WO2014073355A1 - Antenne réseau - Google Patents

Antenne réseau Download PDF

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Publication number
WO2014073355A1
WO2014073355A1 PCT/JP2013/078319 JP2013078319W WO2014073355A1 WO 2014073355 A1 WO2014073355 A1 WO 2014073355A1 JP 2013078319 W JP2013078319 W JP 2013078319W WO 2014073355 A1 WO2014073355 A1 WO 2014073355A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
radiating element
substrate
ground layer
array antenna
Prior art date
Application number
PCT/JP2013/078319
Other languages
English (en)
Japanese (ja)
Inventor
薫 須藤
政幸 中嶋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201380058112.6A priority Critical patent/CN104769775B/zh
Priority to KR1020157009536A priority patent/KR101744605B1/ko
Priority to JP2014545630A priority patent/JP5983760B2/ja
Priority to EP13852406.1A priority patent/EP2919323A4/fr
Publication of WO2014073355A1 publication Critical patent/WO2014073355A1/fr
Priority to US14/700,805 priority patent/US9698487B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H01Q25/005—Antennas or antenna systems providing at least two radiating patterns providing two patterns of opposite direction; back to back antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the present invention relates to an array antenna in which a plurality of antennas are provided on a substrate.
  • Patent Document 1 there is a microstrip antenna (patch antenna) in which a radiating element and a ground layer facing each other with a dielectric that is thinner than a wavelength are provided and a parasitic element is provided on the radiating surface side of the radiating element. It is disclosed.
  • Patent Document 2 discloses an array antenna in which a plurality of antennas are connected by a plurality of transmission lines.
  • Patent Document 3 discloses a configuration in which two or more disk-shaped antennas are connected in parallel and have directivity in different directions.
  • Patent Document 4 discloses a configuration in which antennas are arranged on both sides of a substrate.
  • the antennas described in Patent Documents 1 and 2 have a low directivity to the back surface provided with the ground layer and a narrow communication area.
  • the configuration of Patent Document 3 since a plurality of antennas are arranged in different directions, the communication area is expanded. However, since the plurality of antennas are separate from each other, it is easy to increase the size and the structure is complicated.
  • antenna device of Patent Document 4 antennas are arranged on both sides of the printed board, but a grounding layer is formed on both sides of the printed board, and a radiating element is provided on both sides of the printed board. For this reason, the overall thickness dimension is a value obtained by adding the thicknesses of the two antennas provided on both sides of the printed circuit board to the thickness of the printed circuit board. There is.
  • the present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide an array antenna that has a wide communication area and can be miniaturized.
  • the present invention provides an array antenna in which a plurality of antennas each having a radiating element are provided on a substrate, and one of two antennas adjacent to each other has a surface radiating element as described above.
  • the front antenna portion is arranged on the surface of the substrate or near the surface of the substrate, and the other of the two adjacent antennas has a back radiating element on the back surface of the substrate or near the back surface of the substrate.
  • the back antenna part is formed, and the front radiating element of the front antenna part and the back radiating element of the back antenna part of the two adjacent antennas are mutually projected when vertically projected on the back surface of the substrate. It is the structure arrange
  • the front antenna portion in which the front radiating element is disposed on the surface of the substrate or near the surface of the substrate, and the back antenna portion in which the back radiating element is disposed on the back surface of the substrate or near the back surface of the substrate Therefore, the directivity can be given to both surfaces of the substrate, and the communication area can be expanded compared to the case where the directivity is provided only to one surface of the substrate.
  • the front radiating element of the front antenna unit and the back radiating element of the back antenna unit are arranged so as not to overlap each other when vertically projected on the back surface of the substrate.
  • the back ground layer of the back antenna unit can be disposed on the surface of the substrate or near the surface of the substrate. Therefore, even when the thickness dimension between the ground layer and the radiating element is increased in order to increase the bandwidth of the front antenna part and the back antenna part, the ground layer and the radiating element are controlled while suppressing the thickness dimension of the substrate. A thickness dimension between the two can be ensured. As a result, a small array antenna having a small substrate thickness can be formed.
  • the substrate is a multilayer substrate
  • the front ground layer facing the front radiating element of the front antenna unit is disposed on the back surface of the substrate or near the back surface of the substrate
  • the back grounding layer facing the element is disposed on the surface of the substrate or near the surface of the substrate.
  • a patch antenna can be configured by the surface ground layer and the surface radiating element.
  • the patch antenna can be constituted by the back ground layer and the back radiating element.
  • the front ground layer is disposed near the back surface of the substrate or near the back surface of the substrate, and the back ground layer is disposed near the surface of the substrate or near the surface of the substrate.
  • a wide patch antenna can be formed.
  • the antenna space can be used effectively, and a small array antenna can be formed.
  • the multilayer substrate is provided with a conductor connecting portion that surrounds the front radiating element and the back radiating element, respectively, and electrically connects the front ground layer and the back ground layer. .
  • the multi-layer substrate is provided with the conductor connecting portion so as to surround the front radiating element and the back radiating element, and therefore, a wall by the conductor connecting portion is provided between the front antenna portion and the back antenna portion. Can do. For this reason, it can suppress that a high frequency signal mutually interferes between a front antenna part and a back antenna part.
  • the front antenna portion includes a front parasitic element laminated on the surface of the front radiating element via an insulating layer, and the back antenna portion is interposed on the back surface of the back radiating element via an insulating layer.
  • a laminated back parasitic element is provided.
  • the front antenna unit includes the surface parasitic element laminated on the surface of the surface radiating element via the insulating layer.
  • the stacked patch antenna in which the surface radiating element and the table parasitic element are electromagnetically coupled. Can be formed. For this reason, two resonance modes (electromagnetic field modes) having different resonance frequencies are generated in the front antenna portion, and a wide band can be achieved. Similarly, the back antenna portion can also be widened.
  • the front radiating element of the front antenna part and the back radiating element of the back antenna part of the two antennas adjacent to each other are radiated at a distance when vertically projected onto the back surface of the substrate. It is set to a predetermined value based on the frequency.
  • the spacing interval is set to a predetermined value based on the radiated frequency.
  • the separation distance between the front radiating element and the back radiating element becomes too small, the mutual coupling between the front radiating element and the back radiating element becomes strong, which adversely affects the array antenna characteristics.
  • the separation distance between the front radiating element and the back radiating element becomes excessive, the side lobe increases and the antenna gain in the front direction decreases. Taking these into consideration, these adverse effects can be suppressed by setting the separation distance between the front radiating element and the back radiating element to a predetermined value.
  • the front radiating elements of the front antenna part and the back radiating elements of the back antenna part of the two adjacent antennas are arranged in a staggered pattern when vertically projected on the back surface of the substrate. Yes.
  • the front radiating elements and the back radiating elements are arranged in a staggered pattern when vertically projected onto the back surface of the substrate, the use area efficiency of the substrate is increased and the size can be reduced.
  • FIG. 4 is a plan view showing a back ground layer in FIG. 3.
  • FIG. 5 is a cross-sectional view of the front antenna portion and the back antenna portion as seen from the direction of arrows VV in FIG. 4.
  • FIG. 5 is a cross-sectional view of the front antenna portion and the back antenna portion as seen from the direction of arrows VV in FIG. 4.
  • FIG. 5 is a cross-sectional view of the front antenna portion and the back antenna portion as seen from the direction of arrows VV in FIG. 4.
  • FIG. 9 is a cross-sectional view of the front antenna portion and the back antenna portion as seen from the direction of arrows IX-IX in FIG.
  • It is a disassembled perspective view which shows the array antenna by a 1st modification.
  • It is a top view which shows the array antenna by 3rd Embodiment.
  • It is a disassembled perspective view which expands and shows the front antenna part and back antenna part in FIG.
  • It is a disassembled perspective view of the position similar to FIG. 12 which shows the array antenna by a 2nd modification.
  • the array antenna 1 includes a multilayer substrate 2, a front antenna unit 8, and a back antenna unit 16.
  • the multilayer substrate 2 has a flat plate shape parallel to the XY plane among the X-axis, Y-axis, and Z-axis directions orthogonal to each other.
  • the multilayer substrate 2 is formed such that the dimension in the X-axis direction and the Y-axis direction is about several mm to several cm, and the dimension in the Z-axis direction that is the thickness direction of the multilayer substrate 2 is about several hundred ⁇ m.
  • the multilayer board 2 is a printed board in which, for example, five thin insulating resin layers 3 to 7 are laminated as an insulating layer from the front surface 2A side to the back surface 2B side.
  • the resin substrate is illustrated as the multilayer substrate 2, it is not restricted to this,
  • stacked the insulating ceramic layer as an insulating layer may be sufficient, and a low temperature co-fired ceramic multilayer substrate (LTCC multilayer substrate) may be sufficient.
  • the front antenna unit 8 includes a front radiating element 9, a front ground layer 10, a front feed line 13, and the like.
  • the surface radiating element 9 is formed in a substantially rectangular conductor pattern, and the dimensions in the X-axis direction and the Y-axis direction are, for example, about several hundred ⁇ m to several mm.
  • the dimension of the surface radiating element 9 in the X-axis direction is set so that the electrical length is equal to, for example, half the wavelength of the high-frequency signal RF to be fed.
  • the eight surface radiating elements 9 are arranged at equal intervals in the X-axis direction and are arranged in three rows in the Y-axis direction, first, second and third arrays R1, R2, R3.
  • the distance between the centers of adjacent surface radiating elements 9 in the first and third arrays R1 and R3 is set so that the X-axis direction is Lx and the Y-axis direction is 2 ⁇ Ly.
  • the surface radiating elements 9 forming the first and third arrays R1 and R3 are arranged in a matrix.
  • the surface radiating elements 9 in the second array R2 are arranged and formed in the center of the surface radiating elements 9 forming the first and third arrays R1 and R3 arranged in a matrix.
  • the distance dimension (separation distance) in the X-axis direction between the centers of the adjacent surface radiating elements 9 in the second array R2 is Lx
  • the first and second arrays R1, R2, second and second The spacing dimension (separation spacing) in the Y-axis direction of the three arrays R2, R3 is Ly.
  • the front radiation element 9 is formed of a conductive thin film such as copper or silver.
  • the surface radiating element 9 may be disposed not in the surface of the resin layer 3 but in the vicinity of the surface 2A of the multilayer substrate 2 as long as radio wave radiation is not hindered.
  • the surface ground layer 10 is formed between the resin layer 5 and the resin layer 6 so as to face the surface radiating element 9 and cover substantially the entire surface of the resin layer 6. Therefore, the front ground layer 10 is disposed and formed closer to the back surface 2B of the multilayer substrate 2 than the center position in the thickness direction (Z-axis direction) of the multilayer substrate 2.
  • the front ground layer 10 has a front opening 11 that opens larger than a projection region that overlaps when a back radiating element 17 described later is vertically projected onto the front ground layer 10.
  • the front ground layer 10 is provided with an opening serving as a front via forming portion 12 in order to form a front via 15 described later.
  • the opening diameter of the front via forming portion 12 is formed larger than the inner diameter of the front via 15.
  • the surface ground layer 10 is formed of, for example, a conductive thin film such as copper or silver, and is connected to the ground.
  • the surface feed line 13 is, for example, a microstrip line, and includes a strip-like strip line 14 provided between the resin layer 6 and the resin layer 7 and the surface ground layer 10.
  • the end portion 14A of the strip line 14 is positioned within the region of the surface radiating element 9 when the end portion 14A is vertically projected onto the surface radiating element 9, and the end portion 14A is vertically projected onto the surface ground layer 10. When this is done, it is arranged and formed so as to be located at a substantially central portion of the front via forming portion 12.
  • the end portion 14A penetrates through the resin layers 3 to 6, and the front radiating element 9 via the front via forming portion 12 and the front via 15 extending in the Z-axis direction via the back opening 19 described later. Electrically connected.
  • the front via 15 is a columnar conductor in which a conductive material such as copper or silver is provided in a through hole having an inner diameter of about several tens to several hundreds ⁇ m.
  • the front via 15 is connected to an intermediate position in the X-axis direction except for the center of the front radiation element 9 as a feeding point.
  • the front antenna element 8 which is a patch antenna is constituted by the front radiation element 9, the front ground layer 10, the front feed line 13, and the like. Therefore, on the multilayer substrate 2, the front antenna portions 8 that are eight patch antennas are arranged and formed in a staggered manner.
  • the back antenna unit 16 includes a back radiating element 17, a back ground layer 18, a back feed line 21, and the like.
  • the back radiation element 17 is formed in a substantially rectangular conductor pattern, and the dimensions in the X-axis direction and the Y-axis direction are, for example, about several hundred ⁇ m to several mm.
  • the dimension of the back radiating element 17 in the X-axis direction is set so that the electrical length is equal to, for example, half the wavelength of the high-frequency signal RF to be fed.
  • the back radiating element 17 is arranged and formed at a position where the front radiating element 9 and the back radiating element 17 do not overlap when the front radiating element 9 is vertically projected onto the back surface of the resin layer 7. As shown in FIG. 2, the eight back radiating elements 17 are arranged at equal intervals in the X-axis direction, and are arranged in fourth, fifth, and sixth arrays R4, R5, and R6 aligned in three rows in the Y-axis direction.
  • the distance between the centers of adjacent back radiating elements 17 in the fourth and sixth arrays R4 and R6 is set so that the X-axis direction is Lx and the Y-axis direction is 2 ⁇ Ly.
  • the back radiating elements 17 in the fourth and sixth arrays R4 and R6 are arranged in a matrix.
  • each back radiating element 17 in the fifth array R5 is disposed so as to be positioned at the center of the back radiating elements 17 in the fourth and sixth arrays R4 and R6 arranged in a matrix.
  • the distance dimension (separation distance) in the X-axis direction between the centers of the adjacent back radiating elements 17 in the fifth array R5 is Lx
  • the spacing dimension (separation spacing) in the Y-axis direction of the six arrays R5 and R6 is Ly.
  • the back radiation element 17 is formed of a conductive thin film such as copper or silver.
  • the back radiating element 17 may be disposed not in the back surface of the resin layer 7 but in the vicinity of the back surface 2B of the multilayer substrate 2 if radio wave radiation is not hindered.
  • the first, second, and third arrays R1, R2, and R3 by the surface radiating element 9 are vertically projected on the back surface of the resin layer 7, the extending directions of the first array R1 and the fourth array R4
  • the extension direction of the second array R2 and the fifth array R5 and the extension direction of the third array R3 and the sixth array R6 may or may not overlap.
  • the back ground layer 18 is formed between the resin layer 4 and the resin layer 5 so as to face the back radiation element 17 and cover substantially the entire surface of the resin layer 5. Therefore, the back grounding layer 18 is disposed and formed closer to the surface 2A of the multilayer substrate 2 than the center position of the multilayer substrate 2 in the thickness direction (Z-axis direction).
  • the back ground layer 18 has a back opening 19 that opens larger than a projection region that overlaps when the front radiating element 9 is vertically projected onto the back ground layer 18.
  • the back ground layer 18 is provided with an opening serving as a back via forming portion 20 in order to form a back via 23 described later.
  • the opening diameter of the back via forming portion 20 is formed larger than the inner diameter of the back via 23.
  • the back via 23 and the back grounding layer 18 are insulated by the clearance between the back via 23 and the back via forming portion 20.
  • the back ground layer 18 is formed of, for example, a conductive thin film such as copper or silver, and is connected to the ground.
  • the back feed line 21 is, for example, a microstrip line, and includes a strip-like strip line 22 provided between the resin layer 3 and the resin layer 4 and a back grounding layer 18.
  • the end 22A of the strip line 22 is positioned within the region of the back radiating element 17 when the end 22A is vertically projected onto the back radiating element 17, and the end 22A is vertically projected onto the back ground layer 18. Then, it is arranged and formed so as to be positioned at a substantially central portion of the back via forming portion 20.
  • the end 22A penetrates the resin layers 4 to 7 and is electrically connected to the back radiation element 17 via the back via forming portion 20 and the back via 23 extending in the Z-axis direction via the front opening 11. Connected to.
  • the back via 23 is a columnar conductor in which a conductive material such as copper or silver is provided in a through hole having an inner diameter of about several tens to several hundreds ⁇ m.
  • the back via 23 is connected to an intermediate position in the X-axis direction except for the center of the back radiating element 17 as a feeding point.
  • the back radiating element 17, the back ground layer 18, the back feed line 21, and the like constitute the back antenna portion 16 that is a patch antenna. Accordingly, the back antenna portions 16 which are eight patch antennas are arranged and formed on the multilayer substrate 2 in a staggered manner.
  • the array antenna 1 is formed on the multilayer substrate 2 by the eight front antenna portions 8 and the back antenna portions 16 arranged and formed in a staggered pattern.
  • the distance Lx, Ly between the adjacent front radiating elements 9 and the back radiating elements 17 is equal to or less than a half wavelength ( ⁇ 0 / 2) of the wavelength of the used frequency, and the adjacent back radiating elements 9 are adjacent to each other.
  • the mutual coupling between the radiating elements 17 becomes strong, which adversely affects the array antenna characteristics.
  • the spacing dimensions Lx and Ly are one wavelength ( ⁇ 0) or more, the side lobe in the antenna radiation pattern increases, and the antenna gain in the front direction decreases.
  • the distance dimensions Lx and Ly are preferably about half a wavelength ( ⁇ 0 / 2) to about one wavelength ⁇ 0 with respect to the wavelength ⁇ 0 of the high-frequency signal in free space. Specifically, for example, when a 60 GHz band millimeter wave is applied to the array antenna 1, the distance dimensions Lx and Ly are about 2.5 mm to 5 mm.
  • the front antenna unit 8 When power is supplied from the front feed line 13 toward the front radiating element 9, a current flows through the front radiating element 9 in the X-axis direction. Accordingly, the front antenna unit 8 radiates a high-frequency signal RF corresponding to the dimension of the front radiating element 9 in the X-axis direction upward from the surface 2A of the multilayer substrate 2, and the front antenna unit 8 A high frequency signal RF corresponding to the dimension of the element 9 in the X-axis direction is received.
  • the back antenna unit 16 radiates a high-frequency signal RF corresponding to the size of the back radiating element 17 in the X-axis direction, and the back antenna unit 16 has a high-frequency signal corresponding to the size of the back radiating element 17 in the X-axis direction.
  • a signal RF is received.
  • phase of the high-frequency signal RF supplied to the plurality of surface radiating elements 9 different signals are supplied to the respective surface radiating elements 9 via the plurality of strip lines 14, and the front antenna unit 8.
  • the direction of the radiation beam can be scanned in the X-axis direction and the Y-axis direction.
  • phase of the high-frequency signal RF supplied to the plurality of back radiating elements 17 different signals are supplied to each back radiating element 17 via the plurality of strip lines 22, and the back antenna unit. 16 can scan the direction of the radiation beam in the X-axis direction and the Y-axis direction.
  • the radiation angle of the radio wave can be widened and the communication area can be widened as compared with the case where the directivity is provided only to one surface of the multilayer substrate 2. be able to.
  • the front radiating element 9 and the back radiating element 17 were arranged and formed so as not to overlap each other when they were both vertically projected onto the back surface of the multilayer substrate 2. Therefore, the front ground layer 10 can be disposed near the back surface 2B from the center of the multilayer substrate 2, and the back ground layer 18 can be disposed near the front surface 2A from the center of the multilayer substrate 2. Thereby, the surface ground layer 10 and the back ground layer 18 can be separated from each other using the resin layer 5 common to each other.
  • the thickness dimension between the front radiating element 9 and the front ground layer 10 and the relationship between the back radiating element 17 and the back ground layer 18 are described. It is better to increase the thickness dimension between them. Based on this, even when the dimension between the front radiating element 9 and the front ground layer 10 and the dimension between the back radiating element 17 and the back ground layer 18 are increased, other layers constituting the multilayer substrate 2 The thickness dimension between the radiating elements 9 and 17 and the ground layers 10 and 18 can be secured while adjusting the thickness dimension. As a result, the antenna space can be used effectively, and a small array antenna 1 with a small thickness dimension of the multilayer substrate 2 can be formed. Further, since the front antenna portion 8 and the back antenna portion 16 are arranged in a staggered manner, the use area efficiency of the multilayer substrate 2 is increased, and the array antenna 1 can be miniaturized.
  • the front radiating element 9 made of a microstrip line is used to feed the front radiating element 9 and the back feeding line 21 is used to feed the back radiating element 17, so that it is generally used in a high frequency circuit.
  • Power can be supplied to the front radiating element 9 and the back radiating element 17 using a microstrip line, and the connection between the high-frequency circuit and the array antenna 1 is facilitated.
  • the strip line 14 of the front feed line 13 was provided between the resin layers 3 and 4, and the strip line 22 of the back feed line 21 was provided between the resin layers 6 and 7.
  • the front feed line 13 and the back feed line 21 made of a microstrip line are formed together on the multilayer substrate 2 provided with the front radiating element 9, the back radiating element 17, the front ground layer 10, and the back ground layer 18. It is possible to improve productivity and reduce variation in characteristics.
  • the front antenna portion 8 and the back antenna portion 16 are provided on the multilayer substrate 2 in which a plurality of resin layers 3 to 7 are laminated. For this reason, by providing the surface radiating element 9 and the surface ground layer 10 of the front antenna portion 8 on the surface of the resin layer 3 and the surface of the resin layer 6, these are placed at different positions with respect to the thickness direction of the multilayer substrate 2. It can be easily arranged. Similarly, by providing the back radiating element 17 and the back grounding layer 18 of the back antenna portion 16 on the back surface of the resin layer 7 and the front surface of the resin layer 5, these are placed at different positions with respect to the thickness direction of the multilayer substrate 2. It can be easily arranged.
  • FIGS. 6 to 9 show an array antenna 31 according to a second embodiment of the present invention.
  • the feature of the array antenna 31 is that the front antenna portion and the back antenna portion constituting the array antenna 31 are formed of a stack type patch antenna provided with a parasitic element.
  • the same components as those of the array antenna 1 according to the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
  • the array antenna 31 includes a multilayer substrate 2, a front antenna unit 32, and a back antenna unit 36.
  • the front antenna unit 32 includes a front radiating element 33, a front ground layer 10, a front feed line 13, a front parasitic element 35, and the like.
  • the surface radiating element 33 is formed between the resin layer 4 and the resin layer 5 in the same substantially square shape in the same arrangement state as the surface radiating element 9 of the array antenna 1 according to the first embodiment. More specifically, the surface radiating element 33 is formed inside the back opening 19 of the array antenna 1 according to the first embodiment.
  • the front radiation element 33 and the back grounding layer 18 are insulated by a clearance provided between them. Therefore, the surface radiating element 33 and the surface radiating element 9 differ only in the planar position in the thickness direction of the multilayer substrate 2 on which the surface radiating element 33 and the table radiating element 9 are formed.
  • the front radiation element 33 faces the front ground layer 10 with the resin layer 5 interposed therebetween.
  • the surface radiating element 33 and the end portion 14A of the strip line 14 pass through the resin layer 5 and the resin layer 6 and are electrically connected via the surface via forming portion 12 and the surface via 34 extending in the Z-axis direction. Connected.
  • the surface parasitic element 35 is formed on the surface 2A of the multilayer substrate 2, that is, the surface of the resin layer 3, in the same substantially square shape as the surface radiating elements 9 of the array antenna 1 according to the first embodiment. It is formed. Electromagnetic field coupling occurs between the surface parasitic element 35 and the surface radiating element 33 facing each other across the resin layer 3 and the resin layer 4. 8 illustrates the case where the front parasitic element 35 is smaller than the front radiation element 33, the dimensions of the front parasitic element 35 in the X-axis direction and the Y-axis direction are, for example, X of the front radiation element 33. It may be larger or smaller than the dimensions in the axial direction and the Y-axis direction. The magnitude relationship between the table parasitic element 35 and the table radiating element 33 and their specific shapes are appropriately set in consideration of the radiation pattern, band, and the like of the table antenna section 32.
  • the surface parasitic element 35 and the surface radiation element 33 cause electromagnetic field coupling.
  • the front radiating element 33, the front ground layer 10, the front feed line 13, the front parasitic element 35, and the like constituting the front antenna portion 32 form a stacked patch antenna.
  • eight front antenna portions 32 are arranged and formed in a staggered pattern on the multilayer substrate 2.
  • the back antenna unit 36 includes a back radiating element 37, a back ground layer 18, a back feed line 21, a back parasitic element 39, and the like.
  • the back radiating element 37 is formed between the resin layer 5 and the resin layer 6 in the same substantially square shape in the same arrangement state as the back radiating element 17 of the array antenna 1 according to the first embodiment. More specifically, the back radiating element 37 is formed inside the front opening 11 of the array antenna 1 according to the first embodiment.
  • the back radiating element 37 and the front ground layer 10 are insulated by a clearance provided therebetween. Accordingly, the back radiating element 37 and the back radiating element 17 differ only in the planar position in the thickness direction of the multilayer substrate 2 on which the back radiating element 37 and the back radiating element 17 are formed.
  • the back radiating element 37 faces the back ground layer 18 with the resin layer 5 interposed therebetween.
  • the back radiating element 37 and the end portion 22A of the strip line 22 pass through the resin layer 4 and the resin layer 5 and are electrically passed through the back via forming portion 20 and the back via 38 extending in the Z-axis direction. Connected.
  • the back parasitic element 39 is formed on the back surface 2B of the multilayer substrate 2, that is, on the back surface of the resin layer 7, in the same substantially square shape in the same arrangement state as the back radiation element 17 of the array antenna 1 according to the first embodiment. It is formed. Electromagnetic field coupling occurs between the back parasitic element 39 and the back radiating element 37 facing each other across the resin layer 6 and the resin layer 7. 8 illustrates the case where the back parasitic element 39 is smaller than the back radiation element 37, the dimensions of the back parasitic element 39 in the X-axis direction and the Y-axis direction are, for example, X of the back radiation element 37. It may be larger or smaller than the dimensions in the axial direction and the Y-axis direction.
  • the back parasitic element 39 and the back radiation element 37 cause electromagnetic field coupling.
  • the back radiating element 37, the back ground layer 18, the back feed line 21, the back parasitic element 39, etc. constituting the back antenna unit 36 form a stacked patch antenna. That is, on the multilayer substrate 2, eight back antenna portions 36 are arranged and formed in a staggered manner, and the array antenna 31 is formed together with the eight front antenna portions 32 arranged and formed in a staggered manner.
  • the same operation and effect as the array antenna 1 according to the first embodiment can be obtained.
  • the front antenna unit 32 includes the front parasitic element 35 laminated on the surface of the front radiation element 33 via the resin layers 3 and 4, two resonance modes (electromagnetic field modes) having different resonance frequencies are generated. Therefore, it is possible to increase the bandwidth. For the same reason, the back antenna unit 36 can also be widened.
  • the front radiation element 33 and the back ground layer 18 are formed in the same layer, and the back radiation element 37 and the front ground layer 10 are formed in the same layer. You may form in a different layer.
  • the array antennas 1 and 31 have been described by taking as an example the case where a plurality of strip lines 14 and 22 are formed.
  • the present invention is not limited to this.
  • a common signal may be supplied to the front radiating element 9 and the back radiating element 17 via the strip lines 42 and 43 branched from each other.
  • the configuration of the first modification can also be applied to the second embodiment.
  • FIGS. 11 to 14 show an array antenna 51 according to a third embodiment of the present invention.
  • a feature of the array antenna 51 is that the multilayer substrate 2 includes vias 52 that surround the front radiating element 33 and the back radiating element 37, respectively, and electrically connect the front ground layer 10 and the back ground layer 18. It is in providing.
  • the same components as those of the array antenna 31 according to the second embodiment are denoted by the same reference numerals, and the description thereof is omitted.
  • the array antenna 51 includes the multilayer substrate 2, the front antenna unit 32, and the back antenna unit 36 in substantially the same manner as the array antenna 31 according to the second embodiment.
  • the multilayer substrate 2 includes a via 52 as a conductor connecting portion that surrounds the front radiating element 33 and the back radiating element 37 and electrically connects the front ground layer 10 and the back ground layer 18.
  • the array antenna 51 according to the third embodiment is different from the array antenna 31 according to the second embodiment.
  • the via 52 is a columnar conductor in which a conductive material such as copper or silver is provided in a through hole having an inner diameter of about several tens to several hundreds ⁇ m that penetrates the resin layer 5 of the multilayer substrate 2. Both ends of the via 52 are connected to the front ground layer 10 and the back ground layer 18, respectively.
  • a plurality of vias 52 are provided so as to surround the front radiating element 33 and the back radiating element 37 when the front radiating element 33 and the back radiating element 37 are vertically projected onto the resin layer 5. For this reason, the plurality of vias 52 are arranged in a frame shape surrounding the front radiating element 33 and the back radiating element 37.
  • the distance between the two adjacent vias 52 is set such that the electrical length is sufficiently shorter than the wavelength of the high-frequency signal RF to be fed, for example. Specifically, the distance between the two adjacent vias 52 is set such that the electrical length is less than a half wavelength of the high-frequency signal RF, and preferably smaller than a quarter wavelength.
  • the plurality of vias 52 form conductive walls between the front antenna portion 32 and the back antenna portion 36.
  • the same effect as the array antenna 31 according to the second embodiment can be obtained.
  • the multilayer substrate 2 is provided with the via 52 so as to surround the front radiating element 33 and the back radiating element 37, a wall by the via 52 may be provided between the front antenna part 32 and the back antenna part 36. it can. For this reason, even when the front antenna unit 32 and the back antenna unit 36 are closely arranged, the front antenna unit 32 and the back antenna 36 are separated by separating the front antenna unit 32 and the back antenna unit 36 in the band of the high-frequency signal RF. It is possible to suppress mutual interference of the high-frequency signal RF with the unit 36. Furthermore, since the via 52 electrically connects the front ground layer 10 and the back ground layer 18, the potentials of the front ground layer 10 and the back ground layer 18 can be stabilized.
  • the front radiating element 33 and the back radiating element 37 according to the second embodiment are respectively surrounded to electrically connect the front ground layer 10 and the back ground layer 18.
  • a via 52 to be connected was provided.
  • the present invention is not limited to this.
  • the front radiating element 9 and the back radiating element 17 according to the first embodiment are respectively surrounded.
  • a via 62 may be provided as a conductor connecting portion that electrically connects the front ground layer 10 and the back ground layer 18.
  • the conductor connection portion is formed by the via 52.
  • the conductor connection portion may be formed by a conductor film, for example. This configuration can also be applied to the second modification.
  • the array antennas 1, 31, 51 have been described by taking as an example the case where each of the front antenna units 8, 32 and the back antenna units 16, 36 is provided. And one back antenna part may be provided, and two to seven or nine or more may be provided. Further, the front antenna portion and the back antenna portion do not necessarily have to be the same number, and may be different from each other. This configuration can also be applied to the first and second modifications.
  • the front antenna units 8 and 32 and the back antenna units 16 and 36 are arranged in a plane extending in the X-axis direction and the Y-axis direction. May be. This configuration can also be applied to the first and second modifications.
  • a current in the X-axis direction flows through the front radiating elements 9 and 33 of the front antenna units 8 and 32 and the back radiating elements 17 and 37 of the rear antenna units 16 and 36.
  • the current may flow in different directions. That is, the front antenna unit and the back antenna unit may be the same polarization or different polarizations. This configuration can also be applied to the first and second modifications.
  • microstrip line is used for the front feed line 13 and the back feed line 21 as an example, but a coplanar line or a triplate line (strip line) may be used.
  • This configuration can also be applied to the first and second modifications.
  • the multilayer substrate 2 in which the resin layers 3 to 7 forming the five insulating layers are stacked is used.
  • the number of insulating layers can be changed as needed.
  • the spacing dimensions Lx and Ly when a 60 GHz band millimeter wave is applied to the array antenna 1 are exemplified, but naturally, it may be used for millimeter waves and microwaves in other frequency bands.
  • the distance dimensions Lx and Ly differ depending on the wavelength of the frequency band.
  • the present invention is not limited to the patch antenna, and even if it is a linear antenna such as a dipole antenna, a monopole antenna, or a slot antenna, the same effects as those of the present invention can be obtained by adopting the same arrangement configuration as the present invention. be able to.

Landscapes

  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

Dans la présente invention, huit parties d'antenne d'avers (8) et huit parties d'antennes de revers (16) sont disposées sur un substrat multicouche (2). Des éléments rayonnants d'avers (9) des parties d'antenne d'avers (8) et des éléments rayonnants de revers (17) des parties d'antenne de revers (16) sont positionnés en quinconce quand ils sont projetés orthogonalement sur la face de revers (2B) du substrat multicouche (2). Les éléments rayonnants d'avers (9) sont positionnés sur la face d'avers (2A) du substrat multicouche (2) et une couche de masse d'avers (10) est positionnée vers la face de revers (2B) du substrat multicouche (2). Simultanément, les éléments rayonnants de revers (17) sont positionnés sur la face de revers (2B) du substrat multicouche (2) et une couche de masse de revers (18) est positionnée vers la face d'avers (2A) du substrat multicouche (2). Les éléments rayonnants d'avers (9) et les éléments rayonnants de revers (17) sont positionnés de manière à ne pas se chevaucher lorsqu'ils sont projetés orthogonalement sur la face de revers (2B) du substrat multicouche (2).
PCT/JP2013/078319 2012-11-07 2013-10-18 Antenne réseau WO2014073355A1 (fr)

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CN201380058112.6A CN104769775B (zh) 2012-11-07 2013-10-18 阵列天线
KR1020157009536A KR101744605B1 (ko) 2012-11-07 2013-10-18 어레이 안테나
JP2014545630A JP5983760B2 (ja) 2012-11-07 2013-10-18 アレーアンテナ
EP13852406.1A EP2919323A4 (fr) 2012-11-07 2013-10-18 Antenne réseau
US14/700,805 US9698487B2 (en) 2012-11-07 2015-04-30 Array antenna

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JP2012-245294 2012-11-07
JP2012245294 2012-11-07
JP2013-086510 2013-04-17
JP2013086510 2013-04-17

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US9985354B2 (en) 2014-10-15 2018-05-29 Rogers Corporation Array apparatus comprising a dielectric resonator array disposed on a ground layer and individually fed by corresponding signal lines, thereby providing a corresponding magnetic dipole vector
CN107078396A (zh) * 2014-10-15 2017-08-18 罗杰斯公司 阵列装置、电路材料、以及具有该材料的组件
WO2018003920A1 (fr) * 2016-06-30 2018-01-04 日立金属株式会社 Antenne plane, substrat céramique cocuit, et module de communication sans fil à ondes quasi-millimétriques/millimétriques
JPWO2018003920A1 (ja) * 2016-06-30 2019-02-21 日立金属株式会社 平面アンテナ、同時焼成セラミック基板および準ミリ波・ミリ波無線通信モジュール
WO2018087956A1 (fr) * 2016-11-14 2018-05-17 株式会社日立産機システム Dispositif d'antenne
US10707556B2 (en) 2017-01-23 2020-07-07 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
US10396432B2 (en) 2017-01-23 2019-08-27 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
US11165137B2 (en) 2017-01-23 2021-11-02 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
US10784564B2 (en) 2017-01-23 2020-09-22 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
JP2021502792A (ja) * 2017-12-21 2021-01-28 アップル インコーポレイテッドＡｐｐｌｅ Ｉｎｃ． 近傍界マイクロ波無線電力システム
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JP2019164114A (ja) * 2018-03-19 2019-09-26 パナソニックＩｐマネジメント株式会社 レーダ装置
JP7266234B2 (ja) 2018-03-19 2023-04-28 パナソニックＩｐマネジメント株式会社 レーダ装置
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EP2919323A1 (fr) 2015-09-16
EP2919323A4 (fr) 2016-07-06
CN104769775B (zh) 2017-05-17
CN104769775A (zh) 2015-07-08
JP5983760B2 (ja) 2016-09-06
US20150236425A1 (en) 2015-08-20
KR101744605B1 (ko) 2017-06-08
US9698487B2 (en) 2017-07-04
JPWO2014073355A1 (ja) 2016-09-08
KR20150055042A (ko) 2015-05-20

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