WO2018025790A1 - 液体の精製方法、及び多孔質膜の製造方法 - Google Patents
液体の精製方法、及び多孔質膜の製造方法 Download PDFInfo
- Publication number
- WO2018025790A1 WO2018025790A1 PCT/JP2017/027618 JP2017027618W WO2018025790A1 WO 2018025790 A1 WO2018025790 A1 WO 2018025790A1 JP 2017027618 W JP2017027618 W JP 2017027618W WO 2018025790 A1 WO2018025790 A1 WO 2018025790A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- porous membrane
- particles
- liquid
- filter
- viscous liquid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 144
- 239000012528 membrane Substances 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000002131 composite material Substances 0.000 claims abstract description 68
- 239000002904 solvent Substances 0.000 claims abstract description 59
- 239000002966 varnish Substances 0.000 claims abstract description 59
- 238000004891 communication Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000001914 filtration Methods 0.000 claims description 43
- 239000007787 solid Substances 0.000 claims description 8
- 238000009736 wetting Methods 0.000 claims description 7
- 238000000746 purification Methods 0.000 abstract description 37
- 239000011148 porous material Substances 0.000 abstract description 21
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 41
- -1 polytetrafluoroethylene Polymers 0.000 description 41
- 239000000203 mixture Substances 0.000 description 38
- 229920001721 polyimide Polymers 0.000 description 37
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 34
- 239000004962 Polyamide-imide Substances 0.000 description 30
- 229920002312 polyamide-imide Polymers 0.000 description 30
- 239000000243 solution Substances 0.000 description 30
- 150000004985 diamines Chemical class 0.000 description 28
- 229920005575 poly(amic acid) Polymers 0.000 description 25
- 239000009719 polyimide resin Substances 0.000 description 24
- 239000002243 precursor Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 17
- 239000000377 silicon dioxide Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 16
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- 239000004642 Polyimide Substances 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000003486 chemical etching Methods 0.000 description 11
- 239000002270 dispersing agent Substances 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000000706 filtrate Substances 0.000 description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 7
- 239000004695 Polyether sulfone Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 229920006393 polyether sulfone Polymers 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- 239000002798 polar solvent Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000005979 thermal decomposition reaction Methods 0.000 description 5
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 3
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- SEYKENDCALELBV-UHFFFAOYSA-N 1-N'-phenyl-2,3-dihydroindene-1,1-diamine Chemical compound NC1(CCC2=CC=CC=C12)NC1=CC=CC=C1 SEYKENDCALELBV-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 2
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 2
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 2
- SKKKJNPBIGQNEJ-UHFFFAOYSA-N 9h-fluorene-1,9-diamine Chemical class C1=CC(N)=C2C(N)C3=CC=CC=C3C2=C1 SKKKJNPBIGQNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- LWZFANDGMFTDAV-BURFUSLBSA-N [(2r)-2-[(2r,3r,4s)-3,4-dihydroxyoxolan-2-yl]-2-hydroxyethyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O LWZFANDGMFTDAV-BURFUSLBSA-N 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 150000003949 imides Chemical group 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- LPEKGGXMPWTOCB-UHFFFAOYSA-N methyl 2-hydroxypropionate Chemical compound COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 2
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 229950006451 sorbitan laurate Drugs 0.000 description 2
- 235000011067 sorbitan monolaureate Nutrition 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PPCLPYQKMJUPML-UHFFFAOYSA-N (2-anilinohydrazinyl)benzene Chemical compound C=1C=CC=CC=1NNNC1=CC=CC=C1 PPCLPYQKMJUPML-UHFFFAOYSA-N 0.000 description 1
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- MAPWYRGGJSHAAU-UHFFFAOYSA-N 1,3-bis(4-aminophenyl)urea Chemical compound C1=CC(N)=CC=C1NC(=O)NC1=CC=C(N)C=C1 MAPWYRGGJSHAAU-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- GKQHIYSTBXDYNQ-UHFFFAOYSA-M 1-dodecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+]1=CC=CC=C1 GKQHIYSTBXDYNQ-UHFFFAOYSA-M 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- KDLIYVDINLSKGR-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanatophenoxy)benzene Chemical compound C1=CC(N=C=O)=CC=C1OC1=CC=C(N=C=O)C=C1 KDLIYVDINLSKGR-UHFFFAOYSA-N 0.000 description 1
- URHHESOLJUJYCP-UHFFFAOYSA-N 1-isocyanato-4-[4-[4-(4-isocyanatophenoxy)phenyl]sulfonylphenoxy]benzene Chemical compound C1=CC(N=C=O)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(=CC=3)N=C=O)=CC=2)C=C1 URHHESOLJUJYCP-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QQGBDFMKLXCNHD-UHFFFAOYSA-N 2,2-bis(decanoyloxymethyl)butyl decanoate Chemical compound CCCCCCCCCC(=O)OCC(CC)(COC(=O)CCCCCCCCC)COC(=O)CCCCCCCCC QQGBDFMKLXCNHD-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- FMVOPJLFZGSYOS-UHFFFAOYSA-N 2-[2-(2-ethoxypropoxy)propoxy]propan-1-ol Chemical compound CCOC(C)COC(C)COC(C)CO FMVOPJLFZGSYOS-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- KQRZDJOMDMKAMT-UHFFFAOYSA-N 2-dodecanoylperoxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOOC(=O)CCCCCCCCCCC KQRZDJOMDMKAMT-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- OBCSAIDCZQSFQH-UHFFFAOYSA-N 2-methyl-1,4-phenylenediamine Chemical compound CC1=CC(N)=CC=C1N OBCSAIDCZQSFQH-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-UHFFFAOYSA-N 3-(2,5-dioxooxolan-3-yl)oxolane-2,5-dione Chemical compound O=C1OC(=O)CC1C1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- GDGWSSXWLLHGGV-UHFFFAOYSA-N 3-(4-aminophenyl)-1,1,3-trimethyl-2h-inden-5-amine Chemical compound C12=CC(N)=CC=C2C(C)(C)CC1(C)C1=CC=C(N)C=C1 GDGWSSXWLLHGGV-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- KQIKKETXZQDHGE-FOCLMDBBSA-N 4,4'-diaminoazobenzene Chemical compound C1=CC(N)=CC=C1\N=N\C1=CC=C(N)C=C1 KQIKKETXZQDHGE-FOCLMDBBSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- XTEBLARUAVEBRF-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)aniline Chemical compound NC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 XTEBLARUAVEBRF-UHFFFAOYSA-N 0.000 description 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- TYNNEOUATWMCIY-UHFFFAOYSA-N 4-(4-aminophenyl)phosphonoylaniline Chemical compound C1=CC(N)=CC=C1P(=O)C1=CC=C(N)C=C1 TYNNEOUATWMCIY-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- KSNRJOXTTHDGNZ-UHFFFAOYSA-N 4-[4-(4-aminophenyl)-4-methylpent-1-en-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)CC(=C)C1=CC=C(N)C=C1 KSNRJOXTTHDGNZ-UHFFFAOYSA-N 0.000 description 1
- ZONAQPZTLMOIAV-UHFFFAOYSA-N 4-[4-(4-aminophenyl)-4-methylpentan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)CC(C)(C)C1=CC=C(N)C=C1 ZONAQPZTLMOIAV-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZFWPKNMXSBDNTG-UHFFFAOYSA-N 4-pent-2-enylaniline Chemical compound CCC=CCC1=CC=C(N)C=C1 ZFWPKNMXSBDNTG-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- IEAJQNJSHYCMEK-UHFFFAOYSA-N 5-methoxy-2,5-dimethylhexanoic acid Chemical compound COC(C)(C)CCC(C)C(O)=O IEAJQNJSHYCMEK-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- BYRJNWIHXADTSH-UHFFFAOYSA-N C(CCCCCCCCCCC)C(C(=O)O)CNCCC(=O)O Chemical compound C(CCCCCCCCCCC)C(C(=O)O)CNCCC(=O)O BYRJNWIHXADTSH-UHFFFAOYSA-N 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RUPBZQFQVRMKDG-UHFFFAOYSA-M Didecyldimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC RUPBZQFQVRMKDG-UHFFFAOYSA-M 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N Lactic Acid Natural products CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- SBPRMOITHHGBKT-UHFFFAOYSA-N N(=C=O)C1=CC=C(OC2=CC=C(C=C2)CCC)C=C1 Chemical compound N(=C=O)C1=CC=C(OC2=CC=C(C=C2)CCC)C=C1 SBPRMOITHHGBKT-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920006197 POE laurate Polymers 0.000 description 1
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N Tetrahydrothiophene-1,1-dioxide, Natural products O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NLGOTHQMVKZTBP-KVVVOXFISA-N acetic acid;(z)-octadec-9-en-1-amine Chemical compound CC(O)=O.CCCCCCCC\C=C/CCCCCCCCN NLGOTHQMVKZTBP-KVVVOXFISA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- YSJGOMATDFSEED-UHFFFAOYSA-M behentrimonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCCCCCC[N+](C)(C)C YSJGOMATDFSEED-UHFFFAOYSA-M 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- PKOHJIWQWDODHG-UHFFFAOYSA-N bis[2-[4-(3-aminophenoxy)phenyl]phenyl]methanone Chemical compound Nc1cccc(Oc2ccc(cc2)-c2ccccc2C(=O)c2ccccc2-c2ccc(Oc3cccc(N)c3)cc2)c1 PKOHJIWQWDODHG-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- BTMVHUNTONAYDX-UHFFFAOYSA-N butyl propionate Chemical compound CCCCOC(=O)CC BTMVHUNTONAYDX-UHFFFAOYSA-N 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 description 1
- 229960001927 cetylpyridinium chloride Drugs 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- RZIPTXDCNDIINL-UHFFFAOYSA-N cyclohexane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCCC1(C(O)=O)C(O)=O RZIPTXDCNDIINL-UHFFFAOYSA-N 0.000 description 1
- SMEJCQZFRMVYGC-UHFFFAOYSA-N cyclohexane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C(C(O)=O)C1C(O)=O SMEJCQZFRMVYGC-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 229960004670 didecyldimethylammonium chloride Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical class CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- GBASTSRAHRGUAB-UHFFFAOYSA-N ethylenetetracarboxylic dianhydride Chemical compound O=C1OC(=O)C2=C1C(=O)OC2=O GBASTSRAHRGUAB-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- IIGMITQLXAGZTL-UHFFFAOYSA-N octyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCC IIGMITQLXAGZTL-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- UMSVUULWTOXCQY-UHFFFAOYSA-N phenanthrene-1,2,7,8-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C2C3=CC=C(C(=O)O)C(C(O)=O)=C3C=CC2=C1C(O)=O UMSVUULWTOXCQY-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000205 poly(isobutyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- HUAZGNHGCJGYNP-UHFFFAOYSA-N propyl butyrate Chemical compound CCCOC(=O)CCC HUAZGNHGCJGYNP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/12—Composite membranes; Ultra-thin membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/14—Ultrafiltration; Microfiltration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0079—Manufacture of membranes comprising organic and inorganic components
- B01D67/00793—Dispersing a component, e.g. as particles or powder, in another component
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/02—Inorganic material
- B01D71/024—Oxides
- B01D71/027—Silicium oxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/56—Polyamides, e.g. polyester-amides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2323/00—Details relating to membrane preparation
- B01D2323/06—Specific viscosities of materials involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2323/00—Details relating to membrane preparation
- B01D2323/219—Specific solvent system
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2325/00—Details relating to properties of membranes
- B01D2325/02—Details relating to pores or porosity of the membranes
- B01D2325/0283—Pore size
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2325/00—Details relating to properties of membranes
- B01D2325/20—Specific permeability or cut-off range
Definitions
- the present invention relates to a liquid purification method for purifying a viscous liquid and a method for producing a porous membrane that can be suitably used in the purification method.
- the viscous liquid is a photoresist composition
- bubbles contained in the photoresist composition may cause uneven coating or defects in a patterned film formed using the photoresist composition. It becomes.
- a method for satisfactorily removing bubbles in a viscous liquid such as a photoresist composition is required.
- Patent Document 1 As a method for removing bubbles from a viscous liquid such as a photoresist composition, there has been proposed a method in which a viscous liquid is supplied to a substrate after passing through a filter for removing foreign substances and bubbles (Patent Document 1). ).
- Patent Document 1 does not specifically describe the material, shape, opening diameter, etc. of the filter.
- a known filter such as a non-woven fabric made of PTFE (polytetrafluoroethylene) fiber is applied to remove bubbles, depending on the viscosity of the liquid and the method of passing through the filter, the bubbles in the liquid to be treated It may increase.
- PTFE polytetrafluoroethylene
- the present invention has been made in view of the above problems, and is a method for purifying a viscous liquid that can favorably reduce the number of bubbles in the viscous liquid, and a porous material suitably used as a filter in the production method. It is an object of the present invention to provide a method for producing a membrane.
- the inventors apply a varnish containing a resin component (A), particles (B), and a solvent (S) on a substrate, and a composite comprising the resin component (A) and particles (B).
- the present inventors have found that the above-mentioned problems can be solved by filtering a viscous liquid having a viscosity of 0.1 Pa ⁇ s or more using a filter including a porous film having the above.
- the present invention provides the following.
- a first aspect of the present invention is a liquid purification method comprising filtering a viscous liquid having a viscosity of 0.1 Pa ⁇ s or more with a filter, The filter Coating a varnish containing a resin component (A), particles (B) and a solvent (S) on a substrate to form a composite film comprising the resin component (A) and particles (B); , Removing the particles (B) in the composite membrane, and a method comprising a porous membrane obtained by a production method.
- a second aspect of the present invention is a method for purifying a liquid, comprising filtering a viscous liquid having a viscosity of 0.1 Pa ⁇ s or more with a filter,
- the filter includes a porous film having a communication hole including a structure in which spherical holes or substantially spherical holes communicate with each other.
- the third aspect of the present invention is: Coating a varnish containing a resin component (A), particles (B) and a solvent (S) on a substrate to form a composite film comprising the resin component (A) and particles (B); , Removing the particles (B) in the composite membrane, and a method for producing a porous membrane comprising:
- the viscosity of the varnish is 2.0 Pa ⁇ s or more.
- a method for purifying a viscous liquid that can favorably reduce the number of bubbles in the viscous liquid, and a method for producing a porous membrane suitably used as a filter in the production method. Can do.
- a liquid purification method described below is referred to as a “first purification method”.
- a liquid purification method comprising filtering a viscous liquid having a viscosity of 0.1 Pa ⁇ s or more with a filter, The filter Coating a varnish containing a resin component (A), particles (B) and a solvent (S) on a substrate to form a composite film comprising the resin component (A) and particles (B); , Removing the particles (B) in the composite membrane, and a method comprising a porous membrane obtained by a production method.
- the viscosity of the viscous liquid is a value measured at 25 ° C. using an E-type viscometer.
- a viscous liquid having a predetermined viscosity is filtered while reducing the number of bubbles contained in the viscous liquid by using a filter including a porous membrane obtained through the predetermined process.
- the porous membrane used in the first purification method has pores corresponding to the shape of the particles (B).
- communication holes in which a large number of holes communicate with each other are formed.
- the opening on the surface (first main surface) of the porous membrane and the back surface (second main surface opposite to the first main surface) of the porous membrane are provided.
- Surface is communicated with a communication hole.
- Such a communication hole functions as a flow path for allowing fluid to flow from the first main surface to the second main surface of the porous membrane when the porous membrane is used as a filter.
- the inclusion of the characteristic-shaped communication holes in the porous membrane prevents the bubbles from passing through the porous membrane, and the bubbles when the viscous liquid passes through the porous membrane. And the growth of bubbles dissolved in the viscous liquid is prevented, and as a result, the number of bubbles contained in the viscous liquid is reduced by filtering the viscous liquid using the porous membrane as a filter. It is done.
- the porous membrane also has a function of removing solid minute foreign matters. For this reason, according to the first purification method, not only the number of bubbles in the viscous liquid but also the number of solid foreign substances is reduced.
- the porous membrane used as the filter preferably has a communication hole including a structure in which spherical holes or substantially spherical holes communicate with each other. That is, it is preferable that substantially the entire inner surface of the pores in the porous membrane in the present invention is a curved surface.
- a hole having a shape substantially close to a true sphere may be referred to as a “spherical hole”, and a hole having a shape close to a true sphere is referred to as a “substantially spherical hole”. It may be noted.
- substantially spherical is defined by the sphericity expressed by a value obtained by dividing the major axis of spherical particles or pores by the minor axis.
- a shape that has a sphericity of 1 ⁇ 0.3 or less and is not a sphere is a substantially spherical shape.
- the sphericity of the spherical pores or substantially spherical pores contained in the porous membrane used in the first purification method is preferably 0.90 or more and 1.10 or less, more preferably 0.95 or more and 1.05 or less.
- the Gurley permeability of the porous membrane is preferably, for example, within 1000 seconds, more preferably within 100 seconds, further preferably within 50 seconds, and most preferably within 20 seconds.
- the lower limit is not particularly set since it is preferably as low as possible. However, for example, 1 second or more is preferable in that the number of bubbles can be easily reduced while maintaining the flow rate of the viscous liquid passing through the porous membrane to a certain degree.
- the porous membrane used as a filter in the first purification method is Coating a varnish containing a resin component (A), particles (B) and a solvent (S) on a substrate to form a composite film comprising the resin component (A) and particles (B); , It is manufactured by a method including a porous film obtained by a manufacturing method including removing particles (B) in the composite film.
- the step of forming the composite film is also referred to as “composite film forming step”
- the step of removing the particles (B) from the composite film is also referred to as “removal step”.
- a varnish containing a resin component (A), particles (B), and a solvent (S) is applied onto a substrate to form a coating film, and then the solvent (S) is removed from the coating film.
- grains (B) is removed by removing.
- the resin component (A) is not particularly limited as long as it has sufficient mechanical strength and chemical resistance for use as a filter.
- the resin suitably used as the resin component (A) includes at least one resin selected from the group consisting of polyvinylidene fluoride, polyethersulfone, polyamic acid, polyimide, polyamideimide precursor, and polyamideimide. .
- the resin component (A) contains a polyamic acid or a polyamideimide precursor, imidization treatment is performed on the composite membrane or the porous membrane after removing the particles (B), and polyamide It is preferred to convert the acid or polyamideimide precursor to polyimide or polyamideimide, respectively.
- these resins will be described.
- the polyvinylidene fluoride is not particularly limited as long as it is soluble in the solvent used for varnish formation.
- the polyvinylidene fluoride may be a homopolymer or a copolymer (copolymer).
- Examples of the structural unit to be copolymerized include ethylene, trifluorochloroethylene, tetrafluoroethylene, and hexafluoropropylene, and the mass average molecular weight is, for example, about 10,000 to 5,000,000.
- the polyethersulfone is not particularly limited as long as it is soluble in the solvent used for varnish formation.
- the polyethersulfone can be appropriately selected according to the use of the porous membrane to be produced, and may be hydrophilic or hydrophobic. Further, it may be an aliphatic polyether sulfone or an aromatic polyether sulfone.
- the mass average molecular weight is, for example, from 5,000 to 1,000,000, preferably from 10,000 to 300,000.
- polyamide acid As the polyamic acid, a product obtained by polymerizing any tetracarboxylic dianhydride and diamine can be used without any particular limitation.
- the usage-amount of tetracarboxylic dianhydride and diamine is not specifically limited, It is preferable to use 0.50 mol or more and 1.50 mol or less of diamine with respect to 1 mol of tetracarboxylic dianhydrides, and 0.60 mol More preferably, it is used in an amount of 1.30 mol or less, particularly preferably 0.70 mol or more and 1.20 mol or less.
- the tetracarboxylic dianhydride can be appropriately selected from tetracarboxylic dianhydrides conventionally used as raw materials for polyamic acid synthesis.
- the tetracarboxylic dianhydride may be an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride. From the viewpoint of the heat resistance of the resulting polyimide resin, the aromatic tetracarboxylic dianhydride may be used. Preference is given to using carboxylic dianhydrides.
- a tetracarboxylic dianhydride may be used individually by 1 type, and may be used in combination of 2 or more type.
- aromatic tetracarboxylic dianhydride examples include pyromellitic dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxy Phenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,3,3 ′, 4′- Biphenyltetracarboxylic dianhydride, 2,2,6,6-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2 , 3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-
- aliphatic tetracarboxylic dianhydride examples include, for example, ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, cyclohexane tetracarboxylic dianhydride, 1, 2, Examples include 4,5-cyclohexanetetracarboxylic dianhydride and 1,2,3,4-cyclohexanetetracarboxylic dianhydride. Among these, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride are preferable from the viewpoints of price and availability. Moreover, these tetracarboxylic dianhydrides can also be used individually by 1 type or in mixture of 2 or more types.
- the diamine can be appropriately selected from diamines conventionally used as a raw material for synthesizing polyamic acid.
- the diamine may be an aromatic diamine or an aliphatic diamine, but an aromatic diamine is preferred from the viewpoint of the heat resistance of the resulting polyimide resin. These diamines may be used alone or in combination of two or more.
- aromatic diamines include diamino compounds in which about 1 or 2 to 10 phenyl groups are bonded. Specifically, phenylenediamine and derivatives thereof, diaminobiphenyl compounds and derivatives thereof, diaminodiphenyl compounds and derivatives thereof, diaminotriphenyl compounds and derivatives thereof, diaminonaphthalene and derivatives thereof, aminophenylaminoindane and derivatives thereof, diaminotetraphenyl Compounds and derivatives thereof, diaminohexaphenyl compounds and derivatives thereof, and cardo-type fluorenediamine derivatives.
- Phenylenediamine is m-phenylenediamine, p-phenylenediamine, etc., and phenylenediamine derivatives include diamines to which alkyl groups such as methyl group and ethyl group are bonded, such as 2,4-diaminotoluene, 2,4-triphenylene. Diamines and the like.
- diaminobiphenyl compound two aminophenyl groups are bonded to each other.
- diaminobiphenyl compound two aminophenyl groups are bonded to each other.
- a diaminodiphenyl compound is a compound in which two aminophenyl groups are bonded to each other via other groups.
- the bond is an ether bond, a sulfonyl bond, a thioether bond, a bond by alkylene or a derivative group thereof, an imino bond, an azo bond, a phosphine oxide bond, an amide bond, a ureylene bond, or the like.
- the number of carbon atoms of the alkylene bond is about 1 or more and 6 or less.
- the derivative group of an alkylene group is an alkylene group substituted with one or more halogen atoms and the like.
- diaminodiphenyl compounds include 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl sulfone, 3,4′-diaminodiphenyl sulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl ketone 3,4′-diaminodiphenyl ketone, 2,2-bis (p-aminophenyl) propane, 2,2′-bis (p-aminophenyl) hexafluor
- p-phenylenediamine p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, and 4,4'-diaminodiphenyl ether are preferable from the viewpoint of price and availability.
- a diaminotriphenyl compound is a compound in which two aminophenyl groups and one phenylene group are bonded via another group. As other groups, the same groups as in the diaminodiphenyl compound are selected. Examples of diaminotriphenyl compounds include 1,3-bis (m-aminophenoxy) benzene, 1,3-bis (p-aminophenoxy) benzene, 1,4-bis (p-aminophenoxy) benzene, and the like. be able to.
- diaminonaphthalene examples include 1,5-diaminonaphthalene and 2,6-diaminonaphthalene.
- aminophenylaminoindane examples include 5 or 6-amino-1- (p-aminophenyl) -1,3,3-trimethylindane.
- diaminotetraphenyl compounds examples include 4,4′-bis (p-aminophenoxy) biphenyl, 2,2′-bis [p- (p′-aminophenoxy) phenyl] propane, 2,2′-bis [ and p- (p′-aminophenoxy) biphenyl] propane, 2,2′-bis [p- (m-aminophenoxy) phenyl] benzophenone, and the like.
- cardo-type fluorenediamine derivatives include 9,9-bisaniline fluorene.
- the number of carbon atoms in the aliphatic diamine is preferably about 2 to 15, for example.
- Specific examples of the aliphatic diamine include pentamethylene diamine, hexamethylene diamine, and heptamethylene diamine.
- a compound in which the hydrogen atom of these diamines is substituted with at least one substituent selected from the group such as a halogen atom, a methyl group, a methoxy group, a cyano group, and a phenyl group may be used.
- the means for producing the polyamic acid is not particularly limited, and for example, a known method such as a method of reacting an acid and a diamine component in a solvent can be used.
- the reaction between tetracarboxylic dianhydride and diamine is usually carried out in a solvent.
- the solvent used for the reaction of tetracarboxylic dianhydride and diamine is particularly limited as long as it can dissolve tetracarboxylic dianhydride and diamine and does not react with tetracarboxylic dianhydride and diamine. Not.
- a solvent may be used individually by 1 type and may be used in combination of 2 or more type.
- Examples of the solvent used for the reaction of tetracarboxylic dianhydride and diamine include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylformamide, N, Nitrogen-containing polar solvents such as N-diethylformamide, N-methylcaprolactam, N, N, N ′, N′-tetramethylurea; ⁇ -propiolactone, ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -valerolactone, Lactone polar solvents such as ⁇ -caprolactone and ⁇ -caprolactone; dimethyl sulfoxide; acetonitrile; fatty acid esters such as ethyl lactate and butyl lactate; diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dioxane, tetrahydrofuran, methyl cellosolve acetate
- N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylformamide, N, N-diethyl are considered because of the solubility of the resulting polyamic acid.
- Nitrogen-containing polar solvents such as formamide, N-methylcaprolactam, N, N, N ′, N′-tetramethylurea are preferred.
- the polymerization temperature is generally from ⁇ 10 ° C. to 120 ° C., preferably from 5 ° C. to 30 ° C.
- the polymerization time varies depending on the raw material composition used.
- the polymerization time is usually 3 Hr (hour) or more and 24 Hr or less.
- a polyamic acid may be used individually by 1 type, and may be used in combination of 2 or more type.
- Polyimide resin The structure and molecular weight of the polyimide resin are not limited, and a known polyimide resin can be used. About a polyimide, you may have a functional group which accelerates
- a monomer to introduce a flexible bending structure into the main chain in order to obtain a polyimide resin soluble in a solvent, such as ethylenediamine, hexamethylenediamine, 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, Aliphatic diamines such as 4,4'-diaminodicyclohexylmethane; 2-methyl-1,4-phenylenediamine, o-tolidine, m-tolidine, 3,3'-dimethoxybenzidine, 4,4'-diaminobenzanilide, etc.
- a solvent such as ethylenediamine, hexamethylenediamine, 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, Aliphatic diamines such as 4,4'-diaminodicyclohexylmethane; 2-methyl-1,4-phenylenediamine
- Aromatic diamines such as polyoxyethylene diamine, polyoxypropylene diamine and polyoxybutylene diamine; polysiloxane diamines; 2,3,3 ′, 4′-oxydiphthalic anhydride, 3,4,3 ′ , 4'-Oxydiphthalic anhydride, 2,2-bis (4-hydroxyphenyl) It is effective to use a phenyl) propanedibenzoate-3,3 ′, 4,4′-tetracarboxylic dianhydride.
- a monomer having a functional group that improves solubility in a solvent such as 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl, 2-trifluoromethyl-1,4- It is also effective to use a fluorinated diamine such as phenylenediamine.
- the same monomer as the monomer described in the column of the polyamic acid can be used in combination as long as the solubility is not inhibited.
- Each of the polyimide resin and its monomer may be used alone or in combination of two or more.
- polyimide resin there is no restriction
- known methods such as a method of chemically imidizing or heat imidizing polyamic acid can be used.
- polyimide resins include aliphatic polyimide resins (total aliphatic polyimide resins) and aromatic polyimide resins, and aromatic polyimide resins are preferred.
- aromatic polyimide resin a polyimide resin obtained by subjecting a polyamic acid having a repeating unit represented by formula (1) to a ring-closing reaction by heat or chemical means, or a polyimide resin having a repeating unit represented by formula (2) Etc.
- Ar represents an aryl group.
- the polyamide-imide resin is not limited to its structure and molecular weight, and a known polyamide-imide resin can be used.
- the polyamide-imide resin may have a condensable functional group such as a carboxy group on the side chain or a functional group that promotes a crosslinking reaction or the like during firing.
- a varnish contains a solvent
- dissolved in the solvent to be used is preferable.
- Polyamideimide resin is usually (i) a resin obtained by reacting a diisocyanate with an acid having a carboxy group and an acid anhydride group in one molecule such as trimellitic anhydride, and (ii) trimellitic anhydride chloride.
- a resin obtained by imidizing a precursor polymer (polyamideimide resin precursor) obtained by reacting a reactive derivative of the above acid with a diamine can be used without particular limitation.
- trimellitic anhydride halides such as trimellitic anhydride and trimellitic anhydride chloride, trimellitic anhydride ester, and the like.
- diamines exemplified in the above description of polyamic acid can be mentioned.
- a diaminopyridine compound can also be used.
- the arbitrary diisocyanate is not particularly limited, and examples thereof include diisocyanate compounds corresponding to the arbitrary diamines, and specific examples thereof include metaphenylene diisocyanate, p-phenylene diisocyanate, o-tolidine diisocyanate, and p-phenylene.
- the raw material monomer for the polyamide-imide resin compounds described in general formulas in JP-A-63-283705 and JP-A-2-198619 can also be used in addition to the above.
- imidation in the method (ii) may be either thermal imidization or chemical imidization.
- chemical imidization a method of immersing an unfired composite film formed using a varnish containing a polyamideimide precursor or the like in acetic anhydride or a mixed solvent of acetic anhydride and isoquinoline can be used.
- the polyamideimide precursor can also be said to be a polyimide precursor in terms of a precursor before imidization.
- the polyamideimide resin to be contained in the varnish (1) a polymer obtained by reacting an acid such as trimellitic anhydride with diisocyanate, and (2) a reactive derivative of the above acid such as trimellitic anhydride chloride; It may be a polymer obtained by imidizing a precursor polymer obtained by reaction with diamine.
- the “polyamideimide precursor” means a polymer (precursor polymer) before imidization.
- Each of the polyamideimide resin and the polyamideimide precursor may be used alone or in combination of two or more.
- each of the said polymer, raw material monomer, and oligomer may be used individually by 1 type, and may be used in combination of 2 or more type.
- the material of the particles (B) is not particularly limited as long as it is insoluble in the solvent contained in the varnish and can be removed from the composite film composed of the resin component (A) and the particles (B) later. It can be adopted.
- inorganic materials include metal oxides such as silica (silicon dioxide), titanium oxide, and alumina (Al 2 O 3 ), and organic materials include high molecular weight olefins (polypropylene, polyethylene, etc.), polystyrene, acrylic resins ( Examples thereof include organic polymer fine particles such as methyl methacrylate, isobutyl methacrylate, polymethyl methacrylate (PMMA), epoxy resin, cellulose, polyvinyl alcohol, polyvinyl butyral, polyester, and polyether.
- silica such as colloidal silica is preferable as the inorganic material, and acrylic resin, particularly PMMA is preferable as the organic material. It is preferable to use spherical particles made of such a material as the particles (B) because it is easy to form fine pores having a curved surface on the inner surface in the porous membrane.
- grains (B) may be suitably selected according to the objective from a normal linear polymer or a well-known depolymerizable polymer, for example.
- a normal linear polymer is a polymer in which polymer molecular chains are randomly cut during thermal decomposition
- a depolymerizable polymer is a polymer in which the polymer is decomposed into monomers during thermal decomposition. Any of them can be removed from the composite membrane by decomposing into monomers, low molecular weight substances, or CO 2 upon heating.
- the decomposition temperature of the resin used as the material of the particles (B) is preferably 200 ° C. or higher and 320 ° C. or lower, and more preferably 230 ° C.
- decomposition temperature is 200 ° C. or higher, film formation can be performed even when a high-boiling solvent is used for the varnish, and there is a wide range of selection of baking conditions when a polyimide resin or a polyamideimide resin is generated by baking. Moreover, if decomposition temperature is 320 degrees C or less, particle
- the thermal decomposition temperature is low and the handling at the time of pore formation is easy, so a homopolymer of methyl methacrylate or isobutyl methacrylate (polymethyl methacrylate or polyisobutyl methacrylate), or methyl methacrylate
- a copolymer mainly composed of units derived from isobutyl methacrylate is preferable.
- the particle diameter (average diameter) of the particles (B) is, for example, preferably 800 nm or more and 3500 nm or less, more preferably 900 nm or more and 3000 nm or less, and particularly preferably more than 2000 nm and 2500 nm or less.
- the particle size distribution index (d25 / 75) of the particles (B) may be 1 or more and 6 or less, preferably 1.1 or more and 5 or less, and more preferably 1.2 or more and 4 or less.
- the composite film can be efficiently filled with the particles (B), and therefore, the communication hole that is a flow path for the viscous liquid is formed well.
- d25 and d75 are values of particle diameters where the cumulative frequency of particle size distribution is 25% and 75%, respectively. In this specification, d25 is the larger particle diameter.
- the particles (B1) used for the first varnish and the particles (B2) used for the second varnish are the same, May be different.
- the particle size distribution index of the particles (B1) is preferably equal to or less than the particle size distribution index of the particles (B2).
- the sphericity of the particles (B1) is preferably equal to or less than the sphericity of the particles (B2).
- the particle diameter (average diameter) of the particles (B1) is preferably smaller than the particle diameter of the particles (B2). In this case, it is easy to increase the strength of the porous film while making the opening ratio on the surface of the porous film high and uniform.
- the varnish may further contain a dispersant together with the particles (B) for the purpose of uniform dispersion of the particles (B).
- the varnish contains a dispersant, the resin component (A) and the particles (B) can be mixed more uniformly. Further, the particles (B) can be uniformly distributed in the coating film formed using the varnish. Can be distributed. As a result, it is possible to form a communication hole that efficiently communicates the front and back surfaces of the porous membrane so as to provide a dense opening on the surface of the finally obtained porous membrane and improve the air permeability of the porous membrane. .
- the dispersant is not particularly limited, and can be appropriately selected from known dispersants.
- suitable dispersants include palm fatty acid salt, castor sulfated oil salt, lauryl sulfate salt, polyoxyalkylene allyl phenyl ether sulfate salt, alkylbenzene sulfonic acid, alkylbenzene sulfonate, alkyl diphenyl ether disulfonate, alkyl Anionic surfactants such as naphthalene sulfonate, dialkyl sulfosuccinate, isopropyl phosphate, polyoxyethylene alkyl ether phosphate, polyoxyethylene allyl phenyl ether phosphate; oleylamine acetate, lauryl pyridinium chloride, cetyl pyridinium chloride, lauryl Trimethylammonium chloride, stearyltrimethylammonium chloride, behenyltrimethylammonium chloride And
- Nonionic surfactants Fatty acid alkyl esters such as octyl stearate and trimethylolpropane tridecanoate; Polyether polyols such as polyoxyalkylene butyl ether, polyoxyalkylene oleyl ether and trimethylolpropane tris (polyoxyalkylene) ether .
- the dispersant is not limited to these.
- the said dispersing agent can also be used in mixture of 2 or more types.
- solvent (S) The type of the solvent (S) is not particularly limited as long as it can dissolve the resin component (A) and does not dissolve the particles (B).
- examples of the solvent (S) include the solvents exemplified as the solvent used for the reaction between tetracarboxylic dianhydride and diamine.
- a solvent (S) may be used independently and may be used in combination of 2 or more type.
- examples of the solvent include the above nitrogen-containing polar solvents, lower alkyl ketones such as methyl ethyl ketone, acetone, and tetrahydrofuran, and trimethyl phosphate.
- the solvent includes, in addition to the above nitrogen-containing polar solvent, diphenylsulfone, dimethylsulfone, dimethylsulfoxide, benzophenone, tetrahydrothiophene-1,1-dioxide, 1,3-dimethyl- Examples include polar solvents such as 2-imidazolidinone.
- the varnish is an antistatic agent, a flame retardant, a chemical imidizing agent, a condensing agent, for the purpose of antistatic, imparting flame retardancy, low temperature baking, imparting releasability, improving coatability, etc.
- Known components such as a release agent and a surface conditioner may be appropriately included as necessary.
- the varnish contains the resin component (A), the particles (B), and the solvent (S).
- the method for producing the varnish is not particularly limited as long as the method can produce a varnish in which the resin component (A) is dissolved in the solvent (S) and the particles (B) are dispersed in the solvent (S).
- the monomer may be polymerized in the solvent (S) to produce the resin component (A), or the resin component (A) may be dissolved in the solvent (S).
- the polymerization reaction may be performed in the presence of the particles (B) or in the absence of the particles (B).
- the viscosity of the varnish is preferably 2.0 Pa ⁇ s or more. This viscosity is a value measured at 25 ° C. using an E-type viscometer.
- the viscosity of the varnish has some influence on the dispersion state of the particles (B) in the coating film formed using the varnish, and a porous film having communication holes in a shape that can easily remove bubbles is formed. It is guessed.
- the viscosity of the varnish is more preferably 2.0 Pa ⁇ s or more, and particularly preferably 2.3 Pa ⁇ s or more and 4.9 Pa ⁇ s or less. Further, the viscosity of the varnish is preferably 2.0 Pa ⁇ s or more, more preferably 2.3 Pa ⁇ s or more, and 2.5 Pa or more from the viewpoints of applicability and uniformity of the thickness of the porous film to be formed. -S or more is particularly preferable.
- the method for adjusting the viscosity of the varnish is not particularly limited, but the content of the resin component (A), the type of the resin component (A), the content of the particles (B), the particle diameter of the particles (B), the solvent (S) It is preferable to adjust by changing at least one of the content and the type of the solvent (S).
- the solid content concentration of the varnish is preferably 25% by mass or more.
- the solid content concentration of the varnish is particularly preferably 40% by mass or less.
- a varnish having a solid content concentration of 25% by mass or more it is particularly easy to form a porous film that easily removes bubbles in a viscous liquid.
- the solid content concentration of the varnish is 40% by mass or less, it is easy to apply the varnish to the substrate, and it is easy to form a porous film having a uniform film thickness.
- the ratio V A of the volume V B of particles (B): is V B, 15: 85 ⁇ 40 : 60 is preferred.
- the resin component (A) and the particles (B) are blended in the varnish at such a ratio, it is easy to disperse the particles (B) uniformly in the varnish while preventing aggregation of the particles (B). It is easy to form a porous film having a uniform opening on the surface.
- the coating film thickness is, for example, from 1 ⁇ m to 500 ⁇ m, preferably from 5 ⁇ m to 100 ⁇ m, and preferably from 10 ⁇ m to 50 ⁇ m.
- a release layer may be provided on the substrate as necessary. Further, in the production of the composite film, an immersion step in a solvent containing water, a pressing step, and a drying step after the immersion step may be provided as optional steps before the firing step described later.
- the release layer can be produced by applying a release agent on a substrate and then drying or baking.
- a known mold release agent such as an ammonium alkylphosphate salt, a fluorine-based resin, or silicone can be used without particular limitation.
- the release agent remains slightly on the peeled surface of the composite film. Since this remaining mold release agent can affect the wettability of the porous membrane surface and contamination with impurities, it is preferable to remove this.
- the composite film peeled from the substrate is preferably washed using an organic solvent or the like.
- the cleaning method can be selected from known methods such as a method of removing the composite membrane after immersing it in a cleaning solution, and a method of spraying a cleaning solution on the composite membrane and performing shower cleaning. Further, the washed composite membrane is dried.
- a drying method a known method such as air-drying the washed composite membrane at room temperature or heating the composite membrane to an appropriate set temperature in a thermostatic bath can be applied without limitation. At the time of drying, for example, a method can be adopted in which the end of the composite film is fixed to a SUS mold or the like to prevent deformation.
- the step of forming the release layer and the cleaning process of the unfired composite film can be omitted.
- the first varnish is applied as it is on a substrate such as a glass substrate, and the temperature is from 0 ° C. to 120 ° C. (preferably 0 ° C. under normal pressure or vacuum).
- the first composite film is formed by drying at a normal pressure of 10 ° C. or higher and 100 ° C. or lower (more preferably 10 ° C. or higher and 90 ° C. or lower).
- the film thickness of the first composite film is preferably 1 ⁇ m or more and 5 ⁇ m or less.
- a second varnish is applied on the first composite film, and similarly, 0 ° C. or higher and 80 ° C. or lower (preferably 0 ° C. or higher and 50 ° C. or lower), more preferably normal pressure of 10 ° C. or higher and 80 ° C. or lower. Drying is performed (more preferably 10 ° C. or more and 30 ° C. or less) to form a second composite film, thereby obtaining a composite film that is a two-layer laminated film.
- the film thickness of the second composite film is preferably 5 ⁇ m or more and 50 ⁇ m or less.
- the composite membrane obtained according to the above method is then subjected to a removal step described later.
- the resin component (A) contains polyamic acid, a polyamideimide precursor, or the like
- the composite film is fired before removing the fine particles (B), if necessary, and included in the resin component (A).
- the polyamic acid or the polyamideimide precursor may be converted into a polyimide resin or a polyamideimide resin, respectively.
- Calcination temperature varies depending on the structure of the polyamic acid or polyamideimide precursor contained in the composite film and the presence or absence of a condensing agent.
- the firing temperature is usually preferably 120 ° C. or higher and 400 ° C. or lower, more preferably 150 ° C. or higher and 375 ° C. or lower.
- Calcination does not necessarily have to be clearly separated from the drying process.
- the temperature is raised from room temperature to 375 ° C. in 3 hours and then held at 375 ° C. for 20 minutes, or from room temperature to 375 ° C. in steps of 50 ° C. (each A stepwise drying-thermal imidization method can be used, such as holding for 20 minutes) and finally holding at 375 ° C. for 20 minutes.
- a method may be employed in which the end of the unfired composite film is fixed to a SUS mold or the like to prevent deformation.
- the thickness of the composite film can be obtained by measuring and averaging the thickness of a plurality of locations with a micrometer or the like.
- the average thickness is preferably thinner, for example, may be 1 ⁇ m or more, preferably 5 ⁇ m or more and 500 ⁇ m or less, and more preferably 8 ⁇ m or more and 100 ⁇ m or less.
- a porous membrane having micropores By removing the particles (B) from the composite membrane by selecting an appropriate method, a porous membrane having micropores can be produced with good reproducibility.
- the porous membrane can be obtained by treating the composite membrane with low-concentration hydrogen fluoride water (HF) or the like and dissolving and removing silica from the composite membrane.
- HF hydrogen fluoride water
- the particles (B) are resin fine particles
- the composite film is heated to a temperature not lower than the thermal decomposition temperature of the resin fine particles and lower than the thermal decomposition temperature of the resin component (A). Can be removed and removed from the composite membrane.
- the porous film obtained after the removal step contains a polyamic acid or a polyamideimide precursor as the resin component (A), an imide ring is generated by ring-closing the polyamic acid or the polyamideimide precursor to the porous film.
- Examples of such treatment include the above-described firing treatment.
- Chemical etching may be further performed on the composite film or the porous film formed as described above. By performing chemical etching, the aperture ratio of the porous membrane surface can be increased. In particular, when chemical etching is performed on the porous film, a plurality of holes derived from the particles (B) are communicated well, and a communication hole having a preferable shape is easily formed. It does not specifically limit as a chemical etching method, For example, a conventionally well-known method can be used.
- Examples of the chemical etching method include treatment with a chemical etching solution such as an inorganic alkali solution or an organic alkali solution.
- a chemical etching solution such as an inorganic alkali solution or an organic alkali solution.
- Inorganic alkaline solutions are preferred.
- examples of inorganic alkaline solutions include hydrazine solutions containing hydrazine hydrate and ethylenediamine, solutions of alkali metal hydroxides such as potassium hydroxide, sodium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia solutions, alkali hydroxides And an etching solution mainly containing hydrazine and 1,3-dimethyl-2-imidazolidinone.
- Organic alkaline solutions include primary amines such as ethylamine and n-propylamine; secondary amines such as diethylamine and di-n-butylamine; tertiary amines such as triethylamine and methyldiethylamine; dimethylethanolamine And alcohol amines such as triethanolamine; quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; and alkaline solutions such as cyclic amines such as pyrrole and pihelidine.
- primary amines such as ethylamine and n-propylamine
- secondary amines such as diethylamine and di-n-butylamine
- tertiary amines such as triethylamine and methyldiethylamine
- dimethylethanolamine And alcohol amines such as triethanolamine
- quaternary ammonium salts such as tetra
- pure water and alcohols can be selected as appropriate.
- a solvent to which an appropriate amount of a surfactant is added can also be used.
- the alkali concentration is, for example, 0.01% by mass or more and 20% by mass or less.
- the composite film or the porous film formed as described above may be physically removed separately from or together with the chemical etching.
- the physical removal method include dry etching using plasma (oxygen, argon, etc.), corona discharge, or the like. By this method, the resin component (A) in the porous film is partially removed, and the same curing as the above chemical etching is obtained.
- the obtained porous film has spherical pores having an average diameter of 800 nm or more and 3500 nm or less (preferably 900 nm or more and 3000 nm or less, more preferably more than 2000 nm and 2500 nm or less).
- a hole diameter of a portion (communication hole) where spherical holes are connected it is preferable to include a communication hole of 50 nm or more and 2000 nm or less, more preferably 500 nm or more and 1800 nm or less, and a communication hole of more than 1000 nm and 1300 nm or less. It is particularly preferable that it is included.
- the average pore diameter of the communication holes measured by a porosimeter is preferably 500 nm or more and 2000 nm or less, more preferably 900 nm or more and 1800 nm or less, and further preferably 1000 nm or more and 1500 nm or less.
- the porosity of the obtained porous film is, for example, 50% or more and 90% or less, and preferably 60% or more and 85% or less.
- a viscous liquid is a liquid whose viscosity measured at 25 ° C. using an E-type viscometer is 0.1 Pa ⁇ s or more and does not dissolve or deteriorate the filter when contacted for several minutes to 1 hour. If it does not specifically limit.
- gas is not easily released from the liquid naturally due to the viscosity, and bubbles are present stably.
- bubbles may be generated in the viscous liquid if a flow that entrains the gas occurs.
- the viscous liquid is filtered using the porous film formed by the above-described method, the number of bubbles in the viscous liquid can be effectively reduced.
- the viscosity measured by an E-type viscometer at 25 ° C. is 0.15 Pa ⁇ s or more, preferably 0.7 Pa ⁇ s or more, more preferably 1 Pa ⁇ s or more, and further preferably This is particularly effective for reducing the number of bubbles in a viscous liquid of 1.5 Pa ⁇ s or more.
- the upper limit of the viscosity of the viscous liquid is not particularly limited as long as it can be filtered by a filter, but is preferably 8.0 Pa ⁇ s or less, and more preferably 7.0 Pa ⁇ s or less. If the viscosity is excessively high, filtration with a filter may be difficult in the first place.
- the first purification method is preferably used for purification of a liquid curable material used for forming an insulating film, an antireflection film, an adhesive layer, and a hard coat, for example.
- a liquid curable material used for forming an insulating film, an antireflection film, an adhesive layer, and a hard coat, for example.
- bubbles are included in such a liquid curable material, defects in appearance occur in the formed insulating film, antireflection film, adhesive layer, hard coat, and the like.
- the insulating layer, the antireflection film, the adhesive layer, the hard coat, etc. are transparent layers, in the display device or optical device including these layers, bubbles cause unwanted light scattering or refraction, May degrade performance.
- a photoresist composition is also preferable as an object to be purified by the first purification method. Bubbles in the photoresist composition become defects in the patterned film formed using the photoresist composition. In addition, if bubbles exist in the photoresist composition, when the photoresist composition is applied to the substrate, the bubble portion remains in the coating film, resulting in coating unevenness such as a reduction in the thickness of the portion. Cheap.
- the composition of the photoresist composition is not particularly limited, and may be a negative type or a positive type.
- a raw material chemical solution such as a resin solution used for the curable material, the photoresist composition or the like is also preferable.
- a raw chemical solution having a high concentration and a high viscosity can be purified to effectively reduce the number of bubbles in the liquid.
- the viscous liquid is filtered using a filter including a porous membrane produced by the method described above.
- the viscous liquid is transmitted from one side of the filter to the other side. Such permeation is typically performed by creating a differential pressure between one side of the filter and the other side.
- Examples of the method of using the porous membrane as a filter in the first purification method include a method using a planar porous membrane and a method using a porous membrane processed into a pipe shape. It is preferable that the pipe-like porous membrane has a pleated shape because the contact area between the viscous liquid and the filter increases. As will be described later, the porous membrane is appropriately sealed so that the supply liquid and the filtrate are not mixed.
- the purification of the viscous liquid can be performed by using the above-described porous membrane without differential pressure, that is, by natural filtration by gravity, but is preferably performed by differential pressure.
- the method for generating the differential pressure is not particularly limited as long as a pressure difference is provided between one side and the other side of the porous membrane.
- a method for generating the differential pressure normally, one side of the porous membrane (supply liquid side) is pressurized (positive pressure), and one side of the porous membrane (filtrate side) is negative pressure Reduced pressure (negative pressure) and the like, and pressurization is preferred.
- Pressurization is the application of pressure to the polyimide resin porous membrane side (supply liquid side) where there is a liquid before passing through the porous film (sometimes referred to as “supply liquid” in this specification). is there.
- the fluid flow pressure can be generated by an active fluid pressure application method such as a pump (liquid feed pump, circulation pump, etc.).
- the pump include a rotary pump, a diaphragm pump, a metering pump, a chemical pump, a plunger pump, a bellows pump, a gear pump, a vacuum pump, an air pump, and a liquid pump.
- the flowing liquid pressure may be, for example, a pressure applied to the porous film by the liquid when the liquid is allowed to permeate the porous film only according to gravity. It is preferable that pressure is applied by the above-described positive fluid pressure application method.
- the gas used for pressurization is preferably a gas that is inert or non-reactive with respect to the supply liquid, and specifically includes nitrogen or a rare gas such as helium or argon.
- pressurization is preferred. In that case, the side that collects the liquid that has permeated through the porous membrane may be at atmospheric pressure without decompression.
- a positive pressure by gas is preferable.
- the pressurization may be performed via a pressurization valve or a valve such as a pressurization valve or a three-way valve.
- the reduced pressure is a reduced pressure on the side (filtrate side) collecting the liquid that has passed through the polyimide resin porous membrane.
- the reduced pressure may be reduced by a pump, for example. It is preferable to reduce the pressure to a vacuum.
- the pump is usually disposed between the supply liquid tank (or the circulation tank) and the porous membrane.
- the pressurization may utilize both the flowing liquid pressure and the positive pressure of the gas.
- the differential pressure may be a combination of pressurization and reduced pressure.
- the pressurization may use, for example, both the flowing liquid pressure and the reduced pressure, may use both the positive pressure and the reduced pressure of the gas, or uses the flowing liquid pressure and the positive pressure and the reduced pressure of the gas. May be.
- the combination of the flowing fluid pressure and the positive pressure of the gas and the combination of the flowing fluid pressure and the reduced pressure are preferable from the viewpoint of simplification of production.
- the pressure difference applied before and after the porous membrane by providing the differential pressure is the thickness, porosity or average pore diameter of the porous membrane to be used, or the desired degree of purification, flow rate, flow rate, or concentration of the supply liquid What is necessary is just to set suitably by a viscosity etc.
- the differential pressure is preferably 3 MPa or less, for example.
- the differential pressure is preferably 1 MPa or less, for example. If the differential pressure is excessively high, bubbles may be generated in the viscous liquid during filtration. When the differential pressure is within the above range, it is easy to filter viscous liquid without generating bubbles.
- the lower limit of the differential pressure is not particularly limited, and is, for example, 10 Pa.
- the temperature during filtration may be set as appropriate, for example, in the range of 0 ° C. to 30 ° C., preferably 25 ° C.
- About filtration temperature you may provide a temperature gradient by the time difference of filtration, and you may provide a temperature difference by the supply liquid side and a filtrate side.
- the porous membrane pre-wet the porous membrane with a liquid different from the viscous liquid before supplying the viscous liquid to the porous membrane.
- a liquid different from the viscous liquid By pre-wetting, the wettability between the viscous liquid and the porous membrane is improved, the filtration speed of the viscous liquid is expected to be improved, and the effect of reducing bubbles is increased.
- the liquid used for prewetting include alcohols such as methanol, ethanol, and isopropyl alcohol, or ketones such as acetone and methyl ethyl ketone, and water.
- the liquid used for pre-wetting may be another organic solvent, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol-n-propyl ether, ethylene glycol mono -N-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol mono Ethyl ether, propylene glycol mono-n-propyl ether, propylene glycol Non-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol mono-n
- (Poly) alkylene Recall monoalkyl ether acetates; other ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran; ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone; methyl 2-hydroxypropionate; Lactic acid alkyl esters such as ethyl 2-hydroxypropionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropionic acid Ethyl, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methyl-3-methoxybutylacetate Tate, 3-methyl-3-methoxybutylpropionate
- the liquid used for prewetting can be used individually or in combination of 2 or more types.
- the liquid used for prewetting is preferably a solvent containing one or more of the solvents contained in the viscous liquid, and more preferably the same solvent as the solvent contained in the viscous liquid.
- the method for contacting the pre-wetting liquid and the porous membrane before allowing the supply liquid to permeate is not particularly limited as long as the pre-wetting liquid and the porous membrane can be brought into contact with each other.
- a method of impregnating the porous film with the pre-wetting liquid by immersing the porous film in the pre-wetting liquid can be mentioned.
- the contact between the prewetting liquid and the porous film before allowing the viscous liquid to permeate may be performed by the above-described differential pressure.
- the range of the differential pressure is, for example, about 1 KPa or more and 0.25 MPa or less.
- the prewetting may be performed under pressure. When pressurizing, it is preferable to carry out in the range of 0.01 MPa or more and 0.25 MPa or less.
- the bubbles in the viscous liquid can be removed while preventing the generation of bubbles during the filtration.
- the porous membrane can be used as, for example, filter media or other filter media.
- the porous membrane may be used alone or as a filter media and used as another functional layer (membrane). May be given.
- the porous membrane may be used as a membrane to be combined with other filter media.
- the porous membrane can be used as a membrane used in a filter device or the like.
- the functional layer that can be used in combination with the porous membrane is not particularly limited.
- nylon membrane polytetrafluoroethylene (PTFE) membrane, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA) membrane, or these
- a film having a chemical or physicochemical function such as a film modified with.
- the second purification method is a liquid purification method including filtering a viscous liquid having a viscosity of 0.1 Pa ⁇ s or more through a filter,
- the filter includes a porous membrane having communication holes including a structure in which spherical holes or substantially spherical holes communicate with each other.
- the method for producing a porous membrane used as a filter in the second purification method is not particularly limited.
- the porous film including the predetermined structure is manufactured by the method described for the first manufacturing method.
- the second purification method while the viscous liquid is filtered using a porous membrane having a communication hole including a structure in which spherical holes or substantially spherical holes are connected to each other as a filter, generation of bubbles during filtration is prevented.
- the number of bubbles in the viscous liquid can be reduced.
- the viscous liquid to be purified by the second purification method is the same as the method described for the first purification method.
- the viscous liquid filtration method in the second purification method is also the same as the method described for the first purification method.
- silica (1) is about 1.5 and silica (2) is 1.6 or more.
- -Polyamic acid solution Reaction product of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether (organic solvent: N, N-dimethylacetamide) Organic solvent (1): N, N-dimethylacetamide (DMAc) Organic solvent (2): gamma butyrolactone Dispersant: polyoxyethylene secondary alkyl ether dispersant Dispersion: silica (1): silica with an average particle diameter of 2500 nm Silica (2): silica etching with an average particle diameter of 3500 nm Liquid: Tetramethylammonium hydroxide (TMAH) 5 mass% solution in a mixed solution of isopropyl alcohol: water (mass ratio 6: 4)
- TMAH Tetramethylammonium hydroxide
- the volume ratio of the polyamic acid and silica in the obtained varnish is 40:60 (mass ratio is 30:70), and solid content concentration (concentration of polyamic acid and silica) is 33 mass%.
- the viscosity was 4.0 Pa ⁇ s.
- the unfired composite film is peeled from the substrate to obtain an unfired composite film, and subjected to heat treatment (firing) at 400 ° C. for 15 minutes.
- heat treatment firing
- imidization was performed to obtain a polyimide-fine particle composite film.
- the obtained polyimide-fine particle composite film was immersed in a 20% HF solution to remove fine particles contained in the film, and then washed with water and dried to obtain a polyimide porous film. Further, the opening diameter and the communication holes on the surface of the polyimide porous membrane were expanded using an etching solution, washed with water and dried, and then heat-treated again at 350 ° C. for 15 minutes.
- a polyimide porous membrane 1 having a film thickness of about 40 ⁇ m, an air permeability of 20 seconds or less, a porosity of about 70%, and an average pore diameter of 2500 nm was obtained.
- the average diameter of the communication holes confirmed by the porosimeter was 1000 nm.
- Example 2 A polyimide porous membrane 2 was obtained in the same manner as in Example 1 except that silica (2) was used instead of silica (1).
- the final varnish viscosity was 4.1 Pa ⁇ s.
- the polyimide porous membrane 2 had a thickness of about 40 ⁇ m, an air permeability of 20 seconds or less, a porosity of about 70%, and an average pore diameter of 3500 nm.
- the polyimide porous membrane 2 had a communication hole exceeding 1000 nm.
- Example 1 A varnish was prepared in the same manner as in Example 1 except that the final varnish viscosity was adjusted to about 1.5 Pa ⁇ s.
- the varnish of Comparative Example 1 since a sea island was generated after pre-baking, a polyimide porous film could not be formed.
- Example 3 Using a filter device provided with the polyimide porous membrane 1 obtained in Example 1 as a filter, at room temperature and under the conditions shown in Table 1, the resist composition for the plating process (viscosity (25 ° C., E-type viscometer ): 3.9 Pa ⁇ s, manufactured by Tokyo Ohka Kogyo Co., Ltd., containing propylene glycol monomethyl ether acetate (PGMEA)).
- the resist composition for the plating process viscosity (25 ° C., E-type viscometer ): 3.9 Pa ⁇ s, manufactured by Tokyo Ohka Kogyo Co., Ltd., containing propylene glycol monomethyl ether acetate (PGMEA)
- PGMEA propylene glycol monomethyl ether acetate
- a filter device comprising a filter.
- Discharge solution piping connecting the discharge port of the filter device and the resist solution tank.
- a three-way valve for sampling provided in the middle of the discharge liquid piping. Filtration conditions are as described in Table 1. Before starting filtration, the filter was pre-wet by passing about 4 L of PGMEA through the filter under a pressure of 0.02 MPa.
- Sample 1 and sample 2 were evaluated for reduction of the number of foreign substances and reduction of the number of bubbles according to the following method.
- the coating film was pre-baked at 140 ° C. for 300 seconds, and a film having a thickness of about 38 ⁇ m was observed with NSX-220 (manufactured by Rudolf). The number of foreign matters and the number of bubbles per unit area were counted. The same evaluation was performed on the resist composition before filtration.
- Example 2 The resist composition was filtered in the same manner as in Example 3 except that the filter was changed to a filter made of PTFE fibers having an average pore diameter of 1 ⁇ m (1000 nm) and the filtration conditions were changed to the conditions shown in Table 1. Processed. When the number of bubbles in the resist composition obtained after filtration was confirmed by the same method as in Example 3, it was confirmed that Sample 1 and Sample 2 were reduced in the number of foreign substances. However, in sample 1, a reduction in the number of bubbles from the resist composition before filtration could not be confirmed, and in sample 2, the number of bubbles increased to about 100 times the number of bubbles before filtration.
- Example 4 Using a filter device provided with the polyimide porous membrane 1 obtained in Example 1 as a filter, at room temperature and under the conditions shown in Table 2, a resist composition (viscosity (25 ° C., E-type viscometer) ): 1.0 Pa ⁇ s, Tokyo Ohka Kogyo Co., Ltd., containing propylene glycol monomethyl ether acetate (PGMEA) and 3-methoxybutyl acetate (MA)) was filtered. As a test apparatus, an apparatus having the following configurations 1) to 6) was used. 1) Resist solution tank. 2) A liquid supply pipe connecting the resist liquid tank and the liquid supply port of the filter device.
- a resist composition viscosity (25 ° C., E-type viscometer)
- PMEA propylene glycol monomethyl ether acetate
- MA 3-methoxybutyl acetate
- a liquid supply pump provided in the middle of the liquid supply pipe for supplying liquid to the filter while generating a differential pressure (filtration pressure).
- a filter device comprising a filter.
- Discharge solution piping connecting the discharge port of the filter device and the resist solution tank.
- a three-way valve for sampling provided in the middle of the discharge liquid piping. Filtration conditions are as described in Table 2.
- the resist composition 12L was supplied to the filter device while circulating a part of the resist composition through a circulation system including a resist solution tank, a solution supply pipe, a filter device, and a discharge liquid pipe.
- a 100 mL sample of the filtrate at the time of 12 L supply was collected from the three-way valve. This sample was designated as sample 3.
- Sample 3 was evaluated for the reduction in the number of foreign substances and the reduction in the number of bubbles in the same manner as in Example 3.
- the number of foreign matters and the number of bubbles were evaluated in the same manner as in Example 3.
- a decrease in the number of foreign matters was observed in Sample 3.
- the number of bubbles in sample 3 was reduced to about 6% of the number of bubbles in the resist composition before filtration, and the number of foreign matters was reduced to about 2% of the number of bubbles in the resist composition before filtration.
- Example 3 Evaluation was performed in the same manner as in Example 4 except that the filter in the test apparatus was changed to PTFE nonwoven fabric. Unlike Example 3, the number of bubbles in the sample was not reduced (about 80% of the number of bubbles in the resist composition before filtration remained), and the number of foreign matters was also about 41% of the number of foreign matters in the resist composition before filtration. It was only reduced to.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Water Supply & Treatment (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Degasification And Air Bubble Elimination (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020227032524A KR102508570B1 (ko) | 2016-08-03 | 2017-07-31 | 액체의 정제 방법, 및 다공질막의 제조 방법 |
KR1020197004287A KR102447053B1 (ko) | 2016-08-03 | 2017-07-31 | 액체의 정제 방법, 및 다공질막의 제조 방법 |
CN201780047301.1A CN109562323B (zh) | 2016-08-03 | 2017-07-31 | 液体的纯化方法及多孔膜的制造方法 |
JP2018531875A JP6835848B2 (ja) | 2016-08-03 | 2017-07-31 | 液体の精製方法、及び多孔質膜の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-153112 | 2016-08-03 | ||
JP2016153112 | 2016-08-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018025790A1 true WO2018025790A1 (ja) | 2018-02-08 |
Family
ID=61072678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/027618 WO2018025790A1 (ja) | 2016-08-03 | 2017-07-31 | 液体の精製方法、及び多孔質膜の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6835848B2 (zh) |
KR (2) | KR102508570B1 (zh) |
CN (1) | CN109562323B (zh) |
TW (1) | TWI804471B (zh) |
WO (1) | WO2018025790A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200094214A (ko) * | 2018-03-22 | 2020-08-06 | 후지필름 가부시키가이샤 | 여과 장치, 정제 장치, 약액의 제조 방법 |
CN108371846B (zh) * | 2018-03-30 | 2023-09-26 | 江苏新凯晟机械设备有限公司 | 气液分离装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62267340A (ja) * | 1986-05-01 | 1987-11-20 | ポ−ル・コ−ポレ−ション | ポリビニリデンジフルオライド構造体とその製造方法 |
JP2007012974A (ja) * | 2005-07-01 | 2007-01-18 | Shin Etsu Chem Co Ltd | レジスト膜の成膜方法 |
JP2015502840A (ja) * | 2011-11-03 | 2015-01-29 | ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティドW.L. Gore & Associates, Incorporated | 非架橋エチレンビニルアルコールコポリマーを用いて親水性化された複合ptfe膜 |
JP2015165005A (ja) * | 2014-02-28 | 2015-09-17 | ポール・コーポレーションPallCorporation | 高空隙容積を有する多孔質ポリマー膜 |
WO2016027825A1 (ja) * | 2014-08-20 | 2016-02-25 | 東京応化工業株式会社 | 多孔質ポリイミド膜製造用ワニス及びそれを用いた多孔質ポリイミド膜の製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07233273A (ja) * | 1994-02-24 | 1995-09-05 | Nitto Denko Corp | フッ素樹脂多孔質フィルムの製造法 |
CN1511874A (zh) * | 2002-12-30 | 2004-07-14 | 中国科学院化学研究所 | 有序孔聚合物膜及其制备方法 |
JP2006281021A (ja) | 2005-03-31 | 2006-10-19 | Toray Ind Inc | 濾過装置とそれを用いた塗布装置および塗布方法並びにディスプレイ用部材の製造方法 |
AU2006345112B2 (en) * | 2006-06-27 | 2011-06-16 | Toray Industries, Inc. | Polymer separation membrane and process for producing the same |
JP5176775B2 (ja) * | 2008-06-02 | 2013-04-03 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
WO2010021474A2 (ko) * | 2008-08-20 | 2010-02-25 | 주식회사 코오롱 | 다공성 막 및 그 제조방법 |
JP4879253B2 (ja) | 2008-12-04 | 2012-02-22 | 東京エレクトロン株式会社 | 処理液供給装置 |
CN201392451Y (zh) * | 2009-04-29 | 2010-01-27 | 西安煤航印刷材料有限责任公司 | 一种ps版生产过程中的涂布供胶、排气装置 |
CN101607178B (zh) * | 2009-06-16 | 2011-11-09 | 天津工业大学 | 一种中空纤维多孔膜的制备方法 |
JP5605566B2 (ja) * | 2010-11-18 | 2014-10-15 | 公立大学法人首都大学東京 | 多孔質ポリイミド膜の製造方法 |
WO2013086498A1 (en) * | 2011-12-09 | 2013-06-13 | Emd Millipore Corporation | High viscosity tff device design |
KR20160031037A (ko) * | 2013-04-22 | 2016-03-21 | 도오꾜오까고오교 가부시끼가이샤 | 다공질 폴리이미드막의 제조 방법, 다공질 폴리이미드막, 및 그것을 사용한 세퍼레이터 |
PL3016175T3 (pl) * | 2013-06-27 | 2019-05-31 | Asahi Chemical Ind | Separator dla baterii z niewodnym elektrolitem oraz bateria z niewodnym elektrolitem |
CN105392553B (zh) * | 2013-07-18 | 2017-06-23 | 可乐丽股份有限公司 | 亲水化偏二氟乙烯类多孔中空纤维膜及其制造方法 |
KR101690916B1 (ko) * | 2013-08-08 | 2016-12-28 | 도오꾜오까고오교 가부시끼가이샤 | 다공질 폴리이미드계 수지막의 제조 방법, 다공질 폴리이미드계 수지막 및 그것을 사용한 세퍼레이터 |
US9302228B2 (en) * | 2014-02-28 | 2016-04-05 | Pall Corporation | Charged porous polymeric membrane with high void volume |
WO2016039299A1 (ja) | 2014-09-10 | 2016-03-17 | 東京応化工業株式会社 | 多孔質ポリイミド膜の製造方法 |
-
2017
- 2017-07-31 KR KR1020227032524A patent/KR102508570B1/ko active IP Right Grant
- 2017-07-31 KR KR1020197004287A patent/KR102447053B1/ko active IP Right Grant
- 2017-07-31 WO PCT/JP2017/027618 patent/WO2018025790A1/ja active Application Filing
- 2017-07-31 JP JP2018531875A patent/JP6835848B2/ja active Active
- 2017-07-31 CN CN201780047301.1A patent/CN109562323B/zh active Active
- 2017-08-02 TW TW106126002A patent/TWI804471B/zh active
-
2021
- 2021-02-04 JP JP2021016930A patent/JP7119147B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62267340A (ja) * | 1986-05-01 | 1987-11-20 | ポ−ル・コ−ポレ−ション | ポリビニリデンジフルオライド構造体とその製造方法 |
JP2007012974A (ja) * | 2005-07-01 | 2007-01-18 | Shin Etsu Chem Co Ltd | レジスト膜の成膜方法 |
JP2015502840A (ja) * | 2011-11-03 | 2015-01-29 | ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティドW.L. Gore & Associates, Incorporated | 非架橋エチレンビニルアルコールコポリマーを用いて親水性化された複合ptfe膜 |
JP2015165005A (ja) * | 2014-02-28 | 2015-09-17 | ポール・コーポレーションPallCorporation | 高空隙容積を有する多孔質ポリマー膜 |
WO2016027825A1 (ja) * | 2014-08-20 | 2016-02-25 | 東京応化工業株式会社 | 多孔質ポリイミド膜製造用ワニス及びそれを用いた多孔質ポリイミド膜の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI804471B (zh) | 2023-06-11 |
KR20220131363A (ko) | 2022-09-27 |
JP6835848B2 (ja) | 2021-02-24 |
JP7119147B2 (ja) | 2022-08-16 |
KR102508570B1 (ko) | 2023-03-09 |
JP2021073094A (ja) | 2021-05-13 |
TW201808425A (zh) | 2018-03-16 |
CN109562323B (zh) | 2022-01-11 |
KR102447053B1 (ko) | 2022-09-23 |
CN109562323A (zh) | 2019-04-02 |
KR20190031506A (ko) | 2019-03-26 |
JPWO2018025790A1 (ja) | 2019-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6999764B2 (ja) | 液体の精製方法、薬液又は洗浄液の製造方法、フィルターメディア、及び、フィルターデバイス | |
JP6426209B2 (ja) | ポリイミド及び/又はポリアミドイミド多孔質体並びにその製造方法、分離及び/又は吸着を行う方法、分離材、吸着材、フィルターメディア、積層体、並びに、フィルターデバイス | |
JP6807317B2 (ja) | 多孔質膜の製造方法 | |
JP6883393B2 (ja) | ポリイミド系樹脂膜洗浄液、ポリイミド系樹脂膜を洗浄する方法、ポリイミド膜を製造する方法、フィルタ、フィルターメディア又はフィルターデバイスを製造する方法、及びリソグラフィー用薬液の製造方法 | |
JP7119147B2 (ja) | 液体の精製方法、及び多孔質膜の製造方法 | |
US10155185B2 (en) | Polyimide-based resin film cleaning liquid, method for cleaning polyimide-based resin film, method for producing polyimide coating, method for producing filter, filter medium, or filter device, and method for producing chemical solution for lithography | |
US11713383B2 (en) | Method for producing porous film, method for producing composition for producing porous film, and porous film | |
US20240270919A1 (en) | Composition for producing porous film, method for producing porous film, and porous film | |
JP6782118B2 (ja) | 多孔質体、フィルタ、フィルターメディア、フィルターデバイス、アクリル系ポリマーの精製方法及び製造方法、並びに感光性樹脂組成物の製造方法 | |
WO2016136673A1 (ja) | 液体の精製方法、薬液又は洗浄液の製造方法、フィルターメディア、及び、フィルターデバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17836895 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2018531875 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20197004287 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17836895 Country of ref document: EP Kind code of ref document: A1 |