WO2018032486A1 - 一种硅胶挤塑软灯条的加工工艺 - Google Patents

一种硅胶挤塑软灯条的加工工艺 Download PDF

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Publication number
WO2018032486A1
WO2018032486A1 PCT/CN2016/095955 CN2016095955W WO2018032486A1 WO 2018032486 A1 WO2018032486 A1 WO 2018032486A1 CN 2016095955 W CN2016095955 W CN 2016095955W WO 2018032486 A1 WO2018032486 A1 WO 2018032486A1
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WO
WIPO (PCT)
Prior art keywords
fpc
board
fpc soft
strip
vulcanizing agent
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Application number
PCT/CN2016/095955
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English (en)
French (fr)
Inventor
李忠训
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四川蓝景光电技术有限责任公司
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Application filed by 四川蓝景光电技术有限责任公司 filed Critical 四川蓝景光电技术有限责任公司
Priority to EP16913243.8A priority Critical patent/EP3502544B1/en
Publication of WO2018032486A1 publication Critical patent/WO2018032486A1/zh
Priority to US16/167,743 priority patent/US10851954B2/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the invention relates to a neon strip, in particular to a processing technology of a silicone extruded soft strip.
  • the LED neon belt mainly includes a casing and a circuit board.
  • the circuit board is provided with electronic components and LED lamp beads.
  • the entire casing needs to be well sealed to ensure waterproof and moisture-proof effect. Therefore, the integrity of the casing is very important, and the toughness of the material is important. It is also necessary to be able to meet the requirements of the neon band bendability, and the conventional processing technology is difficult to meet the technical specifications of the LED neon band.
  • the object of the present invention is to provide a processing technology of a silicone extruded soft light strip, which solves the problem of difficulty in processing the LED neon strip in the prior art.
  • the processing technology of a silicone extruded soft light strip comprises the following steps:
  • LED lamp beads and other components are attached to the FPC flexible board and reflow soldering
  • FPC soft board is welded to the board by lead-free manual soldering
  • the solid silica gel mixture is configured by a silicone rubber of the type XS1110-ZA and a platinum vulcanizing agent of the type C-25A and a platinum vulcanizing agent of the type C-25B in a ratio of a mass ratio of 100:0.6 to 1.2:0.6 to 1.2. to make;
  • step (e) For the semi-finished product of step (e), cut short from the position of the connecting piece, install the plug, and then carry out product qualification test, and package the qualified product into the warehouse for sale or use.
  • step a specifically includes the following steps:
  • step a4 Transport the qualified product of step a4 to the next process through the antistatic cart.
  • the step b specifically includes the following steps:
  • the condition of the aging shock is 5 minutes per lighting, 2 minutes of power-off, and the cycle is performed for 24 hours.
  • step d The specific steps of the step d are as follows:
  • the adhesives of model 600A and 600B are prepared according to the ratio of mass ratio of 1:1. After shaking, pour into the adhesive box and pull the FPC soft strip of the reel from the reel. , so that the head is completely immersed in the bottom of the adhesive box, so that the adhesive completely covers the head of the FPC soft strip;
  • the first part of the FPC soft strip coated with adhesive is fixed on the belt line of the baking furnace inlet with silica gel, the traction switch of the baking furnace is opened, the subsequent soft strip is pulled to continue to wet the adhesive, and the infiltrating and bonding is performed.
  • the FPC soft strip of the agent enters the baking oven to make the FPC soft strip and the adhesive completely adhere together;
  • step e The specific steps of the step e are as follows:
  • the silicone rubber of model XS1110-ZA and the platinum vulcanizing agent of model C-25A and the platinum vulcanizing agent of model C-25B are arranged according to the ratio of mass ratio of 100:0.6 to 1.2:0.6 to 1.2, and then used. Stirring and turning over the solid silica gel mixer until the mixture is sufficiently homogeneous to obtain a solid silica gel mixture;
  • the FPC soft strip conveyed by d5 is sent to the extruder equipped with the extrusion mold within 8 hours, and sent to the divided solid silica gel mixture. At the same time, the baking furnace is closed and the extruder is started, and the extrusion starts. Plastic and baking curing;
  • the mass ratio of the silicone rubber of the model XS1110-ZA to the platinum vulcanizing agent of the model C-25A and the platinum vulcanizing agent of the model C-25B is 100:0.8:0.8;
  • the mass ratio of silicone rubber of XS1110-ZA to platinum vulcanizing agent of type C-25A and platinum vulcanizing agent of type C-25B is 100:1:1.
  • a diffusing agent or toner is also added to the solid silica gel mixture, and in summer: a silicone rubber of the type XS1110-ZA, a diffusing agent or a toner and a platinum vulcanizing agent of the type C-25A, and a type C-25B platinum vulcanized.
  • the mass ratio of the agent is 100:4:0.8:0.8
  • the mass ratio is 100:4:1:1.
  • the specific method of the step g is: first cutting from the position of the connecting piece of the FPC soft strip, and then soldering the connector or connecting line required by the customer, and then using the acid glue of the model WR-7516 at both ends of the FPC soft strip.
  • the plug is installed, and after 2 hours, it is naturally air-dried, and the acid gel is solidified.
  • the FPC-based silicone extruded plastic LED neon strip is processed.
  • the present invention has the following beneficial effects:
  • the invention is based on an extrusion process, is matched with a baking furnace, and at the same time of extrusion, the material is solidified, the whole processing process is semi-automatically controlled, the labor cost is low, the processing efficiency is high, and each processing process ends. Qualification inspection is carried out, which greatly improves the product qualification rate.
  • the invention adopts a high-temperature lead-free solder paste for chip processing, thereby avoiding the melting of the solder paste in the subsequent process and destroying the patch effect.
  • the high-temperature lead-free solder wire is used in the welding of the present invention to avoid melting of the solder paste and destroying the welding effect of the FPC in the subsequent processes such as extrusion molding and dispensing.
  • the LED neon strip processing technology disclosed by the invention mainly comprises seven steps of SMT patch, soldering FPC soft board, aging impact, pre-extrusion processing, extrusion molding, and test packaging.
  • the overall process using a solder paste printing machine to print high-temperature lead-free solder paste on the FPC soft board; then use the placement machine to attach the LED lamp beads and other auxiliary components to the FPC soft board printed with solder paste; The FPC soft board after the film is reflow soldered by a reflow soldering machine. Finally, the test tool is used to test whether the semi-finished product after the reflow soldering is finished is qualified, and the marking can be flowed to the welding process.
  • the specific process steps are as follows:
  • Coding Use the printer to print the identification code on the back of the FPC soft board.
  • solder paste return temperature remove the bottled high-temperature lead-free solder paste stored at a low temperature of 0-15 °C from the refrigerator, and place it at room temperature for 4 hours, fully returning to temperature;
  • solder paste stirring the solder paste after the temperature is stirred by a solder paste mixer for 3 minutes to fully release the viscosity and soldering function of the solder paste;
  • solder paste printing the solder paste after soldering is applied to the pad position of the FPC soft board through the debugged solder paste printing machine and steel mesh;
  • Feeding Install the patch LED lamp beads and other auxiliary components on the feeder through the program debugged on the placement machine;
  • Reflow soldering machine parameter setting The temperature of the reflow soldering machine 1-12 temperature zone (including the top and bottom) is set to 150, 160, 170, 180, 180, 180, 190, 210, 240, 255, 255, 210 ° C, respectively. , the chain speed is set to 95cm/min, until the temperature reaches the setting requirement and is stable;
  • Test Connect the test fixture to test the brightness and color temperature of the FPC soft board according to the required voltage to ensure the brightness and color temperature are consistent.
  • the lead-free hand soldering method is used to weld the qualified FPC soft board to the length required by the customer (generally 5 meters, 10 meters 20 meters / strip); after the welding, the appearance inspection and brightness and color temperature test.
  • the specific process steps are as follows:
  • soldering iron temperature setting set the temperature of soldering iron of 60W constant temperature soldering station to 360-400 °C, the temperature reaches the setting requirement and is stable;
  • Appearance inspection Visual inspection of the solder joints of the FPC soft board after soldering to ensure that there are no false soldering, cold soldering, polarity soldering, solder joint height, damage and pad peeling.
  • Brightness and color temperature test The whole board FPC soft board that has passed the visual inspection after welding is tested by brightness and color temperature through special test tooling to ensure the brightness and color temperature are consistent.
  • the tested full-board FPC flexible board is connected to the aging rack required for the product to perform aging impact.
  • the aging impact condition is 5 minutes for each lighting and 2 minutes for power-off, and the cycle lasts for 24 hours.
  • the qualified whole board FPC soft board semi-finished product is placed in the anti-static box and flows to the next process.
  • the overall process firstly, the aging qualified FPC soft board semi-finished products are divided and reeled, and then the neon belt is attached with adhesive, baked, and finally the neon belt with adhesive attached is tested and then rolled up. On the reel.
  • the specific process steps are as follows:
  • Sub-board Place the whole board FPC soft board that has passed the aging impact on the workbench with anti-static skin to divide the board into a single FPC soft strip.
  • Luminance test The brightness of each lamp bead is tested by lighting the FPC soft strip after the sub-board, and it is confirmed that no light is on or the light is blinking. The entire work must be handled with care to avoid damaging the soft strips.
  • Reel The qualified FPC soft strip is rolled up with a reel, usually 30 m/roll.
  • Adhesive configuration The adhesives of model 600A and 600B are disposed at a ratio of 1:1 in mass ratio of 800g/time. Note that the adhesive must be evenly shaken while avoiding adhesive. Eye or respiratory tract.
  • Baking furnace parameter setting set the five temperature zones of the baking oven to 170, 165, 165, 165, 160 °C, and set the traction speed to 5, until the temperature reaches the setting requirement and is stable;
  • the baked FPC soft strip is rolled up from the exit of the baking oven, usually 30 m / roll;
  • Extrusion parameter setting set the 5 temperature zones of the baking oven to 170, 165, 165, 165, 160 °C in summer, 180, 175, 175, 175, 170 °C in winter, until the temperature reaches the setting requirement and is stable.
  • the extrusion speed of the extruder was adjusted to 8.5 (but the extrusion knob could not be turned on) and the towing speed of the oven was adjusted to 10.
  • Matching glue using high-precision electronic scale, the silicone rubber of model XS1110-ZA and the platinum vulcanizing agent of model C-25A, and the platinum vulcanizing agent of model C-25B according to the mass ratio of summer 100:0.8:0.8, In winter, the ratio is 100:1:1; depending on the product type, if you need to add toner or diffusing agent, follow the solid silica gel: diffusing agent or toner: vulcanizing agent A: vulcanizing agent B is summer 100:4:0.8: 0.8, winter 100:4:1:1 mass ratio configuration;
  • Extrusion machine installation Install the extrusion mold on a clean extruder, tighten the inner and outer molds, fix the discharge mold, and then pass the traction FPC soft strip in the large reel through the extrusion mold. Molding, then filling the extruded solid silicone into the extruder through the glue inlet of the extruder;
  • test After the extrusion is completed, the extruded semi-finished products in the anti-static frame are transported to the ventilated place for natural cooling for 20 minutes. After cooling, the traction part is cut off, and the extruded semi-finished products are illuminated by the test tool to confirm all LED lamp bead brightness and color temperature are consistent.
  • the invention adopts a new processing technology, realizes the automatic processing of the LED flexible strip, and the double qualification test of the manual and the test tooling, which not only has high processing efficiency and low cost, but also can effectively ensure the waterproof and moisture resistance of the LED flexible strip. Luminous uniformity and color temperature consistency, with high practical value and application value.

Abstract

一种硅胶挤塑软灯条的加工工艺，包括以下步骤：a.将LED灯珠及其他元器件贴在FPC软板上，并进行回流焊接；b.通过无铅手工焊接的方式将FPC软板焊接成长板；c.对焊接成长板的FPC软板进行老化冲击；d.对老化冲击合格的FPC软板进行挤塑前加工；e.使用固态硅胶混合物配合挤塑模具对FPC软板进行挤塑，再用烘烤炉进行固化；f.对于步骤（e）的半成品，从其连接片位置剪短，安装上堵头，加工完成。本发明能够有效保证LED软灯条的防水防潮性、发光均匀性和色温一致性。

Description

一种硅胶挤塑软灯条的加工工艺 技术领域
本发明涉及一种霓虹灯带，具体地说，是涉及一种一种硅胶挤塑软灯条的加工工艺。
背景技术
随着LED灯应用的普及，LED灯的成品形式也呈现出了多种多样，一些高端的LED产品，逐渐从硬质LED灯产品转向了可弯曲的软灯产品，LED霓虹灯带便是其中具有代表性的一种产品形式。LED霓虹灯带主要包括外壳和电路板，电路板上安装有电子元器件和LED灯珠，整个外壳要实现良好的密封，确保防水防潮效果，因此，外壳的整体性十分重要，而其材料的韧性还要能够达到霓虹灯带可弯曲的要求，常规的加工工艺很难满足LED霓虹灯带的技术指标。
发明内容
本发明的目的在于提供一种一种硅胶挤塑软灯条的加工工艺，解决现有技术中LED霓虹灯带加工困难的问题。
为了实现上述目的，本发明采用的技术方案如下：
一种硅胶挤塑软灯条的加工工艺，包括以下步骤：
a.将LED灯珠及其他元器件贴在FPC软板上，并进行回流焊接；
b.通过无铅手工焊接的方式将FPC软板焊接成长板；
c.对焊接成长板的FPC软板进行老化冲击；
d.对老化冲击合格的FPC软板进行挤塑前加工；
e.使用固态硅胶配合挤塑模具对FPC软板进行挤塑，再用烘烤炉进行固化；
所述固态硅胶混合物由型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂按照质量比100:0.6～1.2:0.6～1.2的比例配置而成；
f.对于步骤(e)的半成品，从其连接片位置剪短，安装上堵头，再进行产品合格测试，将合格产品包装入库，以备销售或使用。
其中，所述步骤a具体包括以下步骤：
a1.在FPC软板的背面喷印识别代码；
a2.在FPC软板的焊盘位置涂布无铅锡膏；
a3.在涂布无铅锡膏后10分钟以内，将LED灯珠及其他元器件贴装在FPC软板上；
a4.将贴装好的FPC软板在2小时以内投入设定好参数的回流焊机中8分钟后取出，先进行目测，再接上测试工装进行亮度与色温测试；
a5.通过防静电推车将步骤a4的合格品运输至下一工序。
所述步骤b具体包括以下步骤：
b1.在步骤a输送过来的FPC软板两端连接处刷助焊剂；
b2.使用高温无铅焊锡丝对FPC软板连接处的焊盘进行手工加锡；再将满足客户长度要求的多块FPC软板用温度达标的烙铁焊接成长板；
b3.检查焊接后的FPC软板外观，再测试其亮度与色温。
所述步骤c中，老化冲击的条件为每点亮5分钟，断电2分钟，如此循环进行24小时。
所述步骤d的具体步骤为：
d1.将老化冲击合格的FPC软板整板放置于铺有防静电皮的工作台上，进行分板，分成单条的FPC软条；
d2.对每颗LED灯珠进行亮度测试，合格者卷盘；
d3.将型号为600A和600B的粘接剂按照质量比1:1的比例进行粘接剂配制，摇匀后倒入粘接剂盒中，将卷盘的FPC软条从卷盘中牵出，使其首部完全浸入粘接剂盒底部，使粘接剂完全覆盖住FPC软条首部；
d4.将涂有粘接剂的FPC软条首部用硅胶固定在烘烤炉入口的皮带线上，打开烘烤炉的牵引开关，牵引后续软条继续浸润粘接剂，并使浸润过粘接剂的FPC软条进入烘烤炉烘烤，使FPC软条和粘接剂完全附着在一起；
d5.卷盘并送入下一工序。
所述步骤e的具体步骤为：
e1.将型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂按照质量比100:0.6～1.2:0.6～1.2的比例进行配置，再使用固态硅胶搅拌机进行搅拌和翻转，直到混合物充分均匀，得到固态硅胶混合物；
e2.将搅拌均匀的固态硅胶混合物按照要求进行分割；
e3.将d5输送过来的FPC软条在8小时以内送入安装有挤塑模具的挤塑机中，并送入分割好的固态硅胶混合物，同时打开烘烤炉关和挤塑机，开始挤塑和烘烤固化；
e4.将挤塑完成的FPC软条置于防静电框中，于通风处自然冷却20分钟；
e5.测试LED灯珠的亮度和色温，然后送入下一次工序。
所述步骤e中，夏季：型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:0.8:0.8；冬季：型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:1:1。
所述固态硅胶混合物中还加入有扩散剂或色粉，且夏季：型号为XS1110-ZA的硅橡胶、扩散剂或色粉与型号为C-25A的铂金硫化剂、型号为C-25B铂金硫化剂的质量比为100:4：0.8:0.8，冬季：型号为XS1110-ZA的硅橡胶、扩散剂或色粉与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:4：1:1。
所述步骤g的具体方法为：先从FPC软条的连接片位置剪断，然后焊接上客户使用时需要的连接头或连接线，再使用型号为WR-7516的酸胶在FPC软条两端安装上堵头，最后经过2小时自然风干，酸胶固化，基于FPC的硅胶挤塑点胶LED霓虹灯带加工完成。
与现有技术相比，本发明具有以下有益效果：
(1)本发明以挤塑工艺为基础，配合烘烤炉，在挤塑的同时，对材料实现固化，整个加工工艺实现半自动化控制，人力成本低，加工效率高，每一道加工工序结束均进行合格性检查，大大提高了产品合格率。
(2)本发明采用高温无铅锡膏进行贴片加工，避免了后续工艺中锡膏熔化，破坏贴片效果。
(3)本发明焊接时使用高温无铅焊锡丝，避免后工序如挤塑和点胶时，锡膏熔化，破坏FPC的焊接效果。
具体实施方式
下面结合实施例对本发明作进一步说明，本发明的实施方式包括但不限于下列实施例。
实施例
本发明公开的LED霓虹灯带加工工艺，主要包括SMT贴片、焊接FPC软板、老化冲击、挤塑前加工、挤塑、和测试包装等七个步骤。
一、SMT贴片
总体过程：采用锡膏印刷机将高温无铅锡膏印刷在FPC软板上；再用贴片机将LED灯珠和其它辅助元器件贴在印刷有锡膏的FPC软板上；然后将贴片后的FPC软板通过回流焊机进行回流焊接；最后，使用测试工装测试回流焊接完成后的半成品是否合格，做好标识即可流向焊接工序。具体工艺步骤为如下：
1.喷码：使用喷码机在FPC软板背面喷印上识别代码。
2.锡膏印刷：
(1)锡膏回温：从冰箱中取出低温0—15℃保存的瓶装高温无铅锡膏，放置在常温中4小时，充分回温；
(2)锡膏搅拌：将回温后的锡膏通过锡膏搅拌机搅拌3分钟，充分释放锡膏的粘性和焊接功能；
(3)锡膏印刷：把搅拌后的锡膏通过调试好的锡膏印刷机和钢网涂布在FPC软板的焊盘位置；
(4)锡膏目检：检查锡膏是否精确地涂布在FPC软板的焊盘位置。
注意事项：涂布完成的FPC必须在10分钟之内进行贴片。
3.SMT贴片：
(1)上料：通过贴片机上调试好的程序，将贴片型LED灯珠及其它辅助元器件安装在喂料器上；
(2)SMT贴片：开动贴片机，将贴片型LED灯珠及其它辅助元器件贴装在涂布有无铅锡膏的FPC软板上；
(3)贴片目检：对于贴片完成后的FPC软板，检查所有元器件是否精确贴装、少贴、漏贴、贴歪、移位、损件以及贴装极性反向等。
4.回流焊接：
(1)回流焊机参数设置：回流焊机1—12温区(包括上下)的温度分别设置为150、160、170、180、180、180、190、210、240、255、255、210℃，链速设置为95cm/min，待温度达到设置要求并稳定；
(2)回流焊投料：将贴片完成合格的FPC软板从回流焊机的入口投入，8分钟后，FPC软板从回流焊机出口流出；
(3)炉后目检：从回流焊机出口将FPC软板捡起，进行目视检查，确保焊接良好，无少件、损件、元器件反向、元器件歪斜、移位、虚假焊、浮高以及立碑等不良问题；
(4)测试：根据所需电压接上测试工装测试FPC软板的亮度和色温，确保亮度与色温一致。
(5)半成品放置与运输：检查合格的贴装半成品整齐放置在防静电推车中运输到光条焊接工序，半成品叠放层数不能超过20层。
注意事项：所有贴片完成的FPC软板必须在2小时之内完成回流焊接。
二、焊接FPC软板
总体过程：采用无铅手工焊接的方式将贴装合格的FPC软板焊接成客户需求的长度(一般为5米、10米20米/条)；焊接后进行外观检查及亮度和色温测试。具体工艺步骤如下：
1.无铅手工焊接：
(1)烙铁温度设置：把60W的恒温焊台的烙铁温度设置为360—400℃，温度达到设置要求并稳定；
(2)刷助焊剂：将整理整齐的整板FPC软板两端连接处刷上助焊剂；
(3)焊接：使用高温无铅焊锡丝对连接处的焊盘进行手工加锡，加锡饱满后将整板的FPC软板顺序相连焊接在一起，当满足客户需求的焊接长度时，就需要焊接上连接片。焊接时注意正负极必须一一对应。
2.外观检查：对焊接后的FPC软板的焊点进行外观检查，确保无虚假焊、冷焊、极性焊反、焊点浮高、损件及焊盘脱落等现象。
3.亮度与色温测试：将焊接后目检合格的整板FPC软板通过专用测试工装进行亮度和色温测试，确保亮度与色温一致。
三、老化冲击
将测试合格的整板FPC软板连接到产品所需的老化架上进行老化冲击，老化冲击条件为每点亮5分钟，断电2分钟，如此循环持续24小时。最后将合格的整板FPC软板半成品放置到防静电框中，流向下一工序。
四、挤塑前加工
总体过程：首先将老化合格的整板FPC软板半成品进行分板并卷盘，再将霓虹灯带附着上粘接剂，进行烘烤，最后将附着粘接剂的霓虹灯带测试合格后卷在大卷盘上。具体工艺步骤如下：
1.分板：将老化冲击合格的整板FPC软板放置在铺有防静电皮的工作台上进行分板，分成单条的FPC软条。
2.亮度测试：把分板后的FPC软条通过点亮，测试每个灯珠的亮度，确认无灯不亮、灯闪烁的现象。整个作业必须轻拿轻放，避免野蛮操作损坏软条。
3.卷盘：将测试合格的FPC软条用卷盘卷好，一般30米/卷。
4.粘接剂配置：将型号为600A和600B的粘接剂按照质量比1:1的比例总共配置800g/次左右，注意配置好的粘接剂需要摇均匀，同时避免粘接剂弄到眼睛或呼吸道。
5.附着粘接剂：
(1)烘烤炉参数设置：将烘烤炉的5个温区设置为170、165、165、165、160℃，牵引速度设置为5，待温度达到设置要求并稳定；
(2)浸润粘接剂：将配置好的粘接剂倒入至粘接剂盒内，把卷盘的FPC软条挂在工装上并从卷盘内牵出，使FPC软条首部完全浸入到粘接剂盒底部，使粘接剂完全覆盖FPC软条；
(3)烘烤：将涂有粘接剂的软条首部用硅胶固定在烘烤炉入口的皮带线上， 打开烘烤炉的牵引开关，牵引后续软条继续浸润粘接剂，并使浸润过粘接剂的FPC软条进入烘烤炉烘烤，使FPC软条和粘接剂完全附着在一起；
(4)炉后卷盘：从烘烤炉出口处将烘烤后的FPC软条用卷盘卷起，一般30米/卷；
(5)焊接并卷盘：将30米/卷的FPC软条测试合格后卷到大卷盘里面，焊接成240米/卷，在软条首部焊接上5米长的牵引FPC软条，方便挤塑时调机。
注意事项：(1)附着粘接剂后的FPC软条必须在8小时内进行挤塑；(2)配置后剩余的粘接剂必须倒入到带瓶盖的瓶子内并密封，超过24小时的粘接剂不能再次使用。
五、挤塑
总体过程：首先将固态硅胶搅拌均匀后，再把附着粘接剂的霓虹灯带通过调试好的挤塑模具和烘烤炉进行挤塑和固化，最后，固化后的霓虹灯带冷却并进行测试。具体工艺步骤如下：
1.挤塑参数设置：把烘烤炉的5个温区设置为夏天170、165、165、165、160℃，冬天180、175、175、175、170℃，待温度达到设置要求并稳定，再将挤塑机的挤塑速度调节到8.5(但是不能打开挤塑旋钮)，烘烤炉的牵引速度调节到10。
2.拌胶：
(1)配胶：使用高精度电子称把型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂按照质量比夏季100:0.8:0.8、冬季100:1:1的比例进行配置；根据产品类型，如果需要加入色粉或扩散剂，则按照固态硅胶：扩散剂或色粉：硫化剂A：硫化剂B为夏季100:4：0.8:0.8，冬季100:4：1:1的质量比进行配置；
(2)炼胶：用固态硅胶搅拌机进行搅拌和翻转，搅拌15分钟，使固态硅胶混合物充分均匀；
(3)分割硅胶：将搅拌均匀的固态硅胶按照长30cm、宽4cm、高2cm进行分割；
注意事项：(1)拌胶后放置在空气中的固态硅胶，必须在12小时内使用，使用前必须再次搅拌均匀；(2)如果长时间不使用，必须放入冰箱冷藏，且冷藏时间超过7天后就不能使用。
3.挤塑模具安装与调试：
(1)挤塑机安装：将挤塑模具安装在清洁干净的挤塑机上，并旋紧内外模，固定出料模具，再将大卷盘内的牵引FPC软条穿过挤塑模具的内模，然后将分割好的固态硅胶通过挤塑机的入胶口将挤塑机填满；
(2)挤塑机一次调试：打开挤塑机的挤塑旋钮，使牵引FPC软条挤出0.5米即关掉挤塑旋钮，观察牵引FPC软条在固态硅胶中的位置，调节出料模具，以便使牵引FPC软条在固态硅胶中位置居中，并且固态硅胶成型良好；
(3)挤塑机二次调试：再次打开挤塑旋钮，让牵引FPC软条挤出0.5米即关掉挤塑旋钮，最终确认牵引FPC软条位于固态硅胶的居中位置，整个固态硅胶成型良好。
4.挤塑与烘烤固化：
(1)开始挤塑：将挤出后包裹牵引FPC软条的固态硅胶的底部紧紧粘接在烘烤炉入口的皮带上，同时打开烘烤炉的牵引开关和挤塑机的挤塑旋钮，开始挤塑；
(2)挤塑与烘烤：挤塑出的半成品进入烘烤炉进行烘烤固化，仔细观察挤出的硅胶形态及FPC软条和灯珠在固态硅胶中的位置，并注意是否需要微调挤塑旋钮，确保挤出的硅胶底部紧贴在烘烤炉皮带上并顺畅地流入烘烤炉，悬空部分的硅胶呈拉直状态并成型良好，硅胶形态饱满光滑，成型完整无脏污，FPC在固态硅胶的居中位置；
(3)炉后目检：炉后人员在牵引部分的挤塑软条刚出炉时确认硅胶完全固化，并将固化情况反馈给挤塑人员，同时确保固化后的半成品全部装入干净的防静电框中。
5.测试：当挤塑完成后，将防静电框中的挤塑半成品搬运至通风处自然冷却20分钟，冷却后切除牵引部分，通过测试工装将挤塑半成品点亮，确认所有 LED灯珠亮度和色温保持一致。
六、测试包装
点亮产品，从连接片可剪位置处将其剪断，焊接上客户需求的连接线或连接头，并使用型号为WR-7516的酸胶在霓虹灯带两端安装上堵头，最后经过2小时自然风干，酸胶固化，一条硅胶挤塑点胶软条成品便加工完成。
本发明采用全新的加工工艺，实现了LED软灯条的自动加工，以及人工和测试工装的双重合格性检测，不仅加工效率高、成本低，而且能够有效保证LED软灯条的防水防潮性、发光均匀性和色温一致性，具有很高的实用价值和应用价值。
上述实施例仅为本发明的优选实施例，并非对本发明保护范围的限制，但凡采用本发明的设计原理，以及在此基础上进行非创造性劳动而作出的变化，均应属于本发明的保护范围之内。

Claims (9)

  1. 一种硅胶挤塑软灯条的加工工艺，其特征在于，包括以下步骤：
    a.将LED灯珠及其他元器件贴在FPC软板上，并进行回流焊接；
    b.通过无铅手工焊接的方式将FPC软板焊接成长板；
    c.对焊接成长板的FPC软板进行老化冲击；
    d.对老化冲击合格的FPC软板进行挤塑前加工；
    e.使用固态硅胶混合物配合挤塑模具对FPC软板进行挤塑，再用烘烤炉进行固化；
    所述固态硅胶混合物由型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂按照质量比100:0.6～1.2:0.6～1.2的比例配置而成；
    f.对于固化后的半成品，从其连接片位置剪短，安装上堵头，再进行产品合格测试，将合格产品包装入库，以备销售或使用。
  2. 根据权利要求1所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤a具体包括以下步骤：
    a1.在FPC软板的背面喷印识别代码；
    a2.在FPC软板的焊盘位置涂布无铅锡膏；
    a3.在涂布无铅锡膏后10分钟以内，将LED灯珠及其他元器件贴装在FPC软板上；
    a4.将贴装好的FPC软板在2小时以内投入设定好参数的回流焊机中，8分钟后从出口处取出，先进行目测，再接上测试工装进行亮度与色温测试；
    a5.通过防静电推车将步骤a4的合格品运输至下一工序。
  3. 根据权利要求2所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤b具体包括以下步骤：
    b1.在步骤a输送过来的FPC软板两端连接焊盘处刷助焊剂；
    b2.使用高温无铅焊锡丝对FPC软板连接处的焊盘进行手工加锡；
    再将满足客户长度要求的多块FPC软板用温度达标的烙铁焊接成长板；
    b3.检查焊接后的FPC软板外观，再测试其亮度与色温。
  4. 根据权利要求3所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤c中，老化冲击的条件为每点亮5分钟，断电2分钟，如此循环进行24小时。
  5. 根据权利要求4所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤d的具体步骤为：
    d1.将老化冲击合格的FPC软板整板放置于铺有防静电皮的工作台上，进行分板，分成单条的FPC软条；
    d2.对每颗LED灯珠进行亮度测试，合格者卷盘；
    d3.将型号为600A和600B的粘接剂按照质量比1:1的比例进行粘接剂配制，摇匀后倒入粘接剂盒中，将卷盘的FPC软条从卷盘中牵出，使其首部完全浸入粘接剂盒底部，使粘接剂完全覆盖住FPC软条首部；
    d4.将涂有粘接剂的FPC软条首部用硅胶固定在烘烤炉入口的皮带线上，打开烘烤炉的牵引开关，牵引后续软条继续浸润粘接剂，并使浸润过粘接剂的FPC软条进入烘烤炉烘烤，使FPC软条和粘接剂完全附着在一起；
    d5.卷盘并送入下一工序。
  6. 根据权利要求5所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤e的具体步骤为：
    e1.将型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂按照质量比100:0.6～1.2:0.6～1.2的比例进行配置，再使用固态硅胶搅拌机进行搅拌和翻转，直到混合物充分均匀，得到固态硅胶混合物；
    e2.将搅拌均匀的固态硅胶混合物按照要求进行分割；
    e3.将d5输送过来的FPC软条在8小时以内送入安装有挤塑模具的挤塑机中，并送入分割好的固态硅胶混合物，同时打开烘烤炉开关和挤塑机，开始挤塑和烘烤固化；
    e4.将挤塑完成的FPC软条置于防静电框中，于通风处自然冷却20分钟；
    e5.测试LED灯珠的亮度和色温，然后送入下一工序。
  7. 根据权利要求6所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤e中，夏季：型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B铂金硫化剂的质量比为100:0.8:0.8；冬季：型号为XS1110-ZA的硅橡胶与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:1:1。
  8. 根据权利要求7所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述固态硅胶混合物中还加入有扩散剂或色粉，且夏季：型号为XS1110-ZA的硅橡胶、扩散剂或色粉与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:4：0.8:0.8，冬季：型号为XS1110-ZA的硅橡胶、扩散剂或色粉与型号为C-25A的铂金硫化剂、型号为C-25B的铂金硫化剂的质量比为100:4：1:1。
  9. 根据权利要求8所述的一种硅胶挤塑软灯条的加工工艺，其特征在于，所述步骤f的具体方法为：先从FPC软条的连接片位置剪断，然后焊接上客户使用时需要的连接头或连接线，再使用型号为WR-7516的酸胶在FPC软条两端安装上堵头，最后经过2小时自然风干，酸胶固化，基于FPC的硅胶挤塑点胶LED霓虹灯带加工完成。
PCT/CN2016/095955 2016-08-18 2016-08-19 一种硅胶挤塑软灯条的加工工艺 WO2018032486A1 (zh)

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