WO2018056594A1 - Carte de circuit imprimé souple ayant une pastille de trou d'interconnexion - Google Patents

Carte de circuit imprimé souple ayant une pastille de trou d'interconnexion Download PDF

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Publication number
WO2018056594A1
WO2018056594A1 PCT/KR2017/009252 KR2017009252W WO2018056594A1 WO 2018056594 A1 WO2018056594 A1 WO 2018056594A1 KR 2017009252 W KR2017009252 W KR 2017009252W WO 2018056594 A1 WO2018056594 A1 WO 2018056594A1
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WO
WIPO (PCT)
Prior art keywords
via pad
distance
wiring pattern
sides
base film
Prior art date
Application number
PCT/KR2017/009252
Other languages
English (en)
Korean (ko)
Inventor
이진한
Original Assignee
스템코 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스템코 주식회사 filed Critical 스템코 주식회사
Priority to CN201780058602.4A priority Critical patent/CN109792838A/zh
Priority to CN202310151504.2A priority patent/CN116033652A/zh
Priority to JP2019516165A priority patent/JP2019530243A/ja
Publication of WO2018056594A1 publication Critical patent/WO2018056594A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via

Definitions

  • the present invention relates to a flexible circuit board having via pads.
  • FPDs flat panel displays
  • LCDs liquid crystal displays
  • OLED organic light emitting diode
  • the complexity of wiring of flexible circuit boards has increased.
  • the wirings are arranged on both sides of the flexible circuit board, and a structure connected to each other through via holes is used.
  • forming the via pads so as to overlap with the via holes formed in the base film may have a somewhat less position margin.
  • the problem to be solved by the present invention relates to a flexible circuit board including a via pad that can sufficiently secure the position margin of the via hole against deformation of the base film.
  • a flexible substrate circuit may include a base film, a first wiring pattern extending in a first direction on one surface of the base film, and a connection in the connection region with the first wiring pattern. And via vias having a polygonal shape, and via holes penetrating the base film and overlapping the via pads, wherein the via pads have a width in a second direction perpendicular to the first direction. The width in the second direction decreases toward the first direction in the central region.
  • the via pad may include a first side and a second side adjacent to each other at an acute angle with the first direction, a third side substantially parallel to the first side, and the second side. It may comprise a fourth side substantially parallel to.
  • first side and the fourth side may meet at the first edge, and the second side and the third side may meet at the second edge.
  • the via pad further includes a fifth side, and at least one pair of sides of the first to fourth sides may be connected through the fifth side.
  • the via hole and the first side may be spaced apart by a first distance
  • the fifth side and the via hole may be spaced apart by a second distance
  • the second distance may be greater than the first distance.
  • the via pad may further include an arc connecting at least one pair of sides of the first to fourth sides.
  • the first side may be spaced apart from the center of the via pad by a first distance, and the radius of curvature of the arc may be less than the first distance.
  • the semiconductor device may further include a second wiring pattern formed on the other surface of the base film opposite to the one surface of the base film, wherein the first wiring and the second wiring pattern are electrically connected to each other through the via pad. Can be connected.
  • a flexible circuit board may include a base film, a first wiring pattern extending in a first direction on one surface of the base film, and at least a portion of the first wiring pattern connected thereto. And via vias having a polygonal shape, and via holes penetrating the base film and overlapping the via pads, wherein the via pads are formed at an acute angle with the first direction and extend parallel to each other. And a third side extending perpendicular to the extending direction of the first side and the second side.
  • the via pad further includes a fifth side, and at least one pair of sides of the first to third sides may be connected through the fifth side.
  • the first side and the via hole are spaced apart by a first distance, and the fourth side and the via hole are spaced apart by a second distance, wherein the first distance is less than the second distance. Can be.
  • the via pad may further include an arc connecting at least one pair of sides of the first side to the third side.
  • the radius of curvature of the arc may be less than the separation distance between the first side and the center of the via pad.
  • the via pad may include a width in a second direction perpendicular to the first direction, and the width in the second direction may decrease in a central area toward the first direction.
  • the flexible circuit board according to the embodiments of the present invention may allow the via holes to be aligned with position margins in the via pads even when the base film is oriented in the vertical direction or the left and right directions due to external factors. .
  • FIG. 1 is a plan view of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
  • FIG 3 is a plan view illustrating via pads included in a flexible circuit board according to an exemplary embodiment of the present invention.
  • 4A is an exemplary diagram for describing a position margin of a via pad of a via hole in a flexible circuit board according to some embodiments of the present disclosure.
  • 4B is an exemplary diagram for describing a position margin of via holes and via pads of a flexible circuit board according to the related art.
  • 5 through 9 are plan views illustrating modifications of via pads included in a flexible circuit board according to some embodiments of the inventive concept.
  • spatially relative terms below “, “ beneath “, “ lower”, “ above “, “ upper” It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as including terms in different directions of the device in use or operation in addition to the directions shown in the figures. For example, when flipping a device shown in the figure, a device described as “below” or “beneath” of another device may be placed “above” of another device. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.
  • first, second, etc. are used to describe various elements or components, these elements or components are of course not limited by these terms. These terms are only used to distinguish one element or component from another element or component. Therefore, the first device or component mentioned below may be a second device or component within the technical idea of the present invention.
  • FIG. 1 is a top view illustrating a flexible circuit board according to an exemplary embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.
  • a flexible circuit board 1 may include a base film 10, a first wiring pattern 20, a second wiring pattern 50, and a via pad 30. And a via hole 40.
  • the base film 10 may be formed of a flexible material and may be included as the substrate in the flexible circuit board 1 to allow the flexible circuit board 1 to be bent or folded.
  • the base film 10 may be, for example, a polyimide film, but the present invention is not limited thereto.
  • the base film 10 may alternatively be a PET film, polyethylene naphthalate film, polycarbonate film or insulating metal foil. In the electronic device 1 according to an embodiment of the present invention, the base film 10 will be described as being a polyimide film.
  • the first wiring pattern 10 may extend in the first direction D1 on one surface of the base film 10.
  • the first direction D1 refers to the longitudinal direction of the flexible circuit board 1, that is, the vertical direction of FIG. 1.
  • the second direction D2 refers to the width direction of the flexible circuit board 10, that is, the left and right directions of FIG. 1, and the first direction D1 and the second direction D2 are orthogonal to each other.
  • the second wiring pattern 50 may be formed on the other surface of the base film 10. That is, the first wiring pattern 20 and the second wiring pattern 50 may be formed on opposite surfaces of the base film 10, respectively.
  • the first wiring pattern 20 and the second wiring pattern 50 may include, for example, a conductive material such as copper, but the present invention is not limited thereto. Specifically, the first wiring pattern 20 and the second wiring pattern 50 may be made of a material having electrical conductivity such as gold and aluminum.
  • one or more insulating layers may be formed to cover the first wiring pattern 20 and the second wiring pattern 50.
  • the at least one insulating layer may include, for example, a solder resist, and may protect the first wiring pattern 20 or the second wiring pattern 50 from external factors.
  • the via pad 30 may be disposed to electrically connect the first wiring pattern 20 and the second wiring pattern 50. That is, the via hole 40 is formed to penetrate the base film 10, the via pad 30 fills the via hole 40, and the first wiring pattern 20 formed on one surface of the base film 10 and the other surface. Are respectively connected to the second wiring patterns 50 to electrically connect them.
  • the via pad 30 may include a material having electrical conductivity, such as copper, gold, or an alloy thereof, similarly to the first wiring pattern 20 or the second wiring pattern 50.
  • FIG. 3 is a plan view illustrating via pads included in a flexible circuit board according to an exemplary embodiment of the present invention.
  • the shape of the via pad 30 will be described in more detail with reference to FIG. 3.
  • the via pads 30 may be disposed to overlap the via holes 40 and may include first to fourth sides 31, 32, 33, and 34 surrounding the via holes 40.
  • the first side 31 and the fourth side 34 meet at the first edge 41
  • the second side 32 and the third side 33 meet at the second edge 42
  • the third side ( 33 and the fourth side 34 may meet at the third edge 53.
  • the first side 31 and the second side 32 of the via pad 30 may meet the first wiring pattern 20 and the connection region 21. That is, the first side 31 and the second side 32 may extend from the connection area 21 at an acute angle with the first direction D1 in which the first wiring pattern 30 extends.
  • the angle in the case of "a specific direction different from the specific direction makes a predetermined angle” means the smaller of the two angles resulting from the intersection of the two directions.
  • the angle that can be generated by crossing two directions is 114 °
  • 60 ° means 60 °.
  • the angle formed by the first direction D1 and the first side 31 is a1
  • the angle formed by the first direction D1 and the second side 32 is a2.
  • connection region 21 may be located at a corner where the first side 31 and the second side 32 meet. Meanwhile, in another embodiment of the present invention, when the first wiring pattern 20 and the via pad 30 are connected on any one of the first to fourth sides 31 to 34, the connection area 21. May be located on the first to fourth sides 31 to 34.
  • the angle formed by the extending direction of the first side 31 and the second side 32 may be about 90 °.
  • the angle between the first and second sides 31 and 32 and the first direction D1 may be about 45 °.
  • first side 31 and the third side 33 may extend to be substantially parallel, and the second side 32 and the fourth side 34 may extend to be substantially parallel.
  • substantially parallel means that the via pad 30 as well as the case where the first side 31 and the third side 33 or the second side 32 and the fourth side 34 are physically parallel. It may include a case where there is a slight difference depending on the margin or yield according to the forming process.
  • the via pad 30 is connected to the first wiring pattern 20 through the connection area 21 on one surface of the base film 10.
  • the via pad 30 has a width in the second direction D2, and the width in the second direction D2 of the via pad 30 decreases toward the first direction D1 about the connection area 21. .
  • the via pad 30 may extend the first width W1 of the second direction D2 at the point where the virtual line extending from the connection area 21 in the second direction D2 and the third edge 53 meet. And the first width W1 is maximum.
  • the second width W2 and the second direction D2 at an arbitrary point where the imaginary line extending in the second direction D2 and the second side 32 and the third side 33 meet each other.
  • the third width W3 at any point where the extended virtual line meets the first side 31 and the fourth side 34 is smaller than the width W1.
  • the area occupied on the via pad 30 by the imaginary line extending from the third edge 53 in the second direction D2 is defined as the 'center area', and the via pad 30 is the first area from the 'center area'. It may be described that the width of the second direction D2 decreases toward the direction D1.
  • Each side 31 to 34 of the via pad 30 may be spaced apart from the via hole 40 at a first distance K. Referring to FIG. The shape of the via pad 30 and the position of the via hole 40 will be described with reference to FIGS. 4A and 4B below.
  • FIG. 4A is an exemplary diagram illustrating position margins of via holes of via holes in a flexible circuit board according to some embodiments of the present disclosure
  • FIG. 4B illustrates positions of via holes and via pads in the flexible circuit board according to the related art. It is an illustration for explaining a margin.
  • the via hole 40 is the shortest distance is the first distance (K).
  • the centers of gravity of the via hole 40 and the via pad 30 do not coincide with each other, and are formed in the first direction D1 as illustrated in FIG. 4A.
  • An error may occur by two distances K1 so that the via hole 40 and the via pad 30 may be disposed.
  • the shortest distance between the first side 31 of the via pad 30 and the via hole 40 is the third distance K2.
  • the via pad 60 included in the flexible circuit board according to the related art has a shape in which the width of the wiring pattern 20 is extended in the second direction D2.
  • the centers of gravity of the via holes 40 and the via pads 60 do not coincide with each other and an error occurs by the second distance K1
  • the sides of the via holes 40 and the via pads 60 ( The shortest distance between 62 may be spaced apart by the fourth distance K3.
  • Equation 1 the shortest distance K2 between the via pad 30 and the via hole 40 in FIG. 4A is calculated, as shown in Equation 1 below.
  • K2 K-K1 * cos a 1
  • Equation 2 the shortest distance K3 between the via pad 60 and the via hole 40 in FIG. 4B is calculated, as shown in Equation 2 below.
  • the first side 31 and the second side 32 of the via pad 30 form an acute angle with the first wiring pattern 20 (0 ⁇ cos a 1 ⁇ 1) and K2> K3.
  • the via pad 40 may be formed through the base film 10, and the via pad 40 may be filled with a conductive material to form the via pad 30. Can be. At this time, the position of the via hole 40 overlaps the via pad 30 and is designed such that the center of gravity of the via hole 40 and the via pad 30 coincide with each other to secure the maximum position margin.
  • the positions of the pre-formed via holes 40 and the via pads 30 are shifted.
  • the via pad 30 may be formed such that the via hole 40 is biased to one side of the via pad 30. If an error occurs in the alignment so that the via pad 30 and the via hole 40 do not overlap, conduction failure occurs between the first wiring pattern and the second wiring pattern 20 and 50 of FIG. Can cause. Therefore, it is important to secure the maximum position margin with respect to the relative movement of the via hole 40 with respect to the via pad 30.
  • the deformation of the base film 10 in the manufacturing process of the flexible circuit board 1 may have a constant orientation. That is, the direction of contraction or expansion of the base film 10 may be predominantly shown in the first direction D1 or the second direction D2.
  • the fact that the directionality of the deformation of the base film 10 is predominant in the first direction D1 is a vector of the relative movement direction of the via hole 40 with respect to the via pad 30 due to the deformation of the base film 10. It means that the first direction (D1) of the components are the majority.
  • the via pad As shown in (30), it may be advantageous to secure a position margin when the first side 31 and the second side 32 form an acute angle with the first direction D1.
  • the first wiring pattern 20 is formed of the first to third edges 41, 42, and 53 of the via pad 30. It may be arranged to connect with either. That is, the first wiring pattern 20 may extend in the first direction D1 to be connected to the via pad 30 through the third edge 53, or may extend in the second direction D2 to the first corner. Alternatively, the via pads 30 may be connected to the via pads 30 through the second edges 41 and 42. In addition, the first wiring pattern 20 may be arranged to be connected to any one of the first to fourth sides 31 to 34 of the via pad 30.
  • FIG 5 is a top view of a via pad included in a flexible circuit board according to another embodiment of the present invention.
  • the via pad 130 may include a fifth side 35 interposed to connect the first side 31 and the fourth side 34, a second side 32, and a third side ( A sixth side 36 interposed between 33 may be further included.
  • a seventh side 37 may be interposed between the third side 33 and the fourth side 34 to connect the third side 33 and the fourth side 34.
  • the via pad 130 has a maximum width W4 at the point where the virtual line extending from the connection region 21 in the second direction D2 and the seventh side 37 meet.
  • the via pads 130 have the widths W2 and W3 of the second direction D2 smaller than the maximum width W4 toward the first direction D1, as described above.
  • the distance D1 between the via hole 40 and the fifth side 35 or the distance D2 between the via hole 40 and the sixth side 36 is a via hole 40.
  • the shortest distance K between the first side 31 That is, the distance D1 between the via hole 40 and the fifth side 35 is greater than the first distance K between the via hole 40 and the first side 31. This is because if the distance D1 between the via hole 40 and the fifth side 35 is less than or equal to the first distance K between the via hole 40 and the first side 31, This is because the via hole 40 may have a smaller position margin with respect to the movement in the first direction D1.
  • the via pad 130 may not include at least one of the fifth to seventh sides 35 to 37. That is, any pair of neighboring sides of the first to fourth sides 31 to 34 may be connected through any one of the fifth to seventh sides 35 to 37, and the other side may be directly connected.
  • FIG. 6 is a top view of a via pad included in a flexible circuit board according to still another embodiment of the present invention.
  • the via pad 230 may include a first arc 43 connecting the first side 31 and the fourth side 34, and a second side 32 and a third side 33. It may include a second arc 44 for connecting, and a third arc 45 for connecting the third side 33 and the fourth side 34. That is, when compared with the via pad 130 described above with reference to FIG. 5, the first to third arcs 43, 44, and 45 rounded to connect the first to fourth sides 31 to 34 are disposed. Can be.
  • the first to third arcs 43 to 45 may have a radius of curvature R.
  • the radius of curvature R of the first to third arcs 43 to 45 may be smaller than the distance K4 at which the center of the via hole 40 is spaced from the first side 31. Can be. This is because, if the radius of curvature R of the first to third arcs 43 to 45 is greater than or equal to the distance K4, the via pads 230 may be formed in an ellipse shape so that the position margin may be small. .
  • the via pad 230 may not include at least one of the first to third arcs 43 to 45. That is, any pair of neighboring sides of the first to fourth sides 31 to 34 may be connected through any one of the first to third arcs 43 to 45, and the other side may be directly connected.
  • FIG. 7 is a top view of a via pad included in a flexible circuit board according to still another embodiment of the present invention.
  • the via pad 330 may include a first wiring pattern 20 extending in the first direction D1, a first side 131 and a second side 132 extending at an acute angle.
  • the first side 131 and the second side 132 may include a third side 33 extending to be orthogonal to a direction forming the first direction D1.
  • the first side 131 and the second side 132 may form an acute angle with the first wiring pattern 20 and may extend in parallel with each other. That is, the angle a1 of the first side 131 and the first direction D1 and the angle a2 of the second side 132 and the first direction D1 may be the same.
  • the first side 131 and the third side 133 may meet at the first edge 141, and the second side 132 and the third side 133 may meet at the second edge 142. That is, the first side 131 and the second side 132 may be connected to each other through the third side 133.
  • the via pad 330 may have a maximum width W1 in the second direction D2 based on the second edge 142. That is, it may have a maximum width W1 at the point where the imaginary line extending in the second direction D2 and the first wiring pattern 20 meet at the second edge 142.
  • the width of the second direction D2 of the via pad 330 decreases toward the first direction D1 with respect to the second edge 142, the virtual line and the second line extending in the second direction D2 are formed.
  • the third width W3 at is smaller than the width W1.
  • an area occupied by the via pad 330 by a virtual line extending from the second edge 142 in the second direction D2 is defined as a 'center area', and the via pad 330 is a 'center area'. It may be described that the width of the second direction D2 decreases from 'to the first direction D1.
  • the via hole 140 may be spaced apart from the third side 133 by a first distance K.
  • the via hole 140 may be spaced apart from the first side 131 and the second side 132 at a first distance K.
  • the via hole 140 may be surrounded by the first wiring pattern 120 and the first to third sides 131, 132, and 133.
  • FIG. 8 is a top view of a via pad included in a flexible circuit board according to still another embodiment of the present invention.
  • the via pad 430 may include a fourth side 135 and a second side 132 and a third side interposed to connect the first side 131 and the third side 133. It may further include a fifth side 136 interposed between the 133. That is, the via hole 140 may be surrounded by the first wiring pattern 20 and the first to fifth sides 131, 132, 133, 135, and 136.
  • the fourth side 135 may extend in the second direction D2, and the fifth side 136 may extend in the first direction.
  • the via pad 430 has a maximum width W4 at the point where the imaginary line extending in the second direction D2 passes through the center of gravity of the via hole 140 and the fifth side 136.
  • the via pad 430 has the widths W2 and W3 of the second direction D2 smaller than the maximum width W4 toward the first direction D1, as described above.
  • the distance D1 between the via hole 140 and the fifth side 136 is greater than the shortest distance K between the via hole 140 and the third side 133. That is, the distance D1 between the via hole 140 and the fifth side 136 is greater than the first distance K between the via hole 140 and the third side 133.
  • the spaced distance between the via hole 140 and the fourth side 135 is equal to the via hole 140 and the third side 133. Or greater than the separation distance K of the first side 131.
  • the via pad 430 may not include any of the first or second sides 135 and 136. That is, any pair of neighboring sides of the first to third sides 131 to 133 may be connected through any one of the first side or the second side 135 and 136, and the other side may be directly connected.
  • FIG. 9 is a top view of a via pad included in a flexible circuit board according to still another embodiment of the present invention.
  • the via pad 530 may include a first arc 144 connecting the first side 131 and a third side 133, and a second side 132 and a third side 133. It may include a second call 145 to connect. That is, when compared with the via pad 130 described above with reference to FIG. 8, the first and second arcs 144 and 145 rounded to connect the first to third sides 131 to 33 may be disposed. have.
  • the first and second arcs 144 and 145 may have a radius of curvature (R).
  • R radius of curvature
  • the radius of curvature R of the first and second arcs 144, 145 may be less than the distance K of which the center of the via hole 140 is spaced from the third 133. have.
  • the via pad 530 may not include any of the first or second arcs 144 and 145. That is, any pair of neighboring sides of the first to third sides 131 to 133 may be connected through any one of the first or second sides 144 and 145, and the other side may be directly connected.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne une carte de circuit imprimé souple. La carte de circuit imprimé souple comprend : un film de base ; un premier motif de câblage s'étendant dans une première direction sur une surface du film de base ; une pastille de trou d'interconnexion connectée au premier motif de câblage dans une région de connexion et ayant une forme polygonale ; et un trou d'interconnexion pénétrant dans le film de base et chevauchant la pastille de trou d'interconnexion, la pastille de trou d'interconnexion comprenant une largeur dans une seconde direction perpendiculaire à la première direction, et la largeur dans la seconde direction diminuant à mesure que la pastille de trou d'interconnexion se rapproche de la première direction dans la région de connexion.
PCT/KR2017/009252 2016-09-23 2017-08-24 Carte de circuit imprimé souple ayant une pastille de trou d'interconnexion WO2018056594A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780058602.4A CN109792838A (zh) 2016-09-23 2017-08-24 具备过孔焊盘的柔性印刷电路板
CN202310151504.2A CN116033652A (zh) 2016-09-23 2017-08-24 具备过孔焊盘的柔性印刷电路板
JP2019516165A JP2019530243A (ja) 2016-09-23 2017-08-24 ビアパッドを有するフレキシブル回路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0122403 2016-09-23
KR1020160122403A KR101923637B1 (ko) 2016-09-23 2016-09-23 비아 패드를 갖는 연성 회로 기판

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WO2018056594A1 true WO2018056594A1 (fr) 2018-03-29

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PCT/KR2017/009252 WO2018056594A1 (fr) 2016-09-23 2017-08-24 Carte de circuit imprimé souple ayant une pastille de trou d'interconnexion

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JP (3) JP2019530243A (fr)
KR (1) KR101923637B1 (fr)
CN (2) CN109792838A (fr)
TW (1) TWI669033B (fr)
WO (1) WO2018056594A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923637B1 (ko) * 2016-09-23 2018-11-30 스템코 주식회사 비아 패드를 갖는 연성 회로 기판
WO2024111972A1 (fr) * 2022-11-25 2024-05-30 엘지이노텍 주식회사 Carte de circuit imprimé souple, module cof et dispositif électronique les comprenant

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521944A (ja) * 1991-07-12 1993-01-29 Canon Inc 印刷配線板
JPH0621631A (ja) * 1992-07-02 1994-01-28 Nec Corp 印刷配線板
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TW201815238A (zh) 2018-04-16
CN109792838A (zh) 2019-05-21
JP2023073414A (ja) 2023-05-25
KR20180032995A (ko) 2018-04-02
JP2021100142A (ja) 2021-07-01

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