CN106449500A - 定位组件 - Google Patents
定位组件 Download PDFInfo
- Publication number
- CN106449500A CN106449500A CN201610855751.0A CN201610855751A CN106449500A CN 106449500 A CN106449500 A CN 106449500A CN 201610855751 A CN201610855751 A CN 201610855751A CN 106449500 A CN106449500 A CN 106449500A
- Authority
- CN
- China
- Prior art keywords
- positioning
- support
- positioning component
- location
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610855751.0A CN106449500A (zh) | 2016-09-27 | 2016-09-27 | 定位组件 |
PCT/CN2017/098863 WO2018059166A1 (zh) | 2016-09-27 | 2017-08-24 | 定位组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610855751.0A CN106449500A (zh) | 2016-09-27 | 2016-09-27 | 定位组件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106449500A true CN106449500A (zh) | 2017-02-22 |
Family
ID=58169589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610855751.0A Pending CN106449500A (zh) | 2016-09-27 | 2016-09-27 | 定位组件 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106449500A (zh) |
WO (1) | WO2018059166A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018059166A1 (zh) * | 2016-09-27 | 2018-04-05 | 清华大学 | 定位组件 |
CN112440220A (zh) * | 2019-08-27 | 2021-03-05 | 北京宝沃汽车有限公司 | 定位销安装座 |
CN114473847A (zh) * | 2021-12-29 | 2022-05-13 | 华海清科股份有限公司 | 一种旋转式晶圆交互系统 |
WO2022147959A1 (zh) * | 2021-01-06 | 2022-07-14 | 长鑫存储技术有限公司 | 浮动销、晶圆承载装置及沉积设备 |
US12119257B2 (en) | 2021-01-06 | 2024-10-15 | Changxin Memory Technologies, Inc. | Floating pin, wafer carrying device and depositing apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110653652A (zh) * | 2019-09-27 | 2020-01-07 | 天津市金星空气压缩机制造股份有限公司 | 一种变速箱翻转用工装 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1083948A (ja) * | 1996-09-09 | 1998-03-31 | Dainippon Screen Mfg Co Ltd | 回転式現像装置 |
JP2009081267A (ja) * | 2007-09-26 | 2009-04-16 | Tokyo Electron Ltd | 基板搬送位置の位置合わせ方法、基板処理システムおよびコンピュータ読み取り可能な記憶媒体 |
CN103489818A (zh) * | 2013-10-14 | 2014-01-01 | 北京自动化技术研究院 | 一种硅片预对准装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4410063B2 (ja) * | 2004-09-06 | 2010-02-03 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6040757B2 (ja) * | 2012-10-15 | 2016-12-07 | 東京エレクトロン株式会社 | 搬送機構の位置決め方法、被処理体の位置ずれ量算出方法及び搬送機構のティーチングデータの修正方法 |
JP5316689B1 (ja) * | 2012-10-31 | 2013-10-16 | 千住金属工業株式会社 | 位置出し治具及び位置調整方法 |
EP3660889A1 (en) * | 2014-07-03 | 2020-06-03 | Newport Corporation | Multi-axis positioning device |
CN106449500A (zh) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | 定位组件 |
-
2016
- 2016-09-27 CN CN201610855751.0A patent/CN106449500A/zh active Pending
-
2017
- 2017-08-24 WO PCT/CN2017/098863 patent/WO2018059166A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1083948A (ja) * | 1996-09-09 | 1998-03-31 | Dainippon Screen Mfg Co Ltd | 回転式現像装置 |
JP2009081267A (ja) * | 2007-09-26 | 2009-04-16 | Tokyo Electron Ltd | 基板搬送位置の位置合わせ方法、基板処理システムおよびコンピュータ読み取り可能な記憶媒体 |
CN103489818A (zh) * | 2013-10-14 | 2014-01-01 | 北京自动化技术研究院 | 一种硅片预对准装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018059166A1 (zh) * | 2016-09-27 | 2018-04-05 | 清华大学 | 定位组件 |
CN112440220A (zh) * | 2019-08-27 | 2021-03-05 | 北京宝沃汽车有限公司 | 定位销安装座 |
WO2022147959A1 (zh) * | 2021-01-06 | 2022-07-14 | 长鑫存储技术有限公司 | 浮动销、晶圆承载装置及沉积设备 |
US12119257B2 (en) | 2021-01-06 | 2024-10-15 | Changxin Memory Technologies, Inc. | Floating pin, wafer carrying device and depositing apparatus |
CN114473847A (zh) * | 2021-12-29 | 2022-05-13 | 华海清科股份有限公司 | 一种旋转式晶圆交互系统 |
Also Published As
Publication number | Publication date |
---|---|
WO2018059166A1 (zh) | 2018-04-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: Tsinghua University Applicant after: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Applicant before: Tsinghua University |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |