WO2018087029A1 - Dispositif et procédé pour fixer un masque dans une position plane - Google Patents

Dispositif et procédé pour fixer un masque dans une position plane Download PDF

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Publication number
WO2018087029A1
WO2018087029A1 PCT/EP2017/078299 EP2017078299W WO2018087029A1 WO 2018087029 A1 WO2018087029 A1 WO 2018087029A1 EP 2017078299 W EP2017078299 W EP 2017078299W WO 2018087029 A1 WO2018087029 A1 WO 2018087029A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
substrate
electromagnets
coating
magnets
Prior art date
Application number
PCT/EP2017/078299
Other languages
German (de)
English (en)
Inventor
Markus Gersdorff
Vladimirs Leontjevs
Original Assignee
Aixtron Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aixtron Se filed Critical Aixtron Se
Publication of WO2018087029A1 publication Critical patent/WO2018087029A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the invention relates to a method and a device for coating at least one substrate by feeding a starting material into a process space, having a substrate holder for receiving the at least one substrate and a mask, which is transferred from a mask transport system before being coated into a contacting system can be brought to the surface of the substrate and after the coating of the surface of the substrate is removable, wherein the mask is at least partially magnetically or magnetically activated.
  • a shield element can be brought between a gas inlet element, from which organic starting materials brought into the gaseous form are brought into a process space by means of a carrier gas, and a cooled substrate holder on which the substrate rests.
  • the screen element With the screen element, the substrate and / or a mask can be brought into the process space.
  • the mask is placed on the substrate lying flat on the substrate holder.
  • the mask has windows framed by webs, so that deposition of the starting material can take place only in the areas released from the windows on the surface of the substrate. The deposition is essentially due to a condensation of the gaseous starting materials on the surface of the substrate to form a solid.
  • the mask On the webs framing the webs also takes place a coating.
  • the mask When releasing the mask from the substrate, the mask is only at its Edge captured by a mask transport means, and displaced in a vertical direction. Due to the force of gravity acting on the mask, the surface portion of the mask lying between the edges bulges downward. This deformation of the mask has the consequence that the deposited on the webs of the mask coating peels off. Particles form which fall down by gravity or which are transported to places where they interfere due to gas flow within the process space.
  • a magnetic mask is held by permanent magnets on a carrier.
  • a mask transport system includes electromagnets that are controllable such that the magnetic force generated by them is greater than the magnetic force generated by the permanent magnets, so that the mask can be removed from the surface of the substrate by means of the mask transport system.
  • the invention has for its object to improve a genus in modern device or a generic method use advantageous, in particular to provide measures to prevent particles from detaching from the mask after dissolving the mask from the substrate.
  • the problem is solved by the invention specified in the claims.
  • the dependent claims represent not only advantageous developments, but also independent solutions to the problem.
  • a device for depositing a layer by means of a one or more gas outlet openings of a gas inlet member in a between the gas outlet openings and a gas outlet openings arranged substrate holder process chamber fed process gas on a voltage applied to a gas outlet openings facing the substrate has substrate for positioning a mask on the substrate or for removing the mask from the substrate, wherein the mask rests on the directed to the gas outlet openings plan broad side of the substrate during the deposition of the layer.
  • the mask has magnetic zones or magnetically activated zones.
  • the mask can interact with an external magnetic field in such a way that it is attracted by a magnet that generates the magnetic field or - if the mask itself is magnetic - can be repelled.
  • a mask stabilization device which has mask stabilization means in order to stabilize the mask after its removal from the surface of the substrate in a predetermined surface enhancement position.
  • the predetermined areal extent corresponds to the areal extent that the mask occupies when it rests on the substrate. If the substrate is a flat, plane object, for example a glass plate, then the surface extension layer is a flat layer. It is provided that the mask removed from the substrate is held in the predetermined surface extension position by means of a magnet force generated by magnets controlled by a control device. The magnetic forces interact with the magnetic or magnetizable zones of the mask.
  • the surface center portion of the mask attracted or repelled by an electromagnet has the same distance to the substrate as an edge portion of the mask.
  • the center of area cut is thereby held by the magnetic field of a spatially associated electromagnet contactless in the balance.
  • the invention furthermore relates to a method in which the mask removed from the substrate is held in a flat position by means of a controlled magnetic force interacting with magnetic or magnetizable zones of the mask, the mask removed from the substrate.
  • the magnetization device may comprise electromagnets or permanent magnets.
  • To control magnetic field strength sensors and / or distance sensors may be provided. In particular, it is provided to use Hall sensors, distance sensors, capacitive or inductive proximity switches to control the magnetic force.
  • the mask stabilization means can be brought between the gas outlet openings of a gas inlet member and the substrate holder.
  • the mask stabilizing means can associate with a screen plate of a screen element which is moved from a storage chamber into the process space in order to prevent heat transfer between substrate holder and gas inlet element in a screen position.
  • the mask holding device engage only at the edge of the preferably rectangular mask.
  • the mask stabilization means can also be arranged in the substrate holder.
  • mask stabilization means in the form of magnets, in particular permanent magnets and / or electromagnets and sensors for determining the magnetic field strength or a vertical position of the mask are assigned to the substrate holder and / or can be brought from outside into the process space , With the sensor elements, the vertical position of the mask with respect to the position of the sensor or the position of the substrate holder and / or the shield plate is determined in particular at locations which are spaced from the edge of the mask.
  • the magnetic fields preferably engage in a surface center portion of the mask, that is, in a surface area of the mask, which is spaced from the edge of the mask to keep this area center portion in a sense in limbo.
  • the magnetic fields generated by electromagnets are controlled such that the mask is held in suspension or that the distance measured by the sensors occupies a desired value.
  • a plurality of sensors distributed over the entire areal extent of the mask are preferably provided, wherein the sensors are assigned to the substrate holder and / or the screen element.
  • the electromagnets, which are controlled by the control device according to the specifications of the sensors, are assigned to the substrate holder and / or the shielding element.
  • the control device is capable of holding the mask in a predetermined vertical position at each of the plurality of measuring points on each of which a sensor is arranged. It is also envisaged to use only one sensor and to position it approximately in the middle of the mask surface, or a plurality of sensors only in the surface center section of FIG.
  • the invention relates both to coating devices in which the substrate holder is arranged vertically above the gas inlet device and also to those devices in which the substrate holder is arranged vertically below the gas inlet element.
  • the gas inlet member preferably extends over the entire surface of the mask and has a plurality of arranged in a gas outlet surface gas outlet openings, which are arranged like a shower head and is brought by a vaporous starting material by means of a carrier gas into the process chamber.
  • the mask is preferably made of INVAR, a material which in a variant of the invention has no permanent magnetic properties, but is attracted in a magnetic field generated by a magnet in the direction of the magnet.
  • both above and below the mask arranged magnets are used, each exerting an attractive force on the mask.
  • the magma generated by the opposing magnets Controlled net fields such that the mask is held in suspension, so the magnetically opposite forces acting on the mask compensate for the force acting on the mask gravity.
  • there are pairs of magnets facing one another one magnet being associated with the screen element and the other magnet with the substrate holder.
  • the pair of magnets may be spatially associated with a magnetic field sensor or a distance sensor, respectively. But it is also envisaged that a sensor is arranged between a pair of magnets and a plurality of magnets are associated control technology a sensor.
  • the method according to the invention is exercised when a coating process in which, in particular, an OLED layer has been applied to a substrate is completed.
  • solid or liquid particles are fed into a carrier gas.
  • the aerosol thus formed is supplied to an evaporator by means of an aerosol transport line.
  • the evaporator has surfaces heated at an evaporation temperature, which heat the carrier gas and the aerosol particles in such a way that the aerosol particles evaporate.
  • the steam thus generated is fed through the gas inlet member into the process space. This is done by a heated gas inlet member.
  • the organic vapor condenses on the substrate which rests on a cooled substrate holder.
  • the substrate can abut against the downwardly facing substrate contact surface of a substrate holder or on an upwardly pointing contact surface of a substrate holder.
  • the mask is raised or lowered by means of mask transport means or a mask holder.
  • the mask transport means or the mask holder only engage at the edge of the mask.
  • the mask made of magnetizable material is pressed against the surface of the substrate during the coating process with magnetic force, wherein the magnets are arranged within the substrate holder and in particular can generate a regulated magnetic field.
  • This slide is preferably a screen element which is intended to interrupt heat radiation from the heated gas inlet element to the substrate holder.
  • This slider may also have magnets that build a magnetic field together with the magnet of the substrate holder. The magnetic field is regulated in such a way that its surface extension position does not change during the vertical displacement of the mask. If, for example, the mask lies in a flat position on the substrate, the magnets hold the mask in a vertical position during its vertical displacement, without the mask bending.
  • either only the substrate holder or only the slider, which may be a screen element has the magnet for the controlled position stabilization of the mask.
  • FIG. 1 shows in cross-section a first exemplary embodiment of a coating device in which a gas inlet element is arranged above a substrate holder and the substrate holder and a shielding element 17 in particular have pairs of opposing magnets between which magnets a mask is held in suspension;
  • FIG. 2 shows a representation according to FIG. 1, but with a magnet arrangement only in the screen element
  • Fig. 3 is a view similar to Figure 1 of a third embodiment, wherein the gas inlet member below a Substrate holder are arranged, wherein in particular paired magnets are assigned to the substrate holder and the screen element and the mask is held by the magnetic force generated by magnets in a suspension, a representation according to Figure 3 of a fourth embodiment, wherein the holding the mask in a floating magnets are only arranged in the substrate holder,
  • FIG. 5 schematically and schematically shows a mask arranged between a substrate holder and a screen element which is held in suspension with magnetic fields generated by a control device in which spacings between mask and substrate holder or mask and screen element are kept constant over time, schematically 5 with magnetic field strengths to a mask without changing its surface extensional position from a contact position on the substrate 6 in a position remote from the substrate vertical to publishers.
  • the devices shown in Figures 1, 2, 3, 4 and 5 have a reactor housing 1, which encapsulates a process chamber 2 gas-tight to the outside. At an opening 4 which can be closed, a storage chamber 3 adjoins the cavity of the reactor housing 1, in which the process space 2 is located.
  • a substrate holder 5 which is cooled to a condensation temperature.
  • the substrate holder 5 has a substrate contact surface on which a substrate 6 rests in contact surface area. The substrate 6 can be held on the Substratstrom- surface of the substrate holder 5 via electrostatic forces.
  • a mask holder 8 which is part of a mask transport device, is capable of a mask 7 from a contact position, in which the mask is touching on the side facing the process space 2 side of the substrate 6 to move in the vertical direction in a distance position. In this case, the mask holder 8 engages only on the edge T of the mask 7.
  • the storage chamber 3 stores a magnetic carrier, which is formed in the embodiments of a shield member 17.
  • the shield element 17 has a shield plate which has a heat-insulating effect and which can be moved by means of a guide 18 or displacement means from the storage chamber 3 into the process space 2, where the shield element 17 thermally separates the substrate holder 5 from a gas inlet element 9 in a screen position. which has gas outlet openings 10 at a gas outlet area facing the process space 2, through which process gas can flow into the process space 2.
  • the process gas contains a vaporous organic starting material which is kept in vapor form by heating the gas inlet member 9 and which condenses in a coating step in the regions of windows between webs of the mask 7 on the substrate 6.
  • a carrier gas which may be hydrogen, nitrogen or a noble gas
  • the carrier gas line 5 discharges into an aerosol Grower 13, where by means of a metering solid or liquid particles which are stored in a reservoir 14, are fed into the carrier gas flow, so that an aerosol is formed, which is fed by means of an aerosol 16 to an evaporator 12 having heated walls, the Carrying carrier gas and the aerosol particles in such a way that the aerosol particles evaporate to be brought as a vapor through a gas feed line 11 in the gas inlet member 9.
  • one or more magnets 20, which are electromagnets, are provided in the substrate holder 5.
  • distance sensors 22, in particular distributed uniformly over the substrate contact surface, are arranged, with which the distance of the mask 7 from the substrate holder 5 can be determined.
  • the screen element 17 also has one or more magnets 19, which are electromagnets and distance sensors 21 to determine the distance between the screen element 17 and mask 7.
  • One of the two magnets 19, 20 may also be a permanent magnet.
  • the magnetic fields B 1 generated by the magnets 20 and the magnetic fields B 2 generated by the magnets 19 are controlled such that the distances a between substrate holder 5 and mask 7 by means of the distance sensor ren 22 and / or the distances b of the mask 7 from the shield member 17, which are determined by the distance sensors 21, have a predetermined value.
  • the target value of the distance a is increased in the course of time until the mask 7 has reached a predetermined end distance.
  • the target value of the distance b can be reduced in time until the mask 7 has reached the predetermined end distance.
  • the mask 7 may consist of INVAR or another material which is not itself magnetically but polarizable in a magnetic field, that is magnetically attracted or repelled by a magnet.
  • the magnetic fields Bi, B 2 generated by the magnets 19, 20 thus each have an attractive and possibly also a repelling effect on the mask 7.
  • An upwardly directed magnetic field Bi and a downwardly directed magnetic field B 2 force are balanced so that they compensate for the force exerted on the mask 7 gravity, thus keeping the mask 7 in the balance.
  • the magnets 19, 20 are preferably distributed uniformly over the substantially rectangular contact surface of the substrate holder 5 or the rectangular extension surface of the shield element 17. Between individual magnets 19, 20, the distance sensors 21, 22 may be provided.
  • the number of distance sensors 21, 22 is preferably less than the number of magnets 19, 20, so that a plurality of magnets 19, 20 respectively of the substrate holder 5 or of the screen element 17 belong to a control circuit comprising a distance sensor 21, 22.
  • the magnetic carrier 17 is formed by a screen element. But it is also possible to form the magnetic carrier otherwise.
  • either only the substrate holder 5 has one or more magnets 20 and one or more distance sensors 22 or only the screen element 17 one or more magnets 19 and one or more distance sensors 21
  • These are electromagnets 19, 20 whose magnetic force can be controlled such that their attraction force exerted on the mask 7 compensates for the force acting on the mask 7 gravity.
  • the control device is set up in such a way that it is able to displace the mask 7 extending in a flat position without changing its flatness by changing the magnetic fields Bi, B 2 vertically.
  • the mask 7 is engaged only at its edge T of the mask holder 8.
  • the regulated magnetic fields Bi, B 2 are generated, which preferably exert a force on the mask 7 only in the surface center section of the mask 7 surrounded by the edge T of the mask 7.
  • the magnetic fields are controlled in such a way that the surface extension position, in particular the flatness of the mask, does not change during its vertical displacement.
  • Figure 6 shows the time course of the magnetic field strengths Bi, B 2 , which are generated by the magnets 19, 20 to change the vertical position x of the mask 7.
  • a device which is characterized by magnetically acting mask stabilizing means 19, 20, 21, 22, 23 in order to stabilize the mask 7 after its removal from the surface of the substrate 6 in a predetermined surface extension position, in particular a flatness ;
  • a device which is characterized in that the mask stabilization means comprise one or more magnets 19, 20, in particular permanent magnets and / or electromagnets, which are assigned to the substrate holder 5 or can be brought from outside into the process space 2 ;
  • a device which is characterized in that the magnets 19 are arranged on a screen element 17 which can be brought between the mask 7 and a gas inlet member 9;
  • a device which is characterized by a control device 23 with which the magnetic fields Bi, B 2 generated by electromagnets 19, 20 of the mask stabilization means are controllable in such a way that at least one surface center section extends below or above with respect to one the gravitational predetermined direction of the magnets 19, 20 lying mask 7 is held in suspension;
  • the mask stabilization means comprise at least one distance sensor 21, 22 for determining a distance a, b between the distance sensor 21, 22 and the mask 7 and / or between the substrate holder 5 and the mask 7;
  • a device characterized in that the mask 7 is disposed in a direction predetermined by gravity either above or below the substrate holder 5;
  • a device which is characterized in that the screen element 17 can be displaced out of the storage chamber 3 and into the process space 2 and back again along a guide 18 and / or by means of displacement means;
  • a method that is characterized in that when removing the mask 7 from the substrate 6, the mask 7 is stabilized by means of magnetic force in a predetermined surface extension position.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif pour le revêtement d'au moins un substrat par injection d'une substance de départ dans un espace de traitement (2), présentant un support de substrat (5), destiné à recevoir ledit au moins un substrat (6) et un masque (7), qui peut être amené sur la surface du substrat (6) avant le revêtement et éliminé de la surface du substrat (6) après le revêtement, à l'aide d'un système de transport de masque (8), le masque (7) étant au moins partiellement magnétique ou magnétiquement activable. Pour éviter que des particules ne se détachent du masque lors du changement de substrat ou de masque, le dispositif présente des agents de stabilisation de masque (19, 20, 21, 22, 23) à effet magnétique, destinés à stabiliser le masque (7) après son élimination de la surface du substrat (6) dans une position d'extension surfacique prédéfinie, en particulier une position plane, les aimants (19) étant disposés au niveau d'un élément de protection (17) qui peut être amené entre le masque (7) et un organe d'admission de gaz (9).
PCT/EP2017/078299 2016-11-08 2017-11-06 Dispositif et procédé pour fixer un masque dans une position plane WO2018087029A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016121375.6A DE102016121375A1 (de) 2016-11-08 2016-11-08 Vorrichtung und Verfahren zur Halterung einer Maske in einer Planlage
DE102016121375.6 2016-11-08

Publications (1)

Publication Number Publication Date
WO2018087029A1 true WO2018087029A1 (fr) 2018-05-17

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PCT/EP2017/078299 WO2018087029A1 (fr) 2016-11-08 2017-11-06 Dispositif et procédé pour fixer un masque dans une position plane

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DE (1) DE102016121375A1 (fr)
TW (1) TW201823854A (fr)
WO (1) WO2018087029A1 (fr)

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CN113493891A (zh) * 2020-03-19 2021-10-12 上海微电子装备（集团）股份有限公司 掩模夹持模块及掩模拉伸装置
TWI806279B (zh) * 2021-08-27 2023-06-21 台灣積體電路製造股份有限公司 處理半導體基板的系統及方法

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CN113493891A (zh) * 2020-03-19 2021-10-12 上海微电子装备（集团）股份有限公司 掩模夹持模块及掩模拉伸装置
CN113493891B (zh) * 2020-03-19 2022-09-02 上海微电子装备（集团）股份有限公司 掩模夹持模块及掩模拉伸装置
TWI806279B (zh) * 2021-08-27 2023-06-21 台灣積體電路製造股份有限公司 處理半導體基板的系統及方法

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