WO2018059166A1 - Ensemble de positionnement - Google Patents

Ensemble de positionnement Download PDF

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Publication number
WO2018059166A1
WO2018059166A1 PCT/CN2017/098863 CN2017098863W WO2018059166A1 WO 2018059166 A1 WO2018059166 A1 WO 2018059166A1 CN 2017098863 W CN2017098863 W CN 2017098863W WO 2018059166 A1 WO2018059166 A1 WO 2018059166A1
Authority
WO
WIPO (PCT)
Prior art keywords
positioning
plate
bracket
curved
workpiece
Prior art date
Application number
PCT/CN2017/098863
Other languages
English (en)
Chinese (zh)
Inventor
路新春
赵德文
许振杰
靳富
王同庆
李昆
Original Assignee
清华大学
天津华海清科机电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 清华大学, 天津华海清科机电科技有限公司 filed Critical 清华大学
Publication of WO2018059166A1 publication Critical patent/WO2018059166A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Definitions

  • the invention relates to the field of industrial automation transmission, and in particular to a positioning assembly.
  • the transfer of the robot to the wafer between different stations needs to be done by means of locating pins and brackets.
  • the position of the wafer cannot be adjusted.
  • the present invention aims to solve at least one of the above technical problems to some extent.
  • the present invention provides a positioning assembly that can adjust the position of a workpiece supported on a positioning plate to meet the needs of production processing.
  • a positioning assembly includes: a bracket; a plurality of positioning pins, a plurality of the positioning pins are spaced apart in a circumferential direction of the bracket and rotatably disposed on the bracket, each of the positioning pins
  • the utility model comprises: a positioning plate for supporting a workpiece, wherein an upper surface of the positioning plate is provided with a positioning protrusion, a lower surface of the positioning plate is attached to an upper surface of the bracket and a rotating shaft is provided, and a central axis of the rotating shaft Not coincident with the central axis of the positioning protrusion, the horizontal distance between the positioning protrusions can be changed by rotating the positioning pin, thereby effectively adjusting the position of the workpiece.
  • the positioning assembly of the embodiment of the present invention since the central axis of the rotating shaft does not coincide with the central axis of the positioning protrusion, the horizontal distance between the positioning protrusions can be changed by rotating the positioning pin, thereby changing the area of the positioning plate for supporting the workpiece. Therefore, the adjustment of the position of the workpiece is realized, the normal and stable production is ensured, and the production cost is reduced.
  • the positioning component according to the embodiment of the present invention may further have the following additional technical features:
  • the outer surface of the positioning projection is a curved surface.
  • the positioning protrusion is disposed coaxially with the positioning plate.
  • the rotating shaft is integrally formed on a lower surface of the positioning plate.
  • the bracket includes: a positioning post; a plurality of support strips, wherein the plurality of support strips are radially distributed on an outer circumference of the positioning post, one end of each of the support strips and the The positioning posts are connected and the other end extends outward.
  • a plurality of the support strips are equally spaced around the outer circumference of the positioning post.
  • the support strip is integrally formed with the positioning post.
  • the bracket is an annular plate
  • the annular plate includes: two first curved plates; a plurality of mounting platforms, wherein the plurality of mounting platforms are respectively disposed on the first curved plate Both ends extend upwardly, the positioning pin is disposed at an upper end of the mounting table; two second curved plates, the first curved plate and the second curved plate are concentrically disposed, the second A curved plate is connected between the two adjacent mounting stations.
  • the positioning pin is provided inside the mounting table.
  • the positioning assembly further includes: a fastening screw, a lower surface of the rotating shaft is provided with a positioning hole, and the fastening screw extends through the lower surface of the bracket into the positioning hole .
  • FIG. 1 is a perspective view of a positioning assembly in accordance with one embodiment of the present invention.
  • FIG. 2 is a perspective view of a positioning assembly in accordance with another embodiment of the present invention.
  • Figure 3 is a perspective view of a locating pin in accordance with one embodiment of the present invention.
  • Figure 4 is a cross-sectional view of a locating pin in accordance with one embodiment of the present invention.
  • Figure 5 is a cross-sectional view of a positioning assembly in accordance with one embodiment of the present invention.
  • Bracket 10 positioning post 11; support bar 111; first curved plate 121; mounting table 122; second curved plate 123;
  • the transfer of the robot to the wafer between different stations needs to be done by means of locating pins and brackets. But because of the positioning pin and bracket plus There are errors in production and installation, so the position of the wafer cannot be adjusted.
  • the present invention addresses the above technical problems.
  • a positioning assembly 100 in accordance with an embodiment of the present invention which may generally include a bracket 10 and a plurality of positioning pins 20, is described below with reference to FIGS.
  • the positioning assembly 100 can be used in a wafer transfer apparatus to meet the wafer's accurate adjustment of wafer position during transport.
  • a plurality of positioning pins 20 are spaced apart in the circumferential direction of the bracket 10 and rotatably provided on the bracket 10.
  • more than one positioning pin 20 is provided in the circumferential direction of the bracket 10, and the positioning pin 20 is rotatable relative to the bracket 10.
  • each of the positioning pins 20 may include: a positioning plate 21 for supporting the workpiece 40.
  • the upper surface of the positioning plate 21 is provided with a positioning protrusion 22, and the lower surface of the positioning plate 21 is attached to the bracket.
  • the upper surface of 10 is provided with a rotating shaft 23.
  • the central axis of the rotating shaft 23 does not coincide with the central axis of the positioning protrusion 22, and the horizontal distance between the plurality of positioning protrusions 22 of the bracket 10 can be changed by rotating the positioning pin 20. Thereby the position of the workpiece 40 is effectively adjusted. That is, the plurality of positioning projections 22 can define the degree of freedom of the workpiece 40 in the horizontal direction. Since the central axis of the rotating shaft 23 is not in the same vertical direction as the central axis of the positioning projection 22, the positioning projection 22 is horizontal. The position changes as the rotation of the rotary shaft 23, that is, the area of the positioning plate 21 for supporting the workpiece 40 changes with the rotation of the rotary shaft 23. For example, as shown in FIG.
  • the position of the workpiece 40 can be adjusted by rotating any one of the positioning pins 20 to meet the needs of production, thereby effectively solving the problem that the position of the workpiece 40 cannot be adjusted, and ensuring normal and stable production. And unnecessary trimming of the positioning assembly 100 is avoided.
  • the positioning assembly 100 of the embodiment of the present invention since the central axis of the rotating shaft 23 does not coincide with the central axis of the positioning protrusion 22, the horizontal distance between the positioning protrusions 22 can be changed by rotating the positioning pin 20, thereby The positioning plate 21 is used to support the area of the workpiece 40, thereby realizing the adjustment of the position of the workpiece 40, ensuring normal and stable production, and reducing production costs.
  • the bracket 10 may include a positioning post 11 and a plurality of support bars 111.
  • a plurality of support bars 111 are radially distributed on the outer circumference of the positioning post 11, and one end of each support bar 111 (such as the inner end of the support bar in FIG. 1) is connected to the positioning post 11 and the other end (see FIG. 1).
  • the outer end of the support strip in the middle extends outward.
  • Each of the positioning pins 20 includes a positioning plate 21, a positioning projection 22 on the upper surface of the positioning plate 21, and a rotating shaft 23 on the lower surface of the positioning plate 21.
  • the lower surface of the positioning plate 21 is attached to the upper surface of the bracket 10.
  • the lower surface of the workpiece 40 is attached to the upper surface of the positioning plate 21, and the end surface of the workpiece 40 is in contact with the outer surface of the positioning projection 22.
  • the outer surface of the locating projection 22 is a curved surface.
  • the friction between the workpiece 40 placed on the positioning plate 21 and the surface of the positioning projection 22 is small. Thereby, it is possible to avoid damage to the workpiece 40 when the position of the station is changed.
  • the positioning protrusion 22 is disposed coaxially with the positioning plate 21.
  • the mold for manufacturing the positioning assembly 100 can be simplified, and the production process of the assembly 100 can be easily positioned.
  • the rotating shaft 23 is integrally formed on the lower surface of the positioning plate 21.
  • the connection strength between the rotating shaft 23 and the positioning plate 21 can be improved, and the production process of the positioning assembly 100 can be facilitated.
  • the bracket 10 may be an annular plate including: two first curved plates 121, a mounting table 122, and two second curved plates 123.
  • a plurality of mounting stages 122 are respectively disposed at two ends of the first curved plate 121 and extend upward, and the positioning pin 20 is disposed at an upper end of the mounting base 122.
  • the first curved plate 121 and the second curved plate 123 are concentrically arranged, and the second curved plate 123 is connected between the adjacent two mounting stages 122.
  • the first curved plate 121 and the second curved plate 123 are at different heights in the vertical direction, and the mounting table 122 is coupled between the first curved plate 121 and the second curved plate 123.
  • the positioning pin 20 is disposed inside the mounting table 122, and since the first curved plate 121 and the second curved plate 123 have a height difference, the workpiece 40 may be placed from above the first curved plate 121 or Leaving the positioning plate 21. Thereby, the structural design of the positioning assembly 100 is made more reasonable.
  • the positioning assembly 100 may further include: a fastening screw 30.
  • the lower surface of the rotating shaft 23 is provided with a positioning hole, and the fastening screw 30 extends through the lower surface of the bracket 10 into the positioning hole. It can be understood that when the horizontal position of the positioning protrusion 22 is adjusted to an appropriate position, the positioning assembly 100 can be fixed on the bracket 10 by the fastening screw 30, thereby improving the stability of the positioning assembly 100 and preventing the positioning assembly 100 from being subjected to an external force factor. Changes have occurred to ensure that the entire production is stable and stable.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise.
  • , or connected integrally may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un ensemble de positionnement (100) comprenant : un support (10); et une pluralité de broches de positionnement (20), la pluralité de broches de positionnement (20) étant agencées à des intervalles dans la direction circonférentielle du support (10), et étant agencées de manière rotative sur le support (10). Chaque broche de positionnement (20) comprend une plaque de positionnement (21) pour supporter une pièce à travailler (40), une surface supérieure de la plaque de positionnement (21) étant pourvue d'un bossage de positionnement (22), une surface inférieure de la plaque de positionnement (21) étant fixée à une surface supérieure du support (10) et étant pourvue d'un arbre rotatif (23), et l'axe central de l'arbre rotatif (23) ne coïncidant pas avec l'axe central du bossage de positionnement (22). La distance horizontale entre les bossages de positionnement (22) peut être modifiée par rotation des broches de positionnement (20), de manière à régler efficacement la position de la pièce à travailler (40).
PCT/CN2017/098863 2016-09-27 2017-08-24 Ensemble de positionnement WO2018059166A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610855751.0 2016-09-27
CN201610855751.0A CN106449500A (zh) 2016-09-27 2016-09-27 定位组件

Publications (1)

Publication Number Publication Date
WO2018059166A1 true WO2018059166A1 (fr) 2018-04-05

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ID=58169589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/098863 WO2018059166A1 (fr) 2016-09-27 2017-08-24 Ensemble de positionnement

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CN (1) CN106449500A (fr)
WO (1) WO2018059166A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110653652A (zh) * 2019-09-27 2020-01-07 天津市金星空气压缩机制造股份有限公司 一种变速箱翻转用工装

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449500A (zh) * 2016-09-27 2017-02-22 天津华海清科机电科技有限公司 定位组件
CN112440220A (zh) * 2019-08-27 2021-03-05 北京宝沃汽车有限公司 定位销安装座
CN112820689B (zh) * 2021-01-06 2022-10-18 长鑫存储技术有限公司 浮动销、晶圆承载装置及沉积设备
CN114473847B (zh) * 2021-12-29 2023-04-25 华海清科股份有限公司 一种旋转式晶圆交互系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1083948A (ja) * 1996-09-09 1998-03-31 Dainippon Screen Mfg Co Ltd 回転式現像装置
CN1746776A (zh) * 2004-09-06 2006-03-15 东京毅力科创株式会社 基板处理装置和基板定位装置
US20140107825A1 (en) * 2012-10-15 2014-04-17 Tokyo Electron Limited Method for positioning a transfer unit, method for calculating positional deviation amount of an object to be processed, and method for correcting teaching data of the transfer unit
CN103794532A (zh) * 2012-10-31 2014-05-14 千住金属工业株式会社 找位夹具和位置调整方法
WO2016003472A1 (fr) * 2014-07-03 2016-01-07 Newport Corporation Dispositif de positionnement multi-axial
CN106449500A (zh) * 2016-09-27 2017-02-22 天津华海清科机电科技有限公司 定位组件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4837642B2 (ja) * 2007-09-26 2011-12-14 東京エレクトロン株式会社 基板搬送位置の位置合わせ方法、基板処理システムおよびコンピュータ読み取り可能な記憶媒体
CN103489818B (zh) * 2013-10-14 2016-04-20 北京自动化技术研究院 一种硅片预对准装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1083948A (ja) * 1996-09-09 1998-03-31 Dainippon Screen Mfg Co Ltd 回転式現像装置
CN1746776A (zh) * 2004-09-06 2006-03-15 东京毅力科创株式会社 基板处理装置和基板定位装置
US20140107825A1 (en) * 2012-10-15 2014-04-17 Tokyo Electron Limited Method for positioning a transfer unit, method for calculating positional deviation amount of an object to be processed, and method for correcting teaching data of the transfer unit
CN103794532A (zh) * 2012-10-31 2014-05-14 千住金属工业株式会社 找位夹具和位置调整方法
WO2016003472A1 (fr) * 2014-07-03 2016-01-07 Newport Corporation Dispositif de positionnement multi-axial
CN106449500A (zh) * 2016-09-27 2017-02-22 天津华海清科机电科技有限公司 定位组件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110653652A (zh) * 2019-09-27 2020-01-07 天津市金星空气压缩机制造股份有限公司 一种变速箱翻转用工装

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