WO2018024744A1 - Compositions de poly(aryléthercétone) (paec) comprenant un composé aromatique de bas poids moléculaire - Google Patents

Compositions de poly(aryléthercétone) (paec) comprenant un composé aromatique de bas poids moléculaire Download PDF

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WO2018024744A1
WO2018024744A1 PCT/EP2017/069472 EP2017069472W WO2018024744A1 WO 2018024744 A1 WO2018024744 A1 WO 2018024744A1 EP 2017069472 W EP2017069472 W EP 2017069472W WO 2018024744 A1 WO2018024744 A1 WO 2018024744A1
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paek
polymer composition
group
poly
polymer
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PCT/EP2017/069472
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English (en)
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Mohammad Jamal El-Hibri
Chantal Louis
David B. Thomas
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Solvay Specialty Polymers Usa, Llc
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Priority to JP2019505469A priority Critical patent/JP6929932B2/ja
Priority to CN201780061268.8A priority patent/CN109843973B/zh
Priority to US16/321,943 priority patent/US11591451B2/en
Priority to EP17751064.1A priority patent/EP3494163B1/fr
Publication of WO2018024744A1 publication Critical patent/WO2018024744A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
    • C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether

Definitions

  • PAEK Poly(aryl ether ketone)
  • the present invention relates to a polymer composition and a polymer- metal junction including the polymer composition, the polymer composition including a poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound.
  • PAEK poly(aryl ether ketone)
  • PAEKs are highly crystalline and are used in a wide range of applications where there is a need for high temperature performance and good chemical resistance. However, PAEKs may exhibit poor adhesion to metals.
  • EP1459882 Bl, EP1559542 Al, and WO 2011123790 Al (so-called nano- molding technology or "NMT- treated").
  • compositions including certain PAEKs that are capable of forming strong adhesive bonds with metal surfaces and that may be processed using relatively low mold temperatures ranging from 150°C to 180°C.
  • Exemplary embodiments are directed to a poly(aryl ether ketone) component including a poly(aryl ether ketone) (PAEK) having a melting temperature (Tm), a crystallization temperature (Tc), and a glass transition temperature (Tg) satisfying the relationship :
  • PAEK amorphous poly(aryl ether ketone)
  • PAEK semi-crystalline poly(aryl ether ketone)
  • the polymer composition may optionally further comprise a reinforcing filler, preferably glass fiber.
  • melting temperature (Tm) or “Tm” means the melting temperature
  • DSC differential scanning calorimetry
  • glass transition temperature (Tg) glass transition temperature
  • halogen includes fluorine, chlorine, bromine, and iodine, unless indicated otherwise;
  • aromatic denotes any mono- or polynuclear cyclic group (or moiety) having a number of ⁇ electrons equal to 4n+2, where n is 1 or any positive integer; an aromatic group (or moiety) can be an aryl and arylene group (or moiety).
  • structured metal surface means a metal surface that has undergone any etching process known to those of skill in the art to roughen the metal surface by removing at least part of the metal.
  • nano- structured metal surface means a metal surface that has been etched to have a nano-pitted surface with surface peaks and valleys having average depth, height and width dimensions in the nano- scale regime ranging from 10 to 1000 nm, preferably from 30 to 800 nm, and more preferably from 50 to 500 nm.
  • NMT-treated metal surface means a nano- structured surface prepared by any non-comparative etching or non-comparative etching/priming process described in EP1459882 Bl, EP1559542 Al, or WO 2011123790 Al, the disclosures all of which are incorporated herein by reference in their entireties, the term “mobile electronic device” is intended to denote any electronic device that is designed to be conveniently transported and used in various locations while exchanging/providing access to data, e.g. through wireless connections or mobile network connection.
  • mold temperature means the actual mold surface temperature as measured with a surface probe, not the mold set point temperature of the recirculating fluid of the mold heater.
  • adhesion strength means the lap shear strength as measured according to ASTM D 1002.
  • heat of fusion means the heat of fusion as measured by DSC according to ASTM D3418-03 using the second heat scan with the melting of the PAEK taken as the area over a linear baseline drawn from 50°C above the Tg to a temperature above the last endotherm.
  • amorphous poly(aryl ether ketone) PAEK
  • Tm melting point
  • PAEK poly(aryl ether ketone)
  • molecular weight means the number average molecular weight (Mn) as measured by gel permeation chromatography (GPC) using polystyrene calibration standards.
  • PAEK poly(aryl ether ketone)
  • the recurring units (R PAEK ) are selected from the group consistin
  • each R' of R' j - is selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine and quaternary ammonium; and
  • - j' is zero or an integer ranging from 1 to 4.
  • the respective phenylene moieties may independently have 1,2-, 1,4- or 1,3-linkages to the other moieties different from R' in the recurring unit (R PAEK )-
  • said phenylene moieties have 1,3- or 1,4- linkages, more preferably they have a 1,4-linkage.
  • j' is preferably at each occurrence zero so that the phenylene moieties have no other substituents than those linking the main chain of the polymer.
  • the PAEK is poly(ether ether ketone) (PEEK).
  • PEEK poly(ether ether ketone)
  • a "poly(ether ether ketone) (PEEK)" denotes any polymer of which more than 50 mol % of the recurring units (R PAEK ) are recurring units of formula J'-A :
  • At least 60 mol %, 70 mol %, 80 mol %, 90 mol %, 95 mol %, 99 mol , and most preferably all of recurring units (R PAEK ) are recurring units (J'-A).
  • the PAEK is poly(ether ketone ketone) (PEKK).
  • PEKK poly(ether ketone ketone)
  • R PAEK recurring units of formula J'-B and formula J"-B :
  • At least 60 mol %, 70 mol %, 80 mol %, 90 mol %, 95 mol %, 99 mol , and most preferably all of recurring units (R PAEK ) are a combination of recurring units (J'-B) and (J"-B).
  • the number of units (J'-B) is at least 58 mol , more preferably at least 65 mol % and most preferably at least 68 mol % of the total number of units (J'-B) and (J"-B).
  • the number of units (J'-B) is at most 85 mol , more preferably at most 83 mol , and most preferably at most 75 mol % of the total number of units (J'-B) and (J"-B).
  • the mole ratio of (J'-B)/(J"-B) is 60/40 or less, the PEKK is considered amorphous.
  • PEKK is available under the trademark Cypek ® from Solvay, SA.
  • Cypek* FC is a semi-crystalline grade that meets the requirement, [(Tm-Tc)/(Tm-Tg)]
  • the PAEK is poly(ether
  • PEK poly(ether ketone)
  • At least 60 mol %, 70 mol %, 80 mol %, 90 mol %, 95 mol %, 99 mol , and most preferably all of recurring units (R PAEK ) are recurring units (J'-C).
  • the PAEK is poly(ether ether ketone ketone) (PEEKK).
  • PEEKK poly(ether ether ketone ketone)
  • At least 60 mol %, 70 mol %, 80 mol %, 90 mol %, 95 mol %, 99 mol , and most preferably all of recurring units (R PAEK ) are recurring units (J'-M).
  • the PAEK is a PEEK-PEDEK copolymer.
  • a "PEEK-PEDEK copolymer” denotes any polymer of which more than 50 mol % of the recurring units (R PAEK ) are both recurring units of formula J'-A (P :
  • the PEEK-PEDEK copolymer may include relative molar proportions of recurring units J'-A and J'-D (PEEK/PEDEK) ranging from 95/5 to 60/40, preferably from 90/10 to 70/30, more preferably from 85/15 to 75/25.
  • the sum of recurring units J' -A and J'-D represents at least 60 mol , 70 mol , 80 mol , 90 mol , 95 mol , 99 mol , of recurring units in the PAEK.
  • recurring units J' -A and J'-D represent all of the recurring units in the PAEK.
  • the PAEK is a PEDEKK polymer.
  • a "PEDEKK” denotes any polymer of which more than 50 mol % of the recurring units (R PAEK ) are both recurring units of formula J'-Q (PEDEKK) and formula J"-Q (PEDEKmK) :
  • At least 60 mol %, 70 mol %, 80 mol %, 90 mol %, 95 mol %, 99 mol , and most preferably all of recurring units (R PAEK ) are a combination of recurring units (J'-Q) and (J"-Q).
  • the number of units (J"-Q) is at least 50 mol , 70 mol , 90 mol , and most preferably all of the total number of units (J'-Q) and (J"-Q).
  • the polymer composition may include one or more than one PAEK.
  • the polymer composition includes a PAEK component including at least one PAEK each having a melting temperature (Tm), a crystallization
  • Tc glass transition temperature
  • Tg glass transition temperature
  • the polymer composition includes at least one PAEK selected from a PEEK-PEDEK copolymer, a PEDEKK, and a semi-crystalline PEKK.
  • the PAEK component includes an amorphous poly(aryl ether ketone) (PAEK), preferably an amorphous PEKK.
  • PAEK amorphous poly(aryl ether ketone)
  • the polymer composition includes an amorphous PAEK, it further includes at least one semi-crystalline PAEK.
  • the semi-crystalline PAEK optionally is a PAEK having a melting temperature (Tm), a crystallization temperature (Tc), and a glass transition temperature (Tg), satisfying the relationship :
  • the polymer composition as a whole exhibits a heat of fusion of at least 8 J/g, preferably at least 16 J/g, most preferably at least 24 J/g.
  • the PAEK component includes at least one first PAEK selected from PEEK-PEDEK copolymer, PEDEKK, and semi-crystalline PEKK, and at least one second PAEK selected from PEEK, PEK, PEEKK, and amorphous PEKK.
  • the concentration of the first PAEK in the polymer composition can range from 1 to 99 wt. , preferably 20 to 80 wt.
  • the concentration of the second PAEK in the polymer composition can range from 1 to 99 wt. , preferably 20 to 80 wt. %.
  • the PAEK component may include a blend of a first PAEK and a second PAEK as shown in Table 1 below :
  • the total amount of PAEKs in the polymer composition preferably ranges from 50.0 to 99.5 % by total weight of the polymer composition.
  • the total amount of PAEKs meeting the (Tm-Tc) / (Tm-Tg) > 0.31 relationship or total amount of amorphous PAEK preferably ranges from 30 to 90 , more preferably from 40 to 80 % by total weight of the PAEKs in the polymer composition.
  • At least one and preferably all of the PAEK exhibit a melt viscosity of at least 0.05 kN-s/m 2 measured according to ASTM D3835 at 400°C and 1000 s "1 using a tungsten carbide die of 0.5 x 3.175 mm, more preferably of at
  • At least one and preferably all of the PAEK exhibit a melt viscosity of at most 0.50 kN-s/m 2 measured according to ASTM D3835 at 400°C and 1000 s "1 using a tungsten carbide die of 0.5 x 3.175 mm, more preferably of at most
  • low molecular weight aromatic compound means at least one compound selected from the group consisting of compounds of formula :
  • Each R 5 and R 6 is independently selected from the group consisting of a hydrogen, a halogen, an optionally-halogenated alkyl, an alkenyl, an alkynyl, a phenyl, an ether, a thioether, a carboxylic acid, an ester, an amide, an imide, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, an alkali or alkaline earth metal phosphonate, an alkyl phosphonate, a -CF 3 group, an amine, and a quaternary ammonium.
  • Each R 5 and R 6 is preferably a methyl or phenyl group.
  • Each R is independently selected from the group consisting of a halogen, an alkyl, an alkenyl, an alkynyl, an aryl, an ether, a thioether, a carboxylic acid, an ester, an amide, an imide, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, an alkali or alkaline earth metal phosphonate, an alkyl phosphonate, an amine, and a quaternary ammonium.
  • Each i is independently selected from 0, 1, 2, 3, 4, and 5; provided, however, that the maximum value for i is equal to the number of positions free for substitution on the respective aromatic ring.
  • i may range from 0 to 5 for terminal phenyl groups but only range from 0 to 4 for non-terminal phenyl groups.
  • i is 0.
  • n is an integer selected from 0 and 1
  • m is an integer ranging from 0 to 32.
  • the linkages between the phenylene units and A r A 4 may independently have 1,2-, 1,3- or 1,4- linkages. Preferably, the linkages are 1,3- or 1,4-.
  • the low molecular weight aromatic compound has a molecular weight ranging from 154 g/mol to 3000 g/mol, preferably from 154 g/mol to 2000 g/mol, more preferably from 154 g/mol to 1000 g/mol, most preferably from 154 g/mol to 500 g/mol.
  • the low molecular weight aromatic compound is selected from compounds of formula (II)
  • Suitable examples of low molecular weight aromatic compounds of formula (II) are 1,3-diphenoxybenzene, 1,4-diphenoxybenzene, m-terphenyl, and p-terphenyl.
  • the low molecular weight aromatic compound is selected from compounds of formula (III) :
  • Suitable examples of low molecular weight aromatic compounds of formula (III) are polyphenylether compounds sold under the trade name Santovac ® from SantoLubes LLC, South Carolina, USA.
  • the low molecular weight aromatic compound of formula (III) is l,4-Bis(4-phenoxybenzoyl)benzene of formula (IIIA) below :
  • the low molecular weight aromatic compound is selected from compounds of formula (IV) :
  • the low molecular weight aromatic compound is preferably diphenyl sulfone, l,4-Bis(4-phenoxybenzoyl)benzene, alkali metal diphenyl sulfone sulfonate, benzophenone, or a combination thereof. Most preferably, the low molecular weight aromatic compound is diphenyl sulfone or 1,4-Bis(4- phenoxybenzoyl)benzene .
  • the low molecular weight aromatic compound is an imide preferably selected from compounds of formulae (V) and (VI) :
  • the low molecular weight aromatic compound preferably ranges from 0.5 wt. % to 5 wt. , preferably from 1 wt. % to 3 wt. , by weight of the polymer composition. Most preferably, the low molecular weight aromatic compound ranges from 1.5 wt. % to 2.5 wt. % by weight of the polymer composition.
  • a large selection of reinforcing fillers may be added to the polymer composition. They are preferably selected from fibrous and particulate fillers.
  • a fibrous reinforcing filler is considered herein to be a material having length, width and thickness, wherein the average length is substantially larger than both the width and thickness.
  • such a material has an aspect ratio, defined as the average ratio between the length and the smallest of the width and thickness of at least 5.
  • the aspect ratio of the reinforcing fibers is at least 10, still more preferably at least 20.
  • the particulate fillers have an aspect ratio of at most 5, preferably at most 2.
  • the reinforcing filler is selected from glass fibers, carbon fibers, carbon nano-tubes, boron nitride fibers, silicon carbide whiskers and boron fibers.
  • Other high aspect ratio reinforcing fillers will be obvious to those skilled in the art. It can also be selected from mineral fillers, such as talc, mica, titanium dioxide, kaolin, calcium carbonate, calcium silicate, magnesium carbonate; boron nitride, wollastonite; and the like, and can include carbon based fillers like graphene, graphite, carbon black and other carbon based particulate fillers.
  • the reinforcing filler may be present in the polymer composition in an amount of at least 5 wt. , preferably at least 10 wt. , more preferably at least 15 wt. , based on the total weight of the polymer composition.
  • the reinforcing filler is also preferably present in an amount of at most 50 wt. %, still more preferably at most 40 wt. %, based on the total weight of the polymer composition.
  • the amount of the reinforcing filler ranges from 10 wt. % to 50 wt. , more preferably from 20 wt. % to 40 wt. % of the polymer composition. Most preferably, the amount of the reinforcing filler is about 30 wt. % of the polymer composition.
  • the polymer composition may include one or more optional additives such as a colorant such as a dye and/or a pigment, for example, titanium dioxide, zinc sulfide, zinc oxide, ultraviolet light stabilizers, heat stabilizers, antioxidants such as organic phosphites and phosphonites, acid scavengers, processing aids, nucleating agents, lubricants, flame retardants, a smoke-suppressing agents, an anti-static agents, anti-blocking agents, and/or conductivity additives such as carbon black.
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • a colorant such as a dye and/or a pigment
  • their total weight is preferably less than 20 wt. , less than 10 wt. , less than 5 wt. % and most preferably less than 2 wt. , based on the total weight of polymer composition.
  • the polymer composition includes a low molecular weight aromatic compound and a blend of a first PAEK and a second PAEK (if applicable) as shown in Table 1A below :
  • PEKK (semi-crystalline) PEDEKK diphenyl sulfone
  • PEKK (semi-crystalline) PEK diphenyl sulfone
  • PEKK silica
  • PEKK amorphous PEKK (amorphous) diphenyl sulfone
  • PEDEKK (amorphous) diphenyl sulfone
  • PAEK amorphous PEEK diphenyl sulfone
  • PEKK si-crystalline copolymer phenoxybenzoyl
  • PEDEKK (amorphous) 1,4-Bis(4- phenoxybenzoyl)benzene
  • PAEK amorphous PEEK 1,4-Bis(4- phenoxybenzoyl)benzene
  • PEKK (semi-crystalline) — 1,4-Bis(4- phenoxybenzoyl)benzene
  • the polymer composition can be made by melt mixing or powder blending the at least one PAEK, the low molecular weight aromatic compound, and any optional ingredients.
  • the components of the mixture may be added or mixed in any order, in any amount or fraction of their total amount, and may be mixed separately or simultaneously.
  • the preparation of the polymer composition can be carried out by any known melt-mixing process that is suitable for preparing thermoplastic molding compositions. Such a process may be carried out by heating the PAEK above its melting temperature to form a melt.
  • the components for forming the polymer composition are fed to the melt- mixing apparatus and melt-mixed in that apparatus.
  • Suitable melt- mixing apparatuses are, for example, kneaders, Banbury mixers, single-screw extruders, and twin-screw extruders.
  • polymer compositions described herein are advantageously provided in the form of pellets, which may be used in injection molding or extrusion processes known in the art.
  • Exemplary embodiments are also directed to a method of increasing the adhesion strength of a polymer composition including a PAEK as described herein to a metal surface, preferably a structured metal surface, more preferably a nano-structured metal surface, and most preferably an NMT-treated metal surface by adding to the polymer composition a low molecular weight aromatic compound as described herein.
  • exemplary embodiments include a method of increasing the adhesion strength of a polymer composition to a metal surface, preferably a nano-structured metal surface, including adding to the polymer composition from 0.5 wt. % to 5 wt. , preferably from 1 wt. % to 3 wt.
  • the polymer composition includes a poly(aryl ether ketone) (PAEK) component including a poly(aryl ether ketone) (PAEK) having a melting temperature (Tm), a crystallization temperature (Tc), and a glass transition temperature (Tg) satisfying the relationship : (Tm-Tc) / (Tm-Tg) > 0.31, or an amorphous poly(aryl ether ketone) (PAEK) and a semi-crystalline poly(aryl ether ketone) (PAEK), and; optionally a reinforcing filler, preferably a glass fiber, where the polymer composition exhibits a heat of fusion of at least 8 J/g, preferably at least 16 J/g, most preferably at least 24 J/g.
  • PAEK poly(aryl ether ketone)
  • PAEK poly(aryl ether ketone)
  • PAEK poly(aryl ether ketone)
  • Tm melting temperature
  • Tc crystall
  • the polymer compositions described herein preferably exhibit a Tg of at least 5°C lower than the lowest Tg of PAEKs in the composition, more preferably at least 7°C lower than the lowest Tg of PAEKs in the composition (as measured in the Examples at half -height on 2 nd heat cycle at 20°C/minute), where the Tg of the polymer composition is the lowest Tg in the case where the polymer composition exhibits more than one Tg.
  • Exemplary embodiments are also directed to a polymer-metal junction including the polymer composition as described herein in contact with, preferably adhered to, a metal surface and a method of making the polymer- metal junction.
  • the metal surface as described herein does not include a metal surface of a mold.
  • the metal can include any metallic composition including, but not limited to, aluminum, copper, gold, iron, nickel, platinum, silver, steel, and blends or alloys thereof ⁇ e.g. , brass and bronze).
  • the polymer-metal junction can be made by contacting the polymer composition as described herein with a metal surface, preferably a structured metal surface, more preferably a nano -structured metal surface, most preferably an NMT-treated metal surface.
  • a metal surface preferably a structured metal surface, more preferably a nano -structured metal surface, most preferably an NMT-treated metal surface.
  • the polymer composition may be deposited on or over-molded onto the metal surface using any suitable melt- processing and deposition method.
  • the polymer-metal junction may be made by injection or compression molding the polymer composition onto the metal surface.
  • the polymer-metal junction is formed by injection molding the polymer composition onto a metal surface, preferably a structured metal surface, more preferably a nano -structured metal surface, most preferably an NMT-treated metal surface, using a mold temperature ranging from 150 to 190°C, preferably 160 to 180°C.
  • the polymer-metal junction exhibits a lap shear strength as measured according to ASTM D1002 greater than or equal to lOMPa, 12 MPa, 15 MPa, 20 MPa, and most preferably greater than or equal to 25 MPa.
  • the polymer-metal junction may exhibit a lap shear strength as measured according to ASTM D1002 that is preferably at least 150 %, 200 %, 300 %, and most preferably at least 400 % greater than the lap shear strength of a polymer-metal junction including an otherwise identical polymer composition without the low molecular weight compound.
  • the nano- structured metal surface includes a layer of a trivalent aluminum compound, preferably having a thickness of about 1 nm.
  • the nano-structured metal surface includes nitrogen detectable by X-ray photoelectron spectroscopy.
  • the nano- structured metal surface is anodized.
  • the nano-structured surface includes a primer material, preferably an organosilane, a titanate, an aluminate, a phosphate, or a zirconate.
  • the polymer composition may be well suited for the manufacture polymer-metal junctions in a wide variety of applications including automotive, electrical, and mobile electronic devices.
  • the polymer-metal junction may be formed by an extrusion process for coating a wire or cable.
  • a wire or cable may be optionally etched, nano-etched, or NMT-treated and then preheated to a temperature ranging from 150°C to 180°C prior to deposition of the polymer composition in a continuous melt extrusion wire coating process.
  • PEEK homopolymer KetaSpire ® KT-880P from Solvay Specialty
  • PEKK polymer Cypek ® FC obtained from Solvay SA; This grade has a melt viscosity in the range 100-300 Pa-s as measured at 400°C and 1000 1/s according to ASTM D-3835; 3) 80-20 PEEK-PEDEK copolymer produced according to Preparative
  • the PEEK-PEDEK copolymers had a melt viscosity in the range
  • Glass Fiber Chopped S-glass fiber having a nominal filament diameter of 9 micrometers and a high temperature sizing designated 553 and designed for reinforcement of high temperature polymers such as polyphenylene sulfide and PEEK. This glass fiber was procured from AGY Corporation.
  • Aromatic Compounds Diphenylsulfone obtained from Proviron America, Inc. having a purity of 99.9 %, and commercially available 1,4-Bis(4- phenoxybenzoyl)benzene .
  • Tg crystallization temperature upon cooling from the melt
  • Tc crystallization temperature upon cooling from the melt
  • the heat of fusion was measured by DSC according to ASTM D3418-03 using the second heat scan with the melting of the PAEK taken as the area over a linear baseline drawn from 50°C above the Tg to a temperature above the last endotherm.
  • the reaction mixture was heated slowly to 150°C.
  • a mixture of 27.339 g of Na 2 C0 3 and 0.171 g of K 2 C0 3 was added via a powder dispenser to the reaction mixture over 30 minutes.
  • the reaction mixture was heated to 320°C at l°C/minute.
  • 6.577 g of 4,4' -difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor.
  • 1.285 g of lithium chloride were added to the reaction mixture.
  • another 2.192 g of 4,4' -difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
  • the reactor content was then poured from the reactor into a SS pan and cooled.
  • the solid was broken up and ground in an attrition mill through a 2 mm screen.
  • Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12.
  • the powder was then removed from the reactor and dried at 120°C under vacuum for 12 hours yielding 72 g of a white powder.
  • the melt viscosity measured by capillary rheology at 400°C, 1000 s-1 using a tungsten carbide die of 0.5 x 3.175 mm was 0.20 kN-s/m .
  • the reaction mixture was heated slowly to 150°C.
  • 150°C a mixture of 27.504 g of Na 2 C0 3 and 0.173 g of K 2 C0 3 was added via a powder dispenser to the reaction mixture over 30 minutes.
  • the reaction mixture was heated to 320°C at l°C/minute.
  • 6.546 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor.
  • 1.065 g of lithium chloride were added to the reaction mixture.
  • another 2.182 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
  • the reactor content was then poured from the reactor into a SS pan and cooled.
  • the solid was broken up and ground in an attrition mill through a 2 mm screen.
  • Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12.
  • the powder was then removed from the reactor and dried at 120°C under vacuum for 12 hours yielding 70 g of a white powder.
  • the melt viscosity measured by capillary rheology at 400°C, 1000 s-1 using a tungsten carbide die of 0.5 x 3.175 mm was 0.12 kN-s/m .
  • All polymer compositions were prepared by first tumble blending pellets of the resins to be blended at the desired compositional ratios for about
  • the extruder had 12 barrel sections with barrel sections 2 through 12 being heated with a temperature profile setting of 330°C for barrel sections 2-4, 340°C for barrel sections 5-10 and 350°C for sections 11-12 and the die.
  • the melt temperature recorded for the extrudate as it exited the die ranged from 380 to 395°C for all the compositions.
  • the feeding of the extruder was such that the resin component(s) and the low molecular weight aromatic additive
  • Injection molding was performed on the example formulations for two purposes : 1) Injection molding was used to produce 3.2 mm (0.125 in) thick ASTM tensile and flexural specimens for mechanical property testing. Type I tensile ASTM specimens and 5 in x 0.5 in x 0.125 in flexural specimens were injection molded using PEEK injection molding guidelines provided by the supplier. 2) Injection molding of lap shear over- molded specimens was also carried out on NMT-treated aluminum (grade A-6061) coupons that were 4.5 mm long x 1.75 mm wide x 2 mm thick. These coupons were prepared and supplied by Taiseiplas Corp.
  • a small rectangular specimen of polymer was over-molded onto the aluminum coupons using a three -plate mold manufactured and supplied by Taiseiplas Corp.
  • the rectangular strip of plastic over-molded onto the aluminum coupons was 4.5 cm in length, 1 cm in width and 3 mm in thickness as nominal dimensions.
  • the plastic piece was over-molded onto the aluminum coupons such that there was an overlap area between the two pieces defined by nominal dimensions of 10 mm x 5 mm to provide a nominal overlap area of 50 mm .
  • the over-molded aluminum/plastic assembly that was obtained from the molding as described above was tested for lap shear strength in an Instron tensile test apparatus following the guidelines of ASTM D1002.
  • a positioning fixture supplied by Taiseiplas was also used to hold the assembly in place in the Instron grips and to maintain the alignment of the metal and plastic pieces during the tensile pull on the two materials to assure that the force applied on the lap interface was a purely shear force.
  • a pull rate of 0.05 in/min was used for the this testing and the lap shear strength of each specimen was calculated by dividing the load needed to break apart each assembly divided by the nominal overlap area of the joint.
  • Examples 8 to 11 were performed using a different batch of NMT-treated coupons than were used in Examples 1-7 and Comparative Examples 1-7. To account for possible variations in etching between coupon batches, Comparative Example 3 was repeated as Comparative Example 3 "Bis" with coupons from the same batch as used for Examples 8 to 11. As shown in Tables 3, 4, and 5, the polymer adhesion to the NMT-treated metal substrate (as indicated by the lap shear strength) was unexpectedly improved in all the examples in which a low molecular weight aromatic compound was included. In addition, as shown in the embodiments of Examples 1 and 2, higher polymer adhesion was unexpectedly achieved with a
  • compositions including the low molecular weight aromatic compounds unexpectedly retained very good mechanical properties essentially on par or within a 10 % deviation from the properties of the analog composition not including the low molecular weight compounds.
  • Examples 8-11 show that use of l,4-bis(4-diphenoxybenzoylbenzene) as the low molecular weight aromatic compound also unexpectedly resulted in polymer compositions exhibiting markedly improved lap shear strength.

Abstract

L'invention concerne une composition polymère comprenant au moins un constituant de type poly(aryléthercétone) (PAEC) et au moins un composé aromatique de bas poids moléculaire. L'invention porte également sur une jonction métal-polymère comprenant la composition de polymère et sur un procédé de fabrication d'une jonction métal-polymère.
PCT/EP2017/069472 2016-08-02 2017-08-01 Compositions de poly(aryléthercétone) (paec) comprenant un composé aromatique de bas poids moléculaire WO2018024744A1 (fr)

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JP2019505469A JP6929932B2 (ja) 2016-08-02 2017-08-01 低分子量芳香族化合物を含むポリ（アリールエーテルケトン）（ｐａｅｋ）組成物
CN201780061268.8A CN109843973B (zh) 2016-08-02 2017-08-01 包含低分子量芳香族化合物的聚(芳醚酮)(paek)组合物
US16/321,943 US11591451B2 (en) 2016-08-02 2017-08-01 Poly(aryl ether ketone) (PAEK) compositions including a low molecular weight aromatic compound
EP17751064.1A EP3494163B1 (fr) 2016-08-02 2017-08-01 Compositions de poly (aryl éther cétone) (paek) comprenant un composé aromatique de poids moléculaire faible

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WO2019215304A1 (fr) * 2018-05-11 2019-11-14 Solvay Specialty Polymers Usa, Llc Compositions de polymère
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WO2020254097A1 (fr) * 2019-06-20 2020-12-24 Solvay Specialty Polymers Usa, Llc Procédé de fabrication d'un copolymère peek-peoek et copolymère obtenu au moyen du procédé
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CN114373586A (zh) * 2021-12-30 2022-04-19 重庆沃特智成新材料科技有限公司 漆包线及其制备方法、用电设备
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CN113966353B (zh) * 2019-06-20 2024-04-05 索尔维特殊聚合物美国有限责任公司 包含与金属基底接触的PEEK-PEoEK共聚物组合物的聚合物-金属接合件
WO2022013520A1 (fr) * 2020-07-15 2022-01-20 Victrex Manufacturing Limited Copolymères, leur préparation et leur utilisation
CN114373586A (zh) * 2021-12-30 2022-04-19 重庆沃特智成新材料科技有限公司 漆包线及其制备方法、用电设备
CN114373586B (zh) * 2021-12-30 2024-04-05 重庆沃特智成新材料科技有限公司 漆包线及其制备方法、用电设备

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