WO2018084021A1 - ダイシングシート - Google Patents

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Publication number
WO2018084021A1
WO2018084021A1 PCT/JP2017/038302 JP2017038302W WO2018084021A1 WO 2018084021 A1 WO2018084021 A1 WO 2018084021A1 JP 2017038302 W JP2017038302 W JP 2017038302W WO 2018084021 A1 WO2018084021 A1 WO 2018084021A1
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WO
WIPO (PCT)
Prior art keywords
dicing
base material
dicing sheet
sensitive adhesive
pressure
Prior art date
Application number
PCT/JP2017/038302
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English (en)
French (fr)
Japanese (ja)
Inventor
茂之 山下
Original Assignee
リンテック株式会社
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Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2018548949A priority Critical patent/JP6980684B2/ja
Priority to KR1020197009560A priority patent/KR102447761B1/ko
Priority to CN201780067328.7A priority patent/CN110073468B/zh
Publication of WO2018084021A1 publication Critical patent/WO2018084021A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68309—Auxiliary support including alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Definitions

  • the present invention relates to a dicing sheet that can be used for dicing (particularly stealth dicing) of a workpiece such as a semiconductor wafer.
  • a laminated pressure-sensitive adhesive sheet (two layers of pressure-sensitive adhesive sheets composed of a base material and a pressure-sensitive adhesive layer) is attached to an extremely thin semiconductor wafer, and the laminated pressure-sensitive adhesive sheet side passes through the laminated pressure-sensitive adhesive sheet.
  • a stealth dicing method in which a semiconductor wafer is divided along a dicing line by irradiating a semiconductor wafer with laser light, forming a modified portion inside the semiconductor wafer, and then expanding the adhesive sheet to produce semiconductor chips. It is disclosed.
  • Patent Document 3 discloses a dicing sheet used in the stealth dicing method.
  • the arithmetic average roughness (Ra) of the surface irradiated with the laser light is set to 0.1 ⁇ m or less in order to improve the laser light transmittance.
  • Patent Document 3 describes that the arithmetic average roughness (Ra) is preferably as small as possible.
  • dicing lines and alignment marks are attached to the semiconductor wafer in advance.
  • a laser dicer used for stealth dicing performs an alignment operation of imaging the alignment mark with a camera (for example, an infrared camera) at a high magnification and reading a dicing line based on the data. Then, the read dicing line is irradiated with laser light. For this reason, the dicing sheet is required to have light transmittance so that the camera can accurately image the alignment mark.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a dicing sheet having light transmittance suitable for high magnification imaging of a workpiece.
  • the present invention provides a dicing sheet comprising at least a base material and an adhesive layer laminated on the first surface side of the base material,
  • the arithmetic average roughness (Ra) on the second surface of the substrate is 0.01 ⁇ m or more and 0.5 ⁇ m or less, and the maximum height roughness (Rz) on the second surface of the substrate is 3 ⁇ m or less.
  • a dicing sheet is provided (Invention 1).
  • “sheet” includes the concept of a tape.
  • invention 1 when imaging a workpiece
  • the base material has a haze value of 15% or less (Invention 2).
  • the substrate is preferably a resin film composed of polyolefin (Invention 3).
  • the dicing sheet according to the above inventions (Inventions 1 to 3) is preferably used for stealth dicing (Invention 4).
  • the dicing sheet according to the above inventions may be used for an application including an operation of imaging a workpiece located on the first surface side of the base material from the second surface side of the base material. Preferred (Invention 5).
  • the dicing sheet according to the present invention has light transmittance suitable for high magnification imaging of a workpiece.
  • FIG. 1 is a cross-sectional view of a dicing sheet according to an embodiment of the present invention.
  • a dicing sheet 1 according to this embodiment includes a base material 2, a pressure-sensitive adhesive layer 3 laminated on the first surface side (upper side in FIG. 1), and a pressure-sensitive adhesive. And a release sheet 6 laminated on the layer 3.
  • the release sheet 6 is peeled and removed when the dicing sheet 1 is used, and protects the pressure-sensitive adhesive layer 3 until that time, and may be omitted from the dicing sheet 1 according to the present embodiment.
  • first surface the surface of the base material 2 on the pressure-sensitive adhesive layer 3 side
  • second surface the opposite surface
  • the dicing sheet 1 according to the present embodiment is used as an example for holding a work when dicing a semiconductor wafer or a glass substrate as a work, but is not limited thereto.
  • the dicing sheet 1 according to the present embodiment is usually formed in a long shape, wound into a roll, and used in a roll-to-roll manner.
  • Base Material Physical Properties (1-1) Average Roughness
  • the arithmetic average roughness (Ra) on the second surface of the base material 2 (hereinafter sometimes referred to as “the back surface of the base material 2”) is 0.01 ⁇ m. As described above, it is 0.5 ⁇ m or less, and the maximum height roughness (Rz) is 3 ⁇ m or less.
  • the arithmetic average roughness (Ra1) and the maximum height roughness (Rz) are measured based on ANSI / ASME B46.1, and the details of the measuring method are as shown in the test examples described later.
  • the arithmetic average roughness (Ra) is to be reduced, air (bubbles) is easily trapped during the formation of the resin film, and bubble marks are partially formed on the formed resin film.
  • the maximum height roughness (Rz) tends to be large.
  • the resin film constituting the base material has the above-mentioned bubble traces, the bubble traces prevent light from being transmitted. This makes it difficult for the camera to image the alignment mark with high accuracy when the workpiece is imaged by the camera via the resin film from the back side of the substrate.
  • the arithmetic average roughness (Ra) on the back surface of the substrate 2 is 0.01 ⁇ m or more and 0.5 ⁇ m or less, and the maximum height roughness (Rz) is 3 ⁇ m or less.
  • the lower limit value of the arithmetic average roughness (Ra) on the back surface of the substrate 2 is 0.01 ⁇ m or more, preferably 0.05 ⁇ m or more, and particularly preferably 0.1 ⁇ m or more.
  • the upper limit value of the arithmetic average roughness (Ra) on the back surface of the substrate 2 is 0.5 ⁇ m or less, preferably 0.4 ⁇ m or less, and particularly preferably 0.3 ⁇ m or less, as described above.
  • the arithmetic average roughness (Ra) exceeds 0.5 ⁇ m, light transmission is hindered by unevenness on the back surface of the substrate 2.
  • the maximum height roughness (Rz) on the back surface of the substrate 2 is 3 ⁇ m or less, preferably 2.5 ⁇ m or less, and particularly preferably 2 ⁇ m or less, as described above. If the maximum height roughness (Rz) exceeds 3 ⁇ m, the unevenness on the back surface of the substrate 2 prevents light from being transmitted.
  • the lower limit of the maximum height roughness (Rz) on the back surface of the substrate 2 is not particularly limited, but is usually 0.01 ⁇ m or more in terms of the film forming method.
  • the unevenness on the front surface of the base material 2 is filled with the pressure-sensitive adhesive layer 3.
  • the arithmetic average roughness (Ra) and the maximum height roughness (Rz) of the front surface of the substrate 2 are not particularly limited.
  • the arithmetic mean roughness (Ra) of the front surface of the base material 2 is an upper limit. Is preferably 2.5 ⁇ m or less.
  • the lower limit value of the arithmetic average roughness (Ra) of the front surface of the substrate 2 is not particularly limited, but is usually 0.01 ⁇ m or more in view of the film forming method.
  • the maximum height roughness (Rz) of the front surface of the substrate 2 is preferably 2.5 ⁇ m or less as an upper limit value.
  • the lower limit of the maximum height roughness (Rz) of the front surface of the substrate 2 is not particularly limited, but is usually 0.01 ⁇ m or more in view of the film forming method.
  • the haze value of the substrate 2 (value measured according to JIS K7136: 2000) is preferably 15% or less, particularly preferably 13% or less, and more preferably 10%. The following is preferable.
  • the workpiece 2 is imaged by the camera from the back side of the substrate 2 through the dicing sheet when the haze value of the substrate 2 is 15% or less, the light beam is transmitted through the substrate 2 well, and the workpiece image Can reach the camera more accurately, and high-magnification imaging can be performed with higher accuracy.
  • the lower limit value of the haze value of the substrate 2 is not particularly limited, but is usually 0.01% or more, preferably 0%.
  • the thickness of the substrate 2 is not particularly limited as long as it can function properly in each process in which the dicing sheet 1 is used, but is preferably 20 to 450 ⁇ m, and particularly preferably 25 to 400 ⁇ m. Preferably, it is preferably 50 to 350 ⁇ m.
  • the base material 2 is comprised with the resin film.
  • the resin film constituting the substrate 2 include polyethylene films such as low density polyethylene (LDPE) film, linear low density polyethylene (LLDPE) film, and high density polyethylene (HDPE) film, polypropylene film, and ethylene-propylene.
  • Polyolefin films such as copolymer film, polybutene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film, norbornene resin film; ethylene-vinyl acetate copolymer film, ethylene- (meth) acrylic acid copolymer Polymer films, ethylene copolymer films such as ethylene- (meth) acrylate copolymer films; polyvinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films ; Polyurethane film; polyimide film; polystyrene films; polycarbonate film, polyethylene terephthalate film, a polyester film such as polyethylene terephthalate and polybutylene terephthalate film and a fluorine resin film.
  • modified films such as these crosslinked films and ionomer films are also used. Further, it may be a laminated film in which a plurality of the same or different types of the above films are laminated.
  • (meth) acrylic acid in the present specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • polyolefin films are preferable, and polypropylene films and polyethylene films are particularly preferable.
  • polypropylene film a random copolymer polypropylene film is particularly preferable.
  • polyethylene film a low density polyethylene (LDPE) film is particularly preferable.
  • LDPE low density polyethylene
  • a random copolymer polypropylene film is most preferable. According to these resin films, the above-described physical properties are easily satisfied. These resin films are also preferable from the viewpoints of expandability, work stickability, chip peelability, and the like.
  • one surface or both surfaces may be subjected to a surface treatment such as an oxidation method or a concavo-convex method or a primer treatment as desired.
  • a surface treatment such as an oxidation method or a concavo-convex method or a primer treatment as desired.
  • the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment, and the like.
  • examples include a thermal spraying method.
  • the base material 2 may contain various additives, such as a coloring agent, a flame retardant, a plasticizer, an antistatic agent, a lubricant, a filler, in the said resin film.
  • additives such as a coloring agent, a flame retardant, a plasticizer, an antistatic agent, a lubricant, a filler, in the said resin film.
  • the resin film which comprises the base material 2 can be manufactured with the manufacturing method according to the kind of resin film, it is manufactured mainly by the T-die method of extrusion molding.
  • the resin film having the arithmetic average roughness (Ra) and the maximum height roughness (Rz) described above it is necessary to prevent air (bubbles) from being involved when forming the resin film.
  • the resin film without a bubble trace can be manufactured also by adjusting the surface roughness of each process rolls, such as a cooling roll at the time of film forming.
  • the manufacturing method of the resin film which has arithmetic mean roughness (Ra) and maximum height roughness (Rz) mentioned above is not limited to this.
  • the pressure-sensitive adhesive layer 3 included in the dicing sheet 1 according to the present embodiment may be made of a non-energy ray-curable pressure-sensitive adhesive or may be made of an energy-ray-curable pressure-sensitive adhesive.
  • the non-energy ray curable pressure-sensitive adhesive those having desired adhesive strength and removability are preferable.
  • Polyvinyl ether-based pressure-sensitive adhesives can be used.
  • an acrylic pressure-sensitive adhesive that can effectively prevent the workpiece or workpiece from falling off in a dicing step or the like is preferable.
  • the adhesive strength of the energy ray curable pressure-sensitive adhesive is reduced by energy ray irradiation, when the workpiece or workpiece and the dicing sheet 1 are to be separated, they can be easily separated by irradiation with energy rays. it can.
  • the energy ray-curable pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 may be composed mainly of a polymer having energy ray-curability, or may be a polymer having no energy ray-curability and many energy ray-curable properties. It may be based on a mixture of a functional monomer and / or an oligomer.
  • the energy ray curable adhesive is mainly composed of a polymer having energy ray curable properties.
  • the polymer having energy ray curability is a (meth) acrylic acid ester (co) polymer (A) (hereinafter referred to as “energy ray”) in which a functional group having energy ray curability (energy ray curable group) is introduced into the side chain. It may be referred to as “curable polymer (A)”).
  • This energy ray curable polymer (A) includes a (meth) acrylic copolymer (a1) having a functional group-containing monomer unit, and an unsaturated group-containing compound (a2) having a substituent bonded to the functional group. It is preferable that it is obtained by making it react.
  • the acrylic copolymer (a1) is composed of a structural unit derived from a functional group-containing monomer and a structural unit derived from a (meth) acrylic acid ester monomer or a derivative thereof.
  • the functional group-containing monomer as a constituent unit of the acrylic copolymer (a1) is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, an amino group, a substituted amino group, or an epoxy group in the molecule. It is preferable that
  • the functional group-containing monomer examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and the like. These may be used alone or in combination of two or more.
  • Examples of the (meth) acrylic acid ester monomer constituting the acrylic copolymer (a1) include alkyl (meth) acrylates having 1 to 20 carbon atoms in the alkyl group, cycloalkyl (meth) acrylates, and benzyl (meth) acrylates. Is used. Among these, particularly preferred are alkyl (meth) acrylates having an alkyl group having 1 to 18 carbon atoms, such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and n-butyl (meth) acrylate. 2-ethylhexyl (meth) acrylate or the like is used.
  • the acrylic copolymer (a1) usually contains 3 to 100% by mass, preferably 5 to 40% by mass of a structural unit derived from the functional group-containing monomer, and is a (meth) acrylic acid ester monomer or its
  • the structural unit derived from the derivative is usually contained in a proportion of 0 to 97% by mass, preferably 60 to 95% by mass.
  • the acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth) acrylic acid ester monomer or a derivative thereof in a conventional manner. Dimethylacrylamide, vinyl formate, vinyl acetate, styrene and the like may be copolymerized.
  • an energy beam curable polymer (A ) Is obtained.
  • the substituent of the unsaturated group-containing compound (a2) can be appropriately selected according to the type of functional group of the functional group-containing monomer unit of the acrylic copolymer (a1).
  • the substituent is preferably an isocyanate group or an epoxy group
  • the substituent is an amino group, a carboxyl group or an aziridinyl group. preferable.
  • the unsaturated group-containing compound (a2) contains 1 to 5, preferably 1 to 2, energy-polymerizable carbon-carbon double bonds per molecule.
  • Specific examples of such unsaturated group-containing compound (a2) include, for example, 2-methacryloyloxyethyl isocyanate, meta-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1,1- ( Bisacryloyloxymethyl) ethyl isocyanate; acryloyl monoisocyanate compound obtained by reaction of diisocyanate compound or polyisocyanate compound with hydroxyethyl (meth) acrylate; diisocyanate compound or polyisocyanate compound, polyol compound, and hydroxyethyl (meth) Acryloyl monoisocyanate compound obtained by reaction with acrylate; glycidyl (meth) acrylate; (meth) acrylic acid, 2-
  • the unsaturated group-containing compound (a2) is usually used in a proportion of 10 to 100 mol%, preferably 20 to 95 mol%, based on the functional group-containing monomer of the acrylic copolymer (a1).
  • the reaction temperature, pressure, solvent, time, presence of catalyst, catalyst can be selected as appropriate.
  • the functional group present in the acrylic copolymer (a1) reacts with the substituent in the unsaturated group-containing compound (a2), so that the unsaturated group is contained in the acrylic copolymer (a1). It introduce
  • the weight average molecular weight of the energy ray curable polymer (A) thus obtained is preferably 10,000 or more, particularly preferably 150,000 to 1,500,000, and more preferably 200,000 to 1,000,000. Is preferred.
  • the weight average molecular weight (Mw) in this specification is the value of polystyrene conversion measured by the gel permeation chromatography method (GPC method).
  • the energy ray-curable pressure-sensitive adhesive is mainly composed of a polymer having energy ray-curability
  • the energy ray-curable pressure-sensitive adhesive further contains an energy ray-curable monomer and / or oligomer (B). May be.
  • the energy ray-curable monomer and / or oligomer (B) for example, an ester of a polyhydric alcohol and (meth) acrylic acid or the like can be used.
  • Examples of the energy ray-curable monomer and / or oligomer (B) include monofunctional acrylic acid esters such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate, trimethylolpropane tri (meth) acrylate, penta Erythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol Polyfunctional acrylic esters such as di (meth) acrylate and dimethyloltricyclodecane di (meth) acrylate, polyester oligo (meth) acrylate, polyurethane oligo (meta Acrylate, and the like.
  • monofunctional acrylic acid esters such as
  • the content of the energy ray curable monomer and / or oligomer (B) in the energy ray curable pressure-sensitive adhesive is 5 to 80% by mass. It is preferable that the content be 20 to 60% by mass.
  • photopolymerization initiator (C) examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, ⁇ -chloranthraquinone, (2,4 6-trimethylbenzyldiphenyl) phosphine oxide, 2-benzothiazole-N, N-diethyldithiocarbamate, oligo ⁇ 2-hydroxy-2-me Le-1- [4-
  • the photopolymerization initiator (C) is energy beam curable copolymer (A) (when energy beam curable monomer and / or oligomer (B) is blended, energy beam curable copolymer (A). And energy ray-curable monomer and / or oligomer (B) in a total amount of 100 parts by weight) used in an amount in the range of 0.1 to 10 parts by weight, particularly 0.5 to 6 parts by weight, per 100 parts by weight. It is preferred that
  • other components may be appropriately blended in addition to the above components.
  • other components include a polymer component or oligomer component (D) that does not have energy beam curability, and a crosslinking agent (E).
  • Examples of the polymer component or oligomer component (D) having no energy ray curability include polyacrylates, polyesters, polyurethanes, polycarbonates, polyolefins, etc., and polymers having a weight average molecular weight (Mw) of 3,000 to 2.5 million. Or an oligomer is preferable.
  • crosslinking agent (E) a polyfunctional compound having reactivity with the functional group of the energy beam curable copolymer (A) or the like can be used.
  • polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts. And reactive phenol resins.
  • the blending amount of these other components is not particularly limited, and is appropriately determined in the range of 0 to 40 parts by mass with respect to 100 parts by mass of the energy beam curable copolymer (A).
  • the energy ray curable adhesive is mainly composed of a mixture of a polymer component having no energy ray curable property and an energy ray curable polyfunctional monomer and / or oligomer will be described below.
  • the polymer component having no energy beam curability for example, the same components as those of the acrylic copolymer (a1) described above can be used.
  • the content of the polymer component having no energy beam curability in the energy beam curable resin composition is preferably 20 to 99.9% by mass, and particularly preferably 30 to 80% by mass.
  • the energy ray-curable polyfunctional monomer and / or oligomer the same one as the above-mentioned component (B) is selected.
  • the blending ratio of the polymer component having no energy ray curability and the energy ray curable polyfunctional monomer and / or oligomer is 10 to 150 parts by mass of the polyfunctional monomer and / or oligomer with respect to 100 parts by mass of the polymer component.
  • the amount is preferably 25 to 100 parts by mass.
  • the photopolymerization initiator (C) and the crosslinking agent (E) can be appropriately blended as described above.
  • the thickness of the pressure-sensitive adhesive layer 3 is not particularly limited as long as it can function properly in each process in which the dicing sheet 1 is used. Specifically, the thickness is preferably 1 to 50 ⁇ m, particularly preferably 2 to 30 ⁇ m, and further preferably 3 to 20 ⁇ m.
  • the release sheet 6 in the present embodiment protects the pressure-sensitive adhesive layer 3 until the dicing sheet 1 is used.
  • the release sheet 6 in the present embodiment is directly laminated on the pressure-sensitive adhesive layer 3, but is not limited to this, and other layers (such as a die bonding film) are laminated on the pressure-sensitive adhesive layer 3,
  • the release sheet 6 may be laminated on the other layer.
  • the configuration of the release sheet 6 is arbitrary, and examples include a plastic film that has been subjected to a release treatment with a release agent or the like.
  • the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • the release agent silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
  • the thickness of the release sheet is not particularly limited, but is usually about 20 to 250 ⁇ m.
  • Manufacturing method of dicing sheet In order to manufacture the dicing sheet 1, as an example, an application for the pressure-sensitive adhesive layer containing the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 and optionally a solvent on the release surface of the release sheet 6. An adhesive is applied and dried to form the pressure-sensitive adhesive layer 3. Then, the base material 2 is crimped
  • the pressure-sensitive adhesive layer 3 in the present embodiment can be attached to a jig such as a ring frame.
  • a jig such as a ring frame.
  • the laminate of the base material 2 and the pressure-sensitive adhesive layer 3 may be half-cut if desired, and may have a desired shape, for example, a shape corresponding to a workpiece (semiconductor wafer). In this case, an excess portion generated by the half cut may be removed as appropriate.
  • the dicing sheet 1 according to the present embodiment is preferably used for stealth dicing. Moreover, it is preferable that the dicing sheet 1 according to the present embodiment is used for an application including an operation of imaging the workpiece located on the first surface side of the base material 2 from the second surface side of the base material 2. Specifically, in stealth dicing, a workpiece alignment mark or the like is imaged at a high magnification by a camera (for example, an infrared camera), and the workpiece is supported when performing an alignment operation for reading a dicing line based on the data. It is preferably used as a dicing sheet. Examples of the work include, but are not limited to, a semiconductor wafer and a glass substrate.
  • a method of manufacturing a chip by stealth dicing from a semiconductor wafer as a work as an example using the dicing sheet 1 according to the present embodiment will be described below.
  • laminated structure L a laminated structure having a configuration in which the semiconductor wafer 7 and the ring frame 8 are laminated on the surface of the dicing sheet 1 on the pressure-sensitive adhesive layer 3 side is obtained.
  • the laminated structure L is subjected to a stealth dicing process.
  • the laminated structure L is installed in a laser processing apparatus (laser dicer) for division processing, and an alignment mark attached to the dicing sheet 1 side of the semiconductor wafer 7 or the opposite side of the dicing sheet 1 is imaged with a camera. Then, an alignment operation for reading the dicing line is performed based on the data.
  • the type of camera is not particularly limited. For example, an infrared camera, a CCD camera, or the like is generally used.
  • the arithmetic average roughness (Ra) and the maximum height roughness (Rz) on the back surface of the base material 2 are set in a predetermined range, so that the light beam is on the back surface of the base material 2. Since the light passes through the dicing sheet 1 without being disturbed by irregularities due to bubbles or the like, the image of the alignment mark can reach the camera accurately, and high-magnification imaging can be performed with high accuracy, and therefore the alignment operation can be performed accurately. it can.
  • the laser dicer irradiates the semiconductor wafer 7 with a laser beam through the dicing sheet 1 along the read dicing line to form a modified layer in the semiconductor wafer 7.
  • the modified layer is reliably formed along a predetermined dicing line provided on the semiconductor wafer 7.
  • the surface roughness of the dicing sheet 1 is set as described above, the laser beam transparency is also excellent.
  • an expanding process for extending the dicing sheet 1 is performed to apply a force (tensile force in the main surface direction) to the semiconductor wafer 7.
  • the semiconductor wafer 7 adhered to the dicing sheet 1 is divided to obtain chips.
  • a chip is picked up from the dicing sheet 1 using a pickup device.
  • the reformed layer is reliably formed along a predetermined dicing line provided on the semiconductor wafer 7, so that the semiconductor wafer 7 is well divided, and therefore the workability of stealth dicing is It is very good.
  • another layer may be interposed between the base material 2 and the pressure-sensitive adhesive layer 3 in the dicing sheet 1. Further, another layer may be interposed between the pressure-sensitive adhesive layer 3 and the release sheet 6 in the dicing sheet 1.
  • the other layer include a die bonding film.
  • the dicing sheet 1 can be used as a dicing die bonding sheet.
  • Example 1 Production of base material A resin composition comprising a random copolymer polypropylene resin is extruded by a small T-die extruder (product name “Lab Plast Mill”, manufactured by Toyo Seiki Seisakusho Co., Ltd.), and from a resin film having a thickness of 70 ⁇ m. The base material which becomes was produced. When the surface roughness (arithmetic mean roughness (Ra) and maximum height roughness (Rz)) of the back surface of the obtained base material was measured by the method described later, it was as shown in Table 1.
  • a release sheet (product name “SP-PET381031” manufactured by Lintec Co., Ltd.) having a silicone release agent layer formed on one side of a 38 ⁇ m thick polyethylene terephthalate film was prepared.
  • the aforementioned adhesive layer coating agent was applied with a knife coater and dried to form an adhesive layer with a thickness of 20 ⁇ m.
  • the front surface of the base material prepared above was overlapped and bonded together to obtain a laminate composed of the base material (70 ⁇ m) / pressure-sensitive adhesive layer (20 ⁇ m) / release sheet.
  • the laminate obtained above was half-cut from the substrate side so as to cut the laminate of the substrate and the pressure-sensitive adhesive layer to form a circular dicing sheet having a diameter of 370 mm.
  • Example 2 to 3 and Comparative Examples 1 to 4 The base material which changed the surface roughness (arithmetic mean roughness (Ra) and maximum height roughness (Rz)) of the back surface of a base material as shown in Table 1 was produced. Dicing sheets of Examples 2 to 3 and Comparative Examples 1 to 4 were produced in the same manner as Example 1 except that the substrate was used.
  • the laminated structure was set on a laser dicer (manufactured by DISCO, product name “DFL7361”), and the infrared camera was focused on the dicing line of the semiconductor wafer through the dicing sheet.
  • the alignment screen high magnification setting
  • the dicing line can be recognized without any problem, and the dicing line was partially blurred but could be recognized.
  • the case was evaluated as ⁇ , and the case where the dicing line was unclear was evaluated as ⁇ .
  • Table 1 The results are shown in Table 1.
  • the modified layer was confirmed by a digital microscope (manufactured by Keyence Corporation, product name “VHX-1000”) at a magnification of 500 times in the cross section of the chip obtained by the stealth dicing.
  • ⁇ indicates that the modified layer at a certain interval was confirmed (good stealth dicing property)
  • x indicates that the modified layer interval was not constant or the modified layer was confirmed to be missing. It was evaluated as (stealth dicing failure). The results are shown in Table 1.
  • the dicing sheet according to the present invention is suitably used for applications including an operation of imaging a workpiece located on the first surface side of the base material from the second surface side of the base material, such as stealth dicing.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Materials For Medical Uses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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WO2013099778A1 (ja) * 2011-12-26 2013-07-04 三井・デュポンポリケミカル株式会社 レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法
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JP7400263B2 (ja) 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法

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TWI747985B (zh) 2021-12-01
KR102447761B1 (ko) 2022-09-27
JP6980684B2 (ja) 2021-12-15
CN110073468B (zh) 2023-01-10

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