CN106061096B - Pcb board and with its mobile terminal - Google Patents
Pcb board and with its mobile terminal Download PDFInfo
- Publication number
- CN106061096B CN106061096B CN201610505734.4A CN201610505734A CN106061096B CN 106061096 B CN106061096 B CN 106061096B CN 201610505734 A CN201610505734 A CN 201610505734A CN 106061096 B CN106061096 B CN 106061096B
- Authority
- CN
- China
- Prior art keywords
- bare crystalline
- pcb board
- escape groove
- crystalline chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 description 4
- 241000276425 Xiphophorus maculatus Species 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a kind of pcb board and there is its mobile terminal, pcb board includes：Plate body, bare crystalline chip, pad and shield bracket, bare crystalline chip are located on the lower surface of plate body；Pad is located on the upper surface of plate body；Shield bracket and pad solder, the lower surface of shield bracket are equipped with escape groove, and escape groove is opposite with bare crystalline chip.Pcb board according to the present invention, by setting escape groove at the shield bracket position opposite with bare crystalline chip, the component of stress can be generated by eliminating bare crystalline chip back.Bare crystalline chip is efficiently avoided as a result, because the stress that the components such as shield bracket generate is damaged, and so as to be effectively protected bare crystalline chip, is extended the service life of bare crystalline chip, is improved the reliability of pcb board and reduce the use cost of pcb board.
Description
Technical field
The present invention relates to technical field of electronic products, more particularly, to a kind of pcb board and with its mobile terminal.
Background technology
In the relevant technologies, with the fast development of electronic product, the fuselage of electronic product is intended to thin, light and handyization so that
Space layout inside electronic product is more and more compacter.The ultra-thin and densification trend of electronic product so that the bare crystalline used
Chip is more and more.However, bare crystalline chip is easily stressed damage, carrying out pcb board, (PCB is " Printed Circuit
The abbreviation of Board ", Chinese are printed circuit board) layout when, the back side of bare crystalline chip cannot have the component for generating stress,
But highdensity PCB layout environments, the back side of bare crystalline chip have shield bracket and span so that bare crystalline chip easily by
Stress damage, the reliability of pcb board.
Invention content
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, the present invention carries
Go out a kind of pcb board, the reliability of the pcb board is high.
It is another object of the present invention to propose a kind of mobile terminal with above-mentioned pcb board.
Pcb board according to a first aspect of the present invention, including：Plate body；Bare crystalline chip, the bare crystalline chip are located at the plate body
Lower surface on；Pad, the pad are located on the upper surface of the plate body；And shield bracket, the shield bracket and institute
Pad solder is stated, the lower surface of the shield bracket is equipped with escape groove, and the escape groove is opposite with the bare crystalline chip.
Pcb board according to the present invention by setting escape groove at the shield bracket position opposite with bare crystalline chip, eliminates
Bare crystalline chip back can generate the component of stress.Bare crystalline chip is efficiently avoided as a result, because the components such as shield bracket produce
Raw stress is damaged, and so as to be effectively protected bare crystalline chip, extends the service life of bare crystalline chip, improves pcb board
Reliability and reduce the use cost of pcb board.
In addition, pcb board according to the present invention, can also have following additional technical characteristic：
According to some embodiments of the present invention, the bare crystalline chip is located at the underface of the escape groove.
Specifically, the depth of the escape groove is H, and the H meets：0.2mm≤H≤0.3mm.
According to some embodiments of the present invention, the width of the escape groove is W1, and the width of the bare crystalline chip is W2, institute
W1 and W2 is stated to meet：W1-W2≥1mm.
Optionally, the width of the escape groove is W1, and the width of the bare crystalline chip meets for W2, the W1 and W2：1mm
≤W1-W2≤1.6mm。
Optionally, the frontal projected area of the escape groove on the upper surface is more than the bare crystalline chip in the upper table
Frontal projected area on face.
Specifically, there is rounding off portion between the side wall of the escape groove and the roof of the escape groove.
Further, it is equipped at position opposite with the escape groove on the pad and avoids notch.
Specifically, the avoidance notch penetrates through the pad.
Mobile terminal according to a second aspect of the present invention, including the pcb board according to the above-mentioned first aspect of the present invention.
Invention content only lists dependent claims, and it is special that each dependent claims are followed by respective supplementary technology
The advantages of sign is brought is placed on described in embodiment and combines specific technical characteristic and describe, and is not placed on inside invention content and describes)
Description of the drawings
Fig. 1 is the structure diagram of pcb board according to embodiments of the present invention.
Reference numeral：
Pcb board 100,
Plate body 1, bare crystalline chip 2, shield bracket 3, escape groove 31.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
Pcb board 100 according to embodiments of the present invention is described below with reference to Fig. 1.Wherein, pcb board 100 can be used for mobile whole
End is such as mobile phone, tablet computer.
As shown in Figure 1, the pcb board 100 of embodiment according to a first aspect of the present invention, including：Plate body 1, bare crystalline chip 2, weldering
Disk (not shown) and shield bracket 3.
Wherein, plate body 1 can be formed as rectangular platy structure, and shield bracket 3 can be formed as the length of open at its lower end
Cube shape, but not limited to this.Bare crystalline chip 2 is located on the lower surface of plate body 1, and pad is located on the upper surface of plate body 1, shielding
Stent 3 and pad solder, shield bracket 3 is fixed on pcb board 100.The lower surface of shield bracket 3 is equipped with escape groove
31, escape groove 31 is opposite with bare crystalline chip 2.That is, the position opposite with bare crystalline chip 2 of shield bracket 3 is hollowed out to be formed
Escape groove 31, the position for making shield bracket 3 opposite with bare crystalline chip 2 not with pad solder.Bare crystalline chip 2 is eliminated as a result, to carry on the back
Face can generate the component of stress, and shield bracket 3 is avoided to efficiently avoid bare crystalline chip 2 because of screen across bare crystalline chip 2
It covers the stress of 3 grade of stent and is damaged, so as to effectively protect bare crystalline chip 2, extend bare crystalline chip 2 uses the longevity
Life improves the reliability of pcb board 100.
Pcb board 100 according to embodiments of the present invention, by being kept away in the position setting opposite with bare crystalline chip 2 of shield bracket 3
Allow slot 31, the component of stress can be generated by eliminating 2 back side of bare crystalline chip.Bare crystalline chip 2 is efficiently avoided as a result, because of screen
The stress for covering the generation of 3 grade components of stent is damaged, and so as to be effectively protected bare crystalline chip 2, extends making for bare crystalline chip 2
With the service life, improve the reliability of pcb board 100 and reduce the use cost of pcb board 100.
According to some embodiments of the present invention, with reference to Fig. 1, bare crystalline chip 2 is located at the underface of escape groove 31.As a result, may be used
Effectively to protect bare crystalline chip 2, and the size of escape groove 31 can be reduced, ensure the shield effectiveness of shield bracket 3, prevent from shielding
It covers the electromagnetism that the component in stent 3 generates to reveal, so as to further improve the reliability of pcb board 100.
Specifically, the depth of escape groove 31 is H, and H meets：0.2mm≤H≤0.3mm.Its concrete numerical value can be according to reality
Need adjusted design.For example, the depth of escape groove 31 can further meet：H=0.25mm etc..Wherein, the depth of escape groove 31
Degree refers to length of the escape groove 31 in the short transverse (for example, upper and lower directions in Fig. 1) of shield bracket 3.Thus, it is possible to
Ensure bare crystalline chip 2 not by stress damage, and can ensure the shield effectiveness of shield bracket 3.
According to some embodiments of the present invention, the width of escape groove 31 is W1, and the width of bare crystalline chip 2 is W2, W1 and W2
Meet：W1-W2≥1mm.Wherein, W1 and W2 can further meet：1mm≤W1-W2≤1.6mm.For example, W1-W2=1mm,
W1-W2=1.2mm etc..For example, referring to Fig. 1, bare crystalline chip 2 can be arranged on the underface of escape groove 31, that is to say, that bare crystalline
The right end of the distance between the left end of chip 2 and the left side wall of escape groove 31 and bare crystalline chip 2 and the right side wall of escape groove 31 it
Between distance it is equal, the avoidance of one end (for example, left end in Fig. 1) of bare crystalline chip 2 and above-mentioned one end of neighbouring bare crystalline chip 2
The distance between side wall (for example, left side wall in Fig. 1) of slot 3 can be W, and W meets：0.5mm≤W≤0.8mm.
For example, as W1-W2=1mm, the spacing between the left end of bare crystalline chip 2 and the left side wall of escape groove 31 is
0.5mm, the spacing between the right end of bare crystalline chip 2 and the right side wall of escape groove 31 are also 0.5mm.Thus, it is possible to further
Ensure that bare crystalline chip 2 is not affected by force.
Optionally, the frontal projected area of escape groove 31 on an upper is more than the orthographic projection of bare crystalline chip 2 on an upper
Area.Thus, it is possible to further ensure that bare crystalline chip 2 is not affected by force, and extends the service life of bare crystalline chip 2.
Specifically, there is rounding off portion between the side wall of escape groove 31 and the roof of escape groove 31.For example, referring to Fig. 1,
The cross section of escape groove 31 can be formed generally as rectangle, the left side wall and right side wall of escape groove 31 and the roof of escape groove 31
Between can be respectively equipped with rounding off portion.It is of course also possible to only the left side wall of escape groove 31 and escape groove 31 roof it
Between setting rounding off portion or rounding off portion is set only between the right side wall of escape groove 31 and the roof of escape groove 31.
Thus, it is possible to avoid scratching user or other component in assembling process, the safety of pcb board 100 is improved, and simple in structure,
It is easy to implement.Further, it is also possible to promote the overall appearance of pcb board 100.
Further, it is equipped at position opposite with escape groove 31 on pad and avoids notch.That is, it can will avoid
The solder tray local of 31 lower section of slot is cancelled.It is not affected by force thus, it is possible to further protect bare crystalline chip 2.
Optionally, notch perforation pad is avoided.That is, the pad of 31 lower section of escape groove can all be cancelled.By
This, can further protect bare crystalline chip 2 to be not affected by force, and simple in structure, be easy to implement.
One specific embodiment of pcb board 100 according to embodiments of the present invention is described below with reference to Fig. 1.
With reference to Fig. 1, pcb board 100 according to embodiments of the present invention, including plate body 1, bare crystalline chip 2, pad and shielding branch
Frame 3.Wherein, plate body 1 is formed as rectangular platy structure, and shield bracket 3 is formed as the rectangular shape of open at its lower end.
Bare crystalline chip 2 is located on the lower surface of plate body 1, and pad is located on the upper surface of plate body 1, shield bracket 3 and pad
Welding, shield bracket 3 is fixed on pcb board 100.The lower surface of shield bracket 3 is equipped with escape groove 31, with keeping away on pad
It is equipped at the position for making slot 31 opposite and avoids notch, bare crystalline chip 2 is located at the underface of escape groove 31.
The cross-sectional shape of escape groove 31 generally rectangle.The left side wall and right side wall of escape groove 31 and escape groove 31
Rounding off portion can be respectively equipped between roof.The depth of escape groove 31 is H, and H meets：H=0.25mm.Bare crystalline chip 2
Spacing between left end and the left side wall of escape groove 31 is 0.5mm, between the right end of bare crystalline chip 2 and the right side wall of escape groove 31
Spacing also be 0.5mm.
Pcb board 100 according to embodiments of the present invention efficiently avoids bare crystalline chip 2 because 3 grade components of shield bracket produce
Raw stress is damaged, and so as to be effectively protected bare crystalline chip 2, extends the service life of bare crystalline chip 2, improves PCB
The reliability of plate 100 and the use cost for reducing pcb board 100.
The mobile terminal of embodiment according to a second aspect of the present invention, including according to the above-mentioned first aspect embodiment of the present invention
Pcb board 100.Wherein, mobile terminal can be mobile phone, tablet computer etc..
The mobile terminal of root embodiment according to a second aspect of the present invention, it is real according to the above-mentioned first aspect of the present invention by setting
The pcb board 100 of example is applied, improves the reliability of mobile terminal.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " axial direction ",
The orientation or position relationship of the instructions such as " radial direction ", " circumferential direction " are based on orientation shown in the drawings or position relationship, merely to just
In the description present invention and simplify description rather than instruction or imply signified device or element must have specific orientation, with
Specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, " multiple " are meant that at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integral；Can be that machinery connects
It connects or is electrically connected or can communicate each other；It can be directly connected, can also be indirectly connected by intermediary, it can be with
It is the interaction relationship of connection inside two elements or two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment of the present invention or example.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It is combined in an appropriate manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the different embodiments or examples described in this specification and the feature of different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (9)
1. a kind of pcb board, which is characterized in that including：
Plate body；
Bare crystalline chip, the bare crystalline chip are located on the lower surface of the plate body；
Pad, the pad are located on the upper surface of the plate body；And
Shield bracket, the shield bracket and the pad solder, the lower surface of the shield bracket are equipped with escape groove to keep away
Exempt from the shield bracket across the bare crystalline chip, the escape groove is opposite with the bare crystalline chip, on the pad with institute
It states to be equipped at the opposite position of escape groove and avoids notch, the width of the escape groove is more than the width of the bare crystalline chip.
2. pcb board according to claim 1, which is characterized in that the bare crystalline chip is located at the underface of the escape groove.
3. pcb board according to claim 1, which is characterized in that the depth of the escape groove is H, and the H meets：0.2mm
≤H≤0.3mm。
4. pcb board according to claim 1, which is characterized in that the width of the escape groove is W1, the bare crystalline chip
Width is W2, and the W1 and W2 meet：W1-W2≥1mm.
5. pcb board according to claim 4, which is characterized in that the width of the escape groove is W1, the bare crystalline chip
Width is W2, and the W1 and W2 meet：1mm≤W1-W2≤1.6mm.
6. pcb board according to claim 1, which is characterized in that the frontal plane of projection of the escape groove on the upper surface
Product is more than the frontal projected area of the bare crystalline chip on the upper surface.
7. pcb board according to claim 1, which is characterized in that the side wall of the escape groove and the roof of the escape groove
Between have rounding off portion.
8. pcb board according to claim 1, which is characterized in that the avoidance notch penetrates through the pad.
9. a kind of mobile terminal, which is characterized in that including the pcb board according to any one of claim 1-8.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810235641.3A CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
| CN201610505734.4A CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
| PCT/CN2017/081271 WO2018000919A1 (en) | 2016-06-28 | 2017-04-20 | Pcb board and mobile terminal having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505734.4A CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235641.3A Division CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106061096A CN106061096A (en) | 2016-10-26 |
| CN106061096B true CN106061096B (en) | 2018-06-29 |
Family
ID=57201397
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610505734.4A Expired - Fee Related CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
| CN201810235641.3A Active CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235641.3A Active CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN106061096B (en) |
| WO (1) | WO2018000919A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061096B (en) * | 2016-06-28 | 2018-06-29 | 广东欧珀移动通信有限公司 | Pcb board and with its mobile terminal |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004093506A2 (en) * | 2003-04-15 | 2004-10-28 | Wavezero, Inc. | Electomagnetic interference shielding for a printed circuit board |
| US8059425B2 (en) * | 2008-05-28 | 2011-11-15 | Azurewave Technologies, Inc. | Integrated circuit module with temperature compensation crystal oscillator |
| JP2011077446A (en) * | 2009-10-01 | 2011-04-14 | Sanyo Electric Co Ltd | Shield case and image display device |
| JP2011216849A (en) * | 2010-03-17 | 2011-10-27 | Tdk Corp | Electronic circuit module component, and method of manufacturing the same |
| CN203072308U (en) * | 2013-03-01 | 2013-07-17 | 广东欧珀移动通信有限公司 | Shielding case support structure |
| CN105658044B (en) * | 2016-01-14 | 2018-12-07 | 广东欧珀移动通信有限公司 | A kind of shield bracket structure and mobile terminal improving mainboard chip stress |
| CN106061096B (en) * | 2016-06-28 | 2018-06-29 | 广东欧珀移动通信有限公司 | Pcb board and with its mobile terminal |
-
2016
- 2016-06-28 CN CN201610505734.4A patent/CN106061096B/en not_active Expired - Fee Related
- 2016-06-28 CN CN201810235641.3A patent/CN108650772B/en active Active
-
2017
- 2017-04-20 WO PCT/CN2017/081271 patent/WO2018000919A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN106061096A (en) | 2016-10-26 |
| CN108650772B (en) | 2020-01-10 |
| CN108650772A (en) | 2018-10-12 |
| WO2018000919A1 (en) | 2018-01-04 |
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180629 |