WO2018087956A1 - Dispositif d'antenne - Google Patents

Dispositif d'antenne Download PDF

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Publication number
WO2018087956A1
WO2018087956A1 PCT/JP2017/024160 JP2017024160W WO2018087956A1 WO 2018087956 A1 WO2018087956 A1 WO 2018087956A1 JP 2017024160 W JP2017024160 W JP 2017024160W WO 2018087956 A1 WO2018087956 A1 WO 2018087956A1
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WIPO (PCT)
Prior art keywords
antenna device
dielectric layer
dielectric
dielectric substrate
contact
Prior art date
Application number
PCT/JP2017/024160
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English (en)
Japanese (ja)
Inventor
久功 松本
藤岡　孝芳
誠 谷川原
Original Assignee
株式会社日立産機システム
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社日立産機システム filed Critical 株式会社日立産機システム
Priority to CN201780047843.9A priority Critical patent/CN109565112B/zh
Publication of WO2018087956A1 publication Critical patent/WO2018087956A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364—Creating multiple current paths
    • H01Q5/371—Branching current paths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present disclosure relates to an antenna device.
  • An antenna device (hereinafter also referred to as “antenna”) is an important component that determines the communication performance of a wireless communication system.
  • antennas There are various types of antennas, but there is a patch antenna as an antenna that realizes one-side directivity.
  • Patent Document 1 discloses a structure example of a patch antenna.
  • Patent Document 1 describes a patch antenna having a structure in which a ground conductor portion and a patch conductor portion face each other.
  • This type of patch antenna has a dielectric constant and dielectric loss tangent (degree of electrical energy loss in the capacitor) of a dielectric material such as a printed circuit board that supports conductor parts such as a ground conductor part and patch conductor part. Determine efficiency. For example, when the dielectric constant is large, the wavelength of the current flowing through the patch conductor portion is shortened, the current density is increased, and the conductor loss is increased. In addition, when the dielectric loss tangent is large, the dielectric loss of the electromagnetic wave passing through the dielectric increases.
  • the patch antenna described in Patent Document 1 has a problem of high assembly cost.
  • a patch antenna having a wide directivity is required.
  • the present disclosure has been made in view of the above points, and provides a patch antenna technology that is easy to assemble and can reduce the manufacturing cost, and at the same time has a wide directivity.
  • the first to n + 2 dielectric layers (2 ⁇ n), the first to nth patch electrodes, and the ground electrode are provided, and the mth
  • the patch electrode (1 ⁇ m ⁇ n ⁇ 1) has two surfaces having a size corresponding to the mth frequency, and one surface of the two surfaces is in contact with the mth dielectric layer, The other of the two surfaces is in contact with the (m + 1) th dielectric layer, the (m + 1) th patch electrode has two surfaces having a size corresponding to the (m + 1) th frequency, and one of the two surfaces is the above-described surface.
  • the m + 1 dielectric layer is in contact, the other of the two surfaces is in contact with the m + 2 dielectric layer, and the ground electrode is in contact with the n + 1 dielectric layer and the n + 2 dielectric layer.
  • An antenna device is provided, wherein the first dielectric layer includes a dielectric substrate.
  • FIG. 1 is a diagram schematically illustrating an antenna device according to a first embodiment. It is the figure which decomposed
  • FIG. 6 is a diagram schematically illustrating an antenna device according to a second embodiment. FIG.
  • FIG. 6 is a diagram schematically illustrating an antenna device according to a third embodiment.
  • FIG. 10 is a diagram schematically illustrating an antenna device according to a fourth embodiment. It is a figure which shows the example of a design of an antenna apparatus. It is a front view of the component which an antenna apparatus has. It is a figure which shows the simulation result of an antenna characteristic. It is the figure which showed the radiation pattern of the antenna apparatus in two frequencies. It is a figure which shows the antenna apparatus of the modification 2. It is a figure which shows the structure of the antenna apparatus of a prior application.
  • the inventor of the present application proposed an antenna device in which a dielectric substrate 203 and a gap G are provided between the patch electrode 201 and the ground electrode 202 shown in FIG. 17 in Japanese Patent Application No. 2016-002177 filed earlier.
  • the antenna apparatus includes a patch electrode 201 sandwiched between two dielectric substrates 203 and 204 and a ground electrode 202 formed on the dielectric substrate 205.
  • the antenna device having the above configuration can be easily manufactured and has high gain and wide directivity. However, since the antenna device has only one patch electrode 201, it receives a signal with an electromagnetic wave having a single frequency.
  • the inventors of the present application have improved the previously proposed antenna device, and have proposed an antenna technology that receives signals with electromagnetic waves having a plurality of frequencies, having high gain and wide directivity.
  • dielectric layer may refer to the dielectric substrate itself or air layer.
  • the dielectric layer may refer to a layer in which a dielectric substrate and an air layer are stacked.
  • the dielectric layer may include a dielectric other than the dielectric substrate and the air layer.
  • FIG. 1 is a diagram schematically illustrating an antenna device 1 according to the first embodiment.
  • the antenna device 1 according to the present embodiment includes a first dielectric substrate 11, a second dielectric substrate 12, a third dielectric substrate 13, a fourth dielectric substrate 14, a first patch electrode 15, and a second patch electrode 16. And a ground electrode 17.
  • Each component with which the antenna apparatus 1 is provided is arrange
  • An air layer G is provided between the third dielectric substrate 13 and the ground electrode 17.
  • each component included in the antenna device 1 will be described with reference to FIG.
  • FIG. 2 is an exploded view of each component included in the antenna device 1.
  • the first dielectric substrate 11 is a rectangular plate-like member having a thickness t1 and having an upper surface 11a and a lower surface 11b.
  • the second dielectric substrate 12 is a rectangular plate-like member having a thickness t2 and having an upper surface 12a and a lower surface 12b.
  • the third dielectric substrate 13 is a rectangular plate-like member having a thickness t3 and having an upper surface 13a and a lower surface 13b.
  • the fourth dielectric substrate 14 is a rectangular plate-like member having an upper surface 14a and a lower surface 14b.
  • the materials of the first dielectric substrate 11, the second dielectric substrate 12, the third dielectric substrate 13, and the fourth dielectric substrate 14 are FR4, acrylic, Teflon (registered trademark), and the like.
  • Each substrate is preferably a printed circuit board made of glass epoxy resin, but a dielectric such as acrylic plate, ABS (resin formed by polymerizing acrylonitrile, butadiene, styrene), glass plate or the like. It may be used.
  • the dimension LS of each substrate is slightly larger than the dimension L of the ground electrode 17 and needs to be sufficiently large at the operating frequency of the antenna device 1.
  • the dimension LS of each substrate is sufficiently wider than the dimensions of the first patch electrode 15 and the second patch electrode 16.
  • the dimension LS of each substrate should be at least twice the dimension of the patch electrode.
  • the dimension LS of each substrate is preferably about 100 to 300 mm, for example, when the operating frequency is about 1 GHz.
  • the first dielectric substrate 11, the second dielectric substrate 12, the third dielectric substrate 13, and the fourth dielectric substrate 14 can be configured to have different sizes.
  • the size of the fourth dielectric substrate 14 on which the ground electrode 17 is arranged is set to be twice as large as the size of the patch electrode according to the above example, and the first dielectric substrate 11, the second dielectric substrate 12, The three dielectric substrate 13 may be smaller than the first dielectric layer 13 as long as the first patch electrode 15 and the second patch electrode 16 can be disposed.
  • the first patch electrode 15 is composed of a circular thin plate member or thin film having an upper surface 15a and a lower surface 15b.
  • the second patch electrode 16 is formed of a circular thin plate member or thin film having an upper surface 16a and a lower surface 16b.
  • the outer diameters L1 and L2 of the first patch electrode 15 and the second patch electrode 16 are determined by the carrier frequency of the wireless system, as in a normal patch antenna. In general, the length of one side of the patch electrode is often set based on the length of 1 ⁇ 2 wavelength of the carrier frequency.
  • the length of one side of the patch electrode is, for example, about 140 mm for the 920 MHz band and about 78 mm for the 1.6 GHz band.
  • the actual size of the patch electrode is several percent of the size based on the wavelength in the free space described above. ⁇ Several tens of percent smaller.
  • the outer diameter L1 of the first patch electrode 15 is smaller than the outer diameter L2 of the second patch electrode 16.
  • the wavelength of the electromagnetic wave received or emitted by the first patch electrode 15 is shorter than the wavelength of the electromagnetic wave received or emitted by the second patch electrode 16.
  • the frequency of electromagnetic waves received or emitted by the first patch electrode 15 is higher than the frequency of electromagnetic waves received or emitted by the second patch electrode 16.
  • the shape of the first patch electrode 15 and the second patch electrode 16 may be other than circular as long as desired characteristics can be obtained.
  • the shape of the first patch electrode 15 and the second patch electrode 16 may be, for example, a regular n-gon (n is 4 or more).
  • the first patch electrode 15 and the second patch electrode 16 are formed as plate members or thin films such as copper, aluminum, and gold.
  • the ground electrode 17 is a rectangular thin plate member or thin film having an upper surface 17a and a lower surface 17b.
  • the ground electrode 17 is formed as a plate member or a thin film such as copper, aluminum, or gold.
  • the ground electrode 17 is formed on substantially the entire upper surface 14 a of the fourth dielectric substrate 14. Accordingly, the size of the ground electrode 17 in plan view is larger than the size of the first patch electrode 15 and the second patch electrode 16 in plan view.
  • the air layer G has a thickness of dg, and is provided, for example, by providing poles at the four corners of the antenna device and separating the third dielectric substrate 13 and the ground electrode 17. The effective dielectric constant of the dielectric layer can be adjusted by providing the air layer G.
  • FIG. 3 is a cross-sectional view of the antenna device 1 in a plane parallel to the yz plane.
  • the lower surface 11b of the first dielectric substrate 11 and the upper surface 12a of the second dielectric substrate 12 are in contact with each other, and the first patch electrode 15 is connected to the first dielectric substrate 11 and the second dielectric substrate. 12 between them.
  • the lower surface 12b of the second dielectric substrate 12 and the upper surface 13a of the third dielectric substrate 13 are in contact with each other, and the second patch electrode 16 is sandwiched between the second dielectric substrate 12 and the third dielectric substrate 13. ing.
  • the ground electrode 17 faces the lower surface 13b of the third dielectric substrate 13 with the air layer G interposed therebetween.
  • the ground electrode 17 is disposed so as to cover the upper surface 14a of the fourth dielectric substrate.
  • the ground electrode 17 is in contact with the upper surface 14a of the fourth dielectric substrate, but the ground electrode 17 may be separated from the upper surface 14a of the fourth dielectric substrate.
  • the antenna device 1 uses the thickness t1 of the first dielectric substrate 11, the thickness t2 of the second dielectric substrate 12, the thickness t3 of the third dielectric substrate 13 and the thickness dg of the air layer G as design parameters.
  • the operating gain and bandwidth can be designed.
  • t1, t2, t3 and dg are designed within the following range.
  • ⁇ is a wavelength ⁇ 1 in the free space of the electromagnetic wave radiated or received by the first patch electrode 15, and an average value of the wavelengths ⁇ 2 or ⁇ 1 and ⁇ 2 in the free space of the electromagnetic wave radiated or received by the second patch electrode 16. is there.
  • the upper equation is a condition for the antenna device 1 to operate as a micro antenna, and the lower equation is a condition for satisfying the design requirement. For example, a value corresponding to a radio communication system to be applied is used as the value of the parameter.
  • FIG. 4 is a diagram for explaining the support structure of the antenna device 1.
  • the first dielectric substrate 11, the second dielectric substrate 12, and the third dielectric substrate 13 are supported and fixed by poles (column portions) 8 and screws 9 arranged at four corners.
  • poles 8 and screws 9 are arranged at the four corners of each substrate, it is possible to avoid adverse effects on the electromagnetic waves radiated from the first patch electrode 15 and the second patch electrode 16, and the antenna. It is possible to support the substrate while suppressing the deterioration of characteristics.
  • the pole 8 and the screw 9 are preferably made of resin, but may be made of metal when strength is required.
  • the arrangement position of the pole 8 and the screw 9 may be any position that does not adversely affect the electromagnetic waves radiated from the first patch electrode 15 and the second patch electrode 16, for example, at any position on the edge portion of each substrate. It may be arranged.
  • the input impedance is 0 at the center in the plane direction of the first patch electrode 15 and the second patch electrode 16, and it is considered that the influence on the antenna characteristics is small even if a conductor or a dielectric is touched in theory.
  • a pole 8 and a screw 9 can be arranged.
  • pole 8 When the pole 8 is provided at the center of the first patch electrode 15 and the second patch electrode 16 as described above, it is possible to reduce the bending of the substrate due to the hollow structure and maintain high antenna performance. In particular, in severe use conditions such as industrial applications, it is assumed that many mechanical impacts are applied, and such a structure that increases the strength may be required. In FIG. 4, four poles 8 are provided. However, the number of poles may be increased or decreased depending on conditions such as required strength and cost.
  • FIG. 5 is a front view of the upper surface 11 a of the first dielectric substrate 11.
  • a first signal land portion 11d for electrical connection with the first patch electrode 15 and the second patch electrode 16 and a first signal use are provided on the upper surface 11a of the first dielectric substrate 11.
  • a through hole 11c penetrating the land portion 11d is provided on the upper surface 11a of the first dielectric substrate 11.
  • the through hole 11c is covered with a conductive through hole wiring, and the first patch electrode 15 and the second patch electrode 16 are electrically connected to the signal line 2 (see FIG. 7) penetrating the through hole 11c.
  • the signal line 2 can be fixed by being soldered in the first signal land portion 11d.
  • the through hole 11 c is provided at a position shifted from the center of the first dielectric substrate 11.
  • FIG. 6 is a front view of the lower surface 14 b of the fourth dielectric substrate 14.
  • a ground land portion 14 d for electrically connecting to the ground electrode 17 is formed on the lower surface 14 b of the fourth dielectric substrate 14.
  • a through hole 14c and a plurality of via hole wirings 14e are formed in the ground land portion 14d.
  • the via hole wiring 14e is formed so as to surround the through hole 14c.
  • the ground electrode 17 is electrically connected to a conductor for grounding via the ground land portion 14d. Similar to the through hole 11 c provided in the first dielectric substrate 11, the through hole 14 c is provided at a position shifted from the center of the fourth dielectric substrate 14.
  • a second signal land portion 14g is formed inside the ground land portion 14d with a gap portion 14f therebetween. That is, the ground land portion 14d and the second signal land portion 14g are separated by the gap portion 14f. Therefore, the ground land portion 14d and the second signal land portion 14g are not electrically connected. In other words, the ground land portion 14d and the second signal land portion 14g are insulated.
  • the through hole 14c is provided in the second signal land portion 14g.
  • the second dielectric substrate 12, the third dielectric substrate 13, the first patch electrode 15, the second patch electrode 16 and the ground electrode 17 are also provided with through holes 12c, 13c, 15c, 16c and 17c.
  • the antenna device 1 is designed so that when each dielectric substrate and the electrode face each other, the positions of the respective through holes coincide with each other to form one through hole.
  • the signal line 2 described above is inserted into the through hole, and the first patch electrode 15 and the second patch electrode 16 are electrically connected to the signal line 2 and supplied with power.
  • the diameter of the through hole 17c provided in the ground electrode 17 is designed to be larger than the diameter of the through hole 14c provided in the fourth dielectric substrate 14. By doing so, it is possible to prevent the signal line 2 and the ground electrode 17 from contacting and short-circuiting.
  • FIG. 7 is a diagram showing a cross section of the antenna device 1 on which an electronic component that transmits a high-frequency signal is mounted.
  • the cross section is a cut surface when cut along the line AB shown in FIGS. 5 and 6.
  • a feeding point 3 is provided at a position on the upper surface 11 a of the first dielectric substrate 11 above the first patch electrode 15, and a high-frequency signal is input / output through the feeding point 3.
  • the feeding point 3 hits, for example, the portion of the solder 4 bonded to fix the signal line 2 in the first signal land portion 11d described above.
  • the impedance of the feeding point 3 is 50 ⁇ .
  • the feeding point 3 is selected at a position where the high-frequency signal enters most efficiently. In this embodiment, the feeding point 3 is selected at a position slightly deviated from the centers of the first patch electrode 15 and the second patch electrode 16 as described above.
  • the signal line 2 penetrates through holes provided in each dielectric substrate and is fixed to the first signal land portion 11d and the second signal land portion 14g with the solder 4.
  • Through holes 11c and 12c provided in the first dielectric substrate 11 and the second dielectric substrate 12 are covered with a conductor, and the signal line 2 is electrically connected to the first patch electrode 15 and the second patch electrode 16. It is connected to the.
  • the diameter of the through hole 17c provided in the ground electrode 17 is designed to be larger than the through hole 14c provided in the fourth dielectric substrate 14, and the signal line 2 does not contact the ground electrode 17. Insulated. That is, the first patch electrode 15 and the second patch electrode 16 are electrically connected to the second signal land portion 14 g via the signal line 2 and are electrically insulated from the ground electrode 17.
  • the ground electrode 17 is electrically connected to the ground land portion 14d through the plurality of via-hole wirings 14e, and is electrically insulated from the second signal land portion 14g.
  • the signal line 2 is connected to the upper surface 11a side (outside the antenna device 1) of the first dielectric substrate 11 and the lower surface of the fourth dielectric substrate. 14b side (outside of the antenna device 1) can be soldered, and assembly work can be easily performed.
  • a microstrip line 14h is formed in the second signal land portion 14g and can be connected to the electronic circuit 5 including a low noise amplifier circuit, for example.
  • the shape of the ground land portion 14d is as shown in FIG. A U-shape is formed so as to surround the land portion 14g. Since the ground land portion 14d and the second signal land portion 14g have the above-described shape, the microstrip line 14h can transmit a high-frequency signal.
  • the gap 14f is designed so that the characteristic impedance of the microstrip line 14h is a desired value (usually 50 ⁇ ).
  • the ground land portion 14d is connected to the ground terminal 5a1 of the electronic circuit 5 (circuit element), and the second signal land portion 14g is connected to the electronic circuit 5 (circuit element) via the microstrip line 14h.
  • Signal terminal (input terminal) 5a2 Since the ground electrode 17 is formed on the upper surface 14a of the fourth dielectric substrate 14, the electronic circuit 5 disposed on the lower surface 14b is electromagnetically separated from the antenna portion.
  • FIG. 8 is a diagram showing an internal configuration of the electronic circuit 5.
  • FIG. 8 is a configuration example of the electronic circuit 5 in the case of configuring an active antenna using a low noise amplifier.
  • the electronic circuit 5 includes, in order from the input side, an antenna terminal 5a, an output terminal 5b, a low noise amplifier (LNA) 5c, a band-pass filter (BPF) connected to the electrode 6 (portion excluding the electronic circuit 5 in FIG. 7). ) 5d, and Bias Tee 5e.
  • the output terminal 5b is connected to a demodulation IC 7 (demodulator), which is an external receiving circuit.
  • demodulation IC 7 demodulator
  • the antenna device 1 includes the first patch electrode 15 and the second patch electrode 16 and is an antenna device corresponding to a plurality of frequencies.
  • the antenna device 1 according to the first embodiment has a configuration in which the upper surface 15 a of the first patch electrode 15 is in contact with the first dielectric substrate 11. In this way, the antenna device 1 can adjust the wavelength shortening rate of the current flowing through the first patch electrode 15 to widen the directivity.
  • the antenna device 1 can reduce the size of one side of the first patch electrode 15 by adjusting the wavelength shortening rate as compared with the antenna device that does not have the first dielectric substrate 11, and as a result, the antenna device. 1 can be reduced in size.
  • the antenna device 1 since the antenna device 1 can reduce the area of the first patch electrode 15, the antenna device 1 acts in the direction of weakening the beam forming effect of the electromagnetic field radiated by the current flowing through the first patch electrode 15, and the directivity can be expanded. Become.
  • the antenna device 1 is suitable for use in, for example, a wireless communication system because of its wide directivity.
  • the positional relationship (direction) between a transmitter and a receiver cannot be specified in many cases. Therefore, the wide directivity antenna device 1 is suitable for use in a mobile communication system.
  • the signal line 2 is connected to the first dielectric by soldering on the upper surface 11 a side (outside) of the first dielectric substrate 11 and the lower surface 14 b side (outside) of the fourth dielectric substrate. It can be fixed to the substrate 11 and the fourth dielectric substrate 14. That is, the soldering operation can be performed on the outer surfaces of the two printed boards, and the soldering operation can be easily performed. This facilitates the assembly work of the antenna device 1 and contributes to a reduction in manufacturing cost.
  • the outer diameter of the first patch electrode 15 is smaller than the outer diameter of the second patch electrode 16.
  • the thickness of each component is designed corresponding to the electromagnetic wave to be radiated or received, as shown in the above-described formula 1. In this way, the antenna device 1 has an increased operating gain.
  • FIG. 9 is a diagram schematically illustrating an antenna device 1A according to the second embodiment. Also in the case of FIG. 9, the pole 8 and the screw 9 are omitted.
  • the antenna device 1A according to the second embodiment is coaxial with the lower surface 14b of the fourth dielectric substrate 14 in place of the ground land portion 14d and the second signal land portion 14g having connection terminals for connection to the electronic circuit 5.
  • worn differs from Example 1.
  • the antenna device 1A is shipped as a patch antenna alone, for example.
  • the coaxial connector 10 has a signal terminal 10a and a ground terminal 10b.
  • the signal line 2 penetrates through holes 11c to 17c provided in each dielectric substrate and each conductor as in the case of the antenna device 1 of the first embodiment.
  • the lower end of the signal line 2 included in the antenna device 1A according to the second embodiment serves as the signal terminal 10a of the coaxial connector 10 mounted on the lower surface 14b of the fourth dielectric substrate 14. Exposed.
  • the signal line 2 is electrically insulated from the ground electrode 17 as in the first embodiment.
  • the ground terminal 10 b of the coaxial connector 10 is connected to the ground land portion 14 d and the via hole wiring via the solder 4 on the lower surface 14 b of the fourth dielectric substrate 14. 14e.
  • the ground electrode 17 provided on the upper surface 14a of the fourth dielectric substrate 14 and the ground land portion 14d provided on the lower surface 14b are electrically connected through a plurality of via-hole wirings 14e. That is, the ground electrode 17 and the ground terminal 10b of the coaxial connector 10 are electrically connected.
  • the signal terminal 10a (that is, the signal line 2) of the coaxial connector 10 is soldered on the upper surface 11a side (outside) of the first dielectric substrate 11 when the antenna device 1A is assembled.
  • the ground terminal 10 b of the coaxial connector 10 can be soldered on the lower surface 14 b side (outside) of the fourth dielectric substrate 14.
  • the soldering work can be performed on the outer surfaces of the two substrates, and the above work can be easily performed.
  • the coaxial connector 10 can be soldered from the outside of the vertically stacked structure of the antenna device 1A, and the antenna device 1A can be easily assembled.
  • the assembly operation can be facilitated and the manufacturing cost can be reduced in the antenna device 1A.
  • FIG. 10 is a diagram schematically illustrating an antenna device 1B according to the third embodiment.
  • the antenna device 1B according to the third embodiment has a configuration in which the signal line 2 penetrates the second dielectric substrate 12, the third dielectric substrate 13, and the fourth dielectric substrate 14, but does not penetrate the first dielectric substrate 11. is there.
  • the feeding point 3 is directly connected to the first patch electrode 15 by a conductive material.
  • a conductive material a material such as a silver paste or a conductive adhesive, a conductive double-sided tape such as a copper tape, an aluminum tape, or the like can be used. Of course, solder may be used.
  • FIG. 11 is a diagram schematically illustrating an antenna device 1C according to the fourth embodiment.
  • An antenna device 1 ⁇ / b> C shown in FIG. 11 has two feeding points 3 ⁇ / b> A and 3 ⁇ / b> B on the upper surface 11 a of the first dielectric substrate 11.
  • These two feed points 3A and 3B are feed points that can receive orthogonal polarization components, respectively, and can be used as antennas for polarization diversity.
  • an antenna capable of receiving circularly polarized waves can be configured by combining signals received at the feeding point 3A and the feeding point 3B with a phase difference of 90 degrees.
  • the dimensions of the first patch electrode 15 and the second patch electrode 16 are designed so that the center frequencies are 1.59 GHz and 1.275 GHz, respectively.
  • FIG. 12 is a diagram illustrating a design example of the antenna device 1D.
  • the second dielectric substrate 12 is replaced with a second dielectric layer 120 in which a dielectric substrate 12A and an air layer 12B are laminated, and a third dielectric substrate 13 is obtained.
  • the dimension of each component is shown.
  • Dielectric substrate 11 150mm x 150mm, thickness 1mm
  • material FR4 Dielectric substrate 12A 150mm x 150mm, thickness 2mm
  • material FR4 Dielectric substrate 13A 150mm x 150mm, thickness 2mm
  • material FR4 Dielectric substrate 13B 150mm x 150mm, thickness 2mm
  • material FR4 Dielectric substrate 14 150 mm x 150 mm, thickness 2 mm, material FR4 Air layer 12B: Thickness 2mm Air layer 13C: Thickness 2mm
  • First patch electrode 15 ⁇ 90 mm
  • circular shape Second patch electrode 16 ⁇ 105 mm
  • circular shape Ground electrode 17 148 mm ⁇ 148 mm, square shape
  • FIG. 13 is a front view of components included in the antenna device 1D. As shown in FIG. 13, the first patch electrode 15 and the second patch electrode 16 are circular, and the ground electrode 17 and each dielectric substrate are rectangular. FIG. 14 and FIG. 15 show simulation results of antenna characteristics and radiation patterns exhibited by the antenna device 1D in the case of the above design values.
  • FIG. 14 is a diagram showing a simulation result of antenna characteristics. As shown in FIG. 14, it can be seen that the antenna device 1D has a small reflection loss at frequencies near 1.28 GHz and 1.59 GHz, and a dual-frequency antenna can be realized.
  • FIG. 15 is a diagram showing radiation patterns of the antenna device 1D at two frequencies.
  • the operating gain of the antenna device is shown in unit dB.
  • the antenna device 1D has high gain and wide directivity at both of the two frequencies.
  • the antenna devices 1 and 1A to 1D have high gain and wide directivity, are compatible with a plurality of frequencies, and are optimal for GNSS.
  • the antenna device can be expected to be used for industrial applications that require particularly high-precision positioning, and can be used in fields such as agriculture, civil engineering, railways, and disaster prevention.
  • the antenna device is, for example, agricultural machinery traveling guidance on large-scale farmland, control of heavy machinery on construction sites, railway driver support, constant monitoring of slopes that may cause landslides and landslides, etc. Can be used for
  • the antenna device 1 includes two patch electrodes corresponding to different frequencies.
  • the antenna device 1 may include three or more patch electrodes corresponding to a plurality of frequencies.
  • FIG. 16 is a diagram illustrating an antenna device 1E according to the second modification.
  • the antenna device 1E shown in FIG. 16 includes first to (n + 2) th dielectric layers Sn + 2 (2 ⁇ n), first to nth patch electrodes (Pn), and a ground electrode (P), and an mth patch electrode.
  • the first dielectric layer S1 includes a dielectric substrate.
  • the antenna device 1E having the above configuration can support three or more frequencies.
  • the dielectric layers S2 to Sn + 2 may include only a dielectric substrate, may include a dielectric substrate and an air layer, or may include only an air layer. Further, since the first dielectric layer S1 includes a dielectric substrate, the antenna device 1E becomes an antenna device having wide directivity due to the wavelength shortening effect.
  • the n patch electrodes are arranged so that the size thereof increases toward the ground electrode P. In this way, the antenna device 1E has high gain and wide directivity.
  • each of the first dielectric layer S1 to the nth dielectric layer Sn is a dielectric substrate having a thickness of t1 to tn
  • the (n + 1) th dielectric layer Sn + 1 is a dielectric having a thickness of tn.
  • the dielectric substrate included in the (n + 1) th dielectric layer is in contact with the surface of the nth patch electrode Pn, and the air layer G is in contact with the surface of the ground electrode P.
  • ⁇ is the average value of the wavelengths ⁇ m or ⁇ 1 to ⁇ n in the free space of the electromagnetic wave radiated or received by the mth patch electrode Pm.
  • ⁇ may be a median value of ⁇ 1 to ⁇ n.
  • the upper equation is a condition for the antenna device 1 to operate as a micro antenna, and the lower equation is a condition for satisfying the design requirement. For example, a value corresponding to a radio communication system to be applied is used as the value of the parameter.
  • the antenna device 1E has a large operating gain by satisfying the relationship shown in the above equation.
  • the antenna device 1D has two air layers 12B and 13C.
  • the air layer 12B and the air layer 13C may be formed of different dielectrics.
  • the air layer 12 ⁇ / b> B and the air layer 13 ⁇ / b> C may be spacers having a dielectric constant suitable for realizing a desired radiation characteristic, for example.
  • Ground electrode 12B, 13C, G Air layer 11a, 12a, 13a, 14a, 15a, 16a, 17a ... Upper surface 11b, 12b, 13b, 14b, 15b, 16b, 17b ... Lower surface 11c, 12c, 13c, 14c, 15c, 16c, 17c ... through hole 11d ... first signal land portion 14d ... ground land portion 14e ... via hole wiring 14f ... gap portion 14g ... second signal land portion 14h ... microstrip Line 120 ... Second dielectric layer 130 ... Third dielectric layer All publications and patent documents cited in this specification are: Which is incorporated herein by reference remain.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

L'invention concerne un dispositif d'antenne 1E pourvu d'une première à une n+2-ième couche diélectrique Sn+2 (2 ≤ n), d'une première à une n-ième électrode de plaque P1, et d'une électrode de masse P, la m-ième électrode de plaque Pm (1 ≤ m ≤ n - 1) comportant deux surfaces ayant une taille correspondant à une m-ième fréquence, une surface des deux surfaces étant en contact avec la m-ième couche diélectrique Sm, l'autre surface des deux surfaces étant en contact avec la m+1-ième couche diélectrique Sm+1, la m+1-ième électrode de plaque Pm+1 comportant deux surfaces ayant une taille correspondant à une m+1-ième fréquence, une surface des deux surfaces étant en contact avec la m+1-ième couche diélectrique Sm+1, l'autre surface des deux surfaces étant en contact avec la m+2-ième couche diélectrique Sm+2, l'électrode de masse P comportant une surface qui est en contact avec la n+1-ième couche diélectrique Sn+1 et une surface qui est en contact avec la n+2-ième couche diélectrique Sn+2, et la première couche diélectrique S1 comprenant un substrat diélectrique.
PCT/JP2017/024160 2016-11-14 2017-06-30 Dispositif d'antenne WO2018087956A1 (fr)

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CN110875521A (zh) * 2018-08-30 2020-03-10 Tdk株式会社 天线
US20240186717A1 (en) * 2022-12-01 2024-06-06 Hitron Technologies Inc. Broadband bipolar millimeter wave antenna

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JP2020174285A (ja) * 2019-04-10 2020-10-22 株式会社Ｓｏｋｅｎ アンテナ装置
US11431107B2 (en) 2019-04-11 2022-08-30 Samsung Electro-Mechanics Co., Ltd. Chip antenna module and method of manufacturing chip antenna module
WO2022168893A1 (fr) * 2021-02-03 2022-08-11 大日本印刷株式会社 Antenne et dispositif de communication
CN115313033A (zh) * 2022-07-29 2022-11-08 四川大学 一种用于携能通信的微带/整流超表面天线

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US20240186717A1 (en) * 2022-12-01 2024-06-06 Hitron Technologies Inc. Broadband bipolar millimeter wave antenna

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CN109565112B (zh) 2021-10-22
TWI663784B (zh) 2019-06-21
JP6761737B2 (ja) 2020-09-30
JP2018082224A (ja) 2018-05-24
CN109565112A (zh) 2019-04-02
TW201818608A (zh) 2018-05-16

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