
多个晶片托架，沿水平方向依次排列；
升降机构，用于驱动所述多个晶片托架同步作升降运动，以与能够传输多个晶片的机械手相配合进行取放片操作。
优选的，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低。
优选的，各个相邻的两个所述晶片托架的所述承载位之间的高度差为6-10mm。
优选的，所述升降机构包括：
至少一个竖直设置的升降轴；
驱动源，用于驱动所述至少一个升降轴同步作升降运动；
至少一个连接组件，所述连接组件的数量与所述升降轴的数量相对应，所述连接组件用于将所述升降轴和与之相邻的两个晶片托架连接在一起。
优选的，每个所述连接组件包括安装板和两个连接板，其中，
所述安装板水平设置，并和与该连接组件相对应的所述升降轴连接；
所述两个连接板叠置在所述安装板上，且分别和与该升降轴相对应的所述两个晶片托架连接。
优选的，所述连接组件还包括第一长槽孔、第一螺纹孔和第一连接螺钉，其中，
所述第一长槽孔设置在每个所述连接板上；
所述第一螺纹孔设置在所述安装板上，且与所述第一长槽孔相对应；
所述第一连接螺钉穿过所述第一长槽孔与所述第一螺纹孔螺纹连接。
优选的，所述连接组件还包括第二长槽孔、第二螺纹孔和第二连接螺钉，其中，
所述第二长槽孔设置在所述安装板上，且其水平轴线方向沿与该连接组件相对应的所述升降轴的圆周方向设置；
所述第二螺纹孔设置在所述升降轴的顶端；
所述第二连接螺钉穿过所述第二长槽孔与所述第二螺纹孔螺纹连接。
优选的，所述连接组件还包括多个第三螺纹孔和多个紧定螺钉，其中，
多个所述第三螺纹孔设置在每个所述连接板上；
多个所述紧定螺钉一一对应地与多个所述第三螺纹孔螺纹连接，且每个紧定螺钉的下端与所述安装板的上表面相接触；
通过调节至少一个所述紧定螺钉与所述第三螺纹孔在其轴向上的相对位置，来调节所述连接板的水平度。
优选的，每个所述晶片托架包括环形托架和多个晶片顶指，其中，
所述环形托架水平设置；
每个所述晶片顶指的下端与所述环形托架连接，且多个所述晶片顶指沿所述环形托架的周向间隔设置；多个所述晶片顶指的上端共同用作承载晶片的承载位。
作为另一个技术方案，本发明还提供一种工艺腔室，包括：
本发明提供的上述传片装置；
沿水平方向依次排列多个工艺子腔，所述多个晶片托架一一对应地设置在所述多个工艺子腔内；
位于各个相邻的两个所述工艺子腔之间，且与二者相连通的连接子腔。
优选的，所述升降机构包括至少一个升降轴和驱动源，其中，
每个所述升降轴位于所述连接子腔的下方，且其上端竖直向上贯穿所述连接子腔，并与和该连接子腔连通的两个所述工艺子腔内的两个所述晶片托架连接，每个所述升降轴的下端与所述驱动源连接；
所述驱动源用于驱动所述至少一个升降轴同步作升降运动。
作为另一个技术方案，本发明还提供一种机械手，包括：
多个用于传输晶片的传片手指，沿水平方向依次排列；
驱动装置，用于驱动多个所述传片手指同步移动，以与本发明提供的上述传片装置相配合进行取放片操作。
作为另一个技术方案，本发明还提供一种半导体装置，包括传输腔室、本发明提供的上述工艺腔室和本发明提供的上述机械手，所述机械手设置在所述传输腔室内，用以在所述工艺腔室与所述传输腔室之间传输晶片。
作为另一个技术方案，本发明还提供一种传片方法，应用于本发明提供的上述半导体装置中，对晶片进行取放片操作；所述取放片操作包括放片过程和取片过程，其中，
所述放片过程包括以下步骤：
S11：所述升降机构驱动多个所述晶片托架同步上升至传片位；
S12：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内，并放置在各个所述晶片托架上；
S13：所述驱动装置驱动各个所述传片手指退出各个所述工艺子腔；
S14：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
所述取片过程包括以下步骤：
S21：所述升降机构驱动多个所述晶片托架同步上升至传片位；
S22：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内，并分别位于置于各个所述晶片托架上的晶片下方，然后驱动各个所述传片手指上升，并托起各个晶片；
S23：所述驱动装置驱动各个所述传片手指同步退出各个所述工艺子腔；
S24：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
优选的，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低；
所述步骤S12进一步包括以下子步骤：
S121：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内；
S122：按所述承载位由高到低的排列顺序依次对与各个承载位相对应的各个所述传片手指上的晶片进行水平方向的位置校准，并在每次校准之后，所述驱动装置驱动各个所述传片手指同步下降相应的高度，以将完成校准的晶片放置在与该晶片所在传片手指相对应的所述晶片托架上；
所述步骤S22进一步包括以下子步骤：
S221：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内；
S222：按所述承载位由低到高的排列顺序依次对其上的晶片进行水平方向的位置校准，并在每次校准之后，所述驱动装置驱动各个所述传片手指同步上升相应的高度，以将完成校准的晶片自与该晶片所在的所述晶片托架上托起。
作为另一个技术方案，本发明还提供一种传片方法，应用于本发明提供的上述半导体装置中，对晶片进行取放片操作；所述取放片操作包括放片过程和取片过程，其中，
所述放片过程包括以下步骤：
S31：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内，并分别位于各个所述晶片托架的上方；
S32：所述升降机构驱动多个所述晶片托架同步上升至传片位，并一一对应地托起各个所述传片手指上的晶片；
S33：所述驱动装置驱动各个所述传片手指退出各个所述工艺子腔；
S34：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
所述取片过程包括以下步骤：
S41：所述升降机构驱动多个所述晶片托架同步上升至传片位；
S42：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内，并位于置于各个所述晶片托架上的晶片下方；
S43：所述升降机构驱动各个所述晶片托架同步下降，以使各个传片手指分别托起各个晶片；
S44：所述驱动装置驱动各个所述传片手指同步退出各个所述工艺子腔。
优选的，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低；
所述步骤S32进一步包括：
按所述承载位由低到高的排列顺序依次对晶片进行水平方向的位置校准，并在每次校准之后，所述升降机构驱动多个所述晶片托架同步上升相应的高度，以托起完成校准的晶片；
所述步骤S43进一步包括：
按所述承载位由高到低的排列顺序依次对其上的晶片进行水平方向的位置校准，并在每次校准之后，所述升降机构驱动各个所述晶片托架同步下降相应的高度，以使与完成校准的晶片相对应的传片手指托起该晶片。
本发明提供的传片装置，其通过设置多个晶片托架，并使用升降机构驱动多个晶片托架同步作升降运动，可以与能够传输多个晶片的机械手配合使用，实现多个晶片同时进行放片和取片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
本发明提供的工艺腔室，其通过设置本发明提供的上述传片装置，并设置沿水平方向依次排列的多个工艺子腔以及位于各个相邻的两个工艺子腔之间，且与二者相连通的连接子腔，可以使机械手与传片装置相配合，同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
本发明提供的机械手，其通过设置多个传片手指，可以与本发明提供的上述传片装置相配合同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
本发明提供的半导体装置，其通过采用本发明提供的上述工艺腔室和本发明提供的上述机械手，可以实现同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
本发明提供的传片方法，其应用于本发明提供的上述半导体装置中，可以实现同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
附图说明
图1为本发明实施例提供的传片装置的剖视图；
图2为本发明实施例提供的传片装置中升降机构与晶片托架的立体图；
图3为本发明实施例中机械手的立体图。
图例说明：
100、工艺腔室 101、第一工艺子腔 102、第二工艺子腔
103、连接子腔 104、底壁
201、第一晶片托架 202、第二晶片托架 203、晶片顶指
204、第一连接板 205、第二连接板 206、定位孔
500、驱动源 501、升降轴 401、晶片托架定位销
502、安装板 600、机械手 601、传片手指
602、腕机械臂 603、肘机械臂 604、驱动装置
具体实施方式
下面将结合本发明中的附图，对本发明中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施 例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提供一种传片装置，其包括多个晶片托架和升降机构，其中，多个晶片托架沿水平方向依次排列，其排列形状可以呈直线或者也可以呈曲线。升降机构用于驱动多个晶片托架同步作升降运动，以与能够传输多个晶片的机械手相配合进行取放片操作。这里，取放片操作包括取片过程和放片过程，其中，取片过程是通过机械手的运动和晶片托架的运动相配合，以将晶片自晶片托架传递至机械手上。放片过程是通过机械手的运动和晶片托架的运动相配合，以将晶片自机械手传递至晶片托架上。
本发明提供的传片装置，其通过设置多个晶片托架，并使用升降机构驱动多个晶片托架同步作升降运动，可以与能够传输多个晶片的机械手配合使用，实现多个晶片同时进行放片和取片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
以下结合图1至图3，对本发明提供的传片装置的具体实施方式进行详细说明。具体地，本发明实施例提供的传片装置，包括：两个晶片托架，分别为：第一晶片托架201和第二晶片托架202；升降机构500位于第一晶片托架201和第二晶片托架202的下方，且分别与第一晶片托架201和第二晶片托架202相连，以驱动第一晶片托架201和第二晶片托架202同步作升降运动。
如图2所示，每个晶片托架包括环形托架和多个晶片顶指203，其中，环形托架水平设置；每个晶片顶指203的下端与环形托架连接，且多个晶片顶指203沿该环形托架的周向间隔设置；多个晶片顶指203的上端共同用作承载晶片的承载位。承载位是指晶片托架用于放置晶片的位置。进一步的，环形托架与晶片顶指203的连接方式具体为：在每个环形托架上设置有多个方形凹槽，且在每个晶片顶指203的下端设置有安装部，该安装部位于方形 凹槽内，且与之相配合，并通过螺钉与环形托架固定连接。
优选的，每个晶片托架上可以设置三个或四个晶片顶指203，且在晶片托架上均匀分布，以实现对晶片的稳定支撑。
另外，由于在进行取片和放片的过程中，通常需要利用自动校准器(AWC)对晶片水平方向上的位置进行校准，只有在校准通过后，机械手才能够将晶片放置在晶片托架上，或者自晶片托架取出晶片；若校准未通过，则需要通过调节机械手的水平位置来调整晶片的水平位置。而对于能够传输多个晶片的机械手来说，如图3所示，机械手的两个传片手指601相对固定，即，两个传片手指601只能同步移动，因此无法在使其中一个传片手指601固定不动的前提下，单独对其中另一个传片手指601的位置进行调整。在这种情况下，晶片托架包括用于承载晶片的承载位，该承载位即为晶片托架用于放置晶片的位置。多个晶片托架的承载位的高度按排列顺序依次降低。这样，可以按由高到低的顺序依次对晶片水平方向上的位置进行校准，并在每次校准之后，将完成校准的晶片进行取放片操作，即，驱动机械手或者晶片托架上升或下降至与该晶片相对应的高度进行取片或放片。容易理解，对晶片水平方向上的位置进行校准，是指通过平移机械手的传片手指601，以使该传片手指601上的晶片能够和晶片托架的承载位对中。
优选的，各个相邻的两个晶片托架的承载位之间的高度差为6-10mm，例如8mm。在该范围内，可以确保在校准下一个晶片的位置时，不会对已完成校准的晶片的位置产生影响。
需要说明的是，上述承载位即由同一晶片托架上的各个晶片顶指203构成，且同一晶片托架上的各个晶片顶指203的顶端高度相同，以共同支撑晶片。而不同的晶片托架上的晶片顶指的高度不同，且按排列顺序依次降低。
升降机构包括至少一个升降轴、驱动源和至少一个连接组件。其中，升降轴竖直设置。驱动源用于驱动至少一个升降轴同步作升降运动。连接组件 的数量与升降轴的数量相对应，该连接组件用于将升降轴和与之相邻的两个晶片托架连接在一起，即，每一个升降轴对应与该升降轴相邻的两个晶片托架，该升降轴通过一个连接组件与这两个晶片托架连接。
下面以晶片托架为两个为例，对升降机构的具体结构进行详细描述。具体地，如图2所示，升降机构包括一个升降轴501、驱动源500和连接组件。其中，升降轴501通过连接组件分别与第一晶片托架201和第二晶片托架202连接。具体地，连接组件包括安装板502和两个连接板，两个连接板分别为第一连接板204和第二连接板205，其中，安装板502水平设置，并和与该连接组件相对应的升降轴501连接。第一连接板204和第二连接板205叠置在安装板502上，且分别和与该升降轴501相对应的两个晶片托架，即，第一晶片托架201和第二晶片托架202连接。优选的，第一晶片托架201和第二晶片托架202对称设置在升降轴501的两侧。
优选的，为了便于拆卸，上述连接板和安装板可以采用螺纹连接。而且，为了配合不同型号的工艺腔室和机械手使用，可以通过改进螺纹连接的方式实现对连接板和安装板在水平方向上的相对位置的调节；和/或，实现对连接板在升降轴的圆周方向上的位置的调节。
具体的，如图2所示，连接组件还包括：第一连接螺钉901、第一长槽孔(图中未绘示)和第一螺纹孔(图中未绘示)。其中，第一长槽孔分别设置在第一连接板204和第二连接板205上，优选的，第一长槽孔的水平轴线方向沿第一晶片托架201和第二晶片托架202的中心连线的方向设置，以在调节连接板的水平位置时，保证第一晶片托架201和第二晶片托架202仍然保持相对设置在升降轴501的两侧。第一螺纹孔设置在安装板502上，且分别与第一连接板204和第二连接板205上的第一长槽孔相对应，即，第一长槽孔的竖直轴线与第一螺纹孔的轴线重合。第一连接螺钉901穿过第一长槽孔与第一螺纹孔螺纹连接。在需要调节连接板的水平位置时，旋松第一连接螺 钉901，此时第一连接螺钉901可以沿第一长槽孔平移，即连接板相对于安装板平移，当连接板和安装板的相对位置确定之后，旋紧第一连接螺钉901，即可将连接板和安装板固定连接。
为了方便固定第一晶片托架201和第二晶片托架202，连接组件还包括第二连接螺钉902、第二长槽孔和第二螺纹孔，其中，第二长槽孔呈圆环状或圆弧状，且设置在安装板上，并且第二长槽孔的水平轴线沿与该连接组件相对应的升降轴501的圆周方向设置，即，第二长槽孔的水平轴线沿环绕升降轴501的方向设置，第二螺纹孔设置在升降轴501的顶端，第二连接螺钉902穿过第二长槽孔与第二螺纹孔螺纹连接。在需要调节连接板在升降轴501的圆周方向上的位置时，旋松第二连接螺钉902，此时第二连接螺钉902可以沿第二长槽孔平移一定角度，即连接板相对于安装板平移一定角度，当连接板和安装板的相对位置确定之后，旋紧第二连接螺钉902，即可将连接板和安装板固定连接。
为了使晶片在传递过程中保持平稳，要保证晶片托架的水平度，连接组件还包括多个紧定螺钉903和分别设置在第一连接件204和第二连接件205上的多个第三螺纹孔(图中未绘示)，多个紧定螺钉903一一对应地与多个第三螺纹孔螺纹连接，且紧定螺钉903的下端与安装板502的上表面相接触。通过调节至少一个紧定螺钉903与第三螺纹孔在其轴向上的相对位置，可以使紧定螺钉903的下端推动安装板502倾斜，旋动不同的紧定螺钉903，安装板502的倾斜方向也不同，从而实现对连接板的水平度的调节，间接实现对晶片托架的水平度进行调节。
作为另一个技术方案，如图1所示，本发明实施例还提供一种工艺腔室，该工艺腔室包括传片装置、多个工艺子腔和连接子腔。其中，多个工艺子腔沿水平方向依次排列。传片装置采用本发明实施例提供的上述传片装置，其中，多个晶片托架一一对应地设置在多个工艺子腔内。连接子腔位于各个相 邻的两个工艺子腔之间，且与二者相连通。
可选的，升降机构包括至少一个升降轴和驱动源，其中，每个升降轴位于连接子腔的下方，且其上端竖直向上贯穿连接子腔，并与和该连接子腔连通的两个工艺子腔内的两个晶片托架连接，每个升降轴的下端与驱动源连接；驱动源用于驱动至少一个升降轴同步作升降运动。
以工艺子腔为两个为例，两个工艺子腔分别为第一工艺子腔101和第二工艺子腔102，连接子腔103设置在第一工艺子腔101和第二工艺子腔102之间，且分别与二者相连通，第一晶片托架201和第二晶片托架202分别位于第一工艺子腔101和第二工艺子腔102内。
升降轴501位于连接子腔103的下方，且升降轴501的上端竖直向上贯穿连接子腔103，并通过位于连接子腔103中的上述连接组件与第一晶片托架201和第二晶片托架202连接。升降轴501的下端与驱动源500连接。
优选的，在非使用状态下，可以借助晶片托架定位销401限定晶片托架的位置。具体地，晶片托架定位销401的下端加工有外螺纹，并与工艺子腔的底壁100螺纹连接。同时，在晶片托架上设置有定位孔206，晶片托架定位销401的上端穿过该定位块206，从而实现对晶片托架位置的限定。
本发明实施例提供的工艺腔室，其通过设置本发明实施例提供的上述传片装置，并设置沿水平方向依次排列的多个工艺子腔以及位于各个相邻的两个工艺子腔之间，且与二者相连通的连接子腔，可以使机械手与传片装置相配合，同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
作为另一个技术方案，本发明还提供一种机械手，其包括多个用于传输晶片的传片手指以及驱动装置。其中，多个传片手指沿水平方向依次排列。驱动装置用于驱动多个传片手指同步移动，以与本发明实施例体提供的上述传片装置相配合进行取放片操作。
以传片手指为两个为例，如图3所示，机械手包括两个传片手指601、腕机械臂602、肘机械臂603和驱动装置604，其中，驱动装置604可以通过腕机械臂602和肘机械臂603带动两个传片手指601在竖直方向和水平方向上同步运动。在本实施例中，两个传片手指601通过U型的连接板连接，且在水平方向上依次排列，并且两个传片手指601的方向一致。
本发明实施例提供的机械手，其通过设置多个传片手指，可以与本发明实施例提供的上述传片装置相配合同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
作为另一个技术方案，本发明还提供一种半导体装置，其包括传输腔室、本发明实施例提供的上述工艺腔室和本发明实施例提供的机械手，其中，机械手设置在传输腔室内，用以在工艺腔室与传输腔室之间传输晶片。
本发明实施例提供的半导体装置，其通过采用本发明实施例提供的上述工艺腔室和本发明实施例提供的上述机械手，可以实现同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
作为另一个技术方案，本发明还提供一种传片方法，其应用于本发明实施例提供的上述半导体装置中，对晶片进行取放片操作。该取放片操作包括放片过程和取片过程。结合图1-3所示，以两个晶片托架为例，对上述放片过程和取片过程进行详细描述。具体地，放片过程包括以下步骤：
S11：升降机构驱动第一晶片托架201和第二晶片托架202同步上升至传片位。该传片位是指取出或放置晶片的位置。
S12：驱动装置604驱动两个传片手指601同步将第一晶片和第二晶片分别传递至第一工艺子腔101和第二工艺子腔102内，并分别放置在第一晶片托架201和第二晶片托架202的晶片顶指203上。
S13：驱动装置604驱动两个传片手指601分别退出第一工艺子腔101 和第二工艺子腔102。
S14：升降机构驱动第一晶片托架201和第二晶片托架202同步下降至工艺位。工艺位是指对晶片进行工艺的位置。
取片过程包括以下步骤：
S21：升降机构驱动承载有第一晶片的第一晶片托架201和承载有第二晶片的第二晶片托架202同步上升至传片位。
S22：驱动装置604同步驱动两个传片手指601一一对应地移入第一工艺子腔101和第二工艺子腔102，并分别位于第一晶片和第二晶片下方，然后驱动两个传片手指601上升，并分别托起第一晶片和第二晶片。
S23：驱动装置604驱动两个传片手指601同步退出第一工艺子腔101和第二工艺子腔102。
S24：升降机构驱动第一晶片托架201和第二晶片托架202同步下降至工艺位。
由于在进行取片和放片的过程中，通常需要利用自动校准器(AWC)对晶片水平方向上的位置进行校准，只有在校准通过后，机械手才能够将晶片放置在晶片托架上，或者自晶片托架取出晶片；若校准未通过，则需要通过调节机械手的水平位置来调整晶片的水平位置。而对于能够传输多个晶片的机械手来说，如图3所示，机械手的两个传片手指601相对固定，即，两个传片手指601只能同步移动，因此无法在使其中一个传片手指601固定不动的前提下，单独对其中另一个传片手指601的位置进行调整。在这种情况下，晶片托架包括用于承载晶片的承载位，该承载位即为晶片托架用于放置晶片的位置。多个晶片托架的承载位的高度按排列顺序依次降低。这样，可以按由高到低的顺序依次对晶片水平方向上的位置进行校准，并在每次校准之后，将完成校准的晶片进行取放片操作，即，驱动机械手或者晶片托架上升或下降至与该晶片相对应的高度进行取片或放片，容易理解，对晶片水平方向上 的位置进行校准，是指通过平移机械手的传片手指601，以使该传片手指601上的晶片能够和晶片托架的承载位对中。
在这种情况下，以两个晶片支架为例，第一晶片托架201的承载位高度高于第二晶片托架202的承载位高度。
上述步骤S12进一步包括以下子步骤：
S121：驱动装置604驱动两个传片手指601同步将第一晶片和第二晶片分别传输至第一工艺子腔101和第二工艺子腔102内。
S122：先将与第一晶片托架201的承载位相对应的传片手指601上的第一晶片的进行水平方向的位置校准，后将与第二晶片托架202的承载位相对应的传片手指601上的第二晶片的进行水平方向的位置校准。并且，在第一晶片水平方向上的位置校准之后，驱动装置604驱动两个传片手指601同步下降第一高度，以将完成校准的第一晶片放置在第一晶片托架201上。与之相类似的，在第二晶片水平方向上的位置校准之后，驱动装置604驱动两个传片手指601同步下降第二高度，以将完成校准的第二晶片放置在第二晶片托架202上。容易理解，上述第一高度大于第二高度，且二者的差值与第一晶片托架201和第二晶片托架202的承载位之间的高度差相同。
步骤S22进一步包括以下子步骤：
S221：驱动装置604同步驱动两个传片手指601一一对应地移入第一工艺子腔101和第二工艺子腔102内。
S222：先将第二晶片托架202的承载位上的第二晶片进行水平方向的位置校准，后将第一晶片托架201的承载位上的第一晶片进行水平方向的位置校准。并且，在第二晶片的位置校准之后，驱动装置604驱动两个传片手指604同步上升第三高度，以将完成校准的第二晶片自第二晶片托架202上托起。与之相类似的，在第一晶片的位置校准之后，驱动装置604驱动两个传片手指604同步上升第四高度，以将完成校准的第一晶片自第一晶片托架201 上托起。容易理解，上述第三高度小于第四高度，且二者的差值与第一晶片托架201和第二晶片托架202的承载位之间的高度差相同。
本发明实施例提供的传片方法，其应用于本发明实施例提供的上述半导体装置中，可以实现同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
作为另一个技术方案，本发明还提供一种传片方法，该方法与上述传片方法相比，其区别在于：上述传片方法是通过机械手的升降来完成晶片的传递，而本发明实施例提供的传片方法是通过晶片托架的升降来完成晶片的传递。
具体地，本发明实施例提供的传片方法，其应用于本发明实施例提供的上述半导体装置中，对晶片进行取放片操作。该取放片操作包括放片过程和取片过程。结合图1-3所示，以两个晶片托架为例，对上述放片过程和取片过程进行详细描述。具体地，放片过程包括以下步骤：
S31：驱动装置604驱动两个传片手指601同步将第一晶片和第二晶片传递至第一工艺子腔101和第二工艺子腔102内，并分别位于第一晶片托架201和第二晶片托架202的上方。
S32：升降机构驱动第一晶片托架201和第二晶片托架202同步上升至传片位，并分别托起两个传片手指601上的第一晶片和第二晶片。
S33：驱动装置604驱动两个传片手指601分别退出第一工艺子腔101和第二工艺子腔102。
S34：升降机构驱动第一晶片托架201和第二晶片托架202下降至工艺位。
取片过程包括以下步骤：
S41：升降机构驱动第一晶片托架201和第二晶片托架202同步上升至传片位。
S42：驱动装置604驱动两个传片手指601分别移入第一工艺子腔101和第二工艺子腔102内，并位于第一晶片和第二晶片的下方。
S43：升降机构驱动第一晶片托架201和第二晶片托架202同步下降，以使两个传片手指601分别托起第一晶片和第二晶片。
S44：驱动装置604驱动两个传片手指601分别退出第一工艺子腔101和第二工艺子腔102。
基于与上述传片方法相同的理由，晶片托架包括用于承载晶片的承载位，该承载位即为晶片托架用于放置晶片的位置。多个晶片托架的承载位的高度按排列顺序依次降低。在这种情况下，以两个晶片支架为例，第一晶片托架201的承载位高度高于第二晶片托架202的承载位高度。
上述步骤S32进一步包括：
先将第二晶片托架202的承载位上的第一晶片进行水平方向的位置校准，后将第一晶片托架201的承载位上的第二晶片进行水平方向的位置校准。并且，在第二晶片的位置校准之后，升降机构驱动第一晶片托架201和第二晶片托架202同步上升第五高度，以托起完成校准的第二晶片。与之相类似的，在第一晶片的位置校准之后，升降机构驱动第一晶片托架201和第二晶片托架202同步上升第六高度，以托起完成校准的第一晶片。容易理解，上述第五高度小于第六高度，且二者的差值与第一晶片托架201和第二晶片托架202的承载位之间的高度差相同。
步骤S43进一步包括：
先将第一晶片托架201的承载位上的第一晶片进行水平方向的位置校准，后将第二晶片托架202的承载位上的第二晶片进行水平方向的位置校准，并在第一晶片托架201的承载位上的第一晶片的位置校准之后，升降机构驱动第一晶片托架201和第二晶片托架202同步下降第七高度，以使与完成校准的第一晶片相对应的传片手指601托起该晶片。与之相类似的，在第二晶 片托架202的承载位上的第二晶片的位置校准之后，升降机构驱动第一晶片托架201和第二晶片托架202同步下降第八高度，以使与完成校准的第二晶片相对应的传片手指601托起该晶片。容易理解，上述第七高度大于第八高度，且二者的差值与第一晶片托架201和第二晶片托架202的承载位之间的高度差相同。
本发明实施例提供的传片方法，其应用于本发明实施例提供的上述半导体装置中，可以实现同时对多个晶片进行取放片操作，从而可以提高晶片传递效率，缩短传片时间，进而可以提高设备产能。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (17)

  1. 一种传片装置，其特征在于，包括：
    多个晶片托架，沿水平方向依次排列；
    升降机构，用于驱动所述多个晶片托架同步作升降运动，以与能够传输多个晶片的机械手相配合进行取放片操作。
  2. 如权利要求1所述的传片装置，其特征在于，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低。
  3. 如权利要求2所述的传片装置，其特征在于，各个相邻的两个所述晶片托架的所述承载位之间的高度差为6-10mm。
  4. 如权利要求1-3任意一项所述的传片装置，其特征在于，所述升降机构包括：
    至少一个竖直设置的升降轴；
    驱动源，用于驱动所述至少一个升降轴同步作升降运动；
    至少一个连接组件，所述连接组件的数量与所述升降轴的数量相对应，所述连接组件用于将所述升降轴和与之相邻的两个晶片托架连接在一起。
  5. 如权利要求4所述的传片装置，其特征在于，每个所述连接组件包括安装板和两个连接板，其中，
    所述安装板水平设置，并和与该连接组件相对应的所述升降轴连接；
    所述两个连接板叠置在所述安装板上，且分别和与该升降轴相对应的所述两个晶片托架连接。
  6. 如权利要求5所述的传片装置，其特征在于，所述连接组件还包括第一长槽孔、第一螺纹孔和第一连接螺钉，其中，
    所述第一长槽孔设置在每个所述连接板上；
    所述第一螺纹孔设置在所述安装板上，且与所述第一长槽孔相对应；
    所述第一连接螺钉穿过所述第一长槽孔与所述第一螺纹孔螺纹连接。
  7. 如权利要求5所述的传片装置，其特征在于，所述连接组件还包括第二长槽孔、第二螺纹孔和第二连接螺钉，其中，
    所述第二长槽孔设置在所述安装板上，且其水平轴线方向沿与该连接组件相对应的所述升降轴的圆周方向设置；
    所述第二螺纹孔设置在所述升降轴的顶端；
    所述第二连接螺钉穿过所述第二长槽孔与所述第二螺纹孔螺纹连接。
  8. 如权利要求5所述的传片装置，其特征在于，所述连接组件还包括多个第三螺纹孔和多个紧定螺钉，其中，
    多个所述第三螺纹孔设置在每个所述连接板上；
    多个所述紧定螺钉一一对应地与多个所述第三螺纹孔螺纹连接，且每个紧定螺钉的下端与所述安装板的上表面相接触；
    通过调节至少一个所述紧定螺钉与所述第三螺纹孔在其轴向上的相对位置，来调节所述连接板的水平度。
  9. 如权利要求1-3任意一项所述的传片装置，其特征在于，每个所述晶片托架包括环形托架和多个晶片顶指，其中，
    所述环形托架水平设置；
    每个所述晶片顶指的下端与所述环形托架连接，且多个所述晶片顶指沿所述环形托架的周向间隔设置；多个所述晶片顶指的上端共同用作承载晶片的承载位。
  10. 一种工艺腔室，其特征在于，包括：
    如权利要求1-9任意一项所述的传片装置；
    沿水平方向依次排列多个工艺子腔，所述多个晶片托架一一对应地设置在所述多个工艺子腔内；
    位于各个相邻的两个所述工艺子腔之间，且与二者相连通的连接子腔。
  11. 如权利要求10所述的工艺腔室，其特征在于，所述升降机构包括至少一个升降轴和驱动源，其中，
    每个所述升降轴位于所述连接子腔的下方，且其上端竖直向上贯穿所述连接子腔，并与和该连接子腔连通的两个所述工艺子腔内的两个所述晶片托架连接，每个所述升降轴的下端与所述驱动源连接；
    所述驱动源用于驱动所述至少一个升降轴同步作升降运动。
  12. 一种机械手，其特征在于，包括：
    多个用于传输晶片的传片手指，沿水平方向依次排列；
    驱动装置，用于驱动多个所述传片手指同步移动，以与如权利要求1-9任意一项所述的传片装置相配合进行取放片操作。
  13. 一种半导体装置，其特征在于，包括传输腔室、如权利要求10或11所述的工艺腔室和如权利要求12所述的机械手，所述机械手设置在所述传输腔室内，用以在所述工艺腔室与所述传输腔室之间传输晶片。
  14. 一种传片方法，其特征在于，应用于如权利要求13所述的半导体装置中，对晶片进行取放片操作；所述取放片操作包括放片过程和取片过程，其中，
    所述放片过程包括以下步骤：
    S11：所述升降机构驱动多个所述晶片托架同步上升至传片位；
    S12：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内，并放置在各个所述晶片托架上；
    S13：所述驱动装置驱动各个所述传片手指退出各个所述工艺子腔；
    S14：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
    所述取片过程包括以下步骤：
    S21：所述升降机构驱动多个所述晶片托架同步上升至传片位；
    S22：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内，并分别位于置于各个所述晶片托架上的晶片下方，然后驱动各个所述传片手指上升，并托起各个晶片；
    S23：所述驱动装置驱动各个所述传片手指同步退出各个所述工艺子腔；
    S24：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
  15. 如权利要求14所述的传片方法，其特征在于，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低；
    所述步骤S12进一步包括以下子步骤：
    S121：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内；
    S122：按所述承载位由高到低的排列顺序依次对与各个承载位相对应的各个所述传片手指上的晶片进行水平方向的位置校准，并在每次校准之后，所述驱动装置驱动各个所述传片手指同步下降相应的高度，以将完成校准的晶片放置在与该晶片所在传片手指相对应的所述晶片托架上；
    所述步骤S22进一步包括以下子步骤：
    S221：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内；
    S222：按所述承载位由低到高的排列顺序依次对其上的晶片进行水平方向的位置校准，并在每次校准之后，所述驱动装置驱动各个所述传片手指同步上升相应的高度，以将完成校准的晶片自与该晶片所在的所述晶片托架上托起。
  16. 一种传片方法，其特征在于，应用于如权利要求13所述的半导体装置中，对晶片进行取放片操作；所述取放片操作包括放片过程和取片过程，其中，
    所述放片过程包括以下步骤：
    S31：所述驱动装置驱动多个所述传片手指同步将各个晶片一一对应地传输至各个所述工艺子腔内，并分别位于各个所述晶片托架的上方；
    S32：所述升降机构驱动多个所述晶片托架同步上升至传片位，并一一对应地托起各个所述传片手指上的晶片；
    S33：所述驱动装置驱动各个所述传片手指退出各个所述工艺子腔；
    S34：所述升降机构驱动多个所述晶片托架同步下降至工艺位。
    所述取片过程包括以下步骤：
    S41：所述升降机构驱动多个所述晶片托架同步上升至传片位；
    S42：所述驱动装置同步驱动各个所述传片手指一一对应地移入各个所述工艺子腔内，并位于置于各个所述晶片托架上的晶片下方；
    S43：所述升降机构驱动各个所述晶片托架同步下降，以使各个传片手指分别托起各个晶片；
    S44：所述驱动装置驱动各个所述传片手指同步退出各个所述工艺子腔。
  17. 如权利要求16所述的传片方法，其特征在于，所述晶片托架包括用于承载晶片的承载位，且多个所述晶片托架的所述承载位的高度按排列顺序依次降低；
    所述步骤S32进一步包括：
    按所述承载位由低到高的排列顺序依次对晶片进行水平方向的位置校准，并在每次校准之后，所述升降机构驱动多个所述晶片托架同步上升相应的高度，以托起完成校准的晶片；
    所述步骤S43进一步包括：
    按所述承载位由高到低的排列顺序依次对其上的晶片进行水平方向的位置校准，并在每次校准之后，所述升降机构驱动各个所述晶片托架同步下降相应的高度，以使与完成校准的晶片相对应的传片手指托起该晶片。
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