WO2018000919A1

WO2018000919A1 - Pcb board and mobile terminal having same

Info

Publication number: WO2018000919A1
Application number: PCT/CN2017/081271
Authority: WO
Inventors: 黄占肯
Original assignee: 广东欧珀移动通信有限公司
Priority date: 2016-06-28
Filing date: 2017-04-20
Publication date: 2018-01-04
Also published as: CN106061096B; CN108650772B; CN108650772A; CN106061096A

Abstract

A PCB board (100) and a mobile terminal (1000) having the PCB board (100), the PCB board (100) comprises: a board body (1), a bare chip (2), a pad, and a shield bracket (3), wherein the bare chip (2) is provided on the lower surface of the plate body (1); the pad is arranged on the upper surface of the plate body (1); the shield bracket (3) is welded with the pad, a yielding groove (31) is provided on the lower surface of the shield bracket (3), and the yielding groove (31) is opposed to the bare chip (2).

Description

PCB board and mobile terminal having the same

Technical field

The present invention relates to the field of electronic product technologies, and in particular, to a PCB board and a mobile terminal having the same.

Background technique

In the related art, with the rapid development of electronic products, the body of electronic products tends to be thin and light, which makes the space layout inside the electronic products more and more compact. The ultra-thin and high-density trend of electronic products has led to the increasing use of bare crystal chips.

Summary of the invention

The present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a PCB board having high reliability.

Another object of the present invention is to provide a mobile terminal having the above PCB board.

A PCB board according to an embodiment of the first aspect of the present invention, comprising: a board; a bare chip, the bare chip is disposed on a lower surface of the board; and a pad, the pad is disposed on the board And a shielding bracket, the shielding bracket is soldered to the pad, and a shielding groove is disposed on a lower surface of the shielding bracket, and the avoidance groove is opposite to the bare chip.

According to the PCB board of the embodiment of the present invention, by providing the relief groove at a portion of the shield holder opposite to the bare chip, the component capable of generating stress on the back surface of the die is eliminated. Thereby, the damage of the bare crystal chip due to the components such as the shield bracket is effectively avoided, thereby effectively protecting the bare chip, prolonging the service life of the die chip, improving the reliability of the PCB board and reducing the PCB board. The cost of use.

DRAWINGS

1 is a schematic structural view of a PCB board according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.

Reference mark:

PCB board 100, mobile terminal 1000,

The board body 1, the bare chip 2, the shield bracket 3, and the escape groove 31.

detailed description

Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

A PCB board 100 according to an embodiment of the present invention will be described below with reference to FIG. The PCB board 100 can be used for the mobile terminal 1000 such as a mobile phone, a tablet computer, or the like.

As shown in FIG. 1, a PCB board 100 according to an embodiment of the first aspect of the present invention includes: a board body 1, a die chip 2, a pad (not shown), and a shield bracket 3.

The plate body 1 may be formed in a rectangular plate-like structure, and the shield bracket 3 may be formed in a rectangular parallelepiped shape in which the lower end is open, but is not limited thereto. The bare chip 2 is disposed on the lower surface of the board body 1, the pad is disposed on the upper surface of the board body 1, and the shield bracket 3 is soldered to the pad to fix the shield bracket 3 on the PCB board 100. A relief groove 31 is provided on the lower surface of the shield holder 3, and the escape groove 31 is opposed to the die chip 2. That is, the portion of the shield holder 3 facing the die chip 2 is hollowed out to form the escape groove 31, and the portion of the shield holder 3 facing the die chip 2 is not soldered to the pad. Thereby, the component capable of generating stress on the back surface of the bare chip 2 is eliminated, and the shield holder 3 is prevented from traversing the die 2 , thereby effectively preventing the die 2 from being damaged due to stress of the shield 3 or the like, thereby being effective. The bare chip 2 is protected to extend the service life of the die 2 and improve the reliability of the PCB 100.

According to the PCB board 100 of the embodiment of the present invention, by providing the escape groove 31 at a portion of the shield holder 3 opposite to the die chip 2, the member capable of generating stress on the back surface of the die chip 2 is eliminated. Thereby, the stress of the bare chip 2 due to the components such as the shield bracket 3 is effectively prevented, thereby effectively protecting the bare chip 2, prolonging the service life of the die 2 and improving the reliability of the PCB 100. And the use cost of the PCB board 100 is reduced.

According to some embodiments of the present invention, referring to FIG. 1, the bare chip 2 is located directly under the escape groove 31. Thereby, the bare chip 2 can be effectively protected, and the size of the escape groove 31 can be reduced, the shielding effect of the shield bracket 3 can be ensured, and electromagnetic leakage generated by components in the shield bracket 3 can be prevented, thereby further improving the PCB. The reliability of the board 100.

Specifically, the depth of the escape groove 31 is H, and H satisfies: 0.2 mm ≤ H ≤ 0.3 mm. The specific value can be adjusted according to actual needs. For example, the depth of the escape groove 31 can further satisfy: H = 0.25 mm or the like. Here, the depth of the escape groove 31 refers to the length of the escape groove 31 in the height direction of the shield holder 3 (for example, the vertical direction in FIG. 1). Thereby, the bare chip 2 can be protected from stress damage, and the shielding effect of the shield holder 3 can be ensured.

According to some embodiments of the present invention, the width of the escape groove 31 is W1, the width of the bare chip 2 is W2, and W1 and W2 satisfy: W1-W2≥1 mm. Among them, W1 and W2 can further satisfy: 1 mm ≤ W1-W2 ≤ 1.6 mm. For example, W1-W2 = 1 mm, W1-W2 = 1.2 mm, and the like. For example, referring to FIG. 1, the bare chip 2 may be disposed directly under the escape groove 31, that is, the distance between the left side of the die 2 and the plane of the left side wall of the escape groove 31 and the die 2 The distance between the right side and the plane of the right side wall of the escape groove 31 is equal, and one side in the width direction of the bare chip 2 (for example, the left-right direction in FIG. 1) (for example, the left side in FIG. 1) a side wall of the escape groove 3 adjacent to the one side of the bare chip 2 (for example, The distance between the planes of the left side wall in Fig. 1 may be W, and W satisfies: 0.5 mm ≤ W ≤ 0.8 mm.

For example, when W1-W2=1 mm, the distance between the left side of the bare chip 2 and the plane of the left side wall of the escape groove 31 is 0.5 mm, and the right side of the die 2 and the right side wall of the escape groove 31. The spacing between the planes is also 0.5mm. Thereby, it is possible to further ensure that the bare chip 2 is not affected by the stress.

Alternatively, the orthographic projection area of the escape groove 31 on the upper surface is larger than the orthographic projection area of the bare chip 2 on the upper surface. Thereby, it is possible to further ensure that the bare chip 2 is not affected by the stress and prolong the service life of the die 2.

Specifically, a smooth transition portion is formed between the side wall of the escape groove 31 and the top wall of the escape groove 31. For example, referring to FIG. 1, the cross section of the escape groove 31 may be formed substantially in a rectangular shape, and a smooth transition portion may be provided between the left side wall and the right side wall of the escape groove 31 and the top wall of the escape groove 31, respectively. Of course, a smooth transition portion may be provided only between the left side wall of the escape groove 31 and the top wall of the escape groove 31, or a smooth transition portion may be provided only between the right side wall of the escape groove 31 and the top wall of the escape groove 31. . Thereby, it is possible to avoid scratching the user or other components during the assembly process, improve the safety of the PCB board 100, and the structure is simple and easy to implement. In addition, the overall appearance of the PCB board 100 can also be improved.

Further, a relief notch is provided at a position on the pad opposite to the escape groove 31. That is to say, the pad below the escape groove 31 can be partially cancelled. Thereby, the bare chip 2 can be further protected from stress.

Optionally, the gap is prevented from penetrating the pad. That is to say, all the pads under the escape groove 31 can be canceled. Thereby, the bare chip 2 can be further protected from stress, and the structure is simple and easy to implement.

One specific embodiment of a PCB board 100 in accordance with an embodiment of the present invention is described below with reference to FIG.

Referring to FIG. 1, a PCB board 100 according to an embodiment of the present invention includes a board body 1, a die chip 2, a pad, and a shield bracket 3. Among them, the plate body 1 is formed in a rectangular plate-like structure, and the shield bracket 3 is formed in a rectangular parallelepiped shape in which the lower end is open.

The bare chip 2 is disposed on the lower surface of the board body 1, the pad is disposed on the upper surface of the board body 1, and the shield bracket 3 is soldered to the pad to fix the shield bracket 3 on the PCB board 100. The lower surface of the shield holder 3 is provided with a relief groove 31, and a relief recess is provided at a position on the pad opposite to the escape groove 31, and the bare chip 2 is located directly below the escape groove 31.

The cross-sectional shape of the escape groove 31 is substantially rectangular. A smooth transition portion may be provided between the left side wall and the right side wall of the escape groove 31 and the top wall of the escape groove 31, respectively. The depth of the escape groove 31 is H, and H satisfies: H = 0.25 mm. The distance between the left side of the bare chip 2 and the plane of the left side wall of the escape groove 31 is 0.5 mm, and the distance between the right side of the bare chip 2 and the plane of the right side wall of the escape groove 31 is also 0.5 mm. .

The PCB board 100 according to the embodiment of the present invention effectively prevents the bare chip 2 from being damaged by the stress generated by the shield bracket 3 and the like, thereby effectively protecting the bare chip 2 and prolonging the service life of the die chip 2. The reliability of the PCB board 100 is improved and the use cost of the PCB board 100 is lowered.

A mobile terminal 1000 according to an embodiment of the second aspect of the present invention includes a PCB board 100 according to the above-described first aspect of the present invention. The mobile terminal 1000 can be a mobile phone, a tablet computer, or the like. For example, in the example of Figure 2, moving The terminal 1000 is a mobile phone.

According to the mobile terminal 1000 according to the embodiment of the second aspect of the present invention, the reliability of the mobile terminal 1000 is improved by providing the PCB board 100 according to the above-described first aspect of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " After, "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Axial", "Radial", "Circumferential", etc. The orientation or positional relationship of the indications is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the invention and the simplified description, rather than indicating or implying that the device or component referred to has a specific orientation, in a specific orientation. The construction and operation are therefore not to be construed as limiting the invention.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless specifically defined otherwise.

In the present invention, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or in one piece; it may be a mechanical connection, or it may be an electrical connection or a communication with each other; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship between two elements. Unless otherwise expressly defined. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims

A PCB board, comprising:

Plate body

a bare chip, the bare chip is disposed on a lower surface of the board;

a pad, the pad being disposed on an upper surface of the board; and

The shielding bracket is soldered to the pad, and a shielding groove is disposed on a lower surface of the shielding bracket, and the avoidance groove is opposite to the bare chip.
The PCB board according to claim 1, wherein the bare chip is located directly below the escape groove.
The PCB board according to claim 1 or 2, wherein the depth of the escape groove is H, and the H satisfies: 0.2 mm ≤ H ≤ 0.3 mm.
The PCB board according to claim 3, wherein said H satisfies: H = 0.25 mm.
The PCB board according to any one of claims 1 to 4, wherein the width of the escape groove is W1, the width of the bare chip is W2, and the W1 and W2 satisfy: W1-W2≥ 1mm.
The PCB board according to claim 5, wherein the escaping groove has a width W1, the bare chip has a width W2, and the W1 and W2 satisfy: 1 mm ≤ W1 - W2 ≤ 1.6 mm.
The PCB board according to claim 6, wherein W1-W2 = 1.2 mm.
The PCB board according to any one of claims 1 to 7, wherein one side in the width direction of the bare chip and a side of the escape groove adjacent to the one side of the die chip The distance between the planes of the walls is W, and the W satisfies: 0.5 mm ≤ W ≤ 0.8 mm.
The PCB board according to claim 8, wherein said W satisfies: W = 0.6 mm.
The PCB board according to any one of claims 1 to 9, wherein an orthographic projection area of the escape groove on the upper surface is larger than an orthographic projection area of the bare chip on the upper surface .
The PCB board according to any one of claims 1 to 10, characterized in that the side wall of the escape groove and the top wall of the escape groove have a smooth transition portion.
The PCB board according to any one of claims 1 to 11, wherein a relief recess is provided at a position on the pad opposite to the escape groove.
The PCB board according to claim 12, wherein the avoidance notch penetrates the pad.
A mobile terminal characterized by comprising the PCB board according to any one of claims 1-13.
The mobile terminal according to claim 14, wherein the mobile terminal is a mobile phone or a tablet.