WO2018045801A1 - 显示基板及制作方法和显示设备 - Google Patents

显示基板及制作方法和显示设备 Download PDF

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Publication number
WO2018045801A1
WO2018045801A1 PCT/CN2017/091180 CN2017091180W WO2018045801A1 WO 2018045801 A1 WO2018045801 A1 WO 2018045801A1 CN 2017091180 W CN2017091180 W CN 2017091180W WO 2018045801 A1 WO2018045801 A1 WO 2018045801A1
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WIPO (PCT)
Prior art keywords
functional film
display substrate
layer
film layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2017/091180
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English (en)
French (fr)
Inventor
周桢力
蒋志亮
梁逸南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/778,773 priority Critical patent/US10510982B2/en
Publication of WO2018045801A1 publication Critical patent/WO2018045801A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, and a display device.
  • OLED Organic Light Emitting Display
  • flat panel display and planar light source technology the bonding of two flat glass sheets is an important technology, and the packaging effect will directly affect the performance of the device, which makes the control of the quality of the packaging effect of the OLED display device appear more important.
  • the packaging of the OLED display device is to bond the substrates on both sides with a frame sealant.
  • an OLED display device packaged by a glass frit packaging technology is a solution in which a Frit material is formulated to a certain viscosity, coated on a glass substrate, heated to remove a solvent, and then bonded to a glass to be packaged, and utilized. The laser instantly melts the Frit material to melt, thereby bonding the two sheets of flat glass together. Due to the use of inorganic packaging media, Frit packaging technology has a strong ability to block moisture and oxygen. Particularly suitable for OLED manufacturing technology sensitive to moisture and oxygen.
  • the sealant When the glass substrate and the substrate to be packaged are packaged in the display device by using the sealant, there is a possibility that the sealant is broken and broken, thereby causing the display device to be eroded by water and oxygen.
  • Embodiments of the present disclosure provide an improved display substrate, method of fabricating the same, and display device to alleviate or solve one or more of the above problems or other problems.
  • an embodiment of the present disclosure provides a display substrate on which a functional film layer is disposed, and at least one layer of the functional film layer includes a protruding array on a side away from the display substrate, wherein the display substrate and the other When the substrate is displayed on the box, the protrusion of the protruding array is embedded A sealant between the substrate and another display substrate.
  • the embossed array is formed by a convex sub-array arrangement, and each of the convex sub-arrays includes a flat portion and at least one convex portion disposed on the flat portion.
  • the functional film layer includes a first functional film layer and a second functional film layer; one side of the first functional film layer is in contact with the display substrate, and the other side is in contact with one side of the second functional film layer; the second functional film The layer includes a protruding array; the second functional film layer is formed with a convex array on a side away from the display substrate; the flat portion and the at least one convex portion are located on the first functional film layer.
  • the first functional film layer is provided with a convex array on a side away from the display substrate.
  • the functional film layer further includes a third functional film layer
  • the third functional film layer covers the flat portion, and the thickness of the third functional film layer is smaller than the thickness of the convex portion; the third functional film layer is provided with at least one via hole, and the top of the at least one convex portion passes through the via hole.
  • the functional film layer further includes a third functional film layer, and the third functional film layer covers the flat portion and the convex portion disposed on the flat portion.
  • the third functional film layer includes a portion in contact with the first functional film layer.
  • At least one functional film layer includes a recessed aperture region and a non-recessed aperture region, and the protruding array is located in the non-recessed aperture region.
  • the cross section of the convex portion in a plane parallel to the display substrate is at least one of the following shapes: a circle, a triangle, a rectangle, and a polygon.
  • the top of the raised portion is a curved surface.
  • the flat portion and the at least one raised portion are metal.
  • the first functional film layer is a buffer layer
  • the buffer layer contains SiNx or SiO 2 .
  • the second functional film layer is a metal layer.
  • the third functional film layer is an insulating layer, and the insulating layer contains SiNx or SiO 2 .
  • an embodiment of the present disclosure provides a method for fabricating a display substrate, including:
  • forming at least one functional film layer on the display substrate includes:
  • a recessed hole region and a non-recessed hole region are formed on the first functional film layer by an etching process on the display substrate after the first exposure and development, and the first photoresist layer is peeled off.
  • forming a convex array on at least one side of the functional film layer away from the display substrate includes:
  • the display substrate after the second exposure development forms a flat portion on the first material layer by an etching process, and peels off the second photoresist layer;
  • the display substrate after the fourth exposure and development is formed with a via hole on the third functional film layer by an etching process
  • the display substrate after the fifth exposure development forms a convex portion on the second material layer by an etching process, and peels off the fourth photoresist layer and the fifth photoresist layer to form a flat portion and is disposed on the flat portion A second functional film layer on the raised portion.
  • the photoresist corresponding to the convex portion remaining on the fifth photoresist layer has the same shape as the top of the convex portion.
  • the curved surface is used to reflect the solidified light.
  • forming a convex array on at least one side of the functional film layer away from the display substrate includes:
  • the display substrate after the second exposure development forms a flat portion on the first material layer by an etching process, and peels off the second photoresist layer;
  • the display substrate after the fourth exposure development forms a convex portion on the second material layer by an etching process, and peels off the third photoresist layer and the fourth photoresist layer to form a flat portion and a flat portion a second functional film layer on the raised portion;
  • the display substrate after the fifth exposure development forms a third functional film layer on the third material layer by an etching process, and the fifth photoresist layer is peeled off.
  • the corresponding portion of the photoresist remaining on the fourth photoresist layer has the same shape as the top of the raised portion.
  • the curved surface is used to reflect the solidified light.
  • an embodiment of the present disclosure provides a display device including the display substrate provided by the first aspect.
  • Figure 1 is a schematic perspective view of a Frit portion
  • Figure 2 is a schematic cross-sectional view of A-A' in Figure 1;
  • FIG. 3 is a schematic perspective structural view of a specific display substrate of a display device according to an embodiment of the present disclosure
  • FIG. 4 is a schematic cross-sectional view showing a B-B' of the display substrate of the display device shown in FIG. 3 according to an embodiment of the present disclosure
  • FIG. 5 is a schematic cross-sectional view showing another B-B' of the display substrate of the display device shown in FIG. 3 according to an embodiment of the present disclosure
  • FIG. 6 is a schematic top view of a convex portion of a display substrate according to an embodiment of the present disclosure
  • FIG. 7 is a flowchart of specific steps of a method for fabricating a display substrate according to an embodiment of the present disclosure
  • 8a, 8b, 8c, 8d, 8e, 8f, 8g, 8h, 8i, 8j, 8k, 8l, 8m, 8n, 8o and 8p are schematic structural diagrams during the manufacturing process of the display substrate provided by the embodiments of the present disclosure ;
  • FIG. 9 is a flowchart of specific steps of another method for fabricating a display substrate according to an embodiment of the present disclosure.
  • 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 10l, 10m, 10n, 10o, 10p, and 10q are another fabrication of a display substrate provided by an embodiment of the present disclosure Schematic diagram of the structure in the process.
  • Figures 1 and 2 show schematic diagrams of Frit.
  • a schematic cross-sectional view of the Frit shown in Fig. 2 is taken in the A-A' direction in Fig. 1.
  • a recessed hole area a and a non-recessed hole area b are provided on the buffer layer 3 of the glass substrate 1.
  • a metal layer 4 and an insulating layer 5 are provided in the non-recessed hole region b.
  • the glass substrate 1 and the glass 2 to be packaged are bonded together by a Frit material 6.
  • the buffer layer 3 on the glass substrate 1 is provided with the recessed hole area a
  • the reliability test of the Frit package technology of the OLED display device when the OLED display device having a bad (Not Good, NG) is analyzed, it is found that Part of the packaged leaky OLED display device is due to the displacement of the Frit material in the non-recessed area b. It was found after the study that the surface of the non-recessed hole region b was parallel to the contact surface of the non-recessed hole region b and the Frit material 6, and the bonding by the Frit material 6 was only performed in the horizontal direction. Before the uncured material 6 is uncured, the contact surface is easily displaced in the non-recessed area b under the influence of the external environment. This causes the Frit material 6 located on the surface of the non-recessed hole region b to fall off, thereby causing the OLED display device to be eroded by water.
  • At least one functional film layer includes a convex array on a side away from the display substrate, and the protrusion of the convex array is embedded in the frame sealant. in.
  • the protrusions of the protruding array are embedded in the sealant. This increases the force for preventing the functional film layer from being displaced away from the side of the display substrate and the contact surface of the sealant, that is, the fixing effect in the parallel direction is increased.
  • a display substrate is provided. As shown in FIGS. 3 and 4, the display substrate 10 A functional film layer is provided thereon. At least one functional film layer includes a raised array 4010 on a side remote from the display substrate 10. When the display substrate 10 is paired with another display substrate 20, the corresponding protrusion of the protruding array 4010 is embedded in the sealant 50 between the display substrate 10 and the other display substrate 20.
  • a schematic cross-sectional view of the display substrate shown in Fig. 4 is obtained in the direction of B-B' in Fig. 3.
  • at least one functional film layer includes a convex array on a side away from the display substrate, and the protrusions of the protruding array are embedded in the sealant.
  • the bumps of the protruding array are embedded in the sealant, which increases the contact surface of the functional film layer away from the display substrate and the sealant. The force of displacement increases the fixation in the parallel direction.
  • a display substrate is provided.
  • the embossed array 4010 is formed by arranging a sub-array array.
  • Each of the protruding sub-arrays includes a flat portion 4011 and at least one convex portion 4014 disposed on the flat portion.
  • the functional film layer includes a first functional film layer 30 and a second functional film layer 40.
  • One side of the first functional film layer 30 is in contact with the display substrate 10, and the other side is in contact with one side of the second functional film layer 40.
  • the second functional film layer 40 includes the protruding array 4010.
  • the second functional film layer 40 is formed with a convex array 4010 on a side away from the display substrate 10.
  • the flat portion 4011 and the at least one convex portion 4014 are located on the first functional film layer 30.
  • the first functional film layer 30 is provided with the protruding array 4010 on a side away from the display substrate 10.
  • the functional film layer further includes a third functional film layer 4012.
  • the third functional film layer 4012 covers the flat portion 4014, and the thickness of the third functional film layer 4012 is smaller than the thickness of the convex portion 4014.
  • the third functional film layer 4012 is provided with at least one via hole 4013, and the top of the at least one convex portion 4014 passes through the via hole 4013.
  • top of the convex portion can be embedded in the sealant.
  • the third functional film layer 4012 includes a portion in contact with the first functional film layer 30.
  • At least one of the functional film layers includes a recessed area a and a non-recessed area b, and the raised array 4010 is located in the non-recessed area b.
  • the cross section of the convex portion 4014 in a plane parallel to the display substrate is at least one of the following shapes: a circle, a triangle, a rectangle, and a polygon.
  • the top of the raised portion 4014 is a curved surface.
  • the flat portion 4011 and the at least one raised portion 4014 are metal. It should be noted that the preparation material of the flat portion and the at least one convex portion may be molybdenum.
  • the first functional film layer 30 is a buffer layer, and the buffer layer contains SiNx or SiO 2 .
  • the second functional film layer 40 is a metal layer.
  • the third functional film layer 4012 is an insulating layer, and the insulating layer contains SiNx or SiO 2 .
  • the second functional film layer is directly disposed on the display substrate, the fixing effect of the display substrate on the second functional film layer is insufficient. Therefore, it is necessary to first provide a first functional film layer on the display substrate. Since the bonding force between the first functional film layer and the display substrate is strong, and the bonding force between the metal layer and the first functional film layer is also strong, the product can be firmly fixed and the stability of the product is increased.
  • the convex array consists of a number of convex sub-arrays.
  • Each of the protruding sub-arrays includes a flat portion and at least one convex portion disposed on the flat portion.
  • the third functional film layer and the first functional film layer are at least one of SiNx or SiO 2 .
  • At least one convex portion passes through a through hole provided on the third functional film layer, and a top portion of the at least one convex portion is embedded in the sealant.
  • the flat portion and the at least one raised portion are formed of a metal.
  • the cross section of the convex portion in a plane parallel to the display substrate is prepared into a different shape such as a circular shape according to actual needs.
  • the top of the convex portion is a curved surface.
  • the top of the curved surface of the convex portion reflects the laser light.
  • the means for emitting laser light is typically located above the first substrate.
  • the sealant around the raised portion receives not only the laser light in the vertical direction but also the laser light reflected by the curved surface. This allows the sealant around the raised portion to receive more laser light in the same amount of time, ie the energy of the laser is more many. This in turn allows the sealant to melt better.
  • the convex sub-array may include at least one convex portion.
  • the recessed holes are arranged in an array, and the projected array is distributed around the recessed areas.
  • a display substrate is provided.
  • the convex array 4010 is formed by a convex sub-array arrangement, and each of the convex sub-arrays includes a flat portion 4011 and at least one convex portion 4014.
  • the functional film layer includes a first functional film layer 30 and a second functional film layer 40.
  • One side of the first functional film layer 30 is in contact with the display substrate 10, and the other side is in contact with one side of the second functional film layer 40.
  • the second functional film layer 40 includes the protruding array 4010.
  • the second functional film layer 40 is formed with a convex array 4010 on a side away from the display substrate 10.
  • the flat portion 4011 and the at least one convex portion 4014 are located on the first functional film layer 30.
  • the first functional film layer 30 is provided with the protruding array 4010 on a side away from the display substrate 10.
  • the functional film layer further includes a third functional film layer 4012.
  • the third functional film layer 4012 covers the flat portion 4014, and the thickness of the third functional film layer 4012 is smaller than the thickness of the convex portion 4014.
  • the difference from the embodiment shown in FIG. 4 is that in the embodiment shown in FIG. 5, the third functional film layer 4012 conformally covers the raised array 4010, ie, covers the flat portion 4011 and the raised portion 4014.
  • the third functional film layer 4012 includes a portion in contact with the first functional film layer 30.
  • At least one of the functional film layers includes a recessed area a and a non-recessed area b, and the raised array 4010 is located in the non-recessed area b.
  • the cross section of the convex portion 4014 in a plane parallel to the display substrate is at least one of the following shapes: a circle, a triangle, a rectangle, and a polygon.
  • the top of the raised portion 4014 is a curved surface.
  • the flat portion 4011 and the at least one raised portion 4014 are metal. It should be noted that the preparation material of the flat portion and the at least one convex portion is, for example, molybdenum.
  • the first functional film layer 30 is a buffer layer, and the buffer layer contains SiNx or SiO 2 .
  • the second functional film layer 40 is a metal layer.
  • the third functional film layer 4012 is an insulating layer.
  • the insulating layer contains SiNx or SiO 2 .
  • the fixing effect of the display substrate on the second functional film layer is insufficient. Therefore, it is necessary to first provide a first functional film layer on the display substrate.
  • the bonding force between the first functional film layer and the display substrate is strong, and the bonding force between the metal layer and the first functional film layer is also strong, so that the product can be firmly fixed and the stability of the product is increased.
  • the convex array is composed of a plurality of convex sub-arrays, wherein each of the convex sub-arrays includes a flat portion and at least one convex portion disposed on the flat portion.
  • the material of the third functional film layer and the first functional film layer is at least one of SiNx or SiO 2 .
  • the third functional film layer is disposed on the first functional film layer and covers the flat portion and the convex portion disposed on the flat portion.
  • the flat portion and the at least one raised portion are formed of a metal.
  • the cross section of the convex portion is prepared into different shapes according to actual needs.
  • the convex sub-array may include at least one convex portion.
  • the recessed holes are arranged in an array, and the projected array is distributed around the recessed areas.
  • the projections embedded in the sealant are a raised portion and a third functional film layer covering the raised portion.
  • the third functional film layer covers the flat portion and the convex portion provided on the flat portion.
  • the raised portion disposed on the flat portion and the third functional film layer thereabove form a convex array of protrusions, and the protrusions are embedded in the sealant.
  • the protrusion is embedded in the sealant. This increases the force for preventing the displacement of the surface of the third functional film layer and the contact surface of the third functional film layer and the sealant, that is, the fixation in the parallel direction is increased, and the third functional film layer and the seal are prevented.
  • Displacement occurs between the contact faces of the sealant. This reduces the probability of breakage of the sealant due to displacement, and solves the problem that the display device is eroded by water oxygen caused by the breakage of the sealant.
  • a convex array is disposed on one side of the third functional film layer, and the convex portion of the convex array and the third functional film layer covering the convex portion are embedded in the sealant. This increases the contact area between the surface of the third functional film layer and the sealant, and increases the adhesion between the surface of the third functional film layer and the sealant, thereby increasing the sealant on the display substrate and another Shows how strong the bond is in the substrate.
  • a method of fabricating a display substrate is provided, such as a fabrication step:
  • Step S101 forming at least one functional film layer on the display substrate 10;
  • Step S102 forming a convex array 4010 on a side of the at least one functional film layer away from the display substrate 10.
  • the array 4010 is protruded
  • the bumps are embedded in the sealant 50 between the display substrate 10 and the other display substrate 20.
  • a functional film layer is formed on the display substrate, and a convex array is formed on a side of the functional film layer away from the display substrate, and the functional film layer is prepared and disposed on the functional film layer.
  • the display substrate on which one side of the display substrate forms a convex array may be coated with a sealant, and then the display substrate is bonded to another display substrate by laser sealing. The sealant is bonded to the display substrate through a side of the functional film layer away from the display substrate.
  • the protrusions of the functional film layer forming the convex array are embedded in the sealant on the side of the functional film layer away from the display substrate, a vertical direction of the functional film layer away from the display substrate and the contact surface of the sealant can be generated.
  • Force Generally, the functional film layer is parallel to the side of the display substrate and the contact surface of the sealant is parallel, and the force generated is only in the horizontal direction. After the frame sealant is cured, under the influence of the external environment, it may be functional. A displacement occurs between the side of the film layer away from the display substrate and the contact surface of the sealant, thereby causing the sealant to break off at the surface of the non-recessed area.
  • the present disclosure prepares a convex array by non-recessed holes in the first functional film layer, so that when the sealant is bonded to the display substrate and the other display substrate, not only the force is generated in the horizontal direction, but also the convex array is embedded in the seal.
  • this produces a force that prevents the functional film from moving away from the side of the display substrate and the contact surface of the sealant, i.e., increases the fixation in the parallel direction.
  • This prevents displacement of the functional film layer from the side of the display substrate and the contact surface of the sealant reduces the probability of breakage of the sealant due to displacement, and solves the problem that the display device is eroded by water and oxygen. The problem.
  • the contact area of the functional film layer away from the display substrate and the sealant is increased.
  • the bonding strength between the side of the functional film layer away from the display substrate and the sealant is increased, thereby increasing the adhesion strength of the sealant in the display substrate and the other display substrate.
  • an embodiment of the present disclosure provides a display substrate, which is illustrated as an example in which a top portion of a convex portion of a flat portion is a curved surface.
  • the manufacturing method includes:
  • Step S1010 preparing a first functional film layer 30 on the display substrate 30 by a deposition process.
  • Step S1010 shown in FIG. 8a may deposit a predetermined thickness of SiNx and SiO 2 on the display substrate by plasma enhanced chemical vapor deposition (PECVD) to form the first functional film layer 30.
  • PECVD plasma enhanced chemical vapor deposition
  • Step S1011 a first photoresist layer 6011 is coated on the first functional film layer 30, and a first exposure and development is performed to form a recessed hole region a and a non-recessed surface on the first photoresist layer 6011.
  • the pattern of the hole area b is the pattern of the hole area b.
  • step S1011 as shown in FIG. 8b, the first functional film layer 30 prepared on the display substrate 20 is overcoated to form a first photoresist layer 6011, and exposed by a single gray-scale mask process, in the first photoresist.
  • a pattern of the recessed hole region a and the non-recessed hole region b is formed on the layer 6011, and the first photoresist layer 6011 forming the recessed hole region a is removed by the first development, and the first light forming the non-recessed hole region b is formed.
  • the glue layer 6011 remains.
  • Step S1012 a recessed hole region a and a non-recessed hole region b are formed on the first functional film layer 30 by an etching process on the display substrate 20 after the first exposure and development, and the first photoresist layer 6011 is peeled off.
  • a recessed hole region a and a non-recessed hole region b may be formed on the first functional film layer 30 of the display substrate 20 after the first exposure and development by dry etching.
  • the flat portion and the convex portion disposed on the flat portion are made of the same material and are metal, and the flat portion and the convex portion disposed on the flat portion are located on the first material layer,
  • the preparation material of a material layer is described as molybdenum metal.
  • Step S1013 shown in FIG. 8d may deposit a predetermined thickness of molybdenum metal on the display substrate 20 after the second exposure development by PECVD to form the first material layer 4015.
  • Step S1014 coating the second photoresist layer 6012 covering the second functional film layer 40, and performing a second exposure development, on the second photoresist layer 6012, the non-recessed hole region b of the first functional film layer 30 The corresponding position forms a pattern of the flat portion 4011.
  • step S1014 the first material layer 4015 prepared on the display substrate 20 is overcoated to form a second photoresist layer 6012, which is exposed by a single gray-scale mask process, in the second photoresist layer.
  • a pattern of the flat portion 4011 is formed on the 6012, and the second photoresist layer 6012 forming the flat portion 4011 is left by the second development, and the second photoresist layer 6012 of the other regions is removed.
  • step S1015 the display substrate 20 after the second exposure and development is formed into a flat portion 4011 on the first material layer 4015 by an etching process, and the second photoresist layer 6012 is peeled off.
  • a flat portion may be formed on the first material layer 4015 of the display substrate 20 after the second exposure development by wet etching. 4011.
  • Step S1016 preparing a third material layer 4017 by a deposition process on the display substrate forming the flat portion 4011.
  • Step S1016 as shown in FIG. 8g may deposit a predetermined thickness of SiNx and SiO 2 on the display substrate by PECVD to form a third material layer 4017.
  • Step S1017 coating a third photoresist layer 6013 covering the third material layer 4017, and performing a third exposure development, forming a third functional film layer 4012 at a position corresponding to the flat portion 4011 on the third photoresist layer 6013. picture of.
  • step S1017 the third material layer 4017 prepared on the display substrate 20 is overcoated to form a third photoresist layer 6013, which is exposed by a single gray-scale mask process, in the third photoresist.
  • a pattern of the third functional film layer 4012 is formed on the layer 6013, and the third photoresist layer 6013 forming the third functional film layer 4012 is left by the third development, and the third photoresist layer 6013 of the other regions is removed.
  • Step S1018 the display substrate 20 after the third exposure and development is formed into a third functional film layer 4012 by an etching process, and the third photoresist layer 6013 is peeled off; wherein the third functional film layer 4012 covers the flat portion 4011.
  • the third functional film layer 4012 may be formed on the third material layer 4017 of the display substrate 20 after the third exposure development by dry etching.
  • Step S1019 coating a fourth photoresist layer 6014 covering the third functional film layer 4012, and performing a fourth exposure development, forming a pattern of via holes 4013 on the fourth photoresist layer 6014.
  • the fourth photoresist layer 6012 is overcoated by coating to form the fourth photoresist layer 6014, and the fourth photoresist layer forming the via hole 4013 is formed by a single gray scale mask process exposure. Layer 6014 is removed, leaving the fourth photoresist layer 6014 of the other regions.
  • step S1020 the display substrate 20 after the fourth exposure and development is formed with a via hole 4013 on the third functional film layer 4012 by an etching process.
  • a via hole 4013 may be formed on the third functional film layer 4012 of the display substrate 20 after the fourth exposure and development by dry etching.
  • Step S1021 a second material layer 4016 is prepared on the display substrate 20 on which the via holes 4013 are formed, and the second material layer 4016 is connected to the flat portion 4011 through the via holes 4013.
  • the convex portion disposed on the flat portion cannot be formed by one molding, it is necessary to prepare a second material layer to cover the via hole disposed on the third functional film layer. At the same time, the flat layer is connected to the flat portion through the via hole. Therefore, a convex portion provided on the flat portion can be prepared.
  • the material used in the preparation of the flat layer is, for example, molybdenum metal in view of the degree of connection between the metals.
  • a second material layer 4016 of a predetermined thickness may be deposited on the display substrate 20 on which the via holes 4013 are formed by PECVD in step S1021 as shown in FIG.
  • Step S1022 coating a fifth photoresist layer 6015 covering the second material layer 4016, and performing a fifth exposure development, leaving a photoresist 40 corresponding to the convex portion 4014 on the fifth photoresist layer 6015;
  • the shape of the photoresist corresponding to the convex portion 4014 remaining on the fifth photoresist layer 6015 is the same as the shape of the top portion of the convex portion 4014.
  • the second photoresist layer 6015 is overcoated by coating the second material layer 4016, and a gradation is formed by using a Gray-tone mask.
  • a portion of the photoresist layer of the fifth photoresist layer 6015 is retained, and the fifth photoresist layer 6015 of the other regions is removed;
  • the multi-gray mask layer herein refers to a line below which the resolution of the exposure machine is made.
  • the mask is covered by a portion of the light source in the mask to achieve a half exposure effect.
  • Step S1023 the display substrate 20 after the fifth exposure and development is formed into a convex portion 4014 on the second material layer 4016 by an etching process, and the fourth photoresist layer 6014 and the fifth photoresist layer 6015 are peeled off to form A second functional film layer 40 including a flat portion 4011 and a raised portion 4014 disposed on the flat portion 4011.
  • the etching process may employ wet etching of the second material layer by an etching solution to form a convex portion 4014.
  • step S1030 the sealant 50 is coated on the display substrate 20 formed above, and the sealant 50 is laser-cured, wherein the curved surface is used to reflect the curing light to the sealant 50.
  • step S1030 shown in FIG. 8p when the top of the convex portion 4014 is a curved surface, it is possible to reflect the laser light through the curved surface at the top of the convex portion 4014 during laser sealing so that the convex portion is located around the convex portion.
  • the sealant 50 not only receives the laser light in the vertical direction but also receives the laser light reflected by the curved surface, so that the sealant 50 located around the convex portion 4014 receives the laser light in the same time. More, that is, the laser has more energy, which in turn makes the sealant 50 more molten, thereby bonding the display substrate 10 to the other display substrate 20 by the cured sealant 50.
  • the description is made by taking the top of the convex portion in the convex sub-array as an arc surface as an example, and the sectional shape of the convex portion is not limited.
  • the material used in the preparation of the flat portion is the same as the material of the gate electrode, and the material used for the flat layer is the same as the material of the source. Since the material of the flat layer is the same as the material of the convex portion of the protruding sub-array, the preparation materials of the flat portion and the flat layer may be the same or different.
  • the material of the flat portion and the flat layer is not limited.
  • the convex array disposed on the flat portion can be prepared through a plurality of processes, and the convex portion in the convex sub-array of the convex array passes through the second material layer.
  • the convex portion of the protruding array is embedded in the sealant. This increases the force for preventing the displacement of the surface of the third functional film layer and the contact surface of the sealant, that is, the fixation in the parallel direction is increased, and the surface of the third functional film can be prevented from contacting the sealant.
  • the displacement between the faces can further reduce the probability of breakage of the sealant due to the displacement, and solve the problem that the display device is eroded by water and oxygen caused by the breakage of the sealant.
  • the convex array is provided on the flat portion, and the convex portion provided on the flat portion is embedded in the sealant by the third functional film layer gate fixing via hole, the surface of the third functional film layer is formed
  • the contact area with the sealant increases, which increases the adhesion between the surface of the third functional film and the sealant, thereby increasing the adhesion of the sealant to the display substrate and the other display substrate. degree.
  • an embodiment of the present disclosure provides a display substrate, which is illustrated by taking an example of a convex portion of a convex portion in a sub-array as an arc surface.
  • the manufacturing method includes:
  • step S2010 the first functional film layer 30 is prepared on the display substrate 30 by a deposition process.
  • the step S2010 shown in FIG. 10a may deposit a predetermined thickness of SiNx and SiO 2 on the display substrate by PECVD to form the first functional film layer 30.
  • Step S2011 applying a first photoresist layer 6011 on the first functional film layer 30, and performing first exposure development, forming a recessed hole region a and a non-recessed hole region b on the first photoresist layer 6011. pattern.
  • step S2011 shown in FIG. 10b the first functional film layer 30 prepared on the display substrate 20 is overcoated to form a first photoresist layer 6011, and exposed by a single gray-scale mask process, in the first photoresist.
  • a pattern of the recessed hole area a and the non-recessed hole area b is formed on the layer 6011, and
  • the first photoresist layer 6011 forming the recessed hole region a is removed, and the first photoresist layer 6011 forming the non-recessed hole region b is left.
  • step S2012 a recessed hole region a and a non-recessed hole region b are formed on the first functional film layer 30 by an etching process on the display substrate 20 after the first exposure and development, and the first photoresist layer 6011 is peeled off.
  • a recessed hole region a and a non-recessed hole region b may be formed on the first functional film layer 30 of the display substrate 20 after the first exposure and development by dry etching.
  • Step S2013 a first material layer 4015 is prepared by a deposition process on the display substrate 10 on which the first functional film layer 30 is formed.
  • the flat portion and the convex portion disposed on the flat portion are made of the same material and are metal, and the flat portion and the convex portion disposed on the flat portion are located on the first material layer,
  • the preparation material of a material layer is described as molybdenum metal.
  • the step S2013 shown in FIG. 10d may form a first material layer 4015 by depositing a predetermined thickness of molybdenum metal on the display substrate 20 after the second exposure development by PECVD.
  • Step S2014 coating the second photoresist layer 6012 covering the first material layer 4015, and performing a second exposure development, on the second photoresist layer 6012, the non-recessed hole region b of the first functional film layer 30 corresponds to The position forms a pattern of the flat portion 4011.
  • a second photoresist layer 6011 is formed by applying a second photoresist layer 6012 on the first material layer 4015 and exposing it by a single gray-scale mask process. 6012 remains to remove the second photoresist layer 6012 from other regions.
  • step S2015 the display substrate 20 after the second exposure development is formed into a flat portion 4011 on the first material layer 4015 by an etching process, and the second photoresist layer 6012 is peeled off.
  • the first material layer 4015 may be etched by wet etching to form a flat portion 4011.
  • Step S2016 coating the third photoresist layer 6013 covering the flat portion 4011, and forming a via hole 4013 at a position corresponding to the convex portion 4014 of the flat portion 4011 on the third photoresist layer 6013 by the third exposure development. picture of.
  • the third photoresist layer 4013 is formed by applying a third photoresist layer 6013 on the flat portion 4011 and exposing it by a single gray-scale mask process. Layer 6013 is removed, leaving the third photoresist layer 6013 of the other regions.
  • Step S2017 passing the deposition process on the display substrate 20 after the third exposure and development A second material layer 4016 is formed on the third photoresist layer 6013; wherein the second material layer 4016 is connected to the flat portion 4011 through the via 4013.
  • the convex portion disposed on the flat portion cannot be formed by one molding, it is necessary to prepare a second material layer to cover the via hole disposed on the third photoresist layer, and the flat layer passes through the via hole and the flat portion. connection. Therefore, a convex portion provided on the flat portion can be prepared.
  • the material used in the preparation of the second material layer is, for example, molybdenum metal in view of the degree of connection between the metals.
  • Step S2017 as shown in FIG. 10i may deposit a predetermined thickness of molybdenum metal on the display substrate 20 after the third exposure development by PECVD to form a second material layer 4016.
  • Step S2018 coating a fourth photoresist layer 6014 covering the second material layer 4016, and performing a fourth exposure development, leaving the photoresist corresponding to the convex portion 4014 on the fourth photoresist layer 6014.
  • step S2018 the fourth photoresist layer 6014 is overcoated by coating the second material layer 4016, and the fourth light forming the convex portion 4014 is formed by exposure with a multi-gray mask.
  • the photoresist of the dicing layer 6014 remains, and the fourth photoresist layer 6014 of the other regions is removed; wherein the photoresist 50 and the top of the convex portion 4014 corresponding to the convex portion 4014 are left on the fourth photoresist layer 6014.
  • the shape is the same.
  • Step S2019 the display substrate 20 after the fourth exposure and development is formed into a convex portion 4014 on the second material layer 4016 by an etching process, and the third photoresist layer 6013 and the fourth photoresist layer 6014 are peeled off;
  • the etching process may employ wet etching of the second material layer 4016 by an etchant to form the convex portion 4014.
  • step S2020 a third material layer 4017 covering the flat portion 4011 and the convex portion 4014 provided on the flat portion 4011 is formed by a deposition process on the display substrate after the fourth exposure development.
  • Step S2020 shown in FIG. 10n may deposit a predetermined thickness of SiNx and SiO 2 on the display substrate by PECVD to form a third material layer 4017.
  • Step S2021 coating a fifth photoresist layer 6015 covering the third material layer 4017, and performing a fifth exposure development, forming a pattern of the third functional film layer 4012 on the fifth photoresist layer 6015.
  • step S2021 by coating the third material layer 4017
  • the fifth photoresist layer 6015 is exposed by a single gray scale mask process, and the fifth photoresist layer 6015 forming the third functional film layer 4012 pattern is retained, and the fifth photoresist layer 6015 of the other regions is removed.
  • Step S2022 the display substrate 20 after the fifth exposure development is formed into a pattern of the third functional film layer 4012 on the third material layer 4017 by an etching process, and the fifth photoresist layer 6015 is peeled off.
  • step S2022 the third material layer 4017 is etched by dry etching to form a third functional film layer 4012.
  • step S2030 the sealant 50 is applied onto the display substrate 20 formed above, the sealant 50 is laser-cured, and the display substrate 10 is bonded to the other display substrate 20 by the cured sealant 50.
  • the top of the raised portion 4014 is a curved surface.
  • the third functional film layer 4012 forms a convex shape of the convex array 4010 at a position covering the convex portion 4014.
  • the top is a curved surface, the laser enters the top of the convex portion 4014 through the third functional film layer 4012, and the curved surface of the top portion of the convex portion 4014 is used to reflect the laser light through the third functional film layer 4012 covering the convex portion.
  • the curing light of the sealant 50 is formed later; the display substrate 10 is bonded to the other display substrate 20 by the cured sealant 50.
  • the projections embedded in the sealant are a raised portion and a third functional film layer covering the raised portion.
  • the third functional film layer covers the flat portion and the convex portion provided on the flat portion.
  • the raised portion disposed on the flat portion and the third functional film layer thereabove form a convex array of protrusions, and the protrusions are embedded in the sealant.
  • the protrusion is embedded in the sealant. This increases the force for preventing the displacement of the surface of the third functional film layer and the contact surface of the third functional film layer and the sealant, that is, the fixation in the parallel direction is increased, and the third functional film layer and the seal are prevented.
  • Displacement occurs between the contact faces of the sealant. This reduces the probability of breakage of the sealant due to displacement, and solves the problem that the display device is eroded by water oxygen caused by the breakage of the sealant.
  • a convex array is disposed on one side of the third functional film layer, and the convex portion of the convex array and the third functional film layer covering the convex portion are embedded in the sealant. This increases the contact area between the surface of the third functional film layer and the sealant, and increases the adhesion between the surface of the third functional film layer and the sealant, thereby increasing the sealant on the display substrate and another Shows how strong the bond is in the substrate.
  • a display device including any of the display substrates provided in the above embodiments.
  • the display device may be: electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, etc., any product or component having a display function.

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Abstract

一种显示基板及制作方法和显示设备。该显示基板(10)上设置有功能膜层(30，40，4012)，在至少一层功能膜层(30，40，4012)在远离显示基板(10)一侧包括凸出阵列(4010)。显示基板(10)与另一显示基板(20)对盒时，凸出阵列(4010)的凸起嵌入显示基板(10)与另一显示基板(20)之间的封框胶(50)。

Description

显示基板及制作方法和显示设备
相关专利申请
本申请主张于2016年9月9日提交的中国专利申请No.201610816073.7的优先权，其全部内容通过引用结合于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及制作方法和显示设备。
背景技术
随着科技的进步，有机发光二极管(Organic Light Emitting Display，OLED)在生活中的使用越来越广泛。在平板显示与平面光源技术当中，对于两片平板玻璃的粘结是一项很重要的技术，其封装效果将直接影响器件的性能，这就使得对OLED显示器件封装效果质量的把控显得更加重要。
通常对OLED显示器件的封装是采用封框胶将两侧的基板粘结。这里以采用玻璃胶(Frit)封装技术封装的OLED显示器件为例，它是将Frit材料配成一定粘度的溶液，涂覆在玻璃基板上，加热除去溶剂，然后与待封装玻璃贴合，利用激光(laser)将Frit材料瞬间烧至融化，从而将两片平板玻璃粘结在一起。Frit封装技术由于采用的是无机封装介质，所以其阻止水汽与氧气的能力很强。特别适合用于对水汽、氧气敏感的OLED制造技术。
采用封框胶对显示器件中玻璃基板与待封装基板封装时，存在封框胶脱落断裂的概率从而造成显示器件被水氧侵蚀的问题。
发明内容
本公开实施例提供一种改进的显示基板及制作方法和显示设备，以减轻或解决一个或多个上述问题或者其它问题。
在第一方面，本公开实施例提供一种显示基板，显示基板上设置有功能膜层，在至少一层所述功能膜层在远离显示基板一侧包括凸出阵列，其中显示基板与另一显示基板对盒时，凸出阵列的凸起嵌入显 示基板与另一显示基板之间的封框胶。
例如，凸出阵列由凸出子阵列排列形成，并且每个凸出子阵列包括平坦部分以及设置于平坦部分上的至少一个凸起部分。
例如，功能膜层包括第一功能膜层和第二功能膜层；第一功能膜层的一侧与显示基板接触，并且另一侧与第二功能膜层的一侧接触；第二功能膜层包括凸出阵列；第二功能膜层在远离显示基板一侧形成有凸出阵列；平坦部分以及至少一个凸起部分位于第一功能膜层上。
例如，第一功能膜层在远离显示基板一侧设置有凸出阵列。
例如，功能膜层还包括第三功能膜层；以及
第三功能膜层覆盖平坦部分，并且第三功能膜层的厚度小于凸起部分的厚度；第三功能膜层上设置有至少一个过孔，并且至少一个凸起部分的顶部穿过过孔。
例如，功能膜层还包括第三功能膜层，并且第三功能膜层覆盖平坦部分和设置于平坦部分上的凸起部分。
例如，第三功能膜层包括与第一功能膜层接触的部分。
例如，至少一层功能膜层包括凹孔区域和非凹孔区域，并且凸出阵列位于非凹孔区域。
例如，凸起部分在平行于显示基板的平面内的截面至少为以下一种形状：圆形、三角形、矩形和多边形。
例如，凸起部分的顶部为弧面。
例如，平坦部分以及至少一个凸起部分为金属。
例如，第一功能膜层为缓冲层，并且缓冲层包含SiNx或者SiO2。
例如，第二功能膜层为金属层。
例如，第三功能膜层为绝缘层，并且绝缘层包含SiNx或者SiO2。
在第二方面，本公开实施例提供一种显示基板的制作方法，包括：
在显示基板上形成至少一层功能膜层；以及
在至少一层功能膜层远离显示基板的一侧形成凸出阵列，其中显示基板与另一显示基板对盒时，凸出阵列的凸起嵌入显示基板与另一显示基板之间的封框胶。
例如，在显示基板上形成至少一层功能膜层包括：
在显示基板上利用沉积工艺形成第一功能膜层；
在第一功能膜层上涂覆第一光刻胶层，并且进行第一次曝光显影， 在第一光刻胶层上形成凹孔区域与非凹孔区域的图案；以及
在第一次曝光显影后的显示基板上通过刻蚀工艺在第一功能膜层上形成凹孔区域与非凹孔区域，并且剥离第一光刻胶层。
例如，在至少一层所述功能膜层远离显示基板的一侧形成凸出阵列包括：
形成第一功能膜层；
在形成第一功能膜层的显示基板上通过沉积工艺制备第一材料层；
涂覆覆盖第一材料层的第二光刻胶层，并且进行第二次曝光显影，在第二光刻胶层上第一功能膜层的非凹孔区域对应的位置形成平坦部分的图案；
在第二次曝光显影后的显示基板通过刻蚀工艺在第一材料层上形成平坦部分，并且剥离第二光刻胶层；
在形成平坦部分的显示基板上通过沉积工艺制备第三材料层；
涂覆覆盖第三材料层的第三光刻胶层，并且进行第三次曝光显影，在第三光刻胶层上平坦部分对应的位置形成第三功能膜层的图案；
在第三次曝光显影后的显示基板通过刻蚀工艺形成第三功能膜层，并且剥离第三光刻胶层，其中第三功能膜层覆盖平坦部分；
涂覆覆盖第三功能膜层的第四光刻胶层，并且进行第四次曝光显影，在第四光刻胶层上形成过孔的图案；
在第四次曝光显影后的显示基板通过刻蚀工艺在第三功能膜层上形成过孔；
在形成过孔的显示基板上制备第二材料层，第二材料层通过过孔与平坦部分连接；
涂覆覆盖第二材料层的第五光刻胶层，并且进行第五次曝光显影，在第五光刻胶层上保留凸起部分对应的光刻胶；以及
在第五次曝光显影后的显示基板通过刻蚀工艺在第二材料层上形成凸起部分，并且剥离第四光刻胶层和第五光刻胶层，形成包含平坦部分和设置于平坦部分上的凸起部分的第二功能膜层。
例如，在第五光刻胶层上保留凸起部分对应的光刻胶与凸起部分顶部的形状相同。
例如，凸起部分的顶部为弧面时，弧面用于反射固化光线。
例如，在至少一层所述功能膜层远离显示基板的一侧形成凸出阵列包括：
形成第一功能膜层；
在形成第一功能膜层的显示基板上通过沉积工艺制备第一材料层；
涂覆覆盖第一材料层的第二光刻胶层，并且进行第二次曝光显影，在第二光刻胶层上第一功能膜层的非凹孔区域对应的位置形成平坦部分的图案；
在第二次曝光显影后的显示基板通过刻蚀工艺在第一材料层上形成平坦部分，并且剥离第二光刻胶层；
涂覆覆盖平坦部分的第三光刻胶层，并通过第三次曝光显影，在第三光刻胶层上平坦部分的凸起部分对应的位置形成过孔的图案；
在第三次曝光显影后的显示基板上通过沉积工艺在第三光刻胶层上形成第二材料层，其中第二材料层通过过孔与平坦部分连接；
涂覆覆盖第二材料层的第四光刻胶层，并且进行第四次曝光显影，在第四光刻胶层上保留凸起部分对应的光刻胶；
在第四次曝光显影后的显示基板通过刻蚀工艺在第二材料层上形成凸起部分，并且剥离第三光刻胶层和第四光刻胶层，形成包含平坦部分和设置与平坦部分上的凸起部分的第二功能膜层；
在第四次曝光显影后的显示基板上通过沉积工艺形成覆盖第二功能膜层的第三材料层；
涂覆覆盖第三材料层的第五光刻胶层，并且进行第五次曝光显影，在第五光刻胶层上形成第三功能膜层的图案；以及
在第五次曝光显影后的显示基板通过刻蚀工艺在第三材料层上形成第三功能膜层，并且剥离第五光刻胶层。
例如，在第四光刻胶层上保留的凸起部分对应的光刻胶与凸起部分顶部的形状相同。
例如，凸起部分的顶部为弧面时，弧面用于反射固化光线。
在第三方面，本公开实施例提供一种显示设备，包含第一方面提供的显示基板。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为Frit部分平面透视结构示意图；
图2为图1中A-A’的截面示意图；
图3为本公开实施例提供的一种显示器件的具体显示基板的平面透视结构示意图；
图4为本公开实施例提供的如图3所示的显示器件的显示基板的B-B’的截面示意图；
图5为本公开实施例提供的如图3所示的显示器件的另一种显示基板的B-B’的截面示意图；
图6为本公开实施例提供的一种显示基板凸起部分顶部示意图；
图7为本公开实施例提供的一种显示基板的制作方法的具体步骤流程图；
图8a、8b、8c、8d、8e、8f、8g、8h、8i、8j、8k、8l、8m、8n、8o和8p为本公开实施例提供的一种显示基板的制作过程中的结构示意图；
图9为本公开实施例提供的一种显示基板的另一种制作方法的具体步骤的流程图；以及
图10a、10b、10c、10d、10e、10f、10g、10h、10i、10j、10k、10l、10m、10n、10o、10p和10q为本公开实施例提供的一种显示基板的另一种制作过程中的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
附图标记：1-玻璃基板；10-显示基板；2-待封装玻璃；20-另一显示基板；3-缓冲层；30-第一功能膜层；4-金属层；40-第二功能膜层； 4010-凸出阵列；4011-平坦部分；4012-第三功能膜层；4013-过孔；4014-凸起部分；4015-第一材料层；4016-第二材料层；4017-第三材料层；5-绝缘层；50-封框胶；6-Frit材料；6011-第一光刻胶层；6012第二光刻胶层；6013-第三光刻胶层；6014-第四光刻胶层；6015-第五光刻胶层；a-凹孔区域；b-非凹孔区域。
图1和图2示出了Frit的示意图。在图1中沿A-A’方向截取得到图2所示的Frit的截面示意图。如图2所示，在玻璃基板1的缓冲层3上设置有凹孔区域a和非凹孔区域b。在非凹孔区域b设置有金属层4和绝缘层5。玻璃基板1与待封装玻璃2通过Frit材料6粘结在一起。虽然在玻璃基板1上的缓冲层3设置有凹孔区域a，在对OLED显示器件的Frit封装技术信赖性测试中，对出现不良(Not Good，NG)的OLED显示器件进行解析时，发现大部分的封装漏气OLED显示器件是由于Frit材料在非凹孔区域b发生了位移脱落断裂。研究后发现，非凹孔区域b的表面与非凹孔区域b和Frit材料6的接触面是平行的，通过Frit材料6的粘结，只是在水平方向上进行了粘接。Frit材料6在未固化前，在外部环境的影响下，在非凹孔区域b该接触面容易发生位移。这导致位于非凹孔区域b表面上的Frit材料6脱落断裂，从而导致OLED显示器件被水氧侵蚀。
在本公开实施例的显示基板中，通过在显示基板上设置有功能膜层，在至少一层功能膜层在远离显示基板一侧包括凸出阵列，并且凸出阵列的凸起嵌入封框胶中。当显示基板与另一个显示基板通过封框胶粘结时，凸出阵列的凸起嵌入封框胶中。这增加了防止功能膜层远离显示基板的一侧和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用。这阻止功能膜层远离显示基板的一侧与封框胶的接触面之间发生位移，降低由于位移造成的封框胶脱落断裂的概率，并且解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，由于在至少一层功能膜层在远离显示基板一侧设置有凸出阵列，并且凸出阵列嵌入封框胶中，这增大功能膜层远离显示基板的一侧与封框胶的接触面积，增加了功能膜层远离显示基板的一侧与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
在一实施例中，提供一种显示基板。如图3、4所示，显示基板10 上设置有功能膜层。至少一层功能膜层在远离显示基板10的一侧包括凸出阵列4010。当显示基板10与另一显示基板20对盒时，凸出阵列4010对应的凸起嵌入显示基板10与另一显示基板20之间的封框胶50。
在图3中沿B-B’方向得到图4所示的显示基板的截面示意图。如图4所示，通过在显示基板上设置有功能膜层，在至少一层功能膜层在远离显示基板一侧包括凸出阵列，并且凸出阵列的凸起嵌入封框胶中。当显示基板与另一显示基板通过封框胶粘结时，由于凸出阵列的凸起嵌入封框胶中，这增加了防止功能膜层远离显示基板的一侧和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用。这阻止功能膜层远离显示基板的一侧与封框胶的接触面之间发生位移，降低由于位移造成的封框胶脱落断裂的概率，并且解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，由于在至少一层功能膜层在远离显示基板一侧设置有凸出阵列，并且凸出阵列嵌入封框胶中，这增大功能膜层远离显示基板的一侧与封框胶的接触面积，增加了功能膜层远离显示基板的一侧与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
在一实施例中，提供一种显示基板。如图3、图4和图6所示，凸出阵列4010由凸出子阵列排列形成。每个凸出子阵列包括平坦部分4011以及设置于平坦部分上的至少一个凸起部分4014。
例如，所述功能膜层包括第一功能膜层30和第二功能膜层40。所述第一功能膜层30的一侧与所述显示基板10接触，并且另一侧与所述第二功能膜层40的一侧接触。所述第二功能膜层40包括所述凸出阵列4010。所述第二功能膜层40在远离所述显示基板10的一侧形成有凸出阵列4010。所述平坦部分4011以及至少一个凸起部分4014位于所述第一功能膜层30上。
例如，所述第一功能膜层30在远离所述显示基板10的一侧设置有所述凸出阵列4010。
例如，所述功能膜层还包括第三功能膜层4012。所述第三功能膜层4012覆盖所述平坦部分4014，并且所述第三功能膜层4012的厚度小于所述凸起部分4014的厚度。所述第三功能膜层4012上设置有至少一个过孔4013，并且所述至少一个凸起部分4014的顶部穿过所述过孔4013。
需要说明的是，凸起部分的顶部可以嵌入封框胶中。
例如，所述第三功能膜层4012包括与所述第一功能膜层30接触的部分。
例如，至少一层所述功能膜层包括凹孔区域a和非凹孔区域b，并且所述凸出阵列4010位于所述非凹孔区域b。
例如，所述凸起部分4014在平行于显示基板的平面内的截面至少为以下一种形状：圆形、三角形、矩形和多边形。所述凸起部分4014的顶部为弧面。
例如，所述平坦部分4011以及至少一个凸起部分4014为金属。需要说明的是，平坦部分以及至少一个凸起部分的制备材料可以为钼。
例如，所述第一功能膜层30为缓冲层，并且所述缓冲层包含SiNx或者SiO2。
例如，所述第二功能膜层40为金属层。
例如，所述第三功能膜层4012为绝缘层，并且所述绝缘层包含SiNx或者SiO2。
需要说明的是，在实际制备过程中，由于直接将第二功能膜层设置在显示基板上时，显示基板对第二功能膜层的固定作用不够。因此，需要在显示基板上首先设置第一功能膜层。由于第一功能膜层与显示基板之间的结合力很强，并且金属层和第一功能膜层之间的结合力也很强，这样就可以很牢固地固定产品，增加产品的稳定性。
如图4所示，凸出阵列由若干个凸出子阵列组成。每个凸出子阵列包括平坦部分以及设置于平坦部分上的至少一个凸起部分。第三功能膜层与第一功能膜层为SiNx或者SiO2中的至少一种。至少一个凸起部分穿过设置在第三功能膜层上的过孔，并且至少一个凸起部分的顶部嵌入封框胶中。平坦部分以及至少一个凸起部分形成的材料为金属。凸起部分在平行于显示基板的平面内的截面根据实际需要，制备成不同形状，如圆形。
如图6所示，凸起部分的顶部为弧面。在激光密封时，凸起部分的弧面的顶部反射激光光线。发射激光光线的装置通常位于第一基板上的上方。位于凸起部分周围的封框胶不仅接收到垂直方向上的激光光线，而且接收到弧面所反射的激光光线。这使得位于凸起部分周围的封框胶在同样的时间内所接收到的激光光线更多，即激光的能量更 多。这进而使得封框胶更好地熔融。
需要说明的是，凸出子阵列至少可以包含一个凸起部分。如图3所示，凹孔区域为阵列排布，并且凸出阵列围绕凹孔区域分布。
在一实施例中，提供一种显示基板。如图3、图5和图6所示，凸出阵列4010由凸出子阵列排列形成，并且每个凸出子阵列包括平坦部分4011以及至少一个凸起部分4014。
例如，所述功能膜层包括第一功能膜层30和第二功能膜层40。所述第一功能膜层30的一侧与所述显示基板10接触，并且另一侧与所述第二功能膜层40的一侧接触。所述第二功能膜层40包括所述凸出阵列4010。所述第二功能膜层40在远离所述显示基板10的一侧形成有凸出阵列4010。所述平坦部分4011以及至少一个凸起部分4014位于所述第一功能膜层30上。
例如，所述第一功能膜层30在远离所述显示基板10的一侧设置有所述凸出阵列4010。
例如，所述功能膜层还包括第三功能膜层4012。所述第三功能膜层4012覆盖所述平坦部分4014，并且所述第三功能膜层4012的厚度小于所述凸起部分4014的厚度。与图4所示实施例不同在于，在图5所示实施例中，第三功能膜层4012适形地覆盖凸出阵列4010，即，覆盖平坦部分4011以及凸起部分4014。
例如，所述第三功能膜层4012包括与所述第一功能膜层30接触的部分。
例如，至少一层所述功能膜层包括凹孔区域a和非凹孔区域b，并且所述凸出阵列4010位于所述非凹孔区域b。
例如，所述凸起部分4014在平行于显示基板的平面内的截面至少为以下一种形状：圆形、三角形、矩形和多边形。所述凸起部分4014的顶部为弧面。
例如，所述平坦部分4011以及至少一个凸起部分4014为金属。需要说明的是，平坦部分以及至少一个凸起部分的制备材料例如为钼。
例如，所述第一功能膜层30为缓冲层，所述缓冲层包含SiNx或者SiO2。
例如，所述第二功能膜层40为金属层。
例如，所述第三功能膜层4012为绝缘层。例如，所述绝缘层包含 SiNx或者SiO2。
需要说明的是，在实际制备过程中，当直接将第二功能膜层设置在显示基板上时，显示基板对第二功能膜层的固定作用不够。因此，需要在显示基板上首先设置第一功能膜层。第一功能膜层与显示基板之间的结合力很强，并且金属层和第一功能膜层之间的结合力也很强，这样就可以很牢固地固定产品，增加产品的稳定性。
如图5所示，凸出阵列由若干个凸出子阵列组成，其中每个凸出子阵列包括平坦部分以及设置于平坦部分上的至少一个凸起部分组成。第三功能膜层与第一功能膜层的材料为SiNx或者SiO2中的至少一种。第三功能膜层设置在第一功能膜层上，并覆盖平坦部分和设置于平坦部分上的凸起部分。平坦部分以及至少一个凸起部分形成的材料为金属。凸起部分的截面根据实际的需要而制备成不同形状。
需要说明的是凸出子阵列至少可以包含一个凸起部分。如图3所示，凹孔区域为阵列排布，并且凸出阵列围绕凹孔区域分布。
在此实施例中，嵌入封框胶中的凸起为凸起部分和覆盖凸起部分的第三功能膜层。第三功能膜层覆盖平坦部分和设置于平坦部分上的凸起部分。在设置于平坦部分上的凸起部分及其上方的第三功能膜层形成了凸出阵列的凸起，并且该凸起嵌入封框胶中。当显示基板与另一显示基板通过封框胶粘结时，该凸起嵌入封框胶中。这增加了防止第三功能膜层的表面与第三功能膜层和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用，并且阻止第三功能膜层与封框胶的接触面之间发生位移。这降低由于位移造成的封框胶脱落断裂的概率，并且解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，在第三功能膜层的一侧设置有凸出阵列，并且凸出阵列的凸起部分和覆盖该凸起部分的第三功能膜层嵌入封框胶中。这使得第三功能膜层表面与封框胶的接触面积增大，增加了第三功能膜层表面与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
在一实施例中，提供一种显示基板制作方法，例如制作步骤：
步骤S101、在显示基板10上形成至少一层功能膜层；
步骤S102、在至少一层功能膜层远离显示基板10的一侧形成凸出阵列4010。当显示基板10与另一显示基板20对盒时，凸出阵列4010 的凸起嵌入显示基板10与另一显示基板20之间的封框胶50。
由上述可知，在制备显示基板时，首先是在显示基板上形成功能膜层，并在功能膜层远离显示基板的一侧形成凸出阵列，在制备完功能膜层以及设置于功能膜层远离显示基板的一侧形成凸出阵列的显示基板上可以涂覆封框胶，然后通过激光密封将显示基板与另一显示基板粘结。封框胶是通过功能膜层远离显示基板的一侧与显示基板粘结。由于在功能膜层远离显示基板的一侧形成凸出阵列的凸起嵌入封框胶中，这样就可以在功能膜层远离显示基板的一侧和封框胶的接触面的垂直方向上产生一个作用力。通常，功能膜层远离显示基板的一侧和封框胶的接触面平行的，产生的作用力也只是在水平方向上，封框胶在固化后，在外界环境的影响下，有可能会在功能膜层远离显示基板的一侧和封框胶的接触面之间发生位移，从而导致封框胶在非凹孔区域的表面发生脱落断裂。本公开通过在第一功能膜层的非凹孔区域制备凸出阵列，使得在封框胶粘结显示基板与另一显示基板时，不仅在水平方向上产生作用力，由于凸出阵列嵌入封框胶中，这就会产生一个防止功能膜层远离显示基板的一侧和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用。这阻止功能膜层远离显示基板的一侧与封框胶的接触面之间发生位移，降低由于位移造成的封框胶脱落断裂的概率，并且解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，由于在功能膜层远离显示基板的一侧形成凸出阵列，并且凸出阵列的凸起嵌入封框胶中，这增大功能膜层远离显示基板的一侧与封框胶的接触面积，增加了功能膜层远离显示基板的一侧与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
如图7和图8a-8p所示，本公开实施例提供一种显示基板，以设置在平坦部分的凸起部分的顶部为弧面为例进行说明，制作方法包括：
步骤S1010、在显示基板上30利用沉积工艺制备第一功能膜层30。
如图8a所示步骤S1010可以采用等离子体增强化学气相沉积法(Plasma Enhanced Chemical Vapor Deposition，PECVD)在显示基板上沉积预定厚度的SiNx与SiO2形成第一功能膜层30。
步骤S1011、在第一功能膜层30上涂覆第一光刻胶层6011，并且进行第一次曝光显影，在第一光刻胶层6011上形成凹孔区域a与非凹 孔区域b的图案。
如图8b所示步骤S1011中，将显示基板20上制备的第一功能膜层30覆盖涂覆形成第一光刻胶层6011，采用单灰阶掩膜板工艺曝光，在第一光刻胶层6011上形成凹孔区域a与非凹孔区域b的图案，通过第一次显影，将形成凹孔区域a的第一光刻胶层6011去除，将形成非凹孔区域b的第一光刻胶层6011保留。
步骤S1012、在第一次曝光显影后的显示基板20上通过刻蚀工艺在第一功能膜层30上形成凹孔区域a与非凹孔区域b，并且剥离第一光刻胶层6011。
如图8c所示步骤S1012中可以通过干法刻蚀(Dry etching)在第一次曝光显影后的显示基板20的第一功能膜层30上形成凹孔区域a与非凹孔区域b。
步骤S1013、在形成第一功能膜层30的显示基板20上通过沉积工艺制备第一材料层4015；
需要说明的是，由于平坦部分以及设置于平坦部分上的凸起部分的制备材料相同且为金属，而平坦部分以及设置于平坦部分上的凸起部分位于第一材料层上，因此这里以第一材料层的制备材料为钼金属进行说明。
如图8d所示步骤S1013可以采用PECVD在第二次曝光显影后的显示基板20上沉积预定厚度的钼金属形成第一材料层4015。
步骤S1014、涂覆覆盖第二功能膜层40的第二光刻胶层6012，并且进行第二次曝光显影，在第二光刻胶层6012上第一功能膜层30的非凹孔区域b对应的位置形成平坦部分4011的图案。
如图8e所示步骤S1014中，将显示基板上20制备的第一材料层4015覆盖涂覆形成第二光刻胶层6012，采用单灰阶掩膜板工艺曝光，在第二光刻胶层6012上形成平坦部分4011的图案，通过第二次显影，将形成平坦部分4011的第二光刻胶层6012保留，将其他区域的第二光刻胶层6012去除。
步骤S1015、在第二次曝光显影后的显示基板20通过刻蚀工艺在第一材料层4015上形成平坦部分4011，并且剥离第二光刻胶层6012。
如图8f所示步骤S1015中，可以通过湿法刻蚀(Wet etching)在第二次曝光显影后的显示基板20的第一材料层4015上形成平坦部分 4011。
步骤S1016、在形成平坦部分4011的显示基板上通过沉积工艺制备第三材料层4017。
如图8g所示步骤S1016可以采用PECVD在显示基板上沉积预定厚度的SiNx与SiO2形成第三材料层4017。
步骤S1017、涂覆覆盖第三材料层4017的第三光刻胶层6013，并且进行第三次曝光显影，在第三光刻胶层6013上平坦部分4011对应的位置形成第三功能膜层4012的图案。
如图8h所示步骤S1017中，将显示基板上20制备的第三材料层4017上覆盖涂覆形成第三光刻胶层6013，采用单灰阶掩膜板工艺曝光，在第三光刻胶层6013上形成第三功能膜层4012的图案，通过第三次显影，将形成第三功能膜层4012的第三光刻胶层6013保留，将其他区域的第三光刻胶层6013去除。
步骤S1018、在第三次曝光显影后的显示基板20通过刻蚀工艺形成第三功能膜层4012，并且剥离第三光刻胶层6013；其中第三功能膜层4012覆盖平坦部分4011。
如图8i所示步骤S1018中，可以通过干法刻蚀在第三次曝光显影后的显示基板20的第三材料层4017上形成第三功能膜层4012。
步骤S1019、涂覆覆盖第三功能膜层4012的第四光刻胶层6014，并且进行第四次曝光显影，在第四光刻胶层6014上形成过孔4013的图案。
如图8j所示步骤S1019中，通过将第三功能膜层4012覆盖涂覆形成第四光刻胶层6014，利用单灰阶掩膜板工艺曝光，将形成过孔4013的第四光刻胶层6014去除，将其他区域的第四光刻胶层6014保留。
步骤S1020、在第四次曝光显影后的显示基板20通过刻蚀工艺在第三功能膜层4012上形成过孔4013。
如图8k所示步骤S1020中，可以通过干法刻蚀在第四次曝光显影后的显示基板20的第三功能膜层4012上形成过孔4013。
步骤S1021、在形成过孔4013的显示基板20上制备第二材料层4016，第二材料层4016通过过孔4013与平坦部分4011连接。
需要说明的是，由于设置于平坦部分的凸起部分不能一次成型制备出来，因此需要制备第二材料层将设置于第三功能膜层的过孔覆盖， 同时平坦层通过过孔与平坦部分连接。因此可以制备出设置于平坦部分上的凸起部分。考虑到金属之间的连接牢靠程度，在制备平坦层时使用的材料例如为钼金属。
如图8l所示步骤S1021中可以采用PECVD在形成过孔4013的显示基板20上沉积预定厚度的钼金属形成第二材料层4016。
步骤S1022、涂覆覆盖第二材料层4016的第五光刻胶层6015，并且进行第五次曝光显影，在第五光刻胶层6015上保留凸起部分4014对应的光刻胶40；其中在第五光刻胶层6015上保留凸起部分4014对应的光刻胶的形状与凸起部分4014顶部的形状相同。
如图8m和图8n所示步骤S1022中，通过将第二材料层4016覆盖涂覆形成第五光刻胶层6015，采用多灰阶掩膜板(Gray-tone mask)曝光，将形成凸起部分的第五光刻胶层6015的光刻胶保留，将其他区域的第五光刻胶层6015去除；这里的多灰阶掩膜板是指，它是制作出曝光机解析度以下的线路掩膜板，再通过掩膜板中的线路部位遮住一部份的光源，以达成半曝光的效果。
步骤S1023、在第五次曝光显影后的显示基板20通过刻蚀工艺在第二材料层4016上形成凸起部分4014，并且剥离第四光刻胶层6014和第五光刻胶层6015，形成包含平坦部分4011和设置于平坦部分4011上的凸起部分4014的第二功能膜层40。
如图8o所示在步骤S1023中，刻蚀工艺可以采用通过蚀刻液对第二材料层进行湿法刻蚀，形成凸起部分4014。
步骤S1030、在上述形成的显示基板20上涂覆封框胶50，对封框胶50进行激光固化，其中弧面用于向封框胶50反射固化光线。
如图8p所示步骤S1030中，当凸起部分4014的顶部为弧面时，这样就可以在激光密封时，通过凸起部分4014顶部的弧面来反射激光光线，使得位于凸起部分周围的封框胶50不仅接收到垂直方向上的激光光线而且还可以接收到弧面所反射的激光光线，从而使得位于凸起部分4014周围的封框胶50在同样的时间内所接收到的激光光线更多，即激光的能量更多，进而使得封框胶50的熔融状态更好，从而通过固化的封框胶50将显示基板10与另一显示基板20粘结。
需要说的是，这里是以凸出子阵列中的凸起部分的顶部为弧面为例进行说明，对其凸起部分的截面形状并不做限定。考虑到实际的制 作流程，在制备平坦部分所使用的材料与栅极的材料相同，平坦层所使用的材料与源极的材料相同。由于平坦层的材料与凸出子阵列的凸起部分的材料相同，所以在制备平坦部分与平坦层时，二者的制备材料可以相同也可以不同。在此对平坦部分与平坦层的材料不做限定。
由上述可知，在制备显示器件的基板时，经过多次工艺才可实现制备出设置于平坦部分上的凸出阵列，而凸出阵列的凸出子阵列中的凸起部分通过第二材料层来制备，并通过设置于第三功能膜层的过孔将凸起部分的底部与平坦部分连接，而凸起部分的顶部高于第三功能膜层。这就使得在激光密封时，封框胶将显示基板与另一显示基板粘结，由于第三功能膜层的厚度小于凸起部分，使得凸出子阵列的凸起部分嵌入封框胶中。当显示基板与另一显示基板通过封框胶粘结时，虽然第三功能膜层的表面和封框胶的接触面是平行的，但是由于凸出阵列的凸起部分嵌入封框胶中。这增加了防止第三功能膜层的表面和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用，能够阻止第三功能膜层的表面与封框胶的接触面之间发生位移，进而能够降低由于位移造成的封框胶脱落断裂的概率，解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，由于在平坦部分上设置有凸出阵列，并通过设置于第三功能膜层栅固定过孔将设置于平坦部分上的凸起部分嵌入封框胶中，使得第三功能膜层的表面与封框胶的接触面积增大，增加了第三功能膜层的表面与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
如图9和图10a-10q所示，本公开实施例提供一种显示基板，以凸出子阵列中的凸起部分的顶部为弧面为例进行说明，制作方法包括：
步骤S2010、在显示基板上30利用沉积工艺制备第一功能膜层30。
如图10a所示步骤S2010可以采用PECVD在显示基板上沉积预定厚度的SiNx与SiO2形成第一功能膜层30。
步骤S2011、在第一功能膜层30上涂覆第一光刻胶层6011，并且进行第一次曝光显影，在第一光刻胶层6011上形成凹孔区域a与非凹孔区域b的图案。
如图10b所示步骤S2011中，将显示基板20上制备的第一功能膜层30覆盖涂覆形成第一光刻胶层6011，采用单灰阶掩膜板工艺曝光，在第一光刻胶层6011上形成凹孔区域a与非凹孔区域b的图案，通过 第一次显影，将形成凹孔区域a的第一光刻胶层6011去除，将形成非凹孔区域b的第一光刻胶层6011保留。
步骤S2012、在第一次曝光显影后的显示基板20上通过刻蚀工艺在第一功能膜层30上形成凹孔区域a与非凹孔区域b，并且剥离第一光刻胶层6011。
如图10c所示步骤S2012中可以通过干法刻蚀在第一次曝光显影后的显示基板20的第一功能膜层30上形成凹孔区域a与非凹孔区域b。
步骤S2013、在形成第一功能膜层30的显示基板10上通过沉积工艺制备第一材料层4015。
需要说明的是，由于平坦部分以及设置于平坦部分上的凸起部分的制备材料相同且为金属，而平坦部分以及设置于平坦部分上的凸起部分位于第一材料层上，因此这里以第一材料层的制备材料为钼金属进行说明。
如图10d所示步骤S2013可以采用PECVD在第二次曝光显影后的显示基板20上沉积预定厚度的钼金属形成第一材料层4015。
步骤S2014、涂覆覆盖第一材料层4015的第二光刻胶层6012，并且进行第二次曝光显影，在第二光刻胶层6012上第一功能膜层30的非凹孔区域b对应的位置形成平坦部分4011的图案。
如图10e所示在步骤S2014中，通过将第一材料层4015上涂覆第二光刻胶层6012，利用单灰阶掩膜板工艺曝光，将形成平坦部分4011的第二光刻胶层6012保留，将其他区域的第二光刻胶层6012去除。
步骤S2015、在第二次曝光显影后的显示基板20通过刻蚀工艺在第一材料层4015上形成平坦部分4011，并且剥离第二光刻胶层6012。
如图10f所示在步骤S2015中，可以采用通过湿法刻蚀对第一材料层4015进行刻蚀，形成平坦部分4011。
步骤S2016、涂覆覆盖平坦部分4011的第三光刻胶层6013，并通过第三次曝光显影，在第三光刻胶层6013上平坦部分4011的凸起部分4014对应的位置形成过孔4013的图案。
如图10g和图10h所示在步骤S2016中，通过将平坦部分4011上涂覆第三光刻胶层6013，利用单灰阶掩膜板工艺曝光，将形成过孔4013的第三光刻胶层6013去除，将其他区域的第三光刻胶层6013保留。
步骤S2017、在第三次曝光显影后的显示基板20上通过沉积工艺 在第三光刻胶层6013上形成第二材料层4016；其中第二材料层4016通过过孔4013与平坦部分4011连接。
需要说明的是，由于设置于平坦部分的凸起部分不能一次成型制备出来，因此需要制备第二材料层将设置于第三光刻胶层的过孔覆盖，同时平坦层通过过孔与平坦部分连接。因此可以制备出设置于平坦部分上的凸起部分。考虑到金属之间的连接牢靠程度，在制备第二材料层时使用的材料例如为钼金属。
如图10i所示步骤S2017可以采用PECVD在第三次曝光显影后的显示基板20上沉积预定厚度的钼金属形成第二材料层4016。
步骤S2018、涂覆覆盖第二材料层4016的第四光刻胶层6014，并且进行第四次曝光显影，在第四光刻胶层6014上保留凸起部分4014对应的光刻胶。
如图10j和图10k所示步骤S2018中，通过将第二材料层4016覆盖涂覆形成第四光刻胶层6014，采用多灰阶掩膜板曝光，将形成凸起部分4014的第四光刻胶层6014的光刻胶保留，将其他区域的第四光刻胶层6014去除；其中在第四光刻胶层6014上保留凸起部分4014对应的光刻胶50与凸起部分4014顶部的形状相同。
步骤S2019、在第四次曝光显影后的显示基板20通过刻蚀工艺在第二材料层4016上形成凸起部分4014，并且剥离第三光刻胶层6013和第四光刻胶层6014；形成包含平坦部分4011和设置于平坦部分4011上的凸起部分4014的第二功能膜层40。
如图10l和图10m所示在步骤S2019中，刻蚀工艺可以采用通过蚀刻液对第二材料层4016进行湿法刻蚀，形成凸起部分4014。
步骤S2020、在第四次曝光显影后的显示基板上通过沉积工艺形成覆盖平坦部分4011与设置于平坦部分4011上的凸起部分4014上的第三材料层4017。
如图10n所示步骤S2020可以采用PECVD在显示基板上沉积预定厚度的SiNx与SiO2形成第三材料层4017。
步骤S2021、涂覆覆盖第三材料层4017的第五光刻胶层6015，并且进行第五次曝光显影，在第五光刻胶层6015上形成第三功能膜层4012的图案。
如图10o所示在步骤S2021中，通过将第三材料层4017上涂覆第 五光刻胶层6015，利用单灰阶掩膜板工艺曝光，将形成第三功能膜层4012图案的第五光刻胶层6015保留，将其他区域的第五光刻胶层6015去除。
步骤S2022、在第五次曝光显影后的显示基板20通过刻蚀工艺在第三材料层4017上形成第三功能膜层4012的图案，并且剥离第五光刻胶层6015。
如图10p所示在步骤S2022中，通过干法刻蚀对第三材料层4017进行刻蚀，形成第三功能膜层4012。
步骤S2030、在上述形成的显示基板20上涂覆封框胶50，对封框胶50进行激光固化，通过固化的封框胶50将显示基板10与另一显示基板20粘结。
如图10q所示步骤S2030中，凸起部分的4014顶部为弧面，对封框胶50进行激光固化时，第三功能膜层4012在覆盖凸起部分4014的位置形成凸出阵列4010的凸起的顶部为弧面，激光通过第三功能膜层4012进入到凸起部分4014的顶部，凸起部分4014的顶部的弧面用于反射激光穿过覆盖凸起部分的第三功能膜层4012后形成封框胶50的固化光线；通过固化的封框胶50将显示基板10与另一显示基板20粘结。
在此实施例中，嵌入封框胶中的凸起为凸起部分和覆盖凸起部分的第三功能膜层。第三功能膜层覆盖平坦部分和设置于平坦部分上的凸起部分。在设置于平坦部分上的凸起部分及其上方的第三功能膜层形成了凸出阵列的凸起，并且该凸起嵌入封框胶中。当显示基板与另一显示基板通过封框胶粘结时，该凸起嵌入封框胶中。这增加了防止第三功能膜层的表面与第三功能膜层和封框胶的接触面发生位移的作用力，即增大了平行方向上的固定作用，并且阻止第三功能膜层与封框胶的接触面之间发生位移。这降低由于位移造成的封框胶脱落断裂的概率，并且解决封框胶脱落断裂造成显示器件被水氧侵蚀的问题。此外，在第三功能膜层的一侧设置有凸出阵列，并且凸出阵列的凸起部分和覆盖该凸起部分的第三功能膜层嵌入封框胶中。这使得第三功能膜层表面与封框胶的接触面积增大，增加了第三功能膜层表面与封框胶之间的粘结牢固程度，进而增加了封框胶在显示基板与另一显示基板中的粘结牢固程度。
在一实施例中，提供一种显示设备，包括上述实施例中提供的任意一种显示基板。
另外，显示装置可以为：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种显示基板，其中所述显示基板上设置有功能膜层，在至少一层所述功能膜层在远离所述显示基板一侧包括凸出阵列，其中所述显示基板与另一显示基板对盒时，所述凸出阵列的凸起嵌入所述显示基板与另一显示基板之间的封框胶。
  2. 根据权利要求1所述的显示基板，其中所述凸出阵列由凸出子阵列排列形成，并且每个所述凸出子阵列包括平坦部分以及设置于平坦部分上的至少一个凸起部分。
  3. 根据权利要求2所述的显示基板，其中所述功能膜层包括第一功能膜层和第二功能膜层；
    所述第一功能膜层的一侧与所述显示基板接触，并且另一侧与所述第二功能膜层的一侧接触；
    所述第二功能膜层包括所述凸出阵列；
    所述第二功能膜层在远离所述显示基板一侧形成有凸出阵列；以及
    所述平坦部分以及所述至少一个凸起部分位于所述第一功能膜层上。
  4. 根据权利要求3所述的显示基板，其中在所述第一功能膜层在远离所述显示基板的一侧设置有所述凸出阵列。
  5. 根据权利要求3所述的显示基板，其中所述功能膜层还包括第三功能膜层；
    所述第三功能膜层覆盖所述平坦部分，并且所述第三功能膜层的厚度小于所述凸起部分的厚度；以及
    所述第三功能膜层上设置有至少一个过孔，并且所述至少一个凸起部分的顶部穿过所述过孔。
  6. 根据权利要求3所述的显示基板，其中所述功能膜层还包括第三功能膜层，并且所述第三功能膜层覆盖所述平坦部分和设置于所述平坦部分上的凸起部分。
  7. 根据权利要求5或6所述的显示基板，其中所述第三功能膜层包括与所述第一功能膜层接触的部分。
  8. 根据权利要求2所述的显示基板，其中至少一层所述功能膜层 包括凹孔区域和非凹孔区域，并且所述凸出阵列位于所述非凹孔区域。
  9. 根据权利要求2所述的显示基板，其中所述凸起部分的顶部为弧面。
  10. 根据权利要求2所述的显示基板，其中所述平坦部分以及所述至少一个凸起部分为金属。
  11. 根据权利要求4所述的显示基板，其中所述第一功能膜层为缓冲层，并且所述缓冲层包含SiNx或者SiO2。
  12. 根据权利要求5所述的显示基板，其中所述第二功能膜层为金属层。
  13. 根据权利要求6或7所述的显示基板，其中所述第三功能膜层为绝缘层，并且所述绝缘层包含SiNx或者SiO2。
  14. 一种显示设备，包含权利要求1-13任一所述的显示基板。
  15. 一种显示基板的制作方法，包括：
    在显示基板上形成至少一层功能膜层；以及
    在至少一层所述功能膜层远离所述显示基板的一侧形成凸出阵列，其中所述显示基板与另一显示基板对盒时，所述凸出阵列的凸起嵌入所述显示基板与另一显示基板之间的封框胶。
  16. 根据权利要求15所述的方法，其中在显示基板上形成至少一层功能膜层包括：
    在所述显示基板上利用沉积工艺形成第一功能膜层；
    在所述第一功能膜层上涂覆第一光刻胶层，并且进行第一次曝光显影，在所述第一光刻胶层上形成凹孔区域与非凹孔区域的图案；以及
    在第一次曝光显影后的显示基板上通过刻蚀工艺在所述第一功能膜层上形成凹孔区域与非凹孔区域，并且剥离所述第一光刻胶层。
  17. 根据权利要求15所述的方法，其中在至少一层所述功能膜层远离所述显示基板的一侧形成凸出阵列包括：
    形成第一功能膜层；
    在形成所述第一功能膜层的所述显示基板上通过沉积工艺制备第一材料层；
    涂覆覆盖所述第一材料层的第二光刻胶层，并且进行第二次曝光显影，在所述第二光刻胶层上所述第一功能膜层的非凹孔区域对应的 位置形成所述平坦部分的图案；
    在第二次曝光显影后的所述显示基板通过刻蚀工艺在所述第一材料层上形成所述平坦部分，并且剥离所述第二光刻胶层；
    在形成所述平坦部分的所述显示基板上通过沉积工艺制备第三材料层；
    涂覆覆盖所述第三材料层的第三光刻胶层，并且进行第三次曝光显影，在所述第三光刻胶层上所述平坦部分对应的位置形成所述第三功能膜层的图案；
    在第三次曝光显影后的所述显示基板通过刻蚀工艺形成所述第三功能膜层，并且剥离所述第三光刻胶层，其中所述第三功能膜层覆盖所述平坦部分；
    涂覆覆盖所述第三功能膜层的第四光刻胶层，并且进行第四次曝光显影，在所述第四光刻胶层上形成过孔的图案；
    在第四次曝光显影后的所述显示基板通过刻蚀工艺在所述第三功能膜层上形成所述过孔；
    在形成过孔的显示基板上制备第二材料层，所述第二材料层通过所述过孔与所述平坦部分连接；
    涂覆覆盖所述第二材料层的第五光刻胶层，并且进行第五次曝光显影，在所述第五光刻胶层上保留所述凸起部分对应的光刻胶；以及
    在第五次曝光显影后的所述显示基板通过刻蚀工艺在所述第二材料层上形成所述凸起部分，并且剥离所述第四光刻胶层和所述第五光刻胶层，形成包含平坦部分和设置于平坦部分上的凸起部分的第二功能膜层。
  18. 根据权利要求17所述的方法，其中在所述第五光刻胶层上保留所述凸起部分对应的光刻胶与所述凸起部分顶部的形状相同。
  19. 根据权利要求15所述的方法，其中在至少一层所述功能膜层远离所述显示基板的一侧形成凸出阵列包括：
    形成第一功能膜层；
    在形成所述第一功能膜层的所述显示基板上通过沉积工艺制备第一材料层；
    涂覆覆盖所述第一材料层的第二光刻胶层，并且进行第二次曝光显影，在所述第二光刻胶层上所述第一功能膜层的非凹孔区域对应的 位置形成所述平坦部分的图案；
    在第二次曝光显影后的所述显示基板通过刻蚀工艺在所述第一材料层上形成所述平坦部分，并且剥离所述第二光刻胶层；
    涂覆覆盖所述平坦部分的第三光刻胶层，并通过第三次曝光显影，在所述第三光刻胶层上所述平坦部分的凸起部分对应的位置形成过孔的图案；
    在第三次曝光显影后的显示基板上通过沉积工艺在所述第三光刻胶层上形成第二材料层，其中所述第二材料层通过所述过孔与所述平坦部分连接；
    涂覆覆盖所述第二材料层的第四光刻胶层，并且进行第四次曝光显影，在所述第四光刻胶层上保留所述凸起部分对应的光刻胶；
    在第四次曝光显影后的所述显示基板通过刻蚀工艺在所述第二材料层上形成所述凸起部分，并且剥离所述第三光刻胶层和所述第四光刻胶层，形成包含平坦部分和设置与平坦部分上的凸起部分的第二功能膜层；
    在第四次曝光显影后的显示基板上通过沉积工艺形成覆盖所述第二功能膜层的第三材料层；
    涂覆覆盖所述第三材料层的第五光刻胶层，并且进行第五次曝光显影，在所述第五光刻胶层上形成所述第三功能膜层的图案；以及
    在第五次曝光显影后的所述显示基板通过刻蚀工艺在所述第三材料层上形成所述第三功能膜层，并且剥离所述第五光刻胶层。
  20. 根据权利要求19所述的方法，其中在所述第四光刻胶层上保留的所述凸起部分对应的光刻胶与所述凸起部分顶部的形状相同。
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