WO2018066285A1 - Dispositif de balayage de faisceau, dispositif de dessin de motif et procédé d'examen de précision de dispositif de dessin de motif - Google Patents

Dispositif de balayage de faisceau, dispositif de dessin de motif et procédé d'examen de précision de dispositif de dessin de motif Download PDF

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Publication number
WO2018066285A1
WO2018066285A1 PCT/JP2017/031735 JP2017031735W WO2018066285A1 WO 2018066285 A1 WO2018066285 A1 WO 2018066285A1 JP 2017031735 W JP2017031735 W JP 2017031735W WO 2018066285 A1 WO2018066285 A1 WO 2018066285A1
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WIPO (PCT)
Prior art keywords
polygon mirror
scanning
origin
pattern
reflected
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PCT/JP2017/031735
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English (en)
Japanese (ja)
Inventor
加藤正紀
鬼頭義昭
林田洋祐
Original Assignee
株式会社ニコン
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to CN201780061776.6A priority Critical patent/CN109791281B/zh
Priority to JP2018543786A priority patent/JP7040453B2/ja
Priority to KR1020197012728A priority patent/KR102450792B1/ko
Publication of WO2018066285A1 publication Critical patent/WO2018066285A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems

Definitions

  • the present invention relates to a beam scanning device that scans a spot light of a beam irradiated on an irradiated surface of an object, a pattern drawing device that draws and exposes a predetermined pattern using such a beam scanning device, and a pattern drawing device
  • the present invention relates to an accuracy inspection method.
  • spot light of a laser beam is projected onto an object to be irradiated (processing object), and the object to be irradiated is orthogonal to the main scanning direction while the spot light is main-scanned in a one-dimensional direction by a scanning mirror (polygon mirror).
  • a laser processing apparatus for example, JP-A-2005-262260 shown below
  • an optical scanning device It is known to use an optical scanning device.
  • Japanese Patent Application Laid-Open No. 2005-262260 discloses a galvano that corrects the irradiation position on the workpiece by reflecting the laser beam from the oscillator 1 in the Y direction (sub-scanning direction).
  • a mirror a polygon mirror that reflects the laser beam reflected by the galvanometer mirror and scans the workpiece in the X direction (main scanning direction), and the laser beam reflected by the galvanometer mirror is condensed on the workpiece.
  • the reflection angle of the galvanometer mirror so as to correct the irradiation position error of the laser beam on the workpiece in correspondence with the distortion generated when the laser beam passes through the f ⁇ lens.
  • FIG. 8 of Japanese Patent Laid-Open No. 2005-262260 shows a laser light source that emits a detection laser beam for detecting the end of each reflecting surface of the polygon mirror while the polygon mirror is rotating, and each reflecting surface of the polygon mirror. And a detector for generating an edge detection signal by receiving the reflected light of the detection laser beam reflected at the edge of the laser, and the timing of pulse oscillation in the oscillator based on the edge detection signal is disclosed in Japanese Patent Laid-Open No. 2005-262260.
  • FIG. 9 A configuration for controlling as shown in FIG. 9 is shown.
  • a laser processing apparatus beam scanning apparatus
  • the processing time of a workpiece can be shortened and the productivity is increased as the polygon mirror is rotated at a higher speed. be able to.
  • the higher the rotation of the polygon mirror the more conspicuous the processing position in the main scanning direction becomes.
  • a processing beam is projected onto each of a plurality of reflecting surfaces of a rotary polygon mirror that rotates around a rotation axis, and the processing beam reflected by each of the plurality of reflecting surfaces is projected.
  • a beam scanning device for scanning on an irradiated object via a scanning optical system, wherein an origin signal is generated when each of the plurality of reflecting surfaces of the rotary polygon mirror has a predetermined specified angle.
  • a correction unit that generates a corrected origin signal corrected by a correction value corresponding to the amount of variation in the time interval of the origin signal generated corresponding to each of the plurality of reflection surfaces.
  • a drawing beam is projected onto each of a plurality of reflecting surfaces of a rotary polygon mirror that rotates about a rotation axis, and the drawing beam reflected by each of the plurality of reflecting surfaces is projected.
  • a pattern drawing apparatus for drawing a pattern on the irradiated object by scanning on the irradiated object via a scanning optical system, wherein each of the plurality of reflecting surfaces of the rotary polygon mirror has a predetermined prescribed value.
  • An origin detection unit that generates an origin signal each time an angle is reached, a drawing control unit that sets a predetermined delay time after the generation of the origin signal as a pattern drawing start time by the drawing beam, and the plurality of reflections
  • a correction unit that corrects the delay time set by the drawing control unit for each of the plurality of reflection surfaces by a correction value according to a variation in time interval at which each of the surfaces becomes the specified angle.
  • a drawing beam is projected onto each of a plurality of reflecting surfaces of a rotary polygon mirror that rotates around a rotation axis, and the drawing beam reflected by each of the plurality of reflecting surfaces is projected.
  • a pattern drawing apparatus for drawing a pattern on the substrate by scanning on a substrate supported by a support member via a scanning optical system, wherein each of the plurality of reflecting surfaces of the rotary polygon mirror is a predetermined one.
  • An origin detection unit that generates an origin signal each time the specified angle is reached, a drawing control unit that sets a predetermined delay time after generation of the origin signal as a pattern drawing start time by the drawing beam, and the plurality A correction unit that corrects the delay time set by the drawing control unit for each of the plurality of reflection surfaces by a correction value according to a variation in time interval at which each of the reflection surfaces becomes the specified angle; Support When the reference pattern formed on the material or the substrate is scanned with the drawing beam, the variation is obtained by measuring the time between the generation time of the reflected light generated from the reference pattern and the generation time of the origin signal. And a measurement unit that obtains a correction value according to.
  • a drawing beam is projected onto each of a plurality of reflecting surfaces of a rotary polygon mirror that rotates about a rotation axis, and the drawing beam reflected by each of the plurality of reflecting surfaces is projected.
  • a pattern drawing apparatus for drawing a pattern on the substrate by scanning on a substrate supported by a support member via a scanning optical system, wherein each of the plurality of reflecting surfaces of the rotary polygon mirror is a predetermined one.
  • An origin detection unit that generates an origin signal each time the specified angle is reached, a drawing control unit that sets a predetermined delay time after generation of the origin signal as a pattern drawing start time by the drawing beam, and the plurality A correction unit that corrects the delay time set by the drawing control unit for each of the plurality of reflection surfaces by a correction value according to a variation in time interval at which each of the reflection surfaces becomes the specified angle;
  • Support A photoelectric conversion element provided on a part of the support surface of the material, and a generation time of a photoelectric signal obtained when the photoelectric conversion element is scanned with the drawing beam and a generation time of the origin signal
  • a measuring unit that obtains a correction value corresponding to the variation by measuring the time between.
  • a drawing beam is projected onto each of a plurality of reflecting surfaces of a rotary polygon mirror that rotates about a rotation axis, and the drawing beam reflected by each of the plurality of reflecting surfaces is projected.
  • a method for inspecting the accuracy of a pattern drawing apparatus that condenses spot light on a substrate supported by a support member via a scanning optical system and scans in a main scanning direction, the plurality of rotating polygon mirrors Among the origin signals generated from the origin detection unit each time each of the reflective surfaces reaches a predetermined specified angle, the specific origin signal generated when the specific reflecting surface of the rotary polygon mirror reaches the specified angle
  • the step of setting the pattern for inspection to be drawn by scanning in the main scanning direction of the spot light by the specific reflecting surface, and the specific origin signal repeatedly generated by the rotation of the rotary polygon mirror Between intervals Drawing the inspection pattern while moving the substrate in the sub-scanning direction intersecting the main scanning direction by a distance smaller than the spot light size, and different the specific reflecting surface of the rotary polygon mirror
  • FIG. 3 is a diagram showing the arrangement of a polygon mirror, an f ⁇ lens system, a beam receiving system constituting an origin sensor, and the like in the drawing unit shown in FIG. 2 in an XY plane. It is the figure which simplified and showed arrangement
  • FIG. 5 is a plan view of the eight-sided polygon mirror shown in FIG. 3 or FIG. 4. It is a figure explaining the method to measure the reproducibility (variation) of the origin signal generation timing. It is the figure which represented typically the method of estimating the time error part by the speed fluctuation
  • variation of a polygon mirror. 10 is a graph showing a result of actually measuring the reproducibility of the origin signal generated corresponding to each of the reflection surfaces of the polygon mirror by a method as shown in FIG. 9 under a predetermined condition.
  • FIG. 12 is a graph showing the result of actually measuring the reproducibility of the origin signal generated corresponding to each of the reflection surfaces of the polygon mirror by the method shown in FIG. 9 under conditions different from those in FIG.
  • FIG. 5 is a diagram showing a state in which a continuous pattern of 5 pixels in the main scanning direction is drawn by superimposing 2 pulses of spot light per pixel on the main scanning direction and the sub-scanning direction at half the spot size. is there. 13 is a graph schematically showing a characteristic graph according to the actual measurement example of FIG. 12. It is a time chart explaining the production
  • FIG. 16 is a diagram illustrating an example of a configuration of a correction circuit (correction unit) that generates a corrected origin signal (corrected origin signal) by inputting an origin signal from a photoelectric conversion element as illustrated in FIG. 15.
  • a correction circuit correction unit
  • corrected origin signal corrected origin signal
  • FIG. 15 It is a figure which shows the structure of the origin sensor by the modification 2. It is a figure which shows an example of the waveform of the photoelectric signal generate
  • FIG. 20 is a time chart showing an example of measuring variations in the generation timing of the corrected origin signal or the origin time of the origin signal using the circuit configuration of FIG. 19.
  • FIG. It is a figure explaining the method of the test exposure for test
  • FIG. 1 is a perspective view showing a schematic configuration of an exposure apparatus (pattern drawing apparatus) EX that performs an exposure process on a substrate (irradiated body) P according to the first embodiment.
  • the exposure apparatus EX is a substrate processing apparatus used in a device manufacturing system for manufacturing an electronic device by performing predetermined processing (such as exposure processing) on the substrate P.
  • the device manufacturing system is a manufacturing system in which a manufacturing line for manufacturing, for example, a flexible display as an electronic device, a film-like touch panel, a film-like color filter for a liquid crystal display panel, flexible wiring, or a flexible sensor is constructed. System. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display.
  • a substrate P is sent from a supply roll (not shown) in which a flexible sheet-like substrate (sheet substrate) P is wound in a roll shape, and various processes are continuously performed on the sent substrate P.
  • the substrate P after various treatments is wound up by a collection roll (not shown), which is a so-called roll-to-roll production method. Therefore, the substrate P after various types of processing is a multi-sided substrate in which a plurality of devices (display panels) are arranged in a state where they are connected in the transport direction of the substrate P.
  • the substrate P sent from the supply roll is sequentially subjected to various processes through the process device in the previous process, the exposure apparatus EX, and the process apparatus in the subsequent process, and is taken up by the collection roll.
  • the substrate P has a belt-like shape in which the moving direction (transport direction) of the substrate P is the longitudinal direction (long direction) and the width direction is the short direction (short direction).
  • a resin film or a foil (foil) made of metal or alloy such as stainless steel is used.
  • the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Among them, one containing at least one or more may be used.
  • the thickness and rigidity (Young's modulus) of the substrate P are within a range in which folds and irreversible wrinkles due to buckling do not occur in the substrate P when passing through the transport path of the device manufacturing system or the exposure apparatus EX. I just need it.
  • a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 ⁇ m to 200 ⁇ m is typical of a suitable sheet substrate.
  • the substrate P may receive heat in each process performed in the device manufacturing system, it is preferable to select the substrate P made of a material whose thermal expansion coefficient is not significantly large.
  • the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film.
  • the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide.
  • the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, etc. are bonded to the ultrathin glass. It may be.
  • the flexibility of the substrate P means the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. .
  • flexibility includes a property of bending by a force of about its own weight.
  • the degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature or humidity, and the like. In any case, when the substrate P is correctly wound around the various transfer rollers provided in the transfer path in the device manufacturing system (exposure apparatus EX) and the transfer direction changing member such as the rotating drum, the substrate P buckles and the crease is formed. If the substrate P can be smoothly transported without being attached or damaged (breaking or cracking), it can be said to be in the range of flexibility.
  • the process device (including a single processing unit or a plurality of processing units) in the preceding process transports the substrate P sent from the supply roll along the longitudinal direction at a predetermined speed toward the exposure apparatus EX. Then, the previous process is performed on the substrate P sent to the exposure apparatus EX.
  • the substrate P sent to the exposure apparatus EX by this pre-process is a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.
  • This photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film).
  • a typical photosensitive functional layer is a photoresist (in liquid or dry film form), but as a material that does not require development processing, the photosensitivity of the part that has been irradiated with ultraviolet rays is modified.
  • SAM silane coupling agent
  • a photosensitive reducing agent When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic.
  • a thin film transistor (TFT) or the like can be formed by selectively applying a conductive ink (ink containing conductive nanoparticles such as silver or copper) or a liquid containing a semiconductor material on the lyophilic portion.
  • a pattern layer to be an electrode, a semiconductor, insulation, or a wiring for connection can be formed.
  • the plating reducing group is exposed to the pattern portion exposed to ultraviolet rays on the substrate P. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions for a certain period of time, so that a pattern layer of palladium is formed (deposited).
  • Such a plating process is an additive process, but may be based on an etching process as a subtractive process.
  • the substrate P sent to the exposure apparatus EX is made of PET or PEN as a base material, and a metal thin film such as aluminum (Al) or copper (Cu) is vapor-deposited on the entire surface or selectively. It is preferable that a photoresist layer is laminated on the substrate.
  • the exposure apparatus (processing apparatus) EX transports the substrate P, which has been transported from the previous process apparatus, to a subsequent process apparatus (including a single processing section or a plurality of processing sections) at a predetermined speed. However, it is a processing apparatus that performs an exposure process on the substrate P.
  • the exposure apparatus EX uses light corresponding to a pattern for an electronic device (for example, a pattern of electrodes and wiring of TFTs constituting the electronic device) on the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface). Irradiate the pattern. Thereby, a latent image (modified portion) corresponding to the pattern is formed on the photosensitive functional layer.
  • the exposure apparatus EX is a direct drawing type exposure apparatus that does not use a mask as shown in FIG. 1, that is, a so-called spot scanning type exposure apparatus (drawing apparatus).
  • the exposure apparatus EX performs pattern exposure for each part of the rotating drum DR that supports the substrate P and conveys it in the longitudinal direction for sub-scanning, and the substrate P that is supported in a cylindrical surface by the rotating drum DR.
  • drawing units Un U1 to U6
  • each of the plurality of drawing units Un receives spot light SP of a pulsed beam LB (pulse beam) for exposure
  • the intensity of the spot light SP is measured with pattern data (drawing data) while one-dimensionally scanning (main scanning) with a polygon mirror (scanning member) in a predetermined scanning direction (Y direction) on the irradiated surface (photosensitive surface) of the substrate P.
  • Modulation on / off at high speed according to the pattern information).
  • a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the irradiated surface of the substrate P.
  • the spot light SP is relatively two-dimensionally scanned on the surface to be irradiated (the surface of the photosensitive functional layer) of the substrate P by the sub-scanning of the substrate P and the main scanning of the spot light SP.
  • a predetermined pattern is drawn and exposed on the irradiated surface.
  • a plurality of exposed areas where the pattern is exposed by the exposure apparatus EX are provided at predetermined intervals along the longitudinal direction of the substrate P. It will be. Since an electronic device is formed in this exposed region, the exposed region is also a device forming region.
  • the rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the direction in which gravity works, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo.
  • the rotating drum DR rotates around the central axis AXo while supporting (holding) a part of the substrate P by bending the outer surface (circumferential surface) into a cylindrical surface in the longitudinal direction. P is transported in the longitudinal direction.
  • the rotating drum DR supports an area (part) on the substrate P onto which the beam LB (spot light SP) from each of the plurality of drawing units Un (U1 to U6) is projected on its outer peripheral surface.
  • the rotating drum DR supports (holds and holds) the substrate P from the surface (back surface) opposite to the surface on which the electronic device is formed (surface on which the photosensitive surface is formed).
  • shafts (not shown) supported by bearings are provided so as to rotate the rotating drum DR around the central axis AXo.
  • the shaft is given a rotational torque from a rotational drive source (not shown) (for example, a motor or a speed reduction mechanism), and the rotary drum DR rotates around the central axis AXo at a constant rotational speed.
  • the light source device (pulse light source device) LS generates and emits a pulsed beam (pulse beam, pulse light, laser) LB.
  • This beam LB is ultraviolet light having sensitivity to the photosensitive layer of the substrate P and having a peak wavelength in a wavelength band of 370 nm or less.
  • the light source device LS emits and emits a pulsed beam LB at a frequency (oscillation frequency, predetermined frequency) Fa according to control of a drawing control device (not shown).
  • the light source device LS includes a semiconductor laser element that generates pulsed light in the infrared wavelength range, a fiber amplifier, and a wavelength conversion element (harmonic) that converts the amplified pulsed light in the infrared wavelength range into pulsed light in the ultraviolet wavelength range.
  • a fiber amplifier laser light source including a wave generating element).
  • the light source device LS is a fiber amplifier laser light source and the pulse generation of the beam LB is turned on / off at high speed according to the state of the pixels constituting the drawing data (logical value “0” or “1”). This is disclosed in the pamphlet of published No. 2015/166910.
  • a beam LB emitted from the light source device LS includes a selection optical element OSn (OS1 to OS6) as a plurality of switching elements, a plurality of reflection mirrors M1 to M12, a plurality of incident mirrors IMn (IM1 to IM6), The light is selectively (alternatively) supplied to each of the drawing units Un (U1 to U6) via a beam switching unit including an absorber TR and the like.
  • the selection optical elements OSn (OS1 to OS6) are transmissive to the beam LB, and are driven by an ultrasonic signal to deflect and emit the first-order diffracted light of the incident beam LB at a predetermined angle.
  • An acousto-optic modulator (AOM: Acousto-Optic Modulator).
  • the plurality of selection optical elements OSn and the plurality of incident mirrors IMn are provided corresponding to each of the plurality of drawing units Un.
  • the selection optical element OS1 and the incident mirror IM1 are provided corresponding to the drawing unit U1
  • the selection optical element OS2 to OS6 and the incidence mirror IM2 to IM6 correspond to the drawing units U2 to U6, respectively. Is provided.
  • the beam LB from the light source device LS is guided to the absorber TR by the reflection mirrors M1 to M12 having its optical path bent in a spiral shape.
  • OSn selection optical elements
  • OS6 selection optical elements
  • an off state a state where no ultrasonic signal is applied and no first-order diffracted light is generated
  • a plurality of lenses are provided in the beam optical path from the reflection mirror M1 to the absorber TR, and the plurality of lenses converge the beam LB from the parallel light flux or after convergence.
  • the diverging beam LB is returned to a parallel light beam. The configuration will be described later with reference to FIG.
  • the beam LB from the light source device LS travels in the ⁇ X direction parallel to the X axis and enters the reflection mirror M1.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M1 enters the reflection mirror M2.
  • the beam LB reflected in the + X direction by the reflection mirror M2 passes straight through the selection optical element OS5 and reaches the reflection mirror M3.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M3 enters the reflection mirror M4.
  • the beam LB reflected in the ⁇ X direction by the reflection mirror M4 passes straight through the selection optical element OS6 and reaches the reflection mirror M5.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M5 enters the reflection mirror M6.
  • the beam LB reflected in the + X direction by the reflection mirror M6 passes straight through the selection optical element OS3 and reaches the reflection mirror M7.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M7 enters the reflection mirror M8.
  • the beam LB reflected in the ⁇ X direction by the reflection mirror M8 passes straight through the selection optical element OS4 and reaches the reflection mirror M9.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M9 enters the reflection mirror M10.
  • the beam LB reflected in the + X direction by the reflection mirror M10 passes straight through the selection optical element OS1 and reaches the reflection mirror M11.
  • the beam LB reflected in the ⁇ Y direction by the reflection mirror M11 enters the reflection mirror M12.
  • the beam LB reflected in the ⁇ X direction by the reflection mirror M12 passes straight through the selection optical element OS2 and is guided to the absorber TR.
  • the absorber TR is an optical trap that absorbs the beam LB in order to suppress leakage of the beam LB to the outside.
  • each of the selection optical elements OSn (OS1 to OS6) has a function of deflecting the optical path of the beam LB from the light source device LS.
  • the beam LBn (LB1 to LB6) deflected by each of the selection optical elements OSn is the original. It is lower than the intensity of the beam LB.
  • the drawing control device controls the selected optical element OSn (OS1 to OS6) so that only one of the selected optical elements OSn (OS1 to OS6) is turned on for a predetermined time.
  • one selected optical element OSn is in the ON state, about 20% of zero-order light that travels straight without being diffracted by the optical element for selection OSn remains, but it is finally absorbed by the absorber TR.
  • Each of the selection optical elements OSn is installed so as to deflect the beam LBn (LB1 to LB6) which is the deflected first-order diffracted light in the ⁇ Z direction with respect to the incident beam LB.
  • Beams LBn (LB1 to LB6) deflected and emitted from each of the selection optical elements OSn are projected onto incident mirrors IMn (IM1 to IM6) provided at positions away from each of the selection optical elements OSn by a predetermined distance. Is done.
  • Each incident mirror IMn reflects the incident beam LBn (LB1 to LB6) in the ⁇ Z direction, thereby guiding the beam LBn (LB1 to LB6) to the corresponding drawing unit Un (U1 to U6).
  • each selection optical element OSn may be used.
  • Each of the plurality of optical elements for selection OSn turns on / off generation of diffracted light obtained by diffracting the incident beam LB in accordance with on / off of a drive signal (ultrasonic signal) from the drawing control device.
  • the selection optical element OS5 transmits the incident beam LB from the light source device LS without diffracting it when the drive signal (high frequency signal) from the drawing control device is not applied and is in the off state. Therefore, the beam LB transmitted through the selection optical element OS5 enters the reflection mirror M3.
  • the selection optical element OS5 is in the on state, the incident beam LB is diffracted and directed to the incident mirror IM5.
  • the switching (beam selection) operation by the selection optical element OS5 is controlled by turning on / off the drive signal.
  • the switching operation of each selection optical element OSn can guide the beam LB from the light source device LS to any one drawing unit Un, and switch the drawing unit Un on which the beam LBn is incident. Can do.
  • a configuration in which a plurality of optical elements for selection OSn are arranged in series with respect to the beam LB from the light source device LS and the beam LBn is supplied to the corresponding drawing unit Un in a time-sharing manner. This is disclosed in the pamphlet of published No. 2015/166910.
  • each of the selection optical elements OSn (OS1 to OS6) constituting the beam switching unit is turned on for a predetermined time is, for example, OS1 ⁇ OS2 ⁇ OS3 ⁇ OS4 ⁇ OS5 ⁇ OS6 ⁇ OS1 ⁇ .
  • This order is determined by the order of the scanning start timing by the spot light set in each of the drawing units Un (U1 to U6). That is, in the present embodiment, any one of the drawing units U1 to U6 is synchronized with the rotation speed of the polygon mirror provided in each of the six drawing units U1 to U6 in synchronization with the rotation angle phase. It is possible to switch to the time division so that one reflection surface of the polygon mirror in one of them performs one spot scanning on the substrate P.
  • the order of spot scanning of the drawing unit Un may be any as long as the phase of the rotation angle of each polygon mirror of the drawing unit Un is synchronized in a predetermined relationship.
  • three drawing units U1, U3, U5 are arranged in the Y direction on the upstream side in the transport direction of the substrate P (the direction in which the outer peripheral surface of the rotary drum DR moves in the circumferential direction).
  • Three drawing units U2, U4, U6 are arranged in the Y direction on the downstream side in the transport direction.
  • pattern drawing on the substrate P is started from the upstream odd-numbered drawing units U1, U3, and U5. Since pattern drawing is also started, the order of spot scanning of the drawing unit Un can be set as U1 ⁇ U3 ⁇ U5 ⁇ U2 ⁇ U4 ⁇ U6 ⁇ U1 ⁇ . Therefore, the order in which each of the selection optical elements OSn (OS1 to OS6) is turned on for a predetermined time is determined as OS1 ⁇ OS3 ⁇ OS5 ⁇ OS2 ⁇ OS4 ⁇ OS6 ⁇ OS1 ⁇ . Even when the selection optical element OSn corresponding to the drawing unit Un having no pattern to be drawn is in the turn-on order, the on / off switching control of the selection optical element OSn is performed based on the drawing data. By doing so, the spot is forcibly maintained in the off state, so spot scanning by the drawing unit Un is not performed.
  • each of the drawing units U1 to U6 is provided with a polygon mirror PM for main scanning the incident beams LB1 to LB6.
  • the polygon mirrors PM of the respective drawing units Un are synchronously controlled so as to maintain a constant rotational angle phase with each other while precisely rotating at the same rotational speed.
  • the main scanning timing (main scanning period of the spot light SP) of each of the beams LB1 to LB6 projected onto the substrate P from each of the drawing units U1 to U6 can be set so as not to overlap each other.
  • each of the selection optical elements OSn (OS1 to OS6) provided in the beam switching unit is controlled in synchronization with the rotation angle positions of the six polygon mirrors PM, thereby providing a light source.
  • An efficient exposure process can be performed in which the beam LB from the apparatus LS is distributed in time division to each of the plurality of drawing units Un.
  • the exposure apparatus EX is a so-called multi-head direct drawing exposure method in which a plurality of drawing units Un (U1 to U6) having the same configuration are arranged.
  • Each of the drawing units Un draws a pattern for each partial region partitioned in the Y direction of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotary drum DR.
  • Each drawing unit Un (U1 to U6) condenses (converges) the beam LBn on the substrate P while projecting the beam LBn from the beam switching unit onto the substrate P (on the irradiated surface of the substrate P). Thereby, the beam LBn (LB1 to LB6) projected onto the substrate P becomes the spot light SP.
  • the spot light SP of the beam LBn (LB1 to LB6) projected on the substrate P is scanned in the main scanning direction (Y direction) by the rotation of the polygon mirror PM of each drawing unit Un.
  • the drawing line SLn is also a scanning locus on the substrate P of the spot light SP of the beam LBn.
  • the drawing unit U1 scans the spot light SP along the drawing line SL1, and similarly, the drawing units U2 to U6 scan the spot light SP along the drawing lines SL2 to SL6.
  • the drawing lines SLn (SL1 to SL6) of the plurality of drawing units Un (U1 to U6) include a central plane that includes the central axis AXo of the rotary drum DR and is parallel to the YZ plane. It is arranged in a staggered arrangement in two rows in the circumferential direction of DR.
  • the odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate P on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center surface, and along the Y direction. They are arranged in a row at a predetermined interval.
  • the even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center surface, and are predetermined along the Y direction. Are arranged in a row separated by an interval of.
  • a plurality of drawing units Un (U1 to U6) are also arranged in a staggered arrangement in two rows in the transport direction of the substrate P across the center plane, and odd-numbered drawing units U1, U3, U5 and even-numbered drawing
  • the units U2, U4, and U6 are provided symmetrically with respect to the center plane when viewed in the XZ plane.
  • the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 are separated from each other, but the Y direction (the width direction of the substrate P).
  • the main scanning direction) is set to be joined without being separated from each other.
  • the drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotary drum DR.
  • joining the drawing lines SLn in the Y direction means that the positions of the ends of the drawing lines SLn are adjacent or partially overlapped.
  • the length of each drawing line SLn may be overlapped within a range of several percent or less in the Y direction including the drawing start point or the drawing end point. .
  • the plurality of drawing units Un share the Y-direction scanning area (the main scanning range section) so as to cover the width dimension of the exposure area on the substrate P in total. ing.
  • the main scanning range in the Y direction the length of the drawing line SLn
  • drawing can be performed by arranging a total of six drawing units U1 to U6 in the Y direction.
  • the width in the Y direction of a large exposure area is increased to about 180 to 360 mm.
  • the length of each drawing line SLn (SL1 to SL6) (length of the drawing range) is basically the same. That is, the scanning distance of the spot light SP of the beam LBn scanned along each of the drawing lines SL1 to SL6 is basically the same.
  • the spot light SP projected on the drawing line SLn during the main scanning is the beam It becomes discrete according to the oscillation frequency Fa (for example, 400 MHz) of the LB. Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction.
  • the amount of overlap is set by the size ⁇ of the spot light SP, the scanning speed (main scanning speed) Vs of the spot light SP, and the oscillation frequency Fa of the beam LB.
  • the effective size (diameter) ⁇ of the spot light SP is 1 / e 2 (or 1/2) of the peak intensity of the spot light SP when the intensity distribution of the spot light SP is approximated by a Gaussian distribution. Determined by width dimension.
  • the scanning speed Vs of the spot light SP rotational speed of the polygon mirror PM
  • the spot light SP so that the spot light SP overlaps the effective size (dimension) ⁇ by about ⁇ ⁇ 1 ⁇ 2.
  • the oscillation frequency Fa is set. Therefore, the projection interval along the main scanning direction of the pulsed spot light SP is ⁇ / 2.
  • the substrate P is effective for the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning. It is desirable to set so as to move by a distance of about 1 ⁇ 2 of a large size ⁇ . Further, when drawing lines SLn adjacent in the Y direction are continued in the main scanning direction, it is desirable to overlap by ⁇ / 2. In the present embodiment, the size (dimension) ⁇ of the spot light SP is set to about 3 to 4 ⁇ m.
  • Each drawing unit Un (U1 to U6) is set so that each beam LBn travels toward the central axis AXo of the rotary drum DR when viewed in the XZ plane.
  • the optical path (beam principal ray) of the beam LBn traveling from each drawing unit Un (U1 to U6) toward the substrate P becomes parallel to the normal line of the irradiated surface of the substrate P in the XZ plane.
  • the beam LBn irradiated from each of the drawing units Un (U1 to U6) to the drawing line SLn (SL1 to SL6) is relative to the tangential plane at the drawing line SLn on the surface of the substrate P curved into a cylindrical surface. It is projected toward the substrate P so as to be always vertical. That is, with respect to the main scanning direction of the spot light SP, the beams LBn (LB1 to LB6) projected onto the substrate P are scanned in a telecentric state.
  • the drawing unit U1 includes at least reflecting mirrors M20 to M24, a polygon mirror PM, and an f ⁇ lens system (drawing scanning lens) FT.
  • a first cylindrical lens CYa (see FIG. 2) is disposed in front of the polygon mirror PM when viewed from the traveling direction of the beam LB1, and an f ⁇ lens system (f- ⁇ lens) is provided.
  • a second cylindrical lens CYb (see FIG. 2) is provided after the FT.
  • the first cylindrical lens CYa and the second cylindrical lens CYb correct the position variation in the sub-scanning direction of the spot light SP (drawing line SL1) due to the tilt error of each reflecting surface of the polygon mirror PM.
  • the beam LB1 reflected in the ⁇ Z direction by the incident mirror IM1 enters the reflection mirror M20 provided in the drawing unit U1, and the beam LB1 reflected by the reflection mirror M20 advances in the ⁇ X direction and enters the reflection mirror M21.
  • the beam LB1 reflected in the ⁇ Z direction by the reflection mirror M21 enters the reflection mirror M22, and the beam LB1 reflected by the reflection mirror M22 advances in the + X direction and enters the reflection mirror M23.
  • the reflection mirror M23 reflects the incident beam LB1 toward the reflection surface RP of the polygon mirror PM so as to be bent in a plane parallel to the XY plane.
  • the polygon mirror PM reflects the incident beam LB1 toward the + ⁇ direction toward the f ⁇ lens system FT.
  • the polygon mirror PM deflects (reflects) the incident beam LB1 one-dimensionally in a plane parallel to the XY plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate P.
  • the polygon mirror (rotating polygonal mirror, movable deflecting member) PM includes a rotating shaft AXp extending in the Z-axis direction and a plurality of reflecting surfaces RP (reflecting in the present embodiment) formed around the rotating shaft AXp.
  • the number of planes RP is assumed to be 8).
  • the reflection angle of the pulsed beam LB1 irradiated on the reflection surface can be continuously changed by rotating the polygon mirror PM around the rotation axis AXp in a predetermined rotation direction.
  • the beam LB1 is deflected by one reflecting surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate P is scanned along the main scanning direction (the width direction of the substrate P, the Y direction). can do.
  • the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate P by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP.
  • the f ⁇ lens system (scanning lens, scanning optical system) FT is a telecentric scanning lens that projects the beam LB1 reflected by the polygon mirror PM onto the reflecting mirror M24.
  • the beam LB1 transmitted through the f ⁇ lens system FT is projected onto the substrate P as the spot light SP through the reflection mirror M24.
  • the reflection mirror M24 reflects the beam LB1 toward the substrate P so that the beam LB1 travels toward the central axis AXo of the rotary drum DR with respect to the XZ plane.
  • the incident angle ⁇ of the beam LB1 to the f ⁇ lens system FT varies depending on the rotation angle ( ⁇ / 2) of the polygon mirror PM.
  • the f ⁇ lens system FT projects the beam LB1 to the image height position on the irradiated surface of the substrate P in proportion to the incident angle ⁇ through the reflection mirror M24.
  • the focal length of the f ⁇ lens system FT is fo and the image height position is yo
  • a surface (parallel to the XY plane) on which the beam LB1 incident on the f ⁇ lens system FT is deflected in one dimension by the polygon mirror PM is a surface including the optical axis AXf of the f ⁇ lens system FT.
  • the optical configuration of the drawing units Un (U1 to U6) will be described with reference to FIG.
  • the drawing unit Un along the traveling direction of the beam LBn from the incident position of the beam LBn to the irradiated surface (substrate P), the reflection mirror M20, the reflection mirror M20a, and the polarization beam splitter BS1.
  • an origin detection sensor (origin point) that detects the angular position of each reflecting surface of the polygon mirror PM in order to detect the drawing start possible timing (scanning start timing of the spot light SP) of the drawing unit Un.
  • a beam transmitting system 60a and a beam receiving system 60b are provided as detectors.
  • the reflected light of the beam LBn reflected by the irradiated surface of the substrate P (or the surface of the rotating drum DR) is converted into the f ⁇ lens system FT, the polygon mirror PM, the polarization beam splitter BS1, and the like.
  • a photodetector DTc is provided for detection via
  • the beam LBn incident on the drawing unit Un travels in the ⁇ Z direction along the optical axis AX1 parallel to the Z axis, and is incident on the reflection mirror M20 inclined by 45 ° with respect to the XY plane.
  • the beam LBn reflected by the reflection mirror M20 travels in the ⁇ X direction toward the reflection mirror M20a that is separated from the reflection mirror M20 in the ⁇ X direction.
  • the reflection mirror M20a is disposed with an inclination of 45 ° with respect to the YZ plane, and reflects the incident beam LBn toward the polarization beam splitter BS1 in the ⁇ Y direction.
  • the polarization separation surface of the polarization beam splitter BS1 is disposed at an angle of 45 ° with respect to the YZ plane, reflects a P-polarized beam, and transmits a linearly polarized (S-polarized) beam polarized in a direction orthogonal to the P-polarized light. If the beam LBn incident on the drawing unit Un is a P-polarized beam, the polarization beam splitter BS1 reflects the beam LBn from the reflection mirror M20a in the ⁇ X direction and guides it to the reflection mirror M21 side.
  • the reflection mirror M21 is disposed at an angle of 45 ° with respect to the XY plane, and reflects the incident beam LBn in the ⁇ Z direction toward the reflection mirror M22 that is separated from the reflection mirror M21 in the ⁇ Z direction.
  • the beam LBn reflected by the reflection mirror M21 enters the reflection mirror M22.
  • the reflection mirror M22 is disposed with an inclination of 45 ° with respect to the XY plane, and reflects the incident beam LBn toward the reflection mirror M23 in the + X direction.
  • the beam LBn reflected by the reflection mirror M22 enters the reflection mirror M23 via a ⁇ / 4 wavelength plate (not shown) and a cylindrical lens CYa.
  • the reflection mirror M23 reflects the incident beam LBn toward the polygon mirror PM.
  • the polygon mirror PM reflects the incident beam LBn toward the + X direction toward an f ⁇ lens system FT having an optical axis AXf parallel to the X axis.
  • the polygon mirror PM deflects (reflects) the incident beam LBn one-dimensionally in a plane parallel to the XY plane in order to scan the spot light SP of the beam LBn on the irradiated surface of the substrate P.
  • the polygon mirror PM has a plurality of reflecting surfaces (each side of a regular octagon in this embodiment) formed around a rotation axis AXp extending in the Z-axis direction, and is rotated by a rotation motor RM coaxial with the rotation axis AXp. Is done.
  • the rotation motor RM is rotated at a constant rotation speed (for example, about 30,000 to 40,000 rpm) by a drawing control device (not shown).
  • the effective length (for example, 50 mm) of the drawing lines SLn is the maximum scanning length (for example, 52 mm) at which the spot light SP can be scanned by the polygon mirror PM.
  • the length is set as follows, and in the initial setting (design), the center point of the drawing line SLn (the point through which the optical axis AXf of the f ⁇ lens system FT passes) is set at the center of the maximum scanning length.
  • the cylindrical lens CYa converges the incident beam LBn on the reflection surface of the polygon mirror PM in the sub-scanning direction (Z direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the beam LBn in a slit shape (ellipse shape) extending in a direction parallel to the XY plane on the reflection surface of the polygon mirror PM. Even when the reflection surface of the polygon mirror PM is tilted from a state parallel to the Z axis by a cylindrical lens CYa whose generating line is parallel to the Y direction and a cylindrical lens CYb described later, the substrate P is irradiated. It is possible to prevent the irradiation position of the beam LBn (drawing line SLn) irradiated on the surface from shifting in the sub-scanning direction.
  • a slit shape ellipse shape
  • the incident angle ⁇ of the beam LBn to the f ⁇ lens system FT (the angle with respect to the optical axis AXf) varies depending on the rotation angle ( ⁇ / 2) of the polygon mirror PM.
  • the incident angle ⁇ of the beam LBn to the f ⁇ lens system FT is 0 degree
  • the beam LBn incident on the f ⁇ lens system FT advances along the optical axis AXf.
  • the beam LBn from the f ⁇ lens system FT is reflected in the ⁇ Z direction by the reflecting mirror M24, and is projected toward the substrate P through the cylindrical lens CYb.
  • the beam LBn projected onto the substrate P by the f ⁇ lens system FT and the cylindrical lens CYb whose generating line is parallel to the Y direction is a minute spot light having a diameter of about several ⁇ m (for example, 2 to 3 ⁇ m) on the irradiated surface of the substrate P. Converged to SP.
  • the beam LBn incident on the drawing unit Un is bent along the optical path cranked in a U-shape from the reflection mirror M20 to the substrate P when viewed in the XZ plane, and proceeds in the ⁇ Z direction to the substrate. Projected to P.
  • Each of the six drawing units U1 to U6 scans the spot light SP of the beams LB1 to LB6 one-dimensionally in the main scanning direction (Y direction) and conveys the substrate P in the longitudinal direction, thereby The irradiated surface is relatively two-dimensionally scanned by the spot light SP, and the pattern drawn on each of the drawing lines SL1 to SL6 is exposed on the substrate P in a state where the patterns are joined in the Y direction.
  • the effective scanning length LT of the drawing lines SLn is 50 mm
  • the effective diameter ⁇ of the spot light SP is 4 ⁇ m
  • the oscillation frequency Fa of the pulse emission of the beam LB from the light source device LS is 400 MHz.
  • the pulsed light is emitted so that the spot light SP overlaps by 1/2 of the diameter ⁇ along the drawing line SLn (main scanning direction)
  • the pixel size Pxy defined on the drawing data is set to 4 ⁇ m square on the substrate P, and one pixel is exposed by two pulses of the spot light SP in each of the main scanning direction and the sub-scanning direction.
  • the scanning speed Vsp is increased, it is necessary to improve the reproducibility of the generation timing of the origin signal from the origin sensors (the beam transmission system 60a and the beam reception system 60b) that determine the pattern drawing start timing.
  • the minimum dimension (minimum line width) of a pattern to be drawn is 8 ⁇ m (for two pixels)
  • a new pattern is superimposed on the pattern already formed on the substrate P and exposed.
  • the overlay accuracy (allowable position error range) in the second exposure is required to be about 1 ⁇ 4 to 5 of the minimum line width. That is, when the minimum line width is 8 ⁇ m, the allowable position error range is 2 ⁇ m to 1.6 ⁇ m.
  • This value is equal to or less than the interval of two pulses of the spot light SP corresponding to the oscillation period Tf (2.5 nS) of the beam LB from the light source device LS, and it is confirmed that an error for one pulse of the spot light SP is not allowed. means. For this reason, the reproducibility of the origin signal generation timing that determines the pattern drawing start timing (start position) needs to be set to a period Tf (2.5 nS) or less.
  • the beam receiving system 60b that constitutes the origin detection sensor (hereinafter also simply referred to as the origin sensor) shown in FIG.
  • the origin signal SZn is generated when a predetermined position immediately before the start of scanning is reached. Since the polygon mirror PM has eight reflecting surfaces RP, the beam receiving system 60b outputs eight origin signals SZn during one rotation of the polygon mirror PM.
  • the origin signal SZn is sent to a drawing control device (not shown), and after the origin signal SZn is generated, scanning of the spot light SP along the drawing line SLn is started after a predetermined delay time Tdn has elapsed.
  • FIG. 3 is a view of the arrangement of the beam receiving system 60b constituting the polygon mirror PM, the f ⁇ lens system FT, the origin sensor (origin origin detector) and the like in the drawing unit Un in the XY plane.
  • the laser beam Bga from the beam transmission system 60a is projected toward one reflecting surface RPa of the reflecting surfaces RP of the polygon mirror PM, and the drawing beam LBn scanned in the angle range ⁇ f is projected.
  • the angle state of the reflective surface RPa at the moment when the spot light SP is located at the drawing start point of the drawing line SLn is shown.
  • the reflection surface RP (RPa) of the polygon mirror PM is disposed so as to be positioned on the entrance pupil plane orthogonal to the optical axis AXf of the f ⁇ lens system FT.
  • the beam LBn traveling from the reflecting mirror M23 toward the polygon mirror PM A reflection surface RP (RPa) is set at a position where the principal ray and the optical axis AXf intersect.
  • the distance from the main surface of the f ⁇ lens system FT to the surface of the substrate P (the condensing point of the spot light SP) is the focal length fo.
  • the laser beam Bga is projected onto the reflecting surface RPa as a parallel light flux in a non-photosensitive wavelength range with respect to the photosensitive functional layer of the substrate P.
  • the reflected beam Bgb of the laser beam Bga reflected by the reflecting surface RPa is directed toward the f ⁇ lens system FT in the state of FIG. 3, but the reflecting surface RPa is reflected by the reflecting surface a predetermined time before the position of FIG.
  • the reflected beam Bgb is incident on the lens system (optical element) GLb constituting the beam receiving system 60b, reflected by the reflecting mirror Mb, and reaches the photoelectric conversion element (photoelectric detector) DTo. .
  • the reflected beam Bgb (parallel light beam) is condensed as spot light SPr on the light receiving surface of the photoelectric conversion element DTo by the lens system GLb, and while the reflected beam Bgb is incident on the lens system GLb, the spot light SPr is converted into a polygon mirror. As the PM rotates, scanning is performed across the light receiving surface of the photoelectric conversion element DTo, and the photoelectric conversion element (narrow origin detector) DTo generates an origin signal SZn. In the present embodiment, in order to improve the reproducibility of the generation timing of the origin signal SZn, the origin detection reflected beam Bgb is compared with the scanning speed Vsp of the spot light SP of the drawing beam LBn on the substrate P.
  • the focal length of the lens system GLb is made larger than the focal length fo of the f ⁇ lens system FT so as to increase the scanning speed of the spot light SPr on the photoelectric conversion element DTo.
  • FIG. 4 is a diagram showing a simplified arrangement of the beam transmission system 60a and the beam receiving system 60b shown in FIGS. 2 and 3.
  • the beam transmission system 60a is a laser beam Bga (hereinafter simply referred to as a beam).
  • a collimator lens (lens system) GLa that converts the beam Bga from the light source into a parallel light beam.
  • the beam Bga projected on the reflecting surface RP (RPa) is rotated in the rotational direction (XY) of the reflecting surface RP (RPa).
  • a main scanning direction parallel to the surface is a parallel light beam having a certain width.
  • the beam receiving system 60b it is preferable to focus the reflected beam Bgb on the spot light SPr that is narrowed down in the main scanning direction on the photoelectric conversion element DTo.
  • a lens system GLb having a focal length Fgs is provided.
  • the distance from the reflecting surface RP (RPa) of the polygon mirror PM to the lens system GLb can be set relatively freely because the reflected beam Bgb becomes a parallel light beam.
  • the light receiving surface of the photoelectric conversion element DTo is disposed at the position of the focal length Fgs on the rear side of the lens system GLb.
  • the spot light SPr of the reflected beam Bgb is set so as to be positioned approximately at the center of the light receiving surface of the photoelectric conversion element DTo. Is done.
  • the reflected beam Bgb ′ is in the same plane as the light receiving surface of the photoelectric conversion element DTo. It is condensed.
  • the reflected beam Bgb ′ directed from the lens system GLb to the photoelectric conversion element DTo does not need to be telecentric, but rather is more non-telecentric in order to increase the speed of the spot light SPr across the light receiving surface of the photoelectric conversion element DTo. Good.
  • FIG. 5 shows a detailed configuration of the photoelectric conversion element DTo.
  • the S9684 series sold as a laser beam synchronous detection photo IC manufactured by Hamamatsu Photonics Co., Ltd. is used.
  • the photo IC includes light receiving surfaces PD1 and PD2, current amplifying units IC1 and IC2, and a comparator unit formed by two PIN photodiodes arranged with a narrow gap (dead zone) in the scanning direction of the spot light SPr.
  • IC3 is packaged into one.
  • each of the current amplification units IC1 and IC2 generates output signals STa and STb as shown in FIG.
  • a constant offset voltage (reference voltage) Vref is applied to the current amplification unit IC1 that amplifies the photocurrent from the light receiving surface PD1 that first receives the spot light SPr, and the output signal STa of the current amplification unit IC1 is received by the light receiving surface PD1. Is biased so as to be at the reference voltage Vref when the photocurrent generated at is zero.
  • the comparator IC3 compares the levels of the output signals STa and STb, and outputs a logic signal that is H level when STa> STb and L level when STa ⁇ STb. Output as signal SZn.
  • the time point when the origin signal SZn transitions from the H level to the L level is defined as the origin time (origin position) Tog, and the generation timing of the origin signal SZn means the origin time Tog.
  • the origin position (origin time Tog) is, for example, when the point on the substrate P through which the optical axis AXf of the f ⁇ lens system FT passes is used as a reference point, the main scanning direction of the spot light SP from the reference point Does not mean the origin as an absolute position that is always set to be separated by a certain distance, but is relatively a predetermined distance before (or a predetermined time before) the pattern drawing start timing along the drawing line SLn. It represents.
  • the origin time Tog is the moment when the levels of the output signals STa and STb coincide with each other while the level of the output signal STb rises while the level of the output signal STa falls.
  • the level changes (rise and fall waveforms) of the output signals STa and STb are caused by the relationship between the width dimension of the light receiving surfaces PD1 and PD2 and the size of the spot light SPr, the scanning speed Vh of the spot light SPr and the response of the light receiving surfaces PD1 and PD2.
  • the diameter of the spot light SPr is larger than the width of the dead zone and smaller than the width of the light receiving surface PD1
  • each of the output signals STa and STb is as shown in FIG.
  • a waveform is generated by the level change, and a stable origin signal SZn is obtained.
  • FIG. 6 schematically shows a beam switching unit including a selection optical element OSn (OS1 to OS6) for selectively distributing the beam LB from the light source device LS to any one of the six drawing units U1 to U6.
  • the configuration is shown. 6 are the same as those shown in FIG. 1, but the reflecting mirrors M1 to M12 shown in FIG. 1 are omitted as appropriate.
  • a light source device LS composed of a fiber amplifier laser light source is connected to the drawing control device 200 and exchanges various control information SJ.
  • the light source device LS includes a clock circuit that generates a clock signal CLK having an oscillation frequency Fa (for example, 400 MHz) when causing the beam LB to emit pulses, and performs drawing for each drawing unit Un sent from the drawing control device 200.
  • the beam LBn is responsive to the clock signal CLK in burst mode (light emission for a predetermined number of clock pulses and light emission stop for a predetermined number of clock pulses). Pulse repetition).
  • the drawing control apparatus 200 receives the origin signal SZn (SZ1 to SZ6) output from the origin sensor (photoelectric conversion element DTo) of each of the drawing units U1 to U6, and the polygon mirror PM of each of the drawing units U1 to U6. Is supplied to each of the polygon rotation control unit for controlling the rotation motor RM of the polygon mirror PM and the selection optical elements OSn (OS1 to OS6) so that the rotation speed and the rotation angle phase of the polygon mirror PM are designated. A beam switching control unit that controls on / off (application / non-application) of drive signals DF1 to DF6 as ultrasonic signals based on an origin signal SZn (SZ1 to SZ6).
  • SZn origin signal
  • SZ1 to SZ6 origin sensor
  • the selection optical element OS4 out of the six selection optical elements OS1 to OS6 is selected, and intensity modulation is performed with the beam LB from the light source device LS (the drawing data of the pattern drawn by the drawing unit U4). 2) is deflected toward the incident mirror IM4 and supplied to the drawing unit U4 as a beam LB4.
  • the order of the selection optical elements OSn from the light source device LS depends on the transmittance and diffraction efficiency of each of the selection optical elements OSn.
  • the intensity of the selected beams LB1 to LB6 the peak intensity of the pulsed light
  • the drawing control apparatus 200 transmits the drive signal so that the relative intensity difference between the beams LB1 to LB6 incident on each of the drawing units U1 to U6 is within a predetermined allowable range (for example, within ⁇ 5%).
  • the level of each of DF1 to DF6 (the amplitude and power of the high frequency signal) is adjusted.
  • FIG. 7 is a diagram showing a specific configuration around the optical element for selection OSn (OS1 to OS6) and the incident mirror IMn (IM1 to IM6).
  • the beam LB emitted from the light source device LS is incident on the selection optical element OSn as a parallel light beam having a minute diameter (first diameter) of 1 mm or less, for example.
  • the drive signal DFn which is a high-frequency signal (ultrasonic signal)
  • the incident beam LB is transmitted without being diffracted by the selection optical element OSn.
  • the transmitted beam LB passes through the condensing lens Ga and the collimating lens Gb provided on the optical path along the optical axis AXb, and enters the selection optical element OSn at the subsequent stage.
  • the beam LB passing through the condenser lens Ga and the collimator lens Gb through the selection optical element OSn is coaxial with the optical axis AXb.
  • the condensing lens Ga condenses the beam LB (parallel light beam) transmitted through the selection optical element OSn so as to be a beam waist at the position of the surface Ps located between the condensing lens Ga and the collimating lens Gb.
  • the collimating lens Gb turns the beam LB diverging from the position of the surface Ps into a parallel light beam.
  • the diameter of the beam LB converted into a parallel light beam by the collimating lens Gb is the first diameter.
  • the rear focal position of the condensing lens Ga and the front focal position of the collimating lens Gb coincide with the surface Ps within a predetermined allowable range, and the front focal position of the condensing lens Ga is within the selection optical element OSn. It arrange
  • the incident beam LB was not diffracted with the beam LBn (first-order diffracted light) diffracted by the selection optical element OSn.
  • a zero-order beam LBnz is generated.
  • the intensity of the incident beam LB is 100% and the decrease due to the transmittance of the optical element for selection OSn is ignored, the intensity of the diffracted beam LBn is about 80% at the maximum, and the remaining 20% is the 0th order. It becomes the intensity of the beam LBnz.
  • the 0th-order beam LBnz passes through the condensing lens Ga and the collimating lens Gb, passes through the subsequent selection optical element OSn, and is absorbed by the absorber TR.
  • the beam LBn (parallel light beam) deflected in the ⁇ Z direction with a diffraction angle corresponding to the high frequency of the drive signal DFn passes through the condenser lens Ga and travels toward the incident mirror IMn provided on the surface Ps. Since the front focal position of the condensing lens Ga is optically conjugate with the diffraction point in the optical element for selection OSn, the beam LBn from the condensing lens Ga toward the incident mirror IMn has a position decentered from the optical axis AXb.
  • the light travels in parallel with the axis AXb and is condensed (converged) so as to be a beam waist at the position of the surface Ps.
  • the position of the beam waist is set so as to be optically conjugate with the spot light SP projected onto the substrate P through the drawing unit Un.
  • the beam LBn diffracted by the selection optical element OSn is reflected in the ⁇ Z direction by the incident mirror IMn, and passes through the collimating lens Gc.
  • the light enters the drawing unit Un along the optical axis AX1 (see FIG. 2).
  • the collimating lens Gc turns the beam LBn converged / diverged by the condenser lens Ga into a parallel light beam coaxial with the optical axis (AX1) of the collimating lens Gc.
  • the diameter of the beam LBn made into a parallel light beam by the collimating lens Gc is substantially the same as the first diameter.
  • the rear focal point of the condensing lens Ga and the front focal point of the collimating lens Gc are arranged on or near the reflecting surface of the incident mirror IMn within a predetermined allowable range.
  • the front focal position of the condenser lens Ga and the diffraction point in the optical element for selection OSn are optically conjugated, and the incident mirror IMn is disposed on the surface Ps that is the rear focal position of the condenser lens Ga.
  • ) is the maximum range of the deflection angle of the optical element for selection OSn itself, the size of the reflecting surface of the incident mirror IMn, and the optical system (relay system) up to the polygon mirror PM in the drawing unit Un. Although it is limited by the magnification, the width in the Z direction of the reflecting surface RP of the polygon mirror PM, the magnification from the polygon mirror PM to the substrate P (magnification of the f ⁇ lens system FT), etc., the effective spot light SP on the substrate P is limited. Adjustment is possible within the range of the size (diameter) or the pixel size (Pxy) defined on the drawing data.
  • an overlay error between a new pattern drawn on the substrate P in each drawing unit Un and a pattern formed on the substrate P, or a new pattern drawn on the substrate P in each drawing unit Un It is possible to correct a joint error between various patterns with high accuracy and at high speed.
  • FIGS. 8 and 9 the reproducibility of the generation timing of the origin signal SZn from the origin sensor (the beam transmission system 60a and the beam reception system 60b) configured as shown in FIGS. A method for measuring and calculating (variation error) will be described.
  • This measurement and calculation can be performed using a processor (CPU) or the like in the drawing control apparatus 200 shown in FIG. 6, or the origin signal SZn may be sent to an external waveform measuring device or the like.
  • FIG. 8 is a plan view of the eight-sided polygon mirror PM shown in FIG. 3 or FIG. 4.
  • the eight reflecting surfaces RP are set to RPa, RPb, RPc, RPd, RPe, RPf, RPg, and RPh in the direction opposite to the rotation direction (clockwise) of the polygon mirror PM.
  • a rotation reference mark Mcc for detecting the origin of rotation of the polygon mirror PM is formed on the upper surface (or lower surface) of the polygon mirror PM.
  • the rotation reference mark Mcc is detected by a reflective photoelectric sensor (also referred to as a rotation detection sensor) that outputs a pulsed detection signal each time the polygon mirror PM rotates once.
  • the speed fluctuation of the polygon mirror PM is measured based on the origin signal SZn.
  • the polygon rotation control unit in the drawing control apparatus 200 is servo-controlled so that the polygon mirror PM is rotated at 36000 rpm, the polygon mirror PM is rotated 600 times per second.
  • the upper rotation time TD for one rotation is 1/600 seconds ( ⁇ 166.667 ⁇ S).
  • the actual circulation time TD from the origin time Tog of any one pulse in the origin signal SZn to the origin time Tog of the ninth pulse is set to be smaller than the oscillation frequency Fa used by the light source device LS for pulse emission.
  • the measurement is repeated using a clock pulse having a high frequency (for example, twice or more). Since the polygon mirror PM rotates at high speed with inertia, the possibility of uneven speed during one rotation is low. However, depending on the servo control characteristics, etc., the design cycle time is several milliseconds to several tens of milliseconds. TD may vary slightly.
  • FIG. 9 is a diagram for explaining a method for measuring the reproducibility (variation) of the generation timing of the origin signal SZn.
  • an example of how to determine the reproducibility of the origin time Tog2 of the origin signal SZn generated corresponding to the reflection surface RPa of the polygon mirror PM shown in FIG. The same measurement can be performed for each of RPb to RPh.
  • the origin time Tog1 generated at the timing just before the origin time Tog2 is obtained as the origin signal SZn generated corresponding to the reflection surface RPh of the polygon mirror PM.
  • the waveforms of the origin signals SZn (a) 1 to SZn (a) 7 generated while the polygon mirror PM rotates 7 times are obtained corresponding to the reflecting surface RPh.
  • the origin times Tog1 are shown aligned on the time axis.
  • the measured values of the origin interval time ⁇ Tmn which should be constant, vary. Since this variation becomes a variation width ⁇ Te of the generation timing of the origin time Tog2 corresponding to the reflection surface RPa, the reproducibility of the origin signal SZn is a standard deviation value ⁇ of a large number of origin times Tog2 distributed within the variation width ⁇ Te. Alternatively, it is obtained as a 3 ⁇ value that is three times the standard deviation value ⁇ . As described above, when the light source device LS oscillates the beam LB with the period Tf, the 3 ⁇ value as reproducibility is preferably smaller than the period Tf.
  • FIG. 10 is a diagram schematically showing a method for predicting the time error due to the speed fluctuation of the polygon mirror PM.
  • the origin interval time ⁇ Tmn corresponding to each of the eight reflecting surfaces RPa to RPh is measured every many turns of the polygon mirror PM.
  • the initial position (first origin time Tog) during one rotation of the polygon mirror PM is the reflection surface RPa, and the waveform of the origin signal SZn generated while the polygon mirror PM rotates twice from the reflection surface RPa is schematically shown. It was shown to.
  • the origin interval time from the origin time Tog generated corresponding to the reflection surface RPa of the origin signal SZn to the origin time Tog generated corresponding to the adjacent reflection surface RPb is ⁇ Tma, and so on.
  • the origin interval time from the surface RPb to the reflection surface RPc is ⁇ Tmb,...
  • the origin interval time from the adjacent reflection surface RPh to the reflection surface RPa is ⁇ Tmh.
  • the starting times Tog generated corresponding to each of the eight reflecting surfaces RPa to RPh are used as start points, and the round times TDa and TDb for each of the reflecting surfaces RPa to RPh of the polygon mirror PM. ... TDh is measured.
  • Each of the round times TDa to TDh may be obtained as a total value of eight origin interval times ⁇ Tma to ⁇ Tmh corresponding to each of the eight reflecting surfaces RPa to RPh.
  • Each of the round times TDa to TDh (or the origin interval time ⁇ Tma to ⁇ Tmh) is repeatedly measured while the polygon mirror PM rotates, for example, N times. Thereby, each data of the round times TDa to TDh measured from the origin time Tog corresponding to each of the eight reflecting surfaces RPa to RPh can be acquired over N rounds.
  • the average lap times ave (TDa) to ave (TDh) of the lap times TDa to TDh acquired over N laps are calculated.
  • each of the origin interval times ⁇ Tma to ⁇ Tmh measured after the second round shown in FIG. 10 includes an error due to the influence of the speed fluctuation in the round of the polygon mirror PM immediately before that, for example, 2
  • the origin interval time ⁇ Tma actually measured after the lap is expected to have changed by the ratio of the revolution time TDa measured in the immediately preceding round and the average round time ave (TDa), and the expected interval time of the origin interval time ⁇ Tma ⁇ Tma ′ is calculated.
  • an average interval time ave ( ⁇ Tma) of N ⁇ 1 origin interval times ⁇ Tma measured in each round after the second round is obtained.
  • the average interval time ave (TDa) is multiplied by the average interval time ave ( ⁇ Tma) to the ratio of the average rotation time ave (TDa) to the actually measured rotation time TDa to calculate the expected interval time ⁇ Tma ′ corrected for the speed fluctuation.
  • the difference value between the actually measured origin interval time ⁇ Tma and the expected interval time ⁇ Tma ′ is obtained as a more accurate variation amount ( ⁇ value) of the origin time Tog generated corresponding to the reflecting surface RPa.
  • the variation amount of the origin time Tog of the origin signal SZn corresponding to each of the other reflection surfaces RPb to RPh is also obtained by the same calculation.
  • each of the origin interval times ⁇ Tma to ⁇ Tmh which is the generation interval of the origin time Tog of the origin signal SZn, is only repeatedly measured during a plurality of rotations of the polygon mirror PM, resulting from the speed fluctuation of the polygon mirror PM. Therefore, accurate reproducibility (3 ⁇ value, etc.) with reduced errors can be obtained.
  • the focal length Fgs of the lens system GLb in the beam receiving system 60a of the origin sensor is set to be the same as the focal length fo (for example, 100 mm) of the f ⁇ lens system FT, and photoelectric conversion is performed to the position of the focal length Fgs of the lens system GLb.
  • the element DTo is arranged, the polygon mirror PM is rotated at about 38000 rpm, and the origin signal SZn (origin time Tog2) generated corresponding to each of the reflection surfaces RPa to RPh of the polygon mirror PM by the method shown in FIG.
  • the reproducibility was measured, a result as shown in FIG. 11 was obtained.
  • FIG. 11 In FIG.
  • the horizontal axis represents each position (RPa ⁇ RPb, RPb ⁇ RPc,... RPh ⁇ RPa) between the measured reflecting surfaces, and the vertical axis represents each reflecting surface after correcting and calculating the fluctuation of the circulation speed.
  • the interval time ⁇ Tma to ⁇ Tmh is obtained by converting the waveform data of the origin signal SZn that is continuously generated over 10 revolutions of the polygon mirror PM into digital data having a sampling rate of 2.5 GHz (0.4 nS). It memorize
  • the interval times ⁇ Tma to ⁇ Tmh after correcting the fluctuations in the rounding speed vary between 197.380 ⁇ S and 197.355 ⁇ S.
  • each of the calculated interval times ⁇ Tma to ⁇ Tmh is 197.368 ⁇ S.
  • Such variation in the interval times ⁇ Tma to ⁇ Tmh is, for example, that each of the eight apex angles formed by the adjacent reflecting surfaces among the reflecting surfaces RPa to RPh of the polygon mirror PM is not precisely 135 degrees.
  • the variation in the interval time ⁇ Tma to ⁇ Tmh can also be caused by the degree of the eccentric error of the polygon mirror PM with respect to the rotation axis AXp.
  • the 3 ⁇ value calculated from the distribution of each variation of the interval times ⁇ Tma to ⁇ Tmh is 2.3 nS to 5.9 nS. This value means that when the pulse oscillation frequency of the beam LB from the light source device LS is set to 400 MHz (period 2.5 nS), an error of approximately three pulses or more is generated with respect to the spot light scanning position.
  • the 3 ⁇ value is about 6 nS. If it exists, it means that the position of the pattern drawn along the drawing line SLn varies by about 5 ⁇ m (more precisely, 4.8 ⁇ m) in the main scanning direction.
  • the focal length of the f ⁇ lens system FT is fo and the distance of the pulse interval (1/2 of the spot diameter) of the spot light SP on the substrate P is ⁇ Yp
  • the polygon mirror PM reflecting surface corresponding to the pulse interval distance ⁇ Yp ) Is changed by ⁇ p ⁇ Yp / fo.
  • the moving distance of the laser beam Bgb (spot light SPr) on the photoelectric conversion element DTo corresponding to the angle change ⁇ p is ⁇ Yg
  • the moving distance ⁇ Yg is ⁇ Yg ⁇ p ⁇ Fgs.
  • the generation accuracy of the origin time Tog of the origin signal SZn preferably corresponds to the accuracy (resolution) of 1/2 or less of the pulse interval distance ⁇ Yp of the spot light SP
  • the laser beam Bgb (spot) on the photoelectric conversion element DTo spot
  • the scanning speed of the light SPr is increased to about twice the scanning speed of the spot light SP on the substrate P. That is, it is preferable that ⁇ Yg ⁇ 2 ⁇ ⁇ Yp. Therefore, in the present embodiment, the focal length Fgs of the lens system GLb is set to about twice the focal length fo of the f ⁇ lens system FT, but it goes without saying that it may be twice or more.
  • FIG. 12 shows the reproducibility measured in the same manner as in FIG. 11 by using another drawing unit having the same configuration as the drawing unit Un actually measured in FIG. 11 and changing the focal length Fgs of the lens system GLb to Fgs ⁇ 2 ⁇ fo.
  • the results are shown.
  • the vertical axis and the horizontal axis in FIG. 12 represent the same as those in FIG. 11, but the scale of the vertical axis in FIG.
  • DTo the scanning speed of the spot light SPr on the photoelectric conversion element DTo about twice the scanning speed of the spot light SP on the substrate P, 3 ⁇ calculated from the distribution of each variation of the interval time ⁇ Tma to ⁇ Tmh.
  • the value was 1.3 nS to 2.5 nS, which was improved by almost half compared to the case of FIG.
  • the pixel size Pxy is 4 ⁇ m square on the substrate P, and one pixel is drawn with two pulses of the spot light SP, the pattern drawn along the drawing line SLn.
  • the variation in the position in the main scanning direction is halved to about 2.5 ⁇ m.
  • the beam Bga for the origin sensor projected onto the reflection surfaces RPa to RPh of the polygon mirror PM has a predetermined thickness (for example, a diameter of 1 to 2 mm) with respect to the dimension in the rotation direction of the reflection surfaces RPa to RPh.
  • a predetermined thickness for example, a diameter of 1 to 2 mm
  • the influence of the surface roughness (polishing marks, etc.) of each of the reflection surfaces RPa to RPh can be reduced, and the average surface angle change can be accurately detected. it can.
  • the diameter dimension of the spot light SPr of the reflected beam Bgb collected on the photoelectric conversion element DTo is the width dimension of the light receiving surfaces PD1 and PD2 in the beam scanning direction and the width of the dead zone between the light receiving surfaces PD1 and PD2.
  • Appropriately set according to The diameter dimension of the spot light SPr in the scanning direction is smaller than the smaller width dimension of the light receiving surfaces PD1 and PD2 and larger than the width of the dead zone so that a signal waveform as shown in FIG. Is set to such a condition.
  • the focal length Fgs of the lens system GLb that receives the reflected beam Bgb is set to be longer than the focal length fo of the f ⁇ lens system FT so as to satisfy such a condition.
  • the intensity distribution in the cross section of the beam Bga emitted from the semiconductor laser light source LDo shown in FIG. 4 is an ellipse having an aspect ratio of about 1: 2.
  • the elliptical minor axis direction may be aligned with the rotational axis AXp direction of the polygon mirror PM in accordance with the rotation direction (main scanning direction) of the reflecting surfaces RPa to RPh of the mirror PM.
  • the beam Bga can be effectively reflected as the reflected beam Bgb even if the height of each of the reflecting surfaces RPa to RPh of the polygon mirror PM is small (dimension in the direction of the rotation axis AXp), and the photoelectric conversion element DTo can be reflected.
  • NA numerical aperture
  • the numerical aperture (NA) in the scanning direction of the reflected beam Bgb that reaches can be made larger than the numerical aperture (NA) in the non-scanning direction, it relates to the scanning direction of spot light SPr (the direction crossing the light receiving surfaces PD1 and PD2 in FIG. 5). Increase resolution and sharpen contrast.
  • the photoelectric conversion element DTo instead of the type that generates the origin signal SZn by comparing the magnitudes of the output signals STa and STb from the two light receiving surfaces PD1 and PD2 as shown in FIG.
  • a type that generates the origin signal SZn by comparing the signal level from the surface with the reference voltage may be used.
  • the reproducibility of the origin time Tog of the origin signal SZn may be improved as the rise and fall of the signal waveform becomes steeper (the response time is shorter). It is preferable that the scanning speed of the spot light SPr crossing the beam is faster than the scanning speed of the drawing spot light SP, and the spot light SPr is condensed as small as possible by the lens system GLb to increase the intensity per unit area.
  • the origin detection sensor (lens system GLb, photoelectric conversion element DTo) according to the present embodiment shown in FIG. 3 has an origin detection beam Bga projected from a light source different from the drawing (processing) beam LBn.
  • the reflected beam Bgb from the polygon mirror PM is photoelectrically detected.
  • the drawing beam LBn is not incident on the f ⁇ lens system FT (blank period) immediately after the reflecting surface RPa of the polygon mirror PM reaches the angular position RPa ′.
  • the lens system GLb has an incident period.
  • the drawing beam LBn is controlled not to enter the drawing unit Un by the pulse oscillation of the beam LB from the light source device LS and the control of the selection optical element OSn. Therefore, even during the blank period, the selection optical element OSn is turned on only during a period in which the drawing beam LBn can enter the lens system GLb, and the beam LB is pulse-oscillated from the light source device LS at the oscillation frequency Fa.
  • the reflected beam of the beam LBn reflected by the polygon mirror PM may be received by the photoelectric conversion element DTo.
  • the drawing beam LBn incident on the lens system GLb during the blank period can be used as an origin detection beam.
  • the variation tendency of the interval times ⁇ Tma to ⁇ Tmh shown in FIG. 12 and the variation tendency of the interval times ⁇ Tma to ⁇ Tmh shown in FIG. 11 are greatly different in nanosecond order. It is assumed that the angle error tendency of each apex angle is different between the polygon mirrors PM used in the actual measurement of the reproducibility of FIG. As in the actual measurement examples of FIGS. 11 and 12, the processing tolerance and the tendency and degree of eccentricity error of the polygon mirror PM may be different for each drawing unit Un (U1 to U6), and the variation of the interval time ⁇ Tma to ⁇ Tmh. The error also differs for each drawing unit Un (U1 to U6).
  • the origin signal SZn The delay time TD set from the origin time Tog to the drawing start time is adjusted for each of the reflection surfaces RPa to RPh of the polygon mirror PM.
  • the signal processing is performed so that the interval times ⁇ Tma to ⁇ Tmh of the origin time Tog of the origin signal SZn generated for each of the reflection surfaces RPa to RPh of the polygon mirror PM are substantially equal within the time of one rotation of the polygon mirror PM. to correct.
  • FIG. 13 depicts a continuous pattern of 5 pixels in the main scanning direction by superimposing two pulses of spot light SP per pixel in the main scanning direction and the sub-scanning direction at a spot size ⁇ of 1 ⁇ 2. It is a figure which shows the state to do.
  • drawing of a pattern for five pixels is started after a certain delay time TD, starting from the origin time Tog of the origin signal SZn generated for each of the reflection surfaces RPa to RPh of the polygon mirror PM.
  • the tendency of variation in the generation timing (origin time Tog) of the origin signal SZn in FIG. 13 is shown as an example in the case of FIG.
  • each of the other reflecting surfaces RPb to RPh of the polygon mirror PM is based on a pattern of five pixels drawn by the spot light SP of the beam LBn scanned on the reflecting surface RPa of the polygon mirror PM.
  • the pattern of 5 pixels drawn by the spot light SP of the beam LBn scanned in (1) varies in the main scanning direction. Therefore, the edge extending in the sub-scanning direction of the drawn pattern meanders in units of pixels (for 1 to 2 pixels).
  • the number of meandering pixels depends on variations in the interval times ⁇ Tma to ⁇ Tmh, regardless of the line width (number of pixels in the main scanning direction) of the pattern to be drawn.
  • FIG. 14 is a graph schematically showing a characteristic graph according to the actual measurement example of FIG. 12, where RPa / b to RPh / a on the horizontal axis represent positions (RPa) between the reflecting surfaces on the horizontal axis in FIG. ⁇ RPb, RPb ⁇ RPc,... RPh ⁇ RPa), and the vertical axis represents the same origin interval time ⁇ Tma to ⁇ Tmh ( ⁇ S) as in FIG.
  • the reference time Tsr in FIG. 14 is a time required for 45-degree rotation when the eight-sided polygon mirror PM rotates precisely at a rotation speed of 38000 rpm, and is 197.368 ⁇ S.
  • times Tab, Tbc, Tcd, Tde, Tef, Tfg, Tgh, and Tha in FIG. 14 are interval times that are the center of the 3 ⁇ value that is three times the standard deviation shown in FIG. Since there is an error in the rotational speed of the polygon mirror PM when actually measured, the average value obtained by dividing the total value of the interval times Tab, Tbc, Tcd, Tde, Tef, Tfg, Tgh, Tha by 8 is the actual reference time Tsr. 'And good.
  • each of the origin interval times ⁇ Tma to ⁇ Tmh of the origin signal SZn output with the characteristics as shown in FIG. 14 is corrected by the delay circuit so as to be aligned with the reference time Tsr ′.
  • FIG. 15 is a time chart for explaining a generation state of the origin signal SZn ′ obtained by correcting the origin signal SZn.
  • the origin signal SZ is from the origin time Tog generated corresponding to the reflective surface RPa of the polygon mirror PM to the origin time Tog generated corresponding to the next reflective surface RPb.
  • the correction state is shown, the other reflection surfaces RPb to RPh are similarly corrected.
  • Origin time Tog corresponding to each of reflection surfaces RPa and RPb of origin signal SZn is generated as interval times Tha, Tab, Tbc...
  • the origin time Tog ′ corresponding to the reflection surface RPa of the corrected origin signal SZn ′ is the previous reflection surface RPh. It is generated by adjusting the delay time ⁇ Toa so that the reference time Tsr ′ is reached from the origin time Tog ′ corresponding to.
  • the origin time Tog ′ corresponding to the reflection surface RPb of the corrected origin signal SZn ′ is adjusted by the delay time ⁇ Tob so as to become the reference time Tsr ′ from the origin time Tog ′ corresponding to the immediately preceding reflection surface RPa. Occur.
  • the origin time Tog ′ of the corrected origin signal SZn ′ corresponding to each of the other reflecting surfaces RPc to RPh is also the origin of the corrected origin signal SZn ′ corresponding to each of the immediately preceding reflecting surfaces RPb to RPg.
  • the delay times ⁇ Toc, ⁇ Tod, ⁇ Toe, ⁇ Tof, ⁇ Tog, and ⁇ Toh are corrected so as to be the reference time Tsr ′ with respect to the time Tog ′.
  • the delay times ⁇ Toa to ⁇ Toh for each of the reflection surfaces RPa to RPh are obtained from the difference values between the interval times Tab to Tha specified as shown in FIG. 14 and the reference time Tsr ′.
  • FIG. 16 shows an example of the configuration of a correction circuit (correction unit) that generates the corrected origin signal SZn ′ (corrected origin signal SZn ′) by inputting the origin signal SZn from the photoelectric conversion element DTo, as shown in FIG. Indicates.
  • This correction circuit is provided as a part of the drawing control apparatus 200 shown in FIG. In FIG. 16, the correction circuit counts the clock signal CCK set to a frequency (for example, 800 MHz) higher than the frequency Fa (400 MHz) of the clock signal CLK from the light source device LS, and the counter circuit 210 has an interval.
  • It has a shift register 212 for setting preset values corresponding to each of the times Tab to Tha, and a shifter control circuit 214 for controlling the shift operation (register selection) of the shift register 212.
  • the sensor 220 that photoelectrically detects the reflected light of the rotation reference mark Mcc shown in FIG. 8 and a logic level circular pulse signal (by one rotation of the polygon mirror PM) based on the signal from the sensor 220. 1 pulse) and a detection circuit 222 for generating Sj.
  • the shifter control circuit 214 outputs to the shift register 212 a shift signal Sff (address designation signal) originating from the reflection surface RPa of the polygon mirror PM based on the circular pulse signal Sj and the origin signal SZn.
  • the shift register 212 includes eight registers 212A corresponding to the eight reflecting surfaces RPa to RPh.
  • the eight registers 212A are connected to be ring shift registers and are held in the respective registers in response to the shift signal Sff.
  • the preset values are sequentially shifted to adjacent registers.
  • An output from one of the eight registers 212 ⁇ / b> A of the shift register 212 is applied to the counter circuit 210.
  • the counter circuit 210 uses the preset value (for example, ⁇ Toa) from the shift register 212 set in response to the reset signal RST to generate a pulse of the clock signal CCK from the origin time Tog of the origin signal SZn generated corresponding to the reflecting surface RPa. In response to the subtraction, a pulsed origin signal SZn ′ is generated at the moment when the count value becomes zero.
  • the counter circuit 210 receives the origin signal SZn ′ as the reset signal RST, and is shifted by one in response to the shift signal Sff after a certain time (less than the reference time Tsr ′) from the origin time Tog ′ of the origin signal SZn ′.
  • the next preset value (for example, ⁇ Tob) from the shift register 212 is read and set.
  • the corrected origin signal SZn ′ output from the counter circuit 210 is a substantially constant reference time Tsr in which variations in the interval times Tab to Tha for each of the reflection surfaces RPa to RPh of the polygon mirror PM are corrected. Use 'to mark the origin time Tog'.
  • the preset values stored in each of the eight registers 212A of the shift register 212 are stored in a memory unit in the drawing control apparatus 200, read out therefrom, and preset. Since the interval times Tab to Tha and the reference time Tsr ′ shown in FIG. 14 differ according to the rotational speed VR of the polygon mirror PM, the characteristics as shown in FIGS. 12 and 14 are measured in advance for each different rotational speed VR. Thus, preset values corresponding to each of the delay times ⁇ Toa to ⁇ Toh corresponding to the reference time Tsr ′ for each rotation speed VR are determined and stored as a table in the memory unit in the drawing control apparatus 200.
  • the rotation speed VR of the polygon mirror PM is changed from a standard value (for example, 38000 rpm) during the drawing operation
  • preset values of delay times ⁇ Toa to ⁇ Toh corresponding to the rotation speed VR of the polygon mirror PM after the change are made. Is read from the table of the memory unit in the drawing control apparatus 200 and set in the register 212A of the shift register 212.
  • the rotational speed VR of the polygon mirror PM is changed every 2000 rpm such as 40000 rpm, 38000 rpm, 36000 rpm,.
  • the preset values of the delay times ⁇ Toa to ⁇ Toh that are created based on the data actually measured in the state and correspond to the rotational speed VR during that time may be obtained by linear interpolation.
  • the reproducibility of the drawing start point is improved and the origin time Tog ′ for each of the reflection surfaces RPa to RPh of the polygon mirror PM. Therefore, the variation of the absolute position of the drawing start point on the substrate P in the main scanning direction is also reduced, and the quality of the drawn pattern is improved.
  • the state of the reflection surface of the polygon mirror PM may be deformed on the order of submicrons depending on the degree of such temperature change.
  • the lens system GLa of the beam transmitting unit (beam transmitting system) 60a that generates the beam Bga for detecting the origin is made of plastic (resin mold) so as to be united with the semiconductor laser light source LDo.
  • the beam Bga toward the polygon mirror PM is likely to change from a parallel state to a convergent or divergent beam due to a change in ambient temperature.
  • a temperature sensor that accurately measures the temperature around the polygon mirror PM and the surroundings of the origin sensors (the beam transmitting unit 60a and the beam receiving unit 60b) is provided, and the reproducibility of the actually measured origin signal SZn ( (3 ⁇ value) and the origin interval time ⁇ Tma to ⁇ Tmh (or the interval times Tab to Tha in FIG. 14), the coefficient of change with respect to the temperature change is obtained in advance, and the delay times ⁇ Toa to ⁇ Toh set in the shift register 212 in FIG.
  • the preset value corresponding to each is corrected according to the temperature measured by the temperature sensor. This reduces the variation of the drawing pattern start point in the main scanning direction due to the temperature change of the drawing unit Un.
  • FIG. 17 is a diagram illustrating the configuration of the origin sensor according to the second modification.
  • the polygon mirror PM in the drawing unit Un, the optical axis AXf of the f ⁇ lens system FT, the beam transmitter 60a constituting the origin sensor, and the beam reception are shown. It is the figure which looked at arrangement
  • a drawing beam LBn is projected toward one reflecting surface RPa of the reflecting surfaces RP of the polygon mirror PM, and is reflected next to the reflecting surface RPa of the polygon mirror PM.
  • a laser beam (origin detection beam) Bga from the beam transmitter 60a is projected onto the surface RPb. Further, the angular position of the reflecting surface RPa in FIG.
  • the reflection surface RP (RPa) of the polygon mirror PM is disposed so as to be positioned on the entrance pupil plane orthogonal to the optical axis AXf of the f ⁇ lens system FT.
  • the beam LBn traveling from the reflecting mirror M23 toward the polygon mirror PM A reflection surface RP (RPa) is set at a position where the principal ray and the optical axis AXf intersect.
  • the distance from the main surface of the f ⁇ lens system FT to the surface of the substrate P (the condensing point of the spot light SP) is the focal length fo.
  • the beam Bga from the beam transmitting unit 60a is projected onto the reflection surface RPb of the polygon mirror PM as a parallel light beam in a non-photosensitive wavelength range with respect to the photosensitive functional layer of the substrate P by the lens system GLa similar to that in FIG. Is done.
  • the reflected beam Bgb of the laser beam Bga reflected by the reflecting surface RPb is directed to the reflecting mirror (reflecting optical member) MRa having a reflecting surface perpendicular to the XY plane.
  • the reflected beam Bgc of the beam Bgb reflected by the reflecting mirror MRa is again projected toward the reflecting surface RPb of the polygon mirror PM.
  • the reflected beam Bgd of the beam Bgc reflected by the reflecting surface RPb is received by the beam receiving unit 60b.
  • the beam receiving unit 60b has beams Bga, Bgb, Bgc, Bgd as shown in FIG. Advances, and the beam receiving unit 60b outputs a pulse-like origin signal SZn.
  • the beam Bga is shown as a simple line, but actually, the beam Bga is set so as to be a parallel light beam having a predetermined width in the rotation direction of the reflection surface RP of the polygon mirror PM in the XY plane.
  • the beam Bgd is shown as a simple line, but actually, the beam Bgd becomes a parallel light beam having a predetermined width in the XY plane, and the beam Bgd is directed to the beam receiving unit 60b according to the rotation of the polygon mirror PM. Are scanned as indicated by an arrow Aw.
  • the beam receiving unit 60 b outputs the origin signal SZn when receiving the beam Bgd, and the lens system GLb that collects the beam Bgd as the spot light SPr on the photoelectric conversion element DTo. And have.
  • the spot light SPr of the beam Bgd after the origin detection beam Bga is reflected twice by the reflection surface RP (RPb) of the polygon mirror PM using the reflection mirror MRa.
  • the scanning speed Vh of the spot light SPr on the light receiving surfaces PD1 and PD2 is a diagram in which the origin detection beam Bga is reflected once by the reflecting surface RP (RPb) of the polygon mirror PM and received by the photoelectric conversion element DTo. Compared to the case of 4, it can be doubled or more.
  • the scanning speed Vh of the beam Bgd (spot light SPr) for detecting the origin on the photoelectric conversion element DTo is doubled compared with the scanning speed Vsp of the drawing beam LBn (spot light SP) on the substrate P.
  • the reproducibility of the origin signal SZn can be improved as in the first embodiment.
  • the focal length Fgs of the lens system GLb provided in the beam receiving unit 60b need not be more than twice the focal length fo of the f ⁇ lens system FT.
  • the scanning speed Vh can be made twice the scanning speed Vsp of the spot light SP.
  • the beam Bga for origin detection is projected onto the reflection surface RPb immediately before the reflection surface RPa of the polygon mirror PM onto which the drawing beam LBn is projected. Therefore, in the case of the origin sensor as shown in FIG. 17, at the moment when the angle of the reflection surface RPa is set so that the spot light SP of the drawing beam LBn is positioned slightly before the drawing start point of the drawing line SLn.
  • the origin signal SZn from the beam receiving unit 60b in FIG. 17 is set to be the origin time Tog. In this way, even when the drawing beam LBn and the origin detection beam Bga are reflected by different reflecting surfaces of the polygon mirror PM, the corrected origin signal SZn ′ is reflected as in the first embodiment. By generating, it can be reduced that the starting point of the drawing pattern varies in the main scanning direction.
  • the reference pattern formed on the outer peripheral surface of the rotary drum DR shown in FIG. 1 is scanned with the spot light SP of the beam LBn projected from the drawing unit Un, and is generated from the reference pattern. Based on the photoelectric signal obtained by detecting the reflected light with the photodetector DTc shown in FIG. 2, the reproducibility of the origin signal SZn and the origin interval time ⁇ Tma to ⁇ Tmh (or the interval time Tab to Tha in FIG. 14) are confirmed. Delay time Toa-Toh is set.
  • a configuration in which a reference pattern is provided on the outer peripheral surface of the rotating drum DR and the specularly reflected light generated when the reference pattern is scanned with the spot light SP is detected by the photodetector DTc in the drawing unit Un is, for example, an international publication. No. 2015/152217 pamphlet.
  • FIG. 18 shows an example of the waveform of the photoelectric signal Sv generated from the photodetector DTc when the line & space reference patterns PTL1 and PTL2 formed on the outer peripheral surface of the rotary drum DR are scanned with the spot light SP.
  • the reference pattern PTL1 is a low-reflectance linear pattern having a line width in the main scanning direction of the spot light SP of 20 ⁇ m and extending in the sub-scanning direction. It is a highly reflective linear pattern extending in the direction.
  • the intensity of the regular reflection light generated from the reference pattern PTL1 is low, and the intensity of the regular reflection light generated from the reference pattern PTL2 is high.
  • the specularly reflected light from the reference patterns PTL1 and PTL2 travels backward in the optical path of the drawing beam LBn in FIG. 2 and reaches the polarization beam splitter BS1.
  • a condensing lens for condensing the specularly reflected light (parallel light beam equivalent to the beam LBn) transmitted through the polarizing beam splitter BS1 is provided on the photodetector DTc.
  • the outer peripheral surface of the substrate P or the rotating drum DR is conjugated with the light receiving surface of the photodetector DTc, and the conjugate of the spot light SP projected on the reference patterns PTL1 and PTL2 is received on the light receiving surface of the photodetector DTc.
  • An image is formed. Therefore, the signal Sv from the photodetector DTc is at a low level while the spot light SP is projecting the reference pattern PTL1, and is at a high level while the reference pattern PTL2 is being projected.
  • Waveform change of the signal Sv from the photodetector DTc is digitally converted into a clock signal CLK from the light source device LS that emits a pulse of the spot light SP or a sampling clock signal obtained by multiplying the clock signal CLK, and stored and analyzed.
  • the reference patterns PTL1 and PTL2 are moved in the sub-scanning direction. The extended edge position can be measured.
  • FIG. 19 shows an example of a circuit configuration for digitally sampling the waveform of the signal Sv from the photodetector DTc.
  • a / D that inputs the signal Sv and digitally converts the level of the signal Sv in response to the sampling clock signal CLK2.
  • Digital conversion is performed by the conversion unit 240, the multiplication unit 241 that generates the sampling clock signal (hereinafter simply referred to as a clock signal) CLK2 multiplied by two times the frequency Fa of the clock signal CLK from the light source device LS, and the A / D conversion unit 240.
  • Waveform storage unit (memory unit) 242 for storing the received data in response to the clock signal CLK2, and a memory for storing the data in the waveform storage unit 242 based on the corrected origin signal SZn ′ and the clock signal CLK2
  • An address generation unit 244 that generates an address value, and a waveform of the signal Sv stored in the waveform storage unit 242 Constituted by the waveform analysis portion 246 having a CPU which reads and analyzes the chromatography data.
  • Information analyzed by the waveform analysis unit 246 is sent to the drawing control apparatus 200 of FIG. 6 to check the reproducibility (3 ⁇ value) of the origin signal SZn ′, the interval times Tab to Tha, or the correction of the delay times Toa to Toh. used.
  • FIG. 20 is a time chart showing an example of measuring variations in the generation timing of the origin time Tog ′ (or origin time Tog) of the origin signal SZn ′ (or origin signal SZn) using the circuit configuration of FIG.
  • a reference as shown in FIG. 16 is provided at a position in the sub-scanning direction (Y direction) corresponding to the vicinity of the scanning start point of the drawing line SLn of the drawing unit Un to be confirmed on the outer peripheral surface of the rotary drum DR. Patterns PTL1 and PTL2 are formed.
  • the rotation angle of the rotary drum DR is set and stopped so that the reference patterns PTL1 and PTL2 are positioned on the drawing line SLn.
  • the beam LB from the light source device LS shown in FIG. 6 is pulse-oscillated at the oscillation frequency Fa, and drawing starts. Shall be.
  • the selection optical element OSn corresponding to the target drawing unit Un is also turned on. The period during which the selection optical element OSn is turned on and the beam LB is supplied to the target drawing unit Un as the beam LBn is set to a range in which the spot light SP of the beam LBn crosses the reference patterns PTL1 and PTL2. .
  • the beam LB from the light source device LS continuously oscillates at the frequency Fa.
  • the level of the photoelectric signal Sv from the photodetector DTc changes in a waveform as shown in FIG.
  • the address generation unit 244 generates an address value that is sequentially incremented in response to the clock pulse of the clock signal CLK2 from the time Tu1 after the delay time ⁇ Tu from the origin time Tog ′, and the waveform storage unit 242 specifies the specified address value.
  • the digital value (value corresponding to the level of the signal Sv) from the A / D converter 240 is sequentially stored.
  • the delay time ⁇ Tu is set to ⁇ Tu> ⁇ TD, and is set to a time until the spot light SP reaches the reference patterns PTL1 and PTL2.
  • the waveform data of the signal Sv is converted into a clock signal during a certain time from the time Tu1 to the time Tu2, that is, the period during which the spot light SP scans the distance including the reference patterns PTL1 and PTL2.
  • the waveform is stored in the waveform storage unit 242 with a time resolution of CLK2.
  • the waveform storage operation as described above is performed as many times as necessary every time the beam LBn is scanned by one designated reflecting surface RP (for example, RPa) of the polygon mirror PM, and the waveform storage unit 242 stores A plurality of waveform data of the photoelectric signal Sv generated by the spot light SP scanned by the same reflecting surface RP of the polygon mirror PM from the time Tu1 to the time Tu2 is stored.
  • the waveform analysis unit 246 analyzes the plurality of stored waveform data and confirms whether or not the reproducibility of the origin time Tog ′ of the origin signal SZn ′ is within a predetermined standard.
  • the waveform analysis unit 246 specifies positions (address positions) where the signal Sv rises or falls in correspondence with the edge positions of the reference patterns PTL1 and PTL2 among the waveform changes of the signal Sv.
  • a midpoint position of PTL1 (low reflectance) is obtained, and an average position CTu (address position) of the midpoint positions is further obtained. Since the address value of one waveform data stored in the waveform storage unit 242 corresponds to the clock pulse of the clock signal CLK2, the time from the time Tu1 to the average position CTu is from the cycle of the clock signal CLK2 and the time Tu1.
  • the time ⁇ TPc from the origin time Tog ′ of the origin signal SZn ′ to the average position CTu can be calculated by the product with the number of addresses up to the average position CTu.
  • the waveform analysis unit 246 performs such analysis for each of the plurality of waveform data stored, and calculates a plurality of times ⁇ TPc.
  • the waveform analysis unit 246 obtains a 3 ⁇ value from the calculated standard deviation value ⁇ of a plurality of times ⁇ TPc, and sends the 3 ⁇ value to the drawing control apparatus 200.
  • each of the interval times Tab to Tha of the origin time Tog ′ of the corrected origin signal SZn ′ generated corresponding to each reflection surface RPa to RPh of the polygon mirror PM is corrected to the reference time Tsr ′ is determined.
  • a counter circuit that counts the clock signal CLK2 is added to the circuit configuration of FIG. 19, and, for example, the origin time generated corresponding to the reflection surface RPa of the polygon mirror PM in the corrected origin signal SZn ′.
  • the interval time between Tog ′ and the origin time Tog ′ generated corresponding to the reflection surface RPb next to the reflection surface RPa is measured a plurality of times, and the average value is obtained and sent to the drawing control apparatus 200.
  • the interval time between other reflecting surfaces is measured in the same manner, and the average value of the obtained interval times is sent to the drawing control apparatus 200.
  • the drawing control apparatus 200 checks whether or not each of the transmitted interval times Tab to Tha is within an allowable range with respect to the reference time Tsr ′, and if there is an error exceeding the allowable range, FIG.
  • the delay times ⁇ Toa to ⁇ Toh set in the shift register 212 are corrected.
  • the second embodiment described above it is possible to suppress the variation in the drawing start position caused by the change over time of the corrected origin signal SZn ′ (or the origin signal SZn before correction), and for a long time. Patterns can be drawn with stable accuracy.
  • the reproducibility of the origin signal SZn ′ and the interval times Tab to Tha were confirmed using the reference patterns PTL1 and PTL2 formed on the outer peripheral surface of the rotary drum DR.
  • the reference patterns PTL1 and PTL2 may be detected.
  • a single-sheet reference sheet (for example, an extremely thin glass sheet or stainless sheet having a thickness equivalent to that of the substrate P and having flexibility and little deformation) on which the reference patterns PTL1 and PTL2 are formed is a rotating drum. It may be fixed by wrapping around the DR.
  • FIG. 21 is a diagram for explaining a test exposure method for verifying the accuracy of the corrected origin signal SZn ′ (or the origin signal SZn before correction) according to the third embodiment.
  • a single drawing unit Un as a target exposes a plurality of rectangular test patterns Tpt arranged in a matrix in the main scanning direction and the sub-scanning direction on the substrate P on which the photosensitive layer is formed.
  • the test pattern Tpt exposed in the column MPa is controlled so as to be drawn only by the reflection surface RPa of the polygon mirror PM.
  • the test pattern Tpt exposed by MPb is controlled so as to be drawn only by the reflection surface RPb of the polygon mirror PM.
  • the test pattern Tpt exposed in each of the columns MPc to MPh is controlled to be drawn on any of the reflection surfaces RPc to RPh of the polygon mirror PM. That is, the substrate P is transported at the normal exposure so that each test pattern Tpt is exposed by the spot light SP of the beam LBn reflected by only one reflecting surface designated during one rotation of the polygon mirror PM. Is sent at a rate of 1/8 of.
  • test patterns Tpt are not necessarily required. Arranged to confirm the shape change of the pattern Tpt.
  • the substrate P to be subjected to the test exposure may be a sheet of PEN film with little expansion and contraction, or an extremely thin glass sheet or stainless steel sheet that is neatly attached to the outer peripheral surface of the rotating drum DR.
  • the substrate P subjected to the test exposure is subjected to development processing or etching processing, and thereafter, the formation state of the edge portions Ef and Et extending in the sub-scanning direction of the test pattern Tpt is enlarged and observed with an inspection device or the like.
  • the origin time Tog ′ of the corrected origin signal SZn ′ corresponding to the reflection surface of the polygon mirror PM on which the test pattern Tpt is drawn. The reproducibility of is degraded.
  • a set of eight columns MPa to MPh of the test pattern Tpt drawn on each of the eight reflecting surfaces RPa to RPh of the polygon mirror PM is repeatedly formed in the sub-scanning direction. Then, for example, the center position of the first test pattern Tpt in the first row MPa and the first test pattern Tpt in the second row MPa separated from the first row MPa in the sub-scanning direction A straight line Lcc connecting the center position of the second test pattern Tpt located at the same position in the main scanning direction is specified, and between each edge portion Ef, Et of the test pattern Tpt aligned in the sub-scanning direction along the straight line Lcc.
  • a position error ⁇ Ytt in the main scanning direction between the center position and the straight line Lcc is measured.
  • These positional errors ⁇ Ytt are substantially the same when each of the interval times Tab to Tha in the corrected origin signal SZn ′ is precisely adjusted to the reference time Tsr ′.
  • the measured position error ⁇ Ytt varies among the columns MPb to MPh, it means that the correction of the interval times Tab to Tha to the reference time Tsr ′ has shifted. That is, the interval times Tab to Tha in the origin signal SZn before correction are changed.
  • the drawing control apparatus 200 corrects the delay times Toa to Toh and sets them in the shift register 212.
  • the corrected origin signal SZn ′ (or the origin before correction)
  • the reproducibility of the origin time Tog ′ (or origin time Tog) generated corresponding to each of the reflection surfaces RPa to RPh of the signal SZn can be confirmed.
  • the rotating drum DR When test exposure is performed as shown in FIG. 21, the rotating drum DR needs to be precisely rotated at a predetermined speed (1/8 of the normal speed). It is also necessary to prevent slight displacement in the extending direction of AXo (main scanning direction). However, it is difficult to suppress the positional fluctuation of the rotating drum DR in the main scanning direction to the micron order or the submicron order.
  • a linear reference pattern PTL3 continuous in the circumferential direction is provided at the end of the outer circumferential surface of the rotating drum DR in the direction in which the central axis AXo extends.
  • a pattern detector DXa that is set on an extension line in the Y-axis direction (main scanning direction) of the odd-numbered drawing lines SL1, SL3, and SL5 and includes a detection area Axv for detecting the reference pattern PTL3, and even-numbered drawing
  • a pattern detector DXb that is set on an extension line in the Y-axis direction (main scanning direction) of the lines SL2, SL4, and SL6 and includes a detection region Axv that detects the reference pattern PTL3 is provided.
  • the pattern detectors DXa and DXb can measure a minute displacement in the Y-axis direction within the detection region Axv of the linear reference pattern PTL3 at any time in the submicron order.
  • a reference plane orthogonal to the central axis AXo is formed on an end surface portion in the direction in which the central axis AXo of the rotating drum DR extends, and the reference plane
  • the displacement in the Y-axis direction may be measured by a capacitance-type or optical non-contact gap sensor (linear sensor) GSa, GSb.
  • the measurement position of the gap sensor GSa is set to be the same as the orientation of the odd-numbered drawing lines SL1, SL3, SL5 when viewed in the XZ plane orthogonal to the central axis AXo, and the measurement position of the gap sensor GSb is set in the XZ plane. Is set to the same orientation as the even-numbered drawing lines SL2, SL4, and SL6.
  • the value of the positional displacement in the Y-axis direction of the rotating drum DR (substrate P) when each of the plurality of test patterns Tpt arranged in the sub-scanning direction is exposed is detected by pattern detection. Measurement is performed by the devices DXa and DXb or the gap sensors GSa and GSb, and stored in the drawing control device 200, for example.
  • the measured value of the test pattern Tpt in the Y direction main scanning direction
  • FIG. 23 is a diagram showing a partial cross section of the rotary drum DR according to the fourth embodiment.
  • a small opening 50J may be a hollow
  • the photoelectric conversion element DTo as shown in FIG.
  • a drawing beam LBn from the drawing unit Un is provided so as to be received vertically.
  • the photoelectric conversion element DTo instead of detecting regular reflection light from the reference patterns PTL1 and PTL2 on the outer peripheral surface of the rotating drum DR as described in FIG. 20, the photoelectric conversion element DTo provided in the rotating drum DR is used. Direct detection of the origin detection beam Bgb (or drawing beam LBn) to measure the reproducibility of the corrected origin signal SZn ′ (or the origin signal SZn before correction) and the variations in the origin interval times Tab to Tha It is.
  • the origin detection sensor (lens system GLb, photoelectric conversion element DTo) is used for origin detection projected from a light source different from the drawing (processing) beam LBn.
  • the reflected beam Bgb of the beam Bga at the polygon mirror PM is photoelectrically detected.
  • the reflected beam Bgb reflected by the reflecting surface RPa enters the f ⁇ lens system FT.
  • the reflected beam Bgb incident on the f ⁇ lens system FT can be condensed on the image surface side (rotary drum DR side) of the f ⁇ lens system FT, similarly to the drawing beam LBn.
  • the reflected beam Bgb of the origin detection beam Bga scanned by the polygon mirror PM and incident on the f ⁇ lens system FT is converted into a photoelectric conversion element DTo provided on the rotary drum DR as shown in FIG. Detect with.
  • the photoelectric conversion element DTo provided in the rotating drum DR. Measurement is performed.
  • the photoelectric conversion element DTo can receive both the origin detection beam Bgb and the drawing beam LBn while the rotary drum DR is stopped.
  • the scanning speed of the drawing beam LBn crossing the photoelectric conversion element DTo in FIG. 23 is equal to the scanning speed of the origin detection beam Bgb. Therefore, the instant at which the spot light of the origin detection beam Bgb is located at the center position of the light receiving surface of the photoelectric conversion element DTo in FIG.
  • the interval time between the signal SZn and the origin time Tog) is measured using, for example, a multiplied clock signal CCK as shown in FIG. 19, thereby correcting the origin signal SZn ′ (or the origin signal SZn before correction). ) Accuracy (reproducibility, variation in origin interval times Tab to Tha).

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Printer (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

Selon la présente invention, un dispositif d'exposition (EX) projette, sur chacune d'une pluralité de surfaces réfléchissantes (RP) d'un miroir polygonal (PM) qui tourne autour d'un axe de rotation (AXp), un faisceau de traitement (LBn), et balaye, sur un substrat (P) par l'intermédiaire d'un système de lentilles fθ (FT), le faisceau de traitement (LBn) réfléchi par chacune de la pluralité de surfaces réfléchissantes (RP). Le dispositif d'exposition (EX) est pourvu de : un capteur de point de départ qui génère un signal de point de départ (SZn) chaque fois que l'une quelconque de la pluralité de surfaces réfléchissantes (RP) du miroir polygonal (PM) atteint un angle prescrit ; et une unité de correction qui génère des signaux de point de départ corrigés (SZn') qui ont été corrigés au moyen de valeurs de correction correspondant aux quantités de variation dans les intervalles de temps entre les signaux de point de départ générés (SZn) correspondant à chacune de la pluralité de surfaces réfléchissantes (RP).
PCT/JP2017/031735 2016-10-04 2017-09-04 Dispositif de balayage de faisceau, dispositif de dessin de motif et procédé d'examen de précision de dispositif de dessin de motif WO2018066285A1 (fr)

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CN201780061776.6A CN109791281B (zh) 2016-10-04 2017-09-04 光束扫描装置
JP2018543786A JP7040453B2 (ja) 2016-10-04 2017-09-04 ビーム走査装置、パターン描画装置、およびパターン描画装置の精度検査方法
KR1020197012728A KR102450792B1 (ko) 2016-10-04 2017-09-04 빔 주사 장치, 패턴 묘화 장치 및 패턴 묘화 장치의 정밀도 검사 방법

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WO2023053879A1 (fr) * 2021-09-30 2023-04-06 日東電工株式会社 Procédé de traitement au laser, procédé de production d'une feuille optique et dispositif de traitement au laser

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JPH08507410A (ja) * 1992-11-02 1996-08-06 イーテック・システムズ・インコーポレーテッド 改良形レーザパターン発生装置
JPH08110488A (ja) * 1994-10-11 1996-04-30 Canon Inc 光走査装置
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CN114821627A (zh) * 2022-06-29 2022-07-29 江西少科智能建造科技有限公司 户门安装图纸智能审查方法、系统、存储介质及电子设备

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CN109791281A (zh) 2019-05-21
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KR102450792B1 (ko) 2022-10-06
JP7040453B2 (ja) 2022-03-23
TW201832860A (zh) 2018-09-16
KR20190057371A (ko) 2019-05-28
TWI735672B (zh) 2021-08-11

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