WO2018036038A1 - 一种轮胎植入式电子标签及组装工艺 - Google Patents

一种轮胎植入式电子标签及组装工艺 Download PDF

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Publication number
WO2018036038A1
WO2018036038A1 PCT/CN2016/110800 CN2016110800W WO2018036038A1 WO 2018036038 A1 WO2018036038 A1 WO 2018036038A1 CN 2016110800 W CN2016110800 W CN 2016110800W WO 2018036038 A1 WO2018036038 A1 WO 2018036038A1
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WO
WIPO (PCT)
Prior art keywords
electronic tag
tire
antenna
chip module
electrode
Prior art date
Application number
PCT/CN2016/110800
Other languages
English (en)
French (fr)
Inventor
杨辉峰
洪斌
Original Assignee
上海仪电智能电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海仪电智能电子有限公司 filed Critical 上海仪电智能电子有限公司
Priority to KR1020197008009A priority Critical patent/KR20190057293A/ko
Priority to EP16914058.9A priority patent/EP3506171A4/en
Priority to JP2019531503A priority patent/JP2019533260A/ja
Priority to US16/327,750 priority patent/US20190205722A1/en
Priority to BR112019003856A priority patent/BR112019003856A2/pt
Priority to CA3034961A priority patent/CA3034961A1/en
Publication of WO2018036038A1 publication Critical patent/WO2018036038A1/zh

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07786Antenna details the antenna being of the HF type, such as a dipole
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60CVEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02Signalling devices actuated by tyre pressure
    • B60C23/04Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0491Constructional details of means for attaching the control device
    • B60C23/0493Constructional details of means for attaching the control device for attachment on the tyre
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07775Antenna details the antenna being on-chip
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2241Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in or for vehicle tyres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D30/00Producing pneumatic or solid tyres or parts thereof
    • B29D30/0061Accessories, details or auxiliary operations not otherwise provided for
    • B29D2030/0077Directly attaching monitoring devices to tyres before or after vulcanization, e.g. microchips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D30/00Producing pneumatic or solid tyres or parts thereof
    • B29D30/0061Accessories, details or auxiliary operations not otherwise provided for
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07764Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier attachable to a tire

Definitions

  • the present invention relates to electronic tags, and in particular to radio frequency identification (RFID) electronic tags for tires.
  • RFID radio frequency identification
  • radio frequency identification RFID
  • a patch-type electronic tag has appeared on the market, which is composed of an IC chip electrically connected to an aluminum film antenna, and the thickness thereof is very thin, and is conveniently packaged in, for example, silicone.
  • the shortcomings of the patch-type electronic label are also very obvious.
  • the tires of the car are constantly rolling to generate a large amount of static electricity, and the anti-static performance of such electronic labels is not good.
  • RFID radio frequency identification
  • This type of tire electronic tag is mainly composed of a radio frequency chip and a spring antenna, and a soldering method is generally adopted between the spring antenna and the radio frequency chip.
  • the melting point of tin is low
  • the conversion temperature of conventional solder is 150-180 degrees Celsius
  • the conversion temperature of high-temperature solder is 180-200 degrees Celsius
  • the electronic tag is implanted in the tire, which needs to withstand a high temperature of at least 200 degrees Celsius and keep it for several tens of minutes.
  • RFID Tire radio frequency identification
  • the surface of the antenna is usually provided with a gold plating layer, which is suitable for soldering.
  • the combination of the gold plating layer and the rubber is not optimal, and it is easy to cause rubber delamination, which may cause serious safety hazards of the tire.
  • an object of the present invention is to provide a highly reliable tire-embedded electronic tag; and at the same time, a corresponding assembly process is provided for the electronic tag.
  • a tire-implanted electronic tag comprising:
  • radio frequency chip module having an electrode thereon
  • the terminal is connected to the antenna at one end, and the other end is cold-pressed and connected to the electrode on the RF chip module.
  • the antenna is a spring-type antenna.
  • the surface of the antenna is provided with a copper-zinc alloy plating layer.
  • the radio frequency chip module is an integrated package structure, such as formed by a radio frequency chip molding package.
  • the terminal is cold-pressed and connected to the antenna.
  • the terminal is a cold-pressed connecting tube.
  • the terminal is a metal pressing piece, and the electrode and the frequency core of the antenna are cold-pressed.
  • the electrodes on the chip module are wrapped in the middle of the metal sheet and fixed by cold pressing.
  • the metal pressing piece is a pre-compressed thin metal piece, and has a "middle" shape structure, and the upper and lower positions are connected with the ribs, and are connected with other metal pressing pieces into a whole row structure, and the ribs are cut after pressing;
  • the two pieces of metal are bent by a mechanical device, and the electrodes of the chip and the electrodes of the antenna are surrounded and clamped and fixed.
  • the electronic tag further comprises a package component, the package component enclosing the electronic tag.
  • the package assembly comprises a cover layer covering the antenna, the radio frequency chip module and the connection terminal.
  • the cover layer is formed by laminating two layers of planar rubber layers.
  • the cover layer is composed of natural rubber which has not been vulcanized, and a protective film is provided on the surface of the cover layer.
  • the package assembly further includes a heat shrink sleeve that encloses the RF chip module and the terminal in the electronic tag.
  • the heat shrinkable sleeve surface is provided with a plurality of small holes.
  • the electronic tag comprising an antenna and a radio frequency chip module, the radio frequency chip module having electrodes thereon, and the electrodes of the antenna and the radio frequency chip module are soldered and fixed by laser welding or arc welding connection.
  • a tire implantable electronic label assembly process including:
  • the heat shrinkable sleeve is placed at the RF chip module, and the heat shrinkable sleeve is heated by the hot air to tightly cover the RF chip module and the electrode connection portion;
  • the upper and lower cover layers are pressed tightly and held for a suitable period of time to complete the bonding.
  • the tire-implanted electronic tag provided by the invention can withstand the high temperature of 300 degrees Celsius without damage, and the stability and reliability of the electronic tag in production and use are ensured.
  • the copper-zinc coating designed for rubber vulcanization makes the combination of antenna and rubber stronger, ensuring the quality and service life of the tire.
  • the tire-implanted electronic tag provided by the present invention is an ultra-high frequency, readable and writable radio frequency tag, which conforms to the HG/T 4953-4956-2016 tire radio frequency identification (RFID) electronic tag machine implantation method and performance. Test methods and coding standards.
  • RFID tire radio frequency identification
  • FIG. 1 is a schematic structural view of a tire-implanted electronic tag in an example of the present invention
  • FIG. 2 is a schematic structural view of a chip package in an example of the present invention.
  • FIG. 3 is a schematic structural view of a terminal block in an example of the present invention.
  • FIG. 4 is a schematic structural view of an antenna in an example of the present invention.
  • This example provides an ultra-high frequency, readable and writable tire-embedded electronic tag that is a passive backscatter tag that conforms to the ISO/IEC 18000-63 air interface requirements, and its working frequency band covers 902. MHz–928MHz.
  • the radio frequency tag 100 is mainly composed of a chip module 101, two antennas 102, two terminals 103, a heat shrinkable sleeve 104, and a cover layer 105.
  • the chip module 101 in the label is specifically a chip package, and the RF chip is formed by a high-reliability molded package, and two electrodes suitable for electrical connection are drawn at both ends of the module.
  • the radio frequency chip is packaged into a special molded package by molding using HIG-3 of ALIEN Corporation.
  • the chip operates from 902MHz to 928MHz.
  • the package body comprises a package body 101a having a rectangular parallelepiped structure and electrodes 101b symmetrically distributed on both end faces of the package body 101a.
  • the electrode 101b is a flat rectangular structure as a whole, and one end thereof is electrically connected to the RF chip in the package body 101a. The other end protrudes from the package body 101a.
  • the scheme of the chip module in this example is not limited thereto, and the specific structure may be changed according to actual needs, for example, the structure of the radio frequency chip, the structure of the package, and the electrode structure may be changed according to actual needs, as long as the guarantee is ensured.
  • the chip module has good stability and reliability.
  • the terminal 103 in this tag is used to connect the chip module 101 and the antenna 102.
  • the two antennas 102 are respectively connected to the two electrodes 101b on the chip module 101 through the two terminals 103.
  • the terminal 103 is a cold-pressed connecting pipe, preferably a copper cold-pressing connecting pipe, which is specifically a hollow cylindrical structure, the outer diameter of the cylinder is between 0.8-1.5 mm, and the wall thickness is 0.15-0.25 mm. Between the cylinders, the length is between 3-6 mm. This example preferably has an outer diameter of 1.0 mm, an inner diameter of 0.75 mm, and a length of 4 mm.
  • the cold-pressed connecting tube 103 of this structure can realize the press-fit connection of the electrode of the chip module and the electrode of the antenna. Specifically, one end of the cold-pressed connecting tube 103 is riveted to the antenna 102 or is cooled by cold pressing. The other end is press-fitted and fixedly connected, and the other end is press-fitted and fixed to the package electrode 101b by cold pressing.
  • the two antennas 102 in the present tag are specifically a pair of independent spring-type antennas distributed on both sides of the chip module 101 and communicated with the two electrodes 101b on the chip module 101 through the terminals 103, respectively.
  • One end of the one-sided spring antenna 102 in this example is a linear electrode. It is mainly made of stainless steel with a wire diameter of 0.15-0.3 mm, and includes two parts of a spring body 102a and an electrode 102b.
  • the spring body 102a has a length of 38-45 mm, a wire diameter of 0.10-0.35 mm, a spring diameter of 1.1-1.5 mm, a pitch of 0.5-1 mm, a preferred length of 38 mm, an antenna wire diameter of 0.25 mm, a spring diameter of 1.2 mm, and a pitch of 0.7 mm.
  • the electrode 102b is a straight section for connection to the terminal 103.
  • the length of the electrode 102b is 2-3 mm, preferably 2.5 mm.
  • a copper-zinc alloy plating layer is disposed on the surface of the spring-type antenna 102, and the bonding strength between the antenna and the rubber is enhanced by the copper-zinc alloy plating layer, thereby ensuring the quality and service life of the tire.
  • the spring-type antenna of this structure can effectively control the length of the antenna, and generally achieve resonance between 860-960 MHz between 60-100 mm.
  • the spring-type antenna structure can make the antenna have good flexibility and ductility. When applied in the tire, it can be deformed with the deformation of the tire rubber, does not affect the performance of the antenna, and is not easily damaged.
  • the specific scheme of the two spring antennas 102 connected to the two electrodes 101b on the chip module 101 through the terminal 103 is as follows:
  • a cold-pressed connecting pipe of a suitable size is selected
  • the package body (ie, chip module) electrode 101b and the electrode 102b of the antenna 102 are respectively subjected to cold pressing In the cavity at both ends of the connecting pipe 103 (ie, the terminal), the cold pressing tool is used to perform point-like pressing from the outside of the cold-pressing connecting pipe, so that the cold-pressed connecting pipe is locally deformed, and the electrode placed inside the cold-pressed connecting pipe is placed. Firmly press and combine reliable conduction.
  • the conductor is electrically connected by using a cold-press connection method, and the effect of withstanding high temperature can be obtained, the connection point is not damaged in a high-temperature environment, and the conduction effect is excellent, and the on-resistance is small.
  • the heat shrinkable sleeve 104 and the cover layer 105 in the present label cooperate to form a package assembly for forming a double coating on the chip module 101 to which the antenna 102 is connected, thereby improving the reliability of the entire label.
  • the heat shrinkable sleeve 104 is a black heat shrinkable sleeve having a length of 10 mm and a diameter of 3 mm.
  • the surface of the black heat shrinkable sleeve is provided with a plurality of small holes, which are preferably evenly distributed on the surface of the black heat shrinkable sleeve.
  • the black heat-shrinkable sleeve of the structure is sleeved on the chip module 101 package and the terminals 103 on both sides thereof, and the chip module 101 and the terminal blocks 103 at both ends thereof are covered by hot air shrinkage to form the first A layer of cladding.
  • the first heat shrinkable sleeve 104 is preferably disposed centering on the chip module 101.
  • the first layer of the covering body can effectively strengthen the mechanical strength of the terminal 103 at both ends of the package of the chip module 101, improve the impact resistance and tensile strength of the product, and make the product more reliable and durable.
  • the cover layer 105 is formed by laminating two layers of unvulcanized natural rubber having a length of 100 mm, a width of 10 mm and a thickness of 0.5 to 1.5 mm. That is, the cover layer 105 is formed by laminating an upper cover layer and a lower cover layer, wherein the upper cover layer and the lower cover layer are respectively an unvulcanized natural rubber layer having a length of 100 mm, a width of 10 mm, and a thickness of 0.5 to 1.5 mm.
  • the present example further adds a protective film to the surface thereof to further improve its performance.
  • the cover layer 105 thus structured is disposed on the chip module 101 package and the terminals on both sides thereof 103 and the outside of the antenna 102 on both sides thereof, the inner device is further covered by a pressing mechanism (that is, the chip module 101 package, the terminal 103, and the antenna 102 are covered in the middle) to form a second layer covering body.
  • the tire-embedded electronic tag thus constructed conforms to the HG/T 4953-4956-2016 radio frequency identification (RFID) electronic tag machine implantation method, performance test method and coding standard for tires.
  • RFID radio frequency identification
  • data can be continuously written to the RF tag through a dedicated RFID reader.
  • the present example also provides a quick and convenient assembly process, and the process of assembling the tire-implanted electronic label based on the process is as follows (see FIG. 1):
  • the antenna preferably a length of 38mm, an antenna wire diameter of 0.25mm, a spring diameter of 1.25mm, a pitch of 0.7mm, a pair of spring-type antennas (the surface of the pair of spring-type antennas is provided with a copper-zinc alloy coating) and copper terminals (ie copper cold pressure connection pipe).
  • the two copper terminals are respectively riveted with the two spring antennas (or pressed and fixed by cold pressing), and then cold-pressed with the upper electrode of the package, wherein the cold pressing process is as described above.
  • Heat shrinkable sleeve coating for the package connecting the antenna through the copper terminal on both sides, preferably a heat shrinkable sleeve with an initial diameter of 3 mm and a length of 10 mm, and a plurality of small holes are provided on the surface of the heat shrinkable sleeve to cover the package
  • the core is sleeved on the package and the copper terminals on both sides thereof, and the package and the copper terminals at both ends thereof are covered by hot air shrinkage to form a coating body.
  • step 4 Place the center of the assembly completed in step 3 symmetrically onto the lower cover and secure it to the surface of the lower cover with force (such as by hand or other force-applying components). Then, the upper cover layer is aligned with the lower cover layer, the assembly is completely covered in the middle, and the upper and lower cover layers are tightly pressed and held for a suitable time by a plane pressing tool to remove air, complete bonding, and form a tire implant. Electronic label.
  • the assembly of the tire-implanted electronic tag can be completed quickly and conveniently, which is not only efficient, but also has a high yield, and ensures mass production of the product.
  • the present embodiment provides an ultra-high frequency, readable and writable tire-embedded electronic tag.
  • the overall solution of the tire-embedded electronic tag is the same as that of the tire-embedded electronic tag of Example 1, and will not be described herein.
  • the difference between the two is that the terminal in the tire-implanted electronic tag provided by the present embodiment uses a metal pressing piece, and the electrode of the radio frequency chip module and the electrode of the antenna are connected by a metal pressing piece.
  • one end of the metal pressing piece is connected to the antenna electrode, and the other end is connected to the electrode on the radio frequency chip module, and the two electrodes are wrapped in the middle of the metal piece by cold pressing, and are fixed by cold pressing.
  • the metal pressing piece here is a pre-compressed thin metal piece, and the "middle"-shaped structure is connected with the upper and lower positions, and is connected with other metal pressing pieces into a whole row structure. After pressing, the connecting ribs are cut, and the left and right pieces of metal are cut.
  • the sheet is curved and surrounded by a mechanical device, and the electrode of the radio frequency chip module and the electrode of the antenna are surrounded and clamped and fixed.
  • the tire-embedded electronic tag thus constructed has the same performance as the HG/T 4953-4956-2016 tire radio frequency identification (RFID) electronic tag machine implantation method, performance test method and coding standard. When used, data can be continuously written to the RF tag through a dedicated RFID reader.
  • RFID radio frequency identification
  • This example provides another UHF, readable and writable tire-embedded electronic tag.
  • the overall solution of the tire-embedded electronic tag is the same as that of the tire-embedded electronic tag in Example 1, and will not be described herein.
  • the difference between the two is the power of the RF chip module in the tire-implanted electronic tag provided by this example.
  • the electrodes of the pole and the antenna are connected by laser welding or arc welding.
  • the electrode of the radio frequency chip module is placed on the electrode of the antenna, and the welding is fixed by laser welding or arc welding.
  • the tire-embedded electronic tag thus constructed has the same performance as the HG/T 4953-4956-2016 tire radio frequency identification (RFID) electronic tag machine implantation method, performance test method and coding standard. When used, data can be continuously written to the RF tag through a dedicated RFID reader.
  • RFID radio frequency identification

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Mechanical Engineering (AREA)
  • Tires In General (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Support Of Aerials (AREA)

Abstract

一种轮胎植入式电子标签(100)及组装工艺,该电子标签(100)主要包括:天线(102)、射频芯片模块(101)以及接线端子(103),其中射频芯片模块(101)上具有电极(101b);接线端子(103)一端与天线(102)连接,另一端与射频芯片模块(101)上的电极(101b)冷压连接。组装时,封装射频芯片形成射频芯片模块(101);接线端子(103)与天线(102)初始化铆接,再与封装体电极(101b)冷压连接;封装连接天线(102)的射频芯片模块(101)。所述轮胎植入式电子标签(100)为超高频、可读写的射频标签,其符合HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准。

Description

一种轮胎植入式电子标签及组装工艺 技术领域
本发明涉及电子标签,具体涉及轮胎用射频识别(RFID)电子标签。
背景技术
21世纪轮胎发展的主题将是人性化,其内涵包括智能便利,绿色安全,最近10年间,以米其林为首的大轮胎制造商已开发出多种智能轮胎技术及产品,轮胎智能化不仅仅是轮胎自身的一场革命,还将带动轮胎制造工艺与生产设备产生变革,让轮胎多一些智慧,让人类更安全。
由此可知,随着信息化时代的发展,将射频识别(RFID)系统应用到轮胎中对轮胎使用状态进行实时监控的技术已成为当今轮胎的发展趋势。现有的技术已经将无线射频识别技术应用到轮胎监测领域,市场上出现了一种贴片式的电子标签,用IC芯片电连接铝膜天线组成,其厚度十分纤薄,方便封装于诸如硅胶、橡胶等材料中,但贴片式电子标签的缺点也非常明显,行驶中汽车的轮胎不断滚动产生大量的静电,此类电子标签的防静电性能欠佳。
针对该情况设计出了一系列改进的轮胎用射频识别(RFID)电子标签。如公告号CN 205176910 U的实用新型专利、公开号CN 105320985 A的发明专利申请公开的轮胎电子标签方案。
这一类的轮胎电子标签主要由射频芯片和弹簧天线构成,其中弹簧天线与射频芯片之间一般采用锡焊接的方式。但是,锡的熔点较低,常规焊锡的转化温度在150~180摄氏度,高温焊锡的转化温度为180~200摄氏度,在轮胎中植入电子标签,需要承受至少200摄氏度的高温并保持几十分钟,这是国标HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准中明确规定的。
常规轮胎电子标签由于需要通过锡焊将天线和芯片焊接起来,因此天线表面通常设置了镀金层,适合锡焊。但是镀金层与橡胶的结合效果并不是最理想的,容易产生橡胶分层现象,严重的还会造成轮胎的安全隐患。
发明内容
针对现有轮胎电子标签所存在的问题,本发明的目的在于提供一种高可靠性的轮胎植入式电子标签;同时在此基础上针对该电子标签提供相应的组装工艺。
为了达到上述目的,本发明采用如下的技术方案:
一方面,提供一种轮胎植入式电子标签,所述电子标签包括:
天线;
射频芯片模块,所述射频芯片模块上具有电极;
接线端子,所述接线端子一端与天线连接,另一端与射频芯片模块上的电极冷压压合连接。
优选的,所述天线为弹簧式天线。
优选的,所述天线表面设置铜锌合金镀层。
优选的,所述射频芯片模块为一体化的封装结构,如由射频芯片模塑封装形成。
优选的,所述接线端子与天线冷压压合连接。
优选的,所述接线端子为冷压连接管。
优选的,所述接线端子为金属压合片,通过冷压方式将天线的电极和频芯 片模块上的电极包裹在金属片中间,并进行冷压固定。
优选的,所述金属压合片为预压成型的薄型金属片,“中”字形结构,上下位连筋,与其他金属压合片连成整排结构,压合后将连筋切断;左右两片金属片通过机械装置进行弯曲包围,将芯片的电极和天线的电极包围在中间再夹紧固定。
优选的,所述电子标签还包括封装组件,所述封装组件包覆电子标签。
优选的,所述封装组件包括覆盖层,所述覆盖层包覆住天线、射频芯片模块及接线端子。
所述覆盖层由两层平面橡胶层覆合而成。
优选的,所述覆盖层由未经硫化处理的天然橡胶构成,并在覆盖层的的表面设置保护膜。
优选的所述封装组件还包括热缩套管,所述热缩套管包覆电子标签中的射频芯片模块和接线端子。
优选的,所述的热缩套管表面设置了多个小孔。
再者,提供另一种轮胎植入式电子标签,所述电子标签包括天线和射频芯片模块,所述射频芯片模块上具有电极,天线与射频芯片模块的电极通过激光焊或电弧焊进行焊接固定连接。
另一发面,提供了一种轮胎植入式电子标签组装工艺,包括:
封装射频芯片形成射频芯片模块;
将天线的电极与封装体电极冷压连接;
将热缩套管放置到射频芯片模块处,通过热风加热热缩套管使其紧密包覆射频芯片模块和电极连接部位;
将完成的组件中心对称放置到下覆盖层,并使其固定在下覆盖层的表面;
将上覆盖层对准下覆盖层,将组件完全包覆在中间;
将上下覆盖层紧紧压合并保持适当的时间,使其完成粘合。
本发明提供的轮胎植入式电子标签,其无需焊接的机械式冷压结构能够承受300摄氏度高温而不受损伤,保证了电子标签在生产和使用中的稳定性和可靠性。同时,专为橡胶硫化设计的铜锌镀层,使天线和橡胶的结合力更强,保证了轮胎的品质和使用寿命。
再者,本发明提供的轮胎植入式电子标签为超高频、可读写的射频标签,其符合HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准。
附图说明
以下结合附图和具体实施方式来进一步说明本发明。
图1为本发明实例中轮胎植入式电子标签的结构示意图;
图2为本发明实例中芯片封装体的结构示意图;
图3为本发明实例中接线端子的结构示意图;
图4为本发明实例中天线的结构示意图。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体图示,进一步阐述本发明。
实例1
本实例提供一种超高频、可读写的轮胎植入式电子标签,该标签为符合ISO/IEC 18000-63空中接口要求的无源后向散射标签,其工作频段覆盖902 MHz–928MHz。
参见图1,其所示为该轮胎植入式电子标签的结构示意图。由图可知,该射频标签100主要由芯片模块101、两天线102、两接线端子103、热缩套管104以及覆盖层105。
参见图2,本标签中的芯片模块101具体为芯片封装体,由射频芯片采用高可靠性模塑封装形成,模块两端引出两个适合电性连接的电极。
本实例中射频芯片采用ALIEN公司的HIG-3,通过模塑封装成专用模塑封装体。该芯片工作在902MHz–928MHz。
由此构成的封装体包括一长方体结构的封装本体101a以及对称分布在封装本体101a两端面的电极101b,该电极101b整体为扁平的方体结构,其一端与封装本体101a内的射频芯片电连接,另一端伸出封装本体101a。这里需要指出的,本实例中的芯片模块的方案并不限于此,具体的结构可根据实际需求进行变动,如射频芯片、封装体的结构、电极结构等都可根据实际需求进行变动,只要保证芯片模块具有良好的稳定可靠性即可。
参见图1和图3,本标签中的接线端子103用于连接芯片模块101和天线102。通过两个接线端子103使得两天线102分别与芯片模块101上的两电极101b连通。
具体实现时,该接线端子103为一冷压连接管,优选铜质冷压连接管,其具体为中空圆柱体结构,圆柱体外径为0.8-1.5mm之间,管壁厚度为0.15-0.25mm之间,圆柱体的长度为3-6mm之间。本实例优选外径1.0mm,内径0.75mm,长度4mm。
由此结构的冷压连接管103,可实现芯片模块的电极和天线的电极的压合连接。具体的,冷压连接管103一端与天线102初始化铆接或通过冷压方式进 行压合固定连接,另一端与封装体电极101b通过冷压方式进行压合固定连接。
参见图1和图4,本标签中的两天线102具体为一对独立的弹簧式天线,分布在芯片模块101两边,并分别通过接线端子103与芯片模块101上的两电极101b连通。
本实例中的单边弹簧式天线102的一端为直线型的电极。其主要由线径0.15-0.3mm的不锈钢制成,包括弹簧本体102a和电极102b两部分。
其中,弹簧本体102a的长度38-45mm,线径0.10-0.35mm,弹簧直径1.1-1.5mm,螺距0.5-1mm;优选长度为38mm,天线线径0.25mm,弹簧直径1.2mm,螺距0.7mm。
电极102b为直线段,用于与接线端子103连接。该电极102b的长度为2-3mm,优选2.5mm。
另外,在弹簧式天线102的表面设置有铜锌合金镀层,通过该铜锌合金镀层使天线和橡胶的结合力更强,保证了轮胎的品质和使用寿命。
这种结构的弹簧式天线可以使天线的长度受到有效控制,一般在60-100mm之间就能获得860-960MHz之间的谐振。
同时,弹簧式天线结构,可以使天线具有良好的柔韧性和延展性,在轮胎中应用的时候,可以随着轮胎橡胶的变形而变形,不影响天线的性能,也不容易被损坏。
上述的两弹簧式天线102分别通过接线端子103与芯片模块101上的两电极101b连通的具体方案如下:
根据弹簧式天线与芯片模块上的电极的大小,选定合适尺寸的冷压连接管;
将封装体(即芯片模块)电极101b和天线102的电极102b分别穿在冷压 连接管103(即接线端子)的两端空腔内,通过冷压工具从冷压连接管的外部进行点状加压,使冷压连接管局部变形,将置于冷压连接管内部的电极牢牢地压合并可靠导通。
本实例中采用冷压连接方式进行导体电性连接,可以获得承受高温的效果,在高温环境中不会损坏连接点,并且导通效果优良,导通电阻较小。
参见图1,本标签中的热缩套管104和覆盖层105配合构成封装组件,用于对连接有天线102的芯片模块101形成双层包覆,提高整个标签的可靠性。
其中,热缩套管104采用长度10mm,直径3mm的黑色热缩套管,该黑色热缩套管的表面设置了多个小孔,这些小孔优选均匀分布在黑色热缩套管的表面。
由此结构的黑色热缩套管,其套设在芯片模块101封装体和其两侧的接线端子103上,通过热风收缩包覆住芯片模块101封装体和其两端的接线端子103,形成第一层包覆体。其中,第一热缩套管104优选以芯片模块101为中心进行设置。
第一层包覆体可有效加强芯片模块101封装体两端的接线端子103的机械强度,提高产品的抗冲击力和抗拉力,使产品更可靠耐用。
覆盖层105,其采用两层长度100mm,宽度10mm,厚度0.5~1.5mm的未经硫化的天然橡胶贴合而成。即该覆盖层105由上覆盖层和下覆盖层贴合而成,其中上覆盖层和下覆盖层分别为长度100mm,宽度10mm,厚度0.5~1.5mm的未经硫化的天然橡胶层。
针对该覆盖层105,本实例在其表面进一步增设保护膜,以进一步提高其性能。
如此结构的覆盖层105设置在芯片模块101封装体和其两侧的接线端子 103和其两侧的天线102外部,通过压合机构进一步包覆住内部器件(即将芯片模块101封装体、接线端子103以及天线102包覆在中间),形成第二层包覆体。
由此构成的轮胎植入式电子标签,其性能符合HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准。使用时,能通过RFID专用读写器连续向射频标签写入数据。
针对上述的轮胎植入式电子标签方案,本实例还提供一种快速便捷的组装工艺,基于该工艺组装本轮胎植入式电子标签的过程如下(参见图1):
1.进行射频芯片封装,采用高可靠性模塑封装射频芯片,形成专用模塑封装体,其尺寸优选为1.55*2.65*1.05mm。
2.连接天线,优选长度为38mm,天线线径0.25mm,弹簧直径1.25mm,螺距0.7mm的一对弹簧式天线(该对弹簧式天线的表面设置有铜锌合金镀层)和铜质接线端子(即铜质冷压连接管)。连接时,将两铜质接线端子分别与两弹簧式天线初始化铆接(或通过冷压方式进行压合固定连接),再与封装体上电极冷压连接,其中冷压过程如上所述。
3.热缩套管包覆,针对两侧通过铜质接线端子连接天线的封装体,优选初始直径3mm,长度10mm的热缩套管,热缩套管表面设置了若干小孔,以封装体为中心套设在封装体和其两侧的铜质接线端子上,通过热风收缩包覆住封装体和其两端的铜质接线端子,形成一层包覆体。
4.将步骤3完成的组件中心对称放置到下覆盖层上,用力(如用手或其它施力部件)使其固定在下覆盖层的表面。接着将上覆盖层对准下覆盖层,将组件完全包覆在中间,用平面压合工具将上下覆盖层紧紧压合并保持适当的时间,使其排除空气,完成粘合,形成轮胎植入式电子标签。
通过上述工序能够快速便捷的完成轮胎植入式电子标签的组装,不仅效率高,而且成品率高,保证产品的大批量生产。
实例2
本实例提供一种超高频、可读写的轮胎植入式电子标签,该轮胎植入式电子标签的整体方案与实例1中的轮胎植入式电子标签相同,此处不加以赘述。两者不同之处在于本实例提供的轮胎植入式电子标签中的接线端子采用金属压合片,通过金属压合片来实现射频芯片模块的电极和天线的电极的压合连接。
具体的,金属压合片一端与天线电极连接,另一端与射频芯片模块上的电极连接,通过冷压方式将两个电极包裹在金属片中间,并进行冷压固定。
这里的金属压合片为预压成型的薄型金属片,“中”字形结构,上下位连筋,与其它金属压合片连成整排结构,压合后将连筋切断,左右两片金属片通过机械装置进行弯曲包围,将射频芯片模块的电极和天线的电极包围在中间再夹紧固定。
由此构成的轮胎植入式电子标签,其性能同样符合HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准。使用时,能通过RFID专用读写器连续向射频标签写入数据。
实例3
本实例提供另一种超高频、可读写的轮胎植入式电子标签,该轮胎植入式电子标签的整体方案与实例1中的轮胎植入式电子标签相同,此处不加以赘述。两者不同之处在于本实例提供的轮胎植入式电子标签中射频芯片模块的电 极和天线的电极之间通过激光焊或电弧焊进行连接。
具体的,将射频芯片模块的电极与天线的电极重叠放置,通过激光焊或者电弧焊的方式进行焊接固定。
由此构成的轮胎植入式电子标签,其性能同样符合HG/T 4953~4956-2016轮胎用射频识别(RFID)电子标签机器植入方法、性能试验方法和编码的标准。使用时,能通过RFID专用读写器连续向射频标签写入数据。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (16)

  1. 一种轮胎植入式电子标签,其特征在于,所述电子标签包括:
    天线;
    射频芯片模块,所述射频芯片模块上具有电极;
    接线端子,所述接线端子一端与天线连接,另一端与射频芯片模块上的电极冷压压合连接。
  2. 根据权利要求1所述的一种轮胎植入式电子标签,其特征在于,所述天线为弹簧式天线。
  3. 根据权利要求1或2所述的一种轮胎植入式电子标签,其特征在于,所述天线表面设置铜锌合金镀层。
  4. 根据权利要求1所述的一种轮胎植入式电子标签,其特征在于,所述射频芯片模块为一体化的封装结构。
  5. 根据权利要求1所述的一种轮胎植入式电子标签,其特征在于,所述接线端子与天线冷压压合连接。
  6. 根据权利要求1或5所述的一种轮胎植入式电子标签,其特征在于,所述接线端子为冷压连接管。
  7. 根据权利要求1或5所述的一种轮胎植入式电子标签,其特征在于,所述接线端子为金属压合片,通过冷压方式将天线的电极和频芯片模块上的电极包裹在金属片中间,并进行冷压固定。
  8. 根据权利要求7所述的一种轮胎植入式电子标签,其特征在于,所述金属压合片为预压成型的薄型金属片,“中”字形结构,上下位连筋,与其他金属压合片连成整排结构,压合后将连筋切断;左右两片金属片通过机械装置 进行弯曲包围,将芯片的电极和天线的电极包围在中间再夹紧固定。
  9. 根据权利要求1所述的一种轮胎植入式电子标签,其特征在于,所述电子标签还包括封装组件,所述封装组件包覆电子标签。
  10. 根据权利要求9所述的一种轮胎植入式电子标签,其特征在于,所述封装组件包括覆盖层,所述覆盖层包覆住天线、射频芯片模块及接线端子。
  11. 根据权利要求10所述的一种轮胎植入式电子标签,其特征在于,所述覆盖层由两层平面橡胶层覆合而成。
  12. 根据权利要求11所述的一种轮胎植入式电子标签,其特征在于,所述覆盖层由未经硫化处理的天然橡胶构成,并在表面设置保护膜。
  13. 根据权利要求9-12中任一项所述的一种轮胎植入式电子标签,其特征在于,所述封装组件还包括热缩套管,所述热缩套管包覆电子标签中的射频芯片模块和接线端子。
  14. 根据权利要求10所述的一种轮胎植入式电子标签,其特征在于,所述的热缩套管表面设置了多个小孔。
  15. 一种轮胎植入式电子标签,其特征在于,所述电子标签包括天线和射频芯片模块,所述射频芯片模块上具有电极,天线与射频芯片模块的电极通过激光焊或电弧焊进行焊接固定连接。
  16. 一种轮胎植入式电子标签组装工艺,其特征在于,所述工艺包括:
    封装射频芯片形成射频芯片模块;
    将天线的电极与封装体电极冷压连接;
    将热缩套管放置到射频芯片模块处,通过热风加热热缩套管使其紧密包覆射频芯片模块和电极连接部位;
    将完成的组件中心对称放置到下覆盖层,并使其固定在下覆盖层的表面;
    将上覆盖层对准下覆盖层,将组件完全包覆在中间;
    将上下覆盖层紧紧压合并保持适当的时间,使其完成粘合。
PCT/CN2016/110800 2016-08-26 2016-12-19 一种轮胎植入式电子标签及组装工艺 WO2018036038A1 (zh)

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EP16914058.9A EP3506171A4 (en) 2016-08-26 2016-12-19 IMPLANTABLE ELECTRONIC LABEL FOR TIRES AND ASSEMBLY PROCEDURES
JP2019531503A JP2019533260A (ja) 2016-08-26 2016-12-19 タイヤ埋込型電子タグ及び組立プロセス
US16/327,750 US20190205722A1 (en) 2016-08-26 2016-12-19 Implantable electronic tag for tire and assembly process
BR112019003856A BR112019003856A2 (pt) 2016-08-26 2016-12-19 marcador eletrônico implantável para um pneu e processo de montagem
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