WO2018040528A1 - 一种mems麦克风中的振膜及mems麦克风 - Google Patents

一种mems麦克风中的振膜及mems麦克风 Download PDF

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Publication number
WO2018040528A1
WO2018040528A1 PCT/CN2017/075590 CN2017075590W WO2018040528A1 WO 2018040528 A1 WO2018040528 A1 WO 2018040528A1 CN 2017075590 W CN2017075590 W CN 2017075590W WO 2018040528 A1 WO2018040528 A1 WO 2018040528A1
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WIPO (PCT)
Prior art keywords
slit
diaphragm
diaphragm body
neck
pressure relief
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Ceased
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PCT/CN2017/075590
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English (en)
French (fr)
Inventor
詹竣凯
蔡孟锦
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Goertek Inc
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Goertek Inc
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Publication date
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Priority to US16/329,193 priority Critical patent/US11381917B2/en
Publication of WO2018040528A1 publication Critical patent/WO2018040528A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones

Definitions

  • the present invention relates to a diaphragm for sounding, and more particularly to a diaphragm in a MEMS microphone; the present invention also relates to a MEMS microphone.
  • MEMS Micro Electro Mechanical Systems
  • the diaphragm and back plate are important components in MEMS microphones.
  • the diaphragm and back plate form capacitors and are integrated on silicon wafers to realize acoustic electricity. Conversion.
  • the traditional diaphragm is made by forming an oxide layer on a silicon substrate, and then depositing a layer of a diaphragm on the oxide layer. After doping and tempering, the desired pattern is etched, and the diaphragm is etched. It is fixed to the substrate by rivet points at its edges. Of course, it is also necessary to extract the electrode from the diaphragm, and change the distance between the diaphragm and the back plate by the vibration of the diaphragm, thereby converting the sound signal into an electrical signal.
  • the MEMS microphone When the MEMS microphone is subjected to mechanical shock, blowing, or falling, the MEMS chip is subjected to a large sound pressure shock, which often causes the diaphragm to be subjected to excessive pressure and damage, thereby causing the entire microphone to fail.
  • a diaphragm in a MEMS microphone comprising a diaphragm body and at least one pressure relief device constrained by the slit on the diaphragm body, the gap comprising at least one of them sequentially received together a two-stage arc-shaped slit, wherein the adjacent two arcuate slits are generally S-shaped and are centrally symmetrical with respect to a position at which they are connected, and the pressure relief device comprises at least two adjacent arcuate slits. At least two flaps, and a neck that connects the flap to the diaphragm body and is in a restrained shape.
  • the sides of the neck are symmetrical along their axes.
  • the arc-shaped slit is provided with two segments, which are respectively recorded as a first slot and a second slot, and the first slot and the second slot jointly form a first flap on the diaphragm body,
  • the second valve flap and the first neck connecting the first valve flap and the diaphragm body are connected to the second valve flap and the second neck portion of the diaphragm body.
  • a first opening is formed between the position where the first slit and the second slit are connected and the free end of the first slit, and the first neck is formed at the first opening position;
  • a tightened second opening is formed between the position where the first slit and the second slit are joined and the free end of the second slit; the second neck is formed at the second opening position.
  • the arc-shaped slit is provided with three segments, which are respectively recorded as a first slot, a second slot, and a third slot that are sequentially received together, and the first slot, the second slot, and the third slot are jointly a first valve flap, a second valve flap, a third valve flap, and a first neck connecting the first valve flap and the diaphragm body, and a second valve connecting the second valve flap and the diaphragm body are formed on the diaphragm body a third valve connecting the third valve flap and the diaphragm body.
  • a first opening is formed between the position where the first slit and the second slit are connected and the free end of the first slit, and the first neck is formed at the first opening position;
  • a tightened third opening is formed between the position where the second slit and the third slit are joined and the free end of the third slit; the third neck is formed at the third opening position.
  • the pressure relief device is provided with one, distributed in a central area of the diaphragm body.
  • the pressure relief device is provided in plurality, and the plurality of pressure relief devices are evenly distributed in the circumferential direction of the diaphragm body.
  • a MEMS microphone comprising the above diaphragm.
  • the slit is formed by etching when depositing the diaphragm body.
  • the diaphragm of the diaphragm In the initial state, the diaphragm of the diaphragm is flush with the diaphragm body as a whole, that is, the valve flap is in a closed state; when subjected to a large sound pressure caused by, for example, mechanical shock, blowing, or falling, At least two flaps of symmetrical structure can be tilted up or down with their respective necks as fulcrums.
  • an effective pressure relief path is formed to achieve the purpose of pressure relief; from one perspective, the diaphragm can withstand the instantaneous air pressure generated by a large sound pressure or drop process, thereby avoiding chip damage.
  • the use of at least two dams of symmetry makes the size of the valve flap not too large to meet the requirements, thereby ensuring the performance requirements of the diaphragm itself.
  • the inventors of the present invention have found that in the prior art, when a MEMS microphone is subjected to mechanical shock, blowing, or dropping, the MEMS chip therein is subjected to a large sound pressure shock, which often causes excessive pressure on the diaphragm. This causes damage to the rupture, which causes the entire microphone to fail. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • Figure 1 is a schematic view showing the structure of a diaphragm of the present invention.
  • Figure 2 is a schematic view showing the structure of the slit of Figure 1.
  • Figure 3 is a schematic view of the valve flap of Figure 1 in an open state.
  • Figure 4 is a schematic illustration of a second embodiment of the slit of the present invention.
  • Figure 5 is a schematic illustration of a third embodiment of the slit of the present invention.
  • Figure 6 is a schematic illustration of another embodiment of a diaphragm of the present invention.
  • the present invention provides a diaphragm in a MEMS microphone comprising a diaphragm body 1 and at least one pressure relief device 2 defined by a slit a on the diaphragm body 1, in the diaphragm body
  • the slit a is provided in a predetermined shape, and the pressure releasing device 2 is formed on the diaphragm body 1 through the slit a.
  • the slit a comprises at least two arc-shaped slits which are sequentially received together, and the arc-shaped slits are sequentially received together, wherein the adjacent two arcuate slits are generally S-shaped and connected with respect to the same
  • the position is center-symmetrical.
  • the pressure relief device 2 includes at least two valve flaps surrounded by at least two adjacent arcuate slits, and a neck portion connecting the valve flap and the diaphragm body 1 in a restrained shape. The neck is constrained relative to the valve flap such that the valve flap can be lifted up or down with the neck as a fulcrum to form a passage for air.
  • the diaphragm of the diaphragm In the initial state, the diaphragm of the diaphragm is flush with the diaphragm body as a whole, that is, the valve flap is in a closed state; when subjected to a large sound pressure caused by, for example, mechanical shock, blowing, or falling, At least two valve lobes of structural symmetry can be lifted up or down with their respective necks as fulcrums, thereby forming an effective pressure relief path for pressure relief purposes; from one perspective, the diaphragm can withstand The instantaneous air pressure generated by the loud pressure or drop process avoids damage to the chip.
  • the use of at least two dams of symmetry makes the size of the valve flap not too large to meet the requirements, thereby ensuring the performance requirements of the diaphragm itself.
  • the pressure relief device 2 of the present invention may be provided with one, and the pressure relief device 2 may be distributed in a central region of the diaphragm body 1, see Fig. 1.
  • the pressure relief device 2 may be provided in plurality, and the plurality of pressure relief devices 2 are evenly distributed in the circumferential direction of the diaphragm body 1, see FIG.
  • the arcuate slit of the present invention may be provided with two, three or more.
  • the arcuate slit is provided with two segments, which are respectively recorded as the first slit 5 and the second. Slot 6.
  • the first slit 5 and the second slit 6 respectively have a non-closed arc shape, and the two slits have the same size and shape.
  • the S-shape is integrally formed and connected with respect to the same.
  • the position is center-symmetrical.
  • the first slit 5 and the second slit 6 of the present invention can be simultaneously formed.
  • the first slit 5 and the second slit 6 of the present invention can be formed by etching the diaphragm body 1.
  • first slit 5 and the second slit 6 are disposed on the diaphragm body 1, the first slit 5 and the second slit 6 jointly form a first flap 3 and a second flap on the diaphragm body 1. 4, and connecting the first valve flap 3 with the first neck portion 7 of the diaphragm body 1, connecting the second valve flap 4 with the second neck portion 8 of the diaphragm body 1, see Fig. 2.
  • the shape of the first slit 5 is curved such that it forms a first valve flap 3 on the diaphragm body 1, the position where the first slit 5 and the second slit 6 are connected and the free end of the first slit 5 A tightened first opening is formed between the heads 9, and the first neck portion 7 is formed at the first opening position.
  • the shape of the connection position of the first slit 5 and the second slit 6 is symmetrically distributed with the shape of the free end 9 of the first slit 5 along an axis therebetween, so that the first neck portion 7
  • the side edges are symmetrical along the axis of the first neck 7.
  • the shape of the second slit 6 is curved such that it forms a second flap 4 on the diaphragm body 1, the position where the first slit 5 and the second slit 6 are connected and the position of the second slit 6 A tight second opening is formed between the free ends 10, and the second neck 8 is formed at the second opening position.
  • the shape of the connection position of the first slit 5 and the second slit 6 and the shape of the free end 10 of the second slit 6 are symmetrically distributed along an axis therebetween, so that the second neck portion 8 The side edges are symmetrical along the axis of the second neck 8.
  • the first valve flap 3 and the second valve flap 4 can be tilted upward or downward with the first neck portion 7 and the second neck portion 8 as fulcrums, respectively. Acting, thereby opening the pressure relief passage of gas through the diaphragm body 1, see Figure 3.
  • the first neck portion 7 and the second neck portion 8 adopt a symmetrical structure, so that when the first valve flap and the second valve flap are opened under a large pressure, warpage deformation due to stress of the diaphragm itself can be avoided. The problem is that the flatness of the diaphragm body 1 can be maintained.
  • the arcuate slit is provided with three segments, which are respectively recorded as the first slit 5, the second slit 6, and the third slit 5a which are sequentially taken together.
  • the first slit 5, the second slit 6, and the third slit 5a jointly form a first flap, a second flap, and a third flap on the diaphragm body 1 in accordance with a similar principle. Connecting the first valve flap and the first neck portion of the diaphragm body, connecting the second valve flap and the second neck portion of the diaphragm body, and connecting the third valve flap and the third neck portion of the diaphragm body.
  • the first slit 5, the second slit 6, and the third slit 5a are respectively in a non-closed arc shape, and the three slits have the same size and shape, so that the three slits are sequentially connected together, and the adjacent two slits are adjacent.
  • the overall shape is S-shaped, and the adjacent two slits are centrally symmetrical with respect to the position at which they are connected.
  • the first slit 5, the second slit 6, and the third slit 5a of the present invention can be simultaneously formed.
  • the first slit 5, the second slit 6, and the third slit of the present invention can be formed by etching the diaphragm body 1. 5a.
  • the shape of the first slit 5 is curved such that it forms a first valve flap on the diaphragm body 1, and a position where the first slit 5 and the second slit 6 are connected and a free end of the first slit 5 are formed.
  • a tightened first opening is formed in the first opening position.
  • the shape of the connection position of the first slit 5 and the second slit 6 is symmetrically distributed with the shape of the free end of the first slit 5 along the axis between the two sides, so that both sides of the first neck The edges are symmetrical along their axis.
  • the second slit 6 is curved in such a shape that a second valve flap is formed on the diaphragm body 1, and the first slit 5 and the second slit 6 are connected to the second slit 6 and the third slit 5a.
  • a tightened second opening is formed between the connected positions, and the second neck is formed at the second opening position.
  • the shape of the connection position of the first slit 5 and the second slit 6 is symmetrical with the shape of the connection position of the second slit 6 and the third slit 5a along the axis of the two, so that the second neck portion
  • the two side edges are symmetrical along the axis of the second neck.
  • the third slit 5a is curved in such a shape that a third valve flap is formed on the diaphragm body 1, and a position where the second slit 6 and the third slit 5a are connected and a free end of the third slit 5a are formed.
  • a tightened third opening is formed in the third opening position.
  • the shape of the connection position of the second slit 6 and the third slit 5a is symmetrically distributed with the shape of the free end of the third slit 5a along an axis therebetween such that both side edges of the third neck are along the axis thereof symmetry.
  • the arcuate slit is provided with four segments, which are respectively referred to as a first slit 5, a second slit 6, a third slit 5a, and a fourth slit 6a which are sequentially received together, with reference to FIG. 5.
  • the four segments jointly form a first valve flap, a second valve flap, a third valve flap, and a fourth valve flap on the diaphragm body 1, and respectively connect the first valve flap, the second valve flap, and the third valve flap.
  • This embodiment is similar to the structure of Embodiment 3 and will not be specifically described herein.
  • the diaphragm of the present invention can be applied in a MEMS microphone to improve the sound pressure resistance of the MEMS microphone.
  • the present invention also provides a MEMS microphone comprising a substrate, a back pole, and a plate capacitor formed with the back pole.
  • the diaphragm of the above structure This configuration of the back electrode and the diaphragm is well known to those skilled in the art.
  • the back electrode and the diaphragm are formed by deposition and etching.
  • the slit described above may be formed by etching when depositing a diaphragm.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种MEMS麦克风中的振膜及MEMS麦克风，包括振膜本体（1）以及在振膜本体（1）上由缝隙（a）限制成的至少一个泄压装置（2），所述缝隙（a）包括依次承接在一起的至少两段圆弧状缝隙，其中，相邻两段圆弧状缝隙整体呈S形，且相对于其连接的位置呈中心对称，所述泄压装置（2）包括由至少两段相邻的圆弧状缝隙形成的至少两个阀瓣，以及连接阀瓣与振膜本体（1）且呈束缚状的颈部。当受到例如机械冲击、吹气、跌落所带来的较大声压时，结构对称的至少两个阀瓣可以以各自的颈部为支点向上或向下翘起，从而形成了有效的泄压路径，以达到泄压的目的。

Description

一种MEMS麦克风中的振膜及MEMS麦克风 技术领域
本发明涉及一种用于发声的振膜，更准确地说，涉及一种MEMS麦克风中的振膜；本发明还涉及一种MEMS麦克风。
背景技术
MEMS(微型机电系统)麦克风是基于MEMS技术制造的麦克风，其中的振膜、背极板是MEMS麦克风中的重要部件，振膜、背极板构成了电容器并集成在硅晶片上，实现声电的转换。传统的振膜的制作工艺是在硅基底上做一层氧化层，然后在氧化层上利用沉积的方式制作一层振膜，经过掺杂、回火后，蚀刻出所所需的图形，振膜通过其边缘的铆钉点固定在基底上。当然，还需要从振膜上引出电极，通过振膜的振动，改变振膜与背极板之间的距离，从而将声音信号转换为电信号。
当MEMS麦克风受到机械冲击、吹气、跌落时，其中的MEMS芯片会受到较大的声压冲击，这往往会使振膜受到过大的压力而导致破裂受损，从而导致整个麦克风的失效。
发明内容
本发明的一个目的是提供一种MEMS麦克风中的振膜的新技术方案。
根据本发明的第一方面，提供了一种MEMS麦克风中的振膜，包括振膜本体以及在振膜本体上由缝隙限制成的至少一个泄压装置，所述缝隙包括依次承接在一起的至少两段圆弧状缝隙，其中，相邻两段圆弧状缝隙整体呈S形，且相对于其连接的位置呈中心对称，所述泄压装置包括由至少两段相邻的圆弧状缝隙形成的至少两个阀瓣，以及连接阀瓣与振膜本体且呈束缚状的颈部。
可选的是，所述颈部的两侧沿其轴线对称。
可选的是，所述圆弧状缝隙设置有两段，分别记为第一缝隙、第二缝隙，所述第一缝隙、第二缝隙共同在振膜本体上形成了第一阀瓣、第二阀瓣，以及连接第一阀瓣与振膜本体的第一颈部，连接第二阀瓣与振膜本体的第二颈部。
可选的是，所述第一缝隙和第二缝隙连接的位置与第一缝隙的自由端头之间形成了束紧的第一开口，所述第一颈部形成在该第一开口位置；
所述第一缝隙和第二缝隙连接的位置与第二缝隙的自由端头之间形成了束紧的第二开口；所述第二颈部形成在该第二开口位置。
可选的是，所述圆弧状缝隙设置有三段，分别记为依次承接在一起的第一缝隙、第二缝隙、第三缝隙，所述第一缝隙、第二缝隙、第三缝隙共同在振膜本体上形成了第一阀瓣、第二阀瓣、第三阀瓣，以及连接第一阀瓣与振膜本体的第一颈部，连接第二阀瓣与振膜本体的第二颈部，连接第三阀瓣与振膜本体的第三颈部。
可选的是，所述第一缝隙和第二缝隙连接的位置与第一缝隙的自由端头之间形成了束紧的第一开口，所述第一颈部形成在该第一开口位置；
所述第一缝隙和第二缝隙连接的位置与所述第二缝隙和第三缝隙连接的位置之间形成了束紧的第二开口，所述第二颈部形成在该第二开口位置；
所述第二缝隙和第三缝隙连接的位置与第三缝隙的自由端头之间形成了束紧的第三开口；所述第三颈部形成在该第三开口位置。
可选的是，所述泄压装置设置有一个，分布在振膜本体的中心区域。
可选的是，所述泄压装置设置有多个，该多个泄压装置均匀分布在振膜本体的圆周方向上。
根据本发明的另一发明，还提供了一种MEMS麦克风，包括上述的振膜。
可选的是，所述缝隙在沉积形成振膜本体时，通过刻蚀的方式形成。
本发明的振膜，初始状态时，阀瓣与振膜本体整体是齐平的，也就是说阀瓣处于关闭状态；当受到例如机械冲击、吹气、跌落所带来的较大声压时，结构对称的至少两个阀瓣可以以各自的颈部为支点向上或向下翘起， 从而形成了有效的泄压路径，以达到泄压的目的；从一个角度而言，使得振膜可以承受大声压或跌落过程所产生的瞬间气压，避免了芯片的受损。采用对称的至少两个阀瓣，使得阀瓣的尺寸不需要太大即可符合要求，从而可保证振膜本身的性能需求。
本发明的发明人发现，在现有技术中，当MEMS麦克风受到机械冲击、吹气、跌落时，其中的MEMS芯片会受到较大的声压冲击，这往往会使振膜受到过大的压力而导致破裂受损，从而导致整个麦克风的失效。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明振膜的结构示意图。
图2是图1中缝隙的结构示意图。
图3是图1中阀瓣在打开状态时的示意图。
图4是本发明缝隙第二种实施方式的示意图。
图5是本发明缝隙第三种实施方式的示意图。
图6是本发明振膜另一种实施方式的示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但 在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1、图2，本发明提供了一种MEMS麦克风中的振膜，其包括振膜本体1以及在振膜本体1上由缝隙a限制成的至少一个泄压装置2，在振膜本体1上按照预定的形状设置缝隙a，并通过所述缝隙a在振膜本体1上形成了所述的泄压装置2。
其中，所述缝隙a包括依次承接在一起的至少两段圆弧状缝隙，这些圆弧状缝隙依次承接在一起，其中相邻的两段圆弧状缝隙整体呈S形，且相对于其连接的位置呈中心对称。所述泄压装置2包括由至少两段相邻的圆弧状缝隙围成的至少两个阀瓣，以及连接阀瓣与振膜本体1且呈束缚状的颈部。所述颈部相对于阀瓣呈束缚状，使得阀瓣可以以该颈部为支点向上或者向下翘起，以便形成空气的通路。
本发明的振膜，初始状态时，阀瓣与振膜本体整体是齐平的，也就是说阀瓣处于关闭状态；当受到例如机械冲击、吹气、跌落所带来的较大声压时，结构对称的至少两个阀瓣可以以各自的颈部为支点向上或向下翘起，从而形成了有效的泄压路径，以达到泄压的目的；从一个角度而言，使得振膜可以承受大声压或跌落过程所产生的瞬间气压，避免了芯片的受损。采用对称的至少两个阀瓣，使得阀瓣的尺寸不需要太大即可符合要求，从而可保证振膜本身的性能需求。
本发明的泄压装置2可以设置有一个，该泄压装置2可以分布在振膜本体1的中心区域，参考图1。所述泄压装置2也可以设置有多个，该多个泄压装置2均匀分布在振膜本体1的圆周方向上，参考图6。
实施例1
本发明的圆弧状缝隙可以设置有两个、三个或者更多个，在本发明一个具体的实施方式，所述圆弧状缝隙设置有两段，分别记为第一缝隙5、第二缝隙6。参考图2，所述第一缝隙5、第二缝隙6分别呈非封闭的圆弧状，该两个缝隙的尺寸和形状一致，二者连接在一起后整体呈S形，且相对于其连接的位置呈中心对称。本发明的第一缝隙5、第二缝隙6可同时形成，例如可通过对振膜本体1进行刻蚀方式形成本发明的第一缝隙5、第二缝隙6。
由于在振膜本体1上设置了第一缝隙5、第二缝隙6，使得所述第一缝隙5、第二缝隙6共同在振膜本体1上形成了第一阀瓣3、第二阀瓣4，以及连接第一阀瓣3与振膜本体1的第一颈部7，连接第二阀瓣4与振膜本体1的第二颈部8，参考图2。具体地，所述第一缝隙5弯曲的形状使得其在振膜本体1上形成了第一阀瓣3，所述第一缝隙5和第二缝隙6连接的位置与第一缝隙5的自由端头9之间形成了束紧的第一开口，所述第一颈部7形成在该第一开口位置。优选的是，所述第一缝隙5和第二缝隙6连接位置的形状与第一缝隙5自由端头9的形状沿着二者之间的轴线对称分布，使得所述第一颈部7的两侧边缘沿这第一颈部7的轴线对称。
基于相同的道理，所述第二缝隙6弯曲的形状使得其在振膜本体1上形成了第二阀瓣4，所述第一缝隙5和第二缝隙6连接的位置与第二缝隙6的自由端头10之间形成了束紧的第二开口，所述第二颈部8形成在该第二开口位置。优选的是，所述第一缝隙5和第二缝隙6连接位置的形状与第二缝隙6自由端头10的形状沿着二者之间的轴线对称分布，使得所述第二颈部8的两侧边缘沿着第二颈部8的轴线对称。
当振膜本体1受到较大的气压冲击时，所述第一阀瓣3、第二阀瓣4可以分别以第一颈部7、第二颈部8为支点发生向上或者向下翘起的动作，从而打开了气体穿过振膜本体1的泄压通道，参考图3。所述第一颈部7、第二颈部8采用对称的结构，使得第一阀瓣、第二阀瓣在受到较大压力而开启时，可以避免由于振膜本身应力而产生的翘曲变形问题，从而可以保持振膜本体1的平整度。
实施例2
在该实施例中，为了加大泄压装置2的泄压量，所述圆弧状缝隙设置有三段，分别记为依次承接在一起的第一缝隙5、第二缝隙6、第三缝隙5a，参考图4。与实施例1基于类似的原理，所述第一缝隙5、第二缝隙6、第三缝隙5a共同在振膜本体1上形成了第一阀瓣、第二阀瓣、第三阀瓣，以及连接第一阀瓣与振膜本体的第一颈部，连接第二阀瓣与振膜本体的第二颈部，连接第三阀瓣与振膜本体的第三颈部。
所述第一缝隙5、第二缝隙6、第三缝隙5a分别呈非封闭的圆弧状，该三个缝隙的尺寸和形状一致，使得三个缝隙依次连接在一起后，相邻两个缝隙整体呈S形，且相邻两个缝隙相对于它们连接的位置呈中心对称。本发明的第一缝隙5、第二缝隙6、第三缝隙5a可同时形成，例如可通过对振膜本体1进行刻蚀方式形成本发明的第一缝隙5、第二缝隙6、第三缝隙5a。
所述第一缝隙5弯曲的形状使得其在振膜本体1上形成了第一阀瓣，所述第一缝隙5和第二缝隙6连接的位置与第一缝隙5的自由端头之间形成了束紧的第一开口，所述第一颈部形成在该第一开口位置。优选的是，所述第一缝隙5和第二缝隙6连接位置的形状与第一缝隙5自由端头的形状沿着二者之间的轴线对称分布，使得所述第一颈部的两侧边缘沿其轴线对称。
所述第二缝隙6弯曲的形状使得其在振膜本体1上形成了第二阀瓣，所述第一缝隙5和第二缝隙6连接的位置与所述第二缝隙6和第三缝隙5a连接的位置之间形成了束紧的第二开口，所述第二颈部形成在该第二开口位置。优选的是，所述第一缝隙5和第二缝隙6连接位置的形状，与第二缝隙6和第三缝隙5a连接位置的形状沿着二者的轴线对称，使得所述第二颈部的两侧边缘沿第二颈部的轴线对称。
所述第三缝隙5a弯曲的形状使得其在振膜本体1上形成了第三阀瓣，所述第二缝隙6和第三缝隙5a连接的位置与第三缝隙5a的自由端头之间形成了束紧的第三开口，所述第三颈部形成在该第三开口位置。优选的是， 所述第二缝隙6和第三缝隙5a连接位置的形状与第三缝隙5a自由端头的形状沿着二者之间的轴线对称分布，使得所述第三颈部的两侧边缘沿其轴线对称。
实施例3
在该实施例中，所述圆弧状缝隙设置有四段，分别记为依次承接在一起的第一缝隙5、第二缝隙6、第三缝隙5a、第四缝隙6a，参考图5。这四段缝隙共同在振膜本体1上形成了第一阀瓣、第二阀瓣、第三阀瓣、第四阀瓣，以及分别连接第一阀瓣、第二阀瓣、第三阀瓣、第四阀瓣与振膜本体1的第一颈部、第二颈部、第三颈部、第四颈部。该实施例与实施例3的结构类似，在此不再具体说明。
本发明的振膜可以应用MEMS麦克风中，从而提高MEMS麦克风的抗声压能力，为此，本发明还提供了一种MEMS麦克风，其包括衬底、背极，以及与背极构成平板式电容结构的上述的振膜。背极与振膜的这种结构方式属于本领域技术人员的公知常识。在制作MEMS麦克风的时候，背极、振膜均是通过沉积、刻蚀的方式形成。上述的缝隙可以在沉积形成振膜时，通过刻蚀的方式形成。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种MEMS麦克风中的振膜，其特征在于：包括振膜本体(1)以及在振膜本体(1)上由缝隙(a)限制成的至少一个泄压装置(2)，所述缝隙(a)包括依次承接在一起的至少两段圆弧状缝隙，其中，相邻两段圆弧状缝隙整体呈S形，且相对于其连接的位置呈中心对称，所述泄压装置(2)包括由至少两段相邻的圆弧状缝隙形成的至少两个阀瓣，以及连接阀瓣与振膜本体(1)且呈束缚状的颈部。
  2. 根据权利要求1所述的振膜，其特征在于：所述颈部的两侧沿其轴线对称。
  3. 根据权利要求1所述的振膜，其特征在于：所述圆弧状缝隙设置有两段，分别记为第一缝隙(5)、第二缝隙(6)，所述第一缝隙(5)、第二缝隙(6)共同在振膜本体(1)上形成了第一阀瓣(3)、第二阀瓣(4)，以及连接第一阀瓣(3)与振膜本体(1)的第一颈部(7)，连接第二阀瓣(4)与振膜本体(1)的第二颈部(8)。
  4. 根据权利要求3所述的振膜，其特征在于：所述第一缝隙(5)和第二缝隙(6)连接的位置与第一缝隙(5)的自由端头(9)之间形成了束紧的第一开口，所述第一颈部(7)形成在该第一开口位置；
    所述第一缝隙(5)和第二缝隙(6)连接的位置与第二缝隙(6)的自由端头(10)之间形成了束紧的第二开口；所述第二颈部(8)形成在该第二开口位置。
  5. 根据权利要求1所述的振膜，其特征在于：所述圆弧状缝隙设置有三段，分别记为依次承接在一起的第一缝隙(5)、第二缝隙(6)、第三缝隙(5a)，所述第一缝隙(5)、第二缝隙(6)、第三缝隙(5a)共同在振膜本体(1)上形成了第一阀瓣、第二阀瓣、第三阀瓣，以及连接第一阀瓣与振膜本体(1)的第一颈部，连接第二阀瓣与振膜本体(1)的第二颈部，连接第三阀瓣与振膜本体(1)的第三颈部。
  6. 根据权利要求5所述的振膜，其特征在于：所述第一缝隙(5)和第二缝隙(6)连接的位置与第一缝隙(5)的自由端头之间形成了束紧的 第一开口，所述第一颈部形成在该第一开口位置；
    所述第一缝隙(5)和第二缝隙(6)连接的位置与所述第二缝隙(6)和第三缝隙(5a)连接的位置之间形成了束紧的第二开口，所述第二颈部形成在该第二开口位置；
    所述第二缝隙(6)和第三缝隙(5a)连接的位置与第三缝隙(5a)的自由端头之间形成了束紧的第三开口；所述第三颈部形成在该第三开口位置。
  7. 根据权利要求1至6任一项所述的振膜，其特征在于：所述泄压装置(2)设置有一个，分布在振膜本体(1)的中心区域。
  8. 根据权利要求1至6任一项所述的振膜，其特征在于：所述泄压装置(2)设置有多个，该多个泄压装置(2)均匀分布在振膜本体(1)的圆周方向上。
  9. 一种MEMS麦克风，其特征在于：包括如权利要求1-8任一项所述的振膜。
  10. 根据权利要求9所述的MEMS麦克风，其特征在于：所述缝隙(a)在沉积形成振膜本体(1)时，通过刻蚀的方式形成。
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CN106375912A (zh) 2017-02-01

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