CN207573221U - A kind of modular power source - Google Patents

A kind of modular power source Download PDF

Info

Publication number
CN207573221U
CN207573221U CN201721525712.0U CN201721525712U CN207573221U CN 207573221 U CN207573221 U CN 207573221U CN 201721525712 U CN201721525712 U CN 201721525712U CN 207573221 U CN207573221 U CN 207573221U
Authority
CN
China
Prior art keywords
metal shell
carbon fiber
fixed
ceramic substrate
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721525712.0U
Other languages
Chinese (zh)
Inventor
邹永顺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Changxin Yongcheng Power Ltd By Share Ltd
Original Assignee
Zhejiang Changxin Yongcheng Power Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Changxin Yongcheng Power Ltd By Share Ltd filed Critical Zhejiang Changxin Yongcheng Power Ltd By Share Ltd
Priority to CN201721525712.0U priority Critical patent/CN207573221U/en
Application granted granted Critical
Publication of CN207573221U publication Critical patent/CN207573221U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a kind of modular power sources, bottom plate including the metal shell described in metal shell is equipped with several spaced set heat emission holes, carbon fiber board is equidistantly fixed on the plate upper surface of metal shell, copper ceramic substrate is covered to be located above carbon fiber board, it covers and heat dissipation gap is formed between copper ceramic substrate and metal shell, magnetic device and power device are fixed on the upper surface for covering copper ceramic substrate, double-sided PCB board is fixed on the back side of magnetic device and power device, double-sided PCB board both ends are equipped with contact pin, contact pin passes through the bottom plate for covering copper ceramic substrate and metal shell, the control element is fixed on the upper and lower surface of double-sided PCB board.The utility model is related to modular power source there is better thermal diffusivity and moisture resistance, service life is long.

Description

A kind of modular power source
Technical field
The utility model is related to military project electronic technology field, specifically, being related to a kind of modular power source.
Background technology
Modular power source is a kind of electric energy converting equipment, can directly mount power supply unit on a printed circuit, can For application-specific integrated circuit (ASIC), digital signal processor (DSP), microprocessor, memory, field programmable gate array (FPGA) and other digital or fictitious loads provide power supply.In general, this generic module is known as loading point (POL) power supply supply system System or point of use power system (PUPS).The advantages of due to modular organization, is apparent, and modular power source is widely used in friendship The communications fields such as exchange device, access device, mobile communication, microwave communication and optical transport, router and automotive electronics, aviation boat It etc..
Traditional modular power source is as shown in Figure 1, including housing 108, cap 101, wiring board 105, and contact pin 109 is described to insert Needle 109 passes through 108 bottom plate of metal shell and is welded on 108 bottom plate of metal shell, and wiring board 105 is welded on contact pin 109;Institute Wiring board 105 is stated as ceramic substrate, control element 102, magnetic device 103, power device 104 are installed on wiring board 105.
Though the modular power source heat dissipation effect of this structure is good, there are the shortcomings that be also apparent from:Ceramic substrate processing technology Complexity, cost of manufacture are 60 times of common double-sided PCB board or more;Ceramic substrate can only single side place component, it is impossible to fully profit With the useful space inside modular power source;Ceramic substrate material is more crisp, is easily broken, stringent to production assembly technology requirement;Ceramics Substrate silver soldering disk in the welding process, be easy to cause Pad off, welding temperature and weld interval is required stringent;Ceramic substrate It is tightly attached on the bottom plate of metal shell, is unfavorable for modular power source heat dissipation.
Utility model content
The purpose of this utility model is that in view of the above-mentioned problems, providing a kind of good heat dissipation effect, reliability is high, can be fully sharp With the modular power source structure of metal shell inner space.
For the attainment of one's purpose, technical solution provided by the utility model is:
The utility model is related to a kind of modular power source, including metal shell, metal shell is cuboid, the top of metal shell Portion is equipped with metal cap, and the bottom plate of the metal shell is equipped with several spaced set heat emission holes, the inside of metal shell Equipped with double-sided PCB board, magnetic device, power device, control element, several carbon fiber boards and copper ceramic substrate is covered, the carbon Fiberboard is equidistantly fixed on the plate upper surface of metal shell, covers copper ceramic substrate and is located above carbon fiber board, bottom surface with The top surface of carbon fiber board is fixedly connected, and surrounding is fixedly connected with the inner wall of metal shell, cover copper ceramic substrate and metal shell it Between form heat dissipation gap, the magnetic device and power device be fixed on the upper surface for covering copper ceramic substrate, and described is two-sided Pcb board is fixed on the back side of magnetic device and power device, and double-sided PCB board both ends are equipped with contact pin, and contact pin, which passes through, covers copper ceramic base The bottom plate of plate and metal shell, the control element are fixed on the upper and lower surface of double-sided PCB board.
Preferably, the carbon fiber board uses the rectangular configuration of strip, the height all same of all carbon fiber boards.
Preferably, the carbon fiber board uses the semicircle ring structure of strip, the internal diameters of all carbon fiber boards, outer diameter and Wall thickness all same.
Preferably, the double-sided PCB board correspond to power device and magnetic device position be respectively equipped with the first card slot and Second card slot, power device are fixed in the first card slot, and magnetic device is fixed in the second card slot.
Preferably, the contact pin is located across the outer rings of metal shell bottom parts and is equipped with glass insulator, and glass is exhausted Edge is fixed in the bottom plate of metal shell.
Using technical solution provided by the utility model, compared with prior art, have the advantages that:
The utility model is related to by spaced carbon fiber board and covering copper ceramic substrate, in the bottom shape of metal shell Into one layer of scattered gap, and heat emission hole is offered on the bottom plate of metal shell, distributed convenient for heat;And carbon fiber layer has Certain wettability power is located at below each device moisture-proof effect of playing.
Description of the drawings
Fig. 1 is the structure diagram of modular power source in the prior art;
Fig. 2 is the structure diagram of the modular power source in the utility model embodiment 1;
Fig. 3 is the structure diagram of the modular power source in the utility model embodiment 2.
It illustrates:Metal shell 1, metal cap 2, carbon fiber board 3 cover copper ceramic substrate 4, double-sided PCB board 5, power Device 6, magnetic device 7, control element 8, contact pin 9, heat emission hole 11, gap 13 of radiating, the first card slot 51, the second card slot 52.
Specific embodiment
To further appreciate that the content of the utility model, the utility model is described in detail in conjunction with the embodiments, below in fact Example is applied for illustrating the utility model, but be not intended to limit the scope of the present invention.
Embodiment 1
With reference to shown in attached drawing 1, a kind of modular power source includes metal shell 1, and metal shell 1 is cuboid, metal shell Top is equipped with metal cap 2, and the bottom plate of the metal shell 1 is equipped with several spaced set heat emission holes 11, metal shell Be internally provided with double-sided PCB board 5, magnetic device 7, power device 6, control element 8, several carbon fiber boards 3 and cover copper ceramic base Plate 4, the carbon fiber board 3 use the rectangular configuration of the equal strip of height, and carbon fiber board 3 is equidistantly fixed on metal-back The plate upper surface of body 1 covers copper ceramic substrate 4 and is located at 3 top of carbon fiber board, and company is fixed in bottom surface and the top surface of carbon fiber board 3 It connects, surrounding is fixedly connected with the inner wall of metal shell 1, is covered and is formed between heat dissipation between the bottom plate of copper ceramic substrate 4 and metal shell 1 Gap 13, the magnetic device 7 and power device 6 are fixed on the upper surface for covering copper ceramic substrate 4, on the double-sided PCB board 5 Equipped with the first card slot 51 and the second card slot 52, double-sided PCB board 5 is stuck in magnetic device 6 by the first card slot 51 and the second card slot 52 With the back side of power device 7,5 both ends of double-sided PCB board are equipped with contact pin 9, and contact pin 9, which passes through, covers copper ceramic substrate 4 and metal shell 1 Bottom plate, wherein contact pin 9 are equipped with glass insulator 10 through the outer ring of metal shell 1, and the control element 8 is fixed on two-sided The upper and lower surface of pcb board 5.The heat that the modular power source structure generates during magnetic device 7 and power device 6 work is by covering copper Ceramic substrate 4 is transmitted in heat dissipation gap 13, then the heat emission hole 11 by being connected with outside distributes heat to metal shell 1 Outside, the good heat dissipation effect of the more conventional modular power source of heat dissipation effect, and carbon fiber board 3 have hygroscopicity, can absorb Moisture in air prevents each component of modular power source from making moist, increases the service life of modular power source.
Embodiment 2
The present embodiment and embodiment 1 difference lies in:Carbon fiber board 3 in the present embodiment uses the semicircular ring knot of strip Structure, internal diameter, outer diameter and the wall thickness all same of all carbon fiber boards.Using the carbon fiber board 3 of the shape can increase carbon fiber board with The area of air contact, dampproof effect are more preferable compared with for embodiment 1.
The utility model is described in detail above in association with embodiment, but the content be only the utility model compared with Good embodiment, it is impossible to be construed as limiting the scope of the utility model.It is made according to the scope of application of this utility model All the changes and improvements etc. should all be still fallen within the patent covering scope of the utility model.

Claims (5)

1. a kind of modular power source, including metal shell, metal shell is cuboid, and the top of metal shell is equipped with metal cap, It is characterized in that:The bottom plate of the metal shell is equipped with several spaced set heat emission holes, and metal shell is internally provided with Double-sided PCB board, magnetic device, power device, control element, several carbon fiber boards and copper ceramic substrate is covered, the carbon fiber Plate is equidistantly fixed on the plate upper surface of metal shell, covers copper ceramic substrate and is located above carbon fiber board, bottom surface is fine with carbon The top surface of dimension plate is fixedly connected, and surrounding is fixedly connected with the inner wall of metal shell, covers shape between copper ceramic substrate and metal shell Into heat dissipation gap, the magnetic device and power device are fixed on the upper surface for covering copper ceramic substrate, the double-sided PCB board The back side of magnetic device and power device is fixed on, double-sided PCB board both ends are equipped with contact pin, and contact pin, which passes through, covers copper ceramic substrate and gold Belong to the bottom plate of housing, the control element is fixed on the upper and lower surface of double-sided PCB board.
2. modular power source according to claim 1, it is characterised in that:The carbon fiber board uses the rectangle knot of strip Structure, the height all same of all carbon fiber boards.
3. modular power source according to claim 1, it is characterised in that:The carbon fiber board uses the semicircular ring of strip Structure, internal diameter, outer diameter and the wall thickness all same of all carbon fiber boards.
4. modular power source according to claim 1, it is characterised in that:The double-sided PCB board corresponds to power device and magnetic The position of property device is respectively equipped with the first card slot and the second card slot, and power device is fixed in the first card slot, and magnetic device is fixed In the second card slot.
5. modular power source according to claim 1, it is characterised in that:The contact pin is located across metal shell base plate The outer ring divided is equipped with glass insulator, and glass insulator is fixed in the bottom plate of metal shell.
CN201721525712.0U 2017-11-14 2017-11-14 A kind of modular power source Expired - Fee Related CN207573221U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721525712.0U CN207573221U (en) 2017-11-14 2017-11-14 A kind of modular power source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721525712.0U CN207573221U (en) 2017-11-14 2017-11-14 A kind of modular power source

Publications (1)

Publication Number Publication Date
CN207573221U true CN207573221U (en) 2018-07-03

Family

ID=62690477

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721525712.0U Expired - Fee Related CN207573221U (en) 2017-11-14 2017-11-14 A kind of modular power source

Country Status (1)

Country Link
CN (1) CN207573221U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110518477A (en) * 2019-09-24 2019-11-29 济南南知信息科技有限公司 A kind of radiating type distribution box

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110518477A (en) * 2019-09-24 2019-11-29 济南南知信息科技有限公司 A kind of radiating type distribution box
CN110518477B (en) * 2019-09-24 2020-11-17 南京瀚元科技有限公司 Heat dissipation type block terminal

Similar Documents

Publication Publication Date Title
JP4833418B2 (en) Power semiconductor device package with concentric leads
JP5687345B2 (en) Wiring board and electronic device
KR101134671B1 (en) LED lamp module with the cooling structure
JP2009071013A (en) Mounting substrate for light emitting element
US20170316878A1 (en) Capacitive component having a heat-conducting connection element
JP2008034778A (en) Circuit module
CN207573221U (en) A kind of modular power source
CN102164453A (en) Circuit module
JP6790902B2 (en) Electronic device
JPWO2016163135A1 (en) Electronic module and electronic device
CN106684076A (en) Packaging structure and manufacture method thereof
JP2013243228A (en) Electronic circuit device
JP6010333B2 (en) Wiring board and electronic device
US8649183B2 (en) Electronic assembly
JP2014157949A (en) Wiring board and electronic device
JP2004235204A (en) Package for storing light emitting element and light emitting device
KR101115403B1 (en) Light emitting apparatus
US8089086B2 (en) Light source
CN203733848U (en) Substrate for carrying reversely mounted chip and LED packaging structure
JP6224449B2 (en) Light-emitting element mounting substrate and light-emitting device including the same
JP6046421B2 (en) Wiring board and electronic device
JP6651999B2 (en) Composite device
JPWO2015029907A1 (en) Electronic component storage package and electronic device
CN207783410U (en) Chip, circuit board assemblies and mobile terminal
CN211062704U (en) Chip module and electronic equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180703

Termination date: 20181114

CF01 Termination of patent right due to non-payment of annual fee