WO2018013261A1 - Metal aprotic organosilanoxide compound - Google Patents
Metal aprotic organosilanoxide compound Download PDFInfo
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- WO2018013261A1 WO2018013261A1 PCT/US2017/036267 US2017036267W WO2018013261A1 WO 2018013261 A1 WO2018013261 A1 WO 2018013261A1 US 2017036267 W US2017036267 W US 2017036267W WO 2018013261 A1 WO2018013261 A1 WO 2018013261A1
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- WIPO (PCT)
- Prior art keywords
- aprotic
- formula
- metal
- independently
- alternatively
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 190
- 239000002184 metal Substances 0.000 title claims abstract description 190
- 150000001875 compounds Chemical class 0.000 title claims abstract description 121
- 239000000203 mixture Substances 0.000 claims abstract description 161
- -1 coatings Substances 0.000 claims abstract description 56
- 239000000470 constituent Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 14
- 229910003849 O-Si Inorganic materials 0.000 claims abstract description 13
- 229910003872 O—Si Inorganic materials 0.000 claims abstract description 13
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 42
- 230000003647 oxidation Effects 0.000 claims description 38
- 125000006659 (C1-C20) hydrocarbyl group Chemical group 0.000 claims description 19
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 claims description 16
- 150000004820 halides Chemical class 0.000 claims description 15
- 239000000376 reactant Substances 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000002879 Lewis base Substances 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 150000007527 lewis bases Chemical class 0.000 claims description 5
- 239000012453 solvate Substances 0.000 claims description 5
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 4
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims description 4
- 125000006651 (C3-C20) cycloalkyl group Chemical group 0.000 claims description 2
- 238000009472 formulation Methods 0.000 abstract description 95
- 229920001296 polysiloxane Polymers 0.000 abstract description 52
- 239000003446 ligand Substances 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 12
- 239000008393 encapsulating agent Substances 0.000 abstract description 11
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- 239000000806 elastomer Substances 0.000 abstract description 10
- 239000000565 sealant Substances 0.000 abstract description 10
- 239000000047 product Substances 0.000 description 79
- 239000003039 volatile agent Substances 0.000 description 37
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 17
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- 125000004429 atom Chemical group 0.000 description 16
- 239000006227 byproduct Substances 0.000 description 16
- 239000010936 titanium Substances 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 14
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- 239000000178 monomer Substances 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 13
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 150000004703 alkoxides Chemical class 0.000 description 10
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 239000011135 tin Substances 0.000 description 10
- 239000004971 Cross linker Substances 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 150000001283 organosilanols Chemical class 0.000 description 9
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 8
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- 229910052801 chlorine Inorganic materials 0.000 description 8
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- 125000001424 substituent group Chemical group 0.000 description 8
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- 125000000129 anionic group Chemical group 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229960005235 piperonyl butoxide Drugs 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
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- 230000001376 precipitating effect Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 6
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
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- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 229910052729 chemical element Inorganic materials 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 125000000744 organoheteryl group Chemical group 0.000 description 4
- 125000005375 organosiloxane group Chemical group 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
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- 238000003756 stirring Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OCKGFTQIICXDQW-ZEQRLZLVSA-N 5-[(1r)-1-hydroxy-2-[4-[(2r)-2-hydroxy-2-(4-methyl-1-oxo-3h-2-benzofuran-5-yl)ethyl]piperazin-1-yl]ethyl]-4-methyl-3h-2-benzofuran-1-one Chemical compound C1=C2C(=O)OCC2=C(C)C([C@@H](O)CN2CCN(CC2)C[C@H](O)C2=CC=C3C(=O)OCC3=C2C)=C1 OCKGFTQIICXDQW-ZEQRLZLVSA-N 0.000 description 3
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- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 3
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- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
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- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 2
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- 150000001450 anions Chemical class 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 125000004404 heteroalkyl group Chemical group 0.000 description 2
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- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
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- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000019241 carbon black Nutrition 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000000155 isotopic effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- FRIJBUGBVQZNTB-UHFFFAOYSA-M magnesium;ethane;bromide Chemical compound [Mg+2].[Br-].[CH2-]C FRIJBUGBVQZNTB-UHFFFAOYSA-M 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- XSXHWVKGUXMUQE-UHFFFAOYSA-N osmium dioxide Inorganic materials O=[Os]=O XSXHWVKGUXMUQE-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 125000000587 piperidin-1-yl group Chemical group [H]C1([H])N(*)C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- IUBQJLUDMLPAGT-UHFFFAOYSA-N potassium bis(trimethylsilyl)amide Chemical compound C[Si](C)(C)N([K])[Si](C)(C)C IUBQJLUDMLPAGT-UHFFFAOYSA-N 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical compound [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- WROMPOXWARCANT-UHFFFAOYSA-N tfa trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F.OC(=O)C(F)(F)F WROMPOXWARCANT-UHFFFAOYSA-N 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/005—Compounds of elements of Group 5 of the Periodic Table without metal-carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/02—Iron compounds
- C07F15/025—Iron compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/069—Aluminium compounds without C-aluminium linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/28—Titanium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/58—Metal-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
Definitions
- This invention generally relates to a metal aprotic organosilanoxide compound, compositions containing or prepared from it, and methods of making and using it.
- Incumbent adhesives may undesirably adhere weakly to certain substrate materials, degrade or decompose (e.g., embrittle or discolor), or delaminate from their substrates under harsh environmental conditions such as air, heat, humidity, and/or sunlight.
- some substrates may be pre- processed (e.g., primed or pre-dried) before being adhered.
- an adhesion promoter may be used as a primer on the substrate or as an additive in the adhesive. Even so, the adhesive may exhibit weak adhesion or aging instability when used in demanding applications.
- This invention generally relates to a metal aprotic organosilanoxide compound, a composition or formulation containing or prepared from it, and methods of making and using them.
- Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand.
- the metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.
- the metal atom may be aluminum, cerium, iron, vanadium, or a combination of any two or more thereof.
- the aprotic organosilanoxide ligand may be an anion that is a conjugate base form of an organosilanol and contains on average, per aprotic organosilanoxide ligand, at least one anionic functional group, Si-O-.
- the aprotic organosilanoxide ligand is free of–OH, -NH, -SH, -PH, and, optionally, SiH groups.
- a metal aprotic organosilanoxide compound, composition and formulation may be used in diverse applications in industries such as building, construction, consumer products, electronics, energy, infrastructure, packaging, telecommunications, and transportation.
- This invention is described herein in an illustrative manner by disclosing a plurality of representative, non-limiting embodiments and examples. In some embodiments the invention is any one of the following numbered aspects. [0005] A metal aprotic organosilanoxide compound of formula (I):
- M 1 is a metal atom Al
- the (C 2 - C 20 )heterohydrocarbyl group contains 2 to 20 carbon atoms and at least one heteroatom selected from N, O, S, and P; alternatively N, O, and S; alternatively N and O; alternatively N; alternatively O; alternatively S; alternatively P.
- the metal aprotic organosilanoxide compound of formula (I) may be a molecule, or a collection of molecules. Each metal atom of the metal aprotic organosilanoxide compound of formula (I) independently has a formal positive oxidation state, ⁇ + , which is reflective of the metal atom’s known positive oxidation states described above.
- Each anionic functional group, Si-O-, of the aprotic organosilanoxide ligand has a formal negative oxidation state, ⁇ -, equal to -1, and the aprotic organosilanoxide ligand has a total formal negative oxidation state, ⁇ -, equal to -y, wherein y is an integer equal to the total number of anionic functional groups, Si- O-, per aprotic organosilanoxide ligand.
- (-y * -1) ⁇ + of the metal atom, wherein * is a multiplication symbol, and the metal aprotic organosilanoxide compound of formula (I) is free of other anionic ligands.
- M 1 is a metal atom Al, Ce, or Fe; alternatively Al, Ce, or V; alternatively Al, Fe, or V; alternatively Ce, Fe, or V.
- Aspect 2 The metal aprotic organosilanoxide compound of aspect 1 wherein M 1 is Al and ⁇ + is +1 or +2, alternatively +1 or +3, alternatively +2 or +3, alternatively +1, alternatively +2, alternatively +3. This compound may be called an aluminum aprotic organosilanoxide.
- Aspect 3 The metal aprotic organosilanoxide compound of aspect 1 wherein M 1 is Ce and ⁇ + is +2 or +3, alternatively +2 or +4, alternatively +3 or +4, alternatively +2, alternatively +3, alternatively +4.
- This compound may be called a cerium aprotic organosilanoxide.
- Aspect 4 The metal aprotic organosilanoxide compound of aspect 1 wherein M 1 is Fe and ⁇ + is +2 to +6, alternatively +1 to +5, alternatively +2 to +5, alternatively +2 to +4, alternatively +1 or +2, alternatively +2 or +3, alternatively +2 or +4, alternatively +3 or +4, alternatively +1, alternatively +2, alternatively +3, alternatively +4, alternatively +5, alternatively +6.
- This compound may be called an iron aprotic organosilanoxide.
- Aspect 5 The metal aprotic organosilanoxide compound of aspect 1 wherein M 1 is V and ⁇ + is +2 to +5, alternatively +1 to +4, alternatively +2 to +5, alternatively +1 or +2, alternatively +2 or +3, alternatively +3 or +4, alternatively +4 or +5, alternatively +1, alternatively +2, alternatively +3, alternatively +4, alternatively +5.
- This compound may be called a vanadium aprotic organosilanoxide.
- Aspect 6 The metal aprotic organosilanoxide compound of any one of aspects 1 to 5 wherein M 1 is Al and ⁇ + is +3; M 1 is Ce and ⁇ + is +3 or +4; M 1 is Fe and ⁇ + is +2 or +3; or M 1 is V and ⁇ + is +5.
- Aspect 7 The metal aprotic organosilanoxide compound of any one of aspects 1-5 wherein subscript n is an integer from 2 to ⁇ + , alternatively ⁇ + .
- Aspect 8 The metal aprotic organosilanoxide compound of any one of aspects 1-7 wherein subscript o is an integer of 0, alternatively 1 or 2, alternatively 1, alternatively 2.
- o is 0, L is absent.
- o is 1, one L is present and forms a co-ordinate bond, also called a dative bond, to M 1 .
- o is 2, two independently selected L are present, or one bidentate L is present, and form(s) a total of two co-ordinate bonds to M 1 .
- Aspect 10 The metal aprotic organosilanoxide compound of any one of aspects 1-9 wherein subscript m is an integer from 3 to 50, alternatively 70 to 100, alternatively 40 to 69, alternatively 3 to 39, alternatively 3 to 30, alternatively 3 to 20, alternatively 3 to 10, alternatively 11 to 100, alternatively 15 to 100, alternatively 20 to 100, alternatively 3, alternatively 4, alternatively 5, alternatively 6, alternatively 7, alternatively 8, alternatively 9, alternatively 10, alternatively m is an integer selected from all but one of 3 to 100.
- the metal aprotic organosilanoxide compound of formula (I) may be referred to as a metal aprotic oligoorganosilanoxide compound.
- the metal aprotic organosilanoxide compound of formula (I) may be referred to as a metal aprotic polyorganosilanoxide compound. If m would be 1 or 2 or > 100, the metal aprotic organosilanoxide compound of formula (I) may exhibit weak adhesion promoting or adhesion co-promoting effects; impart undesirable physical properties to a formulation (e.g., decrease dynamic viscosity too much or be too volatile if m is 1 or 2 or increase dynamic viscosity too much or bury the favorable effect of M 1 if m is > 100).
- Aspect 11 The metal aprotic organosilanoxide compound of any one of aspects 1-10 wherein each X 1 independently is a halide, alternatively an aprotic organoheteryl anion.
- the halide may be fluoride, chloride, bromide, or iodide; alternatively fluoride, chloride, or bromide; alternatively fluoride or chloride; alternatively fluoride; alternatively chloride.
- Each R X independently is an aprotic (C 1 - C 20 )hydrocarbyl selected from a (C 1 -C 20 )alkyl, (C 2 -C 20 )alkenyl, or (C 6 -C 20 )aryl; alternatively a (C 1 -C 6 )alkyl or (C 2 -C 6 )alkenyl; alternatively (C 1 -C 6 )alkyl; alternatively methyl, ethyl, or phenyl.
- aprotic (C 1 - C 20 )hydrocarbyl selected from a (C 1 -C 20 )alkyl, (C 2 -C 20 )alkenyl, or (C 6 -C 20 )aryl; alternatively a (C 1 -C 6 )alkyl or (C 2 -C 6 )alkenyl; alternatively (C 1 -C 6 )alkyl; alternatively methyl, ethyl, or
- each of R 1 to R 5 is independently as defined in any one of limitations (i) to (x): (i) each of R 1 to R 5 is independently an aprotic (C 1 -C 20 )hydrocarbyl group or aprotic (C 2 - C 20 )heterohydrocarbyl group, wherein at least one of R 1 to R 5 independently is an aprotic (C 2 -C 20 )alkenyl group; (ii) each of R 1 to R 5 is independently an aprotic (C 1 -C 20 )hydrocarbyl group, wherein at least one of R 1 to R 5 independently is an aprotic (C 2 -C 20 )alkenyl group or aprotic (C 2 -C 20 )alkynyl group; (iii) each of R 1 to R 5 is independently an aprotic (C 1 - C
- aprotic (C 2 -C 20 )alkenyl groups are aprotic (C 2 -C 10 )alkenyl, aprotic (C 2 -C 6 )alkenyl, unsubstituted (C 2 -C 6 )alkenyl, vinyl, allyl, 1-buten-1-yl, 1-buten-4-yl, and 1-hexen-6-yl.
- aprotic (C 2 -C 20 )alkynyl groups are aprotic (C 2 -C 10 )alkynyl, aprotic (C 2 -C 6 )alkynyl, unsubstituted (C 2 -C 6 )alkynyl, acetylenyl, propargyl, 1-butyn-1-yl, 1- butyn-4-yl, and 1-hexyn-6-yl.
- aprotic (C 1 -C 20 )hydrocarbyl groups are aprotic (C 2 -C 20 )alkenyl; aprotic (C 2 -C 20 )alkynyl; aprotic (C 1 -C 10 )hydrocarbyl; aprotic (C 1 -C 10 )alkyl; aprotic (C 3 - C 10 )cycloalkyl; aprotic (C 6 -C 10 )aryl; unsubstituted (C 1 -C 10 )alkyl; unsubstituted (C 3 - C 10 )cycloalkyl; unsubstituted (C 6 -C 1 methyl; ethyl; propyl; 1-methylethyl; butyl; 1- methylpropyl; 2-methylpropyl; 1,1-dimethylethyl; and phenyl.
- aprotic (C 2 -C 20 )heterohydrocarbyl groups are aprotic (C 2 - C 10 )heterohydrocarbyl; aprotic (C 2 -C 6 )heterohydrocarbyl; aprotic (C 2 -C 6 )heteroalkyl; aprotic (C 2 -C 6 )heterocycloalkyl; aprotic (C 2 -C 6 )heteroaryl; unsubstituted (C 2 -C 6 )heteroalkyl; unsubstituted (C 2 -C 6 )heterocycloalkyl; unsubstituted (C 2 -C 6 )heteroaryl; 1-methoxyethyl; oxiranyl; piperidin-1-yl; thiazolyl; and pyridinyl.
- Halo is F, Cl, Br, or I; alternatively F, Cl, or Br; alternatively F or Cl; alternatively F; alternatively Cl.
- the number of substituents is from 2 to per substitution.
- per substitution is limited to halo substituents, e.g., trifluoromethyl, trifluoromethoxy, or pentachloroethyl.
- the maximum number of non-halo substituents in a particular“R” group is equal to the number of carbon atoms of the corresponding unsubstituted version of that“R” group.
- a substituted (C 6 )hydrocarbyl group may contain at most six substituents, each independently selected as described above.
- Fluoro-substituents in any one or more of the R 1 to R 5 and R X groups may enhance the shelf-life stability at 25° C. of the metal aprotic organosilanoxide compound of formula (I).
- unsubstituted di((C 1 -C 6 )alkyl)amino substituents in any one or more of the R 1 to R 5 and R X groups may decrease the shelf-life stability at 25° C. of the metal aprotic organosilanoxide compound of formula (I).
- the unsubstituted di((C 1 - C 6 )alkyl)amino substituents may enable gelation of the collection of molecules of the substituted metal aprotic organosilanoxide compound of formula (I) containing same. Gelation may be desirable in applications in which gels may be employed such as in priming a surface of a substrate or in forming a thermal gel for use as a thermal interface material.
- the metal aprotic organosilanoxide compound of formula (I) containing the unsubstituted di((C 1 -C 6 )alkyl)amino substituent(s) may be diluted in a solvent, thereby inhibiting or preventing gelation.
- the (A) metal aprotic organosilanoxide compound of formula (I) includes solvates thereof.
- the solvate may be defined as being a metal aprotic organosilanoxide compound of formula (I) as described except further comprising an aprotic organic solvent molecule.
- the solvent molecule may contain at least one heteroatom independently selected from N, O, and S. Examples of suitable organic solvents are such as carboxylic esters, ethers, and ketones.
- the metal aprotic organosilanoxide compound of formula (I) may be characterized by a concentration of the metal and/or aprotic (C 2 -C 20 )alkenyl group and/or aprotic (C 2 - C 20 )alkynyl group therein.
- the metal aprotic organosilanoxide compound of formula (I) may be characterized by a molar ratio of the number of moles of the aprotic (C 2 -C 20 )alkenyl groups and/or aprotic (C 2 -C 20 )alkynyl groups to the number of moles of the metal.
- Unsub/Met The molar ratio may be abbreviated as“Unsub/Met” wherein Unsub” is the total number of moles of aprotic (C 2 -C 20 )alkenyl groups and aprotic (C 2 -C 20 )alkynyl groups and “Met” is the number of moles of metal atoms.
- the Unsub/Met is from 1 to 2 ⁇ + , alternatively from 1 to ⁇ + , alternatively 1, alternatively 2, alternatively 3.
- a composition comprising the metal aprotic organosilanoxide compound of any one of aspects 1-12 and at least one other constituent.
- the composition may be characterized by a concentration of the metal aprotic organosilanoxide compound of formula (I) therein.
- the concentration may be 5 to ⁇ 100 weight percent (wt%), alternatively 10 to ⁇ 100 wt%, alternatively 20 to ⁇ 100 wt%, alternatively 50 to ⁇ 100 wt%, alternatively 67 to ⁇ 100 wt%, alternatively 75 to ⁇ 100 wt%, alternatively 90 to ⁇ 100 wt%, alternatively 50 to 80 wt%, alternatively 20 to 50 wt%, alternatively 99 to ⁇ 100 wt% of the composition.
- the wt% concentration may be determined by tracking amounts of constituents added to the composition.
- the total concentration of the aprotic (C 2 - C 20 )alkenyl groups and aprotic (C 2 -C 20 )alkynyl groups in constituent (A) is from > 0 to 10 millimoles per gram of constituent (A) (mmol/g), alternatively from > 0 to 5 mmol/g, alternatively from 0.5 to 5 mmol/g, alternatively from 1.0 to 4.0 mmol/g.
- the metal aprotic organosilanoxide compound of formula (I) may be characterized by a concentration of the metal therein.
- the metal concentration may be 0.01 to 100 millimoles per gram (mmol/g) of the metal aprotic organosilanoxide compound of formula (I), alternatively 0.01 to 50 mmol/g, alternatively 0.020 to 20 mmol/g, alternatively 0.050 to 10 mmol/g, alternatively 0.10 to 5 mmol/g, alternatively 0.15 to 5 mmol/g of the metal aprotic organosilanoxide compound of formula (I).
- the mmol/g metal concentration may be determined by tracking amounts of constituents added to prepare the metal aprotic organosilanoxide compound of formula (I).
- the composition may be characterized by a concentration of the metal therein.
- the metal concentration may be 5 to ⁇ 100 mole percent (mol%), alternatively 10 to ⁇ 100 mol%, alternatively 20 to ⁇ 100 mol%, alternatively 50 to ⁇ 100 mol%, alternatively 67 to ⁇ 100 mol%, alternatively 75 to ⁇ 100 mole%, alternatively 90 to ⁇ 100 mol%, alternatively 50 to 80 mol%, alternatively 20 to 50 mol%, alternatively 99 to ⁇ 100 mol% of the composition.
- the mol% metal concentration may be determined by tracking amounts of constituents added to the composition.
- the at least one other constituent of the composition is different than the metal aprotic organosilanoxide compound of formula (I) in structure; phase; function; metal content, if any; silicon content, if any; proticity; or a combination of any two or more thereof.
- the at least one other constituent may be the same phase as, alternatively a different phase than the metal aprotic organosilanoxide compound of formula (I) (e.g., both may be solids, or one may be a liquid and the other a solid).
- the at least one other constituent may be free of, alternatively exhibit an adhesion promoting effect.
- the at least one other constituent may be free of, alternatively contain Si atoms.
- the at least one other constituent may be free of, alternatively contain metal atoms.
- the at least one other constituent may be aprotic, alternatively protic.
- Examples of the at least one other constituent are constituents (a) to (h): (a) an organosilanol compound of formula (II): wherein subscript m and
- subscripts m, o and p and groups R 1 -R 5 , L, and X 1 are independently as defined for formula (I), and metal atom, M 2 , is an element of Group 1 or a hemi-element of Group 2; (c) an organosilane-diol compound of formula (IV): 4 5 wherein subscript m
- the invention comprises the dimetal organosilan-dioxide of formula (VI).
- the embodiments may include the dimetal organosilan-dioxide of formula (VI) instead of, alternatively in addition to, the metal aprotic organosilanoxide compound of formula (I).
- the invention comprises the metal organosilan-dioxide of formula (VII).
- the embodiments may include the dimetal organosilan-dioxide of formula (VII) instead of, alternatively in addition to, the metal aprotic organosilanoxide compound of formula (I).
- the composition may be formulated to be curable as described later for“curable formulation”.
- the at least one other constituent of the curable composition or formulation may comprise, instead of or in addition to constituents (a) to (g), a monomer, prepolymer, or curable polymer.
- the curable composition or formulation further comprises a crosslinker, a cure catalyst, or both.
- the curable composition or formulation may be formulated to be condensation curable, hydrosilylation curable, and/or free radical curable as described later.
- M 2 is an element of Group 1 selected from Li, Na, K, and Cs; alternatively Li, Na, and K; alternatively Li and Na; alternatively Li and K; alternatively Na and K; alternatively Li; alternatively Na; alternatively K.
- M 2 is a hemi- element of Group 2 selected from hemi Mg, hemi Ca, and hemi Ba; i.e., 0.5 Mg, 0.5 Ca, and 0.5 Ba.
- the organosilanol compound When m is 3 or 4, the organosilanol compound may be referred to as an oligoorganosilanol compound; and when m is 5 to 100, the organosilanol compound may be referred to as a polyorganosilanol compound.
- the organosilanol compound of formula (II) may be obtained from commercial sources or synthesized by selectively endcapping the organosilane-diol compound of formula (IV):H-[O-Si(R 4 )(R 5 )] m -OH (IV), wherein subscript m and groups R 4 -R 5 are as defined for formula (IV).
- the organosilane-diol compound of formula (IV) has on average, per molecule, one SiOH group at each terminus, and may be selectively endcapped by contacting it with one molar equivalent of an endcapper compound of formula R 1 -Si(R 2 )(R 3 )-X 1 , wherein R 1 -R 3 are as defined for formula (I) and X 1 independently is a halide or an aprotic organoheteryl anion.
- Each R X independently is an aprotic (C 1 - C 20 )hydrocarbyl selected from a (C 1 -C 20 )alkyl, (C 2 -C 20 )alkenyl, or (C 6 -C 20 )aryl; alternatively a (C 1 -C 6 )alkyl or (C 2 -C 6 )alkenyl; alternatively (C 1 -C 6 )alkyl; alternatively methyl, ethyl, or phenyl. Endcapping methods are well-known in the art.
- the organosilane-diol compound of formula (IV):H-[O-Si(R 4 )(R 5 )] m -OH (IV) may be obtained from commercial sources or made by methods that are well-known in the art. For example, by contacting, under condensation reaction conditions, water with a diorganosilane of formula (B): (X 1 ) 2 SiR 4 R 5 (B), wherein groups R 4 and R 5 are as defined for formula (IV) and group X 1 is independently a halide or an aprotic organoheteryl anion as defined above.
- Aspect 16 The method of making of aspect 15 wherein the formal positive oxidation state, ⁇ + , of M 1 in formula (A) is different than the formal positive oxidation state, ⁇ + , of M 1 in formula (I), and the method further comprises a reduction or oxidation reaction step, as the case may be, to convert the formal positive oxidation state, ⁇ + , of the metal, M 1 , of the metal salt reactant of formula (A) to the formal positive oxidation state, ⁇ + , of the metal, M 1 , of the metal organosilanoxide compound of formula (I).
- the reduction or oxidation reaction step may further include a reductant or oxidant, respectively, to effect the reduction or oxidation.
- the reductant is used when the ⁇ + of M 1 in formula (A) is greater than the ⁇ + of M 1 in formula (I).
- the oxidant is used when the ⁇ + of M 1 in formula (A) is less than the ⁇ + of M 1 in formula (I).
- the reduction or oxidation reaction step may occur before, during, and/or after the contacting step.
- the reduction or oxidation reaction may occur in the same or different reactor vessel as the contacting step.
- Aspect 17 The method of making of aspect 15 wherein the formal positive oxidation state, ⁇ + , of M 1 in formula (A) is the same as the formal positive oxidation state, ⁇ + , of M 1 in formula (I), and the method may not further comprise a reduction or oxidation step and may not further comprise a reductant or oxidant.
- each X 1 in formula (A) is the same as X 1 in formula (I).
- the ⁇ + of M 1 in formula (A) is the same as the ⁇ + of M 1 in formula (I); the method does not further comprise a reduction or oxidation step and does not further comprise a reductant or oxidant; and each X 1 is the same in formulas (A) and (I).
- each X 1 is a halide, alternatively an aprotic organoheteryl anion, alternatively an alkoxide.
- the method of making the metal aprotic organosilanoxide compound of formula (I) may comprise contacting an organosilanol precursor compound (e.g., the organosilanol of formula (II) described above) with a metal salt reactant that is free of silicon (e.g., the metal salt reactant of formula (A) described above) to give a product reaction mixture comprising the metal aprotic organosilanoxide compound of formula (I) and a by-product, described below.
- the metal salt reactant e.g., the metal salt reactant of formula (A) described above
- the metal salt reactant may be obtained from commercial sources or synthesized by any suitable method, many of which are well-known in the art.
- the contacting step prepares the metal aprotic organosilanoxide compound of formula (I) directly from the organosilanol precursor compound and the metal salt reactant without going through an intermediate metal aprotic organosilanoxide ligand complex wherein the metal is not the same metal as M 1 in formula (I).
- X 1 in formula (A) independently is a halide
- the contacting step and the product reaction mixture further comprises a metal non- nucleophilic base, such as an organoheteryl metal wherein the metal is the same metal as M 1 in formula (I); and the product reaction mixture further comprises a second by-product.
- the by-products are an organoheteryl-H corresponding to the organoheteryl metal and a metal halide salt corresponding to the halide.
- the organoheteryl is an alkoxide and the halide is a chloride
- the by-products are an alcohol corresponding to the alkoxide and a metal chloride corresponding to the halide.
- the metal non-nucleophilic base such as an organoheteryl metal wherein the metal is the same metal as M 1 in formula (I)
- the metal non-nucleophilic base may be omitted from the contacting step, and thus from the resulting product reaction mixture.
- the method of making the metal aprotic organosilanoxide compound of formula (I) may comprise contacting the organosilanol precursor compound (e.g., the organosilanol of formula (II) described above) with a metal alkoxide salt reactant that is free of silicon (e.g., the metal salt reactant of formula (A) described above wherein each X 1 independently is an alkoxide) to give a product reaction mixture comprising the metal aprotic organosilanoxide compound of formula (I) and an alcohol by-product corresponding to the alkoxide.
- a metal alkoxide salt reactant that is free of silicon e.g., the metal salt reactant of formula (A) described above wherein each X 1 independently is an alkoxide
- the product reaction mixture that contains the metal aprotic organosilanoxide compound of formula (I) and by-product(s) may be used“as is”, i.e., without further processing, or may be further processed. Further processing of the product reaction mixture may comprise removing the by-product(s) therefrom, removing any solvent therefrom, isolating and/or purifying the metal aprotic organosilanoxide compound of formula (I) therefrom, and/or solvent-exchanging the solvent of the product reaction mixture for (replacing with) another solvent.
- the by-product that is the organoheteryl-H e.g., the alcohol, and the solvent may be removed from the product reaction mixture by any suitable technique such as evaporating, distilling, stripping, blotting, decanting, triturating, extracting, or a combination of any two or more thereof.
- the by-product that is the metal halide may be removed from the product reaction mixture by any suitable technique such as filtering or centrifuging/decanting.
- the isolating and/or purifying may comprise precipitating or filtering the metal aprotic organosilanoxide compound of formula (I) therefrom, alternatively precipitating or filtering the by-product therefrom.
- the precipitating may be performed by cooling the product reaction mixture and/or by adding to the reaction mixture a desolubilizing additive such as an organic liquid in which the would-be precipitate is insoluble.
- a desolubilizing additive such as an organic liquid in which the would-be precipitate is insoluble.
- the contacting step and further processing steps may be carried out using conventional techniques for air and moisture sensitive materials such as vacuum-gas manifold equipment (so-called Schlenk line techniques), cannula transfers, inert gas atmospheres, anhydrous solvents, and the like. These techniques are well known.
- the method of making the metal aprotic organosilanoxide compound of formula (I) may comprise going through an intermediate metal aprotic organosilanoxide ligand complex wherein the metal is not Al, Ce, Fe, or V.
- the method comprises preliminarily contacting the organosilanol precursor compound (e.g., the organosilanol of formula (II) described above) with an effective amount of a Group 1 metal or Group 2 hemi-metal non-nucleophilic base such as a Group 1 metal or Group 2 hemi-metal alkoxide (e.g., potassium tertiary-butoxide), a Group 1 metal or Group 2 hemi-metal secondary amide (e.g., lithium diisopropylamide), a Group 1 metal or Group 2 hemi-metal carbanion (e.g., tertiary-butyl lithium ), a Group 1 metal or Group 2 hemi-metal hydride (e.g., NaH or CaH 2 ), a Grignard reagent (e.g., ethyl magnesium bromide), or a Group 1 metal or Group 2 hemi-metal disilazane (
- the intermediate by-product is an alcohol corresponding to the alkoxide, a secondary amine corresponding to the secondary amide, a hydrocarbon corresponding to the carbanion, molecular hydrogen, a hydrocarbon (e.g., ethane) corresponding to the Grignard reagent, or a bis(trialkylsilyl)amine corresponding to the disilazane.
- the Group 1 metal and Group 2 hemi metal may be as defined above for M 2 in formula (III).
- the Group 1 metal may be lithium, sodium, potassium, or cesium.
- the Group 2 hemi-metal may be hemi-magnesium or hemi-calcium (i.e., 0.5 Mg or 0.5 Ca).
- the intermediate reaction mixture that contains the metal aprotic organosilanoxide ligand intermediate and an intermediate by-product may be used“as is”, i.e., without further processing, or may be further processed. Further processing of the intermediate reaction mixture may comprise may comprise isolating and/or purifying the metal aprotic organosilanoxide ligand intermediate therefrom, or concentrating or solvent-exchanging the intermediate reaction mixture; all prior to the next contacting step. The isolating and/or purifying may comprise precipitating or filtering the metal aprotic organosilanoxide ligand intermediate therefrom, alternatively precipitating or filtering the by-product therefrom.
- the precipitating may be performed by cooling the intermediate reaction mixture and/or by adding to the intermediate reaction mixture a desolubilizing additive such as an organic liquid in which the would-be precipitate is insoluble.
- a desolubilizing additive such as an organic liquid in which the would-be precipitate is insoluble.
- the preliminary contacting step and further processing steps may be carried out using conventional techniques for air and moisture sensitive materials such as vacuum-gas manifold equipment (so-called Schlenk line techniques), cannula transfers, inert gas atmospheres, anhydrous solvents, and the like.
- the contacting steps described herein independently are typically performed in a solvent such as an organic solvent or a polydimethylsiloxane fluid, and so the reaction mixtures typically further comprises the solvent.
- suitable aprotic organic solvents are hydrocarbons such as isoalkanes, toluene, and xylenes; ethers such as tetrahydrofuran and dioxane; alcohols such as 2-propanol and 1-butanol; ketones such as methyl ethyl ketone; and pyridine.
- the solvent is aprotic, alternatively protic.
- the contacting steps may be conducted at any suitable temperatures such as from -50° to 150° C. for any suitable period of time such as from 1 minute to 1 day. Generally, the higher the contacting temperature the shorter the period of time.
- the metal aprotic organosilanoxide compound of formula (I) may be used as such or as a constituent in a variety of formulations, which include silicone formulations and organic formulations. Examples of such formulations are adhesives, coatings, elastomers, encapsulants, pottants, and sealants, each of which include silicone formulations and organic formulations.
- Embodiments of the metal aprotic organosilanoxide compound of formula (I) that are used as such may be used as a primer, filler treating agent, or condensation reaction catalyst.
- the primer may be used on a substrate that is in need of adhesion, coating, elastomer, encapsulating, potting, or sealing.
- the filler treating agent may be used on an untreated filler.
- untreated fillers that may be treated with the metal aprotic organosilanoxide compound of formula (I) are silica, boron nitride, alumina, and zirconium dioxide; alternatively silica, boron nitride, and alumina; alternatively silica and boron nitride; alternatively silica and alumina; alternatively silica; alternatively boron nitride; alternatively alumina; alternatively zirconium dioxide.
- Additional examples of untreated fillers that may be treated with the metal aprotic organosilanoxide compound of formula (I) are metal powders, ceramic particles, and mixtures thereof.
- untreated fillers that may be treated with the metal aprotic organosilanoxide compound of formula (I) are carbon particles such as carbon nanotubes (e.g., single-wall or multi-wall), powdered diamond, powdered graphite, graphene, and carbon blacks.
- carbon particles such as carbon nanotubes (e.g., single-wall or multi-wall), powdered diamond, powdered graphite, graphene, and carbon blacks.
- metal powders are powders of aluminum, cobalt, copper, gold, iron, nickel, palladium, platinum, silver, tin, titanium, zinc, and alloys of any two or more thereof.
- the metal particles may have a metal oxide or metal nitride surface layer.
- the metal particles may be core-shell particles comprising a non-metallic core (e.g., glass beads or spheres) and an outer metal shell disposed thereon.
- Ceramic particles are zinc oxide; alumina; a nitride such as an aluminum nitride or boron nitride; a metal oxide such as aluminum oxide, beryllium oxide, copper oxide, magnesium oxide, nickel oxide, silver oxide, zinc oxide, or a combination of any two or more thereof; a metal hydroxide such as aluminum trihydrate or magnesium hydroxide; onyx, a metal carbide such as silicon carbide or tungsten carbide; or a metal titanate such as barium titanate.
- the ceramic particles differ from the metal particles, including the metal particles having a metal oxide or metal nitride surface layer or support material in at least one feature, structure, function, reactivity or property.
- the condensation reaction catalyst may be used for catalyzing curing of monomers, prepolymers, and/or curable polymers.
- monomers, prepolymers, or curable polymers whose curing may be catalyzed by the metal aprotic organosilanoxide compound of formula (I) are urethane, SiOH functional silanes, and SiOH-functional organosiloxanes. Curing of the urethane monomers, prepolymers, or curable polymers gives condensation cured polyurethanes. Curing of the SiOH-functional silanes or organosiloxane prepolymers or curable polymers gives condensation cured polyorganosiloxanes.
- the untreated filler may be in the shape of cuboidals, flakes, granules, irregulars, needles, powders, rods, spheres, or a mixture of any two or more of cuboidals, flakes, granules, irregulars, needles, powders, rods, and spheres.
- Embodiments of the metal aprotic organosilanoxide compound of formula (I) that are used as a constituent in the silicone formulation may function as an adhesion promoter or co- promoter, e.g., in the adhesive, coating, elastomer, encapsulant, pottant, or sealant formulation.
- the formulations are expected to have enhanced adhesion to a substrate compared to an identical formulation except lacking the metal aprotic organosilanoxide compound of formula (I).
- the adhesive, coating, elastomer, encapsulant, pottant, or sealant formulation may be applied to a substrate in need of adhesion, coating, elastomeric functionality, encapsulating, potting, or sealing.
- Embodiments of the metal aprotic organosilanoxide compound of formula (I) that are used as an adhesion promoter may function to enhance adhesion of the adhesive, coating, elastomer, encapsulant, pottant, or sealant formulation to a substrate.
- the formulation may further comprise an additional constituent that is an adhesion promoter other than the metal aprotic organosilanoxide compound of formula (I), such as a conventional adhesion promoter.
- an adhesion promoter other than the metal aprotic organosilanoxide compound of formula (I)
- the metal aprotic organosilanoxide compound of formula (I) may enhance the adhesion-promoting effect of the conventional adhesion promoter so as to synergistically increase adhesion of the adhesive, coating, elastomer, encapsulant, pottant, or sealant formulation to a substrate.
- the substrate may be unprimed (bare) or primed prior to applying the adhesive, coating, encapsulant, or sealant formulation thereto.
- a primed substrate is a substrate that has been pre-treated with a primer, which may be the same as or different than the metal aprotic organosilanoxide compound of formula (I), wherein pre-treatment occurs prior to the applying step.
- the composition that comprises the metal aprotic organosilanoxide compound of formula (I) and at least one other constituent is used as the adhesive formulation, coating formulation, elastomer formulation, encapsulant formulation, pottant formulation, or sealant formulation.
- the formulation is an organic formulation (e.g., an epoxy- based adhesive formulation).
- the formulation is a silicone formulation such as a silicone adhesive formulation, a silicone coating formulation, a silicone elastomer formulation, a silicone encapsulant formulation, a silicone pottant formulation, or a silicone sealant formulation.
- the organic or silicone adhesive formulation may be a pressure-sensitive adhesive formulation.
- Substrate materials that are suitable for being adhered, coated, encapsulated, potted, or sealed with the formulations include silicate glass, metals, organic polymers, polyorganosiloxanes, wood, paper, and semiconductor materials such as silicon and silicon carbide.
- the substrate in need of adhesion, coating, encapsulating, potting, or sealing may be a container, fabric, plastic film, paper, printed circuit board, structural member of a machine, vehicle, or manufactured article, or textile.
- the adhesive formulation may be used as a tie layer in a photovoltaic cell module to adhere a photovoltaic cell to a substrate or superstrate thereof.
- the coating formulation may be used to coat an air bag in vehicular applications such as automotive applications.
- the elastomer formulation may be used as a vibration dampening component of an electronic device.
- the encapsulant formulation may be used to encapsulate a solid state light such as a light-emitting diode (LED), a photovoltaic device such as a photovoltaic or solar panel or battery, or an electronic device such as a printed circuit.
- the pottant formulation may be used to pot a power converter component such as a microinverter.
- the sealant formulation may be used to seal a display panel to a frame of a smartphone or flat-screen television.
- the composition may be formulated to be a curable formulation such as a curable silicone formulation.
- the curable silicone formulation may be formulated to be condensation curable, hydrosilylation curable, free radical curable, or dual-curable.
- the silicone formulations are condensation curable and/or free radical curable, alternatively hydrosilylation curable and/or free radical curable; alternatively condensation curable and/or hydrosilylation curable, alternatively condensation curable, alternatively hydrosilylation curable, alternatively free radical curable, alternatively dual curable.
- the dual- curable formulations may be curable by condensation and free radical curing mechanisms or hydrosilylation and free radical curing mechanisms.
- the free radical curing may comprise radiation curing, peroxide curing, or both.
- the rate of curing may be enhanced by applying heat, pressure, or both to the formulation.
- the at least one other constituent of the curable silicone formulation may comprise, instead of or in addition to constituents (a) to (g), a monomer, prepolymer or curable polymer. Upon curing, the monomer, prepolymer or curable polymer are chemically converted into a polymer of higher molar mass, and then into a network.
- the curable silicone formulation further comprises a crosslinker, a cure catalyst, or both. The crosslinker may be used to form the network.
- the monomer, prepolymer or curable polymer may contain silicon-bonded unsaturated aliphatic groups and the crosslinker may contain silicon-bonded hydrogen atoms (SiH groups).
- SiH groups silicon-bonded hydrogen atoms
- the monomer, prepolymer or curable polymer and the crosslinker independently may contain silicon-bonded unsaturated aliphatic groups.
- the monomer, prepolymer or curable polymer and the crosslinker independently may contain silicon-bonded hydrolyzable groups.
- the monomer, prepolymer or curable polymer may contain two different types of curable groups.
- the free radical curing uses radiation and/or a peroxide to initiate curing.
- the radiation may comprise ultraviolet radiation.
- the peroxide may be an inorganic or organic peroxide.
- the inorganic peroxide may be a hydroperoxide.
- the organic peroxide may be a peroxycarboxylic ester or a peroxycarboxylic anhydride.
- Condensation curing uses water as a curing agent and, optionally, a condensation reaction catalyst.
- Typical condensation reaction catalysts are tin (Sn) compounds.
- Hydrosilylation curing uses a hydrosilylation catalyst and/or a crosslinker.
- the hydrosilylation catalyst typically is based on platinum, rhodium, ruthenium, or palladium.
- the hydrosilylation catalyst is a Pt catalyst.
- the composition may further comprise a titanium and/or zirconium aprotic organosilanoxide compound.
- the present invention further comprises a mixture of the metal aprotic organosilanoxide compound of formula (I) and a metal aprotic organosilanoxide compound of formula (VIII): ⁇ R 1 -Si(R 2 )(R 3 )-[O-Si(R 4 )(R 5 )] m -O ⁇ n - M 3 ( ⁇ L) o (X 1 ) p (VIII), wherein M 3 is Pt having a formal positive oxidation state, ⁇ + , of +1 to +6, Pd having a formal positive oxidation state, ⁇ + , of +1 to +6, Rh having a formal positive oxidation state, ⁇ + , of +1 to +6, Ru having a formal positive oxidation state, ⁇ + , of +1 to +8, Sn having a formal positive oxidation state, ⁇ + , of +1 to +4, Ti having a formal positive oxidation state,
- ⁇ + for Pt is +2 or +4, ⁇ + for Pd is +2 or +4, ⁇ + for Ru is +3 or +4, ⁇ + for Rh is +3, ⁇ + for Sn is +2 or +4, ⁇ + for Ti is +4, and ⁇ + for Zr is +4.
- M 3 is Pt, Pd, Rh, or Ru; alternatively Pt or Rh; alternatively Pt, alternatively Pd, alternatively Rh, alternatively Ru; and M 3 is not Sn, Ti, or Zr.
- M 3 is Sn, Ti, or Zr; alternatively Sn or Ti; alternatively Sn or Zr; alternatively Ti or Zr; alternatively Sn, alternatively Ti, alternatively Zr; and M 3 is not Pt, Pd, Rh, or Ru.
- the crosslinker may be an organosiloxane having on average, per molecule, two or more silicon-bonded hydrogen atoms (Si-H groups).
- the metal aprotic organosilanoxide compound of formula (I) may be as described in any one of aspects 1 to 11.
- the formulations may be formulated as 1-part formulations or as multi-part formulations such as a 2-part formulations.
- the constituents of the formulations may be mixed together by any suitable means such as by mechanically agitating them together such as by shaking or stirring.
- the formulations may be packaged as such along with instructions for their use in a particular application such as adhesive, coating, elastomerizing, encapsulating, potting, or sealing application.
- the multi-part formulations may be packed in multiple packages and the instructions may further include directions for combining the different parts prior to use in a particular application.
- the metal aprotic organosilanoxide compound of formula (I) may be may be kept in a separate part and other constituents in other part(s), and then the parts may be mixed with each other just prior to use in the application.
- the multi-part formulation may be stored at any suitable temperature such as from 20° to 40° C.
- the metal aprotic organosilanoxide compound of formula (I) when used in a 1-part formulation, the 1-part formulation may be stored at a lower temperature such as from -20° to 20° C. In some embodiments the metal aprotic organosilanoxide compound of formula (I) may be made in situ in the 1-part or multiple-part formulation.
- the organosilanol compound of formula (II): ⁇ R 1 -Si(R 2 )(R 3 )-[O-Si(R 4 )(R 5 )] m -OH (II) may kept in one part, the monomer, prepolymer or curable polymer and other constituents such as crosslinker in another part, the catalyst in still another part, and the metal salt reactant of formula (A): M 1 (X 1 ) q (A) may be kept in a fourth part, and then shortly before use of the formulation, the first and fourth parts may be combined with heating to form the metal aprotic organosiloxane compound of formula (I) in situ, the by-product such as alcohol may be removed, and then the resulting product may be combined with the other parts to give the formulation.
- Embodiments of the present invention also include a cured product prepared by curing the curable formulation.
- the cured product is a cured organic product prepared by curing the curable organic formulation (e.g., a curable epoxy formulation).
- the cured product is a cured silicone product prepared by curing any one of the curable silicone formulations.
- the curing may be performed by heating the curable silicone formulations at cure temperatures of from 70° to 200° C., alternatively 80° to 150° C., alternatively 90° to 120° C.
- the curing may produce the cured silicone product, wherein the cured silicone product is free of bubbles.
- the inventive cured silicone product prepared by curing the curable silicone formulation may have improved tolerance for moisture content residing on surface of substrate in order for the cured silicone product to achieve good adhesion to the substrate. This means that there may be no need to pre-dry the surface of the substrate before applying the inventive curable silicone formulation thereto, especially when the moisture content of the surface of the substrate is from > 0 to ⁇ 1.8 wt%.
- a cured product of an identical comparative (non-invention) curable silicone formulation except lacking the metal aprotic organosilanoxide compound of formula (I) may have significantly lower adhesion to the surface of the substrate having the same moisture content.
- the adhesion of the inventive cured silicone product prepared by curing the curable silicone formulation may be further improved when the curable silicone formulation is an addition curable formulation such as hydrosilylation curable or free radical curable.
- the curable silicone formulation is an addition curable formulation such as hydrosilylation curable or free radical curable.
- heating at relatively low adhesion-producing temperatures of from 70° to 120° C., alternatively 80° to 110° C., alternatively 90° to 100° C. may be sufficient.
- an identical comparative (non-invention) hydrosilylation curable silicone formulation except lacking the metal aprotic organosilanoxide compound of formula (I) may require higher adhesion- producing temperatures ⁇ 140° C.
- the improvement in adhesion is enhanced further, and stability to heat may be beneficially increased, when the inventive hydrosilylation curable silicone formulation contains a platinum hydrosilylation catalyst, whereas the non-invention hydrosilylation curable silicone formulation contains a titanium catalyst such as tetrabutyl titanate and may exhibit poor heat stability.
- the metal aprotic organosilanoxide compound of formula (I) may be a liquid, which enables increased compatibility with other silicones materials such as silicone prepolymers or curable silicone polymers such as those prepolymers and curable polymers based on dimethylsilicones or methyl,phenyl silicones. This compatibility can beneficially enable the curable silicone formulations, and cured silicone products prepared by curing same, to be optically clear..flexible designs of formulations and applications.
- the metal aprotic organosilanoxide compound of formula (I) may be any one of, or a combination of any two of, the Examples 1A, 1AA, 1B to 1G, 2A to 2E, 3A to 3E, and 4A described later.
- a Markush group of members A and B may be equivalently expressed as:“a member selected from A and B”;“a member selected from the group consisting of A and B”; or“a member A or B”. Each member may independently be a subgenus or species of the genus. May confers a permitted choice, not an imperative.
- Operative means functionally capable or effective.
- Optional(ly) means is absent (or excluded), alternatively is present (or included).
- Properties are measured using a standard test method and conditions for the measuring (e.g., viscosity: 23° C and 101.3 kPa). Ranges include endpoints, subranges, and whole and/or fractional values subsumed therein, except a range of integers does not include fractional values. Removing a component from a mixture of components does not include selectively derivatizing/reacting the component to form a derivative/product unless the derivative/product is then physically separated from the other components of the mixture.
- Compound shall mean a molecule or collection of such molecules; composition shall mean a mixture of two or more different compounds, wherein the mixture may be configured to be non-curable, alternatively configured to be curable; formulation shall mean a composition configured for a particular use to have a particular material property such as an acoustical, chemical, electrical, magnetic, mechanical, optical, physical, radiological, or thermal property, or a combination of any two or more thereof.
- Cured product such as cured organosiloxane may have a structure that can be varied depending upon the particular reactants and curing conditions used to make it. This variability is not unlimited, but is restricted according to the structures of the reactants (e.g., backbone and/or curable group structures) and curing chemistry and conditions.
- Formulation, one-part means a mixture containing all the constituents and in proportions needed to produce a cured product.
- the one-part formulation may use external factors such as moisture (for condensation curing), heat (for addition curing), or light (for addition curing) to initiate, speed or complete the curing process.
- Formulation, two-part means a system that segregates different reactive constituents into two separate and complementary divisions to prevent premature initiation of curing.
- a monomer, prepolymer, or curable polymer, but not a catalyst may be included in a primary part; and a cure catalyst, but not a monomer, prepolymer, or curable polymer, may be included in a secondary part.
- Initiation of curing is achieved by combining the primary part and the secondary part together to form a one-part formulation.
- Substituted means having, in place of hydrogen, one or more substituents, including per substitution.
- Halogen atom is F, Cl, Br, or I; alternatively F, Cl, or Br; alternatively F or Cl; alternatively F; alternatively Cl.
- Each substituent, alternatively all substituents may be aprotic, alternatively protic.
- Vehicle means a liquid acting as a carrier, diluent, dispersant, storage medium, supernatant, or solvent for another material.
- Any compound herein includes all its isotopic forms, including natural abundance forms and/or isotopically-enriched forms.
- the isotopically-enriched forms may have additional uses, such as medical or anti-counterfeiting applications, wherein detection of the isotopically-enriched form is helpful in treatment or investigation.
- any composition or formulation described herein may contain any one or more of the chemical elements of Groups 1 to 18 of the Periodic Table of the Elements. In other aspects at least one such chemical element is specifically excluded from the composition or formulation, except where such exclusion would negate the same.
- Si atoms are not excluded from silicon compounds and carbon atoms are not excluded from organo groups.
- elements that are not excluded are Si, O, H, C, N, F, Cl, Br, and I; alternatively Si, O, H, C, F, and Cl.
- Preparation 1 mixed 101.6 grams (g) di(OH-terminated)-PDMS fluid (Gelest DMS- S12; “PDMS” means polydimethylsiloxane) with 33.2 g 1,2-divinyl-1,1,2,2- tetramethyldisilazane in a 250 mL three-neck flask. Added 0.1g trifluoroacetic acid (TFA) to catalyze the reaction. Stirred the mixture for 80 minutes at room temperature, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 30° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (114.2 g).
- TFA trifluoroacetic acid
- the product had -OH content of 3.2 wt% and Vi content of 5.5 wt% and included over 50 wt % of the following silicone fluid of formula: Vi(Me) 2 Si[OSi(Me) 2 ] n OH, wherein n is 5 or 6, Vi is vinyl, and Me is methyl.
- Preparation 2 mixed 404.3 g di(OH-terminated)-poly(dimethyl)(vinyl,methyl)siloxane fluid (Dow Corning® 4-7042 fluid) with 80.0 g 1,1,1,2,2,2-hexamethyldisilazane (HMDZ) in a 1 liter three-neck flask. Added 0.2 g TFA to catalyze the reaction. Used an ice bath to remove heat and keep temperature below 30° C. After 3 hours removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 30° C.
- Produced desired product which was the remainder (not the volatiles), as a clear liquid (447.9 g) that was determined by 29 Si NMR to have a -OH content of 4.7 wt% and calculated, assuming mass balance conservation, to have a Vi content of 10.2 wt%.
- the product includes over 50% of the silicone fluid of formula: (Me) 3 Si[OSi(Me)(Vi)] n OH, wherein n is about 4, Vi is vinyl, and Me is methyl.
- Preparation 3 (prophetic): mix 405.2 g di(OH-terminated)-PDMS fluid with 79.9 g 1,2- dimethyl-1,1,2,2-tetravinyldisilazane in a 1 liter three-neck flask. Add 0.28 g TFA to catalyze the reaction. Use a water bath to remove heat and keep temperature below 30° C. After 2.5 hours remove volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 5.5 hours at 25° to 30° C.
- Produce desired product which is the remainder (not the volatiles), as a clear liquid (427.5 g) that is determined by 29 Si NMR to have -OH content of 3.25 wt% and a Vi content of 2 wt%.
- the product includes over 50% of the silicone fluid of formula: Vi(Me) 2 Si[OSi(Me) 2 ] n OH, wherein n is 5 or 6, Vi is vinyl, and Me is methyl.
- Preparation 4 mixed 103.7 g di(OH-terminated)-poly(phenyl,methyl)siloxane (Dow Corning® PB fluid) with 15.38 g 1,2-divinyl-1,1,2,2-tetramethyldisilazane in a 250 mL three- neck flask. Added 3 drops of TFA to catalyze the reaction. Stirred the mixture at room temperature for 2 hours, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 1 hour at 65° C.
- Produced desired product which was the remainder (not the volatiles), as a clear liquid (111.0 g) that was determined by 29 Si NMR to have a -OH content of 2.84 wt% and a Vi content of 2.98 wt%.
- the product includes over 50% of the silicone fluid of formula: Vi(Me) 2 Si[OSi(Me)(Ph)] n OH, wherein n is 4 or 5, Ph is phenyl, Vi is vinyl, and Me is methyl.
- Preparations 5-7 alternative method to remove by-product ammonia (NH 3 ) after reaction of di(OH-terminated)-polydiorganosiloxane with a disilazane: [0077]
- Preparation 5 mixed 134.6g di(OH-terminated)-poly(phenyl,methyl)siloxane (Dow Corning® PB fluid) with 134.6 g toluene and 16.3 g HMDZ in a 500 mL three-neck flask. Added 0.1g TFA to catalyze the reaction. Stirred the mixture at room temperature for 30 minutes, and then transferred it to a separatory funnel.
- Preparation 6 mixed 432 g di(OH-terminated)-poly(phenyl,methyl)siloxane (Dow Corning® PB fluid) with 320 g heptanes and 64.6 g 1,2-divinyl-1,1,2,2-tetramethyldisilazane in a 1 liter three-neck flask. Added 2.0 g TFA to catalyze the reaction. Stirred the mixture at room temperature for 1.5 hours, and then transferred it to a separatory funnel. Washed the solution two times with 500 g of brine (aqueous NaCl), one time with 500 g water acidified with 1.0 g acetic acid, and then one time with 500 g neutral pH water.
- brine aqueous NaCl
- Preparation 7 mixed 703.8 g di(OH-terminated)-PDMS fluid (Gelest DMS-S12) with 53.6 g 1,2-divinyl-1,1,2,2-tetramethyldisilazane in a 2 liter three-neck flask. Added 1.35 g TFA to catalyze the reaction. Stirred the mixture at room temperature for 2 hours, and then transferred it to a separatory funnel.
- Examples 1A, 1AA, 1B, 1C, 1D, 1E, 2A, 2B, 2C, 2D, 2E, 3A, 3B, 3C, 3D, 3E, 4A, and 5A syntheses of examples of the metal aprotic organosilanoxide compound of formula (I).
- Example 1A mixed 2.70 g aluminum secondary-butoxide solution (70% in secondary- butanol) with 8.0 g toluene and 15.70 g of the product silicone fluid of Preparation 1. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 50° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (14.2 g) that was calculated, assuming mass balance conservation, to have an Al content of 0.54 millimoles Al per gram of product (mmol/g; 1.46 wt%) and Vi content of 2.0 mmol/g (5.4 wt%).
- Example 1AA mixed 3.68 g aluminum secondary-butoxide solution (70% in secondary-butanol) with 13.0 g toluene and 17.1 g of the product silicone fluid of Preparation 1. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 50° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (15.6 g) that was calculated, assuming mass balance conservation, to have an Al content of 0.67 mmol/g (1.81 wt%) and Vi content of 2.0 mmol/g (5.4 wt%).
- Example 1B mixed 1.90 g titanium tetraisopropoxide (TPT) with 8.0 g toluene and 16.35 g of the silicone fluid of Preparation 1. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 50° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (15.15 g) that was calculated, assuming mass balance conservation, to have Ti content of 0.44 mmol/g (2.1 wt%) and a Vi content of 2.0 mmol/g (5.4 wt%).
- TPT titanium tetraisopropoxide
- Example 1C mixed 35 g zirconium n-propoxide (NPZ) solution (70% in n-propanol) with 8.0 g toluene and 15.60 g of the silicone fluid of Preparation 1. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at approximately 50° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (14.4 g) that was calculated, assuming mass balance conservation, to have a Zr content of 0.35 mmol/g (3.2 wt%) and a Vi content of 2.0 mmol/g (5.4 wt%).
- NPZ zirconium n-propoxide
- Example 1D (prophetic): mix 5 g of the product of Example 1A with 5 g of the product of Example 1B to give 10 g of desired product (remainder) as a clear liquid that is calculated, assuming mass balance conservation, to have an Al content of 0.27 mmol/g (0.73 wt%), a Ti content of 0.22 mmol/g (1.05 wt%), and a Vi content of 2.0 mmol/g (5.4 wt%).
- Example 1E (prophetic): mix 5 g of the product of Example 1A with 5 g of the product of Example 1C to give 10 g of desired product (remainder) as a clear liquid and is calculated, assuming mass balance conservation, to have an Al content of 0.27 mmol/g (0.73 wt%), a Zr content of 0.17 mmol/g (1.6 wt%), and a Vi content of 2.0 mmol/g (5.4 wt%).
- Example 1F (prophetic): repeat the procedure of Example 1A except use 2.70 g iron secondary-butoxide solution (70% in secondary-butanol) instead of the 2.70 g aluminum secondary-butoxide solution.
- Produce desired product which is the remainder (not the volatiles), as a clear liquid (14.2 g) that is calculated, assuming mass balance conservation, to have a Fe content of 0.54 mmol/g (3.1 wt%) and a Vi content of 2.0 mmol/g (5.4 wt%).
- Example 1G (prophetic): repeat the procedure of Example 1A except use 2.70 g vanadium secondary-butoxide solution (70% in secondary-butanol) instead of the 2.70 g aluminum secondary-butoxide solution.
- Produce desired product which is the remainder (not the volatiles), as a clear liquid (14.2 g) that is calculated, assuming mass balance conservation, to have a V content of 0.54 mmol/g (2.75 wt%) and a Vi content of 2.0 mmol/g (5.4 wt%).
- Example 2A mixed 28.2 g aluminum sec-butoxide solution (70% in sec-butanol) with 30.0 g toluene and 109.5 g of the silicone fluid of Preparation 2. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at 60°-70° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (101.6 g) that was calculated, assuming mass balance conservation, to have an Al content of 0.78 mmol/g (2.1 wt%) and a Vi content of 3.6 mmol/g (9.7 wt%).
- Example 2B mixed 12.8 g titanium tetraisopropoxide (TPT) with 10.0 g toluene and 102.5 g of the silicone fluid of Preparation 2. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2 hours at 60°-70° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (88.3 g) that was calculated, assuming mass balance conservation, to have a Ti content of 0.50 mmol/g (2.4 wt%) and a Vi content of 3.6 mmol/g (9.7 wt%).
- TPT titanium tetraisopropoxide
- Example 2C mixed 24.5 g zirconium n-propoxide (NPZ) solution (70% in n-propanol) with 30 g toluene and 119.6 g of the silicone fluid of Preparation 2. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg for 2 hours at 60°-70° C. Produced desired product, which was the remainder (not the volatiles), as a clear liquid (102.7 g) that was calculated, assuming mass balance conservation, to have a Zr content of 0.50 mmol/g (4.5 wt%) and a Vi content of 3.5 mmol/g (9.5 wt%).
- NPZ zirconium n-propoxide
- Example 2D (prophetic): mix 9 g of the product of Example 2A with 1 g of the product of Example 2B to give 10 g of desired product (remainder) as a clear liquid that is calculated, assuming mass balance conservation, to have an Al content of 0.70 mmol/g (1.9 wt%), a Ti content of 0.05 mmol/g (0.24 wt%), and a Vi content of 3.6 mmol/g (9.7 wt%).
- Example 2E (prophetic): mix 9 g of the product of Example 2A with 5 g of the product of Example 2C to give 10 g of desired product (remainder) as a clear liquid that is calculated, assuming mass balance conservation, to have an Al content of 0.70 mmol/g (1.9 wt%), a Zr content of 0.05 mmol/g (0.45 wt%), and a Vi content of 3.5 mmol/g (9.6 wt%).
- Example 3A (prophetic): mix 29.0 g aluminum sec-butoxide solution (75% in sec- butanol) with 10 g toluene and 149.9 g of the silicone fluid of Preparation 3. Stir the mixture at room temperature for 30 minutes, and then remove volatiles using a rotatory evaporator at 1- 3 mm Hg vacuum for 2 hours at 60°-70° C. Produce desired product, which is the remainder (not the volatiles), as a clear liquid (132.8 g) that is calculated, assuming mass balance conservation, to have an Al content of 0.66 mmol/g (1.8 wt%) and a Vi content of 0.7 mmol/g (2 wt%).
- Example 3B (prophetic): mix 16.0 g titanium tetraisopropoxide (TPT) with 119.1 g of the partially capped OH-terminated silicone fluid (Preparation 3). Stir the mixture at room temperature for 30 minutes, and then remove volatiles using a rotatory evaporator at 1-3 mm Hg for 2 hours at 60-70° C. Produce desired product, which is the remainder (not the volatiles), as a clear liquid (107.8 g) that is calculated, assuming mass balance conservation, to have a Ti content of 0.51 mmol/g (2.4 wt%) and a Vi content of 0.7 mmol/g (2 wt%).
- TPT titanium tetraisopropoxide
- Example 3C (prophetic): mix 28.6 g zirconium n-propoxide (NPZ) solution (70% in n- propanol) with 5 g toluene and 130.0 g of the silicone fluid of Preparation 3. Stir the mixture at room temperature for 30 minutes, and then remove volatiles using a rotatory evaporator at 1- 3 mm Hg vacuum for 2 hours at 60°-70° C. Produce desired product, which is the remainder (not the volatiles), as a clear liquid (120.7 g) that is calculated, assuming mass balance conservation, to have a Zr content of 0.50 mmol/g (4.5 wt%) and a Vi content of 0.7 mmol/g (2 wt%).
- NPZ zirconium n-propoxide
- Example 3D (prophetic): mix 8 g of the product of Example 3A with 2 g of the product of Example 3C to give 10 g of desired product (remainder) as a clear liquid that is calculated, assuming mass balance conservation, to have an Al content of 0.53 mmol/g (1.4 wt%), a Ti content of 0.140 mmol/g (0.5 wt%), and a Vi content of 0.7 mmol/g (2 wt%).
- Example 3E (prophetic): mix 8 g of the product of Example 3A with 2 g of the product of Example 3B to give 10 g of desired product (remainder) as a clear liquid that is calculated, assuming mass balance conservation, to have an Al content of 0.53 mmol/g (1.4 wt%), a Zr content of 0.10 mmol/g (0.9 wt%), and a Vi content of 0.7 mmol/g (2 wt%).
- Example 4A mixed 1.82 g aluminum sec-butoxide solution (75% in sec-butanol) with 20.3 g of the silicone fluid of Preparation 4. Stirred the mixture at room temperature for 30 minutes, and then removed volatiles using a rotatory evaporator at 1-3 mm Hg vacuum for 2.5 hours at 75° C. Produced desired product (remainder) as a clear liquid (19.6g) that was calculated, assuming mass balance conservation, to have an Al content of 0.28 mmol/g (0.75 wt%) and a Vi content of 1.1 mmol/g (2.9 wt%).
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CN201780039770.9A CN109415396A (zh) | 2016-07-13 | 2017-06-07 | 金属非质子有机硅烷氧化物化合物 |
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EP3484899A1 (de) | 2019-05-22 |
US20200317869A1 (en) | 2020-10-08 |
KR102194374B1 (ko) | 2020-12-24 |
KR20190022865A (ko) | 2019-03-06 |
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