CN106061096A - PCB and mobile terminal having the same - Google Patents
PCB and mobile terminal having the same Download PDFInfo
- Publication number
- CN106061096A CN106061096A CN201610505734.4A CN201610505734A CN106061096A CN 106061096 A CN106061096 A CN 106061096A CN 201610505734 A CN201610505734 A CN 201610505734A CN 106061096 A CN106061096 A CN 106061096A
- Authority
- CN
- China
- Prior art keywords
- escape groove
- pcb board
- bare crystalline
- crystalline chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
Abstract
The invention discloses a PCB and a mobile terminal having the same. The PCB comprises a board body, a die chip, a welding plate, and a shielding support. The die chip is arranged on the lower surface of the board body; the welding plate is arranged on the upper surface of the board body; and the shielding support is welded with the welding plate. An avoiding groove is formed in the lower surface of the shielding support and is opposite to the die chip. According to the PCB, because the avoiding groove is formed in the part, opposite to the die chip, of the shielding support, the component that is capable of generating the stress and is arranged at the back of the die chip is removed. Therefore, damages on the die chip due to the stresses on components like the shielding support can be avoided, so that the die chip is protected effectively, the service life of the die chip is prolonged, and reliability of the PCB is improved and the using cost of the PCB is reduced.
Description
Technical field
The present invention relates to technical field of electronic products, especially relate to a kind of pcb board and there is its mobile terminal.
Background technology
In correlation technique, along with the fast development of electronic product, the fuselage of electronic product trend towards thin, lightly change so that
Space layout within electronic product is more and more compacter.Ultra-thin and the densification trend of electronic product so that the bare crystalline used
Chip gets more and more.But, bare crystalline chip is easily subject to stress damage, and carrying out pcb board, (PCB is " Printed Circuit
Board " abbreviation, Chinese is printed circuit board) layout time, the back side of bare crystalline chip can not have produce stress parts,
But highdensity PCB layout environments, the back side of bare crystalline chip has shield bracket and spans so that bare crystalline chip is easily subject to
Stress damage, the reliability of pcb board.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention carries
Going out a kind of pcb board, the reliability of this pcb board is high.
Further object is that and propose a kind of mobile terminal with above-mentioned pcb board.
Pcb board according to a first aspect of the present invention, including: plate body；Bare crystalline chip, described bare crystalline chip is located at described plate body
Lower surface on；Pad, described pad is located on the upper surface of described plate body；And shield bracket, described shield bracket and institute
Stating pad solder, the lower surface of described shield bracket is provided with escape groove, and described escape groove is relative with described bare crystalline chip.
According to the pcb board of the present invention, escape groove is set by the position relative with bare crystalline chip at shield bracket, eliminates
Bare crystalline chip back can produce the parts of stress.Thus, efficiently avoid bare crystalline chip because the parts such as shield bracket produce
Raw stress sustains damage, thus is effectively protected bare crystalline chip, extends the service life of bare crystalline chip, improves pcb board
Reliability and reduce the use cost of pcb board.
It addition, according to the pcb board of the present invention, it is also possible to have a following additional technical characteristic:
According to some embodiments of the present invention, described bare crystalline chip is positioned at the underface of described escape groove.
Specifically, the degree of depth of described escape groove is H, and described H meets: 0.2mm≤H≤0.3mm.
According to some embodiments of the present invention, the width of described escape groove is W1, and the width of described bare crystalline chip is W2, institute
State W1 and W2 to meet: W1-W2 >=1mm.
Alternatively, the width of described escape groove is W1, and the width of described bare crystalline chip is W2, and described W1 and W2 meets: 1mm
≤W1-W2≤1.6mm。
Alternatively, described escape groove frontal projected area on the upper surface is more than described bare crystalline chip table on described
Frontal projected area on face.
Specifically, between sidewall and the roof of described escape groove of described escape groove, there is rounding off portion.
Further, on described pad, the position relative with described escape groove is provided with and dodges breach.
Specifically, the through described pad of breach is dodged described in.
Mobile terminal according to a second aspect of the present invention, including the pcb board according to the above-mentioned first aspect of the present invention.
Summary of the invention only lists dependent claims, and it is special that each dependent claims is followed by respective supplementary technology
Levy the advantage brought be placed on described in embodiment and combine concrete technical characteristic description, be not placed on inside summary of the invention and describe)
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board according to embodiments of the present invention.
Reference:
Pcb board 100,
Plate body 1, bare crystalline chip 2, shield bracket 3, escape groove 31.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to
The embodiment that accompanying drawing describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Below with reference to Fig. 1, pcb board 100 according to embodiments of the present invention is described.Wherein, pcb board 100 may be used for mobile whole
Hold such as mobile phone, panel computer etc..
As it is shown in figure 1, the pcb board 100 of embodiment according to a first aspect of the present invention, including: plate body 1, bare crystalline chip 2, weldering
Dish (not shown) and shield bracket 3.
Wherein, plate body 1 can be formed as rectangular platy structure, and shield bracket 3 can be formed as the length of open at its lower end
Cube shape, but it is not limited to this.Bare crystalline chip 2 is located on the lower surface of plate body 1, and pad is located on the upper surface of plate body 1, shielding
Support 3 and pad solder, to be fixed on shield bracket 3 on pcb board 100.The lower surface of shield bracket 3 is provided with escape groove
31, escape groove 31 is relative with bare crystalline chip 2.It is to say, the position that shield bracket 3 is relative with bare crystalline chip 2 is hollowed out formation
Escape groove 31, make position that shield bracket 3 is relative with bare crystalline chip 2 not with pad solder.Thus, eliminate bare crystalline chip 2 to carry on the back
Face can produce the parts of stress, it is to avoid shield bracket 3, across bare crystalline chip 2, efficiently avoid bare crystalline chip 2 because shielding
Cover the stress of support 3 grade and sustain damage, such that it is able to protection bare crystalline chip 2 effectively, extend the use longevity of bare crystalline chip 2
Life, improves the reliability of pcb board 100.
Pcb board 100 according to embodiments of the present invention, is arranged by the position relative with bare crystalline chip 2 at shield bracket 3 and keeps away
Allow groove 31, eliminate bare crystalline chip 2 back side and can produce the parts of stress.Thus, efficiently avoid bare crystalline chip 2 because shielding
The stress covering generation such as support 3 parts such as grade sustains damage, thus is effectively protected bare crystalline chip 2, extends making of bare crystalline chip 2
With the life-span, improve the reliability of pcb board 100 and reduce the use cost of pcb board 100.
According to some embodiments of the present invention, with reference to Fig. 1, bare crystalline chip 2 is positioned at the underface of escape groove 31.Thus, may be used
Effectively to protect bare crystalline chip 2, and the size of escape groove 31 can be reduced, it is ensured that the shield effectiveness of shield bracket 3, prevent screen
The electromagnetism covering the generation of the components and parts in support 3 is revealed, such that it is able to improve the reliability of pcb board 100 further.
Specifically, the degree of depth of escape groove 31 is that H, H meet: 0.2mm≤H≤0.3mm.Its concrete numerical value can be according to reality
Need adjusted design.Such as, the degree of depth of escape groove 31 can meet further: H=0.25mm etc..Wherein, escape groove 31 is deep
Degree refers to the escape groove 31 length in the short transverse (such as, the above-below direction in Fig. 1) of shield bracket 3.Thus, it is possible to
Guarantee bare crystalline chip 2 is not by stress damage, and can ensure that the shield effectiveness of shield bracket 3.
According to some embodiments of the present invention, the width of escape groove 31 is W1, and the width of bare crystalline chip 2 is W2, W1 and W2
Meet: W1-W2 >=1mm.Wherein, W1 and W2 can meet further: 1mm≤W1-W2≤1.6mm.Such as, W1-W2=1mm,
W1-W2=1.2mm etc..For example, referring to Fig. 1, bare crystalline chip 2 can be arranged on the underface of escape groove 31, say, that bare crystalline
The right-hand member of the distance between left end and the left side wall of escape groove 31 of chip 2 and bare crystalline chip 2 and the right side wall of escape groove 31 it
Between distance equal, dodging of above-mentioned one end of one end (such as, the left end in Fig. 1) of bare crystalline chip 2 and neighbouring bare crystalline chip 2
Distance between the sidewall (such as, the left side wall in Fig. 1) of groove 3 can be that W, W meet: 0.5mm≤W≤0.8mm.
Such as, as W1-W2=1mm, the spacing between left end and the left side wall of escape groove 31 of bare crystalline chip 2 is
0.5mm, the spacing between right-hand member and the right side wall of escape groove 31 of bare crystalline chip 2 is also 0.5mm.Thus, it is possible to further
Ensure bare crystalline chip 2 not affected by force.
Alternatively, escape groove 31 frontal projected area on an upper is more than bare crystalline chip 2 orthographic projection on an upper
Area.Thus, it is possible to ensure bare crystalline chip 2 not affected by force further, extend the service life of bare crystalline chip 2.
Specifically, between sidewall and the roof of escape groove 31 of escape groove 31, there is rounding off portion.For example, referring to Fig. 1,
The cross section of escape groove 31 can be formed generally as the roof of rectangle, the left side wall of escape groove 31 and right side wall and escape groove 31
Between can be respectively equipped with rounding off portion.It is of course also possible to only escape groove 31 left side wall and escape groove 31 roof it
Between rounding off portion is set, or only rounding off portion is set between the right side wall and the roof of escape groove 31 of escape groove 31.
Thus, it is possible to scratch user or miscellaneous part during avoiding assembling, improve the safety of pcb board 100, and simple in construction,
Facilitate implementation.Further, it is also possible to promote the overall appearance of pcb board 100.
Further, relative with escape groove 31 on pad position is provided with dodges breach.It is to say, can will dodge
Solder tray local below groove 31 is cancelled.Thus, it is possible to protect bare crystalline chip 2 not affected by force further.
Alternatively, the through pad of breach is dodged.It is to say, the pad below escape groove 31 all can be cancelled.By
This, can further protect bare crystalline chip 2 not affected by force, and simple in construction, it is simple to realizes.
A specific embodiment below with reference to Fig. 1 description pcb board 100 according to embodiments of the present invention.
With reference to Fig. 1, pcb board 100 according to embodiments of the present invention, including plate body 1, bare crystalline chip 2, pad and shielding
Frame 3.Wherein, plate body 1 is formed as rectangular platy structure, and shield bracket 3 is formed as the rectangular shape of open at its lower end.
Bare crystalline chip 2 is located on the lower surface of plate body 1, and pad is located on the upper surface of plate body 1, shield bracket 3 and pad
Welding, to be fixed on shield bracket 3 on pcb board 100.The lower surface of shield bracket 3 is provided with escape groove 31, on pad with keep away
The position making groove 31 relative is provided with dodges breach, and bare crystalline chip 2 is positioned at the underface of escape groove 31.
The shape of cross section of escape groove 31 generally rectangle.The left side wall of escape groove 31 and right side wall and escape groove 31
Rounding off portion can be respectively equipped with between roof.The degree of depth of escape groove 31 is that H, H meet: H=0.25mm.Bare crystalline chip 2
Spacing between the left side wall of left end and escape groove 31 is 0.5mm, between right-hand member and the right side wall of escape groove 31 of bare crystalline chip 2
Spacing be also 0.5mm.
Pcb board 100 according to embodiments of the present invention, efficiently avoid bare crystalline chip 2 because shield bracket 3 parts such as grade produce
Raw stress sustains damage, thus is effectively protected bare crystalline chip 2, extends the service life of bare crystalline chip 2, improves PCB
The reliability of plate 100 also reduces the use cost of pcb board 100.
The mobile terminal of embodiment according to a second aspect of the present invention, including according to the present invention above-mentioned first aspect embodiment
Pcb board 100.Wherein, mobile terminal can be mobile phone, panel computer etc..
The mobile terminal of root embodiment according to a second aspect of the present invention, real by arranging according to the above-mentioned first aspect of the present invention
Execute the pcb board 100 of example, improve the reliability of mobile terminal.
In describing the invention, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " axially ",
" radially ", the orientation of the instruction such as " circumferential " or position relationship be based on orientation shown in the drawings or position relationship, merely to just
In describe the present invention and simplifying describe rather than instruction or the hint device of indication or element must have specific orientation, with
Specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In describing the invention, " multiple " are meant that at least two, such as two, three
Individual etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, permissible
It is connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this area
For those of ordinary skill, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score permissible
It is that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be in office
One or more embodiments or example combine in an appropriate manner.Additionally, in the case of the most conflicting, the skill of this area
The feature of the different embodiments described in this specification or example and different embodiment or example can be tied by art personnel
Close and combination.
Although above it has been shown and described that embodiments of the invention, it is to be understood that above-described embodiment is example
Property, it is impossible to being interpreted as limitation of the present invention, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, revises, replaces and modification.
Claims (10)
1. a pcb board, it is characterised in that including:
Plate body；
Bare crystalline chip, described bare crystalline chip is located on the lower surface of described plate body；
Pad, described pad is located on the upper surface of described plate body；And
Shield bracket, described shield bracket and described pad solder, the lower surface of described shield bracket is provided with escape groove, described
Escape groove is relative with described bare crystalline chip.
Pcb board the most according to claim 1, it is characterised in that described bare crystalline chip is positioned at the underface of described escape groove.
Pcb board the most according to claim 1, it is characterised in that the degree of depth of described escape groove is H, described H meets: 0.2mm
≤H≤0.3mm。
Pcb board the most according to claim 1, it is characterised in that the width of described escape groove is W1, described bare crystalline chip
Width is W2, and described W1 and W2 meets: W1-W2 >=1mm.
Pcb board the most according to claim 4, it is characterised in that the width of described escape groove is W1, described bare crystalline chip
Width is W2, and described W1 and W2 meets: 1mm≤W1-W2≤1.6mm.
Pcb board the most according to claim 1, it is characterised in that described escape groove frontal plane of projection on the upper surface
Long-pending more than described bare crystalline chip frontal projected area on the upper surface.
Pcb board the most according to claim 1, it is characterised in that the sidewall of described escape groove and the roof of described escape groove
Between there is rounding off portion.
Pcb board the most according to claim 1, it is characterised in that position relative with described escape groove on described pad
It is provided with and dodges breach.
Pcb board the most according to claim 8, it is characterised in that described in dodge the through described pad of breach.
10. a mobile terminal, it is characterised in that include according to the pcb board according to any one of claim 1-9.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505734.4A CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
| CN201810235641.3A CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
| PCT/CN2017/081271 WO2018000919A1 (en) | 2016-06-28 | 2017-04-20 | Pcb board and mobile terminal having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505734.4A CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235641.3A Division CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106061096A true CN106061096A (en) | 2016-10-26 |
| CN106061096B CN106061096B (en) | 2018-06-29 |
Family
ID=57201397
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235641.3A Active CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
| CN201610505734.4A Active CN106061096B (en) | 2016-06-28 | 2016-06-28 | Pcb board and with its mobile terminal |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235641.3A Active CN108650772B (en) | 2016-06-28 | 2016-06-28 | PCB and mobile terminal with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN108650772B (en) |
| WO (1) | WO2018000919A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000919A1 (en) * | 2016-06-28 | 2018-01-04 | 广东欧珀移动通信有限公司 | Pcb board and mobile terminal having same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090296361A1 (en) * | 2008-05-28 | 2009-12-03 | Huang Chung-Er | Integrated circuit module with temperature compensation crystal oscillator |
| CN203072308U (en) * | 2013-03-01 | 2013-07-17 | 广东欧珀移动通信有限公司 | Shielding case support structure |
| CN105658044A (en) * | 2016-01-14 | 2016-06-08 | 广东欧珀移动通信有限公司 | Shielding support structure for improving stress of main board chip, and mobile terminal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100454533C (en) * | 2003-04-15 | 2009-01-21 | 波零公司 | EMI shielding for electronic component packaging |
| JP2011077446A (en) * | 2009-10-01 | 2011-04-14 | Sanyo Electric Co Ltd | Shield case and image display device |
| JP2011216849A (en) * | 2010-03-17 | 2011-10-27 | Tdk Corp | Electronic circuit module component, and method of manufacturing the same |
| CN108650772B (en) * | 2016-06-28 | 2020-01-10 | Oppo广东移动通信有限公司 | PCB and mobile terminal with same |
-
2016
- 2016-06-28 CN CN201810235641.3A patent/CN108650772B/en active Active
- 2016-06-28 CN CN201610505734.4A patent/CN106061096B/en active Active
-
2017
- 2017-04-20 WO PCT/CN2017/081271 patent/WO2018000919A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090296361A1 (en) * | 2008-05-28 | 2009-12-03 | Huang Chung-Er | Integrated circuit module with temperature compensation crystal oscillator |
| CN203072308U (en) * | 2013-03-01 | 2013-07-17 | 广东欧珀移动通信有限公司 | Shielding case support structure |
| CN105658044A (en) * | 2016-01-14 | 2016-06-08 | 广东欧珀移动通信有限公司 | Shielding support structure for improving stress of main board chip, and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000919A1 (en) * | 2016-06-28 | 2018-01-04 | 广东欧珀移动通信有限公司 | Pcb board and mobile terminal having same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108650772A (en) | 2018-10-12 |
| CN106061096B (en) | 2018-06-29 |
| CN108650772B (en) | 2020-01-10 |
| WO2018000919A1 (en) | 2018-01-04 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |