KR20150034489A

KR20150034489A - Microphone package

Info

Publication number: KR20150034489A
Application number: KR20130114637A
Authority: KR
Inventors: 류종인; 김태현; 이강현
Original assignee: 삼성전기주식회사
Priority date: 2013-09-26
Filing date: 2013-09-26
Publication date: 2015-04-03

Abstract

A microphone package of the present invention comprises: a substrate unit where at least one groove is formed; a microphone unit mounted on the substrate; and a shield can unit connected with an electrode pad formed on the groove.

Description

Microphone package

The present invention relates to a microphone package, and more particularly, to a microphone package having a shield can.

The microphone package includes a shield can that protects the microphone element. Here, the shield can protect the microphone device and other electronic components from harmful electromagnetic waves.

The shield can can be electrically connected to the substrate of the microphone package. That is, a pad for connecting a shield can is formed on the substrate of the microphone package.

On the other hand, the shield can pad is formed at a predetermined distance from the circuit pattern of the substrate because it causes disconnection of the circuit when connected to the circuit pattern of the substrate. Therefore, the microphone package having the shield can has a limitation in reducing the size of the substrate.

For reference, Patent Documents 1 and 2 are the prior art related to the present invention.

JP 2006-311106 A JP 2005-311917 A

It is an object of the present invention to provide a microphone package having a structure advantageous for miniaturization of a microphone package.

According to an aspect of the present invention, there is provided a microphone package including: a substrate unit having at least one groove formed therein; A microphone unit mounted on the substrate; And a shield can unit connected to the electrode pad formed in the groove.

In the microphone package according to an embodiment of the present invention, the electrode pad may be formed at the bottom of the groove.

In the microphone package according to an embodiment of the present invention, the grooves are in the form of a plurality of holes formed at intervals in the substrate unit, and the shield can includes protrusions inserted into the holes.

In the microphone package according to an embodiment of the present invention, the substrate unit may be a multilayer substrate.

In the microphone package according to an embodiment of the present invention, the substrate unit may include: a first substrate on which a first circuit pattern is formed; And a second substrate on which a second circuit pattern is formed.

In the microphone package according to an embodiment of the present invention, the electrode pad may be connected to the second circuit pattern.

According to another aspect of the present invention, there is provided a microphone package including: a substrate unit having two or more edges formed at edges thereof; A microphone unit mounted on the substrate; And a shield can unit connected to the electrode pad formed at the step.

In the microphone package according to another embodiment of the present invention, the electrode pad may be formed at the lowermost end of the two or more ends.

In the microphone package according to another embodiment of the present invention, the substrate unit may be a multi-layered substrate.

In the microphone package according to another embodiment of the present invention, the substrate unit may include: a first substrate on which a first circuit pattern is formed; And a second substrate on which a second circuit pattern is formed.

In the microphone package according to another embodiment of the present invention, the electrode pad may be connected to the second circuit pattern.

The present invention can minimize the size of the microphone package.

In addition, the present invention can improve the connection reliability between the substrate and the shield can.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention,
2 is a cross-sectional view showing another embodiment of the microphone package shown in FIG. 1,
Fig. 3 is a front view of the shield can shown in Fig. 2,
FIG. 4 is a cross-sectional view showing another embodiment of the microphone package shown in FIG. 1,
5 is a cross-sectional view of a microphone package according to another embodiment of the present invention,
6 is a cross-sectional view showing another embodiment of the microphone package shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, it is to be understood that the terminology used herein is for the purpose of describing the present invention only and is not intended to limit the technical scope of the present invention.

In addition, throughout the specification, a configuration is referred to as being 'connected' to another configuration, including not only when the configurations are directly connected to each other, but also when they are indirectly connected with each other . Also, to "include" an element means that it may include other elements, rather than excluding other elements, unless specifically stated otherwise.

FIG. 1 is a cross-sectional view of a microphone package according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing another embodiment of the microphone package shown in FIG. 1, FIG. 3 is a front view of the shield can shown in FIG. 4 is a cross-sectional view showing another embodiment of the microphone package shown in Fig. 1, Fig. 5 is a sectional view of a microphone package according to another embodiment of the present invention, and Fig. 6 is a view showing another form of the microphone package shown in Fig. Sectional view.

1 to 4, a microphone package according to an embodiment of the present invention will be described.

The microphone package 100 according to the present embodiment may include a substrate unit 110, a microphone unit 120, and a shield can 130. In addition, the microphone package 100 may further include a semiconductor device 160. Here, the semiconductor device 160 may be a custom semiconductor device (ASIC). In addition, the microphone package 100 may further include other elements necessary for operation of the microphone unit 120. [

The microphone package 100 constructed as described above can be mounted on a portable electronic device to sense sound including voice and convert the sensed sound into an electric signal.

In the following, the main structure of the microphone package 100 will be described.

The substrate unit 110 may include a substrate on which a circuit pattern is formed. In addition, the substrate unit 110 may include one or more electronic components embedded in the substrate in addition to the substrate on which the circuit pattern is formed. For example, the substrate unit 110 may include passive elements mounted on a substrate.

A first acoustic hole 112 may be formed in the substrate unit 110. The first acoustic hole 112 penetrates the substrate unit 110 and can be connected to the microphone unit 120. That is, the sound introduced through the first acoustic hole 112 can be transmitted to the microphone unit 120. Here, the first acoustic hole 112 may have a predetermined volume. That is, the first sound hole 112 may form a back volume or a front volume in the microphone package 100. [

A groove 114 may be formed in the substrate unit 110. The groove 114 may be formed at a predetermined depth from one surface (upper surface in FIG. 1) of the substrate unit 110. Here, the predetermined depth may be smaller than the thickness of the substrate unit 110. The grooves 114 may be formed at the edge of the substrate unit 110. Preferably, the groove 114 may be formed at a position away from a circuit pattern formed on the substrate unit 110. [

An electrode pad 116 may be formed on the substrate unit 110. To be more specific, the electrode pad 116 may be formed in the groove 114 of the substrate unit 110. For example, the electrode pad 116 may be formed on the bottom of the groove 114 or on the side wall of the groove 114. The electrode pad 116 may be connected to a ground pad formed on the other surface of the substrate unit 110 (refer to FIG. 1).

Since the electrode pad 116 thus formed is formed inside the groove 114, it can be easily separated from the circuit pattern formed on one surface of the substrate unit 110 electrically. Therefore, according to the present embodiment, a short circuit phenomenon due to the connection of the electrode pad 116 and the circuit pattern can be reduced.

The microphone unit 120 may be formed on one side of the substrate unit 110. In other words, the microphone unit 120 may be formed at a portion of the substrate unit 110 that is connected to the first acoustic hole 112. The microphone unit 120 may include a support substrate 122, a diaphragm 124, and an electrode substrate 126.

The supporting substrate 122 may be connected to the substrate unit 110 and may have a predetermined circuit pattern. In addition, the support substrate 122 may include holes that are connected to the first acoustic holes 112. The hole may form a back volume or a front volume together with the first acoustic hole 112.

The diaphragm 124 may be oscillatably formed on the supporting substrate 122. For example, the diaphragm 124 may be formed on one side of the supporting substrate 122 by an elastic member. The diaphragm 124 may be made of a conductive material. For example, the diaphragm 124 may be made of doped polysilicon.

The electrode substrate 126 may be formed above the diaphragm 124 and may form a predetermined electric field together with the diaphragm 124. For example, a capacitance of a predetermined size may be formed between the electrode substrate 126 and the diaphragm 124.

The microphone unit 120 configured as described above can convert the sound into an electrical signal by converting the amplitude of the vibration plate 124, which is vibrated by the sound, to the capacitance change amount of the vibration plate 124 and the electrode substrate 126 again.

The shield can 130 may be made of a metal material. However, the shield can 130 is not necessarily made of a metal material, but may be made of a mixture containing a metal powder as required.

The shield can 130 may be formed to cover the microphone unit 120 and the custom semiconductor device 160 to protect the microphone unit 120 and the custom semiconductor device 160 from harmful electromagnetic waves. The shield can 130 may be connected to the electrode pad 116. That is, the end of the shield can 130 is inserted into the groove 114 of the substrate unit 110 and can contact the electrode pad 116.

A second acoustic hole 132 may be formed in the shield can 130. The second acoustic hole 132 may be used as an outlet through which acoustic input or output is made. Accordingly, the inner space of the shield can 130 can be used as a back volume or a front volume.

The microphone package 100 constructed as described above has a structure in which the shield can 130 is inserted into the groove 114 of the board unit 110 so that the bonding force between the board unit 110 and the shield can 130 can be improved And the contact reliability between the shield can 130 and the electrode pad 116 can be improved.

In addition, since the electrode pad 116 is formed in the groove 114 of the substrate unit 110, the gap between the electrode pad 116 and the circuit pattern of the substrate unit 110 is automatically secured, It is possible to reduce the defective rate of the microphone package 100.

Meanwhile, the microphone package 100 according to the present embodiment can be modified into the form shown in Figs. In other words, the grooves 114 may be formed at intervals along at least one of a width direction and a length direction of the substrate unit 110. In addition, the groove 114 may be in the form of a hole penetrating the substrate unit 110 in the thickness direction. The shield can 130 may include a plurality of protrusions 134 inserted into the plurality of grooves 114. That is, the end portion of the shield can 130 may have a sawtooth shape.

The microphone package 100 constructed as described above can further improve the bonding force between the substrate unit 110 and the shield can 130. Meanwhile, in this embodiment, the electrode pad 116 may be formed on the side wall of the groove 114.

The microphone package 100 according to the present embodiment can be distinguished from the above-described microphone package in the form of the board unit 110 as shown in Fig.

That is, in this embodiment, the substrate unit 110 may be in the form of a multi-layer substrate in which a plurality of substrates are laminated in the thickness direction. In addition, the substrate unit 110 may include a first substrate 140 and a second substrate 150. A first circuit pattern 142 may be formed on the first substrate 140 and a second circuit pattern 152 may be formed on the second substrate 150. Here, the first circuit pattern 142 may be connected to the microphone unit 120 and the semiconductor 160, and the second circuit pattern 152 may be connected to the electrode pad 116.

In FIG. 4, the substrate unit 110 is formed of two substrates 140 and 150, but may be formed of three or more substrates, if necessary.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIGS. 5 and 6. FIG.

The microphone package 100 according to the present embodiment can be distinguished from the above-described embodiment in the shape of the substrate unit 110. [

In other words, in this embodiment, the substrate unit 110 may have a stepped end portion 118 formed at the edge thereof. Here, each end 118 may be formed at the same height. However, the respective end portions 118 are not necessarily formed at the same height, but may be formed at different heights as required.

The electrode pad 116 may be formed on one of the plurality of end portions 118. For example, at the lowermost end 118 of the plurality of ends 118, an electrode pad 116 that contacts the shield can 130 may be formed.

The electrode pad 116 is formed at the end portion 118 of the microphone package 100 that is opened to the outside, so that the electrode pad 116 can be easily formed.

Meanwhile, the microphone package 100 according to the present embodiment may be modified into another form as shown in FIG.

The first substrate 140 may have a smaller size than the second substrate 150. That is, when the first substrate 140 is stacked on the second substrate 150, the edge of the second substrate 150 may be exposed to the outside. This structure can form the end portion 118 at the edge of the substrate unit 110 by merely stacking the first substrate 140 and the second substrate 150.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions And various modifications may be made.

100 microphone package
110 substrate unit
112 first acoustic hole 114 groove or hole
116 electrode pad 118 stages
120 microphone unit 122 support substrate
124 Diaphragm 126 Electrode substrate
130 shield can 132 second sound hole
134 protrusion
140 first substrate 142 first circuit pattern
150 second substrate 152 second circuit pattern
160 (customized) Semiconductor device

Claims

A substrate unit in which at least one groove is formed;
A microphone unit mounted on the substrate; And
A shield can unit connected to an electrode pad formed in the groove;
.

The method according to claim 1,
And the electrode pad is formed on the bottom of the groove.

The method according to claim 1,
Wherein the grooves are in the form of a plurality of holes formed at intervals in the substrate unit,
And the shield can includes a protrusion inserted into the hole.

The method according to claim 1,
Wherein the substrate unit comprises a multilayer substrate.

5. The method of claim 4,
Wherein the substrate unit comprises:
A first substrate on which a first circuit pattern is formed; And
A second substrate on which a second circuit pattern is formed;
.

6. The method of claim 5,
And the electrode pad is connected to the second circuit pattern.

A substrate unit having two or more edges formed at edges thereof;
A microphone unit mounted on the substrate; And
A shield can unit connected to the electrode pad formed at the step;
.

8. The method of claim 7,
Wherein the electrode pad is formed at the lowest one of the two or more ends.

8. The method of claim 7,
Wherein the substrate unit comprises a multilayer substrate.

10. The method of claim 9,
Wherein the substrate unit comprises:
A first substrate on which a first circuit pattern is formed; And
A second substrate on which a second circuit pattern is formed;
.

11. The method of claim 10,
And the electrode pad is connected to the second circuit pattern.